Infrared sensor turret for reflow oven

Abstract

An infrared sensor positioned in a reflow oven includes a reflow oven and a first IR sensor turret suspended above a conveyor surface of the reflow oven, wherein directional movement of the first IR sensor turret matches directional movement of the conveyor surface. A method for managing an IR sensor turret positioned in a reflow oven includes positioning, by a first IR sensor turret, a point of interest on a PCBA, wherein the PCBA is positioned on a conveyor in the reflow oven. The method further includes tracking, by the first IR sensor turret, a point of interest on the PCBA, wherein the PCBA is moving along the conveyor in the reflow oven. The method further includes capturing, by the first IR sensor turret, a first set of thermal data at the point of interest for the first sub-region of the reflow oven.

Description

Background Technology

[0001] This disclosure generally relates to reflow ovens, and more specifically, to infrared sensor turrets for reflow ovens.

[0002] Surface Mount Technology (SMT) is the primary method for assembling electronic components on printed circuit boards (PCBs). It utilizes a reflow oven to heat and melt solder paste, creating a mechanical, electrical, and metallurgical bond between the electronic component and the PCB. Thermal profiling represents a critical aspect of ensuring a reliable printed circuit board assembly (PCBA), where the electronic component is successfully connected to multiple PCBs. Thermal profiling involves measuring the temperature of the PCB and electronic components during the reflow process to ensure specific temperatures are reached and maintained for an appropriate amount of time, while controlling an acceptable rate of temperature change. Thermal profiling optimizes the reflow process to ensure the solder melts and flows properly, while preventing overheating of the electronic component and / or PCB, which could lead to permanent damage. Summary of the Invention

[0003] One aspect of the present invention discloses an apparatus for positioning an infrared (IR) sensor turret in a reflow oven, the apparatus comprising the reflow oven and a first IR sensor turret suspended above a conveyor surface of the reflow oven, wherein the directional movement of the first IR sensor turret matches the directional movement of the conveyor surface.

[0004] Another aspect of the present invention discloses a method for managing an infrared (IR) sensor turret positioned in a reflow oven, the method comprising positioning a point of interest on a printed circuit board assembly (PCBA) by a first IR sensor turret, wherein the PCBA is positioned on a conveyor in the reflow oven. The method further comprises tracking the point of interest on the PCBA by the first IR sensor turret, wherein the PCBA is moving along the conveyor in the reflow oven. The method includes capturing a first set of thermal data at the point of interest for a first sub-region of the reflow oven by the first IR sensor turret. Attached Figure Description

[0005] Figure 1 A side view of a multi-zone reflow oven with multiple infrared sensor turrets according to an embodiment of the present invention is depicted.

[0006] Figure 2A A side view of a multi-zone reflow oven with a first infrared sensor turret tracking printed circuit board assemblies in a plurality of infrared sensor turrets according to an embodiment of the present invention is depicted.

[0007] Figure 2BA side view of a multi-zone reflow oven is depicted according to an embodiment of the present invention, showing a first infrared sensor turret, a second infrared sensor turret for tracking a printed circuit board assembly, and a third infrared sensor turret intended for the printed circuit board assembly.

[0008] Figure 2C A side view of a multi-zone reflow oven is depicted according to an embodiment of the invention, showing a first infrared sensor turret for anticipating another printed circuit board assembly, and second and third infrared sensor turrets for tracking the printed circuit board assembly.

[0009] Figure 2D A side view of a multi-zone reflow oven is depicted according to an embodiment of the invention, showing a first infrared sensor turret, a second infrared sensor turret intended to accommodate another printed circuit board assembly, and a third infrared sensor turret for tracking the printed circuit board assembly.

[0010] Figure 3A A side view of an infrared sensor turret with a fully rotating turret according to an embodiment of the present invention is depicted.

[0011] Figure 3B A bottom view of an infrared sensor turret with a rotating turret according to an embodiment of the present invention is depicted.

[0012] Figure 4A A side view of an infrared sensor turret having a bidirectional turret and a rotating base according to an embodiment of the present invention is depicted.

[0013] Figure 4B A bottom view of an infrared sensor turret having a bidirectional turret and a rotating base according to an embodiment of the present invention is depicted.

[0014] Figure 5 This is a functional block diagram illustrating a computing environment according to an embodiment of the present invention.

[0015] Figure 6 A flowchart of an infrared sensor turret procedure for managing multiple infrared sensor turrets in a reflow oven, according to an embodiment of the present invention, is described. Detailed Implementation

[0016] This document discloses detailed embodiments of the claimed structures and methods; however, it is to be understood that the disclosed embodiments are merely illustrative of the claimed structures and methods, which can be implemented in various forms. The invention can be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. In this description, details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the presented embodiments. It will be understood that the singular forms “a,” “an,” and “the” include plural referents unless the context clearly indicates otherwise. Thus, for example, unless the context clearly indicates otherwise, a reference to “component surface” includes a reference to one or more such surfaces.

[0017] According to an aspect of the invention, an apparatus is provided comprising a reflow oven and a first infrared (IR) sensor turret suspended above a conveyor surface of the reflow oven, wherein directional movement of the first IR sensor turret matches directional movement of the conveyor surface. A first advantage of the invention includes preventing cards from being scrapped in a thermal profile testing carriage, thus preventing financial losses associated with the cards and installed electronic components, thermocouple attachments, and engineering / technician labor / processing time. A second advantage of the invention includes improved control and accuracy of thermal formulations for multiple temperature zones of the reflow oven based on thermal data collected by the IR sensor turret. A third advantage of the invention includes easier detection of overheating (i.e., exceeding a threshold) through line monitoring of temperature-sensitive components on printed circuit board assemblies (PCBAs) positioned on the conveyor surface in the reflow oven, thereby preventing runaway situations and reducing rework of multiple PCBAs along the manufacturing line. A fourth advantage of the invention includes providing traceability for each PCBA within the assembly line, each PCBA passing through a reflow oven with an IR sensor turret.

[0018] In an embodiment, the device may further include an IR sensor in a first IR sensor turret pointing toward the top surface of the conveyor surface, wherein directional movement of the first IR sensor turret specifies directional movement of the IR sensor of the first IR sensor turret. An advantage is that the IR sensor tracks the movement of points of interest (e.g., electronic components) on the PCBA as it travels through the reflow oven on the top surface of the conveyor surface. In an embodiment, the device may further include an optical camera having a laser pointing toward the first IR sensor turret pointing toward the top surface of the conveyor surface. An advantage is that the optical camera with the laser can be used to identify points of interest on the PCBA as it travels through the reflow oven on the top surface of the conveyor surface. In an embodiment, the device may further include a first heating element positioned in a first temperature region of the reflow oven, wherein the operating range of the first IR sensor turret covers a first sub-region of the reflow oven, which is located below at least a portion of the first heating element on the conveyor surface. Advantages include a first IR sensor turret that provides thermal data readout coverage for a first sub-region of the reflow oven, which is located below a first heating element having a first temperature zone.

[0019] In an embodiment, the device may further include a second heating element positioned in a second temperature zone of the reflow oven, adjacent to a first heating element, wherein the operating range of the first IR sensor turret covers a second sub-region of the reflow oven, which is located below at least a portion of the second heating element on the conveyor surface. An advantage includes that the first IR sensor turret also provides thermal data readout coverage for the second sub-region of the reflow oven, located below the second heating element having the second temperature zone. In an embodiment, the device may further include a second IR sensor turret suspended above the conveyor surface of the reflow oven, wherein the directional movement of the second IR sensor turret matches the directional movement of the conveyor surface. An advantage includes that the second IR sensor turret provides coverage of the conveyor surface that the first IR sensor turret may not reach. In an embodiment, the device may further include an operating range of the second IR sensor turret covering a third sub-region of the reflow oven, which is located below at least another portion of the second heating element on the conveyor surface. Advantages include providing thermal data readout coverage for a third sub-region of the reflow oven located below a second heating element with a second temperature zone.

[0020] In an embodiment, the apparatus may further include a second sub-region of the reflow oven located below at least a portion of the second heating element on the conveyor surface, the second sub-region of the reflow oven at least partially overlapping with a third sub-region of the reflow oven located below at least a portion of the second heating element on the conveyor surface. Advantages include providing two sets of thermal data for the partially overlapping area of ​​the second and third sub-regions.

[0021] In one embodiment, the device may further include a pivot ball of a first IR sensor turret mechanically coupled to a base, wherein an optical camera and an IR sensor having a laser of the first IR sensor turret protrude from the pivot ball. Advantages include the ability of the IR sensor and optical camera to rotate in any direction specified by the movement of the pivot ball of the first IR sensor turret. In another embodiment, the device may further include a pivot ball that rotates relative to the base in multiple directions. Advantages include a base that remains fixed relative to the pivot ball, which can rotate in any direction (i.e., multiple directions). In yet another embodiment, the device may further include a pivot ball that rotates bidirectionally relative to the base, and the base that rotates bidirectionally. Advantages include simplifying the mechanism for moving the IR sensor and optical camera by allowing both the base and the pivot ball to move independently.

[0022] In one embodiment, the device may further include a first IR sensor turret suspended in a first gap between the first heating element and the second heating element. Advantages include utilizing the first gap present between the two heating elements in the reflow oven. In another embodiment, the device may further include a first IR sensor turret mechanically coupled to the first heating element. Advantages include the possibility of retrofitting a reflow oven with the first IR sensor turret to the first heating element. In another embodiment, the device may further include a first IR sensor turret mechanically coupled to the second heating element. Advantages include the possibility of retrofitting a reflow oven with the first IR sensor turret to the second heating element. In another embodiment, the device may further include a first IR sensor turret mechanically coupled to a top portion within the inner surface of the reflow oven. Advantages include the possibility of retrofitting a reflow oven with the first IR sensor turret to the inner surface of a first gap within the reflow oven, between the first and second heating elements.

[0023] According to an aspect of the invention, a computer-implemented method is provided, comprising positioning a point of interest on a printed circuit board assembly (PCBA) via a first infrared (IR) sensor turret, wherein the PCBA is positioned on a conveyor in a reflow oven. The method may further include tracking the point of interest on the PCBA via the first IR sensor turret, wherein the PCBA is moving along the conveyor in the reflow oven. The method also includes capturing a first set of thermal data at the point of interest for a first sub-region of the reflow oven via the first IR sensor turret. A first advantage of the invention includes preventing cards from being scrapped in thermal profile testing carriages, thus preventing financial losses associated with the cards and installed electronics, thermocouple attachments, and engineering / technical labor / processing time. A second advantage of the invention includes improved control and accuracy of thermal formulations for multiple temperature zones of the reflow oven based on the thermal data collected by the IR sensor turret. A third advantage of the invention includes easier detection of overheating (i.e., exceeding a threshold) by monitoring the lines of temperature-sensitive components on the printed circuit board assembly (PCBA) positioned on the conveyor surface in the reflow oven, thereby preventing runaway situations and reducing rework of multiple PCBAs along the manufacturing line. A fourth advantage of the invention includes providing traceability for each PCBA within the assembly line, each PCBA passing through a reflow oven with an IR sensor turret.

[0024] In one embodiment, the method may further include detecting the edge of a card for the PCBA by a first IR sensor turret. Advantages include using the edge of the card for the PCBA as a reference point to identify points of interest on the PCBA. In another embodiment, the method may further include a first optical camera having a laser of the first infrared sensor turret to detect the edge of the card for the PCBA. Advantages include using a first optical camera with a laser to detect the edge of the card for the PCBA as a reference point to identify points of interest on the PCBA. In yet another embodiment, the method may further include a first IR sensor of the first infrared sensor turret that detects the edge of the card for the PCBA based on a temperature change between the temperature of heated air in the reflow oven and the surface temperature of the edge of the card for the PCBA. Advantages include using an IR sensor turret with only an IR sensor, wherein the IR sensor can detect the edge of the card.

[0025] In embodiments, the method may further include, in response to determining that a second IR sensor turret is available in a reflow oven, using the second infrared (IR) sensor turret to locate a point of interest on the PCBA. The method may also include using the second IR sensor turret to track the point of interest on the PCBA. The method may further include using the second IR sensor turret to capture a second set of thermal data at the point of interest for a second sub-region of the reflow oven. Advantages include utilizing the second IR sensor turret to provide additional coverage of the second sub-region to collect the second set of thermal data at the point of interest on the PCBA. In embodiments, the method may further include configuring a first IR sensor turret from a final position to a desired position to detect another edge of another card for another PCBA positioned on a conveyor in the reflow oven, wherein movement between the final and desired positions defines the operating range of the first IR sensor turret. Advantages include positioning the first IR sensor turret at a position for anticipated arrival of another PCBA traveling along a conveyor in the reflow oven.

[0026] In an embodiment, the method may further include detecting another edge of another card for another PCBA by a first IR sensor turret. Advantages include utilizing the edge of a card in the PCBA as a reference point to identify points of interest on another PCBA in a large-scale production environment, where multiple PCBAs are manufactured and fed through a reflow oven. In an embodiment, the method may further include a portion of a first sub-region overlapping with a portion of a second sub-region. Advantages include providing two sets of thermal data for the partially overlapping area of ​​the first and second sub-regions. In an embodiment, the method may further include a first sub-region that corresponds at least to a first temperature region associated with a first heating element in the reflow oven and a portion of a second temperature region associated with a second heating element in the reflow oven. Advantages include the association of the first and second heating elements with the thermal data for the first sub-region, allowing the first and / or second heating elements to be adjusted based on abnormal temperature readings (e.g., exceeding an upper limit threshold). In an embodiment, the method may further include a second sub-region that corresponds at least to a portion of a second temperature region associated with a second heating element in the reflow oven and a third temperature region associated with a third heating element in the reflow oven. Advantages include the correlation of the second and third heating elements with the thermal data of the second sub-region, which allows the second and / or third heating elements to be adjusted based on abnormal temperature readings (e.g., below a lower threshold).

[0027] Figure 1A side view of a multi-zone reflow oven with multiple infrared sensor turrets according to an embodiment of the present invention is depicted. An enhanced view of a surface mount technology (SMT) reflow oven 100 is shown, wherein the top portion 102 of the reflow oven 100 includes four temperature zones. A typical reflow oven 100 includes a top portion 102 and a lower portion ( Figure 1 (Not shown in the image), wherein a first plurality of heating element sets in the top portion 102 and a second plurality of heating element sets in the lower portion provide the heat required for the reflow soldering process. In an enhanced view of the reflow oven 100, four temperature zones shown are designated as a first temperature zone 104, a second temperature zone 106, a third temperature zone 108, and a fourth temperature zone 110. A first gap 112 separates the first temperature zone 104 and the second temperature zone 106 in the top portion 102, a second gap 114 separates the second temperature zone 106 and the third temperature zone 108 in the top portion 102, and a third gap 116 separates the third temperature zone 108 and the fourth temperature zone 110 in the top portion 102.

[0028] A first heating element 118 located in a first temperature zone 104 within the top portion 102 is adjacent to a second heating element 120 located in a second temperature zone 106 within the top portion 102. The second heating element 120 located in the second temperature zone 106 within the top portion 102 is adjacent to a third heating element 122 located in a third temperature zone 108 within the top portion 102. The third heating element 122 located in the third temperature zone 108 within the top portion 102 is adjacent to a fourth heating element 124 located in a fourth temperature zone 110 within the top portion 102. Each of the first temperature zone 104, second temperature zone 106, third temperature zone 108, and fourth temperature zone 110 may include another set of heating elements located in the lower portion of the reflow oven 100. Figure 1 Not shown in the image.

[0029] A first infrared (IR) sensor turret 126 is positioned in a first gap 112, a second IR sensor turret 128 is positioned in a second gap 114, and a third IR sensor turret 130 is positioned in a third gap 116. In one embodiment, the first sensor turret 126, the second IR sensor turret 128, and the third sensor turret 130 are mechanically coupled to the inner surface of the top portion 102 of the reflow oven 100, wherein each of the first sensor turret 126, the second IR sensor turret 128, and the third sensor turret 130 is suspended above a conveyor surface 132. Each of the first sensor turret 126, the second IR sensor turret 128, and the third sensor turret 130 can be matched to the directional movement of the conveyor surface 132. In another embodiment, a first sensor turret 126 is mechanically coupled to a first heating element 118 and / or a second heating element 120, a second IR sensor turret 128 is mechanically coupled to a second heating element 120 and / or a third heating element 122, and a third sensor turret 130 is mechanically coupled to a third heating element 122 and / or a fourth heating element 124, wherein each of the first sensor turret 126, the second IR sensor turret 128, and the third sensor turret 130 is suspended above the conveyor surface 132.

[0030] Each of the first sensor turret 126, the second IR sensor turret 128, and the third sensor turret 130 is suspended above the conveyor surface 132, such that the movement of the IR sensors of each of the three turrets provides either complete coverage or overlapping complete coverage of the conveyor surface 132. Complete coverage indicates that the length and width of a sub-region of the conveyor surface 132 are covered by one IR sensor, while overlapping complete coverage indicates that the length and width of a sub-region of the conveyor surface 132 are covered by two or more IR sensors. A sub-region represents a portion (i.e., one or more temperature zones) below one or more heating elements in a reflow oven. The conveyor surface 132 can be a portion of a track-based or belt-based conveyor system. One or more actions performed by each of the first sensor turret 126, the second IR sensor turret 128, and the third sensor turret 130 are controlled by an IR sensor turret program 600, which will refer to... Figure 5 and Figure 6 Further detailed discussion.

[0031] In this embodiment, the printed circuit board assembly (PCBA) 134 includes electronic components 136 disposed on a printed circuit board (PCB) 138, wherein solder paste temporarily attaches the electronic components 136 to the PCB 138 until the reflow soldering process is completed. In another embodiment, the PCBA 134 includes electronic components 136 temporarily attached to the top and bottom portions of the PCB 138. The reflow soldering process causes the solder paste to become molten, which, upon cooling, forms permanent solder joints between the electronic components 136 of the PCBA 134 and the PCB 138. The PCBA 134 is disposed on top of a conveyor surface 132, wherein directional arrows 140 indicate the direction of movement of the PCBA 134 through the reflow oven 100. Therefore, the movement of the PCBA 134 along the conveyor surface 132 includes moving from a first temperature region 104 to a second temperature region 106, from the second temperature region 106 to a third temperature region 108, and from the third temperature region 108 to a fourth temperature region 110.

[0032] As PCBA 134 passes through the first temperature region 104, the first IR sensor turret 126 locates and captures temperature data at a point of interest, such as from a specific electronic component of electronic element 136 on PCB 138. As PCBA 134 passes between the first temperature region 104 and the second temperature region 106, the first IR sensor turret 126 captures temperature data at the point of interest, while the second IR sensor turret 128 locates and begins capturing temperature data at the point of interest. As PCBA 134 passes through the second temperature region 106, the second IR sensor turret 128 continues capturing temperature data at the point of interest, while the first IR sensor turret 126 is configured to wait for another PCBA 134 (…). Figure 1 (Not shown) is positioned along the conveyor surface 132. As the PCBA 134 passes between the second temperature region 106 and the third temperature region 108, the second IR sensor turret 128 continues to capture temperature data at the point of interest, while the third IR sensor turret 130 is positioned and begins capturing temperature data at the point of interest. When the PCBA 134 passes through the third temperature region 108, the third IR sensor turret 130 continues to capture temperature data at the point of interest, while the second IR sensor turret 128 is positioned to wait for another PCBA 134 (…). Figure 1 (Not shown) In the position where it travels along the conveyor surface 132. As the PCBA 134 passes between the third temperature zone 108 and the fourth temperature zone 110, the third IR sensor turret 130 continues to capture temperature data at the point of interest until the PCBA 134 passes through the fourth temperature zone 110 and leaves along the conveyor surface 132 to enter one or more cooling zones of the reflow oven 100, where it is located. Figure 1 Not shown in the image. Figures 2A to 2D The diagram shows the movement of PCBA 134 through the four temperature zones of reflow oven 100.

[0033] Figure 2A A side view of a multi-zone reflow oven with a first infrared sensor turret tracking printed circuit board assemblies in a plurality of infrared sensor turrets according to an embodiment of the invention is depicted. When the PCBA 134 enters a first temperature zone 104, the first IR sensor turret 126 positions the edge of the PCBA 134, and based on the positioned edge in the PCBA 134, the first IR sensor turret 126 positions points of interest on the PCBA 134. A conveyor surface 132 may utilize clamps to secure the PCBA 134 to the conveyor surface 132 as it travels through the reflow oven 100. Based on the size of the clamps and the spacing between other clamps on the conveyor surface 132, the first IR sensor turret 126 may position the edge of the PCBA 134. Alternatively, the first IR sensor turret 126 may position the edge of the PCBA 134 based on captured temperature changes, since there is a temperature difference between the top surface of the PCBA 134 and the top surface of the conveyor surface 132. In this embodiment, a first electronic component among the electronic components 136 on the PCB 138 represents the point of interest located by the first IR sensor turret 126. As the PCBA 134 passes through the first temperature zone 104, the first IR sensor turret 126 captures temperature data at the point of interest. Based on the direction of travel toward the conveyor surface 132 as indicated by the directional arrow 140 and the speed at which the conveyor surface 132 moves, the second IR sensor turret 128 anticipates the arrival of the PCBA 134 on the conveyor surface 132 by transitioning from the standby position 202 to the intended position 204.

[0034] Figure 2BA side view of a multi-zone reflow oven, comprising a first infrared sensor turret, a second infrared sensor turret, and a third infrared sensor turret for tracking printed circuit board assemblies, according to an embodiment of the invention, is depicted. As the PCBA 134 passes between a first temperature zone 104 and a second temperature zone 106, the second IR sensor turret 128 positions the edge of the PCBA 134, and based on the positioned edge of the PCBA 134, the second IR sensor turret 128 positions the point of interest on the PCBA 134 tracked by the first IR sensor turret 126. As the PCBA 134 passes through the second temperature zone 106, both the first IR sensor turret 126 and the second IR sensor turret 128 capture temperature data at the point of interest. In cases where both the first IR sensor turret 126 and the second IR sensor turret 128 capture temperature data, differences can be identified, and any faulty IR sensor turret can be repaired or replaced. Based on the direction of travel toward the conveyor surface 132 as specified by the directional arrow 140 and the moving speed of the conveyor surface 132, the third IR sensor turret 130 anticipates the arrival of the PCBA 134 on the conveyor surface 132 by switching from the standby position 202 to the expected position 204.

[0035] Figure 2C A side view of a multi-zone reflow oven is depicted according to an embodiment of the invention, showing a first infrared sensor turret for anticipating another printed circuit board assembly and second and third infrared sensor turrets for tracking the printed circuit board assembly. As the PCBA 134 passes between a second temperature zone 106 and a third temperature zone 108, the third IR sensor turret 130 positions the edge of the PCBA 134, and based on the positioned edge of the PCBA 134, the third IR sensor turret 130 positions a point of interest on the PCBA 134 tracked by the second IR sensor turret 128. As the PCBA 134 passes through the third temperature zone 108, the second IR sensor turret 128 and the third IR sensor turret 130 capture temperature data at the point of interest. Since the PCBA 134 has passed through the data acquisition range of the first IR sensor turret 126 for capturing temperature data at the point of interest, the first IR sensor turret 126 transitions from a final position 206 to an anticipated position 204, anticipating the arrival of another PCBA on the conveyor surface 132. Final position 206 indicates the maximum position of the data acquisition range for the first IR sensor turret 126.

[0036] Figure 2DA side view of a multi-zone reflow oven is depicted according to an embodiment of the invention, showing a first infrared sensor turret, a second infrared sensor turret anticipating another printed circuit board assembly, and a third infrared sensor turret tracking the printed circuit board assembly. As the PCBA 134 passes between a third temperature zone 108 and a fourth temperature zone 110, it reaches the data capture range of the second IR sensor turret 128 for capturing temperature data at a point of interest. As a result, the second IR sensor turret 128 anticipates another PCBA reaching the conveyor surface 132 by transitioning from a final position 206 to a desired position 204. The final position 206 represents the maximum position for the data capture range of the second IR sensor turret 128. The third IR sensor turret 130 continues to capture temperature data at the point of interest until the PCBA 134 passes through the fourth temperature zone 110 and exits along the conveyor surface 132 into one or more cooling zones of the reflow oven 100, where it... Figure 2D Not shown in the image.

[0037] Figure 3A A side view of an infrared sensor turret with a fully rotating turret according to an embodiment of the present invention is depicted. In this embodiment, a first example IR sensor turret 300 is shown. Figures 1 to 2D Each of the first IR sensor turret 126, the second IR sensor turret 128, and the third IR sensor turret 130 is represented in this embodiment. A first example IR sensor turret 300 includes a base 302, a pivot ball 304, an IR sensor 306, and an optional device 308, wherein the optional device 308 may be an optical camera with a laser. The IR sensor 306 and the optional device 308 protrude from the pivot ball 304. The pivot ball 304 is mechanically coupled to the base 302, wherein the pivot ball 304 can rotate in any direction as indicated by directional arrows 310 and 312. In one embodiment, one or more motors are coupled to one or more rack and pinion assemblies to provide rotational movement of the pivot ball 304, wherein the one or more motors are coupled to the base 302, and the one or more rack and pinion assemblies are coupled to the pivot ball 304. One or more motors coupled to base 302 mechanically interact with one or more rack and pinion assemblies to provide rotational movement of pivot ball 304 as specified by directional arrows 310 and 312. In another embodiment, one or more actuators, wherein one or more actuators are coupled to base 302 and pivot ball 304, provide rotational movement of pivot ball 304 as specified by directional arrows 310 and 312. The directional movement of the first example IR sensor turret 300 specifies the directional movement of IR sensor 306 and optional device 308.

[0038] Figure 3BA bottom view of an infrared sensor turret with a rotating turret according to an embodiment of the present invention is depicted. Figure 3A The embodiments discussed herein, the first example being the IR sensor turret 300, represent... Figures 1 to 2D Each of the first IR sensor turret 126, the second IR sensor turret 128, and the third IR sensor turret 130 is a sensor tower. The first example IR sensor turret 300 includes a base 302, a pivot ball 304, an IR sensor 306, and an optional device 308. The pivot ball 304 is mechanically coupled to the base 302, and the pivot ball 304 can rotate in any direction as indicated by directional arrows 310 and 312. In this bottom view of the first example IR sensor turret 300, the pivot ball 304 with the IR sensor 306 and the optional device 308 can rotate along any direction specified by directional arrows 310 and 312.

[0039] Figure 4A A side view of an infrared sensor turret with a bidirectional turret and a rotating base, according to an embodiment of the present invention, is depicted. In this embodiment, a second example IR sensor turret 400 is shown. Figures 1 to 2DEach of the first IR sensor turret 126, the second IR sensor turret 128, and the third IR sensor turret 130 is represented in the second example IR sensor turret 400. The second example IR sensor turret 400 includes a base 302, a pivot ball 304, an IR sensor 306, and an optional device 308, wherein the optional device 308 may be an optical camera with a laser. The IR sensor 306 and the optional device 308 protrude from the pivot ball 304. The pivot ball 304 is mechanically coupled to the base 302, wherein the pivot ball 304 can rotate bidirectionally as indicated by the directional arrow 402 perpendicular to the bidirectional rotation of the pivot ball 304. The base 302 of the second example IR sensor turret 400 can rotate 360 ​​degrees as indicated by the directional arrow 402 for bidirectional rotation perpendicular to the pivot ball 304. In one embodiment, a first or more motor assemblies are coupled to one or more rack and pinion assemblies to provide bidirectional rotational movement of the pivot ball 304, wherein the first or more motor assemblies are coupled to a base 302, and one or more rack and pinion assemblies are coupled to the pivot ball 304. The first or more motor assemblies coupled to the base 302 mechanically interact with the one or more rack and pinion assemblies to provide bidirectional rotational movement of the pivot ball 304 as indicated by directional arrow 310. A second or more motor assemblies are coupled to the base 302 to provide 360-degree rotational movement of the second example IR sensor turret 400, as indicated by directional arrow 402. In another embodiment, one or more actuators provide bidirectional rotational movement of the pivot ball 304, wherein one or more actuators are coupled to the base 302 and the pivot ball 304. The one or more actuators coupled to the base 302 and the pivot ball 304 provide bidirectional rotational movement of the pivot ball 304 as indicated by directional arrow 310. The first example specifies the directional movement of the IR sensor turret 300 and the directional movement of the IR sensor 306 and optional device 308.

[0040] Figure 4B A bottom view of an infrared sensor turret with a bidirectional turret and a rotating base, according to an embodiment of the present invention, is depicted. Figure 4A The second example IR sensor turret 400, as discussed in the embodiments, represents... Figures 1 to 2DEach of the first IR sensor turret 126, the second IR sensor turret 128, and the third IR sensor turret 130 is represented. The second example IR sensor turret 400 includes a base 302, a pivot ball 304, an IR sensor 306, and an optional device 308. The pivot ball 304 is mechanically coupled to the base 302, and the pivot ball 304 can rotate bidirectionally as indicated by direction arrow 310. The base 302 can rotate 360 ​​degrees, as indicated by direction arrow 402. In this bottom view of the first example IR sensor turret 300, the pivot ball 304 with the IR sensor 306 and the optional device 308 can rotate in any direction specified by direction arrows 310 and 312.

[0041] Various aspects of this disclosure are described by narrative text, flowcharts, block diagrams of computer systems, and / or block diagrams of machine logic included in embodiments of a computer program product (CPP). Regarding any flowchart, depending on the technology involved, operations may be performed in a different order than that shown in a given flowchart. For example, again depending on the technology involved, two operations shown in consecutive flowchart blocks may be performed in reverse order, as a single integrated step, simultaneously, or in a manner that at least partially overlaps in time.

[0042] Computer Program Product Embodiment (“CPP Embodiment” or “CPP”) is a term used in this disclosure to describe any collection of one or more storage media (also referred to as “media”) collectively included in a collection of one or more storage devices, which collectively include machine-readable code corresponding to instructions and / or data for performing computer operations specified in a given CPP claim. A “storage device” is any tangible device capable of holding and storing instructions for use by a computer processor. Without limitation, a computer-readable storage medium can be an electronic storage medium, a magnetic storage medium, an optical storage medium, an electromagnetic storage medium, a semiconductor storage medium, a mechanical storage medium, or any suitable combination of the foregoing. Some known types of storage devices that include these media include: magnetic disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), compact disc read-only memory (CD-ROM), digital versatile disc (DVD), memory sticks, floppy disks, mechanical encoding devices (such as punch cards or pits / platforms formed in the main surface of the disk), or any suitable combination of the foregoing. As used in this disclosure, the term computer-readable storage medium is not to be construed as a storage device in the form of a transient signal itself, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides, optical pulses through fiber optic cables, electrical signals transmitted through wires, and / or other transmission media. As will be understood by those skilled in the art, data typically moves at certain incidental points in time during normal operation of the storage device, such as during access, defragmentation, or garbage collection; however, this does not make the storage device transient, because the data is not transient when it is stored.

[0043] Figure 5 This is a functional block diagram illustrating a computing environment according to an embodiment of the present invention, which is typically designated as 500. Figure 5 This is merely an illustration of an implementation and does not imply any limitation regarding the environment in which different embodiments may be implemented. Those skilled in the art can make many modifications to the described environment without departing from the scope of the invention as set forth in the claims.

[0044] The computing environment 500 includes examples of environments for executing at least some of the computer code involved in the methods of performing the present invention, such as IR sensor turret program 600. In addition to block 200, the computing environment 500 includes, for example, a computer 501, a wide area network (WAN) 502, an end-user equipment (EUD) 503, a remote server 504, a public cloud 505, and a private cloud 506. In this embodiment, the computer 501 includes a processor set 510 (including processing circuitry 520 and a cache 521), a communication structure 511, volatile memory 512, persistent storage 513 (including an operating system 522 and block 600, as identified above), a peripheral device set 514 (including a user interface (UI) device set 523, a storage device 524, and an Internet of Things (IoT) sensor set 525), and a network module 515. The remote server 504 includes a remote database 530. The public cloud 505 includes a gateway 540, a cloud orchestration module 541, a set of physical hosts 542, a set of virtual machines 543, and a set of containers 544.

[0045] Computer 501 can take the form of a desktop computer, laptop computer, tablet computer, smartphone, smartwatch or other wearable computer, mainframe computer, quantum computer, or any other form of computer or mobile device now known or to be developed in the future capable of running programs, accessing networks, or querying databases (such as remote database 530). As is well known in the field of computer technology, and depending on the technology, the performance of a computer-implemented method can be distributed across multiple computers and / or multiple locations. On the other hand, in this presentation of computing environment 500, the detailed discussion focuses on a single computer, specifically computer 501, to keep the presentation as simple as possible. Computer 501 can be located in the cloud, even... Figure 5 It is not shown in the cloud. On the other hand, computer 501 does not need to be located in the cloud unless to the extent that can be definitively indicated.

[0046] Processor assembly 510 includes one or more computer processors of any type now known or to be developed in the future. Processing circuitry 520 may be distributed across multiple packages, such as multiple cooperating integrated circuit chips. Processing circuitry 520 may implement multiple processor threads and / or multiple processor cores. Cache 521 is memory located within the processor chip package(s) and is typically used for data or code that should be readily accessible by the threads or cores running on processor assembly 510. Cache memory is typically organized into multiple levels based on its relative proximity to the processing circuitry. Alternatively, some or all of the caches for the processor assembly may be located “off-chip.” In some computing environments, processor assembly 510 may be designed to work with qubits and perform quantum computing.

[0047] Computer-readable program instructions are typically loaded onto computer 501 to cause a series of operational steps to be executed by processor set 510 of computer 501, thereby implementing a computer-implemented method, such that the instructions thus executed will instantiate the method specified in the flowchart and / or the narrative description of the computer-implemented method included in this document (collectively, the “method of the invention”). These computer-readable program instructions are stored in various types of computer-readable storage media, such as cache 521 and other storage media discussed below. The program instructions and associated data are accessed by processor set 510 to control and direct the execution of the method of the invention. In computing environment 500, at least some of the instructions for performing the method of the invention may be stored in persistent storage device 513 in block 600.

[0048] Communication structure 511 is a signal transmission path that allows various components of computer 501 to communicate with each other. Typically, this structure consists of switches and conductive paths, such as switches and conductive paths forming buses, bridges, physical input / output ports, etc. Other types of signal communication paths can be used, such as fiber optic communication paths and / or wireless communication paths.

[0049] Volatile memory 512 is any type of volatile memory now known or to be developed in the future. Examples include dynamic random access memory (RAM) or static RAM. Typically, volatile memory 512 is characterized by random access, but this is not necessary unless explicitly indicated. In computer 501, volatile memory 512 is located in a single package and is situated inside computer 501; however, alternatively or additionally, volatile memory may be distributed across multiple packages and / or located externally relative to computer 501.

[0050] The persistent storage device 513 is any form of non-volatile memory for a computer, now known or to be developed in the future. The non-volatile nature of the memory means that the stored data is retained regardless of whether power is supplied to the computer 501 and / or directly to the persistent storage device 513. The persistent storage device 513 may be a read-only memory (ROM), but typically at least a portion of it allows data to be written, deleted, and rewritten. Some common forms of persistent storage devices include hard disks and solid-state storage devices. The operating system 522 may take several forms, such as various known proprietary operating systems or operating systems employing an open-source portable operating system interface type with a kernel. The code included in box 600 typically includes at least some of the computer code involved in performing the methods of the present invention.

[0051] Peripheral device set 514 includes a set of peripheral devices for computer 501. Data communication connections between peripheral devices and other components of computer 501 can be implemented in various ways, such as Bluetooth connectivity, near field communication (NFC) connectivity, connections made by cables (such as Universal Serial Bus (USB) type cables), plug-in connections (e.g., secure digital (SD) cards), connections made via local area communication networks, and even connections made via wide area networks (such as the Internet). In various embodiments, UI device set 523 may include components such as displays, speakers, microphones, wearable devices (such as goggles and smartwatches), keyboards, mice, printers, touchpads, game controllers, and haptic devices. Storage device 524 is an external storage device (e.g., an external hard drive) or a pluggable storage device (e.g., an SD card). Storage device 524 can be persistent and / or volatile. In some embodiments, storage device 524 may take the form of a quantum computing storage device for storing data in the form of qubits. In embodiments where computer 501 requires a large amount of storage (e.g., where computer 501 locally stores and manages a large database), this storage can be provided by a peripheral storage device designed to store very large amounts of data, such as a storage area network (SAN) shared by multiple geographically distributed computers. The IoT sensor set 525 consists of sensors that can be used in IoT applications. For example, one sensor could be a thermometer, while another could be a motion detector.

[0052] Network module 515 is a collection of computer software, hardware, and firmware that allows computer 501 to communicate with other computers via WAN 502. Network module 515 may include hardware such as a modem or Wi-Fi transceiver, software for packetizing and / or depacketizing data transmitted over the communication network, and / or web browser software for transmitting data over the Internet. In some embodiments, the network control and network forwarding functions of network module 515 are performed on the same physical hardware device. In other embodiments (e.g., embodiments utilizing Software-Defined Networking (SDN)), the control and forwarding functions of network module 515 are performed on physically separate devices, such that the control function manages several different network hardware devices. Computer-readable program instructions for performing the methods of the present invention can typically be downloaded to computer 501 from an external computer or external storage device via a network adapter card or network interface included in network module 515.

[0053] A WAN 502 is any wide area network (e.g., the Internet) capable of transmitting computer data over non-local distances using any technology known now or to be developed in the future for transmitting computer data. In some embodiments, a WAN 502 may be replaced by and / or supplemented by a local area network (LAN) designed to transmit data between devices located in a local area such as a Wi-Fi network. WANs and / or LANs typically include computer hardware such as copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and edge servers.

[0054] End User Equipment (EUD) 503 is any computer system used and controlled by an end user (e.g., a customer of the enterprise operating computer 501) and can take any of the forms discussed above in conjunction with computer 501. EUD 503 typically receives helpful and useful data from the operation of computer 501. For example, assuming computer 501 is designed to provide recommendations to the end user, these recommendations are typically transmitted from network module 515 of computer 501 to EUD 503 via WAN 502. In this way, EUD 503 can display or otherwise present the recommendations to the end user. In some embodiments, EUD 503 can be a client device, such as a thin client, heavy client, mainframe, desktop computer, etc.

[0055] Remote server 504 is any computer system that provides at least some data and / or functionality to computer 501. Remote server 504 can be controlled and used by the same entity operating computer 501. Remote server 504 represents multiple machines that collect and store helpful and useful data for use by other computers, such as computer 501. For example, if computer 501 is designed and programmed to provide recommendations based on historical data, that historical data can be provided to computer 501 from a remote database 530 of remote server 504.

[0056] Public cloud 505 is any computer system that can be used by multiple entities, providing on-demand availability of computer system resources and / or other computing capabilities (especially data storage (cloud storage) and computing power) without direct active management by the user. Cloud computing typically leverages resource sharing to achieve scalability consistency and economy. Direct and active management of the computing resources of public cloud 505 is performed by the computer hardware and / or software of cloud orchestration module 541. The computing resources provided by public cloud 505 are typically implemented by virtual computing environments running on various computers constituting the host physical machine set 542, which is the entire domain of physical computers in and / or available to public cloud 505. Virtual computing environments (VCEs) typically take the form of virtual machines from virtual machine set 543 and / or containers from container set 544. It is to be understood that these VCEs can be stored as images and can be transferred between various physical machine hosts as images or after instantiation of VCEs. The cloud orchestration module 541 manages image transmission and storage, deploys new instantiations of VCE, and manages active instantiations of VCE deployments. Gateway 540 is a collection of computer software, hardware, and firmware that allows the public cloud 505 to communicate via WAN 502.

[0057] Now, we will provide some further explanation of Virtualized Computing Environments (VCEs). A VCE can be stored as an "image." New active instances of a VCE can be instantiated from this image. Two common types of VCEs are virtual machines and containers. A container is a VCE that uses operating system-level virtualization. This refers to an operating system feature where the kernel allows multiple isolated user-space instances, called containers, to exist. From the perspective of the programs running within them, these isolated user-space instances typically behave like real computers. Computer programs running on a regular operating system can utilize all the resources of that computer, such as connected devices, files and folders, network shares, CPU power, and quantifiable hardware capabilities. However, programs running within a container can only use the contents of the container and the devices allocated to the container; this is a characteristic known as containerization.

[0058] Private cloud 506 is similar to public cloud 505, except that computing resources are available only to a single enterprise. While private cloud 506 is depicted as communicating with WAN 502, in other embodiments, private cloud can be completely disconnected from the internet and accessible only via a local / private network. A hybrid cloud is a combination of multiple clouds of different types (e.g., private, community, or public cloud types) typically implemented by different vendors. Each of the multiple clouds remains a separate and discrete entity, but the larger hybrid cloud architecture is bound together by a standardization or proprietary technology that enables orchestration, management, and / or data / application portability across the multiple component clouds. In this embodiment, both public cloud 505 and private cloud 506 are parts of a larger hybrid cloud.

[0059] Figure 6 A flowchart of an infrared sensor turret procedure for managing multiple infrared sensor turrets in a reflow oven, according to an embodiment of the present invention, is described.

[0060] The IR sensor turret program 600 detects the edge (602) of the PCBA with the IR sensor turret. (As previously mentioned...) Figure 1 The SMT reflow oven discussed includes temperature zones designated by multiple heating areas separated by gaps, each gap including an IR sensor turret. Multiple IR sensor turrets are mounted at fixed positions in multiple gaps between multiple temperature zones along the entire length of the reflow oven. Based on the electronic card size, as the PCBA travels on a conveyor through multiple temperature zones positioned along the length of the reflow oven, the IR sensor turret program 600 can track points of interest on the PCBA and provide thermal data for those points of interest. When the PCBA is placed on a conveyor at a first end of the reflow oven, the conveyor moves the PCBA toward a first temperature zone among the multiple temperature zones. The IR sensor turret program 600 can configure the first IR sensor turret among the multiple IR sensor turrets from a standby position to a desired position, wherein the IR sensor is oriented to the area where the edge of the PCBA first appears, based on the direction of travel of the conveyor. In one embodiment, the IR sensor turret program 600 detects the edge of the PCBA with the first IR sensor turret by utilizing an optical camera with a laser. In another embodiment, the IR sensor turret program 600 detects the edge of the PCBA based on the known fixture position where the PCBA is located and the speed at which the conveyor moves the PCBA through the reflow oven. In yet another embodiment, the IR sensor turret program 600 detects the edge of the PCBA with the first IR sensor turret by utilizing an IR sensor to detect the temperature change between the temperature of the heated air in a first temperature zone of the reflow oven and the surface temperature of the edge of the PCBA.

[0061] The IR sensor turret program 600 locates the point of interest on the PCBA (604) with the IR sensor turret. In one embodiment, the IR sensor turret program 600 uses the known dimensions and known coordinates of the PCBA to locate the point of interest on the PCBA with the IR sensor turret. Since the IR sensor turret program 600 detects the edges of the PCBA and the PCBA is in a fixed position on the conveyor, the IR sensor turret program 600 uses the edges of the PCBA as reference points and utilizes the speed of the conveyor when locating the point of interest using the known coordinates. As the PCBA travels on the conveyor, the IR sensor turret program 600 waits for the point of interest to enter the operating range of the first IR sensor turret. In another embodiment, the IR sensor turret program 600 uses image recognition software to identify a specific component from among multiple components located on the PCB of the PCBA. The IR sensor turret program 600 can scan (i.e., locate) a specific component of the PCBA on the first IR sensor turret using an optical camera with a laser by matching a scan of the specific component of the PCBA with a known image of the specific component.

[0062] An IR sensor turret program 600 tracks a point of interest (606) on a PCBA equipped with an IR sensor turret. As the PCBA moves through a first temperature zone and further into a reflow oven, the IR sensor turret program 600 tracks the point of interest on the PCBA equipped with a first IR sensor turret. In response to the IR sensor turret program 600 locating the point of interest on the PCBA equipped with the first IR sensor turret, the IR sensor turret program 600 tracks the point of interest on the PCBA by moving the first IR sensor turret to match the speed of the conveyor. The IR sensor turret program 600 moves the first IR sensor turret by activating one or more motors and / or one or more actuators of the first IR sensor turret, such that the area used for collecting thermal data by the first IR sensor turret remains above the point of interest as the PCBA moves on the conveyor. The IR sensor turret program 600 tracks the point of interest on the PCBA equipped with the first IR sensor turret until the maximum position (i.e., the final position) of the operating range of the first IR sensor turret is reached.

[0063] The IR sensor turret program 600 captures thermal data (608) at a point of interest with the IR sensor turret. Between the expected and final positions within the operating range of the first IR sensor turret, the IR sensor turret program 600 captures thermal data at the point of interest on the PCBA with the first IR sensor turret. The thermal data may include temperature readings on the surface of the point of interest on the PCBA. The IR sensor turret program 600 can continuously capture thermal data at the point of interest with the first IR sensor turret within the operating range of the first IR sensor turret and can create a temperature profile for the point of interest within a first temperature region in the reflow oven.

[0064] The IR sensor turret procedure 600 determines whether another IR sensor turret is available (decision 610). The IR sensor turret procedure 600 determines whether another IR sensor turret from multiple IR sensor turrets is available until the PCBA leaves the heating zone (i.e., temperature zone) of the reflow oven and enters the cooling zone. In this embodiment, the IR sensor turret procedure 600 determines whether a second IR sensor turret can be used to capture thermal data for a point of interest. If the IR sensor turret procedure 600 determines that another IR sensor is available ("Yes" branch, determination 610), the IR sensor turret procedure 600 positions the point of interest on the PCBA with the other IR sensor turret (612). If the IR sensor turret procedure 600 determines that another IR sensor is unavailable ("No" branch, determination 610), the IR sensor turret procedure 600 determines whether another PCBA exists in the reflow oven (decision 620).

[0065] The IR sensor turret program 600 locates the point of interest on a PCBA (612) with another IR sensor turret. In one embodiment, the IR sensor turret program 600 uses known dimensions and known coordinates of the PCBA to locate the point of interest on the PCBA with the IR sensor turret. Since the IR sensor turret program 600 detects the edges of the PCBA and the PCBA is in a fixed position on the conveyor, the IR sensor turret program 600 uses the edges of the PCBA as reference points and utilizes the speed of the conveyor when locating the point of interest using known coordinates. As the PCBA travels on the conveyor, the IR sensor turret program 600 waits for the point of interest to enter the operating range of the second IR sensor turret. In another embodiment, the IR sensor turret program 600 uses image recognition software to identify a specific component from among multiple components located on the PCB of the PCBA. The IR sensor turret program 600 can scan (i.e., locate) a specific component of the PCBA on the second IR sensor turret using an optical camera with a laser by matching a scan of the specific component of the PCBA with a known image of the specific component.

[0066] An IR sensor turret program 600 tracks a point of interest (614) on a PCBA equipped with another IR sensor turret. As the PCBA moves through a second temperature zone and further into the reflow oven, the IR sensor turret program 600 tracks the point of interest on the PCBA equipped with the second IR sensor turret. In response to the IR sensor turret program 600 positioning the point of interest on the PCBA equipped with the second IR sensor turret, the IR sensor turret program 600 tracks the point of interest on the PCBA by moving the second IR sensor turret to match the speed of the conveyor. The IR sensor turret program 600 moves the second IR sensor turret by activating one or more motors and / or one or more actuators of the second IR sensor turret, such that the area used for collecting thermal data by the second IR sensor turret remains above the point of interest as the PCBA moves on the conveyor. The IR sensor turret program 600 tracks the point of interest on the PCBA equipped with the second IR sensor turret until the maximum position (i.e., the final position) of the operating range of the first IR sensor turret is reached.

[0067] IR sensor turret program 600 captures thermal data (616) of a point of interest with another IR sensor turret. Between the intended position and the final position of the operating range of the second IR sensor turret, IR sensor turret program 600 captures thermal data at the point of interest on the PCBA with the second IR sensor turret. As previously discussed, the thermal data may include temperature readings on the surface of the point of interest on the PCBA. IR sensor turret program 600 may continuously capture thermal data at the point of interest with the second IR sensor turret within the operating range of the second IR sensor turret and may create a temperature profile of the point of interest for a second temperature zone in the reflow oven. In some embodiments, the operating range of the first IR sensor turret may overlap with that of the second IR sensor turret, wherein IR sensor turret program 600 may capture thermal data of a sub-region of a temperature region below one or more heating elements by both the first and second IR sensor turrets. (Previous information regarding...) Figure 2B The potential overlap of thermal data captured by the IR sensor turret program 600 in the second temperature region with the first IR sensor turret and the second IR sensor turret was discussed.

[0068] The IR sensor turret program 600 can utilize overlapping thermal data to detect the presence of a faulty IR sensor in a first or second IR sensor turret based on differences in readings. For example, the IR sensor turret program 600 collects thermal data for a second temperature region from both the first and second IR sensor turrets, and collects thermal data for a third temperature region from both the second and third IR sensor turrets. The IR sensor turret program 600 identifies differences (i.e., values ​​meeting or exceeding a change threshold) in a subset of temperature data values ​​between the first set of temperature data values ​​captured by the first IR sensor turret in the second temperature region and the second set of temperature data values ​​captured by the second IR sensor turret. However, for the third temperature region, the IR sensor turret program 600 does not identify any differences (i.e., values ​​below a change threshold) in a subset of temperature data values ​​between the third set of temperature data values ​​captured by the second IR sensor turret and the fourth set of temperature data values ​​captured by the third IR sensor turret. Therefore, the IR sensor turret procedure 600 determines that there is a fault in the IR sensor on the first IR sensor turret, where the fault may require repair, recalibration or replacement of the IR sensor on the first IR sensor turret.

[0069] The IR sensor turret procedure 600 returns the previous IR sensor turret to the starting position (618). In this embodiment, the IR sensor turret procedure 600 returns the previous IR sensor turret to the starting position by moving the first IR sensor turret from the final position to the expected position. The IR sensor turret procedure 600 moves the first IR sensor turret to the expected position, and can wait for the arrival of another PCBA moving on the conveyor to utilize the first IR sensor turret to detect the edge of the other PCBA.

[0070] The IR sensor turret program 600 determines whether another PCBA exists in the reflow oven (determination 620). If the IR sensor turret program 600 determines that another PCBA exists in the reflow oven ("Yes" branch, determination 620), the IR sensor turret program 600 returns to the edge of detecting another PCBA with the first IR sensor turret. If the IR sensor turret program 600 determines that another PCBA exists in the reflow oven ("No" branch, determination 620), the IR sensor turret program 600 stops operating and moves the plurality of IR sensor turrets in the reflow oven to the standby position.

[0071] Various embodiments of the invention have been described for illustrative purposes, but are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or technical improvements to existing technologies on the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. An apparatus comprising: Reflow oven; as well as A first infrared (IR) sensor turret is suspended above the conveyor surface of the reflow oven, wherein the directional movement of the first IR sensor turret matches the directional movement of the conveyor surface.

2. The apparatus according to claim 1, further comprising: The first IR sensor turret has an IR sensor that points to the top surface of the conveyor surface, wherein the directional movement of the first IR sensor turret specifies the directional movement of the IR sensor of the first IR sensor turret.

3. The apparatus according to claim 2, further comprising: An optical camera having a laser pointing at the first IR sensor turret on the top surface of the conveyor surface.

4. The apparatus according to claim 1, further comprising: A first heating element is positioned in a first temperature region of the reflow oven, wherein the operating range of the first IR sensor turret covers a first sub-region of the reflow oven, the first sub-region of the reflow oven being located below at least a portion of the first heating element on the conveyor surface.

5. The apparatus according to claim 4, further comprising: A second heating element is positioned in a second temperature region of the reflow oven, wherein the second heating element is adjacent to the first heating element, and wherein the operating range of the first IR sensor turret covers a second sub-region of the reflow oven, the second sub-region of the reflow oven being located below at least a portion of the second heating element on the conveyor surface.

6. The apparatus according to claim 5, further comprising: A second IR sensor turret is suspended above the conveyor surface of the reflow oven, wherein the directional movement of the second IR sensor turret matches the directional movement of the conveyor surface.

7. The apparatus of claim 6, wherein the operating range of the second IR sensor turret covers a third sub-region of the reflow oven, the third sub-region of the reflow oven being located below at least another portion of the second heating element on the conveyor surface.

8. The apparatus of claim 7, wherein the second sub-region of the reflow oven located below at least a portion of the second heating element on the conveyor surface at least partially overlaps with the third sub-region of the reflow oven located below at least a portion of the second heating element on the conveyor surface.

9. The apparatus according to claim 3, further comprising: The pivot ball of the first IR sensor turret is mechanically coupled to the base, wherein the optical camera and the IR sensor, which have the laser of the first IR sensor turret, protrude from the pivot ball.

10. The apparatus of claim 9, wherein the pivot ball rotates relative to the base in multiple directions.

11. The apparatus of claim 9, wherein the pivot ball rotates bidirectionally relative to the base, and the base rotates bidirectionally.

12. The apparatus of claim 5, wherein the first IR sensor turret is suspended in a first gap between the first heating element and the second heating element.

13. The apparatus of claim 12, wherein the first IR sensor turret is mechanically coupled to the first heating element.

14. The apparatus of claim 12, wherein the first IR sensor turret is mechanically coupled to the second heating element.

15. The apparatus of claim 12, wherein the first IR sensor turret is mechanically coupled to a top portion within the inner surface of the reflow oven.

16. A computer-implemented method, comprising: The point of interest is located on a printed circuit board assembly (PCBA) by a first infrared (IR) sensor turret, wherein the PCBA is positioned on a conveyor in a reflow oven; The point of interest on the PCBA is tracked by the first IR sensor turret, wherein the PCBA is moving along the conveyor in the reflow oven; as well as The first IR sensor turret captures a first set of thermal data at the point of interest in the first sub-region of the reflow oven.

17. The computer-implemented method according to claim 16, further comprising: The edge of the card for the PCBA is detected by the first IR sensor turret.

18. The computer-implemented method of claim 17, wherein a first optical camera having a laser with the first infrared sensor turret detects the edge of the card for the PCBA.

19. The computer-implemented method of claim 17, wherein the first IR sensor of the first infrared sensor turret detects the edge of the card for the PCBA based on a temperature change between the temperature of the heated air in the reflow oven and the surface temperature of the edge of the card for the PCBA.

20. The computer-implemented method according to claim 17, further comprising: In response to determining that a second IR sensor turret is available in the reflow oven, the point of interest is located on the PCBA by the second infrared IR sensor turret; The points of interest on the PCBA are tracked by the second IR sensor turret; as well as The second IR sensor turret captures a second set of thermal data at the point of interest in the second sub-region of the reflow oven.

21. The computer-implemented method according to claim 20, further comprising: The first IR sensor turret is configured from its final position to a desired position to detect another edge of another card for another PCBA positioned on the conveyor in the reflow oven, wherein the movement between the final position and the desired position defines the operating range of the first IR sensor turret.

22. The computer-implemented method according to claim 21, further comprising: The other edge of the other card for the other PCBA is detected by the first IR sensor turret.

23. The computer-implemented method of claim 20, wherein a portion of the first sub-region overlaps with a portion of the second sub-region.

24. The computer-implemented method of claim 23, wherein the first sub-region corresponds at least to a first temperature region associated with a first heating element in the reflow oven, and to a portion of a second temperature region associated with a second heating element in the reflow oven.

25. The computer-implemented method of claim 24, wherein the second sub-region corresponds at least to the second temperature region associated with the second heating element in the reflow oven, and to a portion of the third temperature region associated with the third heating element in the reflow oven.

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