Quartz wafer size measuring device and method

Abstract

The invention discloses a device and method for measuring the size of a quartz wafer, and relates to the technical field of size measurement of the quartz wafer to be measured, the device comprises a base, a light shield arranged on the base and capable of forming a measurement cavity with the base, a light emitting structure arranged on the base, an image acquisition structure arranged in the light shield and correspondingly arranged above the light emitting structure, and a clamping structure arranged on the base, the clamping structure is arranged on the base and arranged between the light-emitting structure and the image acquisition structure, a quartz wafer to be detected is clamped on the clamping structure, and the rotating structure is arranged between the clamping structure and the base; the clamping structure comprises two symmetrically arranged main clamping assemblies, a to-be-tested quartz wafer is clamped between the two main clamping assemblies, a rotating structure is arranged between the main clamping assemblies and the base, and the to-be-tested quartz wafer is arranged between the two auxiliary clamping assemblies; through the clamping structure and the rotating structure, stable clamping of the to-be-measured quartz wafer during measurement can be realized, and multi-dimensional measurement can be realized, so that the measurement precision is improved.

Description

Technical Field

[0001] This invention relates to the field of quartz wafer size measurement technology, specifically to a quartz wafer size measurement device and method. Background Technology

[0002] As the core component of piezoelectric elements, the geometrical accuracy of the quartz crystal directly determines key performance parameters such as the device's resonant frequency and filtering bandwidth. With the miniaturization and high-frequency development of electronic devices, the dimensional tolerance requirements for quartz crystals are becoming increasingly stringent.

[0003] However, existing devices mostly use a single mechanical clamp, which has low clamping force control precision. This can easily cause micro-deformation of thin quartz wafers under test, or cause cracking due to edge stress concentration. At the same time, they can only achieve single-angle measurement, and cannot eliminate measurement deviations caused by edge tilting or chamfer asymmetry of the quartz wafers under test, thus failing to meet the requirements for high-precision measurement. Summary of the Invention The purpose of this invention is to provide a quartz wafer size measuring device and method. Through the clamping structure and the rotating structure, the quartz wafer to be measured can be stably clamped during measurement and multi-dimensional measurement can be achieved, thereby improving the measurement accuracy.

[0004] The above-mentioned optimized structure of the present invention is achieved through the following technical solution: a device for measuring the size of a quartz wafer to be measured, including a base; A light shield is provided on the base and can form a measuring cavity with the base; A light-emitting structure, wherein the light-emitting structure is disposed on the base; An image acquisition structure is disposed inside the light shield and correspondingly positioned above the light-emitting structure; A clamping structure is provided on the base and between the light-emitting structure and the image acquisition structure, and the clamping structure holds the quartz wafer to be tested. It also includes a rotating structure, which is disposed between the clamping structure and the base; The clamping structure includes two symmetrically arranged main clamping components, with the quartz wafer to be tested clamped between the two main clamping components, and the rotating structure is provided between the main clamping components and the base; Two auxiliary clamping components are provided, with the quartz wafer to be tested disposed between the two auxiliary clamping components, and the axis of symmetry between the two auxiliary clamping components is perpendicular to the axis of symmetry between the two main clamping components.

[0005] In some embodiments, the main clamping assembly includes a main drive cylinder, which is connected to the rotating structure; The main clamping block is connected to the output shaft of the main drive cylinder and presses against the quartz wafer to be tested. A negative pressure groove is located in the middle of the main clamping block and is connected to an external vacuum system.

[0006] In some embodiments, the auxiliary clamping assembly includes an auxiliary drive cylinder, which is connected to the base; An auxiliary clamping block is connected to the output shaft of the auxiliary drive cylinder, and the side of the auxiliary clamping block facing the quartz wafer to be tested has an arc surface.

[0007] In some embodiments, the rotating structure includes a rotating motor, which is mounted on the base; A rotating block, which is coaxially connected to the output shaft of the rotating motor; The mounting slot is located on the side of the rotating block near the quartz wafer to be tested, and the main clamping assembly is provided in the mounting slot.

[0008] In some embodiments, the base includes a base plate; A movable structure, wherein the movable structure is disposed on the base plate; A sliding block, wherein the sliding block is disposed on the movable structure; A measuring groove is provided on the top of the sliding block, and the measuring groove is provided with the light-emitting structure, the clamping structure, and the rotating structure; Two support plates are symmetrically arranged on both sides of the base plate; A lifting structure is provided between the two support plates, and the lifting structure is provided with the light shield.

[0009] In some embodiments, the movable structure includes two movable slide rails, which are symmetrically arranged on the base plate, and the sliding block is slidably provided on the two movable slide rails; A movable motor is located on the side of the base plate away from the support plate. A lead screw, one end of which is rotatably connected to the base plate, and the other end of which is connected to the output shaft of the moving motor. The lead screw passes through the sliding block and is screwed into the sliding block.

[0010] In some embodiments, the lifting structure includes a fixing plate disposed on top of the two support plates; Two lifting slide rails are respectively vertically arranged on one side of the two support plates that are close to each other; A lifting block, which is slidably mounted on two lifting slide rails, and the bottom of the lifting block is provided with the light shield; A lifting cylinder is located at the bottom of the fixed plate and connected to the lifting block.

[0011] In some embodiments, a light-shielding structure is further included, the light-shielding structure including a plurality of first light-shielding rings, the plurality of first light-shielding rings being equally spaced at the bottom of the light-shielding cover; Multiple second light-shielding rings are equally spaced on the base, and the second light-shielding rings are inserted into the gap between two adjacent first light-shielding rings.

[0012] In some embodiments, both the first light-shielding ring and the second light-shielding ring are wrapped with light-absorbing cotton.

[0013] A quartz wafer size measuring device and method, comprising the following steps: Step S1: The quartz wafer to be tested is fixed in the measurement cavity by the two main clamping components and the two auxiliary clamping components; Step S2: The light-emitting structure operates, emitting light to project the quartz crystal wafer under test onto the image acquisition structure. The image acquisition structure operates, transmitting the acquired image data back to the external processing system to complete the initial data acquisition. Step S3: The light-emitting structure stops working, the two auxiliary clamping components release the clamping state of the quartz wafer to be tested, the rotating structure works, rotates the quartz wafer to be tested by 180°, and the two auxiliary clamping components work to maintain the clamping state of the quartz wafer to be tested. Step S4: The light-emitting structure operates, emitting light to project the quartz crystal wafer under test onto the image acquisition structure. The image acquisition structure operates, transmitting the acquired image data back to the external processing system to complete the secondary data acquisition. Step S5: The external processing system processes the data collected twice to obtain the size data of the quartz wafer to be tested.

[0014] The above-described technical solutions in the embodiments of the present invention have at least the following technical effects or advantages: (1) The present invention can measure both sides of the quartz crystal wafer to be tested by means of a rotating structure. By collecting the size data of the front and back sides of the quartz crystal wafer to be tested, the measurement deviation caused by edge tilting and chamfer asymmetry can be effectively eliminated, the measurement accuracy can be improved, and thus the high precision measurement requirements can be met.

[0015] (2) The present invention uses a main clamping component that combines mechanical clamping and vacuum adsorption, and an auxiliary clamping component that makes flexible contact, to ensure sufficient clamping force while avoiding the quartz wafer under test from cracking or deforming due to stress concentration.

[0016] (3) The present invention forms a labyrinthine multi-layer light-shielding structure by interlocking multiple first light-shielding rings and multiple second light-shielding rings, and uses light-absorbing cotton to wrap the first light-shielding rings and multiple second light-shielding rings to reduce the transmittance of external stray light, improve the stability of the light environment inside the measurement cavity, reduce the fluctuation of image contrast, and ensure consistent imaging quality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a top view of the present invention; Figure 3 For the present invention Figure 2 Sectional view along the middle AA direction; Figure 4 For the present invention Figure 3 Enlarged view of point B in the middle; Figure 5 This is a schematic diagram of the cross-sectional structure of the clamping structure and rotating structure of the present invention on the sliding block; Figure 6 For the present invention Figure 5 Enlarged view of point C in the middle; Figure 7 For the present invention Figure 5 Enlarged view of point D in the middle.

[0019] In the diagram: 1. Base; 11. Base plate; 12. Moving structure; 121. Moving slide rail; 122. Moving motor; 123. Lead screw; 13. Sliding block; 14. Measuring groove; 15. Support plate; 16. Lifting structure; 161. Fixed plate; 162. Lifting slide rail; 163. Lifting block; 164. Lifting cylinder; 2. Light shield; 3. Light-emitting structure; 4. Image acquisition structure; 5. Clamping structure; 51. Main drive cylinder; 52. Main clamping block; 53. Negative pressure groove; 54. Auxiliary drive cylinder; 55. Auxiliary clamping block; 6. Rotating structure; 61. Rotating motor; 62. Rotating block; 63. Mounting groove; 7. Measuring cavity; 8. Light shielding structure; 81. First light shielding ring; 82. Second light shielding ring. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] refer to Figure 1-7A device for measuring the dimensions of a quartz wafer under test includes a base 1, a light shield 2, a light-emitting structure 3, an image acquisition structure 4, a clamping structure 5, and a rotating structure 6. These components work together to achieve high-precision dimensional measurement of the quartz wafer. The base 1 serves as the supporting foundation for the device, providing a stable mounting reference for each functional component. The light shield 2, located above the base 1, can be made of a light-shielding material. When the light shield 2 is fastened onto the base 1, it forms a measuring cavity 7. The inner wall of the measuring cavity 7 can be coated with a black matte finish to block stray light from entering and ensure a stable optical measurement environment. Qualitatively, the light-emitting structure 3 is fixedly installed in the measurement area of ​​the base 1, which can emit uniform light and project the outline of the quartz wafer to be measured onto the image acquisition structure 4, providing illumination conditions for size detection. The light-emitting structure 3 may include an LED light source, a diffuser plate, and a focusing lens. The LED light source can be a white surface-mount LED array, and the diffuser plate can be made of frosted glass, which can convert the point light source of the LED light source into a surface light source, reducing the glare caused by direct light. The focusing lens is located above the diffuser plate and can adjust the light convergence angle to ensure high illumination uniformity on the surface of the quartz wafer to be measured. The image acquisition structure 4 is installed inside the light shield 2 and is positioned vertically and vertically corresponding to the light-emitting structure 3. The image acquisition structure 4 may include an industrial camera, a microscope lens, and an image transmission module. The industrial camera may be a CMOS area array camera to ensure clear acquisition of image details. The microscope lens may be a fixed-focus microscope lens to magnify the image of the quartz wafer under test and image it onto the photosensitive chip of the industrial camera. The image transmission module may use a GigE interface to transmit the acquired image data back to an external processing system (such as an industrial computer) in real time. The image acquisition structure 4 can accurately capture the projected image of the quartz wafer under test projected by the light-emitting structure 3 and transmit the image data to the external processing system. The clamping structure 5 is located on the base 1 and on the measurement path between the light-emitting structure 3 and the image acquisition structure 4. It can stably clamp and position the quartz wafer under test to ensure that the position of the quartz wafer under test is fixed and does not shift during the measurement process. The rotating structure 6 is connected between the clamping structure 5 and the base 1 and can drive the clamping structure 5 to rotate the quartz wafer under test around the central axis to realize multi-directional measurement of the quartz wafer under test, eliminate single-angle measurement deviation, and improve measurement accuracy.

[0025] The clamping structure 5 includes two symmetrically arranged main clamping components and two symmetrically arranged auxiliary clamping components. The two main clamping components are distributed relative to each other in the horizontal direction. The quartz wafer to be tested is clamped between the two main clamping components, and each main clamping component is connected to the rotating structure 6 to ensure that the rotating structure 6 can synchronously drive the two main clamping components and the quartz wafer to be tested to rotate. The two auxiliary clamping components are distributed relative to each other in a direction perpendicular to the axis of symmetry of the main clamping components. The quartz wafer to be tested is also clamped between the two auxiliary clamping components. Through the orthogonal clamping of the main and auxiliary clamping components, the quartz wafer to be tested is fixed in all directions to ensure the stability of the measurement process.

[0026] In some embodiments, the main clamping assembly includes a main drive cylinder 51, a main clamping block 52, and a negative pressure groove 53. The main drive cylinder 51 is the power source of the main clamping assembly. Its cylinder body is fixedly connected to the rotating structure 6. It can drive the main clamping block 52 to move closer to or away from the quartz wafer under test through the extension and retraction of the output shaft. The main clamping block 52 can be made of a flexible and wear-resistant material. One end of it is fixedly connected to the output shaft of the main drive cylinder 51. When the main drive cylinder 51 drives the output shaft to extend, the main clamping block 52 can be smoothly pressed against the surface of the quartz wafer under test, avoiding hard contact that could damage the quartz wafer under test. The negative pressure groove 53 is located in the middle of the side of the main clamping block 52 facing the quartz wafer under test, and is connected to an external vacuum system through an air pipe. When the main clamping block 52 is pressed onto the surface of the quartz wafer to be tested, the external vacuum system is activated, and a negative pressure is formed in the negative pressure groove 53, generating an adsorption force to assist in clamping the quartz wafer to be tested, further improving the clamping stability, while reducing the mechanical clamping force and reducing the risk of deformation of the quartz wafer to be tested.

[0027] By combining the mechanical clamping of the main drive cylinder 51 with the vacuum adsorption of the negative pressure groove 53, it is possible to ensure that the quartz wafer under test does not shift during the measurement process, and to avoid damage to the quartz wafer under test due to excessive clamping force, so as to meet the clamping requirements of thin and brittle quartz wafers under test.

[0028] In some embodiments, the auxiliary clamping assembly includes an auxiliary drive cylinder 54 and an auxiliary clamping block 55. The cylinder body of the auxiliary drive cylinder 54 is directly fixedly connected to the base 1, and its output shaft is set towards the quartz wafer to be tested. It can drive the auxiliary clamping block 55 to perform telescopic movements. The auxiliary clamping block 55 is fixedly connected to the output shaft of the auxiliary drive cylinder 54, and its side facing the quartz wafer to be tested is designed with an arc surface structure. When the auxiliary drive cylinder 54 drives the auxiliary clamping block 55 to approach the quartz wafer to be tested, the arc surface can form a surface contact with the edge of the quartz wafer to be tested, increasing the contact area while avoiding edge stress concentration and preventing the edge of the quartz wafer to be tested from cracking.

[0029] Since the axes of symmetry of the auxiliary clamping component and the main clamping component are perpendicular to each other, the auxiliary clamping component can fix the quartz wafer under test in a secondary manner from a direction perpendicular to the main clamping component, effectively restricting the rotational freedom of the quartz wafer under test on the horizontal plane. Together with the main clamping component, it forms a cross-shaped clamping, further improving the clamping stability.

[0030] In some embodiments, force sensors can be provided between the main drive cylinder 51 and the main clamping block 52, and between the auxiliary drive cylinder 54 and the auxiliary clamping block 55, to detect the magnitude of the force between the main drive cylinder 51 and the main clamping block 52, and between the auxiliary drive cylinder 54 and the auxiliary clamping block 55, thereby achieving precise control of the force and avoiding clamping failure due to insufficient clamping force or damage to the quartz wafer due to excessive clamping force.

[0031] In some embodiments, the rotating structure 6 includes a rotating motor 61, a rotating block 62, and a mounting groove 63. The rotating motor 61 can be a stepper motor, whose body is fixedly mounted on the base 1 and can be fixedly connected by a bracket or bolts. The output shaft of the rotating motor 61 is arranged in the vertical direction, which can provide stable rotational power and the rotation angle can be precisely controlled. The rotating block 62 can be a rigid cylindrical structure with a groove. The bottom center of the rotating block 62 is coaxially fixedly connected to the output shaft of the rotating motor 61. When the rotating motor 61 is started, it can drive the rotating block 62 to rotate synchronously around the output shaft axis. The mounting groove 63 is opened on the top of the rotating block 62 near the side of the quartz wafer to be tested. The size of the mounting groove 63 matches the cylinder body of the main drive cylinder 51 of the main clamping assembly. The bottom of the main drive cylinder 51 is embedded and fixed in the mounting groove 63 to ensure that the rotating block 62 can synchronously drive the main clamping assembly and the quartz wafer to be tested to rotate when rotating.

[0032] When it is necessary to adjust the measurement angle of the quartz wafer under test, the rotating motor 61 drives the rotating block 62 to rotate, which in turn drives the main clamping assembly and the quartz wafer under test to rotate around the vertical axis through the mounting slot 63. The rotation angle can be set according to the measurement requirements (such as 180°), and the position of the central axis of the quartz wafer under test remains unchanged during the rotation, so as to avoid the measurement reference shift caused by the rotation.

[0033] In some embodiments, the base 1 includes a base plate 11, a movable structure 12, a sliding block 13, a measuring groove 14, a support plate 15, and a lifting structure 16. The base plate 11 may be made of high-rigidity cast iron, serving as the basic frame of the entire base 1 and ensuring the overall stability of the device. The movable structure 12 is located on top of the base plate 11 and can drive the sliding block 13 to move horizontally. The sliding block 13 is a movable carrier and may be made of aluminum alloy. Its bottom is connected to the movable structure 12. The measuring groove 14 is a recessed structure formed on the top of the sliding block 13, and a light-emitting structure is provided inside the measuring groove 14. 3. The clamping structure 5 and the rotating structure 6 can fix the quartz wafer to be tested in the measuring groove 14. The bottom of the measuring groove 14 is equipped with a light-emitting structure 3 to ensure that light can penetrate the measuring groove 14 to illuminate the quartz wafer to be tested. The support plate 15 can be a vertically set rigid plate. The support plate 15 can be formed by welding steel plates. The two support plates 15 are symmetrically fixed on both sides of the base plate 11 to form the mounting bracket of the lifting structure 16. The lifting structure 16 spans between the two support plates 15. Its bottom is connected to the light shield 2, which can drive the light shield 2 to achieve vertical lifting and control the opening and closing of the measuring cavity 7.

[0034] The base plate 11 provides a stable foundation, the moving structure 12 drives the sliding block 13 to adjust the position of the quartz wafer to be tested, the support plate 15 supports the lifting structure 16 to control the lifting of the light shield 2, and the components work together to realize the automated feeding of the quartz wafer to be tested and the sealing control of the measuring cavity 7.

[0035] In some embodiments, the movable structure 12 includes two movable slide rails 121, a movable motor 122, and a lead screw 123. The movable slide rails 121 can be high-precision linear slide rails. The two movable slide rails 121 are symmetrically fixed on the top of the base plate 11 in the horizontal direction and are distributed in parallel to provide sliding guidance for the sliding block 13. The movable motor 122 can be a servo motor and is fixed on the side of the base plate 11 away from the support plate 15. The output shaft is arranged along the length direction of the movable slide rail 121. The lead screw 123 can be a high-precision ball screw. One end of the lead screw is rotatably connected to the base plate 11 through a bearing, and the other end is fixedly connected to the output shaft of the movable motor 122 through a coupling. The lead screw 123 passes through the sliding block 13 in the horizontal direction and is screwed into the threaded hole inside the sliding block 13.

[0036] When it is necessary to move the sliding block 13, the moving motor 122 drives the lead screw 123 to rotate. Through the screw connection between the lead screw 123 and the sliding block 13, the rotational motion is converted into the linear motion of the sliding block 13 along the moving slide rail 121. Due to the high precision characteristics of the servo motor and the ball screw, the positioning accuracy of the sliding block 13 can be controlled at the micron level, ensuring that the quartz crystal under test can be accurately moved to the measurement position in the measurement cavity 7.

[0037] In some embodiments, the lifting structure 16 includes a fixed plate 161, two lifting slide rails 162, a lifting block 163, and a lifting cylinder 164. The fixed plate 161 can be a horizontally arranged rigid plate, fixedly connected to the top of two support plates 15 to form the top frame of the lifting structure 16. The lifting slide rails 162 can be vertical linear slide rails. The two lifting slide rails 162 are respectively vertically fixed on the side of the two support plates 15 that are close to each other and are distributed in parallel. The lifting block 163 can be a vertically arranged block structure. The lifting block 163 can be made of aluminum alloy. Its two sides are respectively slidably connected to the two lifting slide rails 162, and can be vertically lifted along the lifting slide rails 162. The bottom of the lifting block 163 is fixedly connected to the top of the light shield 2. The lifting cylinder 164 can be a thin cylinder. The cylinder body of the lifting cylinder 164 is fixedly installed at the bottom of the fixed plate 161. The piston rod extends downward in the vertical direction, and the end of the piston rod is fixedly connected to the top of the lifting block 163.

[0038] The piston rod of the lifting cylinder 164 retracts, causing the lifting block 163 to slide upward along the lifting slide rail 162, thereby raising the light shield 2 and opening the measuring chamber 7. After the quartz crystal to be tested is fixed in the measuring slot 14, the piston rod of the lifting cylinder 164 extends, pushing the lifting block 163 and the light shield 2 downward until the light shield 2 is fastened to the base plate 11, forming a closed measuring chamber 7. The lifting slide rail 162 ensures that the light shield 2 maintains vertical movement during the lifting process, avoiding tilting that could lead to poor sealing.

[0039] In some embodiments, the device further includes a light-shielding structure 8, which can further enhance the light-shielding effect of the measuring cavity 7. The light-shielding structure 8 includes a plurality of first light-shielding rings 81 and a plurality of second light-shielding rings 82. Both the first light-shielding rings 81 and the second light-shielding rings 82 can be made of light-shielding metal. The plurality of first light-shielding rings 81 are fixedly and concentrically distributed at equal intervals along the vertical direction at the bottom edge of the light-shielding cover 2. The plurality of second light-shielding rings 82 are fixedly and concentrically distributed at equal intervals along the vertical direction at the top of the sliding block 13. The outer diameter of the second light-shielding ring 82 is smaller than the gap width between two adjacent first light-shielding rings 81. When the light-shielding cover 2 is fastened to the base plate 11, the second light-shielding ring 82 can be inserted into the gap between two adjacent first light-shielding rings 81 to form a labyrinth-like sealing structure, thereby extending the propagation path and meandering degree of light, increasing the difficulty of light propagation, and preventing external light from entering the measuring cavity 7, thereby avoiding the influence of stray light on the measurement results.

[0040] In some embodiments, the outer surfaces of both the first light-shielding ring 81 and the second light-shielding ring 82 are wrapped with light-absorbing cotton. The light-absorbing cotton can absorb a small amount of stray light entering the gap, further reducing the interference of stray light on the measurement. The light-absorbing cotton can be made of high-density polyester fiber with a light absorption rate of ≥98%, and the surface is treated with anti-static agents to prevent dust from adsorbing and affecting the light-shielding effect. The light-absorbing cotton can be glued to the surfaces of the first light-shielding ring 81 and the second light-shielding ring 82 with high-temperature resistant adhesive to ensure that all surfaces that may reflect light are covered with light-absorbing cotton, minimizing light reflection. Through the interlocking and cooperation between the multiple second light-shielding rings 82 and the multiple first light-shielding rings 81, and the synergistic effect of the light-absorbing cotton, the stray light transmittance of the measurement cavity 7 can be reduced, ensuring the stability of the optical measurement environment.

[0041] In some embodiments, the system may further include a PLC controller, a driver, a touch screen, and a data storage module. The PLC controller may be a Siemens S7-1200 series, which can receive signals from various sensors and control the coordinated operation of the moving motor 122, the lifting cylinder 164, the main drive cylinder 51, the auxiliary drive cylinder 54, the rotary motor 61, the light-emitting structure 3, and the image acquisition structure 4. The driver may include a servo driver, a stepper driver, and a cylinder solenoid valve, which are used to drive the moving motor 122, the rotary motor 61, and the cylinders. The touch screen may be located on the side of the base plate 11 for human-machine interaction, and can be used to set measurement parameters, start and stop measurement, and view measurement results. The data storage module can store measurement data and images, and can support data export through a USB interface and network transmission through an Ethernet interface.

[0042] A quartz wafer size measuring device and method, comprising the following steps: Step S1: Clamping and fixing the quartz wafer to be tested First, the lifting cylinder 164 of the lifting structure 16 retracts, causing the light shield 2 to rise and opening the measuring chamber 7. The moving structure 12 starts, and the moving motor 122 drives the lead screw 123 to rotate, causing the sliding block 13 to slide along the moving slide rail 121 to the loading position. The operator or automated feeding mechanism places the quartz wafer to be tested into the measuring groove 14 of the sliding block 13. The main drive cylinder 51 extends, driving the main clamping block 52 to press against the surface of the quartz wafer to be tested. After the pressure reaches the set value (e.g., 5-8N), it stops. The external vacuum system is activated, and a negative pressure is formed in the negative pressure groove 53 to adsorb the quartz wafer to be tested. At the same time, the auxiliary drive cylinder 54 extends, driving the arc surface of the auxiliary clamping block 55 to contact the edge of the quartz wafer to be tested, completing the auxiliary fixation. Finally, the quartz wafer to be tested is stably fixed in the measuring position in the measuring cavity 7. The moving structure 12 is activated again, which moves the sliding block 13 and the quartz crystal under test to directly below the measuring cavity 7. The lifting cylinder 164 extends and pushes the light shield 2 down, which engages with the sliding block 13 to form a closed measuring cavity 7. At this time, the second light shield 82 is inserted into the gap between the first light shield 81 to complete the light shielding and sealing.

[0043] Step S2: Initial Data Acquisition When the light-emitting structure 3 is activated, it emits uniform light. The light penetrates the measuring groove 14 and shines on the quartz crystal wafer under test, projecting the outline of the quartz crystal wafer under test onto the image acquisition structure 4 above. The industrial camera in image acquisition structure 4 is activated, capturing the projected image of the quartz crystal wafer under test with the help of a microscope lens. The image data is transmitted back to the external processing system (such as an industrial computer) in real time through the transmission module. The external processing system processes the image (such as grayscale conversion and noise reduction) to complete the initial data acquisition and storage.

[0044] Step S3: Rotation and secondary clamping of the quartz wafer under test The light-emitting structure 3 stops working and cuts off the lighting; the auxiliary drive cylinder 54 retracts, driving the auxiliary clamping block 55 away from the quartz crystal under test to avoid interference with the quartz crystal under test during rotation; the rotating motor 61 drives the rotating block 62 to rotate around the output shaft, and drives the main clamping assembly and the quartz crystal under test to rotate synchronously through the mounting slot 63. When the rotation angle reaches the set 180°, the rotating motor 61 stops, and the quartz crystal under test completes the angle adjustment; The auxiliary drive cylinder 54 extends again, causing the arc surface of the auxiliary clamping block 55 to contact the edge of the quartz wafer to be measured, restoring the auxiliary clamping state, keeping the quartz wafer to be measured stable and fixed, and preparing for the second measurement.

[0045] Step S4: Secondary Data Acquisition The light-emitting structure 3 is activated again, emitting uniform light. The light illuminates the quartz crystal under test after the angle has been adjusted, forming a new contour projection. Image acquisition structure 4 captures the projected image again and sends the secondary acquired image data back to the external processing system. The external processing system processes the secondary image to complete the secondary data acquisition and storage.

[0046] Step S5: Data Processing and Dimension Result Output The external processing system performs in-depth processing on the image data acquired twice. It can use edge detection algorithms (such as the Canny algorithm) to extract the edge contour of the quartz wafer under test in the two images, and combine the camera calibration parameters to convert the image pixel size into the actual physical size. Compare and merge the dimensional data (such as length, width, and chamfer radius) from the two measurements: calculate the average of the two data, eliminate possible deviations due to single-angle measurements, and remove abnormal data; The external processing system outputs the final size data of the quartz wafer under test and stores the data in the database. It supports display via touch screen or export via USB interface to complete the entire measurement process.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for measuring the size of a quartz wafer to be measured, comprising a base (1); A light shield (2) is provided on the base (1) and can form a measuring cavity (7) with the base (1). A light-emitting structure (3) is provided on the base (1); Image acquisition structure (4), the image acquisition structure (4) is disposed inside the light shield (2) and is correspondingly disposed above the light-emitting structure (3); The clamping structure (5) is disposed on the base (1) and between the light-emitting structure (3) and the image acquisition structure (4), and the clamping structure (5) holds the quartz wafer to be tested. Its features are: It also includes a rotating structure (6), which is disposed between the clamping structure (5) and the base (1); The clamping structure (5) includes two symmetrically arranged main clamping components, the quartz wafer to be tested is clamped between the two main clamping components, and the rotating structure (6) is provided between the main clamping components and the base (1). Two auxiliary clamping components are provided, with the quartz wafer to be tested disposed between the two auxiliary clamping components, and the axis of symmetry between the two auxiliary clamping components is perpendicular to the axis of symmetry between the two main clamping components.

2. The device for measuring the size of a quartz wafer according to claim 1, characterized in that: The main clamping assembly includes a main drive cylinder (51), which is connected to the rotating structure (6); Main clamping block (52), which is connected to the output shaft of the main drive cylinder (51) and presses against the quartz wafer to be tested; The negative pressure groove (53) is located in the middle of the main clamping block (52) and is connected to the external vacuum system.

3. The device for measuring the size of a quartz wafer according to claim 1, characterized in that: The auxiliary clamping assembly includes an auxiliary drive cylinder (54), which is connected to the base (1). An auxiliary clamping block (55) is connected to the output shaft of the auxiliary drive cylinder (54), and the side of the auxiliary clamping block (55) facing the quartz wafer to be tested is an arc surface.

4. The device for measuring the size of a quartz wafer according to claim 1, characterized in that: The rotating structure (6) includes a rotating motor (61), which is mounted on the base (1); Rotating block (62), the rotating block (62) is coaxially connected to the output shaft of the rotating motor (61); The mounting slot (63) is located on the side of the rotating block (62) near the quartz wafer to be tested, and the main clamping assembly is provided in the mounting slot (63).

5. The device for measuring the size of a quartz wafer according to claim 1, characterized in that: The base (1) includes a base plate (11); A movable structure (12) is provided on the base plate (11); A sliding block (13) is disposed on the movable structure (12); Measuring groove (14), the measuring groove (14) is located on the top of the sliding block (13), and the measuring groove (14) is provided with the light-emitting structure (3), the clamping structure (5) and the rotating structure (6). Two support plates (15) are symmetrically arranged on both sides of the base plate (11); The lifting structure (16) is located between the two support plates (15), and the light shield (2) is provided on the lifting structure (16).

6. The device for measuring the size of a quartz wafer according to claim 5, characterized in that: The movable structure (12) includes two movable slide rails (121), which are symmetrically arranged on the base plate (11), and the sliding block (13) is slidably provided on the two movable slide rails (121). A movable motor (122) is located on the side of the base plate (11) away from the support plate (15); The lead screw (123) is rotatably connected at one end to the base plate (11) and at the other end to the output shaft of the moving motor (122). The lead screw (123) passes through the sliding block (13) and is screwed into the sliding block (13).

7. The device for measuring the size of a quartz wafer according to claim 5, characterized in that: The lifting structure (16) includes a fixing plate (161), which is located on top of the two support plates (15); Two lifting slide rails (162) are respectively vertically arranged on one side of the two support plates (15); The lifting block (163) is slidably mounted on the two lifting slide rails (162), and the bottom of the lifting block (163) is provided with the light shield (2). A lifting cylinder (164) is located at the bottom of the fixed plate (161) and connected to the lifting block (163).

8. The device for measuring the size of a quartz wafer according to claim 1, characterized in that: It also includes a light-shielding structure (8), which includes a plurality of first light-shielding rings (81), which are equally spaced at the bottom of the light-shielding cover (2); Multiple second light-shielding rings (82) are equally spaced on the base (1), and the gaps between the second light-shielding rings (82) and the two adjacent first light-shielding rings (81) are inserted into each other.

9. The device for measuring the size of a quartz wafer according to claim 8, characterized in that: Both the first light-shielding ring (81) and the second light-shielding ring (82) are wrapped with light-absorbing cotton.

10. A quartz wafer size measuring device and method, using the quartz wafer size measuring device according to any one of claims 1-9, characterized in that: Includes the following steps: Step S1: Fix the quartz wafer to be tested into the measuring cavity (7) using the two main clamping components and the two auxiliary clamping components; Step S2: The light-emitting structure (3) works and emits light to project the quartz crystal wafer to be tested onto the image acquisition structure (4). The image acquisition structure (4) works and transmits the acquired image data back to the external processing system to complete the initial data acquisition. Step S3: The light-emitting structure (3) stops working, the two auxiliary clamping components release the clamping state of the quartz wafer to be tested, the rotating structure (6) works, rotates the quartz wafer to be tested by 180°, and the two auxiliary clamping components work to maintain the clamping state of the quartz wafer to be tested. Step S4: The light-emitting structure (3) works and emits light to project the quartz crystal wafer to be tested onto the image acquisition structure (4). The image acquisition structure (4) works and transmits the acquired image data back to the external processing system to complete the secondary data acquisition. Step S5: The external processing system processes the data collected twice to obtain the size data of the quartz wafer to be tested.

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