Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display panel, a composite film located on the backlight side of the display panel, and a near field communication module located on the side, away from the display panel, of the composite film. The display panel comprises a central area and an edge area, and the edge area surrounds the central area; the composite film comprises a plurality of film layers, and the projection of at least one film layer in the composite film on the display panel is overlapped with at least part of the edge area; and at least one film layer with a conductive function in the composite film is electrically connected with the grounded flexible circuit board. Thus, electrostatic charges at the edge of the display module can be quickly led into the grounding end of the flexible circuit board through at least one film layer with a conductive function in the composite film, and the situation that static electricity breaks down the display panel or damages wires in the display panel, and consequently dark spots or abnormal display is caused is prevented.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] A Near Field Communication (NFC) module is an electronic component integrating near-field communication technology, typically embedded in mobile phones and wearable devices. It enables wireless data exchange and communication over short distances through electromagnetic induction. As user demands for NFC module performance increase, there must be no metal on either side of the NFC traces to interfere with electromagnetic induction. Related technologies often eliminate the copper sheet used for electrostatic discharge (ESD) protection on the NFC to reduce its impact on ESD. However, this can lead to static electricity buildup on the sides of the phone or wearable device, potentially damaging the flexible display panel, injuring the traces, and causing dark spots or display abnormalities.

[0003] Therefore, how to utilize the existing film layer design in display devices to provide an electrostatic grounding path while reducing the impact on NFC electromagnetic induction, so as to protect the display panel traces, has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] To address the aforementioned technical issues, this disclosure provides a display module and display device that, through existing film layer design in the display device, provides a path for electrostatic grounding while reducing the impact on NFC electromagnetic induction, thereby protecting the display panel traces.

[0005] This disclosure provides a display module, including: a display panel, the display panel including a backlight side; the display panel including a central region and an edge region, the edge region surrounding the central region; A composite film, wherein the composite film is located on the backlight side of the display panel. A near-field communication module is located on the side of the composite film opposite to the display panel; The composite film comprises multiple film layers, and the projection of at least one film layer on the display panel overlaps with at least a portion of the edge region; the at least one film layer overlapping with the edge region has a conductive function. The display panel includes a flexible circuit board, which is grounded, and at least one conductive layer of the composite film is electrically connected to the flexible circuit board.

[0006] Based on the same inventive concept, this disclosure provides a display device, including the display module as described above.

[0007] The technical solution provided in this disclosure has the following advantages compared with the prior art: This disclosure provides a display module and display device, including: a display panel, the display panel including a backlight side; the display panel including a central region and an edge region, the edge region surrounding the central region; a composite film, the composite film located on the backlight side of the display panel; a near-field communication module, the near-field communication module located on the side of the composite film opposite to the display panel; the composite film including multiple film layers, at least one of the film layers in the composite film having a projection on the display panel overlapping at least a portion of the edge region; at least one film layer in the composite film overlapping the edge region having a conductive function; the display panel including a flexible circuit board, the flexible circuit board being grounded, and at least one film layer in the composite film having a conductive function being electrically connected to the flexible circuit board. By setting at least one film layer in the composite film having a conductive function to be electrically connected to the grounded flexible circuit board, an effective electrostatic discharge path can be formed; when static electricity is generated by the human body or the external environment, the electrostatic charge at the edge of the display module can be quickly conducted to the grounding terminal of the flexible circuit board through at least one film layer in the composite film having a conductive function, preventing electrostatic discharge from breaking down the display panel or damaging the internal wiring of the display panel, resulting in dark spots or display abnormalities. Furthermore, integrating electrostatic shielding into the composite film eliminates the need for additional metal shielding components, which facilitates the reduction of the size and weight of electronic devices and decreases the impact of electromagnetic induction on near-field communication modules. Attached Figure Description

[0008] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0009] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 The image shown is a schematic diagram of a display module structure in related technologies; Figure 2 The diagram shown is a structural schematic of a display module provided in an embodiment of this disclosure; Figure 3 As shown Figure 2 A plan view of the central display panel; Figure 4 As shown Figure 2 A schematic diagram of the film layers in the display panel; Figure 5 The image shown is a partial planar schematic diagram of a display module provided in an embodiment of this disclosure; Figure 6 As shown Figure 5A plan view of the central metal section; Figure 7 The diagram shown is a structural schematic of another display module provided in an embodiment of this disclosure; Figure 8 As shown Figure 7 The image shows a partial planar schematic of the display module; Figure 9 The diagram shown is a structural schematic of another display module provided in an embodiment of this disclosure; Figure 10 As shown Figure 9 The image shows a partial planar schematic of the display module; Figure 11 The figure shown is a plan view of a display device provided in an embodiment of this disclosure. Detailed Implementation

[0011] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0012] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0013] Figure 1 The image shown is a schematic diagram of a display module structure in related technologies. Please refer to it. Figure 1 The display module 100' includes a display panel 10' and a heat dissipation film 20' located on the backlight side of the display panel 10'. The heat dissipation film 20' includes an organic part 21' and a metal part 22'. The near-field communication module 30' is located on the side of the heat dissipation film 20' away from the display panel 10'. The side of the near-field communication module 30' away from the heat dissipation film 20' includes a copper sheet 40'. The copper sheet 40' and the metal part 22' are respectively connected to a flexible circuit board 50'. The flexible circuit board 50' is grounded. Static electricity at the edge of the display module 100' can be discharged to the grounding terminal of the flexible circuit board 50' through the copper sheet 40' and the metal part 22', thereby achieving electrostatic protection for the display module 100'.

[0014] However, with the development of display technology, the performance requirements for the near-field communication module 30' in display products are constantly increasing. It is required that there be no metal on either side of the near-field communication module 30' in the direction perpendicular to the plane of the display module 100', which could affect electromagnetic induction. When the copper sheet 40' below the near-field communication module 30' is removed, static electricity on the side of the display module 100' is difficult to conduct away, leading to static electricity accumulation. This can easily damage the traces in the display panel 10', resulting in dark spots or abnormalities.

[0015] To address the aforementioned issues, this disclosure provides a display module that, through existing film layer design, provides electrostatic protection for the display module while reducing the impact of electromagnetic induction on the near-field communication module.

[0016] Figure 2 The diagram shown is a structural schematic of a display module provided in an embodiment of this disclosure. Figure 3 As shown Figure 2 A plan view of the central display panel. Figure 4 As shown Figure 2 Please refer to the schematic diagram of the film layers of the display panel. Figures 2 to 4 This disclosure provides a display module 100, including: a display panel 10, the display panel 10 including a backlight side and a light-emitting side, the light-emitting side and the backlight side being opposite sides of the display panel 10. Figure 3 The light-emitting side of the display panel 100 is the side of the display panel 100 that is away from the composite film 20.

[0017] Optionally, the display panel 10 may include a liquid crystal display panel, a mini-LED display panel, a micro-LED display panel, an OLED display panel, etc. This disclosure does not limit the type of display panel. Figure 4 This illustration uses only display panel 10 as an example, which is an OLED display panel. Please refer to [link / reference]. Figure 4 The display panel 10 includes a substrate 11, a driving layer 12, a light-emitting element layer 13, an encapsulation layer 14, and a touch layer 15. The driving layer 12 is located on the side of the substrate 11 facing the light-emitting element layer 13, the encapsulation layer 14 is located on the side of the light-emitting element layer 13 away from the driving layer 12, and the touch layer 15 is located on the side of the encapsulation layer 14 away from the light-emitting element layer 13. This is only for illustrative purposes; in other embodiments, the touch layer 15 may also be located below the encapsulation layer 14 or designed in the same layer as the encapsulation layer 14. This disclosure does not limit this. Optionally, the substrate 10 may be a flexible substrate, including polyimide, etc. The driving layer 12 includes a transistor T, which is used to drive the light-emitting element L in the display panel 10 to emit light. The light-emitting element L includes an anode 32, a light-emitting layer 33, and a cathode 31. The light-emitting layer 33 is located between the cathode 31 and the anode 32. The drain of the transistor L is connected to the anode 32 to provide an anode potential for the light-emitting element L. The cathode 31 obtains a cathode potential. Electrons excited by the cathode 31 and holes excited by the anode 32 meet and recombine in the light-emitting layer 33 to form excitons and realize self-emissive display.

[0018] Optionally, the shape of the display panel 10 can be circular, triangular, square, polygonal, etc. This disclosure does not limit the shape of the display panel 10, and it can be designed according to actual needs.

[0019] Optionally, the display panel 10 includes a central region 16 and an edge region 17, with the edge region 17 surrounding the central region 16. Figure 3 The illustration is based on the example of a circular central area and an annular edge area 17. It does not represent the actual shape of the central area 16 and the edge area 17 in the display panel 10. This disclosure is not limited to this, as long as the edge area 17 surrounds the central area 16.

[0020] Please combine Figure 2 The display module 100 includes a composite film 20 located on the backlight side of the display panel 10. The display module 100 also includes a near-field communication module 30 located on the side of the composite film 20 facing away from the display panel 10; that is, the composite film 20 is located between the display panel 10 and the near-field communication module 30 along a direction perpendicular to the plane of the display module 100. The composite film 20 includes multiple film layers, and the projection of at least one film layer in the composite film 20 onto the display panel 10 overlaps with at least a portion of the edge region 17. Optionally, only one film layer in the composite film 20 may overlap with at least a portion of the edge region 17 of the display panel 10, or multiple film layers in the composite film 20 may overlap with at least a portion of the edge region 17 of the display panel 10. This disclosure does not limit the number of film layers in the composite film 20 that overlap with the edge region 17 of the display panel 10. Furthermore, when multiple film layers in the composite film 20 overlap with at least a portion of the edge region 17 of the display panel 10, the overlap can be multiple film layers in the composite film 20 overlapping with the same edge region 17 of the display panel 10, or it can be one film layer in the composite film 20 overlapping with a portion of the edge region 17 of the display panel 10, and one or more other film layers in the composite film 20 overlapping with another portion of the edge region 17 of the display panel 10. This disclosure does not limit this.

[0021] At least one layer of the composite film 20 that overlaps with the edge region 17 has a conductive function. The display panel 10 includes a flexible circuit board 50, which is grounded. At least one conductive layer of the composite film 20 is electrically connected to the flexible circuit board 50. That is, at least one conductive layer of the composite film 20 that overlaps with the edge region 17 of the display panel 10 is grounded through the flexible circuit board 50, forming an effective electrostatic discharge path. When static electricity is generated by the human body or the external environment, the charge at the edge of the display module 100 can be quickly conducted to the ground through at least one conductive layer of the composite film 20, preventing electrostatic discharge from damaging the display panel 10 or the panel wiring, which could lead to dark spots or display abnormalities. In addition, integrating the electrostatic shielding function into the composite film 20 eliminates the need for additional bulky metal shielding components, which is beneficial for achieving a thinner and lighter design of electronic devices and reducing the impact of electromagnetic induction on the near-field communication module 30.

[0022] Thus, by utilizing the conductive properties of the composite film 20 and setting one or more conductive film layers in the composite film 20 to overlap with the edge region 17 of the display panel 10, effective static discharge of static electricity at the edge of the display module 100 can be achieved without adding additional metal shielding, thereby reducing the impact of electromagnetic induction on the near-field communication module 30.

[0023] Please continue to refer to this. Figure 2 In a display module 100 provided in this disclosure, the composite film 20 includes a buffer layer 23 and a support layer 24, with the buffer layer 23 located on the side of the support layer 24 facing the display panel 10.

[0024] Specifically, the composite film 20 includes a buffer layer 23, which is located between the support layer 24 and the display panel 10. The buffer layer 23 is typically formed of a material with a certain degree of elasticity, such as silicone gel or ultra-clean foam. This disclosure does not limit the material of the buffer layer 23. Because the buffer layer 23 has good filling properties, it can improve the sealing between the composite film 20 and the edge area 17 of the display panel 10, and reduce the accumulation of moisture and dust in the edge area 17, thereby reducing the factors that may cause the electrostatic discharge path to deviate or cause leakage.

[0025] The composite film 20 also includes a support layer 24, which is located on the side of the buffer layer 23 away from the display panel 10, that is, on the side of the buffer layer 23 facing the near-field communication module 30. The support layer 24 can be a single layer, multiple layers, or spliced ​​together from parts of various different materials; this disclosure does not limit it in this way. Figure 2 The illustration is based solely on the example of the composite membrane 20 including the buffer layer 23 and the support layer 24. It is understood that the composite membrane 20 may also include other membrane layers, and this disclosure is not limited thereto.

[0026] Thus, by configuring the composite film 20 to include a buffer layer 23 and a support layer 24, with the buffer layer 23 located on the side of the support layer 24 facing the display panel 10, the buffer layer 23 can provide a certain degree of protection for the display panel 10, improve the sealing performance between the composite film 20 and the edge area 17 of the display panel 10, reduce the causes of electrostatic discharge path deviation, and also reduce the impact on the display panel 100 caused by the drop of the display module 100 or back impact.

[0027] Please continue to refer to this. Figure 2 In a display module 100 provided in this disclosure, the support layer 24 includes a metal part 22, which is electrically connected to the flexible circuit board 50.

[0028] Specifically, the metal portion 22 in the composite film 20 is connected to the flexible circuit board 50, which is grounded. That is, the metal portion 22 is connected to the grounded flexible circuit board 50, providing a reliable discharge path for static electricity. The high charge mobility of the metal portion 22 can instantly capture and quickly guide the charge to the grounding terminal of the flexible circuit board 50, effectively shielding the transient electromagnetic field generated by electrostatic discharge to the outside, preventing electrostatic induction coupling to the pixel driving circuit inside the display panel 10, and reducing display abnormalities caused by the accumulation of static electricity inside the display panel 10.

[0029] Thus, by designing a support layer 24 that includes the metal part 22, the existing film structure of the composite film 20 in the display module 100 can be utilized to provide a reliable electrostatic discharge path without increasing the overall thickness of the display device, and reduce the impact of electromagnetic induction on the near-field communication module 30.

[0030] Figure 5 The image shown is a partial planar schematic diagram of a display module provided in an embodiment of this disclosure. Please refer to it. Figures 2 to 5 In a display module 100 provided in this disclosure, the metal part 22 overlaps with the edge region 17.

[0031] In one optional embodiment provided in this disclosure, the display module 100 includes a display panel 10, a composite film 20, and a near-field communication module 30. Along a direction perpendicular to the plane of the display module 100, the composite film 20 is located on the side of the near-field communication module 30 facing the display panel 10. At least one conductive layer in the composite film 20 overlaps with the edge region 17 of the display panel 10. The composite film 20 includes a buffer layer 23 and a support layer 24. The support layer 24 is located on the side of the buffer layer 23 away from the display panel 10. The support layer 24 includes a metal portion 22, which is electrically connected to a grounded flexible circuit board 50, and overlaps with the edge region 17 of the display panel 10. That is, static electricity at the edge of the display module 100 can be discharged to the ground through the metal portion 22 overlapping with the edge region 17 and the flexible circuit board 50 electrically connected to the metal portion 22, thereby providing effective electrostatic protection for the display module 100.

[0032] At the physical edges of the display panel 10, the electric field is prone to distortion and concentration. Therefore, the edge region 17 is usually the weakest area in the sealing of the display panel 10. When external static electricity approaches the edge of the display module 100, since the metal part 22 overlaps with the edge region 17 of the display panel 10, that is, the metal part 22 can directly contact the external static electricity at the edge of the display module 100. The conductivity of the metal part 22 is much higher than that of the internal circuitry of the display panel 10. The static charge will be preferentially attracted to the metal part 22, rather than accumulating on the display panel 10 and causing circuit damage. The overlap of the metal part 22 with the edge region 17 of the display panel 10 and the connection to the grounded flexible circuit board 50 ensure that the entire metal part 22 is in a stable zero-point position, which reduces the risk of static electricity accumulation on the metal part 22 itself.

[0033] In this way, by setting the metal part 22 to overlap with the edge area 17 of the display panel 10, it is beneficial for the metal part 22 to directly contact external static electricity. Static charges that enter the sides or gaps of the display module 100 can be attracted by the metal part 22 and conducted to the ground through the flexible circuit board 50 before entering the display panel 10, reducing the risk of the display panel 10 being electrostatically damaged.

[0034] Figure 6 As shown Figure 5 Please refer to the plan view of the central metal part. Figure 2 , Figure 5 as well as Figure 6 In this embodiment, the support layer 24 further includes a protective portion 21, and the metal portion 22 includes a cutout 00, with the protective portion 21 located within the cutout 00. That is, the support layer 24 includes a protective portion 21 and a metal portion 22, wherein the metal portion 22 overlaps with the edge region 17 of the display panel 10, and the protective portion 21 is located within the cutout 00 of the metal portion 22. Optionally, along a direction parallel to the plane of the display panel 10, the shape of the cutout 00 of the metal portion 22 can be circular, elliptical, square, polygonal, etc. Figure 6 The illustration only uses a semi-circular cutout 00 as an example. This disclosure does not limit the shape of the cutout 00, as long as the cutout 00 does not overlap with the edge area 17 in the direction perpendicular to the plane of the display panel 10. After the metal part 22 is provided with the cutout 00, the structural strength will decrease. Under assembly pressure or long-term gravity, the film layer above the support layer 24 may collapse, resulting in uneven stress on the display panel 10 and affecting the display effect. By placing the protective part 21 in the cutout 00 of the metal part 22, the shape and size of the protective part 21 match the cutout 00, so that the protective part 21 and the metal part 22 can form a complete support layer 24. This helps to ensure the flatness of the surface of the composite film 20, provides support for the buffer layer 23 and other film layers above, and ensures the visual quality of the display panel 10.

[0035] Thus, by providing a protective portion 21 within the hollow 00 of the metal portion 22, the weakening of the support effect caused by the hollow 00 of the metal portion 22 can be reduced. The hollow 00 is filled with the protective portion 21, and the material of the protective portion 21 can be polyimide or the like. This disclosure does not specifically limit the material of the protective portion 21; it only needs to be an insulating, highly stable, and lightweight material. The material of the protective portion 21 is different from that of the metal portion 22. The protective portion 21 made of polyimide is lighter in weight, which can reduce the excessive overall weight of the display module 100 caused by the entire surface being covered by the metal portion 22, thus contributing to the lightweighting of the display module 100.

[0036] Please refer to Figure 5 In this embodiment, the projection of the near-field communication module 30 on the display panel 10 overlaps with the protective part 21, but the projection of the near-field communication module 30 on the display panel 10 does not overlap with the metal part 22.

[0037] Specifically, the design of the protective part 21 located within the hollow 00 of the metal part 22 divides the support layer 24 into two non-interfering functional areas. Firstly, the metal part 22 surrounds the protective part 21, overlaps with the edge area 17 of the display panel 10, and is connected to the grounded flexible circuit board 50, providing an effective electrostatic discharge path for the edge of the display module 100. Secondly, since the metal part 22 does not overlap with the near-field communication module 30, but only with the protective part 21 in the support layer 24, that is, in the direction perpendicular to the plane of the display panel 10, the metal part 22 avoids the near-field communication module 30. Only the non-conductive protective part 21 overlaps with the near-field communication module 30. Therefore, the high-frequency magnetic field generated by the near-field communication module 30 will not encounter metal obstruction in the direction perpendicular to the plane of the display panel 10, which helps reduce the eddy current loss of the near-field communication module 30 and ensures the signal strength and sensing sensitivity of the near-field communication module 30.

[0038] Although the metal part 22 does not overlap with the near-field communication module 30, it can still serve as an electrostatic barrier for the near-field communication module 30. When external static electricity attempts to penetrate through the edge of the display module 100, the metal part 22, located at the edge of the display module 100, can intercept the static electricity and guide it to the grounding terminal of the flexible circuit board 50 before it reaches the near-field communication module 30 due to its low impedance characteristics. If the metal part 22 overlaps with the near-field communication module 30 or is set as a support layer 24 occupying the entire layer, strong eddy currents will be generated when the near-field communication module 30 is working. The reverse magnetic field generated by the eddy currents will cancel the signal of the near-field communication module 30, resulting in a reduction in the sensing sensitivity of the near-field communication module 30. In this embodiment, by providing a cutout 00 in the metal part 22, the generation of eddy currents can be reduced, allowing the signal generated by the near-field communication module 30 to pass smoothly through the support layer 24, thereby significantly improving the communication distance and sensitivity of the near-field communication module 30. Furthermore, transient large currents may be generated during electrostatic discharge. In this embodiment, the design of the metal part 22 and the near-field communication module 30 not overlapping can greatly reduce the risk of inductive coupling.

[0039] Furthermore, the protective unit 21 and the near-field communication module 30 overlap in a direction perpendicular to the plane of the display panel 10. The protective unit 21 is typically made of non-metallic material, which can buffer the compressive stress generated by the near-field communication module 30 on the display panel 10, preventing local color shifts in the display panel 10 due to compressive stress. The overlapping design of the protective unit 21 and the near-field communication module 30 also provides a certain tolerance space for the production and assembly of the display module 100. As long as the near-field communication module 30 falls within the projection range of the protective unit 21 in a direction perpendicular to the plane of the display panel 10, communication quality can be guaranteed, reducing reliance on high-precision alignment equipment.

[0040] Thus, by placing the protective part 21 in the hollow 00 of the metal part 22 and setting the near-field communication module 30 to overlap with the protective part 21 in a direction perpendicular to the plane of the display panel 10, the unique design of the support layer 24 can achieve the avoidance of the near-field communication module 30 by the metal part 22, thereby reducing the shielding of the near-field communication module 30 by the metal part 22. Under the premise of ensuring the sensing sensitivity of the near-field communication module 30, the static electricity at the edge of the display module 100 can be effectively discharged.

[0041] Figure 7 The diagram shown is a structural schematic of another display module provided in an embodiment of this disclosure. Figure 8 As shown Figure 7 The diagram shows a partial planar representation of the module; please refer to it. Figure 7 and Figure 8 In a display module 100 provided in this disclosure, the projection of the buffer layer 23 on the display panel 10 overlaps with the edge region 17, and the buffer layer 23 has a conductive function.

[0042] In another optional embodiment provided in this disclosure, the display module 100 includes a display panel 10, a composite film 20, and a near-field communication module 30. Along a direction perpendicular to the plane of the display panel 10, the composite film 20 is located between the display panel 10 and the near-field communication module 30. The composite film 20 includes a buffer layer 23 and a support layer 24. The buffer layer 23 is located on the side of the support layer 24 facing the display panel 10, and the conductive buffer layer 23 overlaps with the edge region 17 of the display panel 10. That is, the buffer layer 23 in the composite film 20 is conductive, and since the buffer layer 23 overlaps with the edge region 17 of the display panel 10, static electricity at the edge of the display module 100 can be guided through the conductive buffer layer 23 and discharged along a specific path to reduce static electricity accumulation.

[0043] Please combine Figure 7 and Figure 8 In this embodiment, the buffer layer 23 in the composite film 20 has a conductive function. In this case, the metal part 22 located on the side of the buffer layer 23 away from the display panel 10 can be configured to overlap only with a portion of the edge region 17, or the metal part 22 can be configured not to overlap with the edge region 17 at all but to be directly connected to the buffer layer 23. Figure 7 The illustration only shows the case where the protective portion 21 and the metal portion 22 in the support layer 24 are arranged parallel to each other. The metal portion 22 only overlaps with a portion of the edge region 17. That is, the metal portion 22 can serve as a static discharge path for the conductive buffer layer 23, and based on its specific position design, it also has the function of absorbing and guiding static charge at the edge of the display panel 10. In other embodiments, when the metal portion 22 does not overlap with the edge region 17 at all, the metal portion 22 only overlaps with the buffer layer 23 in a direction perpendicular to the display panel 10 and is electrically connected to the grounded flexible circuit board 50. In this case, the metal portion 22 does not have the function of absorbing static charge, but only serves as a static discharge path.

[0044] In this embodiment, the buffer layer 23 is the layer closest to the display panel 10 in the composite film 20. Since the buffer layer 23 overlaps with the edge region 17 of the display panel 10, any electrostatic charge invading from any gap at the edge of the display panel 10 will first come into contact with the conductive buffer layer 23. The conductive buffer layer 23, which is provided across the entire surface, can achieve equipotential throughout, reducing charge accumulation and improving the durability of the display module 100.

[0045] Microscopic gaps may exist between metal layers or between a metal layer and the display panel 10. The buffer layer 23 is typically made of materials such as silicone gel or ultra-clean foam. The buffer layer 23 can fill these microscopic gaps based on the elastic deformation of the material itself. Compared with rigid metal, the buffer layer 23 can provide a more continuous shielding effect at the edges or corners of the display panel 10, reducing the leakage of electrostatic charge at the gaps and improving the reliability of electrostatic discharge. In addition, the buffer layer 23 overlaps with the edge area 17 of the display panel 10. The conductive buffer layer 23 can also absorb stray electromagnetic radiation generated by the edge driving circuit of the display panel 10, which is beneficial to improving the signal quality and durability of the display module 100.

[0046] Thus, by setting the conductive buffer layer 23 so that its projection on the display panel 10 overlaps with the edge region 17 of the display panel 10, the buffering function and the electrostatic discharge function can be integrated into the buffer layer 23; relative to the metal part 22, the buffer layer 23 is closer to the display panel 10, which is beneficial for the instantaneous response of electrostatic discharge.

[0047] Please refer to Figure 7 In this embodiment, the conductive buffer layer 23 is in direct contact with the metal part 22. Static charge at the edge of the display panel 10 can be rapidly conducted through the buffer layer 23 to the metal part 22 in a direction perpendicular to the plane of the display panel 10, and then discharged through the metal part 22 to the grounding terminal of the flexible circuit board 50. The conductive buffer layer 23 is responsible for collecting static electricity from the edge of the display panel 10, and the metal part 22, which is in direct contact with the buffer layer 23, is responsible for transmitting static electricity. The direct contact between the buffer layer 23 and the metal part 22 forms a conductive structure similar to a "parallel" connection, which reduces the total impedance in the static discharge path, making static discharge more rapid and reducing the impact of residual voltage on the display panel 10.

[0048] Furthermore, the buffer layer 23 is in direct contact with the metal part 22. The surface of the metal part 22 may not be smooth at a microscopic level. The buffer layer 23, made of flexible material, can fill the unevenness of the surface of the metal part 22 based on the elastic deformation of the material itself, which is beneficial to improve the contact degree with the metal part 22. Even if the display module 100 is squeezed or slightly deformed, the elasticity of the buffer layer 23 can ensure that it always fits tightly with the metal part 22, reducing the obstruction of static discharge caused by interlayer separation.

[0049] Conductive materials are usually also good thermal conductors. The buffer layer 23 is in direct contact with the metal part 22. The heat from the edge of the display panel 10 can be quickly transferred to the metal part 22 through the conductive buffer layer 23. The heat can be dissipated by the metal part 22, which can effectively reduce the local operating temperature of the edge area 17 of the display panel 10.

[0050] Thus, by setting the conductive buffer layer 23 to be in direct contact with the metal part 22, the total impedance in the electrostatic discharge path can be reduced, making electrostatic discharge more rapid. It also helps to improve the contact between the buffer layer 23 and the metal part 22, reducing the obstruction of electrostatic discharge caused by interlayer separation.

[0051] Please continue to refer to this. Figure 7 In a display module 100 provided in this disclosure, the buffer layer 23 includes silicone gel and conductive filler, with the conductive filler uniformly distributed in the silicone gel.

[0052] Specifically, the silicone gel has an extremely low elastic modulus and extremely high flexibility, enabling it to absorb stress and reduce impact on the display panel 10. The silicone gel also exhibits certain creep properties, allowing it to fill the microscopic irregularities on the surface of the metal part 22 and the display panel 10, facilitating molecular-level close contact with the contact surface and reducing the interfacial contact resistance with the metal part 22. The uniformly distributed conductive filler can construct an isotropic conductive network within the silicone gel. When any edge of the display panel 10 is subjected to electrostatic discharge, the electrostatic charge can disperse outwards with the same impedance, reducing charge concentration caused by the agglomeration of conductive filler. The uniformly distributed conductive filler also makes the resistivity of the buffer layer 23 more uniform, ensuring uniform current density and reducing the occurrence of localized arcing under high-voltage electrostatic discharge, thus helping to ensure the integrity of the buffer layer 23.

[0053] Silicone gel itself possesses properties such as high temperature resistance, oxidation resistance, and resistance to aging. Even during prolonged operation of the display module 100 in environments with high heat or high humidity, the conductive filler can be firmly encapsulated within the silicone gel, reducing the risk of electrostatic discharge obstruction caused by displacement or agglomeration of the conductive filler. Furthermore, when the display module 100 is dropped or vibrated, the damping properties of the silicone gel can protect the internal conductive filler from being shaken apart or displaced, thus ensuring the long-term conductive stability of the buffer layer 23.

[0054] Thus, by uniformly distributing the conductive filler in the silicone gel, a buffer layer 23 with conductive function can be obtained, which can integrate the dual functions of buffering and conduction. It can reduce the surface contact resistance with the metal part 22. The uniform dispersion of the conductive filler is also conducive to improving the uniformity of resistivity of the buffer layer 23 and reducing the concentration of electrostatic charge.

[0055] Please continue to refer to this. Figure 7 In a display module 100 provided in this disclosure, the conductive filler includes one or more of carbon powder, carbon fiber, graphite, and graphene.

[0056] Optionally, the conductive filler may include only one of carbon powder, carbon fiber, graphite, and graphene; or, the conductive filler may include any two or more of carbon powder, carbon fiber, graphite, and graphene. This disclosure does not limit the type of conductive filler; the specific type depends on actual needs. Compared to traditional metal powders, carbon-based fillers exhibit superior physical stability and electromagnetic balance. Metal powders, such as silver and copper, are easily oxidized during long-term use, and the resistivity of oxidized metal powders spikes, causing electrostatic discharge to fail. Carbon-based materials have relatively stable chemical properties and will not oxidize due to moisture or long-term use, ensuring long-term electrostatic discharge capability.

[0057] Graphene or graphite has extremely high thermal conductivity. The silicon gel filled with graphene or graphite can not only dissipate static electricity, but also quickly and evenly distribute the heat of the display panel 10, alleviating local overheating and reducing poor display caused by local overheating. Combined with the flexibility of the silicon gel, the good heat dissipation effect of the buffer layer 23 can reduce the stress caused by thermal expansion and contraction of the display panel 10, and improve the lifespan of the display module 100.

[0058] When multiple conductive fillers are combined and uniformly dispersed in the silicone gel, for example, carbon fiber can be used to build a conductive framework and carbon powder can fill the gaps. The multi-level conductive network formed by carbon fiber and carbon powder can provide a good conductive path when the silicone gel is subjected to large compression or bending, so as to realize the electrostatic discharge of the display module 100.

[0059] Thus, by uniformly distributing one or more conductive fillers in the silicone gel, the stability of the carbon-based material and the flexibility of the silicone gel can be utilized to allow the buffer layer 23 to capture the static electricity at the edge of the display module 100 and transfer it to the metal part 22 directly connected to it, and then guide it to the grounding terminal of the flexible circuit board 50 through the metal part 22.

[0060] Figure 9 The diagram shown is a structural schematic of another display module provided in an embodiment of this disclosure. Figure 10 As shown Figure 9 The diagram shows a partial planar representation of the module; please refer to it. Figure 9 and Figure 10 In a display module 100 provided in this disclosure, the display module 100 further includes a graphite layer 40, which is located on the side of the near-field communication module 30 away from the composite film 20.

[0061] In one optional embodiment provided in this disclosure, the display module 100 includes a display panel 10, a composite film 20, a near-field communication module 30, and a graphite layer 40. The composite film 20 is located between the display panel 10 and the near-field communication module 30 along a direction perpendicular to the plane of the display module 100. The graphite layer 40 is located on the side of the near-field communication module 30 away from the composite film 20. The composite film 20 includes a buffer layer 23 and a support layer 24. The support layer 24 includes a metal portion 22 connected to a grounded flexible circuit board 50.

[0062] The back of the display module 100 typically has a large metal backplate. Placing the graphite layer 40 between the near-field communication module 30 and the metal backplate can block the contact between the magnetic field and the metal backplate, reducing the reverse eddy currents generated by the metal backplate from canceling the signal of the near-field communication module 30. This ensures the near-field communication module 30 operates in a stable electromagnetic environment and significantly improves its induction intensity. Compared to the previous embodiment where no metal is placed on the side of the near-field communication module 30 away from the composite film 20 to reduce the impact on its electromagnetic induction, this embodiment, although having a graphite layer 40 on the side of the near-field communication module 30 away from the composite film 20, uses the graphite layer 40 as a magnetic shielding material. This allows for electrostatic discharge without affecting the electromagnetic induction of the near-field communication module 30, ensuring its sensitivity. Furthermore, the near-field communication module 30 generates heat during continuous communication. Graphite has excellent thermal conductivity, which allows for rapid heat dissipation, reducing heat conduction towards the display panel 10.

[0063] Thus, by setting a graphite layer 40 on the side of the near-field communication module 30 away from the display panel 10, the heat dissipation effect of the near-field communication module 30 can be improved without affecting the sensing sensitivity of the near-field communication module 30, thereby increasing the service life of the display module 100.

[0064] Please refer to Figure 9 and Figure 10 In this embodiment, the projection of the graphite layer 40 onto the display panel 10 overlaps with at least a portion of the edge region 17. That is, in a direction perpendicular to the plane of the display panel 10, the graphite layer 40 overlaps with at least a portion of the edge region 17 of the display panel 10, and the metal part 22 overlaps with at least a portion of the edge region 17 of the display panel 10. Thus, the conductive graphite layer 40 and the conductive metal part 22 can directly contact external static electricity, thereby forming an overall protective net around the edge of the display module 100, achieving comprehensive electrostatic protection. This allows static electricity on one side of the display module 100 to be guided and discharged through the graphite layer 40, and static electricity on the other side of the display module 100 to be guided and discharged through the metal part 22, which helps reduce the pressure of a single discharge path. Figure 10 This illustration only shows that the overlap between the graphite layer 40 and the edge region 17 of the display panel 10 is equal to the overlap between the metal part 22 and the edge region 17 of the display panel 10. It does not represent the actual overlap ratio between the graphite layer 40 and the metal part 22 and the edge region 17 in the actual process. The specific ratio depends on the actual needs, and this disclosure does not limit it.

[0065] Thus, by setting the graphite layer 40 to overlap with at least part of the edge region 17 on the display panel 10, the graphite layer 40 can absorb the static electricity at the edge of the display panel 10, reducing the probability of the display panel 10 being electrostatically damaged. In addition, the graphite layer 40, together with the metal part 21 overlapping with the edge region 17, can form an overall and comprehensive electrostatic protection for the display panel 10.

[0066] Please combine Figure 9 In this embodiment, the display module 100 includes a flexible circuit board 50, which is located on the side of the graphite layer 40 away from the display panel 10 and is in direct contact with the graphite layer 40; the flexible circuit board 50 is grounded and the metal part 22 is electrically connected to the flexible circuit board 50.

[0067] Specifically, static electricity on one edge of the display module 100 can be directly conducted to the grounding terminal of the flexible circuit board 50 through the graphite layer 40, and static electricity on the other edge of the display module 100 can be directly conducted to the grounding terminal of the flexible circuit board 50 through the metal part 22. By setting two independent static discharge channels, comprehensive electrostatic protection can be provided for the display module 100. At the same time, the metal part 22 in the support layer 24 does not overlap with the near-field communication module 30 in the direction perpendicular to the plane of the display panel 10, which can reduce signal interference to the near-field communication module 30. The graphite layer 40 overlaps with the near-field communication module 30 in the direction perpendicular to the plane of the display panel 10, and will not affect the electromagnetic induction of the near-field communication module 30. Furthermore, since the graphite layer 40 has good conductivity, residual induced charge or electromagnetic interference current can be directly conducted to the grounding terminal of the flexible circuit board 50 through the graphite layer 40.

[0068] It should be noted that "direct contact" in this disclosure refers to a connection that does not involve wires, drilling, or soldering, such as connecting the graphite layer 40 and the flexible circuit board 50 using conductive adhesive. Compared to connections with thin wires, direct connection via surface contact achieved through conductive adhesive can reduce impedance and exhibit better electrical continuity in vibration and drop tests.

[0069] Thus, by setting at least a portion of the flexible circuit board 50 to be in direct contact with the graphite layer 40 and at least a portion of the flexible circuit board 50 to be directly connected to the metal part 22, the layered cooperation between the graphite layer 40 and the metal part 22 can provide two electrostatic discharge channels, achieving all-round protection against edge electrostatic discharge of the display module 100; the direct connection between the graphite layer 40 and the flexible circuit board 50 can also reduce impedance and improve the electrical continuity of the display module 100 during vibration and drop.

[0070] Based on the same inventive concept, this disclosure provides a display device. Figure 11 The figure shown is a plan view of a display device provided in an embodiment of this disclosure. Please refer to it. Figure 11 The display device 200 includes at least one display module 100 in any of the above embodiments. Figure 11 The embodiments shown are only illustrated by the example of a display device 200 including a display module 100, but the actual number of display modules 100 included is not limited.

[0071] The display device 200 provided in this disclosure can be a mobile phone, wireless device, personal data assistant, handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, TV monitor, flat panel display, computer monitor, car display, navigator, cockpit controller and / or display, camera view display, electronic photograph, electronic billboard or sign, projector, building structure, packaging and aesthetic structure, etc. Figure 11 The illustration uses a smartwatch as an example of a display device 200. It is understood that, besides a smartwatch, the display device can also be other wearable devices with a display module 100. Exemplarily, the display device 200 may also include other modules as needed. For example, a wireless charging coil may be included, electrically connected to the motherboard, and used to work with a wireless charging dock to wirelessly charge the battery. The display device 200 provided in this embodiment has the beneficial effects of the display module 100 provided in this embodiment. For details, please refer to the specific descriptions of the display module 100 in the above embodiments; these will not be repeated here.

[0072] Understandable Figure 11 The circular structure is used as an example to illustrate one shape of the display device 200. In some other embodiments of this disclosure, the display device 200 may also be rectangular, elliptical or any other feasible shape, and this disclosure does not specifically limit it.

[0073] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that, include: The display panel includes a backlight side; the display panel includes a central region and an edge region, the edge region surrounding the central region; A composite film, wherein the composite film is located on the backlight side of the display panel. A near-field communication module is located on the side of the composite film opposite to the display panel; The composite film comprises multiple film layers, and the projection of at least one film layer on the display panel overlaps with at least a portion of the edge region; the at least one film layer overlapping with the edge region has a conductive function. The display panel includes a flexible circuit board, which is grounded, and at least one conductive layer of the composite film is electrically connected to the flexible circuit board.

2. The display module as described in claim 1, characterized in that, The composite film includes a buffer layer and a support layer, with the buffer layer located on the side of the support layer facing the display panel.

3. The display module as described in claim 2, characterized in that, The support layer includes a metal portion, which is electrically connected to the flexible circuit board.

4. The display module as described in claim 3, characterized in that, The metal portion overlaps with the edge region.

5. The display module as described in claim 4, characterized in that, The support layer also includes a protective portion, and the metal portion includes a cutout, with the protective portion located within the cutout.

6. The display module as described in claim 5, characterized in that, The projection of the near-field communication module on the display panel overlaps with the protective part, but the projection of the near-field communication module on the display panel does not overlap with the metal part.

7. The display module as described in claim 2, characterized in that, The projection of the buffer layer on the display panel overlaps with the edge region, and the buffer layer has a conductive function.

8. The display module as described in claim 3, characterized in that, The buffer layer is in direct contact with the metal part.

9. The display module as described in claim 8, characterized in that, The buffer layer comprises silica gel and conductive filler, wherein the conductive filler is uniformly distributed in the silica gel.

10. The display module as described in claim 9, characterized in that, The conductive filler includes one or more of carbon powder, carbon fiber, graphite, and graphene.

11. The display module as described in claim 2, characterized in that, The display module also includes a graphite layer located on the side of the near-field communication module opposite to the composite film.

12. The display module as described in claim 10, characterized in that, The projection of the graphite layer onto the display panel overlaps with at least a portion of the edge region.

13. The display module as described in claim 12, characterized in that, The display module includes a flexible circuit board located on the side of the graphite layer away from the display panel and in direct contact with the graphite layer; the flexible circuit board is grounded, and the metal part is electrically connected to the flexible circuit board.

14. A display device, characterized in that, Includes the display module as described in any one of claims 1-13.

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