Air conditioner and control method and device thereof, storage medium and computer program product

Abstract

The invention discloses an air conditioner control method and device, an air conditioner, a storage medium and a computer program product, the air conditioner comprises a mainboard and a mainboard radiator used for cooling the mainboard, a partition plate, cooling liquid and a driving assembly are arranged in the mainboard radiator, and the partition plate is provided with an upper hole for air circulation and a lower hole for liquid circulation; the partition plate divides the mainboard radiator into two cavities, cooling liquid is contained in the lower portion of each cavity, gas is contained in the upper portion of each cavity, throttled refrigerant can make contact with the cooling liquid through a pipeline, and the driving assembly can drive the liquid level of the cooling liquid to change so as to change the contact area of the pipeline and the cooling liquid. The method comprises the following steps: acquiring the operating temperature of the mainboard and the environment temperature of the environment where the mainboard is located; and the driving assembly is controlled to act according to the running temperature and the environment temperature to adjust the liquid level of the cooling liquid. According to the scheme, the heat dissipation sufficiency of the mainboard under the working conditions of extreme high temperature, high load and excessive throttling is improved, and the operation stability of the mainboard is improved.

Description

Technical Field

[0001] This invention belongs to the field of air conditioning technology, and specifically relates to an air conditioning control method, device, air conditioner, storage medium, and computer program product. Background Technology

[0002] Currently, the heat density of the main control board of air conditioners (especially the power module and main control board of the outdoor unit) continues to increase under high temperature conditions and high system load operation. Conventional air cooling can no longer meet the reliable heat dissipation requirements. Therefore, low temperature refrigerant of air conditioning system is gradually used to directly or indirectly cool the main control board.

[0003] Existing refrigerant direct-cooling motherboard heat dissipation solutions often involve directly attaching the throttled, low-temperature refrigerant pipes to the motherboard for heat exchange. While this can improve heat dissipation efficiency, it suffers from a core technical problem: insufficient precision in refrigerant temperature and flow control leads to condensation on the surface of the electronic control motherboard, which in turn causes short circuits and failures. On the one hand, system load fluctuations and deviations in throttling element adjustments can cause the refrigerant temperature to drop too low, resulting in the surface temperature of motherboard components falling below the ambient air dew point, directly causing condensation. The adhering liquid water can cause motherboard corrosion and component short circuits. On the other hand, deliberately limiting the refrigerant heat exchange to avoid condensation can lead to insufficient motherboard heat dissipation under high load conditions, triggering protection shutdowns due to temperature exceeding limits. It is impossible to simultaneously achieve both condensation prevention safety and effective heat dissipation under high temperatures and loads.

[0004] In existing related technologies, some solutions use refrigerant flow regulating valves and temperature sensors to control refrigerant flow in a closed loop to suppress condensation. However, the control logic is complex and prone to adjustment lag and frequent actions, so the risk of condensation cannot be completely eliminated. Some passive indirect heat exchange solutions lack active heat exchange adjustment means, and the heat dissipation capacity is uncontrollable under extreme conditions. They still do not fundamentally solve the core problem of the incompatibility between motherboard condensation and sufficient heat dissipation during refrigerant heat dissipation.

[0005] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0006] The purpose of this invention is to provide an air conditioner control method, device, air conditioner, storage medium, and computer program product to solve the problem that when the air conditioner mainboard uses refrigerant for heat dissipation, it cannot simultaneously meet the requirements of anti-condensation, effective heat dissipation under high load, and stable system regulation. This invention achieves the effect of solving the problem of condensation on the electronic control module caused by excessively low refrigerant temperature, ensuring sufficient cooling capacity for the mainboard under extreme high temperature, high load, and excessive system throttling conditions, while avoiding frequent system adjustments and improving the stability of mainboard operation and the reliability of system heat dissipation.

[0007] This invention provides a control method for an air conditioner. The air conditioner includes a throttling component, a main board, and a main board heat sink for dissipating heat from the main board. The main board heat sink contains a partition, coolant, and a drive component. The partition has an upper hole for gas flow and a lower hole for liquid flow, dividing the main board heat sink into at least two chambers. The lower part of each chamber contains the coolant, and the upper part contains gas. The refrigerant, after being throttled by the throttling component, can contact the coolant through a pipe. The drive component can drive changes in the coolant level to alter the contact area between the pipe and the coolant. The coolant level is positively correlated with the contact area between the pipe and the coolant. The method includes: during the operation of the air conditioner, acquiring the operating temperature of the main board and the ambient temperature of the environment in which the main board is located; controlling the drive component to adjust the coolant level based on the operating temperature and the ambient temperature, thereby changing the contact area between the pipe and the coolant and regulating the heat exchange between the refrigerant and the coolant.

[0008] In some embodiments, the throttling component includes a first throttling component and a second throttling component, and the air conditioner further includes an outdoor heat exchanger, the first throttling component, the second throttling component, and an indoor heat exchanger connected in series; the pipeline between the first throttling component and the second throttling component is in contact with the coolant; the method further includes: if the air conditioner is operating in cooling mode, controlling the first throttling component to be in a throttling state and the second throttling component to be in a fully open state, so that the refrigerant throttled by the first throttling component continues to be in contact with the coolant through the pipeline; if the air conditioner is operating in heating mode, controlling the second throttling component to be in a throttling state and the first throttling component to be in a fully open state, so that the refrigerant throttled by the second throttling component continues to be in contact with the coolant through the pipeline.

[0009] In some embodiments, controlling the actuation of the drive component to adjust the coolant level based on the operating temperature and the ambient temperature includes: determining the magnitude of the operating temperature; if the operating temperature is greater than or equal to a first preset temperature, calculating the temperature change rate of the operating temperature, and controlling the actuation of the drive component to adjust the coolant level based on the temperature change rate; if the operating temperature is less than the first preset temperature, controlling the actuation of the drive component to adjust the coolant level based on the ambient temperature.

[0010] In some embodiments, controlling the drive component to adjust the coolant level based on the temperature change rate includes: determining the magnitude of the temperature change rate; if the temperature change rate is greater than or equal to a first preset temperature change rate, controlling the drive component to drive the coolant level to a first level; if the temperature change rate is less than the first preset temperature change rate but greater than or equal to a second preset temperature change rate, controlling the drive component to drive the coolant level to a second level; if the temperature change rate is less than the second preset temperature change rate, controlling the drive component to drive the coolant level to a third level; where the first level > the second level > the third level.

[0011] In some embodiments, controlling the drive component to adjust the coolant level based on the ambient temperature includes: determining the magnitude of the ambient temperature; if the ambient temperature is greater than or equal to a second preset temperature, controlling the drive component to drive the coolant level to a fourth level; if the ambient temperature is less than the second preset temperature, controlling the drive component to drive the coolant level to a fifth level; where the fourth level > the fifth level.

[0012] In some embodiments, the drive assembly includes a power component and an actuator; controlling the drive assembly to adjust the coolant level includes: controlling the power component to drive the actuator to move along the height direction of the chamber, changing the volume of gas in the upper part of the chamber, and adjusting the coolant level in each chamber using the principle of communicating vessels.

[0013] In conjunction with the above method, another aspect of the present invention provides a control device for an air conditioner. The air conditioner includes a throttling component, a main board, and a main board heat sink for dissipating heat from the main board. The main board heat sink contains a partition, coolant, and a drive component. The partition has an upper hole for gas flow and a lower hole for liquid flow, dividing the main board heat sink into at least two chambers. The lower part of each chamber contains the coolant, and the upper part contains gas. The refrigerant, after being throttled by the throttling component, can contact the coolant through a pipe. The drive component can drive the change in the coolant level to alter the contact area between the pipe and the coolant. The coolant level is positively correlated with the contact area between the pipe and the coolant. The device includes: an acquisition unit configured to acquire the operating temperature of the main board and the ambient temperature of the environment in which the main board is located during the operation of the air conditioner; and a control unit configured to control the drive component to adjust the coolant level based on the operating temperature and the ambient temperature, thereby changing the contact area between the pipe and the coolant and regulating the heat exchange between the refrigerant and the coolant.

[0014] In some embodiments, the throttling component includes a first throttling component and a second throttling component, and the air conditioner further includes an outdoor heat exchanger, the first throttling component, the second throttling component, and an indoor heat exchanger connected in series; the pipeline between the first throttling component and the second throttling component is in contact with the coolant; the control unit is further configured to: if the air conditioner is operating in cooling mode, control the first throttling component to be in a throttling state and the second throttling component to be in a fully open state, so that the refrigerant throttled by the first throttling component continues to be in contact with the coolant through the pipeline; if the air conditioner is operating in heating mode, control the second throttling component to be in a throttling state and the first throttling component to be in a fully open state, so that the refrigerant throttled by the second throttling component continues to be in contact with the coolant through the pipeline.

[0015] In some embodiments, the control unit controls the actuation of the drive component to adjust the coolant level based on the operating temperature and the ambient temperature, including: determining the magnitude of the operating temperature; if the operating temperature is greater than or equal to a first preset temperature, calculating the temperature change rate of the operating temperature and controlling the actuation of the drive component to adjust the coolant level based on the temperature change rate; if the operating temperature is less than the first preset temperature, controlling the actuation of the drive component to adjust the coolant level based on the ambient temperature.

[0016] In some embodiments, the control unit controls the drive assembly to adjust the coolant level based on the temperature change rate, including: determining the magnitude of the temperature change rate; if the temperature change rate is greater than or equal to a first preset temperature change rate, controlling the drive assembly to drive the coolant level to a first level; if the temperature change rate is less than the first preset temperature change rate but greater than or equal to a second preset temperature change rate, controlling the drive assembly to drive the coolant level to a second level; if the temperature change rate is less than the second preset temperature change rate, controlling the drive assembly to drive the coolant level to a third level; wherein the first level > the second level > the third level.

[0017] In some embodiments, the control unit controls the drive assembly to adjust the coolant level based on the ambient temperature, including: determining the magnitude of the ambient temperature; if the ambient temperature is greater than or equal to a second preset temperature, controlling the drive assembly to drive the coolant level to a fourth level; if the ambient temperature is less than the second preset temperature, controlling the drive assembly to drive the coolant level to a fifth level; the fourth level > the fifth level.

[0018] In some embodiments, the drive assembly includes a power component and an actuator; a control unit controls the drive assembly to adjust the coolant level, including: controlling the power component to drive the actuator to move along the height direction of the chamber, changing the volume of gas in the upper part of the chamber, and adjusting the coolant level in each chamber using the principle of communicating vessels.

[0019] In conjunction with the above-described device, the present invention further provides an air conditioner, comprising: the control device for the air conditioner described above.

[0020] In conjunction with the above method, the present invention further provides a storage medium comprising a stored program, wherein, when the program is executed, it controls the device where the storage medium is located to perform the air conditioning control method described above.

[0021] In conjunction with the above method, the present invention further provides a computer program product comprising a computer program that, when processed and executed, implements the steps of the above-described air conditioner control method.

[0022] The present invention extracts the cooling capacity of the refrigerant after throttling by using an indirect cooling method. With the help of a motherboard heatsink structure with a double-hole baffle and an adjustable liquid level via a drive component, combined with the coordinated control of the motherboard operating temperature and the ambient temperature, the sufficiency of motherboard heat dissipation under extreme high temperature, high load and excessive throttling conditions is improved, the stability of motherboard operation is enhanced, and the risk of condensation caused by low refrigerant temperature and component damage caused by frequent system adjustments are avoided.

[0023] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention.

[0024] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0025] Figure 1 This is a flowchart illustrating an embodiment of the air conditioner control method of the present invention; Figure 2 This is a schematic diagram of the structure of an embodiment of the air conditioner control device of the present invention; Figure 3 This is a schematic diagram of an air conditioner structure; Figure 4 This is a schematic diagram of the motherboard heatsink structure. Figure 5 This is a flowchart illustrating another embodiment of the air conditioning control method.

[0026] Referring to the accompanying drawings, the reference numerals in the embodiments of the present invention are as follows: 1-Main board heat sink; 2-First throttling assembly; 3-Second throttling assembly; 4-Refrigerant pipe; 5-Gas port; 6-Motor; 7-Housing and insulation layer; 8-Piston; 9-Baffle; 10-Liquid port; 11-Coolant; 12-Heat spreader; 102-Acquisition unit; 104-Control unit. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0028] According to an embodiment of the present invention, a control method for an air conditioner is provided. The air conditioner includes a throttling component, a main board, and a main board heat sink for dissipating heat from the main board. The main board heat sink contains a partition, a coolant, and a drive component. The partition has an upper hole for gas flow and a lower hole for liquid flow, dividing the main board heat sink into at least two chambers. The lower part of each chamber contains the coolant, and the upper part contains gas. The refrigerant throttled by the throttling component can contact the coolant through a pipe. The drive component can drive the change in the coolant level to change the contact area between the pipe and the coolant. The coolant level is positively correlated with the contact area between the pipe and the coolant.

[0029] After the refrigerant is throttled by the throttling component, its temperature decreases, giving it the ability to absorb heat. When the coolant comes into contact with the low-temperature refrigerant, it can absorb cold energy. The coolant level is positively correlated with the contact area of ​​the refrigerant pipeline. The larger the contact area, the more cold energy the coolant absorbs and the more cold energy is transferred to the motherboard, resulting in a stronger heat dissipation effect. Conversely, the heat dissipation effect is weakened.

[0030] like Figure 1 The flowchart of an embodiment of the method of the present invention is shown. The air conditioner control method may include steps S110 and S120.

[0031] In step S110, during the operation of the air conditioner, the operating temperature of the motherboard and the ambient temperature of the environment in which the motherboard is located are obtained.

[0032] Operating temperature is a core indicator for judging the motherboard's heat status. If the operating temperature is too high, it indicates that the motherboard urgently needs heat dissipation and requires enhanced cooling; if the operating temperature is low, cooling can be appropriately reduced. Ambient temperature is used to help judge the cooling conditions. Under the same operating temperature, the higher the ambient temperature, the more difficult it is for the motherboard to dissipate heat naturally, requiring the maintenance or enhancement of active cooling; the lower the ambient temperature, the easier it is for the motherboard to dissipate heat naturally, allowing for a further reduction in the intensity of active cooling to avoid excessive heat dissipation leading to condensation.

[0033] In step S120, the drive component is controlled to adjust the coolant level based on the operating temperature and the ambient temperature, thereby changing the contact area between the pipeline and the coolant and regulating the heat exchange between the refrigerant and the coolant.

[0034] To achieve on-demand heat dissipation for the motherboard, it's crucial to prevent overheating that could lead to component failure, while also avoiding excessive heat dissipation that could cause the motherboard surface temperature to drop below the dew point, resulting in condensation. By assessing the motherboard's internal heat requirements through operating temperature and external cooling conditions through ambient temperature, the combined approach allows for precise matching of cooling intensity, ensuring stable operation of the motherboard within a safe temperature range.

[0035] Specifically, after the air conditioner starts operating, it collects real-time temperature data from the motherboard surface or core electronic control module as the motherboard's operating temperature; simultaneously, it collects temperature data from the external environment where the outdoor unit is located as the ambient temperature. The collected operating temperature is compared with a preset temperature threshold, and the ambient temperature is compared with a preset ambient temperature threshold. Control commands are generated based on the results of these two comparisons. Upon receiving the commands, the drive components act, changing the volume or pressure distribution of the gas in the upper chambers to cause the coolant to flow between different chambers, thereby adjusting the coolant level. When the coolant level rises, the contact area between the refrigerant pipes and the coolant increases, increasing the heat exchange between them. This results in more cooling absorbed by the coolant and a corresponding increase in the amount of cooling transferred to the motherboard, enhancing heat dissipation. Conversely, when the coolant level falls, the contact area decreases, reducing heat exchange and weakening heat dissipation, thus achieving precise control over the motherboard's heat dissipation effect.

[0036] In some embodiments, the throttling component includes a first throttling component and a second throttling component, and the air conditioner further includes an outdoor heat exchanger, the first throttling component, the second throttling component, and an indoor heat exchanger connected in series; the pipeline between the first throttling component and the second throttling component is in contact with the coolant.

[0037] Figure 3This is a schematic diagram of an air conditioner structure. The air conditioner includes a compressor, an outdoor radiator, an indoor radiator, a main board, a main board radiator 1, a first throttling component 2, and a second throttling component 3, wherein the main board radiator 1 is located between the first throttling component 2 and the second throttling component 3. The high-temperature, high-pressure refrigerant discharged from the compressor first flows through the outdoor radiator for heat dissipation and cooling, and then enters the throttling system composed of the first throttling component 2 and the second throttling component 3. When the air conditioner is operating in cooling mode, the second throttling component 3 is fully open, and the first throttling component 2 performs throttling, causing the refrigerant to form a low-temperature, low-pressure state after throttling and flow into the main board radiator 1, where it exchanges heat with the coolant inside the main board radiator 1. The refrigerant, after absorbing heat from the coolant, then flows into the indoor radiator to complete the cooling cycle. When the air conditioner is operating in heating mode, the first throttling component 2 switches to a fully open state, and the second throttling component 3 performs throttling. The low-temperature, low-pressure refrigerant after throttling also flows into the main board radiator 1 for heat exchange, ensuring a stable source of low-temperature refrigerant for the main board radiator 1 in different operating modes. The motherboard heatsink 1 is divided into two chambers, left and right, by an internal partition. The lower part of the chamber is filled with coolant and the upper part is filled with gas. The partition has holes at the top and bottom for gas and liquid to flow through. By adjusting the coolant level, the contact area with the refrigerant pipes can be changed, thereby controlling the heat exchange rate and ultimately achieving efficient heat dissipation for the motherboard. This not only prevents the motherboard from malfunctioning due to overheating, but also prevents the low-temperature refrigerant from directly contacting the motherboard and causing condensation damage.

[0038] In some embodiments, the method further includes: if the air conditioner is operating in cooling mode, controlling the first throttling component to be in a throttling state and the second throttling component to be in a fully open state, so that the refrigerant throttled by the first throttling component continues to be in contact with the coolant through the pipeline; if the air conditioner is operating in heating mode, controlling the second throttling component to be in a throttling state and the first throttling component to be in a fully open state, so that the refrigerant throttled by the second throttling component continues to be in contact with the coolant through the pipeline.

[0039] Specifically, after the air conditioner is turned on and switched to cooling mode, the system issues a control command to adjust the first throttling component to the preset throttling opening and the second throttling component to fully open. The high-temperature and high-pressure refrigerant discharged by the compressor is cooled by the outdoor heat exchanger and flows into the first throttling component, where it is throttled and becomes low-temperature and low-pressure refrigerant. This low-temperature refrigerant then flows through the pipe between the first and second throttling components, continuously contacting and exchanging heat with the coolant in the mainboard radiator, transferring cooling capacity to the coolant. After completing the heat exchange, the refrigerant continues to flow through the fully open second throttling component, enters the indoor heat exchanger to evaporate and absorb heat, achieving indoor cooling, and finally flows back to the compressor to complete the cycle. After the air conditioner is turned on and switched to heating mode, the system switches the refrigerant circulation direction through a four-way valve and simultaneously issues a control command to adjust the second throttling component to the preset throttling opening, while the first throttling component is fully open. The high-temperature, high-pressure refrigerant discharged from the compressor releases heat through the indoor heat exchanger and flows into the second throttling component, where it is throttled and becomes low-temperature, low-pressure refrigerant. This low-temperature refrigerant flows through the pipe between the second and first throttling components, continuously contacting and exchanging heat with the coolant in the mainboard radiator, transferring cooling capacity to the coolant. After heat exchange, the refrigerant continues to flow through the fully open first throttling component, enters the outdoor heat exchanger to absorb heat, and finally flows back to the compressor to complete the heating cycle. This achieves heat dissipation adaptation between cooling and heating modes. By switching the operating states of the two throttling components, it ensures a stable source of low-temperature refrigerant for the mainboard radiator regardless of the air conditioner's operating mode, guaranteeing the mainboard's heat dissipation needs under all operating conditions and preventing heat dissipation interruption or insufficiency due to mode switching.

[0040] In some embodiments, step S120, controlling the drive component to adjust the coolant level based on the operating temperature and the ambient temperature, includes steps S210 to S230.

[0041] Step S210: Determine the magnitude of the operating temperature.

[0042] Step S220: If the operating temperature is greater than or equal to the first preset temperature, calculate the temperature change rate of the operating temperature, and control the drive component to adjust the coolant level according to the temperature change rate.

[0043] The first preset temperature is a temperature threshold used to determine the motherboard's heat dissipation requirements. Its value needs to be determined by considering the motherboard module's maximum tolerable temperature and safety margin during normal operation. The purpose is to initiate targeted heat dissipation control before the motherboard temperature reaches a critical point that may affect stable operation. For example, a value of 41℃, 43℃, or 45℃ may be used. The detailed calculation method is: First preset temperature T1 = T H / n,T HThis represents the maximum tolerable temperature for normal motherboard operation; n is a safety margin, typically between 1.5 and 2. When the operating temperature reaches or exceeds the first preset temperature, a fixed cooling intensity alone cannot handle potential temperature fluctuations in the motherboard. If the temperature rises too quickly, cooling needs to be rapidly increased to prevent overheating; if the temperature drops too quickly or tends to stabilize, cooling needs to be appropriately reduced to prevent excessive cooling; if the temperature change is gradual, maintaining a moderate cooling intensity is sufficient. By judging the heat generation or heat dissipation trend through the temperature change rate, adjustments can be made as needed, improving the precision of control.

[0044] Specifically, the system calculates the rate of change of the motherboard operating temperature per unit time (i.e., the rate of temperature change) and compares this rate of change with a preset temperature change rate threshold. Based on the comparison result, the system sends an action command to the drive component. The drive component adjusts the coolant level by changing the gas volume in the upper part of the chamber and using the principle of communicating vessels. If the rate of temperature change is high, the coolant level is raised to increase the contact area and enhance heat dissipation. If the rate of temperature change is low, the coolant level is lowered to reduce the contact area and weaken heat dissipation. If the rate of temperature change is moderate, the coolant level is maintained or finely adjusted.

[0045] Step S230: If the operating temperature is lower than the first preset temperature, the drive component is controlled to adjust the coolant level according to the ambient temperature.

[0046] When the operating temperature is below the first preset temperature, the motherboard itself generates less heat, but the ambient temperature will affect the natural heat dissipation effect. When the ambient temperature is high, the natural heat dissipation efficiency is low, and basic heat dissipation needs to be maintained to prevent the motherboard temperature from slowly accumulating and rising. When the ambient temperature is low, the natural heat dissipation efficiency is high, and the motherboard temperature is not easy to rise. Active heat dissipation can be further reduced or stopped to avoid the coolant temperature being too low and causing condensation on the motherboard.

[0047] Specifically, the system collects the real-time temperature of the motherboard's environment and compares it with a preset ambient temperature threshold. If the ambient temperature is high, the system controls the drive components to maintain the basic coolant level to ensure basic heat dissipation. If the ambient temperature is low, the system controls the drive components to lower the coolant level, reduce or stop active cooling, and rely solely on natural cooling to maintain a stable motherboard temperature.

[0048] In some embodiments, step S220, controlling the drive component to adjust the coolant level based on the temperature change rate, includes: determining the magnitude of the temperature change rate; if the temperature change rate is greater than or equal to a first preset temperature change rate, controlling the drive component to drive the coolant level to a first level; if the temperature change rate is less than the first preset temperature change rate but greater than or equal to a second preset temperature change rate, controlling the drive component to drive the coolant level to a second level; if the temperature change rate is less than the second preset temperature change rate, controlling the drive component to drive the coolant level to a third level; where the first level > the second level > the third level.

[0049] The first preset temperature change rate is a high temperature change rate threshold, which can be set to 1~2℃ / min. When the motherboard temperature change rate reaches or exceeds this value, it indicates that the motherboard heats up quickly or the heat dissipation demand increases sharply, requiring the strongest level of heat dissipation control to be activated. The second preset temperature change rate is a low temperature change rate threshold, which can be set to 0.1~0.2℃ / min. Below this value, it indicates that the motherboard temperature changes slowly, and the heat generation or heat dissipation demand is moderate, allowing for a weaker heat dissipation control intensity. The first liquid level represents the highest coolant level, where the contact area between the refrigerant pipes and the coolant is the largest, resulting in the strongest heat exchange and the strongest heat dissipation effect. The second liquid level represents the middle coolant level, where the contact area between the refrigerant pipes and the coolant is at a moderate level, with a moderate heat exchange, sufficient for the motherboard's normal heat dissipation needs. The third liquid level represents the lowest coolant level, where the contact area between the refrigerant pipes and the coolant is the smallest, with the weakest heat exchange, suitable for scenarios where the motherboard generates little heat or has low heat dissipation requirements.

[0050] Temperature change rate dynamically reflects the motherboard's heat generation or dissipation trend. Compared to static operating temperature, it can better predict changes in heat dissipation needs in advance, avoiding lag in regulation. Furthermore, the coolant level is positively correlated with the contact area of ​​the refrigerant piping; a higher level results in a larger contact area, stronger heat exchange, and more significant heat dissipation. By comparing the temperature change rate with different preset thresholds and matching the corresponding coolant level, precise adaptation between heat dissipation intensity and the motherboard's dynamic heat dissipation needs can be achieved, preventing both overheating and excessive heat dissipation.

[0051] When the temperature change rate reaches or exceeds the first preset temperature change rate, it indicates that the motherboard temperature is rising rapidly. If heat dissipation is not enhanced in time, motherboard components may fail due to high temperature. The first liquid level corresponds to the largest contact area and the strongest heat exchange capacity, which can quickly absorb the coolant's cold energy and transfer it to the motherboard, achieving efficient cooling. When the temperature change rate is lower than the second preset temperature change rate, the motherboard temperature tends to stabilize or slowly decrease, and the heat generation is significantly reduced. The minimum contact area corresponding to the third liquid level can significantly reduce the heat exchange capacity, preventing the coolant from absorbing too much cold energy and causing the temperature to drop too low, thereby preventing condensation on the motherboard surface and reducing unnecessary operating losses of drive components. When the temperature change rate is between the two preset values, the motherboard temperature is in a stable state, with no risk of rapid overheating and no need to reduce heat dissipation to the minimum level. The medium contact area corresponding to the second liquid level can provide a moderate heat exchange capacity, maintaining the motherboard temperature within a safe range and avoiding temperature fluctuations caused by excessive or insufficient heat dissipation.

[0052] Specifically, when the system determines that the temperature change rate is greater than or equal to a first preset temperature change rate, it sends a command to the drive component. The drive component, by changing the gas volume in the upper part of the chamber, uses the principle of communicating vessels to cause the coolant to flow towards the chamber closer to the motherboard until the coolant reaches the first level. At this point, the refrigerant pipes are in full contact with the coolant, maximizing heat exchange efficiency and quickly removing excess heat from the motherboard. When the system determines that the temperature change rate is less than a second preset temperature change rate, it controls the drive component to drive the coolant to flow towards the chamber farther from the motherboard until the level drops to the third level. At this point, the refrigerant pipes are only in contact with a small amount of coolant, reducing heat exchange, and the motherboard temperature remains stable through natural heat dissipation and a small amount of active heat dissipation. When the system determines that the temperature change rate is between the two preset values, it controls the drive component to adjust the coolant level to the second level, maintaining a moderate contact area between the refrigerant pipes and the coolant. At this point, the heat exchange rate matches the motherboard's heating rate, achieving a dynamically balanced heat dissipation effect.

[0053] In some embodiments, step S230, controlling the drive component to adjust the coolant level based on the ambient temperature, includes: determining the magnitude of the ambient temperature; if the ambient temperature is greater than or equal to a second preset temperature, controlling the drive component to drive the coolant level to a fourth level; if the ambient temperature is less than the second preset temperature, controlling the drive component to drive the coolant level to a fifth level; the fourth level > the fifth level.

[0054] The second preset temperature is the ambient temperature threshold. Its value needs to be determined comprehensively based on the motherboard's natural heat dissipation efficiency, the climate conditions of the area where it is used, and the dew point temperature. It is used to define the heat dissipation control strategy under different ambient temperatures. The fourth liquid level is the basic liquid level of the coolant. At this point, the refrigerant pipes maintain a certain contact area with the coolant, providing basic heat exchange and meeting the basic heat dissipation needs of the motherboard under low load operation, preventing the motherboard temperature from slowly accumulating and rising. The fifth liquid level is the lowest liquid level of the coolant. The contact area between the refrigerant pipes and the coolant is the smallest (or non-contact), and the heat exchange is the weakest (or non-existent). This is used in scenarios with low ambient temperatures and good natural heat dissipation, to avoid excessive heat dissipation.

[0055] When the ambient temperature reaches or exceeds the second preset temperature, natural heat dissipation is poor. Even if the motherboard operating temperature is low, the temperature may slowly rise due to continuous heat accumulation. The basic contact area corresponding to the fourth liquid level provides sufficient heat exchange to maintain the motherboard temperature within a safe range, preventing the temperature from gradually climbing to a critical value. When the ambient temperature is below the second preset temperature, natural heat dissipation is effective, and the small amount of heat generated by the motherboard can be quickly dissipated through the air without the need for additional active cooling. The minimum contact area corresponding to the fifth liquid level significantly reduces heat exchange, preventing the coolant from absorbing too much cold energy and causing the temperature to drop too low. This prevents condensation from forming on the motherboard surface due to contact with the low-temperature coolant, protecting the circuit board and components.

[0056] Specifically, when the system determines that the ambient temperature is ≥ the second preset temperature, it sends a control command to the drive component. The drive component adjusts the gas volume in the upper part of the chamber, using the principle of communicating vessels to cause the coolant to flow towards the chamber closer to the motherboard until the liquid level reaches the fourth level. At this time, the refrigerant pipes maintain basic contact with the coolant, and the heat exchange rate matches the low-load heating rate of the motherboard, achieving basic heat dissipation. When the system determines that the ambient temperature is < the second preset temperature, it controls the drive component to move the coolant towards the chamber farther from the motherboard until the liquid level drops to the fifth level. At this time, the refrigerant pipes have only a small amount of contact with the coolant (or no contact at all), the heat exchange rate is minimized, and the motherboard mainly relies on natural heat dissipation to maintain temperature stability, while avoiding the risk of condensation.

[0057] In some embodiments, the drive assembly includes a power element and an actuator. The power element provides power output, such as... Figure 4 The motor 6 in the middle. The actuator receives energy transmitted from the power component and converts it into mechanical displacement. Through its own movement, it changes the internal environment of the chamber, indirectly regulating the coolant level, such as... Figure 4 Piston 8 in the middle.

[0058] In some embodiments, controlling the drive assembly to adjust the coolant level includes: controlling the power component to drive the actuator to move along the height direction of the chamber, changing the volume of gas in the upper part of the chamber, and adjusting the coolant level in each chamber using the principle of communicating vessels.

[0059] Moving along the height of the chamber is the most direct and efficient way to change the gas volume in the upper part of the chamber. Displacement in this direction maximizes the use of chamber space, achieving a significant change in gas volume, and thus generating a sufficient pressure difference to drive coolant flow. The application of the communicating vessel principle ensures smooth and controllable coolant flow between chambers, avoiding drastic fluctuations in heat exchange caused by sudden changes in liquid level. This guarantees the stability of heat dissipation, reduces the load on drive components, and extends their service life. Furthermore, this control method requires no complex piping modifications or multiple power sources; liquid level regulation can be achieved through displacement in only one direction, simplifying the control logic and system structure.

[0060] Specifically, the system sends action commands to the power components of the drive assembly based on the judgment results of the motherboard operating temperature, ambient temperature, or temperature change rate. After receiving the command, the power components start and output power to drive the actuators to move along the height direction of the chamber (up or down). The movement of the actuators directly changes the gas containment space in the upper part of the chamber, causing the gas volume in the upper part of the chamber to increase or decrease. The change in gas volume causes a corresponding change in gas pressure in the chamber (the pressure increases when the volume decreases, and the pressure decreases when the volume increases). Since the chambers are connected by holes in the partition, the pressure difference drives the coolant to flow from the chamber with high pressure to the chamber with low pressure. During the flow of coolant, the liquid level in each chamber gradually rebalances, eventually forming a new liquid level distribution, realizing the adjustment of the contact area between the refrigerant pipeline and the coolant, and thus completing the regulation of heat exchange.

[0061] Figure 4This is a schematic diagram of the motherboard heatsink structure. The heatsink is encapsulated by a shell and an insulation layer 7. Internal core components include refrigerant pipes 4, gas vents 5, a motor 6, a piston 8, a baffle 9, liquid vents 10, coolant 11, and a vapor chamber 12. These components work together to achieve indirect heat exchange and liquid level regulation. The baffle 9 divides the internal space of the shell and insulation layer 7 into two independent chambers, left and right. The lower part of both chambers shares the coolant 11, while the upper part is a gas area. The baffle 9 has gas vents 5 at the top and liquid vents 10 at the bottom, allowing for gas and coolant 11 flow between the two chambers, ensuring pressure balance and medium exchange. The vapor chamber 12 is attached to the outer wall of the left chamber, with one end in close contact with the air conditioning motherboard and the other end in contact with the coolant 11 in the left chamber. It transfers the heat generated by the motherboard to the coolant 11, while simultaneously achieving uniform heat distribution and preventing localized overheating or overcooling. The refrigerant pipe 4 runs through the interior of the motherboard heatsink, contacting the coolant 11 in both chambers. It introduces the throttled, low-temperature refrigerant to exchange heat with the coolant 11, providing a source of cooling for heat dissipation. The motor 6 and piston 8 are mounted on the upper part of the right chamber, connected by a drive mechanism. The motor 6 drives the piston 8 to move up and down along the height of the right chamber, thus changing the volume of the gas region in the upper part of the right chamber. Using the principle of communicating vessels, the motor drives the coolant 11 to flow between the left and right chambers through the liquid orifice 10, adjusting the coolant level and ultimately changing the contact area between the refrigerant pipe 4 and the coolant 11, thereby controlling the amount of heat exchange. The casing and insulation layer 7 enclose the heatsink, reducing the loss of coolant 11 and ensuring efficient use of cooling for motherboard heat dissipation, while protecting internal components from external environmental influences. This entire structure uses indirect heat exchange, preventing the low-temperature refrigerant from directly contacting the motherboard, ensuring effective heat dissipation while avoiding the risk of condensation. Combined with the liquid level control logic, it achieves precise and stable motherboard heat dissipation.

[0062] This solution achieves on-demand heat dissipation control of the mainboard by collecting data on the mainboard operating temperature and ambient temperature, combined with the correlation between coolant level and refrigerant piping contact area. This effectively solves the problem of insufficient mainboard heat dissipation under extreme high temperature and high load conditions, while avoiding the risk of condensation caused by excessive heat dissipation. It also reduces component wear caused by frequent system adjustments, significantly improves the stability and reliability of the air conditioner mainboard, and extends the service life of the air conditioner.

[0063] For example, when the outdoor ambient temperature is 38℃ (higher than the preset ambient temperature threshold), and the air conditioner is operating at high load, the motherboard's operating temperature continuously rises to 45℃ (higher than the preset temperature threshold). The system determines that the motherboard urgently needs cooling and immediately controls the drive components to raise the coolant level, increasing the contact area between the refrigerant piping and the coolant. This significantly increases the heat exchange between the refrigerant and coolant. After absorbing sufficient cooling energy, the coolant efficiently transfers the cooling energy to the motherboard, gradually reducing the motherboard's operating temperature to 35℃ (within the safe temperature range). Subsequently, the system continuously monitors the temperature. When the motherboard's operating temperature stabilizes at around 35℃ and the ambient temperature remains at 38℃, the system controls the drive components to maintain the current coolant level, ensuring a stable heat exchange and guaranteeing that the motherboard continues to operate within a safe temperature range.

[0064] For example, if the ambient temperature is 18℃ (below the preset ambient temperature threshold), the air conditioner is running at low load, and the motherboard operating temperature is 30℃ (below the preset temperature threshold), the system, after collecting the temperature data, determines that the motherboard generates little heat and has good natural heat dissipation conditions. It then controls the drive components to lower the coolant level, reducing the contact area between the refrigerant pipes and the coolant, thus reducing heat exchange. In this case, the motherboard can maintain a stable temperature through natural heat dissipation and a small amount of active heat dissipation, preventing condensation from forming on the motherboard surface due to excessive heat dissipation.

[0065] Figure 5 A flowchart illustrating another embodiment of the air conditioning control method includes: Step 1: After the air conditioner is turned on, if it is in cooling mode, the second throttling component will be fully open and the first throttling component will be throttled; if it is in heating mode, the first throttling component will be fully open and the second throttling component will be throttled.

[0066] Step 2, collect motherboard temperature T 主板 Determine if T 主板 ≥T1. If T 主板 If T ≥ T1, then proceed to step 3. 主板 If <T1, then proceed to step 4.

[0067] Step 3, calculate T 主板 The temperature change rate ΔT / t. If ΔT / t ≥ X1, the drive piston moves down to 75%-100% of its stroke; if ΔT / t < X2, the drive piston moves up to below 10%; if X1 > ΔT / t ≥ X2, the stroke percentage is maintained at 25%-75%.

[0068] Step 4, collect ambient temperature T 环 If T 环 If T < T2, the motor drives the piston to move upward to its limit position, with a stroke percentage of 0%, and the coolant flows back to the right chamber, minimizing the contact area between the refrigerant pipe and the coolant; if T 环If the value is ≥T2, the motor drives the piston to move upward to a stroke percentage of less than 10%, and a small amount of coolant is retained in the left chamber to maintain the basic contact area.

[0069] The technical solution of this embodiment extracts the cooling capacity of the refrigerant after throttling by using an indirect cooling method. With the help of a motherboard heatsink structure with a double-hole baffle and an adjustable liquid level via a drive component, combined with the coordinated control of the motherboard operating temperature and the ambient temperature, the sufficiency of motherboard heat dissipation under extreme high temperature, high load and excessive throttling conditions is improved, the stability of motherboard operation is enhanced, and the risk of condensation caused by low refrigerant temperature and component damage caused by frequent system adjustments are avoided.

[0070] According to an embodiment of the present invention, a control device for an air conditioner corresponding to the control method of an air conditioner is also provided. The air conditioner includes a throttling component, a main board, and a main board heat sink for dissipating heat from the main board. The main board heat sink contains a partition, coolant, and a drive component. The partition has an upper hole for gas flow and a lower hole for liquid flow, dividing the main board heat sink into at least two chambers. The lower part of each chamber contains the coolant, and the upper part contains gas. The refrigerant, after being throttled by the throttling component, can contact the coolant through a pipe. The drive component can drive changes in the coolant level to alter the contact area between the pipe and the coolant. The coolant level is positively correlated with the contact area between the pipe and the coolant.

[0071] After the refrigerant is throttled by the throttling component, its temperature decreases, giving it the ability to absorb heat. When the coolant comes into contact with the low-temperature refrigerant, it can absorb cold energy. The coolant level is positively correlated with the contact area of ​​the refrigerant pipeline. The larger the contact area, the more cold energy the coolant absorbs and the more cold energy is transferred to the motherboard, resulting in a stronger heat dissipation effect. Conversely, the heat dissipation effect is weakened.

[0072] See Figure 2 The diagram shows a structural schematic of an embodiment of the device of the present invention. The control device of the air conditioner may include: an acquisition unit 102 and a control unit 104.

[0073] The acquisition unit 102 is configured to acquire the operating temperature of the mainboard and the ambient temperature of the environment in which the mainboard is located during the operation of the air conditioner. For the specific functions and processing of this unit, please refer to step S110.

[0074] Operating temperature is a core indicator for judging the motherboard's heat status. If the operating temperature is too high, it indicates that the motherboard urgently needs heat dissipation and requires enhanced cooling; if the operating temperature is low, cooling can be appropriately reduced. Ambient temperature is used to help judge the cooling conditions. Under the same operating temperature, the higher the ambient temperature, the more difficult it is for the motherboard to dissipate heat naturally, requiring the maintenance or enhancement of active cooling; the lower the ambient temperature, the easier it is for the motherboard to dissipate heat naturally, allowing for a further reduction in the intensity of active cooling to avoid excessive heat dissipation leading to condensation.

[0075] Control unit 104 is configured to control the operation of the drive assembly based on the operating temperature and the ambient temperature to adjust the coolant level, thereby changing the contact area between the pipeline and the coolant and regulating the heat exchange between the refrigerant and the coolant. For the specific functions and processing of this unit, please refer to step S120.

[0076] To achieve on-demand heat dissipation for the motherboard, it's crucial to prevent overheating that could lead to component failure, while also avoiding excessive heat dissipation that could cause the motherboard surface temperature to drop below the dew point, resulting in condensation. By assessing the motherboard's internal heat requirements through operating temperature and external cooling conditions through ambient temperature, the combined approach allows for precise matching of cooling intensity, ensuring stable operation of the motherboard within a safe temperature range.

[0077] Specifically, after the air conditioner starts operating, it collects real-time temperature data from the motherboard surface or core electronic control module as the motherboard's operating temperature; simultaneously, it collects temperature data from the external environment where the outdoor unit is located as the ambient temperature. The collected operating temperature is compared with a preset temperature threshold, and the ambient temperature is compared with a preset ambient temperature threshold. Control commands are generated based on the results of these two comparisons. Upon receiving the commands, the drive components act, changing the volume or pressure distribution of the gas in the upper chambers to cause the coolant to flow between different chambers, thereby adjusting the coolant level. When the coolant level rises, the contact area between the refrigerant pipes and the coolant increases, increasing the heat exchange between them. This results in more cooling absorbed by the coolant and a corresponding increase in the amount of cooling transferred to the motherboard, enhancing heat dissipation. Conversely, when the coolant level falls, the contact area decreases, reducing heat exchange and weakening heat dissipation, thus achieving precise control over the motherboard's heat dissipation effect.

[0078] In some embodiments, the throttling component includes a first throttling component and a second throttling component, and the air conditioner further includes an outdoor heat exchanger, the first throttling component, the second throttling component, and an indoor heat exchanger connected in series; the pipeline between the first throttling component and the second throttling component is in contact with the coolant.

[0079] In some embodiments, the control unit 104 is further configured to: if the air conditioner is operating in cooling mode, control the first throttling component to be in a throttling state and the second throttling component to be in a fully open state, so that the refrigerant throttled by the first throttling component continues to be in contact with the coolant through the pipeline; if the air conditioner is operating in heating mode, control the second throttling component to be in a throttling state and the first throttling component to be in a fully open state, so that the refrigerant throttled by the second throttling component continues to be in contact with the coolant through the pipeline.

[0080] Specifically, after the air conditioner is turned on and switched to cooling mode, the system issues a control command to adjust the first throttling component to the preset throttling opening and the second throttling component to fully open. The high-temperature and high-pressure refrigerant discharged by the compressor is cooled by the outdoor heat exchanger and flows into the first throttling component, where it is throttled and becomes low-temperature and low-pressure refrigerant. This low-temperature refrigerant then flows through the pipe between the first and second throttling components, continuously contacting and exchanging heat with the coolant in the mainboard radiator, transferring cooling capacity to the coolant. After completing the heat exchange, the refrigerant continues to flow through the fully open second throttling component, enters the indoor heat exchanger to evaporate and absorb heat, achieving indoor cooling, and finally flows back to the compressor to complete the cycle. After the air conditioner is turned on and switched to heating mode, the system switches the refrigerant circulation direction through a four-way valve and simultaneously issues a control command to adjust the second throttling component to the preset throttling opening, while the first throttling component is fully open. The high-temperature, high-pressure refrigerant discharged from the compressor releases heat through the indoor heat exchanger and flows into the second throttling component, where it is throttled and becomes low-temperature, low-pressure refrigerant. This low-temperature refrigerant flows through the pipe between the second and first throttling components, continuously contacting and exchanging heat with the coolant in the mainboard radiator, transferring cooling capacity to the coolant. After heat exchange, the refrigerant continues to flow through the fully open first throttling component, enters the outdoor heat exchanger to absorb heat, and finally flows back to the compressor to complete the heating cycle. This achieves heat dissipation adaptation between cooling and heating modes. By switching the operating states of the two throttling components, it ensures a stable source of low-temperature refrigerant for the mainboard radiator regardless of the air conditioner's operating mode, guaranteeing the mainboard's heat dissipation needs under all operating conditions and preventing heat dissipation interruption or insufficiency due to mode switching.

[0081] In some embodiments, the control unit 104 controls the operation of the drive assembly to adjust the coolant level based on the operating temperature and the ambient temperature, including: The control unit 104 is further configured to determine the magnitude of the operating temperature. The specific functions and processing of this unit are described in step S210.

[0082] The control unit 104 is further configured to calculate the temperature change rate of the operating temperature if the operating temperature is greater than or equal to a first preset temperature, and control the drive component to adjust the coolant level based on the temperature change rate. The specific function and processing of this unit are described in step S220.

[0083] The first preset temperature is a temperature threshold used to determine the motherboard's heat dissipation requirements. Its value must be determined by considering the motherboard module's maximum tolerable temperature and safety margin during normal operation. The purpose is to initiate targeted heat dissipation control before the motherboard temperature reaches a critical point that could affect stable operation. When the operating temperature reaches or exceeds the first preset temperature, a fixed heat dissipation intensity alone cannot handle potential temperature fluctuations. If the temperature rises too quickly, heat dissipation needs to be rapidly increased to prevent overheating; if the temperature drops too quickly or tends to stabilize, heat dissipation needs to be appropriately reduced to prevent excessive cooling; if the temperature change is gradual, maintaining a moderate heat dissipation intensity is sufficient. By judging the heat generation or heat dissipation trend through the temperature change rate, adjustments can be made as needed, improving the accuracy of control.

[0084] Specifically, the system calculates the rate of change of the motherboard operating temperature per unit time (i.e., the rate of temperature change) and compares this rate of change with a preset temperature change rate threshold. Based on the comparison result, the system sends an action command to the drive component. The drive component adjusts the coolant level by changing the gas volume in the upper part of the chamber and using the principle of communicating vessels. If the rate of temperature change is high, the coolant level is raised to increase the contact area and enhance heat dissipation. If the rate of temperature change is low, the coolant level is lowered to reduce the contact area and weaken heat dissipation. If the rate of temperature change is moderate, the coolant level is maintained or finely adjusted.

[0085] The control unit 104 is further configured to, if the operating temperature is lower than a first preset temperature, control the drive component to adjust the coolant level based on the ambient temperature. The specific function and processing of this unit are described in step S230.

[0086] When the operating temperature is below the first preset temperature, the motherboard itself generates less heat, but the ambient temperature will affect the natural heat dissipation effect. When the ambient temperature is high, the natural heat dissipation efficiency is low, and basic heat dissipation needs to be maintained to prevent the motherboard temperature from slowly accumulating and rising. When the ambient temperature is low, the natural heat dissipation efficiency is high, and the motherboard temperature is not easy to rise. Active heat dissipation can be further reduced or stopped to avoid the coolant temperature being too low and causing condensation on the motherboard.

[0087] Specifically, the system collects the real-time temperature of the motherboard's environment and compares it with a preset ambient temperature threshold. If the ambient temperature is high, the system controls the drive components to maintain the basic coolant level to ensure basic heat dissipation. If the ambient temperature is low, the system controls the drive components to lower the coolant level, reduce or stop active cooling, and rely solely on natural cooling to maintain a stable motherboard temperature.

[0088] In some embodiments, the control unit 104 controls the drive assembly to adjust the coolant level based on the temperature change rate, including: determining the magnitude of the temperature change rate; if the temperature change rate is greater than or equal to a first preset temperature change rate, controlling the drive assembly to drive the coolant level to a first level; if the temperature change rate is less than the first preset temperature change rate but greater than or equal to a second preset temperature change rate, controlling the drive assembly to drive the coolant level to a second level; if the temperature change rate is less than the second preset temperature change rate, controlling the drive assembly to drive the coolant level to a third level; wherein the first level > the second level > the third level.

[0089] The first preset temperature change rate is a high temperature change rate threshold, which can be set to 1~2℃ / min. When the motherboard temperature change rate reaches or exceeds this value, it indicates that the motherboard heats up quickly or the heat dissipation demand increases sharply, requiring the strongest level of heat dissipation control to be activated. The second preset temperature change rate is a low temperature change rate threshold, which can be set to 0.1~0.2℃ / min. Below this value, it indicates that the motherboard temperature changes slowly, and the heat generation or heat dissipation demand is moderate, allowing for a weaker heat dissipation control intensity. The first liquid level represents the highest coolant level, where the contact area between the refrigerant pipes and the coolant is the largest, resulting in the strongest heat exchange and the strongest heat dissipation effect. The second liquid level represents the middle coolant level, where the contact area between the refrigerant pipes and the coolant is at a moderate level, with a moderate heat exchange, sufficient for the motherboard's normal heat dissipation needs. The third liquid level represents the lowest coolant level, where the contact area between the refrigerant pipes and the coolant is the smallest, with the weakest heat exchange, suitable for scenarios where the motherboard generates little heat or has low heat dissipation requirements.

[0090] Temperature change rate dynamically reflects the motherboard's heat generation or dissipation trend. Compared to static operating temperature, it can better predict changes in heat dissipation needs in advance, avoiding lag in regulation. Furthermore, the coolant level is positively correlated with the contact area of ​​the refrigerant piping; a higher level results in a larger contact area, stronger heat exchange, and more significant heat dissipation. By comparing the temperature change rate with different preset thresholds and matching the corresponding coolant level, precise adaptation between heat dissipation intensity and the motherboard's dynamic heat dissipation needs can be achieved, preventing both overheating and excessive heat dissipation.

[0091] When the temperature change rate reaches or exceeds the first preset temperature change rate, it indicates that the motherboard temperature is rising rapidly. If heat dissipation is not enhanced in time, motherboard components may fail due to high temperature. The first liquid level corresponds to the largest contact area and the strongest heat exchange capacity, which can quickly absorb the coolant's cold energy and transfer it to the motherboard, achieving efficient cooling. When the temperature change rate is lower than the second preset temperature change rate, the motherboard temperature tends to stabilize or slowly decrease, and the heat generation is significantly reduced. The minimum contact area corresponding to the third liquid level can significantly reduce the heat exchange capacity, preventing the coolant from absorbing too much cold energy and causing the temperature to drop too low, thereby preventing condensation on the motherboard surface and reducing unnecessary operating losses of drive components. When the temperature change rate is between the two preset values, the motherboard temperature is in a stable state, with no risk of rapid overheating and no need to reduce heat dissipation to the minimum level. The medium contact area corresponding to the second liquid level can provide a moderate heat exchange capacity, maintaining the motherboard temperature within a safe range and avoiding temperature fluctuations caused by excessive or insufficient heat dissipation.

[0092] Specifically, when the system determines that the temperature change rate is greater than or equal to a first preset temperature change rate, it sends a command to the drive component. The drive component, by changing the gas volume in the upper part of the chamber, uses the principle of communicating vessels to cause the coolant to flow towards the chamber closer to the motherboard until the coolant reaches the first level. At this point, the refrigerant pipes are in full contact with the coolant, maximizing heat exchange efficiency and quickly removing excess heat from the motherboard. When the system determines that the temperature change rate is less than a second preset temperature change rate, it controls the drive component to drive the coolant to flow towards the chamber farther from the motherboard until the level drops to the third level. At this point, the refrigerant pipes are only in contact with a small amount of coolant, reducing heat exchange, and the motherboard temperature remains stable through natural heat dissipation and a small amount of active heat dissipation. When the system determines that the temperature change rate is between the two preset values, it controls the drive component to adjust the coolant level to the second level, maintaining a moderate contact area between the refrigerant pipes and the coolant. At this point, the heat exchange rate matches the motherboard's heating rate, achieving a dynamically balanced heat dissipation effect.

[0093] In some embodiments, the control unit 104 controls the drive assembly to adjust the coolant level based on the ambient temperature, including: determining the magnitude of the ambient temperature; if the ambient temperature is greater than or equal to a second preset temperature, controlling the drive assembly to drive the coolant level to a fourth level; if the ambient temperature is less than the second preset temperature, controlling the drive assembly to drive the coolant level to a fifth level; the fourth level > the fifth level.

[0094] The second preset temperature is the ambient temperature threshold. Its value needs to be determined comprehensively based on the motherboard's natural heat dissipation efficiency, the climate conditions of the area where it is used, and the dew point temperature. It is used to define the heat dissipation control strategy under different ambient temperatures. The fourth liquid level is the basic liquid level of the coolant. At this point, the refrigerant pipes maintain a certain contact area with the coolant, providing basic heat exchange and meeting the basic heat dissipation needs of the motherboard under low load operation, preventing the motherboard temperature from slowly accumulating and rising. The fifth liquid level is the lowest liquid level of the coolant. The contact area between the refrigerant pipes and the coolant is the smallest (or non-contact), and the heat exchange is the weakest (or non-existent). This is used in scenarios with low ambient temperatures and good natural heat dissipation, to avoid excessive heat dissipation.

[0095] When the ambient temperature reaches or exceeds the second preset temperature, natural heat dissipation is poor. Even if the motherboard operating temperature is low, the temperature may slowly rise due to continuous heat accumulation. The basic contact area corresponding to the fourth liquid level provides sufficient heat exchange to maintain the motherboard temperature within a safe range, preventing the temperature from gradually climbing to a critical value. When the ambient temperature is below the second preset temperature, natural heat dissipation is effective, and the small amount of heat generated by the motherboard can be quickly dissipated through the air without the need for additional active cooling. The minimum contact area corresponding to the fifth liquid level significantly reduces heat exchange, preventing the coolant from absorbing too much cold energy and causing the temperature to drop too low. This prevents condensation from forming on the motherboard surface due to contact with the low-temperature coolant, protecting the circuit board and components.

[0096] Specifically, when the system determines that the ambient temperature is ≥ the second preset temperature, it sends a control command to the drive component. The drive component adjusts the gas volume in the upper part of the chamber, using the principle of communicating vessels to cause the coolant to flow towards the chamber closer to the motherboard until the liquid level reaches the fourth level. At this time, the refrigerant pipes maintain basic contact with the coolant, and the heat exchange rate matches the low-load heating rate of the motherboard, achieving basic heat dissipation. When the system determines that the ambient temperature is < the second preset temperature, it controls the drive component to move the coolant towards the chamber farther from the motherboard until the liquid level drops to the fifth level. At this time, the refrigerant pipes have only a small amount of contact with the coolant (or no contact at all), the heat exchange rate is minimized, and the motherboard mainly relies on natural heat dissipation to maintain temperature stability, while avoiding the risk of condensation.

[0097] In some embodiments, the drive assembly includes a power element and an actuator. The power element provides power output, such as... Figure 4 The motor 6 in the middle. The actuator receives energy transmitted from the power component and converts it into mechanical displacement. Through its own movement, it changes the internal environment of the chamber, indirectly regulating the coolant level, such as... Figure 4 Piston 8 in the middle.

[0098] In some embodiments, the control unit 104 controls the drive assembly to adjust the coolant level, including: controlling the power component to drive the actuator to move along the height direction of the chamber, changing the volume of gas in the upper part of the chamber, and adjusting the coolant level in each chamber using the principle of communicating vessels.

[0099] Moving along the height of the chamber is the most direct and efficient way to change the gas volume in the upper part of the chamber. Displacement in this direction maximizes the use of chamber space, achieving a significant change in gas volume, and thus generating a sufficient pressure difference to drive coolant flow. The application of the communicating vessel principle ensures smooth and controllable coolant flow between chambers, avoiding drastic fluctuations in heat exchange caused by sudden changes in liquid level. This guarantees the stability of heat dissipation, reduces the load on drive components, and extends their service life. Furthermore, this control method requires no complex piping modifications or multiple power sources; liquid level regulation can be achieved through displacement in only one direction, simplifying the control logic and system structure.

[0100] Specifically, the system sends action commands to the power components of the drive assembly based on the judgment results of the motherboard operating temperature, ambient temperature, or temperature change rate. After receiving the command, the power components start and output power to drive the actuators to move along the height direction of the chamber (up or down). The movement of the actuators directly changes the gas containment space in the upper part of the chamber, causing the gas volume in the upper part of the chamber to increase or decrease. The change in gas volume causes a corresponding change in gas pressure in the chamber (the pressure increases when the volume decreases, and the pressure decreases when the volume increases). Since the chambers are connected by holes in the partition, the pressure difference drives the coolant to flow from the chamber with high pressure to the chamber with low pressure. During the flow of coolant, the liquid level in each chamber gradually rebalances, eventually forming a new liquid level distribution, realizing the adjustment of the contact area between the refrigerant pipeline and the coolant, and thus completing the regulation of heat exchange.

[0101] This solution achieves on-demand heat dissipation control of the mainboard by collecting data on the mainboard operating temperature and ambient temperature, combined with the correlation between coolant level and refrigerant piping contact area. This effectively solves the problem of insufficient mainboard heat dissipation under extreme high temperature and high load conditions, while avoiding the risk of condensation caused by excessive heat dissipation. It also reduces component wear caused by frequent system adjustments, significantly improves the stability and reliability of the air conditioner mainboard, and extends the service life of the air conditioner.

[0102] Since the processing and functions implemented by the device in this embodiment are basically the same as the embodiments, principles and examples of the aforementioned methods, any details not covered in the description of this embodiment can be found in the relevant descriptions in the aforementioned embodiments, and will not be repeated here.

[0103] By employing the technical solution of this invention, the cooling capacity of the refrigerant after throttling is extracted through indirect cooling. With the help of a motherboard heatsink structure with a double-hole baffle and an adjustable liquid level via a drive component, combined with the coordinated control of the motherboard operating temperature and the ambient temperature, the sufficiency of motherboard heat dissipation under extreme high temperature, high load, and excessive throttling conditions is improved, thus enhancing the stability of motherboard operation and avoiding the risk of condensation caused by low refrigerant temperature and component damage caused by frequent system adjustments.

[0104] According to an embodiment of the present invention, an air conditioner corresponding to an air conditioner control device is also provided. This air conditioner may include the air conditioner control device described above.

[0105] Since the processing and functions implemented by the air conditioner in this embodiment are basically the same as the embodiments, principles and examples of the aforementioned device, any details not covered in the description of this embodiment can be found in the relevant descriptions in the aforementioned embodiments, and will not be repeated here.

[0106] By employing the technical solution of this invention, the cooling capacity of the refrigerant after throttling is extracted through indirect cooling. With the help of a motherboard heatsink structure with a double-hole baffle and an adjustable liquid level via a drive component, combined with the coordinated control of the motherboard operating temperature and the ambient temperature, the sufficiency of motherboard heat dissipation under extreme high temperature, high load, and excessive throttling conditions is improved, thus enhancing the stability of motherboard operation and avoiding the risk of condensation caused by low refrigerant temperature and component damage caused by frequent system adjustments.

[0107] According to an embodiment of the present invention, a storage medium corresponding to an air conditioner control method is also provided, the storage medium including a stored program, wherein the program controls the device where the storage medium is located to execute the air conditioner control method described above when it is executed.

[0108] Since the processing and functions implemented by the storage medium in this embodiment are basically the same as the embodiments, principles and examples of the aforementioned methods, any details not covered in this embodiment can be found in the relevant descriptions in the aforementioned embodiments, and will not be repeated here.

[0109] By employing the technical solution of this invention, the cooling capacity of the refrigerant after throttling is extracted through indirect cooling. With the help of a motherboard heatsink structure with a double-hole baffle and an adjustable liquid level via a drive component, combined with the coordinated control of the motherboard operating temperature and the ambient temperature, the sufficiency of motherboard heat dissipation under extreme high temperature, high load, and excessive throttling conditions is improved, thus enhancing the stability of motherboard operation and avoiding the risk of condensation caused by low refrigerant temperature and component damage caused by frequent system adjustments.

[0110] According to an embodiment of the present invention, a computer program product corresponding to the control method for an air conditioner is also provided. The computer program product includes a computer program that, when processed and executed, implements the steps of the control method for the air conditioner described above.

[0111] Since the processing and functions implemented by the computer program product in this embodiment are basically corresponding to the embodiments, principles and examples of the aforementioned methods, any details not covered in the description of this embodiment can be found in the relevant descriptions in the aforementioned embodiments, and will not be repeated here.

[0112] By employing the technical solution of this invention, the cooling capacity of the refrigerant after throttling is extracted through indirect cooling. With the help of a motherboard heatsink structure with a double-hole baffle and an adjustable liquid level via a drive component, combined with the coordinated control of the motherboard operating temperature and the ambient temperature, the sufficiency of motherboard heat dissipation under extreme high temperature, high load, and excessive throttling conditions is improved, thus enhancing the stability of motherboard operation and avoiding the risk of condensation caused by low refrigerant temperature and component damage caused by frequent system adjustments.

[0113] In summary, it is readily understood by those skilled in the art that, without conflict, the aforementioned advantageous methods can be freely combined and superimposed.

[0114] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A method for controlling an air conditioner, characterized in that, The air conditioner includes a throttling component, a main board, and a main board heat sink for dissipating heat from the main board. The main board heat sink contains a partition, coolant, and a drive component. The partition has an upper hole for gas flow and a lower hole for liquid flow. The partition divides the main board heat sink into at least two chambers, with the coolant contained in the lower part of each chamber and gas in the upper part. The refrigerant after being throttled by the throttling component can contact the coolant through the pipeline; the driving component can drive the change of the coolant level to change the contact area between the pipeline and the coolant, and the coolant level is positively correlated with the contact area between the pipeline and the coolant. The method includes: During the operation of the air conditioner, the operating temperature of the mainboard and the ambient temperature of the environment in which the mainboard is located are obtained; The drive component is controlled to operate according to the operating temperature and the ambient temperature to adjust the coolant level, thereby changing the contact area between the pipeline and the coolant and regulating the heat exchange between the refrigerant and the coolant.

2. The air conditioning control method according to claim 1, characterized in that, The throttling assembly includes a first throttling assembly and a second throttling assembly. The air conditioner also includes an outdoor heat exchanger, the first throttling assembly, the second throttling assembly, and an indoor heat exchanger connected in series. The pipeline between the first throttling assembly and the second throttling assembly is in contact with the coolant. The method further includes: If the air conditioner is operating in cooling mode, the first throttling component is controlled to be in a throttling state and the second throttling component is controlled to be in a fully open state, so that the refrigerant after being throttled by the first throttling component can continuously contact the coolant through the pipeline; If the air conditioner is operating in heating mode, the second throttling component is controlled to be in a throttling state and the first throttling component is in a fully open state, so that the refrigerant after being throttled by the second throttling component continues to be in contact with the coolant through the pipeline.

3. The air conditioning control method according to claim 1, characterized in that, Controlling the operation of the drive component based on the operating temperature and the ambient temperature to adjust the coolant level includes: Determine the magnitude of the operating temperature; If the operating temperature is greater than or equal to the first preset temperature, the temperature change rate of the operating temperature is calculated, and the drive component is controlled to adjust the coolant level based on the temperature change rate. If the operating temperature is lower than the first preset temperature, the drive component is controlled to adjust the coolant level according to the ambient temperature.

4. The air conditioning control method according to claim 3, characterized in that, Controlling the drive component to adjust the coolant level based on the temperature change rate includes: Determine the magnitude of the temperature change rate; If the temperature change rate is greater than or equal to the first preset temperature change rate, then the drive component is controlled to drive the coolant level to the first level. If the temperature change rate is less than the first preset temperature change rate and greater than or equal to the second preset temperature change rate, then the drive component is controlled to drive the coolant level to the second level. If the temperature change rate is less than the second preset temperature change rate, then the drive component is controlled to drive the coolant level to the third level; first level > second level > third level.

5. The air conditioning control method according to claim 3, characterized in that, Controlling the operation of the drive component based on the ambient temperature to adjust the coolant level includes: Determine the magnitude of the ambient temperature; If the ambient temperature is greater than or equal to the second preset temperature, the drive assembly is controlled to drive the coolant level to the fourth level. If the ambient temperature is lower than the second preset temperature, the drive component is controlled to drive the coolant level to the fifth level; the fourth level > the fifth level.

6. The air conditioning control method according to any one of claims 1 to 5, characterized in that, The drive assembly includes a power component and an actuator; Controlling the drive assembly to adjust the coolant level includes: The power unit is controlled to drive the actuator to move along the height direction of the chamber, changing the volume of gas in the upper part of the chamber, and adjusting the liquid level of coolant in each chamber by using the principle of communicating vessels.

7. A control device for an air conditioner, characterized in that, The air conditioner includes a throttling component, a main board, and a main board heat sink for dissipating heat from the main board. The main board heat sink contains a partition, coolant, and a drive component. The partition has an upper hole for gas flow and a lower hole for liquid flow. The partition divides the main board heat sink into at least two chambers, with the coolant contained in the lower part of each chamber and gas in the upper part. The refrigerant after being throttled by the throttling component can contact the coolant through the pipeline; the driving component can drive the change of the coolant level to change the contact area between the pipeline and the coolant, and the coolant level is positively correlated with the contact area between the pipeline and the coolant. The device includes: The acquisition unit is configured to acquire the operating temperature of the motherboard and the ambient temperature of the environment in which the motherboard is located during the operation of the air conditioner. The control unit is configured to control the operation of the drive component based on the operating temperature and the ambient temperature to adjust the coolant level, thereby changing the contact area between the pipeline and the coolant and regulating the heat exchange between the refrigerant and the coolant.

8. An air conditioner, characterized in that, include: The air conditioning control device as described in claim 7.

9. A storage medium, characterized in that, The storage medium includes a stored program, wherein, when the program is executed, it controls the device containing the storage medium to perform the air conditioning control method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the air conditioning control method according to any one of claims 1 to 6.

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