Thermally-induced deformation transfer device and method based on graphene PTFE composite material

Abstract

The invention relates to the technical field of micro-nano manufacturing, in particular to a thermally induced deformation transfer device and method based on a graphene PTFE composite material, the thermally induced deformation transfer device based on the graphene PTFE composite material comprises a base, a first precision displacement table, a heat sink, a TEC module, a sample table, a second precision displacement table and a clamp; the top of the sample table is provided with a circular boss; one two-dimensional material sample is fixed on the circular boss through vacuum adsorption, another two-dimensional material sample needing to be transferred is clamped on the clamp through the heat release adhesive PDMS, the TEC module is controlled to be heated to the target temperature according to the calculated temperature rise rate, the sample table and the circular boss generate displacement in the vertical direction, and the two-dimensional material sample needs to be transferred. The two-dimensional material samples are attached without vibration, and the problem that in the prior art, when the two-dimensional material samples are attached, tiny vibration or impact or pressure concentration is introduced at the contact moment, and consequently the interface quality of the two-dimensional material is reduced is solved.

Description

Technical Field

[0001] This invention relates to the field of micro-nano manufacturing technology, and in particular to a thermo-induced deformation transfer device and method based on graphene-PTFE composite material. Background Technology

[0002] Two-dimensional materials, such as graphene and transition metal sulfides (TMDs), have become core materials for cutting-edge scientific research and the future semiconductor industry due to their unique electrical, optical, and mechanical properties. Stacking different types of two-dimensional materials at specific turns to form van der Waals heterojunctions can produce novel physical phenomena such as superconductivity and Mott insulators, forming the basis for constructing new optoelectronic devices. However, the fabrication of high-quality, pollution-free, and bubble-free van der Waals heterojunctions, especially achieving precise bonding at the final micrometer scale between layers, has always been a key technological challenge in this field.

[0003] Currently, the main technical approaches to achieving precise bonding of two-dimensional materials can be categorized as follows: **Mechanical screw and micrometer head drive scheme:** This is the most traditional and widely used approach. It utilizes a rotating precision screw or micrometer head to convert rotational motion into linear motion via threaded transmission, slowly pushing a sample-carrying platform closer to a fixed platform. This scheme typically relies on manual operation or stepper motor drive, achieving displacement resolution at the micrometer level. To achieve nanometer-level approximation, levers or deceleration mechanisms are often required. **Piezoelectric ceramic drive scheme:** This is currently the mainstream high-precision approach. It utilizes the inverse piezoelectric effect of piezoelectric ceramics, which produces minute deformations when a voltage is applied. Through stacking or multi-layer structures, piezoelectric actuators can provide displacement at nanometer resolution. This scheme usually requires the use of strain gauges or capacitive sensors to form a closed-loop control system to compensate for its inherent nonlinearities (such as hysteresis and creep), thereby achieving precise displacement positioning.

[0004] The aforementioned existing technical solutions all have inherent defects that are difficult to overcome when achieving the ultimate bonding of two-dimensional materials. Among them, the defects of mechanical screw and differential head drive solutions are as follows: mechanical transmission inevitably has friction and gaps, which easily produce "stick-slip" phenomena when starting, stopping and changing direction, introducing micron or even nanometer-level vibrations and impacts, which can easily damage fragile two-dimensional materials or produce wrinkles. Its displacement is essentially a discrete "step" approximation, making it difficult to achieve a truly continuous "creep" bonding. At the same time, it is a point drive or a small area drive, which makes it difficult to ensure the uniformity of bonding pressure across the entire interface (usually tens of micrometers), which can easily lead to air bubble residue. In addition, manual operation relies on experience and has poor repeatability. On the other hand, achieving a high-precision electric control system is complex and cannot fundamentally solve the defects of the mechanical transmission itself. The drawbacks of piezoelectric ceramic drive schemes are as follows: piezoelectric ceramics exhibit severe hysteresis and creep effects, resulting in poor open-loop control accuracy. Real-time compensation relies on high-precision sensors and complex closed-loop control algorithms, leading to system complexity and high cost. Despite high displacement resolution, piezoelectric ceramic drives are inherently rigid. Without a high-bandwidth and high-sensitivity force feedback system, even a small overshoot can easily apply excessive instantaneous pressure to the two-dimensional material, causing damage. Furthermore, large-stroke, high-precision piezoelectric platforms are extremely expensive. To compensate for insufficient stroke, a series scheme of stepper motor coarse positioning and piezoelectric ceramic fine positioning is often used. However, this increases system complexity, size, and cumulative error, without solving the problem of rigid impact at the moment of contact.

[0005] In summary, the inherent defects of the existing technology can be attributed to the fact that, in the final bonding stage, the "rigidity" and "discreteness" of the driving method are fundamentally contradictory to the "flexibility", "uniformity" and "undisturbed" requirements of two-dimensional materials. Whether mechanical or piezoelectric, it is difficult to avoid introducing minute vibrations, impacts or pressure concentrations at the moment of contact, which leads to a decline in the interface quality of two-dimensional materials. Summary of the Invention

[0006] The purpose of this invention is to provide a thermo-induced deformation transfer device and method based on graphene-PTFE composite material, which aims to solve the problem that in the prior art, when bonding two-dimensional materials, a small vibration, impact or pressure concentration is introduced at the moment of contact, which leads to a decrease in the interface quality of the two-dimensional materials.

[0007] To achieve the above objectives, in a first aspect, the present invention provides a thermo-induced deformation transfer device based on graphene-PTFE composite material, comprising a base, a first precision displacement stage, a heat sink, a TEC module, a sample stage, a second precision displacement stage, and a fixture; The first precision displacement stage is disposed on the top of the base, the heat sink is disposed on the top of the first precision displacement stage, the TEC module is disposed inside the heat sink, the sample stage is disposed on the top of the heat sink, the top of the sample stage has a circular boss, the circular boss is provided with vacuum adsorption channels, the second precision displacement stage is disposed on the top of the base, and the clamp is disposed on the second precision displacement stage.

[0008] The heat-induced deformation transfer device based on graphene-PTFE composite material also includes a water-cooled pipe; the water-cooled pipe is disposed on the side of the heat sink.

[0009] The thermally induced deformation transfer device based on graphene-PTFE composite material also includes a temperature sensor; the temperature sensor is disposed inside the circular boss.

[0010] The TEC module includes a standard TEC unit and a high-temperature resistant TEC unit. The standard TEC unit is disposed inside the heat sink, and its hot end is in contact with the heat sink. The high-temperature resistant TEC unit is disposed on top of the standard TEC unit, and its hot end is attached to the cold end of the standard TEC unit. The cold end of the high-temperature resistant TEC unit is attached to the bottom surface of the sample stage via thermally conductive silicone grease.

[0011] The sample stage and the circular boss are both made of PTFE composite material with 20% graphene doping. Their effective thermal deformation length L is 12.5 mm, and their displacement ΔL and temperature difference ΔT satisfy the following relationship: ΔL = L × α × ΔT, where α is the coefficient of thermal expansion of the composite material, and the coefficient of thermal expansion α is 80 × 10⁻⁶. -6 / ℃, the displacement produced by each 1℃ temperature rise is 1μm.

[0012] Secondly, the present invention also provides a method for thermally induced deformation transfer based on graphene-PTFE composite materials, comprising: A two-dimensional material sample is fixed on a circular protrusion by vacuum adsorption, and another two-dimensional material sample to be transferred is clamped on the fixture using heat-release adhesive PDMS. By operating the first and second precision displacement stages, preliminary macroscopic alignment of the two two-dimensional material samples is completed under the microscope; The control software calculates the required temperature rise and heating rate based on the target displacement and the desired bonding speed. The TEC module is controlled to heat the sample to the target temperature according to the calculated temperature rise rate. During this process, the sample stage and the circular boss are displaced in the vertical direction to achieve vibration-free bonding of the two two-dimensional material samples. After the two two-dimensional material samples are bonded together, the TEC module is cooled down, and the sample stage and circular boss shrink and reset, ready for the next operation.

[0013] This invention discloses a thermo-deformation transfer device and method based on graphene-PTFE composite material. A two-dimensional material sample is fixed to a circular protrusion via vacuum adsorption. Another two-dimensional material sample to be transferred is clamped onto the fixture using heat-release adhesive PDMS. The first and second precision displacement stages are operated to achieve preliminary macroscopic alignment of the two two-dimensional material samples under a microscope. Control software calculates the required temperature rise and heating rate based on the target displacement and desired bonding speed. The TEC module is controlled to heat the sample to the target temperature according to the calculated heating rate. During this process, the sample stage and the circular protrusion... The system generates vertical displacement, achieving vibration-free and impact-free "thermal creep" bonding of two two-dimensional material samples. Due to the overall expansion, the bonding pressure is evenly distributed across the entire contact surface, effectively expelling interfacial gases. After reaching the target temperature, the system maintains this temperature for 10-60 seconds (the holding time is adjustable) to ensure thorough bonding. After the two two-dimensional material samples are bonded, the clamp is slowly lifted using a second precision displacement stage to separate the upper and lower samples. The bonding can then be observed under a microscope. Once correct bonding is confirmed, the TEC module is controlled to cool down, and the sample stage and the circular boss retract and reset, ready for the next operation. This method solves the problem in existing technologies where minute vibrations, impacts, or pressure concentrations are introduced at the moment of contact during two-dimensional material bonding, leading to a decrease in the interface quality of the two-dimensional materials. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0015] Figure 1 This is a schematic diagram of the structure of a thermo-induced deformation transfer device based on graphene-PTFE composite material according to the present invention.

[0016] Figure 2 This is a schematic diagram of the structure of a thermo-induced deformation transfer device based on graphene-PTFE composite material according to the present invention from another perspective.

[0017] Figure 3 This is a cross-sectional view of a thermo-induced deformation transfer device based on graphene-PTFE composite material according to the present invention.

[0018] Figure 4 yes Figure 3 A magnified view of detail A.

[0019] Figure 5This is a control block diagram of a thermo-induced deformation transfer device based on graphene-PTFE composite material according to the present invention.

[0020] Figure 6 This is a flowchart of a thermally induced deformation transfer method based on graphene-PTFE composite material according to the present invention.

[0021] 1-Base, 2-First Precision Displacement Stage, 3-Heat Sink, 4-TEC Module, 5-Sample Stage, 6-Second Precision Displacement Stage, 7-Clamp, 8-Circular Boss, 9-Vacuum Adsorption Channel, 10-Water Cooling Pipe, 11-Temperature Sensor, 12-Standard TEC Unit, 13-High Temperature Resistant TEC Unit, 14-PC Host Computer, 15-Control Box, 16-Vacuum Controller, 17-Temperature Controller, 18-Main Controller. Detailed Implementation

[0022] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0023] Firstly, please refer to Figures 1-5 This invention provides a thermo-induced deformation transfer device based on graphene-PTFE composite material, including a base 1, a first precision displacement stage 2, a heat sink 3, a TEC module 4, a sample stage 5, a second precision displacement stage 6, a fixture 7, a water-cooled pipe 10, and a temperature sensor 11; the TEC module 4 includes a standard TEC unit 12 and a high-temperature resistant TEC unit 13; the aforementioned solution solves the problem that in the prior art, when bonding two-dimensional materials, minute vibrations, impacts, or pressure concentrations are introduced at the moment of contact, resulting in a decrease in the interface quality of the two-dimensional materials.

[0024] In this specific embodiment, the first precision displacement stage 2 is disposed on the top of the base 1, the heat sink 3 is disposed on the top of the first precision displacement stage 2, the TEC module 4 is disposed inside the heat sink 3, the sample stage 5 is disposed on the top of the heat sink 3, and the sample stage 5 has a circular boss 8 on its top, the circular boss 8 having vacuum adsorption channels 9, the second precision displacement stage 6 is disposed on the top of the base 1, and the clamp 7 is disposed on the second precision displacement stage 6. The sample stage 5 and the circular boss 8 are integrally formed and are both precision machined from 20% graphene-doped PTFE composite material, which has a diameter of approximately 80 × 10⁻⁶ mm. -6 The high coefficient of thermal expansion at / ℃ and approximately 4 W·m -1 ·K -1The thermal conductivity is [not specified]. The effective thermal deformation length L of the sample stage 5 and the circular boss 8 is designed to be 12.5 mm, and the displacement ΔL and temperature difference ΔT strictly satisfy ΔL = L × α × ΔT. Calculations show that when L = 12.5 mm, α = 80 × 10 [not specified]. -6 At a temperature of ℃, a precise displacement of 1μm can be generated for every 1℃ temperature rise; therefore, displacement control accuracy below 10nm can be easily achieved through the industry-standard ±0.1℃ temperature control accuracy. Taking a 10μm displacement requirement as an example, only a temperature rise of 12.5℃ is required, which is far below the softening point or upper limit of the working temperature of commonly used polymer materials (such as PDMS), ensuring the stability and reliability of the drive. The heat sink 3 is made of oxygen-free copper. The vacuum adsorption channel 9 is connected to an external vacuum generator. In use, a two-dimensional material sample is fixed on the circular protrusion 8 by vacuum adsorption, and another two-dimensional material sample to be transferred is clamped on the fixture 7 using heat-release adhesive PDMS; the first precision displacement stage 2 and the second precision displacement stage 6 are operated to complete the preliminary macroscopic alignment of the two two-dimensional material samples under a microscope; the control software calculates the required temperature rise and heating rate according to the target displacement and the desired bonding speed; the TEC module 4 is controlled to heat to the target temperature according to the calculated temperature rise rate. During this process, the sample stage 5 and the circular protrusion 8 generate vertical displacement. The linear displacement enables vibration-free and impact-free "thermal creep" bonding of two two-dimensional material samples. Due to the overall expansion, the bonding pressure is evenly distributed across the entire contact surface, effectively expelling interfacial gases. After reaching the target temperature, the system maintains this temperature for 10-60 seconds (the holding time is adjustable) to ensure thorough bonding. After the two two-dimensional material samples are bonded, the clamp 7 is slowly lifted by the second precision displacement stage 6 to separate the upper and lower samples. The bonding condition can then be observed under a microscope. Once correct bonding is confirmed, the TEC module 4 is controlled to cool down, and the sample stage 5 and the circular protrusion 8 retract and reset, ready for the next operation. This method solves the problem in existing technologies where minute vibrations, impacts, or pressure concentrations are introduced at the moment of contact during two-dimensional material bonding, leading to a decrease in the interface quality of the two-dimensional materials.

[0025] The water-cooled pipe 10 is located on the side of the heat sink 3. The heat sink 3, made of oxygen-free copper, is connected to an external forced-circulation water chiller via the water-cooled pipe 10.

[0026] Secondly, the temperature sensor 11 is disposed inside the circular boss 8. The temperature sensor 11 is a PT100 platinum resistance temperature sensor, which is embedded inside the circular boss 8, close to the working surface, to accurately measure the table surface temperature.

[0027] Meanwhile, the standard TEC unit 12 is disposed inside the heat sink 3, with its hot end in contact with the heat sink 3; the high-temperature resistant TEC unit 13 is disposed on top of the standard TEC unit 12, with its hot end and the cold end of the standard TEC unit 12 in contact, and the cold end of the high-temperature resistant TEC unit 13 in contact with the bottom surface of the sample stage 5 via thermally conductive silicone grease. The TEC module 4 adopts a two-stage cascade configuration, with the upper layer being the high-temperature resistant TEC unit 13 (encapsulated with high-temperature solder, with a maximum operating temperature of 300℃), whose cold end is tightly in contact with the bottom surface of the sample stage 5 via high-temperature thermally conductive silicone grease. The lower layer is the standard TEC unit 12, whose cold end is in contact with the hot end of the upper-layer high-temperature resistant TEC unit 13. To cope with high-temperature operating conditions, the heat sink 3, made of oxygen-free copper, is connected to an external forced circulation water chiller (temperature control accuracy ±0.1℃) via a water-cooling pipe 10. The heat sink 3 is in close contact with the hot end of the lower standard TEC unit 12, and the efficient heat dissipation solution of the external forced circulation water cooler ensures that the heat of the TEC hot end is removed in time, maintaining system stability.

[0028] Furthermore, both the sample stage 5 and the circular boss 8 are made of PTFE composite material with 20% graphene doping. Their effective thermal deformation length L is 12.5 mm, and their displacement ΔL and temperature difference ΔT satisfy the following relationship: ΔL = L × α × ΔT, where α is the coefficient of thermal expansion of the composite material, and the coefficient of thermal expansion α is 80 × 10⁻⁶. -6 / ℃, the displacement produced by each 1℃ temperature rise is 1μm.

[0029] To better understand the thermally induced deformation transfer device based on graphene-PTFE composite material of the present invention, a specific embodiment is described below. In this embodiment, the thermally induced deformation transfer device based on graphene-PTFE composite material further includes a PC host computer 14, a control box 15, a vacuum controller 16, a temperature controller 17, and a main controller 18 (attached to the main controller 18). The control box 15 is electrically connected to the PC host computer 14, the first precision displacement stage 2, and the second precision displacement stage 6, respectively. The vacuum controller 16, the temperature controller 17, and the main controller 18 are electrically connected to the control box 15, respectively. The temperature controller 17 is connected to the TEC module 4, the temperature... The temperature sensor 11 and the main controller 18 are electrically connected. The vacuum adsorption channel 9 is connected to an external vacuum generator via a pipe. A solenoid valve is installed on the pipe. The vacuum controller 16 controls the solenoid valve to control the vacuum adsorption of the sample stage 5. The temperature controller 17 sends control commands to the TEC module 4 via an algorithm to precisely adjust the magnitude and direction of the current flowing through the TEC module 4, thereby achieving heating and cooling. The main controller 18 has a built-in dedicated "thermal creep bonding" control algorithm, which can automatically calculate and execute a smooth, slow, and overshoot-free temperature rise curve based on a preset final bonding displacement or pressure value, precisely driving the thermal deformation process. The working process of this device is as follows: Clamping: The substrate with the two-dimensional material attached is fixed on the sample stage 5 by vacuum adsorption, and the sample to be transferred is clamped on the upper fixture 7 by heat-release adhesive PDMS (working temperature 80℃). Preliminary alignment: By manipulating the first precision displacement stage 2 (with electric XYZR three-degree-of-freedom adjustment function and manual tilt adjustment function) and the second precision displacement stage 6 (with electric XYZ adjustment function and manual R-axis adjustment function), both of which are currently mature products, the upper and lower two-dimensional materials are roughly aligned into the field of view under the microscope. The spacing between the upper and lower layers is controlled within 10-20um by repeatedly focusing the upper and lower sample layers with electric focusing.

[0030] Performing thermo-deformation precision bonding: The target bonding displacement and bonding speed are input into the control software interface. The software automatically calculates the required temperature rise based on a formula. For example, if the target displacement is 15µm and the bonding speed is 0.01µm / s, the calculated target heating rate is approximately 0.01℃ / s. Within the system's controllable range, the target temperature rise is approximately 10℃. With an initial temperature of room temperature (25℃), the target temperature is 25 + 10 = 35℃, within the PDMS's operating range. The PC host computer 14 sends a command to the temperature controller 17, driving the TEC module 4 to heat the sample stage 5 from 25℃ to 35℃ at a steady rate of 0.01℃ / s. During this approximately 1000-second heating process, the sample stage 5 and its 25mm-long circular protrusion 8 expand uniformly due to heat, producing a smooth, continuous displacement in the vertical direction (Z-axis), ultimately reaching an expansion of approximately 15µm. This displacement slowly and uniformly presses the upper two-dimensional material onto the lower material, achieving vibration-free and impact-free "thermal creep" bonding. Because of the overall expansion, the bonding pressure is evenly distributed across the entire 20mm diameter contact surface, effectively expelling interfacial gas.

[0031] Pressure holding and completion: After reaching the target temperature, the system maintains the temperature for 10-60 seconds (pressure holding time can be set) to ensure sufficient adhesion. Then, the clamp 7 is slowly lifted at a speed of 0.5um / s by the electric Z-axis of the second precision displacement stage 6 to separate the upper sample from the lower sample. The adhesion of the samples can then be observed through a microscope. After confirming that the adhesion is correct, the PC host computer 14 controls the TEC module 4 to work in reverse to cool down, so that the sample stage 5 and the circular boss 8 are actively cooled to room temperature. The sample stage 5 and the circular boss 8 retract and reset, ready for the next operation.

[0032] This invention discloses a thermo-deformation transfer device based on graphene-PTFE composite material. The sample stage 5 and circular boss 8 are made of PTFE composite material doped with 20% graphene. This material possesses high expansion, good thermal conductivity, and flexibility. Furthermore, it abandons traditional mechanical or piezoelectric propulsion mechanisms, instead employing a passive, surface-driven thermo-deformation mechanism as the driving force for final bonding, achieving a perfect combination of nanometer-level precision and large displacement. (The last sentence appears to be incomplete and possibly refers to a different device.) -6With a high coefficient of thermal expansion of 1 μm / ℃, a compact length of only 12.5 mm is required to achieve a displacement efficiency of 1 μm / ℃. At a temperature control accuracy of ±0.1℃, the displacement accuracy is better than 10 nm. Simultaneously, it can achieve a large stroke of over 10 μm with a small temperature rise (e.g., 12.5℃), perfectly matching the bonding requirements of two-dimensional materials. The graphene / PTFE composite material possesses high expansion capacity while retaining the flexibility and internal damping characteristics of polymer materials. Its thermal expansion process is continuous and slightly "buffered," fundamentally eliminating mechanical shock and vibration. The surface-driven mechanism ensures a naturally uniform pressure distribution at the interface, effectively suppressing bubble formation. Graphene doping significantly improves the thermal conductivity of PTFE (up to 4 W·m). -1 ·K -1 This allows the sample stage 5 to respond quickly and uniformly to temperature changes, improving control response speed and temperature uniformity. The displacement and temperature exhibit a highly linear relationship, avoiding the nonlinearity problems inherent in piezoelectric ceramics and simplifying the control system. The core drive unit of this device consists of the sample stage 5 and the circular boss 8, which are made of specially processed composite materials. This eliminates the need for complex mechanical transmission mechanisms or expensive piezoelectric ceramic actuators, significantly simplifying the structure, reducing manufacturing costs, and eliminating moving and wearing parts, resulting in extremely high reliability.

[0033] Secondly, please refer to Figure 6 The present invention also provides a method for thermally induced deformation transfer based on graphene-PTFE composite materials, comprising: S1 fixes a two-dimensional material sample onto the circular boss 8 by vacuum adsorption, and clamps another two-dimensional material sample to be transferred onto the fixture 7 using heat-release adhesive PDMS. S2 operates the first precision displacement stage 2 and the second precision displacement stage 6 to complete the preliminary macroscopic alignment of the two two-dimensional material samples under the microscope; The S3 control software calculates the required temperature rise and heating rate based on the target displacement and the desired bonding speed. S4 controls the TEC module 4 to heat to the target temperature according to the calculated temperature rise rate. During this process, the sample stage 5 and the circular boss 8 generate vertical displacement to achieve vibration-free bonding of the two two-dimensional material samples. After the two two-dimensional material samples are bonded together, the TEC module 4 is cooled down, and the sample stage 5 and the circular boss 8 shrink and reset, ready for the next operation.

[0034] In this embodiment, the sample stage 5 and the circular protrusion 8 are made of graphene / PTFE composite material. The sample is fixed to the circular protrusion 8 by vacuum adsorption, and the initial macroscopic alignment of the two-dimensional material layers is completed under a microscope using a precision displacement stage. The control software calculates the required temperature rise (12.5℃) and heating rate (0.01℃ / s) based on the target displacement (e.g., 10 μm) and the desired bonding speed (e.g., 10 nm / s). The temperature controller 17 drives the TEC module 4 to smoothly raise the sample stage 5 and the circular protrusion 8 from the initial temperature according to a preset curve. During this process, the sample stage 5 and the circular protrusion 8 produce smooth, continuous, and uniform displacement in the vertical direction (Z-axis). Due to the inherent flexibility and damping properties of the graphene / PTFE composite material, its expansion process is more "gentle" than that of metal, further absorbing potential micro-disturbances and achieving absolutely vibration-free and impact-free "thermal creep" bonding. At the same time, the surface-driven characteristics ensure uniform pressure distribution across the entire contact surface. Once the target temperature (i.e., target displacement) is reached, the temperature is maintained until bonding is complete. Then, the control system actively cools down the sample stage 5 and the circular protrusion 8, causing them to retract and reset, ready for the next operation.

[0035] This invention discloses a thermally induced deformation transfer method based on graphene / PTFE composite material. It applies the high-expansion graphene / PTFE composite material to precision displacement actuation, discovering a new application for this specific composite material as an intelligent actuator (sample stage 5 and circular boss 8) in the field of micro / nano manufacturing actuation. Utilizing its high expansion, good thermal conductivity, and flexibility, it solves the fundamental problems of traditional rigid actuators. This composite material actuator (sample stage 5 and circular boss 8) provides precise and controllable displacement on a macroscopic scale ("rigid" requirements), while exhibiting flexible and damping characteristics at the microscopic contact moment ("flexible" actuation), thus achieving a truly damage-free "soft landing." This invention indirectly achieves nanoscale (below 10nm) displacement accuracy by precisely controlling the temperature (accuracy ±0.1℃ is sufficient), transforming the complex displacement control problem into a more easily achievable high-precision temperature control problem. This method solves the problem in existing technologies where, during two-dimensional material bonding, minute vibrations, impacts, or pressure concentrations are introduced at the contact moment, leading to a decrease in the interface quality of the two-dimensional materials.

[0036] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A thermo-induced deformation transfer device based on graphene-PTFE composite material, characterized in that, Includes a base, a first precision displacement stage, a heat sink, a TEC module, a sample stage, a second precision displacement stage, and a fixture; The first precision displacement stage is disposed on the top of the base, the heat sink is disposed on the top of the first precision displacement stage, the TEC module is disposed inside the heat sink, the sample stage is disposed on the top of the heat sink, the top of the sample stage has a circular boss, the circular boss is provided with vacuum adsorption channels, the second precision displacement stage is disposed on the top of the base, and the clamp is disposed on the second precision displacement stage.

2. The thermo-induced deformation transfer device based on graphene-PTFE composite material as described in claim 1, characterized in that, The heat-induced deformation transfer device based on graphene-PTFE composite material also includes a water-cooled pipe; the water-cooled pipe is disposed on the side of the heat sink.

3. The thermo-induced deformation transfer device based on graphene-PTFE composite material as described in claim 1, characterized in that, The thermo-induced deformation transfer device based on graphene-PTFE composite material also includes a temperature sensor; the temperature sensor is disposed inside the circular boss.

4. The thermo-induced deformation transfer device based on graphene-PTFE composite material as described in claim 1, characterized in that, The TEC module includes a standard TEC unit and a high-temperature resistant TEC unit; the standard TEC unit is disposed inside the heat sink, and the hot end of the standard TEC unit is in contact with the heat sink; the high-temperature resistant TEC unit is disposed on top of the standard TEC unit, and the hot end of the high-temperature resistant TEC unit is attached to the cold end of the standard TEC unit, and the cold end of the high-temperature resistant TEC unit is attached to the bottom surface of the sample stage through thermally conductive silicone grease.

5. The thermo-induced deformation transfer device based on graphene-PTFE composite material as described in claim 1, characterized in that, Both the sample stage and the circular boss are made of PTFE composite material with 20% graphene doping. Their effective thermal deformation length L is 12.5 mm, and their displacement ΔL and temperature difference ΔT satisfy the following relationship: ΔL = L × α × ΔT, where α is the coefficient of thermal expansion of the composite material, and the coefficient of thermal expansion α is 80 × 10⁻⁶. -6 / ℃, the displacement produced by each 1℃ temperature rise is 1μm.

6. A method for heat-induced deformation transfer based on graphene-PTFE composite material, applied to the heat-induced deformation transfer device based on graphene-PTFE composite material as described in any one of claims 1-5, characterized in that, include: A two-dimensional material sample is fixed on a circular protrusion by vacuum adsorption, and another two-dimensional material sample to be transferred is clamped on the fixture using heat-release adhesive PDMS. By operating the first and second precision displacement stages, preliminary macroscopic alignment of the two two-dimensional material samples is completed under the microscope; The control software calculates the required temperature rise and heating rate based on the target displacement and the desired bonding speed. The TEC module is controlled to heat the sample to the target temperature according to the calculated temperature rise rate. During this process, the sample stage and the circular boss are displaced in the vertical direction to achieve vibration-free bonding of the two two-dimensional material samples. After the two two-dimensional material samples are bonded together, the TEC module is cooled down, and the sample stage and circular boss shrink and reset, ready for the next operation.

Images