Stay wire hot stamping temperature self-adaptive control method based on data analysis

Abstract

The invention relates to the field of temperature control, in particular to a stay wire hot stamping temperature self-adaptive control method based on data analysis, and the method comprises the steps: obtaining a plurality of temperature sampling points and power sampling points in a sliding window with a set length; calculating a set temperature target value and controlling a heater, wherein the set temperature target value comprises a basic table look-up temperature and a correction term based on the current packaging speed; the correction term is in positive correlation with the thermal resistance offset of the material; the material thermal resistance offset is the difference value between the current effective thermal resistance and the preset reference thermal resistance; the effective thermal resistance is positively correlated with a temperature difference mean value of each temperature sampling point in the sliding window and the environment temperature and is positively correlated with a speed compensation coefficient; the speed compensation coefficient is in positive correlation with the speed sensitivity coefficient in a set range and the average value of the packaging speed in the sliding window. The problem of thermal hysteresis in the speed change process of the hot stamping equipment is solved.

Description

Technical Field

[0001] This invention relates to the field of temperature control, and more particularly to a data analysis-based adaptive temperature control method for hot stamping. Background Technology

[0002] In the transparent film three-dimensional packaging process for cigarettes, cosmetics, and food, the hot stamping quality of the pull tab is a key indicator for evaluating the airtightness and tearability of the packaging. The hot stamping process is essentially a thermodynamic process involving the coupling of temperature, pressure, and time fields. Existing pull tab hot stamping temperature control systems generally employ PID closed-loop control, with some systems introducing a speed-temperature linear compensation strategy. This means that as the packaging speed increases, the set temperature of the heater is linearly increased to compensate for the increased heat carried away by the high-speed flow.

[0003] However, the aforementioned existing technologies have significant limitations when facing complex and ever-changing actual production environments. First, they do not consider the microscopic fluctuations in the thermal properties of materials. Different batches of BOPP or PVC films and yarns have slight differences in adhesive layer thickness and substrate thermal conductivity. Fixed PID parameters are difficult to adapt to this batch effect, resulting in some films not being properly heat-sealed while others are damaged, even under the same parameters. Second, they ignore the real-time changes in dynamic thermal resistance. With prolonged operation of the packaging machine, the surface of the hot stamping roller will wear or accumulate carbon due to friction, causing a nonlinear drift in the thermal contact resistance. Furthermore, the slight vibration of the mechanical transmission chain can cause fluctuations in the contact pressure between the hot stamping head and the film, leading to drastic fluctuations in instantaneous heat transfer efficiency. Existing technologies cannot detect these microscopic changes in the contact interface.

[0004] Furthermore, when the packaging machine switches operating conditions, such as accelerating from low speed to rated high speed or during emergency stop, the response speed of the thermal system is much slower than the change in mechanical speed. Traditional linear compensation response is slow, leading to wire detachment during acceleration due to insufficient heat supply, and film burn-through during deceleration due to the inability to dissipate residual heat. In summary, existing technology urgently needs an adaptive control method that can sense the thermal resistance characteristics of the material in real time, eliminate interference from contact state fluctuations, and effectively overcome thermal inertia hysteresis during speed changes. Summary of the Invention

[0005] In order to effectively overcome the problem of thermal inertia hysteresis during speed change, this invention provides a data analysis-based adaptive control method for hot stamping temperature.

[0006] This invention provides a data analysis-based adaptive temperature control method for hot stamping with string patterns, employing the following technical solution: The adaptive temperature control method for hot stamping based on data analysis includes the following steps: acquiring multiple temperature sampling points and power sampling points within a sliding window of a set length; calculating a target temperature value and controlling the heater, wherein the target temperature value includes a base lookup temperature based on the current packaging speed and a correction term; the correction term is positively correlated with the material thermal resistance offset; the material thermal resistance offset is the difference between the current effective thermal resistance and the preset reference thermal resistance; the effective thermal resistance is positively correlated with the average temperature difference between each temperature sampling point within the sliding window and the ambient temperature, negatively correlated with the average power of each power sampling point within the sliding window, and positively correlated with the speed compensation coefficient; the speed compensation coefficient is positively correlated with the speed sensitivity coefficient within the set range and the average packaging speed within the sliding window, and negatively correlated with the static heat dissipation coefficient; the static heat dissipation coefficient is obtained by: during the preheating stage, the average input power that keeps the hot stamping head at the heat preservation temperature, and the static heat dissipation coefficient is the ratio of the average input power to the difference between the heat preservation temperature and the ambient temperature.

[0007] By constructing a sliding window to collect data and calculate effective thermal resistance, the invisible changes in material properties and equipment status are quantified into thermal resistance values ​​using the principle of energy conservation. Unlike existing technologies that rely solely on fixed PID parameters or simple linear speed compensation, this technology can sense microscopic fluctuations in the external environment and material properties in real time. By combining the static heat dissipation coefficient and the speed compensation coefficient, the set temperature target value is dynamically adjusted, solving the problem of thermal inertia lag caused by batch differences in materials or long-term operation of equipment, and ensuring the consistency of hot stamping quality under different working conditions.

[0008] Preferably, the correction term also includes contact state dispersion, which is negatively correlated with contact state dispersion. The contact state dispersion is the standard deviation of the effective thermal resistance within a preset short-period statistical window.

[0009] By calculating the standard deviation of thermal resistance over a short period, the correction weight is automatically reduced or interference is shielded when severe mechanical vibration is detected, thus avoiding drastic temperature fluctuations caused by sensor noise or mechanical vibration and improving the system's anti-interference capability.

[0010] Preferably, the length of the short-period statistical window is less than the length of the sliding window.

[0011] By setting a short-period statistical window shorter than the sliding window length, different characteristics of the signal can be keenly captured. The longer sliding window is used to calculate the average thermal resistance to reflect the steady-state trend of material properties and ensure the stability of control. The shorter statistical window can quickly respond to high-frequency mechanical vibrations and ensure the timeliness of discreteness calculation. The combination of long and short windows ensures both the smoothness of temperature regulation and the ability to quickly identify abnormal operating conditions.

[0012] Preferably, the effective thermal resistance is calculated as follows: the ratio of the average temperature difference between each temperature sampling point and the ambient temperature within the sliding window to the average power of each power sampling point within the sliding window is taken as the first term of the effective thermal resistance; the sum of the speed compensation coefficient and 1 is taken as the second term of the effective thermal resistance; and the product of the first term and the second term is taken as the effective thermal resistance.

[0013] By incorporating the speed compensation term into the thermal resistance calculation, the impact of airflow on heat dissipation at the current packaging speed can be accurately reflected, thereby obtaining the comprehensive heat transfer capacity under various actual operating conditions, which more accurately characterizes the system's load state than simple temperature feedback.

[0014] Preferably, the method for calculating the effective thermal resistance further includes: when the average power value of each power sampling point within the sliding window is less than a preset power validity threshold, the average power value of each power sampling point within the sliding window is taken as the power validity threshold.

[0015] By setting a power validity threshold, the problem of computational divergence or numerical overflow caused by the denominator approaching zero is solved when the system is in the heat preservation, inertial cooling, or extremely low power output stage. This ensures the mathematical stability and robustness of the algorithm under all operating conditions.

[0016] Preferably, the speed compensation coefficient is calculated as follows: the ratio of the average packaging speed within the sliding window to the unit reference speed is taken as the first ratio, and the square root of the first ratio is taken; the ratio of the preset standard speed sensitivity coefficient to the static heat dissipation coefficient is taken as the second ratio; and the product of the second ratio and the square root of the first ratio is taken as the speed compensation coefficient.

[0017] Based on the power function relationship between the Nusselt number and the Reynolds number in fluid mechanics, it is more in line with the actual physical heat dissipation law when high-speed airflow passes over the hot stamping head. This enables the system to provide heat compensation that is more in line with physical facts during the acceleration or deceleration of the packaging machine, effectively solving the problem of wire detachment or film burn-through caused by thermal inertia lag during speed change.

[0018] Preferably, after acquiring multiple temperature and power sampling points within a sliding window of a set length, the data is further processed using a notch filter algorithm to eliminate power frequency interference.

[0019] By using a notch filter algorithm to preprocess the raw sampled data, the power frequency interference commonly found in industrial sites can be effectively filtered out. This improves the signal-to-noise ratio of temperature and power sampled data, ensuring that subsequent thermal resistance calculations and control decisions are based on real physical changes rather than electromagnetic interference, thereby enhancing the control accuracy of the entire temperature control system.

[0020] Preferably, the method for controlling the heater is to use a PID control algorithm to set a target temperature value as the new control target, thereby controlling the heater.

[0021] The dynamic target temperature calculated by the adaptive algorithm is used as the set value and input into the classic PID controller. This combines the intelligence of the feedforward compensation of this invention with the stability of traditional PID feedback control. The PID algorithm is responsible for eliminating steady-state errors and maintaining system stability, while the adaptive target value guides the system to respond to load changes in advance. The combination of the two achieves fast, accurate and overshoot-free control of the hot stamping temperature.

[0022] Preferably, the power effectiveness threshold is set at 5% to 10% of the rated power of the hot stamping equipment.

[0023] The specific range of power effectiveness threshold values ​​is clearly defined, which can effectively shield computational noise at zero power, retain the necessary sensitivity of the system under low load conditions, and avoid the normal control signals being ignored due to excessively high thresholds, thus ensuring the adaptability and effectiveness of the algorithm on actual industrial equipment.

[0024] Preferably, the basic lookup temperature is obtained by looking up the table to obtain the temperature value corresponding to the current packaging speed.

[0025] The basic lookup temperature is obtained by using a lookup table method, which provides a reliable reference operating point for the control system.

[0026] The present invention has the following technical effects: By constructing a sliding window to analyze power and temperature difference in real time, and combining the principle of energy conservation to quantify the microscopic changes of thin film materials and the heat dissipation characteristics of equipment, the shortcomings of traditional PID and linear compensation in dealing with batch differences of materials and equipment wear are overcome. In addition, a nonlinear velocity compensation model and contact state dispersion evaluation mechanism that conform to fluid mechanics are introduced, which effectively distinguishes between material thermal resistance drift and mechanical vibration interference, and solves the problems of thermal hysteresis, false burning and burning cracks in the speed change process of hot stamping equipment. Attached Figure Description

[0027] Figure 1 This is a flowchart of the adaptive temperature control method for hot stamping based on data analysis according to the present invention.

[0028] Figure 2 This is a schematic diagram showing the change of the effective thermal resistance of the present invention over time.

[0029] Figure 3 This is a schematic diagram illustrating the change of contact state dispersion over time according to the present invention.

[0030] Figure 4 This is a schematic diagram comparing the effects of the present invention with existing technologies. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] This invention discloses a data analysis-based adaptive temperature control method for hot stamping with string patterns, referring to... Figure 1 This includes the following steps: S1: Obtain environmental parameters.

[0033] The temperature, input power, and film movement speed of the hot stamping heater are collected at a sampling frequency of [frequency missing]. During the electric start heating stage of the hot stamping equipment, but before the film conveying begins the preheating and holding stage, the control system uses a PID algorithm to control the heater to maintain the preset holding temperature. When temperature fluctuations remain If the temperature remains within the range for more than 10 seconds, it is determined to be in thermal equilibrium. At this time, the average input power of the heater is collected. The static heat dissipation coefficient is calculated based on the principle of thermal balance, and the expression is:

[0034] in, This represents the static heat dissipation coefficient of the current hot stamping equipment, in units of... ; This represents the average input power of the heater under heat preservation conditions, measured in watts (W). This value reflects the natural heat loss that needs to be compensated to maintain the current temperature. This indicates the preset insulation temperature, which in this preferred embodiment is taken as a value. to The aim is to simulate thermal gradients close to the operating state. The ambient temperature is measured by a temperature sensor installed outside the electrical control cabinet.

[0035] When the hot stamping equipment has been used for a long time, the carbon layer on the surface of the hot stamping wheel will thicken or the insulation material will age. Maintaining the same insulation temperature requires more power, which leads to an increase in the calculated static heat dissipation coefficient.

[0036] S2: Construct a sliding window and preprocess the data.

[0037] To address the issues of power frequency interference and high randomness of single sampling points in industrial settings, a sliding window is constructed along the historical direction, with the current time t as the endpoint. The length of the sliding window is set to 2 seconds, corresponding to the number of sampling points. The window length was chosen to cover multiple power frequency cycles to offset AC interference while ensuring sufficient data to reflect thermal inertia. During each sampling, a notch filter algorithm was used to process the sampled data.

[0038] S3: Calculate the effective thermal resistance.

[0039] When calculating thermal resistance using instantaneous power and temperature difference, the significant hysteresis of heat conduction means that the peak value of instantaneous power often corresponds to the peak value of temperature several seconds later, leading to severe phase errors when calculated directly. Therefore, this step utilizes the principle of energy conservation to calculate the effective thermal resistance at the current moment, expressed as:

[0040] in, express The effective thermal resistance calculated based on the sliding window at any given time, in units of ; Indicates the first in the sliding window The actual temperature of each sampling point; Indicates ambient temperature; This represents the total number of sampling points in the sliding window, as shown in this embodiment. ; This indicates the power availability threshold, which is 5% of the rated power, for example, 10W; Indicates the first in the sliding window Input power at each sampling point; The value represents the electrothermal conversion and conduction efficiency coefficient, which is 0.95 in this preferred embodiment. This indicates the preset speed compensation coefficient; This represents the maximum value function, used to prevent the denominator from being zero or too small.

[0041] The cumulative temperature difference during the sliding window period represents the total thermal potential energy maintained by the system. The reason for setting a power effectiveness threshold is that when the system is in the heat preservation or inertial cooling phase, the input power may be zero, forcing the denominator to have a minimum value. The calculated effective thermal resistance can be limited to a safe range.

[0042] By simultaneously summing the numerator and denominator within a sliding window, the phase difference between the high-frequency power pulse and the temperature response caused by PID control is eliminated. When the packaging material becomes thicker or its thermal conductivity deteriorates, the same input power... Below this point, the heat generated by the heater cannot be effectively transferred to the surface of the thin film material, causing the heater temperature to rise and ultimately leading to a temperature difference. The temperature will naturally rise, increasing the effective thermal resistance; conversely, if the hot stamping equipment is in close contact with the film material and has good thermal conductivity, the heat generated by the heater can be well transferred to the surface of the film material, keeping the heater temperature within a certain range, ultimately leading to a temperature difference. A lower effective thermal resistance means a lower effective thermal resistance. Therefore, the effective thermal resistance accurately quantifies the overall heat transfer capability of current hot stamping equipment.

[0043] In the formula for calculating effective thermal resistance, the expression for the velocity compensation coefficient is:

[0044] in, express The velocity compensation coefficient at any given moment; This represents a preset standard speed sensitivity coefficient, which typically ranges from [0.01, 0.1], and in this preferred embodiment, it is set to 0.05. This indicates the static heat dissipation coefficient of the current hot stamping equipment; This represents the average packaging speed within the sliding window. This represents the unit reference speed, with a value of 1, used to eliminate the influence of dimensions.

[0045] Based on the empirical formula for heat dissipation when fluid flows over a flat plate, namely the power function relationship between the Nusselt number and the Reynolds number, It adopts the square root form of velocity, which is more in line with the nonlinear heat dissipation law under high-speed airflow than linear compensation.

[0046] A high static heat dissipation coefficient indicates that the hot stamping equipment itself dissipates heat quickly or the environment is harsh. This means that the additional heat dissipation caused by speed changes has a lower weight compared to the significant environmental heat dissipation. Therefore, the speed compensation coefficient is relatively low. The heat dissipation coefficient is reduced; conversely, if the hot stamping equipment has good heat preservation and a small static heat dissipation coefficient, the air cooling effect caused by speed becomes the main interference, and the compensation amount is automatically increased. This realizes the adaptive adaptation of control parameters to the physical state of the hot stamping equipment.

[0047] S4: Calculate multidimensional feature evaluation index.

[0048] In order to accurately distinguish between steady-state deviations caused by material changes and transient disturbances caused by mechanical vibrations, this step calculates the material thermal resistance offset and the dispersion of the contact state based on the effective thermal resistance.

[0049] Material thermal resistance offset:

[0050] in, This represents the material thermal resistance offset at time t; This represents the reference thermal resistance value of a standard material under ideal contact conditions. This value is measured and pre-stored using a standard prototype operating under standard conditions, for example... .when When the temperature is too high, it indicates that the material is too thick or has poor thermal conductivity, requiring an increase in temperature; conversely, when the temperature is too low, it indicates that the material is too thin or has poor thermal conductivity. When the temperature is low, it indicates that the material is too thin or has good thermal conductivity, and the temperature needs to be lowered.

[0051] The method for calculating the contact state dispersion is as follows: taking the current time t as the endpoint, a short-period statistical window is constructed along the historical direction. The length of the short-period statistical window is set to 0.5 seconds, corresponding to the number of sampling points. The expression for the contact state discreteness is:

[0052] in, This represents the contact state dispersion at time t; Indicates the length of the short-period statistical window; This represents the mean effective thermal resistance within the short-period statistical window at time t; Indicates the first period within the short-period statistical window Effective thermal resistance at any given moment.

[0053] Effective thermal resistance essentially reflects the resistance to heat transfer. In an ideal state, the hot stamping roller is pressed tightly against the wire, and the heat transfer path is metal, adhesive layer, and thin film substrate. This is a stable solid-state heat conduction process, and the effective thermal resistance is a relatively stable small value. When mechanical vibration occurs between the hot stamping roller and the wire, a tiny gap is instantaneously generated between the hot stamping roller and the film. The contact surface becomes metal, air, and wire. Air has a low thermal conductivity. Therefore, when mechanical vibration occurs, the effective thermal resistance will oscillate between normal and large values, resulting in a large dispersion in the calculated contact state.

[0054] In conclusion, when When the value increases, it reflects severe mechanical vibration or pressure instability between the hot stamping head and the film material, resulting in a low effective thermal resistance signal-to-noise ratio.

[0055] S5: Calculates the target temperature value to control the temperature of hot stamping.

[0056] Based on the reliability of the data, the correction range for the target temperature is dynamically adjusted, and the final set temperature is calculated.

[0057] in, express The adaptive set temperature target value is constantly fed to the PID controller; This represents the base lookup temperature based on the current speed. This value is a production process parameter, for example: correspond ; This represents the thermal resistance correction gain coefficient, used to convert thermal resistance deviation into a temperature compensation value, achieving unit conversion and eliminating the influence of dimensions. Its value is based on experimental results; for example, its value is 10. This represents the contact state dispersion at time t; This represents the dispersion tolerance threshold, with a value of 0.1, used to indicate tolerance for normal mechanical micro-vibrations and to distinguish between normal fluctuations and abnormal vibrations. This represents the material thermal resistance offset at time t.

[0058] When the contact between the hot stamping head and the wire-drawing film material is very smooth, the exponential term The value is small. When the value is large, the PID controller becomes highly dependent on the deviation information caused by the material's thermal resistance offset.

[0059] When the contact between the hot stamping head and the draw film material is not stable, the index term... The value increases, The temperature is reduced. At this point, the controller automatically shields the interference from the thermal resistance calculation value, forcing the system to return to the basic curve, thereby avoiding temperature misadjustment caused by sensor noise.

[0060] When the thermal resistance offset of the material is positive, it indicates that the current thermal resistance of the material is higher than the standard value. This could be due to factors such as a thicker or harder base material, or a decrease in the heat absorption capacity of the environment. In this case, heat has difficulty penetrating the wire to reach the adhesive layer. If the original temperature is maintained, the adhesive layer may not melt completely, resulting in incomplete melting or wire detachment. Therefore, the controller initiates a temperature increase operation. This utilizes a higher temperature difference to overcome the high thermal resistance, ensuring sufficient heat is transferred to the adhesive layer.

[0061] When the thermal resistance offset of the material is negative, it indicates that the current thermal resistance of the material is lower than the standard value, for example, the drawstring is thinner or the thermal conductivity is abnormally good. At this time, heat can easily penetrate the drawstring. If the original temperature is maintained, excessive heat will be instantly transferred to the film, causing it to scald or shrink and wrinkle. In this case, the controller automatically reduces the heat supply to prevent overheating damage to the packaging while ensuring adhesion.

[0062] After calculating the target temperature value, the PID control algorithm uses the target temperature value as the new control target to achieve precise control of the hot stamping temperature.

[0063] The effects of this invention can be seen in conjunction with the accompanying drawings, such as... Figure 2As shown, the curve of the effective thermal resistance calculated by the system in real time changes over time. From 5 to 15 seconds, the curve exhibits a standard trapezoidal structure. The thermal resistance first increases linearly, i.e., the wire thickens, and after maintaining this position for a period of time, it decreases linearly again, i.e., the wire recovers. From 18 to 23 seconds, the curve exhibits violent high-frequency oscillations, representing noise interference caused by mechanical vibration.

[0064] like Figure 3 As shown, during the material gradual change process of 5 to 15 seconds, although the thermal resistance value changes significantly, the calculated dispersion remains at an extremely low level because the change is continuous and smooth, and is judged as a valid signal by the system. During the vibration period of 18 to 23 seconds, the dispersion spikes instantly and exceeds the threshold by a large margin, and is accurately judged as invalid interference by the system.

[0065] like Figure 4 As shown, from 5 to 15 seconds, the adaptive set temperature curve follows the change in thermal resistance, smoothly increasing the temperature to compensate for the thermal resistance, and then decreasing the temperature to return to the baseline. From 18 to 23 seconds, although... Figure 1 The display shows that the thermal resistance is fluctuating wildly at this time, but the adaptive temperature setting curve is unaffected and always fluctuates around the baseline, remaining stable.

[0066] The above are all preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A data analysis-based adaptive temperature control method for hot stamping with string patterns, characterized in that, The steps include: acquiring multiple temperature and power sampling points within a sliding window of a set length; calculating a target temperature value and controlling the heater, wherein the target temperature value includes a base lookup temperature and correction term based on the current packaging speed; The correction item is positively correlated with the material thermal resistance offset; the material thermal resistance offset is the difference between the current effective thermal resistance and the preset reference thermal resistance. The effective thermal resistance is positively correlated with the average temperature difference between each temperature sampling point within the sliding window and the ambient temperature, negatively correlated with the average power of each power sampling point within the sliding window, and positively correlated with the speed compensation coefficient. The speed compensation coefficient is positively correlated with the speed sensitivity coefficient within the set range and the average packaging speed within the sliding window, and negatively correlated with the static heat dissipation coefficient. The static heat dissipation coefficient is obtained by taking the average input power that keeps the hot stamping head at the heat preservation temperature during the preheating stage. The static heat dissipation coefficient is the ratio of the average input power to the difference between the heat preservation temperature and the ambient temperature.

2. The adaptive temperature control method for hot stamping based on data analysis according to claim 1, characterized in that, The correction term also includes contact state dispersion, which is negatively correlated with contact state dispersion. Contact state dispersion is the standard deviation of effective thermal resistance within a preset short-period statistical window.

3. The adaptive temperature control method for hot stamping based on data analysis according to claim 2, characterized in that, The length of a short-period statistical window is less than the length of a sliding window.

4. The adaptive temperature control method for hot stamping based on data analysis according to claim 1, characterized in that, The effective thermal resistance is calculated as follows: the ratio of the average temperature difference between each temperature sampling point and the ambient temperature within the sliding window to the average power of each power sampling point within the sliding window is taken as the first term of the effective thermal resistance; the sum of the speed compensation coefficient and 1 is taken as the second term of the effective thermal resistance; and the product of the first term and the second term is taken as the effective thermal resistance.

5. The adaptive temperature control method for hot stamping based on data analysis according to claim 4, characterized in that, The calculation method for effective thermal resistance also includes: when the average power value of each power sampling point within the sliding window is less than the preset power validity threshold, the average power value of each power sampling point within the sliding window is taken as the power validity threshold.

6. The adaptive temperature control method for hot stamping based on data analysis according to claim 1, characterized in that, The speed compensation coefficient is calculated as follows: the ratio of the average packaging speed within the sliding window to the unit reference speed is taken as the first ratio, and the square root of the first ratio is taken; the ratio of the preset standard speed sensitivity coefficient to the static heat dissipation coefficient is taken as the second ratio. The product of the second ratio and the square root of the first ratio is used as the speed compensation coefficient.

7. The adaptive temperature control method for hot stamping based on data analysis according to claim 1, characterized in that, After acquiring multiple temperature and power sampling points within a sliding window of a set length, the data is further processed using a notch filter algorithm to eliminate power frequency interference.

8. The adaptive temperature control method for hot stamping based on data analysis according to claim 4, characterized in that, The method for controlling the heater is as follows: using a PID control algorithm to set the target temperature value as the new control target, thereby controlling the heater.

9. The adaptive temperature control method for hot stamping based on data analysis according to claim 5, characterized in that, The power availability threshold is set at 5% to 10% of the rated power of the hot stamping equipment.

10. The adaptive temperature control method for hot stamping based on data analysis according to claim 1, characterized in that, The basic lookup temperature is obtained by looking up the table to get the temperature value corresponding to the current packaging speed.

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