Passive lift pin assembly

Abstract

A substrate support assembly includes a substrate support movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised position and the lowered position. The lift pin is disposed in a hole through the substrate support and is vertically movable relative to the substrate support. In use, the substrate support assembly transitions between a first configuration and a second configuration. In the first configuration, the substrate support and the lift pin are coupled such that when the substrate support moves between the lowered position and the intermediate position, the lift pin and the substrate support move simultaneously. In the second configuration, the substrate support and the lift pin are disengaged such that the lift pin remains stationary when the substrate support moves between the intermediate position and the raised position.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to lifting pins for positioning a substrate relative to a substrate support in a substrate processing chamber. Background Technology

[0002] Lifting pins are commonly used in semiconductor processing tools, such as processing chambers, to support and position substrates during substrate transfer operations. In conventional designs, the lifting pin typically resides in a guide hole through a substrate support disposed within the processing chamber. In these conventional designs, the upper end of the lifting pin is typically flared to allow the lifting pin to be positioned against a mating portion of the substrate support when positioned in a lowered position, and to prevent the pin from passing through the guide hole formed in the substrate support. The lower end of the lifting pin extends below the substrate support and is actuated by a lifting plate that contacts the pin at the lower end of the lifting pin. The lifting plate is vertically movable between an upper position and a lower position. When changing from the upper position to the lower position, the lifting plate moves the lifting pin downward to lower the substrate onto the substrate support. When changing from the lower position to the upper position, the lifting plate moves the lifting pin upward to extend the upper end of the lifting pin over the substrate support to contact the substrate, and raises the substrate over the substrate support to facilitate substrate transfer. Due to the repetitive interaction between the surface of the lifting pin and the surface of the guide hole of the substrate support, the design of the guided lifting pin will generate particles and often lead to eventual failure (e.g., jamming).

[0003] Lifting plates are typically powered by one or more electric or pneumatic actuators and control systems, which increases the complexity and cost of the processing chamber. In some cases, the lifting pins do not contact the substrate simultaneously, or the substrate is raised or lowered unevenly. The substrate can slide and may be improperly positioned on the substrate support, which can generate particles on the substrate and adversely affect substrate processing. Improved systems are needed to address these problems. Summary of the Invention

[0004] This disclosure generally relates to lifting pins for positioning a substrate relative to a substrate support in a substrate processing chamber.

[0005] In one embodiment, a substrate support assembly includes a substrate support movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. The substrate support includes a support surface and a reference surface configured to receive a substrate. The substrate support assembly also includes a lifting pin assembly comprising a lifting plate and a plurality of lifting pins. Each lifting pin is disposed in a corresponding hole through the substrate support and includes a first end coupled to a first surface of the lifting plate and a second end on the end of the lifting pin opposite the first end. The substrate support assembly also includes a stop plate positioned below the support surface of the substrate support and configured to restrict upward movement of the lifting plate. The substrate support assembly also includes a plurality of biasing members coupled to a second surface of the lifting plate opposite the first surface of the lifting plate. The lifting plate is disposed between the plurality of biasing members and the reference surface of the substrate support. In use, the substrate support assembly transitions between a first configuration and a second configuration. In the first configuration, when the substrate support moves between a lowered position and an intermediate position, a plurality of biasing members abut against a reference surface of the substrate support to bias the lifting plate. In the second configuration, when the substrate support moves between an intermediate position and a raised position, a stop plate prevents the lifting plate from moving upward.

[0006] In another embodiment, a substrate support assembly includes a substrate support movable between a raised position and a lowered position. The substrate support includes a support surface and a reference surface configured to receive a substrate. The substrate support assembly also includes a lifting pin assembly comprising a lifting plate and a plurality of lifting pins. Each of the plurality of lifting pins has a first end coupled to a first surface of the lifting plate and a second end at an end of the lifting pin opposite to the first end. A hole formed through the substrate support is configured to receive one of the plurality of lifting pins. The substrate support assembly also includes a plurality of biasing members and a stop plate positioned below the support surface of the substrate support. The stop plate is configured to restrict upward movement of the lifting plate. The lifting plate is disposed between the plurality of biasing members and the stop plate. The plurality of biasing members includes three or more biasing members. The plurality of biasing members are configured to abut against the reference surface of the substrate support to bias the lifting plate when the reference surface is positioned below the contact surface of the stop plate. Multiple biasing members are configured to abut against the contact surface of the stop plate to bias the lifting plate when the reference surface is positioned above the contact surface of the stop plate.

[0007] In another embodiment, a method of manipulating a substrate includes moving a substrate support member upward from a lowered position to an intermediate position. A plurality of lifting pins protrude from a support surface of the substrate support member and are positioned on an upper surface of a lifting plate. The lifting plate and the plurality of lifting pins move simultaneously with the substrate support member. The method further includes contacting the substrate with the plurality of lifting pins while the substrate support member and the plurality of lifting pins move simultaneously. The method further includes moving the substrate support member upward from the intermediate position toward a raised position while the plurality of lifting pins remain stationary. The method further includes lifting the substrate away from the plurality of lifting pins by the substrate support member as it moves toward the raised position. Attached Figure Description

[0008] To gain a more detailed understanding of the features described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be made with reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it will be noted that the drawings illustrate only exemplary embodiments and are not intended to limit the scope of this disclosure, as other equivalent embodiments are permissible.

[0009] Figure 1 This is a schematic diagram of the processing chamber.

[0010] Figures 2A to 2D Schematic illustration of what can be used Figure 1 The substrate support assembly in the processing chamber.

[0011] Figures 3A to 3C Schematic illustration of what can be used Figure 1 Another substrate support assembly in the processing chamber.

[0012] Figures 4A to 4C Schematic illustration of what can be used Figure 1 Another substrate support assembly in the processing chamber.

[0013] Figures 5A to 5C Schematic illustration of what can be used Figure 1 Another substrate support assembly in the processing chamber.

[0014] Figures 6A to 6C Schematic illustration of what can be used Figure 1 Another substrate support assembly in the processing chamber.

[0015] Figure 7 Is using Figure 2A To Figure 6C A flowchart of a method for any of the substrate support components.

[0016] Figure 8 Is using Figures 2A to 6C A flowchart of a method for any of the substrate support components.

[0017] To facilitate understanding, the same component symbols have been used where possible to identify common components in the drawings. It is understood that components and features of one embodiment may be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0018] This disclosure relates to lifting pins for positioning substrates relative to substrate supports in a substrate processing chamber during transfer operations.

[0019] Figure 1 A schematic cross-sectional view of the processing chamber 100 is shown. Typically, the processing chamber 100 may include an atomic layer deposition (ALD) chamber, a chemical vapor deposition (CVD) chamber, a physical vapor deposition (PVD) chamber, an etching chamber, a degassing chamber, an ion implantation chamber, an ashing chamber, a cleaning chamber, a thermal processing chamber (e.g., rapid thermal processing, annealing, cooling, thermal management control), or other types of substrate processing chambers.

[0020] However, as Figure 1 As shown, processing chamber 100 is configured as a plasma-enhanced chemical vapor deposition (PECVD) chamber. However, processing chamber 100 may be configured to perform one or more other processing operations that may or may not involve plasma. Processing chamber 100 may include associated hardware related to any of the processes described above.

[0021] The processing chamber 100 includes a chamber body 102 having a base plate 103, a substrate support assembly 110 disposed inside the chamber body 102, and a cover 108 coupled to the chamber body 102. In some embodiments, such as Figure 1 As shown, the processing chamber 100 includes a spray head 140 that can be used as an electrode and is coupled to a power supply 144 via a matching circuit (not shown). The power supply 144 is a radio frequency (RF) power supply electrically coupled to the electrode. Additionally, the power supply 144 provides power between approximately 100 watts and approximately 3,000 watts at a frequency of approximately 50 kHz to approximately 15 MHz. In some embodiments, the power supply 144 can pulse output during various operations. The electrode and the power supply 144 facilitate control of the plasma formed within the processing volume 150.

[0022] The spray head 140 has an opening 142 for allowing one or more processing gases to enter the processing volume 150 from the gas supply source 130. The processing gas is supplied to the processing chamber 100 via a gas feeder 134 and enters a gas chamber 136 before flowing through the opening 142. In some embodiments, different processing gases flowing simultaneously during processing operation enter the processing chamber 100 via separate gas feeders and separate gas chambers before passing through the spray head 140 into the processing volume 150.

[0023] Gas supply source 130 includes one or more gas sources. Gas supply source 130 is configured to deliver one or more gases from one or more gas sources through spray head 140 into processing volume 150. Each of the one or more gas sources provides a processing gas, such as silane, disilane, tetraethyl orthosilicate (TES), germanane, metal halide (such as titanium tetrachloride, tantalum pentachloride, tungsten hexafluoride), organometallic compounds (such as tetra(dimethylamido)titanium, penta(dimethylamido)tantalum), ammonia, oxygen (O2), hydrogen peroxide, hydrogen, diborane, chlorine (Cl2), sulfur hexafluoride, hydrocarbons (generally C2O3), etc. x H y Other gases. In some embodiments, the process gas may be ionized to form plasma within the process volume 150. In examples, one or more of a carrier gas and an ionizable process gas are provided into the process volume 150 to process the substrate 154. For example, when processing a 300 mm substrate, the process gas is introduced into the process chamber 100 at a flow rate from about 6500 sccm to about 8000 sccm, from about 100 sccm to about 10,000 sccm, or from about 100 sccm to about 1000 sccm. Alternatively, other flow rates may be used. In some embodiments, a remote plasma source may be used to deliver plasma to the process chamber 100 and may be coupled to a gas supply source 130.

[0024] In some embodiments, the processing chamber 100 includes a physical vapor deposition (PVD) target, which is connected to... Figure 1 The spray head 140 shown is similarly positioned and thus replaces the spray head 140. In this configuration, the PVD target serves as a sputtering material source and is coupled to a power supply 144, which is typically a DC power supply. The DC power supply is adapted to provide a DC voltage typically greater than 1 kW. A magnetron (e.g., a magnet assembly not shown) is positioned behind the PVD target and is used to help control the bombardment of gaseous ions on the lower surface of the target during processing to allow for uniform etching (e.g., sputtering) of the target surface during processing.

[0025] In any of the various possible processing chamber configurations, the substrate support assembly 110 includes a substrate support 112 configured to support the substrate 154 on a support surface 118 within the processing volume 150 of the processing chamber 100 during processing. The substrate support 112 is disposed on a shaft 124 configured to raise and lower the substrate support 112 using an actuator assembly (not shown) coupled to the shaft 124. In some embodiments, the actuator assembly includes a guide rail (not shown) and an electric motor (not shown) or pneumatic actuator (not shown) configured to guide and drive the substrate support 112 in a first direction (i.e., the vertical direction). When driven in the first direction, the support surface 118 is closer (or farther) from the base plate 103, or, in an alternative view, farther (or closer) from the spray head or PVD target. In some embodiments that can be combined with other embodiments, the substrate support 112 rotates via the shaft 124 as the substrate 154 undergoes processing in the processing chamber 100.

[0026] The substrate support assembly 110 includes one or more lifting pins 114, each of which is disposed through a corresponding hole 116 in the substrate support member 112. It is understood that the substrate support assembly will typically include three or more lifting pins 114, but may include more. The lifting pins 114 are movable to lift the substrate 154 away from the support surface 118 to facilitate the transfer of the substrate 154 into and out of the processing chamber 100. The substrate 154 is provided to the processing volume 150 through the opening 126. In one example, a carrier transported by a robotic arm is used to transport the substrate 154 into and out of the processing volume 120. In another example, a carrier transported by magnetic levitation is used to transport the substrate 154 into and out of the processing volume 120.

[0027] The substrate support 112 contains or is formed of one or more metallic or ceramic materials. Exemplary metallic or ceramic materials include one or more metals, metal oxides, metal nitrides, metal oxynitrides, or any combination thereof. For example, the substrate support 112 may contain or be formed of aluminum, aluminum oxide, aluminum nitride, aluminum oxynitride, or any combination thereof.

[0028] As shown, electrode 122 is embedded within substrate support 112, but alternatively may be coupled to a surface of substrate support 112 (such as support surface 118). Electrode 122 is coupled to power supply 120. Consideration is that power supply 120 may supply DC power, pulsed DC power, radio frequency (RF) power, pulsed RF power, or any combination thereof. Power supply 120 is configured to drive electrode 122 using a drive signal to generate plasma within processing volume 150. Consideration is that the drive signal may be one of a DC signal and a variable voltage signal (e.g., an RF signal). Alternatively, electrode 122 may be coupled to power supply 144 instead of power supply 120, and power supply 120 may be omitted.

[0029] In some embodiments that can be combined with other embodiments, electrode 122 may be omitted. In some embodiments that can be combined with other embodiments, electrode 122 (or another electrode in substrate support 112) is configured as a clamping electrode. In some embodiments that can be combined with other embodiments, substrate support 112 includes a heater, such as a resistance heating assembly. In some embodiments that can be combined with other embodiments, substrate support 112 includes one or more coolant channels.

[0030] Exhaust port 156 is coupled to vacuum pump 160. Vacuum pump 160 removes excess process gas or byproducts from process volume 150 through exhaust port 156 during and / or after processing.

[0031] Figure 1 The substrate support assembly 110 may be configured according to any one of the substrate support assemblies 200, 300, 400, 500 or 600 described below.

[0032] Figures 2A to 2C A substrate support assembly 200 is schematically shown. The substrate support assembly 200 includes a substrate support member 112 disposed on a shaft member 124. By using the actuator assembly described above, the substrate support member 112 can be moved between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. Figure 2A The illustration shows the substrate support 112 in the lowered position; Figure 2B The illustration shows the substrate support 112 in the middle position; and Figure 2C The illustration shows the substrate support 112 in the raised position. Figure 2D This is a top cross-sectional view of an exemplary configuration of the substrate support assembly 200.

[0033] The substrate support assembly 200 includes lifting pins 114, each of which is disposed through a corresponding hole 116 in the substrate support member 112. In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes three lifting pins 114. In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes more than three lifting pins 114, such as four or more, five or more, or six or more lifting pins 114.

[0034] In some embodiments that can be combined with other embodiments, sensor 166 is disposed at the upper end 115 of one or more lifting pins 114. In some embodiments that can be combined with other embodiments, sensor 166 detects the temperature of a substrate (such as substrate 154) or substrate carrier 170 (i.e., carrier 170 hereinafter) near sensor 166. In examples, sensor 166 is a thermocouple, RTD, or thermopile. In another example, sensor 166 includes an optical temperature measurement device utilizing an optical fiber having an end disposed at the tip of the lifting pin 114 (at the upper end 115) and an opposite end transmitting electromagnetic radiation to a radiation detection sensor disposed outside the processing chamber 100. In some embodiments that can be combined with other embodiments, sensor 166 is configured to detect the presence of substrate (such as substrate 154) or carrier 170 using optical or electrical detection techniques. In examples, sensor 166 is a proximity sensor or strain gauge.

[0035] In some embodiments that can be combined with other embodiments, each of two or more lifting pins 114 has a sensor 166 of a common type (such as a temperature sensor, proximity sensor, or strain gauge) disposed thereon. In some embodiments that can be combined with other embodiments, a first sensor 166 of a first type (such as a temperature sensor, proximity sensor, or strain gauge) is disposed on a first lifting pin 114, and a second sensor 166 of a second type (such as another temperature sensor, proximity sensor, or strain gauge) is disposed on a second lifting pin 114.

[0036] In some embodiments that can be combined with other embodiments, sensor 166 communicates wirelessly with the controller, such as via RF, Bluetooth, or the like. In some embodiments that can be combined with other embodiments, sensor 166 may be omitted.

[0037] like Figures 2A to 2CAs shown, each lifting pin 114 is disposed on the lifting plate 210. In some embodiments that can be combined with other embodiments, each lifting pin 114 is disposed on a separate lifting plate 210. In some embodiments that can be combined with other embodiments, two or more lifting pins 114 are disposed on the same lifting plate 210. In some embodiments that can be combined with other embodiments, each lifting pin 114 is disposed on the same lifting plate 210. In some embodiments that can be combined with other embodiments, the lifting plate 210 is in the form of a ring or partial ring around the shaft 124.

[0038] One or more biasing members 220 (such as springs 222) are disposed between the (or each) lifting plate 210 and the base 104. In some embodiments that can be combined with other embodiments, the base 104 is a fixed structure, such as a column base, crossbar, or wall within the processing chamber 100. In some embodiments that can be combined with other embodiments, the base 104 is part of or disposed on the bottom plate 103 of the processing chamber 100. The base plate support 112 is movable vertically relative to the base 104.

[0039] Spring 222 is a compression spring, such as a coil spring, a Belleville spring, or the like. In some embodiments that may be combined with other embodiments, each biasing member 220 is a bellows, as described below regarding Figures 3A to 3C The bellows 322 is described. In some embodiments that can be combined with other embodiments, each biasing member 220 is a flexure, as described below regarding Figures 4A to 4C The described flexural element 422.

[0040] In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes a single biasing member 220 surrounding the shaft 124. In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes a plurality of biasing members 220, such as two or more, three or more, four or more, five or more, or six or more biasing members 220. Considering that each biasing member 220 may be disposed at discrete locations on the substrate 104 surrounding the shaft 124.

[0041] In some embodiments that can be combined with other embodiments, the number of bias members 220 is less than the number of lifting pins 114. In some embodiments that can be combined with other embodiments, the number of bias members 220 is equal to the number of lifting pins 114. In some embodiments that can be combined with other embodiments, the number of bias members 220 is greater than the number of lifting pins 114. It has been found that utilizing a plurality of bias members 220 in an array-type pattern in the horizontal plane (XY plane) can provide improved lateral stability (i.e., in the X and Y directions) and torsional stability (e.g., yaw stability), as well as control over the vertical movement of the lifting pins (e.g., pitch and roll stability). It has been found that an array of at least three or more bias members 220 (e.g., four or more bias members 220, or five or more bias members 220, or six or more bias members 220) provides improved results. In one example, the support assembly 200 includes at least six bias members 220.

[0042] Figure 2D This is a top cross-sectional view illustrating an exemplary configuration of the substrate support assembly 200. In the illustrated example, there are three lifting pins 114 and six biasing members 220 aligned in a circular array about a central axis coinciding with the central axis of the shaft 124. The lifting pins 114 rest on a common lifting plate 210 disposed around the shaft 124. The biasing members are disposed below the lifting plate 210. As shown, in some embodiments that can be combined with other embodiments, at least one biasing member 220 is perpendicularly aligned with the corresponding lifting pin 114 and parallel to the central axis of the shaft 124. In some embodiments that can be combined with other embodiments, each biasing member 220 is perpendicularly aligned with the corresponding lifting pin 114. In some embodiments that can be combined with other embodiments, at least one biasing member 220 is not perpendicularly aligned with the lifting pin 114. In some embodiments that can be combined with other embodiments, at least one biasing member 220 is perpendicularly aligned with the corresponding lifting pin 114, and at least one other biasing member 220 is not perpendicularly aligned with the lifting pin 114. In some embodiments that can be combined with other embodiments, each biasing member 220 is not aligned perpendicularly to the lifting pin 114.

[0043] In some embodiments that can be combined with other embodiments, each biasing member 220 is disposed under a separate lift plate 210. In some embodiments that can be combined with other embodiments, multiple biasing members 220 are disposed under the same lift plate 210. In some embodiments that can be combined with other embodiments, each biasing member 220 is disposed under the same lift plate 210, such as... Figure 2DAs shown in the figure. In some embodiments that can be combined with other embodiments, the (or each) lifting plate 210 is integrated with one or more biasing members 220.

[0044] In some embodiments, a plurality of biasing members 220 upwardly bias each lifting pin 114. The plurality of biasing members 220 upwardly bias the (or each) lifting plate 210. The plurality of biasing members 220 bias the (or each) lifting plate 210 toward the base plate support 112. Return to Figures 2A to 2C Multiple biasing members 220 bias the (or each) lifting plate 210 toward a corresponding stop plate 230. The stop plate 230 is coupled to the base 104. The stop plate 230 includes a contact surface, which may include a lip, flange, shoulder, or the like, providing a maximum vertical travel range of the (or each) lifting plate 210 on the base 104. In one example, the contact surface is a flat surface positioned above and configured to contact the surface of the lifting plate 210 when the lifting plate 210 is in its topmost position. The stop plate 230 is generally configured to control the topmost position of the lifting pin 114 and the lifting plate 210, and also to control the level of the lifting pin 114 and the lifting plate 210 relative to the horizontal plane (XY plane) and / or the base plate support surface 118. It has been found that the ability to control the level of the tip of the lifting pin 114 (e.g., the substrate support portion of the lifting pin 114) relative to the support surface 118 is useful in preventing slippage of the substrate relative to the support surface 118 due to misalignment of the lower surface of the substrate with the support surface 118 during the engagement and disengagement of the two surfaces during substrate transfer. Slippage generates scratches and particles on the lower surface of the substrate, which can affect downstream substrate processing processes, such as photolithography. Avoiding such slippage is a beneficial feature of the substrate support assembly 200.

[0045] In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes a single stop plate 230, such as in the form of a ring or partial ring around the shaft 124. In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes two or more stop plates 230, such as three or more, four or more, or five or more stop plates 230. In one example, the substrate support assembly 200 includes three or more stop plates 230.

[0046] In some embodiments that can be combined with other embodiments, the number of biasing members 220 is less than the number of stop plates 230. In some embodiments that can be combined with other embodiments, the number of biasing members 220 is equal to the number of stop plates 230. In some embodiments that can be combined with other embodiments, the number of biasing members 220 is greater than the number of stop plates 230.

[0047] In some embodiments that can be combined with other embodiments, the number of lifting pins 114 is less than the number of stop plates 230. In some embodiments that can be combined with other embodiments, the number of lifting pins 114 is equal to the number of stop plates 230. In some embodiments that can be combined with other embodiments, the number of lifting pins 114 is greater than the number of stop plates 230.

[0048] The stop plate 230 includes one or more adjustment mechanisms 232 configured to change the distance between the base 104 and the contact surfaces of the stop plate 230 and the corresponding lifting plate 210. In some embodiments, the contact surfaces of the stop plate 230 are defined by one or more contact points 234 of the stop plate 230. In one example, each adjustment mechanism 232 includes a screw with a tip for defining the contact surface. In another example, each adjustment mechanism 232 includes a solenoid with a solenoid shaft having a tip for defining the contact surface. In yet another example, each adjustment mechanism 232 includes a locking bolt with a tip for defining the contact surface. In some embodiments that can be combined with other embodiments, each adjustment mechanism 232 is manually operated in situ. In some embodiments that can be combined with other embodiments, each adjustment mechanism 232 is remotely operated, such as by a controller located outside the processing chamber 100.

[0049] In some embodiments that can be combined with other embodiments, the number of biasing members 220 is less than the number of adjusting mechanisms 232. In some embodiments that can be combined with other embodiments, the number of biasing members 220 is equal to the number of adjusting mechanisms 232. In some embodiments that can be combined with other embodiments, the number of biasing members 220 is greater than the number of adjusting mechanisms 232.

[0050] In some embodiments that can be combined with other embodiments, the number of lifting pins 114 is less than the number of adjusting mechanisms 232. In some embodiments that can be combined with other embodiments, the number of lifting pins 114 is equal to the number of adjusting mechanisms 232. In some embodiments that can be combined with other embodiments, the number of lifting pins 114 is greater than the number of adjusting mechanisms 232.

[0051] The modification of the adjustment mechanism 232 is used to change the maximum vertical travel range of the lifting plate 210 on the base 104. The modification of the adjustment mechanism 232 is used to change the maximum height of the upper end 115 of each lifting pin 114 on the base 104. In this example, the adjustment mechanism 232 is modified such that when each of the plurality of lifting pins 114 is positioned at its maximum height on the base 104, the upper end 115 of the lifting pin 114 is in a common horizontal plane.

[0052] Figure 2A The substrate support 112 is illustrated in the lowered position. A plurality of biasing members 220 bias the (or each) lift plate 210 upwardly and against the shoulder 113 of the substrate support 112. One or more biasing members 220 bias the lift pin 114 towards an "upward" position in which the upper end 115 of the lift pin 114 protrudes from the support surface 118 of the substrate support 112. Since the contact generated by the biasing member 220 pushes the lift plate 210 against the surface of the shoulder 113 (i.e., the reference surface 113A), the vertical distance between the tip of the lift pin 114 and the support surface 118 is well controlled and maintained. As Figure 2A shown, the (or each) lift plate 210 does not contact the stop plate 230. A carrier 170 having a substrate 154 resting on its lip 172 is positioned above the substrate support 112 and does not contact the substrate support assembly 200.

[0053] Figure 2B The substrate support 112 is illustrated in the intermediate position. The substrate support 112 has been moved upward from the lowered position. During the upward movement of the substrate support 112 from the lowered position to the intermediate position, one or more biasing members 220 continue to bias the (or each) lift plate 210 upwardly and against the reference surface 113A of the shoulder 113 of the substrate support 112. In addition, one or more biasing members 220 continue to bias the lift pin 114 towards the "upward" position. In this way, the substrate support 112 and the lift pin 114 are coupled such that the lift pin 114 moves upward simultaneously with the substrate support 112 and remains protruding from the support surface 118. When the substrate support 112 is in the intermediate position, the (or each) lift plate 210 contacts the (or each) stop plate 230, as at the corresponding adjustment mechanism 232.

[0054] As Figure 2B shown, the lift pin 114 has lifted the substrate 154 off the lip 172 of the carrier 170. In some embodiments that can be combined with other embodiments, the height of the carrier 170 within the processing chamber 100 does not change when the substrate support 112 moves from the lowered position to the intermediate position. In some embodiments that can be combined with other embodiments, the lift pin 114 lifts the substrate 154 off the carrier 170 and then removes the carrier 170 from the processing chamber 100 before the substrate support 11 arrives at the intermediate position. In some embodiments that can be combined with other embodiments, the carrier 170 is removed from the processing chamber 100 after confirming (e.g., by using one or more sensors 166) that the lift pin 114 has lifted the substrate 154 off the carrier 170.

[0055] Figure 2CThe illustration shows a base plate support 112 in the raised position. One or more biasing members 220 continue upward and abut against the (or each) stop plate 230, biasing the (or each) lifting plate 210. A lifting pin 114 remains positioned on the (or each) lifting plate 210. The base plate support 112 has moved upward from the intermediate position. During the upward movement of the base plate support 112 from the intermediate position to the raised position, the shoulder 113 of the base plate support 112 moves away from the (or each) lifting plate 210 and does not contact it. In this way, the base plate support 112 and the lifting pin 114 disengage, such that when the base plate support 112 moves upward from the intermediate position to the raised position, the lifting pin 114 remains stationary. For example, the base plate support 112 moves upward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100.

[0056] As shown in the figure, the lifting pin 114 is in the "downward" position relative to the substrate support 112, such that the upper end 115 of the lifting pin 114 does not protrude from the support surface 118 of the substrate support 112. The substrate support 112 has lifted the substrate 154 away from the lifting pin 114. The substrate 154 is supported by the support surface 118 of the substrate support 112. The raised position of the substrate support 112 corresponds to the position of the substrate 154 during processing operations in the processing chamber 100.

[0057] When the substrate support 112 moves downward from the raised position to the intermediate position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves downward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100. When the substrate support 112 moves downward near the intermediate position, the lifting pin 114 (when stationary) protrudes from the support surface 118 and lifts the substrate 154 away from the support surface 118. Subsequently, the positioning carrier 170 receives the substrate 154, as... Figure 2B As shown.

[0058] When the base plate support 112 moves from the raised position to the intermediate position, the shoulder 113 of the base plate support 112 engages the (or each) lifting plate 210. As the base plate support 112 moves downward from the intermediate position to the lowered position, the (or each) lifting plate 210 and lifting pin 114 simultaneously move downward and are guided by the base plate support 112 due to contact between the reference plane 113A of the shoulder 113 and the lifting plate 210. As the base plate support 112 moves downward from the intermediate position to the lowered position, the lifting pin 114 remains protruding from the support surface 118. The base plate 154 moves downward on the lifting pin 114 until the base plate 154 engages the lip 172 of the carrier 170. Further downward movement of the base plate support 112 and the lifting pin 114 causes the base plate 154 to separate from the tip of the lifting pin 114, and the base plate 154 rests on the lip 172 of the carrier 170.

[0059] In some embodiments that can be combined with other embodiments, the height of the carrier 170 within the processing chamber 100 does not change when the substrate support 112 moves from the intermediate position to the lowered position. In some embodiments that can be combined with other embodiments, the substrate 154 engages the lip 172 of the carrier 170, and the carrier 170 and substrate 154 are subsequently removed from the processing chamber 100 before the substrate support 112 reaches the lowered position. In some embodiments that can be combined with other embodiments, the carrier 170 and substrate 154 are removed from the processing chamber 100 after it is confirmed (e.g., by using one or more sensors 166) that the lifting pin 114 no longer supports the substrate 154.

[0060] Figures 3A to 3C A substrate support assembly 300 is schematically shown. The substrate support assembly 300 includes a substrate support member 112 disposed on a shaft member 124. The substrate support member 112 is movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. Figure 3A The illustration shows the substrate support 112 in the lowered position; Figure 3B The illustration shows the substrate support 112 in the middle position; and Figure 3C The illustration shows the substrate support 112 in the raised position.

[0061] Considering that the substrate support assembly 300 may include any or more of the components, features, or aspects of the substrate support assembly 200 described above. The substrate support assembly 300 may include one or more different or additional components, features, or aspects as described below.

[0062] The substrate support assembly 300 includes one or more biasing members 320, such as three or more biasing members 320, or even six or more biasing members 320. As shown, each biasing member 320 is a bellows 322. In some embodiments that can be combined with other embodiments, each biasing member 320 is a spring, as described above. Figures 2A to 2C The spring 222 is described. In some embodiments that can be combined with other embodiments, each biasing member 320 is a flexural member, as described below regarding... Figures 4A to 4C The described flexural element 422.

[0063] In some embodiments that can be combined with other embodiments, the substrate support assembly 300 includes a plurality of bellows 322, such as two or more, three or more, four or more, five or more, or six or more bellows 322. Consideration is given that each bellows 322 may be disposed at discrete locations on the substrate 104 around the shaft 124.

[0064] In some embodiments that can be combined with other embodiments, the number of bellows 322 is less than the number of lifting pins 114. In some embodiments that can be combined with other embodiments, the number of bellows 322 is equal to the number of lifting pins 114. In some embodiments that can be combined with other embodiments, the number of bellows 322 is greater than the number of lifting pins 114.

[0065] In some embodiments that can be combined with other embodiments, each bellows 322 is disposed under a separate lift plate 310. In some embodiments that can be combined with other embodiments, three or more bellows 322 are disposed under the same lift plate 310. In some embodiments that can be combined with other embodiments, each bellows 322 is disposed under the same lift plate 310. A seal 326 between each lift plate 310 and each corresponding bellows 322 facilitates pressurization of each bellows 322. In some embodiments that can be combined with other embodiments, the (or each) lift plate 310 is integrated with one or more bellows 322.

[0066] Each bellows 322 is mounted to the substrate 104 via a connector 330. A seal 328 between the substrate 104 and each connector 330 facilitates the transmission of pressure (e.g., atmospheric pressure) beneath the substrate 104 through each connector 330 to the interior 324 of each bellows 322. In this example, the pressure beneath the substrate 104 is greater than the pressure in the processing volume 150 of the processing chamber 100. In this example, each bellows 322 is upwardly biased against each lifting pin 114; each bellows 322 is upwardly biased against the (or each) lifting plate 310; and each bellows 322 is biased towards the (or each) lifting plate 310 toward the substrate support 112.

[0067] A rod 332 in each bellows 322 is coupled to a corresponding lifting plate 310 disposed on each bellows 322. As shown, in some embodiments that can be combined with other embodiments, each rod 332 can be used to stabilize the lifting plate 310 and lifting pin 114 against lateral movement via a bearing 334. Each rod 332 extends through each corresponding connector 330 and is coupled to a stop plate 336. In some embodiments that can be combined with other embodiments, the position of the stop plate 336 on the rod 332 is adjustable, such as by thread. Each lifting plate 310, rod 332, and stop plate 336 are configured to move perpendicularly relative to the base 104.

[0068] Figure 3A The illustration shows the substrate support 112 in the lowered position. A bellows 322 biases the (or each) lifting plate 310 upwards and against a reference surface 113A of the shoulder 113 of the substrate support 112. The bellows 322 biases the lifting pin 114 toward the "upward" position, in which the upper end 115 of the lifting pin 114 protrudes from the support surface 118 of the substrate support 112. Each stop plate 336 does not contact the stop surface 338 of the connector 330. A carrier 170 having a substrate 154 resting on its lip 172 is positioned on the substrate support 112 and does not contact the substrate support assembly 300.

[0069] Figure 3B The illustration shows the substrate support 112 in its intermediate position. The substrate support 112 has moved upward from the lowered position. During the upward movement of the substrate support 112 from the lowered position to the intermediate position, the bellows 322 continues upward and abuts against the shoulder 113 of the substrate support 112 to bias the (or each) lifting plate 310. Furthermore, the bellows 322 continues to bias the lifting pin 114 toward the "upward" position. In this way, the substrate support 112 and the lifting pin 114 are coupled such that the lifting pin 114 moves upward simultaneously with the substrate support 112 and remains protruding from the support surface 118.

[0070] When the base plate support 112 is in the intermediate position, each stop plate 336 contacts the stop surface 338 of the corresponding connector 330. Any force applied by compression of the bellows 322 and the pressure acting on each of the bellows 322 on the (or each) lifting plate 310 are transmitted to each stop plate 336 through each rod 332. The bellows 322 bias each stop plate 336 into contact with each corresponding stop surface 338.

[0071] As shown, lifting pin 114 has lifted substrate 154 away from carrier 170. In some embodiments that can be combined with other embodiments, the height of carrier 170 within processing chamber 100 does not change as substrate support 112 moves from a lowered position to an intermediate position. In some embodiments that can be combined with other embodiments, lifting pin 114 lifts substrate 154 away from carrier 170, and then removes carrier 170 from processing chamber 100 before substrate support 112 reaches the intermediate position. In some embodiments that can be combined with other embodiments, carrier 170 is removed from processing chamber 100 after confirming (e.g., by using one or more sensors 166) that lifting pin 114 has lifted substrate 154 away from carrier 170.

[0072] Figure 3C The illustration shows the base plate support 112 in the raised position. Bellows 322 continue to bias the (or each) lifting plate 310 upwards. The force applied to the (or each) lifting plate 310 via each bellows 322 is transmitted to each stop plate 336 via each rod 332. Bellows 322 continue to bias each stop plate 336 into contact with each corresponding stop surface 338.

[0073] Each stop plate 336 is biased against the corresponding stop surface 338 to maintain each lifting plate 310 and each lifting pin 114 stationary relative to the base 104. The base plate support 112 has moved upward from the intermediate position. During the upward movement of the base plate support 112 from the intermediate position to the raised position, the reference surface 113A of the shoulder 113 of the base plate support 112 moves away from said (or each) lifting plate 310 and does not contact it. In this way, the base plate support 112 and the lifting pin 114 disengage, such that when the base plate support 112 moves upward from the intermediate position to the raised position, the lifting pin 114 remains stationary. For example, the base plate support 112 moves upward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100.

[0074] As shown in the figure, the lifting pin 114 is in the "downward" position relative to the substrate support 112, such that the upper end 115 of the lifting pin 114 does not protrude from the support surface 118 of the substrate support 112. The substrate support 112 has lifted the substrate 154 away from the lifting pin 114. The substrate 154 is supported by the support surface 118 of the substrate support 112. The raised position of the substrate support 112 corresponds to the position of the substrate 154 during processing operations in the processing chamber 100.

[0075] When the substrate support 112 moves downward from the raised position to the intermediate position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves downward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100. When the substrate support 112 moves downward near the intermediate position, the lifting pin 114 (when stationary) protrudes from the support surface 118 and lifts the substrate 154 away from the support surface 118. Subsequently, the positioning carrier 170 receives the substrate 154, as... Figure 3B As shown.

[0076] When the base plate support 112 moves from the raised position to the intermediate position, the reference surface 113A of the shoulder 113 of the base plate support 112 engages the (or each) lifting plate 310. When the base plate support 112 moves downward from the intermediate position to the lowered position, the (or each) lifting plate 310 and the lifting pin 114 move downward simultaneously with the base plate support 112. When the base plate support 112 moves downward from the intermediate position to the lowered position, the lifting pin 114 remains protruding from the support surface 118. The base plate 154 moves downward on the lifting pin 114 until the base plate 154 engages the lip 172 of the carrier 170. Further downward movement of the base plate support 112 and the lifting pin 114 separates the base plate 154 from the lifting pin 114, and the base plate 154 rests on the lip 172 of the carrier 170.

[0077] In some embodiments that can be combined with other embodiments, the height of the carrier 170 within the processing chamber 100 does not change when the substrate support 112 moves from the intermediate position to the lowered position. In some embodiments that can be combined with other embodiments, the substrate 154 engages the lip 172 of the carrier 170, and the carrier 170 and substrate 154 are subsequently removed from the processing chamber 100 before the substrate support 112 reaches the lowered position. In some embodiments that can be combined with other embodiments, the carrier 170 and substrate 154 are removed from the processing chamber 100 after it is confirmed (e.g., by using one or more sensors 166) that the lifting pin 114 no longer supports the substrate 154.

[0078] Figures 4A to 4C A substrate support assembly 400 is schematically shown. The substrate support assembly 400 includes a substrate support member 112 disposed on a shaft member 124. The substrate support member 112 is movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. Figure 4A The illustration shows the substrate support 112 in the lowered position; Figure 4B The illustration shows the substrate support 112 in the middle position; and Figure 4C The illustration shows the substrate support 112 in the raised position.

[0079] Considering that the substrate support assembly 400 may include any one or more of the components, features, or aspects of the substrate support assemblies 200 or 300 described above, the substrate support assembly 400 may include one or more different or additional components, features, or aspects as described below.

[0080] The substrate support assembly 400 includes one or more biasing members 420. As shown, each biasing member 420 is a flexure 422. The flexure 422 is a dome comprising metal such as nickel-chromium alloy, brass, bronze, beryllium copper, nickel, Monel alloy, or stainless steel. In some embodiments that may be combined with other embodiments, each biasing member 420 is a spring, as described above regarding... Figures 2A to 2C The spring 222 is described. In some embodiments that can be combined with other embodiments, each biasing member 420 is a bellows, as described above regarding... Figures 3A to 3C The bellows 322 is described.

[0081] In some embodiments that can be combined with other embodiments, the substrate support assembly 200 includes a plurality of flexures 422, such as two or more, three or more, four or more, five or more, or six or more flexures 422. Considering that each flexure 422 may be disposed at discrete locations on the axis 124 on the substrate 104.

[0082] In some embodiments that can be combined with other embodiments, the number of flexures 422 is less than the number of lifting pins 114. In some embodiments that can be combined with other embodiments, the number of flexures 422 is equal to the number of lifting pins 114. In some embodiments that can be combined with other embodiments, the number of flexures 422 is greater than the number of lifting pins 114.

[0083] In some embodiments that can be combined with other embodiments, each flexure 422 is disposed under a separate lift plate 410. In some embodiments that can be combined with other embodiments, two or more flexures 422 are disposed under the same lift plate 410. In some embodiments that can be combined with other embodiments, each flexure 422 is disposed under the same lift plate 410. In some embodiments that can be combined with other embodiments, the (or each) lift plate 410 is integrated with one or more flexures 422.

[0084] The flexure 422 biases each lifting pin 114 upward. The flexure 422 biases the (or each) lifting plate 410 upward. The flexure 422 biases the (or each) lifting plate 410 toward the substrate support 112. As shown, in some embodiments that can be combined with other embodiments, the flexure 422 biases the (or each) lifting plate 410 toward the corresponding stop plate 230, as described above with respect to the substrate support assembly 200. The stop plate 230 is coupled to the substrate 104. The stop plate 230 includes a lip, flange, shoulder, or the like, which provide the maximum vertical travel range of the (or each) lifting plate 410 on the substrate 104. As described above, the stop plate 230 includes one or more adjustment mechanisms 232 configured to change the distance between the substrate 104 and the contact points 234 of the stop plate 230 and the corresponding lifting plate 410. In some embodiments that can be combined with other embodiments, the stop plate 230 may be omitted.

[0085] A rod 432 in each flexure 422 is coupled to a corresponding lifting plate 410 disposed on each flexure 422. As shown, in some embodiments that can be combined with other embodiments, each rod 432 may be stabilized by a bearing 434 to resist lateral movement. Each flexure 422 is mounted to the base 104 via a connector 430. Each rod 432 extends into a corresponding connector 430 and is coupled to a stop plate 436. In some embodiments that can be combined with other embodiments, the position of the stop plate 436 on the rod 432 is adjustable, such as by thread adjustment. Each coupled lifting plate 410, rod 432, and stop plate 436 is configured to move perpendicularly relative to the base 104.

[0086] In some embodiments that can be combined with other embodiments, each lifting pin 114 is connected to each corresponding rod 432. In some instances, each lifting pin 114 and rod 432 is in the form of an integral component. In other instances, each lifting pin 114 and rod 432 is in the form of separate components coupled together.

[0087] A seal 426 is placed between each flexure 422 and each corresponding connector 430. Another seal 428 is placed between each connector 430 and the substrate 104. As shown, each connector 430 is closed such that the fluid trapping volume is within each combined connector 430 and flexure 422. Each flexure 422 is upwardly biased against each corresponding lift plate 410 and lift pin 114 by a combination of spring bias of the flexure 422 material and the pressure difference between the fluid trapping volume and the pressure in the processing volume 150 of the processing chamber 100. Each flexure 422 biases each corresponding lift plate 410 toward the substrate support 112.

[0088] In some embodiments that can be combined with other embodiments, each connector 430 is not closed, such that pressure beneath the substrate 104 is transmitted through each connector 430 to the interior of each flexure 422. In one example, the pressure beneath the substrate 104 is greater than the pressure in the processing volume 150 of the processing chamber 100. In this example, each flexure 422 is upwardly biased toward each lifting pin 114; each flexure 422 is upwardly biased toward the (or each) lifting plate 410; each flexure 422 is biased toward the (or each) lifting plate 410 toward the substrate support 112.

[0089] Figure 4A The illustration shows the substrate support 112 in a lowered position. A flexure 422 biases the (or each) lifting plate 410 upwards and against a reference surface 113A of the shoulder 113 of the substrate support 112. The flexure 422 biases the lifting pin 114 toward an "upward" position, in which the upper end 115 of the lifting pin 114 protrudes from the support surface 118 of the substrate support 112. The (or each) lifting plate 410 does not contact the stop plate 230. Each stop plate 436 does not contact the stop surface 438 of the connector 430. A carrier 170 having a substrate 154 resting on its lip 172 is positioned on the substrate support 112 and does not contact the substrate support assembly 400.

[0090] Figure 4B The illustration shows the substrate support 112 in its intermediate position. The substrate support 112 has moved upward from the lowered position. During the upward movement of the substrate support 112 from the lowered position to the intermediate position, the flexure 422 continues upward and abuts against the reference surface 113A of the shoulder 113 of the substrate support 112 to bias the (or each) lifting plate 410. Furthermore, the flexure 422 continues to bias the lifting pin 114 toward the "upward" position. In this way, the substrate support 112 and the lifting pin 114 are coupled such that the lifting pin 114 moves upward simultaneously with the substrate support 112 and remains protruding from the support surface 118.

[0091] When the base plate support 112 is in the intermediate position, the (or each) lifting plate 410 contacts the (or each) stop plate 230 (if present), as at the corresponding adjustment mechanism 232. When the base plate support 112 is in the intermediate position, each stop plate 436 contacts the stop surface 438 of the corresponding connector 430. The force applied to the (or each) lifting plate 410 by each flexure 422 is transmitted to each stop plate 436 through each rod 432. The flexure 422 biases each stop plate 436 into contact with each corresponding stop surface 438.

[0092] As shown, lifting pin 114 has lifted substrate 154 away from carrier 170. In some embodiments that can be combined with other embodiments, the height of carrier 170 within processing chamber 100 does not change as substrate support 112 moves from a lowered position to an intermediate position. In some embodiments that can be combined with other embodiments, lifting pin 114 lifts substrate 154 away from carrier 170 and then removes carrier 170 from processing chamber 100 before substrate support 112 reaches the intermediate position. In some embodiments that can be combined with other embodiments, carrier 170 is removed from processing chamber 100 after confirming (e.g., by using one or more sensors 166) that lifting pin has lifted substrate 154 away from carrier 170.

[0093] Figure 4C The illustration shows the base plate support 112 in the raised position. A flexure 422 continues to bias the (or each) lifting plate 410 upwards. The force applied to the (or each) lifting plate 410 by each flexure 422 is transmitted to each stop plate 436 via each rod 432. The flexure 422 continues to bias each stop plate 436 into contact with each corresponding stop surface 438. In embodiments where one or more stop plates 230 are present, the flexure 422 continues upwards and abuts against the (or each) stop plate 230, biasing the (or each) lifting plate 410.

[0094] Each stop plate 436 is biased against the corresponding stop surface 438 to maintain each lifting plate 410 and each lifting pin 114 stationary relative to the base 104. The base plate support 112 has moved upward from the intermediate position. During the upward movement of the base plate support 112 from the intermediate position to the raised position, the shoulder 113 of the base plate support 112 moves away from said (or each) lifting plate 410 and does not contact it. In this way, the base plate support 112 and the lifting pin 114 disengage, such that when the base plate support 112 moves upward from the intermediate position to the raised position, the lifting pin 114 remains stationary. For example, the base plate support 112 moves upward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100.

[0095] As shown in the figure, the lifting pin 114 is in the "downward" position relative to the substrate support 112, such that the upper end 115 of the lifting pin 114 does not protrude from the support surface 118 of the substrate support 112. The substrate support 112 has lifted the substrate 154 away from the lifting pin 114. The substrate 154 is supported by the support surface 118 of the substrate support 112. The raised position of the substrate support 112 corresponds to the position of the substrate 154 during processing operations in the processing chamber 100.

[0096] When the substrate support 112 moves downward from the raised position to the intermediate position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves downward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100. When the substrate support 112 moves downward near the intermediate position, the lifting pin 114 (when stationary) protrudes from the support surface 118 and lifts the substrate 154 away from the support surface 118. Subsequently, the positioning carrier 170 receives the substrate 154, as... Figure 4B As shown.

[0097] When the base plate support 112 moves from the raised position to the intermediate position, the shoulder 113 of the base plate support 112 engages the (or each) lifting plate 410. When the base plate support 112 moves downward from the intermediate position to the lowered position, the (or each) lifting plate 410 and the lifting pin 114 move downward simultaneously with the base plate support 112. When the base plate support 112 moves downward from the intermediate position to the lowered position, the lifting pin 114 remains protruding from the support surface 118. The base plate 154 moves downward on the lifting pin 114 until the base plate 154 engages the lip 172 of the carrier 170. Further downward movement of the base plate support 112 and the lifting pin 114 separates the base plate 154 from the lifting pin 114, and the base plate 154 rests on the lip 172 of the carrier 170.

[0098] In some embodiments that can be combined with other embodiments, the height of the carrier 170 within the processing chamber 100 does not change when the substrate support 112 moves from the intermediate position to the lowered position. In some embodiments that can be combined with other embodiments, the substrate 154 engages the lip 172 of the carrier 170, and the carrier 170 and substrate 154 are subsequently removed from the processing chamber 100 before the substrate support 112 reaches the lowered position. In some embodiments that can be combined with other embodiments, the carrier 170 and substrate 154 are removed from the processing chamber 100 after it is confirmed (e.g., by using one or more sensors 166) that the lifting pin no longer supports the substrate 154.

[0099] Figures 5A to 5C A substrate support assembly 500 is schematically shown. The substrate support assembly 500 includes a substrate support member 112 disposed on a shaft member 124. The substrate support member 112 is movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. Figure 5A The illustration shows the substrate support 112 in the lowered position; Figure 5B The illustration shows the substrate support 112 in the middle position; and Figure 5C The illustration shows the substrate support 112 in the raised position.

[0100] Considering that the substrate support assembly 500 may include any one or more of the components, features, or aspects of the substrate support assemblies 200, 300, or 400 described above, the substrate support assembly 500 may include one or more different or additional components, features, or aspects as described below.

[0101] The lifting pins 114 of the substrate support assembly 500 are cam-actuated. Each lifting pin 114 is disposed on a first side 512 of a corresponding cam 510. The shoulder 113 of the substrate support 112 is movable to engage with and not engage with a second side 514 of each cam 510. Each cam 510 includes a pivot between the first side 512 and the second side 514.

[0102] Each cam 510 is offset toward the neutral position. As shown in the figure (e.g., in...). Figure 5C In some embodiments that can be combined with other embodiments, each cam 510 is substantially horizontal in the neutral position. In some alternative embodiments that can be combined with other embodiments, when each cam 510 is in the neutral position, the first side 512 is raised relative to the second side 514. In some further alternative embodiments that can be combined with other embodiments, when each cam 510 is in the neutral position, the second side 514 is raised relative to the first side 512.

[0103] Each cam 510 is biased by one or more biasing members 520 (such as springs). As shown, a first spring 522 is coupled to a first side 512 and a base 104 of each cam 510, and a second spring 524 is coupled to a second side 514 and a base 104 of each cam 510. For each cam 510, the first spring 522 biases the cam 510 to rotate about a pivot in one direction (clockwise or counterclockwise), and the second spring 524 biases the cam 510 to rotate about a pivot in the opposite direction (counterclockwise or clockwise). Each of the first spring 522 and the second spring 524 may be a tension spring or a compression spring. Additionally or alternatively, the biasing member 520 may include one or more torsion springs.

[0104] Figure 5A The illustration shows a substrate support 112 in a lowered position. A shoulder 113 of the substrate support 112 contacts a second side 514 of each cam 510 and holds each second side 514 in a “downward” position. A first side 512 of each cam 510 is in an “upward” position. Each lifting pin 114, disposed on the corresponding first side 512 of each cam 510, is in an “upward” position, wherein the upper end 115 of each lifting pin 114 protrudes from the support surface 118 of the substrate support 112.

[0105] A carrier 170 with substrate 154 is positioned on substrate support 112. As shown, lifting pin 114 has lifted substrate 154 away from the lip 172 of carrier 170. In some embodiments that can be combined with other embodiments, the height of carrier 170 within processing chamber 100 does not change when substrate support 112 is moved downward to a lowered position. In some embodiments that can be combined with other embodiments, lifting pin 114 lifts substrate 154 away from carrier 170 and then moves substrate support 112 toward a central position (…). Figure 5B The carrier 170 is removed from the processing chamber 100 before the carrier 170 is removed. In some embodiments that may be combined with other embodiments, the carrier 170 is removed from the processing chamber 100 after it is confirmed (e.g., by using one or more sensors 166) that the lifting pin 114 has lifted the substrate 154 away from the carrier 170.

[0106] Figure 5B The illustration shows a substrate support 112 in its intermediate position. The substrate support 112 has moved upward from a lowered position, and each cam 510 has moved toward a neutral position under the influence of each first spring 522 and second spring 524. During the upward movement of the substrate support 112 from the lowered position to the intermediate position, the second side 514 of each cam 510 moves upward under the influence of each first spring 522. As the second side 514 moves upward, the first side 512 of each cam 510 moves downward. Each lifting pin 114 disposed on the corresponding first side 512 of each cam 510 moves downward. In this way, the substrate support 112 and the lifting pin 114 are coupled such that the lifting pin 114 moves simultaneously with the substrate support 112. As the substrate support 112 moves upward relative to the base 104 from the lowered position to the intermediate position, the lifting pin 114 moves downward relative to the base 104.

[0107] As shown in the figure, in some embodiments that can be combined with other embodiments, when the substrate support 112 is in the intermediate position, the lifting pin 114 remains protruding from the support surface 118. The substrate 154 is supported on the lifting pin 114. However, in some alternative embodiments that can be combined with other embodiments, when the substrate support 112 changes from the lowered position to the intermediate position, the upper end 115 of the lifting pin 114 moves downward below the level of the support surface 118, and the substrate 154 moves from the lifting pin 114 to the support surface 118.

[0108] Figure 5CThe illustration shows a substrate support 112 in an elevated position. The substrate support 112 has been moved upward from a central position. During the upward movement of the substrate support 112 from the central position to the elevated position, the shoulder 113 of the substrate support 112 moves away from the second side 514 of each cam 510 and does not contact the second side. Each cam 510 remains in a neutral position, and each lifting pin 114 remains disposed on each corresponding first side 512 of the corresponding cam 510. In this way, the substrate support 112 and the lifting pin 114 are disengaged such that when the substrate support 112 moves upward from the central position to the elevated position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves upward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100.

[0109] As shown in the figure, the lifting pin 114 is in the "downward" position relative to the substrate support 112, such that the upper end 115 of the lifting pin 114 does not protrude from the support surface 118 of the substrate support 112. The substrate support 112 has lifted the substrate 154 away from the lifting pin 114. The substrate 154 is supported by the support surface 118 of the substrate support 112. The raised position of the substrate support 112 corresponds to the position of the substrate 154 during processing operations in the processing chamber 100.

[0110] When the substrate support 112 moves downward from the raised position to the intermediate position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves downward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100. In the illustrated embodiment, when the substrate support 112 moves downward near the intermediate position, the lifting pin 114 (when stationary) protrudes from the support surface 118 and lifts the substrate 154 away from the support surface 118. However, in some alternative embodiments that may be combined with other embodiments, the lifting pin 114 (when stationary) does not protrude from the support surface 118, and the substrate 154 remains on the support surface 118 when the substrate support 112 is in the intermediate position.

[0111] When the substrate support 112 moves from the raised position to the intermediate position, the shoulder 113 of the substrate support 112 engages the second side 514 of each cam 510. When the substrate support 112 moves downward from the intermediate position to the lowered position, the shoulder 113 of the substrate support 112 pushes each second side 514 toward the "downward" position. Each cam 510 rotates about a pivot, thereby moving the first side 512 of each cam 510 toward the "upward" position. Each lifting pin 114 disposed on the corresponding first side 512 of each cam 510 moves upward. In this way, the substrate support 112 and the lifting pin 114 are coupled such that the lifting pin 114 moves simultaneously with the substrate support 112. When the substrate support 112 moves downward relative to the base 104 from the intermediate position to the lowered position, the lifting pin 114 moves upward relative to the base 104.

[0112] In an embodiment where the upper end 115 of the lifting pin 114 does not protrude from the support surface 118 when the substrate support 112 is in the intermediate position, moving the substrate support 112 downward from the intermediate position to the lowered position causes the upper end 115 of the lifting pin 114 to rise above the level of the support surface 118. In doing so, the lifting pin 114 lifts the substrate 154 away from the support surface 118.

[0113] When the substrate support reaches the lowered position, the upper end 115 of the lifting pin 114 is positioned at its maximum height within the processing chamber 100. The carrier 170 can be positioned to receive the substrate 154. In some embodiments that can be combined with other embodiments, the carrier 170 moves vertically to lift the substrate 154 away from the lifting pin 114.

[0114] In some embodiments that can be combined with other embodiments, the height of the carrier 170 within the processing chamber 100 does not change when the substrate 154 is received. In one example, after positioning the carrier 170 to receive the substrate 154, the substrate support 112 moves upward at least partially from a lowered position toward a central position. As the substrate support 112 moves upward, the lifting pin 114 moves downward and deposits the substrate 154 onto the lip 172 of the carrier 170. Subsequently, the carrier 170 and the substrate 154 are removed from the processing chamber 100. In some embodiments that can be combined with other embodiments, the carrier 170 and the substrate 154 are removed from the processing chamber 100 after it is confirmed (e.g., by using one or more sensors 166) that the lifting pin 114 no longer supports the substrate 154.

[0115] Figures 6A to 6C A substrate support assembly 600 is schematically shown. The substrate support assembly 600 includes a substrate support member 112 disposed on a shaft member 124. The substrate support member 112 is movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised and lowered positions. Figure 6A The illustration shows the substrate support 112 in the lowered position; Figure 6B The illustration shows the substrate support 112 in the middle position; and Figure 6C The illustration shows the substrate support 112 in the raised position.

[0116] A shaft 124 of the substrate support assembly 600 extends through a hole 105 in the substrate 104. A connecting rod 630 located adjacent to the shaft 124 extends through another hole 106 in the substrate 104. A lock 640 selectively couples the shaft 124 to the connecting rod 630. In some embodiments that may be combined with other embodiments, the lock includes a locking bolt 642 that selectively engages with a hole 632 in the connecting rod 630.

[0117] In some embodiments, which can be combined with other embodiments, fluid pressure (pneumatic or hydraulic) moves the locking bolt 642 to engage with the connecting rod 630 and / or moves the locking bolt 642 out of engagement with the connecting rod 630. In some instances, a first fluid pressure is applied to the lock 640 to move the locking bolt 642 to engage with the connecting rod 630, and a second fluid pressure is applied to the lock 640 to move the locking bolt 642 out of engagement with the connecting rod 630. In some instances, the locking bolt 642 is biased to engage with the connecting rod 630, and fluid pressure is applied to move the locking bolt 642 out of engagement with the connecting rod 630. In some instances, the locking bolt 642 is biased out of engagement with the connecting rod 630, and fluid pressure is applied to move the locking bolt 642 to engage with the connecting rod 630.

[0118] In some embodiments that can be combined with other embodiments, the lock 640 includes a solenoid, and a current applied to the solenoid moves the locking bolt 642 to engage with the connecting rod 630 and / or moves the locking bolt 642 out of engagement with the connecting rod 630. In some instances, a first current is applied to the solenoid to move the locking bolt 642 to engage with the connecting rod 630, and a second current is applied to the solenoid to move the locking bolt 642 out of engagement with the connecting rod 630. In some instances, the solenoid is biased to engage with the connecting rod 630, and a current is applied to the solenoid to move the locking bolt 642 out of engagement with the connecting rod 630. In some instances, the solenoid is biased out of engagement with the connecting rod 630, and a current is applied to the solenoid to move the locking bolt 642 to engage with the connecting rod 630.

[0119] In some embodiments that can be combined with other embodiments, the lock 640 includes an electromagnet that selectively magnetically couples the shaft 124 to the connecting rod 630, but omits the locking bolt 642. In an example, the electromagnet does not mechanically couple the shaft 124 to the connecting rod 630, but the electromagnet is energized to magnetically couple the shaft 124 to the connecting rod 630.

[0120] In some embodiments that can be combined with other embodiments, the lock 640 includes an electromagnet that selectively magnetically couples the shaft 124 to the connecting rod 630, and a locking bolt 642 is present. In one example, energizing the electromagnet moves the locking bolt 642 to engage with the connecting rod 630, and also magnetically couples the shaft 124 to the connecting rod 630.

[0121] The connecting rod 630 is vertically movable. A guide or bearing 634 inhibits lateral movement of the connecting rod 630. As shown, in some embodiments that can be combined with other embodiments, the connecting rod 630 is biased downward by a biasing member 620 (such as a spring 622). In some embodiments that can be combined with other embodiments, the biasing member 620 is omitted. The connecting rod 630 passes through a bellows 624 on the base 104. The bellows 624 may be configured similarly to the bellows 322 described above.

[0122] The connecting rod 630 is attached to the top of the bellows 624. In some embodiments that may be combined with other embodiments, the bellows 624 is selectively pressurized to apply an upward biasing force to the connecting rod 630.

[0123] A lifting plate 610 is disposed at the top of the bellows 624. Consideration is given that the lifting plate 610 may form a ring or partial ring at least partially surrounding the shaft 124. Lifting pins 114 are disposed on the lifting plate 610. In some embodiments that can be combined with other embodiments, the substrate support assembly 600 includes three lifting pins 114. In some embodiments that can be combined with other embodiments, the substrate support assembly 600 includes more than three lifting pins 114, such as four or more, five or more, or six or more lifting pins 114. Each lifting pin 114 is disposed through a corresponding hole 116 in the substrate support 112.

[0124] Figure 6AThe illustration shows the substrate support 112 in the lowered position. Lock 640 is engaged to couple the connecting rod 630 (physically and / or magnetically) to the shaft 124. The connecting rod 630, the top of the bellows 624, the lifting plate 610, and the lifting pin 114 are depicted in a low position relative to the base 104. The upper end 115 of the lifting pin 114 protrudes from the support surface 118 of the substrate support 112. A carrier 170 with a substrate 154 resting on its lip 172 is positioned on the substrate support 112 and does not contact the substrate support assembly 600.

[0125] Figure 6B The illustration shows a substrate support 112 in its intermediate position. The substrate support 112 has moved upward from a lowered position. During the upward movement of the substrate support 112 from the lowered position to the intermediate position, a shaft 124 moves upward. The upward movement of the shaft 124, coupled via a lock 640, causes the connecting rod 630 to move upward. The upward movement of the connecting rod 630 causes the top of the bellows 624, the lifting plate 610, and the lifting pin 114 to move upward. In this way, the substrate support 112 and the lifting pin 114 are coupled such that the lifting pin 114 moves upward simultaneously with the substrate support 112 and remains protruding from the support surface 118. The connecting rod 630, the top of the bellows 624, the lifting plate 610, and the lifting pin 114 are depicted as being in a high position relative to the base 104.

[0126] As shown, lifting pin 114 has lifted substrate 154 away from carrier 170. In some embodiments that can be combined with other embodiments, the height of carrier 170 within processing chamber 100 does not change as substrate support 112 moves from a lowered position to an intermediate position. In some embodiments that can be combined with other embodiments, lifting pin 114 lifts substrate 154 away from carrier 170 and then removes carrier 170 from processing chamber 100 before substrate support 112 reaches the intermediate position. In some embodiments that can be combined with other embodiments, carrier 170 is removed from processing chamber 100 after confirmation (e.g., by using one or more sensors 166) that lifting pin 114 has lifted substrate 154 away from carrier 170. After carrier 170 is removed from processing chamber 100, lock 640 is deactivated to disengage connecting rod 630 from shaft 124.

[0127] Figure 6CThe illustration shows the substrate support 112 in the raised position. Before moving the substrate support 112 from the intermediate position to the raised position, the lock 640 is deactivated to disengage the connecting rod 630 from the shaft 124. Disengaging the connecting rod 630 from the shaft 124 causes the substrate support 112 and the shaft 124 to move upward independently of the connecting rod 630 between the intermediate and raised positions. The connecting rod 630, the lifting plate 610, and the lifting pin 114 disposed on the lifting plate 610 do not move upward. In this way, the substrate support 112 and the lifting pin 114 are disengaged such that when the substrate support 112 moves upward from the intermediate position to the raised position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves upward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100.

[0128] As shown in the figure, the lifting pin 114 is in the "downward" position relative to the substrate support 112, such that the upper end 115 of the lifting pin 114 does not protrude from the support surface 118 of the substrate support 112. The substrate support 112 has lifted the substrate 154 away from the lifting pin 114. The substrate 154 is supported by the support surface 118 of the substrate support 112. The raised position of the substrate support 112 corresponds to the position of the substrate 154 during processing operations in the processing chamber 100.

[0129] In some embodiments that can be combined with other embodiments, pressure is applied to the bellows 624 to hold the connecting rod 630 in an elevated position.

[0130] When the substrate support 112 moves downward from the raised position to the intermediate position, the lifting pin 114 remains stationary. For example, the substrate support 112 moves downward relative to the bottom plate 103 of the processing chamber 100, while the lifting pin 114 does not move upward or downward relative to the bottom plate 103 of the processing chamber 100. When the substrate support 112 moves downward near the intermediate position, the lifting pin 114 (when stationary) protrudes from the support surface 118 and lifts the substrate 154 away from the support surface 118. Subsequently, the positioning carrier 170 receives the substrate 154, as... Figure 4B As shown.

[0131] After the substrate support 112 reaches the intermediate position from the raised position, the lock 640 is engaged to couple the connecting rod 630 (physically and / or magnetically) to the shaft 124. When the substrate support 112 moves downward from the intermediate position to the lowered position, the connecting rod 630, the lifting plate 610, and the lifting pin 114 move downward simultaneously with the substrate support 112. In embodiments where pressure has been applied to the bellows 624, the pressure is released to facilitate the downward movement of the connecting rod 630 and the shaft 124 together.

[0132] As the substrate support 112 moves downward from the intermediate position to the lowered position, the lifting pin 114 remains protruding from the support surface 118. The substrate 154 moves downward on the lifting pin 114 until the substrate 154 engages the lip 172 of the carrier 170. Further downward movement of the substrate support 112 and the lifting pin 114 separates the substrate 154 from the lifting pin 114, and the substrate 154 rests on the lip 172 of the carrier 170.

[0133] In some embodiments that can be combined with other embodiments, the height of the carrier 170 within the processing chamber 100 does not change when the substrate support 112 moves from the intermediate position to the lowered position. In some embodiments that can be combined with other embodiments, the substrate 154 engages the lip 172 of the carrier 170, and the carrier 170 and substrate 154 are subsequently removed from the processing chamber 100 before the substrate support 112 reaches the lowered position. In some embodiments that can be combined with other embodiments, the carrier 170 and substrate 154 are removed from the processing chamber 100 after it is confirmed (e.g., by using one or more sensors 166) that the lifting pin 114 no longer supports the substrate 154.

[0134] In some embodiments that can be combined with other embodiments, in any of the substrate support assemblies 110, 200, 300, 400, 500, or 600 disclosed herein, the lifting pin 114 is not disposed through the hole 116 in the substrate support 112, but is disposed around the outer edge of the substrate support 112. In some embodiments that can be combined with other embodiments, in any of the substrate support assemblies 110, 200, 300, 400, 500, or 600 disclosed herein, the hole 116 in the substrate support 112 is configured as a recess around the outer edge of the substrate support 112, and the lifting pin 114 is disposed in the recess.

[0135] Figure 7 This is a flowchart of a method 700 for manipulating a substrate. Method 700 can be performed using any of the substrate support assemblies 110, 200, 300, 400, 500, or 600.

[0136] Operation 702 involves moving the substrate support upward from a lowered position to an intermediate position, such that a lifting pin coupled to the substrate support moves simultaneously with the substrate support. In some embodiments, the lifting pin moves upward simultaneously with the substrate support (e.g., with substrate support assemblies 200, 300, 400, or 600). In some embodiments, the lifting pin moves downward while the substrate support moves upward simultaneously (e.g., together with substrate support assembly 500).

[0137] Operation 704 involves bringing the substrate into contact with the lifting pin as the substrate support and the lifting pin move simultaneously. In some embodiments, operation 704 occurs prior to operation 702, such as when using substrate support assembly 500. In some embodiments, operation 704 occurs during operation 702, such as when using substrate support assemblies 200, 300, 400, or 600. In some embodiments that may be combined with other embodiments, method 700 further includes using a sensor on the lifting pin to detect one of the following: the presence of the substrate on the lifting pin; or the temperature of the substrate.

[0138] In some embodiments that can be combined with other embodiments, method 700 further includes lifting the substrate away from the carrier using lifting pins. In some embodiments that can be combined with other embodiments, method 700 is performed in a processing chamber, and method 700 further includes removing the carrier from the processing chamber.

[0139] Operation 706 involves moving the substrate support upward from a middle position toward a raised position while the lifting pin remains stationary. For example, the substrate support moves upward relative to the bottom plate of the processing chamber, while the lifting pin does not move upward or downward relative to the bottom plate of the processing chamber.

[0140] Operation 708 involves the substrate support lifting the substrate away from the lifting pin when the substrate support moves toward the raised position.

[0141] In some embodiments that can be combined with other embodiments, method 700 further includes moving the substrate support downward from a raised position toward a central position while the lifting pin remains stationary. For example, the substrate support moves downward relative to the bottom plate of the processing chamber, while the lifting pin does not move upward or downward relative to the bottom plate of the processing chamber. In some embodiments that can be combined with other embodiments, method 700 further includes bringing the substrate into contact with the lifting pin as the substrate support moves downward toward the central position. In some embodiments that can be combined with other embodiments, method 700 further includes lifting the substrate away from the substrate support by the lifting pin as the substrate support moves downward toward the central position.

[0142] In some embodiments that can be combined with other embodiments, method 700 further includes moving the substrate support downward from the intermediate position toward the lowered position, such that the lifting pin moves simultaneously with the movement of the substrate support. In some embodiments that can be combined with other embodiments, method 700 further includes transferring the substrate from the lifting pin to the carrier as the lifting pin moves downward toward the lowered position.

[0143] Figure 8 This is a flowchart of a method 800 for manipulating a substrate. Method 800 can be performed using any of the substrate support assemblies 110, 200, 300, 400, 500, or 600.

[0144] Operation 802 involves moving a carrier with a substrate into the processing chamber while the carrier is held at a height above the bottom plate of the processing chamber.

[0145] Operation 804 involves moving a lifting pin toward the substrate while simultaneously moving a substrate support within the processing chamber and while maintaining the carrier at a height above the bottom plate of the processing chamber.

[0146] Operation 806 involves lifting the substrate away from the carrier while the carrier is held at a height above the bottom plate of the processing chamber.

[0147] Operation 808 involves removing the vehicle from the processing chamber while maintaining the vehicle at a height above the floor of the processing chamber.

[0148] Method 700 may incorporate any operation or aspect of Method 800. Method 800 may incorporate any operation or aspect of Method 700.

[0149] Embodiments of this disclosure facilitate the transfer of a substrate between a carrier and a substrate support without altering the height of the carrier within the processing chamber. Embodiments of this disclosure facilitate the actuation of a lifting pin using movement of the substrate support. Embodiments of this disclosure facilitate the actuation of the lifting pin such that it simultaneously contacts the substrate and raises or lowers the substrate.

[0150] Considering that any one or more components or features of any disclosed embodiment may be advantageously integrated into any one or more other non-mutually exclusive embodiments. Although the foregoing relates to embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from its essential scope, which is determined by the following claims.

Claims

1. A substrate support assembly, comprising: A substrate support is movable between a raised position, a lowered position below the raised position, and an intermediate position between the raised position and the lowered position. The substrate support includes a support surface and a reference surface configured to receive a substrate. as well as Lifting pin assembly, including: Lifting plate; as well as Multiple lifting pins, each lifting pin being disposed in a corresponding hole passing through the substrate support, wherein each lifting pin includes: The first end is coupled to the first surface of the lifting plate; and The second end is located on the end of the lifting pin opposite to the first end; A stop plate, positioned below the support surface of the base plate support, is configured to restrict upward movement of the lifting plate; and Multiple biasing members are coupled to a second surface of the lifting plate that is opposite to the first surface of the lifting plate; in: The lifting plate is disposed between the biasing member and the reference surface of the base plate support; During use, the substrate support assembly switches between a first configuration and a second configuration; In the first configuration, when the base plate support moves between the lowered position and the intermediate position, the biasing member abuts against the reference surface of the base plate support to bias the lifting plate; and In the second configuration, when the base plate support moves between the intermediate position and the raised position, the stop plate prevents the lifting plate from moving upward.

2. The substrate support assembly according to claim 1, wherein: In the first configuration, the lifting plate engages with the reference surface of the substrate support; as well as In the second configuration, the lifting plate does not engage with the reference surface of the base plate support.

3. The substrate support assembly according to claim 1, wherein the biasing member is one of a spring, a bellows, or a flexure.

4. The substrate support assembly according to claim 1, wherein: The stop plate is coupled to the base below the lifting plate; The lifting plate is movable to engage the stop plate at the contact point; and The stop plate includes an adjustment mechanism configured to change the distance between the base and the contact point.

5. The substrate support assembly of claim 1, wherein the stop plate is coupled to a rod extending from the second surface of the lifting plate.

6. The substrate support assembly of claim 5, wherein in the first configuration, the stop plate moves together with the lifting plate.

7. A substrate support assembly, comprising: The substrate support is movable between a raised position and a lowered position, and includes a support surface and a reference surface configured to receive the substrate; as well as Lifting pin assembly, including: Lifting plate; as well as Multiple lift pins, including: Each of the lifting pins has a first end coupled to a first surface of the lifting plate and a second end on the end of the lifting pin opposite to the first end; and The hole formed through the substrate support is configured to receive the lifting pin in the lifting pin; A stop plate, positioned below the support surface of the base plate support, is configured to restrict upward movement of the lifting plate; and Multiple bias components; in: The lifting plate is disposed between the biasing member and the stop plate; The biasing member comprises three or more biasing members; and The biasing member is configured to bias the lifting plate against the reference surface of the base plate support when the reference surface is positioned below the contact surface of the stop plate, and to bias the lifting plate against the contact surface of the stop plate when the reference surface is positioned above the contact surface of the stop plate.

8. The substrate support assembly according to claim 7, wherein the biasing member is one of a spring, a bellows, or a flexure.

9. The substrate support assembly of claim 7, wherein when the reference surface of the substrate support is below the contact surface of the stop plate, the second end of each of the lifting pins extends above the support surface of the substrate support.

10. The substrate support assembly of claim 9, wherein when the reference surface of the substrate support is above the contact surface of the stop plate, the support surface of the substrate support is positioned above the second end of each of the lifting pins.

11. The substrate support assembly according to claim 10, wherein: The stop plate includes an adjustment mechanism configured to change the position of the contact surface of the stop plate.

12. The substrate support assembly of claim 7, wherein when the reference surface of the substrate support is above the contact surface of the stop plate, the biasing member is configured to bias the first surface of the lifting plate against the contact surface.

13. The substrate support assembly of claim 7, wherein when the reference surface is below the contact surface of the stop plate, the biasing member is configured to bias the first surface of the lifting plate against the reference surface of the substrate support.

14. The substrate support assembly of claim 7, further comprising a sensor positioned on the second end of one of the lifting pins, the sensor comprising a temperature sensor or a strain gauge.

15. A method for manipulating a substrate, comprising the following steps: The substrate support is moved from the lowered position to the middle position, wherein: Multiple lifting pins protrude from the support surface of the substrate support; The lifting pin is positioned on the upper surface of the lifting plate; as well as The lifting plate and the lifting pin move simultaneously with the base plate support; When the substrate support and the lifting pin move simultaneously, the substrate comes into contact with the lifting pin. When the lifting pin remains stationary, the base plate support is moved upward from the middle position toward the raised position; as well as When the substrate support moves toward the raised position, the substrate is lifted away from the lifting pin by the substrate support.

16. The method of claim 15, further comprising the step of using a sensor on at least one of the lifting pins to detect one of the following: The presence of the substrate on the lifting pin; or The temperature of the substrate.

17. The method of claim 15, further comprising the step of: moving the base plate support downward from the raised position toward the intermediate position while the lifting pin remains stationary.

18. The method of claim 17, wherein the substrate is brought into contact with the lifting pin and the substrate is lifted away from the substrate support by the lifting pin when the substrate support is moved downward toward the intermediate position.

19. The method of claim 18, further comprising the step of: moving the substrate support downward from the intermediate position toward the lowered position, wherein the lifting pin and the substrate support move simultaneously.

20. The method of claim 19, further comprising the step of: transferring the substrate from the lifting pin to the carrier while simultaneously moving the lifting pin and the substrate support.

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