Resistance paste as well as preparation method and application thereof

Abstract

The invention provides a resistance paste and a preparation method and application thereof, and relates to the technical field of electronic pastes.The resistance paste comprises a conductive phase, a glass binding phase and an organic carrier, and the conductive phase is La < 1-x > BaxCo < 1-y > CuyO3; wherein x is the atomic percent of Ba atoms accounting for the total number of La and Ba, y is the atomic percent of Cu atoms accounting for the total number of Cu and Co, x is larger than or equal to 0.4 and smaller than or equal to 0.6, and y is larger than or equal to 0.1 and smaller than or equal to 0.4. The resistance paste provided by the invention adopts the perovskite type conductive ceramic material La1-xBaxCo1-yCuyO3 (x is greater than or equal to 0.4 and less than or equal to 0.6, and y is greater than or equal to 0.1 and less than or equal to 0.4) as a conductive phase, so that on the premise of ensuring the electrical property of the resistance paste, the raw material cost and the synthesis difficulty are remarkably reduced, the preparation process flow is simplified, and the repeatability and batch consistency of products are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of electronic paste technology, and in particular to a resistive paste, its preparation method, and its application. Background Technology

[0002] Low-temperature co-fired ceramic (LTCC) technology has been widely used in RF modules, multi-chip components, and microwave devices due to its outstanding advantages such as high integration density, excellent high-frequency characteristics, and superior thermal stability. This technology achieves high-precision circuit wiring on multilayer ceramic green sheets through screen printing of thick-film pastes, thereby constructing a three-dimensional interconnect structure. LTCC thick-film paste systems mainly include two categories: conductive pastes and resistive pastes. Resistive pastes typically use ruthenium-based oxides (such as RuO2 or its derived ruthenates) as the conductive phase. However, because ruthenium is a precious metal, the raw material is expensive, directly leading to a significant increase in the preparation cost of ruthenium-based resistive pastes. Furthermore, to meet the high-performance requirements of LTCC devices, ruthenium-based resistive materials must possess a strict sheet resistance range, low temperature coefficient of resistance, and high stability, which places high demands on the material synthesis process and microstructure control. The preparation process is complex, and the repeatability and consistency between different batches of products are difficult to guarantee. Summary of the Invention

[0003] This invention provides a resistive paste, its preparation method, and its application, which solves the defects of existing resistive pastes that use ruthenium oxide as the conductive phase, such as high cost, high requirements for synthesis process and microstructure control, complex preparation process, and difficulty in ensuring product repeatability and consistency. While ensuring the electrical performance of the resistive paste, it significantly reduces the cost of raw materials and the difficulty of synthesis, simplifies the preparation process, and effectively improves the repeatability and batch consistency of the product.

[0004] In a first aspect, the present invention provides a resistive paste comprising a conductive phase, a glass binder phase, and an organic carrier, wherein the conductive phase is La. 1-x Ba x Co 1-y Cu y O3; Where x is the atomic percentage of Ba atoms in the total number of La and Ba atoms, y is the atomic percentage of Cu atoms in the total number of Cu and Co atoms, and 0.4≤x≤0.6, 0.1≤y≤0.4.

[0005] The conductive phase La of this invention 1-x Ba x Co 1-y Cu yO3, where 0.4≤x≤0.6, 0.1≤y≤0.4; x can be, for example, 0.4, 0.45, 0.5, 0.55, 0.6, but is not limited to the listed values, and other unlisted values ​​within the range also apply; y can be, for example, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, but is not limited to the listed values, and other unlisted values ​​within the range also apply.

[0006] This invention provides a resistive paste using the perovskite-type conductive ceramic material La. 1-x Ba x Co 1-y Cu y O3 (0.4≤x≤0.6, 0.1≤y≤0.4) is used as the conductive phase. Compared with traditional precious metal (such as ruthenium, palladium, silver, etc.) based resistive pastes, this conductive phase contains no precious metal components at all, significantly reducing raw material costs and avoiding the impact of precious metal price fluctuations on production costs. Furthermore, La... 1-x Ba x Co 1-y Cu y The synthesis route of O3 (0.4≤x≤0.6, 0.1≤y≤0.4) is simple, the process conditions are relaxed, and the reproducibility is good, which further reduces the overall preparation cost, thus providing a cost-effective alternative for LTCC resistor paste.

[0007] In some embodiments, the glass binder phase is lead-containing glass; Preferably, the raw materials for preparing the lead-containing glass, by weight, include 55-75 parts lead tetroxide, 15-25 parts silicon dioxide, 1-7 parts aluminum oxide, and 3-15 parts boron oxide; the weight percentages of lead tetroxide in this embodiment can be, for example, 55, 58, 60, 63, 65, 67, 70, 72, or 75 parts, but are not limited to the listed values, and other unlisted values ​​within the range are also applicable; the weight percentages of silicon dioxide can be, for example, 15, 18, ... 20 parts, 23 parts, 25 parts, but not limited to the listed values, and other unlisted values ​​within the range also apply; the mass fractions of alumina can be, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, but not limited to the listed values, and other unlisted values ​​within the range also apply; the mass fractions of boron oxide can be, for example, 3 parts, 5 parts, 7 parts, 10 parts, 12 parts, 15 parts, but not limited to the listed values, and other unlisted values ​​within the range also apply.

[0008] This scheme selects low-melting-point lead-containing glass as the binder phase. This glass system exhibits good thermodynamic compatibility during sintering and has suitable viscosity-temperature characteristics within the sintering temperature range. It can effectively wet and encapsulate conductive phase particles, and achieve uniform dragging and rearrangement of the conductive phase through capillary action and viscous flow, promoting the formation of a continuous, dense and microstructured resistive film layer after sintering.

[0009] In some embodiments, the median particle size D of the conductive phase 50 The value is 1μm to 1.5μm, for example, it can be 1μm, 1.1μm, 1.2μm, 1.3μm, 1.4μm, 1.5μm, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0010] This scheme controls the median particle size D of the conductive phase. 50 The conductive phase particles, with a diameter of 1μm to 1.5μm, help improve the electrical stability of the paste and avoid excessively high surface roughness after sintering, thereby improving the quality of the paste in the sintered film. At the same time, it can also avoid excessively high viscosity and poor leveling caused by excessively small conductive phase particle size, thus ensuring that the paste has good printing performance.

[0011] In some embodiments, the median particle size D of the glass binder phase 50 The value ranges from 0.6μm to 1.5μm, for example, it can be 0.6μm, 0.7μm, 0.8μm, 0.9μm, 1.0μm, 1.1μm, 1.2μm, 1.3μm, 1.4μm, or 1.5μm, but is not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0012] This scheme controls the median particle size D of the glass binder phase. 50 The submicron-sized glass binder phase, ranging from 0.6μm to 1.5μm, helps to lower the sintering temperature and improve the fluidity of the glass phase, thereby achieving more complete sintering during co-firing. At the same time, it can avoid over-sintering and poor printability caused by excessively small glass binder phase particle size, thus ensuring the stability and batch consistency of the resistor.

[0013] In some embodiments, the resistive paste comprises, by weight parts, 50-70 parts of a conductive phase, for example, 50, 55, 60, 65, or 70 parts, but not limited to the listed values; other unlisted values ​​within the range are also applicable; 5-15 parts of a glass binder phase, for example, 5, 7, 10, 12, or 15 parts, but not limited to the listed values; other unlisted values ​​within the range are also applicable; and 20-40 parts of an organic carrier, for example, 20, 25, 30, 35, or 40 parts, but not limited to the listed values; other unlisted values ​​within the range are also applicable. The organic carrier comprises 5% to 25% resin by weight, for example, 5%, 10%, 15%, 20%, 25%, but not limited to the listed values. Other unlisted values ​​within the range are also applicable.

[0014] This method enables the paste to have good printing performance by controlling the ratio of inorganic powder (conductive phase and glass binder phase) and organic carrier, as well as the resin content in the organic carrier.

[0015] In some embodiments, the resin is ethyl cellulose.

[0016] In some embodiments, the organic carrier further comprises 70% to 92% solvent and 3% to 5% additives by weight percentage.

[0017] In some embodiments, the solvent is selected from one or more of terpineol, butyl carbitol, and butyl carbitol acetate.

[0018] In some embodiments, the adjuvant is selected from one or more of hydrogenated castor oil, polyamide wax, stearic acid, and palmitic acid.

[0019] In some embodiments, the additive is selected from one or more of hydrogenated castor oil and polyamide wax.

[0020] In some embodiments, the conductive phase is prepared by the following method: S1. Lanthanum oxide, barium carbonate, cobalt trioxide, and copper oxide are mixed according to La... 1-x Ba x Co 1-y Cu y The mixture of O3 (0.4≤x≤0.6, 0.1≤y≤0.4) in stoichiometric proportions is wet-milled, dried, and pressed into a green body. S2. The blank is sintered at 1200℃~1300℃ to obtain the conductive phase.

[0021] In some embodiments, the glass binder phase is prepared by the following method: Lead tetroxide, silicon oxide, aluminum oxide and boron oxide are mixed in a certain proportion and melted at 1300℃~1400℃ to obtain the glass binder phase.

[0022] In some embodiments, the resistive paste comprises a conductive phase, a glass binder phase, and an organic carrier, characterized in that the conductive phase is La. 1-x Ba x Co 1-y Cu y O3; Where x is the atomic percentage of Ba atoms in the total number of La and Ba atoms, y is the atomic percentage of Cu atoms in the total number of Cu and Co atoms, and 0.4≤x≤0.6, 0.1≤y≤0.4; The glass bonding phase is lead-containing glass; Preferably, the raw materials for preparing the lead-containing glass, by mass parts, include 55-75 parts lead tetroxide, 15-25 parts silicon oxide, 1-7 parts aluminum oxide, and 3-15 parts boron oxide.

[0023] In some embodiments, the resistive paste comprises, by weight parts, 50-70 parts of a conductive phase, 5-15 parts of a glass binder phase, and 20-40 parts of an organic carrier, wherein the conductive phase is La. 1-x Ba x Co 1-y Cu y O3; Where x is the atomic percentage of Ba atoms in the total number of La and Ba atoms, y is the atomic percentage of Cu atoms in the total number of Cu and Co atoms, and 0.4≤x≤0.6, 0.1≤y≤0.4; The glass bonding phase is lead-containing glass; The raw materials for preparing the lead-containing glass, by mass parts, include 55-75 parts lead tetroxide, 15-25 parts silicon oxide, 1-7 parts aluminum oxide and 3-15 parts boron oxide; The median particle size D of the conductive phase 50 The thickness ranges from 1 μm to 1.5 μm. The median particle size D of the glass binder phase 50 The range is 0.6μm to 1.5μm.

[0024] A second aspect of the present invention provides a method for preparing a resistive paste as described in the first aspect, comprising the following steps: (1) According to the proportion, La 1-x Ba x Co 1-y Cu yO3 (0.4≤x≤0.6, 0.1≤y≤0.4) and a glass binder phase were mixed and ball-milled to obtain an inorganic mixture; (2) The organic carrier is prepared by mixing the solvent, resin and additives in proportion and heating. (3) The inorganic mixture and the organic carrier are homogenized and finely dispersed according to the proportion to obtain the resistive slurry.

[0025] A third aspect of the invention provides the application of the resistive paste as described in the first aspect in the preparation of low-temperature co-fired ceramics.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: The resistive paste provided by this invention uses the perovskite-type conductive ceramic material La. 1-x Ba x Co 1-y Cu y O3 (0.4≤x≤0.6, 0.1≤y≤0.4) as a conductive phase significantly reduces raw material costs and synthesis difficulty while ensuring the electrical properties of the resistive slurry. It also simplifies the preparation process and effectively improves the repeatability and batch consistency of the product. This overcomes the technical defects of traditional ruthenium-based oxide conductive phases, such as high cost, strict process control, complex preparation, and poor consistency. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] The following examples are for illustrative purposes only and are not intended to limit the scope of the invention. Where specific techniques or conditions are not specified in the examples, they should be performed according to the techniques or conditions described in the literature in this field, or according to the product instructions. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased from legitimate channels.

[0029] In this invention, the technical features described in an open-ended manner include both closed-ended technical solutions composed of the listed features and open-ended technical solutions that include the listed features.

[0030] In this invention, numerical ranges are involved. Unless otherwise specified, the numerical ranges are considered continuous and include the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe features or characteristics, the ranges may be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0031] Unless otherwise specified, the term "purity" in this invention refers to mass fraction.

[0032] Example 1 This embodiment provides a resistive paste, which, by weight, comprises 50 parts of a conductive phase, 10 parts of a glass binder phase, and 40 parts of an organic carrier. The conductive phase is La. 0.5 Ba 0.5 Co 0.9 Cu 0.1 O3; The glass binder phase is lead-containing glass. By mass, the raw materials for preparing the lead-containing glass include 60 parts lead tetroxide, 20 parts silicon oxide, 4 parts aluminum oxide and 14 parts boron oxide. By mass, the organic carrier comprises 80 parts solvent, 15 parts resin and 5 parts additives. The solvent is terpineol and butyl carbitol, and the mass ratio of terpineol and butyl carbitol is 1:1. The resin is ethyl cellulose and the additives are polyamide wax.

[0033] The method for preparing the resistive paste provided in this embodiment includes the following steps: (1) The conductive phase is La 0.5 Ba 0.5 Co 0.9 Cu 0.1 Preparation of O3: Lanthanum oxide (purity ≥99%), barium carbonate (purity ≥99%), and cobalt trioxide (purity ≥99%) are mixed according to the La... 0.5 Ba 0.5 Co 0.9 Cu 0.1 O3 was stoichiometrically mixed and placed in a ball mill jar. Using zirconia balls as the grinding medium, it was wet-milled for 8 hours using a planetary mill at a ball:water:powder mass ratio of 5:1:1. After milling, it was dried in a 100℃ oven for 6 hours. A 5 wt% polyvinyl alcohol aqueous solution was added to the dried mixture as a binder for granulation. After granulation, the mixture was pressed into block blanks using a milling tool. The blanks were sintered in air at 1200℃ for 3 hours. Finally, the sintered body was broken up, ball-milled again for 8 hours, and dried to obtain the conductive phase La.0.5 Ba 0.5 Co 0.9 Cu 0.1 O3 (median particle size D) 50 (1.1 μm).

[0034] (2) Preparation of the glass binder phase: 60 parts by mass of lead tetroxide, 20 parts by mass of silicon oxide, 4 parts by mass of aluminum oxide and 14 parts by mass of boron oxide were mixed and placed in a platinum crucible. After being melted uniformly at 1300℃, the mixture was quenched, ground using a planetary ball mill, and dried in an oven at 80℃ to constant weight to obtain the glass binder phase (median particle size D). 50 (0.9μm).

[0035] (3) Preparation of organic carrier: Weigh 40 parts of terpineol, 40 parts of butyl carbitol, 15 parts of ethyl cellulose and 5 parts of polyamide wax by mass and place them in a 90℃ water bath. Stir until completely dissolved and then cool for later use.

[0036] (4) Preparation of resistive paste: According to the mass fraction, 50 parts of La 0.5 Ba 0.5 Co 0.9 Cu 0.1 O3 particles and 10 parts of glass binder phase were placed in a ball mill jar and ball-milled to obtain an inorganic mixture. The inorganic mixture and 40 parts of organic carrier were then placed in a homogenizer for homogenization for 5 minutes at a speed of 900 r / m. The homogenized mixture was then rolled uniformly using a three-roll mill to obtain the resistive slurry.

[0037] Example 2 This embodiment provides a resistive paste, which, by weight, comprises 65 parts of a conductive phase, 15 parts of a glass binder phase, and 20 parts of an organic carrier. The conductive phase is La. 0.4 Ba 0.6 Co 0.8 Cu 0.2 O3; The glass binder phase is lead-containing glass. By mass, the raw materials for preparing the lead-containing glass include 70 parts lead tetroxide, 25 parts silicon oxide, 2 parts aluminum oxide, and 3 parts boron oxide. By mass, the organic carrier comprises 92 parts solvent, 5 parts resin and 3 parts additives. The solvent is terpineol and butyl carbitol acetate, and the mass ratio of terpineol to butyl carbitol acetate is 45:47. The resin is ethyl cellulose and the additives are hydrogenated castor oil.

[0038] The method for preparing the resistive paste provided in this embodiment includes the following steps: (1) The conductive phase is La 0.4 Ba0.6 Co 0.8 Cu 0.2 Preparation of O3: Lanthanum oxide (purity ≥99%), barium carbonate (purity ≥99%), and cobalt trioxide (purity ≥99%) are mixed according to the La... 0.4 Ba 0.6 Co 0.8 Cu 0.2 O3 was stoichiometrically mixed and placed in a ball mill jar. Using zirconia balls as the grinding medium, it was wet-milled for 8 hours using a planetary mill at a ball:water:powder mass ratio of 5:1:1. After milling, it was dried in a 100℃ oven for 6 hours. A 5wt% polyvinyl alcohol aqueous solution was added to the dried mixture as a binder for granulation. After granulation, the mixture was pressed into block blanks using a milling tool. The blanks were sintered in air at 1200℃ for 3 hours. Finally, the sintered body was broken up, ball-milled again for 8 hours, and dried to obtain the conductive phase La. 0.4 Ba 0.6 Co 0.8 Cu 0.2 O3 (median particle size D) 50 (1.2 μm).

[0039] (2) Preparation of the glass binder phase: 70 parts by mass of lead tetroxide, 25 parts by mass of silicon oxide, 2 parts by mass of aluminum oxide and 3 parts by mass of boron oxide were mixed and placed in a platinum crucible. After being melted uniformly at 1300℃, the mixture was quenched, ground using a planetary ball mill, and dried in an oven at 80℃ to constant weight to obtain the glass binder phase (median particle size D). 50 (1.0μm).

[0040] (3) Preparation of organic carrier: Weigh 45 parts of terpineol, 47 parts of butyl carbitol acetate, 5 parts of ethyl cellulose and 3 parts of hydrogenated castor oil by mass and place them in a 90°C water bath. Stir until completely dissolved and then cool for later use.

[0041] (4) Preparation of resistive paste: According to the mass fraction, 65 parts of La 0.4 Ba 0.6 Co 0.8 Cu 0.2 O3 particles and 15 parts of glass binder phase were placed in a ball mill jar and ball-milled to obtain an inorganic mixture. The inorganic mixture and 20 parts of organic carrier were then placed in a homogenizer for homogenization for 5 minutes at a speed of 900 r / m. The homogenized mixture was then rolled uniformly using a three-roll mill to obtain the resistive slurry.

[0042] Example 3 This embodiment provides a resistive paste, which, by weight, comprises 70 parts of a conductive phase, 7 parts of a glass binder phase, and 33 parts of an organic carrier. The conductive phase is La.0.5 Ba 0.5 Co 0.7 Cu 0.3 O3; The glass binder phase is lead-containing glass. By mass, the raw materials for preparing the lead-containing glass include 65 parts lead tetroxide, 15 parts silicon oxide, 7 parts aluminum oxide, and 13 parts boron oxide. By mass, the organic carrier comprises 76 parts solvent, 20 parts resin, and 4 parts additives. The solvent is terpineol, butyl carbitol, and butyl carbitol acetate, and the mass ratio of terpineol, butyl carbitol, and butyl carbitol acetate is 36:20:20. The resin is ethyl cellulose, and the additives are prepared by mixing polyamide wax and hydrogenated castor oil in a mass ratio of 1:1.

[0043] The method for preparing the resistive paste provided in this embodiment includes the following steps: (1) The conductive phase is La 0.5 Ba 0.5 Co 0.7 Cu 0.3 Preparation of O3: Lanthanum oxide (purity ≥99%), barium carbonate (purity ≥99%), and cobalt trioxide (purity ≥99%) are mixed according to the La... 0.5 Ba 0.5 Co 0.7 Cu 0.3 O3 was stoichiometrically mixed and placed in a ball mill jar. Using zirconia balls as the grinding medium, it was wet-milled for 8 hours using a planetary mill at a ball:water:powder mass ratio of 5:1:1. After milling, it was dried in a 100℃ oven for 6 hours. A 5wt% polyvinyl alcohol aqueous solution was added to the dried mixture as a binder for granulation. After granulation, the mixture was pressed into block blanks using a milling tool. The blanks were sintered in air at 1200℃ for 3 hours. Finally, the sintered body was broken up, ball-milled again for 8 hours, and dried to obtain the conductive phase La. 0.5 Ba 0.5 Co 0.7 Cu 0.3 O3 (median particle size D) 50 (1.1 μm).

[0044] (2) Preparation of the glass binder phase: 65 parts by mass of lead tetroxide, 15 parts by mass of silicon oxide, 7 parts by mass of aluminum oxide and 13 parts by mass of boron oxide were mixed and placed in a platinum crucible. After being melted uniformly at 1300℃, the mixture was quenched, ground using a planetary ball mill, and dried in an oven at 80℃ to constant weight to obtain the glass binder phase (median particle size D). 50 (0.9μm).

[0045] (3) Preparation of organic carrier: Weigh 36 parts of terpineol, 20 parts of butyl carbitol, 20 parts of butyl carbitol acetate, 20 parts of ethyl cellulose, 2 parts of polyamide wax and 2 parts of hydrogenated castor oil by mass and place them in a 90℃ water bath. Stir until completely dissolved and then cool for later use.

[0046] (4) Preparation of resistive paste: According to the mass fraction, 70 parts of La 0.5 Ba 0.5 Co 0.7 Cu 0.3 O3 particles and 7 parts of glass binder phase were placed in a ball mill jar and ball-milled to obtain an inorganic mixture. The inorganic mixture and 33 parts of organic carrier were then placed in a homogenizer for homogenization for 5 minutes at a speed of 900 r / m. The homogenized mixture was then rolled uniformly using a three-roll mill to obtain the resistive slurry.

[0047] Performance testing Resistance paste testing: Silver paste was printed onto the substrate using a printer. The substrate was placed on a horizontal platform at room temperature for 10 minutes, then dried in a 120°C oven for 10 minutes. The resistance paste was then printed onto the center of the silver paste terminals, placed on a horizontal platform at room temperature for 10 minutes, and dried in a 120°C oven for 10 minutes. The thickness of the resistance paste was measured using a protractor. The substrates with the resistance paste were then stacked, hot-pressed, and sintered. The resistance value was measured using a multimeter.

[0048] The performance test results of the resistive pastes prepared in the above embodiments are shown in Table 1 below: Table 1

[0049] As shown in Table 1, the resistive paste of the present invention has good leveling and printing adaptability, and the dry film thickness after printing is suitable and the resistance value is stable, which can meet the requirements for use of LTCC resistive paste.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A resistive paste, comprising a conductive phase, a glass binder phase, and an organic carrier, characterized in that, The conductive phase is La. 1-x Ba x Co 1-y Cu y O3; Where x is the atomic percentage of Ba atoms in the total number of La and Ba atoms, y is the atomic percentage of Cu atoms in the total number of Cu and Co atoms, and 0.4≤x≤0.6, 0.1≤y≤0.

4.

2. The resistive paste according to claim 1, characterized in that, The glass bonding phase is lead-containing glass; Preferably, the raw materials for preparing the lead-containing glass, by mass parts, include 55-75 parts lead tetroxide, 15-25 parts silicon oxide, 1-7 parts aluminum oxide, and 3-15 parts boron oxide.

3. The resistive paste according to claim 1 or 2, characterized in that, The median particle size D of the conductive phase 50 The size ranges from 1μm to 1.5μm.

4. The resistive paste according to any one of claims 1 to 3, characterized in that, The median particle size D of the glass binder phase 50 The range is 0.6μm to 1.5μm.

5. The resistive paste according to any one of claims 1 to 4, characterized in that, The resistive paste comprises, by weight, 50-70 parts of conductive phase, 5-15 parts of glass binder phase, and 20-40 parts of organic carrier.

6. The resistive paste according to any one of claims 1 to 5, characterized in that, The organic carrier comprises 5% to 25% resin by weight percentage.

7. The resistive paste according to any one of claims 6, characterized in that, The resin is ethyl cellulose.

8. The resistive paste according to any one of claims 1 to 6, characterized in that, The conductive phase is prepared by the following method: S1. Lanthanum oxide, barium carbonate, cobalt trioxide, and copper oxide are mixed according to La... 1-x Ba x Co 1-y Cu y The mixture of O3 (0.4≤x≤0.6, 0.1≤y≤0.4) in stoichiometric proportions was wet-milled, dried, and pressed into a green body. S2. The blank is sintered at 1200℃~1300℃ to obtain the conductive phase.

9. A method for preparing the resistive paste according to any one of claims 1 to 8, characterized in that, Includes the following steps: (1) According to the proportion, La 1-x Ba x Co 1-y Cu y O3 (0.4≤x≤0.6, 0.1≤y≤0.4) and a glass binder phase were mixed and ball-milled to obtain an inorganic mixture; (2) The organic carrier is prepared by mixing the solvent, resin and additives in proportion and heating. (3) The inorganic mixture and the organic carrier are homogenized and finely dispersed according to the proportion to obtain the resistive slurry.

10. The use of the resistive paste according to any one of claims 1 to 8 in the preparation of low-temperature co-fired ceramics.

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