Honeycomb heat dissipation structure and AR glasses

Abstract

The invention discloses a honeycomb heat dissipation structure and AR glasses, and belongs to the technical field of electronic equipment heat management. The heat dissipation structure comprises a thermal function substrate; the bionic multi-stage honeycomb array is arranged in the thermal function substrate, and the bionic multi-stage honeycomb array comprises at least one main channel and a plurality of secondary honeycomb units extending out of the wall surface of the main channel; the cooling working medium is a phase change microcapsule suspension filled in the microfluid channel network; at least one micropump in communication with the network of microfluidic channels; the plurality of ventilation micropores are formed in the outer wall surface of the secondary honeycomb unit; and the micro valve is arranged at the ventilation micro hole, is made of a thermally-induced deformation material and is configured to be automatically opened and closed in response to temperature change. Through deep fusion of the bionic honeycomb structure and the improved bee colony algorithm, collaborative optimization of heat dissipation, temperature control and low-power-consumption operation is realized, and the long-time operation stability of the AR glasses and the wearing comfort of a user are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology for electronic devices, specifically to a honeycomb heat dissipation structure and AR glasses. Background Technology

[0002] With the rapid development of augmented reality (AR) technology, AR glasses are evolving towards thinner, lighter, and higher-performance devices. However, this trend has led to a sharp increase in the internal heat flux density of the devices, and heat dissipation has become a key technical bottleneck restricting the improvement of AR glasses performance and user experience.

[0003] Currently, AR glasses mainly use the following heat dissipation solutions: Passive cooling solutions include graphene thermal conductive films, metal thermal pads, or vapor chambers. While these solutions are simple in structure and consume no power, their heat dissipation capacity is limited. Under high load conditions, they are prone to thermal saturation and cannot meet the cooling requirements of high-performance processors.

[0004] Active cooling solutions, such as miniature fans, offer improved heat dissipation but suffer from issues like noise, increased power consumption, and space consumption, contradicting the quiet and long-lasting battery life sought by AR glasses.

[0005] In recent years, bionics has shown great potential in the field of heat dissipation. In particular, honeycomb structures have attracted widespread attention in the field of heat dissipation due to their high specific surface area, excellent structural strength, and efficient space utilization.

[0006] In terms of control algorithms, the artificial bee colony algorithm, as an emerging swarm intelligence optimization algorithm, has advantages such as fewer parameters, fast convergence, and strong global search capability.

[0007] However, current technologies lack a dedicated thermal solution for AR glasses that combines an optimized biomimetic honeycomb heat dissipation structure with an improved artificial bee colony algorithm. In particular, there is a lack of a comprehensive thermal management solution that can simultaneously address the unique challenges of AR glasses, such as their extremely compact size, strictly limited power consumption, and drastic thermal dynamic changes.

[0008] To address the aforementioned issues, there is an urgent need for a honeycomb heat dissipation structure and AR glasses to solve the problems associated with traditional methods. Summary of the Invention

[0009] The purpose of this invention is to provide a honeycomb heat dissipation structure and AR glasses for a new energy power generation base with hydro-solar-storage capability to cope with extreme scenarios. Through the deep integration of biomimetic honeycomb structure and improved swarm algorithm, heat dissipation, temperature control and low power consumption operation are synergistically optimized, which significantly improves the long-term operation stability of AR glasses and the user's wearing comfort.

[0010] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A honeycomb heat dissipation structure, comprising: Thermal functional substrate; A biomimetic multi-level honeycomb array is disposed inside a thermal functional substrate. The biomimetic multi-level honeycomb array includes at least one main channel and multiple secondary honeycomb units extending from the wall of the main channel. The main channel and the secondary honeycomb units together constitute a three-dimensional microfluidic channel network. The cooling medium is a phase change microcapsule suspension filled within the microfluidic channel network; At least one micropump, connected to the microfluidic channel network, is used to drive the circulation of the cooling medium; Multiple breathable micropores are formed on the outer wall surface of the secondary honeycomb unit; The micro-valve, made of thermodeformable material, is located at the ventilated micropores and is configured to open and close automatically in response to temperature changes.

[0011] Furthermore, the thermal functional substrate is a phonon crystal thermal metamaterial with a normal thermal conductivity K. z With the average in-plane thermal conductivity K xy Satisfy: K z >2×K xy .

[0012] The biomimetic multi-level honeycomb array and the thermal functional substrate are integrally formed using metal additive manufacturing technology.

[0013] The present invention also provides AR glasses, which have the above-mentioned honeycomb heat dissipation structure internally, including: a frame, temples, a main processor, a power management chip, a display module, and a temperature sensor. The main processor and the power management chip are respectively disposed inside the left and right temples. The display module is disposed on the front of the frame. The left temple has a first thermal interface material and a first honeycomb heat dissipation structure disposed inside, and a first thermal functional substrate of the first honeycomb heat dissipation structure is connected to the first thermal interface material. The first thermal interface material is connected to the heat source of the main processor. The right temple has a second thermal interface material and a second honeycomb heat dissipation structure disposed inside, and a second thermal functional substrate of the second honeycomb heat dissipation structure is connected to the second thermal interface material. The second thermal interface material is connected to the heat source of the power management chip. The frame has a third thermal interface material and a third honeycomb heat dissipation structure disposed inside, and a third thermal functional substrate of the third honeycomb heat dissipation structure is connected to the third thermal interface material. The third thermal interface material is connected to the heat source of the display module.

[0014] Furthermore, the temperature sensor includes at least a first temperature sensor, a second temperature sensor, and a third temperature sensor, and the first temperature sensor, the second temperature sensor, and the third temperature sensor are respectively disposed on the periphery of the main processor, the power management chip, and the display module.

[0015] Furthermore, an intelligent control unit is installed inside the frame. The main processor, power management chip, display module, first honeycomb heat dissipation structure, second honeycomb heat dissipation structure, third honeycomb heat dissipation structure, first temperature sensor, second temperature sensor, and third temperature sensor are connected to the intelligent control unit. The intelligent control unit is configured to run an improved artificial bee colony algorithm. It uses the readings of multiple temperature sensors and system load information as inputs, and the speed of the micro pump and the operating frequency of the main processor as decision variables to perform real-time optimization calculations and output control signals.

[0016] Furthermore, the first thermal interface material and the second thermal interface material are thermally conductive silicone grease, thermally conductive gel, or phase change thermal pads.

[0017] Furthermore, the improved artificial bee colony algorithm is as follows: In the neighborhood search strategy of the hired bees in the traditional artificial bee colony algorithm, a learning factor is introduced for both the best individual in the current population and a random individual. Incorporate a penalty mechanism for system output overshoot into the objective function of the traditional artificial bee colony algorithm.

[0018] In summary, the present invention has at least one of the following beneficial technical effects: 1. Superior heat dissipation performance: Through the biomimetic multi-level honeycomb array design, a huge heat exchange area is achieved in a limited space; combined with the use of phase change microcapsule suspension, it takes advantage of the efficient convective heat transfer of liquid cooling and the huge latent heat storage of phase change materials, and the heat dissipation capacity far exceeds that of traditional graphene or vapor chamber solutions.

[0019] 2. Intelligent temperature control quality: An improved artificial bee colony algorithm is used for intelligent control. By introducing a dual learning factor in the neighborhood search of the hired bees, the convergence speed and global search capability of the algorithm are significantly improved. At the same time, an overshoot penalty term is added to the objective function to ensure that the temperature control process is fast, accurate and without overshoot, effectively avoiding the discomfort caused by sudden temperature changes.

[0020] 3. High-efficiency energy utilization: The system can dynamically optimize the micro-pump speed and processor frequency according to real-time temperature and load conditions, so as to minimize system power consumption and extend the battery life of AR glasses while ensuring heat dissipation.

[0021] 4. Excellent spatial adaptability: The honeycomb heat dissipation structure can be integrally formed through metal additive manufacturing technology, which can be flexibly customized according to the internal space of AR glasses, achieving a high degree of integration with the temples, frames and other structures, resulting in extremely high space utilization.

[0022] 5. Enhanced environmental adaptability: The thermotropic adaptive microporous valves installed on the walls of the honeycomb units can close to prevent dust at low temperatures and open to enhance heat dissipation at high temperatures, enabling the system to have self-regulation capabilities and adapt to different operating environments.

[0023] 6. Enhanced user experience: The directional thermal conductivity of the phonon crystal thermal metamaterial substrate effectively suppresses the diffusion of heat to the skin contact area. Combined with precise temperature control, it ensures comfort during long-term wear, while the fanless design provides a quiet user experience. Attached Figure Description

[0024] Figure 1 A schematic diagram illustrating the improved artificial bee colony algorithm; Figure 2 This is a schematic diagram of the AR glasses structure; Figure 3 This is a schematic diagram of a honeycomb heat dissipation structure.

[0025] Reference numerals: 1. Frame; 2. Temple; 3. Display module; 4. Thermal substrate; 5. Main channel; 6. Secondary honeycomb unit. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0027] like Figure 3 As shown, the present invention provides a honeycomb heat dissipation structure, comprising: Thermal functional substrate 4; A biomimetic multi-level honeycomb array is disposed inside the thermal functional substrate 4. The biomimetic multi-level honeycomb array includes at least one main channel 5 and multiple secondary honeycomb units 6 extending from the wall of the main channel 5. The main channel 5 and the secondary honeycomb units 6 together constitute a three-dimensional microfluidic channel network. The cooling medium is a phase change microcapsule suspension filled within the microfluidic channel network; At least one micropump, connected to the microfluidic channel network, is used to drive the circulation of the cooling medium; Multiple breathable micropores are formed on the outer wall surface of the secondary honeycomb unit 6; The micro-valve, made of thermodeformable material, is located at the ventilated micropores and is configured to open and close automatically in response to temperature changes.

[0028] The main channel 5 is responsible for the rapid distribution of the cooling working fluid and the ash machine. The secondary honeycomb unit 6 provides a huge heat exchange area and can adopt a gradient distribution, making it denser and smaller near the heat source and sparser and slightly larger far from the heat source.

[0029] The cooling medium is a phase change microcapsule suspension, which combines the high efficiency of liquid cooling with the huge energy storage advantage of latent heat of phase change.

[0030] The thermal functional substrate 4 is a phonon crystal thermal supermaterial with a normal thermal conductivity K. z With the average in-plane thermal conductivity K xy Satisfy: K z >2×K xy This allows for the directional guidance of heat flow, preventing heat from diffusing to the skin contact surface.

[0031] The breathable micropores are equipped with miniature valves that can be closed at low temperatures to prevent dust, and opened at high temperatures to promote air convection and achieve heat dissipation as needed.

[0032] The biomimetic multi-level honeycomb array and the thermal functional substrate 4 are integrally formed using metal additive manufacturing technology.

[0033] like Figure 2 As shown, the present invention also provides AR glasses, which have the above-mentioned honeycomb heat dissipation structure inside, including: a frame 1, temples 2, a main processor, a power management chip, a display module 3, and a temperature sensor. The main processor and the power management chip are respectively disposed inside the left temple and the right temple. The display module 3 is disposed on the front of the frame 1. The left temple is provided with the first thermal interface material and the first honeycomb heat dissipation structure, and the first thermal functional substrate of the first honeycomb heat dissipation structure is connected to the first thermal interface material. The first thermal interface material is connected to the heat source of the main processor. The right temple is provided with the second thermal interface material and the second honeycomb heat dissipation structure, and the second thermal functional substrate of the second honeycomb heat dissipation structure is connected to the second thermal interface material. The second thermal interface material is connected to the heat source of the power management chip. The frame 1 is provided with the third thermal interface material and the third honeycomb heat dissipation structure, and the third thermal functional substrate of the third honeycomb heat dissipation structure is connected to the third thermal interface material. The third thermal interface material is connected to the heat source of the display module 3.

[0034] The temperature sensor includes at least a first temperature sensor, a second temperature sensor, and a third temperature sensor, and the first temperature sensor, the second temperature sensor, and the third temperature sensor are respectively disposed on the periphery of the main processor, the power management chip, and the display module 3.

[0035] The frame 1 houses an intelligent control unit. The main processor, power management chip, display module 3, first honeycomb heat dissipation structure, second honeycomb heat dissipation structure, third honeycomb heat dissipation structure, first temperature sensor, second temperature sensor, and third temperature sensor are connected to the intelligent control unit. The intelligent control unit is configured to run an improved artificial bee colony algorithm. It uses the readings of multiple temperature sensors and system load information as inputs, and the speed of the micro pump and the operating frequency of the main processor as decision variables to perform real-time optimization calculations and output control signals.

[0036] The first and second thermal interface materials are thermal grease, thermal gel or phase change thermal pads.

[0037] The improved artificial bee colony algorithm is as follows: In the neighborhood search strategy of the hired bees in the traditional artificial bee colony algorithm, a learning factor is introduced for both the best individual in the current population and a random individual. The objective function of the traditional artificial bee colony algorithm incorporates a penalty mechanism for system output overshoot. A detailed introduction to the improved artificial bee colony algorithm: In actual production processes, common PID parameter tuning methods mainly involve empirical methods, repeated trials, or the 0.618 method to optimize parameters. These methods are complex, tedious, and time-consuming. The emergence of evolutionary algorithms has simplified this process. The artificial bee colony algorithm is another genetic algorithm that has been widely applied in research fields such as automatic control, production planning, and image processing, following the particle swarm algorithm and the ant colony algorithm. The algorithm consists of hired bees, follower bees, scout bees, and food sources. The process is as follows: (1) Initialize the information of each hired bee and the corresponding food source (feasible solution to the problem); (2) Each hired bee base (2) Find new food sources nearby, calculate fitness (i.e., the quality of food sources) and share the information with the bee colony; (3) Follower bees select shared food source information based on fitness; (4) Follower bees go to the selected food source and evaluate the fitness of nearby food sources, and finally go to the food source with the highest fitness; (5) If the fitness of the food source of the hired bee still fails to improve after a certain number of attempts, the food source is abandoned and the hired bee becomes a scout bee to find new food sources; (6) Repeat steps 1 to 5 until the prescribed number of cycles is reached.

[0038] Using the artificial bee colony algorithm to optimize the proportional, integral, and derivative coefficients in a PID controller can be viewed as a problem of finding the optimal solution vector in a three-dimensional solution space.

[0039] Considering the information interaction between agents, a learning factor is added to the current best individual and random individuals in the population based on the standard artificial bee colony algorithm. Simultaneously, an overshoot penalty mechanism for the actuator output is incorporated into the objective function, limiting output overshoot while considering the controlled object's response process. The improved artificial bee colony algorithm flow is as follows: Figure 1 As shown, it specifically includes: 1. Initialize parameters: Set the population size, maximum number of iterations, and limit number of iterations, and use equation (1) to initialize all solution vectors.

[0040] (1) In the formula, i = 1, 2, ..., n, n is the number of food sources, j = 1, 2, ..., D, D is the number of positional components of the food source, upper(j) and lower(j) are the upper limit (maximum value) and lower limit (minimum value) of the j-th positional component, respectively; randij is the j-th positional component of the i-th food source, which is a random number between 0 and 1; 2. The objective function constant of the food source is the integral of the absolute value of the deviation and time, determined by the PID parameters, as shown in the following formula: (2) In the formula, J is the objective function of the food source, ITAE is the error integral index, t is time in seconds, and |e(t)| is the absolute error. An overshoot penalty mechanism for the actuator output is added to the objective function, which is shown in the following equation: (3) In the formula, σ act The maximum overshoot output by the actuator, %, ω act For weights; Choose a continuous and sufficiently large simulation time, and discretize it into m equal extremely short time intervals Δt. The objective function is expressed as: (4) In the formula, t(i) is the discrete i-th time segment, and e(i) is the error value corresponding to t(i).

[0041] 3. The result of hiring bees to perform neighborhood search and generate new solutions is determined by formula (5), and a greedy strategy is used to select a better solution; (5) In the formula, V ijX represents a new solution generated by neighborhood search; k is a random number, and k≠i; c1 and c2 are the learning factors of the current best individual and a random individual in the population, respectively; mj φ is the j-th positional component of the best individual in the current population in the m-th generation; ij1 and φ ij2 Take random numbers with values ​​[0, 1] respectively; j takes random numbers with values ​​[0, R], where R is the number of parameters. If V ij >X ij max Then V ij The value assigned to X ij max If V ij <X ij min Then V ij The value assigned to X ij min ; 4. The probability of each food source being selected is calculated using the following formula: (6) In the formula, p i Let fit be the probability that the i-th food source is selected. i Let be the fitness of the i-th food source; 5. The fitness of food sources is calculated using the following formula: (7) 6. Follow the bee to the selected food source and perform a neighborhood search. The follower bee calculates the fitness of the new food source it finds and uses a greedy strategy to select a better solution. Finally, it updates the Bas value according to step 5. 7. Before reaching the maximum number of iterations, proceed to step 4; once the maximum number of iterations is reached, the loop ends, and the optimal PID control parameters are obtained.

[0042] This invention also provides a heat dissipation method for AR glasses, specifically: S1: System Initialization and Parameter Settings The system powers on and the intelligent control unit initializes. Load the initial parameters of the improved artificial bee colony algorithm, including: population size, maximum number of iterations, initial value of the learning factor, and preset values ​​of each weight coefficient in the objective function.

[0043] Start the micropumps in the first, second, and third honeycomb heat dissipation structures to run at an initial safe speed, ensuring that the cooling medium (phase change microcapsule suspension) begins to circulate in its respective microfluidic channel network.

[0044] S2: Multi-source heat harvesting and conduction The heat generated during the operation of the main processor is efficiently conducted to the first thermal functional substrate of the first honeycomb heat dissipation structure through the first thermal interface material (thermal grease, thermal gel or phase change thermal pad).

[0045] The heat generated by the power management chip during operation is conducted to the second thermal functional substrate of the second honeycomb heat dissipation structure through the second thermal interface material.

[0046] The heat generated during the operation of the display module 3 is conducted to the third thermal functional substrate of the third honeycomb heat dissipation structure through the third thermal interface material.

[0047] Each functional substrate, acting as a phonon crystal thermal supermaterial, directs heat to its corresponding biomimetic multi-level honeycomb array and suppresses the lateral diffusion of heat to the area where the temple shell 2 contacts the user's skin.

[0048] S3: Active phase change cycle heat dissipation The heat conducted to each honeycomb array is absorbed by the phase change microcapsule suspension circulating within the microfluidic channel network.

[0049] When the phase change microcapsules in the suspension flow through a high-temperature region, their core material undergoes a solid-liquid phase change, absorbing and storing a large amount of latent heat.

[0050] The heat-carrying suspension is driven by a micropump to the low-temperature region of the structure (such as the condensation radiation zone at the end of temple 2), where it releases heat, the phase change material solidifies, and a heat dissipation cycle is completed. This process continuously transfers heat from the heat source and dissipates it into the environment.

[0051] S4: Adaptive Passive Convection Cooling On the outer wall of each secondary honeycomb unit 6, there are micro-valves made of thermodeformable material on the venting micropores.

[0052] When the local temperature is below the first threshold (e.g., 35°C), the micro valve is closed, effectively preventing dust and moisture from entering the structure.

[0053] When the local temperature rises due to heat dissipation requirements and exceeds the second threshold (e.g., 40°C), the thermodeformable material deforms, driving the micro-valve to open.

[0054] After the valve is opened, the heated air inside the honeycomb unit forms a micro-convective current with the cold air outside, and heat is exchanged through the breathable micropores to achieve on-demand enhancement of heat dissipation.

[0055] S5: Intelligent Sensing and Optimization Decision-Making The first, second, and third temperature sensors collect temperature data from the three sides of the main processor, power management chip, and display module in real time, and transmit the data to the intelligent control unit.

[0056] Meanwhile, the intelligent control unit obtains real-time system load information from the main processor.

[0057] The intelligent control unit executes the improved artificial bee colony algorithm at a fixed control cycle (e.g., 10 times per second). The algorithm iteratively optimizes and outputs the optimal combination of micropump speeds and main processor operating frequency within the current control cycle.

[0058] S6: Closed-loop control execution The intelligent control unit outputs the optimal micropump speed calculated in step S5 through a PWM (Pulse Width Modulation) signal to drive each micropump to run at the new speed, thereby adjusting the circulation rate and heat dissipation of the cooling medium.

[0059] Meanwhile, the intelligent control unit sends the optimal operating frequency of the main processor to the main processor via a communication bus (such as I²C or SPI), and the main processor adjusts its computing performance and power consumption accordingly.

[0060] This control signal changes the system's heat dissipation and heating state. A new round of temperature data is collected by the sensor and fed back to the intelligent control unit, thus forming a complete, dynamic, and adaptive closed-loop control system.

[0061] In summary, the method of this invention, through the sequential hardware coordination of multi-source heat collection and conduction, active phase change cyclic heat dissipation, and adaptive passive convection heat dissipation, and driven by intelligent software through intelligent perception and optimization decision-making and closed-loop control execution, together constitutes an efficient, precise, and adaptive AR glasses heat dissipation system, ensuring the stable performance of the device and the user's wearing comfort under various operating conditions.

[0062] This invention demonstrates its effectiveness and advancement through a specific embodiment: Experimental setup: A prototype AR glasses device equipped with the heat dissipation solution of this invention was fabricated. The left temple integrates a first honeycomb heat dissipation structure, which is connected to the main processor (using the Qualcomm XR2 platform) via thermal grease; the right temple integrates a second honeycomb heat dissipation structure, which is connected to the power management chip via a phase-change thermal pad; and the frame 1 integrates a third honeycomb heat dissipation structure, which is connected to the driver IC of the Micro-OLED display module 3 via thermal gel.

[0063] The intelligent control unit is configured to execute an improved artificial bee colony algorithm every 100ms, with a population size of 20, a maximum number of iterations of 30, learning factors c1 and c2 both set to 1.5, and overshoot weight ωact set to 2.0.

[0064] Comparative experiment: The present invention was compared and tested with two conventional solutions: Option A: Traditional graphene + metal heatsink solution Option B: Conventional liquid cooling loop + PID control scheme Solution C: The honeycomb heat dissipation + improved artificial bee colony algorithm proposed in this invention. Test conditions: At an ambient temperature of 25°C, the AR glasses were continuously run through a benchmark test program to simulate a high-load application scenario, and the temperature changes and power consumption were recorded over 30 minutes.

[0065] Experimental results: Temperature control effect: Option A (Traditional Graphene): The processor's highest temperature reaches 82℃, and the upward trend is obvious, resulting in overheating and frequency reduction.

[0066] Option B (conventional liquid cooling + PID): The processor temperature is controlled at 68℃, but there is a fluctuation of ±3℃, and there is an overshoot of 2℃ in the initial response stage.

[0067] Solution C (the present invention): The processor temperature is stabilized at 62±0.5℃ with no overshoot, and the temperature control accuracy is significantly improved.

[0068] System power consumption: Under the same heat dissipation effect, the overall heat dissipation system power consumption of the present invention is reduced by about 35% compared with the solution B. This is mainly due to the improved algorithm's optimized configuration of pump speed and processing frequency.

[0069] Temperature uniformity: In the present invention, the maximum temperature difference on the outer surface of the temple 2 does not exceed 2°C, while the corresponding temperature difference in Scheme B reaches more than 5°C, proving that the honeycomb structure does indeed improve the uniformity of temperature distribution.

[0070] Dynamic response characteristics: When the load suddenly increases by 50%, the present invention can stabilize the temperature back to the target value within 3 seconds without overshoot; while solution B takes 8 seconds to stabilize and has obvious temperature overshoot.

[0071] User experience: Under the present invention, the temperature at the point of contact between the temple 2 and the skin is always below 40°C, while in the comparative scheme, the contact temperature exceeds 45°C in the later stage of the test, which is close to the human body's discomfort threshold.

[0072] Results analysis: This embodiment fully demonstrates the effectiveness and advancement of the present invention. Through the organic combination of a biomimetic honeycomb structure and an improved artificial bee colony algorithm, it not only significantly outperforms traditional solutions in heat dissipation performance but also exhibits clear advantages in control precision, energy efficiency, and user experience. Particularly in preventing temperature overshoot, improving temperature uniformity, and reducing contact temperature, the present invention demonstrates unique technical value, perfectly meeting the special requirements of AR glasses for their heat dissipation systems.

[0073] Embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0074] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0075] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0076] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0077] Contents not described in detail in this specification are prior art known to those skilled in the art. It is hereby indicated that the above description is intended to help those skilled in the art understand this invention, but does not limit the scope of protection of this invention. Any equivalent substitutions, modifications, improvements, or simplifications of the above descriptions that do not depart from the essential content of this invention fall within the scope of protection of this invention.

Claims

1. A honeycomb heat dissipation structure, characterized in that, include: Thermal functional substrate; A biomimetic multi-level honeycomb array is disposed inside a thermal functional substrate. The biomimetic multi-level honeycomb array includes at least one main channel and multiple secondary honeycomb units extending from the wall of the main channel. The main channel and the secondary honeycomb units together constitute a three-dimensional microfluidic channel network. The cooling medium is a phase change microcapsule suspension filled within the microfluidic channel network; At least one micropump, connected to the microfluidic channel network, is used to drive the circulation of the cooling medium; Multiple breathable micropores are formed on the outer wall surface of the secondary honeycomb unit; The micro-valve, made of thermodeformable material, is located at the ventilated micropores and is configured to open and close automatically in response to temperature changes.

2. The honeycomb heat dissipation structure according to claim 1, characterized in that, The thermal functional substrate is a phonon crystal thermal supermaterial with a normal thermal conductivity K. z With the average in-plane thermal conductivity K xy Satisfy: K z >2×K xy .

3. The honeycomb heat dissipation structure according to claim 2, characterized in that, The biomimetic multi-level honeycomb array and the thermal functional substrate are integrally formed using metal additive manufacturing technology.

4. An AR glasses device, wherein an internal honeycomb heat dissipation structure as described in any one of claims 1-3 is provided, characterized in that, include: The lens includes a frame, temples, a main processor, a power management chip, a display module, and a temperature sensor. The main processor and power management chip are respectively disposed inside the left and right temples. The display module is disposed on the front of the frame. The left temple contains a first thermal interface material and a first honeycomb heat dissipation structure, with a first thermal functional substrate of the first honeycomb heat dissipation structure connected to the first thermal interface material. The first thermal interface material is connected to the heat source of the main processor. The right temple contains a second thermal interface material and a second honeycomb heat dissipation structure, with a second thermal functional substrate of the second honeycomb heat dissipation structure connected to the second thermal interface material. The second thermal interface material is connected to the heat source of the power management chip. The frame contains a third thermal interface material and a third honeycomb heat dissipation structure, with a third thermal functional substrate of the third honeycomb heat dissipation structure connected to the third thermal interface material. The third thermal interface material is connected to the heat source of the display module.

5. An AR glasses according to claim 4, characterized in that, The temperature sensor includes at least a first temperature sensor, a second temperature sensor, and a third temperature sensor, and the first temperature sensor, the second temperature sensor, and the third temperature sensor are respectively disposed on the periphery of the main processor, the power management chip, and the display module.

6. An AR glasses according to claim 5, characterized in that, The frame houses an intelligent control unit. The main processor, power management chip, display module, first honeycomb heat dissipation structure, second honeycomb heat dissipation structure, third honeycomb heat dissipation structure, first temperature sensor, second temperature sensor, and third temperature sensor are connected to the intelligent control unit. The intelligent control unit is configured to run an improved artificial bee colony algorithm. It uses the readings of multiple temperature sensors and system load information as inputs, and the speed of the micro pump and the operating frequency of the main processor as decision variables to perform real-time optimization calculations and output control signals.

7. An AR glasses according to claim 4, characterized in that, The first and second thermal interface materials are thermal grease, thermal gel or phase change thermal pads.

8. An AR glasses according to claim 6, characterized in that, The improved artificial bee colony algorithm is as follows: In the neighborhood search strategy of the hired bees in the traditional artificial bee colony algorithm, a learning factor is introduced for both the best individual in the current population and a random individual. Incorporate a penalty mechanism for system output overshoot into the objective function of the traditional artificial bee colony algorithm.

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