Manual SIC seed crystal bonding device and method

Abstract

The invention belongs to the technical field of seed crystal bonding, and particularly discloses a manual SIC seed crystal bonding device and method.The manual SIC seed crystal bonding device comprises two supporting frames, an upper pressing mechanism used for extruding seed crystals is arranged between the two supporting frames, and driving mechanisms used for driving the upper pressing mechanism to press downwards are arranged at the upper ends of the two supporting frames; the upper pressing mechanism comprises a limiting plate fixedly connected between the two supporting frames, five transmission rods are slidably connected to the limiting plate in a penetrating mode at the same intervals, and by means of the design that a first driving plate, a second driving plate and a third driving plate in a driving part are sequentially arranged in the sliding direction of the transmission plates and are arranged at the uniform intervals, the driving plates are driven to rotate. The step-shaped downward pressing time sequence of the center pressing piece, the inner ring pressing piece and the outer ring pressing piece is achieved; and meanwhile, through the up-down connecting structure of the third driving plate and the fourth driving plate and the matching of the driving plates and the stress inclined surfaces of the transmission rods, the effects of primary pressure applying and secondary supplementary pressure applying are formed in the edge pressure applying stage.

Description

Technical Field

[0001] This invention belongs to the field of seed crystal bonding technology, specifically relating to a manual SiC seed crystal bonding device and method. Background Technology

[0002] In silicon carbide (SiC) crystal growth, physical vapor transport (PVT) has become the mainstream technology due to its mature process and stable crystal quality. The bonding quality between the seed crystal and the graphite part directly determines the stability of subsequent crystal growth. Among them, "gradual pressure from the center to the edge" is the core requirement of the bonding process. Only by following this sequence can the air bubbles in the adhesive layer gradually diffuse outward from the center and be discharged.

[0003] Currently, manual bonding often uses an airbag pressure method. Although the hemispherical shape of the airbag can initially achieve the initial contact of the center, the pressure transmission depends on the mechanical properties of the curved surface of the airbag. The pressure naturally concentrates in the central area with a smaller radius of curvature, resulting in insufficient pressure in the edge area. This imbalance between sufficient pressure in the center and insufficient pressure at the edge often makes it difficult for the edge adhesive layer to fully adhere due to insufficient pressure. Not only are there residual air bubbles, but localized areas of weak adhesion are also formed, affecting the bonding consistency between the seed crystal and the graphite part. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a manual SiC seed crystal bonding device and method.

[0005] To achieve the above objectives, the present invention provides a manual SiC seed crystal bonding device, comprising two support frames, an upper pressing mechanism for pressing the seed crystal is provided between the two support frames, and a driving mechanism for driving the upper pressing mechanism to press down is provided at the upper end of the two support frames. The pressing mechanism includes a limiting plate fixedly connected between the two support frames. Five transmission rods with consistent spacing are slidably connected through the limiting plate. A central pressing member is fixedly connected to the lower end of the transmission rod located in the middle. Inner ring pressing members are fixedly connected to the lower ends of the transmission rods located on both sides of the central pressing member. Outer ring pressing members are fixedly connected to the lower ends of the transmission rods located on both sides of the inner ring pressing member. A protrusion is fixedly connected to one side of each transmission rod. A return spring is fixedly connected to the upper end of each protrusion. The upper end of each return spring is fixedly connected to the limiting plate. A force-bearing inclined surface is opened at the upper end of each transmission rod.

[0006] In the above technical solution, the driving mechanism further includes a base plate fixedly installed on the upper end of the two support frames, a guide concave plate fixedly connected to the lower end of the base plate, a transmission plate slidably connected to the lower end of the guide concave plate, and a driving component provided at the lower end of the transmission plate.

[0007] In the above technical solution, the driving component further includes a first driving plate fixedly installed at the middle of the lower end of the transmission plate, a second driving plate fixedly installed on both sides of the transmission plate corresponding to the first driving plate, a third driving plate fixedly installed on both sides of the transmission plate corresponding to the second driving plate, and a fourth driving plate fixedly connected to one side of the lower end of the third driving plate.

[0008] In the above technical solution, the first driving plate, the second driving plate, the third driving plate and the fourth driving plate are all provided with extrusion slopes on one side, and the first driving plate, the second driving plate and the third driving plate are spaced at the same distance from each other.

[0009] In the above technical solution, the first drive plate, the second drive plate, the third drive plate and the fourth drive plate are arranged sequentially backward along the sliding direction of the transmission plate, and the spacing between the first drive plate, the second drive plate, the third drive plate and the fourth drive plate is the same in the sliding direction.

[0010] In the above technical solution, the first driving board has the largest thickness, the second driving board has a smaller thickness than the first driving board, the third driving board and the fourth driving board have the same thickness, and the thickness of the third driving board and the fourth driving board is the same as the thickness of the second driving board.

[0011] In the above technical solution, a feed baffle is fixedly connected to one end of the transmission plate, and an exit baffle is fixedly connected to the other end of the transmission plate. A control handle is fixedly connected to one side of the feed baffle away from the transmission plate.

[0012] A manual SiC seed bonding method includes the following steps: S1, SiC seed coated with a preset thickness of high temperature adhesive is concentrically aligned with a graphite part and placed in the working area between two support frames (1), ensuring that the center, middle ring area and edge area of ​​the seed are respectively aligned with the center pressure piece (23), inner ring pressure piece (24) and outer ring pressure piece (25) of the upper pressure mechanism (2); at this time the device is in the initial state, the reset spring (27) is naturally extended, and the transmission rod (22) is supported by the protrusion (26), so that the center pressure piece (23), inner ring pressure piece (24) and outer ring pressure piece (25) are all suspended, avoiding contact with the seed and causing interference; S2. Push the feed baffle (34) towards the support frame (1) to drive the transmission plate (33) to slide along the guide concave plate (32); during the movement of the transmission plate (33), the first drive plate (331) of the lower drive component (330) first contacts the force-bearing inclined surface (28) of the transmission rod (22) in the middle, and the extrusion inclined surface (335) cooperates with the force-bearing inclined surface (28) to convert the horizontal force into vertical pressure, push the transmission rod (22) down and drive the central pressure component (23) to compact the seed crystal center, and initially discharge the central adhesive layer bubbles; S3. Continue pushing the control handle (36). When the transmission plate (33) moves to the preset stroke, the second drive plate (332) contacts the force-bearing inclined surface (28) of the transmission rods (22) on both sides of the center pressure member (23), pushing the inner ring pressure member (24) down to compact the middle ring area of ​​the seed crystal, causing the bubble to migrate to the edge; then the third drive plate (333) contacts the force-bearing inclined surface (28) of the transmission rods (22) on both sides of the inner ring pressure member (24), driving the outer ring pressure member (25) down to initially compact the edge area of ​​the seed crystal; S4. Continue to push the control handle (36) until the feed baffle (34) and the guide concave plate (32) are in contact. The third drive plate (333) drives the fourth drive plate (334) to move synchronously, so that the fourth drive plate (334) contacts the force-bearing inclined surface (28) of the transmission rod (22) corresponding to the outer ring pressure piece (25), and applies secondary supplementary pressure to further compact the seed crystal edge adhesive layer and completely remove residual air bubbles. S5. Maintain the pressure of the control handle (36) and hold it in place. After the high-temperature adhesive has cured according to the preset process, pull the control handle (36) in the opposite direction to drive the transmission plate (33) and the drive component (330) to reset. The reset spring (27) releases its elastic potential energy and pushes the transmission rod (22) and each pressure component upward through the protrusion (26) to remove the bonded seed crystal and graphite component.

[0013] Compared with the prior art, the present invention has the following beneficial effects: (1) By controlling the design of the handle, feed baffle and transmission plate, and with the guide plate limiting the sliding of the transmission plate, the convenient operation of "pulling and pressing" is realized. Manually pushing or pulling the control handle can drive the transmission plate to slide smoothly along the guide plate. Then, the horizontal pulling force is converted into vertical pressing force through the drive component. No additional power source or complicated debugging is required. The operation is intuitive and low in intensity, which is fully compatible with the needs of small and medium batch production and scientific research scenarios for simple operation and reduces the technical threshold of manual bonding.

[0014] (2) By using the sequential arrangement and uniform spacing of the first, second, and third driving plates in the driving components along the sliding direction of the transmission plate, the stepped pressing sequence of the center pressing component, inner ring pressing component, and outer ring pressing component is realized. At the same time, through the upper and lower connection structure of the third and fourth driving plates, and the cooperation between each driving plate and the force-bearing inclined surface of the transmission rod, the effect of initial pressing and secondary supplementary pressing is formed in the edge pressing stage. Combined with the design that the first driving plate has the largest thickness and the second, third, and fourth driving plates have the same thickness, it not only ensures sufficient pressure intensity in the central area, but also makes up for the problem of insufficient edge pressure through secondary pressing. This effectively solves the problem of residual adhesive bubbles and insufficient edge adhesion, significantly improves the uniformity and stability of seed crystal bonding, and provides a guarantee for the subsequent PVT method SiC crystal growth. Attached Figure Description

[0015] Figure 1 This is a front view of the first state of the overall structure proposed in this invention; Figure 2 This is a side view of the overall structure proposed in the present invention in its first state. Figure 3 This is a front view of the second state of the overall structure proposed in this invention; Figure 4 This is a schematic diagram of the drive component structure proposed in this invention; Figure 5 This is a schematic diagram of the upper pressing mechanism proposed in this invention; Figure 6 This is a partial structural cross-sectional view of the present invention.

[0016] In the diagram: 1. Support frame; 2. Pressing mechanism; 21. Limiting plate; 22. Transmission rod; 23. Center pressing component; 24. Inner ring pressing component; 25. Outer ring pressing component; 26. Protrusion; 27. Return spring; 28. Force-bearing inclined surface; 3. Drive mechanism; 31. Base plate; 32. Guide concave plate; 33. Transmission plate; 330. Drive component; 331. First drive plate; 332. Second drive plate; 333. Third drive plate; 334. Fourth drive plate; 335. Extrusion inclined surface; 34. Feed baffle; 35. Exit baffle; 36. Control handle. Detailed Implementation

[0017] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] like Figures 1-6 The manual SiC seed bonding device shown includes two support frames 1, with an upper pressing mechanism 2 for pressing the seed crystal between the two support frames 1. A driving mechanism 3 for driving the upper pressing mechanism 2 to press down is provided at the upper end of the two support frames 1. The upper pressing mechanism 2 includes a limiting plate 21 fixedly connected between the two support frames 1. Five transmission rods 22 with the same spacing are slidably connected through the limiting plate 21. The lower end of the transmission rod 22 located in the middle is fixedly connected to a central pressing member 23. The lower ends of the transmission rods 22 located on both sides of the central pressing member 23 are jointly fixedly connected to an inner ring pressing member 24. The lower ends of the transmission rods 22 located on both sides of the inner ring pressing member 24 are jointly fixedly connected to an outer ring pressing member 25. A protrusion 26 is fixedly connected to one side of each transmission rod 22. A return spring 27 is fixedly connected to the upper end of each protrusion 26. The upper end of each return spring 27 is fixedly connected to the limiting plate 21. A force-bearing inclined surface 28 is opened at the upper end of the transmission rod 22. The driving mechanism 3 includes a base plate 31 fixedly mounted on the upper end of two support frames 1. A guide plate 32 is fixedly connected to the lower end of the base plate 31. A transmission plate 33 is slidably connected to the lower end of the guide plate 32. A driving component 330 is provided at the lower end of the transmission plate 33. The driving component 330 includes a first driving plate 331 fixedly mounted at the middle of the lower end of the transmission plate 33. A second driving plate 332 is fixedly mounted on both sides of the transmission plate 33 corresponding to the first driving plate 331. A third driving plate 333 is fixedly mounted on both sides of the transmission plate 33 corresponding to the second driving plate 332. A fourth driving plate 334 is fixedly connected to one side of the lower end of the third driving plate 333. An extrusion slope 335 is provided on one side of each of the first driving plate 331, the second driving plate 332, the third driving plate 333, and the fourth driving plate 334. The plates 333 are spaced evenly together. The first drive plate 331, the second drive plate 332, the third drive plate 333, and the fourth drive plate 334 are arranged sequentially backward along the sliding direction of the transmission plate 33, and the spacing between the first drive plate 331, the second drive plate 332, the third drive plate 333, and the fourth drive plate 334 is the same in this sliding direction. The first drive plate 331 has the largest thickness, and the second drive plate 332 has a smaller thickness than the first drive plate 331. The third drive plate 333 and the fourth drive plate 334 have the same thickness, and the thickness of the third drive plate 333 and the fourth drive plate 334 is the same as the thickness of the second drive plate 332. A feed baffle 34 is fixedly connected to one end of the transmission plate 33, and an exit baffle 35 is fixedly connected to the other end of the transmission plate 33. A control handle 36 is fixedly connected to one side of the feed baffle 34 away from the transmission plate 33.

[0019] A manual method for bonding SiC seed crystals includes the following steps: S1. In the initial state of the device, the reset spring 27 is in a naturally extended state, supporting the transmission rod 22 upward through the protrusion 26. This keeps the center pressing member 23, inner ring pressing member 24, and outer ring pressing member 25 of the upper pressing mechanism 2 suspended, maintaining a distance from the SiC seed crystal and graphite part to be bonded below, thus reserving space for the placement of the seed crystal and graphite part. At this time, the transmission plate 33 of the drive mechanism 3 is in the initial position within the guide recess 32, and the first drive plate 331 and the second drive plate 332 of the drive component 330 are in the same position. Neither the third drive plate 333 nor the fourth drive plate 334 are in contact with the force-bearing inclined surface 28 of the transmission rod 22, ensuring that there is no interference between the components when placing the seed crystal. The SIC seed crystal coated with high-temperature adhesive is concentrically aligned with the graphite part and placed in the working space between the two support frames 1, and located directly below the central pressure component 23, the inner ring pressure component 24, and the outer ring pressure component 25. The support frame 1 provides rigid support for the entire device, ensuring the installation stability of the upper pressure mechanism 2 and the drive mechanism 3, and avoiding structural shaking during the pressure application process.

[0020] S2. Initial compaction stage: Manually hold the control handle 36 and push the feed baffle 34 towards the device. The feed baffle 34 drives the transmission plate 33 to move smoothly along the sliding direction of the guide concave plate 32. The guide concave plate 32 restricts the movement trajectory of the transmission plate 33 through sliding cooperation with the transmission plate 33, ensuring that it feeds only in the horizontal direction and avoiding deviation that could cause misalignment between the drive plate and the transmission rod. During the movement of the transmission plate 33, the first drive plate 331 of its lower drive component 330 first contacts the force-bearing inclined surface 28 of the transmission rod 22 in the middle. Since the first drive plate 331 has a pressing inclined surface 335 on one side, as the transmission plate 33 continues to feed, the pressing inclined surface 335 interacts with the force-bearing inclined surface 28, converting the horizontal feeding force into a vertical downward force. The pressure pushes the transmission rod 22 in the middle to slide downward along the through hole of the limiting plate 21. When the transmission rod 22 moves downward, it drives the central pressure member 23 at the lower end to move downward synchronously until the central pressure member 23 is in close contact with the central area of ​​the seed crystal and applies a preset pressure. The preset pressure is determined by the thickness of the first drive plate 331. Since the first drive plate 331 has the largest thickness, it can provide the strongest pressure intensity. During this process, the central pressure member 23 first compacts the adhesive layer in the center of the seed crystal and initially pushes the air bubbles in the adhesive layer towards the edge, achieving the effect of "pressing the center first and starting the air release", avoiding the air bubbles from being stuck in the core area of ​​the seed crystal. At the same time, the protrusion 26 on one side of the transmission rod 22 in the middle moves downward with the transmission rod 22, stretching the reset spring 27 above, storing elastic potential energy for subsequent reset.

[0021] S3, In the inner ring compaction stage, continue pushing the control handle 36, and the transmission plate 33 drives the drive component 330 to continue feeding. Since the first drive plate 331, the second drive plate 332, and the third drive plate 333 are arranged sequentially and evenly along the sliding direction of the transmission plate 33, when the transmission plate 33 moves to the preset stroke, the extrusion slope 335 of the second drive plate 332 contacts the force-bearing slope 28 of the two transmission rods 22 on both sides of the central pressure member 23. Similarly, the cooperation between the extrusion slope 335 and the force-bearing slope 28 converts the horizontal feeding force into vertical pressure, pushing the transmission rods on both sides. 22 slides downward along the limiting plate 21, thereby driving the inner ring pressure member 24, which is connected to the lower end of the two transmission rods 22, to move down synchronously until the inner ring pressure member 24 contacts the middle ring area of ​​the seed crystal; because the thickness of the second drive plate 332 is smaller than that of the first drive plate 331, the pressure it applies is slightly lower than that of the center pressure member 23, forming a gradient of "center pressure > inner ring pressure", which pushes the bubbles in the adhesive layer to continuously diffuse from the central area to the edge ring area, avoiding the accumulation of bubbles in the middle ring area; at this time, the protrusions 26 of the two transmission rods 22 synchronously compress the corresponding reset springs 27, storing elastic potential energy for subsequent reset.

[0022] S4, the initial compaction stage of the outer ring: continuously push the control handle 36 until the feed baffle 34 contacts the guide concave plate 32, and continue to push the control handle 36. The handle 36 drives the feed baffle 34 and the transmission plate to continuously feed along the guide concave plate. As the transmission plate 33 feeds, the third drive plate 333, due to its installation position being closer to the transmission rod 22, has its extrusion slope 335 on one side first contacting the force-bearing slope 28 of the two transmission rods 22 at the upper end of the outer ring pressing member 25. With the cooperation of the extrusion slope 335 and the force-bearing slope 28, the horizontal feeding force of the transmission plate 33 is converted into vertical downward pressure, pushing the transmission rod 22 to slide downward along the limiting plate 21, thereby driving the outer ring pressing member 25 to move downward synchronously. At this time, the outer ring pressing member 25 only applies "initial pressure" under the action of the third drive plate 333, which can initially compact the adhesive layer in the seed crystal edge ring area, while continuing to push the residual bubbles to flow towards the outermost edge of the seed crystal, avoiding the accumulation of bubbles in the edge ring area.

[0023] In the final compaction stage of the outer ring, as the transmission plate 33 is fed, the fourth drive plate 334 follows the third drive plate 333 and contacts the transmission rod 22, applying "secondary supplementary pressure" to the transmission rod 22. Since the fourth drive plate 334 and the third drive plate 333 have the same thickness, and both have the same thickness as the second drive plate 332, the secondary supplementary pressure and the initial pressure of the third drive plate 333 are superimposed to form a gradient effect, which drives the outer ring pressing component 25 to further compact the seed crystal edge adhesive layer, completely expelling the residual micro air bubbles in the edge area to the gap between the seed crystal and the graphite component, while avoiding excessive pressure from the outer ring pressing component 25 at one time, which would cause the edge adhesive layer to become too thin.

[0024] S5. Reset phase: After the adhesive layer has cured, manually pull the control handle 36 to drive the feed baffle 34 and transmission plate 33 to slide in the opposite direction along the guide concave plate 32 until the exit baffle 35 contacts the support frame 1, and the transmission plate 33 returns to its initial position. When the transmission plate 33 is reset, each drive plate of the drive component 330 disengages from the force-bearing inclined surface 28 of the transmission rod 22, and the previously compressed reset spring 27 releases its elastic potential energy, pushing the five transmission rods 22 upward through the protrusion 26 to reset along the through hole of the limiting plate 21. The transmission rods 22 drive the central pressure member 23, inner ring pressure member 24, and outer ring pressure member 25 to move upward synchronously, returning to the initial suspended state, and no longer applying pressure to the bonded seed crystal and graphite part.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A manual SiC seed crystal bonding device, comprising two support frames (1), characterized in that, An upper pressing mechanism (2) for extruding seed crystals is provided between the two support frames (1), and a driving mechanism (3) for driving the upper pressing mechanism (2) to press down is provided at the upper end of the two support frames (1); the upper pressing mechanism (2) includes a limiting plate (21) fixedly connected between the two support frames (1), and five transmission rods (22) with equal spacing are slidably connected through the limiting plate (21). The lower end of the transmission rod (22) located in the middle is fixedly connected to a central pressing member (23). The lower ends of the transmission rods (22) on both sides of the core pressure member (23) are fixedly connected to the inner ring pressure member (24). The lower ends of the transmission rods (22) on both sides of the inner ring pressure member (24) are fixedly connected to the outer ring pressure member (25). A protrusion (26) is fixedly connected to one side of each transmission rod (22). A return spring (27) is fixedly connected to the upper end of each protrusion (26). The upper end of each return spring (27) is fixedly connected to the limiting plate (21). A force-bearing inclined surface (28) is opened at the upper end of the transmission rod (22).

2. The manual SiC seed bonding device according to claim 1, characterized in that, The drive mechanism (3) includes a base plate (31) fixedly installed on the upper end of the two support frames (1), a guide plate (32) fixedly connected to the lower end of the base plate (31), a transmission plate (33) slidably connected to the lower end of the guide plate (32), and a drive component (330) provided at the lower end of the transmission plate (33).

3. The manual SiC seed bonding device according to claim 2, characterized in that, The drive component (330) includes a first drive plate (331) fixedly installed at the middle of the lower end of the transmission plate (33), a second drive plate (332) fixedly installed on both sides of the transmission plate (331) corresponding to the first drive plate (331), a third drive plate (333) fixedly installed on both sides of the transmission plate (332) corresponding to the second drive plate (332), and a fourth drive plate (334) fixedly connected to one side of the lower end of the third drive plate (333).

4. The manual SiC seed bonding device according to claim 3, characterized in that, The first drive plate (331), the second drive plate (332), the third drive plate (333) and the fourth drive plate (334) are all provided with an extrusion slope (335) on one side, and the first drive plate (331), the second drive plate (332) and the third drive plate (333) are spaced at the same distance from each other.

5. The manual SiC seed bonding device according to claim 4, characterized in that, The first drive plate (331), the second drive plate (332), the third drive plate (333) and the fourth drive plate (334) are arranged sequentially backward along the sliding direction of the transmission plate (33), and the spacing between the first drive plate (331), the second drive plate (332), the third drive plate (333) and the fourth drive plate (334) in the sliding direction is the same.

6. The manual SiC seed bonding device according to claim 5, characterized in that, The first drive board (331) has the largest thickness, and the second drive board (332) has a thickness less than the first drive board (331). The third drive board (333) and the fourth drive board (334) have the same thickness, and the thickness of the third drive board (333) and the fourth drive board (334) is the same as the thickness of the second drive board (332).

7. The manual SiC seed bonding device according to claim 2, characterized in that, One end of the transmission plate (33) is fixedly connected to a feed baffle (34), and the other end of the transmission plate (33) is fixedly connected to an exit baffle (35). A control handle (36) is fixedly connected to one side of the feed baffle (34) away from the transmission plate (33).

8. A manual SiC seed bonding method, used in the manual SiC seed bonding apparatus as described in any one of claims 1-7, comprising the following steps: S1. Align the SiC seed crystal coated with a pre-set thickness of high-temperature adhesive with the graphite component concentrically and place it in the working area between the two support frames, ensuring that the center, middle ring area, and edge area of ​​the seed crystal correspond to the center pressure component, inner ring pressure component, and outer ring pressure component of the upper pressing mechanism, respectively. At this time, the device is in the initial state, the reset spring extends naturally, and the transmission rod is supported by the protrusion, so that the center pressure component, inner ring pressure component, and outer ring pressure component are all suspended in the air to avoid contact with the seed crystal and causing interference. S2. Push the feed baffle towards the support frame to drive the transmission plate to slide along the guide concave plate. During the movement of the transmission plate, the first drive plate of its lower drive component first contacts the force-bearing inclined surface of the transmission rod in the middle. The squeezing inclined surface and the force-bearing inclined surface cooperate to convert the horizontal force into vertical pressure, push the transmission rod down and drive the central pressing component to compact the seed crystal center, and initially discharge the central adhesive layer bubbles. S3. Continue to push the control handle. When the transmission plate moves to the preset stroke, the second drive plate contacts the force-bearing inclined surface of the transmission rods on both sides of the center pressure member, pushing the inner ring pressure member down to compact the middle ring area of ​​the seed crystal, causing the bubble to migrate to the edge. Then the third drive plate contacts the force-bearing inclined surface of the transmission rods on both sides of the inner ring pressure member, driving the outer ring pressure member down to initially compact the edge area of ​​the seed crystal. S4. Continue to push the control handle until the feed baffle and guide concave plate are in contact. The third drive plate drives the fourth drive plate to move synchronously, so that the fourth drive plate contacts the force-bearing inclined surface of the transmission rod corresponding to the outer ring pressure component, apply secondary supplementary pressure, further compact the seed crystal edge adhesive layer, and completely remove residual air bubbles. S5. Maintain pressure by holding the control handle. After the high-temperature adhesive has cured according to the preset process, pull the control handle in the opposite direction to reset the transmission plate and drive components. The reset spring releases its elastic potential energy and pushes the transmission rod and each pressure component upward through the protrusion to remove the bonded seed crystal and graphite part.

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