Heat dissipation device and electronic equipment
By designing a sliding and adjustable heat dissipation device, the problem of thermal conductive film abrasion during solid-state drive hot-swapping is solved, achieving efficient hot-swapping heat dissipation function and ensuring the disassembly and heat dissipation effect of the storage module when it is powered on.
Patent Information
- Application Number
- CN202511737832.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-04-17
AI Technical Summary
In existing technologies, the thermal pads of solid-state drives are easily scratched during hot-plugging, resulting in poor heat dissipation.
A heat dissipation device is designed, including a guide module, a storage module and a heat dissipation module. The storage module and the heat dissipation module are made to be in a spaced or abutting state by sliding adjustment, realizing hot-swappable function, and heat dissipation is achieved through heat conduction components and heat exchange fluid circuit.
It achieves the goal of not affecting heat dissipation during hot-swapping of solid-state drives, ensuring that the storage module can be detached while powered on, and that the heat dissipation efficiency is higher than that in the non-hot-swappable state.
Smart Images
Figure CN121884881A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of heat dissipation device technology, and in particular to a heat dissipation device and electronic equipment. Background Technology
[0002] Currently, storage devices use cold plates for heat dissipation between solid-state drives (SSDs) with large installation spacing. The spacing between the cold plates is fixed, and the contact surfaces between the SSDs and the cold plates are directly bonded with thermally conductive adhesive. However, since SSDs need to be plugged in and out, especially during hot-plugging, the SSDs cause scratches on the thermally conductive adhesive, affecting the heat dissipation of the adhesive. Summary of the Invention
[0003] This disclosure provides a heat dissipation device and an electronic device.
[0004] The heat dissipation device provided in this embodiment includes a guide module, a storage module, and a heat dissipation module; The storage module is slidably disposed on the guide module; The heat dissipation module is slidably disposed on the guide module; The storage module and / or the heat dissipation module can be slidably adjusted relative to the guide module to form a first state or a second state; In the first state, the storage module and the heat dissipation module are spaced apart; In the second state, at least one side of the storage module is in contact with the heat dissipation module so that the heat dissipation module can dissipate heat from the storage module.
[0005] In one embodiment, the storage module includes a mounting frame having a first mounting member and a second mounting member; The first mounting component is connected to the guide module so that the storage module can be slidably disposed on the guide module; The second mounting component has multiple mounting positions for adapting to and connecting a storage device, so that the storage device can be slidably disposed on the second mounting component.
[0006] In one embodiment, the mounting bracket has a third mounting element; The third mounting member is connected to the backplane assembly so that the backplane assembly is fixed in position relative to the second mounting member, and the storage device located at the mounting position can be connected to the backplane assembly. The second mounting component also has a hollowed-out heat exchange area; In the second state, the heat dissipation module is able to at least partially pass through the heat exchange zone and make heat exchange contact with the storage device.
[0007] In one embodiment, the heat dissipation module includes a connector and a heat exchanger; The connector has a sliding limiting part that is slidably connected to the guide module, so that the heat dissipation module can be slidably disposed on the guide module; The heat exchanger is connected to the connector, and the connector can drive the heat exchanger to slide synchronously relative to the guide module.
[0008] In one embodiment, the surface of the heat exchanger serves as a heat exchange surface that is thermally connected to the storage module, and the heat exchange surface is provided with a heat-conducting element for contacting the storage module. The heat exchanger has an internal flow channel for guiding the heat exchange fluid, and the flow channel is connected to the inlet and outlet interfaces. The liquid inlet is connected to the liquid distribution assembly via a first liquid supply line, and the liquid outlet is connected to the liquid distribution assembly via a second liquid supply line. The heat exchanger exchanges heat through the first liquid supply line and the second liquid supply line, and its position relative to the liquid distribution assembly can be adjusted.
[0009] In one embodiment, the heat dissipation device further includes a locking mechanism; The locking mechanism is adjustablely disposed on the guide module. The locking mechanism is at a first angle relative to the guide module. The locking mechanism is not locked to the storage module and the heat dissipation module, so that the storage module and the heat dissipation module are in the first state. The locking mechanism is at a second angle relative to the guide module, and the locking mechanism is locked to the storage module and the heat dissipation module to keep the storage module and the heat dissipation module in the second state.
[0010] In one embodiment, the locking mechanism includes a first locking part, a second locking part, and an adjusting part; The first locking part is disposed on the first side of the guide module; The second locking part is connected to the first locking part and is disposed on the second side of the guide module; The adjustment part is disposed between the first locking part and the second locking part. The first locking part and the second locking part move relative to the guide module through the adjustment part to switch between the first angle and the second angle.
[0011] In one embodiment, the guide module is connected to both the storage module and the heat dissipation module, and is capable of conducting heat from the storage module to the heat dissipation module. In the first state, the heat dissipation module has a first heat exchange efficiency for the storage module; In the second state, the heat dissipation module has a second heat exchange efficiency for the storage module, and the second heat exchange efficiency is higher than the first heat exchange efficiency.
[0012] In one embodiment, both the storage module and the heat dissipation module are capable of reciprocating relative to the guide module along a first direction; Alternatively, the storage module can reciprocate relative to the guide module along a first direction, and the heat dissipation module can reciprocate relative to the guide module along a second direction; the second direction intersects with the first direction. The first direction is parallel to the plane of the guide module.
[0013] In addition, this disclosure also provides an electronic device, which includes a body and a heat dissipation device connected to the body; The heat dissipation device includes a guide module, a storage module, and a heat dissipation module; The storage module is slidably disposed on the guide module; The heat dissipation module is slidably disposed on the guide module; The storage module and / or the heat dissipation module can be slidably adjusted relative to the guide module to form a first state or a second state; In the first state, the storage module and the heat dissipation module are spaced apart; In the second state, at least one side of the storage module is in contact with the heat dissipation module so that the heat dissipation module can dissipate heat from the storage module.
[0014] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description
[0015] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
[0016] Figure 1 A schematic diagram of the heat dissipation device provided in an embodiment of this disclosure in a first state is shown; Figure 2 A schematic diagram (including the housing) of the heat dissipation device provided in the embodiments of this disclosure in a second state is shown. Figure 3A schematic diagram of the storage module (excluding storage devices) in the heat dissipation device provided in an embodiment of this disclosure is shown. Figure 4 A split view of the storage module in the heat dissipation device provided in an embodiment of this disclosure is shown; Figure 5 An assembly diagram of the storage module in the heat dissipation device provided in an embodiment of this disclosure is shown; Figure 6 An exploded view of the heat dissipation module in the heat dissipation device provided in the embodiments of this disclosure is shown; Figure 7 This diagram illustrates the sliding of the heat dissipation module in the heat dissipation device provided in an embodiment of the present disclosure. Figure 8 The diagram shows the connection and usage of the heat dissipation module in the heat dissipation device provided in the embodiments of this disclosure; Figure 9 A schematic diagram of the locking mechanism in the heat dissipation device provided in an embodiment of this disclosure is shown; Figure 10 A schematic diagram of the external circulation system in the heat dissipation device provided in an embodiment of this disclosure is shown.
[0017] Explanation of the labels in the diagram: 1. Guiding module; 2. Storage module; 21. Mounting bracket; 211. First mounting component; 212. Second mounting component; 2120. Mounting position; 213. Third mounting component; 214. Backplane assembly; 22. Storage device; 3. Heat dissipation module; 31. Connector; 32. Heat exchanger; 321. Heat exchange surface; 322. Heat conduction component; 323. Flow guide cavity; 324. Liquid inlet; 325. Liquid outlet; 33. Liquid distribution assembly; 331. First liquid supply pipeline; 332. First liquid supply pipeline; 4. Locking mechanism; 41. First locking part; 42. Second locking part; 43. Adjustment part; 5. Shell; 6. Circulation system. Detailed Implementation
[0018] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.
[0019] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.
[0020] Combination Figure 1 , Figure 2 and Figure 3 As shown, this embodiment of the present disclosure provides a heat dissipation device, which includes a guide module 1, a storage module 2, and a heat dissipation module 3; the storage module 2 is slidably disposed on the guide module 1; the heat dissipation module 3 is slidably disposed on the guide module 1; The storage module 2 and / or the heat dissipation module 3 can be slidably adjusted relative to the guide module 1 to form a first state or a second state; in the first state, the storage module 2 and the heat dissipation module 3 are spaced apart; in the second state, at least one side of the storage module 2 is abutted against the heat dissipation module 3 so that the heat dissipation module 3 can dissipate heat from the storage module 2.
[0021] The heat dissipation device provided in this disclosure can be used, but is not limited to, for cooling storage devices (such as solid-state drives, hard disk drives, memory modules, etc.) in electronic devices such as computers, servers, and industrial control computers. Taking the cooling of solid-state drives as an example, the usage process will be described and explained.
[0022] When in use, the heat dissipation device can first install several solid-state drives in the storage module 2, then slide the storage module 2 into the guide module 1, and then slide the heat dissipation module 3 into the guide module 1. The positional relationship between the storage module 2 and the heat dissipation module 3 can be changed by sliding and adjusting the position of the storage module 2 relative to the guide module 1, or by sliding and adjusting the position of the heat dissipation module 3 relative to the guide module 1, or by sliding and adjusting the positions of the storage module 2 and the heat dissipation module 3 relative to the guide module 1 simultaneously, so that the two can form a first state or a second state.
[0023] When normal heat dissipation and cooling of the solid-state drive are required, the storage module 2 and the heat dissipation module 3 can be slid relative to each other to form a second state (such as...). Figure 2 As shown), at this time, at least one side of the storage module 2 is in contact with the heat dissipation module 3. The contact form may include, but is not limited to: one storage module 2 corresponding to one heat dissipation module 3; and / or one storage module 2 corresponding to being sandwiched and abutted by two heat dissipation modules 3; and / or one heat dissipation module 3 corresponding to being sandwiched and abutted by two storage modules 2. Here, "and / or" means that the contact form between the storage module 2 and the heat dissipation module 3 may include one or more of the following methods: 1. A storage module 2 is connected to a heat dissipation module 3. For example, a plane is selected in a storage module 2 as the contact surface, and a plane is selected in a heat dissipation module 3 as the heat exchange surface. The heat exchange surface in a storage module 2 and the contact surface in a heat dissipation module 3 are connected in a one-to-one correspondence. 2. A storage module 2 is clamped and abutted by two heat dissipation modules 3. For example, two parallel and spaced planes are selected in a storage module 2 as abutment surfaces, and one plane is selected in each of the two heat dissipation modules 3 as a heat exchange surface. The heat exchange surfaces in the two heat dissipation modules 3 are respectively abutted with the two abutment surfaces in a storage module 2 by mutual reflection clamping. 3. A heat dissipation module 3 is clamped and abutted by two storage modules 2. For example, two parallel and spaced planes are selected in a heat dissipation module 3 as heat exchange surfaces, and one plane is selected in each of the two storage modules 2 as abutting surfaces. The abutting surfaces in the two storage modules 2 are clamped and abutted with the two heat exchange surfaces in a heat dissipation module 3 in a mutually oriented clamping manner. All three contact methods between the storage module 2 and the heat dissipation module 3 can enable the heat generated by the solid-state drive to be conducted through the storage module 2 to the heat dissipation module 3, and then absorbed or dissipated by the heat dissipation module 3.
[0024] When one or more solid-state drives (SSDs) malfunction (e.g., abnormally high temperature, damaged storage function) and need to be removed for individual processing, the storage module 2 and the heat dissipation module 3 can be slid relative to each other to form a first state (e.g., ...). Figure 1 As shown), at this time, multiple storage modules 2 are conveniently separated from multiple heat dissipation modules 3 by spacing. The spacing and separation can include, but are not limited to, the following: the storage modules 2 and / or the heat dissipation modules 3 slide and separate from each other along the length direction of the guide module 1; the storage modules 2 and / or the heat dissipation modules 3 slide and separate from each other along the width direction of the guide module 1; the storage modules 2 and / or the heat dissipation modules 3 slide and separate from each other along the thickness direction of the guide module 1; or one of the storage modules 2 and the heat dissipation modules 3 slides along one of the above three directions, and the other slides along one of the remaining two directions. The "and / or" means that the spacing and separation of the storage modules 2 and the heat dissipation modules 3 can include one or more of the following methods: 1. The storage module 2 is slidably separated along the length of the guide module 1. For example, the heat dissipation module 3 is fixedly set in the guide module 1, and the storage module 2 is slidably set in the length of the guide module 1. The two are separated in the length of the guide module 1 by sliding the storage module 2 away from the heat dissipation module 3. 2. The heat dissipation module 3 is slidably separated along the length of the guide module 1. For example, the storage module 2 is relatively fixed in the guide module 1, and the heat dissipation module 3 is slidably set in the length of the guide module 1. The two are separated in the length of the guide module 1 by sliding the heat dissipation module 3 away from the storage module 2. 3. The storage module 2 and the heat dissipation module 3 are simultaneously slidably separated along the length direction of the guide module 1. For example, the storage module 2 and the heat dissipation module 3 are both slidably set along the length direction of the guide module 1, and the two are separated along the length direction of the guide module 1 by sliding the heat dissipation module 3 and the storage module 2 away from each other. 4. The storage module 2 is slidably separated along the width direction of the guide module 1. For example, the heat dissipation module 3 is relatively fixed in the guide module 1, and the storage module 2 is slidably set in the width direction of the guide module 1. The two are separated in the width direction of the guide module 1 by sliding the storage module 2 away from the heat dissipation module 3. 5. The heat dissipation module 3 is slidably separated along the width direction of the guide module 1. For example, the storage module 2 is relatively fixed in the guide module 1, and the heat dissipation module 3 is slidably set in the width direction of the guide module 1. The two are separated in the width direction of the guide module 1 by sliding the heat dissipation module 3 away from the storage module 2. 6. The storage module 2 and the heat dissipation module 3 are simultaneously slidably separated along the width direction of the guide module 1. For example, the storage module 2 and the heat dissipation module 3 are both slidably set in the width direction of the guide module 1, and the two are separated in the width direction of the guide module 1 by sliding the heat dissipation module 3 and the storage module 2 away from each other. 7. The storage module 2 is slidably separated along the thickness direction of the guide module 1. For example, the heat dissipation module 3 is relatively fixed in the guide module 1, and the storage module 2 is slidably set in the thickness direction of the guide module 1. The two are separated in the thickness direction of the guide module 1 by sliding the storage module 2 away from the heat dissipation module 3. 8. The heat dissipation module 3 is slidably separated along the thickness direction of the guide module 1. For example, the storage module 2 is relatively fixed in the guide module 1, and the heat dissipation module 3 is slidably set in the thickness direction of the guide module 1. The two are separated in the thickness direction of the guide module 1 by sliding the heat dissipation module 3 away from the storage module 2. 9. The storage module 2 and the heat dissipation module 3 are simultaneously slidably separated along the thickness direction of the guide module 1. For example, the storage module 2 and the heat dissipation module 3 are both slidably set in the thickness direction of the guide module 1, and the two are separated in the thickness direction of the guide module 1 by sliding the heat dissipation module 3 and the storage module 2 away from each other. In this way, once storage module 2 is separated from heat dissipation module 3, the solid-state drive (SSD) exhibiting abnormal behavior can be individually removed from its corresponding storage module 2 for processing. The removal process will not affect the other SSDs in storage module 2, nor will it affect the normal power-on and usage functions of the SSDs in other storage modules 2. This allows all remaining normal SSDs to perform the "hot-swap" removal and replacement function of the abnormal SSD while it is powered on.
[0025] It is also worth noting that the heat dissipation module 3 can cool down the storage module 2 in the following ways, but not limited to: setting a temperature phase change material in the heat dissipation module 3, so that the heat transferred from the storage module 2 can be consumed by the material undergoing a phase change when heated; setting a heat dissipation pipe in the heat dissipation module 3 and connecting the heat dissipation pipe to an external liquid supply pipe, so that the storage module 2 is cooled by supplying low-temperature coolant through the external liquid supply pipe.
[0026] In summary, the heat dissipation device provided in this embodiment can achieve the function of heat dissipation by the heat dissipation module 3 contacting the storage module 2 and achieving a corresponding interval between the heat dissipation module 3 and the storage module 2, so that the storage device in the storage module 2 can be hot-swapped and replaced when powered on. This effectively solves the problem in related technologies where the heat dissipation device of the storage device is fixed, making it impossible for the storage device to be hot-swapped when powered on.
[0027] In one embodiment, the storage module 2 includes a mounting frame 21, which has a first mounting member 211 and a second mounting member 212. The first mounting member 211 is connected to the guide module 1 so that the storage module 2 can be slidably disposed on the guide module 1. The second mounting member 212 has a plurality of mounting positions 2120 for adapting to the connection of the storage device 22 so that the storage device 22 can be slidably disposed on the second mounting member 212.
[0028] For example, combining Figure 5 In further detail, the mounting bracket 21 in the storage module 2 is configured to have a first mounting component 211 and a second mounting component 212. The first mounting component 211 can be respectively positioned at the top and bottom of the second mounting component 212 along the height direction. In this way, the storage module 2 can be connected one-to-one with the two guide modules 1 positioned one-to-one through the two first mounting components 211 that are spaced apart at the top and bottom, thereby improving the installation stability of the storage module 2 in the guide module 1.
[0029] Furthermore, the first mounting member 211 may be configured as two mutually spaced and corresponding clamping edges, and shall be slidably clamped and limited to both sides of the guide module 1 by clamping the clamping edges together; or the first mounting member 211 may be configured as a protruding insertion edge, and shall be provided with a corresponding insertion guide groove in the guide module 1, and shall be slidably inserted and limited to the guide module 1 by sliding the insertion edge into the insertion guide groove.
[0030] In addition, combined Figure 4 In further detail, the multiple mounting positions 2120 in the second mounting member 212 can be arranged side by side along the length of the second mounting member 212, so that the storage device 22 can be detachably installed in the mounting bracket 21 by sliding it into the mounting positions 2120 one by one. For example, a rectangular recessed groove and a guide groove with a certain slope and the same width as one side of the recessed groove can be provided at the bottom of the mounting position 2120. When the storage device 22 is slidably inserted into the mounting position 2120, the bottom of the storage device 22 can first be guided by the guide groove, and when the storage device 22 is fully slid into the recessed groove, the bottom of the storage device 22 can sink down and be inserted into the recessed groove, so as to realize the sliding insertion of the storage device 22 in the mounting position 2120.
[0031] The specific arrangement of the storage module 2 described above has the advantages of simple and compact structure, stable relative sliding adjustment to the guide module 1, and the ability to quickly slide and disassemble multiple storage devices 22.
[0032] It is understood that this application does not limit the specific configuration of the storage module 2 described above. That is, those skilled in the art can set and adjust it according to the actual situation. The above situation is only an illustrative example. The storage module 2 in this application can also be implemented in other ways, but it is not limited to the situation described in the above embodiments. For example, the first mounting member 211 is respectively disposed on the top and bottom of the second mounting member 212 along the height direction. It can also be changed to the first mounting member 211 being disposed on two opposite sides of the second mounting member 212 along the water surface direction. In this case, the first mounting member 211 can also be in the form of a roller, and a limiting track for guiding the roller to roll can be correspondingly opened in the guide module 1. In addition, Figure 3 The second mounting component 212 described above has two mounting positions 2120 set along the same height plane, or the two mounting positions 2120 in the second mounting component 212 can be staggered along different height planes so that the storage device 22 in the mounting position 2120 can be staggered to form a heat dissipation space.
[0033] In one embodiment, the mounting bracket 21 has a third mounting member 213; the third mounting member 213 is connected to the backplate assembly 214 so that the backplate assembly 214 is fixed in position relative to the second mounting member 212, and the storage device 22 located at the mounting position 2120 can be connected to the backplate assembly 214; the second mounting member 212 also has a hollowed-out heat exchange area; wherein, in the second state, the heat dissipation module 3 can at least partially pass through the heat exchange area and make heat exchange contact with the storage device 22.
[0034] For example, combining Figure 3 and Figure 4 In further detail, a third mounting component 213 is also provided in the mounting bracket 21, and the third mounting component 213 can also be correspondingly set in the top of the mounting bracket 21. The backplate assembly 214 can be a backplate component equipped with the storage device 22 itself, or a backplate component corresponding to the storage module 2. In this way, when the storage device 22 is installed in the mounting position 2120, the backplate assembly 214 can cover and limit the back side of the storage device 22. The third mounting component 213 can be, but is not limited to, a spring-loaded latch, a pin latch, etc., to fix the backplate assembly 214 in the back side position of the second mounting component 212. In this way, the installation stability of the storage device 22 in the mounting bracket 21 can be further improved by the fixedly set backplate assembly 214.
[0035] Furthermore, the backplate assembly 214 described above can be equipped with a temperature phase change material, a cooling fan, or a liquid pipeline to provide auxiliary heat dissipation and cooling for the back side of the storage device 22.
[0036] In addition, the second mounting component 212 is provided with a hollow heat exchange area. The heat exchange area may be provided in the side of the second mounting component 212 facing the heat dissipation module 3, but is not limited to. Moreover, the shape and size of the heat exchange area can be adapted to the heat dissipation module 3. In this way, when the heat dissipation device is in the second state, the heat dissipation module 3 can at least partially pass through the heat exchange area and make heat exchange contact with the storage device 22 in the second mounting component 212.
[0037] The mounting position 2120 in the second mounting member 212 is a recessed slot corresponding to the bottom plane of the second mounting member 212. In order to enable the storage device 22 to better exchange heat through the heat exchange zone on the side after it is installed in the mounting position 2120, the side plane where the heat exchange zone is located and the bottom plane where the recessed slot is located can be set perpendicular to each other, and the side plane of the heat exchange zone and the side groove surface of the recessed slot are located on the same plane.
[0038] In addition, when the storage module 2 and the heat dissipation module 3 are arranged in an alternating manner, when the heat dissipation device is in the second state, a heat dissipation module 3 will be sandwiched between the two storage modules 2. In this way, the two heat dissipation sides of the heat dissipation module 3 arranged opposite to each other can partially pass through the heat exchange area of the second mounting member 212 in the two storage modules 2, so that each pair of storage modules 2 can share a heat dissipation module 3 for heat dissipation, saving the number of heat dissipation modules 3 and making the structural size of the heat dissipation device more compact.
[0039] In one embodiment, the heat dissipation module 3 includes a connector 31 and a heat exchanger 32; the connector 31 has a sliding limiting part that is slidably connected to the guide module 1 so that the heat dissipation module 3 can be slidably disposed on the guide module 1; the heat exchanger 32 is connected to the connector 31, and the connector 31 can drive the heat exchanger 32 to slide synchronously relative to the guide module 1.
[0040] For example, combining Figure 6 and Figure 7 In further detail, the heat dissipation module 3 is configured to include a connector 31 and a heat exchanger 32, and the connector 31 can also be respectively disposed at the top and bottom of the heat exchanger 32 along the height direction.
[0041] The sliding limiting part in the connector 31 can be disposed on the side of the connector 31 opposite to the heat exchanger 32, and the sliding limiting part can be configured as follows: Figure 4 The two mutually symmetrical inverted "L" shaped limiting heads in the middle can achieve clamping and limiting in the left and right directions and the up and down directions. The connecting piece 31 can be set around the guide module 1 by sliding sleeve, so that the heat dissipation module 3 can only be adjusted by reciprocating along the length extension direction of the guide module 1.
[0042] The sliding limit part can also be set as Figure 7 The inverted "L"-shaped limiting strip is located at one end, allowing a single limiting strip to move vertically (corresponding to...). Figure 7 (In the direction indicated by arrow X3) clamping and limiting, the connector 31 can also be set around the guide module 1 by sliding sleeve, but at this time the heat dissipation module 3 can be extended along the length direction of the guide module 1 (corresponding to Figure 7 (in the direction indicated by arrow X1) and the width extension direction (corresponding to) Figure 7 Adjust the slider by sliding it back and forth in the direction indicated by arrow X2.
[0043] Both specific configurations of the sliding limit part in the connector 31 can achieve the function of slidingly limiting the connection between the heat dissipation module 3 and the guide module 1. The specific configuration of the sliding limit part can be flexibly selected according to the actual use scenario.
[0044] In one embodiment, the surface of the heat exchanger 32 serves as a heat exchange surface 321 that is thermally connected to the storage module 2. The heat exchange surface 321 is provided with a heat-conducting element 322 for contacting the storage module 2. The heat exchanger 32 has a flow channel 323 for guiding the heat exchange liquid. The flow channel 323 is connected to the liquid inlet 324 and the liquid outlet 325. The liquid inlet 324 is connected to the liquid distribution assembly 33 through the first liquid supply pipe 331, and the liquid outlet 325 is connected to the liquid distribution assembly 33 through the second liquid supply pipe 332. The heat exchanger 32 exchanges heat through the first liquid supply pipe 331 and the second liquid supply pipe 332, and its position relative to the liquid distribution assembly 33 can be adjusted.
[0045] For example, combining Figure 6 In further detail, the two opposite sides of the heat exchanger 32 facing the storage module 2 can be used as surface heat exchange surfaces 321, and the heat exchange surface 321 can be provided with heat-conducting elements 322, which can be, but is not limited to, heat-conducting sheets. In this way, when the heat dissipation module 3 comes into contact with the storage module 2, the heat-conducting elements 322 in the heat exchange surface 321 can be squeezed to tightly connect the heat exchanger 32 with the storage module 2, thereby ensuring that the heat in the storage module 2 can be efficiently transferred to the heat exchanger 32.
[0046] In addition, combined Figure 8 In further detail, the heat exchanger 32 has a flow channel 323 inside for guiding the heat exchange fluid. The flow channel 323 can be configured as a meandering channel structure to increase the effective volume of the flow channel 323 inside the heat exchanger 32. Furthermore, the liquid inlet 324 and the liquid outlet 325 can be respectively located on the same side of the heat exchanger 32, with the liquid inlet 324 electrically connected to one end of the flow channel 323 and the liquid outlet 325 electrically connected to the other end of the flow channel 323.
[0047] In addition, the first liquid supply line 331 can be connected to the liquid inlet 324, and the second liquid supply line 332 can be connected to the liquid outlet 325. The liquid distribution component 33 in the first liquid supply line 331 can be, but is not limited to, a liquid supply pump, and the liquid distribution component 33 in the second liquid supply line 332 can be, but is not limited to, a liquid extraction pump. In this way, the flow channel 323 in the heat exchanger 32 can have heat exchange liquid entering at one end and heat exchange liquid flowing out at the other end. Through the dynamic balance of inflow and outflow of heat exchange liquid, it can be ensured that the heat exchanger 32 can continuously remove the heat transferred from the storage module 2. In addition, since the heat exchanger 32 can slide and adjust its position relative to the guide module 1, in order to ensure the normal sealing connection between the liquid inlet 324 and the first liquid supply pipeline 331 and the normal sealing between the liquid outlet 325 and the second liquid supply pipeline 332 when the heat exchanger 32 slides, the liquid inlet 324 and the liquid outlet 325 can be set as telescopic interfaces, and / or the first liquid supply pipeline 331 and the second liquid supply pipeline 332 can be set as telescopic pipelines. In this way, when the heat exchanger 32 slides, the sliding tension or sliding extrusion force generated can cause the telescopic interface and / or the telescopic pipeline to extend or shorten accordingly, so as to ensure that the heat exchange liquid can always flow in and out normally in the guide cavity 323.
[0048] Of course, a sliding platform can also be configured for the first liquid supply line 331 and the second liquid supply line 332. When the heat exchanger 32 slides, the sliding platform can slide synchronously, so that the liquid inlet 324 and the first liquid supply line 331 can always be aligned and connected, and the liquid outlet 325 and the second liquid supply line 332 can always be aligned and connected.
[0049] In addition, combined Figure 10Another external connection method for the heat dissipation device is described, in which the heat dissipation device is connected to a corresponding external circulation system 6. The circulation system 6 has a first liquid supply pipe 331 for unidirectional liquid supply and a second liquid supply pipe 332 for unidirectional liquid return. In this way, the liquid inlet ports 324 of multiple heat exchangers 32 can be connected in parallel with the first liquid supply pipe 331 of the circulation system 6, and the liquid outlet ports 325 of multiple heat exchangers 32 can be connected in parallel with the second liquid supply pipe 332 of the circulation system 6. In this way, the coolant can be supplied to the liquid inlet ports 324 of multiple heat exchangers 32 simultaneously through the first liquid supply pipe 331, and simultaneously returned from the liquid outlet ports 325 of multiple heat exchangers 32 through a single circulation system 6. Similarly, since the position of the heat exchanger 32 changes when the heat dissipation module 3 slides back and forth along the guide module 1, in order to ensure the stable connection of the liquid inlet 324 and the liquid outlet 325 in the heat exchanger 32, the liquid inlet 324 and the liquid outlet 325 can both be set as telescopic pipes with a certain telescopic deformation capability or as elastic corrugated pipes with a certain elastic telescopic deformation capability. In one embodiment, the heat dissipation device also includes a locking mechanism 4; the locking mechanism 4 is adjustablely disposed on the guide module 1, and the locking mechanism 4 is at a first angle relative to the guide module 1, and the locking mechanism 4 can be unlocked connected with the storage module 2 and the heat dissipation module 3 so that the storage module 2 and the heat dissipation module 3 are in a first state; the locking mechanism 4 is at a second angle relative to the guide module 1, and the locking mechanism 4 can be locked connected with the storage module 2 and the heat dissipation module 3 so that the storage module 2 and the heat dissipation module 3 are in a second state.
[0050] For example, combining Figure 2 and Figure 9 In further detail, the locking mechanism 4 may be configured to be rotatably adjustable relative to the guide module 1. When the locking mechanism 4 rotates relative to the guide module 1 to a first angle, the locking mechanism 4 is not locked to the storage module 2 and the heat dissipation module 3. At this time, the storage module 2 and the heat dissipation module 3 can slide relative to the guide module 1 to adjust their own positions and are in the first state. When the locking mechanism 4 rotates relative to the guide module 1 to a second angle, the locking mechanism 4 is locked to the storage module 2 and the heat dissipation module 3. At this time, the storage module 2 and the heat dissipation module 3 can no longer slide relative to the guide module 1. In this way, the locking action of the locking mechanism 4 can keep the storage module 2 and the heat dissipation module 3 in the second state.
[0051] Specifically, and then combined Figure 2To explain, at this point, the locking mechanism 4 is rotated to the first angle relative to the guide module 1, and at this time, the locking mechanism 4 does not yet perform its locking function. However, when the locking mechanism 4 continues to rotate toward the guide module 1 until it is parallel and in close contact with the guide module 1, that is, when the locking mechanism 4 rotates to the second angle relative to the guide module 1, the locking mechanism 4 can perform its locking function, locking and fixing the storage module 2 and the heat dissipation module 3 and maintaining them in the second state.
[0052] Of course, in addition to the above-mentioned rotary locking unlocking method, the locking mechanism 4 can also adopt other locking unlocking methods, such as the "pin + hole" insertion type locking unlocking method, the "screw + screw hole" screw-type locking unlocking method, etc. For example, multiple holes or screw holes are evenly spaced in the guiding extension direction of the guide module 1, and the locking mechanism 4 is set as a pin or screw. When the locking mechanism 4 needs to perform the locking function, it is only necessary to press and fix multiple storage modules 2 and multiple heat dissipation modules 3 first, and insert a pin into the closest hole of the guide module 1, or screw and install a screw into the closest screw hole of the guide module 1. In this way, the locking function can be performed by the part of the pin or screw protruding from the guide module 1. Moreover, in order to ensure that the pin or screw can be tightly abutted against the locking side of the storage module 2 or the heat dissipation module 3, a pointed wedge can also be inserted into both to further assist in improving the locking effect.
[0053] In one embodiment, the locking mechanism 4 includes a first locking part 41, a second locking part 42, and an adjusting part 43; the first locking part 41 is disposed on a first side of the guide module 1; the second locking part 42 is connected to the first locking part 41 and disposed on a second side of the guide module 1; the adjusting part 43 is disposed between the first locking part 41 and the second locking part 42, and the first locking part 41 and the second locking part 42 move relative to the guide module 1 through the adjusting part 43 to switch between a first angle and a second angle.
[0054] For example, combining Figure 9 In further detail, the first locking part 41 in the locking mechanism 4 can be, but is not limited to, a toggle plate, and a corresponding locking hole can be provided in the toggle plate; the second locking part 42 can be, but is not limited to, an elastic compression strip located on one side of the toggle plate; the adjusting part 43 can be, but is not limited to, a rotating shaft located at the rotation axis of the toggle plate, and can be, but is not limited to, a plurality of insertion holes for the rotating shaft to be inserted and installed, and an adjusting groove connecting the plurality of insertion holes, provided in the guide module 1.
[0055] Thus, when the toggle plate rotates to the second angle, it can correspondingly drive the other end of the elastic compression strip to abut and compress the storage module 2 and / or the heat dissipation module 3. Moreover, after the toggle plate is fixed relative to the guide module 1 through the locking hole, the elastic compression strip can continuously and stably press and fix the storage module 2 and the heat dissipation module 3, ensuring their tight contact. When the toggle plate rotates to the first angle, it can correspondingly release the elastic compression strip, so that the other end of the elastic compression strip no longer abuts and compresses the storage module 2 and / or the heat dissipation module 3. In this way, the storage module 2 and the heat dissipation module 3 are no longer pressed and fixed, and their positions can be adjusted by sliding along the guide module 1.
[0056] The term "and / or" means that the contact compression method of the aforementioned elastic compression strip may include one or more of the following methods: 1. The elastic compression strip is used alone to press against or separate from one side of the storage module 2. For example, the heat dissipation module 3 can be fixedly set in the guide module 1, and the storage module 2 can be slidably set in the guide module 1. The side of the storage module 2 facing away from the heat dissipation module 3 is used for the elastic compression strip to press against it. In this way, the elastic compression strip can generate elastic force when it is pressed and press the storage module 2 toward the heat dissipation module 3. 2. The elastic extrusion strip is used alone to press against or separate from one side of the heat dissipation module 3. For example, the storage module 2 can be fixedly set in the guide module 1, and the heat dissipation module 3 can be slidably set in the guide module 1. The side of the heat dissipation module 3 facing away from the storage module 2 is used for the elastic extrusion strip to press against it. In this way, the elastic extrusion strip can generate elastic force when it is pressed and press the heat dissipation module 3 toward the storage module 2. 3. Press and release one elastic extrusion strip against one side of the storage module 2 in one direction, and press and release the other elastic extrusion strip against one side of the heat dissipation module 3 in another mutually oriented direction. For example, the storage module 2 and the heat dissipation module 3 can be slidably arranged in the guide module 1, and an elastic extrusion strip is provided on each of the two end sides. In this way, the two elastic extrusion strips can apply the extrusion action in a mutually oriented manner, so that the storage module 2 and the heat dissipation module 3 are close to each other and press against each other. Furthermore, when different numbers of storage modules 2 and different numbers of heat dissipation modules 3 are in contact, different clamping lengths can be formed. This requires adjusting the locking mechanism 4 at the specific locking position of the guide module 1. At this time, the rotating shaft can be slid along the adjusting groove in the guide module 1, and after reaching the appropriate position, the rotating shaft can be inserted into the insertion hole at that position. Then, the toggle plate can be rotated to the second angle and fixed through the locking hole.
[0057] In addition, it is worth noting that in order to avoid motion interference when the elastic extrusion strip moves along the guide module 1, the elastic extrusion strip can be clamped on both sides of the guide module 1, or a hollow groove structure can be opened in the guide module 1 for the elastic extrusion strip to pass through and move.
[0058] Furthermore, when a guide module 1 contains different numbers of storage modules 2 and different numbers of heat dissipation modules 3, one end of the guide module 1 can be used as a fixed end, and only a sliding and adjustable locking mechanism 4 can be set at the other end. In this way, the locking action of a single locking mechanism 4 can achieve the effect of tightly locking multiple storage modules 2 and multiple heat dissipation modules 3. Alternatively, a sliding and adjustable locking mechanism 4 can be set at each end of the guide module 1. The mutual pressing and locking action of the two locking mechanisms 4 can also achieve the effect of tightly locking multiple storage modules 2 and multiple heat dissipation modules 3. Alternatively, multiple sliding and adjustable locking mechanisms 4 can be set in the guide module 1. The multi-point locking action of multiple locking mechanisms 4 can achieve the effect of separating multiple storage modules 2 and multiple heat dissipation modules 3 into multiple segments and tightly locking them.
[0059] In one embodiment, the guide module 1 is connected to the storage module 2 and the heat dissipation module 3 respectively, and can conduct heat from the storage module 2 to the heat dissipation module 3; in a first state, the heat dissipation module 3 has a first heat exchange efficiency with the storage module 2; in a second state, the heat dissipation module 3 has a second heat exchange efficiency with the storage module 2, and the second heat exchange efficiency is higher than the first heat exchange efficiency.
[0060] For example, combining Figure 1 and Figure 2 In further detail, the guide module 1 can also be made of the aforementioned temperature phase change material, or a cavity for the flow of heat exchange fluid can be opened inside the guide module 1, or the guide module 1 can be directly made into a heat pipe, a heat spreader, or other components. In this way, when the heat dissipation device is in its first state, even if the heat dissipation module 3 and the storage module 2 are spaced apart, the heat dissipation module 3 can still generate a certain amount of heat conduction and heat dissipation effect on the storage module 2 through air cooling, and the guide module 1 can also generate a certain amount of heat conduction and heat dissipation effect on the storage module 2. At this time, the storage module 2 as a whole experiences a relatively low first heat exchange efficiency. When the heat dissipation device is in its second state, the heat dissipation module 3 and the storage module 2 are in direct contact for heat conduction, and the heat dissipation module 3 generates a normal heat conduction and heat dissipation effect on the storage module 2. The guide module 1 can also continue to generate a certain amount of heat conduction and heat dissipation effect on the storage module 2. At this time, the storage module 2 as a whole experiences a relatively high second heat exchange efficiency.
[0061] The aforementioned guide module 1 can participate in the auxiliary heat dissipation of the storage module 2, so that the heat dissipation device can also dissipate heat from the storage module 2 when the storage device 22 is disassembled or replaced.
[0062] In addition, in the first state described above, the heat exchanger 32 in the heat dissipation module 3 is installed and connected to the guide module 1. Therefore, the heat exchanger 32 can dissipate heat and cool down the guide module 1, and then indirectly dissipate heat to the storage module 2 through the guide module 1. Therefore, the first heat exchange efficiency is low.
[0063] In the second state described above, the heat exchange component 32 in the heat dissipation module 3 directly contacts the storage module 2. In addition to directly dissipating heat from the storage module 2, the heat dissipation module 3 can also dissipate heat from the guide module 1 and indirectly dissipate heat from the storage module 2 through the guide module 1. Therefore, the second heat exchange efficiency is higher than the first heat exchange efficiency.
[0064] In addition, in the first state mentioned above, the gap between the heat dissipation module 3 and the storage module 2 can be strengthened by setting up air-cooled heat dissipation devices (such as fans) to increase the air flow rate and improve the heat dissipation effect of air cooling on the storage module 2.
[0065] In one embodiment, both the storage module 2 and the heat dissipation module 3 are capable of reciprocating relative to the guide module 1 along a first direction; or, the storage module 2 is capable of reciprocating relative to the guide module 1 along the first direction, and the heat dissipation module 3 is capable of reciprocating relative to the guide module 1 along a second direction; the second direction is intersecting with the first direction; the first direction and the plane of the guide module 1 satisfy the parallel condition.
[0066] For example, combining Figure 1 and Figure 7 To elaborate further, the aforementioned first direction may be, but is not limited to, the length direction of the guide module 1. Figure 7 The direction indicated by the middle arrow X1), the second direction mentioned above can be, but is not limited to, the width direction of the guide module 1. Figure 7 (in the direction indicated by the middle arrow X2), so that the storage module 2 and the heat dissipation module 3 slide simultaneously along the length direction of the guide module 1 and separate from each other; or, the storage module 2 slides along the length direction of the guide module 1 and the heat dissipation module slides along the width direction of the guide module 1 to achieve separation from each other.
[0067] The aforementioned storage module 2 and heat dissipation module 3 both slide back and forth relative to guide module 1 along the first direction, and the aforementioned storage module 2 and heat dissipation module 3 slide back and forth relative to guide module 1 along two different but intersecting directions, which can achieve rapid separation and rapid contact between storage module 2 and heat dissipation module 3, and facilitate the rapid removal of storage device 22 in storage module 2.
[0068] Furthermore, the aforementioned guide module 1 can be configured as one or more parallel guide rails, guide posts, guide grooves, etc., and the heat dissipation device can also be equipped with a housing 5, and the guide module 1 can be correspondingly arranged in the housing 5 along the length direction of the housing 5, such as... Figure 2 The guide module 1 is respectively disposed in the top wall and bottom wall of the housing 5 along the length direction, so as to guide and connect the top and bottom of the storage module 2 and the heat dissipation module 3 respectively.
[0069] In addition, this disclosure also provides an electronic device, which includes a body and a heat dissipation device connected to the body; the heat dissipation device includes a guide module 1, a storage module 2 and a heat dissipation module 3; the storage module 2 is slidably disposed on the guide module 1; the heat dissipation module 3 is slidably disposed on the guide module 1; wherein the storage module 2 and / or the heat dissipation module 3 can be slidably adjusted relative to the guide module 1 to form a first state or a second state; in the first state, the storage module 2 and the heat dissipation module 3 are spaced apart; in the second state, at least one side of the storage module 2 is abutted against the heat dissipation module 3 so that the heat dissipation module 3 can dissipate heat from the storage module 2.
[0070] The electronic device may be, but is not limited to, a computer, server, industrial control computer, etc., and may include, for example, Figure 9 The circulation system 6 shown has a first liquid supply pipe 331 for unidirectional liquid supply and a second liquid supply pipe 332 for unidirectional liquid return. In this way, the liquid inlet ports 324 of multiple heat exchangers 32 can be connected in parallel with the first liquid supply pipe 331 of the circulation system 6, and the liquid outlet ports 325 of multiple heat exchangers 32 can be connected in parallel with the second liquid supply pipe 332 of the circulation system 6. With just one circulation system 6, coolant can be supplied to the liquid inlet ports 324 of multiple heat exchangers 32 through the first liquid supply pipe 331 and returned from the liquid outlet ports 325 of multiple heat exchangers 32 at the same time.
[0071] Of course, the electronic device may also include a fan-cooled heat dissipation device, which can then assist in cooling the heat dissipation module 3 and the storage module 2, especially when the heat dissipation device is in operation. Figure 1 In the first state, since the heat dissipation module 3 and the storage module 2 are separated to form a gap, the air cooling device can blow air towards the gap to increase the airflow rate between the heat dissipation module 3 and the storage module 2, and greatly improve the heat dissipation effect of air cooling on the storage module 2. Thus, when the electronic device is disassembled and replaced in the first state, it can also maintain the efficient heat dissipation of other storage modules 2, and minimize the impact of the disassembly and replacement process on the normal heat dissipation of other storage modules 2.
[0072] Since the electronic device includes the aforementioned heat dissipation device, it can achieve the advantage of the aforementioned heat dissipation device in performing "hot-swapping" to quickly remove and replace the storage device 2 while it is powered on.
[0073] Since the electronic device provided in this application includes the aforementioned heat dissipation device, the previous embodiments are also applicable to the electronic device provided in this embodiment. The structure and corresponding beneficial effects of the heat dissipation device provided in the previous embodiments will not be described again here. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise expressly defined.
[0074] The above description is merely an embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
Claims
1. A heat dissipation device, comprising: Guiding module; A storage module is slidably disposed on the guide module; A heat dissipation module is slidably disposed on the guide module; The storage module and / or the heat dissipation module can be slidably adjusted relative to the guide module to form a first state or a second state; In the first state, the storage module and the heat dissipation module are spaced apart; In the second state, at least one side of the storage module is in contact with the heat dissipation module so that the heat dissipation module can dissipate heat from the storage module.
2. The heat dissipation device according to claim 1, wherein the storage module includes a mounting frame, the mounting frame having a first mounting member and a second mounting member; The first mounting component is connected to the guide module so that the storage module can be slidably disposed on the guide module; The second mounting component has multiple mounting positions for adapting to and connecting a storage device, so that the storage device can be slidably disposed on the second mounting component.
3. The heat dissipation device according to claim 2, wherein the mounting bracket has a third mounting member; The third mounting member is connected to the backplane assembly so that the backplane assembly is fixed in position relative to the second mounting member, and the storage device located at the mounting position can be connected to the backplane assembly. The second mounting component also has a hollowed-out heat exchange area; in, In the second state, the heat dissipation module is able to at least partially pass through the heat exchange zone and make heat exchange contact with the storage device.
4. The heat dissipation device according to claim 1, wherein the heat dissipation module comprises: A connector having a sliding limiting part that is slidably connected to the guide module, so that the heat dissipation module can be slidably disposed on the guide module; A heat exchanger is connected to the connector, and the connector is capable of driving the heat exchanger to slide synchronously relative to the guide module.
5. The heat dissipation device according to claim 4, wherein the surface of the heat exchanger serves as a heat exchange surface that is thermally connected to the storage module, and the heat exchange surface is provided with a heat-conducting element for abutting against the storage module; The heat exchanger has an internal flow channel for guiding the heat exchange fluid, and the flow channel is connected to the inlet and outlet interfaces. The liquid inlet is connected to the liquid distribution assembly via a first liquid supply line, and the liquid outlet is connected to the liquid distribution assembly via a second liquid supply line. The heat exchanger exchanges heat through the first liquid supply line and the second liquid supply line, and its position relative to the liquid distribution assembly can be adjusted.
6. The heat dissipation device according to claim 1 further includes a locking mechanism; The locking mechanism is adjustablely disposed on the guide module. The locking mechanism is at a first angle relative to the guide module. The locking mechanism is not locked to the storage module and the heat dissipation module, so that the storage module and the heat dissipation module are in the first state. The locking mechanism is at a second angle relative to the guide module, and the locking mechanism is locked to the storage module and the heat dissipation module to keep the storage module and the heat dissipation module in the second state.
7. The heat dissipation device according to claim 6, wherein the locking mechanism comprises: A first locking part is disposed on the first side of the guide module; The second locking part is connected to the first locking part and is disposed on the second side of the guide module; An adjustment section is disposed between the first locking section and the second locking section. The first locking section and the second locking section move relative to the guide module through the adjustment section to switch between the first angle and the second angle.
8. The heat dissipation device according to claim 1, wherein the guide module is connected to the storage module and the heat dissipation module respectively, and is capable of conducting the heat of the storage module to the heat dissipation module; In the first state, the heat dissipation module has a first heat exchange efficiency for the storage module; In the second state, the heat dissipation module has a second heat exchange efficiency for the storage module, and the second heat exchange efficiency is higher than the first heat exchange efficiency.
9. The heat dissipation device according to any one of claims 1 to 8, wherein both the storage module and the heat dissipation module are capable of reciprocating relative to the guide module along a first direction; Alternatively, the storage module can reciprocate relative to the guide module along a first direction, and the heat dissipation module can reciprocate relative to the guide module along a second direction; The second direction is intersecting with the first direction; The first direction is parallel to the plane of the guide module.
10. An electronic device, comprising a body and a heat dissipation device connected to the body; The heat dissipation device includes: Guiding module; A storage module is slidably disposed on the guide module; A heat dissipation module is slidably disposed on the guide module; The storage module and / or the heat dissipation module can be slidably adjusted relative to the guide module to form a first state or a second state; In the first state, the storage module and the heat dissipation module are spaced apart; In the second state, at least one side of the storage module is in contact with the heat dissipation module so that the heat dissipation module can dissipate heat from the storage module.