Semiconductor thermoelectric temperature control adhesive hydrogel end effector

Abstract

The invention relates to the technical field of robot end executors, in particular to a semiconductor thermoelectric temperature control adhesive hydrogel end executor. A semiconductor thermoelectric temperature control adhesive hydrogel end effector comprises temperature-sensitive hydrogel, a water supplementing system, a semiconductor thermoelectric piece, a mounting base and a shell connecting piece, all the parts are modularly assembled to form a compact functional module, and the specific structure is as follows: a microstructure array is arranged on the upper surface of the temperature-sensitive hydrogel, and a micro-channel is embedded in the temperature-sensitive hydrogel; the microstructure array is used for increasing the contact area and dredging phase change to separate out water; the microstructure array is used for increasing the effective contact area and preventing separated water from forming a continuous water film during phase change, and unstable adhesion force is prevented. The temperature-sensitive hydrogel adopts a laser processing or molding forming process. By integrating the active water replenishing system and the bidirectional thermoelectric temperature control module, the adhesive force of the temperature-sensitive hydrogel can be quickly, reversibly and accurately controlled.

Description

Technical Field

[0001] This invention relates to the field of robot end effector technology, and more specifically to a semiconductor thermoelectric temperature-controlled adhesive hydrogel end effector. Background Technology

[0002] As robotics technology strives for greater precision and flexibility, traditional rigid mechanical grippers face challenges in grasping fragile, vulnerable, or irregularly shaped objects, such as precision electronic components, biological samples, flexible thin films, coated parts, and silicon wafers. Therefore, adhesive end effectors based on smart materials have become an important research direction. Currently, the main technical approaches and existing problems of such actuators are as follows:

[0003] 1. Thermoresponsive hydrogels, such as poly(N-isopropylacrylamide), and thermosensitive adhesive polymers, can reversibly modulate their surface adhesion through temperature changes, enabling non-destructive grasping and release. However, existing heating methods mostly employ resistance wires or thin-film heaters, which are single-function, providing only heating and unable to actively cool. This results in reliance on natural cooling from the environment during object release, leading to slow response times, cyclical fields, and severely limiting operational efficiency.

[0004] 2. Due to their inherent properties, hydrogels experience significant moisture evaporation and loss in dry environments, especially after repeated heating, leading to volume shrinkage and degradation of their mechanical properties. Current common solutions primarily involve passive moisturization, which has limited effectiveness under dynamic working conditions and cannot maintain the optimal working state of hydrogels in the long term.

[0005] 3. When using temperature-sensitive adhesive hydrogel for grasping, the hydrogel will cause a water film to appear on the outer interface during the phase transition, which reduces the adhesion force during actual contact, making it impossible to pick up effectively and affecting the grasping success rate and work efficiency.

[0006] In summary, current robotic end effector solutions are insufficient for complex and unconventional picking tasks. Existing temperature-sensitive hydrogel picking solutions have not yet solved the problems of precise and rapid temperature control, long-term maintenance of hydrogel activity, and good engineering integration. Therefore, there is an urgent need for an innovative design to overcome existing bottlenecks and achieve efficient, reliable, and adaptive intelligent grasping. Summary of the Invention

[0007] To address the problems mentioned in the background art, such as slow temperature control of thermally responsive adhesive materials, easy dehydration and failure of hydrogels, and low integration and poor adaptability of existing actuator structures, this invention aims to provide a semiconductor thermoelectric temperature-controlled adhesive hydrogel end effector. Its advantages are that by integrating an active water replenishment system and a bidirectional thermoelectric temperature control module, it achieves rapid, reversible, and precise control of the adhesion force of temperature-sensitive hydrogels, solving the problem of dehydration and inactivation during operation. The modular structural design gives it advantages such as adjustable gripping range, efficient heat dissipation, and easy integration and maintenance, making it particularly suitable for precision operation scenarios involving non-destructive and adaptive gripping of target objects.

[0008] The technical solution adopted by this invention to solve its technical problem is:

[0009] A thermoelectrically controlled adhesive hydrogel end effector includes a temperature-sensitive hydrogel, a water replenishment system, a thermoelectric element, a mounting base, and a housing connector. The components are modularly assembled to form a compact functional module, as detailed below:

[0010] The thermosensitive hydrogel has a microstructure array on its upper surface, with microchannels embedded inside. The microstructure array is used to increase the contact area and facilitate the release of water during phase change. It also increases the effective contact area and prevents the released water from forming a continuous water film during phase change, thus preventing unstable adhesion. The thermosensitive hydrogel is manufactured using laser processing or molding techniques.

[0011] The water replenishment system has a ring-shaped cavity structure, which is set above the temperature-sensitive hydrogel. It integrates a micro peristaltic pump, a liquid storage chamber and a humidity sensor. The outer ring wall has external threads and two flow channel interfaces, which are connected to the microchannel inlet and outlet of the temperature-sensitive hydrogel through a flexible sealing tube to form a closed circulation water circuit.

[0012] The upper side of the semiconductor thermoelectric element is the working end face, and the lower side is the non-working end face. The working end face of the semiconductor thermoelectric element and the lower surface of the temperature-sensitive hydrogel are thermally bonded together through a high thermal conductivity interface material. The working end face integrates a temperature sensor to realize the heating or cooling of the temperature-sensitive hydrogel and temperature closed-loop feedback control.

[0013] The upper side of the mounting base is in contact with the non-working end face of the semiconductor thermoelectric element, and has a cooling channel inside. The outer ring has an external thread and a boss for axial positioning.

[0014] The outer shell connector is a hollow cylindrical sleeve with an internal thread on the inner wall. It connects with the external thread of the water replenishment system and the external thread of the mounting base through the internal thread. The mounting base provides axial positioning through a boss, which ensures that the clamping force is moderate and consistent, avoiding damage to the brittle semiconductor thermoelectric element. The water replenishment system, temperature-sensitive hydrogel, semiconductor thermoelectric element and mounting base are clamped and fixed into a whole.

[0015] The microstructure array is a cylindrical array of small protrusions, and the microchannel is a planar spiral microchannel.

[0016] The water replenishment system uses a semi-transparent material to form a water storage observation window. The humidity sensor is used to monitor the humidity status of the temperature-sensitive hydrogel in real time. The micro peristaltic pump starts and stops according to the feedback signal from the humidity sensor to replenish liquid into the microchannel to maintain the working humidity of the temperature-sensitive hydrogel.

[0017] The cooling channel of the mounting base is connected to an external water cooling circulation system through an external interface to remove the waste heat generated when the semiconductor thermoelectric chip is working, and is physically isolated from the closed circulation water circuit of the water replenishment system.

[0018] The high thermal conductivity interface material is thermally conductive silicone grease.

[0019] The temperature-sensitive hydrogel can be changed to different sizes according to the size, weight and surface properties of the object being grasped, and the microstructure array can also be adapted to the size of the temperature-sensitive hydrogel.

[0020] The shape of the thermosensitive hydrogel can be adapted to the object being grasped, designed as a flat cylindrical shape or a concave curved surface.

[0021] The bottom of the mounting base is provided with a flange structure for connecting the robotic arm.

[0022] The semiconductor thermoelectric element switches between heating and cooling modes by adjusting the direction of the current, enabling rapid and reversible switching of the adhesion state of the temperature-sensitive hydrogel.

[0023] A method for operating an end effector includes the following steps:

[0024] The end effector is connected to the robotic arm via the flange structure of the mounting base, so that the cooling channel of the mounting base is connected to the external water cooling circulation system. The liquid in the storage chamber is injected into the microchannel of the temperature-sensitive hydrogel by a micro peristaltic pump until the humidity sensor reading stabilizes.

[0025] The semiconductor thermoelectric element stops working, the temperature-sensitive hydrogel remains consistent with the ambient temperature, and the humidity sensor continuously monitors the humidity. When the humidity is lower than the first threshold, the micro peristaltic pump is activated to replenish the liquid until the humidity reaches the second threshold.

[0026] After receiving the grabbing command, the control semiconductor thermoelectric sheet is put into cooling mode. The temperature sensor is used to adjust the temperature so that the temperature of the thermosensitive hydrogel is lower than its minimum critical phase transition temperature, the surface viscosity increases, and the robotic arm controls the end effector to contact and adsorb the object.

[0027] Upon receiving the release command, the current direction of the semiconductor thermoelectric element is reversed, causing it to enter the heating mode. The temperature of the thermosensitive hydrogel is higher than its minimum critical phase transition temperature, the surface viscosity decreases, the object falls off, and then the system returns to standby mode.

[0028] The beneficial effects of the semiconductor thermoelectric temperature-controlled adhesive hydrogel end effector of the present invention are:

[0029] Compared with the prior art, the present invention has the following significant advantages:

[0030] 1. Rapid and reversible adhesion control: The use of a semiconductor thermoelectric element for bidirectional active temperature control enables rapid switching between "on" and "off" adhesion force. Compared with solutions that can only heat and rely on natural cooling, this greatly shortens the operation cycle.

[0031] 2. Long-lasting and stable hydrogel activity: By designing a water replenishment system with humidity monitoring and internal circulation microchannels, water can be dynamically replenished and evenly distributed, overcoming the bottleneck of hydrogel dehydration failure in air, especially under heating conditions, and extending its service life.

[0032] 3. High structural integration and efficient heat dissipation: The multi-layer threaded locking structure makes the device compact and robust. In addition to providing an installation interface, the mounting base is designed with cooling channels for the thermoelectric element to dissipate heat, and is physically isolated from the water circulation system that replenishes the hydrogel, avoiding thermal interference and ensuring the working efficiency and lifespan of the thermoelectric element.

[0033] 4. Excellent gripping performance and adaptability: The microstructure array on the hydrogel surface enhances effective contact and adhesion; the modular hydrogel design allows for flexible replacement of the most suitable gripping head according to the size, weight and surface properties (such as wettability and roughness) of the object being gripped, achieving adaptive gripping. Attached Figure Description

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0035] Figure 1 Structural assembly for the end effector Figure 1 ;

[0036] Figure 2 Structural assembly for the end effector Figure 2 ;

[0037] Figure 3 This is a diagram showing the components of an end effector.

[0038] Figure 4 This is a flowchart illustrating the functional implementation of the end effector.

[0039] In the picture:

[0040] Thermosensitive hydrogel 1; Microstructure array 11; Microchannel 12;

[0041] Water replenishment system 2; miniature peristaltic pump 21; humidity sensor 22;

[0042] Semiconductor thermoelectric element 3; Working end face 31; Temperature sensor 32; Non-working end face 33;

[0043] Mounting base 4; Cooling channel 41; Flange structure 42;

[0044] 5. Housing connector. Detailed Implementation

[0045] like Figure 1-2 As shown, this invention discloses a thermoelectrically controlled adhesive hydrogel end effector. The core design concept is to achieve rapid regulation, stable maintenance, and long lifespan of the thermosensitive hydrogel's adhesion state by integrating an active water replenishment system with a high-efficiency thermoelectric temperature control module. This effectively solves the operational difficulties of traditional end effectors when grasping thin, fragile, or irregularly shaped objects. The device includes a thermosensitive hydrogel 1, a water replenishment system 2, a thermoelectric element 3, a mounting base 4, and a housing connector 5. These components are modularly assembled to form a compact functional module. The specific structure is as follows:

[0046] The temperature-sensitive hydrogel 1 has a microstructure array 11 on its upper surface and a microchannel 12 embedded inside. The microstructure array 11 is used to increase the contact area and facilitate the release of water during phase change.

[0047] The water replenishment system 2 has an annular cavity structure and is located above the temperature-sensitive hydrogel. It integrates a micro peristaltic pump 21, a liquid storage chamber, and a humidity sensor 22. The outer ring wall has external threads and two flow channel interfaces, which are connected to the inlet and outlet of the microchannel 12 of the temperature-sensitive hydrogel 1 through a flexible sealing tube to form a closed circulating water circuit.

[0048] The upper side of the semiconductor thermoelectric element 3 is the working end face 31, and the lower side is the non-working end face 33. The working end face 31 of the semiconductor thermoelectric element 3 is thermally bonded to the lower surface of the temperature-sensitive hydrogel 1 through a high thermal conductivity interface material. The working end face 31 integrates a temperature sensor 32, which is used to realize the heating or cooling of the temperature-sensitive hydrogel 1 and the closed-loop temperature feedback control.

[0049] The upper side of the mounting base 4 is in contact with the non-working end face 33 of the semiconductor thermoelectric sheet 3, and has a cooling channel 41 inside, and an external thread and a boss for axial positioning on the outer ring.

[0050] The outer shell connector 5 is a hollow cylindrical sleeve with an internal thread on its inner wall. It is connected to the external thread of the water replenishment system 2 and the external thread of the mounting base 4 through the internal thread. The mounting base 4 is axially limited by the boss, which presses and fixes the water replenishment system 2, the temperature-sensitive hydrogel 1, the semiconductor thermoelectric sheet 3 and the mounting base 4 into a whole.

[0051] The microstructure array 11 is a cylindrical array of small protrusions, and the microchannel 12 is a planar spiral microchannel.

[0052] The water replenishment system 2 is made of a semi-transparent material to form a water storage observation window. The humidity sensor 22 is used to monitor the humidity status of the temperature-sensitive hydrogel 1 in real time. The micro peristaltic pump 21 starts and stops according to the feedback signal of the humidity sensor 22 to replenish liquid into the microchannel 12 to maintain the working humidity of the temperature-sensitive hydrogel 1.

[0053] The cooling channel 41 of the mounting base 4 is connected to an external water cooling circulation system through an external interface to remove the waste heat generated when the semiconductor thermoelectric element 3 is working, and is physically isolated from the closed circulation water circuit of the water replenishment system 2.

[0054] The high thermal conductivity interface material is thermally conductive silicone grease.

[0055] The temperature-sensitive hydrogel 1 can be changed to different sizes according to the size, weight and surface properties of the object being grasped, and the microstructure array 11 can also be changed adaptively according to the size of the temperature-sensitive hydrogel 1.

[0056] The shape of the thermosensitive hydrogel 1 can be adapted to the object being grasped, designed as a flat cylindrical shape or a concave curved surface.

[0057] The bottom of the mounting base 4 is provided with a flange structure 42 for connecting the robotic arm.

[0058] The semiconductor thermoelectric element 3 switches between heating and cooling modes by adjusting the current direction, thereby achieving rapid and reversible switching of the adhesion state of the temperature-sensitive hydrogel.

[0059] A method for operating an end effector, characterized by comprising the following steps:

[0060] The end effector is connected to the robotic arm via the flange structure 42 of the mounting base 4, so that the cooling channel 41 of the mounting base 4 is connected to the external water cooling circulation system. The liquid in the storage chamber is injected into the microchannel 12 of the temperature-sensitive hydrogel 1 by the micro peristaltic pump 21 until the reading of the humidity sensor 22 is stable.

[0061] The semiconductor thermoelectric element 3 stops working, the temperature-sensitive hydrogel 1 remains consistent with the ambient temperature, the humidity sensor 22 continuously monitors the humidity, and when the humidity is lower than the first threshold, the micro peristaltic pump 21 is activated to replenish the liquid until the humidity reaches the second threshold.

[0062] After receiving the grabbing command, the control semiconductor thermoelectric element 3 is put into the cooling mode. The temperature sensor 32 is used to adjust the temperature so that the temperature of the thermosensitive hydrogel 1 is lower than its minimum critical phase transition temperature, the surface viscosity increases, and the robotic arm controls the end effector to contact and adsorb the object.

[0063] After receiving the release command, the current direction of the semiconductor thermoelectric element 3 is reversed, causing it to enter the heating mode. The temperature of the thermosensitive hydrogel 1 is higher than its minimum critical phase transition temperature, the surface viscosity decreases, the object falls off, and then the system returns to the standby state.

[0064] like Figure 3-4 As shown, the specific working steps of the thermoelectrically controlled adhesive hydrogel end effector proposed in this invention are as follows:

[0065] I. System Initialization and Preparation

[0066] Before performing the grasping task, the assembly and initialization of the end effector must be completed:

[0067] The assembled end effector is securely connected to the robotic arm via the flange structure 42 at the bottom of the mounting base 4, ensuring assembly accuracy and structural stability.

[0068] The cooling channel 41 inside the mounting base 4 is connected to the external constant temperature circulating water cooling system through an external interface to ensure that the waste heat outlet channel is unobstructed.

[0069] Check the replenishment fluid level in the reservoir of the water replenishment system 2 to ensure an adequate supply;

[0070] After the power is turned on, the controller starts automatically and drives the micro peristaltic pump 21 to inject the replenishment liquid in the storage chamber into the planar spiral microchannel 12 inside the temperature-sensitive hydrogel 1 until the humidity sensor 22 reading is stable, completing the system initialization and preparing for subsequent work.

[0071] II. Low-power standby mode

[0072] After system initialization, it automatically enters a low-power standby state: at this time, the semiconductor thermoelectric element 3 stops working, and the temperature of the thermosensitive hydrogel 1 remains consistent with the ambient temperature (25°C), remaining in a swollen, soft state with a certain initial viscosity. The humidity sensor 22 continuously monitors the humidity of the internal microenvironment of the thermosensitive hydrogel 1 in real time. Once it detects that the humidity has dropped to a preset minimum threshold due to natural evaporation, the controller immediately starts the micro peristaltic pump 21 to run at low speed, driving a small amount of replenishing liquid to circulate in the closed-loop water circuit to replenish the moisture of the thermosensitive hydrogel 1 until the humidity rises to a preset higher threshold, maintaining its optimal working humidity conditions.

[0073] III. Object Grabbing Operation

[0074] Upon receiving a grasping command, the system enters the grasping workflow. When the grasping target is a fragile object such as a glass slide or biological sample, the specific operations are as follows:

[0075] The controller applies a direct current to the semiconductor thermoelectric element 3, causing its working end face 31, which is in contact with the temperature-sensitive hydrogel 1, to enter the cooling mode.

[0076] The heat of the thermosensitive hydrogel 1 is quickly conducted to the semiconductor thermoelectric sheet 3, and then transferred to the mounting base 4 through the non-working end face 33. The waste heat is discharged by the circulating water in the cooling channel 41 inside the base to ensure cooling efficiency.

[0077] The temperature sensor 32 integrated on the working end face 31 of the semiconductor thermoelectric element 3 senses the temperature of the thermosensitive hydrogel 1 in real time and feeds back the data, realizing second-level control response and accurately reducing the temperature of the thermosensitive hydrogel 1 to below the lowest critical phase transition temperature (LCST).

[0078] At this point, the network structure of the thermosensitive hydrogel 1 is fully swollen and the surface viscosity reaches its maximum value. The robotic arm controls the end effector to move, so that the array of cylindrical protrusions on the upper surface of the thermosensitive hydrogel 1 makes stable contact with the surface of the target object, and achieves firm adsorption of the object through interfacial interactions such as van der Waals forces.

[0079] During the grasping process, the humidity sensor 22 continuously monitors the humidity, and the water replenishment system 2 works in a timely manner to compensate for the uneven distribution of internal moisture that may occur during the cooling process, thus ensuring stable adhesion.

[0080] IV. Object Release and System Reset

[0081] After the robotic arm transfers the object to the designated placement position, it performs a release operation:

[0082] The controller receives a release command and reverses the current direction of the semiconductor thermoelectric element 3, causing its working end face 31 to switch to heating mode;

[0083] Heat is rapidly transferred to the thermosensitive hydrogel 1 through the high thermal conductivity interface material (thermal grease), causing its temperature to rise rapidly to above the minimum critical phase transition temperature (LCST). The thermosensitive hydrogel 1 undergoes a rapid phase transition and shrinkage, releasing internal moisture and almost eliminating surface viscosity.

[0084] Under the influence of gravity, the grabbed object falls smoothly to the target location;

[0085] After the object is released, the semiconductor thermoelectric element 3 stops working, and the system automatically returns to a low-power standby state, waiting for the next grabbing command and preparing to start a new working cycle.

Claims

1. A semiconductor thermoelectrically temperature-controlled adhesive hydrogel end effector, characterized in that: It includes a temperature-sensitive hydrogel (1), a water replenishment system (2), a semiconductor thermoelectric element (3), a mounting base (4), and a housing connector (5). The components are assembled in a modular fashion to form a compact functional module. The specific structure is as follows: The temperature-sensitive hydrogel (1) has a microstructure array (11) on its upper surface and a microchannel (12) embedded inside. The microstructure array (11) is used to increase the contact area, facilitate the release of water during phase change, and prevent water from forming a continuous water film. The water replenishment system (2) has an annular cavity structure and is located above the temperature-sensitive hydrogel. It integrates a micro peristaltic pump (21), a liquid storage chamber and a humidity sensor (22) inside. The outer ring wall is provided with external threads and two flow channel interfaces. It is connected to the inlet and outlet of the microchannel (12) of the temperature-sensitive hydrogel (1) through a sealed flow channel to form a closed circulating water circuit. The upper side of the semiconductor thermoelectric sheet (3) is the working end face (31), and the lower side is the non-working end face (33). The working end face (31) of the semiconductor thermoelectric sheet (3) and the lower surface of the thermosensitive hydrogel (1) are thermally bonded through a thermally conductive interface material. The working end face (31) is integrated with a temperature sensor (32) for heating or cooling the thermosensitive hydrogel (1) and temperature feedback control. The upper side of the mounting base (4) is in contact with the non-working end face (33) of the semiconductor thermoelectric sheet (3), and the interior is provided with a cooling channel (41), and the outer ring is provided with an external thread and a boss for axial positioning. The outer shell connector (5) is a hollow cylindrical sleeve with an internal thread on the inner wall. It is connected to the external thread of the water replenishment system (2) and the external thread of the mounting base (4) through the internal thread. The mounting base (4) is axially limited by the boss, which presses and fixes the water replenishment system (2), the temperature-sensitive hydrogel (1), the semiconductor thermoelectric sheet (3) and the mounting base (4) into a whole.

2. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The microstructure array (11) is a cylindrical array of small protrusions, and the microchannel (12) is a planar spiral microchannel.

3. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The water replenishment system (2) is made of a semi-transparent material to form a water storage observation window. The humidity sensor (22) is used to monitor the humidity status of the temperature-sensitive hydrogel (1) in real time. The micro peristaltic pump (21) starts and stops according to the feedback signal of the humidity sensor (22) to replenish liquid into the microchannel (12) to maintain the working humidity of the temperature-sensitive hydrogel (1).

4. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The cooling channel (41) of the mounting base (4) is connected to an external water cooling circulation system through an external interface to exhaust the waste heat generated when the semiconductor thermoelectric chip (3) is working, and is physically isolated from the closed circulation water circuit of the water replenishment system (2).

5. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The thermal interface material is thermally conductive silicone grease.

6. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The temperature-sensitive hydrogel (1) can be changed to different sizes according to the size, weight and surface properties of the object being grasped, and the microstructure array (11) can also be adapted to the size of the temperature-sensitive hydrogel (1).

7. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The shape of the thermosensitive hydrogel (1) can be adapted to the object being grasped, designed as a flat cylindrical shape or a concave curved surface.

8. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The bottom of the mounting base (4) is provided with a flange structure (42) for connecting the robotic arm.

9. The thermoelectrically controlled adhesive hydrogel end effector according to claim 1, characterized in that: The semiconductor thermoelectric element (3) switches between heating and cooling modes by adjusting the direction of the current, thereby achieving rapid and reversible switching of the adhesion state of the thermosensitive hydrogel (1).

10. A method of operating the end effector according to any one of claims 1-9, characterized in that, Includes the following steps: The end effector is connected to the robotic arm via the flange structure (42) of the mounting base (4), so that the cooling channel (41) of the mounting base (4) is connected to the external water cooling circulation system. The liquid in the storage chamber is injected into the microchannel (12) of the temperature-sensitive hydrogel (1) by the micro peristaltic pump (21) until the humidity sensor (22) reading is stable. The semiconductor thermoelectric element (3) stops working, the temperature-sensitive hydrogel (1) remains consistent with the ambient temperature, the humidity sensor (22) continuously monitors the humidity, and when the humidity is lower than the first threshold, the micro peristaltic pump (21) is started to replenish the liquid until the humidity reaches the second threshold. After receiving the grabbing instruction, the semiconductor thermoelectric sheet (3) is controlled to enter the cooling mode. The temperature sensor (32) is used to adjust the temperature so that the temperature of the thermosensitive hydrogel (1) is lower than its minimum critical phase transition temperature, the surface viscosity increases, and the robotic arm controls the end effector to contact and adsorb the object. After receiving the release command, the current direction of the semiconductor thermoelectric element (3) is reversed, causing it to enter the heating mode. The temperature of the thermosensitive hydrogel (1) is higher than its minimum critical phase transition temperature, the surface viscosity decreases, the object falls off, and then the system returns to the standby state.

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