Display module, adjusting method and display device
By setting test points on the printed circuit board to detect signal changes and adjusting the data packet values in the flip film control table, the problem of screen splitting between flip films in the Flip pixel architecture is solved, ensuring display quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHANGSHA HKC OPTOELECTRONICS CO LTD
- Filing Date
- 2025-12-30
- Publication Date
- 2026-04-21
AI Technical Summary
In the Flip pixel architecture, the extra data line causes screen splitting between flip-chip films, which is more pronounced on high refresh rate and large-size display panels. Existing technologies cannot effectively solve this problem.
By setting a first test point and a second test point on the printed circuit board, the signal change in the fan-out area is detected, and the data packet value in the flip-chip control table is adjusted to improve the driving difference between flip-chip films and eliminate the screen splitting phenomenon.
It eliminates the driving differences between flip-chip films during the display process, avoids screen splitting, and ensures display quality.
Smart Images
Figure CN121905071A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and in particular to a display module, adjustment method and display device. Background Technology
[0002] In the field of display panel technology, due to market development needs, the Flip pixel architecture (data line drives left and right pixels) has emerged. However, due to the special design of the Flip pixel architecture, when actually designing the Dataline, the required number of Datalines will be one more than the actual number of pixel columns. For example, for a resolution of 3840, the required number of Datalines will be (3840*3+1=11521).
[0003] Therefore, during the design process, one COF (Chip-on-Foil) requires an extra dataline, resulting in a wider fanout area on the display panel compared to other locations. Although the display panel design attempts to compensate for this difference by increasing the resistance through winding, it cannot completely compensate for it. Furthermore, due to fluctuations in the manufacturing process, the difference is further amplified. Consequently, a problem arises with adjacent COFs: in some charging-sensitive patterns, screen splitting between COFs occurs, especially on high refresh rate and large-size display panels. Therefore, it is urgent to address the screen splitting issue between COFs. Summary of the Invention
[0004] The purpose of this application is to provide a display module, adjustment method, and display device that improves the split-screen phenomenon of the display module by detecting signal changes at a first test point and a second test point and adjusting the drive control according to the signal changes.
[0005] This application discloses a display module, including a display panel, a flip-chip film, and a printed circuit board. The display panel includes a display area and a fan-out area, with the fan-out area disposed below the display area. One end of the flip-chip film is connected to the fan-out area of the display panel, and the other end of the flip-chip film is connected to the printed circuit board. The printed circuit board is provided with a first test point and a second test point, which are used to test the signal changes in the fan-out area.
[0006] Optionally, the first test point includes a first input terminal and a first output terminal, the second test point includes a second input terminal and a second output terminal, and the display module further includes a first test trace and a second test trace. The first test trace is disposed on the flip-chip film and the fan-out region, and the first test trace is connected to the first input terminal and the first output terminal. The second test trace is disposed on the flip-chip film and is connected to the second input terminal and the second output terminal. The signal delay change of the first test trace is obtained by testing the changes in the electrical signals at the first input terminal and the first output terminal, and the signal delay change of the second test trace is obtained by testing the changes in the electrical signals at the second input terminal and the second output terminal. Subtracting the signal delay change of the first test trace from the signal delay change of the second test trace yields the signal delay change of the first test trace in the fan-out region.
[0007] Optionally, the length of the first test trace on the flip-chip film is the same as the length of the second test trace on the flip-chip film.
[0008] Optionally, the printed circuit board is provided with a storage module for storing a flip-chip control table; wherein the flip-chip control table modifies the value according to the signal delay change of the first test trace in the fan-out region.
[0009] This application also discloses an adjustment method for adjusting a display module as described above, wherein the display module is provided with a first test point and a second test point, and the adjustment method includes the following steps: Obtain the resistance values of the first and second test points; Obtain the charging difference between the first test point and the second test point; Based on the obtained resistance and charging differences, adjust the values in the flip-chip control table to obtain the updated flip-chip control table. The values in the control table for adjusting flip-chip films are data packet values.
[0010] Optionally, the step of adjusting the values in the flip-chip control table based on the obtained resistance and charging differences to obtain an updated flip-chip control table includes: Based on the resistance values of the first test point and the second test point, the resistance value of the first test trace in the fan-out region is obtained. Based on the charging difference between the first test point and the second test point, the charging difference of the first test trace in the fan-out region is obtained. Based on the resistance and charging difference of the first test trace in the fan-out region, adjust the data packet value in the flip-chip control table; and The updated flip-chip control table was obtained.
[0011] Optionally, the adjustment method further includes the step of: Based on the obtained resistance and charging differences, and the updated flip-chip control table, a comparison table is established between the resistance and charging differences and the data packet values in the flip-chip control table.
[0012] Optionally, the step of measuring the resistance values of the first test point and the second test point includes: The display module is not powered on; The resistance values of the first and second test points were obtained by testing with a resistance tester.
[0013] Optionally, the step of measuring the charging difference between the first test point and the second test point includes: Display module powered on; The charging difference corresponding to the resistance value is obtained by testing with an electrical signal tester.
[0014] This application also discloses a display device, including a driving circuit and a display module as described above, wherein the driving circuit drives the display module.
[0015] The display module of this application, by setting a first test point and a second test point on the printed circuit board, detects the signal changes in the fan-out area by detecting the first test point and the second test point, and based on the signal changes, determines the signal delay changes of the data lines corresponding to the different flip-chip films in the fan-out area, and adjusts the drive control of the display module for the data lines of the flip-chip films according to the signal delay changes, thereby eliminating the drive differences between the flip-chip films of the display module, avoiding screen splitting during the display process, and ensuring the display effect of the display module. Attached Figure Description
[0016] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings: Figure 1 This is a schematic diagram of the structure of a display module according to the first embodiment of this application; Figure 2 This is a schematic diagram of the signal changes of TBTE in a display module according to the first embodiment of this application; Figure 3 This is a flowchart of the adjustment method according to the second embodiment of this application; Figure 4This is a schematic diagram of the flip-chip thin film control table in the second embodiment of this application; Figure 5 This is a schematic diagram of CTL3 in the flip-chip thin film control table in the second embodiment of this application; Figure 6 This is a timing diagram of the flip-chip thin film control table in the second embodiment of this application; Figure 7 This is a flowchart illustrating the specific steps of an adjustment method according to a second embodiment of this application; Figure 8 This is a schematic diagram showing the relationship between resistance and packet value in the second embodiment of this application; Figure 9 This is a schematic diagram showing the relationship between the resistance values and packet values of the five process wafers in the second embodiment of this application; Figure 10 This is a schematic diagram of the structure of a display device according to the third embodiment of this application.
[0017] Among them, 100 is the display module; 110 is the display panel; 111 is the display area; 112 is the fan-out area; 120 is the flip-chip film; 130 is the printed circuit board; 131 is the storage module; 140 is the first test point; 141 is the first test trace; 150 is the second test point; 151 is the second test trace; the first input terminal TB; the first output terminal TE; the second input terminal BT1; the second output terminal BT2; 200 is the driving circuit; and 300 is the display device. Detailed Implementation
[0018] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.
[0019] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.
[0020] In addition, terms such as “center,” “horizontal,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” that indicate orientation or positional relationship are based on the orientation or relative positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0021] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0022] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0023] The inventors of this application discovered, during the design of the Flip pixel architecture (data lines driving left and right pixels), that the number of data lines is one more than the actual number of pixel columns. In the display panel, this manifests as an extra channel (used to transmit data signals to the extra data line) for each COF film. Consequently, the fanout area of the display module is wider than the fanout areas of other COF films, resulting in differences with adjacent COF films. These differences are further amplified by fluctuations in the manufacturing process, leading to screen splitting between COF films in some charging-sensitive patterns, especially in high refresh rate and large-size displays. Based on the above reasons, the inventors of this application designed the display module described below to improve the screen splitting phenomenon between COF films in the display panel.
[0024] like Figure 1As shown, as a first embodiment of this application, a display module 100 is disclosed. The display module 100 includes a display panel 110, a flip-chip film 120, and a printed circuit board 130. The display panel 110 includes a display area 111 and a fan-out area 112, with the fan-out area 112 disposed below the display area 111. One end of the flip-chip film 120 is connected to the fan-out area 112 of the display panel 110, and the other end of the flip-chip film 120 is connected to the printed circuit board 130. The printed circuit board 130 is provided with a first test point 140 and a second test point 150, which are used to test the signal changes in the fan-out area 112. It can be understood that the first test point 140 and the second test point 150 in this application are set to correspond to the differentiated flip-chip films 120 within the display module, and are used to detect the changes in the data lines in the differentiated flip-chip films 120 in the fan-out area 112.
[0025] The display module 100 of this application has a first test point 140 and a second test point 150 on the printed circuit board 130. By detecting the first test point 140 and the second test point 150, the signal change of the fan-out area 112 is tested. Based on the signal change, the signal delay change of the data line corresponding to the differentiated flip-chip film 120 in the fan-out area 112 is known. Based on the signal delay change, the drive control of the display module 100 on the data line of the flip-chip film 120 is adjusted to eliminate the drive difference between the flip-chip films 120 of the display module, avoid the screen splitting phenomenon of the display module 100 during the display process, and ensure the display effect of the display module.
[0026] Specifically, the first test point 140 includes a first input terminal TB and a first output terminal TE, and the second test point 150 includes a second input terminal BT1 and a second output terminal BT2. The display module 100 also includes a first test trace 141 and a second test trace 151. The first test trace 141 is disposed on the flip-chip film 120 and the fan-out area 112, and is connected to the first input terminal TB and the first output terminal TE. The second test trace 151 is disposed on the flip-chip film 120, and is connected to the second input terminal BT1 and the second output terminal BT2. It should be noted that the first test trace 141 and the second test trace 151 are only used for testing and are not used to transmit drive signals when the display module 100 is displaying.
[0027] The display module 100 of this application obtains the signal change of the first test trace 141 by detecting the changes in the electrical signals of the first input terminal TB and the first output terminal TE, and obtains the signal change of the second test trace 151 by detecting the changes in the electrical signals of the second input terminal BT1 and the second output terminal BT2. The signal change of the first test trace 141 in the fan-out region 112 can be obtained by subtracting the signal change of the second test trace 151 from the signal change of the first test trace 141. like Figure 1 As shown, the first test trace 141 is set on the flip-chip film 120 and the fan-out area 112, and the second test trace 151 is set on the flip-chip film 120. The signal change measured at the first test point 140 and the signal change measured at the second test point 150 can be subtracted to obtain the signal change of the first test trace 141 in the fan-out area 112. The display module 100 can be controlled according to the signal change to realize the differentiated setting of charging time at different positions of the flip-chip film 120, so as to improve the COF splitting problem caused by panel manufacturing process fluctuations in the display module 100 and improve the display effect of the display module 100. Specifically, when detecting signal changes, the display module 100 can be powered off initially and directly detect the changes in the electrical signals at the first input terminal TB and the first output terminal TE, as well as the changes in the electrical signals at the second input terminal BT1 and the second output terminal BT2, to obtain the resistance values of the first test trace 141 and the second test trace 151 respectively. The resistance values of the first test trace 141 and the second test trace 151 are then subtracted to obtain the resistance value of the first test trace 141 in the fan-out region 112. Subsequently, the display module 100 is powered on again to detect the changes in the electrical signals at the first input terminal TB and the first output terminal TE (e.g., ...). Figure 2 As shown in the diagram, the changes in electrical signals at the second input terminal BT1 and the second output terminal BT2 are compared differentially to obtain the charging difference data corresponding to the resistance value of the first test trace 141 in the fan-out region 112. Then, based on the obtained resistance value of the first test trace 141 in the fan-out region 112 and the corresponding charging difference data, the drive control of the data lines of the flip-chip film 120 in the display module 100 is adjusted to improve the screen splitting phenomenon of the display module 100. Specifically, to make the differential setting of different charging times in the display module 100 more accurate, the length of the first test trace 141 on the flip-chip film 120 is the same as the length of the second test trace 151 on the flip-chip film 120. This allows for more accurate control of the display module 100 based on the detected electrical signal changes, precisely improving the COF screen splitting problem in the display module 100.
[0028] Furthermore, such as Figure 1As shown, the printed circuit board 130 is provided with a storage module 131, which is used to store the flip-chip control table. The flip-chip control table is used to store the control data driving the flip-chip 120. Based on the resistance value of the first test trace 141 in the fan-out area 112 and the corresponding charging difference data, the drive control of the data line of the flip-chip 120 in the display name is adjusted, that is, the Packet value (data packet value, hereinafter referred to as Packet value) in CTL3 of the flip-chip control table is adjusted. After the adjustment is completed, the adjusted flip-chip control table can be stored in the storage module 131. In this embodiment, the storage module 131 can be located at the Flash IC (flash memory chip) on the printed circuit board 130. In subsequent use, the Tcon (timing controller) or SOC (system-on-a-chip processor) of the display module 100 preferentially calls the Flash on the printed circuit board 130. The setting value of CTL3 stored in the flip-chip control table stored in the IC is then transmitted to the display module 100 to improve the COF splitting problem in the display module 100.
[0029] The display module of this embodiment has a first test point 140 and a second test point 150 on the printed circuit board 130. By detecting the first test point 140 and the second test point 150, the signal changes of the first test line 141 and the second test line 151 are obtained. The signal change of the first test line 141 is subtracted from the signal change of the second test line 151 to obtain the signal change of the first test line 141 in the fan-out area 112. Based on the signal change, the signal delay change of the data line corresponding to the differentiated flip-chip film 120 in the fan-out area 112 is known. Based on the signal delay change, the drive control of the display module 100 on the data line of the flip-chip film 120 is adjusted to eliminate the drive difference between the flip-chip films 120 of the display module 100, avoid the screen splitting phenomenon of the display module 100 during the display process, and ensure the display effect of the display module 100.
[0030] like Figure 3 As shown, as a second embodiment of this application, an adjustment method is disclosed for adjusting a display module as described in the above embodiments. The display module is provided with a first test point and a second test point. The adjustment method includes the following steps: Obtain the resistance values of the first and second test points; Specifically, the resistance value of the first test point 140 and the resistance value of the second test point 150 are detected, and the difference between the resistance values of the first test point 140 and the second test point 150 is calculated to obtain the resistance value of the trace of the flip-chip film 120 in the fan-out region 112. Obtain the charging difference between the first test point and the second test point; Specifically, the electrical signals at the first test point 140 and the second test point 150 are detected to obtain the charging difference between the first test point 140 and the second test point 150. Based on the obtained resistance and charging differences, adjust the values in the flip-chip control table to obtain the updated flip-chip control table. Specifically, based on the obtained resistance value and charging difference, the Packet value in the flip-chip control table is adjusted accordingly to change the charging time of the flip-chip 120 in the display module 100, thereby improving the phenomenon of screen splitting between the flip-chip 120 in the display module 100.
[0031] The adjustment method in this embodiment obtains data from the first test point 140 and the second test point 150 on the display module 100, i.e., obtains the resistance value and charging difference. Based on this data, the Packet value in the flip-chip control table is adjusted to improve the charging time of the flip-chip 120 in the display module 100, thereby improving the phenomenon of screen splitting between the flip-chip 120s in the display module 100. The flip-chip control table being adjusted is mainly the COF IC internal timing control table (such as the COF IC internal timing control table). Figure 4 As shown), the Packet value in CTL3 of this control table (the value of CTL3 is as follows) Figure 5 As shown), to adjust the position time T1 of CE (Chanel Enble, the position to start setting to the next line) to TP (the starting point for controlling the next line of data) in each flip-chip film 120 (the relationship between CE and TP is as follows). Figure 6 As shown, the driving time of the data line is adjusted to improve the charging time of the corresponding pixel in the flip film 120, thereby realizing the relative position of the power supply of the data line at different positions of the flip film 120, realizing the differentiated setting of the charging time at different positions of the flip film 120, thereby improving the phenomenon of screen splitting between the flip films 120 in the display module 100.
[0032] Furthermore, such as Figure 7 As shown, the step of adjusting the values in the flip-chip control table based on the measured resistance and charging differences to obtain an updated flip-chip control table includes: Based on the resistance values of the first test point and the second test point, the resistance value of the first test trace in the fan-out region is obtained. Specifically, the resistance values of the first test point 140 and the second test point 150 are detected and subtracted to obtain the resistance value of the first test trace 141 in the fan-out region 112. Based on the charging difference between the first test point and the second test point, the charging difference of the first test trace in the fan-out region is obtained. Specifically, the changes in electrical signals at the first test point 140 and the second test point 150 are detected and compared to obtain the charging difference of the first test trace 141 in the fan-out region 112. Adjust the Packet value in the flip-chip control table based on the resistance value of the first test trace in the fan-out region and the charging difference in the fan-out region; Specifically, based on the resistance value and charging difference of the first test trace 141 in the fan-out area 112, the differences between the flip-chip film 120 and other flip-chip films 120 are determined. Based on the obtained resistance value and charging difference, the Packet value in the flip-chip control table is adjusted so that the power-on time of the data line at the position of the flip-chip film 120 is relatively close to that of the data line of other flip-chip films 120. This achieves differentiated setting of charging time at different positions of different flip-chip films 120, thereby improving the split-screen phenomenon of the display module 100.
[0033] The updated flip-chip control table was obtained.
[0034] Specifically, the updated flip-chip control table is stored in the Flash IC location on the printed circuit board. When the display module is used, it will first call the flip-chip control table stored in the Flash IC location on the printed circuit board, and then transmit the screen display command, thus improving the split-screen phenomenon of the display module.
[0035] Furthermore, the adjustment method also includes the following steps: Based on the obtained resistance and charging differences, and the updated flip-chip control table, a comparison table is established between the resistance and charging differences and the Packet values in the flip-chip control table.
[0036] Specifically, based on the obtained resistance value and charging difference, the Packet value can be determined subjectively through visual effect, so that the display module 100 can improve the split screen phenomenon. A comparison and judgment table is established for resistance value, charging difference and Packet value, so that after the display module 100 detects and obtains the resistance value and charging difference, it can quickly obtain the Packet value for modification according to the comparison and judgment table. Furthermore, based on the established comparison and judgment table, the packet values corresponding to different resistance ranges can be obtained, and the extent of resistance change covered by a change in 1 packet value within different resistance ranges can also be determined, thus establishing a correspondence. For example, ... Figure 8As shown, assuming the resistance value R1 to R2 ranges from 300 to 370, a total of 70Ω corresponds to 5 Packet value changes. Then, within this range, 14Ω corresponds to 1 Packet value change. After establishing the above comparison and judgment relationship table or correspondence, the subsequent display module 100 only needs to directly detect the first test point 140 and the second test point 150 to immediately obtain the Packet value that needs to be modified in order to adjust the Packet value in CTL3 of the flip-chip control table. Since the resistance value is related to the manufacturing process of the display module 100, when establishing the comparison and judgment relationship table, the process limit sheets and center sheets (width / thickness related limit sheets and center sheets) of the display module 100 can be screened through the production records or other records of the display module 100 to obtain the data in the comparison and judgment relationship table. Taking 5 sets of process sheets as an example, the following can be obtained: Figure 9 The data shown indicates that the five chip groups correspond to resistance values R1, R2, R3, R4, and R5, with resistance values decreasing sequentially from R5 to R1, and corresponding charging differences increasing sequentially from t1 to t5. Chips with resistance values R1, R2, and R5 exhibit a split-screen display, while chips with resistance values R3 and R4 exhibit a normal display. Therefore, the Packet value of CTL3 in the flip-chip control table is adjusted for chips with resistance values R1, R2, and R5. This adjustment (which can be determined subjectively or calculated using TCON or SOC) is made so that chips with resistance values R1, R2, and R3 exhibit a normal display. This establishes the correspondence between resistance values R1, R2, R3, R4, and R5 and their corresponding Packet values. Figure 9 As shown; After obtaining the correspondence between resistance and packet values (i.e.) Figure 8 Subsequently, only a detection data output image with a 50% duty cycle and an IIC (Inter-Integrated Circuit) control sampling CMD (Command) command need to be added to the display module production line. When the processing module (i.e., TCON or SOC) receives the sampling command, it tests the test traces of the process wafer to obtain the corresponding resistance value. Based on the correspondence between the resistance value and the packet value, a new packet value is obtained to update the packet value of CTL3 in the flip-chip control table of the process wafer. Through the above method, the process wafers of display modules with process differences can be batch modified to modify the corresponding CTL3 packet value of the flip-chip control table, so that multiple display modules can quickly adjust the flip-chip control table and improve the display splitting phenomenon caused by process fluctuations.
[0037] Furthermore, automated equipment can be added to measure the first test point 140 and the second test point 150. Then, based on the measured data, the established comparison and judgment relationship table can be called and the corresponding flip-chip control table can be directly burned to the Flash IC position of the printed circuit board 130.
[0038] Furthermore, the step of measuring the resistance values of the first test point and the second test point includes: The display module is not powered on; The resistance values of the first and second test points were obtained by testing with a resistance tester.
[0039] In this embodiment, the resistance values of the first test point 140 and the second test point 150 can be detected by a resistance tester, or by other testing instruments; no limitation is made here.
[0040] Furthermore, the step of measuring the charging difference between the first test point and the second test point includes: Display module powered on; The charging difference corresponding to the resistance value is obtained by testing with an electrical signal tester.
[0041] In this embodiment, the charging difference between the first test point 140 and the second test point 150 can be detected by an electrical signal tester, or by other testing instruments; no limitation is made here.
[0042] like Figure 10 As shown, in the third embodiment of this application, a display device 300 is disclosed. The display device 300 includes a driving circuit 200 and a display module 100 as described in the above embodiment. The driving circuit 200 drives the display module 100. In this embodiment, the display device has a first test point and a second test point on a printed circuit board. By detecting the first and second test points, the signal change in the fan-out area is tested, thereby determining the signal delay change of the data lines of the different flip-chip films in the fan-out area. Based on this signal delay change, the driving control of the display device on the data lines of the flip-chip films is adjusted to eliminate the differences between the flip-chip films and improve the screen splitting phenomenon of the display device.
[0043] It should be noted that the limitations on each step involved in this solution are not considered as limiting the order of steps, provided that they do not affect the implementation of the specific solution. The steps listed first can be executed first, later, or even simultaneously. As long as this solution can be implemented, it should be considered to fall within the scope of protection of this application.
[0044] The technical solution of this application can be widely used in various display panels, such as TN (Twisted Nematic) display panels, IPS (In-Plane Switching) display panels, VA (Vertical Alignment) display panels, and MVA (Multi-Domain Vertical Alignment) display panels. Of course, it can also be used in other types of display panels, such as OLED (Organic Light-Emitting Diode) display panels, all of which are applicable to the above solution.
[0045] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.
[0046] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.
Claims
1. A display module, characterized in that, include: The display panel includes a display area and a fan-out area, with the fan-out area located below the display area. A flip-chip film, one end of which is connected to the fan-out area of the display panel; A printed circuit board, wherein the other end of the flip-chip film is connected to the printed circuit board; The printed circuit board is provided with a first test point and a second test point, which are used to test the signal changes in the fan-out area.
2. The display module according to claim 1, characterized in that, The first test point includes a first input terminal and a first output terminal, the second test point includes a second input terminal and a second output terminal, the display module further includes a first test trace and a second test trace, the first test trace is disposed on the flip-chip film and the fan-out area, the first test trace is connected to the first input terminal and the first output terminal, the second test trace is disposed on the flip-chip film, and the second test trace is connected to the second input terminal and the second output terminal; Specifically, the signal delay change of the first test trace is obtained by testing the changes in the electrical signals at the first input terminal and the first output terminal, and the signal delay change of the second test trace is obtained by testing the changes in the electrical signals at the second input terminal and the second output terminal. The signal delay change of the first test trace in the fan-out region is obtained by subtracting the signal delay change of the second test trace from the signal delay change of the first test trace.
3. The display module according to claim 2, characterized in that, The length of the first test trace on the flip-chip film is the same as the length of the second test trace on the flip-chip film.
4. The display module according to claim 1, characterized in that, The printed circuit board is equipped with a storage module, which is used to store the flip-chip control table. The flip-chip control table modifies its values based on the signal delay changes of the first test trace in the fan-out region.
5. An adjustment method for adjusting a display module as described in any one of claims 1 to 4, wherein the display module is provided with a first test point and a second test point, characterized in that, Including the following steps: Obtain the resistance values of the first and second test points; Obtain the charging difference between the first test point and the second test point; Based on the obtained resistance and charging differences, adjust the values in the flip-chip control table to obtain the updated flip-chip control table. The values in the control table for adjusting flip-chip films are data packet values.
6. The adjustment method according to claim 5, characterized in that, The step of adjusting the values in the flip-chip control table based on the obtained resistance and charging differences to obtain an updated flip-chip control table includes: Based on the resistance values of the first test point and the second test point, the resistance value of the first test trace in the fan-out region is obtained. Based on the charging difference between the first test point and the second test point, the charging difference of the first test trace in the fan-out region is obtained. Based on the resistance and charging difference of the first test trace in the fan-out region, adjust the data packet value in the flip-chip control table; and The updated flip-chip control table was obtained.
7. The adjustment method according to claim 5, characterized in that, It also includes the following steps: Based on the obtained resistance and charging differences, and the updated flip-chip control table, a comparison table is established between the resistance and charging differences and the data packet values in the flip-chip control table.
8. The adjustment method according to claim 5, characterized in that, The steps for measuring the resistance values of the first test point and the second test point include: The display module is not powered on; The resistance values of the first and second test points were obtained by testing with a resistance tester.
9. The adjustment method according to claim 5, characterized in that, The step of measuring the charging difference between the first test point and the second test point includes: Display module powered on; The charging difference corresponding to the resistance value is obtained by testing with an electrical signal tester.
10. A display device, characterized in that, It includes a driving circuit and a display module as described in any one of claims 1 to 4, wherein the driving circuit drives the display module.