High-speed wire rod filled with inner tape and forming process of high-speed wire rod

Abstract

The invention discloses a high-speed wire rod filled with an inner belt and a forming process thereof, and the forming process comprises the steps: firstly, when an inner coating layer is embedded on a wire, embedding a special-shaped filling strip into a gap according to gap distribution data, and forming a pre-assembled single wire body; then, a composite shielding layer is constructed on the surface of the pre-assembled single wire body and is coated with a PET outer insulating layer, and a shielding single wire body is output; then integrating the two groups of shielding monomer wire bodies into an inner core assembly side by side, and arranging a plurality of groups of shielding monomer wire bodies on the outer circumference of the inner core assembly to form an outer core assembly; the surface of the integrated cable core body is coated with an aluminum foil mylar, a braid layer and a double-layer outer sheath; performance data are collected through high-frequency signal testing, and closed-loop optimization of geometric parameters of the filling strip is driven; the special-shaped filling strips are embedded into the gaps, and the filling geometric morphology is corrected through parameter iteration based on performance data, so that the dielectric uniformity of the line pair is remarkably improved, electromagnetic interference and signal reflection in high-frequency signal transmission are effectively inhibited, and collaborative improvement of signal integrity and structural reliability in a millimeter wave frequency band is realized.

Description

Technical Field

[0001] This invention relates to the field of cable technology, and in particular to a high-speed wire with an inner filling strip and its forming process. Background Technology

[0002] With the rapid development of 5G communication, high-speed data centers, and autonomous driving technologies, the demand for high-speed cables with transmission rates of 56Gbps and above has surged. These cables need to maintain excellent signal integrity (SI) in the millimeter-wave band, and the core challenge lies in suppressing high-frequency attenuation, crosstalk (SCD21), and phase distortion. When transmitting at speeds above 25G, the impedance abrupt changes caused by non-uniform dielectric structure in traditional cables become increasingly prominent, becoming a technical bottleneck restricting the implementation of protocols such as 10 Gigabit Ethernet and PCIe 5.0.

[0003] The current mainstream high-speed cable manufacturing process uses a single-layer shielding wrapping + circular filler strip structure. However, this process has fundamental limitations: defects in the filler process result in irregular gaps between the circular filler strip and the inner insulation / inner sheath, leading to drastic fluctuations in the dielectric constant (air ε≈1.0, insulation material ε≈2.8~3.5). This causes impedance mismatch in the 40GHz band, resulting in a sharp increase in signal attenuation. The mismatch between the cable geometry and the gaps leads to uncontrollable dielectric distribution. Current technology cannot achieve conformal alignment between the filler and the gaps, causing high-frequency electric field distortion, which becomes a core obstacle limiting breakthroughs in transmission rates.

[0004] Therefore, it is necessary to improve the existing high-speed cable technology to solve the technical problem of uncontrollable dielectric distribution caused by air gaps during cable filling. Summary of the Invention

[0005] The purpose of this invention is to provide a high-speed wire with a filled inner strip and its forming process, thereby solving the above-mentioned technical problems.

[0006] To achieve this objective, the present invention adopts the following technical solution: A forming process for high-speed wire with filled inner bands includes the following steps: S1, a pair of parallel center conductors are independently wrapped with inner insulation layers to form a wire pair, the wire pair is embedded into the inner layer mold, and according to the gap distribution data between the inner insulation layer and the inner layer, a filler strip is used to embed into the gap with an irregular geometric shape to form a pre-assembled single wire body; S2, copper foil Mylar, aluminum foil Mylar and hot melt adhesive film are sequentially wound around the surface of the pre-assembled single-unit line to form a composite shielding layer. Drainage lines are symmetrically pressed on both sides of the composite shielding layer and covered with a PET outer insulation layer to output the shielded single-unit line. S3, two sets of shielded individual wires are positioned side by side and covered with hot melt Mylar to form an inner core assembly; multiple sets of shielded individual wires are arranged around the outer circumference of the inner core assembly and covered with hot melt Mylar to form an outer core assembly, outputting the integrated cable core; S4, aluminum foil Mylar and braided layer are sequentially wrapped on the surface of the integrated cable core, and a double-layer outer sheath is formed by co-extrusion process; S5, transmit test signals to the cable covered with the outer sheath, collect performance data of signal attenuation / SCD21, and iteratively optimize the geometric parameters of the irregular filling of the filler strip based on the performance data.

[0007] Optionally, step S1 includes the following steps: S11, a pair of parallel center conductors are respectively covered with independent inner insulation layers by an extruder to form a double-insulated wire pair, and a microgroove structure is laser-etched on the surface of the inner insulation layer; S12, the double-insulated wire pair is placed into the inner insulation layer mold, and the gap between the inner insulation layer and the inner wall of the mold is scanned by laser triangulation to generate a three-dimensional gap distribution cloud map. S13. Based on the three-dimensional void distribution cloud map, calculate the geometric parameters of the irregular filling strip, including cross-sectional curvature, branch angle and volume ratio.

[0008] Optionally, step S13 may be followed by: S14, a thermoplastic material of the same type as the inner insulation layer is melted and extruded through a shaped nozzle to form a preform of a filler strip. The cavity profile of the shaped nozzle is set in real time according to the geometric parameters. S15, the filler strip preform is embedded into the target gap under vacuum negative pressure environment, and radial pressure and axial micro-vibration are applied in sequence to make the surface texture of the filler strip fit into the micro-groove structure.

[0009] S16, After cooling and shaping, the mold is opened, the pre-assembled single-unit line is output and the actual filling rate is recorded. When the actual filling rate is ≥98%, the process proceeds to the next step.

[0010] Optionally, step S2 includes the following steps: S21, fix the pre-assembled single-unit line to the rotating clamp, and wrap copper foil Mylar at a 45° angle, with the overlap rate controlled at 60%±2%, to form the first shielding layer; S22, aluminum foil Mylar is orthogonally stacked and wound on the surface of the first shielding layer, and the uniformity of the layer thickness is monitored in real time by a laser thickness gauge, and the tension is adjusted to make the thickness uniform; S23, hot melt adhesive film is spirally wrapped on the surface of aluminum foil Mylar, and infrared focusing heating is used to make the hot melt adhesive film flow in a semi-molten state to form a composite shielding layer; S24, tin-plated copper drain lines are symmetrically pressed onto both sides of the composite shielding layer, and radial pressure is applied to embed the drain lines into the hot melt adhesive film. S25 is produced by extruding a PET outer insulation layer through a die to cover the shielding layer. After cooling and shaping, the surface insulation resistance is tested, and the shielded single-unit wire is output.

[0011] Optionally, step S3 includes the following steps: S31, place two sets of shielded single-unit wires in the V-shaped positioning groove, and adjust the spacing to the tolerance of ±0.05mm by using air bearings to form a parallel wire pair; S32, hot melt Mylar is spirally wrapped around the surface of the parallel lines, and gradient hot air is applied to make the Mylar melt and penetrate into the interface between the lines; S33 uses radial hydraulic compaction of hot melt Mylar, which is cooled to form an inner core assembly, and the interface bonding strength is tested.

[0012] Optionally, step 33 may be followed by: S34, fix the inner core assembly on the indexing turntable, and arrange 6 sets of shielded single-unit lines at equal intervals along the circumference, with laser ranging control spacing deviation <0.1mm; S35 uses hot-melt Mylar to cover the outer peripheral shielding single-cell line, and simultaneously starts hot air circulation to achieve rapid fusion; S36, the rotating winding causes the outer core assembly to shrink evenly, and the integrated cable core is output after online detection of concentricity deviation.

[0013] Optionally, step S4 includes the following steps: S41, the integrated cable core is pulled through the laser cleaning zone to remove surface impurities and activate surface energy; S42, aluminum foil Mylar is spirally wound on the cleaned core surface, and the overlap seams are sealed with laser to form a continuous sealed shielding layer; S43, a layer of silver-plated copper wire is woven into the surface of aluminum foil Mylar, and the weaving shrinkage is suppressed by pre-tension thermal management; S44 uses a two-stage co-extrusion die to synchronously extrude a double-layer outer sheath: an inner layer of conductive thermoplastic polyurethane (TPU) and an outer layer of wear-resistant nylon 12. The extrusion pressure is controlled in stages, and after cooling and shaping, a sheathed cable is output.

[0014] Optionally, step S5 includes the following steps: S51 connects the sheathed cable to the vector network analyzer, transmits a 1-56GHz stepped sweep frequency signal, and simultaneously collects full-band attenuation and SCD21 data; S52, extract the performance characteristic values ​​of key frequency points, compare them with the preset channel tolerance threshold, and generate a report of frequency bands exceeding the standard. S53, based on the analysis of structural sensitivity factors in the report of the frequency band exceeding the standard, including the filling porosity, shielding stacking deviation and dielectric constant gradient; S54, input the structural sensitivity factor into the geometric parameter optimization model, which generates optimized geometric parameters including the curvature of the infill strip section, the branch angle, and the volume compensation coefficient.

[0015] The present invention also provides a high-speed wire with an inner filler, which is manufactured using the forming process of the high-speed wire with an inner filler as described above, wherein the high-speed wire comprises: The inner core assembly is formed by covering at least two sets of shielded single-cell wires arranged side by side with hot-melt Mylar. The outer core assembly consists of 6-8 sets of shielded single-unit wires evenly distributed around the outer side of the inner core assembly, which are covered with hot-melt Mylar to form a layered integrated structure. The composite shielding layer includes an aluminum foil Mylar and a silver-plated copper wire braided layer covering the surface of the outer core component.

[0016] Optionally, the shielding unit line includes: A wire pair unit is formed by a pair of parallel center conductors each covered with an independent inner insulating layer; The irregularly shaped filling structure uses a filling material of the same nature as the inner insulation layer and is geometrically embedded in the gap between the inner insulation layer and the inner sheath. The composite electromagnetic shielding layer includes copper foil Mylar, aluminum foil Mylar, and hot melt adhesive film sequentially wrapped around the outer side of the inner layer; The conductive path includes tin-plated copper busbars symmetrically pressed onto both sides of the composite electromagnetic shielding layer; The outer insulation layer is a PET insulating encapsulation layer that covers the composite electromagnetic shielding layer and the drain line.

[0017] Compared with the prior art, the present invention has the following beneficial effects: First, when embedding the inner sheath of the wire pair, irregularly shaped filler strips are used to embed into the gaps according to the gap distribution data to form a pre-assembled single wire body; then, a composite shielding layer is constructed on the surface of the pre-assembled single wire body and covered with a PET outer insulation layer to output a shielded single wire body; next, two sets of shielded single wire bodies are integrated side by side into an inner core assembly, and multiple sets of shielded single wire bodies are arranged around its outer circumference to form an outer core assembly; then, aluminum foil Mylar, a braided layer, and a double-layer outer sheath are wrapped on the surface of the integrated cable core; performance data is collected through high-frequency signal testing to drive closed-loop optimization of the filler strip geometry parameters; this process significantly improves the dielectric uniformity of the wire pair by embedding irregularly shaped filler strips into the gaps and combining parameter iteration correction based on performance data. Combined with the composite shielding layer and the layered integrated structure, it effectively suppresses electromagnetic interference and signal reflection in high-frequency signal transmission, and achieves a synergistic improvement in signal integrity and structural reliability in the millimeter-wave band. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0020] Figure 1 This is one of the schematic diagrams of the forming process of the high-speed wire with filler inner band in this embodiment 1; Figure 2 This is the second schematic diagram of the forming process of the high-speed wire with filling inner band in this embodiment one; Figure 3 This is a schematic cross-sectional view of the high-speed wire with the filling inner band in this embodiment 2; Figure 4 This is a cross-sectional schematic diagram of a single high-speed wire element in the filling of Embodiment 2. Detailed Implementation

[0021] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0022] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0023] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Example 1: Combination Figure 1 and Figure 2 As shown, this embodiment of the invention provides a forming process for a high-speed wire with an inner filling strip, including the following steps: S1, a pair of parallel center conductors are independently wrapped with inner insulation layers to form a wire pair. The wire pair is embedded into the inner sheath mold. According to the gap distribution data between the inner insulation layer and the inner sheath, filler strips are used to embed into the gaps in an irregular geometric shape to form a pre-assembled single wire body.

[0025] Driven by void distribution data, irregular-shaped filling is achieved by embedding a pair of parallel center conductors into a mold after covering them with an inner insulating layer. The filling strips (such as quincunx or quadrilateral shapes) are dynamically matched according to the three-dimensional void model, ensuring a precise fit between the filling material and the voids. This irregular geometric embedding eliminates the dielectric abrupt changes caused by traditional circular filling, significantly improving the dielectric uniformity of the line pairs and laying a structural foundation for high-frequency signal transmission.

[0026] S2, copper foil Mylar, aluminum foil Mylar and hot melt adhesive film are sequentially wound around the surface of the pre-assembled single-unit line to form a composite shielding layer. Drainage lines are symmetrically pressed on both sides of the composite shielding layer and covered with a PET outer insulation layer to output the shielded single-unit line.

[0027] A composite shield is constructed in layers on the surface of the pre-assembled individual wire body: first, copper foil Mylar is wound obliquely (45° overlap) to form an electromagnetic shielding base, then aluminum foil Mylar is orthogonally stacked to suppress capacitance imbalance, and a hot melt adhesive film is wrapped around it to fix the structure. The drain wires are symmetrically pressed and wrapped with a PET outer insulation layer to achieve multi-layer shielding synergistic enhancement and grounding path optimization, effectively suppressing high-frequency electromagnetic interference.

[0028] S3, two sets of shielded individual wires are positioned side by side and covered with hot melt Mylar to form an inner core assembly; multiple sets of shielded individual wires are arranged around the outer circumference of the inner core assembly and covered with hot melt Mylar to form an outer core assembly, outputting the integrated cable core.

[0029] Two sets of shielded individual wires are thermally fused side-by-side to form the inner core assembly, and then multiple sets of individual wires are arranged circumferentially around its outer core assembly. Thermal fusion of Mylar gradient permeates the interface between the wires, combined with precise positioning using air bearings, ensuring the geometric symmetry and dielectric continuity of the inner and outer core assemblies, thus optimizing the overall impedance stability of the cable.

[0030] S4, aluminum foil Mylar and braided layer are sequentially wrapped on the surface of the integrated cable core, and a double outer sheath is formed by co-extrusion process; The integrated cable core is spirally wrapped with Mylar aluminum foil (laser-sealed edges to eliminate gaps), followed by a layer of silver-plated copper wire (55° pre-tension braiding to prevent shrinkage). A two-stage co-extrusion process simultaneously forms an inner conductive TPU layer (to dissipate static charge) and an outer wear-resistant nylon sheath. Graded pressure control ensures the sheath-shielding layer bonding strength, enhancing mechanical protection and environmental durability.

[0031] S5 transmits test signals to the cable covered with the outer sheath, collects performance data of signal attenuation / SCD21, and iteratively optimizes the geometric parameters of the irregular filling of the filler strip based on the performance data.

[0032] A 1-56GHz sweep frequency signal is emitted to the finished cable, and attenuation and SCD21 (SCD21 is the channel insertion loss, reflecting the crosstalk intensity) data are collected across the entire frequency band. Based on the analysis of structural sensitivity factors (such as the filling void ratio) in the out-of-standard frequency band, the geometric parameter model is driven to dynamically optimize the topology configuration of the filling strip, forming a "test-analysis-iteration" closed loop to continuously improve the consistency of high-frequency performance.

[0033] The working principle of this invention is as follows: First, when embedding the inner sheath of the wire pair, irregularly shaped filler strips are used to embed into the gaps according to the gap distribution data to form a pre-assembled single wire body; then, a composite shielding layer is constructed on the surface of the pre-assembled single wire body and covered with a PET outer insulation layer to output a shielded single wire body; next, two sets of shielded single wire bodies are integrated side by side into an inner core assembly, and multiple sets of shielded single wire bodies are arranged around its outer circumference to form an outer core assembly; then, aluminum foil Mylar, a braided layer, and a double-layer outer sheath are wrapped on the surface of the integrated cable core; performance data is collected through high-frequency signal testing to drive closed-loop optimization of the filler strip geometry parameters; this process significantly improves the dielectric uniformity of the wire pair by embedding irregularly shaped filler strips into the gaps and combining parameter iteration correction based on performance data. Combined with the composite shielding layer and the layered integrated structure, it effectively suppresses electromagnetic interference and signal reflection in high-frequency signal transmission, achieving a synergistic improvement in signal integrity and structural reliability in the millimeter-wave band.

[0034] In this embodiment, step S1 specifically includes the following steps: S11 involves extruding a pair of parallel center conductors and coating them with independent inner insulation layers to form a double-insulated wire pair. A microgroove structure is then laser-etched onto the surface of the inner insulation layer. This laser-etched microgroove array increases the interfacial bonding area, enhances the anchoring strength of the filler material, and prevents filler displacement during subsequent processes.

[0035] S12, the double-insulated wire pair is placed into the inner insulation layer mold, and the gap between the inner insulation layer and the inner wall of the mold is scanned by laser triangulation method to generate a three-dimensional gap distribution cloud map, quantify the geometric characteristics of the gap (depth / width / curvature), and provide a data basis for irregular filling.

[0036] S13. Based on the three-dimensional void distribution cloud map, calculate the geometric parameters of the irregular filling strip. The geometric parameters include cross-sectional curvature, branch angle, and volume ratio.

[0037] Based on the analysis of key geometric parameters using 3D void cloud maps: cross-sectional curvature matching the radius of curvature of the void contour; branching angle adapting to the cross-linking region of multiple voids; and volume ratio ensuring complete filling of the infill material. An algorithm dynamically generates the optimal parameter combination to achieve conformal design between the infill material and the voids.

[0038] S14 involves melting a thermoplastic material of the same type as the inner insulation layer and extruding a preform of the filler strip through a shaped nozzle. The geometric parameters of the cavity profile of the shaped nozzle are set in real time. The same thermoplastic material is melted and extruded through a reconfigurable shaped nozzle to create a preform of the filler strip. The nozzle cavity profile is adjusted in real time according to the parameters in S13 (e.g., curvature R0.2mm → R0.15mm) to ensure that the geometry of the preform matches the gaps.

[0039] S15, the filler strip preform is embedded into the target gap under vacuum negative pressure environment, and radial pressure and axial micro-vibration are applied in sequence to make the surface texture of the filler strip fit into the micro-groove structure.

[0040] The filler strip preform is embedded in a vacuum environment (-0.1MPa) to eliminate the risk of air bubble retention. Then, radial pressure (0.5MPa) is applied sequentially to force the material into the deep and narrow gap, and axial micro-vibration (200Hz) drives the filler material to interlock with the microgroove texture, forming a mechanical-molecular dual bonding interface to eliminate the risk of debonding.

[0041] S16: After cooling and shaping, the mold is opened, and the pre-assembled single-unit line is output and the actual fill rate is recorded. When the actual fill rate is ≥98%, it proceeds to the next process. Only when the fill rate is ≥98% (void volume ≤2%) is it released to the next process to ensure dielectric uniformity from the source.

[0042] In this embodiment, step S2 specifically includes the following steps: S21, the pre-assembled single-unit wire is fixed to the rotating clamp and copper foil Mylar is wound at a 45° angle, with the overlap rate controlled at 60%±2%, to form the first shielding layer.

[0043] The pre-assembled single-unit wire is fixed to a rotating fixture, and copper foil Mylar is wound at a 45° angle with the overlap rate controlled at 60%±2%. This design creates a continuous electromagnetic labyrinth at the overlap edge, significantly improving the shielding effectiveness against high-frequency interference; the optimized 60% overlap rate balances material utilization and shielding continuity, avoiding signal leakage gaps caused by low overlap rates.

[0044] S22, aluminum foil Mylar is orthogonally stacked and wound on the surface of the first shielding layer, and the uniformity of the layer thickness is monitored in real time by a laser thickness gauge, and the tension is adjusted to make the thickness uniform; Aluminum Mylar foil is orthogonally layered and wound onto the surface of the copper foil layer (intersecting the copper foil layer at 90°). The orthogonal structure utilizes the complementary skin effect of the two metals to extend the full-band shielding coverage; a laser thickness gauge provides real-time feedback of the layer thickness data and dynamically adjusts the tension to eliminate the capacitance imbalance problem caused by uneven thickness.

[0045] S23 involves spirally coating a hot melt adhesive film onto the Mylar surface of aluminum foil. Infrared focusing heating (150℃±5℃) is used to level the hot melt adhesive film in a semi-molten state, forming a composite shielding layer. The spiral coating of the hot melt adhesive film, heated by infrared focusing (150℃±5℃), causes the film to reach a semi-molten state and level. The focused infrared energy is precisely applied to the adhesive film layer (without damaging the shielding metal), enabling capillary penetration of the adhesive into the micro-gaps of the shielding layer and enhancing interlayer bonding.

[0046] S24, tin-plated copper drain wires are symmetrically pressed onto both sides of the composite shielding layer, and radial pressure is applied to embed the drain wires into the hot melt adhesive film; tin-plated copper drain wires are symmetrically pressed onto both sides of the composite shielding layer, and radial pressure is applied to embed them into the semi-molten adhesive film. The symmetrical layout ensures balanced grounding loop impedance and suppresses common-mode noise caused by ground potential difference; the pressure embedding forms a mechanical-electrical dual connection between the drain wires and the shielding layer.

[0047] S25 involves extruding a PET outer insulation layer through a die to cover the shielding layer. After cooling and setting, the surface insulation resistance is measured, and the shielded unit wire is output. The high volume resistivity of PET provides reliable electrical isolation, preventing leakage current between the shielding layer and other conductors. Insulation resistance testing serves as a quality control checkpoint for off-line production, intercepting defective products.

[0048] In this embodiment, step S3 specifically includes the following steps: S31. Place the two sets of shielded individual wires in the V-shaped positioning groove, and adjust the spacing to a tolerance of ±0.05mm using air bearings to form a side-by-side wire pair. The air bearings utilize compressed air to form a suspended air film, completely preventing mechanical clamps from scratching the shielding surface; the ±0.05mm spacing control ensures the geometric symmetry of the side-by-side wire pairs, optimizing the electromagnetic field distribution for signal transmission.

[0049] S32 involves spirally coating the surface of parallel lines with hot-melt Mylar, applying a gradient of hot air (120℃ for the inner layer and 150℃ for the outer layer) to melt and penetrate the interface between the lines. The inner layer's low temperature softens the Mylar surface, while the outer layer's high temperature drives the melt to directionally penetrate the micro-gaps between the lines, achieving molecular-level interfacial bonding. The capillary force generated by the temperature gradient significantly increases the filling depth, eliminating the incomplete fusion defects of traditional isothermal processes.

[0050] S33 employs radial hydraulic compaction of hot-melt Mylar, followed by cooling to form the inner core assembly and testing the interface bonding strength. Radial hydraulic compaction (0.6 MPa) is used to compact the hot-melt Mylar, and the interface bonding strength is tested after cooling. Uniform hydraulic pressure eliminates pressure dead zones inherent in manual pressing, ensuring the density of dielectric materials between wire pairs; bonding strength testing intercepts defective products, controlling the reliability of the inner and outer core assembly structure from the source.

[0051] S34: The inner core assembly is fixed to the indexing turntable, and six sets of shielded individual wires are arranged equidistantly along the circumference, with laser ranging controlling the spacing deviation to <0.1mm. The indexing turntable ensures a 60° uniform angular accuracy, and the laser provides real-time feedback on the spacing, breaking through the cumulative error limitations of traditional template positioning and ensuring the electromagnetic symmetry of the outer core assembly.

[0052] S35 employs a hot-melt Mylar coating on the outer periphery of the shielded monomer wire, simultaneously initiating a hot air circulation (200℃ / 0.5s→120℃ / 3s cycle) to achieve rapid fusion. The hot-melt Mylar coating on the outer periphery is then activated with a hot air circulation (200℃ / 0.5s→120℃ / 3s). The short-duration high temperature of 200℃ opens the material's molecular chains, immediately followed by a switch to a medium temperature of 120℃ to complete the fusion, significantly reducing heat history accumulation. The circulation mode avoids material carbonization caused by sustained high temperatures, maintaining the chemical stability of the molten interface.

[0053] S36, the rotating winding process causes the outer core assembly to shrink uniformly, and the integrated cable core is output after online detection of concentricity deviation. The rotating winding process causes the outer core assembly to shrink uniformly, and online laser scanning detects concentricity deviation. The rotating tension field induces a balanced release of material stress, avoiding uneven sheath thickness caused by unilateral shrinkage; concentricity detection (deviation ≤0.15mm) ensures impedance continuity when the cable is bent, improving dynamic reliability.

[0054] In this embodiment, step S4 specifically includes the following steps: S41 guides the integrated cable core through a laser cleaning zone to remove surface impurities and activate surface energy. Laser irradiation removes oil, oxides, and other impurities from the integrated cable core surface, while simultaneously breaking and reorganizing the polymer surface molecular chains, significantly increasing the material's surface energy. This surface energy activation enhances the interfacial bonding between the aluminum foil Mylar and the core, resolving the residual contamination problem caused by traditional chemical cleaning.

[0055] S42 involves spirally winding Mylar aluminum foil onto the cleaned core surface, with laser sealing at the overlaps to form a continuous, sealed shielding layer. The spiral-wound Mylar aluminum foil is then laser-sealed at the overlaps (200W power / 5mm / ms scan). The high-energy laser instantly melts the overlapping edge material, forming a metallurgical-grade sealed interface, completely eliminating the risk of aging and failure associated with traditional tape sealing and ensuring the continuity of high-frequency shielding.

[0056] S43 involves weaving a layer of silver-plated copper wire onto the Mylar surface of aluminum foil, using pre-tension thermal management (temperature 80℃ / tension 0.2N) to suppress weaving shrinkage; simultaneously, a layer of silver-plated copper wire is woven onto the aluminum foil surface (weaving angle 55°±1°), with preheating at 80℃ and a constant tension of 0.2N applied. Pre-softening the copper wire reduces internal stress during cold weaving, while constant tension suppresses springback deformation, maintaining the geometric stability of the weaving structure and preventing capacitance fluctuations caused by loosening.

[0057] S44 uses a dual-stage co-extrusion die to simultaneously extrude a double-layer outer sheath: an inner layer of conductive thermoplastic polyurethane (TPU) and an outer layer of wear-resistant nylon 12. The extrusion pressure is controlled in stages (8MPa for the inner layer and 5MPa for the outer layer). After cooling and shaping, a sheathed cable is output.

[0058] Synchronous extrusion using a dual-stage die with zoned temperature control: Inner conductive TPU layer (190℃ / 8MPa): High pressure penetrates the gaps between the braided layers to form a charge dissipation channel; Outer layer abrasion-resistant nylon 12 (230℃ / 5MPa): Low-pressure smooth coating provides mechanical protection; graded pressure control ensures no interface defects between sheath layers, balancing electrical safety and environmental durability.

[0059] In this embodiment, step S5 specifically includes the following steps: The S51 connects a sheathed cable to a vector network analyzer, transmitting a 1-56GHz stepped sweep signal and simultaneously acquiring full-band attenuation and SCD21 data. Similarly, it connects the sheathed cable to the vector network analyzer again, transmitting a 1-56GHz stepped sweep signal (0.1GHz step) and simultaneously acquiring full-band attenuation and SCD21 data. This range covers core 5G / 6G communication frequency bands (such as the 28GHz n257 / n261 band and 40G Ethernet frequencies), accurately locating high-frequency performance bottlenecks. The stepped scan mode can identify narrowband resonant points, avoiding the risk of missed detections associated with traditional segmented testing.

[0060] S52 extracts performance characteristic values ​​of key frequency points (28GHz / 40GHz / 56GHz), compares them with preset channel tolerance thresholds to generate an out-of-standard frequency band report; extracts attenuation and SCD21 characteristic values ​​of the three key frequency points (28GHz / 40GHz / 56GHz), and compares them with preset tolerance thresholds (e.g., 28GHz attenuation ≤ 0.8dB / m, SCD21 ≤ -35dB). This generates an out-of-standard frequency band report, quickly identifying the failed frequency bands and avoiding the waste of computational resources for full-band data analysis.

[0061] Advantages of parameter settings: The selection criteria for 28 / 40 / 56GHz are as follows: 28GHz is the core frequency band for 5G millimeter wave, 40GHz is the frequency band for high-speed data center interconnection, and 56GHz is the next-generation PCIe 6.0 extended frequency band.

[0062] S53, based on the analysis of structural sensitivity factors in the report of the frequency band exceeding the standard, including the filling porosity, shielding stacking deviation and dielectric constant gradient; Based on the analysis of the physical root causes of the out-of-range frequency band reports: if the attenuation exceeds the standard at 56GHz → the main cause is a fill void ratio > 3% (dielectric mutation); if the SCD21 deteriorates at 40GHz → the main cause is a shielding stacking deviation > 8μm (capacitive imbalance); if the attenuation suddenly increases at 28GHz → the main cause is a dielectric constant gradient > 0.15 / mm (impedance mismatch). A quantitative correlation between electrical performance and structural defects is established, breaking through the limitations of traditional trial-and-error optimization.

[0063] S54. Input the structural sensitivity factor into the geometric parameter optimization model. The geometric parameter optimization model generates optimized geometric parameters including the curvature of the infill strip section, the branch angle, and the volume compensation coefficient.

[0064] By inputting structural sensitivity factors into a pre-trained geometric parameter optimization model (based on a neural network), three sets of key parameters are output: cross-sectional curvature optimization adjusts the curvature of the filler strip contour (e.g., R0.2mm→R0.15mm) to adapt to the gaps; branch angle optimization corrects the filling angle of multi-branched gaps (e.g., 60°→72°); and volume compensation coefficient compensates for material cooling shrinkage (e.g., +5% volume), thereby achieving precise reconfigurability of the filling structure to respond to high-frequency transmission requirements.

[0065] Example 2: Combination Figure 3 and Figure 4 As shown, the present invention also provides a high-speed wire with an inner filler, which is manufactured using the molding process of the high-speed wire with an inner filler as described in Example 1. The high-speed wire includes: The inner core assembly 10 is formed by covering a hot-melt Mylar 11 with at least two sets of shielded single-unit wires 30 arranged side by side.

[0066] The outer core component 20 has 6-8 sets of shielded single-unit lines evenly distributed around the outer side of the inner core component, which are covered with hot-melt Mylar to form a layered integrated structure.

[0067] The composite shielding layer 40 includes an aluminum foil Mylar and a silver-plated copper wire braided layer covering the surface of the outer core component.

[0068] In this embodiment, the shielding single-unit wire 30 further includes: A wire pair unit is formed by a pair of parallel center conductors 31 each covered with an independent inner insulating layer 32; The irregular filling structure 33 uses a filling material of the same type as the inner insulation layer and is geometrically embedded in the gap between the inner insulation layer and the inner liner layer. The composite electromagnetic shielding layer 34 includes copper foil Mylar, aluminum foil Mylar 341 and hot melt adhesive film 342 sequentially wrapped around the outer side of the inner layer. Conductive path 35 includes tin-plated copper busbars symmetrically pressed onto both sides of the composite electromagnetic shielding layer; The outer insulation layer 36 is a PET insulating encapsulation layer that covers the composite electromagnetic shielding layer and the drain line.

[0069] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A forming process for high-speed wire with an inner filling, characterized in that, Includes the following steps: S1, a pair of parallel center conductors are independently wrapped with inner insulation layers to form a wire pair, the wire pair is embedded into the inner layer mold, and according to the gap distribution data between the inner insulation layer and the inner layer, a filler strip is used to embed into the gap with an irregular geometric shape to form a pre-assembled single wire body; S2, copper foil Mylar, aluminum foil Mylar and hot melt adhesive film are sequentially wound around the surface of the pre-assembled single-unit line to form a composite shielding layer. Drainage lines are symmetrically pressed on both sides of the composite shielding layer and covered with a PET outer insulation layer to output the shielded single-unit line. S3, two sets of shielded individual wires are positioned side by side and covered with hot melt Mylar to form an inner core assembly; multiple sets of shielded individual wires are arranged around the outer circumference of the inner core assembly and covered with hot melt Mylar to form an outer core assembly, outputting the integrated cable core; S4, aluminum foil Mylar and braided layer are sequentially wrapped on the surface of the integrated cable core, and a double-layer outer sheath is formed by co-extrusion process; S5, transmit test signals to the cable covered with the outer sheath, collect performance data of signal attenuation / SCD21, and iteratively optimize the geometric parameters of the irregular filling of the filler strip based on the performance data.

2. The forming process of the high-speed wire with filled inner strip according to claim 1, characterized in that, Step S1 includes the following steps: S11, a pair of parallel center conductors are respectively covered with independent inner insulation layers by an extruder to form a double-insulated wire pair, and a microgroove structure is laser-etched on the surface of the inner insulation layer; S12, the double-insulated wire pair is placed into the inner insulation layer mold, and the gap between the inner insulation layer and the inner wall of the mold is scanned by laser triangulation to generate a three-dimensional gap distribution cloud map. S13. Based on the three-dimensional void distribution cloud map, calculate the geometric parameters of the irregular filling strip, including cross-sectional curvature, branch angle and volume ratio.

3. The forming process of high-speed wire with filled inner strip according to claim 2, characterized in that, Following step S13, the following is also included: S14, a thermoplastic material of the same type as the inner insulation layer is melted and extruded through a shaped nozzle to form a preform of a filler strip. The cavity profile of the shaped nozzle is set in real time according to the geometric parameters. S15, the filler strip preform is embedded into the target gap under vacuum negative pressure environment, and radial pressure and axial micro-vibration are applied in sequence to make the surface texture of the filler strip fit into the micro-groove structure. S16, After cooling and shaping, the mold is opened, the pre-assembled single-unit line is output and the actual filling rate is recorded. When the actual filling rate is ≥98%, the process proceeds to the next step.

4. The forming process of the high-speed wire with filled inner strip according to claim 1, characterized in that, Step S2 includes the following steps: S21, fix the pre-assembled single-unit line to the rotating clamp, and wrap copper foil Mylar at a 45° angle, with the overlap rate controlled at 60%±2%, to form the first shielding layer; S22, aluminum foil Mylar is orthogonally stacked and wound on the surface of the first shielding layer, and the uniformity of the layer thickness is monitored in real time by a laser thickness gauge, and the tension is adjusted to make the thickness uniform; S23, hot melt adhesive film is spirally wrapped on the surface of aluminum foil Mylar, and infrared focusing heating is used to make the hot melt adhesive film flow in a semi-molten state to form a composite shielding layer; S24, tin-plated copper drain lines are symmetrically pressed onto both sides of the composite shielding layer, and radial pressure is applied to embed the drain lines into the hot melt adhesive film. S25 is produced by extruding a PET outer insulation layer through a die to cover the shielding layer. After cooling and shaping, the surface insulation resistance is tested, and the shielded single-unit wire is output.

5. The forming process of the high-speed wire with filled inner strip according to claim 1, characterized in that, Step S3 includes the following steps: S31, place two sets of shielded single-unit wires in the V-shaped positioning groove, and adjust the spacing to the tolerance of ±0.05mm by using air bearings to form a parallel wire pair; S32, hot melt Mylar is spirally wrapped around the surface of the parallel lines, and gradient hot air is applied to make the Mylar melt and penetrate into the interface between the lines; S33 uses radial hydraulic compaction of hot melt Mylar, which is cooled to form an inner core assembly, and the interface bonding strength is tested.

6. The forming process of the high-speed wire with filled inner strip according to claim 5, characterized in that, Step 33 is followed by: S34, fix the inner core assembly on the indexing turntable, and arrange 6 sets of shielded single-unit lines at equal intervals along the circumference, with laser ranging control spacing deviation <0.1mm; S35 uses hot-melt Mylar to cover the outer peripheral shielding single-cell line, and simultaneously starts hot air circulation to achieve rapid fusion; S36, the rotating winding causes the outer core assembly to shrink evenly, and the integrated cable core is output after online detection of concentricity deviation.

7. The forming process of high-speed wire with filled inner strip according to claim 1, characterized in that, Step S4 includes the following steps: S41, the integrated cable core is pulled through the laser cleaning zone to remove surface impurities and activate surface energy; S42, aluminum foil Mylar is spirally wound on the cleaned core surface, and the overlap seams are sealed with laser to form a continuous sealed shielding layer; S43, a layer of silver-plated copper wire is woven into the surface of aluminum foil Mylar, and the weaving shrinkage is suppressed by pre-tension thermal management; S44 uses a two-stage co-extrusion die to synchronously extrude a double-layer outer sheath: an inner layer of conductive thermoplastic polyurethane (TPU) and an outer layer of wear-resistant nylon 12. The extrusion pressure is controlled in stages, and after cooling and shaping, a sheathed cable is output.

8. The forming process of high-speed wire with filled inner strip according to claim 1, characterized in that, Step S5 includes the following steps: S51 connects the sheathed cable to the vector network analyzer, transmits a 1-56GHz stepped sweep frequency signal, and simultaneously collects full-band attenuation and SCD21 data; S52, extract the performance characteristic values ​​of key frequency points, compare them with the preset channel tolerance threshold, and generate a report of frequency bands exceeding the standard. S53, based on the analysis of structural sensitivity factors in the report of the frequency band exceeding the standard, including the filling porosity, shielding stacking deviation and dielectric constant gradient; S54, input the structural sensitivity factor into the geometric parameter optimization model, which generates optimized geometric parameters including the curvature of the infill strip section, the branch angle, and the volume compensation coefficient.

9. A high-speed wire with an inner filling, characterized in that, The high-speed wire is manufactured using the forming process of the high-speed wire with filled inner band as described in any one of claims 1 to 8, wherein the high-speed wire comprises: The inner core assembly is formed by covering at least two sets of shielded single-cell wires arranged side by side with hot-melt Mylar. The outer core assembly consists of 6-8 sets of shielded single-unit wires evenly distributed around the outer side of the inner core assembly, which are covered with hot-melt Mylar to form a layered integrated structure. The composite shielding layer includes an aluminum foil Mylar and a silver-plated copper wire braided layer covering the surface of the outer core component.

10. The high-speed wire with an inner filling as described in claim 9, characterized in that, The shielded single-unit wire body includes: A wire pair unit is formed by a pair of parallel center conductors each covered with an independent inner insulating layer; The irregularly shaped filling structure uses a filling material of the same nature as the inner insulation layer and is geometrically embedded in the gap between the inner insulation layer and the inner sheath. The composite electromagnetic shielding layer includes copper foil Mylar, aluminum foil Mylar, and hot melt adhesive film sequentially wrapped around the outer side of the inner layer; The conductive path includes tin-plated copper busbars symmetrically pressed onto both sides of the composite electromagnetic shielding layer; The outer insulation layer is a PET insulating encapsulation layer that covers the composite electromagnetic shielding layer and the drain line.

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