Automatic batch test method for current type temperature sensor chips

Abstract

The invention discloses an automatic batch test method for current type temperature sensor chips, and belongs to the field of automatic test programs. The method comprises the following steps: resetting a power supply and a digital multimeter, and clearing previous interface settings; a relay is arranged to enable a power supply to be connected with the to-be-tested station and the corresponding peripheral resistor; setting a power supply voltage; the digital multimeter is set as a direct current gear; reading the reading of the digital multimeter and storing the data in a table file; replacing peripheral resistors and stations until all chips are tested under all working conditions; judging whether the parameters are qualified or not, if yes, displaying PASS, and if not, displaying FAIL. According to the invention, the burden of testers can be reduced, the test time cost is reduced, and data errors are avoided.

Description

Technical Field

[0001] This invention relates to the field of automated testing procedures, and in particular to an automated batch testing method for current-type temperature sensor chips. Background Technology

[0002] In modern electronic systems, temperature sensors have always been a crucial component, especially in applications requiring temperature measurement, where their role is increasingly recognized. Currently used current-type temperature sensor chips can be configured with external resistors to generate a constant current proportional to the ambient temperature; the magnitude of this current characterizes the temperature. They are widely used in temperature control systems, temperature acquisition systems, and other fields. This particular temperature sensor requires only three ports, operating normally with an external 3V-36V power supply, and requires no additional power or input signal. Its operating range is wide, from -55℃ to +125℃.

[0003] The main parameter of this temperature sensor is the power supply current at different temperatures. Common testing hardware connections in existing technologies include... Figure 1 As shown, in automated batch testing environments, due to the small current and significant differences in current magnitude among different external resistors, it is often necessary to manually switch external resistor conditions and manually record the current parameters during testing. The entire process is cumbersome, introduces numerous errors, and involves a large number of components that are prone to damage. These disadvantages are detrimental to mass production testing. Summary of the Invention

[0004] The purpose of this invention is to provide an automated batch testing method for current-type temperature sensor chips to solve the problems in the background art.

[0005] To address the aforementioned technical problems, this invention provides an automated batch testing method for current-type temperature sensor chips, comprising the following steps: Step 1: Adjust the temperature sensor chip temperature to the required test temperature; Step 2: Switch the test board channel and select the workstation where the temperature sensor chip to be tested is located; Step 3: Turn on the power supply and switch the digital multimeter to the current setting; Step 4: The LabVIEW host computer automatically controls the power supply to switch to the set voltage, reads the current corresponding to the digital multimeter, and writes the data to a table file; Step 5: Switch different external conditions of the temperature sensor chip using a relay; Step 6: Repeat step 4 to collect the current magnitude under different external conditions; Step 7: Repeat steps 2-6 to collect the current of all temperature sensor chips on the multi-station test board; Step 8: Determine whether the parameters of all the chips at the above workstations are qualified. If qualified, display PASS; otherwise, display FAIL.

[0006] In one embodiment, before powering on and initializing the test system in step 1, the method further includes ensuring that the LabVIEW host computer is connected to a power supply, a digital multimeter, and an STM32F407 microcontroller.

[0007] In one embodiment, the connection circuit of the temperature sensor chip includes: the positive terminal of the power supply is connected to the positive terminal of the digital multimeter, the negative terminal of the digital multimeter is connected to the input terminal of the STM32F407 microcontroller, the power supply and the digital multimeter are connected to a LabVIEW host computer via a USB bus, and the STM32F407 microcontroller is connected to the LabVIEW host computer via a serial UART port.

[0008] In one embodiment, the specific method for switching test stations in step 2 includes: Step 1: The LabVIEW host computer sends the start configuration command; Step II: Initialize the PA9 and PA10 pins of the UART1 serial port of the STM32F407 microcontroller; Step III: Initialize the corresponding GPIO port pins on the STM32F407 microcontroller that control the opening and closing of the relay; Step IV: The LabVIEW host computer sends a serial port command to the STM32F407 microcontroller. Based on the received command, the STM32F407 microcontroller determines the workstation number on the test board that needs to be connected, configures the corresponding GPIO port voltage, and controls the corresponding relay to open and close, thereby connecting the corresponding workstation.

[0009] This invention provides an automated batch testing method for current-type temperature sensor chips, which uses LabVIEW to implement automated testing and data storage. The programmable instrument automatically measures, stores, and judges the quality of key indicators of all temperature sensor chips on the test board, reducing the burden on testing personnel, lowering testing time costs, and avoiding data errors. Attached Figure Description

[0010] Figure 1 This is a connection diagram of common test hardware in existing technologies.

[0011] Figure 2 This is a hardware connection diagram of the test system of the present invention.

[0012] Figure 3 This is a flowchart of the LabVIEW testing method of the present invention. Detailed Implementation

[0013] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a more detailed explanation of the automated batch testing method for a current-type temperature sensor chip proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.

[0014] Based on such Figure 2 The present invention provides an automated batch testing method for current-type temperature sensor chips, according to the test system shown. Figure 2 The hardware connection shown connects the power supply, digital multimeter, STM32 control board (STM32F407 microcontroller), USB data cable, and serial cable to the computer; and the STM32 control board is connected to the multi-station test board in the high and low temperature chamber.

[0015] like Figure 3 As shown, after the program loads, it will start running automatically, including the following steps: 1. Perform power-on initialization on the STM32F407 microcontroller, ensure that the LabVIEW host computer is connected to a power source, and use a digital multimeter; 2. Reset the power supply and digital multimeter to clear previous interface settings; 3. Set a relay to connect the power supply to the station under test and the corresponding external resistor; 4. Set the power supply voltage; 5. Set the digital multimeter to the DC current setting; 6. Read the digital multimeter readings and save the data in a spreadsheet file; 7. Repeat steps 3, 4, 5, and 6 until all operating conditions of all chips have been tested; 8. Determine if the parameters are qualified. If qualified, display PASS; otherwise, display FAIL. The graphical interface displays in real time the current workstation number of the chip being tested, the test progress, the path to save the test data file, and the selected test temperature.

[0016] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An automated batch testing method for current-type temperature sensor chips, characterized in that, Includes the following steps: Step 1: Adjust the temperature sensor chip temperature to the required test temperature; Step 2: Switch the test board channel and select the workstation where the temperature sensor chip to be tested is located; Step 3: Turn on the power supply and switch the digital multimeter to the current setting; Step 4: The LabVIEW host computer automatically controls the power supply to switch to the set voltage, reads the current corresponding to the digital multimeter, and writes the data to a table file; Step 5: Switch different external conditions of the temperature sensor chip using a relay; Step 6: Repeat step 4 to collect the current magnitude under different external conditions; Step 7: Repeat steps 2-6 to collect the current of all temperature sensor chips on the multi-station test board; Step 8: Determine whether the parameters of all the chips at the above workstations are qualified. If qualified, display PASS; otherwise, display FAIL.

2. The automated batch testing method for current-type temperature sensor chips as described in claim 1, characterized in that, Before powering on and initializing the test system in step 1, the following steps are also included: ensuring that the LabVIEW host computer is connected to a power supply, a digital multimeter, and an STM32F407 microcontroller.

3. The automated batch testing method for current-type temperature sensor chips as described in claim 2, characterized in that, The connection circuit of the temperature sensor chip includes: the positive terminal of the power supply is connected to the positive terminal of the digital multimeter, the negative terminal of the digital multimeter is connected to the input terminal of the STM32F407 microcontroller, the power supply and the digital multimeter are connected to the LabVIEW host computer via a USB bus, and the STM32F407 microcontroller is connected to the LabVIEW host computer via a serial UART port.

4. The automated batch testing method for a current-type temperature sensor chip as described in claim 1, characterized in that, The specific method for switching test stations in step 2 includes: Step 1: The LabVIEW host computer sends the start configuration command; Step II: Initialize the PA9 and PA10 pins of the UART1 serial port of the STM32F407 microcontroller; Step III: Initialize the corresponding GPIO port pins on the STM32F407 microcontroller that control the opening and closing of the relay; Step IV: The LabVIEW host computer sends a serial port command to the STM32F407 microcontroller. Based on the received command, the STM32F407 microcontroller determines the workstation number on the test board that needs to be connected, configures the corresponding GPIO port voltage, and controls the corresponding relay to open and close, thereby connecting the corresponding workstation.

Images