Electrode polishing device
By designing an electrode polishing device using clamps, moving components, and pressure plates made of elastic materials and sandpaper, the problem of over-polishing of electrodes is solved, achieving uniform polishing of the electrode surface and ensuring electrochemical properties, thus meeting the needs of electrodes of different specifications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUANENG NUCLEAR ENERGY TECH RES INST CO LTD
- Filing Date
- 2026-01-20
- Publication Date
- 2026-04-24
AI Technical Summary
Existing handheld polishing machines and industrial-grade polishing machines use a rigid connection method for their abrasives, which can easily lead to over-polishing of the electrode surface, damaging the electrode shape and reaction area, and affecting electrochemical research.
An electrode grinding device including a clamp, a moving component, and a grinding component was designed. The device utilizes a pressure plate made of elastic material and sandpaper. The moving component drives the electrode to move and rotate linearly on the sandpaper. Combined with the stable clamping of the clamp, flexible grinding is achieved, avoiding over-grinding caused by hard contact.
It effectively maintains the original shape and diameter of the electrode, ensures the stability of the contact area between the electrode and the electrolyte, improves the stability and consistency of the polishing operation, adapts to electrodes of different specifications, and meets the requirements of quantitative electrochemical research.
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Figure CN121912295A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of electrode polishing technology, and specifically relates to an electrode polishing device. Background Technology
[0002] In electrochemical experiments, the surface of columnar metal electrodes generally needs to be polished to remove the surface oxide film and prevent it from affecting the electrode's electrochemical properties. Furthermore, polishing should not significantly alter the diameter or electrode shape. This is because the electrode diameter affects the contact area between the electrode and the electrolyte, directly influencing the electrode reaction area, which is crucial for quantitative electrochemical studies; therefore, polishing should not be excessive.
[0003] Existing handheld polishing machines and industrial-grade polishing machines typically use a rigid connection method for their grinding wheels. This rigid connection method makes it easy to over-polish when the grinding wheel comes into contact with the electrode, thereby damaging the electrode shape and affecting the electrode reaction area. Summary of the Invention
[0004] The present invention aims to at least partially solve one of the technical problems in related technologies. To this end, embodiments of the present invention provide an electrode polishing device that can avoid over-polishing of the electrode and reduce the impact of polishing on the electrode reaction area.
[0005] The electrode polishing apparatus of this invention includes: A clamp for holding a cylindrical electrode; A movable component for driving the clamp to rotate and move linearly; A grinding assembly includes multiple pressure plates, with a grinding slit formed between the multiple pressure plates. Sandpaper is disposed in the grinding slit, and the pressure plates are made of an elastic material so that the sandpaper contacts the electrode in the grinding slit. In this process, the moving component drives the electrode into the grinding slit, and the sandpaper contacts the electrode under the elastic force of the pressure plate. The moving component drives the electrode to move linearly back and forth and rotate on the sandpaper so that the sandpaper grinds the electrode.
[0006] The electrode polishing device of this invention utilizes the elastic properties of the pressure plate to allow sandpaper to adaptively conform to the surface of the cylindrical electrode, avoiding over-polishing caused by hard contact between the abrasive and the electrode, effectively maintaining the original shape and diameter of the electrode. A moving component drives the clamp to move the cylindrical electrode linearly back and forth, and the rotation adjusts the contact position between the electrode and the sandpaper, achieving uniform polishing of the electrode surface, thoroughly removing the oxide film, and ensuring the electrochemical characteristics of the electrode. The linear movement function of the moving component precisely controls the depth of the cylindrical electrode entering the polishing slit, further controlling the polishing degree and maintaining a stable contact area between the electrode and the electrolyte, meeting the requirements of quantitative electrochemical research. The stable clamping of the clamp, combined with the rotation and linear movement drive of the moving component, automates the electrode polishing operation, replacing hand-held polishing and improving the stability and consistency of the polishing operation. The flexible polishing structure formed by the sandpaper in the polishing slit and the elastic pressure plate eliminates the traditional hard connection method of the abrasive, adapting to the polishing needs of cylindrical electrodes of different specifications and improving the versatility of the device.
[0007] In some embodiments, the moving component includes a slide rail and a slide block, the slide block being slidably disposed on the slide rail, the movement direction of the slide block being parallel to the central axis of the electrode, the electrode being connected to the slide block, and the slide block being used to drive the electrode into the grinding slit.
[0008] In some embodiments, the moving component further includes a rotary motor disposed on the slide, the output end of the rotary motor being connected to the clamp, and the rotary motor being used to drive the electrode to rotate.
[0009] In some embodiments, sandpaper is provided on both sides of the grinding seam.
[0010] In some embodiments, the sanding assembly further includes a moving element connected to a plurality of pressure plates, the moving element being used to drive the plurality of pressure plates to move along a first direction so that different positions of the sandpaper contact the electrodes.
[0011] In some embodiments, the sandpaper of different grit sizes is provided at intervals along the first direction in the sanding slit.
[0012] In some embodiments, a cleaning cloth is provided between adjacent sandpapers in the first direction, the cleaning cloth being connected to the pressure plate, and the cleaning cloth being used to clean metal shavings from the electrode surface.
[0013] In some embodiments, the polishing assembly further includes a base connected to the pressure plate, the base being used to support the pressure plate.
[0014] In some embodiments, the grinding assembly further includes a top plate and an adjusting member, the pressure plate being located between the top plate and the base, and the adjusting member being used to adjust the distance between the top plate and the base, thereby adjusting the pressure of the pressure plate on the electrode.
[0015] In some embodiments, the adjusting member includes a plurality of threaded rods, the central axis of which is perpendicular to a first direction, the threaded rods passing through the base and the top plate, and the threaded rods being threadedly connected to the base and the top plate. Attached Figure Description
[0016] Figure 1 This is an overall schematic diagram of the present invention.
[0017] Figure 2 This is the front view of the present invention.
[0018] Figure 3 This is the present invention. Figure 2 Isometric side sectional view at point AA.
[0019] Figure 4 This is the present invention. Figure 3 A magnified view of a section at point B.
[0020] Figure label: 1. Fixture; 2. Electrodes; 3. Moving components; 31. Slide rail; 32. Slide block; 33. Rotary motor; 4. Grinding components; 41. Pressure plate; 42. Grinding seam; 43. Sandpaper; 44. Base; 45. Top plate; 46. Adjustment components. Detailed Implementation
[0021] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0022] like Figures 1-4 As shown, the electrode polishing device of this embodiment includes a clamp 1, a moving component 3, and a polishing component 4.
[0023] Clamp 1 is used to hold the cylindrical electrode 2; The moving component 3 is used to drive the clamp 1 to rotate and move linearly; The grinding assembly 4 includes multiple pressure plates 41, and a grinding slit 42 is formed between the multiple pressure plates 41. Sandpaper 43 is provided in the grinding slit 42. The pressure plates 41 are made of elastic material so that the sandpaper 43 contacts the electrode 2 in the grinding slit 42. In this process, the moving component 3 drives the electrode 2 into the grinding slit 42, and the sandpaper 43 contacts the electrode 2 under the elastic force of the pressure plate 41. The moving component 3 drives the electrode 2 to move linearly back and forth and rotate on the sandpaper 43 so that the sandpaper 43 grinds the electrode 2.
[0024] The electrode polishing device of this invention utilizes the elastic properties of the pressure plate to allow sandpaper to adaptively conform to the surface of the cylindrical electrode, avoiding over-polishing caused by hard contact between the abrasive and the electrode, effectively maintaining the original shape and diameter of the electrode. A moving component drives the clamp to move the cylindrical electrode linearly back and forth, and the rotation adjusts the contact position between the electrode and the sandpaper, achieving uniform polishing of the electrode surface, thoroughly removing the oxide film, and ensuring the electrochemical characteristics of the electrode. The linear movement function of the moving component precisely controls the depth of the cylindrical electrode entering the polishing slit, further controlling the polishing degree and maintaining a stable contact area between the electrode and the electrolyte, meeting the requirements of quantitative electrochemical research. The stable clamping of the clamp, combined with the rotation and linear movement drive of the moving component, automates the electrode polishing operation, replacing hand-held polishing and improving the stability and consistency of the polishing operation. The flexible polishing structure formed by the sandpaper in the polishing slit and the elastic pressure plate eliminates the traditional hard connection method of the abrasive, adapting to the polishing needs of cylindrical electrodes of different specifications and improving the versatility of the device.
[0025] Specifically, the clamp 1 stably holds the cylindrical electrode 2. The moving component 3 first drives the clamp 1 to move the cylindrical electrode 2 linearly, so that the cylindrical electrode 2 enters the grinding slit 42 formed between the multiple pressure plates 41 of the grinding component 4. The sandpaper 43 in the grinding slit 42 is in contact with the surface of the cylindrical electrode 2 under the elastic force of the pressure plate 41 made of elastic material. Then the moving component 3 drives the clamp 1 to move the cylindrical electrode 2 linearly back and forth on the sandpaper 43 to grind the electrode 2. After grinding for a period of time, the moving component 3 drives the electrode 2 to rotate at a certain angle so that other positions of the electrode 2 come into contact with the sandpaper 43, so that the sandpaper 43 grinds the surface of the cylindrical electrode 2.
[0026] In some embodiments, such as Figure 3 As shown, the moving component 3 includes a slide rail 31 and a slide block 32. The slide block 32 is slidably mounted on the slide rail 31. The movement direction of the slide block 32 is parallel to the central axis of the electrode 2. The electrode 2 is connected to the slide block 32. The slide block 32 is used to drive the electrode 2 into the grinding slit 42.
[0027] The electrode grinding device of this invention uses a slide rail to limit the movement trajectory of the slide block, allowing the electrode to move along its central axis into the grinding slit. This ensures the straightness of the electrode movement and avoids uneven grinding caused by electrode misalignment. The sliding cooperation between the slide block and the slide rail enables smooth movement of the electrode into the grinding slit, precisely controlling the electrode's insertion position and ensuring accurate grinding intervention. The slide block drives the electrode to move along its central axis, making the contact between the electrode and the sandpaper gentler. Combined with the elastic characteristics of the pressure plate, this further avoids over-grinding caused by hard contact.
[0028] Specifically, the clamp 1 holds the cylindrical electrode 2 and is connected to the slide 32 of the moving component 3. The slide 32 is slidably set on the slide rail 31 and its movement direction is parallel to the central axis of the electrode 2. The slide 32 slides linearly along the slide rail 31, driving the electrode 2 to move smoothly along its own central axis and accurately enter the grinding slit 42 of the grinding component 4.
[0029] In some embodiments, such as Figure 3 As shown, the moving component 3 also includes a rotating motor 33, which is mounted on the slide 32. The output end of the rotating motor 33 is connected to the clamp 1, and the rotating motor 33 is used to drive the electrode 2 to rotate.
[0030] The electrode grinding device of this invention uses a rotary motor to directly drive the clamp to rotate the electrode, providing stable and controllable rotational force for grinding. This achieves uniform grinding of the electrode surface, effectively removing the oxide film while avoiding over-grinding in certain areas. The integrated design of the rotary motor on the slide allows for linkage between the linear movement and rotational drive of the electrode, ensuring the coordination of the electrode's position and rotation during grinding and improving the stability of the grinding operation. By replacing manual labor with the power drive of the rotary motor, the device precisely controls the electrode's rotation angle, managing grinding efficiency and intensity while ensuring that the original diameter and shape of the electrode are not damaged.
[0031] Specifically, after the rotating motor 33 starts, it outputs rotational torque, which directly drives the fixture 1 to rotate the cylindrical electrode 2 around its own central axis, so that different surfaces of the electrode 2 come into contact with the sandpaper 43 in the grinding slit 42, thus completing the uniform grinding operation on the surface of the electrode 2.
[0032] In some embodiments, such as Figure 2 , Figure 4 As shown, sandpaper 43 is provided on both sides of the grinding seam 42.
[0033] The electrode grinding device of this invention achieves simultaneous grinding of both sides of the electrode surface through sandpaper on both sides of the grinding slit, improving grinding efficiency and avoiding surface flatness differences caused by unilateral grinding. The elastic pressure plate presses the sandpaper on both sides, ensuring stable contact between the sandpaper and the electrode surfaces. Combined with the symmetrical grinding structure, this further maintains the original diameter and shape of the electrode, preventing grinding misalignment. The bidirectional grinding structure formed by the sandpaper on both sides of the grinding slit reduces the stroke required for a single grinding operation, shortens grinding time, and improves the overall convenience of the grinding process.
[0034] Specifically, sandpaper 43 is provided on both sides of the grinding slit 42. The pressure plate 41 made of elastic material presses the sandpaper 43 on both sides of the plate onto the corresponding side surface of the electrode 2 through its own elasticity. When the electrode 2 moves in a straight reciprocating motion, the surface of the electrode 2 and the sandpaper 43 on both sides of the grinding slit 42 generate uniform relative friction at the same time, thus completing the grinding operation on the surface of the electrode 2.
[0035] In some embodiments, the grinding assembly 4 further includes a moving element connected to a plurality of pressure plates 41. The moving element is used to drive the plurality of pressure plates 41 to move along a first direction so that different positions of the sandpaper 43 contact the electrode 2.
[0036] The electrode grinding device of this invention uses a moving component to drive a pressure plate, which moves the sandpaper along a first direction. This allows different positions of the sandpaper to alternately contact the electrode, preventing excessive wear on a single area of the sandpaper and ensuring consistent grinding precision. The moving component fully utilizes the entire grinding area of the sandpaper, extending its lifespan, reducing the frequency of consumable replacements, and improving the continuity and efficiency of the grinding operation.
[0037] Specifically, the moving parts of the grinding component 4 are connected to multiple pressure plates 41. The moving parts drive the multiple pressure plates 41 to move along the first direction, which in turn causes the sandpaper 43 to move synchronously along the first direction, so that the unused new position of the sandpaper 43 continues to contact the surface of the electrode 2, thereby achieving continuous and stable grinding operation.
[0038] In some embodiments, such as Figure 2 As shown, multiple sandpapers 43 with different grit sizes are spaced apart along the first direction in the grinding seam 42.
[0039] The electrode grinding device of this invention achieves gradient grinding of the electrode surface by using sandpaper of different grits spaced at intervals along a first direction within the grinding slit. This eliminates the need to change sandpaper, allowing for multi-stage grinding requirements such as coarse grinding and fine grinding, thus improving grinding efficiency and effectiveness. The orderly arrangement of sandpaper of different grits, combined with the moving motion driven by the moving parts, allows the grinding process to progress gradually from removing thick oxide films to refining surface roughness, ensuring the flatness and smoothness of the electrode surface. By adapting different grit sandpapers to the needs of different grinding stages of the electrode, the device avoids the problems of incomplete or excessive grinding with a single grit sandpaper, effectively maintaining the original diameter and shape of the electrode. The integrated arrangement of different grit sandpapers within the grinding slit simplifies the multi-precision grinding operation process, reduces the frequency of manual sandpaper changes, and improves the continuity and stability of the grinding operation.
[0040] Specifically, the moving part drives the pressure plate 41 to move along the first direction, causing sandpaper 43 of different grits to contact the surface of the electrode 2 in sequence, realizing continuous grinding operation from coarse grinding to fine grinding (or switching grinding precision as needed), and removing the oxide film on the surface of the electrode 2 through gradient grinding of sandpaper 43 of different grits.
[0041] In some embodiments, a cleaning cloth is provided between adjacent sandpaper 43 in the first direction. The cleaning cloth is connected to the pressure plate 41 and is used to clean metal shavings from the surface of the electrode 2.
[0042] The electrode polishing device of this invention uses a cleaning cloth placed between adjacent sandpapers to simultaneously clean metal shavings from the electrode surface during polishing. This prevents residual metal shavings from affecting the polishing accuracy of subsequent sandpaper, ensuring the continuity and effectiveness of gradient polishing. The cleaning cloth is connected to a pressure plate, and the elastic pressure of the pressure plate ensures the cleaning cloth adheres tightly to the electrode surface, improving the efficiency of metal shaving removal and preventing metal shavings from scratching the electrode surface. The synergistic effect of the cleaning cloth and sandpapers of different grits achieves integrated polishing and cleaning, eliminating the need for additional cleaning steps, simplifying the polishing process, and improving overall work efficiency. The timely removal of metal shavings from the electrode surface by the cleaning cloth reduces metal shavings adhering to the sandpaper surface, extending the effective lifespan of the sandpaper and reducing consumable replacement costs. The spaced arrangement of the cleaning cloth and sandpaper in the first direction adapts to the rhythm of gradient polishing, ensuring the cleanliness of the electrode surface after each stage of polishing, providing a clean surface foundation for the next stage of polishing, and guaranteeing the final surface flatness and electrochemical properties of the electrode.
[0043] Specifically, the moving part drives the pressure plate 41 to move along the first direction, causing sandpaper 43 of different grits to sequentially perform gradient polishing on the surface of electrode 2. The metal shavings generated during the polishing process are simultaneously wiped away by the cleaning cloth between adjacent sandpaper 43 when it comes into contact with and rubs against the surface of electrode 2, ensuring the polishing effect of subsequent sandpaper 43.
[0044] In some embodiments, such as Figure 2 As shown, the polishing assembly 4 also includes a base 44, which is connected to the pressure plate 41 and is used to support the pressure plate 41.
[0045] The electrode polishing device of this invention provides stable support for the pressure plate through the base, ensuring the stability of the pressure plate's structure and preventing the pressure plate from shifting or deforming due to its own elasticity or the force exerted upon contact with the electrode, thus ensuring the precise contact position between the sandpaper and the electrode.
[0046] Specifically, the base 44 of the grinding component 4 provides stable support for the pressure plate 41. After the pressure plate 41 is connected to the base 44, the structure remains stable. A grinding seam 42 is formed between multiple pressure plates 41 and sandpaper 43 is placed in the seam.
[0047] In some embodiments, such as Figure 2 As shown, the grinding assembly 4 also includes a top plate 45 and an adjusting member 46. The pressure plate 41 is located between the top plate 45 and the base 44. The adjusting member 46 is used to adjust the distance between the top plate 45 and the base 44, thereby adjusting the pressure of the pressure plate 41 on the electrode 2.
[0048] The electrode polishing device of this invention adjusts the distance between the top plate and the base via an adjusting component, enabling flexible control of the pressure applied to the electrode by the pressure plate. The polishing pressure can be adapted to the electrode material and oxide film thickness, avoiding over-polishing due to excessive pressure or incomplete polishing due to insufficient pressure. The cooperation between the top plate and the base creates a bidirectional limit on the pressure plate, and the adjustable distance ensures controllable elastic deformation of the pressure plate, guaranteeing uniform pressure on the sandpaper and consistent polishing of the electrode surface. The pressure adjustment function of the adjusting component adapts to the polishing needs of different grit sandpapers; increasing pressure during coarse polishing improves film removal efficiency, while decreasing pressure during fine polishing refines surface smoothness, enhancing the adaptability and precision of the polishing process.
[0049] Specifically, the pressure plate 41 of the grinding component 4 is located between the base 44 and the top plate 45. The base 44 provides bottom support for the pressure plate 41. The adjusting component 46 can adjust the distance between the top plate 45 and the base 44. The clamp 1 holds the columnar electrode 2. The moving component 3 drives the electrode 2 into the grinding slit 42 formed by multiple pressure plates 41. By adjusting the distance between the top plate 45 and the base 44, the pressure plate 41 made of elastic material is compressed to different degrees. The pressure plate 41 converts the compressive force into the force of the sandpaper 43 in the grinding slit 42, thereby adjusting the pressure of the sandpaper 43 in contact with the surface of the electrode 2. The moving component 3 drives the electrode 2 to move. Under the adjusted pressure, the sandpaper 43 generates relative friction with the surface of the electrode 2, completing the grinding operation of the electrode 2 surface.
[0050] In some embodiments, such as Figure 2As shown, the adjusting member 46 includes a plurality of threaded rods, the central axis of which is perpendicular to the first direction. The threaded rods pass through the base 44 and the top plate 45, and are threadedly connected to the base 44 and the top plate 45.
[0051] The electrode grinding device of this invention adjusts the distance between the top plate and the base through the threaded transmission of the threaded rod, thereby achieving precise adjustment of the pressure plate on the electrode. This allows the grinding pressure to be finely controlled according to requirements, ensuring the stability of the grinding effect.
[0052] Specifically, by rotating the threaded rod, the distance between the top plate 45 and the base 44 is changed by the threaded transmission, thereby creating a corresponding degree of compression on the elastic pressure plate 41 located between the two.
[0053] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0055] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0056] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0057] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0058] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.
Claims
1. An electrode polishing device, characterized in that, include: Clamp (1), the clamp (1) is used to clamp the cylindrical electrode (2); A moving component (3) is used to drive the clamp (1) to rotate and move linearly; A grinding assembly (4) includes multiple pressure plates (41) forming a grinding slit (42) between the multiple pressure plates (41). Sandpaper (43) is provided in the grinding slit (42). The pressure plates (41) are made of elastic material so that the sandpaper (43) contacts the electrode (2) in the grinding slit (42). The moving component (3) drives the electrode (2) into the grinding slit (42), and the sandpaper (43) contacts the electrode (2) under the elastic force of the pressure plate (41). The moving component (3) drives the electrode (2) to move and rotate linearly on the sandpaper (43) so that the sandpaper (43) grinds the electrode (2).
2. The electrode polishing device according to claim 1, characterized in that, The moving component (3) includes a slide rail (31) and a slide block (32). The slide block (32) is slidably disposed on the slide rail (31). The movement direction of the slide block (32) is parallel to the central axis of the electrode (2). The electrode (2) is connected to the slide block (32). The slide block (32) is used to drive the electrode (2) into the grinding slit (42).
3. The electrode polishing device according to claim 2, characterized in that, The moving component (3) also includes a rotating motor (33), which is mounted on the slide (32). The output end of the rotating motor (33) is connected to the clamp (1), and the rotating motor (33) is used to drive the electrode (2) to rotate.
4. The electrode polishing apparatus according to claim 1, characterized in that, The sandpaper (43) is respectively provided on both sides of the grinding seam (42).
5. The electrode polishing apparatus according to claim 1 or 4, characterized in that, The polishing assembly (4) also includes a moving part connected to a plurality of pressure plates (41). The moving part is used to drive the plurality of pressure plates (41) to move along a first direction so that different positions of the sandpaper (43) contact the electrode (2).
6. The electrode polishing apparatus according to claim 5, characterized in that, The grinding seam (42) is provided with a plurality of sandpapers (43) of different grit sizes at intervals along the first direction.
7. The electrode polishing apparatus according to claim 6, characterized in that, A cleaning cloth is provided between adjacent sandpapers (43) in the first direction. The cleaning cloth is connected to the pressure plate (41) and is used to clean metal shavings from the surface of the electrode (2).
8. The electrode polishing apparatus according to claim 1, characterized in that, The polishing assembly (4) also includes a base (44) which is connected to the pressure plate (41) and is used to support the pressure plate (41).
9. The electrode polishing apparatus according to claim 8, characterized in that, The grinding assembly (4) also includes a top plate (45) and an adjusting member (46). The pressure plate (41) is located between the top plate (45) and the base (44). The adjusting member (46) is used to adjust the distance between the top plate (45) and the base (44), thereby adjusting the pressure of the pressure plate (41) on the electrode (2).
10. The electrode polishing apparatus according to claim 9, characterized in that, The adjusting member (46) includes a plurality of threaded rods, the central axis of which is perpendicular to the first direction. The threaded rods pass through the base (44) and the top plate (45) and are threadedly connected to the base (44) and the top plate (45).