Compressor driver, air conditioner compressor controller and its temperature control method

Abstract

This application discloses a compressor driver, an air conditioning compressor controller, and a temperature control method thereof. The PCB board of the compressor driver is connected to the controller base plate, with the second side of the PCB board facing the controller base plate. A packaged silicon carbide power device module is mounted on a preset pad area on the second side of the PCB board using a preset soldering process. The second side of a thermally conductive phase change sheet is attached to the heat sink area of ​​the controller base plate. The controller base plate is connected to the controller cover plate, and the first side of the thermally conductive phase change sheet is aligned with the preset pad area, and the first side of the thermally conductive phase change sheet is attached to the packaged silicon carbide power device module on the preset pad area. The embodiments of this application enable the packaged silicon carbide power device module to be mounted on the PCB board without screw fixing, and the installation uses a unified surface mount process to improve assembly efficiency. Furthermore, it eliminates the need to bend the pins of the packaged silicon carbide power device module to improve device connection reliability.

Description

Technical Field

[0001] This application relates to the field of compressor technology, and in particular to compressor drivers, air conditioning compressor controllers and their temperature control methods. Background Technology

[0002] Silicon carbide power devices, with their advantages of high voltage withstand capability, low switching losses, high temperature resistance, and excellent high-frequency performance, have become core components of high-voltage inverter systems in new energy vehicles and are widely used in automotive air conditioning compressor controllers. Conventional plug-in silicon carbide power device solutions are compatible with early assembly processes and are one of the mainstream application solutions.

[0003] The assembly process of a conventional plug-in silicon carbide power device driver is as follows: thermal grease is uniformly applied to the surface of the controller base plate, and the ceramic substrate is tightly attached to the surface of the thermal grease; thermal grease is then uniformly applied again to the side of the ceramic substrate away from the controller base plate, and the pins of the silicon carbide power device are bent and shaped; the silicon carbide power device is fastened to the controller base plate with screws, and then the pins are soldered to the PCB board to complete the overall assembly of the PCB board. However, this solution is limited by the characteristics of device packaging and mechanical structure, resulting in complex base plate processing. Its long pin package is susceptible to the effects of operating conditions such as vehicle vibration, and it also increases the parasitic inductance of the circuit.

[0004] More specifically, conventional plug-in silicon carbide power device drivers using the above assembly process have the following drawbacks:

[0005] 1) The installation process is complex, involving multiple steps such as applying silicone grease, attaching ceramic substrates, fixing, and welding, resulting in high installation costs;

[0006] 2) Insufficient temperature sampling accuracy: Temperature detection can only monitor the pin temperature of plug-in silicon carbide power devices and cannot accurately reflect the actual temperature of the wafer body, causing the over-temperature protection setpoint to deviate from the actual requirements.

[0007] 3) Pin stress is affected. The pin bending process of plug-in silicon carbide power devices may affect the reliability of device connection in the long term. Summary of the Invention

[0008] This application provides a compressor driver, an air conditioner compressor controller, and a temperature control method thereof, aiming to solve the problem that in the prior art, when conventional plug-in silicon carbide power device drivers use plug-in silicon carbide power devices, not only is the installation process complicated, but the pin stress of the plug-in silicon carbide power devices is also affected, which leads to the impact on the reliability of device connection.

[0009] In a first aspect, embodiments of this application provide a compressor driver, which includes a controller base plate, a thermally conductive phase change sheet, an encapsulated silicon carbide power device module, a PCB board, and a controller cover plate; the PCB board is connected to the controller base plate, and the second side of the PCB board faces the controller base plate; the encapsulated silicon carbide power device module is mounted on a preset pad area on the second side of the PCB board through a preset soldering process; the second side of the thermally conductive phase change sheet is attached to the heat sink area of ​​the controller base plate; the controller base plate is connected to the controller cover plate, such that the first side of the thermally conductive phase change sheet is aligned with the preset pad area, and the first side of the thermally conductive phase change sheet is attached to the encapsulated silicon carbide power device module on the preset pad area; wherein, the encapsulated silicon carbide power device module is a plurality of encapsulated silicon carbide power devices obtained by Q-DPAK packaging process.

[0010] Secondly, embodiments of this application also provide an air conditioner compressor controller, which includes a compressor driver as described in the first aspect above, and also includes an MCU control unit; a temperature detection module is further provided on the PCB board of the compressor driver, and the MCU control unit is connected to the temperature detection module.

[0011] Thirdly, embodiments of this application also provide a temperature control method for an air conditioning compressor controller, which is applied to the air conditioning compressor controller described in the second aspect above; the temperature control method for the air conditioning compressor controller includes:

[0012] The temperature detection module in the air conditioner compressor controller collects the current sampling parameters according to a preset temperature acquisition cycle and sends them to the MCU control unit in the air conditioner compressor controller; the current sampling parameters are the sampling parameters corresponding to the current operating temperature of the packaged silicon carbide power device module in the air conditioner compressor controller under the current operating state;

[0013] The MCU control unit determines the current temperature measurement temperature based on the current sampling parameters;

[0014] The MCU control unit determines the current over-temperature protection judgment result based on the current measured temperature and the preset over-temperature protection strategy;

[0015] If the MCU control unit determines that the current over-temperature protection determination result is an over-temperature protection execution result, it obtains the corresponding current target over-temperature protection sub-strategy according to the over-temperature protection strategy, and executes the corresponding over-temperature protection operation according to the current target over-temperature protection sub-strategy.

[0016] This application provides a compressor driver, an air conditioner compressor controller, and a temperature control method thereof. The compressor driver includes a controller base plate, a thermally conductive phase change sheet, a packaged silicon carbide power device module, a PCB board, and a controller cover plate. The PCB board is connected to the controller base plate, with its second side facing the controller base plate. The packaged silicon carbide power device module is mounted on a preset pad area on the second side of the PCB board using a preset soldering process. The second side of the thermally conductive phase change sheet is attached to the heat sink area of ​​the controller base plate. The controller base plate is connected to the controller cover plate, and the first side of the thermally conductive phase change sheet is aligned with the preset pad area, and the first side of the thermally conductive phase change sheet is attached to the packaged silicon carbide power device module on the preset pad area. The packaged silicon carbide power device module consists of several packaged silicon carbide power devices obtained using the Q-DPAK packaging process. This application allows the packaged silicon carbide power device module to be mounted on the PCB board without screw fixing, and the installation uses a unified surface mount process to improve assembly efficiency. It also eliminates the need to bend the pins of the packaged silicon carbide power device module to improve device connection reliability. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an exploded structural diagram of a compressor driver provided in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of a first partial structure of a compressor driver provided in an embodiment of this application;

[0020] Figure 3 A partial structural installation diagram of the compressor driver provided in an embodiment of this application;

[0021] Figure 4 A schematic block diagram of the structure of an air conditioning compressor controller provided in an embodiment of this application;

[0022] Figure 5 This is a schematic flowchart of the temperature control method for an air conditioning compressor controller provided in an embodiment of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0025] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0027] Please also refer to Figures 1-3 ,in Figure 1 This is an exploded structural diagram of the compressor driver provided in an embodiment of this application. Figure 2 This is a schematic diagram of a first partial structure of the compressor driver provided in an embodiment of this application. Figure 3 This is a partial structural installation diagram of the compressor driver provided in an embodiment of this application. Figures 1-3As shown, the compressor driver 1 includes a controller base plate 10, a thermally conductive phase change sheet 20, an encapsulated silicon carbide power device module 30, a PCB board 40, and a controller cover plate 50. The PCB board 40 is connected to the controller base plate 10, and the second side of the PCB board 40 faces the controller base plate 10. The encapsulated silicon carbide power device module 30 is mounted on a preset pad area on the second side of the PCB board 40 using a preset soldering process. The second side of the thermally conductive phase change sheet 20 is attached to the heat sink area of ​​the controller base plate 10. The controller base plate 10 is connected to the controller cover plate 50, such that the first side of the thermally conductive phase change sheet 20 is aligned with the preset pad area, and the first side of the thermally conductive phase change sheet 20 is attached to the encapsulated silicon carbide power device module 30 on the preset pad area. The encapsulated silicon carbide power device module 30 consists of several encapsulated silicon carbide power devices obtained by Q-DPAK packaging technology.

[0028] In this embodiment, the compressor driver 1 is assembled as follows:

[0029] 1) The packaged silicon carbide power device module 30 is mounted on the second surface of the PCB board 40 to a preset pad area using a preset soldering process;

[0030] 2) The second side of the thermally conductive phase change sheet 20 is attached to the heat sink area of ​​the controller base plate 10;

[0031] 3) Connect the PCB board 40 to the controller base plate 10, with the second side of the PCB board 40 facing the controller base plate 10, and make the first side of the thermally conductive phase change sheet 20 aligned with the preset pad area, and make the first side of the thermally conductive phase change sheet 20 bonded to the packaged silicon carbide power device module 30 on the preset pad area.

[0032] 4) Connect the controller base plate 10 to the controller cover plate 50.

[0033] The above installation process eliminates the need for steps such as applying thermal grease, bending leads, and securing with individual screws required for through-hole silicon carbide power devices. The standardized surface mount technology (SMT) improves assembly efficiency and eliminates the need to bend the leads of packaged silicon carbide power device modules to enhance device connection reliability. It also eliminates the risk of loosening or breaking of leads in through-hole silicon carbide power device modules under vibration, significantly reducing assembly time and increasing production efficiency. Furthermore, the standardized SMT process reduces human error and improves consistency in mass production.

[0034] In the Q-DPAK packaging process, Q-DPAK stands for Quad Flat No-lead Package for Power Applications. It's a bottom-mount surface-mount power device package that transforms the internal chip heat dissipation path from the traditional wafer, substrate, lead frame, pins, PCB board to heat sink to the wafer, the bottom heat dissipation surface of the packaging substrate, and finally the heat sink. Based on the bottom heat dissipation characteristics of Q-DPAK packaging, the bottom heat dissipation surface of each packaged silicon carbide power device obtained through Q-DPAK packaging is attached to the thermally conductive phase change plate on the heat sink area of ​​the controller base plate 10, achieving heat transfer direction away from the PCB board. Furthermore, all packaged silicon carbide power devices use Q-DPAK packaging, offering advantages such as compatibility with automated production lines, low-resistance and high-efficiency heat dissipation, low parasitic inductance, vibration and temperature cycling resistance, and high reliability. Simultaneously, packaged silicon carbide power devices eliminate the screw-fixed design of traditional through-hole silicon carbide power devices, removing the screw holes on the controller base plate, simplifying the controller base plate machining process, and reducing the number of parts by eliminating the need for additional positioning components and fixing structures. This method not only circumvents the limitation of low thermal conductivity of PCB materials, but also allows the heat sinks in the heat sink area to be adapted to refrigerants to enhance heat dissipation (as shown in the reference). Figure 3 The gaps in the radiator 11 on the radiator area can be filled with refrigerant 12. When the compressor driver 1 is specifically applied to the air conditioner compressor controller, the packaged silicon carbide power device module 30 in the compressor driver 1 is connected to the compressor motor in the compressor, and both are controlled by the MCU control unit (MCU stands for Microcontroller Unit) in the air conditioner compressor controller to control the switching of each packaged silicon carbide power device in the packaged silicon carbide power device module 30 to achieve inversion, and drive the compressor motor through the U / V / W three-phase output.

[0035] In one embodiment, the preset welding process is a reflow soldering process.

[0036] In this embodiment, please continue to refer to Figures 1-3 When the packaged silicon carbide power device module 30 is mounted onto the preset pad area on the second surface of the PCB board 40 using a preset soldering process, a reflow soldering process is specifically used. If the packaged silicon carbide power device module 30 includes multiple packaged silicon carbide power devices, each packaged silicon carbide power device can be mounted onto the corresponding position of the preset pad area on the second surface of the PCB board 40 using a reflow soldering process.

[0037] Specifically, the main process of reflow soldering includes: accurately mounting the pre-treated packaged silicon carbide power devices onto the preset pad areas on the PCB board 40 using a fully automatic pick-and-place machine, and then curing them in a nitrogen-protected reflow oven according to a preset curve to achieve an automated process of reliable soldering. Before the pre-treated packaged silicon carbide power devices are precisely mounted onto the pads of the PCB board 40 using a fully automated pick-and-place machine, solder paste (composed of solder powder, flux, etc.) needs to be printed on the pads of the PCB board 40. Only then can the pre-treated packaged silicon carbide power devices be mounted onto the corresponding areas of the pads with printed solder paste using the fully automated pick-and-place machine. During the nitrogen-protected reflow oven curing process according to the preset curve, the solder paste between the packaged silicon carbide power devices and the pads of the PCB board 40 undergoes a temperature cycle of preheating, activation, reflow, and cooling. In the above process, the solder paste melts, wets the pads and the leads of the packaged silicon carbide power devices, and forms a strong metallurgical bond after cooling (forming an intermetallic compound IMC, where IMC stands for Intermetallic). Compound); When curing in a nitrogen-protected reflow oven according to a preset curve, it should include at least the following important parameters: liquidus temperature (e.g., 217°C for lead-free solder and 183°C for leaded solder), peak temperature (usually 20-30°C above the liquidus), time the solder paste is above the liquidus (generally 30-90 seconds), heating and cooling rates, etc. If the nitrogen-protected reflow oven is divided into a preheating zone, a holding zone, a reflow zone, and a cooling zone according to the preset curve, the heating rate in the preheating zone is 1-3°C / s and the maximum does not exceed 6°C / s; the holding time in the holding zone is 60 to 120 seconds; the time the solder paste is above the liquidus in the reflow zone is 30-90 seconds and the peak temperature does not exceed 230°C; and the cooling rate in the cooling zone is 2-4°C / s.

[0038] In one embodiment, such as Figures 1-3 As shown, the packaged silicon carbide power device module 30 includes multiple packaged silicon carbide power devices 31, which are arranged in a preset array manner.

[0039] In this embodiment, when the packaged silicon carbide power device module 30 includes 6 packaged silicon carbide power devices 31, they can be arranged in an array of 2 rows and 3 columns, and all of them are mounted on the corresponding positions of the preset pad areas on the second surface of the PCB board 40 using a reflow soldering process.

[0040] In one embodiment, such as Figures 1-3 As shown, a plurality of locking screw through holes are uniformly arranged on the area surrounding the packaged silicon carbide power device module 30 on the PCB board 40, and the PCB board 40 is screwed to the controller base plate 10 by a plurality of locking screws having the same number as the plurality of locking screw through holes passing through the corresponding locking screw through holes.

[0041] In this embodiment, multiple locking screw through holes are uniformly arranged on the area surrounding the packaged silicon carbide power device module 30 on the PCB board 40. For example, there are five locking screw through holes, and five locking screws 41 pass through the corresponding locking screw through holes to screw onto the controller base plate 10. This ensures that the force on the PCB board 40 is evenly distributed, guaranteeing the structural reliability for long-term use. Simultaneously, it also ensures that the packaged silicon carbide power device module 30 in the pre-set pad area on the second surface of the PCB board 40 can maintain a tight, long-term fit with the first surface of the thermally conductive phase change sheet 20 mounted on the heat sink area of ​​the controller base plate 10, preventing gaps and effectively maintaining the stability of heat dissipation performance.

[0042] In one embodiment, such as Figures 1-3 As shown, a screw through hole is provided on the PCB board 40 at the center of the packaged silicon carbide power device module 30, and the PCB board 40 is screwed to the controller base plate 10 by a screw passing through the screw through hole.

[0043] In this embodiment, in addition to the multiple locking screw through holes evenly arranged around the packaged silicon carbide power device module 30 on the PCB board 40, a screw through hole is further provided on the PCB board 40 at the center of the packaged silicon carbide power device module 30. A screw 42 passes through the screw through hole to screw the PCB board 40 to the controller base plate 10, thereby forming a layout with evenly distributed screws around the perimeter and central filling, so that the PCB board and the packaged silicon carbide power device module are evenly distributed, suppressing and reducing PCB board deformation, ensuring the structural reliability of long-term use, and effectively avoiding the board deformation problem caused by local stress concentration.

[0044] After the PCB board 40 is connected to the controller base plate 10 in the above manner, the controller base plate 10 and the controller cover plate 50 are fixed together by assembly screws, thereby completing the assembly process of the entire compressor driver.

[0045] As can be seen, the compressor driver in this embodiment enables the packaged silicon carbide power device module to be mounted on the PCB board without screw fixing and the installation adopts a unified surface mount process to improve assembly efficiency. It also eliminates the need to bend the pins of the packaged silicon carbide power device module to improve device connection reliability.

[0046] This application also provides an air conditioning compressor controller, such as... Figure 4As shown, the air conditioner compressor controller includes a compressor driver 1 as described in any of the preceding embodiments, and also includes an MCU control unit 2; a temperature detection module 3 is also provided on the PCB board of the compressor driver, and the MCU control unit is connected to the temperature detection module.

[0047] In this embodiment, the air conditioning compressor controller can be applied to the air conditioning compressor controller unit of new energy vehicles (pure electric, hybrid). In its specific implementation, in addition to the compressor driver 1 as described in any of the aforementioned embodiments, it also includes an MCU control unit 2. The PCB board of the compressor driver is also provided with a temperature detection module 3. The temperature detection module 3 specifically adopts NTC (Negative Temperature Coefficient) and is set adjacent to the heat dissipation surface of the packaged silicon carbide power device module in the compressor driver. The internal chip heat dissipation path of the packaged silicon carbide power device module is changed from the traditional wafer, substrate, lead frame, pin, PCB board to heat sink to wafer, bottom heat dissipation surface of packaged substrate to heat sink. This makes the sampling temperature of the temperature detection module highly correlated with the wafer temperature of the packaged silicon carbide power device module, and the temperature measurement accuracy is improved.

[0048] Meanwhile, because packaged silicon carbide power device modules do not require lead bending processes and have a shorter heat transfer path compared to traditional methods (transforming the traditional heat transfer path from wafer, substrate, lead frame, pins, PCB board to temperature sensing module into a path from wafer, bottom heat dissipation surface of the packaged substrate, PCB board to temperature sensing module), lower thermal resistance, improved thermal conductivity, and significantly reduced temperature decay, the high-precision temperature sampling allows for more accurate detection of the true temperature of the packaged silicon carbide power device module. This enables the development of over-temperature protection strategies tailored to the operating conditions, preventing protection failures or false triggering. Furthermore, efficient heat conduction not only keeps the compressor driver operating temperature within a safer range but also increases the actual application power of the packaged silicon carbide power device module while reducing the failure rate caused by overheating.

[0049] This application also provides a temperature control method for an air conditioning compressor controller, such as... Figure 5 The diagram shown is a flowchart illustrating the temperature control method for an air conditioning compressor controller provided in this application embodiment. The temperature control method for the air conditioning compressor controller is applied to an air conditioning compressor controller as described in any of the foregoing embodiments, such as... Figure 5 As shown, the temperature control method for the air conditioning compressor controller provided in this application includes steps S110 to S140.

[0050] S110. The temperature detection module in the air conditioner compressor controller collects the current sampling parameters according to the preset temperature acquisition cycle and sends them to the MCU control unit in the air conditioner compressor controller; the current sampling parameters are the sampling parameters corresponding to the current operating temperature of the packaged silicon carbide power device module in the air conditioner compressor controller under the current operating state.

[0051] S120. The MCU control unit determines the current temperature measurement temperature based on the current sampling parameters.

[0052] S130, The MCU control unit determines the current over-temperature protection judgment result based on the current measured temperature and the preset over-temperature protection strategy;

[0053] S140. If the MCU control unit determines that the current over-temperature protection determination result is an over-temperature protection execution result, it obtains the corresponding current target over-temperature protection sub-strategy according to the over-temperature protection strategy, and executes the corresponding over-temperature protection operation according to the current target over-temperature protection sub-strategy.

[0054] In this embodiment, please refer to again Figures 1-4To more accurately detect the true temperature of the packaged silicon carbide power device module 30 and formulate an over-temperature protection strategy that fits the operating conditions to avoid protection failure or false triggering, the temperature detection module 3 can first collect the current sampling parameters according to a preset temperature acquisition cycle. If the temperature detection module 3 specifically uses a negative temperature coefficient thermistor and is located adjacent to the heat dissipation surface of the packaged silicon carbide power device module 30 in the compressor driver, the current parameter obtained by the negative temperature coefficient thermistor according to the preset temperature acquisition cycle (e.g., 50ms; of course, the above value is only for example and can be set to other acquisition cycles according to the user's actual needs) is not a temperature value but a sampling voltage (corresponding to an analog voltage value). At this time, the sampling voltage is sent as the current sampling parameter to the MCU control unit 2 in the air conditioner compressor controller for analog-to-digital conversion (i.e., ADC conversion) and converted into a stable value, thus determining the current measured temperature. The range of the temperature value corresponding to the current sampling parameter of the temperature detection module 3 can be limited to -40℃ to 200℃. The temperature detection module 3 includes multiple negative temperature coefficient thermistors, and each negative temperature coefficient thermistor is set adjacent to the heat dissipation surface of one of the packaged silicon carbide power devices in the packaged silicon carbide power device module 30 in the compressor driver. In this way, the MCU control unit 2 can obtain the measured temperature of each packaged silicon carbide power device in the packaged silicon carbide power device module 30 at each temperature acquisition moment. At this time, the maximum or average value of the measured temperature of the above packaged silicon carbide power devices can be used as the current measured temperature. Of course, if the packaged silicon carbide power device module 30 includes 6 packaged silicon carbide power devices 31, and they are arranged in a 2x3 array, the heat dissipation of the packaged silicon carbide power devices in the middle column will inevitably be worse than that of the packaged silicon carbide power devices in the left and right columns. After the MCU control unit 2 can obtain the measured temperature of each packaged silicon carbide power device at each temperature acquisition moment, the measured temperatures of the two packaged silicon carbide power devices in the middle column can be multiplied by a preset array position compensation coefficient (such as 0.9; of course, the above value is only for example and can be set to other coefficient values ​​according to the actual needs of the user) to adjust their corresponding real wafer temperature. The measured temperatures of the packaged silicon carbide power devices in the left and right columns do not need to be adjusted. The MCU control unit can determine the current measured temperature at each temperature acquisition moment after adjusting the measured temperature.

[0055] When the MCU control unit determines the current over-temperature protection judgment result based on the current measured temperature and the preset over-temperature protection strategy, it mainly determines whether the current measured temperature exceeds one of the multiple preset temperature thresholds set in the over-temperature protection strategy. These multiple preset temperature thresholds include at least a first preset temperature threshold (e.g., set to 100℃; however, this value is only for example and can be set to other temperature values ​​according to actual user needs), a third preset temperature threshold (e.g., set to 110℃; however, this value is only for example and can be set to other temperature values ​​according to actual user needs; the third preset temperature threshold is greater than the first preset temperature threshold), etc. Taking the current measured temperature exceeding the first preset temperature threshold as an example, the current over-temperature protection judgment result can be determined as an over-temperature protection execution result, corresponding to a situation requiring speed reduction control. Similarly, taking the current measured temperature exceeding the third preset temperature threshold as an example, the current over-temperature protection judgment result can be determined as an over-temperature protection execution result, corresponding to a situation requiring over-temperature shutdown. Since the preset temperature acquisition period is known, the multiple temperature measurements corresponding to the acquisition parameters of the negative temperature coefficient thermistor, arranged in time sequence, can obtain the rate of temperature change (i.e., the derivative of temperature with time). If the rate of temperature change exceeds the first preset temperature rate of change gradient threshold (e.g., set to 1℃ / s; of course, the above value is only for example, and can be set to other temperature rate of change gradient thresholds according to the user's actual needs), the current over-temperature protection judgment result can be determined as the over-temperature protection execution result, corresponding to the situation requiring speed reduction control. Furthermore, if the rate of temperature change exceeds the second preset temperature rate of change gradient threshold (e.g., set to 5℃ / s; of course, the above value is only for example, and can be set to other temperature rate of change gradient thresholds according to the user's actual needs, where the second preset temperature rate of change gradient threshold is greater than the first preset temperature rate of change gradient threshold), the current over-temperature protection judgment result can be determined as the over-temperature protection execution result, corresponding to the situation requiring over-temperature shutdown.

[0056] If the MCU control unit determines that the current over-temperature protection judgment result is an over-temperature protection execution result (i.e., a situation requiring speed reduction control or over-temperature shutdown), then it obtains the corresponding current target over-temperature protection sub-strategy (such as a speed reduction control strategy or a shutdown control strategy) according to the over-temperature protection strategy, and executes the corresponding over-temperature protection operation according to the current target over-temperature protection sub-strategy. Based on the accurate measurement of the current operating temperature of the packaged silicon carbide power device module in the air conditioner compressor controller by the temperature detection module, and by setting a precise temperature derating threshold, a closed-loop control over-temperature protection strategy can be constructed, which can improve the accuracy and reliability of over-temperature protection.

[0057] In one embodiment, as a first embodiment of step S140, step S140 includes:

[0058] If the current target over-temperature protection sub-strategy is determined to be a speed reduction control strategy, then when the current measured temperature is detected to exceed the first preset temperature threshold, the compressor driver in the air conditioning compressor controller is controlled to perform speed reduction control according to the preset speed reduction control strategy until the latest measured temperature is detected to be less than or equal to the second preset temperature threshold, at which point the compressor driver is controlled to resume full-speed operation. Specifically, when the compressor driver in the air conditioning compressor controller is controlled to perform speed reduction control according to the preset speed reduction control strategy, the driving speed of the compressor driver is reduced to the first preset driving speed. The first preset driving speed is less than the full-speed driving speed corresponding to the full-speed operation state of the compressor driver, and the second preset temperature threshold is less than the first preset temperature threshold.

[0059] In this embodiment, if the current target over-temperature protection sub-strategy is determined to be a speed reduction control strategy, then when the current measured temperature is detected to exceed the first preset temperature threshold (e.g., 100℃), the compressor driver in the air conditioning compressor controller is controlled to perform speed reduction control according to the preset speed reduction control strategy, and the driving speed of the compressor driver is reduced to the first preset driving speed. The first preset driving speed is less than the full-speed driving speed corresponding to the full-speed operation state of the compressor driver, and the second preset temperature threshold is less than the first preset temperature threshold. The first preset driving speed can be set to 90%, 80%, etc. of the full-speed driving speed. The compressor driver can also reduce from the full-speed driving speed to the first preset driving speed evenly within a preset time (e.g., 5s, 10s, etc.) to ensure the safety of each component in the air conditioning compressor controller. Moreover, after the protection is triggered and the speed reduction control is performed, temperature measurement will continue.

[0060] Furthermore, during the aforementioned speed reduction process, when the current measured temperature is initially detected to exceed the first preset temperature threshold, a speed reduction flag is generated in the MCU control unit. This speed reduction continues until the latest measured temperature is detected to be less than or equal to the second preset temperature threshold (e.g., 95°C), at which point the compressor driver is controlled to resume full-speed operation, and the speed reduction flag in the MCU control unit is cleared. Through this detection process, intelligent speed reduction control of the compressor driver in the air conditioning compressor controller is achieved.

[0061] In one embodiment, as a second embodiment of step S140, step S140 includes:

[0062] If the current target over-temperature protection sub-strategy is determined to be a shutdown control strategy, then when the number of consecutively detected current temperature readings exceeding the third preset temperature threshold is greater than or equal to the first preset number of times, the compressor driver in the air conditioning compressor controller is controlled to shut down. After shutdown, when the number of consecutively detected current temperature readings not exceeding the first preset temperature threshold is greater than or equal to the second preset number of times, the compressor driver is controlled to restart.

[0063] In this embodiment, if the current target over-temperature protection sub-strategy is determined to be a shutdown control strategy, then when the current measured temperature is detected to exceed the third preset temperature threshold (e.g., 110°C), the preset shutdown control strategy continues to collect multiple consecutive current measured temperatures at a preset temperature acquisition cycle. When the first cumulative number of over-temperature events corresponding to the consecutively detected current measured temperatures exceeding the third preset temperature threshold is greater than or equal to the first preset number, the compressor driver in the air conditioning compressor controller is controlled to shut down to ensure the safety of each component in the air conditioning compressor controller. Moreover, after the shutdown control is triggered by the above protection, temperature measurement will continue.

[0064] Furthermore, during the aforementioned shutdown control process, whenever the current measured temperature exceeds the third preset temperature threshold, the count in the fault counter in the MCU control unit will be incremented by 1 (the initial value of the count in the fault counter is 0, and the count in the fault counter is reset to zero after each specific shutdown operation). When the latest first over-temperature cumulative number in the fault counter is greater than or equal to the first preset number (e.g., set to 5 times; of course, the above value is only for example and can be set to other values ​​according to the user's actual needs), the compressor driver in the air conditioning compressor controller will be shut down.

[0065] After the aforementioned protection triggers and the shutdown control is activated, temperature monitoring continues. Whenever the current measured temperature is detected to be less than or equal to a first preset temperature threshold, the fault clearing counter in the MCU control unit is incremented by 1 (the initial value of the fault clearing counter is 0, and the count is reset to zero after each restart operation). When the latest cumulative over-temperature count in the fault clearing counter is greater than or equal to the first preset count, the compressor driver in the air conditioning compressor controller is restarted. Through this detection process, intelligent shutdown control of the compressor driver in the air conditioning compressor controller is achieved.

[0066] In one embodiment, the method further includes the following after step S130:

[0067] If the MCU control unit determines that the current over-temperature protection determination result is that the over-temperature protection will not be executed, then the compressor driver in the air conditioning compressor controller will remain in operation.

[0068] In this embodiment, if the MCU control unit determines that the current over-temperature protection determination result is that the over-temperature protection will not be executed, it means that the current measured temperature has not exceeded the first preset temperature threshold. At this time, neither speed reduction control nor shutdown control will be triggered, and the operating state and corresponding operating speed of the compressor driver in the air conditioning compressor controller can be maintained.

[0069] In summary, the embodiments of this application provide a compressor driver, an air conditioning compressor controller, and a temperature control method thereof. The compressor driver includes a controller base plate, a thermally conductive phase change sheet, an encapsulated silicon carbide power device module, a PCB board, and a controller cover plate. The PCB board is connected to the controller base plate, and the second side of the PCB board faces the controller base plate. The encapsulated silicon carbide power device module is mounted on a preset pad area on the second side of the PCB board through a preset soldering process. The second side of the thermally conductive phase change sheet is attached to the heat sink area of ​​the controller base plate. The controller base plate is connected to the controller cover plate, and the first side of the thermally conductive phase change sheet is aligned with the preset pad area, and the first side of the thermally conductive phase change sheet is attached to the encapsulated silicon carbide power device module on the preset pad area. The encapsulated silicon carbide power device module consists of several encapsulated silicon carbide power devices obtained by Q-DPAK packaging technology. The embodiments of this application enable packaged silicon carbide power device modules to be mounted on PCB boards without screw fixing, and the installation adopts a unified surface mount process to improve assembly efficiency. Furthermore, it eliminates the need to bend the pins of packaged silicon carbide power device modules to improve device connection reliability.

[0070] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this application.

[0071] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of each unit is merely a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0072] The steps in the methods of this application embodiment can be adjusted, merged, or deleted according to actual needs. The units in the apparatus of this application embodiment can be merged, divided, or deleted according to actual needs. Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0073] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, a terminal, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application.

[0074] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A compressor drive, characterized in that, The system includes a controller base plate, a thermally conductive phase change electrode, a packaged silicon carbide power device module, a PCB board, and a controller cover plate. The PCB board is connected to the controller base plate, with its second side facing the controller base plate. The packaged silicon carbide power device module is mounted on a preset pad area on the second side of the PCB board using a preset soldering process. The second side of the thermally conductive phase change electrode is attached to the heat sink area of ​​the controller base plate. The controller base plate is connected to the controller cover plate, such that the first side of the thermally conductive phase change electrode aligns with the preset pad area, and the first side of the thermally conductive phase change electrode is attached to the packaged silicon carbide power device module on the preset pad area. The packaged silicon carbide power device module consists of several packaged silicon carbide power devices obtained using a Q-DPAK packaging process.

2. The compressor driver according to claim 1, characterized in that, The preset welding process is a reflow soldering process.

3. The compressor driver according to claim 1, characterized in that, The packaged silicon carbide power device module includes multiple packaged silicon carbide power devices, which are arranged in a preset array manner.

4. The compressor driver according to claim 3, characterized in that, The PCB board has a plurality of locking screw through holes uniformly arranged in the area surrounding the packaged silicon carbide power device module, and the PCB board is screwed to the controller base plate by a plurality of locking screws having the same number as the plurality of locking screw through holes passing through the corresponding locking screw through holes.

5. The compressor driver according to claim 4, characterized in that, A screw through hole is provided on the PCB board at the center of the packaged silicon carbide power device module, and the PCB board is screwed to the controller base plate by a screw passing through the screw through hole.

6. An air conditioner compressor controller, characterized in that, The compressor driver as described in any one of claims 1-5 is further comprising an MCU control unit; a temperature detection module is also provided on the PCB board of the compressor driver, and the MCU control unit is connected to the temperature detection module.

7. A temperature control method for an air conditioner compressor controller, applied to the air conditioner compressor controller as described in claim 6, characterized in that, include: The temperature detection module in the air conditioner compressor controller collects the current sampling parameters according to a preset temperature acquisition cycle and sends them to the MCU control unit in the air conditioner compressor controller; the current sampling parameters are the sampling parameters corresponding to the current operating temperature of the packaged silicon carbide power device module in the air conditioner compressor controller under the current operating state; The MCU control unit determines the current temperature measurement temperature based on the current sampling parameters; The MCU control unit determines the current over-temperature protection judgment result based on the current measured temperature and the preset over-temperature protection strategy; If the MCU control unit determines that the current over-temperature protection determination result is an over-temperature protection execution result, it obtains the corresponding current target over-temperature protection sub-strategy according to the over-temperature protection strategy, and executes the corresponding over-temperature protection operation according to the current target over-temperature protection sub-strategy.

8. The temperature control method for an air conditioning compressor controller according to claim 7, characterized in that, The step of executing the corresponding over-temperature protection operation according to the current target over-temperature protection sub-strategy includes: If the current target over-temperature protection sub-strategy is determined to be a speed reduction control strategy, then when the current measured temperature is detected to exceed the first preset temperature threshold, the compressor driver in the air conditioning compressor controller is controlled to perform speed reduction control according to the preset speed reduction control strategy until the latest measured temperature is detected to be less than or equal to the second preset temperature threshold, at which point the compressor driver is controlled to resume full-speed operation. Specifically, when the compressor driver in the air conditioning compressor controller is controlled to perform speed reduction control according to the preset speed reduction control strategy, the driving speed of the compressor driver is reduced to the first preset driving speed. The first preset driving speed is less than the full-speed driving speed corresponding to the full-speed operation state of the compressor driver, and the second preset temperature threshold is less than the first preset temperature threshold.

9. The temperature control method for an air conditioning compressor controller according to claim 7, characterized in that, The step of executing the corresponding over-temperature protection operation according to the current target over-temperature protection sub-strategy includes: If the current target over-temperature protection sub-strategy is determined to be a shutdown control strategy, then when the number of consecutively detected current temperature readings exceeding the third preset temperature threshold is greater than or equal to the first preset number of times, the compressor driver in the air conditioning compressor controller is controlled to shut down. After shutdown, when the number of consecutively detected current temperature readings not exceeding the first preset temperature threshold is greater than or equal to the second preset number of times, the compressor driver is controlled to restart.

10. The temperature control method for an air conditioning compressor controller according to claim 7, characterized in that, After the step of the MCU control unit determining the current over-temperature protection judgment result based on the current measured temperature and the preset over-temperature protection strategy, the method further includes: If the MCU control unit determines that the current over-temperature protection determination result is that the over-temperature protection will not be executed, then the compressor driver in the air conditioning compressor controller will remain in operation.

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