Air-cooled phase change radiator with lattice structure

Abstract

The invention belongs to the technical field of heat dissipation, and particularly relates to a lattice structure air-cooled phase change radiator which comprises a shell, a cavity is formed in the shell, and a first air inlet and a first air outlet which are communicated with the cavity are formed in the shell; the lattice structure is internally provided with a plurality of first gas channels and a plurality of second gas channels, and the first gas inlet and the first gas outlet are communicated with the first gas channels; the phase change assembly is arranged in the cavity and arranged on the lower portion of the lattice structure, the phase change assembly comprises a plurality of phase change units, a bottom shell and an upper plate, the bottom shell and the upper plate are arranged at the two ends of the phase change units, a phase change cavity is formed between the upper plate and the bottom shell, each phase change unit correspondingly communicates with the corresponding second gas channel, and a plurality of uniform-temperature three-dimensional channels in a vacuum state are formed. The bottom shell is used for making contact with a heating source, a working medium is packaged in the phase change unit, heat of the bottom shell can be efficiently conducted into the uniform-temperature three-dimensional channel through phase change circulation of the working medium, the uniform-temperature three-dimensional channel and the first gas channel are staggered, and therefore rapid heat exchange is conducted.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology, and in particular relates to a gas-cooled phase change heat sink with a lattice structure. Background Technology

[0002] As the performance of various communication and industrial electronic products improves, chip power is increasing, and heat flux density is also rising, necessitating heat dissipation to ensure the proper functioning of the chips. The higher the chip's performance, the more heat it generates; therefore, heat dissipation devices play a crucial role in electronic products.

[0003] Most existing heat sinks are liquid-cooled heat sinks. When cooling the data in places such as computer rooms, liquid is introduced through pipes to cool the chips in the computer room. Because there are many heavy devices in the computer room, there are also many liquid pipes, which affects the aesthetics. At the same time, if the liquid pipes leak, the computer room will lose water, causing machine damage and resulting in significant losses. Summary of the Invention

[0004] The purpose of this invention is to provide a gas-cooled phase change heat sink with a lattice structure, which aims to solve the problems in the background art.

[0005] To achieve the above objectives, the present invention provides an air-cooled phase change heat sink with a lattice structure, comprising a shell, a cavity inside the shell, and a first air inlet and a first air outlet communicating with the cavity on the shell;

[0006] The system includes an outer casing, which contains a cavity, and the outer casing has a first air inlet and a first air outlet communicating with the cavity. A lattice structure is disposed within the cavity, and the lattice structure is provided with a plurality of first gas channels and a plurality of second gas channels. The plurality of first gas channels and the plurality of second gas channels are not interconnected but are interleaved. The first gas inlet and the first gas outlet are connected to the plurality of first gas channels. A phase change assembly is disposed within the cavity and at the lower part of the lattice structure. The phase change assembly includes multiple phase change units and a bottom shell and an upper plate disposed at both ends of the multiple phase change units. A heat dissipation cavity is formed between the upper plate and the bottom shell. Each phase change unit is connected to each of the second gas channels to form multiple uniform temperature three-dimensional channels in a vacuum state. The bottom shell is used to contact the heat source. The phase change unit is encapsulated with a working fluid, which can efficiently conduct the heat of the bottom shell to the uniform temperature three-dimensional channel through the phase change cycle of the working fluid to exchange heat with the gas flowing through the first gas channel.

[0007] Optionally, each phase change unit includes a solid heat-conducting column and a shell surrounding the heat-conducting column, forming a phase change cavity between the shell and the heat-conducting column. An opening is provided on the upper plate, and the phase change cavity is connected to the second gas channel to jointly form a vacuum-equivalent temperature three-dimensional channel. The phase change cavity is encapsulated with a working fluid. Both the shell and the bottom shell are made by metal powder 3D printing additive manufacturing process and have capillary structures. The capillary structures of the shell and the bottom shell are connected to form a liquid reflux channel.

[0008] Optionally, the cavity is provided with a partition, which divides the cavity into an upper cavity and a lower cavity. The lattice structure is located in the upper cavity, and the phase change component is located in the lower cavity. The partition is provided with multiple through holes. The upper end of each phase change unit is connected to the lower end of a second gas channel. The through holes are aligned with and connected to the openings in the vertical direction. Vapor can enter the second gas channel through the openings and the through holes.

[0009] Optionally, the upper cavity is provided with a guide plate, and the first air inlet and the first air outlet are respectively located on both sides of the guide plate. The guide plate is used to separate the internal space of the upper cavity so that gas enters from the first air inlet, passes through the lattice structure, and then flows out from the first air outlet.

[0010] Optionally, the lattice structure is made of a high thermal conductivity metal.

[0011] Optionally, the high thermal conductivity metal material is one of copper, copper alloy, and aluminum alloy.

[0012] Optionally, the outer casing is further provided with a second air inlet and a second air outlet that communicate with the phase change cavity.

[0013] Optionally, the metal powder includes one of copper powder, titanium powder or aluminum powder, and the capillary porosity is between 40% and 70%.

[0014] Optionally, the heat-conducting pillar is made of a material with high thermal conductivity, and the material of the heat-conducting pillar can be one of pure copper, oxygen-free copper, or nickel-plated copper.

[0015] Compared with the prior art, the above-mentioned one or more technical solutions in the lattice-structured air-cooled phase change heat sink provided by the embodiments of the present invention have at least one of the following technical effects: This radiator addresses the leakage risks of existing liquid-cooled heat sinks, preventing equipment damage and significant losses. It employs an air-cooled phase-change cooling system, eliminating the need for liquid piping. Heat transfer is achieved through the phase-change cycle of the working fluid, combined with gas flow to remove heat. This replaces the traditional liquid piping layout of liquid-cooled heat sinks, fundamentally preventing issues like water loss and equipment damage caused by liquid leaks. This enhances the safety and stability of equipment operation in the data center and reduces maintenance costs. The complex internal lattice structure provides a significantly larger specific surface area than straight channels, creating a larger contact surface for heat exchange. Within the same volume, a larger heat exchange contact surface results in better heat exchange efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the structure of the present invention from another angle.

[0019] Figure 3 This is a schematic cross-sectional view of the structure of the present invention.

[0020] Figure 4 for Figure 3 Enlarged view of point A.

[0021] Figure 5 This is a cross-sectional schematic diagram of the first embodiment of the present invention.

[0022] Figure 6 This is a cross-sectional schematic diagram of the second embodiment of the present invention.

[0023] Figure 7 This is a schematic diagram of the crystal lattice structure of the present invention.

[0024] Figure 8 This is a schematic cross-sectional view of the crystal structure of the present invention.

[0025] The following are the labeling elements in the figure: 100. Outer shell; 110. Cavity; 120. First air inlet; 130. First air outlet; 140. Second air inlet; 150. Second air outlet; 160. Partition; 161. Through hole; 170. Guide plate; 171. Air guide chamber; 200. Crystal structure; 300, Phase change assembly; 310, Phase change unit; 311, Heat-conducting column; 312, Shell; 313, Phase change cavity; 320, Bottom shell; 330, Top plate; 331, Opening; 340, Heat dissipation cavity. Detailed Implementation

[0026] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0027] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0030] This invention provides a 200 air-cooled phase change heat sink with a lattice structure, such as... Figure 1-8 As shown, a 200-type air-cooled phase change heat sink with a lattice structure is disclosed to solve the technical problem of messy liquid pipe arrangement and easy leakage leading to equipment damage in existing liquid-cooled heat sinks in computer rooms and other occasions. Its specific structure is described in detail below with reference to the technical solution in the claims. The overall structure is compact, heat dissipation is efficient and no liquid pipes are required, which is suitable for the heat dissipation needs of heat sources such as chips in computer rooms.

[0031] The heat sink includes a housing 100, a lattice structure 200, and a phase change component 300. The housing 100 is made of metal or plastic, preferably aluminum alloy, which ensures the structural strength of the housing 100, reduces the overall weight, and provides some auxiliary heat conduction. A sealed cavity 110 is formed inside the housing 100, providing installation space for the lattice structure 200 and the phase change component 300. A first air inlet 120 and a first air outlet 130 are provided on the same side wall of the housing 100. Both the first air inlet 120 and the first air outlet 130 are circular, and their axes are perpendicular to the side wall of the housing 100, ensuring smooth airflow into and out of the cavity 110 while preventing eddies at the inlet and outlet, thus reducing airflow resistance. To improve sealing, high-temperature resistant sealing rubber rings are nested at both the first air inlet 120 and the first air outlet 130, which fit tightly against the side wall of the outer casing 100 to prevent gas leakage and ensure heat dissipation efficiency.

[0032] like Figure 3 , 7 As shown in Figure 8, the lattice structure 200 is disposed within the cavity 110 of the outer shell 100 and is made of a high thermal conductivity metal, preferably copper, which has a thermal conductivity of 401 W / (m·K), enabling rapid heat conduction and improving heat exchange efficiency. The lattice structure 200 is integrally formed with the shape of the cavity 110 and is fixed within the cavity 110 by welding or gluing. Multiple first gas channels and multiple second gas channels are integrally formed within the lattice structure 200. These channels are independent and not interconnected, but are arranged in an alternating pattern, extending vertically or horizontally to ensure that gases and vapors can flow independently and avoid mutual interference. The complex internal structure of the lattice structure 200 provides a surface area far exceeding that of straight channels, creating a larger contact surface for heat exchange. With the same volume, a larger contact surface results in better heat exchange efficiency. The lattice structure 200 acts like countless miniature flow disruptors within the flow channel, constantly interfering with the airflow and transforming it from stable laminar flow into chaotic turbulent flow. Compared to smooth channels, the heat transfer coefficient can be increased by approximately 140%. The lattice structure 200 itself is a good conductor of heat, rapidly transferring heat from the hot end to the entire structure and eliminating local hot spots. Simultaneously, the induced eddies also promote the microscopic mixing of hot and cold fluids.

[0033] As an optimal arrangement, each second gas channel is located at the center of multiple adjacent first gas channels. This arrangement maximizes the use of the space in the lattice structure 200, allowing the cooling gas in the first gas channels to fully contact the steam in the second gas channels, thereby improving the heat exchange area and efficiency. Both the first inlet 120 and the first outlet 130 are connected to multiple first gas channels. The upper cavity 110 is equipped with a guide plate. Specifically, the first inlet 120 is connected to one end of all the first gas channels through a guide cavity 171 separated by the guide plate 170, and the first outlet 130 is connected to the other side of all the first gas channels through the other guide cavity 171. This arrangement guides the cooling gas to enter each first gas channel evenly, preventing insufficient gas flow in some channels and ensuring uniform heat dissipation.

[0034] Furthermore, such as Figure 5 As shown, one end of the guide plate is fixedly mounted on the cavity wall of the upper cavity 110, and the other end can be connected to the lattice structure 200, closely fitting the upper surface of the lattice structure 200, and can also be used as... Figure 6 As shown, the guide plate 170 extends into the lattice structure 200. The guide plate 170 divides part of the internal space of the upper cavity 110 into two gas guiding chambers 171, forming a U-shaped flow channel. The first air inlet 120 and the first air outlet 130 are respectively located on both sides of the guide plate, with the first air inlet 120 corresponding to one end of the U-shaped flow channel and the first air outlet 130 corresponding to the other end of the U-shaped flow channel. The function of the guide plate is to guide the flow direction of the cooling gas, so that after the gas enters from the first air inlet 120, it flows evenly along the U-shaped flow channel through all the first gas channels of the entire lattice structure 200, fully exchanging heat with the vapor in the second gas channels, and then flows out from the first air outlet 130. This avoids the gas flowing directly from the air inlet to the air outlet, which would result in some of the first gas channels not being fully utilized, thus improving heat dissipation efficiency and uniformity.

[0035] Furthermore, such as Figure 3As shown, the phase change assembly 300 is installed inside the cavity 110 of the outer casing 100 and is fixedly disposed at the lower part of the lattice structure 200, closely fitting with the bottom plate of the lattice structure 200 to ensure efficient heat conduction. The phase change assembly 300 includes multiple phase change units 310 and a bottom shell 320 and an upper plate 330 fixedly installed at the upper and lower ends of the multiple phase change units 310. The upper plate 330 and the bottom shell 320 are both flat plate structures, parallel to each other and perpendicular to the phase change units 310. The upper plate 330 and the bottom shell 320 enclose a sealed heat dissipation cavity 340. The phase change units 310 are evenly distributed in the heat dissipation cavity 340. The upper end of each phase change unit 310 is connected to the lower opening of a second gas channel. The other end of the second gas channel is closed. After the two are connected, multiple uniform temperature three-dimensional channels in a vacuum state are formed. The uniform temperature three-dimensional channels provide a sealed space for the vapor flow and heat exchange of the phase change working fluid. The bottom shell 320 is made of a material with excellent thermal conductivity. Its lower end face is in close contact with heat sources such as chips in the computer room to quickly absorb the heat generated by the heat source and transfer it to the interior of the phase change unit 310. Each phase change unit 310 is encapsulated with a phase change working fluid. The working fluid is a low-boiling-point, high-thermal-conductivity fluid (such as a mixture of acetone, ethanol, and deionized water). Through its own phase change cycle, it can efficiently conduct the heat absorbed by the bottom shell 320 to the uniform temperature three-dimensional channel, and then fully exchange heat with the gas flowing in the first gas channel to achieve rapid cooling of the heat source. The heat source only needs to reach 40°C for the interior to reach 100°C for vaporization.

[0036] Furthermore, such as Figure 3As shown, each phase change unit 310 includes a solid heat-conducting column 311 and a shell 312 surrounding the outside of the heat-conducting column 311. The shell 312 is coaxially arranged with the heat-conducting column 311, and the two form an annular phase change cavity 313. The phase change cavity 313 is the containing space for the phase change working fluid and the steam flow space. An opening 331 is provided on the upper plate 330 at the position corresponding to each phase change unit 310. The opening 331 communicates with the phase change cavity 313 and is aligned and communicates with the lower opening of the second gas channel. After the phase change cavity 313, the opening 331 and the second gas channel are connected, they together form a uniform temperature three-dimensional channel in a vacuum state. The phase change working fluid is encapsulated in the phase change cavity 313. Both the ring shell 312 and the bottom shell 320 are made of metal powder using 3D printing additive manufacturing process. The metal powder used is copper powder. The ring shell 312 and the bottom shell 320 formed by 3D printing process have a uniformly distributed capillary structure inside. The capillary structure of the ring shell 312 and the capillary structure of the bottom shell 320 are interconnected and together form a liquid return channel, which facilitates the rapid return of the liquid formed by the vaporization and condensation of the phase change working fluid to the bottom of the phase change unit 310, so as to realize the continuous phase change cycle. The aforementioned uniform temperature three-dimensional channel forms a steam channel, which allows the steam after the phase change working fluid is vaporized to rise rapidly, so as to realize the rapid heat transfer. The capillary structure formed by 3D printing of metal powder has a porosity between 40% and 70%. This porosity range can balance capillary suction and liquid reflux efficiency, ensuring the stability and efficiency of phase change cycle. The solid heat-conducting column 311 is made of a material with high thermal conductivity, preferably one of pure copper, oxygen-free copper or nickel-plated copper, which can further improve the thermal conductivity of phase change unit 310 and accelerate the transfer of heat from bottom shell 320 to uniform temperature three-dimensional channel.

[0037] Furthermore, such as Figure 3 As shown, a partition plate 160 is provided inside the cavity 110, which is tightly fitted to the cavity 110 of the outer shell 100 and fixed inside the cavity 110 by welding or integral molding. The partition plate 160 divides the cavity 110 into an upper cavity 110 and a lower cavity 110. The partition plate 160 is provided with multiple through holes 161, the number of which is the same as the number of phase change units 310, and the positions of which correspond to the openings 331 on the upper plate 330. The through holes 161 are aligned with and connected to the openings 331 in the vertical direction, ensuring that the steam generated in the phase change cavity 313 can smoothly enter the second gas channel through the openings 331 and through holes 161, avoiding steam stagnation during flow and improving heat exchange efficiency.

[0038] The outer casing 100 is also provided with a second air inlet 140 and a second air outlet 150. Both the second air inlet 140 and the second air outlet 150 are connected to the heat dissipation cavity 340. According to the actual heat dissipation requirements, auxiliary heat dissipation gas can be introduced into the phase change cavity 313 through the second air inlet 140 and discharged through the second air outlet 150, further improving the heat dissipation efficiency of the phase change component 300 and adapting to the heat dissipation requirements of high-power heat sources.

[0039] The heat sink in this embodiment operates as follows: The lower surface of the bottom shell 320 is tightly attached to the heat source. The heat generated by the heat source during operation is rapidly conducted to the bottom shell 320. The bottom shell 320 conducts the heat through its capillary structure to the ring shell 312 and solid heat-conducting column 311 of the phase change unit 310, and then to the working fluid in the phase change cavity 313. When the heat absorbed by the working fluid reaches its phase change temperature (40°C), the working fluid undergoes a phase change, evaporating from a liquid state to a gaseous vapor state. Under the action of the pressure difference, the vapor enters the corresponding second gas channel through the opening 331 of the upper plate 330 and the through hole 161 of the partition plate 160. Simultaneously, cooling gas (such as room temperature air at 25°C) enters the upper cavity 110 through the first air inlet 120. Guided by the guide plate, it flows evenly through all the first gas channels, exchanging heat with the high-temperature steam in the second gas channel. After releasing heat, the high-temperature steam condenses into a liquid working fluid. The liquid working fluid flows back to the phase change cavity 313 through capillary force in the liquid return channel formed by the capillary structure of the shell 312 and the bottom shell 320, completing the phase change cycle of the working fluid. After heat exchange, the cooling gas temperature rises and flows out from the first air outlet 130, carrying away a large amount of heat, thereby achieving continuous and efficient heat dissipation of the heat source.

[0040] Based on the above specific embodiments, this 200 air-cooled phase change heat sink with lattice structure has the following beneficial effects compared with existing liquid-cooled heat sinks: It solves the leakage hazards of existing liquid-cooled heat sinks and avoids equipment damage and major losses: This heat sink adopts an air-cooled phase change heat dissipation method, which eliminates the need for liquid pipelines. Heat transfer is achieved through the phase change cycle of the phase change working fluid, and the heat is carried away by gas flow. It replaces the liquid pipeline layout of traditional liquid-cooled heat sinks, fundamentally eliminating problems such as water loss in the computer room and equipment damage caused by liquid pipeline leakage, improving the safety and stability of computer room equipment operation, and reducing maintenance costs.

[0041] With its compact structure and simple layout, this air-cooled phase change radiator enhances the aesthetics of the computer room. Existing liquid-cooled radiators require a large number of liquid pipes to accommodate the numerous devices in the computer room, resulting in messy piping and affecting the room's appearance. This radiator, featuring a lattice structure 200, integrates the outer shell 100, lattice structure 200, and phase change component 300 into one unit, eliminating the need for additional liquid piping. Its compact structure and small size prevent messy piping after installation, effectively improving the overall aesthetics of the computer room and simplifying its layout design.

[0042] With high heat dissipation efficiency, this heat sink is suitable for the heat dissipation needs of high-power equipment in computer rooms. It adopts a combination of phase change heat dissipation and air cooling. The phase change cycle of the phase change working fluid can quickly absorb and transfer heat, and the heat conduction efficiency is much higher than that of traditional liquid cooling. At the same time, multiple first and second gas channels are formed within the lattice structure 200, which increases the contact area between the gas and the heat sink and improves the heat exchange efficiency.

[0043] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention and should not be construed as limiting the specific implementation of the invention to these descriptions. For those skilled in the art, the architectural form of this invention can be flexibly varied without departing from its conceptual framework, leading to the development of a series of products. Any simple deductions or substitutions should be considered as falling within the patent protection scope defined by the submitted claims.

Claims

1. A gas-cooled phase change heat sink with a lattice structure, characterized in that, The system includes an outer casing, which contains a cavity, and the outer casing has a first air inlet and a first air outlet communicating with the cavity. A lattice structure is disposed within the cavity, and the lattice structure is provided with a plurality of first gas channels and a plurality of second gas channels. The plurality of first gas channels and the plurality of second gas channels are not interconnected but are interleaved. The first gas inlet and the first gas outlet are connected to the plurality of first gas channels. A phase change assembly is disposed within the cavity and at the lower part of the lattice structure. The phase change assembly includes multiple phase change units and a bottom shell and an upper plate disposed at both ends of the multiple phase change units. A heat dissipation cavity is formed between the upper plate and the bottom shell. Each phase change unit is connected to each of the second gas channels to form multiple uniform temperature three-dimensional channels in a vacuum state. The bottom shell is used to contact the heat source. The phase change unit is encapsulated with a working fluid, which can efficiently conduct the heat of the bottom shell to the uniform temperature three-dimensional channel through the phase change cycle of the working fluid to exchange heat with the gas flowing through the first gas channel.

2. The air-cooled phase change heat sink with a lattice structure according to claim 1, characterized in that, Each phase change unit includes a solid heat-conducting column and a shell surrounding the heat-conducting column, forming a phase change cavity between the shell and the heat-conducting column. An opening is provided on the upper plate, and the phase change cavity is connected to the second gas channel to jointly form a vacuum-equivalent temperature three-dimensional channel. The phase change cavity is encapsulated with a working fluid. Both the shell and the bottom shell are made by metal powder 3D printing additive manufacturing process and have capillary structures. The capillary structures of the shell and the bottom shell are connected to form a liquid reflux channel.

3. The air-cooled phase change heat sink with a lattice structure according to claim 2, characterized in that, The cavity is provided with a partition, which divides the cavity into an upper cavity and a lower cavity. The crystal structure is located in the upper cavity, and the phase change component is located in the lower cavity. The partition is provided with multiple through holes. The upper end of each phase change unit is connected to the lower end of a second gas channel. The through holes are aligned with and connected to the openings in the vertical direction. Vapor can enter the second gas channel through the openings and the through holes.

4. The air-cooled phase change heat sink with a lattice structure according to claim 3, characterized in that, The upper cavity is provided with a guide plate, and the first air inlet and the first air outlet are respectively located on both sides of the guide plate. The guide plate is used to separate the internal space of the upper cavity so that gas enters from the first air inlet, passes through the lattice structure, and then flows out from the first air outlet.

5. The air-cooled phase change heat sink with a lattice structure according to claim 1, characterized in that, The lattice structure is made of a high thermal conductivity metal.

6. The air-cooled phase change heat sink with a lattice structure according to claim 5, characterized in that, The high thermal conductivity metal material is one of copper, copper alloy, and aluminum alloy.

7. The air-cooled phase change heat sink with a lattice structure according to claim 1, characterized in that, The outer casing is also provided with a second air inlet and a second air outlet that are connected to the phase change cavity.

8. The air-cooled phase change heat sink with a lattice structure according to claim 2, characterized in that, The metal powder includes one of copper powder, titanium powder or aluminum powder, and the capillary porosity is between 40% and 70%.

9. The air-cooled phase change heat sink with a lattice structure according to claim 2, characterized in that, The heat-conducting pillar is made of a material with high thermal conductivity, and the material of the heat-conducting pillar can be one of pure copper, oxygen-free copper, or nickel-plated copper.

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