Semiconductor process equipment and gas distribution assembly

Abstract

The invention relates to the technical field of semiconductor processes, in particular to semiconductor process equipment and a gas distribution assembly. Due to the fact that the number of the gas distribution channels of the gas distribution assembly is at least two, the driving magnetic piece in the gas distribution valve structure can drive the driven magnetic piece to move, the through-flow area of the gas distribution channels is changed through the driven magnetic piece, the gas flow in the gas distribution channels is adjusted, and the gas distribution mode is changed. Compared with an existing fixed gas distribution mode, the gas distribution mode in the gas distribution assembly can be adjusted, different requirements of different processes and materials for gas can be better met, and the problem that the gas distribution mode in an existing gas distribution system is poor in adaptability to different gas requirements is solved. In addition, the driving magnetic piece drives the driven magnetic piece through the magnetic acting force between the driving magnetic piece and the driven magnetic piece, abrasion between parts can be reduced, and the stability of the equipment is enhanced.

Description

[0001] This application is a divisional application of the original Chinese invention patent application entitled "A Semiconductor Process Equipment and Gas Distribution Component". The original application number is 202510157283.9; the original application date is February 12, 2025. Technical Field

[0002] This application relates to the field of semiconductor process technology, specifically to a semiconductor process equipment and a gas distribution component. Background Technology

[0003] In semiconductor manufacturing processes, the flow rate, direction, and uniformity of gas injected into the reaction chamber of semiconductor process equipment directly affect the processing accuracy and product quality, including etching and thin film deposition. Traditional gas distribution systems typically employ fixed vent structures, which are insufficient to meet the flexible requirements of different processes.

[0004] In the current gas distribution structure of semiconductor process equipment, gas is introduced into the reaction chamber from an external gas source and distributed into the reaction chamber according to pre-designed gas distribution holes. The shape and position of the distribution holes on the gas distribution plate determine the gas distribution pattern. This fixed gas distribution pattern has poor adaptability to the gas requirements of different processes and materials. Summary of the Invention

[0005] The purpose of this application is to provide a gas distribution component for semiconductor process equipment, in order to improve the problem of poor adaptability of gas distribution patterns to different gas requirements in current gas distribution systems.

[0006] In addition, the purpose of this application is to provide a semiconductor process apparatus using the above-mentioned gas distribution components.

[0007] In a first aspect, one embodiment provides a gas distribution component, the gas distribution component being applied to semiconductor process equipment, comprising: An air intake cover having an air intake hole for gas to enter; A gas distribution plate having at least two gas distribution holes for injecting gas into the reaction chamber of a semiconductor process equipment; an air inlet cover and the gas distribution plate being arranged in the thickness direction of the gas distribution plate; and a gas distribution assembly having at least two gas distribution channels connecting the gas distribution holes and the air inlet holes. And an air distribution valve structure, the air distribution valve structure including an active magnetic component and a driven magnetic component, the active magnetic component can drive the driven magnetic component to move through the magnetic force between the active magnetic component and the driven magnetic component, so that the driven magnetic component changes the flow area of ​​the air distribution channel to adjust the air flow rate in the air distribution channel; The driven magnetic component includes a driven magnetic ring, and the active magnetic component includes an active magnetic ring. The driven magnetic ring and the active magnetic ring are arranged coaxially. The active magnetic ring drives the driven magnetic ring to rotate, thereby changing the flow area of ​​the air distribution channel.

[0008] In a further embodiment, the active magnetic element is located on the side of the air inlet cover facing away from the air distribution plate, the driven magnetic element and the active magnetic element are arranged at intervals in the thickness direction of the air inlet cover, the driven magnetic element is located within the gas distribution assembly, and the air inlet cover separates the driven magnetic element and the active magnetic element.

[0009] Furthermore, in one embodiment, the gas distribution channel includes an elongated channel and an adjustment channel, with at least two gas distribution holes communicating with the same elongated channel; the elongated channel is connected to the air inlet through the adjustment channel; each adjustment channel has an adjustment port for gas to enter, and the adjustment ports of each adjustment channel are arranged in a ring, and the driven magnetic component adjusts the gas flow rate in the gas distribution channel by adjusting the flow area of ​​the adjustment port.

[0010] In a further embodiment, the driven magnetic element includes a sphere, which is used to block the adjustment port to close the adjustment channel; The sphere is fixed to the driven magnetic ring. The sphere is an elastic sphere so as to block the adjustment port through elastic deformation, or the sphere is movably connected to the driven magnetic ring so that the sphere can move relative to the driven magnetic ring to open and close the adjustment port.

[0011] In a further embodiment, the gas distribution assembly includes a gas guide plate, which is detachably installed between the air inlet cover and the gas distribution plate, the driven magnetic element is installed in the gas guide plate, and at least a portion of the gas distribution channel is located in the gas guide plate.

[0012] In another embodiment, the gas distribution assembly includes an external drive mechanism that drives the active magnetic element to move.

[0013] Furthermore, in one embodiment, at least one air distribution channel is a first air distribution channel, and at least one air distribution channel is a second air distribution channel. The movement stroke of the driven magnetic component includes a first position where the first air distribution channel and the second air distribution channel are both opened, a second position where the first air distribution channel is both opened and the second air distribution channel is both closed, and a third position where the second air distribution channel is both opened and the first air distribution channel is both closed.

[0014] Furthermore, in one embodiment, the flow area of ​​at least two of the air distribution channels is adjusted by the same driven magnetic element.

[0015] In a second aspect, one embodiment provides a semiconductor process apparatus, including a reaction chamber and a gas distribution assembly as described in any embodiment of the first aspect.

[0016] According to the gas distribution assembly of the above embodiments, since the gas distribution assembly has at least two gas distribution channels, the active magnetic component in the gas distribution valve structure can drive the driven magnetic component to move, causing the driven magnetic component to change the flow area of ​​the gas distribution channel, thereby adjusting the gas flow rate in the gas distribution channel and changing the gas distribution pattern. Compared with the currently fixed gas distribution pattern, the gas distribution pattern in the gas distribution assembly of this application is adjustable, which can better adapt to the different gas requirements of different processes and materials, and improve the problem of poor adaptability of the gas distribution pattern to different gas requirements in the current gas distribution system. In addition, the active magnetic component drives the driven magnetic component through the magnetic force with the driven magnetic component, which can reduce the wear between components and enhance the stability of the equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram showing the positions of the gas distribution component and the reaction chamber in one embodiment; Figure 2 This is a cross-sectional view of the gas distribution assembly and the reaction chamber in one embodiment; Figure 3 for Figure 1 Exploded view of the gas distribution components and reaction chamber; Figure 4 This is a schematic diagram of the airflow direction in a gas distribution channel in one embodiment; Figure 5 This is a schematic diagram of the air guide plate in one embodiment; Figure 6 This is a schematic diagram of the air guide plate in another embodiment; Figure 7 This is a cross-sectional view of the gas distribution component in another embodiment.

[0018] List of feature names corresponding to the reference numerals in the figure: 1. Reaction chamber; 11. Reaction chamber shell; 2. Gas distribution assembly; 21. Inlet cover; 211. Inlet port; 212. Inlet connector; 213. Inlet cover plate; 2131. Magnetic ring positioning groove; 22. Gas distribution plate; 221. Gas distribution hole; 222. Sealing ring; 223. Sealing ring; 23. Gas distribution valve structure; 231. Active magnetic component; 2311. Active magnetic ring 232. Driven magnetic component; 2321. Driven magnetic ring; 2322. Sphere; 2323. Magnetic ring hole; 24. Air distribution channel; 241. First air distribution channel; 242. Second air distribution channel; 243. Third air distribution channel; 244. Annular channel; 245. Adjustment channel; 2451. Adjustment port; 25. Connecting rib; 26. Air guide plate; 261. Plate body; 262. Air guide cover plate; 3. Bearing seat.

[0019] Explanation of reference numerals in parentheses in the accompanying drawings: The feature referred to by the reference numerals in parentheses in the accompanying drawings is the feature represented by both the number inside the parentheses and the number outside the parentheses. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0021] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0022] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include direct connection, indirect connection, and contact connection (linkage).

[0023] The embodiments described in the detailed implementation can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different embodiments. In order to avoid unnecessary repetition, the various possible combinations of the embodiments will not be described separately.

[0024] To address the problem that current gas distribution structures using fixed gas distribution patterns cannot adapt to different gas distribution requirements, this application employs a gas distribution valve structure that can adjust the gas flow rate in the gas distribution channel, thereby changing the gas distribution pattern of the gas distribution component and adapting to different gas distribution needs. The gas distribution component and semiconductor process equipment of this application will be described in detail below with reference to the accompanying drawings.

[0025] Please refer to Figure 1 The semiconductor process equipment includes a reaction chamber 1 and a gas distribution assembly 2, the gas distribution assembly 2 being used to supply gas to the reaction chamber 1. In one embodiment, please refer to... Figure 1 The gas distribution assembly 2 is located at the top of the reaction chamber 1. In one embodiment, please refer to... Figure 1 The reaction chamber 2 contains a support 3 for holding the wafer. Semiconductor processing equipment can perform processes such as etching, chemical vapor deposition, and physical vapor deposition.

[0026] Please refer to Figures 1 to 7 The gas distribution assembly 2 includes an inlet cover 21, a gas distribution plate 22, and a gas distribution valve structure 23. The inlet cover 21 has an inlet hole 211 for gas to enter. The inlet cover 21 and the gas distribution plate 22 are arranged in the thickness direction of the gas distribution plate 22. The gas distribution plate 22 has at least two gas distribution holes 221 for spraying gas into the reaction chamber 1 of the semiconductor process equipment. The gas distribution assembly 2 has at least two gas distribution channels 24 that connect the gas distribution holes 221 and the inlet hole 211. After the gas enters the gas distribution channel 24 through the inlet hole 211, it enters the gas distribution hole 221 through the gas distribution channel 24, and then enters the reaction chamber through the gas distribution hole 221.

[0027] To adapt to different air distribution needs, the air distribution valve structure 23 includes an active magnetic component 231 and a driven magnetic component 232. The active magnetic component 231 can drive the driven magnetic component 232 to move through the magnetic force between itself and the driven magnetic component 232. The driven magnetic component 232 is used to change the flow area of ​​the air distribution channel 24 to adjust the air flow rate in the air distribution channel 24.

[0028] Since the gas distribution assembly 2 has at least two gas distribution channels 24, the active magnetic component 231 in the gas distribution valve structure 23 can drive the driven magnetic component 232 to move, causing the driven magnetic component 232 to change the flow area of ​​the gas distribution channel 24, thereby adjusting the gas flow rate in the gas distribution channel 24 and changing the gas distribution pattern. Compared with the current fixed gas distribution pattern, the gas distribution pattern in the gas distribution assembly 2 of this application is adjustable, which can better adapt to the different gas requirements of different processes and materials, and improve the problem of poor adaptability of the gas distribution pattern to different gas requirements in the current gas distribution system. In addition, the active magnetic component 231 drives the driven magnetic component 232 through the magnetic force between the active magnetic component 231 and the driven magnetic component 232, which can reduce the wear between components and enhance the stability of the equipment.

[0029] To improve the uniformity of gas distribution, the layout of the gas distribution holes 221 on the gas distribution plate 22 can adopt various feasible schemes. For example, in one embodiment, please refer to... Figure 2 and Figure 4 The air distribution holes 221 arranged in a ring shape form an air distribution hole group, and the number of air distribution hole groups is two or more. In one embodiment, please refer to... Figure 4 The air distribution hole group has three vents. In some other embodiments, the air distribution hole group may also have two, four, or five vents. For some application scenarios, please refer to [reference needed]. Figure 4 To ensure a more uniform airflow distribution between the central and edge regions of the air distribution plate 22, the flow area of ​​the air distribution holes 221 near the center of the air distribution plate 22 is smaller than that of the air distribution holes 221 farther from the center of the air distribution plate 22. That is, the closer the air distribution hole 221 is to the center of the air distribution plate 22, the smaller its flow area; and the farther away it is from the center of the air distribution plate 22, the larger its flow area. For example, in an embodiment not shown, the air distribution holes 221 are arrayed on the air distribution plate 22, and the air distribution holes 221 are evenly distributed on the air distribution plate 22.

[0030] In one embodiment, please refer to Figure 2 To facilitate operation of the active magnetic component 231, it is positioned on the side of the air inlet cover 21 facing away from the air distribution plate 22. The driven magnetic component 232 is spaced apart from the active magnetic component 231 along the thickness direction of the air inlet cover 21. The driven magnetic component 232 is located within the gas distribution assembly 2, and the air inlet cover 21 separates the driven magnetic component 232 from the active magnetic component 231. The active magnetic component 231 is positioned on the outside of the air inlet cover 21 for easy operation or connection to the drive mechanism.

[0031] In one embodiment (not shown), the gas distribution assembly 2 includes an external drive mechanism that drives the active magnetic element 231 to move. Regarding the form of the external drive mechanism, in one embodiment, the external drive mechanism includes a motor that drives the active magnetic element 231 to rotate, suitable for automated operation. In one embodiment, where high precision is required, a servo motor can be used to achieve precise rotation angle control.

[0032] In one embodiment, by connecting an intelligent control system to an external drive mechanism, automated gas distribution adjustment and process parameter setting can be achieved, further improving the controllability and precision of the process.

[0033] In some other embodiments, in addition to using an external drive mechanism to drive the active magnetic component 231, the external magnetic component can also be manually rotated.

[0034] In one embodiment, please refer to Figures 2 to 4 The flow area of ​​at least two gas distribution channels 24 is adjusted by the same driven magnetic element 232. Through the linkage control of the active magnetic element 231 and the driven magnetic element 232, at least two gas distribution channels 24 can be dynamically adjusted, enabling real-time adjustment of gas distribution and adjustment of the gas distribution holes 221 in different areas.

[0035] Specifically, in one embodiment, please refer to Figure 2 and Figure 4 At least one air distribution channel 24 is a first air distribution channel 241, and at least one air distribution channel 24 is a second air distribution channel 242. During the movement stroke of the driven magnetic component 232, there is a first position where the first air distribution channel 241 is opened and the second air distribution channel 242 is opened, a second position where the first air distribution channel 241 is opened and the second air distribution channel 242 is closed, and a third position where the second air distribution channel 242 is opened and the first air distribution channel 241 is closed.

[0036] Furthermore, in another embodiment, please refer to... Figure 2 and Figure 4 At least one air distribution channel 24 is a third air distribution channel 243, and at least one of the first air distribution channel 241, the second air distribution channel 242, and the third air distribution channel 243 is in an open state. Depending on the usage requirements, any one or any two of the first air distribution channel 241, the second air distribution channel 242, and the third air distribution channel 243 can be closed. Alternatively, all of the first air distribution channel 241, the second air distribution channel 242, and the third air distribution channel 243 can be opened. In some other embodiments, the number of air distribution channels 24 can be increased or decreased as needed, in addition to the two or three provided in the above embodiments, such as four, five, or six.

[0037] Regarding the form of the active magnetic element 231 and the driven magnetic element 232, in one embodiment, please refer to... Figure 2 and Figure 3 The driven magnetic element 232 includes a driven magnetic ring 2321, and the active magnetic element 231 includes an active magnetic ring 2311. The driven magnetic ring 2321 and the active magnetic ring 2311 are arranged coaxially. The active magnetic ring 2311 drives the driven magnetic ring 2321 to rotate, thereby changing the flow area of ​​the air distribution channel 24. Specifically, in one embodiment, please refer to... Figure 2 and Figure 3 The flow area of ​​each air distribution channel 24 is adjusted by the driven magnetic ring 2321.

[0038] In one embodiment, both the active magnetic element 231 and the driven magnetic element 232 are made of permanent magnet material. For another embodiment, please refer to... Figure 2 and Figure 4 Both the active magnetic ring 2311 and the driven magnetic ring 2321 are multi-pole distributed magnetic rings. In the circumferential direction of the magnetic ring, the multi-pole distributed magnetic ring includes multiple alternating N poles and S poles. During the rotation of the active magnetic ring 2311, the driven magnetic ring 2321 is driven to rotate by utilizing the principle of like poles repulsion and unlike poles attraction.

[0039] In one embodiment, please refer to Figure 2 The active magnetic ring 2311 and the driven magnetic ring 2321 are arranged in the thickness direction of the air intake cover 21. In some other embodiments, the active magnetic ring 2311 and the driven magnetic ring 2321 can also be nested together, for example, the active magnetic ring 2311 is located outside the driven magnetic ring 2321. In some other embodiments, the active magnetic element 231 and the driven magnetic element 232 can also adopt a disk structure in addition to using magnetic rings.

[0040] In some other embodiments, in addition to driving the driven magnetic element 232 to rotate, the active magnetic element 231 can also drive the driven magnetic element 232 to reciprocate along a straight line.

[0041] In one embodiment, please refer to Figure 2 and Figure 3 To facilitate the installation of the active magnetic ring 2311, the air intake cover 21 includes an air intake connector 212 and an air intake cover plate 213. The air intake connector 212 is fixed on the air intake cover plate 213. The air intake cover plate 213 has a magnetic ring positioning groove 2131. At least a portion of the active magnetic ring 2311 is installed in the magnetic ring positioning groove 2131. The magnetic ring positioning groove 2131 positions the active magnetic ring 2311, facilitating the installation of the active magnetic ring 2311.

[0042] In one embodiment, please refer to Figure 2 , Figure 4 and Figure 5The gas distribution channel 24 includes an annular channel 244 and an adjusting channel 245, with at least two gas distribution holes 221 communicating with the same annular channel 244. The annular channel 244 communicates with the air inlet 211 through the adjusting channel 245, and the annular channels 244 of each gas distribution channel 24 are arranged from the center to the edge of the gas distribution plate 22. Each adjusting channel 245 has an adjusting port 2451 for gas entry, and the adjusting ports 2451 of each adjusting channel 245 are arranged in annularity. The driven magnetic element 232 adjusts the gas flow rate in the gas distribution channel 24 by adjusting the flow area of ​​the adjusting port 2451. The adjusting port 2451 is led to the location of the driven magnetic element 232 through the adjusting channel 245, so that the driven magnetic element 232 can control multiple gas distribution channels 24.

[0043] In some other embodiments, in addition to using an annular channel 244, the air distribution channel 24 can also be a long strip channel, which can be either a straight channel or a curved channel.

[0044] It should be noted that the annular channel 244 in this application can be not only a circular annular channel 244, but also other closed channels, such as square channels, elliptical channels, polygonal channels, etc.

[0045] In one embodiment, please refer to Figures 2 to 4 The air distribution plate 22 is a circular plate. In some other embodiments, the air distribution plate 22 may also be an elliptical plate, a polygonal plate, etc.

[0046] Regarding the specific form of the annular channel 244, please refer to one embodiment. Figure 2 , Figure 4 and Figure 5 The annular channel 244 is provided with connecting ribs 25. In one embodiment, to reduce the influence of the connecting ribs 25 on the airflow, the same annular channel 244 corresponds to multiple regulating channels 245, and the regulating ports 2451 of the multiple regulating channels 245 are all adjusted by the driven magnetic element 232 to regulate the flow area. In one embodiment, the regulating channel 245 communicating with the annular channel 244 on the outer side is connected by the connecting ribs 25 in the annular channel 244 on the inner side, that is, the connecting ribs 25 on the inner side also serve as the carriers of the regulating channel 245. Specifically, in one embodiment, please refer to... Figure 4 and Figure 5 There are four connecting ribs 25 in a ring channel 244.

[0047] In one embodiment, as another variation of the annular channel 244, the connecting ribs 25 in the annular channel 244 divide the annular channel 244 into multiple independent elongated channels, where "independent" means that the gas between adjacent channels does not flow between them.

[0048] Regarding the cooperation method between the driven magnetic component 232 and the adjustment port 2451, please refer to one embodiment. Figures 2 to 5 The driven magnetic element 232 includes a ball 2322, which is used to block the adjustment port 2451 to close the adjustment channel 245. In another embodiment, please refer to... Figure 6 and Figure 7 One side of the driven magnetic ring 2321 is an annular surface capable of blocking the regulating port 2451. The driven magnetic ring 2321 can directly block the regulating port 2451 to close the regulating channel 245. In order to open the regulating port 2451, the driven magnetic ring 2321 also has a magnetic ring hole 2323. One end of the magnetic ring hole 2323 is located on the annular surface blocking the regulating port 2451. When it is necessary to open the regulating channel 245, the driven magnetic ring 2321 is rotated so that the opening of the magnetic ring hole 2323 communicates with the regulating port 2451, thus connecting the regulating channel 245 with the air inlet 211. In one embodiment, the driven magnetic ring 2321 can also block a portion of the regulating port 2451 to reduce the flow area of ​​the air distribution channel 24. In some other embodiments, for ease of manufacturing, the gas distribution assembly may also include an adjustment ring fixed to the driven magnetic ring 2321, which can block the adjustment port 2451 or change the flow area of ​​the adjustment port 2451.

[0049] Based on the above, it should be noted that the change of the flow area of ​​the air distribution channel 24 described in this application includes both reducing the flow area of ​​the air distribution channel 24 to a set value and closing the air distribution channel 24, that is, reducing the flow area of ​​the air distribution channel 24 to zero. For example, when the driven magnetic ring 2321 blocks the adjustment port 2451 through the annular surface, the flow area of ​​the air distribution channel 24 is adjusted by changing the area of ​​the connection between the adjustment port 2451 and the opening of the magnetic ring hole 2323. When the adjustment port 2451 and the opening of the magnetic ring hole 2323 are misaligned, the adjustment port 2451 and the magnetic ring hole 2323 are no longer connected. At this time, the adjustment port 2451 is closed, and the corresponding air distribution channel 24 is closed.

[0050] When using the sphere 2322, the sphere 2322 and the driven magnetic ring 2321 can adopt various feasible connection relationships. For example, in one embodiment, please refer to... Figure 2 and Figure 3The sphere 2322 is fixed to the driven magnetic ring 2321. The sphere 2322 is an elastic sphere 2322, which can seal the adjustment port 2451 through elastic deformation. The sphere 2322 can be made of polytetrafluoroethylene or rubber. The sphere 2322 and the driven magnetic ring 2321 can be fixed to the driven magnetic ring 2321 by snap-fit, adhesive or other methods. Alternatively, a magnetic sheet can be fixed to the elastic sphere 2322 so that the elastic sphere 2322 and the driven magnetic ring 2321 are magnetically attracted and fixed. For example, in another embodiment not shown, the sphere 2322 and the driven magnetic ring 2321 are movably connected, and the sphere 2322 can move relative to the driven magnetic component 232 to open and close the adjustment port 2451. When the adjustment port 2451 needs to be opened, the driven magnetic ring 2321 is rotated, pulling the ball 2322 out of the adjustment port 2451. When the adjustment port 2451 needs to be blocked, the driven magnetic ring 2321 is rotated to allow the ball 2322 to enter the adjustment port 2451. Regarding the form of movable connection between the ball 2322 and the driven magnetic ring 2321, in some scenarios, the ball 2322 can be connected to the driven magnetic ring 2321 through a flexible coupling or a flexible shaft. Of course, the ball 2322 can also be connected to the driven magnetic ring 2321 through a movable rocker arm.

[0051] In one embodiment, to facilitate the movement of the ball 2322 driven by the driven magnetic ring 2321, the diameter of the ball 2322 should be much larger than the diameter of the adjustment port 2451, for example, the diameter of the ball 2322 should be more than twice the diameter of the adjustment port 2451. This makes it easier for the ball 2322 to be brought out of the adjustment port 2451.

[0052] It should be noted that the seal between the sphere 2322 and the regulating port 2451 relies not only on gravity but also on the vacuum effect during the evacuation of the reaction chamber 1. Under the vacuum, the sphere 2322 and the regulating port 2451 are locked together. When the reaction chamber 1 is evacuated and the reaction gas is injected, the sphere 2322 and the regulating port 2451 can remain in a sealed state. When the active magnetic ring 2311 rotates, the magnetic force between the active magnetic ring 2311 and the driven magnetic ring 2321 drives the driven magnetic ring 2321 to move, and the driven magnetic ring 2321 carries the sphere 2322 out of the regulating port 2451.

[0053] For ease of design of the air distribution channel 24, in one embodiment, please refer to... Figures 2 to 4 The gas distribution assembly 2 includes a guide plate 26, which is detachably mounted between the inlet cover 21 and the distribution plate 22. A driven magnetic component 232 is mounted in the guide plate 26, and at least a portion of the distribution channel 24 is located within the guide plate 26. This allows the guide plate 26, inlet cover 21, and distribution plate 22 to be detachable, enabling them to be machined separately and facilitating the forming of the distribution channel 24. Furthermore, parts of suitable dimensions can be adjusted and replaced according to process requirements, simplifying assembly maintenance and reducing operating costs.

[0054] Specifically, in one embodiment, please refer to Figure 2 and Figure 3 To facilitate the sealing between the air guide plate 26 and the air distribution plate 22, a sealing ring 222 is provided on the air distribution plate 22. The sealing ring 222 is sealed to the air guide plate 26 through a sealing ring 223. The air distribution channel 24 is located between adjacent sealing rings 222. The sealing rings 222 are fixed to the air distribution plate 22 by welding, bonding, or integral molding.

[0055] In some embodiments, please refer to Figure 1 and Figure 2 The reaction chamber 1 has a reaction chamber shell 11, an air inlet cover 21, an air guide plate 26, an air distribution plate 22, and the reaction chamber shell 11 can be installed together in a variety of feasible ways. For example, it can be fastened with bolts, combined with a quick disassembly design, to facilitate on-site maintenance and replacement; or, a slide groove or plug-in buckle can be designed in the frame of the semiconductor process equipment to support the quick disassembly and precise positioning of the gas distribution components; or, a snap-fit ​​connection can also be used to facilitate quick assembly and disassembly.

[0056] Regarding the assembly sequence, in one embodiment, the air inlet cover 21, the air guide plate 26, and the air distribution plate 22 are screwed into the reaction chamber shell 11 for fixation. Alternatively, the air inlet cover 21, the air guide plate 26, and the air distribution plate 22 can be fixed together using bolts, snap-fits, adhesives, or interference fits, and then the entire assembly is fixed to the reaction chamber shell 11. Another option is to fix the air inlet cover 21 and the air guide plate 26 together, and then the entire assembly is fixed to the air distribution plate 22.

[0057] In some other embodiments, the gas distribution component 2 may not have a gas guide plate 26. For example, the gas distribution channel 24 may be built into the air inlet cover 21 or the gas distribution plate 22. Alternatively, the air inlet cover 21 and the gas distribution plate 22 may be fixed together to form the gas distribution channel 24. Correspondingly, the driven magnetic component 232 may be installed on the air inlet cover 21 or the gas distribution plate 22 as needed.

[0058] To further facilitate the processing of the air distribution plate 22, in one embodiment, please refer to... Figure 2 and Figure 3 The air guide plate 26 includes a plate body 261 and an air guide cover plate 262, with the air guide cover plate 262 positioned between the plate body 261 and the air guide plate 26. The air guide cover plate 262 and the plate body 261 are sealed by welding. In some other embodiments, the air guide cover plate 262 and the plate body 261 can also be fixed and sealed with the sealing ring 223 by means of bolt connection, welding, snap-fit, bonding, or interference fit.

[0059] In one embodiment, to facilitate monitoring of the airflow status, the gas distribution component 2 includes a gas sensor for detecting the gas flow rate and / or pressure. The gas sensor is provided at the air inlet 211 and / or the air outlet and / or the air distribution channel 24.

[0060] In summary, by employing an adjustable gas distribution component, the opening and closing states of the gas distribution holes 221 can be precisely controlled, overcoming the uneven distribution caused by the traditional fixed gas distribution hole design. The precise arrangement of the gas guide plate 26 and the gas distribution holes 221 significantly improves the uniformity of gas distribution during etching and thin film deposition processes, reducing the difference in deposition rates between the center and the edges. The magnetic ring adjustment mechanism allows the equipment to flexibly adjust the outlet gas position and flow rate according to process requirements, achieving precise gas supply for substrates of different sizes and shapes. For example, for small-sized substrates (such as 2-inch and 4-inch wafers), only the gas distribution channel 24 near the center of the gas distribution plate 22 can be opened, concentrating the gas supply to the small-sized substrate located in the center and reducing unnecessary gas diffusion and waste. For large-sized substrates (such as 12-inch wafers), all gas distribution channels 24 can be opened, including those near the center of the gas distribution plate 22 and those far from the center, ensuring uniform gas supply to all areas of the large-sized substrate surface and improving the problem of inconsistent process results between the center and the edges.

[0061] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A gas distribution assembly, wherein the gas distribution assembly is used in semiconductor process equipment, characterized in that, include: An air intake cover having an air intake hole for gas to enter; A gas distribution plate having at least two gas distribution holes for injecting gas into the reaction chamber of a semiconductor process equipment; an air inlet cover and the gas distribution plate being arranged in the thickness direction of the gas distribution plate; and a gas distribution assembly having at least two gas distribution channels connecting the gas distribution holes and the air inlet holes. And an air distribution valve structure, the air distribution valve structure includes an active magnetic component and a driven magnetic component, the active magnetic component can drive the driven magnetic component to move through the magnetic force between the active magnetic component and the driven magnetic component, so that the driven magnetic component changes the flow area of ​​the air distribution channel to adjust the air flow rate in the air distribution channel; The driven magnetic component includes a driven magnetic ring, and the active magnetic component includes an active magnetic ring. The driven magnetic ring and the active magnetic ring are arranged coaxially. The active magnetic ring drives the driven magnetic ring to rotate, thereby changing the flow area of ​​the air distribution channel.

2. The gas distribution assembly of claim 1, wherein, The active magnetic component is located on the side of the air inlet cover facing away from the air distribution plate. The driven magnetic component and the active magnetic component are arranged at intervals in the thickness direction of the air inlet cover. The driven magnetic component is located within the gas distribution assembly. The air inlet cover separates the driven magnetic component from the active magnetic component.

3. The gas distribution assembly of claim 1 or 2, wherein, The gas distribution channel includes an elongated channel and an adjustment channel. At least two of the gas distribution holes are connected to the same elongated channel. The elongated channel is connected to the air inlet through the adjustment channel. Each of the adjustment channels has an adjustment port for gas to enter. The adjustment ports of each adjustment channel are arranged in a ring. The driven magnetic component adjusts the gas flow rate in the gas distribution channel by adjusting the flow area of ​​the adjustment port.

4. The gas distribution assembly of claim 3, wherein, The driven magnetic component includes a ball, which is used to block the adjustment port to close the adjustment channel; The sphere is fixed to the driven magnetic ring. The sphere is an elastic sphere so as to block the adjustment port through elastic deformation, or the sphere is movably connected to the driven magnetic ring so that the sphere can move relative to the driven magnetic ring to open and close the adjustment port.

5. The gas distribution assembly as described in claim 1 or 2, characterized in that, The gas distribution assembly includes a gas guide plate, which is detachably installed between the air inlet cover and the gas distribution plate. The driven magnetic element is installed in the gas guide plate, and at least a portion of the gas distribution channel is located in the gas guide plate.

6. The gas distribution assembly of claim 1 or 2, wherein, The gas distribution assembly includes an external drive mechanism that drives the movement of the active magnetic component.

7. The gas distribution assembly of claim 1 or 2, wherein, At least one air distribution channel is a first air distribution channel, and at least one air distribution channel is a second air distribution channel. The movement stroke of the driven magnetic component includes a first position where the first air distribution channel and the second air distribution channel are both opened, a second position where the first air distribution channel is both opened and the second air distribution channel is both closed, and a third position where the second air distribution channel is both opened and the first air distribution channel is both closed.

8. The gas distribution assembly of claim 1 or 2, wherein, The flow area of ​​at least two of the air distribution channels is adjusted by the same driven magnetic element.

9. A semiconductor process apparatus, comprising a reaction chamber and a gas distribution assembly as described in any one of claims 1-8.

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