Flood-prevention shielding type front plug-in device and production process

Abstract

The invention discloses a flood-prevention shielding type front plug device and a production process, the flood-prevention shielding type front plug device comprises a T-shaped insulating sleeve, the T-shaped insulating sleeve comprises a transverse pipe and a vertical pipe which are communicated with each other, the end face of the transverse pipe extends outwards to form a plug hole, the plug hole is communicated with the transverse pipe, and the transverse pipe and the vertical pipe are of an integrated structure made of a silicone rubber material; the inner semi-conducting layer covers the middle part of the transverse pipe and the whole inner wall of the vertical pipe, connecting areas are arranged on the inner sides of the two ends of the inner semi-conducting layer, and the connecting areas are respectively communicated with the inserting holes in the two ends of the transverse pipe; the outer semi-conducting layer is coated on the outer walls of the transverse pipe and the vertical pipe; and the cable bracket is arranged outside the inner semi-conductive layer of the inner wall of the vertical pipe and is used for leading in and penetrating through a cable. The silicon rubber integrated structure and the semi-conductive layer are adopted for shielding, and the problems of flood prevention, water prevention and induced charge are solved; the support fixes the cable to prevent poor crimping, the conductive part opening is convenient for maintenance, and the stability is improved.

Description

Technical Field

[0001] This invention relates to the field of power equipment technology, and in particular to a flood-proof shielded front insertion device and its manufacturing process. Background Technology

[0002] In power supply systems, ring network switchgear, as a key device connecting power supply cables and branch cables, is widely used in substations and prefabricated substations in load centers such as residential communities, large public buildings, and factories.

[0003] However, the plug-in devices used in existing ring network switchgear have many problems.

[0004] On the one hand, when the ring network switchgear is in operation, due to the effect of the high voltage electric field, induced charges will be generated on the surface of the pluggable device. When a local cable terminal fails, it is not possible to directly perform plugging and unplugging operations. The power must be cut off to the ring network switchgear before the cable can be pulled out for maintenance, which results in a large impact range for maintenance.

[0005] On the other hand, ring main switchgear is usually placed outdoors. Under severe weather conditions such as rainstorms and floods, the induced charge on the surface of the plug-in device can become conductive in water, posing a great safety hazard. At the same time, traditional plug-in devices have shortcomings in structural design, such as insufficient phase separation length of cable terminals. For large cross-section cables, improper construction can easily lead to stress on the cable terminals, poor crimping with the bushing, and overheating, which can cause material aging and even accidents due to insulation failure. Therefore, a flood-proof shielded front-plug device and its manufacturing process are proposed. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a flood-proof shielded front insertion device and its manufacturing process, thereby solving the problems mentioned in the background section.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a flood-proof shielded front insertion device, comprising:

[0008] The T-type insulating sleeve includes a horizontal tube and a vertical tube that are interconnected. The end of the horizontal tube extends outward to form a plug hole, which is connected to the horizontal tube. The horizontal tube and the vertical tube are an integral structure made of silicone rubber, which can enhance the sealing and flood resistance of the overall structure, effectively block external water intrusion, and improve flood control performance.

[0009] An internal semiconducting layer covers the middle part of the horizontal tube and the entire inner wall of the vertical tube. Connection areas are opened on the inner sides of both ends of the internal semiconducting layer. The connection areas are respectively connected to the insertion holes at both ends of the horizontal tube. They can work together to shield the internal electric field, reduce the accumulation of induced charge, and ensure the conductivity stability of the connection area.

[0010] An external semiconductor layer covers the outer wall of the horizontal and vertical tubes and extends beyond the end face of the horizontal tube, which can enhance the external shielding effect. Together with the internal semiconductor layer, it forms a complete shielding system, further reducing the safety risks caused by surface induced charges.

[0011] A cable support is installed on the outside of the inner semiconducting layer of the inner wall of the vertical pipe. It can provide stable support for the cable, prevent the cable terminal from shifting due to force, and reduce the heat generation and material aging problems caused by poor crimping. The cable support is used to guide and pass the cable through. The lower port of the cable support is larger and the upper port is smaller.

[0012] The conductive connection part is formed by the outward protrusion of the outer semiconducting layer on the outer wall of the vertical tube. An opening is opened on the outside of the conductive connection part to facilitate the quick connection and maintenance of external conductive components, reduce the power outage range during maintenance, and improve the ease of use. The insertion hole has a tapered structure that gradually narrows outward. The other end of the horizontal tube has an insertion hole that gradually widens outward. The lower end of the vertical tube has a tapered structure.

[0013] Preferably, the connection between the horizontal and vertical tubes of the T-shaped insulating sleeve adopts an arc transition structure. The arc transition structure is integrally formed with the horizontal and vertical tubes. This structure can reduce the concentration of electric field stress and enhance the overall mechanical strength of the T-shaped insulating sleeve, avoiding cracking due to stress concentration during installation or use. The integral structure of the silicone rubber material ensures the accuracy of the interference fit when the horizontal and vertical tubes are matched with other connecting devices, so that the interior is sealed after connection, and has excellent waterproof and floodproof effects.

[0014] Preferably, the internal semiconductor layer has a gradual transition section near the edges of both ends in the coverage area of ​​the middle part of the horizontal tube. The gradual transition section gradually thins from the coverage area in the middle of the horizontal tube towards the insertion holes at both ends of the horizontal tube where the internal semiconductor layer is not covered. Since the internal semiconductor layer only covers the middle part of the horizontal tube, and the insertion hole areas at both ends of the horizontal tube are not covered by the internal semiconductor layer, this gradual transition section can optimize the electric field distribution between the coverage area in the middle of the horizontal tube and the uncovered areas at both ends, reduce corona generation, and further improve the shielding effect.

[0015] Preferably, the outer semiconducting layer extends beyond the end face of the horizontal tube and covers other connecting devices when connected to them, enhancing the shielding effect. The conductive connection part is connected to the grounding wire through an opening, improving the shielding effect of the outer semiconducting layer and the safety of the device.

[0016] A manufacturing process for a flood-proof shielded front insertion device, based on the aforementioned flood-proof shielded front insertion device, includes the following steps:

[0017] Step 1: Raw material preparation:

[0018] Select suitable silicone rubber material to make T-shaped insulating sleeves, prepare semiconducting material to make inner semiconducting layer, outer semiconducting layer, and insulating material to make cable bracket and conductive material to make conductive connection part;

[0019] Step 2: Forming the T-shaped insulating sleeve:

[0020] The silicone rubber material is injected into a T-shaped mold using a mold injection molding process, followed by demolding and visual inspection.

[0021] Step 3: Preparation and Installation of Internal Semiconductor Layer

[0022] Semiconductor material is wrapped around the middle of the horizontal tube and the inner wall of the vertical tube of the T-shaped insulating sleeve, and a connection area is opened.

[0023] Step 4: Cable bracket installation:

[0024] The cable bracket is installed on the inner semiconducting layer of the inner wall of the vertical pipe;

[0025] Step 5: Fabrication and Installation of the External Semiconductor Layer

[0026] Semiconductor material is wrapped around the outer walls of the horizontal and vertical tubes of the T-shaped insulating sleeve;

[0027] Step Six: Fabrication and Installation of Conductive Connections:

[0028] Conductive material is processed into conductive connectors and installed on the outside of the outer semiconducting layer on the outer wall of the vertical pipe;

[0029] Step 7: Overall Testing and Debugging

[0030] The completed device is tested for insulation performance, shielding effect, and waterproof performance, and any problems are adjusted and repaired.

[0031] When coating semiconductor materials, high-precision coating equipment is used to ensure that the semiconductor materials are evenly adhered to the middle of the horizontal tube and the inner wall of the vertical tube, with the thickness controlled within the range of 0.5-1mm. The connection area is precisely opened by laser engraving technology to ensure that the edge of the connection area is smooth and burr-free, and to ensure the connection stability with the subsequent insertion hole.

[0032] During the raw material preparation stage, silicone rubber, semiconductor materials, and conductive materials are rigorously selected to ensure the basic performance of the device. The T-shaped insulating sleeve is formed using a mold injection molding process with precise parameter control, ensuring that the sleeve is defect-free and has high mechanical strength. The internal semiconductor layer is uniformly coated and laser-engraved to optimize the electric field distribution and improve connection reliability. The installation design of the cable bracket and conductive connection takes into account both cable guidance and grounding safety. The external semiconductor layer completely covers the outer wall to enhance the shielding effect. Finally, insulation, shielding, and waterproof performance tests ensure that the device meets the design requirements. The entire process is logically clear, and each link works closely together, effectively improving the device's waterproof, flood-proof, and electromagnetic shielding capabilities, while ensuring long-term operational stability and safety.

[0033] Preferably, in the raw material preparation step, the silicone rubber material has insulation performance, waterproof performance and mechanical strength that meet the requirements of the device, the semiconductor material has good conductivity and shielding effect, the insulating material is a high-strength material, and the conductive material is a material with good conductivity.

[0034] In the raw material preparation process, to ensure that the material performance meets the standards, the silicone rubber material must be tested by a professional institution to confirm that its insulation resistance is not lower than a specific standard value (such as 100MΩ), its waterproof rating reaches IPX8, and its mechanical strength can withstand the tensile and compressive forces during the installation and use of the device without breaking. Semiconductor materials must provide a conductivity test report to ensure stable conductivity. Insulating materials should be made of high-strength engineering plastics that can withstand long-term use without aging. Conductive materials should be made of high-purity copper or aluminum to ensure good conductivity and corrosion resistance.

[0035] The adequacy of raw material preparation is crucial to the performance of the flood-proof shielded front insertion device. The high insulation, water resistance, and mechanical strength of the silicone rubber material ensure the stable operation of the device in harsh environments, preventing malfunctions caused by leakage and water ingress. The good conductivity and shielding effect of the semiconductor material optimize the electric field distribution, reduce corona generation, and improve the safety of the device. High-strength insulating materials and highly conductive materials respectively ensure the stability of the cable support and the reliability of the conductive connection, enhancing the overall mechanical strength and grounding effect of the device. These measures together improve the durability, safety, and shielding effectiveness of the device.

[0036] Preferably, in the T-shaped insulating sleeve molding step, the parameters of injection temperature, pressure and time are controlled so that the silicone rubber material can flow fully in the mold and be molded to form a defect-free T-shaped insulating sleeve.

[0037] To ensure sufficient flow of silicone rubber material and the formation of a defect-free sleeve, the injection temperature must be controlled within the optimal temperature range of the silicone rubber material's melting point (e.g., 160-180℃, adjusted according to the specific material). The injection pressure should be set to a value that fills the mold without causing material decomposition (e.g., 5-10MPa). The injection time should be set according to the sleeve thickness and mold complexity to allow sufficient time for material to fill and cure (e.g., 30-60 seconds). By precisely controlling these parameters, it is possible to ensure uniform flow of silicone rubber material in the mold, avoiding defects such as bubbles and cracks, and forming a structurally complete and stable T-shaped insulating sleeve.

[0038] In the T-type insulating sleeve molding process, precise control of injection temperature, pressure, and time parameters is crucial for producing high-quality flood-proof shielding front insert devices. Appropriate injection temperature ensures the silicone rubber material reaches its optimal melting state, promoting full flow within the mold and preventing incomplete melting due to insufficient temperature or material decomposition due to excessive temperature. Reasonable injection pressure ensures the material evenly fills every corner of the mold, preventing uneven filling due to insufficient pressure or material breakage due to excessive pressure. Appropriate injection time allows sufficient time for the material to solidify in the mold, ensuring the stability and integrity of the sleeve structure. By precisely controlling these key parameters, not only can defect-free T-type insulating sleeves be formed, improving the overall quality and reliability of the product, but also the scrap rate during production can be effectively reduced, lowering production costs. Furthermore, this refined production control helps improve the product's waterproof and flood-proof performance, as a defect-free sleeve structure better prevents water penetration, ensuring the safe operation of electrical equipment in harsh environments.

[0039] Preferably, in the internal semiconductor layer preparation and installation steps, a coating or winding process is used to uniformly cover the semiconductor material on the inner wall of the T-shaped insulating sleeve, and to ensure that the thickness of the internal semiconductor layer is uniform and consistent, and that it is tightly attached to the inner wall.

[0040] In the preparation and installation of the internal semiconductor layer, to ensure uniform coating of the semiconductor material, an automated coating equipment can be used, with precise coating speed and thickness parameters set. At the same time, the rotating T-shaped insulating sleeve is used to make the semiconductor material evenly wrapped or coated on the inner wall. After completion, a high-precision measuring tool is used to detect the thickness of the internal semiconductor layer to ensure that the thickness deviation at each point is within the allowable range, so as to achieve a tight fit with the inner wall.

[0041] Preferably, in the preparation and installation steps of the external semiconductor layer, a coating or injection molding process is used to completely cover the outer wall of the T-shaped insulating sleeve with the external semiconductor layer, and the length of the external semiconductor layer extending out of the end face of the horizontal tube is controlled to meet the design requirements.

[0042] In the preparation and installation of the external semiconductor layer, when using a coating process, the semiconductor material is prepared into a slurry of appropriate viscosity and sprayed evenly onto the outer wall of the T-shaped insulating sleeve using a spray gun. Alternatively, an injection molding process can be used, where the semiconductor material is heated and melted and then injected into a mold that wraps around the outer wall of the T-shaped insulating sleeve. At the same time, measuring tools are used to accurately measure the length of the external semiconductor layer extending beyond the end face of the horizontal tube. By adjusting the mold size or the spraying range, it is ensured that its length strictly meets the design requirements, guaranteeing the shielding and connection effects.

[0043] Preferably, in the manufacturing and installation steps of the conductive connection part, the conductive material is processed into a specific shape, and the conductive connection part is firmly installed on the outer semiconducting layer of the outer wall of the vertical pipe by welding or other suitable methods, ensuring that the opening position is convenient for the grounding wire to pass through;

[0044] First, according to the design requirements, the conductive material (such as copper or aluminum) is cut and bent into a specific shape, such as a rectangle or L-shape, to adapt to the installation requirements of the outer wall of the riser. Then, the conductive connection is firmly welded to the outer semiconducting layer of the outer wall of the riser by resistance welding, laser welding or other suitable welding processes. During the welding process, the welding temperature and time must be controlled to avoid damage to the semiconducting layer. Finally, check whether the opening position is accurate to ensure that it is easy to connect the grounding wire later.

[0045] In summary, compared with the prior art, the present invention provides a flood-proof shielded front insertion device and its manufacturing process, which has the following beneficial effects:

[0046] The T-shaped insulating sleeve of this invention adopts an integrated silicone rubber structure, which realizes the sealing of the structure and improves the flood resistance. It can effectively block the intrusion of external moisture and solve the waterproof problem during rainstorms and floods. The inner and outer semiconductor layers work together to shield the induced charge, reduce the accumulation of surface charge, solve the problem of power outages for maintenance due to induced charge, and reduce the safety hazards of conductivity in flood environments.

[0047] The cable bracket is fixed to the inner wall of the vertical pipe, which provides stable support for the cable, avoids stress on the cable terminal, and solves the problems of heat generation and aging caused by poor crimping. The open design of the conductive connection part enables convenient connection of external components, simplifies maintenance operations, reduces the scope of maintenance impact, and improves the overall operational stability and applicability of the device. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the flood-proof shielding front insertion device of the invention.

[0049] Figure 2 This is a structural cross-sectional view of the flood-proof shielding front insertion device of the invention.

[0050] Figure 3This is a flowchart illustrating the manufacturing process of the flood-proof shielding front insertion device of this invention.

[0051] Explanation of reference numerals in the attached figures:

[0052] 1. T-type insulating sleeve; 2. Horizontal tube; 3. Vertical tube; 4. Inner semiconducting layer; 5. Connection area; 6. Insertion hole; 7. Outer semiconducting layer; 8. Cable bracket; 9. Conductive connection part. Detailed Implementation

[0053] Example 1: Production and application of flood-proof shielded front insertion device:

[0054] Raw material preparation: High-quality silicone rubber material is selected, which has good insulation performance, waterproof performance reaches IPX8 level, high mechanical strength, and can withstand a certain external impact; the semiconductor material is carbon nanotube composite material with good conductivity and shielding effect; the insulation material of cable bracket 8 is high-strength epoxy resin material, and the conductive material of conductive connection part 9 is copper alloy.

[0055] Molding of T-type insulating sleeve 1: The silicone rubber material is heated to a suitable injection temperature, generally 180-200℃, and injected into the T-type mold under a pressure of 10-15MPa. The holding time is 5-8 minutes to allow the silicone rubber material to fully fill the mold cavity and form T-type insulating sleeve 1. After demolding, the T-type insulating sleeve 1 is visually inspected and no defects are found.

[0056] Preparation and installation of the inner semiconducting layer 4: The carbon nanotube composite material is uniformly coated on the middle part of the horizontal tube 2 and the inner wall of the vertical tube 3 of the T-shaped insulating sleeve 1 using a coating process. The coating thickness is controlled at 0.5-1mm. After coating, a connection area 5 is opened on the inner side of both ends of the inner semiconducting layer 4 using a special tool to ensure that the connection area 5 is connected to the insertion holes 6 at both ends of the horizontal tube 2.

[0057] Cable bracket 8 installation: The pre-made epoxy resin cable bracket 8 is firmly installed on the inner semi-conductive layer 4 of the inner wall of the vertical pipe 3 with adhesive to ensure that the position of the cable bracket 8 is accurate.

[0058] Preparation and installation of the outer semiconducting layer 7: Through injection molding, carbon nanotube composite material is injection molded onto the outer wall of the horizontal tube 2 and vertical tube 3 of the T-shaped insulating sleeve 1 to form an outer semiconducting layer 7 with a thickness of 1-1.5mm, and the outer semiconducting layer 7 extends 2-3mm beyond the end face of the horizontal tube 2.

[0059] Fabrication and installation of conductive connection part 9: The copper alloy is processed into a conductive connection part 9 of a specific shape, and an opening with a diameter of 5-8mm is made on the conductive connection part 9; then the conductive connection part 9 is installed on the outer semiconducting layer 7 of the outer wall of the vertical pipe 3 using a welding process, ensuring that the conductive connection part 9 protrudes outward;

[0060] Overall testing and debugging: The insulation performance of the device was tested using a professional insulation resistance tester. The insulation resistance value was greater than 1000MΩ, which meets the requirements. The shielding effect was tested using a shielding effectiveness tester. The shielding effectiveness reached more than 30dB, which meets the design requirements. The waterproof performance was tested. The device was completely submerged in water for 24 hours and then removed. No water ingress was found inside, indicating good waterproof performance.

[0061] Application scenario: This flood-proof shielded front-plug device was applied to a residential community substation in a city and used in conjunction with a ring network switchgear. During a rainstorm, the surrounding area was flooded, but the device effectively prevented water intrusion. During the operation of the ring network switchgear, no surface charge concentration was observed. When a cable terminal malfunctioned, it could be plugged and unplugged for maintenance, ensuring the normal power supply to the community.

[0062] Example 2: Production of flood-proof shielded front insertion devices of different specifications:

[0063] Adjusting raw material dimensions: Adjust the amount of silicone rubber material and mold size according to different usage requirements to produce T-type insulating sleeves 1 of different specifications; for example, for devices that need to connect large cross-section cables, appropriately increase the inner diameter of the horizontal tube 2 and vertical tube 3 of the T-type insulating sleeve 1.

[0064] Corresponding component adjustments: Based on the changes in the size of the T-type insulating sleeve 1, the material usage and coating thickness of the inner semiconducting layer 4 and the outer semiconducting layer 7 are adjusted accordingly; at the same time, the size and structure of the cable bracket 8 are adjusted to adapt to the requirements of cable introduction and passage of different specifications; for the conductive connection part 9, its shape and size are adjusted according to the overall size of the device and the installation position to ensure that the opening position is convenient for the connection of the grounding wire.

[0065] Production process adjustments: When injection molding the T-type insulating sleeve 1, adjust the injection temperature, pressure, and time parameters appropriately according to changes in mold size and material usage; when preparing and installing the inner semiconducting layer 4 and the outer semiconducting layer 7, adjust the coating or injection molding process parameters according to changes in material usage and coating thickness; when installing the cable bracket 8 and the conductive connection part 9, select appropriate installation methods and fixing methods according to changes in their size and structure.

[0066] Testing and Application: Comprehensive testing was conducted on the flood-proof shielded front-insertion devices of different specifications produced, and all performance indicators met the corresponding design requirements. These devices of different specifications were applied to different places, such as power distribution stations in factories and enterprises, and substations in large public buildings, which met the actual use needs and effectively improved the safety and stability of power supply.

[0067] This invention provides a technical solution: a flood-proof shielded front insertion device. Please refer to [link / reference]. Figure 1 and Figure 2 ,include:

[0068] T-type insulating sleeve 1, T-type insulating sleeve 1 includes a horizontal tube 2 and a vertical tube 3 that are interconnected. The end of the horizontal tube 2 extends outward to form a plug hole 6, which is connected to the horizontal tube 2. The horizontal tube 2 and the vertical tube 3 are an integral structure made of silicone rubber.

[0069] An inner semiconducting layer 4 covers the middle part of the horizontal tube 2 and the entire inner wall of the vertical tube 3. A connection area 5 is provided on the inner side of both ends of the inner semiconducting layer 4, and the connection area 5 is connected to the insertion hole 6 at both ends of the horizontal tube 2 respectively.

[0070] An outer semiconductor layer 7 covers the outer walls of the horizontal tube 2 and the vertical tube 3, and the outer semiconductor layer 7 extends out of the end face of the horizontal tube 2.

[0071] Cable bracket 8 is set outside the inner semiconducting layer 4 on the inner wall of the vertical pipe 3. It is used to guide and pass the cable through. The lower port of the cable bracket 8 is large and the upper port is small.

[0072] The conductive connection part 9 is formed by the outward protrusion of the outer semiconducting layer 7 on the outer wall of the vertical tube 3, and an opening is opened on the outside of the conductive connection part 9; the insertion hole 6 has a tapered structure that gradually narrows outward, and the other end of the horizontal tube 2 has an insertion hole 6 that gradually widens outward, and the lower end of the vertical tube 3 has a tapered structure.

[0073] When using injection molding to manufacture T-shaped insulating sleeve 1, the silicone rubber material must first be preheated to a suitable temperature, generally controlled between 120-150℃. Then, the preheated material is slowly injected into the T-shaped mold. During the injection process, the pressure is maintained at 8-12MPa, and the injection time is adjusted to 3-5 minutes according to the sleeve specifications to ensure that the silicone rubber material flows fully and fills the mold. After molding, the sleeve is naturally cooled to room temperature before demolding to ensure that it is free of defects.

[0074] The flood-proof shielding front insertion device adopts a T-shaped insulating sleeve 1, made of silicone rubber. The horizontal tube 2 and vertical tube 3 are integrated. The silicone rubber ensures precise interference fit with other connecting devices. After connection, the internal seal provides excellent waterproof and flood-proof effects. The arc transition structure at the connection between the horizontal tube 2 and the vertical tube 3 reduces electric field stress concentration, enhances overall mechanical strength, and prevents cracking during installation or use. The internal semiconducting layer 4 optimizes the electric field distribution, reduces corona, and improves the shielding effect. The extended end of the external semiconducting layer 7 covers other devices to enhance shielding. The conductive connection part 9 connects to the grounding wire to improve safety and shielding effect. The cable bracket 8 facilitates cable insertion and passage. The insertion hole 6 and the tapered structure at the lower end of the vertical tube 3 facilitate connection and installation. All structures work together to improve the performance and reliability of the device.

[0075] Please see Figure 1 and Figure 2 The connection between the horizontal tube 2 and the vertical tube 3 of the T-type insulating sleeve 1 adopts an arc transition structure. The arc transition structure is integrally formed with the horizontal tube 2 and the vertical tube 3. This structure can reduce the concentration of electric field stress and enhance the overall mechanical strength of the T-type insulating sleeve 1, avoiding cracking due to stress concentration during installation or use. The integral structure of silicone rubber material ensures the accuracy of the interference fit when the horizontal tube 2 and the vertical tube 3 are matched with other connecting devices, so that the inside is sealed after connection, and has excellent waterproof and floodproof effects.

[0076] When designing the T-shaped mold, the connection between the horizontal tube 2 and the vertical tube 3 is designed as an arc shape with a specific radius of curvature. This radius of curvature is determined based on the electric field distribution calculation and mechanical strength test results to ensure that it can effectively disperse the electric field stress and withstand the mechanical force during installation and use. During injection molding, by precisely controlling the injection temperature, pressure and time parameters, the silicone rubber material can fully fill the arc area of ​​the mold to form a defect-free integrated arc transition structure.

[0077] The connection between the horizontal tube 2 and the vertical tube 3 of the T-type insulating sleeve 1 adopts an arc transition structure and is integrally formed with the tube body, which has significant advantages: First, the arc structure can evenly disperse the electric field stress, avoiding the electric field concentration phenomenon caused by traditional right-angle connections, reducing the risk of corona generation and insulation breakdown; Second, the integrated molding process enhances the overall mechanical strength of the sleeve, preventing cracks caused by stress concentration during installation or use, and extending the equipment life; Third, the integrated structure of silicone rubber material ensures precise and controllable interference fit when mating with other connecting devices, forming a reliable sealing environment, effectively blocking moisture intrusion, thereby achieving excellent waterproof and floodproof effects at the same time, ensuring the stable operation of power equipment in harsh environments.

[0078] Please see Figure 1 and Figure 2 The internal semiconductor layer 4 has a gradual transition section near the two ends of the coverage area in the middle of the horizontal tube 2. The gradual transition section gradually thins from the coverage area in the middle of the horizontal tube 2 toward the insertion holes 6 at both ends of the horizontal tube 2 where the internal semiconductor layer 4 is not covered. Since the internal semiconductor layer 4 only covers the middle of the horizontal tube 2, and the insertion hole 6 areas at both ends of the horizontal tube 2 are not covered by the internal semiconductor layer 4, this gradual transition section can optimize the electric field distribution between the coverage area in the middle of the horizontal tube 2 and the uncovered areas at both ends, reduce corona generation, and further improve the shielding effect.

[0079] The specific implementation of the gradual transition section is as follows: when the inner semiconductor layer 4 covers the middle of the horizontal tube 2 near the two ends, the coating thickness of the semiconductor material is gradually reduced to form a transition area with gradually decreasing thickness from the middle of the horizontal tube 2 to the two end insertion holes 6. This transition section is achieved by precisely controlling the material flow rate and speed in the coating process to ensure a smooth transition without abrupt changes, thereby effectively optimizing the electric field distribution.

[0080] The internal semiconductor layer 4 has a gradual transition section in the middle of the horizontal tube 2. This design significantly optimizes the electric field distribution between the middle of the horizontal tube 2 and the uncovered areas at both ends. Since the internal semiconductor layer 4 does not cover the insertion holes 6 at both ends of the horizontal tube 2, the introduction of the gradual transition section effectively reduces the concentration of electric field at this point, thereby reducing the possibility of corona generation. This design not only improves the shielding effect of the device, but also enhances the safety of the overall electrical performance. Through a smooth electric field transition, it reduces electrical faults that may be caused by sudden changes in electric field, and improves the stability and reliability of the device operation. At the same time, this design does not require additional materials or complex structures, achieving optimization under existing process conditions, and is cost-effective and easy to implement.

[0081] Please see Figure 1 and Figure 2 The outer semiconducting layer 7 extends out of the end face of the horizontal tube 2 and covers other connecting devices when connected to them, enhancing the shielding effect. The conductive connection part 9 connects to the grounding wire through the opening, improving the shielding effect of the outer semiconducting layer 7 and the safety of the device.

[0082] When connecting with other connecting devices, the portion of the outer semiconducting layer 7 extending beyond the end face of the horizontal tube 2 is first stretched and shaped appropriately so that it can fit tightly against the outer surface of other connecting devices. Then, it is fixed and sealed with special conductive tape or conductive adhesive to ensure tight coverage and conductivity, thereby effectively enhancing the shielding effect. When the conductive connecting part 9 is connected to the grounding wire through the opening, the end of the grounding wire is first stripped to expose the internal conductive core wire. Then, the conductive core wire is inserted into the opening of the conductive connecting part 9 and the conductive core wire is firmly connected to the conductive connecting part 9 by welding or crimping to ensure reliable connection of the grounding wire, improve the shielding effect of the outer semiconducting layer 7 and the safety of the device.

[0083] The outer semiconducting layer 7 extends beyond the end face of the horizontal tube 2 and covers other connecting devices, which can expand the shielding range, make the electric field distribution of the entire connection range more uniform, reduce the electric field concentration phenomenon, and thus significantly enhance the shielding effect. It effectively prevents the influence of external electromagnetic interference on the inside of the device. At the same time, the conductive connection part 9 connects to the grounding wire through the opening, providing a reliable grounding path for the outer semiconducting layer 7, which can promptly conduct induced charges to the ground, further improving the shielding effect of the outer semiconducting layer 7. In addition, this design enhances the safety of the device, avoids equipment failure or safety accidents caused by electric field concentration or electromagnetic interference, ensures the stable operation of the device in complex electromagnetic environments, and improves the reliability and stability of the entire system.

[0084] A manufacturing process for a flood-proof shielded front insertion device, based on the above-mentioned flood-proof shielded front insertion device, please refer to [link to relevant documentation]. Figure 1 , Figure 2 and Figure 3 It includes the following steps:

[0085] Step 1: Raw material preparation:

[0086] Select suitable silicone rubber material to make T-type insulating sleeve 1, prepare semiconducting material to make inner semiconducting layer 4, outer semiconducting layer 7, and insulating material to make cable bracket 8 and conductive material to make conductive connection part 9;

[0087] Step 2: Forming the T-shaped insulating sleeve:

[0088] The silicone rubber material is injected into a T-shaped mold using a mold injection molding process, followed by demolding and visual inspection.

[0089] Step 3: Preparation and Installation of Internal Semiconductor Layer

[0090] Semiconductor material is wrapped around the middle of the horizontal tube 2 and the inner wall of the vertical tube 3 of the T-shaped insulating sleeve 1, and a connection area 5 is opened.

[0091] Step 4: Cable bracket installation:

[0092] The cable bracket 8 is installed on the inner semiconducting layer 4 of the inner wall of the vertical pipe 3;

[0093] Step 5: Fabrication and Installation of the External Semiconductor Layer

[0094] Semiconductor material is wrapped around the outer walls of the horizontal tube 2 and vertical tube 3 of the T-shaped insulating sleeve 1;

[0095] Step Six: Fabrication and Installation of Conductive Connections:

[0096] The conductive material is processed into a conductive connection part 9 and installed on the outside of the outer semiconducting layer 7 on the outer wall of the vertical pipe 3;

[0097] Step 7: Overall Testing and Debugging

[0098] The completed device is tested for insulation performance, shielding effect, and waterproof performance, and any problems are adjusted and repaired.

[0099] When coating the semiconductor material, a high-precision coating device is used to ensure that the semiconductor material is evenly attached to the middle of the horizontal tube 2 and the inner wall of the vertical tube 3, with the thickness controlled within the range of 0.5-1mm. The connection area 5 is precisely opened by laser engraving technology to ensure that the edge of the connection area 5 is smooth and burr-free, and to ensure the connection stability with the subsequent insertion hole 6.

[0100] During the raw material preparation stage, silicone rubber, semiconductor materials, and conductive materials are rigorously selected to ensure the basic performance of the device. The T-shaped insulating sleeve 1 is formed using a mold injection molding process with precise parameter control, ensuring that the sleeve is defect-free and has high mechanical strength. The internal semiconductor layer 4 optimizes the electric field distribution and improves connection reliability through uniform coating and laser engraving technology. The installation design of the cable bracket 8 and conductive connection part 9 takes into account both cable guidance and grounding safety. The external semiconductor layer 7 completely covers the outer wall, enhancing the shielding effect. Finally, through insulation, shielding, and waterproof performance testing, the device is ensured to meet design requirements. The entire process is logically clear, with each link working closely together, effectively improving the device's waterproof, floodproof, and electromagnetic shielding capabilities, while ensuring long-term operational stability and safety.

[0101] Please see Figure 1 , Figure 2 and Figure 3 In the raw material preparation steps, the insulation performance, waterproof performance and mechanical strength of the silicone rubber material meet the requirements of the device, the semiconductor material has good conductivity and shielding effect, the insulating material is a high-strength material, and the conductive material is a material with good conductivity.

[0102] In the raw material preparation process, to ensure that the material performance meets the standards, the silicone rubber material must be tested by a professional institution to confirm that its insulation resistance is not lower than a specific standard value (such as 100MΩ), its waterproof rating reaches IPX8, and its mechanical strength can withstand the tensile and compressive forces during the installation and use of the device without breaking. Semiconductor materials must provide a conductivity test report to ensure stable conductivity. Insulating materials should be made of high-strength engineering plastics that can withstand long-term use without aging. Conductive materials should be made of high-purity copper or aluminum to ensure good conductivity and corrosion resistance.

[0103] The adequacy of raw material preparation is crucial to the performance of the flood-proof shielded front insertion device. The high insulation, water resistance, and mechanical strength of the silicone rubber material ensure the stable operation of the device in harsh environments, preventing malfunctions caused by leakage and water ingress. The good conductivity and shielding effect of the semiconductor material optimize the electric field distribution, reduce corona generation, and improve the safety of the device. High-strength insulating materials and highly conductive materials respectively ensure the stability of the cable bracket 8 and the reliability of the conductive connection 9, enhancing the overall mechanical strength and grounding effect of the device. These measures together improve the durability, safety, and shielding effectiveness of the device.

[0104] Please see Figure 1 , Figure 2 and Figure 3 In the T-shaped insulating sleeve molding process, the parameters of injection temperature, pressure and time are controlled to ensure that the silicone rubber material flows fully in the mold and is formed to create a defect-free T-shaped insulating sleeve 1.

[0105] To ensure sufficient flow of silicone rubber material and the formation of a defect-free sleeve, the injection temperature must be controlled within the optimal temperature range of the silicone rubber material's melting point (e.g., 160-180℃, adjusted according to the specific material). The injection pressure should be set to a value that fills the mold without causing material decomposition (e.g., 5-10MPa). The injection time should be set according to the sleeve thickness and mold complexity to allow sufficient time for material to fill and cure (e.g., 30-60 seconds). By precisely controlling these parameters, it is possible to ensure uniform flow of silicone rubber material in the mold, avoiding defects such as bubbles and cracks, and forming a structurally complete and stable T-shaped insulating sleeve 1.

[0106] In the T-type insulating sleeve molding process, precise control of injection temperature, pressure, and time parameters is crucial for producing high-quality flood-proof shielding front insert devices. Appropriate injection temperature ensures the silicone rubber material reaches its optimal melting state, promoting full flow within the mold and preventing incomplete melting due to insufficient temperature or material decomposition due to excessive temperature. Reasonable injection pressure ensures the material evenly fills every corner of the mold, preventing uneven filling due to insufficient pressure or material breakage due to excessive pressure. Appropriate injection time allows sufficient time for the material to solidify in the mold, ensuring the stability and integrity of the sleeve structure. By precisely controlling these key parameters, not only can defect-free T-type insulating sleeves be formed, improving the overall quality and reliability of the product, but also the scrap rate during production can be effectively reduced, lowering production costs. Furthermore, this refined production control helps improve the product's waterproof and flood-proof performance, as a defect-free sleeve structure better prevents water penetration, ensuring the safe operation of electrical equipment in harsh environments.

[0107] Please see Figure 1 , Figure 2 and Figure 3 In the internal semiconductor layer preparation and installation steps, a coating or winding process is used to uniformly cover the inner wall of the T-shaped insulating sleeve 1 with semiconductor material, and to ensure that the thickness of the internal semiconductor layer 4 is uniform and consistent, and that it is tightly attached to the inner wall.

[0108] In the preparation and installation of the inner semiconductor layer, in order to ensure uniform coating of the semiconductor material, an automated coating equipment can be used, with precise coating speed and thickness parameters set. At the same time, the rotating T-shaped insulating sleeve 1 is used to make the semiconductor material evenly wrapped or coated on the inner wall. After completion, a high-precision measuring tool is used to detect the thickness of the inner semiconductor layer 4 to ensure that the thickness deviation at each place is within the allowable range, so as to achieve a tight fit with the inner wall.

[0109] The internal semiconducting layer 4 is uniformly coated or wound onto the inner wall of the T-shaped insulating sleeve 1, ensuring a uniform thickness and tight fit with the inner wall. This design has several advantages. First, the uniform semiconducting layer optimizes the electric field distribution, reduces corona generation, improves the shielding effect of the device, and ensures safe and stable power transmission. Second, the tight fit enhances the bonding force between the semiconducting layer and the insulating sleeve, improves the overall mechanical strength, and reduces the risk of detachment due to vibration or environmental factors. In addition, the uniform thickness and tight fit also help improve the waterproof performance of the device, preventing moisture infiltration that could lead to a decline in electrical performance, thereby extending the service life of the device and improving the reliability and safety of the power system operation.

[0110] Please see Figure 1 , Figure 2 and Figure 3 In the preparation and installation steps of the external semiconductor layer, the coating or injection molding process is used to completely cover the outer wall of the T-shaped insulating sleeve 1 with the external semiconductor layer 7, and the length of the external semiconductor layer 7 extending out of the end face of the horizontal tube 2 is controlled to meet the design requirements.

[0111] In the preparation and installation steps of the external semiconductor layer, when using the coating process, the semiconductor material is prepared into a slurry of appropriate viscosity and sprayed evenly on the outer wall of the T-shaped insulating sleeve 1 using a spray gun. Alternatively, the semiconductor material is heated and melted and injected into a mold that wraps the outer wall of the T-shaped insulating sleeve 1 to form the shape. At the same time, the length of the external semiconductor layer 7 extending out of the end face of the horizontal tube 2 is accurately measured using measuring tools. By adjusting the mold size or the spraying range, it is ensured that its length strictly meets the design requirements to guarantee the shielding and connection effect.

[0112] The coating or injection molding process ensures that the outer semiconducting layer 7 completely covers the outer wall of the T-shaped insulating sleeve 1, making the shielding effect of the entire device uniform and consistent, avoiding shielding gaps. The length of the outer semiconducting layer 7 extending beyond the end face of the horizontal tube 2 meets the design requirements. When connected with other connecting devices, it can better cover the connecting devices and enhance the overall shielding effect. At the same time, precise length control is conducive to the stable connection of the conductive connection part 9 to the grounding wire, improving the safety of the device. Overall, this preparation and installation method improves the shielding performance and operational safety of the flood-proof shielded front insertion device, ensuring the stability and reliability of power transmission.

[0113] Please see Figure 1 , Figure 2 and Figure 3 In the process of manufacturing and installing the conductive connection part, the conductive material is processed into a specific shape, and the conductive connection part 9 is firmly installed on the outer semiconducting layer 7 of the outer wall of the vertical pipe 3 by welding or other suitable methods, so as to ensure that the opening position is convenient for the grounding wire to be connected.

[0114] First, according to the design requirements, the conductive material (such as copper or aluminum) is cut and bent into a specific shape, such as a rectangle or L-shape, to adapt to the installation requirements of the outer wall of the vertical pipe 3. Then, the conductive connection part 9 is firmly welded to the outer semiconducting layer 7 of the outer wall of the vertical pipe 3 by resistance welding, laser welding or other suitable welding processes. During the welding process, the welding temperature and time need to be controlled to avoid damage to the semiconducting layer. Finally, check whether the opening position is accurate to ensure that it is convenient for the subsequent grounding wire to be connected.

[0115] First, by processing the conductive material into a specific shape and firmly installing it on the outer wall of the vertical pipe 3, the close contact between the conductive connection part 9 and the outer semiconducting layer 7 is ensured, improving the efficiency of current conduction. Second, the accurate setting of the opening position facilitates the quick connection of the grounding wire, simplifies the installation process, and improves work efficiency. In addition, the use of strong connection methods such as welding enhances the mechanical strength of the conductive connection part 9, avoiding safety hazards caused by loosening or falling off during use. Overall, this design not only improves the safety and reliability of the device but also promotes stable current transmission, providing a strong guarantee for the long-term stable operation of the flood-proof shielded front insertion device in complex environments.

Claims

1. A flood-proof shielded front insertion device, characterized in that, include: T-type insulating sleeve (1), the T-type insulating sleeve (1) includes a horizontal tube (2) and a vertical tube (3) that are connected to each other. The end of the horizontal tube (2) extends outward to form a plug hole (6). The horizontal tube (2) and the vertical tube (3) are an integral structure made of silicone rubber. An inner semiconducting layer (4) covers the middle part of the horizontal tube (2) and the entire inner wall of the vertical tube (3). A connection area (5) is provided on the inner side of both ends of the inner semiconducting layer (4). The connection area (5) is connected to the insertion holes (6) at both ends of the horizontal tube (2). An outer semiconductor layer (7) is wrapped around the outer wall of the horizontal tube (2) and the vertical tube (3), and the outer semiconductor layer (7) extends out of the end face of the horizontal tube (2); Cable bracket (8) is set on the outside of the inner semiconducting layer (4) on the inner wall of the vertical pipe (3); The conductive connection part (9) is formed by the outer semiconducting layer (7) of the outer wall of the vertical tube (3) protruding outward, and an opening is opened on the outside of the conductive connection part (9).

2. The flood-proof shielding front insertion device according to claim 1, characterized in that: The connection between the horizontal tube (2) and the vertical tube (3) of the T-shaped insulating sleeve (1) adopts an arc transition structure, and the arc transition structure is integrally formed with the horizontal tube (2) and the vertical tube (3).

3. The flood-proof shielding front insertion device according to claim 1, characterized in that: The internal semiconductor layer (4) has a gradual transition section near the two ends of the covering area in the middle of the horizontal tube (2). The gradual transition section gradually thins from the covering area in the middle of the horizontal tube (2) toward the insertion holes (6) at both ends of the horizontal tube where the internal semiconductor layer (4) is not covered.

4. The flood-proof shielding front insertion device according to claim 1, characterized in that: The outer semiconducting layer (7) extends out of the end face of the horizontal tube (2), and the conductive connection part (9) is connected to the grounding wire through the opening.

5. A manufacturing process for a flood-proof shielded front insertion device, based on the flood-proof shielded front insertion device as described in any one of claims 1-4, characterized in that, Includes the following steps: Step 1: Raw material preparation: Select suitable silicone rubber material to make T-type insulating sleeve (1), prepare semiconducting material to make inner semiconducting layer (4), outer semiconducting layer (7), and insulating material to make cable bracket and conductive material to make conductive connection part (9). Step 2: Forming the T-shaped insulating sleeve: The silicone rubber material is injected into a T-shaped mold using a mold injection molding process, followed by demolding and visual inspection. Step 3: Preparation and Installation of Internal Semiconductor Layer Semiconductor material is wrapped around the middle of the horizontal tube (2) and the inner wall of the vertical tube (3) of the T-shaped insulating sleeve (1), and a connection area (5) is opened. Step 4: Cable bracket installation: The cable bracket (8) is installed on the inner semiconducting layer (4) of the inner wall of the vertical pipe (3); Step 5: Fabrication and Installation of the External Semiconductor Layer Semiconductor material is wrapped around the outer walls of the horizontal tube (2) and vertical tube (3) of the T-shaped insulating sleeve (1); Step Six: Fabrication and Installation of Conductive Connections: The conductive material is processed into a conductive connection part (9) and installed on the outside of the outer semiconducting layer (7) on the outer wall of the vertical pipe (3); Step 7: Overall Testing and Debugging The completed device is tested for insulation performance, shielding effect, and waterproof performance, and any problems are adjusted and repaired.

6. The manufacturing process of a flood-proof shielding front insertion device according to claim 5, characterized in that: In the raw material preparation step, the insulation performance, waterproof performance, and mechanical strength of the silicone rubber material meet the requirements for use in the device.

7. The manufacturing process of a flood-proof shielding front insertion device according to claim 5, characterized in that: In the T-shaped insulating sleeve molding step, the parameters of injection temperature, pressure and time are controlled so that the silicone rubber material can flow and be formed in the mold to form a T-shaped insulating sleeve (1).

8. The manufacturing process of a flood-proof shielding front insertion device according to claim 5, characterized in that: In the preparation and installation steps of the internal semiconductor layer, a coating or winding process is used to uniformly coat the semiconductor material onto the inner wall of the T-shaped insulating sleeve (1).

9. The manufacturing process of a flood-proof shielding front insertion device according to claim 5, characterized in that: In the preparation and installation steps of the external semiconductor layer, the coating or injection molding process is used to completely cover the outer wall of the T-shaped insulating sleeve (1) with the external semiconductor layer (7), and the length of the external semiconductor layer (7) extending out of the end face of the horizontal tube (2) is controlled to meet the design requirements.

10. The manufacturing process of a flood-proof shielding front insertion device according to claim 5, characterized in that: In the manufacturing and installation steps of the conductive connection part, the conductive material is processed into a specific shape, and the conductive connection part (9) is firmly installed on the outer semiconducting layer (7) of the outer wall of the vertical pipe (3) by welding or other suitable methods.

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