ACF pasting device and ACF pasting method

Abstract

The invention provides an ACF pasting device and an ACF pasting method. The invention provides an ACF pasting device and the like which can properly control the feeding amount of a tape of a tape feeding mechanism. The ACF pasting device is provided with: a cutting unit that performs a cutting process for forming an ACF slice supported by a substrate layer; a crimping unit that performs a crimping process for peeling off the ACF slice from the base material layer and crimping the ACF slice to the substrate; an imaging unit that performs an imaging process for generating a captured image by imaging a cut-off portion of the ACF layer supported by the substrate layer, the cut-off portion being cut off by the cutting-off process, prior to the crimping process; a tape feeding mechanism that feeds a tape including the ACF slice supported by the substrate layer from a first position at which the cutting process is performed to a second position at which the imaging process is performed by a predetermined feeding amount, the predetermined feeding amount being set on the basis of distance information relating to the distance between the cutting unit and the imaging unit; and an updating unit that updates the distance information on the basis of the amount of deviation by which the cutting portion in the captured image deviates from the predetermined position.

Description

Technical Field

[0001] This invention relates to an ACF (Anisotropic Conductive Film) bonding apparatus and a method for bonding ACF onto a substrate. Background Technology

[0002] In the past, there have been devices for bonding ACF as an adhesive member to a substrate (see, for example, Patent Document 1). Such devices transport ACF by means of a conveyor belt and adhere ACF to the substrate by means of a pressing tool provided with an adhesive head.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: JP 2016-164584

[0006] ACF slices are formed by cutting (half-cutting) the ACF supported on the substrate at given intervals. These ACF slices are then adhered to the substrate using an adhesion head, thus bonding the ACF to the substrate. Here, a conveyor mechanism, similar to the aforementioned conveyor unit, moves the ACF from the cut position to the position where it is to be adhered to the substrate. To adhere the ACF slices to the appropriate position on the substrate, it is necessary to move the ACF a suitable distance after cutting. In other words, the conveyor mechanism needs to feed the ACF at an appropriate feed rate. Summary of the Invention

[0007] The present invention provides an ACF pasting device, etc., which can appropriately control the feed amount of the belt in the belt feeding mechanism.

[0008] An ACF bonding apparatus according to one aspect of the present invention comprises: a supply unit for supplying a tape including a substrate layer and an ACF (Anisotropic Conductive Film) layer; a cutting unit for performing a cutting process in which the ACF layer included in the tape supplied from the supply unit is cut to form an ACF slice supported by the substrate layer; a pressing unit for performing a pressing process in which the ACF slice is peeled from the substrate layer and pressed onto a substrate; and an imaging unit for performing an imaging process before performing the pressing process, in which the imaging process captures images of the ACF layer supported by the substrate layer after the cutting process. The cut portion is photographed to generate a photographic image; a belt feeding mechanism performs belt feeding processing, in which the belt, including the ACF slice supported by the substrate layer, is fed from a first position where the cutting processing is performed to a second position where the photographing processing is performed by a given feed amount, the given feed amount being set based on distance information related to the distance between the cut portion and the photographing portion; and an updating unit updates the distance information based on the deviation amount of the cut portion in the photographic image from the given position.

[0009] Furthermore, in one aspect of the ACF bonding method according to the present invention, the cutting portion is subjected to a cutting process, in which the cutting process is performed by cutting the portion from the portion used to supply the substrate layer and ACF (Anisotropic Conductive Carbon). A tape supply unit supplies a tape containing an anisotropic conductive film (ACF) layer, in which the ACF layer is cut to form an ACF slice supported by the substrate layer. A pressing unit performs a pressing process, in which the ACF slice is peeled from the substrate layer and pressed onto the substrate. Before the pressing process, an imaging unit performs an imaging process, in which the cut portion of the ACF layer supported by the substrate layer is imaged to generate an image. A tape feeding mechanism performs a tape feeding process, in which the tape containing the ACF slice supported by the substrate layer is fed from a first position of the cutting process to a second position of the imaging process by a given feed amount. The given feed amount is set based on distance information related to the distance between the cutting unit and the imaging unit. An updating unit updates the distance information based on the deviation amount of the cut portion in the image from the given position.

[0010] The effects of the invention

[0011] According to the present invention, an ACF bonding device, etc., can be provided that can appropriately control the feed amount of the belt in the belt feeding mechanism. Attached Figure Description

[0012] Figure 1 This is a diagram showing the structure of the ACF adhesive device according to the embodiment.

[0013] Figure 2 This is a front view showing the ACF pasting mechanism involved in the implementation method.

[0014] Figure 3 This is a side view showing the ACF pasting mechanism involved in the embodiment.

[0015] Figure 4 This is a top view showing the ACF pasting mechanism involved in the embodiment.

[0016] Figure 5 This is a flowchart illustrating the processing steps of the ACF pasting device involved in the embodiment.

[0017] Figure 6 This diagram illustrates the specific processing steps of the pasting and imaging processes in the ACF pasting apparatus according to the embodiment.

[0018] Figure 7 This is a diagram representing a camera image related to the implementation method.

[0019] Figure 8 This is a flowchart illustrating a modified example of the processing steps of the ACF adhesive device according to the embodiment.

[0020] Explanation of reference numerals in the attached figures

[0021] 3 substrate

[0022] 4 Electrode section

[0023] 10 ACF Adhesive Device

[0024] 20 ACF pasting mechanism

[0025] 21 Supply Department

[0026] 22 Cut-off section

[0027] 23. Brought into the mechanism

[0028] 24. Crimping section

[0029] 25. Camera Department

[0030] 30 Control device

[0031] 31 Control Department

[0032] 32 Update Department

[0033] 33 Storage Department

[0034] 210 Substrate Moving Mechanism

[0035] 211 X-axis worktable

[0036] 212 Y-axis worktable

[0037] 213 Z-axis worktable

[0038] 214 platforms

[0039] 220L, 220R Adhesion Mechanism Unit

[0040] 221 with supply reel

[0041] 222 with recycling unit

[0042] 223 Adhesion Head

[0043] 224 Adhesion support platform

[0044] 225 with cutting unit

[0045] 225a backing plate

[0046] 225b Cutter

[0047] 228 X-axis track mechanism

[0048] 229 Adhesion substrate

[0049] Cameras 230 and 231

[0050] 232 Feed Roller

[0051] 233 Pressing Roller

[0052] 234 Guide Roller

[0053] TP with

[0054] TP1 substrate layer

[0055] tp2 ACF layer

[0056] tp3 ACF slice. Detailed Implementation

[0057] Hereinafter, embodiments of the present invention will be described in detail using the accompanying drawings. Furthermore, the embodiments described below represent specific examples of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangements and connection methods of constituent elements, steps, and sequences of steps shown in the following embodiments are examples and are not intended to limit the scope of the present invention. Therefore, any constituent element not described in the independent claims in the following embodiments will be described as an arbitrary constituent element.

[0058] Furthermore, all figures are schematic diagrams and may not be strictly representational. Also, the same reference numerals are used to label identical structural components across all figures.

[0059] Furthermore, in the following embodiments, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The vertical direction is referred to as the Z-axis direction or up-down direction; a direction in a plane perpendicular to the vertical direction is referred to as the Y-axis direction or depth direction; and a direction in that vertical plane perpendicular to the Y-axis direction is referred to as the X-axis direction, left-right direction, or transverse direction. Furthermore, in the following embodiments, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. Furthermore, in the following embodiments, the positive side of the Y-axis direction is inward or inward, and the negative side of the Y-axis direction is near the front or near the front. Furthermore, in the following embodiments, the positive side of the X-axis direction is right or right, and the negative side of the X-axis direction is left or left.

[0060] Furthermore, in the following embodiments, the coordinates in the camera image are represented by a three-axis orthogonal coordinate system consisting of the X1 axis, Y1 axis, and Z1 axis. For example, the X1 axis is the axis corresponding to the X-axis, the Y1 axis is the axis corresponding to the Y-axis, and the Z1 axis is the axis corresponding to the Z-axis. Additionally, the positive and negative sides of the X1, Y1, and Z1 axes correspond to the positive and negative sides of the X-axis, Y-axis, and Z-axis, respectively.

[0061] Furthermore, in the following implementation, the terms "above" and "below" do not refer to the absolute spatial direction of upward (vertical above) and downward (vertical below), but are used as terms defined by relative positional relationships.

[0062] Furthermore, the values ​​in the following embodiments are all examples, and other values ​​may also be used.

[0063] Furthermore, in this specification, ordinal numbers such as "the first" and "the second" do not imply the quantity or order of constituent elements unless otherwise specified, but are used for the purpose of distinguishing them to avoid confusion of the same constituent elements.

[0064] Furthermore, in the following embodiments, when the comparison with above the threshold and below the threshold is described, it means that the threshold is distinguished as a boundary, and it may also mean above the threshold and below the threshold, respectively.

[0065] (Implementation Method)

[0066] [structure]

[0067] First, the structure of the ACF pasting device involved in the implementation method will be explained.

[0068] Figure 1This is a diagram showing the structure of the ACF adhesive device 10 according to the embodiment. Figures 2-4 This is a diagram showing the specific structure of the ACF pasting mechanism 20 according to the embodiment. Specifically, Figure 2 This is a front view showing the ACF pasting mechanism 20 involved in the implementation method. Figure 3 This is a side view showing the ACF pasting mechanism 20 according to the embodiment. Figure 4 This is a top view showing the ACF pasting mechanism 20 according to the embodiment. Additionally, in Figure 4 The image shows a portion of the ACF pasting mechanism 20.

[0069] ACF bonding device 10 is used to bond components to substrate 3 using ACF (more specifically, ACF slices tp3 peeled from tp). Figure 6 The device is described. Specifically, the ACF adhesive device 10 uses the adhesive head 223 to apply the ACF layer tp2 (refer to the reference) contained in the tape tp. Figure 6 A slice (ACF slice tp3) is pasted onto a substrate 3 placed on a stage 214.

[0070] The ACF bonding apparatus 10 is, for example, part of a component mounting system used in the production of display panels, etc. In this component mounting system, the ACF bonding apparatus 10 bonds ACF strips tp3 to the electrode portion 4 provided on a substrate 3, and then thermally presses the substrate 3 and the component together via the ACF strips tp3 using a component pressing device (not shown). The ACF bonding apparatus 10, for example, bonds the ACF strips tp3 to a substrate 3 transported from an upstream device via a transport section. The substrate 3 with the ACF strips tp3 bonded thereon is then transported, for example, via the transport section to a component pressing device located downstream of the ACF bonding apparatus 10.

[0071] The TP layer includes a substrate layer TP1 (reference). Figure 6 The substrate layer tp1 is a separator used to support the ACF layer tp2. The substrate layer tp1 is, for example, a strip-shaped film formed of a resin such as polyethylene terephthalate. The ACF layer tp2 is a strip-shaped layer composed of ACF. The ACF slice tp3 is a slice formed by cutting the ACF layer tp2.

[0072] The ACF bonding apparatus 10 cuts (halve-cuts) the ACF layer tp2 to a given size while it is held in place by the substrate layer tp1 using the cutting part 22, thereby forming an ACF slice tp3. Then, the ACF bonding apparatus 10 peels the ACF slice tp3 from the substrate layer tp1 by moving it while clamping it with two peeling pins. Next, the ACF bonding apparatus 10 adjusts the position of the substrate 3 placed on the stage 214, and the ACF slice tp3 cut to the given size is bonded to the substrate 3 by the adhesion head 223.

[0073] As substrate 3, an example is a flexible substrate in the form of a film formed of resin or the like. Alternatively, substrate 3 can also be a rigid substrate such as a glass substrate.

[0074] Examples of electronic components that are attached to substrate 3 with an ACF slice tp3 as a guide are ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

[0075] The ACF adhesive device 10 includes an ACF adhesive mechanism 20 and a control device 30.

[0076] The ACF bonding mechanism 20 is a mechanism that performs the operation of bonding ACF slices tp3 onto a substrate 3 transported from upstream and then transporting it downstream.

[0077] The ACF pasting mechanism 20 includes a supply unit 21, a cutting unit 22, a belt feeding mechanism 23, a crimping unit 24, and a camera unit 25.

[0078] The supply unit 21 is a mechanism for supplying materials including the substrate layer tp1 and the ACF layer tp2. For example, the supply unit 21 includes a supply reel 221.

[0079] The belt supply reel 221 is a reel that holds the belt tp. Specifically, the belt supply reel 221 is a reel on which the belt tp is wound. The belt tp is unwound from the belt supply reel 221 by driving one or more rollers. For example, the belt tp held in the belt supply reel 221 is fed to a given position by the belt feed mechanism 23. Thus, for example, the supply section 21 and the belt feed mechanism 23 jointly supply the belt tp.

[0080] The cutting section 22 is a mechanism for performing a cutting process in which an ACF slice tp3 supported by a substrate layer tp1 is formed by cutting the ACF layer tp2 contained in the tape tp supplied from the supply section 21. For example, the cutting section 22 includes a tape cutting unit 225.

[0081] The tape cutting unit 225 is a mechanism for cutting the ACF layer tp2 contained in the tape tp. For example, the tape cutting unit 225 includes a backing plate 225a and a cutter 225b. For example, the tape cutting unit 225 cuts the ACF layer tp2 in the tape tp unwound from the tape supply reel 221 by moving the cutter 225b in the vertical direction. That is, the tape cutting unit 225 cuts the tape tp in half. This cutting forms an ACF slice tp3. Specifically, the cutter 225b cuts the ACF layer tp2 in the tape tp by a drive mechanism having a guide (not shown) and a motor driven by the control device 30. More specifically, the cutter 225b clamps the tape tp between itself and the backing plate 225a by rising, pressing and cutting the ACF layer tp2 of the tape tp. Furthermore, when the substrate 3 is supported by the adhesion support stage 224, the periphery of the substrate 3 is positioned between the adhesion head 223, the abutment 225a, the tape tp, and the adhesion support stage 224.

[0082] The belt feeding mechanism 23 is a mechanism for feeding the belt tp held in the supply unit 21. Specifically, the belt feeding mechanism 23 performs a belt feeding process in which the belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed. Specifically, the belt feeding mechanism 23 performs a belt feeding process in which the belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed from a first position for cutting to a second position for imaging by a given feed amount (a given belt tp length), which is set based on distance information related to the distance between the cutting unit 22 and the imaging unit 25. For example, the belt feeding process performed by the belt feeding mechanism 23 is used to supply the belt from the supply unit 21.

[0083] The distance information is information related to the distance between the cutting section 22 and the camera section 25. Specifically, the distance information (the initial value of the distance information) represents, for example, the distance between the position of the cutter 225b of the cutting section 22 when it cuts the ACF layer tp2 and the position of the camera center in tp when the camera section 25 captures an image of the cutting position. However, it is not particularly limited and can be arbitrarily determined. For example, the initial value of the distance information can be calculated using the position of the abutment 225a of the cutting section 22 or the position of the camera 230 of the camera section 25.

[0084] The belt feeding mechanism 23 includes, for example, a feed roller 232, a pressing roller 233, a guide roller 234, and a belt recovery section 222.

[0085] The feed roller 232 is used to feed a roller with a tp. For example, the feed roller 232 includes a roller and a motor for rotating the roller. The motor is, for example, a servo motor, but can be any type of roller.

[0086] The pressing roller 233 is a roller used to feed the belt tp. In this embodiment, the belt tp is supported by clamping it between the feed roller 232 and the pressing roller 233, and the belt tp is fed in a given direction by rotating the feed roller 232. The feed roller 232 and the pressing roller 233 are, for example, pressure rollers. Thus, for example, the belt feeding mechanism 23 includes rollers that feed the belt tp by abutting against and rotating it.

[0087] The guide roller 234 is a roller that constrains the movement of the belt tp. Specifically, the guide roller 234 constrains the movement of the belt tp in the width direction (the Y-axis direction in this embodiment).

[0088] The tape collection unit 222 is a mechanism for collecting tape tp. For example, the tape collection unit 222 has a suction mechanism for attracting tape tp, and collects tape tp by attracting tape tp. Specifically, the tape collection unit 222 collects the substrate layer tp1 left after the ACF layer tp2 is attached to the substrate 3. The tape collection unit 222 may be a mechanism that winds up tape tp by rotating a motor (not shown).

[0089] The crimping section 24 is a mechanism for performing a crimping process in which an ACF slice tp3 is peeled from the substrate layer tp1 and crimped onto the substrate 3. Specifically, the crimping section 24 peels the ACF slice tp3, supported by the substrate layer tp1 contained in the tape feed mechanism 23, from the substrate layer tp1 and crimps it onto the substrate 3. For example, the crimping section 24 includes an adhesion head 223 and an adhesion support stage 224.

[0090] The adhesion head 223 is used to peel the ACF slice tp3 from the substrate layer tp1 and press it onto the substrate 3. An adhesion support stage 224 is disposed below the adhesion head 223. For example, the adhesion head 223 is moved up and down by a drive mechanism having a guide (not shown) and a motor driven by a control device 30, thereby pressing the ACF slice tp3 onto the substrate 3.

[0091] The adhesion support stage 224 is a support stage from the end (in other words, the periphery) of the substrate 3 supported below. The substrate 3 is transported upstream to the ACF bonding mechanism 20 via the substrate moving mechanism 210, and its end is placed on the adhesion support stage 224. Then, the ACF slice tp3 is bonded to the substrate 3 via the adhesion head 223. The substrate moving mechanism 210 moves the substrate 3 with the ACF slice tp3 bonded to it downstream.

[0092] The substrate moving mechanism 210 is a mechanism for moving the substrate 3. The substrate moving mechanism 210 includes an X-axis stage 211, a Y-axis stage 212, a Z-axis stage 213, and a carrier stage 214.

[0093] The X-axis worktable 211 is a mechanism for moving the stage 214 in the X-axis direction. The Y-axis worktable 212 is a mechanism for moving the stage 214 in the Y-axis direction. The Z-axis worktable 213 is a mechanism for moving the stage 214 in the Z-axis direction. The X-axis worktable 211, Y-axis worktable 212, and Z-axis worktable 213 are, for example, equipped with guides and drive mechanisms such as motors for moving the stage 214. The stage 214 can move arbitrarily in these three axes by controlling the drive mechanisms through the control device 30.

[0094] Stage 214 is a stage for placing substrate 3. Substrate 3 is positioned such that its end extends beyond stage 214 when viewed from above. When the ACF slice tp3 is attached to substrate 3, this end is supported from below by the adhesion support stage 224.

[0095] The X-axis stage 211 is, for example, a track-like structure, disposed on the adhesion base 229 along the X-axis direction. The Y-axis stage 212 is, for example, a track-like structure, disposed on the X-axis stage 211 in a state parallel to the Y-axis direction, and can move freely in the X-axis direction. The Z-axis stage 213 is disposed on the Y-axis stage 212, and can move freely in the Y-axis direction, causing the upper platform 214 to rise and fall in the Z-axis direction and rotate around the Z-axis.

[0096] The substrate 3 is placed and held in place on the stage 214. The substrate moving mechanism 210 moves the substrate 3 held in place on the stage 214 in the X-axis, Y-axis and Z-axis directions, thereby causing the substrate 3 to rotate about the Z-axis.

[0097] For example, the substrate moving mechanism 210 places the peripheral portion of the substrate 3 held on the stage 214 onto the adhesion support stage 224, and the adhesion support stage 224 supports the substrate 3 from below, causing the substrate 3 to rotate and move.

[0098] The adhesion head 223 lowers to press the tape tp, which passes between itself and the adhesion support stage 224, onto the periphery of the substrate 3 supported by the adhesion support stage 224. That is, the adhesion head 223 presses the tape tp onto the periphery of the substrate 3 and the adhesion support stage 224. At this time, an ACF slice tp3 is formed on the lower surface of the substrate layer tp1 of the pressed tape tp. Furthermore, multiple electrode portions 4 are formed on the periphery of the substrate 3. Therefore, the ACF slice tp3 is pressed and adhered to the electrode portions 4 of the substrate 3 and peeled off from the substrate layer tp1. The substrate layer tp1, from which the ACF slice tp3 has been peeled off, is then recycled to the tape recycling section 222.

[0099] The camera unit 25 is a camera that performs image processing before the crimping process by the crimping unit 24. In this image processing, it captures images of the cut portions of the ACF layer tp2, which are supported by the substrate layer tp1 and cut by a cutting process, to generate an image. Specifically, the camera unit 25 captures images of the cut portions of the ACF layer tp2, which are supported by the substrate layer tp1 included in the belt tp fed by the belt feed mechanism 23, to generate an image. For example, the camera unit 25 includes cameras 230 and 231.

[0100] Camera 230 is a camera that captures images of the cut portion of the ACF layer tp2, which is supported by the substrate layer tp1 contained in the belt tp fed by the belt feeding mechanism 23, to generate an image. After the ACF layer tp2 is cut by the cutting part 22, the belt tp is fed by the belt feeding mechanism 23 from the position where the ACF layer tp2 was cut (first position) to the position where the camera 230 captures images of the cut portion (second position). For example, the camera 230 fixes its position and captures images of the cut portion in the belt tp fed to the second position. Then, for example, the belt tp moves from the second position to the position where the ACF slice tp3 is adhered (pressed) to the substrate 3 by the adhesion head 223 (third position).

[0101] Furthermore, the second and third positions can be the same or different. In this embodiment, the second and third positions are the same. The first, second, and third positions are, for example, located in positions arranged in this order along the X-axis, and are the same in both the Y-axis and Z-axis directions. In this embodiment, the band tp is configured to be located at the first, second, and third positions described above, respectively, and moves along the X-axis (in other words, the direction of the band's extension) to pass through the first, second, and third positions described above.

[0102] Camera 231 is a camera that generates an image by photographing an ACF slice tp3 adhered to the substrate 3. Specifically, camera 231 photographs the cut portion of the ACF slice tp3 adhered to the substrate 3.

[0103] The video images captured (generated) by cameras 230 and 231 are used, for example, to determine abnormalities in the various mechanisms of the ACF pasting device 10, or displayed on a display device (not shown) for the operator to determine the presence or absence of abnormalities. In this embodiment, the video images generated by camera 230 are used to update distance information. Details regarding the distance information update process will be described later.

[0104] In this embodiment, the ACF pasting mechanism 20 includes two pasting mechanism units 220L and 220R, an X-axis track mechanism 228, a pasting base 229, and a camera 231.

[0105] The adhesion base 229 is a base for supporting two adhesion mechanism units 220L and 220R.

[0106] X-axis track mechanism 228 is disposed on the upper surface of adhesion base 229 along the X-axis direction. Two adhesion mechanism units 220L and 220R are freely arranged and mounted on the X-axis track mechanism 228 along the X-axis direction. In addition, the X-axis track mechanism 228 is provided with a changing mechanism for changing the spacing between the two adhesion mechanism units 220L and 220R.

[0107] The two adhesion mechanism units 220L and 220R are mechanisms for adhering the ACF slice tp3 to the substrate 3, and have the same structure.

[0108] For example, the adhesion mechanism units 220L and 220R respectively include a feed reel 221, a take-up section 222, an adhesion head 223, an adhesion support platform 224, a cutting unit 225, a camera 230, a feed roller 232, a pressing roller 233, and a guide roller 234.

[0109] For example, after multiple ACF slices tp3 are attached to the substrate 3 by the adhesion mechanism units 220L and 220R, the substrate moving mechanism 210 moves the substrate 3 to the position where the camera 231 takes pictures, and the camera 231 takes pictures.

[0110] Furthermore, the adhesion mechanism unit 220L and adhesion mechanism unit 220R can respectively adhere ACF slices tp3 to the same substrate 3, or they can respectively adhere ACF slices tp3 to different substrates 3. In addition, the ACF adhesion mechanism 20 can have one adhesion mechanism unit or more than three.

[0111] The control device 30 is a computer that controls the various components of the ACF pasting device 10 (specifically, the various components of the ACF pasting mechanism 20). For example, these components or the drive mechanisms used to drive these components are communicatively connected to the control device 30 via wireless or control lines, and perform a given operation under the control of the control device 30.

[0112] The control device 30 is implemented, for example, through a communication interface, a non-volatile memory for storing programs, a temporary storage area for executing programs (i.e., volatile memory), an input / output port for transmitting and receiving signals, and a CPU (Central Processing Unit) for executing programs.

[0113] The control device 30 includes a control unit 31, an update unit 32, and a storage unit 33.

[0114] The control unit 31 is a processing unit that controls the various actions (various operations) of each component of the ACF pasting mechanism 20, such as the supply unit 21, the cutting unit 22, the belt feeding mechanism 23, the crimping unit 24, and the camera unit 25.

[0115] For example, the control unit 31 repeatedly performs the cutting process of the cutting part 22, the feeding process of the feed mechanism 23, the crimping process of the crimping part 24, and the imaging process of the imaging unit 25 to repeatedly photograph the cut part, and repeatedly paste the ACF slice tp3 onto the substrate 3.

[0116] The update unit 32 is a processing unit that updates distance information based on the camera image obtained by the camera unit 25. Specifically, the update unit 32 updates the distance information based on the deviation amount (distance) of the cut-off portion in the camera image generated by the camera unit 25 (specifically, camera 230) from a given position.

[0117] Distance information is, for example, pre-stored in storage unit 33. Update unit 32 updates, for example, the distance information stored in storage unit 33.

[0118] For example, the control unit 31 or the update unit 32 calculates the given feed rate based on the distance information stored in the storage unit 33. Furthermore, for example, if the distance information has been updated, the control unit 31 or the update unit 32 uses the updated distance information to calculate the given feed rate.

[0119] Furthermore, the method for calculating a given feed rate based on distance information can be arbitrarily determined and is not particularly limited.

[0120] Furthermore, the given location can be arbitrarily determined and is not particularly limited. Information representing the given location is, for example, pre-stored in storage unit 33.

[0121] Furthermore, the updating unit 32 can also update the distance information based on multiple camera images. For example, the updating unit 32 updates the distance information based on the deviation of the cut portion from a given position in each of the multiple camera images generated by repeatedly executing the cutting process of the cutting unit 22, the crimping process of the crimping unit 24, the imaging process of the imaging unit 25, and the feed process of the feed mechanism 23. For example, the updating unit 32 calculates the average deviation of each of the multiple images from the given position and updates the distance information based on the calculated average value.

[0122] Alternatively, instead of using the average, you can use the median, maximum, or minimum value.

[0123] In addition, multiple camera images can be two or more.

[0124] Furthermore, the updating unit 32 can determine whether to update the distance information based on given conditions. For example, the control unit 31 can control the operation of the pressing unit 24 based on the determination result of the updating unit 32.

[0125] For example, the updating unit 32 determines whether to update the distance information based on the deviation of the cut-off portion in each of the multiple camera images from a given position.

[0126] In addition, the deviation may be the standard deviation, but the degree of deviation can be obtained by using variance or other methods, and can be calculated by any method.

[0127] For example, the update unit 32 updates the distance information if the deviation is less than a given threshold. On the other hand, for example, the update unit 32 does not update the distance information if the deviation is greater than or equal to the given threshold. For example, if the deviation is greater than or equal to the given threshold, the update unit 32 outputs an error message to notify the operator that the feed rate (tp) is not being fed at an appropriate feed rate. For example, the update unit 32 outputs the error message to the notification device described later, so that the notification device notifies the operator that the feed rate (tp) is not being fed at an appropriate feed rate.

[0128] Furthermore, the given threshold can be arbitrarily determined and is not particularly limited. Information representing the given threshold can, for example, be pre-stored in storage unit 33.

[0129] The control unit 31 or the update unit 32 may also output camera images and error messages to external devices. For example, the control unit 31 or the update unit 32 may output error messages to a notification device such as a display and / or a speaker to notify the operator that the feed rate of the device is not appropriate.

[0130] The control unit 31 and the update unit 32, and other processing units, are implemented, for example, by a processor and a control program executed by the processor and stored in a memory.

[0131] The storage unit 33 is a storage device that stores various data, such as the size of the substrate 3, the bonding position and direction of the ACF slice tp3, the operation of each component, the timing of the operation, and the timing of transferring the substrate 3 to the component pressing device located after the ACF bonding device 10, as well as the control program executed by the processing unit and the information used by the update unit 32 in determining the presence or absence of anomalies. The storage unit 33 is implemented, for example, by a flash memory or an HDD (Hard Disk Drive).

[0132] [Processing Steps]

[0133] Next, the processing steps of the ACF pasting device 10 according to the embodiment will be described in detail.

[0134] Figure 5 This is a flowchart illustrating the processing steps of the ACF pasting device 10 according to the embodiment. Figure 6 This diagram illustrates the specific processing steps of the pasting and imaging processes in the ACF pasting apparatus 10 according to the embodiment. Additionally, in Figure 6 The diagram only illustrates the structure for illustrative purposes; illustrations of parts of the ACF pasting mechanism 20, such as the adhesive support platform 224, are omitted.

[0135] First, the substrate moving mechanism 210 moves the substrate 3 (S110). Specifically, the control unit 31 controls the substrate moving mechanism 210 to place the end of the substrate 3 onto the adhesion support stage 224. More specifically, as Figure 6 As shown in (a), the substrate 3 is moved so that the position where the ACF slice tp3 is pasted on the substrate 3, i.e., the first pasting position, is located below the adhesive head 223. The first pasting position is the position where the electrode part 4 is arranged in the substrate 3, and it is the position from which the ACF slice tp3 is pasted.

[0136] Next, the cutting section 22 performs a cutting process, in which an ACF slice tp3 supported by the substrate layer tp1 is formed by cutting the ACF layer tp2 contained in the strip tp, which includes the substrate layer tp1 and the ACF layer tp2, supplied from the supply section 21 (S120). Specifically, the control section 31 controls the cutting section 22 to form the ACF slice tp3 supported by the substrate layer tp1. More specifically, as Figure 6 As shown in (b), the ACF slice tp3 is formed by cutting the ACF layer tp2 with the cutting unit 225.

[0137] Next, the belt feed mechanism 23 performs a belt feed process to position the cutting portion (also referred to simply as the cutting position) within the imaging area (within the imaging range) of the imaging unit 25 (specifically, the camera 230). In this belt feed process, the belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed (S130). Specifically, the control unit 31 controls the belt feed mechanism 23 to feed the belt tp so that the cutting position is located within the imaging area of ​​the imaging unit 25. More specifically, as... Figure 6 As shown in (c), move the band tp so that the cut section ( Figure 6 (c) The boundary between ACF layer tp2 and ACF slice tp3 is located above camera 230. The imaging area is, for example, the area within the field of view of camera 230.

[0138] In this embodiment, the belt feeding mechanism 23 performs belt feeding processing, in which the belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed from a first position for cutting to a second position for imaging processing by a given feed amount. This given feed amount is set based on distance information related to the distance between the cutting section 22 and the imaging section 25. For example, the control unit 31 calculates the given feed amount based on the distance information stored in the storage unit 33 and controls the belt feeding mechanism 23 to feed the belt tp with the calculated given feed amount (given length).

[0139] Next, the control unit 31 causes the imaging unit 25 (specifically, the camera 230) to capture an image of the cutting position (S140). Specifically, the imaging unit 25 performs an imaging process in which it captures an image of the cut portion of the ACF layer tp2, which is supported by the substrate layer tp1 included in the belt tp fed by the belt feed mechanism 23, to be cut off by the cutting process, thereby generating an image. In this way, the imaging unit 25 captures an image of the cut portion of the ACF layer tp2, which is supported by the substrate layer tp1, to be cut off by the cutting process before performing the crimping process.

[0140] Next, the updating unit 32 updates the distance information based on the camera image (S150). Specifically, the updating unit 32 updates the distance information based on the amount of deviation of the cut portion in the camera image from a given position.

[0141] Next, the belt feed mechanism 23 further performs a belt feed process to position the ACF slice tp3 at the crimping position. In this belt feed process, the belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed (S160). Specifically, the control unit 31 controls the belt feed mechanism 23 to feed the belt tp, so that the ACF slice tp3 moves to the position where it is crimped onto the substrate 3. More specifically, as... Figure 6As shown in (d), the ACF slice tp3 is moved between the adhesive head 223 and the first adhesive position.

[0142] In addition, in this example, Figure 6 The position of ACF slice tp3 shown in (c) and Figure 6 The position of ACF slice tp3 shown in (d) is the same. If the position of ACF slice tp3 during step S140 is the same as the position of ACF slice tp3 during step S170 (described later), step S160 may be omitted.

[0143] Next, the pressing unit 24 performs a pressing process (S170) to peel the ACF slice tp3 from the substrate layer tp1 and press it onto the substrate 3. Specifically, the pressing unit 24 peels the ACF slice tp3, supported by the substrate layer tp1 contained in the belt tp fed by the belt feeding mechanism 23, from the substrate layer tp1 and presses it onto the substrate 3. More specifically, the control unit 31 controls the pressing unit 24 to peel the ACF slice tp3 supported by the substrate layer tp1 from the substrate layer tp1 and press it onto the substrate 3. Further specifically, as Figure 6 As shown in (e), the ACF slice tp3 is adhered to the first adhesion position in the substrate 3. Furthermore, for example, as... Figure 6 As shown in (f), the substrate 3 is moved so that the ACF slice tp3 attached to the substrate 3 is positioned below the camera 231, and the camera 231 captures an image.

[0144] Next, the control unit 31 determines whether the pasting of the ACF slice tp3 on the substrate 3 is completely finished (S180).

[0145] When the control unit 31 determines that the pasting of all ACF slices tp3 on the substrate 3 is completed ("Yes" in S180), the process ends. For example, the control unit 31 controls the substrate moving mechanism 210 to transport the substrate 3 with the pasted ACF slices tp3 to the downstream, and transports a new substrate 3 from the upstream, and performs the process again from step S110.

[0146] On the other hand, if the control unit 31 determines that the pasting of the ACF slice tp3 on the substrate 3 is not completely finished ("No" in S180), it returns the process to step S110 and moves the substrate 3 to the position where the newly pasted ACF slice tp3 is placed. For example, the substrate 3 is moved so that... Figure 6 The second adhesive placement position shown in (f) is located below the adhesive head 223. The second adhesive placement position is the position where the electrode portion 4 is disposed in the substrate 3, and it is the position from which the ACF slice tp3 is attached.

[0147] By repeating this process, in the next step S110 and subsequent steps, the distance information updated to the appropriate value can be used to perform step S130.

[0148] Furthermore, the processing order of each step is the same, but can be arbitrarily changed. For example, step S150 can be executed after step S140, after step S170, or at any time interval.

[0149] Furthermore, step S150 can also be performed if step S140 has been performed a given number of times. In this case, for example, if step S140 has not been performed a given number of times, then step S160 is performed in the next step after step S140.

[0150] Figure 7 This is a diagram representing a camera image related to the implementation method. Specifically, Figure 7 This is a specific example of the image captured by camera 230 in step S140. More specifically, Figure 7 This refers to the image generated when the camera 230 captures a cut-off portion of the ACF slice tp3 located in the camera area of ​​the camera 230.

[0151] For example, the update unit 32 determines whether the deviation of the cut-off position in the X1 axis direction of the camera image from the reference position is greater than a given reference value determined based on a given feed rate. The given reference value is, for example, the reference deviation amount described above.

[0152] like Figure 7 As shown, for example, a reference position is pre-determined using a reference line at the center of the X1 axis in the captured image. Furthermore, for example, the update unit 32 calculates a virtual line representing the position of the cut-off portion (cut-off position), i.e., a cut-off line. For example, the update unit 32 calculates a straight line that approximates the shape of the cut-off portion in the captured image using a straight line, and uses this as the cut-off line. For example, the cut-off portion is the edge of the ACF slice tp3 located on the side of the ACF layer tp2. That is, the cut-off position is the location where the edge of the ACF slice tp3 located on the side of the ACF layer tp2 is situated. In this example, the cut-off portion is... Figure 7 The edge of the ACF slice tp3 shown is located on the negative X1 axis side. The cut-off line is, for example, a virtual line parallel to the edge of the ACF slice tp3 located on the ACF layer tp2 side. Specifically, the cut-off line is a virtual line used to approximate the cut-off portion as a straight line. In this example, the cut-off line is the boundary line used to approximate the boundary between ACF layer tp2 and ACF slice tp3 as a straight line.

[0153] For example, the updating unit 32 calculates the distance in the X1 direction between the baseline and the cutting line as the deviation.

[0154] The updating unit 32 updates the distance information when it determines that the deviation of the cut position in the X1-axis direction of the camera image from the reference position is greater than a given reference value. On the other hand, the updating unit 32 does not update the distance information when it determines that the deviation of the cut position in the X1-axis direction of the camera image from the reference position is less than or equal to a given reference value.

[0155] Furthermore, the given reference value can be arbitrarily determined in advance and is not particularly limited. The information representing the given reference value can be stored in the storage unit 33 in advance, for example.

[0156] Furthermore, the given reference value can be a single value or a value within a specified range. That is, for example, the update unit 32 can also determine whether the deviation amount is within a given reference range determined based on the given feed rate. For example, if the update unit 32 determines that the deviation amount of the cut position in the X1-axis direction of the camera image from the reference position is outside the given reference range, it updates the distance information. On the other hand, if the update unit 32 determines that the deviation amount of the cut position in the X1-axis direction of the camera image from the reference position is within the given reference range, it does not update the distance information.

[0157] Furthermore, the updating unit 32 can determine whether to update the distance information based on the deviation of the deviation calculated from multiple camera images.

[0158] Figure 8 This is a flowchart illustrating a modified example of the processing steps of the ACF adhesive device 10 according to the embodiment. Additionally, in Figure 8 In the explanation, with Figure 5 The differences in the flowchart shown are explained focusing on these points.

[0159] First, the substrate moving mechanism 210 moves the substrate 3 (S110).

[0160] Next, the cutting section 22 performs a cutting process, in which an ACF slice tp3 supported by the substrate layer tp1 is formed by cutting the ACF layer tp2 contained in the strip tp, which includes the substrate layer tp1 and the ACF layer tp2, supplied from the supply section 21.

[0161] Next, the feed mechanism 23 performs a feed process to position the cut-off part (also referred to as the cut-off position) within the imaging area (within the imaging range) of the camera unit 25 (specifically, the camera 230). In this feed process, the feed includes the ACF slice tp3 supported by the substrate layer tp1 (S130).

[0162] Next, the control unit 31 causes the camera unit 25 (specifically the camera 230) to capture an image of the cut-off position (S140).

[0163] Next, the update unit 32 determines whether the camera unit 25 has captured images of the cut-off position a given number of times (S151). In other words, the update unit 32 determines whether the processing steps S110-S140 and S160-170 have been performed a given number of times. That is, the update unit 32 determines whether the camera unit 25 has generated a given number of captured images.

[0164] If the update unit 32 determines that the camera unit 25 has not captured the cut position a given number of times (S151 "No"), the belt feed mechanism 23 positions the ACF slice tp3 at the crimping position by performing a further belt feed process, wherein the belt feed process includes feeding the ACF slice tp3 supported by the substrate layer tp1 (S160).

[0165] Next, the pressing section 24 performs a pressing process (S170) to peel the ACF slice tp3 from the substrate layer tp1 and press it onto the substrate 3.

[0166] Next, the control unit 31 determines whether the pasting of the ACF slice tp3 on the substrate 3 is completely finished (S180).

[0167] When the control unit 31 determines that the pasting of all ACF slices tp3 on the substrate 3 has been completed ("Yes" in S180), the process ends.

[0168] On the other hand, if the control unit 31 determines that the pasting of the ACF slice tp3 on the substrate 3 has not been completely completed (S180 "No"), the process returns to step S110 and the substrate 3 is moved to the position where the new ACF slice tp3 is pasted.

[0169] By repeating the process a given number of times, for example in step S151, if the update unit 32 determines that the camera unit 25 has captured the cut position a given number of times ("Yes" in S151), the average value of the deviation calculated based on the multiple camera images generated by the camera unit 25 is calculated (S152).

[0170] Next, the update unit 32 determines whether the average value of the calculated deviation is greater than the given reference value (S153).

[0171] If the update unit 32 determines that the average value of the calculated deviation is below the given reference value (S153 "No"), for example, the count of the number of shots is initialized and the process is transferred to step S160. Therefore, if the deviation is greater than the given reference value, the distance information is not updated and each process is repeated. For example, if the given number of shots are taken again, the processes in steps S152 and S153 are executed.

[0172] Here, if the update unit 32 determines that the average value of the calculated deviation is greater than the given reference value ("Yes" in S153), it calculates the deviation of the calculated deviation (S154).

[0173] Next, the update unit 32 determines whether the calculated deviation is above a given threshold (S155).

[0174] If the update unit 32 determines that the calculated deviation is insufficient for a given threshold (S155 "No"), it updates the distance information based on the average value of the calculated deviation (S156). Furthermore, for example, the update unit 32 initializes the count of the number of camera shots and moves the processing to step S160.

[0175] On the other hand, if the updating unit 32 determines that the calculated deviation is above a given threshold ("Yes" in S155), it outputs an error message (S157). For example, if the control unit 31 receives an error message, it stops the cutting unit 22, the feed mechanism 23, the pressing unit 24, and the camera unit 25. As a result, the ACF bonding device 10 stops abruptly, halting all processes for bonding the CF slice tp3 to the substrate 3.

[0176] Alternatively, after outputting error message 157, the processing can be transferred to step S160.

[0177] (Effects, etc.)

[0178] The following examples illustrate techniques obtained from the disclosure of this specification and explain the effects obtained from the illustrated techniques.

[0179] Technology 1 is an ACF bonding apparatus 10, comprising: a supply unit 21 for supplying a strip tp including a substrate layer tp1 and an ACF layer tp2; a cutting unit 22 for performing a cutting process in which the ACF layer tp2 contained in the strip tp supplied from the supply unit 21 is cut to form an ACF slice tp3 supported by the substrate layer tp1; a pressing unit 24 for performing a pressing process in which the ACF slice tp3 is peeled from the substrate layer tp1 and pressed onto a substrate 3; and an imaging unit 25 for performing an imaging process before the pressing process, in which the imaging process is performed on the substrate... A camera image is generated by photographing the cut portion of the ACF layer tp2 supported by the substrate layer tp1, which is cut by a cutting process; a belt feed mechanism 23 performs a belt feed process in which a belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed from a first position where the cutting process is performed to a second position where the camera process is performed by a given feed amount, which is set based on distance information related to the distance between the cut portion 22 and the camera portion 25; and an update unit 32 updates the distance information based on the deviation amount of the cut portion in the camera image from the given position.

[0180] The distance between the cutting section 22 and the imaging section 25 is, for example, the distance designed in the ACF bonding device 10. However, due to manufacturing errors in the ACF bonding device 10, the actual distance between the cutting section 22 and the imaging section 25 may differ from the designed distance. Consequently, a given feed rate set based on the distance information representing the designed distance may not be suitable for bonding the ACF slice tp3 to the appropriate position on the substrate 3. Therefore, the updating section 32 updates the distance information based on the imaging image. Accordingly, the distance information is updated to correspond to the actual state of the ACF bonding device 10. Thus, the given feed rate set based on the distance information is updated to correspond to the actual state of the ACF bonding device 10. Therefore, according to the ACF bonding device 10 of Art 1, the feed rate of the tape feed mechanism 23 with tp can be appropriately controlled.

[0181] Furthermore, the initial value of the distance information may represent, for example, the distance between the position of the cutter 225b of the cutting section 22 when it cuts the ACF layer tp2 and the position of the camera center in tp when the camera unit 25 captures an image of the cutting position, but it is not particularly limited and can be arbitrarily determined. For example, the initial value of the distance information can be calculated using the position of the abutment 225a of the cutting section 22 or the position of the camera 230 of the camera unit 25.

[0182] Based on the ACF pasting device 10 described in Technology 1, Technology 2 updates the distance information based on the deviation of the cut portion from a given position in each of the multiple camera images generated by repeatedly performing the cutting process, crimping process, camera process, and feed process.

[0183] Therefore, since the distance information is updated based on multiple camera images, the distance information can be updated to a more suitable value.

[0184] Based on the ACF pasting device 10 described in Technology 2, Technology 3 has an updating unit 32 that determines whether to update the distance information based on the deviation of the cut portion in each of the multiple camera images from a given position.

[0185] When the deviation is large, for example, if the feed mechanism 23 itself malfunctions, there is a high probability of adverse conditions occurring outside of the distance information. Therefore, by determining whether to update the distance information based on the deviation, unnecessary updates to the distance information can be suppressed.

[0186] Based on the ACF pasting device 10 described in Technology 3, Technology 4 updates the distance information when the deviation is less than a given threshold.

[0187] Therefore, unnecessary updates to distance information can be suppressed.

[0188] Technique 5 is an ACF bonding method. The cutting section 22 performs a cutting process, in which the ACF layer tp2 contained in the strip tp supplied from the supply section 21 (which supplies strip tp containing a substrate layer tp1 and an ACF layer tp2) is cut to form an ACF slice tp3 supported by the substrate layer tp1 (S120). The pressing section 24 performs a pressing process, in which the ACF slice tp3 is peeled from the substrate layer tp1 and pressed onto the substrate 3 (S170). The imaging section 25 performs an imaging process before the pressing process, in which the ACF slice tp3 supported by the substrate layer tp1 is imaged. The cut portion of the CF layer tp2, which is cut by the cutting process, is photographed to generate a photographic image (S140). The belt feed mechanism 23 performs a belt feed process, in which the belt tp, including the ACF slice tp3 supported by the substrate layer tp1, is fed from the first position of the cutting process to the second position of the photographing process by a given feed amount. The given feed amount is set based on distance information related to the distance between the cutting portion 22 and the photographing portion 25 (S130). The updating unit 32 updates the distance information based on the deviation amount of the cutting portion in the photographic image from the given position (S150).

[0189] Accordingly, it achieves the same effect as the ACF adhesive device 10 involved in technology 1.

[0190] (Other implementation methods)

[0191] The above describes the ACF pasting device and the like in this embodiment based on the above embodiments. However, the present invention is not limited to the above embodiments.

[0192] For example, the processing steps in the above embodiments do not necessarily have to be processed in the order shown in the flowchart in a time sequence, and may also include parallel or individual processing.

[0193] Furthermore, for example, all or part of the components of the ACF pasting device, such as the control unit and the update unit, can be constructed using dedicated hardware, or they can be implemented by executing software programs suitable for each component. Each component can also be implemented by a program execution unit such as a CPU or processor reading and executing the software program recorded on a recording medium such as an HDD or semiconductor memory.

[0194] Furthermore, the processing unit of the ACF adhesive device can be composed of one or more electronic circuits. These electronic circuits can be general-purpose circuits or dedicated circuits.

[0195] One or more electronic circuits may include semiconductor devices, ICs, or LSIs (Large Scale Integration). ICs or LSIs can be integrated on a single chip or on multiple chips. Here, they are referred to as ICs or LSIs, but the terminology varies depending on the degree of integration; they may be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration). Furthermore, FPGAs (Field Programmable Gate Arrays), which are programmed after the LSI is manufactured, can be used for the same purpose.

[0196] Furthermore, the present invention can be implemented not only as an ACF pasting device, but also as a program comprising the processing steps of each component of the ACF pasting device, and a computer-readable recording medium such as a DVD (Digital Versatile Disc) recording the program. That is, the above-described general or specific embodiments can be implemented by a system, device, integrated circuit, computer program, or computer-readable non-transitory recording medium, or by any combination of a system, device, integrated circuit, computer program, and recording medium.

[0197] Furthermore, the present invention also includes forms obtained by implementing various modifications to each embodiment that can be conceived by those skilled in the art, and forms achieved by arbitrarily combining the constituent elements and functions of each embodiment without departing from the spirit of the present invention.

[0198] Industrial availability

[0199] This invention can be used in an ACF bonding apparatus for bonding ACF to a substrate.

Claims

1. An ACF (Anchor Fluidized Ink) adhesive device, comprising: The supply department is used to supply tapes including a substrate layer and an ACF layer. The cutting section performs a cutting process in which an ACF slice supported by the substrate layer is formed by cutting the ACF layer contained in the strip supplied from the supply section. The pressing part is subjected to a pressing process in which the ACF slice is peeled from the substrate layer and pressed onto the substrate. The camera unit performs imaging processing before the pressing process, in which it captures an image of the cut portion of the ACF layer supported by the substrate layer that has been cut by the cutting process. A belt feeding mechanism performs belt feeding processing, in which the belt, including the ACF slice supported by the substrate layer, is fed from a first position where the cutting process is performed to a second position where the imaging process is performed by a given feed amount, the given feed amount being set based on distance information related to the distance between the cutting portion and the imaging portion. and The updating unit updates the distance information based on the amount of deviation of the cut-off portion in the camera image from a given position.

2. The ACF pasting device according to claim 1, wherein, The updating unit updates the distance information based on the deviation of the cut portion from the given position in each of the multiple camera images generated by repeatedly executing the cutting process, the crimping process, the camera process, and the feed process.

3. The ACF pasting device according to claim 2, wherein, The updating unit determines whether to update the distance information based on the deviation of the cut-off portion in each of the plurality of camera images from the given position.

4. The ACF pasting device according to claim 3, wherein, The updating unit updates the distance information if the deviation is less than a given threshold.

5. An ACF pasting method, The cutting section performs a cutting process in which an ACF slice supported by the substrate layer is formed by cutting the ACF layer contained in the strip supplied from the supply section, which is used to supply the strip containing the substrate layer and the ACF layer. The pressing part undergoes a pressing process, in which the ACF slice is peeled from the substrate layer and pressed onto the substrate. Before the crimping process, the camera unit performs imaging processing, in which it captures an image of the cut portion of the ACF layer, which is supported by the substrate layer, that has been cut off by the cutting process. A belt feeding mechanism performs belt feeding processing, in which the belt, including the ACF slice supported by the substrate layer, is fed from a first position where the cutting process is performed to a second position where the imaging process is performed by a given feed amount, the given feed amount being set based on distance information related to the distance between the cutting section and the imaging section. The updating unit updates the distance information based on the amount of deviation of the cut-off portion in the camera image from a given position.

Images