Electronic and electrical system and vehicle

Abstract

The invention discloses an electronic and electrical system and a vehicle, relates to the technical field of vehicle-mounted communication, and aims to solve the problems that a vehicle electronic and electrical system is relatively complex and relatively low in communication efficiency. The electronic and electrical system comprises a central computing platform, a plurality of optical boxes and a plurality of electronic devices, the central computing platform is in optical fiber communication with the plurality of optical boxes, each electronic device in the plurality of electronic devices is in electrical communication and / or optical fiber communication with at least one optical box in the plurality of optical boxes, and at least two optical boxes in the plurality of optical boxes are connected through optical fibers.

Description

Electrical and electronic systems and vehicles Technical Field

[0001] This application relates to the field of vehicle communication technology, and more particularly to an electronic and electrical system and a vehicle. Background Technology

[0002] With the development of vehicle intelligence, the demand for in-vehicle functions such as intelligent driving is constantly increasing, and the design of vehicle electronic and electrical systems is facing various challenges.

[0003] In related technologies, with the increasing demands of vehicle functions, the bandwidth of vehicle communication and the efficiency and security of data transmission also need to be improved in sync. Currently, the rapid acquisition and high-speed transmission of vehicle data are achieved by continuously increasing the number of data transmission lines and various sensors in the vehicle. However, the increasing number of data transmission lines leads to more serious electromagnetic compatibility interference problems during data transmission, affecting communication efficiency. Furthermore, the large number of controllers, sensors, and other modules increases the complexity of the vehicle's electronic and electrical systems. Summary of the Invention

[0004] The purpose of this application is to provide an electronic and electrical system and vehicle that aims to solve the problems of complex vehicle electronic and electrical systems and low communication efficiency.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] This application provides an electronic and electrical system, including a central computing platform, multiple optical boxes, and multiple electronic devices; the central computing platform communicates with the multiple optical boxes via optical fiber, each of the multiple electronic devices communicates with at least one of the multiple optical boxes via electrical and / or optical fiber, and at least two of the multiple optical boxes are connected to each other via optical fiber.

[0007] The electronic and electrical system provided in this application embodiment connects the central computing platform and each optical box via optical fiber to achieve optical fiber communication between the central computing platform and the optical box. Since optical fiber carries data by transmitting optical signals, and optical signals do not suffer from electromagnetic interference, the data transmission rate in vehicle communication can be improved. Furthermore, using optical fiber to connect various devices in the electronic and electrical system can unify the data types between different devices, thereby unifying the device interface types and reducing the complexity of the electronic and electrical system.

[0008] In some embodiments, the plurality of optical boxes includes a first optical box and a second optical box, wherein the first optical box is connected to the central computing platform via optical fiber, and the second optical box is connected to the first optical box via optical fiber.

[0009] In some embodiments, the second optical box is connected to the central computing platform via optical fiber.

[0010] In some embodiments, the plurality of optical boxes includes a third optical box, which is connected to the second optical box and / or the first optical box via optical fiber.

[0011] In some embodiments, the third optical box is connected to the central computing platform via optical fiber.

[0012] In some embodiments, the plurality of optical boxes further includes a fourth optical box, which is connected to the first and third optical boxes via optical fibers.

[0013] In some embodiments, the plurality of electronic devices include sensors and / or actuators.

[0014] In some embodiments, the plurality of optical boxes includes a first optical box, which includes a beam splitter and / or an optical module.

[0015] In some embodiments, the first optical box includes a beam splitter; the beam splitter is connected to the optical modules of the second optical box and / or electronic devices via optical fibers; or the beam splitter is connected to the beam splitter of the second optical box via optical fibers, and multiple optical boxes include the second optical box.

[0016] In some embodiments, the first optical box further includes an optical connector connected to a beam splitter; the optical connector is connected to the optical module of the second optical box and / or electronic devices via an optical fiber; or the optical connector is connected to the beam splitter of the second optical box via an optical fiber.

[0017] In some embodiments, the first optical box includes an optical module for photoelectric conversion and / or electro-optical conversion, and the optical module is electrically connected to electronic devices.

[0018] In some embodiments, the first optical box further includes a power distribution module connected to the vehicle's power supply system and connected to the optical module to supply power to the optical module.

[0019] In some embodiments, the central computing platform includes a system-on-a-chip (SOC), at least one media access control (MAC) chip, and at least one optical line terminal (OLT) optical module; the SOC communicates electrically with multiple MAC chips, and the MAC chips communicate electrically with at least one OLT optical module.

[0020] In some embodiments, at least one MAC chip includes a first MAC chip, which is in electrical communication with at least two OLT optical modules, the at least two OLT optical modules including a first OLT optical module and a second OLT optical module; the first OLT optical module is responsible for transmitting information sent and / or received by the first MAC chip after the second OLT optical module fails; or, the second OLT optical module is responsible for transmitting information sent and / or received by the first MAC chip after the first OLT optical module fails.

[0021] In some embodiments, the plurality of optical boxes includes a first optical box, which is connected to a first OLT optical module via an optical fiber, and the first optical box is connected to a second OLT optical module via an optical fiber.

[0022] In some embodiments, the plurality of optical boxes includes a first optical box and a second optical box; the first optical box is connected to a first OLT optical module via an optical fiber, and the second optical box is connected to a second OLT optical module via an optical fiber.

[0023] In some embodiments, the first optical box is also connected to the second OLT optical module via optical fiber, and the second optical box is also connected to the first OLT optical module via optical fiber.

[0024] In some embodiments, at least one MAC chip includes a first MAC chip and a second MAC chip; the first MAC chip is responsible for transmitting information sent and / or received by the SOC after the second MAC chip fails; or, the second MAC chip is responsible for transmitting information sent and / or received by the SOC after the first MAC chip fails.

[0025] In some embodiments, at least one OLT optical module includes a first OLT optical module and a third OLT optical module, a first MAC chip is electrically connected to the first OLT optical module, and a second MAC chip is electrically connected to the third OLT optical module.

[0026] In some embodiments, at least one OLT optical module further includes a second OLT optical module and a fourth OLT optical module, and the first MAC chip also communicates electrically with the second OLT optical module, and the second MAC chip also communicates electrically with the fourth OLT optical module.

[0027] In some embodiments, the plurality of optical boxes includes a first optical box, which is connected to a first OLT optical module via an optical fiber, and the first optical box is also connected to a third OLT optical module via an optical fiber.

[0028] In some embodiments, the plurality of optical boxes includes a first optical box and a second optical box, the first optical box being connected to a first OLT optical module via optical fiber, and the second optical box being connected to a third OLT optical module via optical fiber.

[0029] In some embodiments, the plurality of electronic devices include at least a first electronic device, and the first electronic device has a first communication link and a second communication link with the SOC; the first communication link is responsible for transmitting information between the first electronic device and the SOC after the second communication link fails; or, the second communication link is responsible for transmitting information between the first electronic device and the SOC after the first communication link fails.

[0030] In some embodiments, the first communication link and the second communication link are any two of the following links:

[0031] The communication link includes the first MAC chip, the first OLT optical module, and the first optical box;

[0032] The communication link includes the first MAC chip, the first OLT optical module, and the second optical box;

[0033] The communication link includes the first MAC chip, the second OLT optical module, and the first optical box;

[0034] The communication link includes the first MAC chip, the second OLT optical module, and the second optical box;

[0035] The communication link includes the second MAC chip, the third OLT optical module, and the first optical box.

[0036] This includes the communication link between the second MAC chip, the third OLT optical module, and the second optical box;

[0037] This includes the communication link between the second MAC chip, the fourth OLT optical module, and the first optical box;

[0038] This includes the communication link of the second MAC chip, the fourth OLT optical module, and the second optical box.

[0039] In some embodiments, at least one MAC chip includes a first MAC chip, the first MAC chip including a data processing module, the data processing module being used to convert data between passive optical network communication protocol and other communication protocols.

[0040] In some embodiments, the first MAC chip further includes a serial deserialization module, which is connected to the data processing module and the OLT optical module. The serial deserialization module is used to serialize data from the data processing module and transmit it to the OLT optical module, or to deserialize data from the OLT optical module and transmit it to the data processing module.

[0041] In some embodiments, the first MAC chip further includes a data channel module, which is connected to the data processing module and is responsible for data scheduling and bandwidth allocation within the first MAC chip.

[0042] In some embodiments, the first MAC chip further includes a data interface module, which is connected to the SOC and the data channel module, and is used to provide a data interface for communication between the first MAC chip and the SOC.

[0043] In some embodiments, the first MAC chip further includes at least one of the following:

[0044] The control module is used to manage the various modules in the first MAC chip;

[0045] The clock module is used to provide clock signals;

[0046] Peripheral interface module;

[0047] Debug the interface module.

[0048] In some embodiments, the electronic device or optical box includes a third MAC chip, and the first MAC chip includes a data processing module for converting data between passive optical network communication protocol and other communication protocols.

[0049] In some embodiments, the third MAC chip further includes a serial deserialization module, which is connected to the data processing module and the ONU optical module. The serial deserialization module is used to serialize data from the data processing module and transmit it to the ONU optical module, or to deserialize data from the ONU optical module and transmit it to the data processing module.

[0050] In some embodiments, the third MAC chip further includes a data channel module connected to the data processing module, which is responsible for data scheduling and bandwidth allocation within the third MAC chip.

[0051] In some embodiments, the third MAC chip further includes at least one of the following:

[0052] The control module is used to manage the various modules in the third MAC chip;

[0053] The clock module is used to provide clock signals;

[0054] Business interface module;

[0055] Peripheral interface module;

[0056] Debug the interface module.

[0057] In some embodiments, a first electronic device among a plurality of electronic devices is configured to: in the event of an abnormal electrical connection and / or fiber optic connection with a central computing platform, perform data processing based on the computing power of the first electronic device to obtain a processing result, and perform work based on the processing result.

[0058] In some embodiments, the central computing platform is configured to: perform data processing based on its own computing capabilities and generate control commands;

[0059] The first electronic device among multiple electronic devices is configured to receive control commands sent by the central computing platform and perform operations based on the control commands, provided that the electrical connection and / or fiber optic connection with the central computing platform is normal.

[0060] In some embodiments, the first electronic device among a plurality of electronic devices is configured to monitor the electrical and / or fiber optic connections with the central computing platform based on a heartbeat mechanism.

[0061] In some embodiments, a first optical box among a plurality of optical boxes is used to supply power to at least one of the electronic devices connected to the first optical box.

[0062] In some embodiments, the first electronic device among a plurality of electronic devices has a data processing function.

[0063] In some embodiments, at least one of the plurality of electronic devices is electrically connected to the optical cell.

[0064] In some embodiments, the electronic devices and the optical box are electrically connected based on CAN or CAN FD.

[0065] In some embodiments, at least one of the plurality of electronic devices is connected to the optical fiber of the optical box for communication.

[0066] This application provides a vehicle including the electronic and electrical systems described in any of the above embodiments. Attached Figure Description

[0067] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0068] Figure 1 is an architecture diagram of an electronic and electrical system provided in an embodiment of this application;

[0069] Figure 2 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0070] Figure 3 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0071] Figure 4 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0072] Figure 5 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0073] Figure 6 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0074] Figure 7 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0075] Figure 8 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0076] Figure 9 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0077] Figure 10 is an architecture diagram of another electronic and electrical system provided in an embodiment of this application;

[0078] Figure 11 is a structural diagram of a cable and optical box provided in an embodiment of this application;

[0079] Figure 12 is an architecture diagram of an optical network provided in an embodiment of this application;

[0080] Figure 13 is an architectural diagram of an optical box provided in an embodiment of this application;

[0081] Figure 14 is an architecture diagram of a slave MAC chip provided in an embodiment of this application;

[0082] Figure 15 is an architecture diagram of a master MAC chip provided in an embodiment of this application;

[0083] Figure 16 is a schematic diagram of a scenario of an electronic and electrical system provided in an embodiment of this application;

[0084] Figure 17 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0085] Figure 18 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0086] Figure 19 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0087] Figure 20 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0088] Figure 21 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0089] Figure 22 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0090] Figure 23 is a schematic diagram of another scenario of the electronic and electrical system provided in the embodiment of this application;

[0091] Figure 24 is an architecture diagram of another optical network provided in an embodiment of this application;

[0092] Figure 25 is an architecture diagram of another optical network provided in an embodiment of this application;

[0093] Figure 26 is an architecture diagram of another optical network provided in an embodiment of this application;

[0094] Figure 27 is an architecture diagram of another optical network provided in an embodiment of this application;

[0095] Figure 28 is an architecture diagram of an ONU optical module provided in an embodiment of this application;

[0096] Figure 29 is an architecture diagram of an OLT optical module provided in an embodiment of this application. Detailed Implementation

[0097] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0098] In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or relative positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Unless otherwise specified, the above-mentioned orientational descriptions can be flexibly set in practical applications, provided that the relative positional relationships shown in the accompanying drawings are satisfied.

[0099] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0100] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "communication" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0101] In some embodiments, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes that element.

[0102] In some embodiments, the words "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0103] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0104] With the development of vehicle intelligence and the continuous increase in vehicle functional requirements, vehicle electronic and electrical systems also need to be redesigned. Specifically, the rapid increase in the requirements for intelligent driving levels (L1, L2, L3, etc.) requires sensors to be upgraded and onboard communication bandwidth to be increased in order to meet the timely response requirements of intelligent driving.

[0105] Furthermore, users' increasing emphasis on vehicle safety has led to higher requirements for vehicle safety redundancy. In addition, the increase in vehicle functions has resulted in an increase in hardware such as controllers, making the entire vehicle system more complex. At the same time, increasing communication bandwidth by adding signal transmission lines will lead to an increase in electromagnetic compatibility (EMC) interference problems, which will affect data transmission efficiency.

[0106] Against this backdrop, in order to address the problems of complex electronic and electrical systems and low communication efficiency in related technologies, this application provides an electronic and electrical system and a vehicle. The implementation methods of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0107] Figure 1 shows an architecture diagram of an electronic and electrical system provided in an embodiment of this application. The electronic and electrical system 100 includes a central computing platform 110, multiple optical boxes (such as a first optical box 121, a second optical box 122, a third optical box 123, and a fourth optical box 124), and multiple electronic devices (such as an actuator 131 and a sensor 132).

[0108] The central computing platform 110 is used to centrally manage electronic devices in various functional domains within the vehicle, and can integrate functions including but not limited to: gateway functions, powertrain domain control functions, chassis domain control functions, body domain control functions, cockpit domain control functions, and intelligent driving domain functions.

[0109] By setting up a central computing platform 110 to replace the various functional domain controllers, the number of electronic control units (ECUs) that need to be configured in the vehicle can be reduced, thus lowering the vehicle production cost; it can also reduce the length of the wiring harnesses that need to be laid in the vehicle, thereby reducing data transmission latency.

[0110] The optical box has the functions of signal conversion and forwarding. Among them, signal conversion refers to photoelectric conversion and / or electro-optical conversion of signals.

[0111] In this embodiment, the central computing platform 110 communicates with multiple optical boxes via optical fiber. Each of the multiple electronic devices communicates electrically and / or via optical fiber with at least one of the multiple optical boxes. At least two of the multiple optical boxes are connected by optical fiber. Thus, information sent from the central computing platform 110 to the electronic devices, or information sent from the electronic devices to the central computing platform 110, can be relayed through the optical boxes. By rationally configuring the topology between the central computing platform, the multiple optical boxes, and the multiple electronic devices, the communication latency between the central computing platform and the electronic devices can be reduced, and the communication efficiency can be improved.

[0112] In some embodiments, at least one of the plurality of electronic devices is connected to the optical fiber of the optical box for communication.

[0113] In some embodiments, at least one of the plurality of electronic devices is electrically connected to the optical cell.

[0114] In some embodiments, the electronic devices and the optical box are electrically connected based on Controller Area Network (CAN), CAN with Flexible Data Rate (CAN FD), or CAN with Extended Length (CAN XL).

[0115] The electronic and electrical system provided in this application embodiment connects the central computing platform 110 and each optical box via optical fiber to realize optical fiber communication between the central computing platform 110 and the optical box. Since optical fiber carries data by transmitting optical signals and optical signals do not cause electromagnetic interference, it can improve the data transmission rate in vehicle communication. Furthermore, using optical fiber to connect various devices in the electronic and electrical system can unify the data types between different devices, thereby unifying the device interface types and reducing the complexity of the electronic and electrical system.

[0116] In some embodiments, the optical box may have a power supply function. For example, a first optical box among a plurality of optical boxes is used to supply power to at least one of the electronic devices connected to the first optical box. In this way, supplying power to the electronic devices based on the optical box can simplify the layout of power supply lines.

[0117] In some embodiments, the central computing platform 110 and multiple optical boxes can be connected via structural cables. That is, the vehicle's backbone network is laid out using structural cables. The structural cables include power conductors and optical fibers. The power conductors connect to the vehicle's power supply system. Because optical fiber signal transmission is resistant to electromagnetic interference, placing the power conductors and optical fibers in the same structural cable saves material costs and wiring length. The power conductors in the structural cable can supply power to the central computing platform 110 and the optical boxes.

[0118] In some embodiments, the electronic device includes a sensor and / or an actuator.

[0119] For example, as shown in Figure 2, the sensor may include, but is not limited to: lidar, millimeter-wave radar, camera, temperature sensor, pressure sensor, and displacement sensor.

[0120] For example, actuators may include, but are not limited to: displays, airbags, head-up displays, color-changing canopies, and speakers.

[0121] In some embodiments, some or all of the multiple electronic devices (e.g., the first electronic device) may have data processing capabilities. Based on this, the electronic devices may include a microcontroller unit (MCU), which implements the data processing function. In this way, the central computing platform 110 and the electronic devices in the vehicle's electronic and electrical system can achieve hierarchical computing, thereby improving the safety redundancy of the electronic and electrical system.

[0122] In some embodiments, a sensor including an MCU may be referred to as a smart sensor, and an actuator including an MCU may be referred to as a smart actuator, without limitation.

[0123] In some embodiments, all smart sensors or smart actuators can transmit data to their respective connected optical boxes via a CAN network. The optical boxes then transmit the data to the central computing platform 110 via optical fiber, where the central computing platform 110 performs unified calculations and processing.

[0124] For example, the smart sensor can first collect vehicle signals, process them through its built-in MCU processor to obtain CAN FD signals, and then transmit the CAN FD signals to the optical box. After receiving the CAN FD signals, the optical box performs an electro-optical conversion to convert the CAN FD signals into optical signals, which are then transmitted to the central computing platform 110 through the optical fiber in the structural cable. The central computing platform 110 analyzes the optical signals to obtain the data they carry, performs calculations and decisions on the data, and finally outputs the calculation results as optical signals, which are then transmitted to the optical box through the optical fiber in the structural cable. The optical box converts the optical signals into CAN FD electrical signals and sends them to the smart actuator. The smart actuator analyzes the CAN FD signals to obtain the execution instructions they carry and responds to the execution instructions.

[0125] For example, the electronic device includes an optical module, which can directly convert electrical signals into optical signals within the electronic device and transmit them to the optical box via optical fiber. For instance, for some smart sensors with high bandwidth requirements, such as cameras, LiDAR, and millimeter-wave radar, by setting up optical modules in these smart sensors, communication with the optical box can be achieved via optical signals, thereby realizing high bandwidth and low latency data transmission.

[0126] In some embodiments, the central computing platform 110 is configured to: perform data processing based on its own computing power to generate control commands; and the first electronic device among the plurality of electronic devices is configured to: receive the control commands sent by the central computing platform 110 and perform operations based on the control commands, provided that the electrical connection and / or optical fiber connection with the central computing platform 110 is normal.

[0127] For example, referring to Figure 3, when the CAF FD connection between the second optical box 122 and the electronic device is not interrupted, the electronic device can upload data to the central computing platform 110 for processing, the central computing platform 110 generates control commands, and then the electronic device receives the control commands sent by the central computing platform 110 to perform its work.

[0128] In some embodiments, each of the plurality of electronic devices is further configured to: in the event of an abnormal electrical connection and / or fiber optic connection with the central computing platform 110, perform data processing based on its own computing capabilities to obtain a processing result, and then perform operations based on the processing result. Thus, even if the central computing platform 110 malfunctions, or communication between the central computing platform 110 and the electronic devices fails, the electronic devices will not malfunction due to being out of control of the central computing platform 110. The electronic devices can also maintain normal operation with the support of their own computing capabilities.

[0129] For example, as shown in FIG3, in the event of an interruption of the CAF FD connection between the first optical box 121 and the electronic device, the electronic device can use its own MCU to perform single-point calculation and local diagnosis, and execute the final calculation or diagnosis result.

[0130] In some embodiments, each of the aforementioned electronic devices is configured to monitor the electrical and / or fiber optic connections with the central computing platform 110 based on a heartbeat mechanism. That is, if an electronic device does not receive a signal (e.g., a heartbeat signal) from the central computing platform 110 within a preset time period, it can be considered that the electrical and / or fiber optic connections between the electronic device and the central computing platform 110 are abnormal.

[0131] Thus, this application adopts a high-performance central computing platform 110 as the central brain command center to integrate vehicle information and coordinate calculations; at the same time, it integrates a highly integrated general-purpose sentinel chip and a lightweight operating system in the intelligent sensors / actuators, which have their own computing power to achieve single-point calculation and local diagnosis. This allows the vehicle to operate independently when the central computing platform 110 fails or the network is paralyzed, thereby improving vehicle safety redundancy.

[0132] The following examples illustrate the communication process of electronic and electrical systems in different scenarios.

[0133] In one alternative implementation, when optical signals are used for transmission between various devices in an electronic and electrical system, the optical box may only serve as a relay, i.e., single-channel input and single-channel output without any processing; or it may serve as a combining / splitting function, such as multiple cameras sequentially acquiring optical image information and transmitting it to the central computing platform 110 via the optical box, or the central computing platform 110 transmitting the same image information simultaneously to multiple display devices via the optical box.

[0134] Scenario 1, as shown in Figure 4, takes electronic devices including a camera and a head-up display as an example. The camera captures optical image information of the rear of the vehicle and transmits the light signal to the central computing platform 110 via an optical box. The central computing platform 110 processes the image information carried by the light signal (such as restoration, enhancement, and cropping), and then transmits the light signal carrying the processed image information to the head-up display via the optical box, directly imaging on the windshield.

[0135] Scenario 2, as shown in Figure 5, takes an electronic device including a lidar as an example. The central computing platform 110 directly emits an optical signal (such as a laser) which is transmitted to the lidar via an optical box. The lidar transmits the optical signal to the external space of the vehicle in the form of a detection light wave. Then, the optical signal is reflected by an object and received again by the lidar. The received reflected optical signal is then transmitted back to the central computing platform 110 via the optical box.

[0136] Scenario 3, as shown in Figure 6, takes an electronic device including a camera and a display screen as an example. The camera internally converts the acquired electrical signals into light signals, which are then transmitted to the central computing platform 110 via an optical box. The central computing platform processes the image information carried by the light signals (such as restoration, enhancement, and stitching), and then outputs a light signal carrying the processed image information, which is transmitted to the display screen via the optical box. The display screen converts the light signals into electrical signals and drives the display unit to display the image information.

[0137] In another alternative implementation, when optical and electrical signals are transmitted between various devices in an electronic and electrical system, the optical box can have a photoelectric conversion function, that is, converting the received optical signal into an electrical signal output, or converting the received electrical signal into an optical signal output.

[0138] Scenario 4, as shown in Figure 7, takes electronic components including a camera and a color-changing canopy as an example. The camera receives ambient light and transmits the light signal to the central computing platform 110 via an optical box. After analysis and processing, the central computing platform 110 outputs the control signal in the form of an optical signal. The optical signal is converted into an electrical signal in the optical box and transmitted to the canopy to adjust its light transmittance.

[0139] Scenario 5, as shown in Figure 8, takes electronic devices including a camera and a speaker as an example. The camera captures facial image information of the driver and converts it into light signal output. The light signal is transmitted to the central computing platform 110 via the optical box. The central computing platform 110 processes the image information carried by the light signal (such as image processing, analysis, and recognition), encodes the reminder information into a light signal output, and converts the light signal into an electrical signal in the optical box, which is then transmitted to the speaker to drive the speaker to emit a prompt voice.

[0140] Scenario 6, as shown in Figure 9, takes electronic devices including battery management and pixel lights as an example. The battery management system outputs battery power information in the form of electrical signals, which are converted into optical signals by the optical box and transmitted to the central computing platform 110. The central computing platform 110 processes (such as parsing and calculating) the battery power information carried by the optical signals and converts it into image information, which is then output in the form of optical signals. The optical signals are directly transmitted to the pixel lights via the optical box, and the pixel lights display battery power and other information outside the vehicle.

[0141] Scenario 7, as shown in Figure 10, takes electronic devices including a wheel speed sensor and a display screen as an example. The wheel speed sensor transmits the collected wheel speed information to the optical box in the form of an electrical signal. The electrical signal is converted into an optical signal in the optical box and then transmitted to the central computing platform 110. The central computing platform 110 processes the wheel speed information carried by the optical signal and then converts it back into an optical signal for output. The optical signal is directly transmitted to the display screen via the optical box. The display screen then converts the optical signal back into an electrical signal to drive the display unit to display image information.

[0142] Scenario 8, as shown in Figure 11, takes electronic devices including a collision sensor and an airbag as an example. After the collision sensor detects a certain degree of collision, it outputs an electrical signal. The electrical signal is converted into a light signal in the optical box and transmitted to the central computing platform 110. The central computing platform 110 processes the collision information carried by the light signal and then transmits the execution command information to the optical box in the form of a light signal. The light signal is converted into an electrical signal in the optical box, driving the airbag to deploy.

[0143] The optional connection methods between optical boxes and between optical boxes and the central computing platform 110 are described below.

[0144] In one possible implementation, the multiple optical boxes include a first optical box 121 and a second optical box 122. The first optical box 121 is connected to the central computing platform 110 via optical fiber, and the second optical box 122 is connected to the first optical box 121 via optical fiber.

[0145] For example, as shown in FIG12, the first optical box 121 is connected to the central computing platform 110 via optical fiber, and the second optical box 122 is connected to the first optical box 121 via optical fiber. At this time, if the second optical box 122 emits an optical signal, the first optical box 121 is used to forward the optical signal to the central computing platform 110 without performing any other processing on the optical signal.

[0146] In another possible implementation, the multiple optical boxes include a first optical box 121 and a second optical box 122. The first optical box 121 is connected to the central computing platform via optical fiber, the second optical box is connected to the first optical box via optical fiber, and the second optical box is connected to the central computing platform via optical fiber.

[0147] For example, as shown in Figure 13, the first optical box 121 is connected to the central computing platform 110 via optical fiber, the second optical box 122 is connected to the first optical box 121 via optical fiber, and the second optical box 122 is connected to the central computing platform 110 via optical fiber. In this case, if the second optical box 122 emits an optical signal, the signal is split into two paths: one path can be forwarded to the central computing platform 110 via the first optical box 121, and the other path is directly transmitted to the central computing platform 110 via optical fiber.

[0148] In another possible implementation, multiple optical boxes include a first optical box, a second optical box, and a third optical box. The first optical box is connected to the central computing platform via optical fiber, the second optical box is connected to the first optical box via optical fiber, and the third optical box is connected to the second optical box and / or the first optical box via optical fiber.

[0149] In one example, as shown in Figure 14, the first optical box 121 is connected to the central computing platform 110 via optical fiber, the second optical box 122 is connected to the first optical box 121 via optical fiber, and the third optical box 123 is connected to the first optical box 121 via optical fiber. In this case, the optical signal emitted by the third optical box 123 is forwarded to the central computing platform 110 via the second optical box 122, without any further processing of the optical signal.

[0150] In another example, as shown in Figure 15, the first optical box 121 is connected to the central computing platform 110 via optical fiber, the second optical box 122 is connected to the first optical box 121 via optical fiber, and the third optical box 123 is connected to the second optical box 122 via optical fiber. In this case, the optical signal emitted by the third optical box 123 is split into two optical signals by the second optical box 122. One signal can be forwarded to the central computing platform 110 via the first optical box 121, while the other signal is directly transmitted to the central computing platform 110 via optical fiber.

[0151] In another example, as shown in Figure 16, the first optical box 121 is connected to the central computing platform 110 via optical fiber, the second optical box 122 is connected to the first optical box 121 via optical fiber, the third optical box 123 is connected to the second optical box 122 via optical fiber, and the third optical box 123 is connected to the first optical box 121 via optical fiber. In this case, the optical signal emitted by the third optical box 123 can be split into two paths. The first optical signal is further split into two paths by the second optical box 122, and then forwarded to the central computing platform 110 via the first optical box 121, or directly sent to the central computing platform 110 via optical fiber. The second optical signal can be forwarded to the central computing platform 110 via the first optical box 121.

[0152] In another possible implementation, multiple optical boxes include a first optical box, a second optical box, and a third optical box. The first optical box is connected to the central computing platform via optical fiber, the second optical box is connected to the first optical box via optical fiber, the third optical box is connected to the second optical box and / or the first optical box via optical fiber, and the third optical box is connected to the central computing platform via optical fiber.

[0153] For example, as shown in Figure 17, the first optical box 121 is connected to the central computing platform 110 via optical fiber, the second optical box 122 is connected to the first optical box 121 via optical fiber, the third optical box 123 is connected to the second optical box 122 via optical fiber, the third optical box 123 is connected to the first optical box 121 via optical fiber, and the third optical box 123 is connected to the central computing platform 110 via optical fiber. In this case, the optical signal emitted by the third optical box 123 can be divided into three paths. The first optical signal is further divided into two paths by the second optical box 122, and then forwarded to the central computing platform 110 by the first optical box 121, or directly sent to the central computing platform 110 via optical fiber. The second optical signal can be forwarded to the central computing platform 110 by the first optical box 121; the third optical signal can be directly sent to the central computing platform 110 via optical fiber.

[0154] In another possible implementation, multiple optical boxes include a first optical box, a second optical box, a third optical box, and a fourth optical box. The first optical box is connected to the central computing platform via optical fiber, the second optical box is connected to the first optical box via optical fiber, the third optical box is connected to the second optical box and / or the first optical box via optical fiber, the third optical box is connected to the central computing platform via optical fiber, and the fourth optical box is connected to the first optical box and the third optical box via optical fiber.

[0155] For example, as shown in Figure 18, the first optical box 121 is connected to the central computing platform 110 via optical fiber; the second optical box 122 is connected to the first optical box 121 via optical fiber; the third optical box 123 is connected to the second optical box 122 via optical fiber; the third optical box 123 is connected to the first optical box 121 via optical fiber; the third optical box 123 is connected to the central computing platform 110 via optical fiber; and the fourth optical box 124 is connected to the first optical box 121 via optical fiber; the fourth optical box 124 is also connected to the third optical box 123 via optical fiber. In this case, the optical signal emitted by the fourth optical box 124 can be split into two paths: one path is further split into three optical signals by the third optical box 123 and forwarded to the central computing platform 110; the other path is forwarded to the central computing platform by the first optical box 121.

[0156] The structure of an optical box will be described below using the first optical box among multiple optical boxes as an example.

[0157] Figure 19 shows an architectural diagram of a first optical box 121 provided in an embodiment of this application. The first optical box includes a beam splitter 1212 and / or an optical module 1211.

[0158] In some embodiments, when the first optical box is electrically connected to the electronic device, the first optical box 121 includes an optical module 1211, which is used for photoelectric conversion and / or electro-optical conversion, and is electrically connected to the electronic device.

[0159] In some embodiments, the optical splitter 1212 is used to achieve passive power distribution of the optical signal. The plurality of optical boxes also includes a second optical box 122, and the optical splitter 1212 of the first optical box 121 is connected via optical fiber to the optical module of the second optical box 122 and / or electronic devices. Alternatively, the optical splitter 1214 of the first optical box 121 is connected via optical fiber to the optical splitter of the second optical box 122.

[0160] In some embodiments, the first optical box 121 further includes an optical connector 1213, which is connected to the beam splitter 1212. The optical connector 1213 is used to couple optical fibers. The optical connector 1213 is connected to the optical module of the second optical box 122 and / or electronic devices via optical fibers; or the optical connector 1213 is connected to the beam splitter of the second optical box 122 via optical fibers.

[0161] In some embodiments, the first optical box 121 further includes a power distribution module 1214, which is connected to the vehicle's power supply system and is connected to the optical module 1211 to supply power to the optical module. Optionally, the power distribution module 1214 can also supply power to electronic devices connected to the first optical box.

[0162] Figure 20 shows an architectural diagram of a structural cable and a first optical box provided in an embodiment of this application. The structural cable 140 includes a power conductor 141 and an optical fiber 142. The first optical box 121 includes a control module 1215 and an optical module 1211. The control module 1215 is used to control and manage the first optical box.

[0163] In some embodiments, the power supply line 141 is used to transmit electrical energy to the first optical box 121, the optical fiber 142 is used to transmit optical signals to the first optical box 121, the electrical signal line is used to transmit electrical signals to the optical box 121, and the optical module 1211 is used to convert the electrical signals into optical signals and send them through the optical fiber.

[0164] For example, an electrical signal line can transmit a CAN FD signal, and an optical module 1211 can convert the received CAN FD signal into an optical signal and transmit it through an optical fiber.

[0165] In some embodiments, the first optical box 121 is also used to power at least one of a plurality of electronic devices. Thus, since the signal transmission method of optical fiber does not involve EMC interference coils, the power supply wires and optical fibers can be integrated into the structural cable, achieving the goal of saving material costs and cable length.

[0166] It should be understood that Figure 19 or Figure 20 is merely an exemplary structural schematic diagram of the first optical box 121. The first optical box 121 may not include some of the components shown in the structure of Figure 19 or Figure 20, or it may include components not shown in the structure of Figure 19 or Figure 20.

[0167] The following provides an exemplary description of the structure of the central computing platform, and uses this structure to illustrate the communication links between the central computing platform, the optical box, and electronic devices.

[0168] In some embodiments, as shown in FIG21, the central computing platform 110 includes a system on chip (SoC), at least one media access control (MAC) chip, and at least one optical line terminal (OLT) optical module.

[0169] An SOC can integrate processing units such as CPU and GPU to handle complex computing tasks, such as intelligent driving and vehicle status monitoring.

[0170] In some embodiments, the SOC may also be configured with a graphics processor and a multimedia processing unit, enabling it to provide functions such as high-definition video playback, audio processing, and speech recognition.

[0171] The MAC chip is responsible for enabling data transmission between nodes within the vehicle (such as the central computing platform and electronic devices). The MAC chip can control photoelectric conversion / electro-optical conversion.

[0172] The OLT optical module can convert electrical signals within the main OLT into optical signals for output, and it can also convert externally received optical signals into electrical signals. The optical signal from the OLT optical module can be split into multiple optical signals by a splitter in the optical box and distributed to multiple ONU optical modules; this stage is called downlink transmission. The optical signals from multiple ONU optical modules can be converged to a single splitter, combined, and uploaded to the OLT optical module; this stage is called uplink transmission.

[0173] In some embodiments, the central computing platform 110 may include multiple MAC chips, such as a first MAC chip and a second MAC chip. The first MAC chip is responsible for transmitting information sent and / or received by the SOC after the second MAC chip fails; the second MAC chip is responsible for transmitting information sent and / or received by the SOC after the first MAC chip fails.

[0174] In some embodiments, a MAC chip can connect to one or more OLT optical modules. When a MAC chip is connected to multiple OLT optical modules, if one OLT optical module connected to the MAC chip fails, the other OLT optical modules connected to the MAC chip can still operate normally, thereby ensuring that the MAC chip can communicate normally with the outside world.

[0175] In some embodiments, an optical box can connect to one or more OLT optical modules. When an optical box connects to multiple OLT optical modules, if one of the OLT optical modules connected to the optical box fails, the OLT optical modules connected to the optical box can still work normally, thereby ensuring that the optical box can communicate normally with the central computing platform 110.

[0176] In some embodiments, the multiple OLT optical modules connected to the optical box can be connected to the same MAC chip or to different MAC chips. It should be understood that when the multiple OLT optical modules connected to the optical box are connected to different MAC chips, if one MAC chip fails, the other MAC chips can still function normally, thereby ensuring that the optical box can communicate normally with the central computing platform 110.

[0177] In some embodiments, an electronic device can connect to one or more optical boxes. When an electronic device is connected to multiple optical boxes, if one optical box fails, the other optical boxes can continue to function normally, thereby ensuring that the electronic device can communicate normally with the central computing platform 110.

[0178] For example, the at least one MAC chip mentioned above includes a first MAC chip, which is in electrical communication with at least two OLT optical modules, including a first OLT optical module and a second OLT optical module. The first OLT optical module is responsible for transmitting information sent and / or received by the first MAC chip after the second OLT optical module fails; or, the second OLT optical module is responsible for transmitting information sent and / or received by the first MAC chip after the first OLT optical module fails.

[0179] For example, the aforementioned plurality of optical boxes may include a first optical box, which is connected to a first OLT optical module via optical fiber, and the first optical box is connected to a second OLT optical module via optical fiber.

[0180] For example, the aforementioned plurality of optical boxes may include a first optical box and a second optical box, wherein the first optical box is connected to the first OLT optical module via optical fiber, and the second optical box is connected to the second OLT optical module via optical fiber.

[0181] For example, the at least one MAC chip includes a first MAC chip and a second MAC chip, and the at least one OLT optical module includes a first OLT optical module and a third OLT optical module. The first MAC chip is in electrical communication with the first OLT optical module, and the second MAC chip is in electrical communication with the third OLT optical module.

[0182] For example, at least one OLT optical module further includes a second OLT optical module and a fourth OLT optical module, and the first MAC chip also communicates electrically with the second OLT optical module, and the second MAC chip also communicates electrically with the fourth OLT optical module.

[0183] For example, the plurality of optical boxes includes a first optical box, which is connected to a first OLT optical module via optical fiber, and the first optical box is also connected to a third OLT optical module via optical fiber.

[0184] For example, the multiple optical boxes include a first optical box and a second optical box. The first optical box is connected to a first OLT optical module via optical fiber, and the second optical box is connected to a third OLT optical module via optical fiber.

[0185] In some embodiments, the plurality of electronic devices include at least a first electronic device, and the first electronic device and the SOC have at least a first communication link and a second communication link; the first communication link is responsible for transmitting information between the first electronic device and the SOC after the second communication link fails; or, the second communication link is responsible for transmitting information between the first electronic device and the SOC after the first communication link fails.

[0186] In some embodiments, the first communication link and the second communication link are any two of the following links:

[0187] The communication link includes the first MAC chip, the first OLT optical module, and the first optical box;

[0188] The communication link includes the first MAC chip, the first OLT optical module, and the second optical box;

[0189] The communication link includes the first MAC chip, the second OLT optical module, and the first optical box;

[0190] The communication link includes the first MAC chip, the second OLT optical module, and the second optical box;

[0191] This includes the communication link between the second MAC chip, the third OLT optical module, and the first optical box;

[0192] This includes the communication link between the second MAC chip, the third OLT optical module, and the second optical box;

[0193] This includes the communication link between the second MAC chip, the fourth OLT optical module, and the first optical box;

[0194] This includes the communication link of the second MAC chip, the fourth OLT optical module, and the second optical box.

[0195] In this way, when the MAC chip fails, the OLT optical module fails, the trunk fiber breaks, the splitter fails, or the branch fiber breaks, it can seamlessly and quickly switch to the backup line to ensure the normal operation of the vehicle.

[0196] For example, as shown in Figure 22, consider electronic devices including a display screen and a seat. The display screen is connected to the same optical box via a branch optical fiber. This optical box is connected to two optical modules on the central computing platform via two independent trunk optical fibers (left side of the vehicle body and right side of the vehicle body). These two optical modules belong to the same MAC chip.

[0197] For example, the seat is connected to the same optical box via a CAN FD. This optical box is connected to two optical modules on the central computing platform via two independent backbone optical fibers (left side of the vehicle body and right side of the vehicle body). These two optical modules belong to the same MAC chip.

[0198] Thus, the redundant design allows for a quick and seamless switch to another link when the backbone fiber or optical module fails, ensuring driving safety.

[0199] Optionally, in vehicles with moderate functional safety, such as those containing a small number of cameras, displays, and other terminals, where the total bandwidth exceeds the limit of a single MAC chip in the vehicle's electronic and electrical system, one optical box can connect two OLT optical modules under different MAC chips, with the two MAC chips being redundant.

[0200] For example, as shown in Figure 23, consider electronic devices including a camera and a car window. The camera is connected to the same optical box via a branch optical fiber. This optical box is connected to two optical modules on the central computing platform via two independent trunk optical fibers (left side of the vehicle and right side of the vehicle). These two optical modules belong to two different MAC chips.

[0201] For example, the car window is connected to the same optical box via a CAN FD. This optical box is connected to two optical modules on the central computing platform via two independent backbone optical fibers (left side of the car body and right side of the car body). These two optical modules belong to two different MAC chips.

[0202] Thus, the redundant design allows for a quick and seamless switch to another link when the backbone fiber, optical module, or MAC chip fails, further ensuring driving safety.

[0203] Optionally, in vehicles with low bandwidth configuration and moderate functional safety, such as vehicles containing multiple cameras, displays, and other terminals, where the total bandwidth does not exceed the upper limit of a single MAC chip, an electronic device can connect to two different optical boxes under the same MAC chip.

[0204] For example, as shown in Figure 24, taking electronic devices including a panoramic camera and turn signals as an example, the panoramic camera is connected to different optical boxes (left side of the vehicle body and right side of the vehicle body) through two independent branch optical fibers (left A-pillar and right A-pillar). The two optical boxes are each connected to two optical modules on the central computing platform through the trunk optical fiber (left side of the vehicle body and right side of the vehicle body). These two optical modules belong to the same MAC chip.

[0205] For example, the turn signals are connected to different optical boxes via two independent CAN FDs. Each of the two optical boxes is connected to two optical modules on the central computing platform via a trunk optical fiber. These two optical modules belong to the same MAC chip.

[0206] Thus, the redundant design allows for a quick and seamless switch to another link when branch fiber, trunk fiber, or optical module fails, further ensuring driving safety.

[0207] Optionally, in vehicles with high bandwidth and high functional safety, such as those containing multiple cameras, displays, LiDAR, and other terminals, where the total bandwidth exceeds the limit of a single MAC chip, an electronic device can connect to different optical boxes under two different MAC chips.

[0208] For example, as shown in Figure 25, taking electronic devices including a lidar and an airbag as an example, the lidar is connected to two different optical boxes (left side of the vehicle and right side of the vehicle) via two independent branch optical fibers (left A-pillar and right A-pillar). The two optical boxes are connected to two optical modules on the central computing platform via two independent trunk optical fibers (left side of the vehicle and right side of the vehicle). These two optical modules belong to two different MAC chips.

[0209] For example, the airbag is connected to two different optical boxes (left side of the vehicle and right side of the vehicle) via two independent CAN FDs. The two optical boxes are connected to two optical modules on the central computing platform via two independent backbone optical fibers (left side of the vehicle and right side of the vehicle). These two optical modules belong to two different MAC chips.

[0210] In this way, the redundant design allows for a quick and seamless switch to another link regardless of which part of the link fails, further ensuring driving safety.

[0211] In this embodiment, the MAC chip used in the OLT optical module is called the master MAC chip, and the MAC chip used in the ONU optical module is called the slave MAC chip. Both the master and slave MAC chips are used to convert between the passive optical network (PON) protocol and other protocols.

[0212] The aforementioned optical box or electronic device may include a third MAC chip, which is a slave MAC chip. Figure 26 shows an architecture diagram of a third MAC chip provided in an embodiment of this application. The third MAC chip 200 includes a data processing module 210. The data processing module 210 is used to convert data between passive optical network communication protocols and other communication protocols. The English name for the data processing module can be: PON MAC module.

[0213] In some embodiments, the third MAC chip 200 further includes a serial deserialization module 220. The data channel module 230 is connected to the data processing module 210 and the ONU optical module. The serial deserialization module 220 is used to serialize the data from the data processing module and transmit it to the ONU optical module, or to deserialize the data from the ONU optical module and transmit it to the data processing module.

[0214] In some embodiments, the third MAC chip 200 further includes a data channel module 230, which is connected to the data processing module 210 and is used for data scheduling and bandwidth allocation.

[0215] In some embodiments, the third MAC chip 200 further includes a control module 240, which manages the various modules in the third MAC chip and has functions such as calculation, control, and management. The control module 240 can be a CPU.

[0216] In some embodiments, the third MAC chip 200 further includes a clock module 250, which generates a clock signal with a stable frequency and is used for tasks such as timing and counting.

[0217] In some embodiments, the third MAC chip further includes a debug interface module 260, which is used for software and hardware debugging and verification.

[0218] In some embodiments, the third MAC chip further includes at least one business interface module, which is used to connect electronic devices, such as external SoCs, cameras, displays, etc.

[0219] In some embodiments, the third MAC chip further includes at least one peripheral interface module 270, which may include an inter-integrated circuit (I2C) interface module, a serial peripheral interface (SPI) interface module, or a general-purpose input / output (GPIO) interface module.

[0220] For example, during the conversion of electrical signals into optical signals, high-bandwidth service electrical signals enter the slave-end MAC chip. Within the third MAC chip, service data packets enter the data processing module through the data channel module. The control module transmits control signals to the data processing module through the bus within the third MAC chip. Clock signals enter the third MAC chip through the clock interface, and external control signals enter through the peripheral interface and are transmitted to the data processing module through the bus. The data processing module identifies, slices, encapsulates, and packages the service data packets according to the control signals and clock signals. At this time, each service data packet is encapsulated and packaged into a unified optical signal protocol format. Subsequently, the data packets undergo serialization processing in the serial deserialization module to obtain serial data. The serial data is output from the third MAC chip to the laser to be converted into an optical signal.

[0221] For example, during the conversion of optical signals into electrical signals, the optical signals are transformed into serial electrical signals by a detector and enter the third MAC chip; the serial electrical signals are deserialized in the serial deserialization module and then enter the data processing module; the control module transmits control signals to the data processing module through the chip's internal bus; the clock signal enters the third MAC chip through the clock interface, and the external control signal enters through the peripheral interface and is transmitted to the data processing module through the bus; the data processing module identifies, slices, encapsulates, and packages data packets according to the control signals and clock signals. At this time, each optical signal protocol data is encapsulated and packaged into each service protocol format, and finally, the service data packets are output to the outside of the third MAC chip through the data channel module at each interface.

[0222] For example, the aforementioned central computing platform may include a first MAC chip, which is the master MAC chip. Figure 27 shows an architecture diagram of a first MAC chip provided in an embodiment of this application. The first MAC chip 300 includes a data processing module 310. The data processing module 310 is used to convert data between passive optical network communication protocols and other communication protocols. The English name for the data processing module can be: PON MAC module.

[0223] In some embodiments, the first MAC chip further includes a serial deserialization module 320, which is connected to the data processing module 310 and the OLT optical module. The serial deserialization module 320 is used to serialize data from the data processing module 310 and transmit it to the OLT optical module, or to deserialize data from the OLT optical module and transmit it to the data processing module 310.

[0224] In some embodiments, the first MAC chip 300 further includes a data channel module 330, which is connected to the data processing module 310 and is used for data scheduling and bandwidth allocation.

[0225] In some embodiments, the first MAC chip 300 further includes a data interface module. One end of the data interface module is adapted to connect to the SOC, and the other end is connected to the data channel module to support data communication between the SOC and the host MAC chip. The data interface module may include, but is not limited to, a double data rate (DDR) interface module and a peripheral component interconnect express (PCIe) interface module.

[0226] In some embodiments, the first MAC chip 300 further includes a control module 340, which manages the various modules within the chip and has functions of internal chip calculation, management, and control. The control module 340 may be a CPU.

[0227] In some embodiments, the first MAC chip 300 further includes a clock module 350, which generates a clock signal with a stable frequency and is used for tasks such as timing and counting.

[0228] In some embodiments, the first MAC chip 300 further includes a debug interface module 360, which is used for software and hardware debugging and verification.

[0229] In some embodiments, the first MAC chip 300 further includes at least one peripheral interface module 370, which may include an inter-integrated circuit (I2C) interface module, a serial peripheral interface (SPI) interface module, or a general-purpose input / output (GPIO) interface module.

[0230] The workflow of the first MAC chip in converting optical signals into electrical signals or in converting electrical signals into optical signals is similar to that of the third MAC chip, and will not be described in detail here.

[0231] In some embodiments, the master MAC chip can convert the high-bandwidth signal of the central computing platform into a PON signal, which is then transmitted in the optical fiber after photoelectric conversion; the slave MAC chip can convert the high-bandwidth signals of the camera, display screen, lidar, sensor, and actuator into PON signals, which are then transmitted in the optical fiber after photoelectric conversion.

[0232] In this way, by using the MAC chip in the central computing platform and the MAC chip in the electronic device, the data transmission protocol is converted to the PON protocol so that the data to be transmitted can be carried by optical signals, avoiding EMC interference and improving the efficiency of data transmission.

[0233] Figure 28 shows an architecture diagram of an ONU optical module provided in an embodiment of this application. The ONU optical module 400 includes a laser 401, a laser driver 402, a clock recovery circuit 403, a MAC chip 404, an MCU 405, a wavelength division multiplexer 406, a photodetector 407, a transimpedance amplifier 408, a linear amplifier 409, and a clock recovery circuit 410.

[0234] For example, taking the transmission of optical signals by the ONU optical module as an example. The electrical signals of the electronic devices are first input into the MAC chip 404 chip in the ONU optical module 401 for processing (such as protocol conversion, encapsulation into frames, data serialization, etc.), then the clock information is embedded through the clock recovery circuit 403, and finally, driven by the electrical signal of the laser driver 402, the laser 401 emits laser signals, which enter the optical fiber through the wavelength division multiplexer 406.

[0235] For example, taking the reception of optical signals by the ONU optical module as an example. The optical signal from the optical fiber enters the photodetector 407 via the wavelength division multiplexer 406. The photodetector 407 generates a current under illumination to form an electrical signal. The transimpedance amplifier 408 amplifies the weak current signal and converts it into a voltage signal. The linear amplifier 409 further processes the voltage signal (such as amplification, shaping, filtering, etc.). Then, the clock information is extracted by the clock recovery circuit 410, and the data signal is recovered using the clock information as the sampling basis. Finally, the data signal is transmitted to the electronic device in the form of an electrical signal through the MAC chip 404.

[0236] Figure 29 shows an architecture diagram of an OLT optical module provided in an embodiment of this application. The OLT optical module 500 includes a clock recovery circuit 501, a laser driver 502, a laser 503, a wavelength division multiplexer 504, an MCU 505, a clock recovery circuit 506, a linear amplifier 507, a transimpedance amplifier 508, and a photodetector 509.

[0237] For example, taking the transmission of optical signals by an OLT optical module as an example. The electrical signal emitted by the SoC is input to the MAC chip for processing. Then, the electrical signal enters the clock recovery circuit 501 in the OLT optical module 500 to embed clock information. Finally, driven by the electrical signal of the laser driver 502, the laser 503 emits a laser signal, which enters the optical fiber through the wavelength division multiplexer 504.

[0238] For example, taking the optical signal received by the OLT optical module as an example, the optical signal from the optical fiber enters the photodetector 509 via the wavelength division multiplexer 504. The photodetector 509 generates a current under illumination, forming an electrical signal. The transimpedance amplifier 508 amplifies the weak current signal and converts it into a voltage signal. The linear amplifier 507 further processes the signal, and then the clock information is extracted by the clock recovery circuit 506. The data signal is recovered using the clock information as the sampling basis. Finally, the data signal is transmitted to the SoC in the form of an electrical signal through the MAC chip.

[0239] In the embodiments provided in this application, it should be understood that the disclosed system can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0240] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0241] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0242] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic and electrical system, characterized in that, The electronic and electrical system includes a central computing platform, multiple optical boxes, and multiple electronic devices; the central computing platform communicates with the multiple optical boxes via optical fiber, each of the multiple electronic devices communicates with at least one of the multiple optical boxes via electrical and / or optical fiber, and at least two of the multiple optical boxes are connected to each other via optical fiber.

2. The electronic and electrical system according to claim 1, characterized in that, The plurality of optical boxes includes a first optical box and a second optical box. The first optical box is connected to the central computing platform via optical fiber, and the second optical box is connected to the first optical box via optical fiber.

3. The electronic and electrical system according to claim 2, characterized in that, The second optical box is connected to the central computing platform via optical fiber.

4. The electronic and electrical system according to claim 3, characterized in that, The plurality of optical boxes includes a third optical box, which is connected to the second optical box and / or the first optical box via optical fiber.

5. The electronic and electrical system according to claim 4, characterized in that, The third optical box is connected to the central computing platform via optical fiber.

6. The electronic and electrical system according to claim 5, characterized in that, The plurality of optical boxes also includes a fourth optical box, which is connected to the first optical box and the third optical box via optical fiber.

7. The electronic and electrical system according to any one of claims 1 to 6, characterized in that, The plurality of electronic devices include sensors and / or actuators.

8. The electronic and electrical system according to claim 1, characterized in that, The plurality of optical boxes includes a first optical box, which includes a beam splitter and / or an optical module.

9. The electronic and electrical system according to claim 8, characterized in that, The first optical box includes a beam splitter; the beam splitter is connected to the second optical box and / or the optical module of the electronic device via an optical fiber; or the beam splitter is connected to the beam splitter of the second optical box via an optical fiber, and the plurality of optical boxes includes the second optical box.

10. The electronic and electrical system according to claim 9, characterized in that, The first optical box further includes an optical connector, which is connected to the beam splitter; the optical connector is connected to the optical module of the second optical box and / or electronic device via an optical fiber; or the optical connector is connected to the beam splitter of the second optical box via an optical fiber.

11. The electronic and electrical system according to claim 8, characterized in that, The first optical box includes an optical module, which is used for photoelectric conversion and / or electro-optical conversion, and is electrically connected to the electronic device.

12. The electronic and electrical system according to claim 11, characterized in that, The first optical box also includes a power distribution module, which is connected to the vehicle's power supply system and is connected to the optical module to supply power to the optical module.

13. The electronic and electrical system according to claim 1, characterized in that, The central computing platform includes a system-on-a-chip (SOC), at least one media access control (MAC) chip, and at least one optical line terminal (OLT) optical module; the SOC communicates electrically with the plurality of MAC chips, and the MAC chips communicate electrically with at least one of the OLT optical modules.

14. The electronic and electrical system according to claim 13, characterized in that, The at least one MAC chip includes a first MAC chip, which is in electrical communication with at least two OLT optical modules. The at least two OLT optical modules include a first OLT optical module and a second OLT optical module. The first OLT optical module is responsible for transmitting information sent and / or received by the first MAC chip after the second OLT optical module fails. Alternatively, the second OLT optical module may be responsible for transmitting information sent and / or received by the first MAC chip after the first OLT optical module fails.

15. The electronic and electrical system according to claim 14, characterized in that, The plurality of optical boxes includes a first optical box, which is connected to the first OLT optical module via optical fiber, and the first optical box is connected to the second OLT optical module via optical fiber.

16. The electronic and electrical system according to claim 14, characterized in that, The plurality of optical boxes includes a first optical box and a second optical box; the first optical box is connected to the first OLT optical module via optical fiber, and the second optical box is connected to the second OLT optical module via optical fiber.

17. The electronic and electrical system according to claim 16, characterized in that, The first optical box is also connected to the second OLT optical module via optical fiber, and the second optical box is also connected to the first OLT optical module via optical fiber.

18. The electronic and electrical system according to claim 13, characterized in that, The at least one MAC chip includes a first MAC chip and a second MAC chip; the first MAC chip is responsible for transmitting the information sent and / or received by the SOC after the second MAC chip fails. Alternatively, the second MAC chip may be responsible for transmitting the information sent and / or received by the SOC after the first MAC chip fails.

19. The electronic and electrical system according to claim 18, characterized in that, At least one of the OLT optical modules includes a first OLT optical module and a third OLT optical module, wherein the first MAC chip is electrically connected to the first OLT optical module, and the second MAC chip is electrically connected to the third OLT optical module.

20. The electronic and electrical system according to claim 19, characterized in that, At least one of the OLT optical modules further includes a second OLT optical module and a fourth OLT optical module, the first MAC chip also communicates electrically with the second OLT optical module, and the second MAC chip also communicates electrically with the fourth OLT optical module.

21. The electronic and electrical system according to claim 19 or 20, characterized in that, The plurality of optical boxes includes a first optical box, which is connected to the first OLT optical module via optical fiber, and the first optical box is also connected to the third OLT optical module via optical fiber.

22. The electronic and electrical system according to claim 19 or 20, characterized in that, The plurality of optical boxes include a first optical box and a second optical box. The first optical box is connected to the first OLT optical module via optical fiber, and the second optical box is connected to the third OLT optical module via optical fiber.

23. The electronic and electrical system according to any one of claims 13 to 22, characterized in that, The plurality of electronic devices includes at least a first electronic device, and the first electronic device has a first communication link and a second communication link with the SOC; the first communication link is responsible for transmitting information between the first electronic device and the SOC after the second communication link fails. Alternatively, the second communication link may be responsible for transmitting information between the first electronic device and the SOC after the first communication link fails.

24. The electronic and electrical system according to claim 23, characterized in that, The first communication link and the second communication link are any two of the following links: a communication link including a first MAC chip, a first OLT optical module, and a first optical box; a communication link including a first MAC chip, a first OLT optical module, and a second optical box; a communication link including a first MAC chip, a second OLT optical module, and a first optical box; a communication link including a first MAC chip, a second OLT optical module, and a second optical box; a communication link including a second MAC chip, a third OLT optical module, and a first optical box; a communication link including a second MAC chip, a fourth OLT optical module, and a first optical box; and a communication link including a second MAC chip, a fourth OLT optical module, and a second optical box.

25. The electronic and electrical system according to claim 13, characterized in that, The at least one MAC chip includes a first MAC chip, which includes a data processing module for converting data between passive optical network communication protocols and other communication protocols.

26. The electronic and electrical system according to claim 25, characterized in that, The first MAC chip further includes a serial deserialization module, which is connected to the data processing module and the OLT optical module. The serial deserialization module is used to serialize data from the data processing module and transmit it to the OLT optical module, or to deserialize data from the OLT optical module and transmit it to the data processing module.

27. The electronic and electrical system according to claim 26, characterized in that, The first MAC chip also includes a data channel module, which is connected to the data processing module and is responsible for data scheduling and bandwidth allocation within the first MAC chip.

28. The electronic and electrical system according to claim 27, characterized in that, The first MAC chip further includes a data interface module, which is connected to the SOC and the data channel module, and is used to provide a data interface for communication between the first MAC chip and the SOC.

29. The electronic and electrical system according to any one of claims 26 to 28, characterized in that, The first MAC chip further includes at least one of the following: a control module for managing the various modules in the first MAC chip; a clock module for providing clock signals; a peripheral interface module; and a debug interface module.

30. The electronic and electrical system according to claim 1, characterized in that, The electronic device or the optical box includes a third MAC chip, which includes a data processing module for converting data between passive optical network communication protocols and other communication protocols.

31. The electronic and electrical system according to claim 30, characterized in that, The third MAC chip further includes a serial deserialization module, which is connected to the data processing module and the ONU optical module. The serial deserialization module is used to serialize data from the data processing module and transmit it to the ONU optical module, or to deserialize data from the ONU optical module and transmit it to the data processing module.

32. The electronic and electrical system according to claim 31, characterized in that, The third MAC chip also includes a data channel module, which is connected to the data processing module and is responsible for data scheduling and bandwidth allocation within the third MAC chip.

33. The electronic and electrical system according to any one of claims 30 to 32, characterized in that, The third MAC chip further includes at least one of the following: a control module for managing the various modules in the third MAC chip; a clock module for providing clock signals; a service interface module; a peripheral interface module; and a debugging interface module.

34. The electronic and electrical system according to any one of claims 1-33, characterized in that, The first electronic device among the plurality of electronic devices is configured to: in the event of an abnormal electrical connection and / or optical fiber connection with the central computing platform, perform data processing based on the computing power of the first electronic device to obtain a processing result, and perform work based on the processing result.

35. The electronic and electrical system according to any one of claims 1-34, characterized in that, The central computing platform is configured to: process data based on its own computing power and generate control commands; the first electronic device among the plurality of electronic devices is configured to: receive control commands sent by the central computing platform and perform operations based on the control commands, provided that the electrical connection and / or optical fiber connection with the central computing platform is normal.

36. The electronic and electrical system according to any one of claims 34 or 35, characterized in that, The first of the plurality of electronic devices is configured to monitor the electrical and / or fiber optic connections with the central computing platform based on a heartbeat mechanism.

37. The electronic and electrical system according to any one of claims 1 to 36, characterized in that, The first optical box among the plurality of optical boxes is used to supply power to at least one of the electronic devices connected to the first optical box.

38. The electronic and electrical system according to any one of claims 1-37, characterized in that, The first electronic device among the plurality of electronic devices has data processing capabilities.

39. The electronic and electrical system according to any one of claims 1-38, characterized in that, The plurality of electronic devices includes at least one electronic device that is electrically connected to the optical box.

40. The electronic and electrical system according to claim 39, characterized in that, The electronic devices and the optical box are electrically connected via CAN or CAN FD.

41. The electronic and electrical system according to any one of claims 1-38, characterized in that, The plurality of electronic devices includes at least one electronic device that is optically connected to the optical box.

42. A vehicle, characterized in that, Includes the electronic and electrical systems as described in any one of claims 1 to 41.

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