Printing apparatus

Abstract

A printing apparatus for printing a solder paste on a substrate using a mask is provided with: a squeegee that slides on the mask and prints the solder paste on the substrate through an opening provided in the mask; a cover for blocking the falling of the solder paste adhering to the squeegee; and a control unit that controls the movement of the cover between a retracted position at which the sliding of the squeegee on the mask is not hindered, and a catch position at which the falling of the solder paste adhering to the squeegee is blocked.

Description

[0001] This application is a divisional application of patent application No. 202180070975.X, filed on July 30, 2021, entitled "Printing Apparatus". Technical Field

[0002] This invention relates to printing apparatus. Background Technology

[0003] Screen printing apparatuses are known to have mechanisms to prevent solder adhering to the squeegee from falling onto the screen mask. Patent Document 1 discloses a screen printing apparatus in which a cleaning unit is provided under the screen mask, having an abutment member along the end face of the squeegee. After the screen mask is retracted, the abutment member of the cleaning unit is used to wipe away the solder adhering to the end face of the squeegee, thereby preventing the solder adhering to the squeegee from falling.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-16571 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, the structure disclosed in Patent Document 1 cannot prevent the solder attached to the scraper from falling onto the screen mask before the screen mask is retracted.

[0009] The purpose of this invention is to provide a printing apparatus capable of preventing solder adhering to a squeegee from falling onto a screen mask.

[0010] Solution for solving the problem

[0011] The printing apparatus of the present invention uses a mask to print solder paste onto a substrate. The printing apparatus includes: a squeegee that slides on the mask and prints the solder paste onto the substrate through an opening in the mask; a cover that catches the falling solder paste adhered to the squeegee; and a control unit that controls the movement of the cover between a retracted position and a catch position, the retracted position being a position that does not obstruct the sliding of the squeegee on the mask, and the catch position being a position that catches the falling solder paste adhered to the squeegee.

[0012] Invention Effects

[0013] According to the present invention, it is possible to prevent solder adhering to the scraper from falling onto the wire mesh mask. Attached Figure Description

[0014] Figure 1 This is a perspective view showing the screen printing apparatus in this embodiment.

[0015] Figure 2 This is a side view showing the screen printing apparatus in this embodiment.

[0016] Figure 3A This is a side view showing the scraper head when the cover of the solder fall prevention mechanism in this embodiment is in the retracted position.

[0017] Figure 3B This is a side view showing the scraper head when the cover of the solder fall prevention mechanism in this embodiment is in the blocking position.

[0018] Figure 4A This is a perspective view showing the area near the scraper when the cover of the solder fall prevention mechanism in this embodiment is in the retracted position.

[0019] Figure 4B This is a perspective view showing the area near the scraper when the cover of the solder fall prevention mechanism in this embodiment is in the blocking position.

[0020] Figure 5A This is a perspective view showing the solder fall prevention mechanism when the cover is in the retracted position in this embodiment.

[0021] Figure 5B This is a perspective view showing the solder falling prevention mechanism when the cover is in the supporting position in this embodiment.

[0022] Figure 6 This is a diagram illustrating the assembly and disassembly of the flat plate constituting the cover in this embodiment.

[0023] Figure 7 This is a block diagram showing the control system of the screen printing apparatus in this embodiment.

[0024] Figure 8 This is a flowchart illustrating an example of the processing performed by the control device in this embodiment at the end of a printing operation.

[0025] Figure 9 This is a flowchart illustrating an example of the processing performed by the control device at the start of a printing operation in this embodiment.

[0026] Figure 10A This is the first diagram illustrating the actions of the scraper and the cover at the end of the printing operation in this embodiment.

[0027] Figure 10B This is the second diagram illustrating the actions of the scraper and the cover at the end of the printing operation in this embodiment.

[0028] Figure 10C This is the third figure, used to illustrate the actions of the squeegee and the cover at the end of the printing operation in this embodiment.

[0029] Figure 10D This is the fourth figure, which illustrates the actions of the squeegee and the cover at the end of the printing operation in this embodiment.

[0030] Figure 10E This is the fifth figure, which illustrates the actions of the squeegee and the cover at the end of the printing operation in this embodiment.

[0031] Figure 10F This is the sixth figure, which illustrates the actions of the squeegee and the cover at the end of the printing operation in this embodiment.

[0032] Figure 10G This is the seventh figure, which illustrates the actions of the scraper and the cover at the end of the printing operation in this embodiment.

[0033] Figure 10H This is Figure 8, which illustrates the actions of the squeegee and the cover at the end of the printing operation in this embodiment.

[0034] Figure 10I This is the ninth figure, illustrating the actions of the scraper and the cover at the end of the printing operation in this embodiment.

[0035] Figure 10J This is Figure 10, which illustrates the actions of the scraper and the cover at the end of the printing operation in this embodiment.

[0036] Figure 11 This is a diagram showing the structure of a solder fall prevention mechanism as a modified example of this embodiment.

[0037] Explanation of reference numerals in the attached figures

[0038] 1. Screen printing equipment

[0039] 2 substrate

[0040] 2d electrode

[0041] 8 Operators

[0042] 9 Solder paste

[0043] 11 Abutment

[0044] 12. Substrate holding and moving mechanism

[0045] 13. Silkscreen mask

[0046] 13W frame components

[0047] 14. Loading into the conveyor

[0048] 16 cameras

[0049] 16K camera movement mechanism

[0050] 16a Upper camera section

[0051] 16b Lower camera section

[0052] 17 Scraper Head

[0053] 17K Printhead Moving Mechanism

[0054] 19 Mask support section

[0055] 21. Substrate holding section

[0056] 22 Mobile Stations

[0057] 31 Conveyor

[0058] 32 Lower bearing section

[0059] 33 Clamping device

[0060] 33F Front Clamp

[0061] 33R Rear Clamp

[0062] 41. Mobile base

[0063] 42 Scraper

[0064] 42F Front scraper

[0065] 42R rear scraper

[0066] 43 Scraper Lifting Working Cylinder

[0067] 60 Control device

[0068] 60a Image Processing Unit

[0069] 61 Input device

[0070] 71 Solder paste recovery device

[0071] 73 abutment

[0072] 89. Shell

[0073] 91 Automatic Mask Positioning Unit

[0074] 93 Solder recycling installation unit

[0075] 97 strokes

[0076] 99 working cylinders

[0077] 105 Recycling Unit Support Rod

[0078] 113 Skeleton

[0079] 190 Solder Supply Unit

[0080] 200 Solder Fall Prevention Mechanism

[0081] 210 masks

[0082] 211 Support plate

[0083] 212 Flat panel

[0084] 213 convex part

[0085] 214 concavity

[0086] 215 ribs

[0087] 216 knurled screws

[0088] 220 Cover Moving Mechanism

[0089] 221 Fixing part

[0090] 222 First Arm

[0091] 223 Second Arm

[0092] 224 cylinders

[0093] 225 strokes

[0094] Rotation axes 231, 232, 233, 234, 235

[0095] 300 Solder Fall Prevention Mechanism

[0096] 310 Cover

[0097] 311 Rotating Axis

[0098] 320 columns

[0099] P1 Retreat Position

[0100] P2 bearing position

[0101] Q: Solder stripping location. Detailed Implementation

[0102] Hereinafter, embodiments of the present invention will be described in detail with appropriate reference to the accompanying drawings. However, sometimes more detailed descriptions than necessary are omitted. For example, detailed descriptions of well-known matters and repetitive descriptions of substantially the same structures are sometimes omitted. This is to avoid making the following description unnecessarily lengthy and to facilitate understanding by those skilled in the art. It should be noted that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present invention and are not intended to limit the subject matter of the technical solutions described herein.

[0103] (This implementation method)

[0104] <Structure of a screen printing apparatus>

[0105] Reference Figure 1 as well as Figure 2 The structure of screen printing apparatus 1 will be described. Figure 1 This is a perspective view showing the screen printing apparatus 1 in this embodiment. Figure 2 This is a side view showing the screen printing apparatus 1 in this embodiment.

[0106] The screen printing apparatus 1 repeatedly performs the screen printing operation of receiving a substrate 2 fed from the upstream process side, screen printing solder paste 9 on each electrode 2d of the substrate 2, and handing it over to the downstream process side apparatus. The screen printing apparatus 1 can be referred to as a printing apparatus. The substrate 2 can be referred to as a circuit board. The solder paste 9 can be referred to as solder or paste. As an example of the downstream process side apparatus, a component mounting apparatus (not shown) can be cited.

[0107] For ease of explanation, the left-right direction as observed by operator 8 will be used as the X-axis, with the left side designated as the upstream process side and the right side as the downstream process side. Furthermore, the front-back direction, with the direction closest to operator 8 as "forward" and the direction furthest from operator 8 as "backward," will be used as the Y-axis, and the up-down direction as the Z-axis. For further explanation, the negative direction of the X-axis may sometimes be referred to as "left," the positive direction as "right," the negative direction of the Y-axis as "forward," the positive direction as "backward," the positive direction of the Z-axis as "up," and the negative direction as "down." It should be noted that these directional representations are for illustrative purposes only and are not intended to limit the actual orientation of the structure during use.

[0108] The screen printing apparatus 1 includes a substrate holding and moving mechanism 12 on a base 11. The substrate holding and moving mechanism 12 has a mechanism for holding and moving the substrate 2 to be printed. The substrate holding and moving mechanism 12 can be referred to as a stage. A screen mask 13 is disposed above the substrate holding and moving mechanism 12. The screen mask 13 can be referred to as a mask.

[0109] A feed conveyor 14 is provided to the left of the substrate holding and moving mechanism 12. The feed conveyor 14 receives the substrate 2 fed from the upstream process side of the screen printing apparatus 1 and transports the substrate 2 to the substrate holding and moving mechanism 12. A take-out conveyor (not shown) is provided to the right of the substrate holding and moving mechanism 12. The take-out conveyor receives the substrate 2 from the substrate holding and moving mechanism 12 and transports the substrate 2 to the downstream process side.

[0110] A camera 16 is movable in the area below the screen mask 13. A scraper head 17 is movable in the area above the screen mask 13.

[0111] like Figure 2 As shown, the substrate holding and moving mechanism 12 has a substrate holding part 21 and a moving stage part 22.

[0112] The substrate holding section 21 includes a positioning conveyor 31, a lower support section 32, and a pair of front and rear grippers 33. The positioning conveyor 31 positions the substrate 2 received from the infeed conveyor 14 at a predetermined gripping position. The lower support section 32 supports the substrate 2 positioned at the gripping position by the positioning conveyor 31 from below. The grippers 33 grip and hold the substrate 2 from the side (Y-axis direction). The gripper located on the operator's side of the two grippers 33 in the substrate holding section 21 is called the front gripper 33F, and the gripper located on the opposite side of the operator is called the rear gripper 33R. It should be noted that the operator 8 can be referred to as the worker.

[0113] The moving stage 22 includes an XYθ stage mechanism composed of multiple stage mechanisms stacked in multiple stages, and moves the substrate holding part 21 in the horizontal direction and the vertical direction.

[0114] The screen mask 13 is configured as a metal component having a rectangular flat plate shape extending in the XY plane. Patterned openings (not shown) are provided on the screen mask 13 corresponding to the arrangement of the electrodes 2d on the substrate 2. These patterned openings can be referred to as openings. The screen mask 13 is divided into borders and supported by a generally quadrilateral frame member 13W.

[0115] Above the substrate holding and moving mechanism 12, as Figure 1 As shown, L-shaped guide rails 19 are provided on the ground to support the left and right sides of the frame member 13W respectively. The screen mask 13 and the frame member 13W are arranged on the guide rails of the mask support 19 and can move in the front-back direction.

[0116] like Figure 2As shown, the camera 16 has an upper shooting section 16a that directs the shooting view upwards and a lower shooting section 16b that directs the shooting view downwards. The camera 16 is driven by a camera movement mechanism 16K that uses a ball screw mechanism as an actuator, thereby enabling it to move in the XY plane.

[0117] <Structure of the scraper head>

[0118] Reference Figure 1 , Figure 2 , Figure 3A as well as Figure 3B The structure of scraper head 17 is explained. Figure 3A This is a side view showing the scraper head 17 when the cover 210 of the solder fall prevention mechanism 200 in this embodiment is in the retracted position P1. Figure 3B This is a side view showing the scraper head 17 when the cover 210 of the solder fall prevention mechanism 200 in this embodiment is in the blocking position P2.

[0119] The scraper head 17 is configured to include a movable base 41, two scrapers 42, and two scraper lifting cylinders 43.

[0120] The movable base 41 is a component that extends in the left-right direction. The movable base 41 is driven by the printhead moving mechanism 17K, which uses a ball screw mechanism as an actuator, and thus moves in the front-back direction.

[0121] Two scraper blades 42 are arranged side-by-side on the movable base 41. The two scraper blades 42 move as a single unit in the front-to-back direction as the movable base 41 moves. The scraper blade 42 located at the front (…) Figure 2 The scraper 42 (on the right side of the paper) is called the front scraper 42F, which moves the scraper located behind ( Figure 2 The scraper 42 on the left side of the paper is called the rear scraper 42R.

[0122] The front scraper 42F and the rear scraper 42R are each composed of a "plate"-shaped component extending in the left-right direction, and they extend diagonally downwards in a downward-expanding manner. For the front scraper 42F, the rear surface is the paste-scraping surface, and for the rear scraper 42R, the front surface is the paste-scraping surface.

[0123] Two scraper lifting cylinders 43 are arranged side by side on the movable base 41 in the front-to-back direction. The front scraper lifting cylinder 43 raises and lowers the front scraper 42F, and the rear scraper lifting cylinder 43 raises and lowers the rear scraper 42R.

[0124] The scraper lifting cylinder 43 enables the scraper 42 to be separated from the upper surface of the screen mask 13 by a specified distance at a standby height position (refer to...). Figure 2The scraper 42 shown moves up and down between the lower end of the scraper 42 and the contact height position of the screen mask 13.

[0125] The scraper head 17 is equipped with an automatic mask positioning unit 91 and a solder paste recovery device 71.

[0126] The automatic mask positioning unit 91 moves the screen mask 13 by moving the frame member 13W, thereby positioning the screen mask 13. At this time, the automatic mask positioning unit 91 can move further rearward than the frame member 13W. This moving position becomes the rearmost moving position of the scraper head 17.

[0127] The solder paste recovery device 71 is a device for recovering excess solder paste 9 on the screen mask 13. The solder paste recovery device 71 can be disposed between the scraper head 17 and the automatic mask positioning unit 91. Thus, even if the scraper head 17 moves to the rearmost position, the scraper head 17 will not interfere with the frame 113 of the device.

[0128] The solder paste recovery device 71 is installed in a detachable manner on the solder recovery mounting unit 93 of the automatic mask positioning unit 91. The structure of the solder recovery mounting unit 93 will now be described in detail.

[0129] The solder recovery installation unit 93 includes a mask positioning rod 97, a working cylinder 99 that drives the rod 97 in the vertical direction, and a recovery unit support rod 105 that supports the solder paste recovery device 71. Multiple working cylinders 99 are arranged in the left-right direction and are installed in the housing of the solder recovery installation unit 93.

[0130] Furthermore, in the solder recovery installation unit 93, a recovery unit support rod 105 is provided between multiple working cylinders 99. A lifting working cylinder and a lifting rod for raising and lowering the solder paste recovery device 71 are installed on the recovery unit support rod 105. The solder paste recovery device 71 is installed on this lifting rod.

[0131] The solder paste recovery device 71 has an abutting part 73 that abuts against the screen mask 13 to hold the recovered solder paste 9.

[0132] The abutment part 73 is made of a narrow strip-shaped thin plate extending along the length of the scraper 42. The abutment part 73 is installed such that one long side is fixed to the housing 89 of the solder paste recovery device 71 and the other long side is inclined downward.

[0133] When a printing operation is completed, the solder paste recovery device 71 moves forward by abutting part 73 against the screen mask 13, and recovers excess solder paste 9 on the screen mask 13. When the screen mask 13 is replaced for use in the next printing, the solder paste recovery device 71 supplies the recovered solder paste 9 to the replaced screen mask 13.

[0134] A solder drop prevention mechanism 200 is provided on the scraper head 17 to prevent the solder paste 9 adhering to the scraper 42 from falling onto the screen mask 13. The solder drop prevention mechanism 200 is configured to include a cover 210 and a cover moving mechanism 220. The cover 210 blocks the falling of the solder paste 9 adhering to the scraper 42 in the raised state. The cover moving mechanism 220 is a mechanism that moves the cover 210 between a retraction position P1, which does not obstruct the sliding of the scraper 42 on the screen mask 13, and a blocking position P2, which blocks the falling of the solder paste 9 adhering to the scraper 42. Next, the solder drop prevention mechanism 200 will be described in detail.

[0135] <Details of the solder drop prevention mechanism>

[0136] Reference Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 5A , Figure 5B as well as Figure 6 The structure of the solder falling prevention mechanism 200 is described in detail. Figure 4A This is a perspective view showing the area near the scraper 42 when the cover 210 of the solder fall prevention mechanism 200 in this embodiment is in the retracted position P1. Figure 4B This is a perspective view showing the area near the scraper 42 when the cover 210 of the solder fall prevention mechanism 200 in this embodiment is in the blocking position P2. Figure 5A This is a perspective view showing the solder falling prevention mechanism 200 when the cover 210 is in the retreat position P1 in this embodiment. Figure 5B This is a perspective view showing the solder falling prevention mechanism 200 when the cover 210 is in the supporting position P2 in this embodiment. Figure 6 This is a diagram illustrating the loading and unloading of the flat plate 212 that constitutes the cover 210 in this embodiment.

[0137] As described above, the solder fall prevention mechanism 200 is configured to include a cover 210 and a cover moving mechanism 220.

[0138] The length of the cover 210 in the left-right direction is longer than the length of the scraper 42 in the left-right direction. Furthermore, the length of the cover 210 in the front-back direction is longer than the distance between the lower ends of the front scraper 42F and the rear scraper 42R when viewed from the side. Therefore, when the cover 210 is in the supporting position P2 below the front scraper 42F and the rear scraper 42R, it can withstand solder paste 9 falling from either the front scraper 42F or the rear scraper 42R.

[0139] The cover moving mechanism 220 has a mechanism for moving the cover 210 between the retracted position P1 and the receiving position P2. For example, the cover moving mechanism 220 is configured to include two fixed parts 221, two first arms 222, two second arms 223, and two cylinders 224.

[0140] The two fixing parts 221 are fixed to the left and right sides of the scraper head 17, respectively.

[0141] The two cylinders 224 are an example of actuators that drive the cover 210. The two cylinders 224 are respectively fixed to the left fixed part 221 and the right fixed part 221. The cylinders 224 cause the rod 225 to slide in the back-and-forth direction by intake and exhaust. It should be noted that other types of actuators, such as hydraulic cylinders, can also be used instead of the cylinders 224.

[0142] One end of the first arm 222 of one side is connected to the short side of the left side of the cover 210 via a rotating shaft 231, and the other end of the first arm 222 of the other side is connected to the rod 225 of the cylinder 224 on the left side via a rotating shaft 232. Furthermore, the first arm 222 of the other side is connected to the fixing part 221 on the left side via a rotating shaft 233 midway from one end to the other. One end of the first arm 222 of the other side is connected to the short side of the right side of the cover 210 via a rotating shaft 231, and the other end of the first arm 222 of the other side is connected to the rod 225 of the cylinder 224 on the right side via a rotating shaft 232. Furthermore, the first arm 222 of the other side is connected to the fixing part 221 on the right side midway from one end to the other via a rotating shaft 233.

[0143] One side's second arm 223 is configured to be substantially parallel to the left side's first arm 222, with one end connected to the left short side of the cover 210 via a rotation shaft 234, and the other end connected to the left side's fixing part 221 via a rotation shaft 235. The other side's second arm 223 is configured to be substantially parallel to the right side's first arm 222, with one end connected to the right short side of the cover 210 via a rotation shaft 234, and the other end connected to the right side's fixing part 221 via a rotation shaft 235.

[0144] When the cover 210 moves to the retracted position P1, the cylinder 224 operates as follows. That is, the cylinder 224... Figure 4A as well as Figure 5A As shown, the rod 225 slides backward. Consequently, the other end of the first arm 222 moves backward and downward under the action of the rod 225, and the rotation axis 233 connecting the first arm 222 to the fixed part 221 becomes the fulcrum, causing one end of the first arm 222 to move forward and upward. Simultaneously, the cover 210 connected to one end of the first arm 222 also moves forward and upward. As a result, the cover 210 moves towards the retracted position P1.

[0145] When the cover 210 is moved to the bearing position P2, the cylinder 224 operates as follows. That is, the cylinder 224... Figure 4B as well as Figure 5B As shown, rod 225 slides forward. Consequently, the other end of the first arm 222 moves forward and upward under the action of rod 225, and the rotation shaft 233 connecting the first arm 222 to the fixing part 221 becomes the fulcrum, causing one end of the first arm 222 to move backward and downward. Simultaneously, the cover 210 connected to one end of the first arm 222 also moves backward and downward. As a result, the cover 210 moves towards the bearing position P2. Here, the bearing position P2 is the position below the scraper 42. That is, the lengths of the first arm 222 and the second arm 223, as well as the sliding distance of rod 225 of cylinder 224, are designed such that the cover 210 is located at the bearing position P2, i.e., below the scraper 42.

[0146] The cover moving mechanism 220 is configured to maintain the horizontal posture of the cover 210 during the movement of the cover 210 between the retracted position P1 and the supported position P2. Thus, during the movement of the cover between the retracted position P1 and the supported position P2, it is possible to prevent the solder paste 9 supported by the cover 210 from slipping off the cover 210.

[0147] like Figure 6 As shown, the cover 210 is configured to include a support plate 211 and a flat plate 212. The support plate 211 is made of a generally rectangular thin plate. The flat plate 212 is made of a generally rectangular thin plate that can be stacked on top of the support plate 211.

[0148] The flat plate 212 is configured to be detachable from the support plate 211. For example, a protrusion 213 is formed on one short side of the flat plate 212, which can engage with a recess 214 formed on one short side of the support plate 211. Furthermore, the other short side of the flat plate 212 and the other short side of the support plate 211 can be secured by knurled screws 216. Thus, the operator 8 can... Figure 6As shown, by removing the knurled screws 216, the short side of the other side of the flat plate 212 is lifted, and the protrusion 213 on the short side of one side of the flat plate 212 is pulled out from the recess 214 of the support plate 211, thereby making it easy to remove the flat plate 212 from the support plate 211.

[0149] Therefore, even if the flat plate 212 is contaminated by solder paste 9 falling from the scraper 42, the operator 8 can replace it with a clean flat plate 212 and immediately resume the printing operation. Thus, printing efficiency is improved compared to interrupting the printing operation and cleaning the contaminated cover 210. It should be noted that the contaminated flat plate 212 is cleaned during external changeover and can be reused.

[0150] A rib 215 extending upward along the long side of the front of the support plate 211 can be provided. This prevents the support plate 211 from deflecting. On the other hand, a rib may not be provided on the long side of the rear of the support plate 211. This is because if a rib is provided on the long side of the rear of the support plate 211, the solder paste 9 hanging from the scraper 42 may adhere to the rib when the cover 210 is moved to the bearing position P2.

[0151] Furthermore, with the cover 210 in the supporting position P2, the distance between the cover 210 and the lower end of the scraper 42 can be longer than the distance between the cover 210 and the screen mask 13. By increasing the distance between the cover 210 and the lower end of the scraper 42, the possibility of the solder paste 9 hanging from the scraper 42 contacting the long rear side of the cover 210 can be reduced when the cover 210 is moved towards the supporting position P2.

[0152] <Structure of Control Systems>

[0153] Reference Figure 7 The control system of screen printing apparatus 1 will be described. Figure 7 This is a block diagram showing the control system of the screen printing apparatus 1 in this embodiment.

[0154] The screen printing apparatus 1 includes a control device 60 that controls the operation of each device included in the screen printing apparatus 1. The control device 60 may be referred to as a control unit, controller, processor, or CPU (Central Processing Unit). In addition, the control device 60 may include a memory (e.g., ROM (Read-Only Memory) and RAM (Random Access Memory)) for storing data and computer programs used for control.

[0155] The control device 60 controls actions related to the transport of the substrate 2 by the infeed conveyor 14, the holding and movement of the substrate 2 by the substrate holding and moving mechanism 12, and the transport of the substrate 2 by the outfeed conveyor (not shown). The control device 60 controls actions related to the movement and shooting of the camera 16 by the camera moving mechanism 16K, the movement of the squeegee head 17 by the printhead moving mechanism 17K, and the lifting and lowering of each squeegee 42 by the squeegee lifting cylinder 43. The control device 60 controls actions related to the recovery and supply of solder paste 9 by the solder paste recovery device 71.

[0156] The control device 60 controls actions related to the movement of the cover 210 performed by the cover moving mechanism 220. Details of the control of the movement of the cover 210 will be described later. The control device 60 controls the solder stripping action of the scraper 42. Details of the solder stripping action of the scraper 42 will be described later.

[0157] The image data captured by the camera 16 is sent to the control device 60, where image recognition is performed in the image processing unit 60a of the control device 60.

[0158] In the screen printing apparatus 1 of this embodiment, the required input is received from the input device 61 connected to the control device 60. As a result, the contact points of the front and rear pairs of squeegees 42 can be arbitrarily set.

[0159] In addition, by inputting the required information from the input device 61, the sliding speed of the squeegee 42 on the screen mask 13 and the printing pressure of the squeegee 42 on the screen mask 13 can be set arbitrarily.

[0160] Furthermore, the screen printing apparatus 1 can arbitrarily set the printing start position and printing end position based on input from the input device 61. The input device 61 can arbitrarily select either the front or rear side for the printing start position. The input device 61 can also arbitrarily select either the front or rear side for the printing end position. The input device 61 can notify the control device 60 of its selected printing start position and / or printing end position. The input device 61 can be composed of input devices such as a touch panel, buttons, and switches.

[0161] The control device 60 can set the solder paste 9 recovery position according to the printing end position. The control device 60 can set the solder paste 9 supply position according to the printing start position.

[0162] <Details on the movement control of the cover>

[0163] Reference Figure 8 as well as Figure 9The movement control of the cover 210 by the control device 60 is described in detail.

[0164] Figure 8 This is a flowchart illustrating an example of the processing performed by the control device 60 in this embodiment at the end of a printing operation. The control device 60 can begin this processing upon detecting the end of a printing operation. For example, the control device 60 begins the processing when the operator 8 presses the production end button. For example, the control device 60 begins the processing when a pre-set production quantity has been completed. For example, the control device 60 begins the processing when switching production models. For example, the control device 60 begins the processing when the solder supply unit 190 (see reference...) Figures 10A to 10J In the event of a replacement operation, the process begins. The solder supply unit 190 is a unit (device) that automatically supplies solder paste 9 onto the screen mask 13. For example, the control device 60 starts the process when the scraper 42 is controlled to rise. For example, the control device 60 starts the process after the scraper 42 stops sliding on the screen mask 13.

[0165] As S101, the control device 60 performs a solder stripping action on the squeegee 42. Details of the solder stripping action will be described later, but the solder stripping action causes at least a portion of the solder paste 9 hanging from the squeegee 42 to adhere (transfer) to the screen mask 13 side. It should be noted that the solder stripping action on the squeegee 42 is performed if printing has been performed before the squeegee is pressed, or it may not be performed if printing has not been performed before the squeegee is pressed. This is because if printing has not been performed before the squeegee is pressed, the solder paste 9 does not hang down from the squeegee 42.

[0166] As S102, the control device 60 causes the scraper 42 to rise.

[0167] As in step S103, the control device 60 releases the movement lock of the cover 210. As a result, the cover 210 can be moved.

[0168] As in S104, the control device 60 drives the cover moving mechanism 220 to move the cover 210 from the retraction position P1 to the blocking position P2.

[0169] As S105, the control device 60 sets the movement lock of the cover 210. As a result, the cover 210 is fixed in the bearing position P2.

[0170] Figure 9This is a flowchart illustrating an example of the processing performed by the control device 60 at the start of a printing operation in this embodiment. The control device 60 initiates this processing upon detecting the start of a printing operation. For example, the control device 60 initiates this processing when the operator 8 presses the production start (or restart) button. For example, the control device 60 initiates this processing when the squeegee 42 has been replaced. For example, the control device 60 initiates this processing when the squeegee 42 is controlled to descend. For example, the control device 60 initiates this processing before the squeegee 42 begins to slide on the screen mask 13.

[0171] As in S201, the control device 60 releases the movement lock of the cover 210. As a result, the cover 210 can be moved.

[0172] As in S202, the control device 60 drives the cover moving mechanism 220, thereby moving the cover 210 from the blocking position P2 to the retraction position P1.

[0173] As S203, the control device 60 sets the movement lock of the cover 210. As a result, the cover 210 is fixed in the retracted position P1.

[0174] As in S204, the control device 60 lowers the squeegee 42 and begins printing. It should be noted that the lowering of the squeegee 42 can be performed when printing has started, and not performed when printing has not started.

[0175] <Details of the scraper and cover operation at the end of the printing job>

[0176] Reference Figures 10A to 10J An example of the action of the scraper 42 and the cover 210 at the end of the printing operation is described in detail. Figures 10A to 10J This diagram illustrates the actions of the scraper 42 and the cover 210 at the end of the printing operation in this embodiment. It should be noted that... Figures 10A to 10J The actions described herein can be controlled by control device 60. Additionally, in Figures 10A to 10J The image shows an example where a solder supply unit 190 is connected to the scraper head 17, but the solder supply unit 190 may not be connected to the scraper head 17.

[0177] First, such as Figure 10A As shown, the front squeegee 42F moves from front to back while scraping the solder paste 9 on the screen mask 13 in a lowered state. It should be noted that the rear squeegee 42R is in a raised state at this time. Thus, the solder paste 9 is printed onto the substrate 2 through the pattern openings provided in the screen mask 13. Then, the front squeegee 42F stops at the printing end position.

[0178] Next, as Figure 10BAs shown, the substrate holding and moving mechanism 12 lowers the substrate 2, which is printed with solder paste 9. As a result, the substrate 2 is peeled off from the screen mask 13.

[0179] Next, as Figure 10C As shown, the substrate holding and moving mechanism 12 moves the substrate 2 onto the delivery conveyor (not shown). Here, when the control device 60 detects that the printing operation has ended, as... Figure 10D As shown, the front scraper 42F rises.

[0180] Next, as Figure 10E as well as Figure 10F As shown, the rear squeegee 42R performs a solder peeling action at a predetermined solder peeling position Q. That is, the rear squeegee 42R, as part of the solder peeling action, temporarily descends at the solder peeling position Q and then rises. The descended rear squeegee 42R may or may not contact the screen mask 13. Furthermore, the descending and rising actions of the rear squeegee 42R based on the solder peeling action can be performed once or multiple times. As a result, at least a portion of the solder paste 9 hanging down from the rear squeegee 42R adheres (transfers) to the screen mask 13 side, and the solder paste 9 shortens as it hangs down from the rear squeegee 42R. It should be noted that the solder peeling position Q can be the same as or near the printing end position of the squeegee 42.

[0181] Next, as Figure 10G As shown, the front scraper 42F moves towards the solder peeling position Q. And, as... Figure 10G as well as Figure 10H As shown, the front scraper 42F performs a solder stripping action at the solder stripping position Q. That is, the front scraper 42F temporarily descends at the solder stripping position Q and then rises as part of the solder stripping action. The descending front scraper 42F may or may not contact the screen mask 13. Furthermore, the descent and descent of the front scraper 42F based on the solder stripping action can be performed once or multiple times. As a result, at least a portion of the solder paste 9 hanging down from the front scraper 42F adheres (transfers) to the screen mask 13 side, and the solder paste 9 shortens as it hangs down from the front scraper 42F.

[0182] It should be noted that, through Figure 10E , Figure 10F , Figure 10G as well as Figure 10H The solder paste 9 adhering to the side of the screen mask 13 during the solder peeling process described herein can be recovered and reused by the solder paste recovery device 71. This reduces the amount of waste solder paste 9 and improves resource utilization efficiency.

[0183] In addition, Figure 10E , Figure 10F , Figure 10G as well as Figure 10H In the solder stripping operation described above, the printing end position is rearward (the side furthest from the operator 8). Therefore, after the rear squeegee 42R performs the solder stripping operation at the solder stripping position Q, the front squeegee 42F moves to the solder stripping position Q and performs the solder stripping operation. This prevents the squeegee head 17, which is moving rearward, from moving forward midway, thus efficiently performing the solder stripping operation of both the rear squeegee 42R and the front squeegee 42F. However, if the printing end position is forward (the side closer to the operator 8), then after the front squeegee 42F performs the solder stripping operation at the solder stripping position Q, the rear squeegee 42R moves to the solder stripping position Q and performs the solder stripping operation. This again prevents the squeegee head 17, which is moving forward, from moving rearward midway, thus efficiently performing the solder stripping operation of both the front squeegee 42F and the rear squeegee 42R. Alternatively, the solder stripping action can be performed simultaneously by both the front scraper 42F and the rear scraper 42R at the end of the printing process. In this case, although there are two solder stripping positions Q, the time required for the solder stripping action can be shortened.

[0184] Next, as Figure 10I As shown, the cover 210 moves from the retracted position P1 to the receiving position P2 while maintaining a horizontal posture. Here, as described above, since the scraper 42 performs a solder stripping action beforehand, the cover 210 moving from the retracted position P1 to the receiving position P2 is prevented from contacting the solder paste 9 hanging down from the scraper 42. Assuming that the solder paste 9 hangs down a considerable distance from the scraper 42 without performing a solder stripping action, in the following situation... Figure 10I When the cover 210 moves from the retracted position P1 to the supporting position P2, the following situation may occur. That is, the cover 210 will cut off the solder paste 9 that hangs down long from the scraper 42, and the cut solder paste 9 will fall onto the screen mask 13 or into the interior of the device.

[0185] Next, as Figure 10J As shown, with the retaining cover 210 in the supporting position P2, the scraper head 17 moves forward (towards the operator 8). During this movement, the solder paste 9 falling from the scraper 42 is blocked by the cover 210 and therefore does not reach the screen mask 13.

[0186] After the scraper head 17 has moved forward, the operator 8 performs the prescribed tasks. For example, the operator 8 supplies solder paste 9 to the solder supply unit 190. For example, the operator 8 changes the screen mask 13. For example, the operator 8 sets up the lower support 32. For example, the operator 8 changes the flat plate 212 of the cover 210. It should be noted that, when changing the flat plate 212 of the cover 210, the operator 8 may move the cover 210 to the retracted position P1. As a result, the position of the cover 210 is closer to the operator 8, making the replacement of the flat plate 212 easier.

[0187] <Variation Example>

[0188] Figure 11 This is a diagram showing the structure of the solder fall prevention mechanism 300 as a modified example in this embodiment. Figure 11 As shown, the solder falling prevention mechanism 300 is a structure that includes a cover 310 and a column 320.

[0189] The cover 310 is fixed to one end of the column 320. The other end of the column 320 is connected to the scraper head 17 via a rotating shaft 311. Thus, the cover 310 and the column 320 can swing about the rotating shaft 321 connected to the scraper head 17.

[0190] The solder fall prevention mechanism 300 can be configured such that when the column 320 is tilted downwards, the cover 310 is in the supporting position P2 (solid line position), and when the column 320 is tilted downwards at an angle, the cover 310 is in the retracted position P1 (dashed line position). Thus, by rotating the column 320, the cover 310 can be moved between the supporting position P2 and the retracted position P1.

[0191] However, in Figure 11 In the case of the structure, since the cover 310 tilts when it is moved to the retracted position P1, the solder paste 9 that falls on the cover 310 may slide off the cover 310.

[0192] In contrast, Figure 3A , Figure 3B The solder fall prevention mechanism 200 shown has the advantage that the solder paste 9 falling on the cover 210 will not slip off the cover 210 because the cover 210 maintains a horizontal posture while it moves to the retracted position P1.

[0193] Additionally, if a solder supply unit 190 is connected to the front of the scraper head 17, Figure 11The structure shown does not allow the retracted position P1 of the cover 310 to be positioned in the front (near the operator 8), so the retracted position P1 of the cover 310 must be positioned in the rear (away from the operator 8). In this case, cleaning the cover 310 in the retracted position P1 becomes difficult for the operator 8.

[0194] In contrast, Figure 3A , Figure 3B Even when the solder fall prevention mechanism 200 shown is connected to the front of the scraper head 17 with the solder supply unit 190, it can still set the retraction position P1 of the cover 210 in front (towards the operator 8). Therefore, when the printing operation is finished, the operator 8 can easily clean the cover 210 by moving the cover 210 to the forward retraction position P1.

[0195] (Summary of the present invention A)

[0196] The printing apparatus 1 of the present invention described above can function as follows.

[0197] (Performance A1)

[0198] The printing apparatus 1 of the present invention for printing solder paste 9 onto a substrate 2 using a mask 13 includes: a squeegee 42 that slides on the mask 13 and prints solder paste 9 onto the substrate 2 through an opening provided in the mask 13; a cover 210 that catches the falling solder paste 9 attached to the squeegee 42; and a control unit 60 that controls the movement of the cover 210 between a retraction position P1, which does not obstruct the sliding of the squeegee 42 on the mask 13, and a catching position P2, which catches the falling solder paste 9 attached to the squeegee 42.

[0199] As a result, the solder paste 9 adhering to the scraper 42 is blocked by the cover 210 located in the retracted position P1, thus preventing the solder paste 9 adhering to the scraper 42 from falling into the mask 13 or the device 1.

[0200] (Performance A2)

[0201] In the above-mentioned manifestation A1, the cover 210 may be configured to include a horizontal flat plate 212 that supports the solder paste 9 falling from the scraper 42, and move between a retraction position P1 and a supporting position P2 while maintaining the horizontal posture of the flat plate 212.

[0202] Therefore, during the movement of the cover 210 between the retracted position P1 and the supporting position P2, the horizontal posture of the cover 210 is maintained, thus preventing the solder paste 9 on the cover 210 from slipping off the cover 210.

[0203] (Performance A3)

[0204] In the above-mentioned manifestation A2, the flat plate 212 of the cover 210 can be installed and removed.

[0205] This allows the flat plate 212 that is holding the solder paste 9 to be replaced, and production can be resumed immediately.

[0206] (Example A4)

[0207] In any of the above manifestations A1 to A3, the control unit 60 may, after stopping the sliding of the scraper 42 on the mask 13, raise the scraper 42 and move the cover 210 from the retraction position P1 to the blocking position P2.

[0208] Therefore, when the printing operation ends (or is interrupted), the cover 210 automatically moves to the support position P2.

[0209] (Example A5)

[0210] In any of the above manifestations A1 to A4, the control unit 60 may move the cover 210 from the supporting position P2 to the retracting position P1 and lower the scraper 42 before the scraper 42 begins to slide on the mask 13.

[0211] Thus, when the printing operation begins (or resumes), the cover 210 automatically moves to the retraction position P1.

[0212] (Example A6)

[0213] In any of the above manifestations A1 to A5, the retreat position P1 may be closer to the operator 8 of the printing device 1 than the blocking position P2.

[0214] As a result, operator 8 can easily clean the cover 210 located in the retreat position P1.

[0215] (Summary of the present invention B)

[0216] Furthermore, the printing apparatus of the present invention described above can function as follows.

[0217] (Performance B1)

[0218] The printing apparatus 1 of the present invention for printing solder paste 9 onto a substrate using a mask 13 includes: a squeegee 42 that slides on the mask 13 and prints solder paste 9 onto the substrate 2 through an opening provided in the mask 13; and a control unit 60 that controls a solder peeling action, which is an action of lowering the squeegee 42, so that at least a portion of the solder paste 9 attached to the squeegee 42 is attached to the mask 13 side.

[0219] Thus, under the action of solder peeling, the solder paste 9 attached to the scraper 42 is attached (transferred) to the mask 13 side, so the solder paste 9 attached to the mask 13 side can be recovered and reused.

[0220] (Performance B2)

[0221] In the above-mentioned manifestation B1, the printing apparatus 1 may further include a cover 210 that supports the falling of solder paste 9 attached to the squeegee 42, and the control unit 60 performs a solder peeling action on the squeegee 42, so that the cover 210 moves from a position that does not obstruct the sliding of the squeegee 42 on the mask 13, i.e., a retraction position P1, to a position that supports the falling of solder paste 9 attached to the squeegee 42, i.e., a supporting position P2.

[0222] As a result, under the action of solder peeling, the solder paste 9 attached to the scraper 42 is attached (transferred) to the mask 13 side, and the solder paste 9 hanging down from the scraper 42 becomes shorter, so that the cover 210 moving from the retraction position P1 to the bearing position P2 can be prevented from contacting the solder paste 9 hanging down from the scraper 42.

[0223] (Performance B3)

[0224] In either of the above manifestations B1 or B2, the control unit 60 may perform the solder stripping action of the squeegee 42 at the printing end position of the squeegee 42.

[0225] Therefore, excess solder paste 9 during printing, along with solder paste 9 adhering to the side of the mask 13 under the action of solder peeling, gathers and accumulates at the end of printing. Thus, the recovery of excess solder paste 9 becomes easy.

[0226] (Performance B4)

[0227] In the above-described embodiment B3, the squeegee 42 may include a first squeegee 42F on the side closer to the operator 8 of the printing device 1 and a second squeegee 42R on the side farther from the operator 8. When the printing end position is on the side closer to the operator 8, after the solder peeling action of the first squeegee 42F is performed at the printing end position, the second squeegee 42R is moved toward the printing end position to perform the solder peeling action of the second squeegee 42R.

[0228] Thus, the first scraper 42F and the second scraper 42R can be efficiently stripped of solder while the scraper 42 is moved toward the operator 8.

[0229] (Performance B5)

[0230] In the above-described embodiment B3, the squeegee 42 may include a first squeegee 42F on the side closer to the operator 8 of the printing device 1 and a second squeegee 42R on the side farther from the operator 8. When the printing end position is on the side farther from the operator 8, after the solder peeling action of the second squeegee 42R is performed at the printing end position, the first squeegee 42F is moved towards the printing end position to perform the solder peeling action of the first squeegee 42F.

[0231] Thus, the second scraper 42R and the first scraper 42F can be efficiently stripped of solder while the scraper 42 is moved away from the operator 8.

[0232] The embodiments have been described above with reference to the accompanying drawings, but the present invention is not limited to the examples described above. Those skilled in the art will obviously be able to conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the technical solutions described, and understand that these contents naturally also fall within the technical scope of the present invention. Furthermore, the constituent elements of the above embodiments can be arbitrarily combined without departing from the spirit of the invention.

[0233] It should be noted that this application is based on Japanese patent application (Japanese Patent Application No. 2020-175458) filed on October 19, 2020, the contents of which are incorporated herein by reference.

[0234] Industrial applicability

[0235] The technology of this invention is useful in solder printing apparatus.

Claims

1. A printing apparatus for printing solder paste onto a substrate using a mask, wherein, The printing apparatus includes: A scraper slides on the mask and prints the solder paste onto the substrate through an opening in the mask; The cover, which prevents the solder paste adhering to the scraper from falling; The control unit controls the movement of the cover between a retracted position and a blocking position, wherein the retracted position is a position that does not obstruct the sliding of the scraper on the mask, and the blocking position is a position that blocks the falling solder paste attached to the scraper. as well as A solder paste recovery device that recovers the solder paste from the mask. The retraction position is between the bearing position and the solder paste recovery device.

2. The printing apparatus according to claim 1, wherein, The cover is configured to include a horizontal planar plate that catches the solder paste falling from the scraper, and the cover moves between the retracted position and the catching position while maintaining the horizontal orientation of the planar plate.

3. The printing apparatus according to claim 2, wherein, The flat panel of the cover can be installed or removed.

4. The printing apparatus according to any one of claims 1 to 3, wherein, After the control unit stops the scraper from sliding on the mask, it raises the scraper and moves the cover from the retracted position to the blocking position.

5. The printing apparatus according to any one of claims 1 to 3, wherein, Before the scraper begins to slide on the mask, the control unit moves the cover from the supporting position to the retracting position and lowers the scraper.

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