Apparatus and method for detecting substrate using plasma

Abstract

The present disclosure relates to an apparatus and a method for detecting a substrate using plasma, which may include the steps of: moving a plasma generator in a preset direction on a surface of a substrate whose metal layer is protected by an insulating sheet, and irradiating a gas released through the plasma generator; measuring a signal generated in the substrate during irradiation of the gas; and analyzing a characteristic of the measured signal to determine whether the metal layer is exposed to the outside.

Description

Technical Field

[0001] This disclosure relates to a substrate inspection apparatus and method, and more specifically, to a substrate inspection apparatus and method utilizing plasma. Background Technology

[0002] In recent years, with the increasing demand for electric vehicles, the development and demand for secondary batteries have also shown an increasing trend.

[0003] The performance of secondary batteries typically decreases with temperature changes, and there is a risk of overheating and explosion, especially when the temperature rises.

[0004] Furthermore, since secondary batteries contain various flammable materials, the heating or explosion of a secondary battery may trigger the combustion or explosion of other external components, thereby causing personal injury and property damage.

[0005] In addition, when the temperature of the secondary battery rises, causing the shape of components such as the separator to deform, it may cause combustion or explosion due to internal short circuit between the positive and negative electrodes.

[0006] Therefore, it is necessary to conduct detailed inspections on components used in secondary batteries. Consequently, there is an urgent need to develop a technology that can quickly and conveniently inspect substrates suitable for secondary batteries, while also more accurately detecting defects.

[0007] Existing technical documents Patent documents Patent Document 1: Korean Patent Publication No. 10-2020-0007292 (Publication Date: January 22, 2020). Summary of the Invention

[0008] The problem that the invention aims to solve The purpose of this disclosure is to provide a substrate inspection apparatus and method that utilizes plasma to rapidly and conveniently inspect substrates in a non-contact / non-destructive manner, thereby detecting defective factors and screening defective products.

[0009] The technical problems to be solved by this disclosure are not limited to those described above. Other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

[0010] means for solving problems To address the aforementioned technical problem, a plasma-based substrate inspection method according to one aspect of this disclosure may include the following steps: moving a plasma generator along a predetermined direction on the surface of a substrate whose metal layer is protected by an insulating sheet, and irradiating a gas released through the plasma generator; measuring a signal generated in the substrate during the irradiation of the gas; and analyzing the characteristics of the measured signal to determine whether the metal layer is exposed to the outside.

[0011] On the other hand, according to one aspect of the present disclosure, a plasma-based substrate inspection apparatus may include: a plasma generator that moves along a predetermined direction on the surface of a substrate in which a metal layer is protected by an insulating sheet and irradiates a gas released through the plasma generator; a measurement unit that measures a signal generated in the substrate during the irradiation of the gas; and a discrimination unit that analyzes the characteristics of the measured signal to determine whether the metal layer is exposed to the outside.

[0012] In addition, a computer program may be provided, stored on a computer-readable recording medium, for executing the methods for implementing the present disclosure.

[0013] In addition, a computer-readable recording medium may be provided, which stores a computer program for executing the methods for implementing the present disclosure.

[0014] Invention Effects According to the above-described technical solution of this disclosure, by using plasma to rapidly and conveniently inspect the substrate in a non-contact / non-destructive manner, defective factors can be detected and defective products can be screened.

[0015] The effects of this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0016] Figure 1 This is a diagram illustrating the configuration of a plasma-based substrate inspection apparatus according to an embodiment of the present disclosure.

[0017] Figure 2 This is a diagram illustrating a plasma-based substrate inspection method according to an embodiment of the present disclosure.

[0018] Figure 3 This diagram illustrates a specific operation in a substrate for determining whether a metal layer is exposed to the outside according to an embodiment of the present disclosure.

[0019] Figure 4 This is a diagram illustrating the structure of a substrate according to an embodiment of the present disclosure.

[0020] Figure 5This is a schematic diagram illustrating the process of inspecting a substrate according to an embodiment of the present disclosure. Detailed Implementation

[0021] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, can be clearly understood by referring to the detailed description of the embodiments and accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various forms. These embodiments are intended only to make this disclosure more complete and to fully inform those skilled in the art of the scope of this disclosure, which is defined only by the scope of the claims.

[0022] The terminology used in this specification is for describing embodiments and not for limiting this disclosure. In this specification, the singular includes the plural unless specifically mentioned. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other components besides those mentioned. Throughout this specification, the same reference numerals denote the same components, and "and / or" includes each of the mentioned components and all combinations of one or more of them. Although terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below, within the scope of the technical concept of this disclosure, can also be the second component.

[0023] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) should be understood to have the meaning commonly understood by one of ordinary skill in the art to which this disclosure pertains. Furthermore, terms defined in commonly used dictionaries should not be idealized or over-interpreted unless otherwise explicitly defined.

[0024] Throughout this disclosure, the same reference numerals denote the same components. This disclosure does not describe all elements of the embodiments, and omits conventional content in the technical field to which this disclosure pertains or content repeated between embodiments. As used in the specification, "unit" or "module" refers to a hardware component such as software, an FPGA (Field-Programmable Gate Array), or an ASIC (Application-Specific Integrated Circuit), which performs a specific function. However, "unit" or "module" is not limited to the meaning of software or hardware. A "unit" or "module" may also be configured to reside in an addressable storage medium or to drive one or more processors. Therefore, by way of example, a "unit" or "module" may include components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functionality provided in components and "units" or "modules" may be combined into a smaller number of components and "units" or "modules," or further divided into additional components and "units" or "modules."

[0025] Throughout this manual, when it is mentioned that one part is "connected" to another part, it includes not only direct connections but also indirect connections, including connections via wireless communication networks.

[0026] Furthermore, throughout the specification, when a section “includes” a component, it means that other components may be included, rather than excluded, unless otherwise stated.

[0027] Throughout this specification, when it is mentioned that a component is "on" another component, it includes not only cases where the component is in contact with the other component, but also cases where there are other components between them.

[0028] Terms such as “first” and “second” are used to distinguish one component from another; the components are not limited by the terms mentioned above.

[0029] Unless the context clearly indicates otherwise, singular expressions include plural expressions.

[0030] The identifiers used in each step are for illustrative purposes only and do not indicate the order of the steps. Unless the context explicitly states a specific order, the steps may be performed in a different order than that stated.

[0031] The working principle and embodiments of this disclosure are described below with reference to the accompanying drawings.

[0032] Figure 1 This is a diagram illustrating the configuration of a plasma-based substrate inspection apparatus according to an embodiment of the present disclosure.

[0033] Reference Figure 1 According to an embodiment of the present disclosure, a plasma-based substrate inspection apparatus (hereinafter referred to as "inspection apparatus") 100 may include a plasma generator 110, a measurement unit 120, and a discrimination unit 130.

[0034] First, the plasma generator 110 moves along a preset direction on the surface of the substrate to be tested and releases gas for irradiation. The substrate includes a metal layer and an insulating layer, wherein the insulating layer is composed of an insulating sheet to prevent the metal layer from being exposed to the outside. The substrate can be a substrate or thin film for a battery, for example, a substrate or thin film for a pouch battery. On the other hand, the insulating layer can be located on one or both sides of the metal layer. Furthermore, the gas can be any of various forms such as anions, cations, negative charges, positive charges, neutrons, and free radicals. The generated plasma can then be atmospheric pressure plasma.

[0035] As one embodiment, when multiple substrates are arranged in a row, the plasma generator 110 can sequentially move each substrate along one direction of the arrangement of the multiple substrates and release gas for irradiation. Alternatively, the substrates can be arranged in a row in multiple quantities during the appearance inspection step, and multiple substrates can be moved sequentially to perform appearance inspection by the plasma generator.

[0036] In another embodiment, the plasma generators 110 can also be configured in a plurality of rows. In this case, the plurality of plasma generators 110 can move the substrate along one direction and release gas for irradiation. For example, the length of the plurality of plasma generators 110 arranged covers one side of the substrate, and the plurality of plasma generators 110 move in a direction perpendicular to the arrangement direction, thereby achieving coverage of the entire surface of the substrate by releasing gas. On the other hand, the gas release can be carried out in a linear or radial manner.

[0037] On the other hand, the measurement unit 120 measures the signals generated in the substrate during the irradiation of gas by the plasma generator 110. For this purpose, a probe is attached to an exposed area of ​​the metal layer of the substrate, such as the folded side regions, allowing the measurement unit 120 to measure signals including current and voltage. Therefore, noise caused by uneven signal measurement in the insulating treatment area, i.e., the insulating layer, can be suppressed. Alternatively, when all areas on both sides of the substrate are protected by an insulating layer, holes can be drilled in virtual areas to expose the metal layer for signal measurement, thereby enabling detection.

[0038] The discrimination unit 130 analyzes the characteristics of the signal measured by the measurement unit 120 to determine whether the metal layer is exposed to the outside. At this time, the analysis of signal characteristics may include peak extraction, displacement generation, waveform changes, etc.

[0039] For example, the discrimination unit 130 can confirm the waveform of the measured signal and compare its displacement value with a preset threshold. If a change above the preset threshold is detected (displacement value greater than the preset threshold), it is determined that the metal layer is exposed to the outside, and the corresponding substrate is classified as a defective product; if only a waveform based on the dielectric constant of the insulating sheet is detected (displacement value less than or equal to the preset threshold), it is determined that the metal layer is not exposed to the outside, and the corresponding substrate is classified as a normal product.

[0040] On the other hand, although Figure 1 Although not shown, the detection device 100 may also include a communication unit, a storage unit, and a sensor unit.

[0041] The communication unit sends and receives at least one piece of information or data with at least one device / terminal. The at least one device / terminal may be a device / terminal that needs to receive detection results provided by the detection device 100, and its type and form are not limited.

[0042] In addition, the communication unit can communicate with other devices and send and receive wireless signals in a communication network based on wireless Internet technology.

[0043] Wireless Internet technologies may include, for example, WLAN (Wireless LAN), Wi-Fi (Wireless Fidelity), Wi-Fi Direct (Wireless Fidelity Direct), DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband), WiMAX (World Interoperability for Microwave Access), HSDPA (High Speed ​​Downlink Packet Access), HSUPA (High Speed ​​Uplink Packet Access), LTE (Long Term Evolution), LTE-A (Long Term Evolution-Advanced), etc. The detection device 100 can transmit and receive data based on at least one wireless Internet technology, including Internet technologies not listed above.

[0044] For short-range communication, at least one of the following technologies can be used: Bluetooth™, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra Wideband), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless Fidelity), Wi-Fi Direct, and Wireless USB (Wireless Universal Serial Bus). This wireless area network can support wireless communication between the detection device 100 and at least one terminal. In this case, the wireless area network can be a wireless personal area network.

[0045] The storage unit may store at least one process (algorithm) for detecting a substrate using plasma, or data of a program for implementing that process. Furthermore, the storage unit may also store processes for performing other operations, without limitation.

[0046] On the other hand, the storage unit can store at least one pre-trained model (including a language model) for detecting the substrate using plasma, as well as various information / data that support the various functions of the detection device 100.

[0047] In addition, the storage unit may also store multiple applications running in the detection device 100, as well as data and instructions for operating the detection device 100. At least a portion of these applications can be downloaded from an external server via wireless communication. Alternatively, the applications may be stored in at least one memory included in the storage unit and installed on the detection device 100, and run by at least one processor stored in the storage unit to perform operations (or functions).

[0048] On the other hand, at least one memory may include at least one type of storage medium selected from flash memory, hard disk, multimedia card micro, card-type memory (e.g., Secure Digital Storage Card (SD) or Extended Digital (XD) memory card), random access memory (RAM), SRAM (Static Random Access Memory), read-only memory (ROM), EEPROM (Electrically Erasable Programmable Read-Only Memory), PROM (Programmable Read-Only Memory), magnetic storage, magnetic disk, and optical disk. Furthermore, the memory may store information temporarily, permanently, or semi-permanently, and may be provided in an internal or removable manner.

[0049] This storage unit can also be further integrated with other independent external servers.

[0050] On the other hand, the sensor unit may include at least one vision sensor, which can be used to scan the surface of the substrate before irradiating it with gas, thereby detecting scratches present on the surface. In this case, the plasma generator 110 irradiates the area where the scratch is detected with gas. For example, when a scratch is detected, the plasma generator 110 can use the vision sensor to move along the direction of the scratch and irradiate gas.

[0051] Figure 2 This is a diagram illustrating a plasma-based substrate inspection method according to an embodiment of the present disclosure.

[0052] Reference Figure 2 The plasma generator is moved along a preset direction on the surface of the substrate whose metal layer is protected by an insulating sheet, and the gas released through the plasma generator 110 is irradiated (S101). During the irradiation of the gas, the measurement unit 120 measures the signal generated in the substrate (S103).

[0053] Then, the discrimination unit 130 analyzes the characteristics of the signal measured in step S103 to determine whether the metal layer is exposed to the outside (S105).

[0054] On the other hand, although Figure 2 Although not shown in the diagram, before step S101, an operation can be performed to scan the surface of the substrate using at least one vision sensor. This allows for accurate detection of defects, such as scratches on the substrate surface.

[0055] Figure 3 This diagram illustrates a specific operation in a substrate for determining whether a metal layer is exposed to the outside according to an embodiment of the present disclosure, and more specifically shows... Figure 2 Step S105 in the diagram. However, this diagram is only applicable to the case where displacement is detected as a signal characteristic. If other characteristics are used, the specific operation may differ, and this is not limited.

[0056] Reference Figure 3 The discrimination unit 130 confirms the waveform of the signal measured by the measurement unit 120 (S1051), and compares the displacement value (A) with the preset threshold (B) based on the confirmation result (S1052).

[0057] Then, based on the comparison result of step S1052, if the displacement value is greater than the preset threshold (A>B), it is determined that the metal layer is exposed to the outside, and the corresponding substrate is classified as a defective product (S1053); if the displacement value is less than or equal to the preset threshold (A≤B), it is determined that the metal layer is not exposed to the outside, and the corresponding substrate is classified as a normal product (S1054).

[0058] Figure 4This is a diagram illustrating the structure of a substrate according to an embodiment of the present disclosure.

[0059] Reference Figure 4 The substrate 10 can be composed of seven layers: polypropylene 201, adhesive 202, anti-corrosion layer 203, aluminum foil (corresponding to the metal layer) 204, anti-corrosion layer 205, adhesive 206, and nylon 207.

[0060] Figure 5 This is a schematic diagram illustrating the process of inspecting a substrate according to an embodiment of the present disclosure.

[0061] Reference Figure 5 The plasma generator 110 moves on the surface of the substrate 10, which is protected by an insulating sheet on an aluminum foil 204, and irradiates the gas released through the nozzle.

[0062] At this time, the movement direction of the plasma generator 110 can be preset, and it can move on the surface of the substrate 10 and irradiate gas based on the preset movement direction.

[0063] During the irradiation process, the measurement unit 120 measures the signal generated in the substrate 10. For this purpose, a probe is attached to the uninsulated side region 211 of the substrate 10, so that the measurement unit 120 can measure the signal.

[0064] When a defect on the substrate 10 causes the metal layer to be exposed to the outside, the gas irradiated by the plasma generator 110 will come into contact with the aluminum foil 204, thereby generating a rapid signal change instantaneously.

[0065] That is, the discrimination unit 130 can detect the abrupt signal change by analyzing the signal waveform, thereby determining whether the metal layer is exposed to the outside.

[0066] The aforementioned program may include code written in computer languages ​​such as C, C++, JAVA, and machine language, readable by the computer's processor (CPU) through the computer's device interface, so that the computer can read the program and execute the method implemented by the program. This code may include functional code related to functions defining the functionality required to perform the method, and execution step-related control code required by the computer's processor to perform the function according to predetermined steps. Furthermore, the code may further include memory reference-related code to instruct the computer's processor on which location (address) in the computer's internal or external memory should reference the required additional information or media when performing the function. Additionally, when the computer's processor needs to communicate with other remote computers or servers to perform the function, the code may further include communication-related code to instruct how to use the computer's communication module to communicate with other remote computers or servers, and what information or media should be sent and received during communication.

[0067] The storage medium is not a register, cache, or memory that stores data only for a short time, but rather a medium that stores data in a semi-permanent manner and can be read by a device. Specifically, examples of the storage medium include, but are not limited to, ROM, RAM, CD-ROM, magnetic tape, floppy disk, and optical data storage devices. That is, the program can be stored on various recording media on various servers accessible to the computer, or on various recording media on the user's computer. Furthermore, the medium can be distributed across computer systems connected via a network, thereby storing computer-readable code in a distributed manner.

[0068] The steps of the methods or algorithms described in the embodiments of this disclosure can be implemented directly in hardware, or by a software module executed by hardware, or by a combination of both. The software module can reside in RAM (Random Access Memory), ROM (Read-Only Memory), EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash memory, hard disk, removable disk, CD-ROM (Optical Disc Read-Only Memory), or any form of computer-readable recording medium known in the art to which this disclosure pertains.

[0069] The embodiments of this disclosure have been described above with reference to the accompanying drawings. However, those skilled in the art to which this disclosure pertains should understand that various modifications and variations can be made without departing from the technical concept or essential features of this disclosure. Therefore, the embodiments described above should be understood in all respects as exemplary and not restrictive.

Claims

1. A method for detecting a substrate using plasma, performed by a device, characterized in that, The plasma-based substrate inspection method performed by the device includes the following steps: A plasma generator is moved along a predetermined direction on the surface of a substrate whose metal layer is protected by an insulating sheet, and the gas released through the plasma generator is irradiated. The signal generated in the substrate is measured during the irradiation of the gas; as well as The characteristics of the measured signal are analyzed to determine whether the metal layer is exposed to the outside.

2. The plasma-based substrate detection method according to claim 1, characterized in that, The signal is measured by attaching a probe to an exposed area of ​​the metal layer of the substrate.

3. The plasma-based substrate detection method according to claim 1, characterized in that, In the step of determining whether the metal layer is exposed to the outside, The waveform of the measured signal is confirmed. If a change above a preset threshold is detected, the substrate is determined to be a defective product. If only a waveform based on the dielectric constant of the insulating sheet is detected, the substrate is determined to be a normal product.

4. The plasma-based substrate detection method according to claim 1, characterized in that, The substrate testing method further includes the following steps: Prior to the step of irradiating the gas, the surface of the substrate is scanned using a vision sensor.

5. The plasma-based substrate inspection method according to claim 4, characterized in that, The scanning step involves detecting scratches on the substrate surface using the visual sensor.

6. The plasma-based substrate inspection method according to claim 5, characterized in that, The step of irradiating the gas is performed in the area where the scratch was detected.

7. The plasma-based substrate inspection method according to claim 6, characterized in that, In the step of irradiating the gas When the scratch is detected, a visual sensor is used to move along the direction of the scratch and irradiate the gas.

8. The plasma-based substrate inspection method according to claim 1, characterized in that, The plasma generators are arranged in a row.

9. The plasma-based substrate inspection method according to claim 1, characterized in that, The substrates are arranged in multiple ways. In the step of determining whether the metal layer is exposed to the outside, Each substrate is moved sequentially along a direction in which multiple substrates are arranged and irradiated with gas.

10. A substrate inspection device utilizing plasma, characterized in that, The plasma-based substrate inspection device includes: A plasma generator moves along a predetermined direction on the surface of a substrate whose metal layer is protected by an insulating sheet, and irradiates the gas released through the plasma generator. The measurement unit measures the signal generated in the substrate during the irradiation of the gas; and The discrimination unit analyzes the characteristics of the measured signal to determine whether the metal layer is exposed to the outside.

Images