Coil component

Abstract

The invention provides a coil assembly. The coil component includes: a body having first and second surfaces facing each other in a first direction and first and second side surfaces facing each other in a second direction, and including a magnetic material; the supporting component is arranged in the main body and is provided with a through hole; a coil disposed on at least one of the surfaces of the support member; external electrodes disposed on the first side surface, the second side surface, and the first surface of the body; and a first insulating layer disposed on the second surface of the body. The main body includes: a molded portion having a first surface and a second surface opposite in the first direction and a plurality of side surfaces connecting the first surface of the molded portion and the second surface of the molded portion, and including a core protruding from the first surface of the molded portion and passing through the through hole; and a cover portion disposed on the molded portion and surrounding the coil.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0144032, filed on October 21, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] An inductor (coil assembly) is a typical passive device that, together with resistors and capacitors, forms an electronic circuit to remove noise. Inductors have been combined with capacitors in resonant circuits, filter circuits, etc., to utilize electromagnetic properties to amplify signals within a specific frequency band.

[0004] When an inductor has a wound coil, the main body can have a T-shaped core structure formed using a mold. However, in the case of an inductor with a thin-film coil, it may be difficult to achieve such a structure. Summary of the Invention

[0005] One aspect of this disclosure is to provide a coil assembly that allows for diversification of structure and characteristics.

[0006] According to one aspect of this disclosure, a coil assembly includes: a body including a first surface and a second surface facing each other in a first direction and a first side surface and a second side surface facing each other in a second direction, and comprising a magnetic material; a support member disposed within the body, including a first surface and a second surface facing each other in the first direction, and having a through hole penetrating the support member in the first direction; a coil disposed on at least one of the first surface and the second surface of the support member; an external electrode disposed on the first side surface, the second side surface, and the first surface of the body; and a first insulating layer disposed on the second surface of the body, wherein the body includes: a molded portion including a first surface and a second surface facing each other in the first direction and a plurality of side surfaces connecting the first surface and the second surface of the molded portion, and including a core protruding from the first surface of the molded portion and passing through the through hole; and a cover portion disposed on the first surface of the molded portion, and the second surface of the molded portion forming the second surface of the body.

[0007] According to another aspect of this disclosure, a coil assembly includes: a body including a first surface and a second surface facing each other in a first direction and a first side surface and a second side surface facing each other in a second direction, and comprising a magnetic material; a support member disposed within the body, including a first surface and a second surface facing each other in the first direction, and having a through hole penetrating the support member in the first direction; a coil disposed on at least one of the first surface and the second surface of the support member; and an external electrode disposed on the first side surface and the second side surface of the body, wherein the body includes: a molded portion including a first surface and a second surface facing each other in the first direction and a plurality of side surfaces connecting the first surface and the second surface of the molded portion, and including a core protruding from the first surface of the molded portion and passing through the through hole; and a cover portion disposed on the first surface of the molded portion, the molded portion comprising ferrite, and the cover portion comprising resin and magnetic metal particles dispersed in the resin. Attached Figure Description

[0008] Other aspects, features, and advantages of this disclosure will become clearer from the following detailed description, taken in conjunction with the accompanying drawings: Figure 1 This is a perspective view schematically illustrating a coil assembly according to a first embodiment of the present disclosure; Figure 2 yes Figure 1 An exploded perspective view of a portion of the coil assembly; Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I'; Figure 4 yes Figure 3 Enlarged views of parts A and B; Figure 5 This is a modified example of the first embodiment of this disclosure. Figure 3 Enlarged views of parts A and B; Figure 6 This is another modified example of the first embodiment of this disclosure. Figure 3 Corresponding cross-sectional view; Figure 7 This is a schematic perspective view of a coil assembly according to a second embodiment of the present disclosure; Figure 8 It is along Figure 7 The cross-sectional view taken from line II-II'; and Figure 9 This is a modified example of the second embodiment of the present disclosure. Figure 8 The corresponding cross-sectional view. Detailed Implementation

[0009] The terminology used herein to describe embodiments of this disclosure is not intended to limit the scope of this disclosure. “A” and “an” are singular because they have a single indicator; however, the use of the singular form in this document should not preclude the presence of more than one indicator. In other words, unless the context clearly indicates otherwise, the number of elements mentioned in the singular form in this disclosure may be one or more. It will be further understood that the terms “comprising,” “including,” “having,” and / or “containing” as used herein specify the presence of the stated features, quantities, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, and / or combinations thereof.

[0010] The terminology used in this specification is for describing particular embodiments only and is not intended to limit this disclosure. Unless the context clearly distinguishes them, expressions used in the singular include those used in the plural. It should be understood throughout this specification that terms such as “comprising” or “having” are intended to indicate the presence of the features, quantities, steps, actions, elements, components, or combinations thereof disclosed in the specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, quantities, steps, actions, elements, components, or combinations thereof. Furthermore, throughout the specification, “on” means located “above” or “below” the target portion and does not necessarily mean located on the upper side relative to the direction of gravity.

[0011] In addition, “combination” not only means that the contact relationship between the components is direct physical contact, but also includes the concept of another component being located between the components so that the components are in contact with the other component.

[0012] Since the dimensions (e.g., thickness) of each component shown in the accompanying drawings are arbitrarily shown for ease of description, this disclosure is not necessarily limited to the dimensions (e.g., thickness) shown.

[0013] In the accompanying drawings, the X direction may be defined as a first direction or a thickness direction, the Y direction may be defined as a second direction or a length direction, and the Z direction may be defined as a third direction or a width direction. In the following description, the first direction (X direction), the second direction (Y direction), and the third direction (Z direction) each represent two directions; for example, the first direction (X direction) includes both the upward direction and the downward direction relative to the accompanying drawings.

[0014] In the following description, coil assemblies according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and in the description with reference to the drawings, the same or corresponding components are assigned the same reference numerals, and repeated descriptions of the same or corresponding components will be omitted.

[0015] In the following description, embodiments of the present disclosure will be illustrated with reference to specific examples and accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure are provided to provide a more complete description of the disclosure to those skilled in the art. Therefore, for clarity, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings are the same elements.

[0016] Various types of electronic components are used in electronic devices, and various types of coil assemblies can be appropriately used among these electronic components for noise removal purposes. That is, in electronic devices, coil assemblies can be used as power inductors, high-frequency inductors, general-purpose ferrite beads, high-frequency ferrite beads (e.g., ferrite beads suitable for the GHz band), common-mode filters, etc.

[0017] (First embodiment) Figure 1 This is a schematic perspective view of a coil assembly according to a first embodiment of the present disclosure. Figure 2 yes Figure 1 An exploded perspective view of a portion of the coil assembly. Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'. Figure 4 yes Figure 3 Enlarged views of parts A and B.

[0018] Reference Figure 1 According to this embodiment, the coil assembly 1000 includes a main body 100, a support member 200, a coil 300, external electrodes 410 and 420, and a first insulating layer 510.

[0019] A support member 200 and a coil 300 are disposed within a body 100, and the body 100 can form the shape of a coil assembly 1000. The body 100 may include a first surface 101 and a second surface 102 facing each other in a first direction (X direction), and a first side surface 103, a second side surface 104, a third side surface 105, and a fourth side surface 106 connecting the first surface 101 and the second surface 102. Specifically, the first side surface 103 and the second side surface 104 may face each other and connect the first surface 101 and the second surface 102 in a second direction (Y direction), and the third side surface 105 and the fourth side surface 106 may face each other and connect the first surface 101 and the second surface 102 in a third direction (Z direction). The first surface 101 of the body 100 may be configured as a mounting surface for mounting the coil assembly 1000 as described below, and therefore may be the lower surface of the body 100. The second surface 102 facing the first surface 101 in the first direction (X direction) may be the upper surface. The first side surface 103, the second side surface 104, the third side surface 105, and the fourth side surface 106 can be multiple side surfaces connecting the first surface 101 and the second surface 102 of the body 100. The body 100 can be formed such that, for example, the coil assembly 1000, in which the external electrodes 410 and 420 described below are formed according to this embodiment, has a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.8 mm; a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm; a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.8 mm; a length of 1.0 mm, a width of 0.6 mm, and a thickness of 0.8 mm; a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.8 mm; a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.65 mm; or a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.6 mm, but is not limited thereto. For example, the coil assembly 1000 may be formed with a length of 4.0 mm and a width of 4.0 mm, or it may be formed with a length of 10.0 mm and a width of 10.0 mm. Furthermore, the aforementioned exemplary values ​​for the length, width, and thickness of the coil assembly 1000 refer to values ​​that do not reflect manufacturing errors; therefore, values ​​that can be identified as including manufacturing errors should be considered to correspond to the aforementioned exemplary values.

[0020] The main body 100 may include a molding portion 110 and a covering portion 120 disposed on a first surface of the molding portion 110.

[0021] Reference Figure 2 The molding portion 110 may include first surfaces MS1 facing each other in a first direction (X direction). Figure 2 The lower surface) and the second surface MS2 ( Figure 2The molding portion 110 has an upper surface and multiple side surfaces MS3, MS4, MS5, and MS6 connecting the first surface MS1 and the second surface MS2. The first surface MS1 of the molding portion 110 can contact the cover portion 120, and the second surface MS2 of the molding portion 110 can form the second surface 102 of the main body 100. The multiple side surfaces MS3, MS4, MS5, and MS6 of the molding portion 110 can form part of the multiple side surfaces 103, 104, 105, and 106 of the main body 100.

[0022] The molding portion 110 may include a base 111 and a core 112. The base 111 and the core 112 may be formed together during the same process and may be integrated with each other. Therefore, there may be no boundary between the base 111 and the core 112.

[0023] The core 112 may be disposed in a protruding form at the center of the first surface MS1 of the base 111 and penetrate the coil 300. Therefore, in this disclosure, the first and second surfaces of the molding portion 110 may be used to have the same meaning as the first and second surfaces of the base 111, and the plurality of side surfaces of the molding portion 110 may be used to have the same meaning as the plurality of side surfaces of the base 111. The core 112 may protrude from the first surface MS1 of the base 111 and pass through the through-hole H of the support member 200 described below.

[0024] exist Figure 2 In the coil 300, the base 111 may be disposed on the top of the core 112, and the first surface (lower surface) MS1 of the base 111 may contact the coil 300. The base 111 may not pass through the hollow core formed by the coil 300.

[0025] As described above, the molding portion 110, including the base 111 and the core 112, can be a T-shaped core. Furthermore, the second surface MS2 of the molding portion 110 can form the second surface 102 of the body 100. Here, the second surface 102 of the body 100 can be the upper surface. Therefore, the molding portion 110 of the coil assembly 1000 according to this embodiment can have a shape such as... Figure 3 The "T" shape in the cross-sectional view.

[0026] The cover portion 120 may be provided on the first surface MS1 of the molding portion 110. Figure 2 In this design, the cover portion 120 may be disposed below the molding portion 110, and the coil 300 may be disposed between the cover portion 120 and the molding portion 110. The cover portion 120 may be disposed on the molding portion 110 and the coil 300, and then pressed to be combined with the molding portion 110.

[0027] Cover portion 120 may include a first surface CS1 that contacts the first surface MS1 of molding portion 110. Figure 2The cover portion 120 has an upper surface, a second surface CS2 facing the first surface CS1 in the first direction (X direction), and multiple side surfaces CS3, CS4, CS5, and CS6 connecting the first surface CS1 and the second surface CS2. The second surface CS2 of the cover portion 120 may form the first surface 101 of the main body 100. The multiple side surfaces CS3, CS4, CS5, and CS6 of the cover portion 120 may, together with the multiple side surfaces MS3, MS4, MS5, and MS6 of the molding portion 110, form the multiple side surfaces 103, 104, 105, and 106 of the main body 100.

[0028] The molding portion 110 and the covering portion 120 may include resin and magnetic material dispersed in the resin. In this embodiment, the molding portion 110 and the covering portion 120 may include magnetic metal particles as magnetic materials. Specifically, the molding portion 110 may include first magnetic metal particles 11, and the covering portion 120 may include second magnetic metal particles 12.

[0029] The permeability of the molding portion 110 and the covering portion 120 may be different. The permeability of the molding portion 110 and the covering portion 120 can be adjusted in the following manner.

[0030] The first magnetic metal particles 11 included in the molding section 110 and the second magnetic metal particles 12 included in the covering section 120 may have different particle size distributions. Specifically, in such cases... Figure 4 The particle size distribution based on area analysis may differ in the cross-sectional samples collected in the XY direction shown.

[0031] The diameter of the first magnetic metal particle 11 may differ from the diameter of the second magnetic metal particle 12. Furthermore, in this specification, the difference in diameter between the magnetic metal particles 11 and 12 may refer to a difference in their average diameter. Additionally, the difference in the average diameter of the magnetic metal particles 11 and 12 may refer to a difference in their particle size distribution values, expressed as D50 or D90.

[0032] Additionally, refer to Figure 4 The resin R110 content in the molding section 110 can be greater than that in the covering section 120, thus the magnetic metal particle filling rate in the molding section 110 can be lower. The resin content can be obtained by the ratio of the area occupied by the resin to the total area in a cross-sectional sample taken in the XY direction. Since the molding section 110 can have a lower magnetic metal particle filling rate compared to the covering section 120, the molding section 110 can exhibit a relatively low permeability (relative permeability). The magnetic metal particle filling rate can be obtained by the volume fraction or area fraction of the magnetic metal particles dispersed in the resin. However, this disclosure is not limited thereto, and reference is made to... Figure 5Compared to the cover portion 120, the molding portion 110 can have a lower resin content and a higher filling rate of magnetic metal particles in the molding portion 110.

[0033] Magnetic metal particles 11 and 12 may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, magnetic metal particles 11 and 12 may be at least one selected from the group consisting of pure iron particles, Fe-Si based alloy particles, Fe-Si-Al based alloy particles, Fe-Ni based alloy particles, Fe-Ni-Mo based alloy particles, Fe-Ni-Mo-Cu based alloy particles, Fe-Co based alloy particles, Fe-Ni-Co based alloy particles, Fe-Cr based alloy particles, Fe-Cr-Si based alloy particles, Fe-Si-Cu-Nb based alloy particles, Fe-Ni-Cr based alloy particles, and Fe-Cr-Al based alloy particles.

[0034] The magnetic metal particles 11 and 12 can be amorphous or crystalline. For example, the magnetic metal particles 11 and 12 can be Fe-Si-B-Cr based amorphous alloy particles, but are not limited to this.

[0035] The surface of each of the magnetic metal particles 11 and 12 may be covered with an insulating material. The insulating material may be, alone or in combination, an organic insulating material including but not limited to epoxy resin, polyimide, liquid crystal polymer, etc., or it may be an oxide insulating film (including the metallic components of the magnetic metal particles 11 and 12) or an inorganic insulating material (such as SiO₂). x SiN x Or phosphate).

[0036] The resin may include, but is not limited to, epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination.

[0037] The molding section 110 can be formed by filling a mold with a "T"-shaped cavity with a composite material including magnetic material and resin. A molding process for the magnetic material or composite material in which high temperature and high pressure are applied to the mold can also be performed, but is not limited thereto.

[0038] The cover portion 120 can be formed by placing the coil 300 on the molding portion 110 in a mold, and then filling the mold with a composite material including magnetic material and resin. As described above, since the particle size distribution of the magnetic metal particles in the molding portion 110 and the cover portion 120 is different, a boundary can be formed in the portion where the molding portion 110 and the cover portion 120 intersect.

[0039] The coil assembly 1000 according to this embodiment includes a support member 200 disposed in the main body 100. (See reference...) Figure 2 The support member 200 may include first surfaces facing each other in a first direction (X direction). Figure 2 The upper surface and the second surface Figure 2 The lower surface of the support member 200), and the coil 300, which will be described below, may be disposed on at least one of the first surface and the second surface of the support member 200.

[0040] Reference Figure 2 The support member 200 may have a through hole H formed therein. The through hole H may penetrate the support member 200 in a first direction (X direction). The core 112 of the molding portion 110 may be disposed in the through hole H. The T-shaped core structure according to this embodiment can be applied to a thin-film coil assembly. As described above, the T-shaped core structure makes it easy to use heterogeneous materials as magnetic materials for the molding portion 110 and the cover portion 120. Furthermore, since the T-shaped core is formed using a mold, the density of the magnetic material can be easily increased by high-pressure molding.

[0041] The support member 200 may contact the core 112 of the molding portion 110 through the side surface forming the through hole H, but is not limited thereto.

[0042] The support member 200 may be formed using an insulating material including at least one of thermosetting insulating resins (such as epoxy resin), thermoplastic insulating resins (such as polyimide), and photosensitive insulating resins, or it may be formed using an insulating material prepared by impregnating a reinforcing material (such as glass fiber or inorganic filler) in an insulating resin. As an example, the support member 200 may be formed using insulating materials such as copper-clad laminate (CCL), prepreg, Ajinomoto build-up film (ABF), FR-4, bismaleimide triazine (BT) resin, photosensitive dielectric (PID), etc., but is not limited thereto.

[0043] As an inorganic filler, at least one selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0044] When the support member 200 is formed using an insulating material including reinforcing material, the support member 200 can provide superior rigidity. If the support member 200 is formed using an insulating material that does not contain glass fiber, the support member 200 can help reduce the thickness of the entire coil assembly 1000. When the support member 200 is formed using an insulating material including a photosensitive insulating resin, the number of processes can be reduced, which is advantageous in terms of reducing production costs, and micro-hole processing is possible.

[0045] The coil assembly 1000 according to this embodiment includes a coil 300. The coil 300 may be disposed in the body 100 and may be disposed on at least a first surface of the support member 200.

[0046] A coil 300 is disposed in the main body 100. Specifically, the coil 300 may be disposed on the molding portion 110 and covered by the covering portion 120. The coil 300 forms at least one turn, and the core 112 of the molding portion 110 may be disposed in the hollow core formed by the turn of the coil. In addition, the covering portion 120 may be disposed in the outer region of the turn.

[0047] The coil 300 may include a first coil pattern 310 disposed on a first surface of the support member 200 (the upper surface in the figure in this embodiment) and a second coil pattern 320 disposed on a second surface of the support member 200 (the lower surface in the figure in this embodiment).

[0048] The coil 300 may include a first coil pattern 310 and a first lead-out portion 311 disposed on a first surface of the support member 200. The coil 300 may include a second coil pattern 320 and a second lead-out portion 321 disposed on a second surface of the support member 200.

[0049] The first coil pattern 310 and the second coil pattern 320 form one or more turns centered on the core 112, and may have a planar spiral shape. Specifically, one or more turns may be formed based on a central axis substantially parallel to the first direction (X direction). However, this disclosure is not limited thereto.

[0050] Reference Figure 2 and Figure 3 On the upper surface of the support member 200, the first coil pattern 310 contacts and connects to the first lead-out portion 311. On the lower surface of the support member 200, the second coil pattern 320 contacts and connects to the second lead-out portion 321.

[0051] The first lead-out portion 311 extends to the first side surface 103 and is connected to the first external electrode 410 described below. The second lead-out portion 321 extends to the second side surface 104 and is connected to the second external electrode 420 described below.

[0052] The through-hole 330 penetrates the support member 200 and contacts each of the first coil pattern 310 and the second coil pattern 320. Therefore, the coil 300 can be used as a single coil as a whole.

[0053] At least one of the components constituting coil 300 may include one or more conductive layers. For example, when coil 300 is formed by applying a plating process to the surface of support member 200, at least one of the components constituting coil 300 may include a first conductive layer formed by electroless plating and a second conductive layer disposed on the first conductive layer. The first conductive layer may be a seed layer for forming the second conductive layer by plating on support member 200, and the second conductive layer may be an electroplated layer. Here, the electroplated layer may have a single-layer structure or a multi-layer structure. An electroplated layer with a multi-layer structure may be formed as a conformal film structure in which one electroplated layer is covered by another electroplated layer, or it may be formed as a shape in which one electroplated layer is stacked only on one surface of another electroplated layer. Coil 300 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but is not limited thereto.

[0054] An insulating film IF may be formed on the surface of the coil 300. Specifically, the insulating film IF may be disposed between the coil 300 and the body 100. The insulating film IF may be formed on the surface of the support member 200 on which the coil 300 is formed, but is not limited thereto. The insulating film IF may contact the first surface MS1 of the molding portion 110.

[0055] The insulating film IF is used to electrically isolate the coil 300 from the body 100 and may include, but is not limited to, known insulating materials such as parylene. As another example, the insulating film IF may include insulating materials other than parylene (such as epoxy resin). The insulating film IF can be formed by vapor deposition, but is not limited to. As another example, the insulating film IF can be formed by stacking insulating films for forming the insulating film IF on both sides of the support member 200 where the coil 300 is formed and curing them, or by coating both sides of the support member 200 where the coil 300 is formed and curing them. Furthermore, for the foregoing reasons, the insulating film IF is an optional component in this embodiment. That is, if the body 100 has sufficient resistance at the design operating current and design operating voltage of the coil assembly 1000, the insulating film IF can be omitted in this embodiment.

[0056] External electrodes 410 and 420 are disposed on the surface of the body 100. The external electrodes may include a first external electrode 410 and a second external electrode 420 respectively connected to the first coil pattern 310 and the second coil pattern 320.

[0057] Specifically, the first external electrode 410 may be disposed on the first side surface 103 and the first surface 101 of the main body 100, and may be connected to the first lead-out portion 311. The second external electrode 420 may be disposed on the second side surface 104 and the first surface 101 of the main body 100, and may be connected to the second lead-out portion 321. The first external electrode 410 and the second external electrode 420 may have an "L" shape.

[0058] External electrodes 410 and 420 may be disposed on the first surface 101 of the main body 100, and the first surface 101 of the main body 100 may be configured as the mounting surface of the coil assembly when mounted on a substrate. When the coil assembly 1000 is mounted on an electronic device or the like, the external electrodes 410 and 420 may serve to electrically connect the coil 300 in the coil assembly 1000 to the electronic device.

[0059] External electrodes 410 and 420 may not be disposed on the second surface 102 of the body 100. Instead, the first insulating layer 510, described below, may be disposed on the second surface 102 of the body 100.

[0060] The external electrodes 410 and 420 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but are not limited thereto. The first external electrode 410 and the second external electrode 420 may be formed as a multilayer structure. For example, the first external electrode 410 and the second external electrode 420 may include first metal layers 411 and 421 and a second metal layer, the first external electrode 410 and the second external electrode 420 being connected to the coil 300 through the first metal layers 411 and 421. The first metal layers 411 and 421 may be conductive resin layers or copper (Cu) plating, the conductive resin layer comprising conductive particles containing at least one of copper (Cu) and silver (Ag) and an insulating resin. Alternatively, the second metal layer may have a bilayer structure of nickel (Ni) plating and tin (Sn) plating. For example, the second metal layer may include first layers 412 and 422 and second layers 413 and 423. The first layers 412 and 422 may be formed by electroplating, by vapor deposition such as sputtering, or by coating a conductive paste comprising conductive particles such as copper (Cu) and / or silver (Ag) and curing it, and the second layers 413 and 423 may be formed by electroplating.

[0061] The first insulating layer 510 may be disposed on the second surface 102 of the main body 100. The first insulating layer 510 may contact the second surface MS2 of the molding part 110.

[0062] When the first metal layers 411 and 421 of the external electrodes 410 and 420 are formed on the surface of the body 100 by plating, the first insulating layer 510 can be used as a plating resist. Therefore, the first insulating layer 510 can be formed on the surface of the body 100 before the formation of the first metal layers 411 and 421 of the external electrodes 410 and 420, thereby defining areas on the surface of the body 100 where the first metal layers 411 and 421 will be formed. However, the scope of this disclosure is not limited thereto.

[0063] The second insulating layer 520 may be disposed on the first surface 101 of the main body 100. The second insulating layer 520 may contact the second surface CS2 of the cover portion 120.

[0064] When the first metal layers 411 and 421 of the external electrodes 410 and 420 are formed on the surface of the body 100 by plating, the second insulating layer 520 can be used as a plating resist. Therefore, the second insulating layer 520 can be formed on the surface of the body 100 before the formation of the first metal layers 411 and 421 of the external electrodes 410 and 420, thereby defining areas on the surface of the body 100 where the first metal layers 411 and 421 will be formed. However, the scope of this disclosure is not limited thereto.

[0065] The first insulating layer 510 and the second insulating layer 520 may include thermoplastic resins (such as polystyrene resin, vinyl acetate resin, polyester resin, polyethylene resin, polypropylene resin, polyamide resin, rubber resin, acrylic resin, and parylene resin), thermosetting resins (such as phenolic resin, epoxy resin, polyurethane resin, melamine resin, and alkyd resin), photosensitive resins, and SiO2. x or SiN x .

[0066] The first insulating layer 510 and the second insulating layer 520 can be formed by coating liquid insulating resin onto the surface of the body 100, coating insulating paste onto the surface of the body 100, stacking insulating films on the surface of the body 100, or forming insulating resin on the surface of the body 100 by vapor deposition. When the first insulating layer 510 and the second insulating layer 520 are formed by stacking insulating films on the surface of the body 100, dry films (DF) including photosensitive insulating resin, Ajinomoto stacked films (ABF) excluding photosensitive insulating resin, or polyimide films, etc., can be used.

[0067] Figure 6 This is another modified example of the first embodiment of this disclosure. Figure 3 The corresponding cross-sectional view.

[0068] Reference Figure 6The first insulating layer 510 may extend onto the first side surface 103 and the second side surface 104 of the body 100. The first insulating layer 510 may cover the portions of the first metal layers 411 and 421 disposed on the first side surface 103 and the second side surface 104 of the body 100.

[0069] The first insulating layer 510 may be disposed on the first side surface 103 and the second side surface 104 of the main body 100, thereby realizing a coil assembly with a lower electrode structure. The second metal layer may not be disposed on the first side surface 103 and the second side surface 104 of the main body 100, and may be disposed only on the first surface 101 of the main body 100.

[0070] (Second Embodiment) Figure 7 This is a schematic perspective view of a coil assembly according to a second embodiment of the present disclosure. Figure 8 It is along Figure 7 The cross-sectional view taken from line II-II'.

[0071] Reference Figure 7 and Figure 8 In the coil assembly 2000 according to the second embodiment, the molding part 110 may include ferrite as a magnetic material.

[0072] Ferrites can be at least one of the following: spinel-type ferrites (such as Mg-Zn type ferrites, Mn-Zn type ferrites, Mn-Mg type ferrites, Cu-Zn type ferrites, Mg-Mn-Sr type ferrites and Ni-Zn type ferrites), hexagonal ferrites (such as Ba-Zn type ferrites, Ba-Mg type ferrites, Ba-Ni type ferrites, Ba-Co type ferrites and Ba-Ni-Co type ferrites), garnet-type ferrites (such as Y-type ferrites) and Li-type ferrites.

[0073] When the molding portion 110 includes ferrite as the magnetic material, the first insulating layer 510 may not be provided on surfaces MS2, MS3, MS4, MS5, and MS6 of the outer surface of the main body 100 of the molding portion 110. Since the first insulating layer 510 can be omitted, the molding portion 110 can be additionally provided in the space where the first insulating layer 510 is omitted, and the volume of the main body, that is, the volume of the magnetic material, can be ensured.

[0074] The plurality of side surfaces MS3, MS4, MS5 and MS6 of the molding portion 110 may be located outside the plurality of side surfaces CS3, CS4, CS5 and CS6 of the cover portion 120. In other words, the plurality of side surfaces MS3, MS4, MS5 and MS6 of the molding portion 110 may be positioned relative to the plurality of side surfaces CS3, CS4, CS5 and CS6 of the cover portion 120 toward the outside of the body 100.

[0075] The external electrodes 410 and 420 may not be provided on the plurality of side surfaces MS3, MS4, MS5 and MS6 of the molding portion 110. When the first metal layers 411 and 421 of the external electrodes 410 and 420 are formed, the plurality of side surfaces MS3, MS4, MS5 and MS6 of the molding portion 110 may be used as a resist agent.

[0076] The cover portion 120 may include resin and magnetic metal particles dispersed in the resin.

[0077] Since the molding portion 110 and the covering portion 120 include different magnetic materials, a boundary can be formed in the part where the molding portion 110 and the covering portion 120 intersect.

[0078] Figure 9 This is a modified example of the second embodiment of the present disclosure. Figure 8 The corresponding cross-sectional view.

[0079] Reference Figure 9 The molding portion 110 may also include a protrusion 113 protruding from the first surface MS1.

[0080] The protrusion 113 may contact the coil 300 or the insulating film IF covering the coil 300. A portion of the cover 120 may be disposed in the space between the molding portion 110 and the coil 300. Alternatively, a portion of the cover 120 may be disposed in the through hole H of the support member 200.

[0081] As an effect of this disclosure, coil assemblies that allow for diversification of structure and characteristics can be provided.

[0082] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: The body includes a first surface and a second surface facing each other in a first direction, and a first side surface and a second side surface facing each other in a second direction, and includes a magnetic material; A support member is disposed within the main body, including a first surface of the support member and a second surface of the support member facing each other in the first direction, and having a through hole penetrating the support member in the first direction; A coil is disposed on at least one of the first surface and the second surface of the support member; External electrodes are disposed on the first side surface of the main body, the second side surface of the main body, and the first surface of the main body; as well as A first insulating layer is disposed on the second surface of the body. The main body includes: a molding portion comprising a first surface and a second surface of the molding portion opposite to each other in the first direction, and a plurality of side surfaces connecting the first surface and the second surface of the molding portion, and including a core protruding from the first surface of the molding portion and passing through the through hole; and a cover portion disposed on the first surface of the molding portion, and The second surface of the molding portion forms the second surface of the body.

2. The coil assembly according to claim 1, wherein, The molding portion and the covering portion comprise resin and magnetic metal particles dispersed in the resin.

3. The coil assembly according to claim 2, wherein, The molding section includes first magnetic metal particles, the covering section includes second magnetic metal particles, and the first magnetic metal particles in the molding section and the second magnetic metal particles in the covering section have different particle size distributions.

4. The coil assembly according to claim 2, wherein, The resin content of the molding part is greater than that of the covering part.

5. The coil assembly according to claim 1, wherein, The external electrode is not disposed on the second surface of the main body.

6. The coil assembly according to claim 1, wherein, The first insulating layer covers the portion of the external electrode disposed on the first side surface and the second side surface of the body.

7. The coil assembly according to claim 1, wherein, The cover includes: a first surface of the cover that contacts the first surface of the molding portion; a second surface of the cover that faces the first surface of the cover; and a plurality of side surfaces that connect the first surface of the cover and the second surface of the cover, wherein the second surface of the cover forms the first surface of the body.

8. The coil assembly according to claim 1, wherein, The external electrode includes a first external electrode disposed on the first side surface and the first surface of the body, and a second external electrode disposed on the second side surface and the first surface of the body.

9. The coil assembly according to claim 1, wherein, The coil includes: a first coil pattern disposed on the first surface of the support member; a second coil pattern disposed on the second surface of the support member; and a through hole penetrating the support member and connecting the first coil pattern and the second coil pattern.

10. The coil assembly according to claim 1, wherein, The molded portion has a T-shape in cross-sectional views along the first and second directions.

11. A coil assembly, comprising: The body includes a first surface and a second surface facing each other in a first direction, and a first side surface and a second side surface facing each other in a second direction, and includes a magnetic material; A support member is disposed within the main body, including a first surface of the support member and a second surface of the support member facing each other in the first direction, and having a through hole penetrating the support member in the first direction; A coil is disposed on at least one of the first surface and the second surface of the support member; as well as External electrodes are disposed on the first side surface and the second side surface of the main body. The main body includes: a molding portion comprising a first surface and a second surface of the molding portion opposite to each other in the first direction, and a plurality of side surfaces connecting the first surface and the second surface of the molding portion, and including a core protruding from the first surface of the molding portion and passing through the through hole; and a cover portion disposed on the first surface of the molding portion. The molding part includes ferrite, and The covering includes resin and magnetic metal particles dispersed in the resin.

12. The coil assembly according to claim 11, wherein, The cover includes: a first surface of the cover that contacts the first surface of the molding portion; a second surface of the cover that faces the first surface of the cover; and a plurality of side surfaces that connect the first surface of the cover and the second surface of the cover, wherein the plurality of side surfaces of the molding portion are located outside the plurality of side surfaces of the cover.

13. The coil assembly of claim 11, wherein, The external electrode is not disposed on the plurality of side surfaces of the molding portion.

14. The coil assembly of claim 11, wherein, The molding portion further includes a protrusion extending from the first surface of the molding portion, and a portion of the covering portion is disposed between the first surface of the molding portion and the coil.

15. The coil assembly of claim 11, wherein, The second surface of the molding portion forms the second surface of the body.

16. The coil assembly of claim 11, wherein, The molded portion has a T-shape in cross-sectional views along the first and second directions.

Images