Heat dissipation system, heat dissipation method, touch screen module and electronic equipment

Abstract

The invention relates to a heat dissipation system, a heat dissipation method, a touch screen module and electronic equipment. The heat dissipation system comprises a power supply conversion circuit, an external power supply module, a temperature sensor and a micro-control unit, wherein the power supply conversion circuit is arranged in the touch screen module and used for managing multiple paths of power supplies; the external power supply module is connected with the power conversion circuit through an external port arranged on the touch screen module; the touch screen module further comprises a plurality of loads using a plurality of power supplies; the temperature sensor is used for detecting the temperature of the position where the temperature sensor is located; and the micro-control unit is used for controlling the power conversion circuit to supply power to the plurality of loads through the multi-path power supply and the external power supply module or not according to the temperature so as to carry out balanced heat dissipation on the touch screen module.

Description

Technical Field

[0001] This application relates to the field of touch screen heat dissipation technology, and in particular to a heat dissipation system, heat dissipation method, touch screen module and electronic device. Background Technology

[0002] Currently, touchscreen development often involves multiple circuits using different voltages, such as 5V to 3.3V, 5V to 3.0V, 5V to 1.2V, and 5V to 1.8V. Each different voltage conversion requires an additional power conversion circuit, which generates significant heat, increasing the heat-generating area. Some devices have built-in temperature detection, with the temperature sensor typically integrated on the printed circuit board (PCB). However, touchscreens generate heat during operation, and the initial PCB design must consider factors such as structure, circuit function, size, and cost. This inevitably leads to the temperature sensor being placed near heat-generating components like the power supply. Furthermore, the limited cooling system during prolonged or high-load operation can cause localized overheating within the touchscreen, resulting in lower temperature sensor accuracy. This can lead to misjudgments of the ambient temperature, causing temperature imbalances and negatively impacting the user experience.

[0003] There are currently no effective solutions to the aforementioned technical problems in the related technologies. Summary of the Invention

[0004] This application provides a heat dissipation system, heat dissipation method, touch screen module, and electronic device to solve the problem in the prior art where the temperature sensor is placed close to components that are prone to heat generation, such as switching power supplies, resulting in low temperature sensor detection accuracy and a poor user experience.

[0005] In a first aspect, this application provides a heat dissipation system, which includes a power conversion circuit for managing multiple power supplies in a touch screen module, an external power module, a temperature sensor, and a microcontroller unit; the external power module is connected to the power conversion circuit through an external port disposed on the touch screen module; the touch screen module also includes multiple loads using multiple power supplies; The temperature sensor is used to detect the temperature at the location. The microcontroller unit is used to control whether the power conversion circuit supplies power to the multiple loads through the multi-channel power supply and the external power module according to the temperature, so as to achieve balanced heat dissipation for the touch screen module.

[0006] Optionally, the temperature sensor is positioned on the printed circuit board of the touchscreen module at a distance less than that of the power conversion circuit relative to the plurality of loads.

[0007] Secondly, this application provides a heat dissipation method, the method comprising: acquiring the detected temperature of the temperature sensor; and, based on the rate of change of the detected temperature and the comparison result of the detected temperature with a first preset threshold, controlling the multiple power supplies and / or the external power supply module to supply power to the multiple loads based on the power conversion circuit, so as to perform balanced heat dissipation on the touch screen module.

[0008] Optionally, based on the comparison result of the detected temperature and a preset threshold, controlling the multiple power supplies and / or the external power module to supply power to the multiple loads based on the power conversion circuit includes: when the rate of change of the detected temperature does not exceed a second preset threshold and the detected temperature is less than a first preset threshold, controlling the multiple power supplies to supply power to the multiple loads based on the power conversion circuit; when the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is less than the first preset threshold, controlling the multiple power supplies and the external power module to supply power to the multiple loads based on the power conversion circuit, wherein the power supply from the multiple power supplies to the multiple loads is greater than or equal to the power supply from the external power module to the multiple loads; when the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is greater than or equal to the first preset threshold, controlling the multiple power supplies and the external power module to supply power to the multiple loads based on the power conversion circuit, wherein the power supply from the multiple power supplies to the multiple loads is less than the power supply from the external power module to the multiple loads.

[0009] Optionally, when the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is less than a first preset threshold, controlling the multiple power supplies and the external power module to supply power to the multiple loads based on the power conversion circuit includes: acquiring the change in the rate of change; when the change indicates that the detected temperature is continuously increasing and less than the first preset threshold, dynamically reducing the proportion of the multiple power supplies supplying power to the multiple loads and dynamically increasing the proportion of the external power module supplying power to the multiple loads according to the change; when the change indicates that the detected temperature is continuously decreasing, dynamically increasing the proportion of the multiple power supplies supplying power to the multiple loads and dynamically decreasing the proportion of the external power module supplying power to the multiple loads according to the change.

[0010] Optionally, when the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is greater than or equal to the first preset threshold, the power conversion circuit controls the multiple power supplies and the external power module to supply power to the multiple loads, including: acquiring the power of the multiple loads; determining the power supply source for each load based on the power, wherein the power supply source includes the multiple power supplies and the external power module.

[0011] Optionally, determining the power source of each load based on the power includes: determining the power ratio of the plurality of loads based on the power; readjusting the power ratio based on the adjustment factors corresponding to the plurality of loads; and determining the power source of each load based on the readjusted power ratio.

[0012] Optionally, determining the power source for each load based on the readjusted power ratio includes: sorting the loads from largest to smallest according to the readjusted power ratio, determining the power source for a preset number of loads with the highest power ratio as the external power module, and determining the power source for the remaining loads as the multi-channel power supply.

[0013] Thirdly, this application provides a touch screen module, including: an acquisition module for acquiring the detected temperature of the temperature sensor; and a processing module for controlling the multiple power supplies and / or the external power supply module to supply power to the multiple loads based on the rate of change of the detected temperature and the comparison result of the detected temperature with a first preset threshold, so as to perform balanced heat dissipation on the touch screen module.

[0014] Fourthly, this application also provides an electronic device, including: a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; the memory is used to store a computer program; and the processor is used to implement the heat dissipation method described in the second aspect when executing the computer program.

[0015] Compared with the prior art, the above-mentioned technical solution provided in this application embodiment has the following advantages: In this application embodiment, an external power module is connected through an external interface. The external power module can also supply power to the touch screen module. That is, when the temperature detected by the temperature sensor is high or the temperature rises rapidly, multiple loads can be supplied by multiple power supplies and the external power module at the same time, thereby reducing the energy consumption of multiple power supplies inside the touch screen module, reducing its temperature, and keeping the temperature of the entire touch screen module within a controllable range, thus achieving balanced heat dissipation of the touch screen module. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0019] Figure 1 This is a schematic diagram of a heat dissipation system provided in an embodiment of this application; Figure 2 This is one of the structural schematic diagrams of a touch screen module provided in an embodiment of this application; Figure 3 A flowchart illustrating a heat dissipation method provided in an embodiment of this application; Figure 4 This is a power supply diagram of a touchscreen module provided in an embodiment of this application; Figure 5 A flowchart illustrating a method for improving temperature detection accuracy based on distributed heat dissipation from a touchscreen, as provided in this application embodiment; Figure 6 This is a second schematic diagram of the structure of a touch screen module provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0022] To address the problem in existing technologies where temperature sensors are placed close to heat-generating components such as switching power supplies, resulting in low detection accuracy and a poor user experience, this application provides a heat dissipation system, such as... Figure 1 As shown, the heat dissipation system 11 includes a power conversion circuit 14 for managing multiple power supplies 13 in the touch screen module 12, an external power module 15, a temperature sensor 16, and a microcontroller unit 17; the external power module 15 is connected to the power conversion circuit 14 through an external port 18 provided on the touch screen module; the touch screen module also includes multiple loads 19 that use multiple power supplies. The touchscreen module in this application embodiment can be a module applied to a terminal or device, such as a smartphone, tablet computer, or other terminal or device. Additionally, the multiple loads in this application embodiment can include a display screen, a Wi-Fi component, embedded memory, etc. The multiple power supplies in this application embodiment can be 12V to 5V power supplies, 5V to 3.3V power supplies, 5V to 3.0V power supplies, 5V to 1.6V power supplies, 5V to 1.2V power supplies, etc.

[0023] Furthermore, the temperature sensor 16 in this embodiment is used to detect the temperature at its location. In a specific example, the distance of the temperature sensor 16 on the printed circuit board of the touchscreen module relative to the power conversion circuit 14 is less than the distance relative to the multiple loads 19. That is, the temperature sensor in this embodiment is far from the multiple loads whose temperature needs to be detected. Therefore, the temperature detected by the temperature sensor may not be the actual temperature of the multiple loads; that is, the temperature detected by the temperature sensor is lower than the actual temperature of the multiple loads. Placing the temperature sensor in the power conversion circuit, which makes the temperature sensor too close to the heat source (multiple power supplies), will cause its detection accuracy to decrease, thereby affecting the accuracy of temperature judgment and leading to temperature regulation imbalance.

[0024] However, the microcontroller unit 17 in this embodiment is used to control whether the power conversion circuit 14 supplies power to multiple loads 19 through the multi-power supply 13 and the external power module 15 according to the temperature, so as to achieve balanced heat dissipation for the touch screen module.

[0025] As can be seen, in this embodiment of the application, an external power module is connected through an external interface. This external power module can also supply power to the touch screen module. That is, when the temperature detected by the temperature sensor is high or the temperature rises rapidly, multiple loads can be powered simultaneously by multiple power supplies and the external power module, thereby reducing the energy consumption of the multiple power supplies inside the touch screen module, lowering its temperature, and keeping the temperature of the entire touch screen module within a controllable range, thus achieving balanced heat dissipation of the touch screen module.

[0026] Furthermore, in a specific example, taking a multi-power supply including a 5V to 3.3V power supply, a 5V to 3.0V power supply, and a 5V to 1.8V power supply; and multiple loads including a WIFI component, an embedded memory EMMC, and a display and touch port, the touch screen module in this embodiment is as follows: Figure 2 As shown. Based on this, in this embodiment of the application, for touch screen modules using multiple power supplies, the power conversion circuit contains components with relatively high horizontal heights, such as electrolytic capacitors and inductors. These components are usually placed in one area for convenient routing and structural avoidance. Meanwhile, the PCB of the touch screen module will have various fixed-position interfaces depending on the function, such as interfaces for transmitting RGB signals and touch signals, BMS interfaces, TYPE-C ports, program debugging ports, SD card slots, etc. This results in limited space on the PCB edge, and temperature sensors may be placed near the power conversion circuit. This means that placing the temperature sensor too close to the heat source will lead to a decrease in detection accuracy. To address the situation where the temperature sensor is limited by PCB size, component layout, and structural design and placed around the power conversion circuit, the existing touch screen utilizes additional interfaces to connect an external power conversion module to the power network to power the corresponding power supply circuit. Simultaneously, the power conversion circuits are dynamically adjusted according to the load of each power supply to achieve balanced heat dissipation within a cycle.

[0027] Based on the heat dissipation system in the embodiments of this application, the embodiments of this application also provide a heat dissipation method, such as... Figure 3 As shown, the steps of this method include: Step 301: Obtain the detected temperature from the temperature sensor; Step 302: Based on the detected temperature change rate and the comparison result between the detected temperature and the first preset threshold, control the multiple power supplies and / or external power modules to supply power to multiple loads based on the power conversion circuit, so as to achieve balanced heat dissipation for the touch screen module.

[0028] As can be seen, in this embodiment, an external power module is connected through the external interface of the touchscreen module, which is an additional charging module. Therefore, under high temperature conditions, the touchscreen module can be powered simultaneously by multiple power supplies and the external power module, thereby reducing the power supply pressure on the multiple power supplies inside the touchscreen module, thus reducing heat generation and achieving a heat dissipation effect for the touchscreen module.

[0029] In an optional embodiment of this application, the method of controlling multiple power supplies and / or external power modules to supply power to multiple loads based on the comparison result of the detected temperature and the preset threshold in step 302 above may further include: Step 11: If the rate of change of the detected temperature does not exceed the second preset threshold and the detected temperature is less than the first preset threshold, control the multiple power supplies to supply power to multiple loads based on the power conversion circuit. Step 12: When the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is less than the first preset threshold, the power conversion circuit controls the multiple power supplies and the external power supply module to supply power to multiple loads, wherein the power supply from the multiple power supplies to the multiple loads is greater than or equal to the power supply from the external power supply module to the multiple loads. Step 13: When the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is greater than or equal to the first preset threshold, the power conversion circuit controls the multiple power supplies and the external power supply module to supply power to multiple loads, wherein the amount of power supplied by the multiple power supplies to the multiple loads is less than the amount of power supplied by the external power supply module to the multiple loads.

[0030] As can be seen from steps 11 to 13 above, in this embodiment, it can be determined whether multiple loads are currently powered solely by a multi-source power supply or whether multiple power supplies and an external power module are required to power multiple loads simultaneously, based on the rate of change of the detected temperature and the comparison result between the detected temperature and the first preset threshold. Furthermore, during this power supply process, if multiple power supplies and an external power module are simultaneously powering multiple loads, it can be further determined, based on the rate of change of the detected temperature and the comparison result between the detected temperature and the first preset threshold, whether the power supply from the multi-source power supply or the power supply from the external power module is greater.

[0031] Specifically, if the current detected temperature change rate is large, exceeding the second preset threshold, but the detected temperature is still below the first preset threshold, it indicates that although the touchscreen module's temperature is rising rapidly, it is not yet very high. In this case, the load can still be powered primarily by the multiple power supplies within the touchscreen module. However, due to the rapid temperature rise, to prevent excessive temperature increases, an external power module can be used as an auxiliary power supply. This satisfies the power supply requirements of the touchscreen module while preventing a sudden temperature surge. Furthermore, if the detected temperature continues to rise rapidly and exceeds the first preset threshold, it indicates that the internal temperature of the touchscreen is already very high. In this case, the multiple power supplies within the touchscreen module should be used as an auxiliary charging source, while the external power module should be used as the primary charging source to dissipate heat from the touchscreen module. Therefore, in this embodiment, when multiple power supplies and an external power module are supplying power simultaneously, the power output of both can be dynamically adjusted. This ensures the power supply requirements are met while preventing the touchscreen module from overheating, achieving a balanced heat dissipation effect.

[0032] In this regard, in an optional embodiment of the present application, the method described in 12 above, which involves controlling multiple power supplies and external power modules to supply power to multiple loads when the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is less than a first preset threshold, may further include: Step 21: Obtain the changes in the rate of change; Step 22: When the temperature detected by the change condition continues to increase but is less than the first preset threshold, dynamically reduce the proportion of power supply from multiple power sources to multiple loads and dynamically increase the proportion of power supply from external power modules to multiple loads according to the change condition. Step 23: When the temperature detected by the change condition continues to decrease, dynamically increase the proportion of power supply from multiple power sources to multiple loads and dynamically decrease the proportion of power supply from external power modules to multiple loads according to the change condition.

[0033] As can be seen from steps 21 to 23 above, in this embodiment, during the process of multiple power supplies and external power modules simultaneously supplying power to multiple loads, the power supply ratio of the power supplies and external power modules can be dynamically adjusted according to the rate of change of the detected temperature. Since the overall power demand of multiple loads is fixed, that is, the sum of the power supply of the power supplies and the power supply of the external power modules is also fixed, during the dynamic adjustment process, if the power supply ratio of the power supplies increases, the power supply ratio of the external power modules decreases. Specifically, when the temperature continues to increase, the power supply of the external power modules can be dynamically increased, and the power supply of the power supplies can be reduced to avoid the power supplies generating more heat due to the increased power supply, thus increasing the temperature of the touch screen module; if the detected temperature continues to decrease, the proportion of the power supplies supplied by the power supplies can be increased, and the proportion of the external power modules supplied to the loads can be dynamically reduced; if the temperature continues to decrease, only the power supplies need to supply power in the end. Therefore, in this embodiment, by dynamically adjusting the power supply ratio of the power sources by detecting the rate of change of temperature, not only can the power supply demand of the touch screen module be guaranteed, but also the heat dissipation of the touch screen module can be balanced.

[0034] Furthermore, in an optional embodiment of this application, the method of controlling multiple power supplies and external power modules to supply power to multiple loads based on the power conversion circuit when the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is greater than or equal to the first preset threshold, as involved in step 13 above, may further include: Step 31: Obtain the power of multiple loads; Step 32: Determine the power source for each load based on power, where the power source includes multiple power supplies and external power modules.

[0035] In this embodiment, if the rate of change of the current detected temperature is large and the detected temperature also exceeds the first preset threshold, it indicates that the power of multiple loads in the touch screen module is large. At this time, the corresponding power source can be determined based on the power of the multiple loads. That is, the loads with larger power can be powered by an external power module, and the loads with smaller power can be powered by multiple power sources in the touch screen module. While ensuring that the multiple loads in the touch screen module work normally, most of the power demand is transferred to the external power module, thereby reducing the energy consumption of the multiple power sources in the touch screen module, thereby reducing the heat generation and effectively controlling the temperature of the touch screen module.

[0036] Furthermore, the method of determining the power source of each load based on power in step 32 above can further include: Step 41: Determine the power ratio of multiple loads based on power; Step 42: Adjust the power ratio again based on the adjustment factors corresponding to the multiple loads; Step 43: Determine the power source for each load based on the readjusted power ratio.

[0037] Specifically, the method of determining the power source of each load based on the readjusted power ratio in step 43 refers to sorting the loads based on the readjusted power ratio from largest to smallest, determining the power source of a preset number of loads with the highest power ratio as an external power module, and determining the power source of the remaining loads as a multi-channel power supply.

[0038] In this embodiment, each load corresponds to an adjustment factor, which is related to the distance between the load and the temperature sensor; that is, the farther the load is from the temperature sensor, the larger the adjustment factor. Based on this, for steps 41 to 43 above, in a specific example, if the current multiple loads are WIFI, EMMC, and a display screen, and the power of these multiple loads is: display screen 1.3W, WIFI 2.6W, and EMMC 0.6W, then the power ratio of these multiple loads can be obtained as display screen:WIFI:EMMC 29:58:13. Combining the above... Figure 2 It is known that the main heat source of the display is the backlight, located between the EMMC and WIFI. The EMMC is closest to the power conversion circuit, while the WIFI is furthest away. Based on the spacing, the ratio of display:WIFI:EMMC is 2:1:3, and the final adjustment ratio is display:WIFI:EMMC 58:58:39. The display backlight, WIFI, and EMMC are all powered by 3.3V. According to the ratio, the 3.3V power supply network for WIFI and EMMC can be provided by an external power supply first, and the insufficient part is provided by the 5V to 3.3V power supply from multiple power supplies.

[0039] The present application will now be explained in detail with reference to specific embodiments of the present application. These specific embodiments provide a method for improving temperature detection accuracy based on distributed heat dissipation from a touchscreen, such as... Figure 4 The diagram shown is a power supply schematic of an embodiment of this application. Based on this, the method for improving temperature detection accuracy based on distributed heat dissipation of the touchscreen in this embodiment of the application is as follows: Figure 5 As shown, it includes the following steps: Step 501: Power on the touchscreen; Step 502: Check the backlight condition; Step 503: Determine if the backlight is always on; if not, proceed to step 504; if yes, proceed to step 506. Step 504: When the touchscreen is in standby or off state, the external power supply and the power conversion circuit on the PCB are allocated according to the operating status of EMMC, main chip, and WIFI to achieve temperature transfer. Step 505: Achieve constant temperature near the temperature sensor; Step 506: Determine whether the external power supply temperature exceeds a certain threshold; if yes, proceed to step 507; otherwise, proceed to step 509. Step 507: The external power supply grids reduce current output; Step 508: The power conversion circuit on the PCB increases the power output to ensure the touch screen operates under high load. Step 509: The external power supply maintains 80% of its maximum power output to provide power to the power supply network, and any shortfall is provided by the power conversion circuit on the PCB.

[0040] For steps 501 to 509 above, in conjunction with the above... Figure 2 and Figure 4It is known that most of the loads in the touchscreen are powered by 3.3V and 5V. Among them, the components with relatively high power consumption, besides the main chip, are the display, WIFI, and eMMC. The main power supply links are 3.3V and 5V. The external power module is connected to the terminal block on the PCB through soft PFC. At the same time, the power supply network of the external power module is connected to the power management circuit. This power management circuit is also connected to the power network output by the power conversion circuit near the temperature sensor on the PCB, such as 1.2V, 1.8V, 3.0V, 3.3V, and 5V. The power network is managed by the power management circuit before supplying power to the corresponding loads. For the external power module, only a 12V network is needed for input, while the output can be 1.2V, 1.8V, 3.0V, 3.3V, or 5V. The power management circuit simulates a load by supplying power to both circuits. For example, if the 5V network currently consumes 1W of power, the current flowing through the actual load network is 0.2A. The power supply to the PCB-side power conversion circuit and the external power module is allocated based on the ambient temperature of the temperature sensor and the overall internal temperature. The PCB side provides 0.1A of current, and the external power module side provides 0.1A of current. Furthermore, if the ambient temperature of the temperature sensor exceeds a certain threshold, the supply current is dynamically allocated to ensure the PCB-side power conversion circuit operates under a light load, keeping the ambient temperature of the temperature sensor within a reasonable range. For circuits with significant power consumption, such as WIFI, EMMC, and the display, an adjustment factor is introduced based on the power ratio and the distance from the temperature sensor. The display consumes 1.3W, WIFI 2.6W, and EMMC 0.6W, resulting in a display:WIFI:EMMC ratio of 29:58:13. The main heat source of the display is the backlight, located between the EMMC and WIFI. The EMMC is closest to the power conversion circuit, while the WIFI is furthest. Based on the distance, the display:WIFI:EMMC ratio is 2:1:3. The final adjustment ratio is display:WIFI:EMMC 58:58:39. The display backlight, WIFI, and EMMC are powered by 3.3V. Based on the ratio, the 3.3V power supply network for WIFI and EMMC can be preferentially provided by an external power supply, with the remaining portion provided by a 5V to 3.3V power supply on the PCB.

[0041] As can be seen from the embodiments of this application, since the PCB of the touch screen module itself contains high-temperature components such as electrolytic capacitors and inductors, some space is reserved in the vertical structural design for these high-temperature components. Using this space, an external power supply is embedded. Under the joint regulation of the PCB's own power conversion circuit and the external power conversion circuit, heat dissipation is balanced, effectively solving the problem of excessive local temperature inside the touch screen. At the same time, it can also improve the detection accuracy of the temperature sensor. The access of the external power supply can also effectively prevent the main chip from being powered normally when one of the power supplies is not working properly, thus improving the power supply stability.

[0042] As can be seen, embodiments of this application also provide a touchscreen module, such as... Figure 6 As shown, the touchscreen module includes: The acquisition module 602 is used to acquire the detected temperature of the temperature sensor; The processing module 604 is used to control multiple power supplies and / or external power supply modules to supply power to multiple loads based on the detected temperature change rate and the comparison result between the detected temperature and a first preset threshold, so as to achieve balanced heat dissipation for the touch screen module.

[0043] As can be seen, in this embodiment of the application, an external power module is connected through an external interface. This external power module can also supply power to the touch screen module. That is, when the temperature detected by the temperature sensor is high or the temperature rises rapidly, multiple loads can be powered simultaneously by multiple power supplies and the external power module, thereby reducing the energy consumption of the multiple power supplies inside the touch screen module, lowering its temperature, and keeping the temperature of the entire touch screen module within a controllable range, thus achieving balanced heat dissipation of the touch screen module.

[0044] In an optional embodiment of this application, the processing module may further include: a first processing unit, configured to control multiple power supplies to power multiple loads based on a power conversion circuit when the rate of change of the detected temperature does not exceed a second preset threshold and the detected temperature is less than a first preset threshold; a second processing unit, configured to control multiple power supplies and an external power module to power multiple loads based on a power conversion circuit when the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is less than the first preset threshold, wherein the power supply from the multiple power supplies to the multiple loads is greater than or equal to the power supply from the external power module to the multiple loads; and a third processing unit, configured to control multiple power supplies and an external power module to power multiple loads based on a power conversion circuit when the rate of change of the detected temperature exceeds the second preset threshold and the detected temperature is greater than or equal to the first preset threshold, wherein the power supply from the multiple power supplies to the multiple loads is less than the power supply from the external power module to the multiple loads.

[0045] In an optional embodiment of this application, the second processing unit in this application embodiment may further include: a first processing subunit, configured to acquire the change in the rate of change; a second processing subunit, configured to, when the change indicates that the detected temperature is continuously increasing and is less than a first preset threshold, dynamically reduce the proportion of power supplied by multiple power sources to multiple loads and dynamically increase the proportion of power supplied by an external power module to multiple loads based on the change; and a third processing subunit, configured to, when the change indicates that the detected temperature is continuously decreasing, dynamically increase the proportion of power supplied by multiple power sources to multiple loads and dynamically decrease the proportion of power supplied by an external power module to multiple loads based on the change.

[0046] In an optional embodiment of this application, the second processing unit in this application embodiment may further include: a fourth processing subunit for acquiring the power of multiple loads; and a fifth processing subunit for determining the power source of each load based on the power, wherein the power source includes multiple power supplies and an external power module.

[0047] In an optional embodiment of this application, the fifth processing subunit in this application is used to perform the following steps: determining the power ratio of multiple loads based on power; readjusting the power ratio based on the adjustment factors corresponding to the multiple loads; determining the power source of each load based on the readjusted power ratio; wherein, determining the power source of each load based on the readjusted power ratio means: sorting the loads based on the readjusted power ratio from largest to smallest, determining the power source of a preset number of loads with the highest power ratio as an external power module, and determining the power source of the remaining loads as a multi-channel power supply.

[0048] like Figure 7 As shown in the figure, this application provides an electronic device, including a processor 711, a communication interface 712, a memory 713, and a communication bus 714, wherein the processor 711, the communication interface 712, and the memory 713 communicate with each other through the communication bus 714. Memory 713 is used to store computer programs; In one embodiment of this application, when the processor 711 executes the program stored in the memory 713, it implements the heat dissipation method provided in any of the aforementioned method embodiments, and its function is similar, so it will not be described again here.

[0049] This application also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the heat dissipation method provided in any of the foregoing method embodiments.

[0050] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0051] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software plus a general-purpose hardware platform, or of course, using hardware. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the related technology, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0052] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0053] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A heat dissipation system, characterized by, The heat dissipation system includes a power conversion circuit for managing multiple power supplies in the touch screen module, an external power module, a temperature sensor, and a microcontroller unit; the external power module is connected to the power conversion circuit through an external port on the touch screen module; the touch screen module also includes multiple loads using multiple power supplies. The temperature sensor is used to detect the temperature at the location. The microcontroller unit is used to control whether the power conversion circuit supplies power to the multiple loads through the multi-channel power supply and the external power module according to the temperature, so as to achieve balanced heat dissipation for the touch screen module.

2. The heat dissipation system of claim 1, wherein, The temperature sensor is positioned on the printed circuit board of the touchscreen module at a distance less than that of the power conversion circuit relative to the plurality of loads.

3. The heat dissipation method of the heat dissipation system according to claim 1 or 2, characterized by, The method includes: Obtain the detected temperature of the temperature sensor; Based on the detected temperature change rate and the comparison result between the detected temperature and the first preset threshold, the power conversion circuit controls the multiple power supplies and / or the external power supply module to supply power to the multiple loads in order to achieve balanced heat dissipation for the touch screen module.

4. The method of claim 3, wherein, Based on the comparison result between the detected temperature and the preset threshold, the power conversion circuit controls the multiple power supplies and / or the external power module to supply power to the multiple loads, including: If the rate of change of the detected temperature does not exceed the second preset threshold and the detected temperature is less than the first preset threshold, the power conversion circuit controls the multiple power supplies to supply power to the multiple loads. When the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is less than the first preset threshold, the power conversion circuit controls the multiple power supplies and the external power module to supply power to the multiple loads, wherein the amount of power supplied by the multiple power supplies to the multiple loads is greater than or equal to the amount of power supplied by the external power module to the multiple loads. When the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is greater than or equal to the first preset threshold, the power conversion circuit controls the multiple power supplies and the external power module to supply power to the multiple loads, wherein the amount of power supplied by the multiple power supplies to the multiple loads is less than the amount of power supplied by the external power module to the multiple loads.

5. The method of claim 4, wherein, When the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is less than a first preset threshold, controlling the multiple power supplies and the external power module to supply power to the multiple loads based on the power conversion circuit includes: Obtain the change in the rate of change; When the change indicates that the detected temperature continues to increase but is less than the first preset threshold, the proportion of the multiple power supplies providing power to the multiple loads is dynamically reduced, and the proportion of the external power supply module providing power to the multiple loads is dynamically increased, based on the change. When the change indicates that the detected temperature is continuously decreasing, the proportion of the multiple power supplies providing power to the multiple loads is dynamically increased, and the proportion of the external power supply module providing power to the multiple loads is dynamically decreased, based on the change.

6. The method of claim 4, wherein, When the rate of change of the detected temperature exceeds a second preset threshold and the detected temperature is greater than or equal to the first preset threshold, the power conversion circuit controls the multiple power supplies and the external power module to supply power to the multiple loads, including: Obtain the power of the multiple loads; The power supply source for each load is determined based on the power, wherein the power supply source includes the multi-source power supply and the external power module.

7. The method of claim 6, wherein, The power supply source for each load is determined based on the power rating, including: The power ratio of the plurality of loads is determined based on the power. The power ratio is readjusted based on the adjustment factors corresponding to the multiple loads respectively; The power source for each load is determined based on the readjusted power ratio.

8. The method of claim 7, wherein, The power supply source for each load is determined based on the readjusted power ratio, including: The loads are sorted from largest to smallest based on the readjusted power ratios, and the power supply source for the preset number of loads with the highest power ratios is determined as the external power module, while the power supply source for the remaining loads is determined as the multi-channel power supply.

9. A touch screen module based on the heat dissipation system of claim 1 or 2, characterized in that, include: The acquisition module is used to acquire the detected temperature of the temperature sensor; The processing module is used to control the multiple power supplies and / or the external power supply module to supply power to the multiple loads based on the detected temperature change rate and the comparison result between the detected temperature and the first preset threshold, so as to achieve balanced heat dissipation for the touch screen module.

10. An electronic device, comprising: include: The processor, communication interface, memory, and communication bus are connected, with the processor, communication interface, and memory communicating with each other via the communication bus. The memory is used to store computer programs; the processor is used to implement the heat dissipation method according to any one of claims 3-8 when executing the computer programs.

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