Substrate processing system, interface device, and substrate processing method

Abstract

The invention relates to a substrate processing system, an interface apparatus, and a substrate processing method. Provided is a technique capable of narrowing the pitch of a plurality of substrates processed in batches and suppressing interference between the substrates and a transfer robot. The substrate processing system includes: a batch processing unit that processes batches including a plurality of substrates at a first pitch in batches; a single-chip processing unit that processes the batches of substrates one by one; and an interface unit for transferring the substrate between the batch processing unit and the single-sheet processing unit, the batch processing unit including: a processing tank for storing a block-shaped or vaporous processing liquid; a first holder that holds the substrate at a first pitch; and a second holder that receives substrates arranged at a second pitch, which is N (N is a natural number of 2 or more) times the first pitch, from the first holder in the processing liquid, and the interface unit includes a transport unit that transports the substrates held separately in the processing liquid by the first holder and the second holder from the batch processing unit to the single sheet processing unit.

Description

[0001] This application is a divisional application of the invention patent application with application number 202011054695.3, application date September 30, 2020, and invention title "Substrate Processing System and Substrate Processing Method". Technical Field

[0002] This disclosure relates to a substrate processing system and a substrate processing method. Background Technology

[0003] The drying apparatus described in Patent Document 1 includes a buffer tank, a transfer unit, and a rotary drying unit. The buffer tank holds the washed semiconductor wafers in water. The semiconductor wafers are washed while multiple wafers are placed on a holding platform, and are held in the water of the buffer tank while still on the holding platform. The transfer unit removes the semiconductor wafers one by one from the buffer tank and transfers them. The rotary drying unit supports a semiconductor wafer transferred from the transfer unit, ensuring its main surface is horizontal, and rotates it at high speed to remove water.

[0004] Patent Document 1: Japanese Patent Application Publication No. 9-162157 Summary of the Invention

[0005] The problem the invention aims to solve

[0006] One technical solution disclosed herein provides a technique that enables narrowing the spacing between multiple substrates processed in batches and suppressing interference between the substrates and the transport robot.

[0007] Solution for solving the problem

[0008] The substrate processing system of the present disclosure has the following features:

[0009] The batch processing unit processes batches of substrates containing multiple substrates at a first pitch.

[0010] A single-wafer processing unit processes the substrates in the batch one by one; and

[0011] An interface section is used to connect the substrate between the batch processing section and the single-chip processing section.

[0012] The batch processing unit includes: a processing tank for storing a blocky or mist-like processing liquid; a first holding device for holding the substrates at the first spacing; and a second holding device for receiving, in the processing liquid, the substrates arranged at a second spacing, which is N times the first spacing (N being a natural number greater than 2).

[0013] The interface section includes a conveying section that conveys the substrate, which is separately held in the first holding device and the second holding device in the processing liquid, from the batch processing section to the single-piece processing section.

[0014] The effects of the invention

[0015] According to a technical solution disclosed herein, the spacing between multiple substrates processed in batches can be narrowed and interference between the substrates and the transport robot can be suppressed. Attached Figure Description

[0016] Figure 1 This is a top view showing a substrate processing system according to one embodiment.

[0017] Figure 2 This is a flowchart illustrating a substrate processing method according to one embodiment.

[0018] Figure 3 It means Figure 1 A top view of an example of a batch forming section.

[0019] Figure 4A It means Figure 3 A side view of an example of the operation of the batch forming section.

[0020] Figure 4B This indicates that the batch formation department continues Figure 4A A side view of an example of the subsequent action.

[0021] Figure 4C This indicates that the batch formation department continues Figure 4B A side view of an example of the subsequent action.

[0022] Figure 5 It means Figure 1 A top view of an example of a batch release section.

[0023] Figure 6A It means Figure 5 A cross-sectional view of an example of the operation of the batch release unit.

[0024] Figure 6B This indicates that the batch release of the department continues. Figure 6A A cross-sectional view of an example of the subsequent action.

[0025] Figure 6C This indicates that the batch release of the department continues. Figure 6B A cross-sectional view of an example of the subsequent action.

[0026] Figure 7 It means Figure 1 A side view of an example of the conveyor section of the interface section.

[0027] Figure 8This is a side view of another example of a conveyor section.

[0028] Figure 9 It means Figure 1 A perspective view of an example of a drying apparatus.

[0029] Figure 10 This is a top view showing the substrate processing system of the first modified example.

[0030] Figure 11 This is a top view showing the substrate processing system of the second modified example. Detailed Implementation

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Sometimes, the same or corresponding structures are labeled with the same reference numerals in the various drawings, and descriptions are omitted.

[0032] like Figure 1 As shown, the substrate processing system 1 includes an infeed / outfeed unit 2, a single-wafer processing unit 3, an interface unit 5, a batch processing unit 6, and a control unit 9. The infeed / outfeed unit 2 has a mounting stage 21 for a housing C. The housing C holds multiple (e.g., 25) substrates W and feeds them in and out relative to the infeed / outfeed unit 2. Inside the housing C, the substrates W are held horizontally and vertically at a second distance P2 (P2 = N × P1) that is N times the first distance P1. N is a natural number greater than 2; in this embodiment, it is 2, but it can also be 3 or greater. The single-wafer processing unit 3 processes the substrates W one by one. The interface unit 5 transfers the substrates W between the single-wafer processing unit 3 and the batch processing unit 6. The batch processing unit 6 processes batches L containing multiple (e.g., 50) substrates W at the first distance P1. A batch L, for example, includes N housings C of substrates W.

[0033] The infeed / outfeed unit 2, the single-wafer processing unit 3, the interface unit 5, and the batch processing unit 6 are arranged in this order from the negative side of the X-axis direction to the positive side of the X-axis direction. The substrate W is fed from the infeed / outfeed unit 2... Figure 1 The substrate is conveyed in the order indicated by arrows A1, A2, A3, A4, and A5, and then returns to the feed-in / feed-out section 2. The feed-in / feed-out section 2 serves as both a feed-in section and a feed-out section, thus enabling the miniaturization of the substrate processing system 1.

[0034] The feed / discharge unit 2 has a mounting platform 21, which has multiple mounting plates 22. Multiple boxes C are mounted on the mounting plates 22. The number of mounting plates 22 is not particularly limited. Similarly, the number of boxes C is not particularly limited.

[0035] The feed-in / feed-out section 2 has a first conveying area 23, which is adjacent to the mounting stage 21 and positioned on the X-axis side of the mounting stage 21. A first conveying device 24 is provided in the first conveying area 23. The first conveying device 24 has a first conveying arm that moves in the horizontal direction (X-axis and Y-axis directions) and the vertical direction, and rotates about the vertical axis. The first conveying arm conveys substrates W between the housing C and the junction 25 (described later). The number of first conveying arms can be one or more; in the latter case, the first conveying device 24 conveys multiple substrates W in batches (e.g., 5 substrates).

[0036] The feed-in / feed-out section 2 has a transfer section 25, which is adjacent to the first transport area 23 and disposed on the positive side of the first transport area 23 in the X-axis direction. The transfer section 25 has a first conveying device 26 for temporarily storing the substrate W. There can be multiple first conveying devices 26, and multiple first conveying devices 26 can also be stacked in the vertical direction. The first conveying device 26 receives the substrate W from the first transport device 24 and temporarily stores the substrate W until it is transferred to the second transport device 32 described later. In addition, the first conveying device 26 receives the substrate W from the second transport device 32 and temporarily stores the substrate W until it is transferred to the first transport device 24.

[0037] The single-wafer processing unit 3 has a second transport region 31, which is adjacent to the junction 25 and positioned on the positive side of the junction 25 in the X-axis direction. A second transport device 32 is provided in the second transport region 31. The second transport device 32 has a second transport arm that moves in the horizontal direction (X-axis and Y-axis directions) and the vertical direction, and rotates about the vertical axis. The second transport arm transports substrates between devices adjacent to the second transport region 31. The number of second transport arms can be one or more; in the latter case, the second transport device 32 transports multiple substrates (e.g., 5) W in batches.

[0038] The single-piece processing unit 3 includes, for example, a second conveying device 33, a liquid processing device 34, and a drying device 35 adjacent to the second conveying area 31. The second conveying device 33 is adjacent to the second conveying area 31 and is positioned on the positive side of the second conveying area 31 in the X-axis direction. The second conveying device 33 receives the substrate W from the second conveying device 32 and temporarily stores the substrate W until it is handed over to the interface unit 5. The liquid processing device 34 is a single-piece type, processing the substrate W one by one using a processing liquid. The processing liquid can also be multiple, such as pure water like DIW, and a drying liquid with a lower surface tension than pure water is preferred. The drying liquid is preferably alcohol such as IPA (isopropanol). The drying device 35 is a single-piece type, drying the substrate W one by one using a supercritical fluid. Alternatively, both the liquid processing device 34 and the drying device 35 may not be single-piece types; the liquid processing device 34 may be a single-piece type while the drying device 35 is a batch type. The drying device 35 may batch dry multiple substrates W using a supercritical fluid. The number of substrates W processed in batches using the drying device 35 can be more than the number of substrates W processed in batches using the batch processing unit 6, but it can also be less than that number.

[0039] Furthermore, the configuration and number of the liquid treatment device 34 and the drying device 35 are not limited to Figure 1 In some cases, the liquid treatment device 34 may be arranged on both sides of the second conveying area 31 in the Y-axis direction. Furthermore, the liquid treatment device 34 may also be stacked in the Z-axis direction. The arrangement of the drying device 35 is the same as that of the liquid treatment device 34. In addition, devices other than the liquid treatment device 34 and the drying device 35 may also be arranged next to the second conveying area 31.

[0040] The interface section 5 includes, for example, a batch forming section 51 and a conveying section 52. The batch forming section 51 holds multiple substrates W at a first pitch P1 to form a batch L. The conveying section 52 conveys the substrates W from the single-piece processing section 3 to the batch forming section 51, and also conveys the substrates W from the batch processing section 6 to the single-piece processing section 3.

[0041] like Figure 7 As shown, the conveying unit 52 includes a first conveying robot 53 and a second conveying robot 54. The first conveying robot 53 conveys the substrate W from the monolithic processing unit 3 to the batch forming unit 51. The second conveying robot 54 conveys the substrate W from the batch processing unit 6 to the monolithic processing unit 3. Additionally, as... Figure 8 As shown, the conveying unit 52 may also include a conveying robot 41 that serves as both the first conveying robot 53 and the second conveying robot 54.

[0042] Since the first conveyor robot 53 and the second conveyor robot 54 are set up independently, the process A1 of the substrate W moving from the single-piece processing unit 3 to the batch processing unit 6 and the process A3 of the substrate W moving from the batch processing unit 6 to the single-piece processing unit 3 can be controlled separately. Therefore, it is possible to prevent the substrate W from stalling at the interface unit 5, thereby improving productivity.

[0043] The batch processing unit 6 has a third conveying area 61, which is adjacent to the interface unit 5 and positioned on the positive side of the interface unit 5 in the X-axis direction. A third conveying device 62 is provided in the third conveying area 61. The third conveying device 62 has a third conveying arm, which moves in the horizontal direction (X-axis and Y-axis directions) and the vertical direction, and rotates about the vertical axis. Alternatively, the third conveying arm may not rotate about the vertical axis. The third conveying arm conveys substrates W between devices adjacent to the third conveying area 61. The third conveying arm conveys batches L in batches.

[0044] The third transport area 61 is rectangular when viewed from above, with its length along the X-axis. A batch forming section 51 is positioned next to the short side of the third transport area 61, and a processing tank (e.g., a third rinsing fluid tank 68) is positioned next to the long side of the third transport area 61. A transport section 52 is positioned next to both the batch forming section 51 and the processing tank. The transport section 52 provides easy access to both the batch forming section 51 and the processing tank; therefore, as the first transport robot 53 and the second transport robot 54, transport robots with a narrow range of motion at the tip of their arms can be used.

[0045] However, since the batch forming section 51 is located next to the short side of the third transport area 61, and the processing tank is located next to the long side of the third transport area 61, the arrangement direction of the substrates W is different in the batch forming section 51 and the processing tank. Therefore, the third transport device 62 rotates about the vertical axis. By rotating the third transport device 62, the arrangement direction of the substrates W can be changed between the X-axis direction and the Y-axis direction. Alternatively, the third transport device 62 can be operated without rotating about the vertical axis when it is not necessary to change the arrangement direction of the substrates.

[0046] The batch processing unit 6 includes, for example, a first chemical solution tank 63, a first rinsing liquid tank 64, a second chemical solution tank 65, a second rinsing liquid tank 66, a third chemical solution tank 67, and a third rinsing liquid tank 68 adjacent to the third conveying area 61. These processing tanks are arranged along the long side of the third conveying area 61. Specifically, the first chemical solution tank 63, the first rinsing liquid tank 64, the second chemical solution tank 65, the second rinsing liquid tank 66, the third chemical solution tank 67, and the third rinsing liquid tank 68 are arranged in this order from the positive side of the X-axis direction to the negative side of the X-axis direction.

[0047] Furthermore, the number of processing tanks arranged next to the third conveying area 61 is not limited to... Figure 1 The quantity. For example, the second chemical solution tank 65 and the second rinsing solution tank 66 in Figure 1 There can be one group, but there can also be multiple groups.

[0048] The first chemical solution tank 63 stores the first chemical solution used for impregnating batch L. The first chemical solution is not particularly limited, but may be, for example, DHF (dilute hydrofluoric acid). DHF is used to remove the natural oxide film. BHF (a mixture of hydrofluoric acid and ammonium fluoride) may also be used instead of DHF. The first rinsing solution tank 64 stores the first rinsing solution used for impregnating batch L. The first rinsing solution is pure water, such as DIW (deionized water), used to remove the first chemical solution from the substrate W.

[0049] The batch processing unit 6 has a first processing device 71 that receives and holds batch L from the third conveying device 62. The first processing device 71 holds multiple substrates W at a first spacing P1 in the Y-axis direction and holds each of the multiple substrates W vertically. In addition, the batch processing unit 6 has a first driving device 72 that moves the first processing device 71 in the X-axis and Z-axis directions. The first processing device 71 holds batch L in a first chemical solution, then holds batch L in a first rinsing solution, and then transfers batch L to the third conveying device 62.

[0050] Furthermore, the number of units of the first processing device 71 and the first driving device 72 is one in this embodiment, but it can also be multiple. In the latter case, one unit immerses batch L in the first chemical solution, and another unit immerses batch L in the first rinsing solution. In this case, the first driving device 72 only needs to move the first processing device 71 in the Z-axis direction, or it may not need to move the first processing device 71 in the X-axis direction.

[0051] The second chemical solution tank 65 stores a second chemical solution for impregnating batch L. The second chemical solution is not particularly limited, and may be, for example, an aqueous phosphoric acid solution. The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film from the silicon oxide film and the silicon nitride film. The second rinsing solution tank 66 stores a second rinsing solution for impregnating batch L. The second rinsing solution is pure water, such as DIW (deionized water), used to remove the second chemical solution from the substrate W.

[0052] The batch processing unit 6 has a second processing device 73 that receives and holds batch L from the third conveying device 62. Similar to the first processing device 71, the second processing device 73 holds multiple substrates W at a first spacing P1 in the Y-axis direction and holds each substrate W vertically. Furthermore, the batch processing unit 6 has a second drive device 74 that moves the second processing device 73 in the Z-axis direction. The second processing device 73 holds batch L in a second chemical solution, after which it transfers batch L to the third conveying device 62.

[0053] Similarly, the batch processing unit 6 has a third processing device 75 that receives and holds batch L from the third conveying device 62. Like the first processing device 71, the third processing device 75 holds multiple substrates W at a first spacing P1 in the Y-axis direction and holds each substrate W vertically. Furthermore, the batch processing unit 6 has a third driving device 76 that moves the third processing device 75 in the Z-axis direction. The third processing device 75 holds batch L in the second rinsing solution, and then transfers batch L to the third conveying device 62.

[0054] The third chemical solution tank 67 stores the third chemical solution used for impregnating batch L. The third chemical solution is not particularly limited, but may be, for example, SC1 (a mixture of ammonia, hydrogen peroxide, and water). SC1 is used to remove organic matter and particulate matter. The third rinsing solution tank 68 stores the third rinsing solution used for impregnating batch L. The third rinsing solution is pure water used to remove the third chemical solution from the substrate W, such as DIW (deionized water).

[0055] The batch processing unit 6 has a first holding device 811 that receives and holds batch L from the third conveying device 62. The first holding device 811 holds multiple substrates W at a first spacing P1 in the Y-axis direction and holds each of the multiple substrates W vertically. In addition, the batch processing unit 6 has a drive device 818 that moves the first holding device 811 in the X-axis and Z-axis directions. The first holding device 811 holds batch L in a third chemical solution, and then holds batch L in a third rinsing solution.

[0056] Furthermore, the number of units for the first holding device 811 and the drive device 818 is one in this embodiment, but it can also be multiple. In the latter case, one unit immerses batch L in the third chemical solution, and another unit immerses batch L in the third rinsing solution. In this case, the drive device 818 only needs to move the first holding device 811 in the Z-axis direction, or it may not need to move the first holding device 811 in the X-axis direction.

[0057] Furthermore, the batch processing unit 6 has a second holding device 814, which receives multiple substrates W arranged at a second pitch P2 (P2 = N × P1) from the first holding device 811 in a third processing liquid. The first holding device 811, the second holding device 814, and the drive device 818 form a batch release unit 81.

[0058] Furthermore, the types of chemical solutions used in the batch processing section 6 are not limited to dilute hydrofluoric acid, BFH, phosphoric acid aqueous solution, and SC1. For example, they can also be dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), electroplating solutions, etc. The chemical solution can also be for stripping or electroplating. In addition, the number of chemical solutions is not particularly limited, and can be one.

[0059] The control unit 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the board processing system 1. The control unit 9 controls the operation of the board processing system 1 by causing the CPU 91 to execute the programs stored in the storage medium 92. Furthermore, the control unit 9 includes an input interface 93 and an output interface 94. The control unit 9 receives signals from the outside via the input interface 93 and sends signals to the outside via the output interface 94.

[0060] The aforementioned program is stored on, for example, a computer-readable storage medium, and installed from that storage medium onto the storage medium 92 of the control unit 9. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards. Alternatively, the program can be downloaded from a server via the Internet and installed onto the storage medium 92 of the control unit 9.

[0061] Next, refer to Figure 2 The operation of the substrate processing system 1 described above, namely the substrate processing method, will be explained. Figure 2 The process shown is performed under the control of the control unit 9.

[0062] First, the box C, containing multiple substrates W, is fed into the feed / discharge section 2 and placed on the mounting plate 22. Inside the box C, the substrates W are held horizontally and vertically at a second spacing P2 (P2 = N × P1). N is a natural number of 2 or more; in this embodiment, it is 2, but it can also be 3 or more.

[0063] Next, the first conveying device 24 removes the substrate W from box C. Figure 2The substrate W is then transported from the first conveying device 26 (S101) to the second conveying device 33. Next, the second conveying device 32 receives the substrate W from the first conveying device 26 and transports it to the second conveying device 33. Afterwards, the first conveying robot 53 receives the substrate W from the second conveying device 33 and transports it to the batch forming unit 51.

[0064] Next, the batch forming unit 51 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a batch L ( Figure 2 (S102). A batch L, for example, includes N substrates W with boxes C. The spacing between substrates W narrows from the second spacing P2 to the first spacing P1, thereby increasing the number of substrates W that can be processed in batches.

[0065] Next, the third conveying device 62 receives batch L from the batch forming unit 51 and conveys it to the first processing unit 71. During this process, the third conveying device 62 rotates about the vertical axis, changing the arrangement direction of the multiple substrates W from the X-axis direction to the Y-axis direction.

[0066] Next, the first processing device 71 descends from above the first chemical solution tank 63, immersing batch L in the first chemical solution to perform the first chemical solution treatment. Figure 2 (S103). Then, the first processing device 71 rises to pull up batch L from the first chemical solution, and then moves along the X-axis direction above the first rinsing liquid tank 64.

[0067] Next, the first processing device 71 descends from above the first rinsing liquid tank 64, immersing batch L in the first rinsing liquid to perform the first rinsing liquid treatment. Figure 2 (S104). Then, the first processing device 71 rises to pull up batch L from the first rinsing liquid. Next, the third conveying device 62 receives batch L from the first processing device 71 and conveys it to the second processing device 73.

[0068] Next, the second processing device 73 descends from above the second chemical solution tank 65, immersing batch L in the second chemical solution to perform the second chemical solution treatment. Figure 2 (S105). Then, the second processing device 73 rises to pull up batch L from the second chemical solution. Next, the third conveying device 62 receives batch L from the second processing device 73 and conveys it to the third processing device 75.

[0069] Next, the third processing device 75 descends from above the second rinsing liquid tank 66, immersing batch L in the second rinsing liquid to perform the second rinsing liquid treatment. Figure 2 (S106). Then, the third processing device 75 rises to pull up batch L from the second flushing fluid. Next, the third conveying device 62 receives batch L from the third processing device 75 and conveys it to the first holding device 811.

[0070] Next, the first holding device 811 descends from above the third chemical solution tank 67, immersing batch L in the third chemical solution for third chemical solution treatment. Figure 2 (S107). Then, the first holding device 811 rises to pull up batch L from the third chemical solution, and then moves along the X-axis direction above the third rinsing liquid tank 68.

[0071] Next, the first holding device 811 is lowered from above the third rinsing solution tank 68, immersing batch L in the third rinsing solution to perform the third rinsing solution treatment. Figure 2 (S108).

[0072] Furthermore, during its descent, the first holding device 811 transfers a portion of the batch L to the second holding device 814, thereby widening the spacing of the substrates W from the first spacing P1 to the second spacing P2. Figure 2 (S109). The second holding device 814 holds multiple substrates W at a second spacing P2, and the first holding device 811 also holds multiple substrates W at a second spacing P2. In addition, the first holding device 811 holds substrates W that are transferred to the second holding device 814 and substrates W that are not transferred to the second holding device 814 and continue to be held in an alternating manner. That is, substrates W that are part of batch L and substrates W that are the remaining part of batch L are arranged alternately to form batch L.

[0073] Next, the second transport robot 54 transports the substrates W, which are held separately in the first holding device 811 and the second holding device 814 in the third rinsing liquid, to the single-wafer processing unit 3. Because the spacing between the substrates W is wider, interference between the substrates W and the second transport robot 54 can be prevented. Furthermore, the spacing between the substrates W during batch L formation can be narrowed, thereby increasing the number of substrates W processed in batches. The second transport robot 54 transports the substrates W one by one to the liquid treatment apparatus 34 of the single-wafer processing unit 3.

[0074] Next, the liquid processing apparatus 34 processes the substrate W one by one using liquid. Figure 2 (S110). The liquid can be multiple, such as pure water (DIW), or a drying liquid with a lower surface tension than pure water. Alcohol, such as IPA (isopropanol), is preferred as the drying liquid. The liquid treatment apparatus 34 supplies pure water and drying liquid to the upper surface of the substrate W in this order, forming a liquid film of drying liquid.

[0075] Next, the second conveying device 32 receives the substrate W from the liquid treatment device 34 and holds the substrate W horizontally with the liquid film of the drying liquid facing upwards. The second conveying device 32 conveys the substrate W from the liquid treatment device 34 to the drying device 35.

[0076] Next, the drying apparatus 35 uses supercritical fluid to dry the substrates W one by one. Figure 2 (S111). It is possible to replace the drying liquid with supercritical fluid, thereby suppressing the collapse of the uneven pattern of the substrate W caused by the surface tension of the drying liquid. Since supercritical fluid requires a pressure vessel, in order to miniaturize the pressure vessel, it is processed on a single sheet instead of in batch processing.

[0077] like Figure 9 As shown, the drying apparatus 35 includes a pressure vessel 351, a movable tray 353, and a supply port 356. The pressure vessel 351 has an inlet / outlet 352 for feeding and discharging a substrate W. The movable tray 353 has a cover 354 for opening and closing the inlet / outlet 352 and a holding portion 355 for horizontally holding the substrate W. With the cover 354 closed, the holding portion 355 horizontally holds the substrate W inside the pressure vessel 351. An embossed pattern is pre-formed on the upper surface of the substrate W, and a film of drying liquid covers the embossed pattern. The supply port 356 supplies a supercritical fluid, such as carbon dioxide, into the pressure vessel 351. Furthermore, the number and position of the supply ports 356 are not limited to... Figure 9 The quantity and location are shown. The single-piece drying device 35 uses supercritical fluid to dry the substrate W on a piece-by-piece basis, forming a liquid film.

[0078] Furthermore, the drying apparatus 35 is a single-piece type in this embodiment, but as described above, it can also be a batch type. The batch drying apparatus 35 uses supercritical fluid to dry multiple substrates W on which liquid films are formed in batches. The single-piece drying apparatus 35 has one holding part 355, while the batch drying apparatus 35 has multiple holding parts 355.

[0079] Furthermore, the drying apparatus 35 of this embodiment utilizes supercritical fluid to dry the substrate W, but the drying method is not particularly limited. The drying method can be any method that can suppress the collapse of the uneven pattern on the substrate W; for example, it can be rotary drying, scanning drying, or hydrophobic drying. In rotary drying, the substrate W is rotated, and centrifugal force is used to throw the liquid film off the substrate W. In scanning drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the outer periphery of the substrate W, and centrifugal force is used to throw the liquid film off the substrate W. Scanning drying can also move the supply position of a drying gas, such as N2 gas, from the center of the substrate W toward the outer periphery of the substrate W in a manner that follows the supply position of the drying liquid.

[0080] Then, the second conveying device 32 receives the substrate W from the drying device 35 and conveys it to the first conveying device 26.

[0081] Next, the first conveying device 24 receives the substrate W from the first conveying device 26 and stores it in the box C. Figure 2 (S112). The box C is fed out from the feed-out section 2 while containing multiple substrates W.

[0082] Next, refer to Figure 3 , Figure 4A , Figure 4B and Figure 4C The batch forming section 51 will be described. Furthermore, based on the space occupied in the accompanying drawings, the number of substrates W is shown as less than the actual number. The number of first holding grooves 513, the number of second holding grooves 516, and the number of through grooves 517 are the same.

[0083] The batch forming section 51 has a first holding device 511, such as Figure 4C As shown, the first retaining device 511 holds multiple pieces (e.g., 50 pieces, in...) Figure 4C The illustrated diagram shows 12 out of 50 substrates (W) held at a first spacing P1 along the X-axis to form batch L. (See diagram for reference.) Figure 3 As shown, the first holding device 511 has multiple first arms 512. The number of first arms 512 is not limited to the number shown in the figure.

[0084] Multiple first arms 512 extend along the X-axis and have first retaining grooves 513 arranged at a first spacing P1 in the X-axis direction. The outer periphery of the substrate W is inserted into the first retaining groove 513, thereby holding the outer periphery of the substrate W in the first retaining groove 513. The multiple first arms 512 hold the respective outer peripheries of multiple substrates W at circumferential intervals.

[0085] In addition, the batch forming section 51 has a second holding device 514, such as Figure 4B As shown, the second retaining device 514 holds multiple pieces (e.g., 25 pieces, in...) Figure 4B (Only 6 out of the 25 substrates shown in the diagram) are held at a second spacing P2 in the X-axis direction. Figure 3 As shown, the second holding device 514 has multiple second arms 515. The number of second arms 515 is not limited to the number shown in the figure.

[0086] Multiple second arms 515 extend along the X-axis and have second retaining grooves 516 arranged at a second spacing P2 in the X-axis direction. The outer periphery of the substrate W is inserted into the second retaining grooves 516, thereby holding the outer periphery of the substrate W in the second retaining grooves 516. The multiple second arms 515 hold the respective outer peripheries of multiple substrates W at circumferential intervals.

[0087] Furthermore, the multiple second arms 515 also have through grooves 517 arranged at a second spacing P2 in the X-axis direction. The outer periphery of the substrate W is also inserted into the through grooves 517, but the through grooves 517 do not hold the outer periphery of the substrate W, allowing the substrate W to pass through. The through grooves 517 and the second holding grooves 516 are arranged alternately in the X-axis direction. The through grooves 517 and the second holding grooves 516 are arranged at the same X-axis position as any of the multiple first holding grooves 513.

[0088] Furthermore, the batch forming section 51 includes a drive device 518, which raises and lowers the first holding device 511 relative to the second holding device 514. This positions the first holding device 511 in a retracted position below the second holding device 514 (see reference). Figure 4B ) and the batch formation position above the second holding device 514 (refer to Figure 4C It rises and falls between ).

[0089] Next, refer to it again. Figure 4A , Figure 4B and Figure 4C The operation of the batch forming unit 51 will be explained.

[0090] First, such as Figure 4A As shown, the first holding device 511 stops at a receiving position lower than the second holding device 514. The receiving position can be set between the retraction position and the batch forming position, or it can be set above the second holding device 514. The first conveying robot 53 transports multiple substrates W (e.g., 5 substrates) at a time. Figure 4A (Only 2 out of the 5 pieces shown in the illustration) are inserted into the through slot 517 of the second retainer 514, and transferred to the first retainer 511. This action is repeated multiple times, causing the first retainer 511 to hold multiple pieces (e.g., 25 pieces, in...) Figure 4A (Only 6 out of 25 substrates shown in the figure) are held at the second spacing P2. Alternatively, the first transport robot 53 can also insert the substrates W one by one into the through slot 517 of the second holding device 514 and transfer them to the first holding device 511.

[0091] Next, as Figure 4B As shown, to prevent direct interference between the substrate W and the first conveying arm 531 of the first conveying robot 53, the first holding device 511 descends from the receiving position to the retracting position. Then, the first conveying robot 53 transports the substrate W in multiple layers (e.g., 5 layers, in...) Figure 4B Only 2 out of the 5 pieces shown in the diagram are inserted into the second retaining slot 516 of the second retaining device 514, and are transferred to the second retaining device 514. This action is repeated multiple times, so that the second retaining device 514 holds multiple pieces (e.g., 25 pieces, in...) Figure 4A(Only 6 out of 25 substrates shown in the figure) are held at the second spacing P2. Alternatively, the first transport robot 53 can also insert the substrates W one by one into the second holding slot 516 of the second holding device 514 and transfer them to the second holding device 514.

[0092] Next, as Figure 4C As shown, the first holding device 511 rises from the retracted position to the batch forming position. During this process, the first holding device 511 receives the substrate W from the second holding device 514 using the empty first holding slot 513, and combines it with the substrate W that was originally held, thereby forming a batch L.

[0093] A batch L may include, for example, N substrates W of boxes C. A batch L may include a substrate W of one box C, or it may include substrates W of three or more boxes C. A batch L may include multiple substrates W with a first spacing P1.

[0094] The batch forming unit 51 may also have a third holding device (not shown). Similar to the second holding device 514, the third holding device holds multiple substrates W at a second pitch P2 and transfers the held substrates W to the first holding device 511. The first holding device 511 receives substrates W not only from the second holding device 514 but also from the third holding device. Therefore, the ratio N of the first pitch P1 to the second pitch P2 can be increased, thereby increasing the number of substrates W processed in batches.

[0095] Next, refer to Figure 5 , Figure 6A , Figure 6B and Figure 6C The batch release section 81 will be explained. Furthermore, based on the space occupied in the accompanying drawings, the number of substrates W is shown as less than the actual number. The same applies to the number of the first holding grooves 813, the second holding grooves 816, and the through grooves 817.

[0096] Batch release section 81 has a first holding device 811, such as Figure 6A As shown, the first retaining device 811 holds multiple pieces (e.g., 50 pieces, in...) Figure 6A (Only 12 out of 50 substrates are shown in the diagram) The substrates W are held in the Y-axis direction at a first spacing P1. Figure 5 As shown, the first holding device 811 has multiple first arms 812. The number of first arms 812 is not limited to the number shown in the figure.

[0097] Multiple first arms 812 extend along the Y-axis and have first retaining grooves 813 arranged at a first spacing P1 in the Y-axis direction. The outer periphery of the substrate W is inserted into the first retaining groove 813, thereby holding the outer periphery of the substrate W in the first retaining groove 813. The multiple first arms 812 hold the respective outer peripheries of multiple substrates W at circumferential intervals.

[0098] In addition, the batch release section 81 has a second holding device 814, such as Figure 6B As shown, the second retaining device 814 holds multiple pieces (e.g., 25 pieces, in...) Figure 6B (Only 6 out of the 25 substrates shown in the diagram) are held at a second spacing P2 in the Y-axis direction. Figure 5 As shown, the second holding device 814 has multiple second arms 815. The number of second arms 815 is not limited to the number shown in the figure.

[0099] Multiple second arms 815 extend along the Y-axis and have second retaining grooves 816 arranged at a second spacing P2 in the Y-axis direction. The outer periphery of the substrate W is inserted into the second retaining groove 816, thereby holding the outer periphery of the substrate W in the second retaining groove 816. The multiple second arms 815 hold the respective outer peripheries of multiple substrates W at circumferential intervals.

[0100] Furthermore, the multiple second arms 815 also have through slots 817 arranged at a second spacing P2 in the Y-axis direction. The outer periphery of the substrate W is also inserted into the through slots 817, but the through slots 817 do not hold the outer periphery of the substrate W, allowing the substrate W to pass through. The through slots 817 and the second holding slots 816 are alternately arranged in the Y-axis direction. The through slots 817 and the second holding slots 816 are arranged at the same Y-axis position as any of the multiple first holding slots 813.

[0101] Furthermore, the batch release unit 81 includes a drive device 818, which raises and lowers the first holding device 811 relative to the second holding device 814. This raises the first holding device 811 to a lowering start position above the second holding device 814 (see reference). Figure 6A ) and the descent end position below the second holding device 814 (refer to Figure 6B It rises and falls between ).

[0102] Next, refer to it again. Figure 6A , Figure 6B and Figure 6C The actions of the batch release unit 81 are explained.

[0103] First, such as Figure 6A As shown, the first holding device 811 holds multiple substrates W in the Y-axis direction at a first spacing P1 at the descent start position. The first holding device 811 holds each of the multiple substrates W vertically. The descent start position is set above the third rinsing liquid tank 68.

[0104] Next, as Figure 6B As shown, the first holding device 811 descends to transfer a portion of batch L to the second holding device 814. The second holding device 814 receives multiple substrates W arranged at a second spacing P2 from the first holding device 811 in a third rinsing solution. At the end of the descent position, the first holding device 811 holds the multiple substrates W that have passed through the through groove 817 of the second holding device 814 at the second spacing P2 through the through groove.

[0105] As a result, multiple substrates W are held separately in the third rinsing solution by the first holding device 811 and the second holding device 814. The second holding device 814 holds the multiple substrates W at a second spacing P2 at a position higher than the first holding device 811. Similarly, the first holding device 811 holds the multiple substrates W at the second spacing P2. The multiple substrates W are held vertically.

[0106] Next, as Figure 6B As shown, the second transport robot 54 receives substrate W from the second holding device 814, removes substrate W one by one from the third rinsing liquid, and transports them to the single-substrate processing unit 3. Since the substrate W is held at a second spacing P2, interference between the substrate W and the second transport arm 541 of the second transport robot 54 can be prevented. Furthermore, the second transport robot 54 can also remove multiple substrates W from the third rinsing liquid. This removal process is repeated until all substrates W have been removed from the second holding device 814.

[0107] Next, as Figure 6C As shown, the first holding device 811 rises to transfer the substrate W to the second transfer robot 54. The first holding device 811 stops at a position slightly below the second holding device 814, but it can also stop at a position slightly above the second holding device 814. This is as long as the substrate W continues to be immersed in the third rinsing solution.

[0108] Next, as Figure 6C As shown, the second transport robot 54 receives substrate W from the first holding device 811, removes substrate W one by one from the third rinsing liquid, and transports them to the single-substrate processing unit 3. Since the substrate W is held at a second spacing P2, interference between the substrate W and the second transport arm 541 of the second transport robot 54 can be prevented. Furthermore, the second transport robot 54 can also remove multiple substrates W from the third rinsing liquid. This removal process is repeated until all substrates W have been removed from the first holding device 811.

[0109] As described above, the substrate W remains in the third rinsing liquid until it is removed from the third rinsing liquid using the second transport robot 54. Since the substrate W is located below the surface of the third rinsing liquid, the surface tension of the third rinsing liquid does not act on the substrate W, thus preventing the collapse of the uneven pattern on the substrate W.

[0110] The batch release unit 81 may also have a third holding device (not shown). Similar to the second holding device 814, the third holding device receives multiple substrates W arranged at a second pitch P2 from the first holding device 811 in a third rinsing solution. The first holding device 811 transfers substrates W not only to the second holding device 814 but also to the third holding device, thus increasing the ratio N of the first pitch P1 to the second pitch P2.

[0111] Furthermore, to minimize the size of the batch processing unit 6, the batch release unit 81 is located in the third rinsing liquid tank 68, but it can also be located in a dedicated processing tank. Similar to the third rinsing liquid tank 68, this processing tank is preferably used for storing pure water. Using pure water can suppress the aging of the second conveying arm 541 of the second conveying robot 54. Alternatively, as long as the aging of the second conveying arm 541 can be suppressed, the batch release unit 81 can also be located in a chemical solution tank.

[0112] Next, refer to Figure 7 The first conveyor robot 53 and the second conveyor robot 54 will be described. Furthermore, based on the space occupied in the attached drawings, the number of the first conveyor arms 531 of the first conveyor robot 53 is shown as less than the actual number.

[0113] The first transport robot 53 transports the substrate W from the single-wafer processing unit 3 to the batch forming unit 51 of the interface unit 5. After the substrate W is formed into batch L by the batch forming unit 51, it is transported from the batch forming unit 51 to the batch processing unit 6.

[0114] The first conveying robot 53 is, for example, a 6-axis robot with 6 rotational axes R1, R2, R3, R4, R5, and R6. Alternatively, the first conveying robot 53 can also be a 7-axis robot. Furthermore, the first conveying robot 53 can also be a jointed robot, or an orthogonal robot, etc. Orthogonal robots can also have rotational axes.

[0115] The first conveying robot 53 has a first conveying arm 531 at the tip of its arm. The first conveying arm 531 is used to hold the substrate W. The thickness of the first conveying arm 531 is set to allow the first conveying arm 531 to be inserted between substrates W arranged at a second spacing P2. Multiple first conveying arms 531 may also be provided to enable batch conveying of multiple substrates (e.g., 5 substrates). Figure 7 The diagram shows only 2 out of 5 substrates (W).

[0116] The second transport robot 54 transports the substrate W from the batch processing unit 6 to the single-wafer processing unit 3. For example, the second transport robot 54 transports the substrate W from the third rinsing liquid tank 68 to the liquid processing device 34. For the transport of the substrate W from the third rinsing liquid tank 68 to the liquid processing device 34, the second transport robot 54 is used, while the second transport device 32 is not used. Therefore, it is possible to prevent the second transport device 32 from being wetted by the third rinsing liquid. Furthermore, the transport source is appropriately selected according to the structure of the batch processing unit 6. Similarly, the transport destination is appropriately selected according to the structure of the single-wafer processing unit 3.

[0117] The second conveying robot 54 is configured similarly to the first conveying robot 53, and has a second conveying arm 541 at the end of its arm. The second conveying arm 541 is used to hold the substrate W. The thickness of the second conveying arm 541 is set to allow the second conveying arm 541 to be inserted between the substrates W arranged at a second spacing P2. Only one second conveying arm 541 is provided for conveying substrates W one by one, but multiple arms may be provided to enable batch conveying of multiple substrates W.

[0118] Since the second conveying arm 541 removes the substrate W from the third rinsing solution, it becomes wet with the third rinsing solution. To prevent the third rinsing solution from dripping from the second conveying arm 541 onto its wrist, the second conveying robot 54 is suspended from the top 55 of the interface section 5. On the other hand, the first conveying robot 53 is disposed on the ground 56 of the interface section 5.

[0119] Alternatively, the configurations of the second conveying robot 54 and the first conveying robot 53 can be reversed; for example, the first conveying robot 53 can be suspended from the top 55, while the second conveying robot 54 can be positioned on the ground 56. In this case, it is possible to prevent the third rinsing liquid adhering to the second conveying arm 541 from dripping onto the first conveying robot 53. The first conveying robot 53 is always able to convey the substrate W in a dry state.

[0120] Alternatively, both the first conveyor robot 53 and the second conveyor robot 54 can be suspended from the top 55, or both can be positioned on the ground 56. Furthermore, one or more of the first conveyor robot 53 and the second conveyor robot 54 can be mounted on a side wall. The side wall is positioned between the top 55 and the ground 56, and unlike the top 55 and the ground 56, this side wall is vertically positioned. The top 55 and the ground 56 are horizontally positioned.

[0121] Alternatively, during the transport of the substrate W using the second transport arm 541, a high-humidity gas may be supplied to the substrate W to prevent it from drying out. Alternatively, a gas nozzle may be provided in the second transport robot 54 to blow away droplets adhering to the second transport arm 541. Furthermore, a water collection tray may be provided in the second transport robot 54 to collect droplets dripping from the second transport arm 541 toward its wrist. The droplets are formed by the condensation of the third rinsing liquid or the high-humidity gas.

[0122] Next, refer to Figure 10 The substrate processing system 1 of the first modified example will be described below. Hereinafter, the differences between this modified example and the above-described embodiment will be mainly explained.

[0123] like Figure 10 As shown, the substrate processing system 1 of this modified example is independently provided with a feeding section 2A and a discharging section 2B. The cassette C is fed into the feeding section 2A while holding multiple substrates W at a second spacing P2. Furthermore, the cassette C is discharging out from the discharging section 2B while holding multiple substrates W at a second spacing P2.

[0124] Furthermore, the substrate processing system 1 of this modified example has a second interface section 5A, which is different from the interface section 5. The second interface section 5A transfers the substrate W between the feeding section 2A and the batch processing section 6. The second interface section 5A has a batch forming section 51 and a transport robot 57.

[0125] Conveyor Robot 57 and Figure 7 The first conveying robot 53 shown is similarly configured to convey substrates W from the feeding section 2A to the batch forming section 51. In addition, the conveying robot 57 can convey all substrates W stored in a box C in batches, for example, it can convey 25 substrates W in batches.

[0126] The interface 5 in this modification has a function equivalent to Figure 7 The second conveying robot 54 shown is a conveying robot 58. The conveying robot 58 conveys the substrate W from the batch processing unit 6 to the single-wafer processing unit 3. The interface unit 5 does not have... Figure 7 The first transport robot 53 shown has the following functions. At the interface section 5, the base plate W travels in a one-way manner.

[0127] The second interface section 5A, the batch processing section 6, the interface section 5, and the single-piece processing section 3 are arranged in this order between the feed section 2A and the delivery section 2B along the transport direction of the substrate W. The substrate W is fed from the feed section 2A... Figure 10 The arrows A1, A2, A3, and A4 are shown in sequence, and the material is conveyed to the delivery unit 2B.

[0128] According to this modified example, since the substrate W travels in a one-way manner in the interface section 5 and the second interface section 5A, it is possible to suppress the process stagnation of the substrate W and improve productivity.

[0129] In this modified example, the batch forming unit 51 and the processing tanks such as the third rinsing liquid tank 68 are arranged next to the long side of the third transport area 61 of the batch processing unit 6. Specifically, the batch forming unit 51, the first chemical solution tank 63, the first rinsing liquid tank 64, the second chemical solution tank 65, the second rinsing liquid tank 66, the third chemical solution tank 67, and the third rinsing liquid tank 68 are arranged in a row in this order.

[0130] As described above, the batch forming section 51 and the processing tanks such as the third rinsing liquid tank 68 are arranged next to the long side of the third transport area 61 of the batch processing section 6. Therefore, the arrangement direction of the substrates W is the same in the batch forming section 51 and the processing tank. Therefore, the third transport device 62 does not need to rotate about the vertical axis, and since no rotation axis is needed, the structure of the third transport device 62 can be simplified.

[0131] Next, refer to Figure 11 The substrate processing system 1 of the second modification will be described below. Hereinafter, the differences between this modification and the first modification described above will be mainly explained. In the first modification described above, the feed section 2A, the second interface section 5A, the batch processing section 6, the interface section 5, the single-wafer processing section 3, and the output section 2B are arranged in a row in this order.

[0132] In this modified example, the feed section 2A, the second interface section 5A, the batch processing section 6, the interface section 5, the single-chip processing section 3, and the output section 2B are arranged in a U-shape in this order. Specifically, the feed section 2A, the second interface section 5A, and the batch processing section 6 are arranged in a row in the X-axis direction, the output section 2B and the single-chip processing section 3 are arranged in a row in the X-axis direction, and the interface section 5 extends from the batch processing section 6 to the single-chip processing section 3 in the Y-axis direction.

[0133] Interface 5 has: equivalent to Figure 7 The second conveying robot 54 shown includes a conveying robot 58, a conveying device 591, a conveying area 592, and a conveying device 593. The conveying robot 58, the conveying device 591, the conveying area 592, and the conveying device 593 are arranged in a row along the Y-axis in this order.

[0134] A conveying device 594 is provided in the conveying area 592. The conveying device 594 has a conveying arm that moves in the horizontal direction (X-axis and Y-axis directions) and the vertical direction, and rotates about the vertical axis. The conveying arm conveys the substrate W from the conveying device 591 to another conveying device 593. The number of conveying arms can be one or more. In the latter case, the conveying device 594 conveys multiple substrates (e.g., 5) in batches.

[0135] Next, the operation of the interface section 5 in this modified example will be explained. First, the transport robot 58 removes the substrate W from the third rinsing liquid and transports it to the transport device 591. Next, the transport device 594 transports the substrate W from the transport device 591 to another transport device 593. Afterward, the second transport device 32 of the single-wafer processing unit 3 receives the substrate W from the transport device 593 and transports it to the liquid processing device 34.

[0136] The substrate W is fed from the feed section 2A with Figure 11 The arrows A1, A2, A3, A4, A5, and A6 are conveyed in sequence to the delivery unit 2B.

[0137] The embodiments of the substrate processing system and substrate processing method of this disclosure have been described above, but this disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope of the claims. These contents naturally also fall within the technical scope of this disclosure.

[0138] For example, in the above embodiments and variations, the substrate W is housed inside the box C at a second pitch P2, but it can also be housed at a pitch other than the second pitch P2. It can be housed at a pitch narrower than the second pitch P2 (e.g., the first pitch P1) or a pitch wider than the second pitch P2. If the batch release unit 81 widens the pitch of the substrate W from the first pitch P1 to the second pitch P2, interference between the substrate W and the transport robots 54 and 58 can be suppressed.

[0139] In the above embodiments and variations, the batch forming unit 51 may narrow the spacing between the substrates W when forming batch L, or it may not narrow it. For example, if a number of substrates W less than the maximum number of substrates that can be stored in the box C are stored in the box C, the batch forming unit 51 may not narrow the spacing between the substrates W. In short, if the batch release unit 81 widens the spacing between the substrates W from the first spacing P1 to the second spacing P2, interference between the substrates W and the transport robots 54 and 58 can be suppressed.

[0140] In the above embodiments and variations, the batch release unit 81 widens the spacing of the substrate W from the first spacing P1 to the second spacing P2 in a block-shaped processing liquid larger than the substrate W. However, it can also widen the spacing of the substrate W from the first spacing P1 to the second spacing P2 in a mist-like processing liquid. Even if the processing liquid is mist-like, the substrate W can be prevented from drying out, thus suppressing the collapse of the uneven pattern on the substrate W.

[0141] In the above embodiments and variations, such as Figure 7 As shown, the conveying unit 52 includes a first conveying robot 53 and a second conveying robot 54, but it can also be as follows: Figure 8 As shown, it includes a conveyor robot 41. The conveyor robot 41 also serves as the first conveyor robot 53 and the second conveyor robot 54.

[0142] The conveying robot 41 has a first conveying arm 531 of the first conveying robot 53 and a second conveying arm 541 of the second conveying robot 54. The first conveying arm 531 and the second conveying arm 541 are respectively mounted on the top of the arm of the conveying robot 41. The conveying robot 41 uses the first conveying arm 531 to convey the substrate W from the monolithic processing unit 3 to the batch forming unit 51, and uses the second conveying arm 541 to convey the substrate W from the batch processing unit 6 to the monolithic processing unit 3.

[0143] like Figure 8 As shown, in order to enable the first conveying arm 531 and the second conveying arm 541 to move independently, the conveying robot 41 also has a moving mechanism 411 for moving the second conveying arm 541 relative to the first conveying arm 531. The moving mechanism 411 is provided, for example, at the tip of the arm of the conveying robot 41. Figure 8 In this process, the moving mechanism 411 moves the second conveying arm 541 relative to the tip of the arm of the conveying robot 41, but it can also move the first conveying arm 531 relative to the tip of the arm of the conveying robot 41.

[0144] like Figure 8 As shown, the conveying robot 41 can be suspended from the top 55, placed on the ground 56, or placed on the side wall.

Claims

1. A substrate processing system, comprising: The batch processing department processes multiple substrates in batches. The feeding section delivers the first box containing multiple substrates; A single-wafer processing unit processes multiple substrates one by one; An interface section that connects multiple substrates between the batch processing section and the single-wafer processing section; as well as The delivery unit delivers a second box containing multiple of the aforementioned substrates. The batch processing unit includes a processing tank that stores a block or mist-like processing liquid larger than the size of the multiple substrates. The feeding unit and the batch processing unit are arranged side by side with respect to the feeding unit and the single-chip processing unit. Furthermore, the interface section is disposed adjacent to the batch processing section and the single-chip processing section. The interface section has: The first conveying area has a first conveying device; A first conveying device, disposed adjacent to the batch processing unit, is used to horizontally hold multiple substrates; and A second conveying device, disposed adjacent to the single-piece processing unit, is used to horizontally hold the substrate conveyed from the first conveying device. The first conveying device is used to convey at least one substrate between the first conveying device and the second conveying device. The first conveying device, the first conveying area, and the second conveying device are configured to be arranged in a column in the order of the first conveying device, the first conveying area, and the second conveying device.

2. The substrate processing system according to claim 1, wherein, The batch processing unit includes a batch forming unit that forms batches comprising multiple substrates. The batch forming section includes a first holding device that holds a plurality of said substrates arranged at a first spacing; and a second holding device that receives, in the processing liquid, a plurality of said substrates arranged at a second spacing from the first holding device, the second spacing being N times the first spacing, where N is a natural number greater than or equal to 2. The interface section includes a conveying section that conveys multiple substrates, which are separately held in the first and second holding devices in the processing liquid, from the batch processing section to the single-piece processing section.

3. The substrate processing system according to claim 2, wherein, The batch processing unit also includes a second conveying area that is rectangular when viewed from above, and a second conveying device that moves and rotates while holding the batch in the second conveying area.

4. The substrate processing system according to claim 1, wherein, The batch processing unit has a second conveying area that is rectangular when viewed from above. The processing groove is located next to the long side of the second conveying area. The interface section includes a transport robot that pulls multiple substrates from the processing tank to transport them to the first conveying device. The conveying robot, the first conveying device, the first conveying area, and the second conveying device are configured to be arranged in a column in the order of the conveying robot, the first conveying device, the first conveying area, and the second conveying device.

5. The substrate processing system according to claim 2, wherein, The treatment tank stores pure water for immersing the batch.

6. The substrate processing system according to claim 2, wherein, The batch processing unit includes a chemical solution tank for storing the batch of dilute hydrofluoric acid for impregnation.

7. The substrate processing system according to claim 2, wherein, The batch processing unit includes a chemical solution tank for storing the phosphoric acid aqueous solution used to impregnate the batch.

8. The substrate processing system according to claim 2, wherein, The batch processing unit includes a chemical solution tank for storing a mixed solution of ammonia, hydrogen peroxide, and water for impregnating the batch.

9. The substrate processing system according to claim 2, wherein, The batch processing unit includes a chemical solution tank for storing a mixed solution of sulfuric acid, hydrogen peroxide, and water for impregnating the batch.

10. The substrate processing system according to claim 1, wherein, The single-wafer processing unit includes a liquid processing apparatus that processes multiple substrates one by one using liquid.

11. The substrate processing system according to claim 1, wherein, The single-piece processing unit includes a drying device that uses supercritical fluid to dry multiple substrates one by one.

12. An interface device for a substrate processing system, wherein, The substrate processing system has: The feeding section delivers the first box, which contains multiple substrates. A batch processing unit that processes multiple substrates in batches, the batch processing unit including a processing tank storing a block or mist-like processing liquid larger than the size of the multiple substrates; A single-wafer processing unit processes multiple substrates one by one; as well as The delivery unit delivers a second box containing multiple of the aforementioned substrates. The interface device has: The first conveying area has a first conveying device; A first conveying device, disposed adjacent to the batch processing unit, is used to horizontally hold multiple substrates; and A second conveying device, disposed adjacent to the single-piece processing unit, is used to horizontally hold the substrate conveyed from the first conveying device. The first conveying device is used to convey at least one substrate between the first conveying device and the second conveying device. The first conveying device, the first conveying area, and the second conveying device are configured to be arranged in a column in the order of the first conveying device, the first conveying area, and the second conveying device. The interface device is disposed adjacent to the batch processing unit and the single-wafer processing unit, and is used to transfer multiple substrates between the batch processing unit and the single-wafer processing unit. The feeding section and the batch processing section are arranged side by side with respect to the sending section and the single-chip processing section.

13. The interface device according to claim 12, wherein, The batch processing unit includes a batch forming unit that forms batches comprising multiple substrates. The batch forming section includes a first holding device that holds a plurality of said substrates arranged at a first spacing; and a second holding device that receives, in the processing liquid, a plurality of said substrates arranged at a second spacing from the first holding device, the second spacing being N times the first spacing, where N is a natural number greater than or equal to 2. The interface device includes a conveying section that conveys multiple substrates, which are separately held in the first and second holding devices in the processing liquid, from the batch processing section to the single-piece processing section.

14. The interface device according to claim 13, wherein, The batch processing unit further includes a second conveying area that is rectangular when viewed from above, and a second conveying device that moves and rotates while holding the batch containing multiple substrates in the second conveying area.

15. The interface device according to claim 12, wherein, The batch processing unit has a second conveying area that is rectangular when viewed from above. The processing groove is located next to the long side of the second conveying area. The interface device includes a transport robot that pulls multiple substrates from the processing tank to transport them to the first conveying device. The conveying robot, the first conveying device, the first conveying area, and the second conveying device are configured to be arranged in a column in the order of the conveying robot, the first conveying device, the first conveying area, and the second conveying device.

16. A substrate processing method using a substrate processing system, the substrate processing system having an infeed section, a batch processing section, an interface section, a single-wafer processing section, and an outfeed section, the substrate processing method comprising the following processes: The first box containing multiple substrates is fed into the feeding section; Multiple substrates are transported from the feeding section to the batch processing section; Multiple substrates are processed in batches in the batch processing unit; The interface section is used to transfer multiple substrates from the batch processing section to the single-substrate processing section; Multiple substrates are processed one by one in the single-wafer processing unit; Multiple substrates are transported from the single-piece processing unit to the delivery unit; as well as A second box containing multiple of the aforementioned substrates is delivered. The batch processing unit includes a processing tank that stores a block or mist-like processing liquid larger than the size of the multiple substrates. The feeding unit and the batch processing unit are arranged side by side with respect to the feeding unit and the single-chip processing unit. Furthermore, the interface section is disposed adjacent to the batch processing section and the single-chip processing section. The interface section has: The first conveying area has a first conveying device; A first conveying device, disposed adjacent to the batch processing unit, is used to horizontally hold multiple substrates; and A second conveying device, disposed adjacent to the single-piece processing unit, is used to horizontally hold the substrate conveyed from the first conveying device. The first conveying device is used to convey at least one substrate between the first conveying device and the second conveying device. The first conveying device, the first conveying area, and the second conveying device are configured to be arranged in a column in the order of the first conveying device, the first conveying area, and the second conveying device.

17. The substrate processing method according to claim 16, wherein, The process of batch processing multiple of the aforementioned substrates includes the following processes: A first holding device provided in the batch processing unit holds a plurality of substrates arranged at a first interval; as well as A second holding device disposed in the batch processing unit receives multiple substrates arranged at a second spacing from the first holding device in the processing liquid, the second spacing being N times the first spacing, where N is a natural number greater than or equal to 2. The process of transferring multiple substrates includes: using a transport section provided at the interface to transport multiple substrates, which are separately held in the first holding device and the second holding device in the processing liquid, from the batch processing section to the single-substrate processing section.

18. The substrate processing method according to claim 17, wherein, The batch processing unit also includes a second conveying area and a second conveying device that are rectangular when viewed from above. The process of batch processing multiple substrates includes: using the second conveying device to move and rotate the batch containing multiple substrates in the second conveying area.

19. The substrate processing method according to claim 16, wherein, The batch processing unit has a second conveying area that is rectangular when viewed from above. The processing groove is located next to the long side of the second conveying area. The process of transferring multiple substrates includes: using a transport robot provided at the interface to pull multiple substrates from the processing tank and transport them to the first transfer device. The conveying robot, the first conveying device, the first conveying area, and the second conveying device are configured to be arranged in a column in the order of the conveying robot, the first conveying device, the first conveying area, and the second conveying device.

20. The substrate processing method according to claim 18, wherein, The treatment tank stores pure water for immersing the batch.

Images