Electronic device

Abstract

The invention provides an electronic device which comprises a first substrate, a second substrate, a first light-emitting unit and an adhesive layer. The second substrate is arranged opposite to the first substrate. The first light-emitting unit is arranged between the first substrate and the second substrate. The first surface of the first light-emitting unit is provided with a first microstructure, and the first surface is far away from the first substrate. The adhesive layer is arranged between the second substrate and the first surface of the first light-emitting unit. A first gap is formed between the adhesive layer and the first microstructure.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having a gap between an adhesive layer and a light-emitting unit. Background Technology

[0002] With technological advancements and evolving user demands, devices utilizing light-emitting diodes (LEDs) are becoming increasingly common in daily life. Flip-chip LEDs (such as miniature LEDs) often feature surface microstructures on their light-emitting surfaces to increase light output. However, the full lamination process can affect these microstructures, leading to a decrease in LED brightness. Therefore, an improved LED structure is needed to maintain optimal light output. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic device that can maintain the light output of a light-emitting diode.

[0004] This invention provides an electronic device including a first substrate, a second substrate, a first light-emitting unit, and an adhesive layer. The second substrate is disposed relative to the first substrate. The first light-emitting unit is disposed between the first substrate and the second substrate. A first surface of the first light-emitting unit has a first microstructure. The first surface is located away from the first substrate. The adhesive layer is disposed between the second substrate and the first surface of the first light-emitting unit. A first gap exists between the adhesive layer and the first microstructure. Attached Figure Description

[0005] Figure 1 A schematic cross-sectional view illustrating a first embodiment of the electronic device according to the present invention is shown.

[0006] Figure 2 Draw the corresponding Figure 1 A schematic diagram of one modified implementation.

[0007] Figure 3 Draw the corresponding Figure 1 A partially enlarged schematic diagram of another embodiment of the first upper surface of the first light-emitting unit, or the second upper surface of the second light-emitting unit, or the third upper surface of the third light-emitting unit.

[0008] Figure 4 Draw the corresponding Figure 3 A partially enlarged schematic diagram of one embodiment of the upper surface.

[0009] Figure 5 A schematic cross-sectional view of an electronic device according to a second embodiment of the present invention is shown.

[0010] Figure 6A schematic cross-sectional view of an electronic device according to a third embodiment of the present invention is shown.

[0011] Figure 7 A schematic cross-sectional view of an electronic device according to a fourth embodiment of the present invention is shown.

[0012] Explanation of reference numerals in the attached figures: 101-Electronic device; 102-Electronic device; 103-Electronic device; 104-Electronic device; 110-First substrate; 120-Circuit layer; 130-First light-emitting unit; 131-First microstructure; 131A-First protruding structure; 131B-First recessed structure; 130T-First surface; 138-Fixing adhesive; 139-Pixel defining layer; 140-Second light-emitting unit; 140T-Second surface; 141-Second microstructure; 141A-Second protruding structure; 141B-Second recessed structure; 145-Third light-emitting unit; 145T-Third surface; 146-Third microstructure; 146A-Third protruding structure; 146B-Third recessed structure; 150-Adhesive Layer; 151-First gap; 152-Lower surface; 152C-Recess; 153-Second gap; 154-Third gap; 160-Light conversion layer; 161-First light conversion element; 162-Second light conversion element; 163-Third light conversion element; 170-Color filter layer; 171-First color filter element; 172-Second color filter element; 173-Third color filter element; 174-Light shielding layer; 175-Barrier element; 180-Second substrate; 185-Light emitting surface; d1-Distance; d2-Distance; H-Distance; Q-Depth point; P-Reference point; P1-First pixel area; P2-Second pixel area; P3-Third pixel area; R-Depth; T-Thickness; W-Width. Detailed Implementation

[0013] The present invention will be described in detail below with reference to specific embodiments and accompanying drawings. To make the invention clearer and easier to understand, the accompanying drawings are simplified schematic diagrams, and the components may not be drawn to scale. Furthermore, the number and dimensions of the components in the drawings are merely illustrative and are not intended to limit the scope of the invention.

[0014] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements, and this invention is not intended to distinguish between elements that have the same function but different names. When the terms "comprising," "including," and / or "having" are used in this specification, they specify the presence of the stated features, areas, steps, operations, and / or elements, but do not exclude the presence or addition of one or more other features, areas, steps, operations, elements, and / or combinations thereof.

[0015] When an element, such as a layer or region, is referred to as being "on" or extending "on" another element (or a variant thereof), it can be directly on or directly extended to the other element, or there may be intervening elements between them. On the other hand, when an element is referred to as being "directly on" another element (or a variant thereof) or "directly" extending "on" another element, there are no intervening elements between them. Furthermore, when an element is referred to as being "coupled" to another element (or a variant thereof), it can be directly connected to the other element or indirectly connected (e.g., electrically connected) to the other element through one or more elements.

[0016] The terms “approximately,” “equal to,” “same as,” “substantially,” or “roughly” are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0017] The ordinal numbers used in the specification and claims of this invention, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacture. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0018] It should be noted that the technical solutions provided in different embodiments of the present invention can be substituted for, combined or mixed with each other to form another embodiment without violating the spirit of the present invention.

[0019] Figure 1 A schematic cross-sectional view of a first embodiment of an electronic device 101 according to the present invention is illustrated. The electronic device 101 of the present invention includes, for example, a light-emitting diode (LED). The LED may include, for example, a mini light-emitting diode (mini LED), a micro LED, or a quantum dot LED (e.g., QLED, QDLED), and may be fluorescent, phosphorescent, or other suitable materials, and the materials may be arranged and combined in any way, but are not limited thereto. Various embodiments of the present invention illustrate a plurality of light-emitting units located on a substrate, wherein the light-emitting unit includes a micro LED as an example, but the present invention is not limited thereto.

[0020] The electronic device of the present invention may include, for example, a first substrate 110, a circuit layer 120, a first light-emitting unit 130, a second light-emitting unit 140 as needed, a third light-emitting unit 145 as needed, an adhesive layer 150, a light conversion layer 160 as needed, a color filter layer 170 as needed, and a second substrate 180, but the present invention is not limited thereto. Figure 1 The electronic device 101 illustrating the present invention includes a first substrate 110, a circuit layer 120, a first light-emitting unit 130, a second light-emitting unit 140, a third light-emitting unit 145, an adhesive layer 150, and a second substrate 180. The second substrate 180 may be disposed relative to the first substrate 110, and a space for accommodating at least one light-emitting unit and the adhesive layer 150 may be formed between the second substrate 180 and the first substrate 110.

[0021] The first substrate 110 can be used to support the circuit layer 120. The first substrate 110 and the second substrate 180 can each be made of a rigid transparent material, such as glass, or any suitable material, but the invention is not limited thereto. In each figure, the Z-direction represents the stacking direction of the first substrate 110, circuit layer 120, first light-emitting unit 130, adhesive layer 150, and second substrate 180 of the electronic device, or the thickness direction of the film layer, or it can also be considered as the normal direction of the first substrate 110. In each figure, the X and Y directions are parallel to the surface of the first substrate 110, and the X direction is perpendicular to the Y direction. Furthermore, in each figure, the X and Y directions are perpendicular to the Z-direction.

[0022] Circuit layer 120 may be disposed on first substrate 110. Circuit layer 120 may include a composite layer structure of various electronic components (not shown), conductive layers (not shown), and insulating layers (not shown) suitable for electronic devices, and may be electrically connected to first light-emitting unit 130, second light-emitting unit 140, and third light-emitting unit 145. The composite layer structure may, for example, include multiple conductive layers and multiple insulating layers, providing the required circuit pattern and distribution through the transition between multiple conductive layers and multiple insulating layers. The material of the conductive layer in circuit layer 120 may, for example, include copper, electroplated copper, other suitable conductive materials, or combinations thereof, but the present invention is not limited thereto. The insulating layer in circuit layer 120 may, for example, include organic or inorganic materials, such as photosensitive polyimide (PSPI), build-up film (ABF), silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), other suitable insulating materials, or combinations thereof, but the present invention is not limited thereto.

[0023] The electronic components included in circuit layer 120 may be, for example, an array of electronic components, active components, passive components, wires, bonding pads, a common electrode, or transistors (not shown) electrically connected to and controlling the light-emitting unit, but the present invention is not limited thereto. Passive and active components include, for example, capacitors, resistors, inductors, sensors, diodes, transistors, semiconductor components, integrated circuits (ICs), printed circuit boards (PCBs), etc. In some embodiments, the transistor may be a thin-film transistor (TFT) responsible for the on / off state of the light-emitting unit. The thin-film transistor may be, for example, a switching element, a driving element, or a transistor with other functions, but is not limited thereto. The thin-film transistor may include a semiconductor material layer, a gate, a gate dielectric layer, a source and a drain electrically connected to the semiconductor material layer, but is not limited thereto. The semiconductor material layer may comprise amorphous silicon, polycrystalline silicon such as low-temperature polysilicon (LTPS), or metal oxide semiconductor materials such as indium gallium zinc oxide (IGZO) or indium gallium oxide (IGO), other suitable materials, or combinations thereof, but is not limited thereto. In some embodiments, different transistors may comprise different semiconductor materials, but is not limited thereto. The semiconductor material layer may also comprise a source contact region, a drain contact region, and a channel region disposed between the source contact region and the drain contact region in a thin-film transistor and corresponding to the gate. The semiconductor material layer may define the channel region. In the upward viewing direction Z (i.e., the normal direction of the surface of the first substrate 110), the semiconductor material layer at least partially overlaps with the gate, and a dielectric material is disposed between the semiconductor material layer and the gate as a gate dielectric layer. The gate dielectric layer may be an insulating layer, but is not limited thereto, and may be adjusted as needed. The thin-film transistor of the present invention is merely illustrative. The type or structure of the thin-film transistor can be adjusted as needed, without limiting the possible type or structure of the thin-film transistor of the present invention. Therefore, any other suitable thin-film transistor structure may replace the thin-film transistor described above. The first electrode layer (not shown) electrically connected to the transistor in circuit layer 120 can be used to transfer current from the transistor to the corresponding light-emitting unit. The second electrode layer (not shown) electrically connected to the transistor in circuit layer 120 can contain a common electrode for a plurality of light-emitting units.

[0024] The first light-emitting unit 130 is disposed between the first substrate 110 and the second substrate 180, for example, on the surface of the first substrate 110. The circuit layer 120 may be disposed between the first substrate 110 and the first light-emitting unit 130. Depending on the requirements, a plurality of light-emitting units may be accommodated between the first substrate 110 and the second substrate 180. The plurality of light-emitting units may, for example, be micro-light-emitting diodes (LEDs), but the invention is not limited thereto. The plurality of light-emitting units may be used to emit blue light with a main peak wavelength in the range of 420 nanometers (nm) to 460 nanometers, or green light with a main peak wavelength in the range of 510 nanometers to 540 nanometers, or red light with a main peak wavelength in the range of 610 nanometers to 640 nanometers, to obtain better optical performance, but the invention is not limited thereto. The single-side dimension of the micro-light-emitting diode chip may be from 10 micrometers to 100 micrometers, and the area of ​​the micro-light-emitting diode chip may be from 100 square micrometers to 5000 square micrometers, but the invention is not limited thereto. Figure 1 The illustration shows three light-emitting units disposed on the first substrate 110, but the present invention is not limited thereto.

[0025] like Figure 1 As shown, the electronic device may include a plurality of pixel areas. A plurality of light-emitting units may be disposed on the surface of the first substrate 110 (e.g., the surface formed by the X and Y directions), between the first substrate 110 and the second substrate 180. On the surface of the first substrate 110, the plurality of light-emitting units may be arranged in a matrix, but are not limited thereto. For ease of explanation, Figure 1 Only three pixel areas P1, P2, and P3 are displayed, and only three light-emitting units are displayed, but the present invention is not limited thereto. Specifically, a first light-emitting unit 130 is disposed in the first pixel area P1, a second light-emitting unit 140 is disposed in the second pixel area P2, and a third light-emitting unit 145 is disposed in the third pixel area P3. On a light-emitting surface 185 of the second substrate, different pixel areas can emit light of different colors. In some embodiments, the color of the light emitted by the pixel areas is not limited, for example, red, green, and blue. For example, on the light-emitting surface 185 of the second substrate, the first pixel area P1 can emit light of a first color, and the second pixel area P2 can emit light of a second color; the first color and the second color can be different. For ease of explanation, specifically, the first pixel area P1 can emit red light, the second pixel area P2 can emit green light, and the third pixel area P3 can emit blue light.

[0026] A plurality of light-emitting units may include light-emitting units that emit a specific color, such as at least one of red, green, and blue light-emitting units, but the present invention is not limited thereto. Each light-emitting unit may be used to emit monochromatic light with a particularly narrow full width at half maximum (FWHM) value of the main peak (maximum peak value), such as monochromatic light of blue, green, or red light, to obtain better optical performance, but the present invention is not limited thereto. According to some embodiments of the present invention, the first light-emitting unit 130, the second light-emitting unit 140, and the third light-emitting unit 145 may be light-emitting units that emit the same color as each other. According to other embodiments of the present invention, the first light-emitting unit 130 emits light of a first color, and the second light-emitting unit 140 emits light of a second color, wherein the first color and the second color are different. For example, the first light-emitting unit 130, the second light-emitting unit 140, and the third light-emitting unit 145 may be light-emitting units that emit different colors as each other. According to some embodiments, Figure 1 In this invention, the first light-emitting unit 130, the second light-emitting unit 140, and the third light-emitting unit 145 can be light-emitting units that emit different colors of light. For example, the first light-emitting unit 130 can be a light-emitting unit that emits red light, the second light-emitting unit 140 can be a light-emitting unit that emits green light, and the third light-emitting unit 145 can be a light-emitting unit that emits blue light. However, the invention is not limited to this.

[0027] In some embodiments, each light-emitting unit may include (but is not limited to) a micro light-emitting diode. Each micro light-emitting diode can be used to define a pixel (or sub-pixel) or be considered as a pixel (or sub-pixel) and generate light of a predetermined wavelength. For example, each light-emitting unit may correspond to one of a red pixel, a green pixel, a blue pixel, or other colors or wavelengths or combinations thereof, but the invention is not limited thereto.

[0028] like Figure 1 As shown, a pixel definition layer 139 (PDL) can be disposed between two adjacent light-emitting units. Each pixel definition layer 139 can be located on the first substrate 110. For example, the pixel definition layer 139 can be located between light-emitting units 130 and 140, or between light-emitting units 140 and 145. The pixel definition layer 139 can contain various organic or inorganic materials, such as black or white photoresist, but the present invention is not limited thereto. The top surface of the pixel definition layer 139 can be no lower than the top surface of each light-emitting unit, but the present invention is not limited thereto. The pixel definition layer 139 can have a light-shielding function, reducing the possibility of light mixing between adjacent light-emitting units affecting the image quality of the display device. The pixel definition layer 139 can also have a reflective function, improving the light utilization efficiency of the light-emitting units, but the present invention is not limited thereto.

[0029] like Figure 1 As shown, the adhesive 138 can be disposed between adjacent light-emitting units and pixel defining layers 139 to fix the positions of the light-emitting units and pixel defining layers 139 respectively. The adhesive 138 can, for example, directly contact the surfaces of adjacent light-emitting units, the surface of pixel defining layers 139, and the surface of adhesive layer 150. For instance, the adhesive 138 can be disposed between light-emitting unit 140 and pixel defining layer 139, and can directly contact the sidewalls of light-emitting unit 140, the sidewalls of pixel defining layer 139, and the lower surface 152 of adhesive layer 150. The cured adhesive 138 can fix the light-emitting unit to the first substrate 110, thereby enhancing the bonding strength between the light-emitting unit and the first substrate 110. The adhesive 138 can include a suitable adhesive material. The height of the top surface of the adhesive 138 may not exceed the height of the top surface of adjacent light-emitting units or the top surface of pixel defining layers 139.

[0030] The adhesive layer 150 can be disposed between the second substrate 180 and the light-emitting unit, respectively covering the top surface of the light-emitting unit. For example, it can be disposed between the second substrate 180 and the first surface 130T of the first light-emitting unit 130, between the second substrate 180 and the second light-emitting unit 140, or between the second substrate 180 and the third light-emitting unit 145, but the present invention is not limited thereto. The adhesive layer 150 may include, for example, an adhesive material and directly contact the surfaces of the second substrate 180, the fixing adhesive 138, the light-emitting unit, and the pixel defining layer 139. The cured adhesive material can fix the light-emitting unit to the second substrate 180, thereby enhancing the bonding strength between the light-emitting unit and the second substrate 180.

[0031] The adhesive material in the adhesive layer 150 may include a substantially transparent optical polymeric material, such as at least one of optically clear resin (OCR) or optically clear adhesive (OCA), to bond the second substrate 180 to the light-emitting unit without substantially affecting the light-emitting intensity of the electronic device 101. The adhesive material may be a high-transmittance material, for example, the transmittance of the adhesive material may be greater than or equal to 95% (transmittance ≥ 95%), but the invention is not limited thereto. In other words, the transmittance of the adhesive material for light with wavelengths of 380nm to 780nm is greater than or equal to 95%. Alternatively, the transmittance of the adhesive material for light with a wavelength of 550nm is greater than or equal to 95%. However, the invention is not limited thereto. The adhesive material may be acrylic, siloxane, silicon, or epoxy resin-based materials, but the invention is not limited thereto. The composition of the optically clear resin may be, for example, polymethyl methacrylate, and the composition of the optically clear adhesive may be, for example, polyurethane acrylic resin, but the invention is not limited thereto.

[0032] like Figure 1 As shown, the adhesive layer 150 may have a thickness T in a cross-sectional view. The thickness T is the maximum dimension of the adhesive layer 150 in the Z direction. In some embodiments, the thickness T ranges from 0.1 μm ≤ T < 300 μm, or between 60 and 0.5 microns, that is, 0.5 μm ≤ T ≤ 60 μm. For example, 0.1 μm ≤ T ≤ 300 μm, for example 0.2 μm ≤ T ≤ 250 μm, for example 2 μm ≤ T ≤ 150 μm, but the present invention is not limited thereto.

[0033] According to some embodiments of the present invention, the adhesive layer 150 formed of an adhesive material has a storage modulus. The storage modulus represents the deformation energy of the adhesive layer 150. In some embodiments, the storage modulus may be greater than or equal to 10 KPa and may be less than or equal to 2000 KPa, that is, 10 KPa ≤ storage modulus ≤ 2000 KPa. For example, 100 KPa ≤ storage modulus ≤ 1000 KPa, or for example 200 KPa ≤ storage modulus ≤ 500 KPa, but the present invention is not limited thereto. According to some other embodiments of the present invention, the adhesive layer 150 formed of an adhesive material has a loss modulus. The loss modulus represents the loss energy of the adhesive layer 150. In some embodiments, 5 KPa ≤ loss modulus ≤ 200 KPa. For example, 10 KPa ≤ loss modulus ≤ 100 KPa, or for example 20 KPa ≤ loss modulus ≤ 80 KPa. According to some other embodiments of the present invention, the ratio of the loss modulus to the storage modulus is the loss factor (tanδ) of the adhesive layer 150, that is, loss factor = loss modulus / storage modulus. The loss factor can be greater than 0 and can be less than 1, that is, 0 < tanδ < 1. For example, 0.01 < tanδ < 0.4, or for example 0.1 < tanδ < 0.25. A smaller loss factor of the adhesive layer 150 is beneficial to maintaining the light output of the light-emitting units in each electronic device of the present invention. The loss factor of the adhesive layer 150 can be obtained by measuring the loss modulus and the storage modulus of the adhesive material of the adhesive layer 150 respectively by an instrument. For example, the viscosity and damping phase (tanδ) represented by the loss modulus and the storage modulus of the adhesive layer 150 can be measured by a dynamic mechanical analyzer (DMA). <照

[0034] As Figure 1 [[ID=]] Figure 1As illustrated, the second surface 140T of the second light-emitting unit 140 may have a second microstructure 141, and the third surface 145T of the third light-emitting unit 145 may have a third microstructure 146. The second surface 140T is located away from the first substrate 110. In some embodiments, the microstructure includes a periodic arrangement structure. A periodic arrangement structure means that the arrangement structure has a minimum arrangement unit, and this minimum arrangement unit is repeatedly formed along an arrangement direction, such as the X direction or the Y direction. Or in some embodiments, the microstructure includes an irregular arrangement structure. An irregular arrangement structure means that this arrangement structure does not have fixed arrangement units. For example, such as Figure 1 As shown, the first surface 130T of the first light-emitting unit 130, the second surface 140T of the second light-emitting unit 140, and the third surface 145T of the third light-emitting unit 145 can each have a periodic arrangement structure formed by repeating the smallest arrangement unit along the arrangement direction.

[0035] Figure 2 Draw the corresponding Figure 1 A schematic diagram of one modified embodiment is shown. The surface of the light-emitting unit may have a plurality of protrusions. In a cross-sectional view, the top of one of the plurality of protrusions may be arc-shaped. Figure 1 or Figure 2 The first microstructures 131, arranged regularly or irregularly, include a plurality of first protruding structures 131A and a plurality of first recessed structures 131B. For example, Figure 2 The first surface 130T of the illustrated first light-emitting unit 130 includes an irregularly arranged first microstructure 131, and the top of one of the plurality of first protrusions 131A is arc-shaped, but the present invention is not limited thereto. The second microstructure 141 or the third microstructure 146 may also include a periodically arranged structure or an irregularly arranged structure, respectively. Figure 1 or Figure 2 The microstructures, each containing a plurality of protrusions, can be drawn to increase the light output of each light-emitting unit. Figure 1 or Figure 2 The positions marked on the lower surface 152 of the adhesive layer 150 can be flat.

[0036] Figure 3 Draw the corresponding Figure 1 A partially enlarged schematic diagram of another embodiment of the first surface 130T of the first light-emitting unit 130, the second surface 140T of the second light-emitting unit 140, or the third surface 145T of the third light-emitting unit 145. Figure 4 Draw the corresponding Figure 3A partially enlarged schematic diagram of one embodiment of the upper surface of the light-emitting unit. The surface of the light-emitting unit may have a plurality of protrusions. In a cross-sectional view, the apex of one of the plurality of protrusions is an acute angle. The acute angle at the apex may have an included angle θ. In some embodiments, the included angle θ may be greater than 0°. In other embodiments, the included angle θ may be less than 90°, for example, such that 0° < θ < 90°, for example 10° < θ < 80°, for example 20° < θ < 70°, but the invention is not limited thereto. For example, Figure 3 The first surface 130T of the illustrated first light-emitting unit 130 has a periodic arrangement structure formed by repeatedly arranging the smallest arrangement units along the arrangement direction. The smallest arrangement unit may be a first microstructure 131 including a first protruding structure 131A and a first recessed structure 131B. The top of one of the plurality of protruding structures in the periodic arrangement structure is an acute angle. Figure 3 The position indicated by the lower surface 152 of the adhesive layer 150 shown in the drawing may not be flat.

[0037] like Figure 2 or Figure 3 As illustrated, the upper surface of the light-emitting unit can have a plurality of protrusions. In the cross-sectional view, in one direction, there is a minimum straight-line distance between two adjacent protrusions among the plurality of protrusions. This distance can be between 0.1 micrometers and 10 micrometers. For example, taking the first surface 130T of the first light-emitting unit 130 as an example, the first surface 130T of the first light-emitting unit 130 has a first microstructure 131. The first microstructure 131 has a plurality of first protrusions 131A. In one direction of the cross-sectional view, the distance d1 between two adjacent first protrusions 131A among the plurality of first protrusions 131A can be between 0.1 micrometers and 10 micrometers, that is, 0.1 μm ≤ d1 ≤ 10 μm, for example 0.2 μm ≤ d1 ≤ 8 μm, or for example 0.5 μm ≤ d1 ≤ 7 μm, but the present invention is not limited thereto. Taking the second surface 140T of the second light-emitting unit 140 as an example, the second surface 140T of the second light-emitting unit 140 has a second microstructure 141. The second microstructure 141 has a plurality of second protrusion structures 141A and second recessed structures 141B. In one direction of the cross-sectional view, the distance d2 between two adjacent second protrusion structures 141A among the plurality of second protrusion structures 141A can be between 0.1 μm and 10 μm, that is, 0.1 μm ≤ d2 ≤ 10 μm, for example 0.2 μm ≤ d2 ≤ 8 μm, for example 0.5 μm ≤ d2 ≤ 7 μm, but the present invention is not limited thereto. According to some embodiments of the present invention, the distance d1 and the distance d2 can be the same. According to other embodiments of the present invention, the distance d1 and the distance d2 can be different. Figure 1The third surface 145T of the third light-emitting unit 140 shown in the figure may have a third microstructure 146. The third microstructure 146 may have a plurality of third protrusion structures 146A and third recessed structures 146B.

[0038] like Figure 3 As shown, the first microstructure 131 of the first light-emitting unit 130 has a plurality of first recessed structures 131B. The adhesive layer 150 has a lower surface 152, which is away from the second substrate 180. The lower surface 152 has a recess 152C, which is recessed toward the first substrate 110, and the recess 152C of the adhesive layer 150 overlaps the first recessed structures 131B of the first light-emitting unit 130.

[0039] Please continue reading. Figure 1 , Figure 2 ,or Figure 3 According to some embodiments, a first gap 151 exists between the adhesive layer 150 and the first microstructure 131 of the first light-emitting element 130. For example, the adhesive layer 150 has a first gap 151 with the first microstructure 131 of the first light-emitting unit 130, or the adhesive layer 150 has a second gap 153 with the second microstructure 141 of the second light-emitting unit 140, or the adhesive layer 150 has a third gap 154 ​​with the third microstructure 146 of the third light-emitting unit 145. In other words, a gap can be formed between the lower surface 152 of the adhesive layer 150 and the surface of the light-emitting unit, such as at least one of the first surface 130T, the second surface 140T, and the third surface 145T. According to some embodiments of the present invention, each gap may include air. Specifically, the first gap 151 exists between the lower surface 152 of the adhesive layer 150 and the first microstructure 131 of the first light-emitting unit 130. The lower surface 152 of the adhesive layer 150 can directly contact the first protrusion structure 131A of the first microstructure 131.

[0040] According to some embodiments of the present invention, for example, the gap of the first gap 151 in a cross-sectional view may have a width W and a depth H. The width W is the maximum dimension of the gap in the X or Y direction. The depth H is the maximum dimension of the gap in the Z direction. In some embodiments, the width W may be between 0.05 micrometers and 3 micrometers, that is, 0.05 μm ≤ W ≤ 3 μm, but the present invention is not limited thereto. The depth H may be between 0.05 micrometers and 3 micrometers, that is, 0.05 μm ≤ D ≤ 3 μm, but the present invention is not limited thereto. For example, the width W and depth H of the gap of the first gap 151 may be designed to have an appropriate ratio. According to some embodiments, the ratio of the first depth to the first width (H / W) of the first gap 151 may be between 0.1 and 2.0. It may be between 0.1 and 2.0, that is, 0.1 ≤ (H / W) ≤ 2.0, or 0.4 ≤ (H / W) ≤ 1.0, but the present invention is not limited thereto. According to some embodiments of the present invention, the first gap 151 of the first light-emitting unit 130, the second gap 153 of the second light-emitting unit 140, and the third gap 154 ​​of the third light-emitting unit 145 may have the same shape or size. According to other embodiments of the present invention, for example... Figure 2 As shown in the figure, the shape or size of the first gap 151 of the first light-emitting unit 130, the second gap 153 of the second light-emitting unit 140, and the third gap 154 ​​of the third light-emitting unit 145 may be different.

[0041] According to some embodiments, a suitable adhesive layer 150 is selected, such that a gap exists between the microstructure of the light-emitting unit and the adhesive layer 150. Specifically, the adhesive layer 150 is provided such that a first gap 151 exists between the first microstructure 131 of the first light-emitting unit 130 and the adhesive layer 150. A second gap 153 exists between the second microstructure 141 of the second light-emitting unit 140 and the adhesive layer 150. In this way, the brightness loss caused by the adhesive layer 150 to the light-emitting unit can be reduced, thereby improving the light extraction efficiency of the light-emitting unit and the light extraction efficiency of the electronic device.

[0042] Figure 4 Draw the corresponding Figure 3This is a partially enlarged schematic diagram of one embodiment of the upper surface of the adhesive layer 150. For example, the lowest point of the adhesive layer 150 in the region outside the first gap 151 is a reference point P, and the lowest point of the adhesive layer 150 in the first gap 151 of a given light-emitting unit is a deep-penetration point Q. The distance between the deep-penetration point Q and the reference point P in the Z direction is called the entry depth R. When the entry depth R is large, the adhesive layer 150 may affect the microstructure of the light-emitting unit, thereby reducing the brightness of the electronic device. There can be an entry depth ratio R / H between the entry depth R of the adhesive layer 150 and the depth H of the first gap 151. According to some embodiments of the present invention, the entry depth ratio R / H may not be greater than 0.5, for example, between 0 and 0.5, that is, 0 < (R / H) ≤ 0.5, for example, 0.05 < (R / H) ≤ 0.4, but the present invention is not limited thereto. A smaller entry depth ratio R / H is beneficial to reduce the influence of the adhesive layer 150 on the optical properties of the microstructure of the light-emitting unit, thereby maintaining the brightness of the electronic device.

[0043] Figure 5 A schematic cross-sectional view of an electronic device 102 according to a second embodiment of the present invention is shown. The main difference between the electronic device 102 of the second embodiment and the electronic device 101 of the first embodiment is that the electronic device 102 of the second embodiment further includes a color filter layer 170, which may be required as needed. The color filter layer 170 is disposed between the adhesive layer 150 and the second substrate 180, and is disposed in the Z direction relative to the corresponding light-emitting unit. The color filter layer 170 may, for example, directly contact the surfaces of the adhesive layer 150 and the second substrate 180.

[0044] The color filter layer 170 may include color filter elements, which may be respectively disposed above the light-emitting side of different light-emitting units. For example, the color filter layer 170 may include a first color filter element 171, or may further include a second color filter element 172 and a third color filter element 173. The first color filter element 171, the second color filter element 172, and the third color filter element 173 may correspond to a red filter element, a green filter element, and a blue filter element, respectively. For example, the red filter element in the color filter layer 170 may be disposed between the adhesive layer 150 and the second substrate 180, and disposed in the Z direction relative to the corresponding first light-emitting unit 130, and so on, but the present invention is not limited thereto. Each color filter element may contain a suitable color material. The top surfaces of the color filter elements in the color filter layer 170 may be flush with each other, forming a coplanar structure.

[0045] like Figure 5As shown, in the electronic device 102 of the second embodiment, the color filter layer 170 may include a light-shielding layer 174 disposed between adjacent red, green, and blue filter elements. The light-shielding layer 174 may, for example, directly contact the surfaces of the adhesive layer 150 and the second substrate 180. The light-shielding layer 174 may contain a light-shielding material, which may include, for example, black material, black photoresist, black printing ink, black resin, other suitable materials, or combinations thereof, but is not limited thereto. The light-shielding layer 174 may be a black matrix layer. The light-shielding layer 174 may be located between two adjacent filter elements, defining the positions of the red, green, and blue filter elements, and also helping to reduce crosstalk of light from adjacent filter elements. In this invention, the output light leaving the color filter layer 170 can be considered as the final visible light of the electronic device 102 perceived by the user (observer). The light-shielding layer 174 may overlap the pixel defining layer 139.

[0046] Figure 6 A cross-sectional view of an electronic device 103 according to a third embodiment of the present invention is shown. The main difference between the electronic device 103 of the third embodiment and the electronic device 101 of the first embodiment is that the electronic device 103 of the third embodiment further includes a color filter layer 170 and a color conversion layer 160 as needed, and a group consisting of a first light-emitting unit 130, a second light-emitting unit 140, and a third light-emitting unit 145 selected from green light-emitting units and blue light-emitting units. Figure 6 The illustration shows that the first light-emitting unit 130 can be a light-emitting unit emitting blue light, the second light-emitting unit 140 can be a light-emitting unit emitting green light, and the third light-emitting unit 145 can be a light-emitting unit emitting blue light, but the present invention is not limited thereto. Replacing the first light-emitting unit 130 emitting red light with a light-emitting unit emitting blue light helps to increase the luminous efficiency of the first light-emitting unit 130.

[0047] like Figure 6 As shown, the light conversion layer 160 may include a first light conversion element 161, a second light conversion element 162 as needed, or a third light conversion element 163 as needed. The light conversion layer 160 may be located between the adhesive layer 150 and the color filter layer 170 in the normal direction of the first substrate 110, such as the Z direction, overlapping with the corresponding light-emitting unit to adjust the output light of the electronic device 103. The light conversion layer 160 may be correspondingly disposed above the light-emitting side of the light-emitting unit. Figure 6The color filter layer 170 in the light-emitting unit blocks, absorbs, or filters light that has not been converted by the light conversion layer 160, thereby enhancing the purity of the monochromatic light output by the light-emitting unit. This allows the electronic device 103 to improve its optical performance and enhance the color quality of the output light. Each light-emitting unit, along with its corresponding filter element, light conversion layer 160, and a portion of the adhesive layer 150, can form a pixel P1. For example, the first light-emitting unit 130, along with its corresponding first color filter element 171, first light conversion element 161, and a portion of the adhesive layer 150 (overlapping with the light-emitting unit 130), can form a pixel P1.

[0048] The light conversion layer 160 may be a wavelength conversion element to adjust the wavelength of the output light of the electronic device 103, but is not limited thereto. For example, the wavelength conversion element may output blue light, cyan light, green light, yellow light, red light, or a combination thereof, but is not limited thereto. The wavelength conversion element includes quantum dot particles (QD particles), phosphorescent materials, fluorescent materials, pigments, dyes, scattering particles, filter layers, other suitable materials, or combinations thereof, but is not limited thereto, that convert blue light into red or green light. The quantum dots may be composed of semiconductor nanocrystal structures. When the quantum dots are excited by input light, the input light is converted by the quantum dots into emitted light of other colors. The color of the emitted light can be adjusted by changing the material, shape, or size of the quantum dots. In some embodiments, the quantum dots may comprise spherical particles, rod-shaped particles, or particles with any other suitable shape, as long as the quantum dots can emit light of a suitable color.

[0049] The second light conversion element 162, or the third light conversion element 163, may not include quantum dot particles, depending on the situation. For example, when the second light-emitting unit 140 is a green light-emitting unit with a green filter element disposed thereon, and the third light-emitting unit 145 is a blue light-emitting unit with a blue filter element disposed thereon, the second light conversion element 162 and the third light conversion element 163 may each be replaced with a scattering layer filled with scattering particles instead of quantum dot particles. In other words, each light-emitting unit does not necessarily have a wavelength conversion element disposed thereon.

[0050] A first light conversion element 161 is disposed between the adhesive layer 150 and the color filter layer 170, and is positioned relative to the first light-emitting unit 130. A second light conversion element 162 or a third light conversion element 163 may be similarly disposed. According to some embodiments, Figure 6In this design, the first light-emitting unit 130 and the third light-emitting unit 145 are blue. The first light conversion element 161 may include quantum dot particles, and the second light conversion element 162 and the third light conversion element 163 may include scattering layers. The first color filter element 171 is red, the second color filter element 172 is green, and the third color filter element 173 is blue. The first light conversion element 161 can convert the blue light emitted by the first light-emitting unit 130 into red light. Thus, on the light-emitting surface 185 of the second substrate 180, the first pixel area P1 emits red light, the second pixel area P2 emits green light, and the third pixel area P3 emits blue light.

[0051] The light conversion layer 160 may further include a barrier layer. The barrier layer includes barrier elements disposed between adjacent light conversion layers, such as a barrier element 175 disposed between adjacent first light conversion elements 161 and second light conversion elements 162, and a barrier element 175 disposed between adjacent second light conversion elements 162 and third light conversion elements 163, but the invention is not limited thereto. The barrier layer can serve as a bank, but the invention is not limited thereto. The barrier layer can be used to define the position of the light conversion layer 160. The light-shielding layer 174 may, for example, directly contact the surfaces of the color filter layer 170, the barrier layer, and the second substrate 180. The barrier layer may, for example, directly contact the surfaces of the adhesive layer 150, the color filter layer 170, the light-shielding layer 174, and the light conversion layer 160. The second substrate 180 may, for example, directly contact the surfaces of the color filter layer 170 and the light-shielding layer 174.

[0052] In one embodiment, the first light conversion element 161 and the second light conversion element 162 emit different colors of light. For example, when the first light-emitting unit 130 is a blue light-emitting unit, the first light conversion element 161 corresponding to the blue light-emitting unit can convert blue light into red light, but is not limited to this. When the second light-emitting unit 140 is a blue light-emitting unit, the second light conversion element 162 corresponding to the blue light-emitting unit can convert blue light into green light, but is not limited to this. Thus, the first light-emitting unit 130 and the second light-emitting unit 140 emit the same blue light, while the first light conversion element 161 and the second light conversion element 162 emit different colors of red and green light, respectively.

[0053] In another embodiment, the top surfaces of the first light conversion element 161, the second light conversion element 162, and the third light conversion element 163 can be flush with each other, forming a coplanar structure. This coplanar structure helps reduce the optical differences among the first light-emitting unit 130, the second light-emitting unit 140, and the third light-emitting unit 145. The arrangement of the first light-emitting unit 130 and the third light-emitting unit 145 emitting light of the same color in the electronic device 103 further simplifies the structure of the electronic device 103, reduces the manufacturing complexity of the electronic device 103, and / or maintains the optical performance of the electronic device 103.

[0054] Figure 7 A schematic cross-sectional view of an electronic device 104 according to a fourth embodiment of the present invention is shown. The main difference between the electronic device 104 of the fourth embodiment and the electronic device 103 of the third embodiment is that the configuration of the light conversion layer and the light-emitting unit of the electronic device 104 of the fourth embodiment is different. Figure 7 The illustrated electronic device 104 of the fourth embodiment includes light conversion elements emitting different colors and light-emitting units emitting the same color. For example, the electronic device 104 may further include a second light conversion element 162. The second light conversion element 162 is disposed between the adhesive layer 150 and the color filter layer 170, and is disposed relative to the second light-emitting unit 140. In one embodiment, the first light-emitting unit 130 emits light of a first color, and the second light-emitting unit 140 emits light of a second color; the first color and the second color may be the same, for example, the first color and the second color may be blue. In another embodiment, the first light conversion element 161 has a first emitted color, and the second light conversion element 162 has a second emitted color; the first emitted color and the second emitted color are different. For example, the first emitted color is red, and the second emitted color is green, but the invention is not limited thereto.

[0055] The electronic device 104 may further include a third light conversion element 163. When the third color is blue and the third emitted light color is blue, the third light conversion element 163 may not include quantum dot particles, but instead be replaced by a scattering layer filled with scattering particles. The arrangement of the first light-emitting unit 130, the second light-emitting unit 140, and the third light-emitting unit 145 emitting light of the same color in the electronic device 104 helps to further simplify the structure of the electronic device 104, reduce the manufacturing complexity of the electronic device 104, and / or maintain the optical performance of the electronic device 104. According to some embodiments, Figure 7In this design, the first light-emitting unit 130, the second light-emitting unit 140, and the third light-emitting unit 145 are blue. The first light conversion element 161 and the second light conversion element 162 may include quantum dot particles, and the third light conversion element 163 may include a scattering layer. The first color filter element 171 is red, the second color filter element 172 is green, and the third color filter element 173 is blue. The first light conversion element 161 can convert the blue light emitted by the first light-emitting unit 130 into red light, and the second light conversion element 162 can convert the blue light emitted by the second light-emitting unit 140 into green light. Thus, on the light-emitting surface 185 of the second substrate 180, the first pixel area P1 emits red light, the second pixel area P2 emits green light, and the third pixel area P3 emits blue light.

[0056] The table below shows the light output of the electronic device of this invention before and after bonding, using three different adhesive layers. The three adhesive layers have different loss factors (tanδ). The data in the table show that selecting an appropriate adhesive layer is beneficial for maintaining the light output of the electronic device.

[0057]

[0058] In some embodiments, a suitable adhesive layer is selected so that there is a gap between the microstructure of the light-emitting surface of the light-emitting unit and the adhesive layer. This reduces the brightness loss that the adhesive layer may cause and improves the light extraction efficiency of the light-emitting unit.

[0059] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, include: First substrate; A second substrate is disposed relative to the first substrate; A first light-emitting unit is disposed between the first substrate and the second substrate, and a first surface of the first light-emitting unit has a first microstructure, the first surface being away from the first substrate; as well as An adhesive layer is disposed between the second substrate and the first surface of the first light-emitting unit; There is a first gap between the adhesive layer and the first microstructure.

2. The electronic device as claimed in claim 1, characterized in that, The first microstructure of the first light-emitting unit has a plurality of first protrusion structures. In a cross-sectional view, in a first direction, a first distance d1 between two adjacent first protrusion structures is between 0.1 micrometers and 10 micrometers.

3. The electronic device as claimed in claim 1, characterized in that, Also includes: A second light-emitting unit is disposed between the first substrate and the second substrate. The first light-emitting unit and the second light-emitting unit are disposed adjacent to each other in the first direction. The electronic device includes a first pixel area and a second pixel area. The first light-emitting unit is disposed in the first pixel area, and the second light-emitting unit is disposed in the second pixel area. On a light-emitting surface of the second substrate, the first pixel area emits light of a first color, and the second pixel area emits light of a second color. The first color and the second color are different.

4. The electronic device as claimed in claim 1, characterized in that, The second light-emitting unit has a second microstructure on a second surface, the second surface being away from the first substrate, wherein there is a second gap between the adhesive layer and the second microstructure, and the size of the first gap and the size of the second gap are different.

5. The electronic device as claimed in claim 4, characterized in that, The second microstructure of the second light-emitting unit has a plurality of second protrusion structures. In the cross-sectional view, in the first direction, a second distance d2 between two adjacent second protrusion structures among the plurality of second protrusion structures is between 0.1 micrometers and 10 micrometers. The first distance and the second distance are different.

6. The electronic device as claimed in claim 1, characterized in that, The first microstructure of the first light-emitting unit has a plurality of first protrusion structures, and in a cross-sectional view, at least one of the plurality of first protrusion structures has an arc-shaped top.

7. The electronic device as claimed in claim 1, characterized in that, The first microstructure of the first light-emitting unit has a plurality of first protrusion structures, and in a cross-sectional view, at least one of the plurality of first protrusion structures has an acute angle at its top.

8. The electronic device as claimed in claim 1, characterized in that, The loss factor of the adhesive layer is greater than 0 and less than 1.

9. The electronic device as claimed in claim 1, characterized in that, The storage modulus of the adhesive layer is greater than or equal to 10 kPa and less than or equal to 2000 kPa.

10. The electronic device as claimed in claim 1, characterized in that, In a cross-sectional view, the first gap has a first depth and a first width, the ratio of the first depth to the first width being between 0.1 and 2.

0.

11. The electronic device as claimed in claim 1, characterized in that, The first microstructure of the first light-emitting unit has a plurality of first recessed structures, the adhesive layer has a lower surface that is away from the second substrate, the lower surface has a recess that is recessed toward the first substrate, and the recess of the adhesive layer overlaps the first recessed structure of the first light-emitting unit.

12. The electronic device as claimed in claim 1, characterized in that, Also includes: A first color filter element is disposed between the adhesive layer and the second substrate and is disposed corresponding to the first light-emitting unit.

13. The electronic device as claimed in claim 12, characterized in that, Also includes: A first light conversion element is disposed between the adhesive layer and the first color filter element and is disposed corresponding to the first light-emitting unit.

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