Substrate processing apparatus and method for cleaning lock key

Abstract

The invention relates to a substrate processing apparatus and a method of cleaning a lock key. The present invention prevents a substrate from being contaminated by particles derived from a lock key and a member in contact with the lock key. A substrate processing apparatus for drying a substrate by replacing a liquid film formed on an upper surface of the substrate with a supercritical fluid is provided with: a pressure vessel having a drying chamber for drying the substrate therein; the cover body is used for blocking the opening of the drying chamber; the locking key is used for limiting the cover body to move from a closing position where the cover body closes the opening to an opening position where the cover body opens the opening; and a cleaning unit that cleans the lock key.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus and a cleaning method for a locking key. Background Technology

[0002] In the manufacturing process of semiconductor devices, supercritical drying is performed to prevent pattern collapse. In supercritical drying, a substrate covered with liquid such as IPA is replaced by a supercritical fluid such as supercritical CO2 inside a supercritical container, thereby drying the substrate. To prevent leakage of supercritical fluid when high-pressure supercritical fluid is supplied into the supercritical container, a locking key is used to lock the lid in a way that prevents the lid of the supercritical container from being opened (see, for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-030850 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a technique for preventing substrate contamination by particulate matter originating from locking keys and components in contact with locking keys.

[0008] Solution for solving the problem

[0009] According to a technical solution of this disclosure, a substrate processing apparatus is provided, which replaces a liquid film formed on the upper surface of a substrate with a supercritical fluid to dry the substrate. The substrate processing apparatus includes: a pressure vessel having a drying chamber inside for drying the substrate; a cover that seals the opening of the drying chamber; a locking key that restricts the cover from moving from a closed position where the cover seals the opening to an open position where the cover opens the opening; and a cleaning unit that cleans the locking key.

[0010] The effects of the invention

[0011] According to the above-mentioned technical solution, it is possible to prevent the substrate from being contaminated by particles originating from the locking key and components in contact with the locking key. Attached Figure Description

[0012] Figure 1 This is a schematic cross-sectional view of a substrate processing apparatus according to one embodiment.

[0013] Figure 2 yes Figure 1 A schematic longitudinal sectional view of the substrate processing apparatus shown.

[0014] Figure 3 yes Figure 1 Another schematic longitudinal sectional view of the substrate processing apparatus shown.

[0015] Figure 4 This is a flowchart illustrating a substrate processing method according to one embodiment.

[0016] Figures 5A-5C For assembly in Figure 1 A schematic longitudinal sectional view illustrating an example of the substrate feeding operation in the drying unit of the substrate processing apparatus shown.

[0017] Figures 6A-6B This is a schematic longitudinal sectional view illustrating an example of fluid flow during the drying process in the drying unit.

[0018] Figure 7A This is a side view of a drying unit showing an example of the structure and operation of the cover and locking key provided in the drying unit. It is a diagram showing the state in which the cover is in the closed position and the locking key is in the locked position.

[0019] Figure 7B yes Figure 7A A cross-sectional view of the drying unit shown along line VIIB-VIIB.

[0020] Figure 8A It means in Figure 7A The side view of the drying unit shown shows the cover in the standby position and the locking key in the unlocked position.

[0021] Figure 8B yes Figure 8A A cross-sectional view of the drying unit shown along line VIIIB-VIIIB.

[0022] Figure 9A This is a cross-sectional view showing an example of the structure and operation of the locking key and surrounding components of the drying unit, and a diagram showing the state of the locking key in the unlocked position.

[0023] Figure 9B It means Figure 9A The diagram shows a cross-sectional view of the lock key in the locked position.

[0024] Figure 10 This is a cross-sectional view illustrating an example of a structure in which a resin layer and a rolling element are provided on the surface of a locking key. Figure 9A A cross-sectional view of region X in the diagram.

[0025] Figure 11 It is an explanation of the composition Figure 4 The flowchart is an example of a sub-step of step S4 in the flowchart.

[0026] Figures 12A-12EThis is a schematic diagram illustrating an example of the mechanism by which wear powder originating from the locking key is generated and adheres to the substrate.

[0027] Figures 13A-13B This is a schematic diagram illustrating the structure and function of the locking key cleaning section in the first embodiment.

[0028] Figure 14 This is a schematic diagram illustrating the structure and function of the locking key cleaning section in the second embodiment.

[0029] Figures 15A-15B This is a schematic diagram illustrating the structure and function of the locking key cleaning section in the third embodiment.

[0030] Figures 16A-16C This is a schematic diagram illustrating the structure and function of the locking key cleaning section in the fourth embodiment.

[0031] Explanation of reference numerals in the attached figures

[0032] W, substrate; S, drying chamber; 51, pressure vessel; 52, cover; 57, locking key; 500A, 500B, 500C, 500D, cleaning section. Detailed Implementation

[0033] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Furthermore, in the drawings, the same or corresponding structures are labeled with the same reference numerals, and sometimes descriptions are omitted. In this specification, the X-axis, Y-axis, and Z-axis are mutually perpendicular directions. The X-axis and Y-axis are horizontal directions, and the Z-axis is a vertical direction.

[0034] First, refer to Figures 1-3 The substrate processing apparatus 1 of the embodiment will be described below. Figure 1 As shown, the substrate processing apparatus 1 includes an infeed / outfeed station 2 and a processing station 3.

[0035] The infeed / outfeed station 2 includes a loading platform 21, a conveying section 22, and a transfer section 23. The loading platform 21 is used to load multiple carriers C. The multiple carriers C respectively accommodate multiple horizontal substrates W at intervals in the vertical direction.

[0036] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may also include electronic circuits or other devices formed on the surface of the semiconductor substrate or the glass substrate. The substrate W may also have raised or recessed patterns on its surface.

[0037] A first conveying device 22a is disposed inside the conveying section 22. The first conveying device 22a conveys the substrate W inside the conveying section 22 and conveys the substrate W between a plurality of devices disposed next to the conveying section 22.

[0038] The first conveying device 22a includes a first conveying arm for holding the substrate W. The first conveying arm is capable of movement in both the horizontal (X-axis and Y-axis) and vertical directions, as well as rotation about the vertical axis. There may be one or more first conveying arms.

[0039] The transfer section 23 has a transfer device 23a that temporarily accommodates the substrate W.

[0040] Processing station 3 includes a conveying module 31 and multiple processing modules 32. The conveying module 31 is cuboid in shape. A second conveying device 31a is disposed inside the conveying module 31. The second conveying device 31a conveys the substrate W between multiple devices disposed next to the conveying module 31.

[0041] The second conveying device 31a includes a second conveying arm for holding the substrate W. The second conveying arm is capable of movement in both the horizontal (X-axis and Y-axis) and vertical directions, as well as rotation about the vertical axis. There may be one or more second conveying arms.

[0042] Multiple processing modules 32 can also be configured. For example... Figure 1 As shown, multiple processing modules 32 can also be symmetrically arranged on both sides of the conveying module 31 in the Y-axis direction.

[0043] The processing module 32 includes a liquid film forming unit 32a, a drying unit 32b, and a supply unit 32c. The processing module 32 may also have multiple sets (e.g., two sets) of liquid film forming units 32a, drying units 32b, and supply units 32c.

[0044] The liquid film forming unit 32a supplies liquid to the upper surface of a horizontal substrate W. The liquid film forming unit 32a includes, for example, a rotating holding disk that holds the substrate W horizontally and a nozzle that sprays liquid onto the upper surface of the substrate W. The nozzle supplies liquid to the center of the upper surface of the rotating substrate W. The liquid wets and spreads from the center of the upper surface of the substrate W towards the periphery due to centrifugal force. For example, a pharmaceutical solution, a rinsing solution, and a drying solution are supplied in this sequence. Multiple pharmaceutical solutions can also be supplied, and a rinsing solution can also be supplied between the supply of one pharmaceutical solution and the supply of another.

[0045] The liquid film forming unit 32a forms, for example, a liquid film of a drug solution on the upper surface of a horizontal substrate W, then replaces the liquid film of the drug solution with a liquid film of a rinsing solution, and then replaces the liquid film of the rinsing solution with a liquid film of a drying solution. The drug solution is, for example, SC1 (an aqueous solution of ammonia and hydrogen peroxide) or DHF (dilute hydrofluoric acid). The rinsing solution is, for example, DIW (deionized water). The drying solution is, for example, an organic solvent such as IPA (isopropanol).

[0046] Drying unit 32b replaces the liquid film formed on the upper surface of the horizontal substrate W with a supercritical fluid, thereby drying the substrate W. A supercritical fluid is a fluid that operates at a temperature above its critical temperature and a pressure above its critical pressure. By replacing the liquid film, such as a drying liquid, with a supercritical fluid, the collapse of the uneven pattern on the substrate W caused by surface tension can be suppressed. Details of drying unit 32b will be described later.

[0047] The supply unit 32c supplies fluid to the drying unit 32b. Specifically, the supply unit 32c includes a supply device assembly comprising a flow meter, a flow regulator, a back pressure valve, a heater, etc., and a housing containing the supply device assembly. For example, the supply unit 32c supplies high-pressure CO2 as a fluid to the drying unit 32b.

[0048] Viewed from above, the drying unit 32b and supply unit 32c included in the same processing module 32 are arranged alternately in the X-axis direction. The supply unit 32c supplies fluid to the drying unit 32b adjacent to it on the negative X-axis side.

[0049] Viewed from above, the processing module 32 protrudes further in the positive X-axis direction than the conveying module 31. A supply unit 32c is disposed in this protruding portion. The supply unit 32c is open on three sides (positive Y-axis direction, negative Y-axis direction, and positive X-axis direction), providing good operability during maintenance.

[0050] When multiple processing modules 32 are provided, the second conveying device 31a conveys a substrate W between multiple units included in the same processing module 32 (e.g., between the liquid film forming unit 32a and the drying unit 32b).

[0051] The substrate processing apparatus 1 includes a control device 4 (only in...) Figure 1 (As shown in the diagram). The control device 4 is capable of controlling the operation of all operable components included in the substrate processing apparatus 1. The control device 4 is, for example, a computer, and includes a control arithmetic unit 41 and a storage unit 42. The storage unit 42 stores programs (including processing procedures) for controlling various processes executed in the substrate processing apparatus 1. The control arithmetic unit 41 controls the operation of the substrate processing apparatus 1 by reading and executing the programs stored in the storage unit 42. The control arithmetic unit 41 may also be a CPU (Central Processing Unit) or one or more circuits.

[0052] Alternatively, the aforementioned program can be recorded on a computer-readable storage medium and loaded from that storage medium into the storage unit 42 of the control device 4. The computer-readable storage medium can be, for example, any one or a combination of two or more of the following: hard disk (HD), floppy disk (FD), optical disk (CD), magneto-optical disk (MO), memory card, RAM (Random Access Memory), ROM (Read Only Memory), and SSD (Solid State Drive).

[0053] Next, refer to Figure 4 The operation of the substrate processing apparatus 1 will be explained. Figure 4 Steps S1 to S4 shown are implemented under the control of control device 4.

[0054] First, the first conveying device 22a removes the substrate W from the carrier C and conveys the removed substrate W to the conveying device 23a. Next, the second conveying device 31a removes the substrate W from the conveying device 23a and conveys the removed substrate W to the liquid film forming unit 32a.

[0055] Next, the liquid film forming unit 32a supplies the liquid medicine to the upper surface of the horizontal substrate W (step S1). The liquid medicine is supplied to the center of the upper surface of the rotating substrate W and expands radially to the upper surface by centrifugal force to form a liquid film.

[0056] Next, the liquid film forming unit 32a supplies rinsing liquid to the upper surface of the horizontal substrate W (step S2). The rinsing liquid is supplied to the center of the upper surface of the rotating substrate W and expands radially upwards by centrifugal force to form a liquid film. The liquid film of the pharmaceutical solution is replaced by the liquid film of the rinsing liquid.

[0057] Next, the liquid film forming unit 32a supplies drying liquid to the upper surface of the horizontal substrate W (step S3). The drying liquid is supplied to the center of the upper surface of the rotating substrate W and expands radially upwards through centrifugal force to form a liquid film. The liquid film of the rinsing liquid is replaced by the liquid film of the drying liquid.

[0058] Next, the second conveying device 31a takes out the substrate W from the liquid film forming unit 32a and conveys the taken-out substrate W to the drying unit 32b.

[0059] Next, the drying unit 32b replaces the liquid film formed on the upper surface of the horizontal substrate W with a supercritical fluid, thereby drying the substrate W (step S4). By replacing the liquid film of the drying liquid with a supercritical fluid, the appearance of a liquid-gas interface on the uneven pattern of the substrate W can be suppressed. As a result, the generation of surface tension can be suppressed, and the collapse of the uneven pattern can be prevented.

[0060] Finally, the second conveying device 31a removes the substrate W from the drying unit 32b and conveys the removed substrate W to the conveying device 23a. Next, the first conveying device 22a removes the substrate W from the conveying device 23a and places the removed substrate W into the carrier C.

[0061] Next, referring to the cross-sectional view obtained by cutting the central portion of the drying unit 32b in the X direction with a cutting plane parallel to the YZ plane, Figures 5A-5C The structure and function of the drying unit 32b are explained. Figures 5A-5C The drying unit 32b shown is positioned on the positive Y-axis side of the conveying module 31. In the description of the drying unit 32b, the direction in which the substrate W is fed into the drying chamber S (in...) Figures 5A-5C With the positive Y-axis as the front, the direction in which the substrate W is sent out of the drying chamber S (in the direction of the positive Y-axis) is the front. Figures 5A-5C (The middle part is the negative Y-axis direction) will be explained later.

[0062] The drying unit 32b includes: a pressure vessel 51, which has a drying chamber S in which a substrate W is formed; a cover 52, which seals a first opening Sa of the drying chamber S; and a support 53, which is fixed inside the drying chamber S and holds the substrate W horizontally inside the drying chamber S. The first opening Sa is the inlet and outlet of the substrate W. The substrate W is fed into the drying chamber S through the first opening Sa, and after being dried in the drying chamber S, it is discharged from the drying chamber S through the first opening Sa.

[0063] In one structural example, pressure vessel 51 includes a lower wall 51a, an upper wall 51b, a front wall 51c, a rear wall 51d, and a pair of side walls, forming a drying chamber S within it. Figures 5A-5C In this structure, one side wall is the inner wall of the drying chamber S. The drying chamber S is, for example, rectangular. A first rectangular opening Sa is formed on the rear wall 51d, and a second rectangular opening Sb is formed on the front wall 51c.

[0064] The cover 52 is located behind the rear wall 51d. The cover 52 can be in the closed position ( Figure 5C The location shown) and the open location ( Figure 5B The cover 52 moves between the positions shown. The closed position is where the cover 52 closes the first opening Sa. The open position is located behind the closed position and is where the cover 52 opens the first opening Sa.

[0065] The second opening Sb is closed by the cover 61. The cover 61 can be opened and closed, but remains closed during normal operation of the drying unit 32b, for example, it can be opened during maintenance of the drying unit 32b.

[0066] The cover 52 can be in an open position and a standby position. Figure 5AThe cover 52 rotates between the positions shown to facilitate the entry of the second conveyor 31a into the drying chamber S. The standby position is the position where the substrate W deviates from the movement path of the conveyor arm during the feeding and feeding of the substrate W. When the substrate W is fed in or out, the cover 52 is in the standby position.

[0067] The support 53 includes a rectifier plate 53a and a support pin 53b disposed on the upper surface of the rectifier plate 53a. The rectifier plate 53a is fixed to the wall of the pressure vessel 51. The rectifier plate 53a guides and rectifies the flow of fluid in the drying chamber S. The support pin 53b supports the substrate W on its upper surface. At this time, a gap is formed between the substrate W and the rectifier plate 53a.

[0068] Figure 6A and Figure 6B It is a record Figures 5A-5C The figures do not show components related to fluid supply and discharge, and enlarged views of the area surrounding the substrate W. As shown in these figures, a discharge port 51g for discharging fluid from the drying chamber S and a supply port 51h for supplying fluid to the drying chamber S are provided on the lower wall 51a of the pressure vessel 51. A plurality of fluid ejection ports 61a are provided on the second cover 61. Figure 6A The paper is arranged at approximately equal intervals in the vertical direction (X-axis direction).

[0069] like Figure 7A , Figure 7B , Figure 8A as well as Figure 8B As shown, the drying unit 32b includes a support frame 54 for supporting the pressure vessel 51. The support frame 54 has, for example, a horizontal base plate 54a, multiple columns 54b protruding upward from the base plate 54a, and a pair of horizontal plates 54c fixed to the upper surface of the multiple columns 54b. The pressure vessel 51 is fixed on the pair of horizontal plates 54c arranged on both sides in the X direction.

[0070] The drying unit 32b includes a direct-acting mechanism 55 that moves the cover 52 back and forth between a closed position and an open position, and a rotation mechanism 56 that rotates the cover 52 between an open position and a standby position. The rotation mechanism 56 includes, for example, a rotation shaft 56a of the cover 52 and a rotation actuator 56b that rotates the rotation shaft 56a. On the other hand, the direct-acting mechanism 55 includes, for example, a sliding member 55a that holds a bearing of the rotation shaft 56a and a direct-acting actuator 55b that moves the sliding member 55a back and forth.

[0071] The rotation axis 56a of the cover 52 is symmetrically arranged on both sides of the cover 52 in the X-axis direction. The slider 55a is also symmetrically arranged on both sides of the cover 52 in the X-axis direction. The guides 55c of the slider 55a are respectively laid on a pair of horizontal plates 54c. A rotary actuator 56b is fixed to one of the sliders 55a and can move forward and backward together with the slider 55a. A linear actuator 55b is fixed to a horizontal plate 54c.

[0072] The direct-acting actuator 55b, for example, is a pneumatic cylinder that uses compressed air pressure to press the cover 52 against the pressure vessel 51. A sealing member (not shown) that can be flattened by the driving force of the direct-acting actuator 55b to seal between the cover 52 and the pressure vessel 51 prevents the cover 52 from obstructing the movement of the locking key 57 when the locking key 57 (described later) is inserted into the fitting hole 51i in the upper wall 51b of the pressure vessel 51. Alternatively, the direct-acting actuator 55b may also include a motor and a ball screw that converts the rotational motion of the motor into linear motion of the cover 52.

[0073] The drying unit 32b includes a locking key 57 that restricts the cover 52 from retracting from the closed position to the open position. The locking key 57 is wedge-shaped and embedded in the fitting hole 51i of the pressure vessel 51, restricting (essentially preventing) the retraction of the cover 52. Even if fluid is supplied to the drying chamber S, causing the pressure in the drying chamber S to rise, the retraction of the cover 52 can be restricted, thus preventing fluid leakage.

[0074] The lower wall 51a and upper wall 51b of the pressure vessel 51 protrude rearward compared to the rear wall 51d. In this protruding portion, a fitting hole 51i extends through the lower wall 51a and upper wall 51b in the Z-axis direction. Multiple fitting holes 51i are formed at open intervals in the X-axis direction. Multiple locking keys 57 are also provided at open intervals in the X-axis direction. Each locking key 57 is inserted into a corresponding fitting hole 51i formed in the lower wall 51a and upper wall 51b.

[0075] The number of locking keys 57 is not particularly limited, but may be, for example, three. Unlike the case where the number of locking keys 57 is two, the central portion of the cover 52 in the X-axis direction can also be pressed. As a result, when fluid is supplied to the drying chamber S and the pressure of the drying chamber S increases, the central portion of the cover 52 in the X-axis direction can be prevented from bulging backward compared to the end portion in the X-axis direction.

[0076] The drying unit 32b may also be equipped with a laser thickness gauge 58, which measures the thickness of the liquid film LF formed on the upper surface of the substrate W fed into the drying chamber S of the pressure vessel 51.

[0077] The drying unit 32b is equipped with a locking key 57 in the locked position. Figure 9B The position shown) and the lock / unlock position ( Figure 9AThe lifting mechanism 59 moves up and down between the positions shown. The locked position is the position where the locking key 57 restricts the retraction of the cover 52, and the position where the locking key 57 is inserted into the fitting hole 51i of both the lower wall 51a and the upper wall 51b. The unlocked position is the position where the locking key 57 allows the cover 52 to retract, and the position where the locking key 57 is pulled downward from the fitting hole 51i of the upper wall 51b and the lower wall 51a. The unlocked position is set below the lower wall 51a of the pressure vessel 51, not only to prevent interference between the locking key 57 and the substrate W, but also to provide a locking key cleaning part described later.

[0078] The lifting mechanism 59 includes, for example, a lifting platform 59a that carries a plurality of locking keys 57 and a direct-acting actuator 59b that raises and lowers the lifting platform 59a. The lifting platform 59a has a horizontal surface 59a1 on which the locking keys 57 are carried. The direct-acting actuator 59b is, for example, a pneumatic cylinder that raises and lowers the lifting platform 59a, thereby raising and lowering the plurality of locking keys 57. The direct-acting actuator 59b may also include a motor and a ball screw that converts the rotational motion of the motor into linear motion of the lifting platform 59a.

[0079] exist Figure 7B A brush for cleaning the locking key 57 is provided in the area 500R enclosed by a single-dot line. The locking key cleaning part is mainly used to remove wear powder adhering to the locking key 57. The specific structure of the locking key cleaning part will be described in detail later.

[0080] like Figure 9A As shown, the rolling element 60 can also be set at the locking key 57. The rolling element 60 is, for example, a ball, which is held in place and rotates freely around the center of the ball. The rolling element 60 can also be a roller.

[0081] When the lifting mechanism 59 raises the locking key 57 from the unlocked position to the locked position, the rolling element 60 rolls in contact with the cover 52 or the pressure vessel 51. The rolling element 60 reduces frictional resistance and suppresses the generation of particles caused by friction.

[0082] Multiple rolling elements 60 are also provided on the lower surface 57a of the locking key 57, and they roll in contact with the horizontal surface 59a1 of the lifting mechanism 59. When the locking key 57 is raised, it can move horizontally inside the fitting hole 51i, thereby reducing frictional resistance.

[0083] Preferably, the locking key 57 is raised or lowered with its rear surface 57b vertically upright. It is also possible to raise the locking key 57 with its rear surface 57b tilted forward, but the corner 57c of the upper surface of the locking key 57 may collide with the rear surface 52a of the cover 52.

[0084] Multiple rolling elements 60 are provided at intervals along the Z-axis on the rear surface 57b of the locking key 57. Compared to the case where only one element is provided, friction between the locking key 57 and the pressure vessel 51 can be suppressed. This structure is particularly effective when the rear surface 57b of the locking key 57 is vertically upright.

[0085] like Figure 9A As shown, the locking key 57 may also have on its front surface: an inclined surface 57d, which is inclined in a manner that moves forward from the top towards the bottom; and a vertical surface 57e, which extends directly downward from the bottom of the inclined surface 57d. By forming the inclined surface 57d, it is possible to prevent the corner 57c of the front end of the upper surface of the locking key 57 from colliding with the rear surface 52a of the cover 52.

[0086] The rolling element 60 is also disposed on the inclined surface 57d of the locking key 57, and rolls in contact with the rear surface 52a of the cover 52. The rear surface 52a of the cover 52 is opposite to the inclined surface 57d of the locking key 57, and is inclined forward from the top to the bottom.

[0087] Next, refer to Figure 11 , for Figure 4 The details of step S4 described in the text will be explained. Figure 11 The steps (sub-steps) S41 to S45 shown are implemented under the control of the control device 4.

[0088] First, the second conveying device 31a holds the substrate W with the liquid film LF formed on it horizontally and feeds the substrate W into the drying chamber S inside the pressure vessel 51 (step S41). During this process, the laser film thickness gauge 58 measures the film thickness of the liquid film LF. It can be confirmed whether the uneven pattern of the substrate W is covered by the liquid film LF.

[0089] Next, the support 53 fixed to the drying chamber S receives the substrate W from the second conveying device 31a and supports the received substrate W horizontally. Then, the second conveying device 31a exits from the first opening Sa of the drying chamber S to the outside.

[0090] Next, the rotating mechanism 56 rotates the cover 52 from the standby position to the open position. Then, the direct-acting mechanism 55 moves the cover 52 from the open position to the closed position. As a result, the cover 52 seals the first opening Sa of the drying chamber S.

[0091] Next, the lifting mechanism 59 raises the locking key 57 from the unlocked position to the locked position. The locking key 57 presses against the cover 52 from the rear, restricting the retraction of the cover 52. In S42, described later, fluid leakage can be suppressed.

[0092] Next, supply unit 32c supplies fluids such as CO2 to drying chamber S, causing the pressure in drying chamber S to rise (step S42). At this time, as... Figure 6A As shown, fluid is supplied to the drying chamber S from the supply port 51h of the lower wall 51a. Fluid is ejected upwards from the supply port 53a5 of the rectifier plate 53a. Although not shown in the diagram, in top view, multiple supply ports 53a5 are formed at each of the four corners of the rectifier plate 53a, and fluid flows from the outside to the inside of the substrate W. A flow from the periphery to the center of the substrate forms above it. Therefore, it is possible to prevent the liquid film LF from spilling onto the outside of the substrate W due to the fluid flow. In top view, the supply port 53a5 is positioned on the outside of the substrate W, so even if fluid is ejected directly upwards from the supply port 53a5, the substrate W will not be blown away. During the period when the pressure in the drying chamber S rises, the fluid does not exit from the drying chamber S but accumulates in the drying chamber S. The pressure in the drying chamber S rises to a set pressure above the critical pressure.

[0093] Next, the supply unit 32c supplies fluid to the drying chamber S, and the discharge unit (not shown) discharges fluid from the drying chamber S, maintaining the pressure in the drying chamber S at a set pressure while discharging the dried liquid containing the fluid dissolved in the supercritical state from the drying chamber S (step S43). At this time, fluid is supplied to the drying chamber S from multiple nozzles 61a spaced apart along the X-axis on the second cover 61, such as... Figure 6B As shown, after flowing in a curtain-like manner along the upper part of the substrate W, the fluid flows into the space below the rectifier plate 53a through the outlet 53a4 of the rectifier plate 53a, and finally exits to the outside of the drying chamber S through the outlet 51g. When the fluid flows along the upper part of the substrate W, the liquid forming the liquid film LF is replaced by a supercritical fluid.

[0094] Then, the fluid supply to the drying chamber S is stopped, and the pressure inside the drying chamber S is reduced to atmospheric pressure by opening the drying chamber S to the atmosphere, thereby causing the supercritical fluid to vaporize and be discharged from the drying chamber S, thereby drying the substrate W (step S44).

[0095] Next, the lifting mechanism 59 lowers the locking key 57 from the locked position to the unlocked position. At this time, as will be described in detail later, the locking key cleaning unit 500 removes the wear powder adhering to the locking key 57.

[0096] Next, the direct-acting mechanism 55 moves the cover 52 backward from the closed position to the open position. Then, the rotating mechanism 56 rotates the cover 52 from the standby position to the open position.

[0097] Next, the second conveying device 31a enters the drying chamber S inside the pressure vessel 51, receives the substrate W from the support 53, and sends out the received substrate W (step S45).

[0098] For more detailed information on the technical matters described up to this point in the specification of this application, please refer to Patent Document 1 (Japanese Patent Application Publication No. 2022-030850) filed by the applicant of this application. The technical matters described in Patent Document 1 can also be applied to the substrate processing apparatus 1 of this application.

[0099] The following section provides a more detailed explanation of the structure of the locking key 57.

[0100] Preferably, the rolling element 60 provided on the locking key 57 is configured such that the rolling element 60 can retract inward from the surface of the locking key 57. When the pressure inside the drying chamber S inside the pressure vessel 51 rises to the supercritical pressure of CO2 (approximately 16 MPa), if the rolling element 60, which is in point contact with the cover, is used to withstand the pressure on the cover 52, the rolling element 60 may break. When the rolling element 60 retracts, the locking key 57 and the rolling element 60 are flush, and as a result, if the locking key 57 comes into contact with the surface of the component it faces (such as the cover 52), there is no concern about the rolling element 60 breaking.

[0101] In order for the rolling element 60 to retract inward from the surface of the locking key 57, as a structural example, it is possible to use... Figure 10 The ball plug shown is a mechanical element (hereinafter referred to as "ball plug" for convenience). The ball plug has a structure in which a ball (rolling element) 60, elastically stressed by a spring 602, is rotatably assembled inside a sleeve 601 (cylindrical body). The diameter of the inlet of the sleeve 601 is slightly smaller than the diameter of the ball 60, preventing the ball 60 from falling out of the sleeve 601. The sleeve 601 of the ball plug is received in a hole formed in the locking key 57. Alternatively, an external thread can be formed on the outer circumferential surface of the ball plug sleeve, and it can be installed in the threaded hole formed in the locking key 57. To reduce the amount of wear powder generated between the ball and the ball plug in contact with the ball, the ball can also be received inside the sleeve of the ball plug in a state held in a resin retainer or support 603. In this case, the resin retainer or support is received inside the sleeve in a state of elastic stress. When the ball (rolling element) 60 is pressed, the spring 602 is compressed while the ball 60 retracts into the sleeve 601.

[0102] As long as the rolling element 60 can be moved backward, the material constituting the rolling element 60 is not limited to steel materials such as tool steel, but can also be engineering plastics or ceramics.

[0103] Alternatively, a resin layer 200 can be provided on the portion of the entire surface of the locking key 57 that bears the high load caused by the supercritical pressure in the drying chamber S (specifically, the inclined surface 57d and the rear surface 57b), either on the locking key 57 itself or in place of the rolling element 60. By providing the resin layer 200, the generation of metal wear powder, which may occur due to sliding between metal parts under high surface pressure (described in detail later), can be prevented. If metal wear powder adheres to the substrate W, the substrate W is more likely to develop problems. In the case of both the rolling element 60 and the resin layer 200, it is preferable that the rolling element 60 is configured to retract to a position flush with the surface of the resin layer 200. Figure 10 The diagram schematically illustrates a structure in which a rolling element 60 and a resin layer 200 are provided on the surface of the locking key 57.

[0104] Preferably, the material forming the resin layer 200 has strength that makes it resistant to denting even under relatively high surface pressure and has a low coefficient of friction. Preferred materials for forming the resin layer 200 include, for example, PEEK (polyetheretherketone), nylon, and high-density polypropylene.

[0105] The resin layer 200 can be formed from a resin plate ranging from 1 mm to several mm in diameter. For example... Figure 10 As shown, by providing complementary protrusions and recesses 202 on the resin layer 200 and the locking key 57, the resin layer 200 can be prevented from shifting off and falling off the locking key 57 due to shear force when the locking key 57 slides and contacts the object (e.g., the rear surface 52a of the cover 52). In one structural example, Figure 10 The arrows in the diagram indicate the lifting direction (Z-axis direction) of the locking key 57, and the protrusions and recesses 202 extend in a direction orthogonal to the lifting direction of the locking key 57. Complementary protrusions and recesses 202 may be, for example, a T-shaped protrusion provided on the back side of the resin layer 200 and a T-shaped recess formed on the surface of the locking key 57, but are not limited thereto.

[0106] Next, refer to Figures 12A-12E The mechanism by which wear powder originating from the locking key 57 (especially wear powder originating from the resin layer 200) is generated and adheres to the substrate W, as previously briefly described, will be explained.

[0107] Afterwards, the substrate W to be dried is placed in the drying chamber S of the pressure vessel 51, and the cover 52 is closed. Then, as... Figure 12AAs shown, the locking key 57 is raised from the unlocked position to the locked position. At this time, just before the locking key 57 reaches the locked position, the inclined surface 57d and the rear surface 57b (which has a resin layer 200 on its surface) slide relative to their opposing surfaces, namely the rear surface 52a of the cover 52 and the inner surface of the fitting hole 51i (which are made of metal), through a wedge-shaped action. Furthermore, even when the rolling element 60 is provided, the rolling element 60 retracts inward and becomes flush with the resin layer 200 just before reaching the locked position, thus causing the aforementioned sliding. Although the fragile resin layer 200 may sometimes be damaged, generating wear powder originating from the resin layer, the amount of wear powder generated is very small.

[0108] Next, when supercritical high-pressure CO2 is filled into the drying chamber S, as... Figure 12B As shown, the cover 52 is pressed against the locking key 57 with a relatively large force (indicated by the arrow), for example, around 20 tons. This causes the locking key 57 to flex, resulting in sliding under high surface pressure between the surface of the locking key 57 (resin layer 200) and its opposite surface. Due to this sliding, the fragile resin layer 200 is damaged, generating wear powder originating from the resin layer. Most of the problematic wear powder is generated at this time.

[0109] During sliding, the resin layer 200 (here composed of PEEK) on the surface of the locking key 57 becomes charged, but the metal component relative to which it slides remains almost uncharged. Therefore, if the amount of wear powder generated is small, then... Figure 12C As shown, abrasive powder preferentially adheres to the surface of the resin layer 200 of the locking key 57. It hardly adheres to metal components.

[0110] If the substrate W is processed repeatedly, abrasive powder accumulates on the surface of the resin layer 200. When an excessive amount of abrasive powder accumulates on the surface of the resin layer 200, such as... Figure 12D As shown, some wear powder also adheres to the surface of the component that is in contact with the resin layer 200 of the locking key 57 (rear surface 52a of the cover 52, inner surface of the fitting hole 51i).

[0111] like Figure 12E As shown, for example, wear powder adhering to the inner surface of the fitting hole 51i may sometimes detach and adhere to the surface of the substrate W when the substrate W is fed into or out of the pressure vessel 51. The above is the mechanism by which wear powder originating from the locking key 57 is generated and adheres to the substrate W.

[0112] Next, several embodiments of the locking key cleaning unit 500 will be described. Here, the case in which a PEEK resin layer 200 is provided on the surface of the locking key 57 will be used as an example.

[0113] [First embodiment of the lock key cleaning section]

[0114] Reference Figure 13A and Figure 13B The locking key cleaning unit 500A of the first embodiment will be described.

[0115] The locking key cleaning unit 500A of the first embodiment includes brushes 501 for cleaning the locking keys 57 by brushing them. Three locking keys 57 are provided in a drying unit 32b, and at least one pair of brushes 501 are provided relative to each locking key 57. One of the pair of brushes 501 (also referred to as the "rear brush 501") cleans the rear surface 57b of the locking key 57, and the other (also referred to as the "front brush 501") cleans the front surface (inclined surface 57d and vertical surface 57e) of the locking key 57. In one structural example, each brush 501 is a laterally longer brush (longer in the X-axis direction), and its X-axis width (horizontal width) is greater than or equal to the X-axis width of the corresponding locking key 57.

[0116] The front brush 501 and the rear brush 501 are positioned to contact the upper end of the inclined surface 57d and the upper end of the rear surface 57b of the corresponding locking key 57, respectively, when the locking key 57 is in the unlocked position. As described above, preferably, when the locking key 57 is in the unlocked position, the upper end of the locking key 57 is located lower than the lower surface of the lower wall 51a of the pressure vessel 51.

[0117] During the washing process, the lifting mechanism 59 is used to move the locking key 57 up and down at least once, preferably multiple times, and the brush 501 is used to wipe the area of ​​the locking key 57 where the resin layer 200 is provided, thereby removing the wear powder (hereinafter sometimes also marked with reference numeral P) adhering to the resin layer 200 of the locking key 57.

[0118] Alternatively, the brush 501 can be elastically applied toward the locking key 57 to ensure reliable contact between the brush 501 and the locking key 57. Because the locking key 57 has an upward-tapering cone shape, this design facilitates reliable cleaning of the inclined surface 57d.

[0119] Specifically, for example, such as Figure 9A As shown, the brush guide 503 supports the brush shaft 502 connected to the brush 501, allowing it to slide along the Y-axis. The brush guide 503 is directly fixed to the support frame 54, or fixed to a bracket fixed to the support frame 54. A coil spring 504 is arranged in a compressed state between the brush 501 and the brush guide 503, and the reaction force of the coil spring 504 presses the brush 501 against the locking key 57.

[0120] When the locking key 57 is wiped with the brush 501, the resin layer 200 becomes charged (or uncharged) depending on the combination of the materials of the resin layer 200 and the brush 501. In this case, if abrasive powder adheres to the surface of the pressure vessel 51 and the surface of the cover 52 that are in contact with the locking key 57 in the locked position, the abrasive powder moves (adheres) to the charged resin layer 200 when the locking key 57 is moved to the locked position. Therefore, the locking key 57 can be moved back and forth between the locked and unlocked positions more than once, preferably multiple times, while performing the suction described below. This also removes the abrasive powder adhering to the surfaces of the pressure vessel 51 and the cover 52.

[0121] To recover and reuse the wear powder wiped off by brush 501 from locking key 57, it is preferable to provide a local exhaust duct 510 in the area where the wear powder may float. The local exhaust duct 510 is connected, for example, to a factory exhaust system (exhaust duct) provided in a semiconductor manufacturing plant, and is internally under negative pressure. Therefore, if a suitable opening 509 (a suction opening) is provided in the local exhaust duct 510, most of the wear powder floating around the local exhaust duct 510 can be recovered.

[0122] [Second Embodiment of Locking Key Cleaning Section]

[0123] Reference Figure 14 The locking key cleaning unit 500B of the second embodiment will be described.

[0124] The lock key cleaning unit 500B of the second embodiment differs from the lock key cleaning unit 500A of the first embodiment in that the brush 501 has a suction force that sucks up and recovers the abrasive powder wiped off by the brush 501. Other aspects are the same as those of the first embodiment.

[0125] In this second embodiment, an air passage 511 for use as a suction path is provided inside the brush 501 (more specifically, the base of the brush on which bristles (filaments) are embedded). The upstream end (inlet) of the air passage 511 is surrounded by bristles (filaments).

[0126] The upstream end of the suction line 512 is connected to the air passage 511 of brush 501. The suction line 512 is provided with an injector 513 that acts with suction force in the air passage 511 of brush 501 to recover the abrasive powder wiped off by brush 501. The downstream end of the suction line 512 is connected to a local exhaust duct 510.

[0127] Similar to the first embodiment, the locking key 57 is raised or lowered using the lifting mechanism 59, at least during which time a suction force acts on the air passage 511 of the brush 501. The abrasive powder wiped off by the brush 501 is discharged sequentially to the factory exhaust system via the air passage (suction path) 511, the suction line 512, and the local exhaust pipe 510. Therefore, there is no need to worry about the abrasive powder wiped off by the brush 501 scattering into the space around the locking key 57 in the unlocked position.

[0128] In this second embodiment, the same structure as in the first embodiment, which directly sucks abrasive powder that may be floating around the local exhaust duct 510 into the local exhaust duct 510, can also be used.

[0129] [Third embodiment of the locking key cleaning section]

[0130] Reference Figure 15A and Figure 15B The locking key cleaning unit 500C of the third embodiment will be described.

[0131] The locking key cleaning unit 500C of the third embodiment has a pair of charged brushes and a pair of de-energizing brushes as brushes 501 for each locking key 57. For ease of explanation, the charged brushes will be referred to as "charged brush 501C" and the de-energizing brushes as "de-energizing brush 501D".

[0132] The charged brush 501C (specifically, the bristles (filaments) of the charged brush 501C) is formed of a material that charges the resin layer 200 when rubbed against it. The de-energizing brush 501D (specifically, the bristles (filaments) of the de-energizing brush 501D) is formed of a material that de-energizes the resin layer 200 when rubbed against it. As an example, if the resin layer 200 is PEEK, the bristles of the charged brush 501C are made of polypropylene, and the material of the de-energizing brush 501D is, for example, nylon. Furthermore, the order of the ease with which materials can be charged is known, and a "charge sequence" is also known, arranged in order of ease of charging from materials that are easily positively charged to materials that are easily negatively charged. Referring to the charge sequence, the materials of the bristles of the charged brush 501C and the de-energizing brush 501D can be determined based on their relationship with the materials constituting the resin layer 200.

[0133] The charged brush 501C and the de-energizing brush 501D are arranged adjacent to each other in the vertical direction, with the charged brush 501C positioned above the de-energizing brush 501D. Therefore, when the locking key 57 is lowered, if the resin layer 200 is partially divided into multiple sections in the vertical direction (for convenience, referred to as a "partial section"), the charged brush 501C contacts this partial section first, followed by the de-energizing brush 501D. Thus, this partial section is wiped by the de-energizing brush 501D while being de-energized, thereby easily removing wear powder adhering to this partial section (see reference). Figure 15A ).

[0134] On the other hand, when the locking key 57 is raised, the non-brushing brush 501D first contacts a portion of the resin layer 200, followed by the brush 501C contacting that portion. Therefore, as... Figure 15B As shown, when the locking key 57 reaches the locked position, the resin layer 200 becomes electrically charged. By bringing the charged resin layer 200 into contact with the surfaces of the pressure vessel 51 and the cover 52, abrasive powder adhering to the surfaces of the pressure vessel 51 and the cover 52 can be moved towards the resin layer 200. This abrasive powder, which has moved to the resin layer 200 in this way, can be removed from the resin layer 200 by the electrostatic brush 501D during the movement of the locking key 57 from the locked position to the unlocked position.

[0135] According to this third embodiment, both wear powder adhering to the locking key 57 and wear powder adhering to the pressure vessel 51 and the cover 52 can be removed efficiently.

[0136] In this third embodiment, similar to the first embodiment, a local exhaust duct 510 may be provided in the area where the wear powder (P) may float in order to recover the wear powder wiped off by the brush 501 (charged brush 501C, non-charged brush 501D) from the locking key 57. Furthermore, similar to the second embodiment, the brush 501 may be used to apply suction force to draw in and recover the wear powder (P) wiped off by the brush 501.

[0137] [Fourth embodiment of the lock key cleaning section]

[0138] Next, refer to Figures 16A-16C The locking key cleaning unit 500D of the fourth embodiment will be described. For the sake of simplicity, the case in which a pair of brushes 501 facing each other are provided for a locking key 57 will be described. For ease of explanation, one of the pair of brushes 501 facing each other will be referred to as the first brush 501A, and the other as the second brush 501B.

[0139] In this fourth embodiment, such as Figure 16BAs shown, a brush with an air passage 511 is used, similar to the brush 501 used in the second embodiment. The air passage 511 of the first brush 501A (501) is connected to a pressurized gas supply source 522 via a gas supply line 520A (520) equipped with an on / off valve 521A (521). The air passage 511 of the second brush 501B (501) is connected to the pressurized gas supply source 522 via a gas supply line 520B (520) equipped with an on / off valve 521B (521). The pressurized gas supply source 522 is, for example, a device provided as a factory energy source, capable of supplying clean air (or nitrogen) as pressurized gas.

[0140] like Figure 16A As shown, when the locking key 57 is in the locked position, as Figure 16B As shown, the on / off valve 521A is opened and the on / off valve 521B is closed, and gas is blown from the first brush 501A to the second brush 501B. Then, the on / off valve 521A is closed and the on / off valve 521B is opened, and gas is blown from the second brush 501B to the first brush 501A. This operation is then repeated at least once, preferably multiple times. As a result, the abrasive powder adhering to the brush 501 is blown away. The abrasive powder that is blown away and floats is sucked up and recovered by a local exhaust pipe 510 with an opening. According to this structure, abrasive powder temporarily adhering to the brushes 501 (501A, 501B) can be prevented from re-adhering to the locking key 57, thus improving the cleaning efficiency of the locking key 57.

[0141] like Figure 16C As shown, the air passage 511 of brush 501 (501A, 501B) can also be used as a suction passage and a discharge passage. Figure 16C The structure shown is thought to be the following: In Figure 14 The structure shown combines Figure 16B The structure shown includes valves (on / off valves 525, 521) for switching between suction and discharge. Specifically, a connection point 517 is provided between the brush 501 of the suction line (gas line) 512 and the ejector 513, where a connection is made. Figure 16B The gas supply line 520 is shown with an on / off valve 521. Furthermore, an on / off valve 525 is installed on the suction line 512 slightly downstream of the connection point 517. Alternatively, a three-way valve can be installed at the connection point 517 instead of both the on / off valve 521 and the on / off valve 525.

[0142] By opening the on / off valve 521 and closing the on / off valve 525, the air passage 511 of the brush 501 can be used as a gas discharge passage. By closing the on / off valve 521 and opening the on / off valve 525, the air passage 511 of the brush 501 can be used as a suction passage.

[0143] Alternatively, gas can be ejected from one of a pair of opposing brushes 501 while suction is performed using the other brush. That is, suction from the second brush 501B can be performed simultaneously with gas ejection from the first brush 501A (501), followed by suction from the first brush 501A simultaneously with gas ejection from the second brush 501B (501). In this case, a portion of the abrasive powder blown away from one brush can be recovered via the air passage 511 through the other brush.

[0144] The structure of the fourth embodiment described above can also be applied to a structure, as in the third embodiment, where a pair of charged brushes 501C (501) and a pair of de-charged brushes 501D (501) are provided for a locking key 57. Furthermore, in this case, from the viewpoint of preventing a decrease in gas flow velocity due to interference between the injected airflows, it is preferable to inject gas from all (two) brushes located on the same side (e.g., the front side) of the locking key 57, and then from all (two) brushes located on the same side (e.g., the rear side) of the locking key 57.

[0145] In the above embodiment, the case where a resin layer 200 is provided on the surface of the locking key 57 and the wear powder is resin wear powder has been described, but it is not limited to this. The resin layer 200 may not be provided on the surface of the locking key 57. In this case, metallic wear powder may be generated, but the locking key 57 with such metallic wear powder adhering to it can still be cleaned by the locking key cleaning section using a brush as described above (however, the wear powder removal promotion function achieved by the electrical charge of the resin cannot be used). Alternatively, wear powder may be generated by the rolling element 60 (ball or roller), but the amount is negligible and can be removed by a brush.

[0146] The above description only covers the cleaning of the locking key 57 on the first opening Sa side, but a cover and locking key are also provided on the second opening Sb side (see reference). Figure 12A (Components labeled with reference numerals 52' and 57' in the attached drawings). During normal operation, the cover on the second opening Sb side is always in the closed position, and the locking key on the second opening Sb side is always in the locked position. If the internal pressure of the drying chamber S increases, abrasive powder is generated due to the sliding of the cover on the second opening Sb side and the locking key, according to the mechanism described above. Although this abrasive powder hardly damages the substrate W, a locking key cleaning section can be provided to clean the locking key on the second opening Sb side. The second opening Sb is open, for example, during maintenance, so maintenance can be easily performed by cleaning the locking key before maintenance.

[0147] It should be considered that the embodiments disclosed herein are illustrative rather than restrictive in all respects. The above embodiments may also be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0148] In the above embodiments, cleaning can also be performed each time a substrate W is processed. Cleaning can also be performed periodically, for example, at the start of processing the first substrate W in a processing batch, or for example, each time a predetermined number of substrates W are processed. In this case, for example, a brush movement mechanism (not shown) that moves the brush 501 forward and backward relative to the locking key 57 can be provided, so that the brush 501 contacts the lifting locking key 57 only when cleaning is desired.

Claims

1. A substrate processing apparatus, which replaces a liquid film formed on the upper surface of a substrate with a supercritical fluid to dry the substrate, characterized in that, The substrate processing apparatus includes: A pressure vessel having an internal drying chamber for drying the substrate; A cover that seals the opening of the drying chamber; A locking key that restricts the cover from moving from a closed position where the cover blocks the opening toward an open position where the cover opens the opening; as well as The cleaning unit cleans the locking key.

2. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing apparatus also includes a lifting mechanism that moves the locking key between a locked position and a unlocked position. In the locked position, the locking key restricts the cover from moving from a closed position where the cover blocks the opening toward an open position where the cover opens the opening. In the unlocked position, the locking key allows the cover to move between the closed position and the open position. When the locking key is moved using the lifting mechanism, the cleaning unit cleans the locking key.

3. The substrate processing apparatus according to claim 2, characterized in that, The cleaning unit is equipped with a brush, which is used to wipe the locking key when the lifting mechanism is used to move the locking key, thereby cleaning the locking key.

4. The substrate processing apparatus according to claim 3, characterized in that, The brush is elastically pressed against the locking key.

5. The substrate processing apparatus according to claim 3, characterized in that, The substrate processing apparatus also includes a suction unit that suctions the powder wiped off by the brush from the locking key.

6. The substrate processing apparatus according to claim 5, characterized in that, The suction section has a suction port disposed on the brush.

7. The substrate processing apparatus according to claim 5, characterized in that, The suction unit has a suction port located below the brush, which suctions powder floating below the brush.

8. The substrate processing apparatus according to claim 3, characterized in that, The brush includes a first brush and a second brush. The first brush is configured to contact a first surface of the locking key that is in contact with the cover, and the second brush is configured to contact a second surface of the locking key located on the opposite side of the first surface.

9. The substrate processing apparatus according to claim 3, characterized in that, A resin layer is provided on the portion of the surface of the locking key that bears the load from the cover when the locking key is in the locked position.

10. The substrate processing apparatus according to claim 9, characterized in that, The brush includes a first brush and a second brush, the first brush being formed of a material that charges the resin layer when wiping it, and the second brush being formed of a material that de-charges the resin layer when wiping it.

11. The substrate processing apparatus according to claim 10, characterized in that, The first brush is positioned above the second brush.

12. The substrate processing apparatus according to claim 3, characterized in that, The substrate processing apparatus is provided with a gas jetting section, which jets gas toward the brush to blow away the powder attached to the brush.

13. The substrate processing apparatus according to claim 8, characterized in that, The first brush is provided with a first gas jet section that sprays gas toward the second brush to blow away the powder adhering to the second brush, and the second brush is provided with a second gas jet section that sprays gas toward the first brush to blow away the powder adhering to the first brush.

14. A method for cleaning a locking key, wherein the cleaning method for cleaning the locking key is performed in a substrate processing apparatus, the substrate processing apparatus comprising: a pressure vessel having a drying chamber therein, wherein the substrate is dried by replacing a liquid film formed on the upper surface of the substrate with a supercritical fluid; and a cover that seals the opening of the drying chamber. and the locking key, which restricts the movement of the cover, the locking key being configured to move up and down between a locked position and a unlocked position, wherein in the locked position, the locking key restricts the cover from moving from a closed position where the cover blocks the opening toward an open position where the cover opens the opening, and in the unlocked position, the locking key allows the cover to move between the closed position and the open position, characterized in that, The cleaning methods for this locking key include: A brush is provided at a position that can contact the locking key when the locking key moves between the locked position and the unlocked position; as well as The locking key is moved between the locked position and the unlocked position, and the locking key is wiped with the brush to remove the powder adhering to the surface of the locking key.

15. The cleaning method for the locking key according to claim 14, characterized in that, The cleaning method for the locking key also includes: sucking up and recycling the powder wiped off the locking key by the brush.

16. The cleaning method for the locking key according to claim 14, characterized in that, A resin layer is provided on the surface of the locking key. The brush is formed of a material that electrifies the resin layer when it is wiped. The cleaning method for the locking key also includes: When the locking key is moved from the unlocked position to the locked position, the brush electrifies the resin layer. The charged resin layer is brought into contact with the cover, thereby using electrostatic attraction to cause the powder attached to the cover to adhere to the resin layer of the locking key; as well as When the locking key is moved from the locked position to the unlocked position, the brush removes the powder adhering to the resin layer of the locking key.

17. The cleaning method for the locking key according to claim 14, characterized in that, The locking key is cleaned before processing the first substrate of a batch, or whenever a predetermined number of substrates are processed.

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