Display device

Abstract

The present disclosure relates to a display device. A display device according to an embodiment of the present disclosure may include: a substrate including a display area and a non-display area surrounding the display area; a light emitting element disposed on the substrate; and an encapsulation layer disposed on the light emitting element. The encapsulation layer may include a plurality of inorganic encapsulation layers and a plurality of organic encapsulation layers. Each of two or more of the plurality of inorganic encapsulation layers may have a plurality of openings.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0143589, filed on October 21, 2024, which is incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0003] Embodiments of this disclosure relate to display devices. Background Technology

[0004] With the advent of the information age, the industry of displays that visually present electronic information signals has developed rapidly, leading to an increased demand for flexible display devices that can be bent, folded, or rolled, or stretchable display devices that can be stretched or contracted.

[0005] Stretchable display devices can be realized using flexible substrates. However, since various driving circuits, sub-pixels, and protective layers are all located on the substrate, it is quite difficult to realize a flexible display device that can display images normally.

[0006] Meanwhile, "kirigami structure" (a variant of origami) is a three-dimensional structure formed by extending, unfolding, or twisting adjacent patterns divided by cutting lines on a flat surface of paper. Summary of the Invention

[0007] Embodiments of this disclosure may provide a display device having an encapsulation layer that ensures flexibility and resistance to breakage.

[0008] Embodiments of this disclosure may provide a display device having an encapsulation layer with excellent moisture-proof properties.

[0009] Embodiments of this disclosure may provide a display device that is stretchable while preventing a degradation in display quality.

[0010] A display device according to embodiments of this disclosure may include: a substrate including a display area and a non-display area surrounding the display area; a light-emitting element disposed on the substrate; and an encapsulation layer disposed on the light-emitting element. The encapsulation layer may include a plurality of inorganic encapsulation layers and a plurality of organic encapsulation layers. Each of two or more of the plurality of inorganic encapsulation layers may have a plurality of openings.

[0011] A display device according to embodiments of the present disclosure may include a light-emitting element disposed on a substrate and an encapsulation layer disposed on the light-emitting element. The encapsulation layer may include a plurality of inorganic encapsulation layers and a plurality of organic encapsulation layers. Each of the plurality of inorganic encapsulation layers may include a plurality of openings. Among the plurality of inorganic encapsulation layers, the thickness of the inorganic encapsulation layer farther from the substrate may be equal to or greater than the thickness of the inorganic encapsulation layer closer to the substrate.

[0012] According to embodiments of the present disclosure, a display device may be provided having an encapsulation layer that ensures flexibility and resistance to breakage.

[0013] According to one embodiment of the present disclosure, a display device may be provided having an encapsulation layer having excellent moisture-proof properties.

[0014] According to embodiments of the present disclosure, a display device can be provided that is stretchable while preventing a degradation in display quality.

[0015] According to specific embodiments of this disclosure, a display device can be provided that improves service life and reduces power consumption through an encapsulation layer with excellent moisture-proof properties. Attached Figure Description

[0016] The above and other objects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 A display device according to an embodiment of the present disclosure is shown;

[0018] Figure 2 A display panel according to an embodiment of the present disclosure is shown;

[0019] Figure 3 This is a cross-sectional view showing a display panel according to an embodiment of the present disclosure;

[0020] Figure 4 An example of a stretchable electronic device according to an embodiment of the present disclosure is shown;

[0021] Figure 5 This is a cross-sectional view showing a portion of the encapsulation layer in a display panel according to an embodiment of the present disclosure;

[0022] Figures 6 to 8 This is a plan view showing a portion of the encapsulation layer in a display panel according to an embodiment of the present disclosure;

[0023] Figure 9This is a cross-sectional view showing a portion of the encapsulation layer in a display panel according to an embodiment of the present disclosure;

[0024] Figures 10 to 16 This is a plan view showing a portion of the encapsulation layer in a display panel according to an embodiment of the present disclosure;

[0025] Figure 17 This is a cross-sectional view showing a portion of the encapsulation layer in a display panel according to an embodiment of the present disclosure;

[0026] Figure 18 It is a cross-sectional view showing a portion of the display area of ​​a display panel according to an embodiment of the present disclosure; and

[0027] Figure 19 This is a cross-sectional view showing a portion of the non-display area of ​​a display panel according to an embodiment of the present disclosure. Detailed Implementation

[0028] In the following description of examples or embodiments of this disclosure, reference will be made to the accompanying drawings, in which specific examples or embodiments that may be implemented are illustrated by way of illustration, and in which the same reference numerals and symbols may be used to denote the same or similar components, even when these components are shown in different drawings. Furthermore, in the following description of examples or embodiments of this disclosure, detailed descriptions of well-known functions and components incorporated herein are omitted where it is determined that the description may make the subject matter of some embodiments of this disclosure considerably unclear. Terms such as “comprising,” “having,” “including,” “constituting,” “made of,” and “formed from” as used herein are generally intended to allow for the addition of additional components, unless said terms are used in conjunction with the term “only.” As used herein, unless the context clearly indicates otherwise, the singular forms are intended to include the plural forms.

[0029] Terms such as “first,” “second,” “A,” “B,” “(A),” or “(B)” may be used herein to describe elements of this disclosure. Each of these terms is not intended to define the nature, order, sequence, or number of elements, but is only used to distinguish the corresponding element from other elements.

[0030] When referring to a first element being "connected or coupled to" a second element, or "in contact with or overlapping" a second element, it should be interpreted that not only can the first element be "directly connected or coupled to" the second element or "directly in contact with or overlapping" a second element, but a third element can also be "placed" between the first and second elements, or the first and second elements can be "connected or coupled," "in contact with," or "overlapped" with each other via a fourth element. Here, the second element can be included in at least one of two or more elements that are "connected or coupled" to each other, or that are "in contact with" or "overlapped" with each other.

[0031] When time-related terms, such as “after,” “later,” “next,” “before,” etc., are used to describe the process or operation of an element or configuration, or the flow or steps in an operation, processing, or manufacturing method, these terms may be used to describe a discontinuous or non-sequential process or operation, unless used with the terms “directly” or “immediately.”

[0032] Furthermore, when referring to any size, relative dimensions, etc., the numerical or corresponding information of the component or feature (e.g., level, range, etc.) should be considered, including tolerances or error ranges that may be caused by various factors (e.g., processing factors, internal or external influences, noise, etc.), even if no relevant description is specified. Moreover, the term "may" fully encompasses all the meanings of the term "may".

[0033] In the following, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0034] Figure 1 A display device 100 according to an embodiment of the present disclosure is shown.

[0035] Reference Figure 1 The display device 100 according to embodiments of the present disclosure may include a display panel 110 as a component for displaying images and a display driving circuit. The display driving circuit may be a circuit for driving the display panel 110. The display driving circuit may include, but is not limited to, a data driving circuit 120, a gate driving circuit 130, and a controller 140.

[0036] The display panel 110 may include a substrate 111 and a plurality of sub-pixels SP disposed on the substrate 111.

[0037] The substrate 111 may include a display area DA and a non-display area NDA.

[0038] The display area DA is the area where images can be displayed, and it can also be called the active area. Multiple sub-pixels SP used for displaying images can be set in the display area DA.

[0039] The non-display area NDA is the area where no image is displayed, and it can be the area outside the display area DA. The non-display area NDA can also be called a border (or border area). The non-display area NDA may include pad areas for connecting or bonding (or attaching) drive circuitry.

[0040] The display device 100 according to the embodiments of the present disclosure may be a self-emissive display device in which the display panel 110 emits its own light, but the embodiments of the present disclosure are not limited thereto. When the display device 100 according to the embodiments of the present disclosure is a self-emissive display device, each of the plurality of sub-pixels SP may include a light-emitting element.

[0041] For example, the display device 100 according to embodiments of the present disclosure may be an organic light-emitting diode (OLED) display, wherein the light-emitting element is implemented as an organic light-emitting diode (OLED). As another example, the display device 100 according to embodiments of the present disclosure may be an inorganic light-emitting display device, wherein the light-emitting element is implemented as a light-emitting diode based on inorganic materials. As another example, the display device 100 according to embodiments of the present disclosure may be a quantum dot display device, wherein the light-emitting element is implemented as a quantum dot, which is a self-emitting semiconductor crystal. As another example, the display device 100 according to embodiments of the present disclosure may be a micro-LED display device or a mini-LED display device.

[0042] The structure of each of the plurality of sub-pixels SP can vary depending on the type of display device 100. For example, when the display device 100 is a self-emissive display device in which the sub-pixels SP emit their own light, each sub-pixel SP may include a self-emissive light-emitting element, one or more transistors, and one or more capacitors, but the embodiments of the present disclosure are not limited thereto.

[0043] Various types of signal lines for driving multiple sub-pixels SP can be provided on the substrate 111 of the display panel 110. For example, the various types of signal lines may include multiple data lines DL for transmitting data signals (also known as data voltage or image signals) and multiple gate lines GL for transmitting gate signals (also known as scan signals).

[0044] Multiple data lines DL and multiple gate lines GL can intersect each other. Each of the multiple data lines DL can be configured to extend along a column direction. Each of the multiple gate lines GL can be configured to extend along a row direction. According to embodiments of this disclosure, the column direction and the row direction can be relative directions. For example, depending on the viewing angle, the column direction can be the row direction, and depending on the viewing angle, the row direction can be the column direction. For ease of description, an example is described below in which each of the multiple data lines DL is configured in the column direction and each of the multiple gate lines GL is configured in the row direction, but embodiments of this disclosure are not limited thereto. In embodiments of this disclosure, the angle between the row direction and the column direction can be 90 degrees, or it can be an angle other than 90 degrees. Furthermore, in embodiments of this disclosure, the row direction can be referred to as the first direction, and the column direction can be referred to as the second direction.

[0045] The data driving circuit 120 can be a circuit for driving multiple data lines DL and can output data signals to multiple data lines DL.

[0046] The data drive circuit 120 can receive digital image data DATA from the controller 140, and can convert the received image data DATA into an analog data signal (or data voltage) and output it to multiple data lines DL.

[0047] For example, the data driving circuit 120 can be connected to the display panel 110 via a tape auto-bonding (TAB) method, or connected to the bonding pads of the display panel 110 via a chip-on-glass (COG) or chip-on-panel (COP) method, or implemented and connected to the display panel 110 via a chip-on-film (COF) method, but the embodiments of this disclosure are not limited thereto.

[0048] The data driving circuit 120 can be connected to one side of the display panel 110 (e.g., the top or bottom side). As another example, depending on the driving scheme or panel design, the data driving circuit 120 can be connected to both sides of the display panel 110 (e.g., both the top and bottom sides) or two or more of the four sides of the display panel 110.

[0049] The data driving circuit 120 can be connected outside the display area DA of the display panel 110, but as another example, the data driving circuit 120 can be set in the display area DA of the display panel 110.

[0050] The gate drive circuit 130 is a circuit used to drive multiple gate lines GL and can output gate signals to multiple gate lines GL.

[0051] The gate drive circuit 130 can receive a first gate voltage corresponding to an on-state voltage (or also called an on-level voltage) and a second gate voltage corresponding to an off-state voltage (or also called an off-level voltage), as well as various gate drive control signals GCS, generate a gate signal including portions having the first gate voltage and portions having the second gate voltage for a predetermined time (e.g., one frame time), and supply the generated gate signal to multiple gate lines GL. For example, the on-state voltage can be a high-level voltage, and the off-state voltage can be a low-level voltage. As another example, the on-state voltage can be a low-level voltage, and the off-state voltage can be a high-level voltage.

[0052] In the display device 100 according to an embodiment of the present disclosure, the gate driving circuit 130 may be embedded in the display panel 110 as a gate in panel (GIP) type, but the embodiments of the present disclosure are not limited thereto. When the gate driving circuit 130 is of the gate in panel type, the gate driving circuit 130 may be formed on the substrate 111 of the display panel 110 during the manufacturing process of the display panel 110.

[0053] For example, the gate drive circuit 130 can be disposed in the non-active region NDA of the display panel 110.

[0054] As another example, the gate driving circuit 130 can be disposed in the display area DA of the display panel 110. For example, the gate driving circuit 130 can be disposed in a first portion of the display area DA (e.g., the left or right portion of the display area DA). As another example, the gate driving circuit 130 can be disposed in both a first portion of the display area DA (e.g., the left or right portion of the display area DA) and a second portion of the display area DA (e.g., the right or left portion of the display area DA). As yet another example, the gate driving circuit 130 can be disposed over the entire display area DA.

[0055] When the gate driving circuit 130 is disposed in the display area DA of the display panel 110, the gate driving circuit 130 may vertically overlap with the sub-pixels SP disposed in the display area DA. For example, the gate driving circuit 130 may vertically overlap with the light-emitting elements and transistors included in the sub-pixels SP disposed in the display area DA. The gate driving circuit 130 may vertically overlap with multiple light-emitting elements and multiple transistors, which are included in multiple sub-pixels SP disposed in the display area DA. The gate driving circuit 130 may include multiple transistors. Each of the multiple transistors included in the gate driving circuit 130 may include an active layer comprising a first semiconductor material, and each of the multiple transistors included in the sub-pixels SP may include an active layer comprising a second semiconductor material. For example, the first semiconductor material and the second semiconductor material may be substantially the same. As another example, the first semiconductor material and the second semiconductor material may be different from each other. For example, the first semiconductor material may be a silicon-based semiconductor material (such as low-temperature polycrystalline silicon), and the second semiconductor material may be an oxide semiconductor material. For example, the active layer may be, but is not limited to, a semiconductor layer.

[0056] The controller 140 is a device for controlling the data drive circuit 120 and the gate drive circuit 130, and can control the driving timing of multiple data lines DL and multiple gate lines GL.

[0057] The controller 140 can supply a data drive control signal DCS to the data drive circuit 120 to control the data drive circuit 120, and can supply a gate drive control signal GCS to the gate drive circuit 130 to control the gate drive circuit 130.

[0058] The controller 140 can receive input image data from the host system 150 and supply image data DATA to the data drive circuit 120 based on the input image data.

[0059] The controller 140 can be implemented as a component independent of the data drive circuit 120, or the controller 140 and the data drive circuit 120 can be integrated into an integrated circuit (IC).

[0060] The controller 140 may be a timing controller used in display technology, a control device capable of performing other control functions and the functions of a timing controller, or a control device other than a timing controller, or it may be a circuit in a control device. The controller 140 may be implemented as various circuits or electronic components, such as integrated circuits (ICs), field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), or processors, but is not limited thereto.

[0061] The controller 140 can be mounted on a printed circuit board or flexible printed circuit and can be electrically connected to the data drive circuit 120 and the gate drive circuit 130 via the printed circuit board or flexible printed circuit.

[0062] The controller 140 can send / receive signals to / from the data drive circuit 120 according to one or more predetermined interfaces. The interfaces may include, for example, a low-voltage differential signaling (LVDS) interface, an embedded clock point interface (EPI) interface, and a serial peripheral interface (SPI), but embodiments of this disclosure are not limited thereto.

[0063] To provide touch sensing and image display functions, the display device 100 according to embodiments of the present disclosure may include a touch sensor and a touch sensing circuit that senses the touch sensor to detect whether a touch occurs by a touch object such as a finger or a pen, or the location of the touch.

[0064] The touch sensing circuit may include: a touch driving circuit that drives and senses the touch sensor, and generates and outputs touch sensing data; and a touch controller that can use the touch sensing data to detect the occurrence of a touch or the location of a touch.

[0065] A touch sensor may include multiple touch electrodes. A touch sensor may also include multiple touch lines for electrically connecting the multiple touch electrodes and touch driving circuitry.

[0066] The touch sensor can exist outside the display panel 110 in the form of a touch panel, or it can exist inside the display panel 110. When the touch panel exists outside the display panel 110 in the form of a touch panel, the touch panel is referred to as an external type. When the touch sensor is external, the touch panel and the display panel 110 can be manufactured separately, or they can be combined during the assembly process. An external type touch panel may include a touch panel substrate and multiple touch electrodes on the touch panel substrate.

[0067] When a touch sensor is present inside the display panel 110, the touch sensor, as well as signal lines and electrodes related to display driving, can be formed on the substrate during the manufacturing process of the display panel 110.

[0068] The touch driving circuit can supply a touch driving signal to at least one of a plurality of touch electrodes and can sense at least one of the plurality of touch electrodes to generate touch sensing data.

[0069] Touch sensing circuits can perform touch sensing in self-capacitance sensing schemes or mutual capacitance sensing schemes.

[0070] When a touch sensing circuit performs touch sensing using a self-capacitance sensing scheme, it can perform touch sensing based on the capacitance between each touch electrode and the touch object (e.g., a finger or pen). According to the self-capacitance sensing scheme, each of the multiple touch electrodes can be used as both a driving touch electrode and a sensing touch electrode. The touch driving circuit can drive all or some of the multiple touch electrodes and sense all or some of the multiple touch electrodes.

[0071] When a touch sensing circuit performs touch sensing using a mutual capacitance sensing scheme, it can perform touch sensing based on the capacitance between the touch electrodes. According to the mutual capacitance sensing scheme, multiple touch electrodes are divided into driving touch electrodes and sensing touch electrodes. The touch driving circuit can drive the driving touch electrodes and sense the sensing touch electrodes.

[0072] The touch driver circuit and touch controller included in the touch sensing circuit can be implemented as separate devices or a single device. The touch driver circuit and data driver circuit can be implemented as separate devices or a single device.

[0073] The display device 100 may also include a power supply circuit for supplying various types of power to the display driver integrated circuit and / or touch sensing circuit. The power supply circuit may supply various voltages and electrical voltages related to display driving to the display driver circuit or the display panel 110.

[0074] The display device 100 according to the embodiments of this disclosure may be a mobile terminal, such as a smartphone or tablet computer, or a monitor or television (TV) of various sizes, but is not limited thereto, and may be a display of various types and sizes capable of displaying information or images.

[0075] The display device 100 according to embodiments of this disclosure may further include electronic devices, such as a camera (image sensor), a detection sensor, etc. For example, the detection sensor may be a sensor that detects an object or human body by receiving light such as infrared, ultrasonic, or ultraviolet light, but embodiments of this disclosure are not limited thereto.

[0076] Figure 2 A display panel 110 according to an embodiment of the present disclosure is shown.

[0077] Reference Figure 2 The display panel 110 may include a substrate 111 disposed in a plurality of sub-pixels SP and an encapsulation layer 200 on the substrate 111. The encapsulation layer 200 may also be referred to as an encapsulation substrate or an encapsulation unit.

[0078] Reference Figure 2When the display device 100 according to the embodiments of the present disclosure is a self-emissive display device, each of the plurality of sub-pixels SP disposed on the substrate 111 may include an emitting element ED and a sub-pixel circuit unit SPC for driving the emitting element ED.

[0079] Reference Figure 2 The sub-pixel circuit SPC may include a plurality of transistors and at least one capacitor for driving the light-emitting element ED, but embodiments of the present disclosure are not limited thereto. In the present disclosure, the sub-pixel circuit SPC can drive the light-emitting element ED by supplying a driving current to the light-emitting element ED at a predetermined timing. The light-emitting element ED can be driven by the driving current to emit light.

[0080] The multiple transistors may include a driving transistor DT for driving the light-emitting element ED and a scanning transistor ST that is turned on or off according to the scanning signal SC.

[0081] The driving transistor DT can supply driving current to the light-emitting element ED.

[0082] The scanning transistor ST can be configured to control the electrical state of the corresponding node in the sub-pixel circuit SPC or to control the state or operation of the drive transistor DT.

[0083] At least one capacitor may include a storage capacitor Cst for maintaining a constant voltage during a frame.

[0084] To drive the sub-pixel SP, a data signal VDATA as an image signal and a scan signal SC as a gate signal can be applied to the sub-pixel SP. Furthermore, to drive the sub-pixel SP, a common drive signal including a drive voltage VDD and a base voltage VSS can be applied to the sub-pixel SP.

[0085] The light-emitting element ED may include a pixel electrode PE, a light-emitting unit EL, and a common electrode CE. The light-emitting unit EL may be disposed between the pixel electrode PE and the common electrode CE.

[0086] For example, a pixel electrode PE can be an electrode disposed in each sub-pixel SP, and a common electrode CE can be an electrode commonly disposed in all sub-pixels SP. For example, the pixel electrode PE can be an anode, and the common electrode CE can be a cathode. As another example, the pixel electrode PE can be a cathode, and the common electrode CE can be an anode. In the following description, for ease of description, an example in which the pixel electrode PE is an anode and the common electrode CE is a cathode will be described.

[0087] When the light-emitting element ED is an organic light-emitting element, the light-emitting unit EL may include a light-emitting layer EML, a first common intermediate layer COM1 between the pixel electrode PE and the light-emitting layer EML, and a second common intermediate layer COM2 between the light-emitting layer EML and the common electrode CE. The first common intermediate layer COM1 and the second common intermediate layer COM2 can be collectively referred to as the common intermediate layer EL_COM.

[0088] An emissive layer EML can be set for each sub-pixel SP. A common intermediate layer EL_COM can be arranged on multiple sub-pixels SP, but the implementation of this disclosure is not limited thereto.

[0089] An Emissive Layer (EML) can be set for each emitting region. A common intermediate layer (EL_COM) can typically be set across multiple emitting and non-emitting regions, but embodiments of this disclosure are not limited thereto. For example, the common intermediate layer (EL_COM) can be set within a portion of the non-display region (NDA).

[0090] For example, the first common intermediate layer COM1 may include a hole injection layer HIL, an electron blocking layer EBL, and a hole transport layer HTL, but the embodiments of this disclosure are not limited thereto. The second common intermediate layer COM2 may include an electron transport layer ETL, a hole blocking layer HBL, and an electron injection layer EIL, but the embodiments of this disclosure are not limited thereto.

[0091] The hole injection layer (HIL) injects holes from the pixel electrode (PE) into the hole transport layer (HTL), and the HTL then transports the holes to the emissive layer (EML). The electron injection layer (EIL) injects electrons from the common electrode (CE) into the electron transport layer (ETL), and the ETL then transports the electrons to the emissive layer (EML).

[0092] For example, the common electrode CE can be electrically connected to the base voltage line VSSL. The base voltage VSS (which is a common drive signal) can be applied to the common electrode CE through the base voltage line VSSL. The pixel electrode PE can be directly or indirectly (through another transistor) electrically connected to the first node N1 of the drive transistor DT of each sub-pixel SP. In this disclosure, "base voltage VSS" may also be referred to as "low potential power voltage" or "low potential voltage," and "base voltage line VSSL" may also be referred to as "low potential power voltage line" or "low potential voltage line."

[0093] Each light-emitting element (ED) may include the overlapping portion of the pixel electrode (PE), the light-emitting layer (EML) in the light-emitting unit (EL), and the common electrode (CE). A predetermined light-emitting region can be formed by each ED. For example, the light-emitting region of each ED may include the overlapping region of the pixel electrode (PE), the light-emitting layer (EML) in the light-emitting unit (EL), and the common electrode (CE).

[0094] For example, the light-emitting element ED can be an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), a quantum dot light-emitting element, a micro LED, or a mini LED, but the embodiments of this disclosure are not limited thereto. For example, when the light-emitting element ED is an organic light-emitting diode (OLED), the light-emitting unit EL of the light-emitting element ED can include a light-emitting unit EL comprising organic materials.

[0095] The driving transistor DT can be a driving transistor used to supply driving current to the light-emitting device ED. The driving transistor DT can be electrically connected between the driving voltage line VDDL and the light-emitting element ED.

[0096] The driving transistor DT may include a first node Na, a second node Nb, and a third node Nc. The first node Na may be electrically connected to the light-emitting element ED, the second node Nb may receive the data signal VDATA, and the third node Nc may receive the driving voltage VDD from the driving voltage line VDDL. The driving transistor DT may be connected to the first node Na and the third node Nc.

[0097] In the driving transistor DT, the second node Nb can be a gate node, the first node Na can be a source node or a drain node, and the third node Nc can be a drain node or a source node. For ease of description, the following example will be described below: In the driving transistor DT, the second node Nb can be a gate node, the first node Na can be a source node, and the third node Nc can be a drain node, but the implementation of this disclosure is not limited to this.

[0098] Figure 2 The scanning transistor ST included in the sub-pixel circuit SPC shown can be a switching transistor used to transmit the data signal VDATA, which is an image signal, to the second node Nb, which is the gate node of the driving transistor DT.

[0099] The scanning transistor ST can be controlled to turn on and off via the scan signal SC to control the electrical connection between the second node Nb of the driving transistor DT and the data line DL. The scan signal SC is a gate signal applied through the scan line SCL, which is a gate line GL of a certain type. The drain or source electrode of the scanning transistor ST can be electrically connected to the data line DL, the source or drain electrode of the scanning transistor ST can be electrically connected to the second node Nb of the driving transistor DT, and the gate electrode of the scanning transistor ST can be electrically connected to the scan line SCL.

[0100] The storage capacitor Cst can be electrically connected between the first node Na and the second node Nb of the driving transistor DT. The storage capacitor Cst can include a first capacitor electrode electrically connected to or corresponding to the first node Na of the driving transistor DT, and a second capacitor electrode electrically connected to or corresponding to the second node Nb of the driving transistor DT.

[0101] The capacitor Cst can be an external capacitor intentionally designed to be outside the driving transistor DT, but it is not a parasitic capacitor (e.g., Cgs or Cgd), which is an internal capacitor that can exist between the first node Na and the second node Nb of the driving transistor DT, but the implementation of this disclosure is not limited to this.

[0102] Each of the driving transistor DT and the scanning transistor ST can be an n-type transistor or a p-type transistor, but embodiments of this disclosure are not limited thereto. For example, one of the driving transistor DT and the scanning transistor ST can be an n-type transistor or a p-type transistor.

[0103] The display panel 110 may have a top-emitting structure or a bottom-emitting structure.

[0104] When the display panel 110 has a top-emitting structure, at least a portion of the sub-pixel circuit SPC can overlap with at least a portion of the light-emitting element ED in the vertical direction. Therefore, the area of ​​the emitting region can be increased, and the aperture ratio can be increased.

[0105] When the display panel 110 has a bottom-emitting structure, the sub-pixel circuit SPC can be designed not to overlap with the light-emitting element ED in the vertical direction.

[0106] like Figure 2 As shown, the sub-pixel circuit SPC can have a 2T (transistor) 1C (capacitor) structure, including two transistors DT and ST and a capacitor Cst. In some cases, the sub-pixel circuit unit SPC may also include one or more transistors, or one or more capacitors.

[0107] For example, a subpixel circuit SPC can have an 8T1C structure including 8 transistors and 1 capacitor. As another example, a subpixel circuit SPC can have a 6T2C structure including 6 transistors and 2 capacitors. As yet another example, a subpixel circuit SPC can have a 7T1C structure including 7 transistors and 1 capacitor. However, embodiments of this disclosure are not limited to these.

[0108] Depending on the structure of the sub-pixel circuit SPC, the type and number of gate lines or gate signals supplied to the sub-pixel SP can vary. Furthermore, the type and number of common drive signals supplied to the sub-pixel SP can also vary depending on the structure of the sub-pixel circuit SPC.

[0109] Since the circuit elements in each sub-pixel SP (e.g., light-emitting elements ED implemented as organic light-emitting diodes (OLEDs) comprising organic materials) are susceptible to external moisture or oxygen, an encapsulation layer 200 can be disposed on the display panel 110. The encapsulation layer 200 prevents external moisture or oxygen from penetrating into the circuit elements (e.g., the light-emitting elements ED). The encapsulation layer 200 can be configured in various ways to prevent the light-emitting elements ED from contacting moisture or oxygen. For example, the encapsulation layer 200 can consist of two or more layers in which organic and inorganic films are alternately stacked, but embodiments of this disclosure are not limited thereto.

[0110] Reference Figure 2 The display device 100 according to the embodiments of the present disclosure may include a touch sensor layer 210, which includes a plurality of sensor electrodes, a touch driving circuit 220, and a touch controller 230; the plurality of sensor electrodes are used to sense user touch, the touch driving circuit 220 is configured to sense the plurality of sensor electrodes, and the touch controller 230 is configured to use the sensing results (touch sensing data) of the touch driving circuit 220 to determine the presence or absence of a touch or touch coordinates.

[0111] The touch sensor layer 210 can be embedded in the display panel 110. For example, the touch sensor layer 210 can be disposed on the encapsulation layer 200 in the display panel 110. The touch sensor layer 210 can be a touch unit.

[0112] The display panel 110 may also include a plurality of touchpads TP and a plurality of touch wiring lines, the plurality of touchpads TP being electrically connected to the touch driving circuit 220, and the plurality of touch wiring lines being used to electrically connect a plurality of sensor electrodes included in the touch sensor layer 210 to the plurality of touchpads TP connected to the touch driving circuit 220.

[0113] Figure 3 This is a cross-sectional view of a display panel 110 according to an embodiment of the present disclosure.

[0114] Reference Figure 3 The display panel 110 according to the embodiments of the present disclosure may include transistor units, light-emitting element units and packaging units, but the embodiments of the present disclosure are not limited thereto.

[0115] The substrate 111 can be a single layer or multiple layers. When the substrate 111 includes multiple layers, it may include a first substrate 301, an intermediate substrate layer (or intermediate layer) 302, and a second substrate 303. The intermediate substrate layer 302 may be located between the first substrate 301 and the second substrate 303. For example, each of the first substrate 301 and the second substrate 303 may be a polyimide (PI) layer, but embodiments of this disclosure are not limited thereto. The intermediate substrate layer 302 may be an inorganic insulating layer, but embodiments of this disclosure are not limited thereto. When charge is applied to the first substrate PI1, which is a polyimide layer, the intermediate substrate layer 302 can prevent the charge from affecting the transistors disposed on the second substrate 303 through the second substrate 303, which is also a polyimide layer.

[0116] Furthermore, the intermediate substrate layer 302 can prevent moisture components from penetrating upward through the first substrate 301. For example, the intermediate substrate layer 302 can be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), or it can be formed of a bilayer of silicon dioxide (SiO2) and silicon nitride (SiNx), but is not limited thereto.

[0117] The intermediate substrate layer 302 may be formed on the front surface of the substrate 111, but is not limited thereto. For example, the intermediate substrate layer 302 may not be formed in a portion of the non-display area NDA. Specifically, the intermediate substrate layer 302, which includes inorganic materials, may not be formed in areas of stress concentration or where cracks may occur.

[0118] The transistor unit may include a substrate 111, insulating layers 311, 312, 313, 321, 322 and 323 on the substrate 111, thin film transistors TFT1 and TFT2, storage capacitor Cst, and various electrodes or signal lines.

[0119] The thin-film transistors TFT1 and TFT2 included in the transistor unit may include a first thin-film transistor TFT1 and a second thin-film transistor TFT2.

[0120] The first thin-film transistor TFT1 may include a first active layer ACT1, a first electrode E1a, a second electrode E1b, and a third electrode E1c.

[0121] The first electrode E1a can be a gate electrode, the second electrode E1b can be a source electrode or a drain electrode, and the third electrode E1c can be a drain electrode or a source electrode. In the following description, for ease of explanation, the first electrode E1a is referred to as the first gate electrode E1a, the second electrode E1b as the first source electrode E1b, and the third electrode E1c as the first drain electrode E1c; however, the embodiments of this disclosure are not limited thereto.

[0122] The first active layer ACT1 may be a first semiconductor material, but the embodiments of this disclosure are not limited thereto. For example, the first semiconductor material may include oxide semiconductor, amorphous silicon, polycrystalline silicon, or low-temperature polycrystalline silicon (LTPS), but the embodiments of this disclosure are not limited thereto. The first thin-film transistor TFT1 may be implemented as a p-channel transistor or an n-channel thin-film transistor, but the embodiments of this disclosure are not limited thereto.

[0123] The second thin-film transistor TFT2 may include a second active layer ACT2, a fourth electrode E2a, a fifth electrode E2b, and a sixth electrode E2c.

[0124] The fourth electrode E2a can be a gate electrode, the fifth electrode E2b can be a source electrode or a drain electrode, and the sixth electrode E2c can be a drain electrode or a source electrode. In the following description, for ease of explanation, the fourth electrode E2a is referred to as the second gate electrode E2a, the fifth electrode E2b as the second source electrode E2b, and the sixth electrode E2c as the second drain electrode E2c. However, embodiments of this disclosure are not limited thereto.

[0125] The second active layer ACT2 can be a second semiconductor material, but the embodiments of this disclosure are not limited thereto. For example, the second semiconductor material may include oxide semiconductor, amorphous silicon, polycrystalline silicon, or low-temperature polycrystalline silicon (LTPS), but the embodiments of this disclosure are not limited thereto. The second thin-film transistor TFT2 can be implemented as a p-channel transistor or an n-channel thin-film transistor, but the embodiments of this disclosure are not limited thereto.

[0126] For example, one of the first active layer ACT1 of the first thin-film transistor TFT1 and the second active layer ACT2 of the second thin-film transistor TFT2 may include an oxide semiconductor material. As another example, one of the first active layer ACT1 of the first thin-film transistor TFT1 and the second active layer ACT2 of the second thin-film transistor TFT2 may include a low-temperature polycrystalline silicon semiconductor material. As another example, the first active layer ACT1 of the first thin-film transistor TFT1 and the second active layer ACT2 of the second thin-film transistor TFT2 may include an oxide semiconductor material. As another example, the first active layer ACT1 of the first thin-film transistor TFT1 and the second active layer ACT2 of the second thin-film transistor TFT2 may include a low-temperature polycrystalline silicon semiconductor material. As another example, in the first thin-film transistor TFT1 and the second thin-film transistor TFT2, the driving transistor DT may be configured with an oxide semiconductor as the active layer, and the scanning transistor ST may be configured with a low-temperature polycrystalline silicon as the active layer. As another example, in the first thin-film transistor TFT1 and the second thin-film transistor TFT2, the driving transistor DT may be configured with a low-temperature polycrystalline silicon as the active layer, and the scanning transistor ST may be configured with an oxide semiconductor as the active layer. As another example, the transistors included in the gate in-panel (GIP) type gate drive circuit 130 may be configured with oxide semiconductor or low-temperature polysilicon as the active layer. As another example, all transistors configured on the substrate 111 and the transistors included in the gate in-panel (GIP) type gate drive circuit 130 may be configured with oxide semiconductor as the active layer.

[0127] The second active layer ACT2 of the second thin-film transistor TFT2 can be located at a higher position than the first active layer ACT1 of the first thin-film transistor TFT1 from the substrate 111.

[0128] A first buffer layer 311 may be disposed below the first active layer ACT1 of the first thin-film transistor TFT1, and a second buffer layer 321 may be disposed below the second active layer ACT2 of the second thin-film transistor TFT2. For example, the first active layer ACT1 of the first thin-film transistor TFT1 may be located on the first buffer layer 311, and the second active layer ACT2 of the second thin-film transistor TFT2 may be located on the second buffer layer 321. The second buffer layer 321 may be located at a higher position than the first buffer layer 311.

[0129] The storage capacitor Cst can be disposed in various metal layers in the display panel 110. For example, the storage capacitor Cst may include a first capacitor electrode CAPE1 and a second capacitor electrode CAPE2.

[0130] The light-emitting element portion may include a plurality of light-emitting elements ED disposed on the planarization layer 330. Each of the plurality of light-emitting elements ED may include a pixel electrode PE, a light-emitting unit EL, and a common electrode CE.

[0131] The encapsulation unit may include an encapsulation layer 200 on multiple light-emitting elements (EDs). The encapsulation layer 200 may be a single layer or multiple layers, but embodiments of this disclosure are not limited thereto. In addition to the encapsulation layer 200, the encapsulation portion may also include a dam portion (DAM).

[0132] In the following text, refer to Figure 3 The structure or vertical structure of the display panel 110 according to embodiments of the present disclosure will be described in more detail.

[0133] Reference Figure 3 The first buffer layer 311 may be disposed on the substrate 111. The first buffer layer 311 may be a single layer or multiple layers, but the embodiments of the present disclosure are not limited thereto. When the first buffer layer 311 includes multiple layers, the first buffer layer 311 may include a lower buffer layer 311a and an upper buffer layer 311b.

[0134] The first active layer ACT1 of the first thin-film transistor TFT1 may be disposed on the first buffer layer 311. The first active layer ACT1 may include a channel region forming a channel, a source connection region on one side of the channel region, and a drain connection region on the other side of the channel region.

[0135] The first insulating layer 312 may be disposed on the first active layer ACT1 of the first thin-film transistor TFT1. The first gate electrode E1a of the first thin-film transistor TFT1 may be disposed on the first insulating layer 312. The second insulating layer 313 may be disposed on the first gate electrode E1a of the first thin-film transistor TFT1. The first insulating layer 312 may be a gate insulating layer, but the embodiments of this disclosure are not limited thereto. The second insulating layer 313 may be an interlayer insulating layer, but the embodiments of this disclosure are not limited thereto.

[0136] The second buffer layer 321 can be disposed on the second insulating layer 313.

[0137] A second active layer ACT2 of the second thin-film transistor TFT2 can be disposed on the second buffer layer 321. The second active layer ACT2 may include a channel region forming a channel, a source connection region on one side of the channel region, and a drain connection region on the other side of the channel region.

[0138] The third insulating layer 322 can be disposed on the second active layer ACT2 of the second thin-film transistor TFT2. The second gate electrode E2a of the second thin-film transistor TFT2 can be disposed thereon. The fourth insulating layer 323 can be disposed on the second gate electrode E2a of the second thin-film transistor TFT2. The third insulating layer 322 can be a gate insulating layer, but the embodiments of this disclosure are not limited thereto. The fourth insulating layer 323 can be an interlayer insulating layer, but the embodiments of this disclosure are not limited thereto.

[0139] The first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1, and the second source electrode E2b and the second drain electrode E2c of the second thin-film transistor TFT2 can be disposed on the fourth insulating layer 323.

[0140] The first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1 can be connected to the source connection region and the drain connection region of the first active layer ACT1 through the holes of the fourth insulating layer 323, the third insulating layer 322, the second buffer layer 321, the second insulating layer 313 and the first insulating layer 312, respectively.

[0141] The second source electrode E2b and the second drain electrode E2c of the second thin-film transistor TFT2 can be connected to the source connection region and the drain connection region of the second active layer ACT2 through the holes of the fourth insulating layer 323 and the third insulating layer 322, respectively.

[0142] The first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1, and the second source electrode E2b and the second drain electrode E2c of the second thin-film transistor TFT2, may include a first metal and may be disposed in a first metal layer. Here, the first metal and the first metal layer may be referred to as a first source-drain metal and a first source-drain metal layer.

[0143] Reference Figure 3 For example, the storage capacitor Cst can be formed by a first capacitor electrode CAPE1 and a second capacitor electrode CAPE2. In some cases, the storage capacitor Cst can be formed by three or more capacitor electrodes, or it can have two or more capacitors connected in parallel.

[0144] Each of the first capacitor electrode CAPE1 and the second capacitor electrode CAPE2 can be disposed on various metal layers disposed in the display panel 110.

[0145] For example, the first capacitor electrode CAPE1 may include the same first gate metal as the first gate electrode E1a of the first thin-film transistor TFT1 on the first insulating layer 312, and may be disposed in the first gate metal layer, but the embodiments of this disclosure are not limited thereto. For example, the second capacitor electrode CAPE2 may be disposed on the second insulating layer 313.

[0146] The second source electrode E2b of the second thin-film transistor TFT2 can be electrically connected to the second capacitor electrode CAPE2 through the holes in the fourth insulating layer 323, the third insulating layer 322, and the second buffer layer 321.

[0147] For example, when the subpixel SP is configured as follows Figure 2 As shown, the first thin-film transistor TFT1 can be Figure 2 The scanning transistor ST, and the second thin-film transistor TFT2 can be Figure 2 The driving transistor DT.

[0148] The transistor unit may further include metal layers MP1 and MP2. For example, the first metal layer MP1 may be disposed between the lower buffer layer 311a and the upper buffer layer 311b included in the first buffer layer 311, but embodiments of the present disclosure are not limited thereto. The second metal layer MP2 may include the same first gate metal as the first gate electrode E1a of the first thin-film transistor TFT1, and may be disposed in the first gate metal layer, but embodiments of the present disclosure are not limited thereto. The first metal layer MP1 may be a first metal pattern, and the second metal layer MP2 may be a second metal pattern, but embodiments of the present disclosure are not limited thereto.

[0149] Each of the first metal layer MP1 and the second metal layer MP2 can be set in the display area DA or the non-display area NDA.

[0150] Reference Figure 3 The transistor unit may further include a first shielding pattern BSM1 disposed on the substrate 111. The first shielding pattern BSM1 may overlap with the first active layer ACT1 of the first thin-film transistor TFT1. The first shielding pattern BSM1 may be disposed below the first active layer ACT1 of the first thin-film transistor TFT1. For example, the first shielding pattern BSM1 may be disposed between the substrate 111 and the first buffer layer 311, or it may be disposed between the lower buffer layer 311a and the upper buffer layer 311b.

[0151] The transistor unit may further include a second shielding pattern BSM2 disposed on the substrate 111. The second shielding pattern BSM2 may overlap with the second active layer ACT2 of the second thin-film transistor TFT2. The second shielding pattern BSM2 may be disposed below the second active layer ACT2 of the second thin-film transistor TFT2. For example, the second shielding pattern BSM2 may be disposed in a metal layer between the second insulating layer 313 and the second buffer layer 321. The second shielding pattern BSM2 may be disposed in the same metal layer as the second capacitor CAPE2, but the embodiments of this disclosure are not limited thereto. As another example, the second shielding pattern BSM2 may be disposed in the same first gate metal layer as the first gate electrode E1a of the first thin-film transistor TFT1.

[0152] Reference Figure 3 The transistor unit may also include a common drive signal layer (CVP) to which a common drive signal is applied. The common drive signal layer (CVP) may be located in the display area (DA) or the non-display area (NDA).

[0153] For example, the common drive signal applied to the common drive signal layer CVP can also be referred to as a power signal, and can include at least one of the drive voltage VDD and the base voltage VSS. The drive voltage VDD can be referred to as a high-potential drive voltage (high-potential power supply voltage or high-potential voltage), and the base voltage VSS can be referred to as a low-potential drive voltage (low-potential power supply voltage or low-potential voltage).

[0154] The planarization layer 330 can be disposed on the first thin-film transistor TFT1 and the second thin-film transistor TFT2, and can be disposed below the light-emitting element ED. The planarization layer 330 can be an organic insulating layer including an organic insulating material.

[0155] For example, planarization layer 330 may consist of a single layer. As another example, planarization layer 330 may include two layers. Planarization layer 330 may include a first planarization layer 331 and a second planarization layer 332. As yet another example, planarization layer 330 may include three or more layers. However, embodiments of this disclosure are not limited thereto.

[0156] Reference Figure 3 The first planarization layer 331 can be disposed on the first source electrode E1b and the first drain electrode E1c of the first thin-film transistor TFT1 and the second source electrode E2b and the second drain electrode E2c of the second thin-film transistor TFT2. For example, the first planarization layer 331 can be disposed on the first thin-film transistor TFT1 and the second thin-film transistor TFT2. For example, the first planarization layer 331 can be disposed simultaneously covering both the first thin-film transistor TFT1 and the second thin-film transistor TFT2.

[0157] Reference Figure 3 The connection electrode RE can be disposed on the first planarization layer 331. The connection electrode RE can be electrically connected to the second source electrode E2b and the pixel electrode PE of the second transistor TFT2.

[0158] The connection electrode RE can be electrically connected to the second source electrode E2b of the second thin-film transistor TFT2 through the holes in the first planarization layer 331. The second source electrode E2b of the second thin-film transistor TFT2 can be electrically connected to the second capacitor electrode CAPE2 of the storage capacitor Cst.

[0159] The connecting electrode RE can be disposed in a second metal layer on the first planarization layer 331, and can include a second metal. The second metal and the second metal layer can be referred to as a second source-drain metal and a second source-drain metal layer.

[0160] The second planarization layer 332 can be disposed on the connecting electrode RE.

[0161] Reference Figure 3 The light-emitting element unit can be disposed on the second planarization layer 332. The light-emitting element ED can be formed on the second planarization layer 332. The light-emitting element ED may include a pixel electrode PE, a light-emitting unit EL, and a common electrode CE. The emitting region of the light-emitting element ED can be formed in the region where the pixel electrode PE, the intermediate layer EL, and the common electrode CE overlap and contact each other.

[0162] The pixel electrode PE can be disposed on the second planarization layer 332. The pixel electrode PE can be electrically connected to the connection electrode RE through the holes in the second planarization layer 332.

[0163] A dam 340 can be disposed on the pixel electrode PE. An opening in the dam 340 can expose a portion of the pixel electrode PE to form an emission region. The opening in the dam 340 can overlap with a portion of the pixel electrode PE.

[0164] For example, the dam 340 may be formed of a material including black pigment, or of an organic material such as benzocyclobutene resin, polyimide resin, acrylic resin, or photosensitive polymer, but embodiments of the present disclosure are not limited thereto. When the dam 340 is formed of a material including black pigment, black dye, etc., the dam 340 may be a black dam. When the dam 340 is formed of a material including black pigment or black dye, it may block light from the outside or block light reflected from the outside, and thus may further improve the brightness of the display device 100.

[0165] The light-emitting unit EL of the light-emitting element ED can be disposed on a portion of the diaphragm 340 and the pixel electrode PE. The common electrode CE can be disposed on the light-emitting unit EL.

[0166] Reference Figure 3 The encapsulation unit can be disposed on the light-emitting element unit and can be located on the common electrode CE. The encapsulation unit may include an encapsulation layer 200 formed on the common electrode CE.

[0167] The encapsulation layer 200 can prevent moisture or oxygen from penetrating into the light-emitting element ED. For example, the encapsulation layer 200 can prevent moisture or oxygen from penetrating into the organic material included in the light-emitting unit EL of the light-emitting element ED. The encapsulation layer 200 can be formed of a single layer or multiple layers, but the embodiments of this disclosure are not limited thereto.

[0168] For example, the encapsulation layer 200 may include a first encapsulation layer 341, a second encapsulation layer 342, and a third encapsulation layer 343, but the embodiments of this disclosure are not limited thereto. For example, the first encapsulation layer 341 and the third encapsulation layer 343 may include inorganic layers, and the second encapsulation layer 342 may include an organic layer, but the embodiments of this disclosure are not limited thereto.

[0169] The display panel 110 according to embodiments of the present disclosure may have a built-in touch sensor. In this case, the display panel 110 according to embodiments of the present disclosure may include a touch sensor layer 210 formed on the encapsulation layer 200. The touch sensor layer 210 may be a touch unit.

[0170] Reference Figure 3 The touch sensor layer 210 may include a plurality of touch electrodes TE corresponding to the touch sensor, and may include a touch metal layer on which a plurality of touch metals are disposed to form a plurality of touch electrodes TE.

[0171] For example, the touch metal layer may include a first touch metal layer and a second touch metal layer, with a plurality of first touch metals TM1 disposed on the first touch metal layer and a plurality of second touch metals TM2 disposed on the second touch metal layer. In this case, the touch sensor layer 210 may include a touch interlayer insulating layer 352 between the first touch metal layer and the second touch metal layer.

[0172] One of the first touch metal layer and the second touch metal layer can be a sensor metal layer, while the other can be a bridging metal layer.

[0173] For example, the first touch metal layer can be a bridging metal layer, while the second touch metal layer can be a sensor metal layer. In this case, the plurality of second touch metals TM2 disposed in the second touch metal layer can be sensor metals forming a touch sensor, while the plurality of first touch metals TM1 disposed in the first touch metal layer can be bridging metals electrically connected to the plurality of second touch metals TM2 which are sensor metals.

[0174] As another example, the first touch metal layer can be a sensor metal layer, while the second touch metal layer can be a bridging metal layer. In this case, the plurality of first touch metals TM1 disposed in the first touch metal layer can be sensor metals forming a touch sensor, while the plurality of second touch metals TM2 disposed in the second touch metal layer can be bridging metals electrically connected to the plurality of first touch metals TM1 which are sensor metals.

[0175] As another example, each of the first touch metal layer and the second touch metal layer can be a sensor metal layer and a bridging metal layer. For example, the first touch metal layer can be a sensor metal layer and a bridging metal layer, and the second touch metal layer can be a sensor metal layer and a bridging metal layer. In this case, the plurality of first touch metals TM1 disposed in the first touch metal layer can include sensor metal and bridging metal, while the plurality of second touch metals TM2 disposed in the second touch metal layer can include sensor metal and bridging metal.

[0176] The touch sensor layer 210 may include at least one insulating layer (or touch insulating layer).

[0177] For example, the touch sensor layer 210 may include an insulating layer 352 disposed between a first touch metal layer and a second touch metal layer. A plurality of first touch metals TM1 are disposed on the first touch metal layer, and a plurality of second touch metals TM2 are disposed on the second touch metal layer. For example, the insulating layer 352 may be an inorganic layer comprising an inorganic insulating material or an organic layer comprising an organic insulating material.

[0178] As another example, the touch sensor layer 210 may also include a buffer layer (or touch buffer layer) 351 between the encapsulation layer 200 and the touch metal layer. The buffer layer 351 may be disposed between the encapsulation layer 200 and the first touch metal layer, on which a plurality of first touch metals TM1 are disposed. Here, the buffer layer 351 may be omitted. For example, the buffer layer 351 may be an inorganic layer comprising an inorganic insulating material or an organic layer comprising an organic insulating material.

[0179] As another example, the touch sensor layer 210 may also include a protective layer (or touch protection layer) 353 on the touch metal layer. The protective layer 353 may be disposed on the first touch metal layer, on which a plurality of second touch metals TM2 are disposed. For example, the protective layer 353 may be an inorganic layer comprising an inorganic insulating material or an organic layer comprising an organic insulating material. The protective layer 353 may extend to the upper portion of the touch line TL. The protective layer 353 may further extend to the upper portion of the touchpad TP.

[0180] Each of the plurality of touch electrodes TE may be formed of at least one second touch metal TM2. Each of the plurality of touch electrodes TE may be a grid-type electrode with a plurality of openings, but embodiments of the present disclosure are not limited thereto.

[0181] For example, multiple touch electrodes TE may include a first touch electrode TE1 and a second touch electrode TE2. When the first touch metal layer is a bridging metal layer and the second touch metal layer is a sensor metal layer, two or more second touch metals TM2 forming a first touch electrode TE1 corresponding to a touch sensor can be electrically connected through a first touch metal TM1 that is a bridging metal. For example, second touch metals TM2 spaced apart from each other can be electrically connected through a first touch metal TM1 to form a first touch electrode TE1.

[0182] Multiple first touch metals TM1 can be disposed on the buffer layer 351. An insulating layer 352 can be disposed on the multiple first touch metals TM1. Multiple second touch metals TM2 can be disposed on the insulating layer 352. Some of the multiple second touch metals TM2 can be connected to the corresponding first touch metals TM1 through holes in the insulating layer 352.

[0183] Reference Figure 3 Multiple first touch metal TM1 and multiple second touch metal TM2 can be configured not to overlap with the light-emitting element ED. Multiple first touch metal TM1 and multiple second touch metal TM2 can overlap with the embankment 340.

[0184] The protective layer 353 can be disposed on the touch metal layer. The protective layer 353 can be disposed while covering multiple touch metals TM1 and TM2 disposed in the touch metal layer.

[0185] Reference Figure 3 The touch line TL electrically connects the touch electrode TE to the touch panel TP. The touch line TL can be formed from at least one of a first touch metal TM1 and a second touch metal TM2. For example, the touch line TL can be disposed in at least one of a first touch metal layer and a second touch metal layer. However, embodiments of this disclosure are not limited thereto.

[0186] The touch line TL can be formed from a first touch metal TM1, or from a second touch metal TM2, or from both. When a touch line TL is formed from the first touch metal TM1 and the second touch metal TM2, the first touch metal TM1 and the second touch metal TM2 constituting the touch line TL can be electrically connected through holes in the insulating layer 352.

[0187] When the display panel 110 is of the type in which a touch sensor is embedded, the touch line TL can extend along the outer inclined surface SLP1 of the encapsulation layer 200 and can extend beyond the upper part of at least one dam portion DAM to reach the touch panel TP in the non-display area NDA.

[0188] Figure 4 An example of a stretchable electronic device according to an embodiment of the present disclosure is shown.

[0189] Reference Figure 4 The stretchable display device may include a display panel 110, which is made stretchable in any direction (e.g., in the shorter or longer or inclined direction of the material performing the display) and is recoverable after stretching.

[0190] For example, a device (e.g., a membrane) that can be displayed without being damaged when stretched arbitrarily is called a stretchable display device.

[0191] Figure 5 This is a cross-sectional view showing a portion of the encapsulation layer 200 in a display panel according to an embodiment of the present disclosure.

[0192] Reference Figure 5 The encapsulation layer 200 may include multiple inorganic encapsulation layers 520 and multiple organic encapsulation layers 510. The first organic encapsulation layer 511 may be disposed at the lowest part, and the first inorganic encapsulation layer 521, the second organic encapsulation layer 512, the third organic encapsulation layer 513, the third inorganic encapsulation layer 523 and the fourth organic encapsulation layer 514 may be disposed sequentially on the first organic encapsulation layer 511.

[0193] In other words, multiple inorganic encapsulation layers 520 and multiple organic encapsulation layers 510 can be alternately arranged. By alternately stacking multiple inorganic encapsulation layers 520 and multiple organic encapsulation layers 510, the encapsulation layer 200 can protect the light-emitting element ED from foreign substances such as moisture, oxygen and dust particles.

[0194] although Figure 5 Only three inorganic encapsulation layers 520 and four organic encapsulation layers 510 are shown in the diagram, but the encapsulation layer 200 may include hundreds to thousands of inorganic encapsulation layers 520 and organic encapsulation layers 510. Therefore, the plurality of inorganic encapsulation layers 520 can be formed to have a thickness in nm. For example, the thickness of at least one of the plurality of inorganic encapsulation layers 520 may be 10 nm.

[0195] Because the multiple organic encapsulation layers 510 have flexible physical properties, they are not easily damaged even when an external force is applied to stretch the display device. On the other hand, the multiple inorganic encapsulation layers 520 have excellent moisture penetration resistance, but if an external force is applied to the display device, the inorganic encapsulation layers may quickly reach their yield point and break due to their low modulus. Modulus can represent the ratio of the strain of the inorganic encapsulation layer 520 to the stress applied to the inorganic encapsulation layer 520.

[0196] Here, to ensure both the moisture-proof effect and flexibility of the encapsulation layer 200 in the stretchable display device according to the embodiments of this disclosure, each of two or more of the plurality of inorganic encapsulation layers 520 may include a plurality of openings. The plurality of inorganic encapsulation layers 520 are described in detail below with reference to the accompanying drawings.

[0197] Figures 6 to 8 This is a plan view showing some of the plurality of inorganic encapsulation layers 520 in a display panel according to an embodiment of the present disclosure.

[0198] Reference Figures 6 to 8 Multiple openings can be arranged in multiple rows, and multiple openings in two adjacent rows can be arranged in a zigzag pattern.

[0199] Here, multiple openings arranged in multiple rows can refer to multiple openings arranged in the first direction D1.

[0200] Figure 6 This is a plan view showing some of the plurality of inorganic encapsulation layers 520 in a display panel according to an embodiment of the present disclosure.

[0201] At least one of the plurality of inorganic encapsulation layers 520 may include having Figure 6 Multiple openings 610 of the shape disclosed herein.

[0202] The length of each of the plurality of openings 610 in the first direction D1 may be less than or equal to its length in the second direction D2, which is different from the first direction D1. The second direction D2 may be perpendicular to the first direction D1. In other words, each of the plurality of openings 610 may have a horizontal length equal to or less than the vertical length. For example, each of the plurality of openings 610 may have a width in the first direction D1 and a length in the second direction D2, which is different from the first direction D1, and each of the plurality of openings 610 may have a width in the first direction D1 that is less than its length in the second direction D2.

[0203] In a display panel according to an embodiment of the present disclosure, at least one of the plurality of openings 610 can be deformed by an external force applied to the substrate.

[0204] For example, when a tensile force is applied to the substrate in the first direction D1, at least one of the plurality of openings 610 can deform to increase the length in the first direction D1 and decrease the length in the second direction D2.

[0205] For example, when a tensile force is applied to the substrate in the second direction D2, at least one of the plurality of openings 610 can deform to increase its length in the second direction D2 and decrease its length in the first direction D1.

[0206] When a tensile force is applied to the substrate in the first direction D1, the degree of deformation of at least one of the plurality of openings 610 can be greater than the degree of deformation of at least one of the plurality of openings 610 when a tensile force is applied to the substrate in the second direction D2. In other words, the tensile strength of the inorganic encapsulation layer including the plurality of openings 610 in the first direction D1 can be equal to or greater than the tensile strength in the second direction D2.

[0207] Therefore, since the display device according to the embodiments of the present disclosure includes an inorganic encapsulation layer having a plurality of openings 610, the tensile strength of the inorganic encapsulation layer / opening 610, substrate or display device in the first direction D1 may be greater than or equal to the tensile strength of the inorganic encapsulation layer / opening 610, substrate or display device in the second direction D2.

[0208] The stretchability of the display device in the first direction D1 can be equal to or greater than the stretchability of the display device in the second direction D2.

[0209] This could mean that the stretchability of the plurality of openings 610 in the first direction D1 is equal to or greater than the stretchability of the plurality of openings 410 in the second direction D2, or that the stretchability of the plurality of inorganic encapsulation layers 520 in the first direction D1 is equal to or greater than the stretchability of the plurality of inorganic encapsulation layers 520 in the second direction D2.

[0210] In addition, tensile strength can indicate the degree of deformation.

[0211] The stretchability of the display device in the first direction D1 can be equal to or greater than the stretchability of the display device in the second direction D2, which means that the degree of deformation of the display device in the first direction D1 can be equal to or greater than the degree of deformation of the display device in the second direction D2.

[0212] Furthermore, this could mean that the degree of deformation of the plurality of openings 610 in the first direction D1 is equal to or greater than the degree of deformation of the plurality of openings 610 in the second direction D2, or that the degree of deformation of the plurality of inorganic encapsulation layers 520 in the first direction D1 is equal to or greater than the degree of deformation of the plurality of inorganic encapsulation layers 520 in the second direction D2.

[0213] Figure 7 This is a plan view showing some of the plurality of inorganic encapsulation layers 520 in a display panel according to an embodiment of the present disclosure.

[0214] At least one of the plurality of inorganic encapsulation layers 520 may include having Figure 7 Multiple openings 710 of the shape disclosed herein.

[0215] Reference Figure 7 The multiple openings 710 can be arranged in multiple rows, and the multiple rows can include a first row R1 and a second row R2 that are adjacent to each other. The multiple openings 710 can include a first opening 711 arranged in the first row R1 and a multiple second openings 712 arranged in the second row R2.

[0216] The length of each of the plurality of openings 710 in the first direction D1 may be equal to or greater than its length in the second direction D2, which is different from the first direction D1. In other words, each of the first opening 711 and the second opening 712 may have a horizontal length greater than or equal to the vertical length. For example, the horizontal length of the first opening 711 may be 6 mm and the vertical length may be 2 mm, but this disclosure is not limited thereto.

[0217] In the display panel according to embodiments of the present disclosure, the dimensions of the first opening 711 and the second opening 712 may be different. For example, the length of the first opening 711 in the second direction D2 may be greater than the length of the second opening 712 in the second direction D2. As another example, the lengths of the first opening 711 in the first direction D1 and the second opening 712 in the second direction D2 may be greater than the lengths of the second opening 712 in the first direction D1 and the second direction D2, but the present disclosure is not limited thereto.

[0218] In a display panel according to an embodiment of the present disclosure, at least one of the plurality of openings 710 can be deformed by an external force applied to the substrate.

[0219] For example, when a tensile force is applied to the substrate in the first direction D1, at least one of the plurality of openings 710 can deform to increase the length in the first direction D1 and decrease the length in the second direction D2.

[0220] For example, when a tensile force is applied to the substrate in the second direction D2, at least one of the plurality of openings 710 can deform to increase the length in the second direction D2 and decrease the length in the first direction D1.

[0221] When a tensile force is applied to the substrate in the first direction D1, the degree of deformation of at least one of the plurality of openings 710 may be less than the degree of deformation of at least one of the plurality of openings 710 when a tensile force is applied to the substrate in the second direction D2. In other words, the tensile strength of the inorganic encapsulation layer including the plurality of openings 710 in the second direction D2 may be equal to or greater than the tensile strength in the first direction D1.

[0222] Therefore, since the display device according to the embodiments of the present disclosure includes an inorganic encapsulation layer having a plurality of openings 710, the tensile strength of the inorganic encapsulation layer / opening 710, substrate or display device in the second direction D2 can be greater than or equal to the tensile strength of the inorganic encapsulation layer / opening 710, substrate or display device in the first direction D1.

[0223] The stretchability of the display device in the second direction D2 can be equal to or greater than the stretchability of the display device in the first direction D1.

[0224] This could mean that the stretchability of the plurality of openings 710 in the second direction D2 is equal to or greater than the stretchability of the plurality of openings 710 in the first direction D1, or that the stretchability of the plurality of inorganic encapsulation layers 520 in the second direction D2 is equal to or greater than the stretchability of the plurality of inorganic encapsulation layers 520 in the first direction D1.

[0225] Furthermore, tensile strength can mean the degree of deformation, and some of the repetitive descriptions of the above configurations are omitted.

[0226] Figure 8 This is a plan view showing some of the plurality of inorganic encapsulation layers 520 in a display panel according to an embodiment of the present disclosure.

[0227] At least one of the plurality of inorganic encapsulation layers 520 may include having Figure 8 Multiple openings 810 of the shape disclosed herein.

[0228] Each of the plurality of openings 810 may include a stem-shaped hole 811 extending in the first direction D1 and a plurality of branch-shaped holes 812 extending from the stem-shaped hole 811.

[0229] In a display panel according to an embodiment of the present disclosure, at least one of the plurality of openings 810 can be deformed by an external force applied to the substrate.

[0230] For example, when a tensile force is applied to the substrate in the first direction D1, at least one of the plurality of openings 810 may include a branch-shaped hole 812 which may be deformed to increase its length in the first direction D1.

[0231] For example, when a tensile force is applied to the substrate in the second direction D2, at least one of the plurality of openings 810, including a stem hole 811, can deform to increase its length in the second direction D2.

[0232] Therefore, the inorganic encapsulation layer including multiple openings 810 can have constant tensile strength in the first direction D1 and the second direction D2. Thus, since the display device according to the embodiments of this disclosure includes an inorganic encapsulation layer having multiple openings 810, the tensile strength (e.g., the inorganic encapsulation layer / openings 810, the substrate, or the display device) in the first direction D1 and the second direction D2 can be constant.

[0233] Figure 9 This is a cross-sectional view showing a portion of the encapsulation layer 200 in a display panel according to an embodiment of the present disclosure.

[0234] The encapsulation layer 200 may include a plurality of inorganic encapsulation layers 520, and the plurality of inorganic encapsulation layers 520 may include a lower inorganic encapsulation layer 910 and an upper inorganic encapsulation layer 930, wherein the upper inorganic encapsulation layer 930 is located further away from the substrate 111 than the lower inorganic encapsulation layer 910. Although in Figure 9 Although not shown, the lower inorganic encapsulation layer 910 may have multiple lower openings, and the upper inorganic encapsulation layer 930 may have multiple upper openings.

[0235] The plurality of inorganic encapsulation layers 520 may further include an intermediate inorganic encapsulation layer 920 disposed between the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930. Although in Figure 9 It is not shown in the figure, but the intermediate inorganic encapsulation layer 920 may have multiple intermediate openings.

[0236] Each of the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920, and the upper inorganic encapsulation layer 930 can be a single layer included in a plurality of inorganic encapsulation layers 520.

[0237] Furthermore, some adjacent inorganic encapsulation layers among the multiple inorganic encapsulation layers 520 can be collectively referred to as the lower inorganic encapsulation layer 910. Some adjacent inorganic encapsulation layers located further away from the substrate 111 than the lower inorganic encapsulation layer 910 can be collectively referred to as the upper inorganic encapsulation layer 930. Some adjacent inorganic encapsulation layers disposed between the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930 can be collectively referred to as the intermediate inorganic encapsulation layer 920.

[0238] In a display panel according to an embodiment of the present disclosure, at least a portion of the area of ​​each of the plurality of lower openings may not overlap with at least a portion of each of the plurality of upper openings. Furthermore, at least a portion of the area of ​​each of the plurality of intermediate openings may not overlap with at least a portion of the area of ​​each of the plurality of upper openings and the plurality of lower openings.

[0239] If multiple lower openings overlap with multiple upper openings, moisture introduced from outside the display panel can quickly reach the light-emitting element (ED) through the overlapping paths of the upper and lower openings. When the ED includes an organic layer formed of organic material, the moisture reaching the ED may degrade the organic layer.

[0240] At least a portion of each of the plurality of lower openings does not overlap with at least a portion of each of the plurality of upper openings, thereby increasing and complicating the permeation path of moisture introduced from the outside of the display panel. Therefore, when moisture permeates the plurality of inorganic encapsulation layers 520 including the plurality of openings, moisture can be prevented from reaching the light-emitting element ED.

[0241] Furthermore, since the multiple intermediate openings are located between the multiple upper openings and the multiple lower openings, and at least a portion of each of the multiple intermediate openings does not overlap with at least a portion of each of the multiple upper openings and the multiple lower openings, the permeation path of moisture introduced from the outside of the display panel can be further increased and complicated. Therefore, even if moisture permeates into the encapsulation layer, it can prevent moisture from reaching the light-emitting element (ED).

[0242] Therefore, even if the display device is stretched in various directions, moisture introduced from the outside of the display panel can be prevented from penetrating the encapsulation layer 200 and reaching the light-emitting element ED.

[0243] In the following description, various embodiments in which at least a portion of the lower and upper openings do not overlap are described in more detail.

[0244] Figures 10 to 13 This is a plan view showing a portion of the encapsulation layer in a display panel according to an embodiment of the present disclosure.

[0245] Figure 10 This is a plan view showing the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0246] Reference Figure 10 The lower inorganic encapsulation layer 910 may include a plurality of lower openings 1010, and the upper inorganic encapsulation layer 930 may include a plurality of upper openings 1030. Each of the plurality of lower openings 1010 and the plurality of upper openings 1030 may have a length in a first direction D1 that is less than or equal to its length in a second direction D2, which is different from the first direction D1. In other words, each of the plurality of lower openings 1010 and the plurality of upper openings 1030 may have a horizontal length that is equal to or less than its vertical length.

[0247] Reference Figure 10In a display panel according to an embodiment of the present disclosure, the size of each of the plurality of upper openings 1030 may be equal to or smaller than the size of each of the plurality of lower openings 1010.

[0248] For example, the length of the upper opening 1030 in the second direction D2 may be equal to or less than the length of the lower opening 1010 in the second direction D2. As another example, the length of the upper opening 1030 in the first direction D1 and the length of the first opening 711 in the second direction D2 may be equal to or less than the length of the lower opening 1010 in the first direction D1 and the length of the lower opening 711 in the second direction D2, but this disclosure is not limited thereto.

[0249] Since the size of each of the plurality of upper openings 1030 is less than or equal to the size of each of the plurality of lower openings 1010, moisture introduced from outside the display panel can be prevented from penetrating the encapsulation layer 200 and reaching the light-emitting element ED.

[0250] Among the multiple inorganic encapsulation layers 520, the uppermost inorganic encapsulation layer, that is, the inorganic encapsulation layer closer to the outside of the display panel, can be the first to come into contact with moisture introduced from the outside. Therefore, the size of the upper opening 1030 can be the smallest among all the openings included in the multiple inorganic encapsulation layers 520.

[0251] Reference Figure 10 In the display panel according to embodiments of the present disclosure, the number of upper openings 1030 per unit area included in the upper inorganic encapsulation layer 930 can be greater than or equal to the number of lower openings 1010 per unit area included in the lower inorganic encapsulation layer 910. In other words, the density of the plurality of upper openings 1030 in the upper inorganic encapsulation layer 930 can be greater than or equal to the density of the plurality of lower openings 1010 in the lower inorganic encapsulation layer 910.

[0252] Because the plurality of upper openings 1030 are arranged more densely than the plurality of lower openings 1010, the flexibility of the display panel can be ensured. Flexibility may refer to stretchability in at least one of the first direction D1 and the second direction D2, but this disclosure is not limited thereto.

[0253] In the display panel according to embodiments of the present disclosure, the size of each of the plurality of upper openings 1030 may be smaller than or equal to the size of each of the plurality of lower openings 1010. Therefore, when an external force is applied to the substrate along the first direction D1 or the second direction D2, the deformation of at least one upper opening 1030 may be less than the deformation of at least one lower opening 1010. Consequently, the flexibility of the upper inorganic encapsulation layer 930 including the plurality of upper openings 1030 is less than that of the lower inorganic encapsulation layer 910 including the plurality of lower openings 1010, and therefore the flexibility of the display panel may also deteriorate.

[0254] Therefore, by increasing the number of upper openings 1030 per unit area included in the upper inorganic encapsulation layer 930, the number of upper openings 1030 that deform when an external force is applied to the substrate can be increased. Thus, the flexibility of the upper inorganic encapsulation layer 930 can be ensured and the flexibility of the display panel can be enhanced.

[0255] Figure 11 This is a plan view showing the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0256] Reference Figure 11 The lower inorganic encapsulation layer 910 may include a plurality of lower openings 1110, and the upper inorganic encapsulation layer 930 may include a plurality of upper openings 1130. Each of the plurality of lower openings 1110 and the plurality of upper openings 1130 may have a length in a first direction D1 that is equal to or greater than its length in a second direction D2, which is different from the first direction D1. In other words, each of the plurality of lower openings 1110 and the plurality of upper openings 1130 may have a horizontal length that is greater than or equal to its vertical length.

[0257] Reference Figure 11 In a display panel according to an embodiment of the present disclosure, the size of each of the plurality of upper openings 1130 may be equal to or smaller than the size of each of the plurality of lower openings 1110.

[0258] For example, the length of the upper opening 1130 in the first direction D1 may be less than or equal to the length of the lower opening 1110 in the first direction D1. As another example, the length of the upper opening 1130 in the first direction D1 and the length of the first opening 711 in the second direction D2 may be equal to or less than the length of the lower opening 1110 in the first direction D1 and the length of the lower opening 711 in the second direction D2, but this disclosure is not limited thereto.

[0259] Since the size of each of the plurality of upper openings 1130 is less than or equal to the size of each of the plurality of lower openings 1110, moisture introduced from outside the display panel can be prevented from penetrating the encapsulation layer 200 and reaching the light-emitting element ED.

[0260] Reference Figure 11 In the display panel according to embodiments of the present disclosure, the number of upper openings 1130 per unit area included in the upper inorganic encapsulation layer 930 can be greater than or equal to the number of lower openings 1110 per unit area included in the lower inorganic encapsulation layer 910. In other words, the density of the plurality of upper openings 1130 in the upper inorganic encapsulation layer 930 can be greater than or equal to the density of the plurality of lower openings 1110 in the lower inorganic encapsulation layer 910.

[0261] Because the multiple upper openings 1130 are arranged more densely than the multiple lower openings 1110, the flexibility of the display panel can be ensured.

[0262] Because the size of each of the plurality of upper openings 1130 is less than or equal to the size of each of the plurality of lower openings 1110, and the number of upper openings 1130 per unit area is equal to or greater than the number of lower openings 1110 per unit area, the configuration is... Figure 10 The configurations are the same, so redundant descriptions can be omitted.

[0263] Figure 12 This is a plan view showing the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0264] Reference Figure 12 The lower inorganic encapsulation layer 910 may include a plurality of lower openings 1210, and the upper inorganic encapsulation layer 930 may include a plurality of upper openings 1230. Each of the plurality of lower openings 1210 and the plurality of upper openings 1230 may include a stem-shaped aperture extending in a first direction D1 and a plurality of branch-shaped apertures extending from the stem-shaped aperture.

[0265] Reference Figure 12 In a display panel according to an embodiment of the present disclosure, the size of each of the plurality of upper openings 1230 may be equal to or smaller than the size of each of the plurality of lower openings 1210.

[0266] For example, the length (width) of the stem-shaped hole of the upper opening 1230 in the second direction D2 may be less than or equal to the length (width) of the stem-shaped hole of the lower opening 1210 in the second direction D2. As another example, the length (width) of the branch-shaped hole of the upper opening 1230 in the first direction D1 and the length (width) of the branch-shaped hole in the second direction D2 may be equal to or less than the length of the branch-shaped hole of the lower opening 1210 in the first direction D1 and the length of the branch-shaped hole in the second direction D2, but this disclosure is not limited thereto.

[0267] Since the size of each of the plurality of upper openings 1230 is less than or equal to the size of each of the plurality of lower openings 1210, moisture introduced from outside the display panel can be prevented from penetrating the encapsulation layer 200 and reaching the light-emitting element ED.

[0268] Reference Figure 12In the display panel according to embodiments of the present disclosure, the number of upper openings 1230 per unit area included in the upper inorganic encapsulation layer 930 can be greater than or equal to the number of lower openings 1210 per unit area included in the lower inorganic encapsulation layer 910. In other words, the density of the plurality of upper openings 1230 in the upper inorganic encapsulation layer 930 can be greater than or equal to the density of the plurality of lower openings 1210 in the lower inorganic encapsulation layer 910.

[0269] Because the multiple upper openings 1230 are arranged more densely than the multiple lower openings 1210, the flexibility of the display panel can be ensured.

[0270] Because the size of each of the plurality of upper openings 1230 is less than or equal to the size of each of the plurality of lower openings 1210, and the number of upper openings 1230 per unit area is equal to or greater than the number of lower openings 1210 per unit area, the configuration is... Figure 10 The configurations are the same, so redundant descriptions can be omitted.

[0271] Figure 13 This is a plan view showing the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0272] Reference Figure 13 The lower inorganic encapsulation layer 910 may include a plurality of lower openings 1310, and the upper inorganic encapsulation layer 930 may include a plurality of upper openings 1330. Each of the plurality of lower openings 1310 may have a length in a first direction D1 that is equal to or greater than its length in a second direction D2, which is different from the first direction D1, and each of the plurality of upper openings 1330 may have a length in the first direction D1 that is equal to or less than its length in the second direction D2. In other words, each of the plurality of lower openings 1310 may have a horizontal length greater than or equal to its vertical length, and each of the plurality of upper openings 1330 may have a horizontal length less than or equal to its vertical length, but this disclosure is not limited thereto. For example, the horizontal length of each of the plurality of lower openings 1310 may be less than or equal to its vertical length, and the horizontal length of each of the plurality of upper openings 1330 may be greater than or equal to its vertical length. Alternatively, the plurality of lower openings 1310 may have a length in a first direction D1 and a width in a second direction D2 different from the first direction D1, and the plurality of upper openings 1330 may have a width in the first direction D1 and a length in a second direction D2 different from the first direction D1.

[0273] In the display panel of an embodiment according to this disclosure, and Figures 10 to 12 The differences lie in the fact that the lower openings 1010, 1110, and 1210 have similar shapes to the upper openings 1030, 1130, and 1230 but have different dimensions, as shown in the reference. Figure 13 The shape of the lower opening 1310 and the shape of the upper opening 1330 can be different.

[0274] Therefore, at least a portion of each of the plurality of lower openings 1310 does not overlap with at least a portion of each of the plurality of upper openings 1330, thereby increasing and complicating the penetration path of moisture introduced from outside the display panel. Thus, when moisture penetrates the plurality of inorganic encapsulation layers 520 including the plurality of openings, moisture can be prevented from reaching the light-emitting element ED.

[0275] The lower inorganic encapsulation layer 910, comprising a plurality of lower openings 1310 having a length in the first direction D1 equal to or greater than the length in the second direction D2, can have a stretchability in the first direction D1 equal to or less than that in the second direction D2. On the other hand, the upper inorganic encapsulation layer 930, comprising a plurality of upper openings 1330 having a length in the first direction D1 equal to or less than the length in the second direction D2, can have a stretchability in the first direction D1 equal to or greater than that in the second direction D2. Therefore, the encapsulation layer 200, with alternating lower inorganic encapsulation layers 910 and upper inorganic encapsulation layers 930, can have constant stretchability in the first direction D1 and the second direction D2.

[0276] In the following description, various embodiments in which at least a portion of each of the lower opening 910, the middle opening 920 and the upper opening 930 does not overlap are described in more detail.

[0277] Figures 14 to 16 This is a plan view showing a portion of the encapsulation layer 200 in a display panel according to an embodiment of the present disclosure.

[0278] Figure 14 This is a plan view showing the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0279] Reference Figure 14 The lower inorganic encapsulation layer 910 may include multiple lower openings 1410, the middle inorganic encapsulation layer 920 may include multiple middle openings 1420, and the upper inorganic encapsulation layer 930 may include multiple upper openings 1430.

[0280] Each of the plurality of lower openings 1410 and the plurality of upper openings 1430 may have a first length L1 in a first direction D1 and a second length L2 in a second direction D2 different from the first direction D1. Each of the plurality of intermediate openings 1420 may include a stem-shaped opening extending in a direction corresponding to the shorter of the first length L1 and the second length L2 and a plurality of branch-shaped openings extending from the stem-shaped opening.

[0281] Reference Figure 14 The first length L1 may be less than or equal to the second length L2. Therefore, each of the plurality of intermediate openings 1420 may include a stem-shaped opening extending in a direction corresponding to the first length L1 (i.e., in the first direction D1). A plurality of branch-shaped openings may extend from the stem-shaped openings along the second direction D2 and connect with each other.

[0282] Reference Figure 14 Since the lower opening 1410 and the upper opening 1430 are similar in shape and size, moisture introduced from outside the display panel can quickly reach the light-emitting element ED through the paths of the multiple overlapping upper openings 1430 and multiple lower openings 1410.

[0283] However, a plurality of intermediate openings 1420 are disposed between a plurality of lower openings 1410 and a plurality of upper openings 1430, and the shape of the intermediate openings 1420 may differ from the shapes of the lower openings 1410 and the upper openings 1430. Therefore, at least a portion of each of the plurality of intermediate openings 1420 may not overlap with at least a portion of each of the plurality of upper openings 1430 and the plurality of lower openings 1410. Thus, the plurality of intermediate openings 1420 can increase and complicate the moisture permeation path, thereby preventing moisture from rapidly reaching the light-emitting element (ED).

[0284] The lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930, which respectively include a plurality of lower openings 1410 and a plurality of upper openings 1430 having a first length L1 equal to or greater than the second length L2, can have tensile strength in the first direction D1 equal to or greater than that in the second direction D2.

[0285] However, the intermediate inorganic encapsulation layer 920, which includes a stem-shaped hole extending in the first direction D1 and a plurality of branch-shaped holes extending from the stem-shaped hole in the second direction D2, can have constant tensile strength in the first direction D1 and the second direction D2.

[0286] Therefore, since the intermediate inorganic encapsulation layer 920 is disposed between the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930, the tensile strength of the entire encapsulation layer 200 in the first direction D1 and the second direction D2 can be uniform.

[0287] Figure 15 This is a plan view showing the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0288] Reference Figure 15 The lower inorganic encapsulation layer 910 may include multiple lower openings 1510, the middle inorganic encapsulation layer 920 may include multiple middle openings 1520, and the upper inorganic encapsulation layer 930 may include multiple upper openings 1530.

[0289] Each of the plurality of lower openings 1510 and the plurality of upper openings 1530 may have a third length L3 in a first direction D1 and a fourth length L4 in a second direction D2 different from the first direction D1. Each of the plurality of intermediate openings 1520 may include a stem-shaped opening extending in a direction corresponding to the larger of the third length L3 and the fourth length L4 and a plurality of branch-shaped openings extending from the stem-shaped opening.

[0290] Reference Figure 15 The third length L3 can be greater than or equal to the fourth length L4. Therefore, each of the plurality of intermediate openings 1520 may include a stem-shaped opening extending in a direction corresponding to the third length L3 (i.e., in the first direction D1). A plurality of branch-shaped openings may extend from the stem-shaped openings along the second direction D2 and connect with each other.

[0291] Since multiple intermediate openings 1520 with different shapes from the lower openings 1510 and the upper openings 1530 are provided between the multiple lower openings 1510 and the multiple upper openings 1530, the moisture penetration path can be increased and complicated to prevent moisture from quickly reaching the light-emitting element ED.

[0292] Furthermore, the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930, which include an opening having a third length L3 greater than or equal to a fourth length L4, can have a tensile strength in the first direction D1 that is less than or equal to that in the second direction D2. However, since the intermediate inorganic encapsulation layer 920 is disposed between the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930, the tensile strength of the entire encapsulation layer 200 in the first direction D1 and the second direction D2 can be uniform.

[0293] Because the multiple intermediate openings 1520 have different shapes from the lower opening 1510 and the upper opening 1530, and because the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930 are configured with good stretching orientation, Figure 14 Since the configurations are the same, duplicate descriptions can be omitted.

[0294] Figure 16 This is a plan view showing the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920 and the upper inorganic encapsulation layer 930 according to an embodiment of the present disclosure.

[0295] Reference Figure 16 The lower inorganic encapsulation layer 910 may include multiple lower openings 1610, the middle inorganic encapsulation layer 920 may include multiple middle openings 1620, and the upper inorganic encapsulation layer 930 may include multiple upper openings 1630.

[0296] Each of the plurality of lower openings 1610 may have a third length L3 in a first direction D1 and a fourth length L4 in a second direction D2 different from the first direction D1. Each of the plurality of upper openings 1630 may have a first length L1 in the first direction D1 and a second length L2 in the second direction D2.

[0297] The dimensional relationship between the third length L3 and the fourth length L4 of each of the plurality of lower openings 1610 can be the opposite of the dimensional relationship between the first length L1 and the second length L2 of each of the plurality of upper openings 1630. In other words, the horizontal length of the lower opening 1610 is greater than or equal to the vertical length, while the horizontal length of the upper opening 1630 is less than or equal to the vertical length.

[0298] In a display panel according to an embodiment of the present disclosure, each of the plurality of intermediate openings 1620 may include a stem-shaped hole extending along a first direction D1 and a plurality of branch-shaped holes extending from the stem-shaped hole.

[0299] Therefore, the shapes of the lower opening 1610, the middle opening 1620, and the upper opening 1630 can be different. Therefore, at least a portion of the corresponding areas of the plurality of lower openings 1610, the plurality of middle openings 1620, and the plurality of upper openings 1630 can not overlap each other. Therefore, the permeation path of moisture introduced from outside the display panel can be increased and complicated, thereby preventing moisture from reaching the light-emitting element (ED) when it permeates the multiple inorganic encapsulation layers.

[0300] According to the embodiments of the present disclosure described above, the lower inorganic encapsulation layer 910 may have a stretchability in the second direction D2 that is greater than or equal to its stretchability in the first direction D1, and the upper inorganic encapsulation layer 930 may have a stretchability in the first direction D1 that is greater than or equal to its stretchability in the second direction D2. The intermediate inorganic encapsulation layer 920 may have constant stretchability in the first direction D1 and the second direction D2.

[0301] Therefore, the tensile strength of the entire encapsulation layer 200, including the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920 and the upper inorganic encapsulation layer 930, can be uniform in the first direction D1 and the second direction D2.

[0302] Figure 17 This is a cross-sectional view showing a portion of the encapsulation layer 200 in a display panel according to an embodiment of the present disclosure.

[0303] The encapsulation layer 200 may include a plurality of inorganic encapsulation layers 520, and the plurality of inorganic encapsulation layers 520 may include a lower inorganic encapsulation layer 910, an upper inorganic encapsulation layer 930 located further from the substrate 111 than the lower inorganic encapsulation layer 910, and an intermediate inorganic encapsulation layer 920 disposed between the lower inorganic encapsulation layer 910 and the upper inorganic encapsulation layer 930. Although in Figure 17 Although not shown in the figure, the lower inorganic encapsulation layer 910 may have multiple lower openings, the upper inorganic encapsulation layer 930 may have multiple upper openings, and the middle inorganic encapsulation layer 920 may have multiple middle openings.

[0304] In the display panel according to embodiments of the present disclosure, the thickness of the inorganic encapsulation layer farther from the substrate 111 among the plurality of inorganic encapsulation layers 520 may be equal to or greater than the thickness of the inorganic encapsulation layer closer to the substrate 111. (Refer to...) Figure 17 The thickness of the intermediate inorganic encapsulation layer 920 can be greater than or equal to the thickness of the lower inorganic encapsulation layer 910, and the thickness of the upper inorganic encapsulation layer 930 can be greater than or equal to the thickness of the intermediate inorganic encapsulation layer 920. In other words, the thickness can increase in the order of the lower inorganic encapsulation layer 910, the intermediate inorganic encapsulation layer 920, and the upper inorganic encapsulation layer 930.

[0305] The thicknesses of the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920, and the upper inorganic encapsulation layer 930 can be related to the multiple openings included in each inorganic encapsulation layer.

[0306] For example, if the thickness of the inorganic encapsulation layer increases when the size of each opening included in one of the multiple inorganic encapsulation layers 520 is larger than a moisture particle, moisture introduced from outside the display panel can quickly penetrate into the encapsulation layer through the paths of the large and deep openings. In this case, if the thickness of the inorganic encapsulation layer (in nm) is designed to be very thin, moisture can be immediately blocked by contact with other inorganic or organic encapsulation layers. Therefore, as the size of each of the multiple openings included in the inorganic encapsulation layer increases, the thickness of the inorganic encapsulation layer may decrease.

[0307] Conversely, as the size of each of the multiple openings included in the inorganic encapsulation layer decreases, the thickness of the inorganic encapsulation layer may increase. By designing the path through which moisture introduced from the outside of the display panel can move to be narrow and long, rapid penetration of moisture into the encapsulation layer 200 can be effectively prevented.

[0308] Reference Figures 10 to 12 The size of each of the plurality of upper openings may be equal to or smaller than the size of each of the plurality of lower openings. In other words, in a display panel according to an embodiment of the present disclosure, the plurality of openings, including those located in an inorganic encapsulation layer further away from the substrate 111, may have a smaller size.

[0309] Therefore, the thickness can be increased in the order of the lower inorganic encapsulation layer 910, the middle inorganic encapsulation layer 920, and the upper inorganic encapsulation layer 930 closest to the substrate 111, and the size can be decreased in the order of the lower opening, the middle opening, and the upper opening.

[0310] Figure 18 This is a cross-sectional view showing a portion of the display area DA of a display panel 110 according to an embodiment of the present disclosure.

[0311] Reference Figure 18 The display panel 110 according to the embodiments of the present disclosure may include a substrate 111, a transistor unit, a light-emitting element ED, a dam 340, and an encapsulation layer 200 in which a plurality of inorganic encapsulation layers 520 and a plurality of organic encapsulation layers 510 are alternately disposed, and some repeated descriptions of the configuration described above are omitted.

[0312] The encapsulation layer 200 includes a first inorganic encapsulation layer to a third inorganic encapsulation layer 521, 522 and 523 and a first organic encapsulation layer to a fourth organic encapsulation layer 511, 512, 513 and 514, and each of the first inorganic encapsulation layer to the third inorganic encapsulation layer 521, 522 and 523 may include a plurality of openings.

[0313] Reference Figure 18 The thickness of the second inorganic encapsulation layer 522 can be greater than or equal to the thickness of the first inorganic encapsulation layer 521, and the thickness of the third inorganic encapsulation layer 523 can be greater than or equal to the thickness of the second inorganic encapsulation layer 522. In other words, the thickness can increase in the order of the first inorganic encapsulation layer 521, the second inorganic encapsulation layer 522, and the third inorganic encapsulation layer 523.

[0314] Reference Figure 18 The size of each opening included in the second inorganic encapsulation layer 522 may be less than or equal to the size of each opening included in the first inorganic encapsulation layer 521, and the size of each opening included in the third inorganic encapsulation layer 523 may be less than or equal to the size of each opening included in the second inorganic encapsulation layer 522. In other words, the size of the plurality of openings included in each inorganic encapsulation layer may decrease in the order of the first inorganic encapsulation layer 521, the second inorganic encapsulation layer 522, and the third inorganic encapsulation layer 523.

[0315] Reference Figure 18 The gaps between the multiple openings in each inorganic encapsulation layer can decrease in the order of the first inorganic encapsulation layer 521, the second inorganic encapsulation layer 522, and the third inorganic encapsulation layer 523. In other words, the number of openings per unit area in each inorganic encapsulation layer increases in the order of the first inorganic encapsulation layer 521, the second inorganic encapsulation layer 522, and the third inorganic encapsulation layer 523.

[0316] Reference Figure 18 Organic materials can be inserted into each of the multiple openings. For example, during the manufacturing of encapsulation layer 200, organic materials used to form multiple organic encapsulation layers 510 can fill the empty spaces created when multiple openings are provided in multiple inorganic encapsulation layers 520.

[0317] For example, the first inorganic encapsulation layer 521 can be formed on the first organic encapsulation layer 511 using a vacuum deposition method (such as chemical vapor deposition (CVD) or atomic layer deposition (ALD)), but is not limited thereto. While depositing the first inorganic encapsulation layer 521, multiple openings included in the first inorganic encapsulation layer 521 can be patterned. The second organic encapsulation layer 512 can be formed on the first inorganic encapsulation layer 521 using methods such as inkjet coating, metal-organic chemical vapor deposition (MOCVD), etc., but this disclosure is not limited thereto. In this case, since the organic material forming the second organic encapsulation layer 512 is fluid, the organic material can be inserted into the multiple openings. Alternatively, the organic material forming the second organic encapsulation layer 512 can be formed and deposited in the multiple openings through a chemical reaction between supplied reactive gases.

[0318] Figure 19 This is a cross-sectional view showing a portion of the non-display area NDA of a display panel 110 according to an embodiment of the present disclosure.

[0319] Reference Figure 19 The display panel 110 according to the embodiments of the present disclosure may include a substrate 111, a transistor unit, a light-emitting element ED, a dam 340, an encapsulation layer 200 in which a plurality of inorganic encapsulation layers 520 and a plurality of organic encapsulation layers 510 are alternately arranged, and a dam portion DAM. However, the present disclosure is not limited thereto, and repeated descriptions of some of the above-described configurations are omitted.

[0320] The encapsulation layer 200 includes a first inorganic encapsulation layer to a third inorganic encapsulation layer 521, 522 and 523 and a first organic encapsulation layer to a fourth organic encapsulation layer 511, 512, 513 and 514, and each of the first inorganic encapsulation layer to the third inorganic encapsulation layer 521, 522 and 523 may include a plurality of openings.

[0321] Multiple openings can be set in the display area DA, and can be set to overlap with the embankment 340 in a portion of the non-display area NDA, but this disclosure is not limited thereto.

[0322] Multiple openings can be set in the display area DA, or in a portion of the non-display area NDA, and can be omitted from the area of ​​the outer inclined surface SLP2 of the encapsulation layer 200 located in the non-display area NDA.

[0323] The outer inclined surface SLP2 of the encapsulation layer 200 can appear in the non-display area NDA located on the side surface or edge of the display panel 110. Interlayer steps can occur at the point where components extending from the display area DA (such as the substrate 111, metal lines, planarization layer 330, and embankment 340) end. Therefore, the encapsulation layer 200 covering the steps may be susceptible to moisture introduced from the side surface of the display panel 110. Therefore, since multiple openings are not provided in the area where the outer inclined surface SLP2 of the encapsulation layer 200 is located, moisture penetration can be prevented.

[0324] In the display panel 110 according to an embodiment of the present disclosure, the dam portion DAM can be located further outward than the plurality of openings.

[0325] The dam portion DAM may include a first outer dam ODAM1 and a second outer dam ODAM2 disposed outside the plurality of organic encapsulation layers 510, and a first inner dam IDAM1 disposed inside the first outer dam ODAM1.

[0326] At least one of the plurality of organic encapsulation layers 510 may be disposed on the first inner dam IDAM1. For example, at least one of the first to fourth organic encapsulation layers 511, 512, 513 and 514 may be disposed on the first inner dam IDAM1 or may be disposed to cover the first inner dam IDAM1. As another example, at least one of the first to fourth organic encapsulation layers 511, 512, 513 and 514 may be disposed between the first inner dam IDAM1 and the first outer dam ODAM1, while covering the first inner dam IDAM1.

[0327] Reference Figure 19 The first pattern 1994 can be disposed on the gate insulating layer 1920, and the second pattern 1996 can be disposed on the second insulating layer 1940. The first pattern 1994 and the second pattern 1996 can be signal lines or various electrodes. The first pattern 1994 can include the same metal as the gate electrode 1930. The second pattern 1996 can include the same metal as the source / drain electrode 1950.

[0328] Reference Figure 19 The connection pattern CP can be set on the planarization layer 330. The base voltage line VSSL can be electrically connected to the common electrode CE through the connection pattern CP.

[0329] Reference Figure 19The first outer dam ODAM1 may include a first sub-dam 1971 and a first spacer 1981 in contact with the upper portion of the first sub-dam 1971, and the second outer dam ODAM2 may include a second sub-dam 1972 and a second spacer 1982 in contact with the upper portion of the second sub-dam 1972. The first sub-dam 1971 and the second sub-dam 1972 may include the same material as the first inner dam ODAM1, and the first spacer 1981 and the second spacer 1982 may include the same material as the dike 340, but this disclosure is not limited thereto.

[0330] The following is a brief description of the implementation of the above disclosure.

[0331] A display device according to embodiments of this disclosure may include: a substrate including a display area and a non-display area surrounding the display area; a light-emitting element disposed on the substrate; and an encapsulation layer disposed on the light-emitting element. The encapsulation layer may include a plurality of inorganic encapsulation layers and a plurality of organic encapsulation layers. Each of two or more of the plurality of inorganic encapsulation layers may have a plurality of openings.

[0332] According to the display device according to the embodiments of the present disclosure, a plurality of inorganic encapsulation layers and a plurality of organic encapsulation layers may be alternately arranged.

[0333] According to the display device according to the embodiments of the present disclosure, among the plurality of inorganic encapsulation layers, the thickness of the inorganic encapsulation layer further away from the substrate may be equal to or greater than the thickness of the inorganic encapsulation layer closer to the substrate.

[0334] According to the display device according to the embodiments of the present disclosure, a plurality of openings can be arranged in a plurality of rows, and a plurality of openings in two adjacent rows arranged in the plurality of rows can be arranged in a zigzag pattern.

[0335] According to an embodiment of the present disclosure, for one of two or more inorganic encapsulation layers: each of the plurality of openings may have a width in a first direction and a length in a second direction different from the first direction, wherein in each of the plurality of openings, the width in the first direction may be less than the length in the second direction, and the stretchability of the display device in the first direction may be equal to or greater than the stretchability of the display device in the second direction.

[0336] According to the display device according to the embodiments of the present disclosure, a plurality of openings can be arranged in a plurality of rows, the plurality of rows may include a first row and a second row that are adjacent to each other, the plurality of openings may include a plurality of first openings arranged in the first row and a plurality of second openings arranged in the second row, and the size of the first openings may be different from the size of the second openings.

[0337] According to the display device according to the embodiments of the present disclosure, each of the plurality of openings may include: a stem-shaped hole extending in a first direction; and a plurality of branch-shaped holes extending from the stem-shaped hole.

[0338] According to the display device according to the embodiments of the present disclosure, a plurality of inorganic encapsulation layers may include a lower inorganic encapsulation layer and an upper inorganic encapsulation layer, the upper inorganic encapsulation layer being positioned further away from the substrate than the lower inorganic encapsulation layer, the lower inorganic encapsulation layer may have a plurality of lower openings, the upper inorganic encapsulation layer may have a plurality of upper openings, and at least a portion of each of the plurality of lower openings may not overlap with at least a portion of each of the plurality of upper openings.

[0339] According to the display device according to the embodiments of the present disclosure, the size of each of the plurality of upper openings may be equal to or smaller than the size of each of the plurality of lower openings.

[0340] According to the display device according to the embodiments of the present disclosure, the number of unit areas of the plurality of upper openings included in the upper inorganic encapsulation layer may be equal to or greater than the number of unit areas of the plurality of lower openings included in the lower inorganic encapsulation layer.

[0341] According to the display device according to the embodiments of the present disclosure, each of the plurality of lower openings may have a length in a first direction and a width in a second direction different from the first direction, and each of the plurality of upper openings may have a width in the first direction and a length in a second direction different from the first direction.

[0342] According to the display device according to embodiments of the present disclosure, the plurality of inorganic encapsulation layers may further include an intermediate inorganic encapsulation layer located between the lower inorganic encapsulation layer and the upper inorganic encapsulation layer, the intermediate inorganic encapsulation layer may have a plurality of intermediate openings. At least a portion of each of the plurality of intermediate openings may not overlap with at least a portion of each of the plurality of upper openings and the plurality of lower openings.

[0343] According to the display device according to the embodiments of the present disclosure, each of the plurality of lower openings and the plurality of upper openings may have a first length in a first direction and a second length in a second direction different from the first direction, and each of the plurality of intermediate openings may have a stem-shaped hole extending in a direction corresponding to the shorter of the first length and the second length, and a plurality of branch-shaped holes extending from the stem-shaped hole.

[0344] According to the display device according to the embodiments of the present disclosure, each of the plurality of lower openings and the plurality of upper openings may have a third length in a first direction and a fourth length in a second direction different from the first direction, and each of the plurality of intermediate openings may have a stem-shaped hole extending in a direction corresponding to the longer of the third length and the fourth length, and a plurality of branch-shaped holes extending from the stem-shaped hole.

[0345] According to the display device according to the embodiments of the present disclosure, the dimensional relationship between the length of each of the plurality of lower openings in a first direction and the length in a second direction different from the first direction may be opposite to the dimensional relationship between the length of each of the plurality of upper openings in the first direction and the length in the second direction, and each of the plurality of intermediate openings may have a stem-shaped hole extending along the first direction and a plurality of branch-shaped holes extending from the stem-shaped hole.

[0346] According to the display device according to the embodiments of the present disclosure, the encapsulation layer may have an externally inclined surface, and a plurality of openings may be provided in the display area and may be provided in a portion of the non-display area, but may not be provided in an area in which the externally inclined surface may be positioned in the non-display area.

[0347] The display device according to embodiments of this disclosure may also include a dam portion disposed further outward than the plurality of openings.

[0348] According to the display device according to the embodiments of the present disclosure, organic material can be inserted into each of the plurality of openings.

[0349] According to the display device according to the embodiments of the present disclosure, at least one of the plurality of openings can be deformed by an external force applied to the substrate.

[0350] The above description is presented to enable any person skilled in the art to make and use the technical concepts of this disclosure, and is provided in the context of a particular application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this disclosure. The above description and accompanying drawings are provided as examples of the technical concepts of this disclosure for illustrative purposes only. That is, the disclosed embodiments are intended to illustrate the scope of the technical concepts of this disclosure.

Claims

1. A display device, comprising: A substrate, the substrate including a display area and a non-display area surrounding the display area; A light-emitting element, wherein the light-emitting element is disposed on the substrate; as well as An encapsulation layer is disposed on the light-emitting element; The encapsulation layer includes multiple inorganic encapsulation layers and multiple organic encapsulation layers, and Each of two or more of the plurality of inorganic encapsulation layers has a plurality of openings.

2. The display device according to claim 1, wherein, The plurality of inorganic encapsulation layers and the plurality of organic encapsulation layers are alternately arranged.

3. The display device according to claim 1, wherein, Among the plurality of inorganic encapsulation layers, the thickness of the inorganic encapsulation layer further away from the substrate is equal to or greater than the thickness of the inorganic encapsulation layer closer to the substrate.

4. The display device according to claim 1, wherein, The plurality of openings are arranged in multiple rows, and In this arrangement, multiple openings in two adjacent rows of the plurality of rows are arranged in a zigzag pattern.

5. The display device according to claim 1, wherein, For one of the two or more inorganic encapsulation layers: Each of the plurality of openings has a width in a first direction and a length in a second direction different from the first direction. In each of the plurality of openings, the width in the first direction is smaller than the length in the second direction, and Wherein, the stretchability of the display device in the first direction is equal to or greater than the stretchability of the display device in the second direction.

6. The display device according to claim 1, wherein, The multiple openings are arranged in multiple rows. The plurality of rows includes a first row and a second row that are adjacent to each other. The plurality of openings includes a plurality of first openings arranged in the first row and a plurality of second openings arranged in the second row. The size of each of at least one of the plurality of first openings is different from the size of one of the plurality of second openings.

7. The display device according to claim 1, wherein, Each of the plurality of openings includes: Stem-shaped pores extending along the first direction; and Multiple branch-shaped holes extend from the stem-shaped hole.

8. The display device according to claim 1, wherein, The plurality of inorganic encapsulation layers include a lower inorganic encapsulation layer and an upper inorganic encapsulation layer, wherein the upper inorganic encapsulation layer is positioned further away from the substrate than the lower inorganic encapsulation layer. The lower inorganic encapsulation layer has multiple lower openings. The upper inorganic encapsulation layer has multiple upper openings, and Wherein, at least a portion of the region of each of the plurality of lower openings does not overlap with at least a portion of the region of one of the plurality of upper openings.

9. The display device according to claim 8, wherein, The size of each of the plurality of upper openings is equal to or smaller than the size of each of the plurality of lower openings.

10. The display device according to claim 8, wherein, The number of unit areas of the plurality of upper openings included in the upper inorganic encapsulation layer is equal to or greater than the number of unit areas of the plurality of lower openings included in the lower inorganic encapsulation layer.

11. The display device according to claim 8, wherein, Each of the plurality of lower openings has a length in a first direction and a width in a second direction different from the first direction, and each of the plurality of upper openings has a width in the first direction and a length in the second direction different from the first direction.

12. The display device according to claim 8, wherein, The plurality of inorganic encapsulation layers also includes an intermediate inorganic encapsulation layer located between the lower inorganic encapsulation layer and the upper inorganic encapsulation layer. The intermediate inorganic encapsulation layer has multiple intermediate openings, and Wherein, at least a portion of each of the plurality of intermediate openings does not overlap with at least a portion of one of the plurality of upper openings and at least a portion of one of the plurality of lower openings.

13. The display device according to claim 12, wherein, Each of the plurality of lower openings and the plurality of upper openings has a first length in a first direction and a second length in a second direction different from the first direction. Each of the plurality of intermediate openings has a stem-shaped opening extending in a direction corresponding to the shorter of the first length and the second length, and a plurality of branch-shaped openings extending from the stem-shaped opening.

14. The display device according to claim 12, wherein, Each of the plurality of lower openings and the plurality of upper openings has a third length in a first direction and a fourth length in a second direction different from the first direction. Each of the plurality of intermediate openings has a stem-shaped opening extending in a direction corresponding to the longer of the third length and the fourth length, and a plurality of branch-shaped openings extending from the stem-shaped opening.

15. The display device according to claim 12, wherein, The dimensional relationship between the length of each of the plurality of lower openings in the first direction and its length in the second direction (different from the first direction) is the opposite of the dimensional relationship between the length of each of the plurality of upper openings in the first direction and its length in the second direction. Each of the plurality of intermediate openings has a stem-shaped hole extending along the first direction and a plurality of branch-shaped holes extending from the stem-shaped hole.

16. The display device according to claim 1, wherein, The encapsulation layer also has an externally inclined surface, and The plurality of openings are provided in the display area, and in a portion of the non-display area, but not in the area where the external inclined surface is located in the non-display area.

17. The display device according to claim 1, further comprising a dam portion disposed further outward than the plurality of openings.

18. The display device according to claim 1, wherein, Organic material was inserted into each of the plurality of openings.

19. The display device according to claim 1, wherein, At least one of the plurality of openings is deformed by an external force applied to the substrate.

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