Packaging tool and method for silicon micro-strip detector
By combining module bonding fixtures and detector pressing fixtures, and employing vacuum adsorption and multiple positioning technologies, the accuracy and protection issues in the packaging of silicon microstrip detector modules are solved, achieving high-precision, damage-free packaging results suitable for semiconductor device manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZIJINSHAN ASTRONOMICAL OBSERVATORY CHINESE ACAD OF SCI
- Filing Date
- 2025-12-23
- Publication Date
- 2026-04-21
AI Technical Summary
Existing technologies struggle to achieve high-precision, non-destructive packaging of silicon microstrip detection modules, especially in large-area silicon microstrip detection modules, where the packaging process cannot simultaneously ensure position resolution accuracy and module protection.
The system employs modular bonding fixtures and detector pressing fixtures, utilizing a combination of multi-material structural collaborative positioning and vacuum adsorption technology, along with various positioning pins and positioning methods to prevent silicon wafer scratches and achieve high-precision bonding and pressing.
It achieves high-precision packaging of silicon microstrip detection modules, avoiding scratches and damage, improving operational flexibility and structural stability, and is suitable for the manufacture of semiconductor device-specific equipment.
Smart Images
Figure CN121908674A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of high-energy physics silicon microstrip detector technology, and relates to a packaging tool and method, particularly to a packaging tool and method for a silicon microstrip detector. Background Technology
[0002] With the development of semiconductor technology, semiconductor particle detection technology and its performance are constantly improving. Silicon microstrip detector modules are commonly used track-based silicon microstrip detectors in particle physics. They can measure the specific location where charged particles strike the detector, and based on the measured information, their trajectories in space can be determined, providing technical and data support for high-energy physics research. Furthermore, large-area silicon microstrip detector modules can effectively improve the angular resolution of silicon microstrip detectors, enhancing their performance.
[0003] Firstly, the packaging process of the silicon microstrip detector module, specifically its bonding, is crucial. High-precision, high-reliability packaging ensures improved position resolution. Specifically, bonding involves attaching a silicon wafer with metal microstrips arranged on its surface to the PCB board using a tooling fixture, facilitating subsequent signal readout via electronics. Therefore, the bonding position accuracy and flatness significantly impact the position resolution of the silicon microstrip detector module. It is essential to ensure accuracy while simultaneously protecting the detector's performance and preventing scratches caused by improper structure or handling. Secondly, due to the limitations of semiconductor processes, silicon microstrip detector modules are relatively brittle and easily scratched or damaged by external forces. Furthermore, the required detection accuracy necessitates high-precision packaging while ensuring the module's safety. Therefore, packaging large-area silicon microstrip detector modules is challenging, demanding higher standards for packaging fixtures and processes. Summary of the Invention
[0004] This invention provides a packaging fixture and method for silicon microstrip detectors to overcome the shortcomings of existing technologies.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: In a first aspect, the present invention provides a packaging fixture for a silicon microstrip detector, wherein the silicon microstrip detector is composed of a plurality of silicon microstrip detection modules arranged in parallel on a support plate, the silicon microstrip detection module includes a PCB board and a plurality of silicon wafers arranged in a strip shape fixed on the PCB board, the surface of the silicon wafers being arranged with a plurality of metal microstrips, and adjacent silicon wafers being connected by solder wires to transmit signals. The packaging fixture includes a module bonding fixture and a detector pressing fixture; The module bonding fixture is used to bond silicon microstrip detection modules, including a bonding adsorption base, positioning strips, several silicon wafer positioning pins, a PCB board positioning structure, and a counterweight block. The bonding adsorption base is divided into several adsorption areas corresponding to several silicon wafers. The positioning strips are detachably fixed to the bonding adsorption base and are located on one side of the several adsorption areas. The several silicon wafer positioning pins correspond to several adsorption areas, and the silicon wafer positioning pins can be inserted into the side of the corresponding adsorption area perpendicular to the positioning strip. The positioning strips and silicon wafer positioning pins set on the bonding adsorption base form orthogonal positioning on both sides of the adsorption area, that is, positioning is achieved on both vertical sides of the adsorption area, and the silicon wafers can be placed on the corresponding adsorption areas through orthogonal positioning. The adsorption area has several annular bonding adsorption grooves that can generate negative pressure by evacuating air, which can adsorb and fix the silicon wafers placed thereon. The PCB board positioning structure is used to position the PCB board so that it is bonded above the several adsorbed and fixed silicon wafers. The counterweight block is equipped with a pressure block positioning structure, which can be placed on the PCB board bonded to several silicon wafers and is located above the several silicon wafers. The detector pressing fixture is used for pressing and assembling silicon microstrip detectors, and includes several positioning components, a mask plate, and a pressing and adsorption base. The positioning components include X-axis positioning parts and Y-axis positioning parts that can be detachably fixed to a support plate, forming an orthogonal positioning of the silicon microstrip detector module when fixed. The mask plate is a hollow plate that matches the shape and specifications of the silicon microstrip detector module. The pressing and adsorption base includes a pressing and adsorption plate and several suction cups that correspond one-to-one with several silicon wafers of the silicon microstrip detector module. The suction cups are fixed below the pressing and adsorption plate, and their lower surfaces have several annular pressing and adsorption grooves that can generate negative pressure by evacuating air, which can adsorb and fix the corresponding silicon wafers, thereby achieving the overall adsorption and fixation of the silicon microstrip detector module.
[0006] To optimize the above technical solution, the specific measures also include: Furthermore, the adhesive adsorption base includes an adhesive adsorption plate and a suction plate; the suction plate is a polytetrafluoroethylene plate, fixed above the adhesive adsorption plate; the adhesive adsorption groove is formed on the upper surface of the suction plate; each adsorption area of the adhesive adsorption plate and the suction plate is provided with an air extraction channel; in each adsorption area, one end of the air extraction channel of the adhesive adsorption plate is connected to a negative pressure device through an adhesive tooling pipe, and the other end is connected to one end of the air extraction channel of the suction plate, and the other end of the air extraction channel of the suction plate is formed in the adhesive adsorption groove.
[0007] Furthermore, the adhesive adsorption base has a pad groove formed on the adsorption plate between two adjacent adsorption areas. When the silicon wafer is placed on the adsorption area by orthogonal positioning, the pads on the edge of the silicon wafer for soldering solder wires are located above the pad groove.
[0008] Furthermore, the PCB board positioning structure consists of several PCB board positioning pins that can be inserted into the adhesive base; the PCB board has several positioning holes that correspond one-to-one with the several PCB board positioning pins; the PCB board can be attached to the top of several adsorbed and fixed silicon wafers by fitting the positioning holes onto the corresponding PCB board positioning pins.
[0009] Furthermore, the pressure block positioning structure consists of several pressure block positioning pins that can be inserted into the adhesive adsorption base; the side of the counterweight pressure block has several semi-circular positioning grooves that correspond one-to-one with several pressure block positioning pins; several pressure block positioning pins inserted into the adhesive adsorption base are distributed around the PCB board that is pasted on several silicon wafers, and the counterweight pressure block can be placed in the several pressure block positioning pins through the positioning grooves against the inner side of the pressure block positioning pins; Furthermore, the positioning strip is equipped with several positioning pins that can be inserted into the adhesive base; the positioning strip can be detachably fixed to the adhesive base by the several positioning pins.
[0010] Furthermore, both the silicon wafer positioning pin and the pressure block positioning pin include a pin body and a handle; the handle is fixed to one end of the pin body, forming a T-shaped structure; one of the two sides of the pin body opposite the handle is a plane.
[0011] Furthermore, the positioning strip is a copper strip; when the positioning strip is fixed on the adhesive adsorption base, it has several positioning protrusions on the side facing the adsorption area, and each adsorption area is equipped with a corresponding positioning protrusion.
[0012] Furthermore, the suction cup is provided with an air extraction channel; the pressing and adsorption plate is provided with a plurality of air extraction channels corresponding one-to-one with the plurality of suction cups; one end of the air extraction channel of the pressing and adsorption plate is connected to a negative pressure device through a pressing tooling pipe, and the other end is connected to one end of the air extraction channel of the corresponding suction cup, and the other end of the air extraction channel of the suction cup is opened in the pressing and adsorption groove; the suction cup is made of polytetrafluoroethylene; the suction cup is fixed to the pressing and adsorption plate by a plurality of countersunk screws, so that its thickness can be adjusted by countersunk screws.
[0013] Furthermore, the pressing and adsorption plate has several observation windows extending through its upper and lower surfaces, located on both sides of each of the suction cups along the length of the pressing and adsorption plate, corresponding to the positions of the solder wires between the silicon wafers; the side of the pressing and adsorption plate also has several observation grooves, located on both sides of each of the suction cups along the width of the pressing and adsorption plate, corresponding to the positions of the two edges of the silicon microstrip detection module; the size of the suction cup is smaller than the size of the silicon wafer; the width of the pressing and adsorption base does not exceed that of the silicon microstrip detection module.
[0014] Furthermore, the photomask is made of silicone.
[0015] Furthermore, both the X-axis positioning component and the Y-axis positioning component are bent plates with an L-shaped cross-section. One plate of the bent plate is fixed to the side of the support plate, and the other plate is placed on the upper surface of the support plate. Positioning is achieved by the side of the plate placed on the support plate.
[0016] Secondly, the present invention also provides a method for packaging a silicon microstrip detector using the above-mentioned packaging fixture, comprising the following steps: S1. Using the module pasting fixture, several silicon wafers are pasted onto the PCB board to fabricate the silicon microstrip detection module; S2. Solder wires are welded to adjacent silicon wafers in the silicon microstrip detection module; S3. Using the detector pressing fixture, several silicon microstrip detector modules with solder wires already welded are pasted and pressed onto the support plate to fabricate the silicon microstrip detector.
[0017] Further, S1 includes the following steps: S1.1 Fix the positioning strip to the adhesive base; S1.2 Place the silicon wafer on the corresponding adsorption area, then open the corresponding air extraction channel to adsorb and fix the silicon wafer, and then remove the corresponding silicon wafer positioning pin; adsorb and fix all silicon wafers in this way, and then remove the positioning strip. S1.3 Apply glue to the surface of the PCB board, and then use the PCB board positioning structure to place the PCB board on several silicon wafers; S1.4. The counterweight block is placed on the PCB board using the aforementioned pressure block positioning structure; specifically, several pressure block positioning pins are inserted into the adhesive base, and then the counterweight block is placed on the PCB board using the pressure block positioning pins, and then the several pressure block positioning pins are removed. S1.5. Allow the adhesive to cure and complete the bonding and fabrication of the silicon microstrip detection module.
[0018] Further, S3 includes the following steps: S3.1 Fix the X-axis positioning component corresponding to the silicon microstrip detection module to be installed on the support plate; S3.2 Place the mask plate using the X-axis positioning component, and apply adhesive to the cutouts in the mask plate; S3.3 Remove the mask plate and fix the Y-axis positioning component corresponding to the silicon microstrip detection module to be installed on the support plate; S3.4. Use the pressing and adsorption base to adsorb and fix the silicon microstrip detection module to be installed. During adsorption, each suction cup of the pressing and adsorption base corresponds one-to-one with each silicon wafer of the silicon microstrip detection module to be installed. S3.5. The silicon microstrip detection module to be installed is placed at the dispensing position using the pressing and adsorption base and with the help of the X-axis positioning component and the Y-axis positioning component, and the silicon microstrip detection module is fixed. Specifically, the pressing and adsorption plate has a groove at the position corresponding to the end of the PCB board. After the silicon microstrip detection module is placed at the dispensing position, the silicon microstrip detection module is fixed to the support plate at the groove using screws. S3.6 Remove the X-axis positioning component of the fixed silicon microstrip detection module, and remove the pressing tooling pipeline connected to the pressing adsorption base of the fixed silicon microstrip detection module. S3.7 Repeat S3.1 to S3.6 to fix all the silicon microstrip detection modules in sequence; S3.8. Allow the adhesive to cure, then remove the pressing and adsorption base of each silicon microstrip detection module and the Y-axis positioning component to complete the pressing and fabrication of the silicon microstrip detector.
[0019] The beneficial effects of the present invention are as follows: The present invention provides a packaging fixture and method for silicon microstrip detectors, including a module bonding fixture for bonding silicon microstrip detector modules and a detector pressing fixture for pressing large-area microstrip silicon microstrip detectors.
[0020] The module bonding fixture employs a multi-material structure for coordinated positioning, ensuring high-precision bonding and encapsulation while preventing the silicon wafer with its surface-mounted metal microstrips from being affected by the structure, thus avoiding scratches or cuts. Vacuum suction is used to adsorb the silicon microstrip detector, with annular bonding and adsorption grooves on the contact surface. This releases stress while increasing the adsorption area and improving structural stability. Multiple positioning pins and methods are incorporated for greater operational flexibility.
[0021] The detector lamination fixture uses PTFE (polytetrafluoroethylene) contact material to maximize the protection of the silicon microstrip detector module and prevent damage during the lamination process. During operation, suction is used for pickup to prevent direct contact that could damage the silicon microstrip detector module. It offers strong compatibility, allowing for multiple parallel arrangements to achieve lamination and encapsulation of large-area silicon microstrip detector modules.
[0022] This invention enables high-precision structural packaging of silicon microstrip detectors, consisting of silicon microstrip detection modules and large-area silicon microstrip detection modules, while ensuring that the performance of the silicon microstrip detection modules is not affected by factors such as scratches. The tooling is easy to operate, highly reliable, and has strong practicality, showing broad application prospects in fields such as semiconductor device manufacturing equipment. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the structure of a silicon microstrip detector; Figure 2This is a schematic diagram of the silicon microstrip detection module; Figure 3 This is a partial structural diagram of the module pasting fixture when placing the counterweight block; Figure 4 This is a partial structural diagram of the module bonding fixture before placing the silicon wafer; Figure 5 This is an exploded view of the modular pasting fixture. Figure 6 This is a partial structural diagram of the detector pressing fixture during static curing; Figure 7 This is a partial structural diagram of the detector pressing fixture when placing the mask plate; Figure 8 This is a structural diagram of the press-fit adsorption base of the detector press-fit tooling at different angles; Figure 9 This is a schematic diagram of the adhesive adsorption plate of the module adhesive fixture; Figure 10 This is a structural diagram showing the silicon wafer positioning pins / pressure block positioning pins of the module bonding fixture at different angles; Figure 11 This is a schematic diagram of the observation window and observation groove of the detector pressing fixture; Figure 12 This is a structural schematic diagram of the X-axis positioning component of the detector pressing fixture; Figure 13 This is a flowchart of the packaging process for a silicon microstrip detector using a packaging tool. Figure 14 This is a flowchart of the process for packaging a silicon microstrip detection module using a modular bonding tooling. Figure 15 This is a schematic diagram of the structure when a module bonding fixture is used to attach and fix a silicon wafer. Figure 16 This is a schematic diagram of the structure when the module bonding fixture adsorbs and fixes all the silicon wafers; Figure 17 This is a structural diagram of the module mounting fixture when placing the PCB board; Figure 18 This is a structural diagram of the module pasting fixture when removing the pressure block positioning pin; Figure 19 This is a flowchart of the detector lamination tooling for packaging silicon microstrip detectors; Figure 20 This is a schematic diagram of the detector pressing fixture for installing the X-axis positioning component and the Y-axis positioning component; Figure 21 This is a schematic diagram of the detector pressing tool pressing adsorption base adsorbing silicon micro strip detector module; Figure 22 This is a schematic diagram of a detector pressing fixture for mounting a silicon microstrip detector module. Figure 23 This is a schematic diagram of the detector pressing fixture for installing two silicon microstrip detector modules; The markings in the attached diagram are as follows: 11. Attach the adsorption base; 111. Attach the adsorption groove; 112. Attach the adsorption plate; 1121. Attach the air outlet of the adsorption plate; 1122. Attach the air inlet of the adsorption plate; 113. Adsorption plate; 114. Attach the tooling pipe; 115. Solder pad groove; 12. Positioning strip; 121. Strip positioning pin; 122. Positioning boss; 13. Silicon wafer positioning pin; 131. Pin body; 132. Handle; 14. Counterweight block; 141. Block positioning pin; 142. 15. Positioning groove; 21. PCB board positioning pin; 22. Mask plate; 22. Pressing and adsorption base; 221. Pressing and adsorption plate; 222. Suction cup; 223. Pressing and adsorption groove; 224. Pressing tooling pipeline; 225. Observation window; 226. Observation groove; 231. X-axis positioning component; 232. Y-axis positioning component; 223. Pressing and adsorption groove; A. Silicon micro-strip detection module; A1. PCB board; A2. Silicon wafer; A3. Metal micro-strip; A4. Solder wire; B. Support plate. Detailed Implementation
[0024] The specific embodiments of the present invention will be described below with reference to the accompanying drawings.
[0025] This invention provides a packaging fixture for a silicon microstrip detector.
[0026] like Figure 1 As shown, the silicon microstrip detector consists of several silicon microstrip detection modules A arranged in parallel on the support plate B, such as... Figure 2 As shown, the silicon microstrip detection module A includes a PCB board A1 and several silicon wafers A2 arranged in a strip shape fixed on the PCB board A1. Several metal microstrips A3 are arranged on the surface of the silicon wafers A2. Adjacent silicon wafers A2 are connected by solder wires A4, which are responsible for signal transmission.
[0027] The packaging fixtures include module bonding fixtures and detector pressing fixtures.
[0028] like Figure 3 , Figure 4 and Figure 5As shown, the module bonding fixture is used to bond the silicon microstrip detection module A, including a bonding and adsorption base 11, positioning strips 12, several silicon wafer positioning pins 13, a PCB board positioning structure, and a counterweight block 14. The bonding and adsorption base 11 is divided into several adsorption areas corresponding one-to-one with several silicon wafers A2. The positioning strips 12 are detachably fixed to the bonding and adsorption base 11 and are located on one side of the several adsorption areas. The several silicon wafer positioning pins 13 correspond one-to-one with several adsorption areas and can be inserted into the side of the corresponding adsorption area perpendicular to the positioning strips 12. The positioning strips 12 and silicon wafer positioning pins 13 set on the bonding and adsorption base 11 form orthogonal positioning on both sides of the adsorption area, that is, positioning is achieved on both vertical sides of the adsorption area, and the silicon wafers A2 can be placed on the corresponding adsorption areas through orthogonal positioning. The adsorption area has several annular bonding and adsorption grooves 111 that can generate negative pressure by evacuation, which can adsorb and fix the silicon wafers A2 placed thereon. The PCB board positioning structure is used to position the PCB board A1 so that it is bonded above the several adsorbed and fixed silicon wafers A2. The counterweight block 14 is equipped with a block positioning structure, which can be placed on the PCB board A1 that is pasted on several silicon wafers A2, and is located above the several silicon wafers A2.
[0029] like Figure 6 , Figure 7 and Figure 8 As shown, the detector pressing fixture is used for pressing and assembling silicon microstrip detectors, and includes several positioning components, a mask plate 21, and a pressing and adsorption base 22. The positioning components include X-axis positioning elements 231 and Y-axis positioning elements 232 that can be detachably fixed to the support plate B. When fixed, they form an orthogonal positioning for the silicon microstrip detector module A; that is, the X-axis positioning elements 231 and Y-axis positioning elements 232 are distributed on both vertical sides when the silicon microstrip detector module A is fixed to the support plate B, thereby achieving positioning in two vertical directions when the silicon microstrip detector module A is pasted onto the support plate B. The mask plate 21 is a perforated plate that matches the shape and specifications of the silicon microstrip detector module A. The pressing and adsorption base 22 includes a pressing and adsorption plate 221 and several suction cups 222 that correspond one-to-one with several silicon wafers A2 of the silicon microstrip detector module A. The suction cup 222 is fixed below the pressure adsorption plate 221. The lower surface has several annular pressure adsorption grooves 223 that can generate negative pressure by evacuating air, which can adsorb and fix the corresponding silicon wafer A2, thereby realizing the overall adsorption and fixation of the silicon microstrip detection module A.
[0030] The module bonding fixture employs an integral adsorption structure for adsorption, which better ensures the overall flatness of the multiple silicon wafers A2 within the silicon microstrip detection module A, thereby guaranteeing detection performance. The detector pressing fixture uses a separate adsorption structure with multiple suction cups 222. If pressing problems occur, the thickness of each suction cup 222 can be adjusted individually to ensure that the silicon wafers A2 are not damaged during the pressing process. Both the bonding adsorption groove 111 and the pressing adsorption groove 223 are annular, which disperses the vacuum suction force transmitted through the pores onto the surface of the silicon wafers A2, ensuring uniform adsorption force distribution and preventing excessive suction force from damaging the silicon wafers A2.
[0031] Specifically, regarding the module pasting fixture: like Figure 4 , Figure 5 and Figure 9 As shown, the adhesive adsorption base 11 includes an adhesive adsorption plate 112 and a suction plate 113. The adhesive adsorption plate 112 is made of aluminum alloy, which provides stronger structural rigidity and helps ensure structural accuracy. The suction plate 113 is made of polytetrafluoroethylene (PTFE) plate with countersunk holes. It is fixed above the adhesive adsorption plate 112 by corresponding countersunk screws, ensuring structural rigidity while maintaining a flat surface without protrusions, thus avoiding interference or impact on other structures. The adhesive adsorption groove 111 is formed on the upper surface of the suction plate 113. Each adsorption area of the adhesive adsorption plate 112 and the suction plate 113 is provided with an air extraction channel. In each adsorption area, one end of the air extraction channel of the adhesive adsorption plate 112 is connected to a negative pressure device through the adhesive tooling pipe 114, and the other end is connected to one end of the air extraction channel of the suction plate 113. The other end of the air extraction channel of the suction plate 113 is formed in the adhesive adsorption groove 111. Specifically, one end of the suction channel of the adhesive adsorption plate 112 is an adhesive adsorption plate outlet 1121 located on the side of the adhesive adsorption plate 112, which is connected to the negative pressure device through an adhesive tooling pipe 114 equipped with a valve. The other end is an adhesive adsorption plate inlet 1122 located on the upper surface of the adhesive adsorption plate 112. One end of the suction channel of the suction plate 113 is a suction plate outlet located on the lower surface of the suction plate 113. The adhesive adsorption plate inlet 1122 and the suction plate outlet are aligned and connected. The surface of the polytetrafluoroethylene plate is relatively soft, and it can directly contact the silicon wafer A2 without scratching the silicon wafer A2. In addition, the surface of the suction plate 113 has a high flatness, which can ensure the adhesive accuracy of the silicon microstrip detection module A.
[0032] like Figure 4 As shown, there is a pad groove 115 on the suction plate 113 between two adjacent adsorption areas of the adhesive adsorption base 11. When the silicon wafer A2 is placed on the adsorption area by orthogonal positioning, the pads on the edge of the silicon wafer A2 for soldering the solder wire A4 are located above the pad groove 115, thereby avoiding contact between the pads and the suction plate 113 and protecting the pads.
[0033] like Figure 3 , Figure 4 and Figure 5As shown, the PCB board positioning structure consists of several PCB board positioning pins 15 that can be inserted into the adhesive base 11. PCB board A1 has several positioning holes, each corresponding to one of the PCB board positioning pins 15. PCB board A1 can be attached to the top of several adsorbed and fixed silicon wafers A2 by fitting the positioning holes onto the corresponding PCB board positioning pins 15.
[0034] like Figure 3 and Figure 5 As shown, the pressure block positioning structure consists of several pressure block positioning pins 141 that can be inserted into the adhesive base 11. The side of the counterweight pressure block 14 has several semi-circular positioning grooves 142, which correspond one-to-one with the pressure block positioning pins 141. The pressure block positioning pins 141 inserted into the adhesive base 11 are distributed around the PCB board A1 that is pasted on several silicon wafers A2. The counterweight pressure block 14 can be placed in the pressure block positioning pins 141 through the positioning grooves 142 against the inner side of the pressure block positioning pins 141. That is, the pressure block positioning pins 141 are distributed around and close to the counterweight pressure block 14 when the counterweight pressure block 14 is directly above the several silicon wafers A2, thereby achieving strict and precise positioning of the counterweight pressure block 14. The positioning grooves 142 facilitate the fit with the pressure block positioning pins 141 and prevent over-positioning.
[0035] like Figure 4 and Figure 5 As shown, the positioning strip 12 is equipped with several positioning pins 121 that can be inserted into the adhesive base 11. The positioning strip 12 can be detachably fixed to the adhesive base 11 by the several positioning pins 121. Specifically, some of the positioning pins 121 are inserted into the positioning strip 12 and then into the adhesive base 11, while other positioning pins 121 are inserted into the adhesive base 11 along the side of the positioning strip 12. Together, they achieve the detachable fixation between the positioning strip 12 and the adhesive base 11.
[0036] like Figure 10 As shown, both the silicon wafer positioning pin 13 and the pressure block positioning pin 141 include a pin body 131 and a handle 132. The handle 132 is fixed to one end of the pin body 131, forming a T-shaped structure. One of the two sides of the pin body 131 opposite to the handle 132 is a flat surface. When the silicon wafer positioning pin 13 or the pressure block positioning pin 141 is inserted for positioning, its non-flat arc-shaped side faces the silicon wafer A2 or the counterweight pressure block 14, allowing for precise positioning of the silicon wafer A2 or the counterweight pressure block 14. When it is necessary to remove the silicon wafer positioning pin 13 or the pressure block positioning pin 141, it is rotated 90° so that the flat surface faces the silicon wafer A2 or the counterweight pressure block 14, thus preventing it from contacting the silicon wafer A2 or the counterweight pressure block 14 during removal and avoiding damage to the silicon wafer A2 or the counterweight pressure block 14.
[0037] Positioning strip 12 is made of copper. For example... Figure 4 and Figure 5 As shown, when the positioning strip 12 is fixed to the adhesive adsorption base 11, it has several positioning protrusions 122 on the side facing the adsorption area, and each adsorption area is equipped with a corresponding positioning protrusion 122. Preferably, each adsorption area is equipped with two positioning protrusions 122, forming a three-point positioning with the silicon wafer positioning pin 13. When the silicon wafer A2 is placed in its corresponding adsorption area, it is positioned by the positioning protrusions 122 and the silicon wafer positioning pin 13, that is, by contacting the two vertical sides of the silicon wafer A2 with the positioning protrusions 122 and the silicon wafer positioning pin 13. The copper strip is relatively soft and does not easily scratch the silicon wafer A2. Moreover, the copper strip has lower hardness than conventional steel positioning parts and is easy to polish, so that the positional accuracy of the positioning protrusions 122 can be adjusted according to the accuracy requirements, and can be adjusted in real time when deviation occurs.
[0038] Regarding the detector pressing fixture: like Figure 8 As shown, suction cup 222 is provided with an air extraction channel. Pressing and adsorption plate 221 is provided with several air extraction channels corresponding one-to-one with the suction cups 222. One end of the air extraction channel of pressing and adsorption plate 221 is connected to a negative pressure device through pressing tooling pipe 224, and the other end is connected to one end of the corresponding suction cup 222's air extraction channel. The other end of the suction cup 222's air extraction channel is located in the pressing and adsorption groove 223. Specifically, one end of the air extraction channel of pressing and adsorption plate 221 is a pressing and adsorption plate outlet located on the side of pressing and adsorption plate 221, connected to a negative pressure device through pressing tooling pipe 224 equipped with a valve; the other end is a pressing and adsorption plate inlet located on the lower surface of pressing and adsorption plate 221. One end of the air extraction channel of suction cup 222 is a suction cup outlet located on the upper surface of suction cup 222. The pressing and adsorption plate inlet and the suction cup outlet are aligned and connected. The material of pressing and adsorption plate 221 is aluminum alloy. The suction cup 222 is made of polytetrafluoroethylene, which is relatively soft and can effectively protect the silicon wafer A2. The suction cup 222 is fixed to the pressure adsorption plate 221 by several countersunk screws, so its thickness can be adjusted by the countersunk screws.
[0039] like Figure 6 , Figure 8 and Figure 11As shown, the pressing and adsorption plate 221 has several observation windows 225 extending through its upper and lower surfaces, located on both sides of each suction cup 222 along the length of the pressing and adsorption plate 221, corresponding to the positions of the solder wires A4 between the silicon wafers A2. The observation windows 225 are used to observe the condition of the solder wires A4 between the silicon wafers A2 and whether the silicon microstrip detection module A and the Y-axis positioning component 232 are tightly fitted during the pressing process, allowing for inspection of the packaging without affecting the pressing. The side of the pressing and adsorption plate 221 also has several observation grooves 226, located on both sides of each suction cup 222 along the width of the pressing and adsorption plate 221, corresponding to the positions of the two edges of the silicon microstrip detection module A. The observation grooves 226 are used to observe whether the silicon microstrip detection module A and the X-axis positioning component 231, and whether the silicon microstrip detection modules A are tightly fitted during the pressing process, allowing for inspection of the packaging without affecting the pressing.
[0040] like Figure 6 and Figure 8 As shown, the size of the suction cup 222 is smaller than the size of the silicon wafer A2. This facilitates observation of the edges of the silicon wafer A2 and also protects the solder wire A4. The width of the pressing and adsorption base 22 does not exceed that of the silicon microstrip detection module A, thereby ensuring that multiple silicon microstrip detection modules A can be pressed simultaneously, improving packaging efficiency.
[0041] The mask plate 21 is made of silicone.
[0042] like Figure 6 , Figure 7 and Figure 12 As shown, both the X-axis positioning component 231 and the Y-axis positioning component 232 are L-shaped bent plates. One plate is fixed to the side of the support plate B, and the other plate is placed on the upper surface of the support plate B. Positioning is achieved by the side of the plate on the support plate B. Specifically, positioning is achieved by the two vertical sides of the silicon microstrip detection module A, which is adsorbed and fixed by the press-fit adsorption base 22, contacting the sides of the plates on the support plate B of the X-axis positioning component 231 and the Y-axis positioning component 232. The X-axis positioning component 231 and the Y-axis positioning component 232 are made of polyimide material, ensuring structural rigidity and positioning accuracy while effectively protecting the silicon microstrip detection module A itself and preventing scratches that could affect its performance.
[0043] like Figure 13 As shown, the present invention also provides a method for packaging a silicon microstrip detector using a packaging fixture, comprising the following steps: S1. Using a module pasting fixture, several silicon wafers A2 are pasted onto the PCB board A1 to create a silicon microstrip detection module A.
[0044] S2. Solder wire A4 is welded to the adjacent silicon wafer A2 in the silicon microstrip detection module A.
[0045] S3. Using a detector pressing fixture, several silicon microstrip detector modules A with solder wires A4 already soldered are pasted and pressed onto the support plate B to fabricate a silicon microstrip detector.
[0046] Specifically, such as Figure 14 As shown, S1 includes the following steps: S1.1, such as Figure 4 As shown, the positioning strip 12 is fixed to the adhesive base 11.
[0047] S1.2, such as Figure 15 As shown, place silicon wafer A2 on the corresponding adsorption area, then fix silicon wafer A2 by opening the corresponding air extraction channel, and then remove the corresponding silicon wafer positioning pin 13. Repeat this process to fix all silicon wafers A2, and then remove the positioning strip 12. Figure 16 As shown.
[0048] S1.3. Apply adhesive to the surface of PCB board A1, and then use the PCB board positioning structure to place PCB board A1 on several silicon wafers A2, such as... Figure 17 As shown.
[0049] S1.4. Place the counterweight block 14 on the PCB board A1 using the pressure block positioning structure. Specifically, as follows... Figure 3 As shown, insert several pressure block positioning pins 141 onto the adhesive base 11, then use the pressure block positioning pins 141 to place the counterweight pressure block 14 on the PCB board A1, and then remove the pressure block positioning pins 141. Figure 18 As shown.
[0050] S1.5. Allow the adhesive to cure and complete the bonding and fabrication of the silicon microstrip detection module A.
[0051] like Figure 19 As shown, S3 includes the following steps: S3.1 Fix the X-axis positioning component 231 corresponding to the silicon microstrip detection module A to be installed onto the support plate B.
[0052] S3.2, such as Figure 7 As shown, a mask plate 21 is placed with the help of an X-axis positioning component 231, and adhesive is applied to the cutouts in the mask plate 21.
[0053] S3.3, such as Figure 20 As shown, remove the mask plate 21 and fix the Y-axis positioning component 232 corresponding to the silicon microstrip detection module A to be installed on the support plate B.
[0054] S3.4, such as Figure 21As shown, the silicon microstrip detection module A to be installed is fixed by the pressure adsorption base 22. During adsorption, each suction cup 222 of the pressure adsorption base 22 corresponds one-to-one with each silicon wafer A2 of the silicon microstrip detection module A to be installed.
[0055] S3.5, such as Figure 22 As shown, the silicon microstrip detection module A to be installed is placed at the dispensing position by the pressing and adsorption base 22 and with the help of the X-axis positioning component 231 and the Y-axis positioning component 232, thus fixing the silicon microstrip detection module A. Specifically, the pressing and adsorption plate 221 has a groove at the position corresponding to the end of the PCB board A1. After the silicon microstrip detection module A is placed at the dispensing position, screws are used to fix the silicon microstrip detection module A to the support plate B at this groove.
[0056] S3.6 Remove the X-axis positioning component 231 of the fixed silicon microstrip detection module A, and remove the pressing tooling pipe 224 connected to the pressing adsorption base 22 of the fixed silicon microstrip detection module A.
[0057] S3.7 Repeat S3.1~S3.6 to fix all silicon microstrip detection modules A in sequence, such as... Figure 23 and Figure 6 As shown.
[0058] S3.8. Allow the adhesive to cure, then remove the pressing and adsorption base 22 and Y-axis positioning component 232 of each silicon microstrip detector module A to complete the pressing and fabrication of the silicon microstrip detector.
[0059] In one specific embodiment, the bonding process of silicon microstrip detector module A is as follows: Before use, all structures in the module bonding fixture are cleaned to prevent contamination of the silicon microstrip detector surface. During cleaning, the various holes on the bonding adsorption plate 112 are rinsed multiple times with alcohol to prevent aluminum shavings from affecting the packaging performance of the silicon microstrip detector. After cleaning, the suction plate 113 is fixed to the bonding adsorption plate 112 with countersunk screws, ensuring that no screws protrude and that the corresponding holes on the suction plate 113 and the bonding adsorption plate 112 are aligned. Then, the silicon wafer positioning pin 13, PCB board positioning pin 15, and strip positioning pin 121 are installed. The positioning strip 12 is then installed using the strip positioning pin 121. The bonding fixture pipeline 114 is connected, and the bonding fixture pipeline 114 is connected to a vacuum pump to provide suction, while the valve on the bonding fixture pipeline 114 is temporarily closed. Using silicon wafer positioning pin 13 to provide X-axis positioning for silicon wafer A2, and using the positioning boss 122 of positioning strip 12 to provide Y-axis positioning for silicon wafer A2, place silicon wafer A2 on the surface of suction plate 113, and open the valve on the adhesive tooling pipe 114 corresponding to the suction area to clamp the silicon wafer A2. Then, by rotating the handle 132 of silicon wafer positioning pin 13, align its flat side with the side of silicon wafer A2, ensuring that the two are not in contact, slowly remove silicon wafer positioning pin 13. Repeat the above steps to clamp three silicon wafers A2 into their corresponding suction areas. After the silicon wafers A2 are placed and fixed, apply glue to the surface of PCB board A1 that contacts silicon wafer A2, and place it on several silicon wafers A2 under the limit of PCB board positioning pin 15. After placement, install pressure block positioning pin 141, and under the limit of pressure block positioning pin 141, press the counterweight pressure block 14 onto the other side of PCB board A1 to clamp PCB board A1 and silicon wafer A2. At this point, rotate the handle 132 of the pressure block positioning pin 141 so that its flat side is aligned with the pressure block, ensuring that the two are not in contact, and then slowly remove the pressure block positioning pin 141. This is a schematic diagram of the final pressing effect. After that, let it stand for 24 hours for the adhesive to cure, and the bonding process is complete.
[0060] The lamination process for the silicon microstrip detector is as follows: First, the support plate B and the detector lamination fixture itself are cleaned to prevent aluminum shavings or other impurities from affecting the performance of the silicon microstrip detector module A. High voltage is required during the testing of the silicon microstrip detector module A, and conductive impurities can cause short circuits. After cleaning, an X-axis positioning component 231 is installed on the surface of the support plate B. A mask plate 21 is then installed using the X-axis positioning component 231, and structural adhesive is injected into the cutouts. After adhesive application, the mask plate 21 is removed, and a Y-axis positioning component 232 is installed, completing the installation of one set of positioning component assemblies. The lamination adsorption base 22 is then used to press the silicon microstrip detector module A tightly against the substrate. The valve on the lamination fixture's pipeline 224 is opened, and the silicon microstrip detector module A is then gripped, connecting it to the lamination adsorption base 22 as a whole. Using X-axis positioning component 231 and Y-axis positioning component 232, the silicon microstrip detection module A is placed on the support plate B, with the two edges of the silicon microstrip detection module A tightly against the X-axis positioning component 231 and Y-axis positioning component 232. After pressing, the integrity of the solder wire A4 and the tightness of its edges are observed through the observation window 225 and observation groove 226 of the pressing adsorption base 22. After confirming that the pressing is correct, screws are installed at the screw holes at the beginning of the silicon microstrip detection module A to secure its position and prevent it from sliding and causing displacement. The valve on the pressing fixture pipeline 224 is closed, and the pressing fixture pipeline 224 is gently removed to complete the encapsulation of this silicon microstrip detection module A. Finally, the X-axis positioning component 231 is removed, and a shorter X-axis positioning component 231 is installed for positioning the next silicon microstrip detection module A. The remaining silicon microstrip detection modules A are sequentially encapsulated on the surface of the support plate B. Multiple sets of pressing and adsorption bases 22 can be arranged in parallel to achieve the pressing of a large area of silicon microstrip detection modules A. After all pressing is completed, the entire surface of silicon microstrip detection modules A is encapsulated after standing for 24 hours. The detection layer after encapsulation is complete.
[0061] In this invention, unless otherwise stated, scientific and technical terms used herein have the meanings commonly understood by those skilled in the art. Furthermore, the reagents, materials, and procedures used herein are all widely used in the relevant fields.
[0062] It should be noted that the terms such as "upper", "lower", "left", "right", "front", and "back" used in the invention are only for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.
[0063] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A packaging fixture for a silicon microstrip detector, characterized in that: The silicon microstrip detector consists of several silicon microstrip detection modules arranged in parallel on a support plate. Each silicon microstrip detection module includes a PCB board and several silicon wafers arranged in strips and fixed on the PCB board. The packaging fixture includes a module bonding fixture and a detector pressing fixture; The module bonding fixture includes a bonding adsorption base, positioning strips, several silicon wafer positioning pins, a PCB board positioning structure, and a counterweight block. The bonding adsorption base is divided into several adsorption areas corresponding to the silicon wafers. The positioning strips are detachably fixed to the bonding adsorption base and are located on one side of the several adsorption areas. The silicon wafer positioning pins can be inserted into one side of the adsorption area. The positioning strips and silicon wafer positioning pins on the bonding adsorption base form orthogonal positioning on both sides of the adsorption area, and the silicon wafers can be placed on the corresponding adsorption areas through orthogonal positioning. The adsorption area has several annular bonding adsorption grooves, which can adsorb and fix the silicon wafers placed thereon. The PCB board positioning structure is used to position the PCB board so that it is pasted on top of several adsorbed and fixed silicon wafers; the counterweight block can be placed on the PCB board through the block positioning structure and is located on top of several silicon wafers. The detector pressing fixture includes several positioning components, a mask plate, and a pressing and adsorption base. The positioning components include X-axis and Y-axis positioning parts that can be detachably fixed to a support plate, forming an orthogonal positioning of the silicon microstrip detection module when fixed. The mask plate is a hollow plate that matches the silicon microstrip detection module. The pressing and adsorption base includes a pressing and adsorption plate and several suction cups corresponding to the silicon wafers of the silicon microstrip detection module. The suction cups are fixed below the pressing and adsorption plate, and their lower surfaces have several annular pressing and adsorption grooves that can adsorb and fix the corresponding silicon wafers.
2. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: The adhesive adsorption base includes an adhesive adsorption plate and a suction plate; the suction plate is a polytetrafluoroethylene plate and is fixed above the adhesive adsorption plate; the adhesive adsorption groove is formed on the upper surface of the suction plate; each adsorption area of the adhesive adsorption plate and the suction plate is provided with an air extraction channel; in each adsorption area, one end of the air extraction channel of the adhesive adsorption plate is connected to a negative pressure device, and the other end is connected to one end of the air extraction channel of the suction plate, and the other end of the air extraction channel of the suction plate is formed in the adhesive adsorption groove.
3. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: The adhesive adsorption base has a pad groove between two adjacent adsorption areas. When the silicon wafer is placed on the adsorption area by orthogonal positioning, the pads on the edge of the silicon wafer are located above the pad groove.
4. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: The PCB board positioning structure consists of several PCB board positioning pins that can be inserted into the adhesive base; the PCB board has several positioning holes that correspond one-to-one with the several PCB board positioning pins; the PCB board can be attached to the top of several adsorbed and fixed silicon wafers by fitting the positioning holes onto the corresponding PCB board positioning pins. The pressure block positioning structure consists of several pressure block positioning pins that can be inserted into the adhesive adsorption base; the side of the counterweight pressure block has several positioning grooves that correspond one-to-one with several pressure block positioning pins; several pressure block positioning pins inserted into the adhesive adsorption base are distributed around the PCB board that is pasted on several silicon wafers, and the counterweight pressure block can be placed in the several pressure block positioning pins through the positioning grooves against the inner side of the pressure block positioning pins. The positioning strip is equipped with several positioning pins that can be inserted into the adhesive base; the positioning strip can be detachably fixed to the adhesive base by the several positioning pins.
5. The packaging fixture for the silicon microstrip detector according to claim 4, characterized in that: Both the silicon wafer positioning pin and the pressure block positioning pin include a pin body and a handle; the handle is fixed to one end of the pin body, forming a T-shaped structure; one of the two sides of the pin body opposite the handle is a plane.
6. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: The positioning strip is a copper strip; when the positioning strip is fixed on the adhesive adsorption base, it has several positioning protrusions on the side facing the adsorption area, and each adsorption area is equipped with a corresponding positioning protrusion.
7. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: The suction cup is provided with an air extraction channel; the pressing and adsorption plate is provided with a plurality of air extraction channels corresponding one-to-one with the plurality of suction cups; one end of the air extraction channel of the pressing and adsorption plate is connected to a negative pressure device, and the other end is connected to one end of the air extraction channel of the corresponding suction cup; the other end of the air extraction channel of the suction cup is opened in the pressing and adsorption groove. The suction cup is made of polytetrafluoroethylene; the suction cup is fixed to the press-fit adsorption plate by several countersunk screws.
8. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: The pressing and adsorption plate has several observation windows that penetrate its upper and lower surfaces, respectively located on both sides of each of the suction cups along the length of the pressing and adsorption plate. The side of the pressing and adsorption plate is also provided with several observation grooves, which are located on both sides of each of the suction cups in the width direction of the pressing and adsorption plate. The size of the suction cup is smaller than the size of the silicon wafer; the width of the pressing and adsorption base does not exceed that of the silicon microstrip detection module.
9. The packaging fixture for the silicon microstrip detector according to claim 1, characterized in that: Both the X-axis positioning component and the Y-axis positioning component are L-shaped bent plates. One plate is fixed to the side of the support plate, and the other plate is placed on the upper surface of the support plate. Positioning is achieved by the side of the plate placed on the support plate.
10. The method for packaging a silicon microstrip detector using a packaging fixture as described in any one of claims 1 to 9, characterized in that: Includes the following steps: S1. Using the module pasting fixture, several silicon wafers are pasted onto the PCB board to fabricate the silicon microstrip detection module; S2. Solder wires are welded to adjacent silicon wafers in the silicon microstrip detection module; S3. Using the detector pressing fixture, several silicon microstrip detector modules are pasted and pressed onto the support plate to fabricate the silicon microstrip detector. S1 includes the following steps: S1.1 Fix the positioning strip to the adhesive base; S1.2 Place the silicon wafer on the corresponding adsorption area, then adsorb and fix the silicon wafer, and then remove the corresponding silicon wafer positioning pin; adsorb and fix all silicon wafers in this way, and then remove the positioning strip; S1.3 Apply glue to the surface of the PCB board, and then use the PCB board positioning structure to place the PCB board on several silicon wafers; S1.
4. The counterweight block is placed on the PCB board using the aforementioned pressure block positioning structure; S1.
5. Allow the adhesive to cure and complete the bonding and fabrication of the silicon microstrip detection module; S3 includes the following steps: S3.1 Fix the X-axis positioning component corresponding to the silicon microstrip detection module to be installed on the support plate; S3.2 Place the mask plate using the X-axis positioning component, and apply adhesive to the cutouts in the mask plate; S3.3 Remove the mask plate and fix the Y-axis positioning component corresponding to the silicon microstrip detection module to be installed on the support plate; S3.
4. Use the pressing and adsorption base to adsorb and fix the silicon microstrip detection module to be installed. During adsorption, each suction cup of the pressing and adsorption base corresponds one-to-one with each silicon wafer of the silicon microstrip detection module to be installed. S3.
5. Place the silicon microstrip detection module to be installed at the dispensing position using the pressing and adsorption base and with the help of the X-axis positioning component and the Y-axis positioning component, and fix the silicon microstrip detection module. S3.6 Remove the X-axis positioning component of the fixed silicon microstrip detection module; S3.7 Repeat S3.1 to S3.6 to fix all the silicon microstrip detection modules in sequence; S3.
8. Allow the adhesive to cure, then remove the pressing and adsorption base of each silicon microstrip detection module and the Y-axis positioning component to complete the pressing and fabrication of the silicon microstrip detector.