Temperature monitoring method and system for satellite-borne active phased array transceiver assembly

Abstract

The invention belongs to the field of thermal control of spacecrafts, particularly relates to a temperature monitoring method and system for a satellite-borne active phased array transceiver assembly, and aims to solve the problem of how to realize intelligent temperature monitoring capable of reflecting overall temperature field distribution. The method comprises the following steps: dividing an area into M monitoring areas according to the temperature distribution of the area where a transceiving component is located; arranging thermistors in the M monitoring areas, wherein the higher the temperature of the monitoring area is, the larger the arrangement density of the thermistors is; setting M slave nodes, and collecting voltage information of the thermistor through a multiplexing switch; a master node is arranged, the master node is connected with the slave nodes through a daisy chain, and the higher the temperature of the monitoring area is, the closer the corresponding slave nodes are to the master node; and the measured temperature of each thermistor is calculated according to the voltage information received by the main node. According to the temperature monitoring method and system for the satellite-borne active phased array transceiver assembly, capturing of local high-temperature hot spots and temperature gradient reconstruction and monitoring of a whole-region temperature field are achieved.

Description

Technical Field

[0001] This invention belongs to the field of spacecraft thermal control, specifically relating to a method and system for temperature monitoring of a spaceborne active phased array transceiver component. Background Technology

[0002] The spaceborne transceiver (TR) module is the core of an active phased array antenna. During the operation of the spaceborne TR module, a large amount of heat is generated due to energy losses in electronic components such as RF power amplification and signal processing. Temperature is a key parameter affecting the performance and reliability of the spaceborne TR module, and its changes are directly related to the core performance indicators of the module.

[0003] Traditional temperature monitoring methods (such as single-point thermocouples) can only collect temperature data at localized points, failing to reflect the overall temperature field distribution characteristics of the component and making it difficult to detect potential risks such as localized hot spots or abnormal temperature gradients. To cover the temperature monitoring needs of the component area, multiple sets of thermocouples need to be deployed, resulting in a significant increase in the number of wires. This not only increases the overall weight of the component, contradicting the satellite platform's requirement for "lightweight" payloads, but also increases assembly difficulty and the risk of failure due to the complexity of the wiring. Furthermore, existing temperature monitoring systems lack intelligent on-orbit adjustment and health management capabilities, failing to meet the requirements of highly reliable, long-life satellite platforms.

[0004] Therefore, how to achieve intelligent temperature monitoring that can reflect the overall temperature field distribution is an urgent problem to be solved. Summary of the Invention

[0005] To address the aforementioned technical problems in the prior art, namely how to achieve intelligent temperature monitoring that can reflect the overall temperature field distribution, this application provides a temperature monitoring method and system for a spaceborne active phased array transceiver component.

[0006] In a first aspect of this application, a temperature monitoring method for a spaceborne active phased array transceiver assembly is provided, the temperature monitoring method comprising:

[0007] The region is divided into M monitoring zones based on the temperature distribution of the area where the transceiver components are located. The temperature of the (i+1)th monitoring zone is greater than or equal to the temperature of the ith monitoring zone. ∈ And i is an integer;

[0008] Thermistors are deployed in M ​​monitoring areas. The thermistors are placed on a heat dissipation substrate near the transceiver component. The deployment positions of the thermistors and the transceiver components corresponding to the deployment positions are recorded. The deployment density of the thermistors in the (i+1)th monitoring area is greater than or equal to the deployment density of the thermistors in the ith monitoring area.

[0009] M slave nodes are set up, and the i-th slave node corresponds to the i-th monitoring area. The i-th slave node is used to collect the voltage information of each thermistor in the i-th monitoring area through a multiplexer.

[0010] A master node is set up, and the master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order of temperature from high to low in the corresponding monitoring area, and in order of proximity to distance.

[0011] The slave node sends the collected voltage information to the master node;

[0012] The master node calculates the measurement temperature corresponding to each thermistor based on the voltage information received.

[0013] Optionally, the step of calculating the measurement temperature corresponding to each thermistor based on the voltage information received by the master node includes:

[0014] The resistance value of the thermistor at the measurement temperature is calculated based on the voltage information. Where U represents the voltage information, and V represents the voltage unit, volt. This indicates the resistance value of the voltage divider resistor connected in series with the thermistor. For 1,000 euros;

[0015] According to the calculation formula The measured temperature T1 is obtained by solving the equation, where the temperatures of T1 and T2 are in Kelvin (K), R is the nominal resistance value of the thermistor at the nominal temperature T2, and B is the material constant of the thermistor.

[0016] Optionally, the temperature monitoring method further includes:

[0017] If a first over-limit thermistor exists, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted. The first over-limit thermistor is the thermistor whose measured temperature exceeds the preset absolute safety limit.

[0018] Optionally, the temperature monitoring method further includes:

[0019] If the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number, or if there are thermistors in the monitoring area with a heating rate greater than or equal to a preset first threshold, an alarm signal will be displayed. The second over-limit thermistors are the thermistors whose measured temperature is greater than or equal to a preset second threshold.

[0020] Optionally, the temperature monitoring method further includes:

[0021] If the measured temperature corresponding to a single thermistor is greater than or equal to the second threshold, mark the placement location of the thermistor and the transceiver component corresponding to the placement location.

[0022] Optionally, the temperature monitoring method further includes:

[0023] If the onboard active phased array transceiver component reaches the sunny area, the second threshold is set to the first temperature value; if the onboard active phased array transceiver component reaches the shadow area, the second threshold is set to the second temperature value, and the first temperature value is greater than the second temperature value.

[0024] Optionally, in the temperature monitoring method, the thermistor is covered with a diamond thermal pad so that the thermal resistance between the thermistor and the heat dissipation substrate is less than 0.3℃ / W.

[0025] In a second aspect of this application, a temperature monitoring system for a spaceborne active phased array transceiver assembly is provided, the temperature monitoring system comprising:

[0026] A thermistor is disposed on a heat dissipation substrate near the transceiver component. The thermistor's placement corresponds to the transceiver component, and the thermistor density in the (i+1)th monitoring area is greater than or equal to the thermistor density in the ith monitoring area. The monitoring area is obtained by dividing the area where the transceiver component is located according to temperature distribution, and the temperature of the (i+1)th monitoring area is greater than or equal to the temperature of the ith monitoring area. ∈ And i is an integer, and M is the number of monitored areas;

[0027] There are M slave nodes, with the i-th slave node corresponding to the i-th monitoring area. The i-th slave node includes a multiplexer, which is connected to the thermistors in the i-th monitoring area. The i-th slave node is used to collect the voltage information corresponding to each thermistor in the i-th monitoring area through the multiplexer and send the voltage information to the master node.

[0028] The master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order of decreasing temperature in their respective monitoring areas and in order of proximity to the master node.

[0029] The temperature monitoring unit is used to calculate the measurement temperature corresponding to each thermistor based on the voltage information received by the master node.

[0030] Optionally, the temperature monitoring unit is specifically used for:

[0031] The resistance value of the thermistor at the measurement temperature is calculated based on the voltage information. Where U represents the voltage information, and V represents the voltage unit, volt. This indicates the resistance value of the voltage divider resistor connected in series with the thermistor. For 1,000 euros;

[0032] According to the calculation formula The measured temperature T1 is obtained by solving the equation, where the temperatures of T1 and T2 are in Kelvin (K), R is the nominal resistance value of the thermistor at the nominal temperature T2, and B is the material constant of the thermistor.

[0033] Optionally, the temperature monitoring unit is further configured to:

[0034] Based on the measured temperature of the thermistor, it is determined whether there is a first over-limit thermistor. If there is a first over-limit thermistor, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted. The first over-limit thermistor is the thermistor whose measured temperature exceeds the preset absolute safety limit.

[0035] Optionally, the temperature monitoring unit is further configured to:

[0036] Based on the measured temperature of the thermistor, calculate the number of second over-limit thermistors in each monitoring area, and determine whether the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number.

[0037] If the number of the second over-limit thermistors in the same monitoring area is greater than or equal to the preset number, an alarm signal will be displayed. The second over-limit thermistor is the thermistor whose measured temperature is greater than or equal to the preset second threshold.

[0038] Alternatively, based on the measured temperature of the thermistor, the heating rate of each thermistor can be calculated, and it can be determined whether the heating rate is greater than or equal to a preset first threshold. If there is a thermistor in the monitoring area with a heating rate greater than or equal to the preset first threshold, an alarm signal can be displayed.

[0039] Optionally, the temperature monitoring unit is further configured to:

[0040] Determine whether the measured temperature corresponding to a single thermistor is greater than or equal to the second threshold. If the measured temperature corresponding to the thermistor is greater than or equal to the second threshold, mark the placement location of the thermistor and the transceiver component corresponding to the placement location.

[0041] Optionally, the temperature monitoring unit is further configured to:

[0042] If the onboard active phased array transceiver component reaches the sunny area, the second threshold is set to the first temperature value; if the onboard active phased array transceiver component reaches the shadow area, the second threshold is set to the second temperature value, and the first temperature value is greater than the second temperature value.

[0043] The temperature monitoring method and system for spaceborne active phased array transceiver components provided in this application employs a distributed thermistor sensor network and intelligent algorithms. It divides the monitoring area according to the temperature distribution of the TR component array surface and utilizes multiplexing cyclic gating to achieve precise reconstruction of the temperature field of the entire TR component array surface. This enables more accurate and effective real-time monitoring of the operating temperature of spaceborne multi-channel TR components, maintaining the TR component operating temperature within the required range, effectively ensuring the stable operation of the TR components, and guaranteeing signal quality. It also provides a basis for on-orbit adaptive calibration and fault prediction of the antenna, improving the reliability of core components and the lifespan of the satellite. Attached Figure Description

[0044] Figure 1 This is a flowchart illustrating one embodiment of the temperature monitoring method for the spaceborne active phased array transceiver component of this application.

[0045] Figure 2 This is a schematic diagram showing the layout and distribution of the thermistors;

[0046] Figure 3 This is a schematic diagram showing the connection between a multiplexer and a single thermistor.

[0047] Figure 4 This is a flowchart illustrating another implementation of the temperature monitoring method for the spaceborne active phased array transceiver component of this application.

[0048] Figure 5 This is a structural block diagram of one embodiment of the temperature monitoring system for the spaceborne active phased array transceiver component of this application. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, in conjunction with the accompanying drawings and examples, further clarifies this application. It should be understood that the specific examples described herein are merely illustrative and not intended to limit the scope of this application. Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0050] The present application will now be described in detail with reference to the accompanying drawings. A first aspect of this application provides a method for temperature monitoring of a spaceborne active phased array transceiver assembly. Figure 1 The diagram illustrates a flowchart of one embodiment of the temperature monitoring method for the spaceborne active phased array transceiver component of this application. Figure 1As shown, the temperature monitoring method for a spaceborne active phased array transceiver component according to the first embodiment of this application includes:

[0051] Step S101: Divide the area into M monitoring areas according to the temperature distribution of the area where the transceiver components are located, wherein the temperature of the (i+1)th monitoring area is greater than or equal to the temperature of the ith monitoring area, where... ∈ And i is an integer;

[0052] Step S102: Deploy thermistors in M ​​monitoring areas. The thermistors are placed on the heat dissipation substrate near the transceiver components. Record the deployment position of the thermistors and the transceiver components corresponding to the deployment positions. The deployment density of the thermistors in the (i+1)th monitoring area is greater than or equal to the deployment density of the thermistors in the ith monitoring area.

[0053] Step S103: Set up M slave nodes, with the i-th slave node corresponding to the i-th monitoring area. The i-th slave node is used to collect the voltage information corresponding to each thermistor in the i-th monitoring area through a multiplexer and send the collected voltage information to the master node.

[0054] Step S104: Set up a master node. The master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order from near to far according to the temperature of the corresponding monitoring area from high to low.

[0055] Step S105: Calculate the measurement temperature corresponding to each thermistor based on the voltage information received by the master node.

[0056] It should be noted that, within the TR module array, the area beneath heat-generating components such as power amplifier chips and signal processing electronic devices has a higher temperature, while other areas are cooler. This results in relatively high-temperature and relatively low-temperature regions within the TR module array area. Therefore, in step S101, the area can be divided into M monitoring regions based on the temperature distribution within the TR module area. This temperature distribution can be obtained in advance through trial operation or experimentation. The number of monitoring regions can be set according to actual monitoring needs. The division can be based on a gradient from high to low temperature. For example, if the difference between the highest and lowest temperatures in the TR module area is significant, more monitoring regions can be divided according to the gradient from high to low temperature for more precise monitoring of the temperature gradient. Conversely, if the difference between the highest and lowest temperatures is small, fewer monitoring regions can be divided according to the gradient from high to low temperature. The resulting M monitoring regions can be arranged according to the temperature of each monitoring region, where the temperature of the (i+1)th monitoring region is greater than or equal to the temperature of the ith monitoring region. ∈ And i is an integer, the temperature of each monitoring area can be the average temperature of each detection point in each monitoring area, and the detection point temperature is the temperature detected by the detection point set during trial operation or experiment.

[0057] In step S102, thermistors are deployed in M ​​monitoring areas and placed on the heat dissipation substrate near the transceiver component. Figure 2 A schematic diagram showing the layout of thermistors is provided; the red dots in the diagram represent thermistors. Figure 2 As shown, the higher the temperature of the monitoring area, the higher the density of thermistors. That is, the density of thermistors in the (i+1)th monitoring area is greater than or equal to the density of thermistors in the ith monitoring area, so as to achieve more accurate and timely monitoring of high-temperature areas. Simultaneously, the placement position of each thermistor and the corresponding TR component at the indicated placement position are recorded. Specifically, each thermistor and each TR component can be numbered separately. The indicated placement position can be represented by the number of the nearest TR component or the number of the nearest TR component plus the numbers of other nearby devices. That is, each thermistor can correspond to a TR component number. Each thermistor can correspond to one TR component number or multiple TR component numbers, meaning each thermistor can be near one or multiple TR components. "Near" can mean the distance between the thermistor and the TR component is within a set range. In this application, the thermistors are used to measure the operating temperature of TR components. Within a certain range, the operating temperatures are the same or similar, so one thermistor can correspond to multiple TR components. This application does not limit one thermistor to measuring the operating temperature of only one TR component, thereby reducing the number of sensor devices (thermometers) and wiring, and reducing the complexity of the temperature monitoring system. The placement locations can be recorded and stored in the form of a mapping table consisting of the thermistor number and the corresponding TR component number.

[0058] For example, the thermistors can be deployed on a heat dissipation substrate near the power amplifier chip and low-noise amplifier chip of each adjacent power module and TR component. For example, the thermistor can be an MF501 type thermistor with a material constant of 3950K±1%, and can be glass-encapsulated to ensure long-term stability and radiation resistance. Preferably, the thermistor can be covered with a diamond thermal pad, which can be a thin layer to ensure that the thermal resistance between the thermistor and the heat dissipation substrate is less than 0.3℃ / W. Preferably, aerospace-grade thermally conductive adhesive (EP77-TC) can be used to bond the thermistor to the heat dissipation substrate. For example, taking an X-band active phased array antenna of a sun-synchronous orbit SAR (Synthetic Aperture Radar) payload as an example, the antenna array contains 1024 TR components, which can be divided into 6 monitoring areas, with a total of 768 thermistors deployed as monitoring points.

[0059] Specifically, in step S103, M slave nodes are set, each corresponding to a monitoring area; that is, the i-th slave node corresponds to the i-th monitoring area. Each slave node includes a multiplexer switch, which is connected to each thermistor in the monitoring area corresponding to the slave node, to collect the voltage information of each thermistor. For example, Figure 3 This is a schematic diagram showing the connection between a multiplexer and a single thermistor, as shown below. Figure 3 As shown, a voltage divider resistor R can be added between the thermistor Rt and the multiplexer to facilitate the acquisition of the thermistor voltage information. For example, the multiplexer (MUX) can be a radiation-hardened ADI ADG52 series with 128 channels, each channel transmitting the voltage information of one thermistor. It should be noted that... Figure 3This diagram illustrates the connection between a multiplexer and a single thermistor. The entire thermistor voltage information acquisition circuit is not shown in the diagram, as existing technology can be used for this circuit, so it will not be described in detail. In one embodiment, the acquisition circuit may include a multiplexer, a high-precision constant current source, an analog-to-digital converter (ADC), and a radiation-hardened FPGA. The FPGA is configured to control the multiplexer to cyclically select each thermistor channel and acquire the voltage value of each channel through constant current source driving and ADC sampling. Simultaneously, a synchronous sample-and-hold circuit can be used to ensure that the voltage signals of each sensing channel within the same module are latched at the same time, thereby eliminating gradient measurement errors introduced by the timing difference of the sequential acquisition. The multiplexer is selected with a channel on-resistance matching degree better than ±0.5Ω to ensure the consistency of the measurement reference of each channel. The output of each thermistor sensing channel is connected to the sample-and-hold unit. The sample-and-hold unit can be composed of a radiation-hardened analog switch, a low dielectric absorption polypropylene holding capacitor, and a high input impedance buffer amplifier. The synchronous sampling pulse generated by the FPGA acts simultaneously on the control terminals of the sample-and-hold units of all channels, so that the instantaneous voltage values ​​of all channels are synchronously captured and held. Subsequently, the multiplexer sequentially selects the output of each sample-and-hold unit to the analog-to-digital converter (ADC) for digitization, thereby fundamentally eliminating the time difference error introduced by sequential acquisition and ensuring the authenticity of the gradient calculation value.

[0060] Specifically, in step S104, a master node is set up. The master node is connected to M slave nodes in a daisy-chain configuration. The M slave nodes are connected to the master node in descending order of temperature for their respective monitoring areas, and in ascending order of proximity. Therefore, the slave node corresponding to the monitoring area with the highest temperature is closest to the master node, and the slave node corresponding to the monitoring area with the lowest temperature is furthest from the master node, and so on. The closer a slave node is to the master node, the higher the temperature of the monitoring area it corresponds to. The daisy-chain connection method has the advantages of simple structure and less wiring. Since signals are sent and received cascaded through the nodes in the daisy chain, the slave node is closest to the master node, so its signal can be sent to the master node first, and the master node's signal can also be sent to the slave node first. Furthermore, the failure of other slave nodes will not affect the communication between the slave node and the master node. Therefore, the slave node with the higher temperature in the corresponding monitoring area is closer to the master node, which can ensure that the monitoring area with the higher temperature can be monitored more stably and timely.

[0061] It should be noted that both slave and master nodes are electronic devices containing chips. For example, the chip in the master node can be a high-performance radiation-hardened FPGA (Field-Programmable Gate Array), such as the Xilinx Virtex-5QV; the chip in the slave node can be a radiation-hardened FPGA, such as the Xilinx XC3S200AN. The slave node also includes a multiplexer switch.

[0062] Specifically, in step S105, after the master node receives the voltage information of the thermistor sent by the slave node, in one embodiment, the master node can calculate the corresponding measurement temperature of the thermistor based on the voltage information; in another embodiment, the master node can transmit the voltage information to the control center, and the control center can calculate the corresponding measurement temperature of the thermistor based on the voltage information. Specifically, the current resistance value of the corresponding thermistor is first calculated based on the voltage information (voltage value). Where U represents the voltage information, and V represents the voltage unit, volt. This indicates the resistance value of the voltage divider resistor connected in series with the thermistor. The resistance is kiloohms; then, based on the current resistance value of the thermistor, the corresponding measurement temperature is calculated, that is, the current measurement temperature at the location of the thermistor. Specifically, this is calculated using the formula: The measured temperature T1 is obtained by solving for T1 and T2, where the temperatures are in Kelvin (K), R is the nominal resistance value of the thermistor at the nominal temperature T2, and B is the material constant of the thermistor.

[0063] Figure 4 A flowchart illustrating another embodiment of the temperature monitoring method for the spaceborne active phased array transceiver component of this application is shown, as follows: Figure 4 As shown, the temperature monitoring method for a spaceborne active phased array transceiver component according to the second embodiment of this application includes:

[0064] Step S401: Divide the area into M monitoring areas according to the temperature distribution of the area where the transceiver components are located, wherein the temperature of the (i+1)th monitoring area is greater than or equal to the temperature of the ith monitoring area, where... ∈ And i is an integer;

[0065] Step S402: Deploy thermistors in M ​​monitoring areas. The thermistors are placed on the heat dissipation substrate near the transceiver components. Record the deployment position of the thermistors and the transceiver components corresponding to the deployment positions. The deployment density of the thermistors in the (i+1)th monitoring area is greater than or equal to the deployment density of the thermistors in the ith monitoring area.

[0066] Step S403: Set up M slave nodes, with the i-th slave node corresponding to the i-th monitoring area. The i-th slave node is used to collect the voltage information corresponding to each thermistor in the i-th monitoring area through a multiplexer and send the collected voltage information to the master node.

[0067] Step S404: Set up a master node. The master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order of temperature from high to low in their respective monitoring areas, and in order of proximity to distance.

[0068] Step S405: Calculate the measurement temperature corresponding to each thermistor based on the voltage information received by the master node;

[0069] Step S406: If a first over-limit thermistor exists, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted. The first over-limit thermistor is the thermistor whose measured temperature exceeds the preset absolute safety limit.

[0070] Step S407: If the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number, or if there are thermistors in the monitoring area with a heating rate greater than or equal to a preset first threshold, an alarm signal is displayed. The second over-limit thermistor is the thermistor whose measured temperature is greater than or equal to a preset second threshold.

[0071] Step S408: If the measured temperature corresponding to a single thermistor is greater than or equal to the second threshold, mark the placement location of the thermistor and the transceiver component corresponding to the placement location.

[0072] Step S409: If the onboard active phased array transceiver component reaches the sunshine area, the second threshold is set to the first temperature value; if the onboard active phased array transceiver component reaches the shadow area, the second threshold is set to the second temperature value, and the first temperature value is greater than the second temperature value.

[0073] Steps S401-S405 can be referred to steps S101-S105.

[0074] In one possible implementation, after calculating the measured temperature in steps S406-S409, different levels of early warning and corresponding operations can be performed based on the measured temperature. Specifically, in step S406, if there is a thermistor whose measured temperature exceeds the preset absolute safety limit, i.e., there is a first over-limit thermistor, it indicates that the operating temperature of the corresponding TR component has exceeded the safe temperature range, which is the most dangerous state. In this case, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted to ensure the safety of the TR component and the core components of the phased array. Specifically, in step S407, if there is a second over-limit thermistor with a measured temperature greater than or equal to a preset second threshold, and the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number (e.g., 3); or, further calculate the heating rate of each thermistor by measuring the temperature, and if there is a thermistor with a heating rate greater than or equal to a preset first threshold (e.g., 1℃ / second), it indicates that the temperature of the monitoring area where these thermistors are located is on the verge of a dangerous state, so an alarm signal is displayed, and a structured interrupt signal is generated and sent to the satellite platform main controller. This signal may include an anomaly level identifier, precise physical location information, key over-limit parameters, and preliminary handling suggestions, and may also automatically execute a predetermined mitigation strategy, including but not limited to instructing relevant payloads to operate with local reduced power, adjusting the operating point of the thermal control system, and downloading all event data to the ground station. Specifically, in step S408, if there is a thermistor with a corresponding measured temperature greater than or equal to the second threshold, it indicates that the temperature at the location where the thermistor is installed is dangerous, and attention needs to be paid to changes in the temperature at the location. Therefore, the location of the thermistor and the TR component corresponding to the location are marked. If the measured temperature of the thermistor subsequently decreases, the marking can be removed. If the measured temperature of the thermistor continues to rise, the warning operation is upgraded, for example, upgraded to step S407 or step S406.

[0075] It should be noted that the danger level in step S406 is higher than that in step S407, and the danger level in step S407 is higher than that in step S408. For example, step S406 can be defined as a Level 3 warning operation, step S407 as a Level 2 warning operation, and step S408 as a Level 1 warning operation. The temperature monitoring method for the spaceborne active phased array transceiver component provided in this application can execute only the Level 3 warning operation, only the Level 3 and Level 2 warning operations, or all Level 3 to Level 1 warning operations.

[0076] Specifically, in one possible implementation, in step S409, the second threshold in steps S407 and S408 is dynamically adjusted: when the onboard active phased array TR component reaches the sunny area, the second threshold is set to the first temperature value; when the onboard active phased array TR component reaches the shadow area, the second threshold is set to the second temperature value. The first temperature value is greater than the second temperature value, meaning the second threshold in the sunny area is higher than the second threshold in the shadow area. Since the ambient temperature in the sunny area is higher than that in the shadow area, the threshold is adjusted accordingly. Whether the onboard active phased array TR component is in the sunny or shadow area can be determined by acquiring satellite operational data. Adjusting the second threshold for different lighting areas in step S409 makes the temperature monitoring and early warning operations in steps S407 and S408 more accurate.

[0077] It should be noted that steps S405-S409 can be executed by a temperature monitoring unit, which can be integrated into the master node or independent of the master node. For example, the temperature monitoring unit is a functional unit in the ground control center. The master node transmits voltage information to the ground control center; specifically, the master node transmits the voltage information to the temperature monitoring unit, which then executes steps S405-S409.

[0078] The temperature monitoring method for spaceborne active phased array transceiver components provided in this application divides the monitoring area according to the temperature distribution of the TR component's location. Combined with a distributed thermistor sensor network and utilizing multiplexing cyclic gating, it can capture local high-temperature hotspots and reconstruct and monitor the temperature gradient of the entire temperature field. This not only enables effective real-time monitoring of TR component temperature, ensures stable operation of the TR component, guarantees the reliability of the TR component and core components, and improves satellite lifespan, but also reduces the amount of wiring, better meeting the satellite platform's requirement for "lightweight" payload.

[0079] A second aspect of this application provides a temperature monitoring system for a spaceborne active phased array transceiver assembly. Figure 5 This paper illustrates a structural block diagram of one embodiment of the temperature monitoring system for the spaceborne active phased array transceiver assembly of this application. Figure 5 As shown, the temperature monitoring system for the spaceborne active phased array transceiver assembly according to the third embodiment of this application includes:

[0080] A thermistor is disposed on a heat dissipation substrate near the transceiver component. The thermistor's placement corresponds to the transceiver component, and the thermistor density in the (i+1)th monitoring area is greater than or equal to the thermistor density in the ith monitoring area. The monitoring area is obtained by dividing the area where the transceiver component is located according to temperature distribution, and the temperature of the (i+1)th monitoring area is greater than or equal to the temperature of the ith monitoring area. ∈ And i is an integer, and M is the number of monitored areas;

[0081] There are M slave nodes, with the i-th slave node corresponding to the i-th monitoring area. The i-th slave node includes a multiplexer, which is connected to the thermistors in the i-th monitoring area. The i-th slave node is used to collect the voltage information corresponding to each thermistor in the i-th monitoring area through the multiplexer and send the voltage information to the master node.

[0082] The master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order of decreasing temperature in their respective monitoring areas and in order of proximity to the master node.

[0083] The temperature monitoring unit is used to calculate the measurement temperature corresponding to each thermistor based on the voltage information received by the master node.

[0084] For example, the thermistor is covered with a thin layer of diamond thermal pad so that the thermal resistance between the thermistor and the heat dissipation substrate is less than 0.3℃ / W; the thermistor can be an MF501 type thermistor with a material constant of 3950K±1% and can be encapsulated in glass to ensure the long-term stability and radiation resistance of the thermistor; the thermistor and the heat dissipation substrate can be bonded with aerospace-grade thermally conductive adhesive (EP77-TC).

[0085] Specifically, the temperature monitoring unit is used for:

[0086] The resistance value of the thermistor at the measurement temperature is calculated based on the voltage information. Where U represents the voltage information, and V represents the voltage unit, volt. This indicates the resistance value of the voltage divider resistor connected in series with the thermistor. For 1,000 euros; and,

[0087] According to the calculation formula The measured temperature T1 is obtained by solving the equation, where the temperatures of T1 and T2 are in Kelvin (K), R is the nominal resistance value of the thermistor at the nominal temperature T2, and B is the material constant of the thermistor.

[0088] In one possible implementation, the temperature monitoring unit is further configured to:

[0089] Based on the measured temperature of the thermistor, it is determined whether there is a first over-limit thermistor. If there is a first over-limit thermistor, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted. The first over-limit thermistor is the thermistor whose measured temperature exceeds the preset absolute safety limit.

[0090] In another possible implementation, the temperature monitoring unit is further configured to:

[0091] Based on the measured temperature of the thermistor, calculate the number of second over-limit thermistors in each monitoring area, and determine whether the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number.

[0092] If the number of the second over-limit thermistors in the same monitoring area is greater than or equal to the preset number, an alarm signal will be displayed. The second over-limit thermistor is the thermistor whose measured temperature is greater than or equal to the preset second threshold.

[0093] Alternatively, based on the measured temperature of the thermistor, the heating rate of each thermistor can be calculated, and it can be determined whether the heating rate is greater than or equal to a preset first threshold. If there is a thermistor in the monitoring area with a heating rate greater than or equal to the preset first threshold, an alarm signal can be displayed.

[0094] In yet another possible implementation, the temperature monitoring unit is further configured to:

[0095] Determine whether the measured temperature corresponding to a single thermistor is greater than or equal to the second threshold. If the measured temperature corresponding to the thermistor is greater than or equal to the second threshold, mark the placement location of the thermistor and the transceiver component corresponding to the placement location.

[0096] In another possible implementation, the temperature monitoring unit is further configured to:

[0097] If the onboard active phased array transceiver component reaches the sunny area, the second threshold is set to the first temperature value; if the onboard active phased array transceiver component reaches the shadow area, the second threshold is set to the second temperature value, and the first temperature value is greater than the second temperature value.

[0098] The temperature monitoring unit can be integrated into the master node or operate independently of it. For example, the temperature monitoring unit is a functional unit within the ground control center. The master node transmits voltage information to the ground control center; specifically, the master node transmits the voltage information to the temperature monitoring unit, which then performs steps such as temperature measurement calculation, monitoring, and early warning operations.

[0099] In one possible implementation, the system can periodically initiate a self-calibration mode to correct constant current source drift and ADC error by injecting pre-stored high-precision standard reference resistor signals. Specifically, the system automatically enters calibration mode every 24 hours (one orbital cycle). The master node controls the slave node to switch the input channel to a set of high-precision, low-drift on-board reference resistors (resistance values ​​of 1kΩ, 5kΩ, and 10kΩ, with an accuracy of ±0.01%), collects the reference resistor readings, compares them with the standard values, and uses the least squares method to fit new ADC gain and offset correction coefficients (B material constants), updating the calculation model. This process can effectively compensate for circuit parameter drift caused by space radiation and aging.

[0100] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process and related descriptions of the system described above can be referred to the corresponding processes in the foregoing method embodiments, and therefore will not be repeated here.

[0101] The temperature monitoring system for the spaceborne active phased array transceiver module provided in this application adopts a distributed thermistor sensor network and intelligent algorithm. By utilizing multiplexing and cyclic gating, it realizes real-time monitoring of the temperature field of the entire array TR module at single points and in regions, ensuring the safe and stable operation of the TR module and core components, improving satellite lifespan, and reducing the number of sensors and wiring compared to traditional temperature control methods, thus reducing the satellite platform load.

[0102] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. The program corresponding to the software module / unit or method step can be placed in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. To clearly illustrate the interchangeability of electronic hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in electronic hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0103] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module (unit), program segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0104] The terms “first”, “second”, etc., are used to distinguish similar objects, not to describe or indicate a specific order or sequence.

[0105] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, system, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, methods, systems, or apparatus / devices.

[0106] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A method of temperature monitoring of a space-borne active phased array transceiver assembly, characterized by, include: The region is divided into M monitoring zones based on the temperature distribution of the area where the transceiver components are located. The temperature of the (i+1)th monitoring zone is greater than or equal to the temperature of the ith monitoring zone. ∈ And i is an integer; Thermistors are deployed in M ​​monitoring areas. The thermistors are placed on a heat dissipation substrate near the transceiver component. The deployment positions of the thermistors and the transceiver components corresponding to the deployment positions are recorded. The deployment density of the thermistors in the (i+1)th monitoring area is greater than or equal to the deployment density of the thermistors in the ith monitoring area. M slave nodes are set up, with the i-th slave node corresponding to the i-th monitoring area. The i-th slave node is used to collect the voltage information corresponding to each thermistor in the i-th monitoring area through a multiplexer and send the collected voltage information to the master node. A master node is set up, and the master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order of temperature from high to low in the corresponding monitoring area, and in order of proximity to distance. The master node calculates the measurement temperature corresponding to each thermistor based on the voltage information received.

2. The temperature monitoring method of claim 1, wherein, The step of calculating the measurement temperature corresponding to each thermistor based on the voltage information received by the master node includes: The resistance value of the thermistor at the measurement temperature is calculated based on the voltage information. Where U represents the voltage information, and V represents the voltage unit, volt. This indicates the resistance value of the voltage divider resistor connected in series with the thermistor. For 1,000 euros; According to the calculation formula solving for the measured temperature T1, where T1 and T2 are in Kelvin, R is the nominal resistance value of the thermistor at nominal temperature T2, and B is the material constant of the thermistor.

3. The temperature monitoring method of claim 1 or 2, wherein, Also includes: If a first over-limit thermistor exists, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted. The first over-limit thermistor is the thermistor whose measured temperature exceeds the preset absolute safety limit.

4. The temperature monitoring method of claim 3, wherein, Also includes: If the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number, or if there are thermistors in the monitoring area with a heating rate greater than or equal to a preset first threshold, an alarm signal will be displayed. The second over-limit thermistors are the thermistors whose measured temperature is greater than or equal to a preset second threshold.

5. The temperature monitoring method of claim 4, wherein, Also includes: If the measured temperature corresponding to a single thermistor is greater than or equal to the second threshold, mark the placement location of the thermistor and the transceiver component corresponding to the placement location.

6. The temperature monitoring method of claim 5, wherein, Also includes: If the onboard active phased array transceiver component reaches the solar radiation area, the second threshold is set as the first temperature value; If the onboard active phased array transceiver component reaches the shadow region, the second threshold is set as the second temperature value, and the first temperature value is greater than the second temperature value.

7. The temperature monitoring method of claim 1, wherein, The thermistor is covered with a diamond thermal pad so that the thermal resistance between the thermistor and the heat dissipation substrate is less than 0.3℃ / W.

8. A temperature monitoring system for a spaceborne active phased array transceiver assembly, characterized in that, include: A thermistor is disposed on a heat dissipation substrate near the transceiver component. The thermistor's placement corresponds to the transceiver component, and the thermistor density in the (i+1)th monitoring area is greater than or equal to the thermistor density in the ith monitoring area. The monitoring area is obtained by dividing the area where the transceiver component is located according to temperature distribution, and the temperature of the (i+1)th monitoring area is greater than or equal to the temperature of the ith monitoring area. ∈ And i is an integer, and M is the number of monitored areas; There are M slave nodes, with the i-th slave node corresponding to the i-th monitoring area. The i-th slave node includes a multiplexer, which is connected to the thermistors in the i-th monitoring area. The i-th slave node is used to collect the voltage information corresponding to each thermistor in the i-th monitoring area through the multiplexer and send the voltage information to the master node. The master node is connected to the M slave nodes in a daisy chain. The M slave nodes are connected to the master node in order of decreasing temperature in their respective monitoring areas and in order of proximity to the master node. The temperature monitoring unit is used to calculate the measurement temperature corresponding to each thermistor based on the voltage information received by the master node.

9. The temperature monitoring system of claim 8, wherein, The temperature monitoring unit is specifically used for: calculating a resistance value of the thermistor at the measured temperature from the voltage information wherein U is the voltage information, V denotes the voltage unit volt, denotes the resistance value of a voltage dividing resistor in series with the thermistor, is a kilo-ohm; According to the calculation formula The measured temperature T1 is solved, wherein T1 and T2 are temperatures in Kelvin, R is a nominal resistance value of the thermistor at a nominal temperature T2, and B is a material constant of the thermistor.

10. The temperature monitoring system of claim 8 or 9, wherein, The temperature monitoring unit is also used for: Based on the measured temperature of the thermistor, it is determined whether there is a first over-limit thermistor. If there is a first over-limit thermistor, the power supply to the monitoring area corresponding to the first over-limit thermistor is interrupted. The first over-limit thermistor is the thermistor whose measured temperature exceeds the preset absolute safety limit.

11. The temperature monitoring system of claim 10, wherein, The temperature monitoring unit is also used for: Based on the measured temperature of the thermistor, calculate the number of second over-limit thermistors in each monitoring area, and determine whether the number of second over-limit thermistors in the same monitoring area is greater than or equal to a preset number. If the number of the second over-limit thermistors in the same monitoring area is greater than or equal to the preset number, an alarm signal will be displayed. The second over-limit thermistor is the thermistor whose measured temperature is greater than or equal to the preset second threshold. Alternatively, based on the measured temperature of the thermistor, the heating rate of each thermistor can be calculated, and it can be determined whether the heating rate is greater than or equal to a preset first threshold. If there is a thermistor in the monitoring area with a heating rate greater than or equal to the preset first threshold, an alarm signal can be displayed.

12. The temperature monitoring system of claim 11, wherein, The temperature monitoring unit is also used for: Determine whether the measured temperature corresponding to a single thermistor is greater than or equal to the second threshold. If the measured temperature corresponding to the thermistor is greater than or equal to the second threshold, mark the placement location of the thermistor and the transceiver component corresponding to the placement location.

13. The temperature monitoring system of claim 12, wherein, The temperature monitoring unit is also used for: If the onboard active phased array transceiver component reaches the sunny area, the second threshold is set to the first temperature value; if the onboard active phased array transceiver component reaches the shadow area, the second threshold is set to the second temperature value, and the first temperature value is greater than the second temperature value.

14. The temperature monitoring system as described in claim 8, characterized in that, The thermistor is covered with a diamond thermal pad so that the thermal resistance between the thermistor and the heat dissipation substrate is less than 0.3℃ / W.

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