Enhanced mode for scanning acoustic microscopy inspection in semiconductor inspection

Abstract

A scanning acoustic microscope system may include one or more measurement assemblies, where a respective one of the measurement assemblies includes a transducer and a receiver, wherein the receiver of at least one of the one or more measurement assemblies includes a multi-pixel sensor to simultaneously generate sensor data for a plurality of locations associated with a sample. The tool may include a stage configured to scan the sample for measurement by the one or more measurement assemblies. The tool may include a controller communicatively coupled to the one or more measurement assemblies, where the controller includes one or more processors configured to execute program instructions, the program instructions cause the processor to implement a metering recipe by: receiving the sensor data from the one or more measurement assemblies while the sample is scanned by the stage; and generating one or more measurements of the sample based on the sensor data.

Description

[0001] Cross-reference of related applications

[0002] This application claims the right to U.S. Provisional Application No. 63 / 542,545, filed October 5, 2023, pursuant to 35 USC § 119(e), the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to wafer inspection, and more specifically, to wafer inspection performed by scanning acoustic microscopy. Background Technology

[0004] Scanning optical microscopy (SAM) can be used as a non-destructive method for inspecting wafers and other surfaces during semiconductor manufacturing, and is particularly useful for detecting image defects in multilayer structures. Current limitations of SAM lie in its use in high-volume manufacturing and the resulting trade-offs. For example, the faster inspection speed of SAM devices often results in lower resolution and sensitivity of the scanned surface.

[0005] Therefore, there is a need to develop systems and methods to increase scanning speed without reducing scanning resolution or sensitivity. Summary of the Invention

[0006] According to one or more embodiments of this disclosure, a scanning acoustic microscope system is disclosed. In one embodiment, the scanning acoustic microscope system includes: one or more measurement assemblies, wherein corresponding ones of the measurement assemblies include transducers and receivers, wherein the receiver of at least one of the one or more measurement assemblies may include a multi-pixel sensor for simultaneously generating sensor data at multiple locations associated with a sample; a stage configured to scan the sample for measurement by the one or more measurement assemblies; and a controller communicatively coupled to the one or more measurement assemblies, wherein the controller includes one or more processors configured to execute program instructions that cause the one or more processors to perform a metrological formulation by: receiving the sensor data from the one or more measurement assemblies while the sample is scanned by the stage; and generating one or more measurements of the sample based on the sensor data.

[0007] In some aspects, the technology described herein relates to a scanning acoustic microscope system comprising: a controller communicatively coupled to one or more measurement assemblies and a stage, wherein corresponding components of the measurement assemblies include a transducer and a receiver, wherein the receiver of at least one of the one or more measurement assemblies includes a multi-pixel sensor for simultaneously generating sensor data at multiple locations associated with a sample, wherein the stage is configured to scan the sample for measurement by the one or more measurement assemblies, and wherein the controller includes one or more processors configured to execute program instructions that cause the one or more processors to perform an inspection or metrological formulation by: receiving the sensor data from the one or more measurement assemblies while the sample is being scanned by the stage; and generating one or more measurements of the sample based on the sensor data.

[0008] In some aspects, the techniques described herein relate to a method comprising: receiving sensor data from one or more measurement assemblies while a sample is scanned by a stage, wherein a corresponding one of the measurement assemblies includes a transducer and a receiver, wherein the receiver of at least one of the one or more measurement assemblies includes a multi-pixel sensor for simultaneously generating sensor data at multiple locations associated with the sample; and generating one or more measurements of the sample based on the sensor data. Attached Figure Description

[0009] Those skilled in the art can better understand the many advantages of this disclosure by referring to the accompanying drawings.

[0010] Figure 1 A block diagram illustrating a scanning acoustic microscope system for inspecting a substrate according to one or more embodiments of the present disclosure.

[0011] Figures 2A to 2C This describes the scanning of samples using different sensors according to one or more embodiments of this disclosure.

[0012] Figures 3A to 3B Examples of staggered measurement assembly configurations for scanning samples according to one or more embodiments of this disclosure are described.

[0013] Figure 4 This is a conceptual view illustrating a scanning acoustic microscope system 100 comprising a rotating stage rotated by a spindle, according to one or more embodiments of the present disclosure.

[0014] Figure 5A This describes test scans of samples scanned at different acoustic frequencies according to one or more embodiments of this disclosure.

[0015] Figure 5BThis describes test scans of samples scanned at different transducer powers according to one or more embodiments of this disclosure.

[0016] Figure 6 The illustration depicts a process flowchart of a method for measuring a sample via a scanning acoustic microscope system according to one or more embodiments of the present disclosure. Detailed Implementation

[0017] The disclosed subject matter will now be described in detail with reference to the accompanying drawings. This disclosure has been specifically shown and described with respect to particular embodiments and their specific features. The embodiments set forth herein should be considered illustrative rather than restrictive. It will be readily apparent to those skilled in the art that various changes and modifications in form and detail can be made without departing from the spirit and scope of this disclosure.

[0018] Embodiments of this disclosure relate to systems and methods for increasing the speed of scanning acoustic microscopy (SAM) examination of samples (e.g., wafers) without reducing scanning resolution or sensitivity. The system includes a measurement assembly comprising a transducer and a receiver. The receiver may include a multi-pixel sensor capable of generating sensor data at multiple locations associated with the sample. The system may utilize one or more SAM sensor configurations, such as an array of SAM sensors interleaved in each pass, one or more SAM sensor scanning capabilities (e.g., scanning with different pixel shapes), and one or more scanning modes (e.g., selectively scanning the outer radial edge region of the sample along a radial axis).

[0019] For reference Figures 1 to 6 According to one or more embodiments of the present disclosure, a system and method for inspecting a substrate via SAM.

[0020] Figure 1 A block diagram illustrating a scanning acoustic microscope system 100 for inspecting a substrate according to one or more embodiments of the present disclosure.

[0021] In one embodiment, the scanning acoustic microscope system 100 includes one or more measurement assemblies 102. The measurement assemblies 102 include a transducer 104 for transmitting acoustic signals and a receiver 106 for receiving reflected acoustic signals. The receiver 106 may include a sensor 108 (e.g., a multi-pixel sensor) that simultaneously generates sensor data for multiple locations associated with a sample 110 (e.g., a wafer or other semiconductor substrate). The scanning acoustic microscope system 100 may further include a stage 112 (e.g., a translation stage or a rotation stage or both) configured to adjust, move, and / or scan the sample 110 relative to the measurement assemblies 102. For example, the stage 112 may be configured such that the sample 110 is moved by the stage 112 relative to the measurement assemblies 102. In another example, the stage may be configured such that the measurement assemblies 102 are moved by the stage 112 relative to the sample 110. In yet another example, the transducer and sensor are part of the same integrated circuit (e.g., the same chip).

[0022] In an embodiment, the scanning acoustic microscope system 100 includes one or more controllers 114 having one or more processors 116 configured to execute program instructions held in a memory 118. For example, the memory 118 may hold program instructions configured to cause one or more processors 116 to perform any of the one or more process steps described throughout this disclosure. For example, the program instructions may include implementing a metrological or inspection formulation. Specifically, the program instructions may include receiving sensor data from one or more measurement assemblies 102 when the sample 110 is scanned. The program instructions may also include generating one or more measurements of the sample 110 (e.g., inspection or metrological measurements) based on the sensor data. In another example, the program instructions may include implementing a metrological or inspection formulation by at least one of identifying defects on the sample based on the measurement or classifying said defects. The controller may be communicatively coupled to one or more measurement assemblies 102 and the stage 112.

[0023] Figure 2A The section to C describes the scanning of a sample 110 (e.g., a wafer) using different measurement assemblies 102 according to one or more embodiments of this disclosure. The scanning acoustic microscope system 100 can operate in different system configurations using different configurations of the measurement assemblies 102 and combinations of different methods of scanning with said different configurations.

[0024] Figure 2AThis describes a sample 110 scanned by a measurement assembly 102 configured as a one-dimensional line multi-pixel sensor 108 according to one or more embodiments of the present disclosure. For example, the measurement assembly 102 may include a row of sensor units that scan and record one row of pixels (e.g., scanned in the XY direction or the rotational (R-θ) direction) as the sample 110 moves. Previously scanned segments 204a to b of the sample 110 are recorded and later stitched together to form a map of the overall scanned area.

[0025] Figure 2B This description describes a sample 110 scanned by a measurement assembly 102, an array of two-dimensional measurement assemblies configured to scan in a time-delay integration (TDI) mode, according to one or more embodiments of the present disclosure. For example, the measurement assembly 102 may comprise measurement assembly sub-units of a 2D array that scans pixel regions (e.g., in the XY direction or a rotational (R-θ) direction) one at a time as the sample 110 moves. For example, the 2D array may sequentially scan adjacent regions of the sample 110, where a representative image of the sample is assembled from arrangements derived from previously scanned segments 204c to g.

[0026] Figure 2C This describes a sample 110 scanned according to one or more embodiments of the present disclosure by a measurement assembly 102, which is an array of two-dimensional measurement assemblies configured to scan in a step-scan (e.g., real-time flash) mode. For example, the measurement assembly 102 may comprise measurement assembly sub-units of a 2D array of segments of the sample scanned at one time. Once a segment has been scanned, the stage 112 and / or the measurement assembly 102 moves to another segment of the sample 110 and scanning continues. A representative image of the sample 110 can then be assembled from the arrangement of scans from previously scanned segments 204h to l.

[0027] Figures 3A to 3B Examples of measurement assembly configurations 300a to c for scanning sample 110 according to one or more embodiments of this disclosure are described. For example, configuration 300a may include a measurement assembly 102 configured to contain a multi-pixel sensor 108 with nine sensor subunits distributed along a channel direction and providing a pixel size (e.g., a measurement area) equal to half the spacing along the channel direction, such as... Figure 3AAs shown in the diagram. In this configuration, scanning a scan band 304a of sample 110 along a scan direction orthogonal to the channel direction generates nine channels 305 that generate data. Each channel 305 is associated with one of the sensor units, with gaps maintained between regions of the sample measured by the sensor units. Once the initial measurement scan band 304a is completed, the measurement assembly 102 or translation stage 112 is moved or translated to another portion of sample 110 orthogonal to the scan direction (e.g., along the channel direction), such that sensor units are arranged in a second scan band 304b to measure between at least some of the gaps between regions measured by the sensor units during the first scan band 304a. This process can continue until a selected portion of the sample is fully characterized by the measurement assembly 102. For example, Figure 3A Third and fourth measurement scan bands 304c to d are drawn, similar to the first two measurement scan bands 304a and b, and are intersected. In this manner, the entire surface of the sample 110 can be scanned efficiently because the translation stage 112 is configured to translate the sample along two or more measurement scan bands, wherein at least one measurement scan band at least partially intersects with a second measurement scan band, and at least partially fills at least some of the gaps in the second measurement scan band. The intersecting scan bands can be performed in either an XY mode or a rotational R-θ mode.

[0028] refer to Figure 3BThe scanning acoustic microscope system 100 may include a measurement assembly 102 (e.g., a multi-pixel sensor 108 configured to include five sensor units) capable of scanning with different measurement assembly configurations 300b to c. The different measurement assembly configurations 300b to c enable multi-sensor scanning with different resolutions. For example, the measurement assembly 102 can switch between a low-resolution measurement assembly configuration 300b in which the sensor units scan with relatively large pixel sizes and a high-resolution measurement configuration 300c in which the sensor units scan with smaller pixel sizes. For example, in the low-resolution measurement assembly configuration 300b, the pixel size of the sensor units is large enough that there are no gaps along the channel direction. Specifically, the measurement condition 300b provides that the sensor units have a pixel size twice the separation distance along the channel direction to ensure complete coverage of the scan band. By scanning without gaps between sensor units, the low-resolution assembly configuration 300b utilizes a scan band spacing 308 that is approximately the same width as the measurement assembly 102 along the channel direction, enabling the measurement assembly 102 to scan a portion of the sample 110 in three consecutive non-overlapping scan bands. In another example, in the high-resolution measurement assembly configuration 300c, higher resolution scanning is achieved by reducing the area imaged by individual sensor units (e.g., pixel size). For example, one or more sensor units may include adjustable imaging lenses, allowing the pixel size to be reduced by changing the magnification of the imaging lenses. For illustration, the pixel size of the sensor units in the low-resolution measurement assembly configuration 300c is one-third the height of the pixel size of the sensor units in the high-resolution measurement assembly configuration 300b. This reduction in pixel size also increases the scan resolution by a factor of three. Due to the reduced height of the scan by the sensor units in the high-resolution measurement assembly configuration 300c, gaps 311 may appear in the surface coverage area between the sensor units. To ensure complete surface coverage, the scan bands of the measurement assembly 102 are staggered, wherein the scan band spacing 312 of the high-resolution assembly configuration 300c is approximately one-third the size of the scan band spacing 308 of the low-resolution assembly configuration 300b. Due to the smaller scan band spacing, the measurement assembly 102 scanned in the high-resolution measurement assembly configuration 300c may require more scan bands (e.g., eight) to cover a specific portion of the sample 100 compared to when using the low-resolution measurement assembly configuration 300b.

[0029] Different measurement assemblies configuration 300 can be used to scan sample 110. For example, and such Figure 3A and 3BAs shown, the measurement assembly 102 may have a fixed spacing and be configured to switch between scans of different pixel sizes. In another example, the measurement assembly 102 may have a fixed spacing and be configured to switch between scans of different pixel shapes. In another example, the measurement assembly 102 may be configured to change the spacing between one or more sensor units. In another example, the measurement assembly 102 may contain a different number of sensor units. For example, measurement assembly configuration 300a includes a measurement assembly 102 configured with a multi-pixel sensor 108 having nine sensor units, while measurement assembly configurations 300b to c include a measurement assembly 102 configured with a multi-pixel sensor 108 having five sensor units. Therefore, the above description should not be construed as limiting the embodiments of this disclosure but is merely illustrative.

[0030] Figure 4 This illustration shows a simplified schematic of a scanning acoustic microscope system 100 comprising a rotating stage 112 rotated by a spindle 400, according to one or more embodiments of the present disclosure. The stage 112 rotates the sample 110 while a scanning head 402 comprising one or more measurement assemblies 102 performs R-θ measurements (e.g., the channel direction is aligned along the radial axis of the sample 110). The stage 112 may also position the outer radial edge of the sample 110 below one or more measurement assemblies 102 for measurement.

[0031] In embodiments, the operation of the scanning acoustic microscope system 100 includes edge or near-edge inspection modes. For example, the edge inspection mode can be used in wafer (e.g., sample 110) inspection methods, such as wafer-to-wafer bonding inspection, where gaps typically occur near the wafer edge. The edge inspection mode may include positioning one or more measurement assemblies 102 at the outer ring of sample 110 such that the channel direction is aligned along the radial axis of sample 110 and the stage 112 rotates the sample during measurement. The edge inspection mode may also include slowing down the inspection speed at a specific radius until the edge of the wafer is reached to increase the signal-to-noise ratio (SNR) for better detection. For example, different rings within the sample may correspond to different measurement areas, where the measurement area of ​​the outer ring spins faster than the measurement area of ​​the inner ring. The inspection speed is adjusted to compensate for the difference in ring spin.

[0032] Edge inspection mode can also use a denser sampling scheme to increase the likelihood of locating defects in edge region 404 or other measurement areas. Edge inspection mode can utilize other methods to improve the sensitivity of wafer inspection by covering only a limited wafer area.

[0033] In this embodiment, the scanning acoustic microscope system 100 is designed to inspect edge regions 404. For example, the scanning acoustic microscope system 100 may incorporate a rotating stage 112 for inspecting edge regions 404 (e.g., rings) of the sample 110. For example, for a 300 mm wafer, the scanning acoustic microscope system 100 may inspect regions of the outer portion of the wafer (e.g., within a range of 60 mm from the center to the edge of the wafer to 130 mm from the center to the edge).

[0034] For example, for a 300 mm wafer, the scanning acoustic microscope system 100 can be configured to inspect the outer 20 mm of the wafer (e.g., a radius from 130 mm to 150 mm). In another example, the scanning acoustic microscope system 100 can be configured to inspect the outer 30 mm of the wafer (e.g., a radius from 120 mm to 150 mm). In another example, the scanning acoustic microscope system 100 can be configured to inspect the outer 40 mm of the wafer (e.g., a radius from 110 mm to 150 mm). In another example, the scanning acoustic microscope system 100 can be configured to inspect the outer 50 mm of the wafer (e.g., a radius from 100 mm to 150 mm). In yet another example, the scanning acoustic microscope system 100 can be configured to inspect the outer 60 mm of the wafer (e.g., a radius from 90 mm to 150 mm).

[0035] In an embodiment, the measurement assembly 102 of the scanning acoustic microscope system 100 scanning in R-θ mode is configured with a linear array configuration (e.g., for an increased field of view in the radial direction). For example, the measurement assembly 102 can be configured in both array and staggered configurations, such as... Figures 3A to 3B It is displayed in the middle.

[0036] In an embodiment, the scanning acoustic microscopy system 100, scanning in R-θ mode, is configured to scan non-square pixels of the sample 110 (e.g., optimized for R-θ scanning mode). For example, the sensor 108 of the scanning acoustic microscopy system 100 may be configured to scan pixels with unequal pixel size / length in the radial direction versus the tangential direction (e.g., pixels of sensor 108 have different sizes along two orthogonal directions). Using non-square pixels can reduce SNR during scanning. In an embodiment, the scanning acoustic microscopy system 100 may include dual-sided sensors 108 (e.g., back and front) for improved sensitivity and throughput.

[0037] In an embodiment, the scanning acoustic microscope system 100, scanning in XY mode, is configured to scan non-square pixels of the sample 110. For example, the sensor 108 of the scanning acoustic microscope system 100 may be configured to scan pixels with unequal pixel size / length between the X and Y axes (e.g., the pixels of sensor 108 have different sizes along two orthogonal directions).

[0038] In embodiments, where a pattern of device structure (e.g., printed circuit system) is present, the scanning acoustic microscopy system 100 detects voids in the sample 110 by minimizing the effect of pattern noise during scanning. For example, the scanning acoustic microscopy system 100 may utilize a shred-to-shred or shred-to-reference comparison method to reject or minimize common or expected patterned background in the sample 110.

[0039] In embodiments, samples are scanned independently using inspection or metrological methods other than SAM, with the results compared to those of the scanning acoustic microscopy system 100. For example, for bonded wafers, the inspection or metrological tool may scan two individual wafers prior to bonding. By using independently measured background patterns, the scanning acoustic microscopy system 100 can improve pattern detection and classification sensitivity by selecting appropriate algorithms and / or their parameters (e.g., thresholds). Inspection and / or metrological data included in these independent measurements may include shape data, thickness data (e.g., layer thickness), nanostructure data, mapping data (e.g., using wafer layout and / or database layout), and in-plane displacement (IPD) data. This data can help identify regions that may exhibit higher porosity. Measurements may also include film thickness data and stress data.

[0040] In one embodiment, the scanning acoustic microscope system 100 includes or is integrated with inspection tools and / or metrology tools. For example, the scanning acoustic microscope system 100 may be integrated with a flatness / shape metrology tool. In another example, the scanning acoustic microscope system 100 may be integrated with a pattern defect inspection tool. In yet another example, the scanning acoustic microscope system 100 may be integrated with an edge inspection tool.

[0041] In one embodiment, the scanning acoustic microscopy system 100 combines multiple measurements from different scanning conditions. For example, the scanning acoustic microscopy system 100 may perform several scans of sample 110 at different acoustic frequencies and / or transducer powers. In another example, the scanning acoustic microscopy system 100 may use different integration times to perform several scans of sample 110. In yet another example, the scanning acoustic microscopy system 100 may use different sampling (e.g., pixel) sizes to perform several scans of sample 110. Combining the scans then increases the sample detail achievable with a single scan. For example, combining multiple scans may increase the detail of the penetration depth or allow for greater focusing on the penetration depth. Combining scans may also facilitate the identification of a wider range of defect or feature types. Combining scans may also enhance the scanning acoustic microscopy system 100's ability to extend the dynamic measurement range of defect and / or feature parameters.

[0042] In embodiments, a dosing or testing formulation is implemented by incorporating data from multiple scans. For example, program instructions stored in memory 118 may cause one or more processors 116 to implement the dosing formulation by: (e.g., via multiple scans) receiving additional data associated with sample 110, relating the additional data to one or more measurements (e.g., from one or more original scans), and adjusting the one or more measurements based on the additional data.

[0043] Figure 5A This describes the test scans of sample 110 scanned at different acoustic frequencies according to one or more embodiments of this disclosure.

[0044] In an embodiment, the scanning acoustic microscopy system 100 can be used to distinguish different defects or features by combining scans and / or scan data using different scanning parameters. For example, by setting the acoustic frequency of the scanning acoustic microscopy system 100 for deep defect detection, both deep and shallow defects can be identified, as shown in the first scan 500 of sample 110. Deep defects are depicted as hollow circles, while shallow defects are depicted as solid circles. The acoustic frequency of the scanning acoustic microscopy system 100 can then be set for shallow defect detection, resulting in only shallow defects being identified, as shown in the second scan 502 of sample 110. By combining the first scan 500 and the second scan 502 (e.g., by removing defects present in both scans that are shallow defects), a third scan 504 that identifies only deep defects can be generated.

[0045] Figure 5BThis describes test scans of sample 110 at different transducer powers according to one or more embodiments of the present disclosure. In embodiments, the scanning acoustic microscope system 100 can be used to extend the size setting dynamic range by combining scans and / or scan data at varying transducer powers or by using different channels with lower sensitivity. For example, sample 110 can be scanned at high transducer power, which can effectively measure small defects attributable to unsaturated signals, but saturates larger defects attributable to saturation that cannot be effectively measured, such as in... Figure 5B The first scan 506 is shown. Large defects are depicted as hollow circles, while small defects are depicted as solid circles. Scanning at lower transducer power (e.g., as shown in the second scan 508) does not saturate larger defects, allowing them to be appropriately sized. However, scanning at lower transducer power fails to identify smaller defects. By combining the first scan 508 and the second scan 510, a third scan 510 is produced that correctly identifies the size of both small and large defects. In this way, and elsewhere described herein, the measurement assembly 102 and / or stage 112 can be configured to provide multiple measurements of common locations of the sample 110 under different measurement conditions, enabling the controller 114 to implement metrological formulations by generating one or more combined measurements based on different measurement conditions.

[0046] Figure 6 The illustration depicts a process flow diagram of a method 600 for measuring a sample 110 via a scanning acoustic microscope system 100 according to one or more embodiments of the present disclosure. Method 600 generally describes the use of the scanning acoustic microscope system 100 to implement a metrological formulation. For example, method 600 can be used to detect voids in a bilateral wafer.

[0047] In one embodiment, the method includes a step 602 of simultaneously scanning multiple locations within a sample 110 relative to a measurement assembly 102, which includes a transducer 104 and a multi-pixel sensor 108. In another embodiment, the method 600 includes a step 604 of transmitting acoustic signals using the transducer 104. In yet another embodiment, the method 600 includes a step 606 of acquiring reflected acoustic signals using the multi-pixel sensor 108, wherein the reflected acoustic signals include sensor data. In yet another embodiment, the method 600 includes a step 608 of generating one or more measurements of the sample 110 based on the sensor data. These measurements may include measurements generated from a single wafer or measurements generated from multiple wafers that have been bonded together (e.g., two, three, or more wafers). For example, because the scanning acoustic microscopy system 100 can detect deep defects within a substrate, measurements can be generated from both the top and bottom wafers of a bonded wafer assembly.

[0048] refer to Figure 1The controller 114 may include one or more processors 116 that may comprise any processor or processing element known in the art. For the purposes of this disclosure, the terms “processor” or “processing element” may be broadly defined to encompass any device having one or more processing or logic elements (e.g., one or more microprocessor devices, one or more application-specific integrated circuit (ASIC) devices, one or more field-programmable gate arrays (FPGAs), or one or more digital signal processors (DSPs)). In this sense, one or more processors 116 may comprise any device configured to execute algorithms and / or instructions (e.g., program instructions stored in memory). In embodiments, one or more processors 116 may embody a desktop computer, a mainframe computer system, a workstation, an image computer, a parallel processor, a network-connected computer, or any other computer system configured to execute programs configured to operate or in conjunction with the scanning acoustic microscope system 100, as described throughout this disclosure.

[0049] Furthermore, different subsystems of the scanning acoustic microscope system 100 may include processors or logic elements suitable for performing at least a portion of the steps described in this disclosure. Therefore, the above description should not be construed as limiting the embodiments of this disclosure, but is merely illustrative. Additionally, the steps described throughout this disclosure may be performed by a single controller 114 or alternatively by multiple controllers. Furthermore, controller 114 may include one or more controllers housed in a common housing or within multiple housings. In this manner, any controller or combination of controllers may be separately packaged as modules suitable for integration into the scanning acoustic microscope system 100.

[0050] Memory media 118 may comprise any storage medium known in the art suitable for storing program instructions executable by one or more associated processors 132. For example, memory media 118 may comprise a non-transitory memory medium. By another example, memory media 118 may comprise, but is not limited to, read-only memory (ROM), random access memory (RAM), magnetic or optical storage devices (e.g., magnetic disks), magnetic tape, solid-state drives, and the like. It should be further noted that memory media 118 may be housed together with one or more processors 116 within a common controller housing. In embodiments, memory media 118 may be remotely located relative to the physical location of one or more processors 116 and controller 114. For example, one or more processors 116 of controller 114 may access remote storage (e.g., a server) accessible via a network (e.g., the Internet, an intranet, and the like).

[0051] The objects described herein sometimes refer to different components contained within or connected to different other components. It should be understood that such depicted architectures are merely exemplary, and many other architectures can in fact be implemented to achieve the same functionality. Conceptually, any arrangement of components achieving the same functionality is effectively “associated” to achieve the desired functionality. Therefore, any two components combined herein to achieve a particular functionality can be considered “associated” with each other to achieve the desired functionality, regardless of the architecture or intermediate components. Similarly, any two such associated components can also be considered “operably connected” or “operably coupled” to each other to achieve the desired functionality, and any two components that can be suchly associated can also be considered “operably coupled” to each other to achieve the desired functionality. Specific examples of being operablely coupled include, but are not limited to, physically matable and / or physically interactive components and / or wirelessly interactive components and / or logically interactive and / or logically interactive components.

[0052] Those skilled in the art will understand that, in general, the terms used herein and especially in the appended claims (e.g., the body of the appended claims) are intended to be “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “including but not limited to,” etc.). Those skilled in the art will further understand that if a particular number of described claims are anticipated, this intention will be explicitly stated in the claims, and this intention will not exist in the absence of such a statement. For example, to aid understanding, the appended claims may contain the introductory phrases “at least one” and “one or more” to introduce the claim statements. However, the use of such phrases should not be construed as implying that the introduction of a claim statement by the indefinite article “a” or “an” limits any particular claim containing such an introduction to an invention containing only one such statement, even when the same claim contains the introductory phrases “a or more” or “at least one” and indefinite articles (e.g., “a” or “an” (e.g., “a” and / or “an” should generally be interpreted as “at least one” or “a or more”)); the same applies to the use of definite articles used to introduce a claim statement. Furthermore, even if a specific number of introduced claim statements are explicitly stated, those skilled in the art should recognize that such a statement should generally be interpreted as indicating at least the number stated (e.g., a simple statement of “two statements” without other modifiers generally indicates at least two statements, or two or more statements). Furthermore, in examples where conventions such as "at least one of A, B, and C" are used, those skilled in the art should generally understand that this construction is expected in the sense of such conventions (e.g., "a system having at least one of A, B, and C" would include, but is not limited to, systems having only A, only B, only C, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). In examples where conventions such as "at least one of A, B, or C" are used, those skilled in the art should generally understand that this construction is expected in the sense of such conventions (e.g., "a system having at least one of A, B, or C" would include, but is not limited to, systems having only A, only B, only C, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). Those skilled in the art should further understand that, in practice, whether in the description, claims, or drawings, any transition words and / or phrases presenting two or more alternative terms should be understood to contemplate the possibility of including one, any, or both of the terms. For example, the phrase “A or B” should be understood as including the possibility of “A” or “B” or “A and B”.

[0053] While specific aspects of the subject matter of the invention described herein have been shown and described, those skilled in the art will understand that changes and modifications can be made based on the teachings herein without departing from the subject matter and its broader aspects, and therefore the appended claims are intended to cover all such changes and modifications within the true spirit and scope of the subject matter as described herein. Furthermore, it should be understood that the invention is defined by the appended claims.

Claims

1. A scanning acoustic microscope system, comprising: One or more measurement assemblies, wherein each measurement assembly includes a transducer and a receiver, wherein the receiver of the respective measurement assembly includes a multi-pixel sensor for simultaneously generating sensor data at multiple locations associated with a sample; A stage configured to scan the sample for measurement by the one or more measurement assemblies; and A controller communicatively coupled to the one or more measurement assemblies, wherein the controller includes one or more processors configured to execute program instructions that cause the one or more processors to implement the metering formulation by: Receive sensor data from the one or more measurement assemblies while the sample is scanned by the stage; and One or more measurements of the sample are generated based on the sensor data.

2. The scanning acoustic microscope system of claim 1, wherein the one or more measurements include inspection measurements.

3. The scanning acoustic microscope system of claim 2, wherein the program instructions further cause the one or more processors to implement the metrological formulation by at least one of identifying defects on the sample based on the inspection measurement or classifying the defects.

4. The scanning acoustic microscope system of claim 1, wherein the one or more measurements include metrological measurements.

5. The scanning acoustic microscope system according to claim 1, wherein the multi-pixel sensor comprises: One-dimensional line sensor.

6. The scanning acoustic microscope system of claim 1, wherein the multi-pixel sensor comprises: Time Delay Integration (TDI) sensor.

7. The scanning acoustic microscope system according to claim 1, wherein the multi-pixel sensor comprises: Two-dimensional array sensor.

8. The scanning acoustic microscope system of claim 1, wherein the multi-pixel sensor comprises: Dual-sided sensors.

9. The scanning acoustic microscope system of claim 1, wherein the channel direction is aligned along the radial axis of the sample, wherein the pixels of the multi-pixel sensor scanning along the channel include radial length and tangential length, wherein the radial length and the tangential length are different.

10. The scanning acoustic microscope system of claim 7, wherein the two-dimensional array sensor operates in a step-scan mode.

11. The scanning acoustic microscope system of claim 1, wherein the one or more measurement assemblies comprise two or more measurement assemblies distributed along the channel direction.

12. The scanning acoustic microscope system of claim 11, wherein the stage translates the sample in a scanning direction orthogonal to the channel direction during the measurement.

13. The scanning acoustic microscope system of claim 11, wherein the channel direction is aligned along the radial axis of the sample, wherein the stage rotates the sample during the measurement.

14. The scanning acoustic microscope system of claim 13, wherein the stage positions the outer radial edge of the sample below the one or more measurement assemblies for the measurement.

15. The scanning acoustic microscope system of claim 11, wherein the size of the measurement field along the channel direction of the two or more measurement assemblies is separated by gaps, wherein the stage is configured to translate the sample along two or more measurement scan bands, wherein a first measurement scan band of the two or more measurement scan bands at least partially intersects with a second measurement scan band of the two or more measurement scan bands to provide that the measurement field of the first measurement scan band at least partially fills at least some of the gaps in the second measurement scan bands.

16. The scanning acoustic microscope system of claim 1, wherein at least one of the one or more measurement assemblies or the stage is configured to provide different measurement conditions for two or more measurement areas on the sample.

17. The scanning acoustic microscope system of claim 16, wherein at least one of the two or more measurement areas corresponds to the outer radial edge region of the sample.

18. The scanning acoustic microscope system of claim 16, wherein the different measurement conditions include different scanning speeds in the different measurement zones.

19. The scanning acoustic microscope system of claim 1, wherein the program instructions further cause the one or more processors to implement the metrology formula by: Receive additional data associated with the sample; Relate the additional data to the one or more measurements; and The one or more measurements may be adjusted based on the additional data.

20. The scanning acoustic microscope system of claim 19, wherein the one or more measurements include one or more inspection measurements, and wherein the additional data includes additional metrological data.

21. The scanning acoustic microscope system of claim 20, wherein adjusting the one or more measurements based on the additional data includes adjusting one or more inspection algorithms based on the additional metrological data.

22. The scanning acoustic microscope system of claim 20, wherein the additional metrological data includes: At least one of the following: layer thickness, characteristic shape, or nanomorphology data.

23. The scanning acoustic microscope system of claim 1, wherein at least one of the one or more measurement assemblies or the stage is configured to provide multiple measurements of common locations of the sample under different measurement conditions, wherein the program instructions are further configured to cause the one or more processors to implement the metrological formulation by generating one or more combined measurements based on the different measurement conditions.

24. A system comprising: A controller communicatively coupled to one or more measurement assemblies and a stage, wherein corresponding components of the one or more measurement assemblies include a transducer and a receiver, wherein the receiver of at least one of the one or more measurement assemblies includes a multi-pixel sensor for simultaneously generating sensor data at multiple locations associated with a sample, wherein the stage is configured to scan the sample for measurement by the one or more measurement assemblies, and wherein the controller includes one or more processors configured to execute program instructions that cause the one or more processors to implement a metrological formulation by: Receive sensor data from the one or more measurement assemblies while the sample is scanned by the stage; and One or more measurements of the sample are generated based on the sensor data.

25. A method comprising: In contrast to the measurement assembly that simultaneously scans multiple locations within a sample, the measurement assembly includes a transducer and a multi-pixel sensor; The transducer is used to transmit acoustic signals; The multi-pixel sensor is used to acquire reflected acoustic signals, wherein the reflected acoustic signals include sensor data; and One or more measurements of the sample are generated based on the sensor data.

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