Heat dissipation device

Abstract

The heat dissipation device according to the present invention comprises: a one-side heat conduction panel provided as a sheet metal member; and the other-side heat conduction panel which is a metal plate member, the bent edge end parts of the one-side heat conduction panel and the other-side heat conduction panel are in surface joint with each other to form a refrigerant flowing space, and the refrigerant flows in the refrigerant flowing space through phase change. The bent edge end of either the one-side heat-conducting panel or the other-side heat-conducting panel is arranged so as to at least partially overlap with the bent edge end of the other on the outside in the thickness direction of the refrigerant flow space. According to the present invention, the edge end portion of any one of the bent edge portions and the edge end portion of the other one of the bent edge portions can realize the mutual surface joint, thereby not only maximizing the heat dissipation performance, but also providing the advantage of preventing a worker from being hurt when manufacturing a product.

Description

Technical Field

[0001] This invention relates to a heat dissipation apparatus, and more specifically, to a heat dissipation apparatus designed to prevent volume changes in the refrigerant flow space despite changes in internal pressure during phase change of the refrigerant as a phase change material, and to allow condensed liquid refrigerant to collect uniformly along the direction of gravity, thereby maximizing heat dissipation performance. Furthermore, by rounding the sharp edges, it prevents injury to workers and improves product productivity. Background Technology

[0002] In various industries such as communications, electronics, and electrical engineering, related technologies continue to evolve in order to be applied to more advanced industries. To achieve higher levels of technological development, high-power energy is required. Equipment using high-power energy inevitably faces the problem of high heat generation, thus necessitating the development of corresponding cooling systems.

[0003] Cooling systems are used in various industries, including air conditioning, mobile communications, data centers, air mobility, electric vehicles, energy storage devices, and displays. These cooling systems are a major contributor to electricity consumption, which is gradually increasing with industrial development.

[0004] Generally, heat dissipation devices are broadly classified into active cooling devices and passive cooling devices. Active cooling devices mainly use fans to force convection, while passive cooling devices can be classified as those that utilize natural convection without using fans.

[0005] However, existing heat dissipation systems have limitations in effectively dissipating the high heat generated by continuously evolving high-tech applications. Therefore, innovative technologies are needed in related industries to address this problem, and heat dissipation devices are being developed as part of this solution.

[0006] A phase transition refers to a change in the inherent state of a liquid, gas, or solid when it accumulates a large amount of energy or releases stored heat.

[0007] A phase transition refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not occur during a phase transition is called sensible heat, while the heat used during a phase transition is called latent heat.

[0008] However, since heat dissipation devices are directly proportional to temperature and pressure, there is a problem that the pressure also increases as the temperature rises. Within a sealed heat dissipation device, the high temperature conducted from the heat source causes pressure to rise, potentially leading to the device's own rupture. To solve this problem, the pressure needs to be prevented from rising, and the heat dissipation device must have sufficient internal volume to achieve pressure equilibrium during the phase transition cycle of matter. Summary of the Invention Technical issues

[0009] The present invention aims to solve the above-mentioned technical problems and its purpose is to provide a heat dissipation device that can maximize heat dissipation performance.

[0010] In addition, another object of the present invention is to provide a heat dissipation device that can minimize harm to workers during product manufacturing.

[0011] Furthermore, another object of the present invention is to provide a heat dissipation device that can prevent injury to installation personnel.

[0012] The technical problems of the present invention are not limited to those described above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description. Technical solution

[0013] According to an embodiment of the present invention, a heat dissipation device includes: a side heat-conducting panel, which is configured as a metal sheet component; and a other side heat-conducting panel, which is configured as a metal sheet component. The bent edge ends of the side heat-conducting panel and the other side heat-conducting panel are mutually face-joined to form a refrigerant flow space. The refrigerant undergoes a phase change and flows in the refrigerant flow space. The bent edge end of any one of the side heat-conducting panels and the other side heat-conducting panel is arranged such that it at least partially overlaps with the bent edge end of the other side along the thickness direction of the refrigerant flow space, such that the bent edge end of any one side and the bent edge end of the other side can achieve the aforementioned mutual face-joining.

[0014] Here, the edge of the aforementioned heat-conducting panel on one side and the edge of the aforementioned heat-conducting panel on the other side can be bent along the direction of the thickness forming the refrigerant flow space.

[0015] Furthermore, the bent edge of the aforementioned heat-conducting panel on one side can be a panel with a thickness forming part of the thickness of the aforementioned refrigerant flow space on one side, and the bent edge of the aforementioned heat-conducting panel on the other side can be a panel with a thickness forming part of the thickness of the aforementioned refrigerant flow space on the other side.

[0016] According to another embodiment of the present invention, a heat dissipation device includes: a side heat-conducting panel, which is configured as a metal sheet component; and a other side heat-conducting panel, which is configured as a metal sheet component. The bent edge ends of the side heat-conducting panel and the other side heat-conducting panel are mutually face-joined to form a refrigerant flow space. The refrigerant undergoes a phase change and flows in the refrigerant flow space. The bent edge end of any one of the side heat-conducting panels and the other side heat-conducting panel is arranged such that it at least partially overlaps with the bent edge end of the other side on the outer side of the thickness direction of the refrigerant flow space, such that the bent edge end of any one side and the bent edge end of the other side can achieve the aforementioned mutual face-joining.

[0017] Here, at the edge end of the other heat-conducting panel, which is the object to be inserted in the aforementioned one-sided heat-conducting panel and the other-sided heat-conducting panel, a thickness forming panel is orthogonally bent. At the edge end of the one-sided heat-conducting panel into which the other-sided heat-conducting panel is inserted, a joint is formed by bending. The joint is connected to the inner side of the front end of the thickness forming panel of the other-sided heat-conducting panel.

[0018] Furthermore, a contact surface can be further formed on the edge end of the heat-conducting panel inserted into the press-in portion. The press-in portion has a slot-shaped press-in groove and is arranged to transfer the heat generated by the heating element. The contact surface protrudes outward from the refrigerant flow space to contact the inner surface of the press-in portion.

[0019] Furthermore, the contact surface formed on the aforementioned heat-conducting panel on one side can be spaced apart from the aforementioned joint portion.

[0020] Furthermore, multiple reinforcement portions may be formed on the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side. These multiple reinforcement portions are recessed into the refrigerant flow space, and the contact surface may be formed protruding in the opposite direction to the multiple reinforcement portions formed on the aforementioned heat-conducting panel on one side.

[0021] Furthermore, when the portion of the ends of the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side that is relatively close to the heating element that generates and supplies predetermined heat is defined as the evaporation end, and the portion other than the evaporation end is defined as the condensation end, the heat dissipation device may further include: a plurality of condensation section sintered body columns, the plurality of condensation section sintered body columns being arranged in the aforementioned refrigerant flow space and being arranged to guide the liquid refrigerant condensed at the aforementioned condensation end to flow toward the aforementioned evaporation end side, wherein the aforementioned condensation end excludes the evaporation ends of the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side provided in the aforementioned press-in portion.

[0022] Furthermore, the aforementioned plurality of condenser sintered body columns can be disposed in the aforementioned refrigerant flow space by means of an evaporator sintered body base connected to one end of each of the plurality of condenser sintered body columns.

[0023] Furthermore, multiple pillar support protrusions may be formed on the aforementioned one-side heat-conducting panel and the other-side heat-conducting panel. These multiple pillar support protrusions support the arrangement of the multiple condensation section sintered body pillars. The aforementioned contact surface may protrude in the opposite direction to the multiple pillar support protrusions formed on the aforementioned one-side heat-conducting panel.

[0024] According to another embodiment of the present invention, the heat dissipation device includes: a side heat-conducting panel, which is configured as a metal plate component; and a other side heat-conducting panel, which is configured as a metal plate component, forming a refrigerant flow space between the other side heat-conducting panel and the other side heat-conducting panel, wherein the refrigerant undergoes a phase change and flows in the refrigerant flow space, and a other side thickness forming panel is bent and disposed on the other side heat-conducting panel, the other side thickness forming panel being bent and disposed to be inserted into the side heat-conducting panel, and the front end of the other side thickness forming panel being engaged with the side heat-conducting panel in a state of being concealed from the outside by the side heat-conducting panel.

[0025] Here, the aforementioned heat-conducting panel on one side can be orthogonally bent to form a panel with a thickness on one side, so that it can be surface-fitted with the other side thickness-forming panel of the aforementioned heat-conducting panel on the other side.

[0026] Furthermore, the outer side of the aforementioned other heat-conducting panel and the thickness of one side of the aforementioned heat-conducting panel can match the front end of the panel.

[0027] Furthermore, the other side thickness forming panel of the aforementioned other side heat-conducting panel can be bent in an arc shape with a predetermined radius relative to the outer side surface of the aforementioned other side heat-conducting panel, so that a gap filled with metal coating is formed between it and the front end of the other side thickness forming panel of the aforementioned heat-conducting panel.

[0028] Furthermore, the aforementioned filler metal coating gap can be defined as the gap between the front end of the panel formed by the thickness of the aforementioned side being bent perpendicularly relative to the outer side surface of the aforementioned side heat-conducting panel and the outer side surface of the aforementioned other side heat-conducting panel.

[0029] In addition, filler metal that melts at a temperature above a predetermined melting point can be coated into the gaps in the filler metal coating.

[0030] Furthermore, after the filler metal is applied to the gaps in the filler metal coating, the heat-conducting panel on one side can be joined to the heat-conducting panel on the other side by a brazing process.

[0031] In addition, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be configured as metal sheet components made of stainless steel (SUS).

[0032] In addition, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be laminated and joined by laser welding or brazing.

[0033] Furthermore, the aforementioned sintered column of the condensation section and the sintered base of the evaporation section can be formed by sintering stainless steel powder.

[0034] Furthermore, the aforementioned sintered column of the condensation section and the sintered base of the evaporation section can be formed by sintering metal powder (powder) of the same material as the metal sheet components of the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side.

[0035] Furthermore, the metal powder used in the aforementioned sintered column of the plurality of condensation section and the sintered base of the aforementioned evaporation section can be made of stainless steel.

[0036] Furthermore, the aforementioned evaporation sintered body base can be formed by sintering copper (Cu) metal powder.

[0037] Furthermore, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be made of the same or different metal materials with a thermal conductivity of a predetermined value or higher.

[0038] In addition, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be processed by sheet metal fabrication using stamping die technology. The effects of the invention

[0039] According to an embodiment of the present invention, the heat dissipation device can achieve the following various effects.

[0040] First, the present invention dissipates system heat through the process of internal refrigerant filling and phase change, which can significantly improve the overall heat dissipation performance.

[0041] Secondly, the present invention joins two metal plate components by laser welding or brazing, thereby easily forming a refrigerant flow space filled with refrigerant, which has the effect of greatly improving product productivity.

[0042] Third, by rounding the sharp edges of the product during manufacturing, the present invention prevents workers from being injured by the sharp edges, thus improving work safety. Attached Figure Description

[0043] Figure 1 This is a perspective view showing the state in which the heat dissipation device according to the present invention is installed in the press-in portion of the housing body. Figure 2 As a heat dissipation device according to the first embodiment of the present invention, it is along... Figure 4 A cross-sectional view taken from line AA and its enlarged partial view. Figure 3 This is a heat dissipation device as a variation of the first embodiment of the present invention. Figure 1 Decomposed 3D diagram, Figure 4 yes Figure 1 Front view, Figure 5 They are along Figure 4 A cross-sectional view taken from line AA and a partial enlarged view. Figure 6 This is a perspective view showing a heat dissipation device according to a second embodiment of the present invention. Figure 7 yes Figure 6 Decomposed 3D diagram, Figure 8 yes Figure 6 Front view, Figure 9a and Figure 9b They are along Figure 8 The cross-sectional view taken from the BB line and CC line, and a partial enlarged view. Figure 10 This is a perspective view showing an application example of a heat dissipation device according to a third embodiment of the present invention. Figure 11 This is a perspective view showing a heat dissipation device according to a third embodiment of the present invention. Figure 12 yes Figure 11 Decomposed 3D diagram, Figure 13 yes Figure 11 Front view, Figure 14 It is along Figure 13A cross-sectional view taken from the DD line and a partially enlarged view used to illustrate the state of the joint through filler metal. Figure 15 It is along Figure 13 The exploded cross-section of the DD line and the enlarged partial view used to illustrate the state of the joint by the filler metal.

[0044] Explanation of reference numerals in the attached figures 200: Heat dissipation device (first embodiment) 200A: One-sided heat-conducting panel 200B: The other side heat-conducting panel 200A-P: (One side) thickness forming panel 200B-P: The thickness on the other side forms the panel. 220: Contact with face 240W: Joint 201: Evaporation end 203: Condensation end 205: Refrigerant flow space 230: Strength-reinforcing section 235: Column support protrusion 250: Sintered column of condenser section 251: Supporting protrusion 255: Evaporation section sintered body base 290: Exhaust pipe 295: Exhaust port 1200: Heat dissipation device (second embodiment) 1200A: One-sided heat-conducting panel 1200B: The other side heat-conducting panel 1201: Evaporation end 1203: Condensation end 1205: Refrigerant flow space 1220: Contact with face 1230: Strength-reinforced section 1235: Column support protrusion 1240W: Joint 1250: Sintered column of the condenser section 1255: Evaporation section sintered body base 2200: Heat dissipation device (third embodiment) 2200A: One-sided heat-conducting panel 2200B: The other side heatsink panel 2201: Evaporation end 2203: Condenser end 2205: Refrigerant flow space 2210: Filling gaps in metal coating 2220: Filler metal 2230: Strength-reinforced section 2235: Column support protrusion 2250: Sintered column of condenser section 2255: Evaporation section sintered body base 2290: Exhaust pipe 2295: Exhaust port Detailed Implementation

[0045] Hereinafter, a heat dissipation device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0046] It should be noted that when affixing reference labels to the constituent elements of each figure, identical constituent elements should be labeled in the same way, even if they are shown on different figures. Furthermore, when describing embodiments of the present invention, detailed descriptions of well-known structures or functions are omitted if it is determined that such detailed descriptions would hinder the understanding of the embodiments of the present invention.

[0047] In describing the constituent elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish the constituent element from other constituent elements, and the nature, order, or sequence of the constituent elements is not limited by the term. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms identical to those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be construed as having an idealized or overly formal meaning unless explicitly defined in this application.

[0048] Figure 1 This is a perspective view showing the state in which the heat dissipation device according to the present invention is installed in the press-in portion of the housing body. Figure 2 As a heat dissipation device according to the first embodiment of the present invention, it is along... Figure 4 A cross-sectional view taken from line AA and its enlarged partial view. Figure 3 This is a heat dissipation device according to a second embodiment of the present invention. Figure 1 Decomposed 3D diagram, Figure 4 yes Figure 1 Front view, Figure 5 They are along Figure 4 A cross-sectional view taken from line AA and a partial enlarged view.

[0049] like Figures 1 to 5As shown, the heat dissipation device 200 according to the first embodiment of the present invention includes: a heat-conducting panel 200A on one side, which is configured as a metal plate component; and a heat-conducting panel 200B on the other side, which is configured as a metal plate component.

[0050] In particular, a refrigerant flow space 205 with a sealed structure to the outside is formed in the portion corresponding to the space between one side heat-conducting panel 200A and the other side heat-conducting panel 200B, as described later. This refrigerant is filled with refrigerant, which flows through an external heating element (e.g., see below). Figure 10 The heat supplied (as indicated by reference numeral 51) undergoes a phase change in the refrigerant flow space 205, thereby dissipating system heat. This will be explained in more detail later.

[0051] Here, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be made of the same metal material (metal sheet material) with a thermal conductivity of more than a predetermined value.

[0052] Preferably, it can be made of at least stainless steel among metallic materials to facilitate the phase change of the refrigerant (especially the phase change of the refrigerant from a gaseous state to a liquid state) through heat exchange with the outside air (outside air).

[0053] As mentioned above, the specific reasons for using stainless steel as the metal material for constituting the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side will be explained in more detail later.

[0054] Furthermore, in the heat dissipation device 200 according to the first embodiment of the present invention, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be formed by sheet metal processing using a stamping die process.

[0055] For reference, although the stamping die process is not shown in the figure, it can be understood as a sheet metal processing process of stainless steel base material using stamping die equipment, so that at least each edge end is joined to each other through the joining guide frame 280. At this time, the stamping die process can not only form the shape of one side heat-conducting panel 200A and the other side heat-conducting panel 200B, but also simultaneously form multiple strength reinforcing parts 230 described later.

[0056] Here, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be sheet metal parts made of stainless steel. The thickness of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side is set to be very thin, and can be set to a thickness of no more than 0.15t.

[0057] Generally speaking, among metallic materials, aluminum (Al) is the most widely used material considering thermal conductivity and weight. Here, when the heat dissipation device, which essentially performs heat dissipation or heat exchange, is itself in the form of heat dissipation fins, and does not use a phase-change refrigerant as described in one embodiment of the present invention as a heat transfer medium, but performs heat transfer solely through the material itself, it is natural that aluminum can be chosen as the optimal material.

[0058] In other words, aluminum not only has an excellent thermal conductivity of 230, but also has a low specific gravity, making it one of the most widely used materials for heat dissipation components.

[0059] However, although aluminum has a higher thermal conductivity and specific gravity than stainless steel (which has a thermal conductivity of 20) used in one embodiment of the present invention for the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side), its price is relatively high compared to the cost, and the amount of refrigerant that can be filled is very limited.

[0060] For example, when distilled water (water) is used as a refrigerant, it can cause a chemical reaction in the case of aluminum materials, making it unable to perform its function as a refrigerant. Therefore, there is a problem that distilled water must be excluded from the alternative refrigerants.

[0061] To address the issues with this aluminum material, stainless steel, which hardly reacts chemically with distilled water, is used as the metal material for one side heat-conducting panel 200A and the other side heat-conducting panel 200B in the heat dissipation devices 200, 1200, and 2200 according to the present invention.

[0062] The edges of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side are joined together to form a refrigerant flow space 205, in which the refrigerant undergoes a phase change and flows.

[0063] However, as described above, when the edge ends of two metal plate components with extremely thin thickness (0.15T) are joined together, the thickness of the edge ends is only 0.3T. Therefore, if they are not processed separately, they have very sharp ends, which poses a risk of injury to workers during the work process.

[0064] In order to minimize the harm to such workers during the work process, such as Figure 1 and Figure 2 As shown, in the heat dissipation device 200 according to the first embodiment of the present invention, all edge ends (refer to) of one side heat-conducting panel 200A and the other side heat-conducting panel 200B Figure 2The reference numerals 200A-P and 200B-P in the attached drawings are all bent, and the edge ends of each bend are a panel 200A-P with a thickness on one side and a panel 200B-P with a thickness on the other side. The panel 200A-P with a thickness on one side of the heat-conducting panel 200A and the panel 200B-P with a thickness on the other side of the heat-conducting panel 200B can be arranged to at least partially overlap in the thickness direction of the refrigerant flow space 205.

[0065] More in detail, such as Figure 2 As shown, the thickness forming panel 200A-P on one side is a part that is bent along the edge of the heat-conducting panel 200A on one side, and can be bent approximately orthogonally to the heat-conducting panel 200B on the other side. The thickness forming panel 200B-P on the other side is a part that is bent along the edge of the heat-conducting panel 200B on the other side, and can be bent approximately orthogonally to the heat-conducting panel 200A on one side.

[0066] That is, the edge ends of one side heat-conducting panel 200A and the edge ends of the other side heat-conducting panel 200B are bent along the thickness direction of the refrigerant flow space 205, thereby forming the aforementioned one-sided thickness forming panel 200A-P and the other-sided thickness forming panel 200B-P.

[0067] A heat dissipation device 200 according to a first embodiment of the present invention, having the configuration described above, such as... Figure 2 As shown, the thickness forming panels 200A-P on one side and the thickness forming panels 200B-P on the other side are arranged parallel to each other along the thickness direction of the refrigerant flow space 205, and are arranged overlapping in the thickness area of ​​the refrigerant flow space 205 so that they can be joined to each other. By joining the joined parts of the surfaces in a predetermined joining manner, shielding can be achieved so that the refrigerant filled inside does not leak to the outside.

[0068] However, in the heat dissipation device 200 according to the first embodiment of the present invention, the front end of the other side thickness forming panel 200B-P is connected to the inner side of the one side thickness forming panel 200A-P, so that it is set and joined in a way that is not visible from the outside, but the embodiments of the present invention are not limited thereto.

[0069] That is, the heat dissipation device 200 of the modified example of the first embodiment of the present invention, such as Figure 1 , Figures 3 to 5 As shown, the bent edge end of either one of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side is arranged to at least partially overlap with the bent edge end of the other side on the outside of the thickness direction of the refrigerant flow space 205, so as to achieve mutual surface engagement.

[0070] At this time, either the heat-conducting panel 200A on one side or the heat-conducting panel 200B on the other side can be joined by inserting into the other. More specifically, the bent portion at the edge end of the heat-conducting panel 200A on one side forms the thickness of the refrigerant flow space 205, and the bent portion at the edge end of the heat-conducting panel 200B on the other side can be bent in the opposite direction to the portion forming the refrigerant flow space 205.

[0071] In a modified heat dissipation device 200 according to the first embodiment of the present invention, the edge end of one side heat-conducting panel 200A is inserted into the edge end side of the other side heat-conducting panel 200B, such that the thickness of the forming panel 200P and the joint portion 200W corresponding to each edge end can be joined to each other.

[0072] More in detail, such as Figure 1 , Figures 3 to 5 As shown, in one side heat-conducting panel 200A and the other side heat-conducting panel 200B, the edge end of the side heat-conducting panel 200A, which is the object to be inserted, can be orthogonally bent to form a thickness forming panel 200A-P.

[0073] Furthermore, in one side heat-conducting panel 200A and the other side heat-conducting panel 200B, the edge end of the inserted other side heat-conducting panel 200B can be bent to provide a joint 240W, and the joint 240W is connected to the inner side of the front end of the panel 200A-P formed by the thickness of one side heat-conducting panel 200A.

[0074] At this time, the front end of the thickness forming panel 200A-P of one side of the heat-conducting panel 200A and the front end of the joint portion 240W of the heat-conducting panel 200B on the other side can be formed in a mutually consistent manner. Therefore, it can be formed such that the part of the joint portion 240W of the heat-conducting panel 200B on the other side is inserted relative to the inner side of the thickness forming panel 200A-P of one side of the heat-conducting panel 200A, and then joined.

[0075] The space between the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side, which are thus joined together, is filled with refrigerant, forming a refrigerant flow space 205 where the refrigerant undergoes a phase change and flows. One end of the space can be inserted into a slotted pressing portion 150 formed on the housing portion 110, so as to allow for contact with a heating element (heat-generating element of an electronic device, see below) that supplies heat to the filled refrigerant. Figure 10 Combined with the attached figure 51).

[0076] like Figure 5As shown, the pressing part 150 includes a one-side pressing part 151 and a other-side pressing part 152. The one-side pressing part 151 is in contact with the outer side of the one-side heat-conducting panel 200A corresponding to the evaporation end 201 described later. The other-side pressing part 152 is in contact with the outer side of the other-side heat-conducting panel 200B corresponding to the evaporation end 201 described later. The inner sides of the one-side pressing part 151 and the other-side pressing part 152 can be defined as pressing grooves 150S.

[0077] Here, the part where the press-in portion 150 is inserted into the edge end of the heat dissipation device 200 formed by joining one side heat-conducting panel 200A and the other side heat-conducting panel 200B is defined as the evaporation end 201, and all other parts except the evaporation end 201 are defined as the condensation end 203.

[0078] In the modified heat dissipation device 200 according to the first embodiment of the present invention, which has the above-described configuration, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side are joined to each other by the thickness forming panel 200A-P and the joint portion 240W respectively. This is to prevent the refrigerant from being separated from the heat-generating body by the sharp edge end formed by the sheet metal processing of the stamping die process, and also to prevent the operator from being injured by the sharp edge end when inserting the heat dissipation device into the pressing portion 150 or after the heat dissipation device is installed.

[0079] On the other hand, the edge end (i.e., the evaporation end 201) of the press-in groove 150 inserted into the heat-conducting panel 200B on the other side can be further processed to form a contact surface 220. The press-in portion 150 has a slot in the shape of a narrow groove and is arranged to transfer the heat generated by the heating element. The contact surface 220 protrudes outward from the refrigerant flow space 205 to contact the inner surface of the press-in portion 152 on the other side of the press-in portion 150.

[0080] The contact surface 220 serves to provide a contact area so that it can be joined to the inner side of the other side of the press-in portion 152 (i.e., the inner wall of the slot-shaped press-in groove 150S) in the press-in portion 150 by laser welding or brazing. At this time, the contact surface 220 formed on one side of the heat-conducting panel 200A can be spaced apart from the joint portion 240W.

[0081] However, the above welding methods are not limited to either brazing or laser welding.

[0082] For example, as with the multiple strength reinforcements 230 described later, brazing is a more suitable joining method for joining inside the refrigerant flow space 205, while laser welding is a more suitable joining method for joining the edge ends of one side heat-conducting panel 200A and the other side heat-conducting panel 200B. The two processes can be used in combination.

[0083] On the other hand, multiple strength reinforcements 230 and multiple column support protrusions 235 can be formed on one side of the heat-conducting panel 200A and the other side of the heat-conducting panel 200B, respectively. The multiple strength reinforcements 230 are processed into a structure that is recessed towards the refrigerant flow space 205 during the stamping die process. The multiple column support protrusions 235 are used to support the setting of the condenser sintered body column 250 described later.

[0084] The multiple strength-enhancing parts 230 not only enhance the strength of the heat-conducting panel 200A and the heat-conducting panel 200B formed with an extremely thin thickness, but also can actively respond to the internal pressure changes caused by the phase change of the refrigerant by welding the joints in the refrigerant flow space 205.

[0085] Here, the contact surface 220 formed at the edge end of the other side heat-conducting panel 200B can be provided to protrude in the opposite direction to the plurality of strength reinforcement portions 230 formed on the other side heat-conducting panel 200B.

[0086] On the other hand, such as Figures 1 to 3 As shown, the heat dissipation device 200 according to the first embodiment of the present invention may further include a plurality of condensation section sintered body columns 250 arranged in the refrigerant flow space 205.

[0087] Multiple condenser sintered body pillars 250 can be attached to the inner surface of the heat-conducting panel 200B-P on the other side by means of an evaporator sintered body base 255 connecting one end of each of the multiple condenser sintered body pillars. As described above, the multiple condenser sintered body pillars 250 can serve to guide the condenser ends (see below) Figure 6 and Figure 7 The liquid refrigerant condensing at the reference numeral 1203 in the attached figure flows towards the evaporator end (see below). Figure 6 and Figure 7 The condensation end (reference numeral 1201) has the function of side flow, wherein the evaporation end 201 provided on one side of the heat-conducting panel 200A and the other side of the heat-conducting panel 200B of the pressure section 150 is excluded.

[0088] The multiple condenser section sintered body columns 250 and the evaporator section sintered body base 255, which will be described below, can be formed by sintering stainless steel powder. In the following description, since the multiple condenser section sintered body columns 250 and the evaporator section sintered body base 255 differ only in their placement within the refrigerant flow space 205 and the resulting contribution characteristics (functions) to the refrigerant phase change, their manufacturing methods will be described under the premise that they are the same.

[0089] Therefore, as explained, when it is understood that one side heat-conducting panel 200A and the other side heat-conducting panel 200B are metal sheet components made of stainless steel, although their formation or processing methods are slightly different, it can be understood that multiple condensation section sintered body columns 250 and evaporation section sintered body bases 255 are formed by sintering stainless steel metal powder to have the same thermal conductivity.

[0090] However, the multiple condenser sintered body columns 250 and evaporator sintered body bases 255 need not all be made of stainless steel metal powder by sintering. Given the high thermal conductivity required to achieve the degree of phase transformation of the liquid refrigerant into the gaseous refrigerant by the heat supplied by the heating element 51, the evaporator sintered body base 255 can also be formed as a sintered body made of copper metal powder (powder).

[0091] On the other hand, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be laminated and joined by welding. The welding method here can include either general laser welding or brazing.

[0092] On the other hand, in the heat dissipation device 200 according to the first embodiment of the present invention, a plurality of support protrusions 251 can be integrally formed on the sintered column 250 of the condensation section. The plurality of support protrusions 251 protrude and are supported by the inner side of one side heat-conducting panel 200A and the inner side of the other side heat-conducting panel 200B.

[0093] More specifically, the sintered column 250 of the condenser section is sintered in the shape of a four-sided rod with four sides, wherein any one side (hereinafter referred to as the "first side") is supported or fixed in contact with the inner side of either one of the heat-conducting panels 200A on one side or the heat-conducting panel 200B on the other side (hereinafter referred to as "one side heat-conducting panel 200A"). The front end face of a plurality of support protrusions 251 is formed on the side of the sintered column 250 of the condenser section opposite to the first side (hereinafter referred to as the "second side"), and can be supported or fixed in contact with the inner side of the heat-conducting panel 200B on the other side.

[0094] As described above, the first surface of the condenser sintered body column 250 is supported on the inner side of one side heat-conducting panel 200A, and the front end surfaces of the multiple support protrusions 251 formed on the second surface are supported on the inner side of the other side heat-conducting panel 200B. This not only strengthens the rigidity of the heat-conducting panel 200A and the heat-conducting panel 200B formed with a relatively thin thickness (0.15T), but also prevents the energy participating in the refrigerant phase change from being converted into physical energy unrelated to heat dissipation by preventing the swaying (or flow) that may occur in the heat-conducting panel 200A and the heat-conducting panel 200B due to the internal pressure change of the refrigerant flow space 205 during the refrigerant phase change, thereby improving the heat dissipation performance.

[0095] Furthermore, the gaseous or liquid refrigerant flows smoothly through the space between the multiple support protrusions 251, thereby preventing the gas-liquid circulation from deviating to one side and ensuring uniform dispersion and flow.

[0096] On the other hand, multiple pillar support protrusions 235 can be further formed on one side of the heat-conducting panel 200A and the other side of the heat-conducting panel 200B, and the multiple pillar support protrusions 235 support the arrangement of multiple condensation section sintered body pillars 250.

[0097] Similarly, it should be understood that the contact surface 220 formed on the edge end of the other side heat-conducting panel 200B can be defined as protruding in the opposite direction to the plurality of support protrusions 251 formed on the other side heat-conducting panel 200B.

[0098] On the other hand, either one of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side (in other embodiments of the invention, the heat-conducting panel 200B on the other side corresponds to this) may have an exhaust port 295 connected to the exhaust pipe 290.

[0099] An exhaust pipe 290 is provided on the exhaust port 295, so that the vacuuming process of the refrigerant flow space 205 can be performed through the exhaust pipe 290 before or after the refrigerant is filled.

[0100] Figure 6 This is a perspective view showing a heat dissipation device according to a second embodiment of the present invention. Figure 7 yes Figure 6 Decomposed 3D diagram, Figure 8 yes Figure 6 Front view, Figure 9a and Figure 9b They are along Figure 8 The cross-sectional view taken from the BB line and CC line, and a partial enlarged view.

[0101] Reference Figures 1 to 5The heat dissipation device 200 according to the first embodiment and its variations of the present invention has been described with the premise that one side heat-conducting panel 200A and the other side heat-conducting panel 200B are generally rectangular. However, it should be noted that the overall shape of the heat dissipation device is not limited to being rectangular.

[0102] For example, according to such Figures 6 to 9b The heat dissipation device 1200 shown according to the second embodiment of the present invention can be formed into various shapes depending on the arrangement of the heat-generating element directly applied and the shape of the electronic device product.

[0103] Thus, the heat dissipation device 1200 according to the second embodiment of the present invention differs from the heat dissipation device 200 according to the first embodiment and its variations, except for its external shape, while other constituent elements can be configurations that perform the same function.

[0104] More specifically, the heat dissipation device 1200 according to the second embodiment of the present invention also forms a refrigerant flow space 1205 between one side heat-conducting panel 1200A and the other side heat-conducting panel 1200B, where the refrigerant undergoes a phase change and flows. A specific portion of the outer ends of one side heat-conducting panel 1200A and the other side heat-conducting panel 1200B is defined as a portion near the heat-generating element and is defined as a portion that performs the function corresponding to the evaporation end 1201. The remaining outer ends other than the evaporation end 1201 are defined as portions that perform the function corresponding to the condensation end 1203. This is the same as the heat dissipation device 200 according to the first embodiment and its variations of the present invention.

[0105] That is, in the case of the heat dissipation device 200 according to the first embodiment and its modifications as described above, the shape is rectangular, and the long side corresponding to its long side (not marked in the drawings) serves as the evaporation end connected to the heat-generating element (see below). Figure 10 The following reference numeral 2201) performs the function. In contrast, in the case of the heat dissipation device 1200 according to the second embodiment of the present invention, as the evaporation end is substantially close to the object receiving the heat supply, i.e., the heating element, only a portion of its edge end corresponds to this, while the remaining portion is designed to perform the condensation end (see below). Figure 10 The following figure (2203) shows the function.

[0106] Furthermore, the heat dissipation device 1200 according to the second embodiment of the present invention, such as Figures 6 to 9bAs shown, multiple strength reinforcement portions 1230 and column support protrusions 1235 can be formed on one side of the heat-conducting panel 1200A and the other side of the heat-conducting panel 1200B, respectively. The multiple strength reinforcement portions 1230 are recessed towards the refrigerant flow space 1205 during the stamping die process. The column support protrusions 1235 support the sintered column 1250 of the condenser section.

[0107] The column support protrusions 1235 are arranged in pairs, with the distance between them approximately equal to the width of the condenser sintered body column 1250. Thus, when the heat-conducting panel 1200A on one side and the heat-conducting panel 1200B on the other side are joined together, the column support protrusions 1235 simultaneously support the two ends of the condenser sintered body column 1250 in the width direction from both sides inside the refrigerant flow space 1205, thereby providing stable support for the condenser sintered body column 1250, which is a relatively fragile sintered body.

[0108] The multiple strength-enhancing parts 1230 not only enhance the strength of the heat-conducting panel 1200A and the heat-conducting panel 1200B formed with an extremely thin thickness, but also can actively respond to the internal pressure changes caused by the phase change of the refrigerant by welding the joints in the refrigerant flow space 1205. This has been explained above.

[0109] Similarly, a contact surface 1220 can be further formed on the edge end of the heat-conducting panel 1200A on one side corresponding to the evaporation end 1201, which is the part of the insertion pressing portion 150. The contact surface 1220 protrudes outward from the refrigerant flow space 1205 to contact the inner surface of the pressing portion 150.

[0110] Furthermore, in the heat dissipation device 1200 according to the second embodiment of the present invention, it is also arranged such that the joint portion 1240W provided on the other side heat-conducting panel 1200B is in face contact with the inner side surface of the thickness forming panel 1200A-P provided on the one side heat-conducting panel 1200A, and the internal refrigerant flow space 1205 is formed by the mutual face contact. Its technical principle is the same as that of the heat dissipation device 200 according to the first embodiment and its variations of the present invention.

[0111] Figure 10 This is a perspective view showing an application example of a heat dissipation device according to a third embodiment of the present invention.

[0112] like Figure 10As shown, the heat dissipation device 2200 according to the third embodiment of the present invention can be configured to receive generated heat from an electronic device 50 (e.g., an LED unit, etc.) on which a heat-generating element 51 (e.g., an LED element in a lighting device) is installed as a heat dissipation target, and dissipate heat through heat exchange with the outside air (outdoor air).

[0113] Here, although the electronic device that dissipates heat through the heat dissipation device 2200 according to the third embodiment of the present invention is limited to the LED unit 50 including the LED element 51, the electronic device is not limited thereto, and electronic devices related to antenna devices or similar technical fields that are the main technical fields of the applicant of the present invention are not excluded.

[0114] LED unit 50 in Figure 10 The heat generated by the LED element (i.e., the heating element, 51) is transferred and supplied to the heat dissipation device 2200 according to the third embodiment of the present invention via the back side.

[0115] However, in order to facilitate the installation on the back of the LED unit 50 and the heat transfer to the heat dissipation device 2200, a plurality of heat transfer medium blocks can be provided between the LED unit 50 and the heat dissipation device 2200 on the same principle as the press-in portion 150 described above. The evaporation end 2201 of the heat dissipation device 2200 can be connected by the installation groove 155 formed between the plurality of heat transfer medium blocks or on itself.

[0116] Figure 11 This is a perspective view showing a heat dissipation device according to a third embodiment of the present invention. Figure 12 yes Figure 11 An exploded 3D diagram.

[0117] In the heat dissipation device 2200 according to the third embodiment of the present invention, such as Figure 11 and Figure 12 As shown, the heat-conducting panel 2200A on one side and the heat-conducting panel 2200B on the other side are also similar to the heat dissipation device 1200 of the second embodiment of the present invention, and can be processed as sheet metal components with a thermal conductivity of a predetermined value or higher by a stamping die process.

[0118] Here, the heat-conducting panel 2200A on one side and the heat-conducting panel 2200B on the other side are sheet metal components made of stainless steel. Even when the edges of the heat-conducting panel 2200A on one side and the heat-conducting panel 2200B on the other side are face-joined to form an internally sealed (shielded) refrigerant flow space 2205, the sum of their thicknesses is 0.3t, which is extremely sharp. Therefore, in order to minimize the risk of injury to the installer due to the sharp edges during the work process, the design can be changed to increase the product thickness by forming the panel 2200A-P with the thickness described later.

[0119] At this time, either the heat-conducting panel 2200A on one side or the heat-conducting panel 2200B on the other side can be joined by inserting into the other. In the heat dissipation device 2200 according to the third embodiment of the present invention, a structure is adopted in which the other side thickness forming panel 2200B-P of the other side heat-conducting panel 2200B is inserted along the thickness direction formed by the one side thickness forming panel 2200A-P of the heat-conducting panel 2200A on one side, as described later.

[0120] More specifically, a thickness forming panel 2200B-P is bent and disposed on the other side heat-conducting panel 2200B. The thickness forming panel 2200B-P is bent such that the portion corresponding to the edge end is inserted relative to the heat-conducting panel 2200A on the other side, and the front end of the thickness forming panel is engaged with the heat-conducting panel 2200A on the other side while being concealed from the outside by the heat-conducting panel 2200A on the other side.

[0121] In addition, a side thickness forming panel 2200A-P can be orthogonally bent on one side of the heat-conducting panel 2200A so that it can be surface-fitted with the other side thickness forming panel 2200B-P of the other side of the heat-conducting panel 2200B.

[0122] Here, the other side heat-conducting panel 2200B is joined in such a way that it is inserted relative to the other side heat-conducting panel 2200A, and the other side thickness forming panel 2200B-P, which includes the front end of the other side heat-conducting panel 2200B, is inserted and joined to the other side thickness forming panel 2200A-P of the other side heat-conducting panel 2200A, so that the front end of the other side thickness forming panel 2200B-P is concealed from the outside.

[0123] Therefore, the thickness of one side of the heat-conducting panel 2200A forming panel 2200A-P can be orthogonally bent to be face-to-face with the outer side of the thickness of the other side of the heat-conducting panel 2200B forming panel 2200B-P.

[0124] Here, the thickness forming panel 2200A-P of one side of the heat-conducting panel 2200A performs the function of forming the overall thickness of the refrigerant flow space 2205 as a thickness forming panel, thereby enabling the additional function of preventing workers (including assembly workers) from being injured while working by eliminating sharp edge ends.

[0125] The space between the heat-conducting panel 2200A on one side and the heat-conducting panel 2200B on the other side, which are thus joined together, is filled with refrigerant, forming a refrigerant flow space 2205 in which the filled refrigerant undergoes a phase change and flows, and is able to make surface thermal contact with the heating element 51 that supplies heat to the filled refrigerant.

[0126] The refrigerant filled in the refrigerant flow space 2205 is a phase change substance that can undergo a phase change due to the heat supplied by the heating element 51 or through heat exchange with the outside air. In particular, as the refrigerant here, if aluminum (Al) is excluded from the metal material constituting the heat-conducting panel 2200A on one side and the heat-conducting panel 2200B on the other side, distilled water (water) which does not raise concerns about environmental pollution is preferably used.

[0127] On the other hand, in the edge end of the heat dissipation device 2200 according to the third embodiment of the present invention, which is joined by a heat-conducting panel 2200A on one side and a heat-conducting panel 2200B on the other side, the part that receives heat supply from the heat-generating element 51 is defined as the evaporation end 2201, and all other parts except the evaporation end 2201 are defined as the condensation end 2203.

[0128] Here, as Figure 11 and Figure 12 As shown, the heat dissipation device 2200 according to the third embodiment of the present invention may further include a condenser sintered column 2250 arranged in the refrigerant flow space 2205.

[0129] On the other hand, in the refrigerant flow space 2205, as a lower part relative to the direction of gravity, a part can be understood as a region where liquid refrigerant is stored and evaporates into gaseous refrigerant as heat is supplied (evaporation region), and as a higher part relative to the direction of gravity, a part can be understood as a region where gaseous refrigerant flows actively and condenses into liquid refrigerant through heat exchange with external air (outer air) (condensation region).

[0130] The following can be understood as... Figure 11The attached diagram, with the dashed line 2200C as the reference, divides the area into an evaporation zone and a condensation zone. Most of the liquid refrigerant is stored below the dashed line 2200C due to gravity. The gaseous refrigerant is independent of the dashed line 2200C. Once a phase change occurs from the liquid refrigerant, it flows and diffuses to all parts of the refrigerant flow space 2205, including the evaporation zone.

[0131] Furthermore, based on reference numeral 2200C, the portion corresponding to the lower direction of gravity is defined as the evaporation region, and the portion corresponding to the upper direction of gravity is defined as the condensation region, based on reference numeral 2200C, is defined as the condensation region, and the portion corresponding to the upper direction of gravity is defined as the condensation region, and the portion corresponding to the upper direction of gravity is defined as the condensation region, and the portion corresponding to the upper direction of gravity, is defined as the condensation region, and the portion corresponding to the upper direction of gravity, is defined as the condensation region, and the portion corresponding to the upper direction of gravity, is defined as the condensation region, and the portion corresponding to the upper direction of gravity, is defined as the condensation region, and the portion corresponding to the lower ...

[0132] Here, multiple condenser sintered body columns 2250 are arranged at an angle at intervals in the region of the condenser end 2203, and the lower ends of the multiple condenser sintered body columns 2250 can be connected by the evaporator sintered body base 2255 with the gravity direction as the reference.

[0133] The evaporation section sintered body base 255, which connects the lower ends of multiple guide sintered body strips 251, can be attached to the inner side of the heat-conducting panel 200B-P formed by the thickness of the other side heat-conducting panel 200B.

[0134] Here, the sintered body base 2255 of the evaporation section is preferably formed only on the side of the evaporation end 2201. However, in the heat dissipation device 2200 according to the third embodiment of the present invention, a sintered body additional base 2255-1 may be further provided. The sintered body additional base 2255-1 extends further into the condensation end 2203 at the lower end with reference to the direction of gravity, that is, the end side of the condensation end 2203 corresponding to the upper side of the evaporation end 2201.

[0135] When multiple condenser sintered body columns 2250 are arranged such that the liquid refrigerant condensed in the region corresponding to the condenser end 2203 flows downward naturally due to gravity, the multiple condenser sintered body columns 2250 can be arranged vertically or inclined such that their upper ends are located above the direction of gravity and their lower ends are located below the direction of gravity.

[0136] Here, when the liquid refrigerant condensed by the aforementioned multiple condensation section sintered body columns 2250 is guided downward in the direction of gravity, the sintered body additional base 2255-1 can facilitate its collection in the area corresponding to the evaporation end 2201.

[0137] The sintered body base 2255 of the evaporation section is actually located in the part of the evaporation end 2201 closest to the heating element 51, and plays the role of directly receiving heat from the heating element 51 to make the liquid refrigerant evaporate.

[0138] Figure 13 yes Figure 11 Front view, Figure 14 It is along Figure 13 A cross-sectional view taken from the DD line and a partially enlarged view used to illustrate the state of the joint through filler metal. Figure 15 It is along Figure 13 The exploded cross-section of the DD line and the enlarged partial view used to illustrate the state of the joint by the filler metal.

[0139] In the heat dissipation device 2200 according to the third embodiment of the present invention, such as Figures 13 to 15 As shown, bonding can be achieved by applying filler metal 2220 in the filler metal coating gap 2210, which corresponds to the space between the rounded outer surface of the panel 2200B-P (described later) which is the edge end of the other side heat-conducting panel 2200B and the front end of the panel 2200A-P (which is the edge end of the other side heat-conducting panel 2200A).

[0140] In order to form the filler metal coating gap 2210 as described above, the outer side of the other side heat-conducting panel 2200B and the front end of the panel 2200A-P formed by the thickness of one side of the heat-conducting panel 2200A can be configured to match each other.

[0141] More specifically, the other side thickness forming panel 2200B-P of the other side heat-conducting panel 2200B can be formed by bending in an arc shape with a predetermined radius relative to the outer side surface of the other side heat-conducting panel 2200B, so that the aforementioned filler metal coating gap 2210 is formed between it and the front end of the other side thickness forming panel 2200A-P of the other side heat-conducting panel 2200A.

[0142] Here, the filler metal coating gap 2210 can be defined as the gap between the front end of the panel 2200A-P formed by bending perpendicularly to the outer side of the heat-conducting panel 2200A on one side and the outer side of the heat-conducting panel 2200B on the other side.

[0143] When the other side heat-conducting panel 2200B is configured to be inserted relative to the other side heat-conducting panel 2200A as described above, such as Figure 14 and Figure 15As shown, a filler metal coating gap 2210 is naturally formed between the arc-shaped outer surface of panel 2200B-P, which is formed on the other side of the heat-conducting panel 2200B, and the front end of panel 2200A-P, which is formed on the other side of the heat-conducting panel 2200A. After the filler metal 2220 is coated, the filler metal 2220 is melted and penetrated by the brazing process and then hardened, thereby joining the heat-conducting panel 2200A on one side to the heat-conducting panel 2200B on the other side.

[0144] Unspecified reference numeral 2290 is "exhaust pipe", and reference numeral 2295 is "exhaust port".

[0145] The heat dissipation device according to an embodiment of the present invention has been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiment. It should be noted that those skilled in the art can make various modifications and improvements within the same scope without departing from the concept of the present invention. Therefore, the patent and scope of protection of the present invention should be determined by the appended claims. Industrial availability

[0146] This invention provides a heat dissipation device that maximizes heat dissipation performance and improves productivity.

Claims

1. A heat dissipation device, characterized in that, include: One side heat-conducting panel is made of metal sheet component; as well as The other side heat-conducting panel is made of a metal sheet component. The bent edges of the aforementioned heat-conducting panels on one side and the other side are joined together to form a refrigerant flow space, in which the refrigerant undergoes a phase change and flows. The bent edge of either one of the aforementioned heat-conducting panels on one side and the other side is arranged to at least partially overlap with the bent edge of the other side along the thickness direction of the refrigerant flow space, such that the bent edge of either one side and the bent edge of the other side can achieve the aforementioned mutual surface engagement.

2. The heat dissipation device according to claim 1, characterized in that, The edge ends of the aforementioned heat-conducting panel on one side and the edge ends of the aforementioned heat-conducting panel on the other side are bent along the direction of the thickness forming the aforementioned refrigerant flow space.

3. The heat dissipation device according to claim 2, characterized in that, The bent edge of the aforementioned heat-conducting panel is part of the thickness of the panel forming the refrigerant flow space. The bent edge of the aforementioned other side heat-conducting panel forms a panel with a thickness that is part of the thickness of the refrigerant flow space.

4. A heat dissipation device, characterized in that, include: One side heat-conducting panel is made of metal sheet component; as well as The other side heat-conducting panel is made of a metal sheet component. The bent edges of the aforementioned heat-conducting panels on one side and the other side are joined together to form a refrigerant flow space, in which the refrigerant undergoes a phase change and flows. The bent edge of either one of the aforementioned heat-conducting panels on one side and the other heat-conducting panel is arranged such that it at least partially overlaps with the bent edge of the other panel on the outer side of the thickness direction of the refrigerant flow space, so that the bent edge of either one panel and the bent edge of the other panel can achieve the aforementioned mutual surface engagement.

5. The heat dissipation device according to claim 4, characterized in that, At the edge end of the heat-conducting panel on one side and the other side, which serves as the insertion object, a thickness-forming panel is orthogonally bent. At the edge end of the heat-conducting panel inserted into the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side, a joint is formed by bending, and the joint is connected to the inner side of the front end of the panel formed by the thickness of the heat-conducting panel on the other side.

6. The heat dissipation device according to claim 5, characterized in that, A contact surface is further formed on the edge end of the heat-conducting panel inserted into the press-in portion. The press-in portion has a slot-shaped press-in groove and is arranged to transfer the heat generated by the heating element. The contact surface protrudes outward from the refrigerant flow space to contact the inner surface of the press-in portion.

7. The heat dissipation device according to claim 6, characterized in that, The contact surface formed on the aforementioned heat-conducting panel on one side is spaced apart from the aforementioned joint portion.

8. The heat dissipation device according to claim 6, characterized in that, Multiple reinforcement portions are further formed on the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side. The multiple reinforcement portions are recessed into the refrigerant flow space, and the contact surface protrudes in the opposite direction to the multiple reinforcement portions formed on the heat-conducting panel on the other side.

9. The heat dissipation device according to claim 5, characterized in that, When the portion of the ends of the aforementioned heat-conducting panels on one side and the other side that is relatively close to the heating element that generates and supplies predetermined heat is defined as the evaporation end, and the portion other than the evaporation end is defined as the condensation end, The aforementioned heat dissipation device further includes: a plurality of sintered condenser columns, which are arranged in the refrigerant flow space and configured to guide the liquid refrigerant condensed at the condensing end to flow toward the evaporating end side, wherein the condensing end excludes the evaporating end of the heat-conducting panel on one side and the heat-conducting panel on the other side provided in the pressing part.

10. The heat dissipation device according to claim 9, characterized in that, The aforementioned multiple condenser sintered body columns are disposed in the aforementioned refrigerant flow space via an evaporator sintered body base connected to one end of each of the multiple condenser sintered body columns.

11. The heat dissipation device according to claim 9, characterized in that, Multiple pillar support protrusions are further formed on the aforementioned one-side heat-conducting panel and the other-side heat-conducting panel. The multiple pillar support protrusions support the arrangement of the multiple condensation section sintered body pillars. The aforementioned contact surface protrudes in the opposite direction to the multiple pillar support protrusions formed on the aforementioned one-side heat-conducting panel.

12. A heat dissipation device, characterized in that, include: One side heat-conducting panel is made of metal sheet component; as well as The other heat-conducting panel, which is a metal sheet component, forms a refrigerant flow space between itself and the aforementioned heat-conducting panel. The refrigerant undergoes a phase change and flows within this refrigerant flow space. The other side heat-conducting panel is bent and has a thickness-forming panel bent so as to be inserted into the heat-conducting panel. The front end of the other side thickness-forming panel is connected to the heat-conducting panel from the outside while being covered by the heat-conducting panel.

13. The heat dissipation device according to claim 12, characterized in that, A panel with one side thickness is orthogonally bent on one side of the aforementioned heat-conducting panel so that it can be surface-fitted with the panel with the other side thickness of the aforementioned heat-conducting panel.

14. The heat dissipation device according to claim 13, characterized in that, The outer side of the aforementioned heat-conducting panel and the thickness of one side of the aforementioned heat-conducting panel form a matching front end of the panel.

15. The heat dissipation device according to claim 13, characterized in that, The other side thickness forming panel of the aforementioned other side heat-conducting panel is bent in an arc shape with a predetermined radius relative to the outer side surface of the aforementioned other side heat-conducting panel, so that a gap filled with metal coating is formed between it and the front end of the other side thickness forming panel of the aforementioned heat-conducting panel.

16. The heat dissipation device according to claim 15, characterized in that, The aforementioned filler metal coating gap is defined as the gap between the front end of the panel formed by the thickness of the aforementioned side being bent perpendicularly relative to the outer side surface of the aforementioned one-sided heat-conducting panel and the outer side surface of the aforementioned other-sided heat-conducting panel.

17. The heat dissipation device according to claim 15 or 16, characterized in that, The gaps in the above-mentioned filler metal coating are coated with filler metal that melts at a temperature above a predetermined melting point.

18. The heat dissipation device according to claim 17, characterized in that, After the filler metal is applied to the gaps between the filler metal coatings, the heat-conducting panel on one side is joined to the heat-conducting panel on the other side by a brazing process.

19. The heat dissipation device according to any one of claims 1, 4, and 12, characterized in that, The aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side are metal sheet components made of stainless steel.

20. The heat dissipation device according to any one of claims 1, 4, and 12, characterized in that, The aforementioned heat-conducting panel on one side is laminated and joined to the heat-conducting panel on the other side by laser welding or brazing.

21. The heat dissipation device according to claim 9 or 10, characterized in that, The aforementioned sintered column of the condensation section and the sintered base of the evaporation section are formed by sintering stainless steel powder.

22. The heat dissipation device according to claim 21, characterized in that, The aforementioned sintered column of the condensation section and the sintered base of the evaporation section are formed by sintering metal powder of the same material as the metal sheet components of the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side.

23. The heat dissipation device according to claim 22, characterized in that, The metal powder used in the aforementioned multiple condensation section sintered body columns and the aforementioned evaporation section sintered body base is made of stainless steel.

24. The heat dissipation device according to claim 22, characterized in that, The aforementioned evaporation section sintered body base is formed by sintering copper metal powder.

25. The heat dissipation device according to any one of claims 1, 4, and 12, characterized in that, The aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side are made of the same or different metal materials with a thermal conductivity of more than a predetermined value.

26. The heat dissipation device according to any one of claims 1, 4, and 12, characterized in that, The aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side are processed by sheet metal fabrication using a stamping die process.

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