Organosilicone modified acrylate pressure-sensitive adhesive and preparation method thereof

Abstract

The invention discloses a preparation method of an organic silicon modified acrylate pressure-sensitive adhesive. The optical pressure-sensitive adhesive comprises the following raw material components in parts by weight: 70-90 parts of an acrylate soft monomer, 5-15 parts of an organic silicon monomer, 5-15 parts of a functional monomer, 0.01-1 part of a curing agent and 0.01-1 part of a photoinitiator. The addition of the organic silicon monomer in the formula of the pressure-sensitive adhesive has benefits on the bonding effect of a non-polar material and the viscosity after water absorption, which is mainly characterized in that the organic silicon has good flexibility and low surface energy and can migrate to the surface of the pressure-sensitive adhesive, so that the polarity of the surface of the pressure-sensitive adhesive is greatly reduced, the wettability of the pressure-sensitive adhesive on a non-polar substrate is improved, and the adhesive property of the pressure-sensitive adhesive is improved. The bonding effect on a non-polar base material is enhanced; the existence of hydrophilic groups such as methoxyl and ethyoxyl ensures the water absorption capacity of the pressure-sensitive adhesive, and the high steric hindrance or long-chain branch of monomers such as organic silicon enables the pressure-sensitive adhesive to have a loose network structure, so that the pressure-sensitive adhesive is endowed with relatively good moisture permeability.

Description

Organosilicon-modified acrylate pressure-sensitive adhesive and its preparation method Technical Field

[0001] This invention relates to the field of adhesive materials, and in particular to an organosilicon-modified acrylate pressure-sensitive adhesive and its preparation method. Background Technology

[0002] In recent years, the field of flexible wearable electronic devices has developed rapidly, bringing tremendous changes to our lives and making significant contributions to human health monitoring and disease prevention. Acrylic pressure-sensitive adhesives are also gradually being applied to new use cases such as skin and electronic devices. However, the surface of living organisms is often affected by sweat and bodily fluids, which greatly weakens the adhesive strength of pressure-sensitive adhesives. Therefore, acrylic pressure-sensitive adhesives not only need to have good adhesion to electronic components, metals, and skin, but also need to be low in toxicity; leave no residue after peeling, do not cause skin damage; and have high breathability and water absorption. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an organosilicon-modified acrylate pressure-sensitive adhesive and its preparation method, in order to address the shortcomings of the prior art.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: silicone-modified acrylate pressure-sensitive adhesive, comprising the following raw material components by weight: 70-90 parts of acrylate soft monomer, 5-15 parts of silicone monomer, 5-15 parts of functional monomer, 0.01-1 parts of curing agent and 0.01-1 parts of photoinitiator.

[0005] Preferably, the acrylate soft monomer is one or more of butyl acrylate, 2-ethylhexyl acrylate, methoxyethyl acrylate, heptyl acrylate, n-octyl acrylate, decyl acrylate, ethoxyethoxyethyl acrylate, lauryl acrylate, or octadecyl acrylate.

[0006] Preferably, the organosilicon monomer is one or more of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, 3-methacryloyloxypropyltrimethoxysilane, and vinyl polydimethylsiloxane.

[0007] Preferably, the functional monomer is one or more of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, acrylic acid, carboxyethyl acrylate, and glycidyl methacrylate.

[0008] Preferably, the curing agent is one or more of 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, and dipentaerythritol hexaacrylate.

[0009] Preferably, the photoinitiator is one or more of 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoyl)phosphonate, 1-hydroxy-cyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 2,2-dimethoxy-2-phenylethyl ketone.

[0010] Preferably, the acrylate soft monomer is a mixture of 2-ethylhexyl acrylate and methoxyethyl acrylate, the functional monomer is hydroxyethyl acrylate, and the organosilicon monomer is one or both of vinyltris(2-methoxyethoxy)silane and vinyl polydimethylsiloxane.

[0011] Preferably, the curing agent is polyethylene glycol diacrylate, and the photoinitiator is 2,2-dimethoxy-2-phenylethyl ketone.

[0012] The present invention also provides a method for preparing the silicone-modified acrylate pressure-sensitive adhesive as described above, comprising the following steps: S1, silicone-modified acrylate prepolymer: 70-90 parts by weight of acrylate soft monomer, 5-15 parts by weight of silicone monomer, 5-15 parts by weight of functional monomer, and 0.01-1 parts by weight of photoinitiator are mixed, then stirred and nitrogen gas is introduced, and the reaction is carried out by LED light irradiation to obtain silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.01-1 parts by weight of photoinitiator and 0.01-1 parts by weight of curing agent are added to silicone-modified acrylate prepolymer, stirred to make it uniform, then coated on a release film, and another release film is attached to the adhesive surface, and cured under ultraviolet light to obtain silicone-modified acrylate pressure-sensitive adhesive.

[0013] Preferably, the preparation method of the silicone-modified acrylate pressure-sensitive adhesive includes the following steps: S1, silicone-modified acrylate prepolymer: 70-90 parts by weight of acrylate soft monomer, 5-15 parts by weight of silicone monomer, 5-15 parts by weight of functional monomer, and 0.01-1 parts by weight of photoinitiator are mixed, then stirred and nitrogen gas is introduced for 15-30 minutes. The reaction is carried out under LED light until the viscosity reaches 3000-6000 cps, thus obtaining the silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.01-1 parts by weight of photoinitiator and 0.01-1 parts by weight of curing agent are added to the silicone-modified acrylate prepolymer, stirred to mix evenly, then coated onto a release film, and another release film is attached to the adhesive surface. The mixture is cured under ultraviolet light, with the light energy controlled at 6000-10000 mJ / cm². 2 Organosilicon-modified acrylate pressure-sensitive adhesive was obtained.

[0014] The beneficial effects of this invention are as follows: This invention provides an organosilicon-modified acrylate pressure-sensitive adhesive and its preparation method. The pressure-sensitive adhesive prepared by this invention has excellent adhesion to both polar and non-polar materials, and features high water absorption and high air permeability, making it suitable for use in the field of flexible wearable electronic devices. The addition of organosilicon monomers in the pressure-sensitive adhesive formulation of this invention benefits both the adhesion to non-polar materials and the adhesion after water absorption. This is mainly because organosilicon has good flexibility and low surface energy, which allows it to migrate to the surface of the pressure-sensitive adhesive, greatly reducing the polarity of the adhesive surface and improving its wettability to non-polar substrates, thus enhancing its adhesion to non-polar substrates. The presence of hydrophilic groups such as methoxy and ethoxy groups ensures the water absorption of the pressure-sensitive adhesive, while the high steric hindrance or long branches of organosilicon monomers give it a loose network structure, resulting in good moisture permeability. Detailed Implementation

[0015] The present invention will be further described in detail below with reference to embodiments, so that those skilled in the art can implement it based on the description.

[0016] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0017] Unless otherwise specified, the experimental methods used in the following examples are conventional methods. Unless otherwise specified, the materials and reagents used in the following examples are commercially available. For examples where specific conditions are not specified, conventional conditions or conditions recommended by the manufacturer are followed. For reagents or instruments whose manufacturers are not specified, they are all commercially available products.

[0018] This invention provides a silicone-modified acrylate pressure-sensitive adhesive, comprising the following raw material components by weight: 70-90 parts of acrylate soft monomer, 5-15 parts of silicone monomer, 5-15 parts of functional monomer, 0.01-1 parts of curing agent and 0.01-1 parts of photoinitiator.

[0019] In a preferred embodiment, the acrylate soft monomer is one or more of butyl acrylate, 2-ethylhexyl acrylate, methoxyethyl acrylate, heptyl acrylate, n-octyl acrylate, decyl acrylate, ethoxyethoxyethyl acrylate, lauryl acrylate, or octadecyl acrylate.

[0020] In a preferred embodiment, the method for preparing the silicone-modified acrylate pressure-sensitive adhesive includes the following raw material components by weight: 70-90 parts of acrylate soft monomer, 5-15 parts of silicone monomer, 5-15 parts of functional monomer, 0.01-1 parts of curing agent and 0.01-1 parts of photoinitiator.

[0021] In a preferred embodiment, the acrylate soft monomer is one or more of butyl acrylate, 2-ethylhexyl acrylate, methoxyethyl acrylate, heptyl acrylate, n-octyl acrylate, decyl acrylate, ethoxyethoxyethyl acrylate, lauryl acrylate, or octadecyl acrylate.

[0022] In a preferred embodiment, the organosilicon monomer is one or more of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, 3-methacryloyloxypropyltrimethoxysilane, and vinyl polydimethylsiloxane.

[0023] In a preferred embodiment, the functional monomer is one or more of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, acrylic acid, carboxyethyl acrylate, and glycidyl methacrylate.

[0024] In a preferred embodiment, the curing agent is one or more of 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, and dipentaerythritol hexaacrylate.

[0025] In a preferred embodiment, the photoinitiator is one or more of 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoyl)phosphonate, 1-hydroxy-cyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 2,2-dimethoxy-2-phenylethyl ketone.

[0026] In a preferred embodiment, the acrylate soft monomer is a mixture of 2-ethylhexyl acrylate and methoxyethyl acrylate, the functional monomer is hydroxyethyl acrylate, and the organosilicon monomer is one or both of vinyltris(2-methoxyethoxy)silane and vinyl polydimethylsiloxane.

[0027] In a preferred embodiment, the curing agent is polyethylene glycol diacrylate and the photoinitiator is 2,2-dimethoxy-2-phenylethyl ketone.

[0028] This invention also provides a method for preparing a silicone-modified acrylate pressure-sensitive adhesive, comprising the following steps: S1, silicone-modified acrylate prepolymer: 70-90 parts by weight of acrylate soft monomer, 5-15 parts by weight of silicone monomer, 5-15 parts by weight of functional monomer, and 0.01-1 parts by weight of photoinitiator are mixed, then stirred and nitrogen gas is introduced, and the reaction is carried out by LED light irradiation to obtain silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.01-1 parts by weight of photoinitiator and 0.01-1 parts by weight of curing agent are added to the silicone-modified acrylate prepolymer, stirred to make it uniform, then coated on a release film, and another release film is attached to the adhesive surface, and cured under ultraviolet light to obtain silicone-modified acrylate pressure-sensitive adhesive.

[0029] In a preferred embodiment, the preparation method of the silicone-modified acrylate pressure-sensitive adhesive includes the following steps: S1, silicone-modified acrylate prepolymer: 70-90 parts by weight of acrylate soft monomer, 5-15 parts by weight of silicone monomer, 5-15 parts by weight of functional monomer, and 0.01-1 parts by weight of photoinitiator are mixed, then stirred and nitrogen gas is introduced for 15-30 minutes. The reaction is carried out under LED light until the viscosity reaches 3000-6000 cps, thus obtaining the silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.01-1 parts by weight of photoinitiator and 0.01-1 parts by weight of curing agent are added to the silicone-modified acrylate prepolymer, stirred to make it uniform, then coated on a release film, and another release film is attached to the adhesive surface. The adhesive is cured under ultraviolet light, with the light energy controlled at 6000-10000 mJ / cm². 2 Organosilicon-modified acrylate pressure-sensitive adhesive was obtained.

[0030] The above is the general concept of the present invention. Based on this, detailed embodiments and comparative examples are provided below to further illustrate the present invention.

[0031] Example 1: A method for preparing a silicone-modified acrylate pressure-sensitive adhesive, comprising the following steps: S1, silicone-modified acrylate prepolymer: 50 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methoxyethyl acrylate, 5 parts by weight of vinyltris(2-methoxyethoxy)silane, 5 parts by weight of hydroxyethyl acrylate, and 0.1 parts by weight of photoinitiator are mixed. Stirring is then started and nitrogen gas is introduced for 20 minutes. The mixture is then irradiated with a 5W LED lamp at a distance of 10 cm from the reactor until the viscosity reaches 4500 cps, thus obtaining the silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.1 parts by weight of 2,2-dimethoxy-2-phenylethyl ketone and 0.1 parts by weight of polyethylene glycol diacrylate are added to the silicone-modified acrylate prepolymer. The mixture is stirred until homogeneous, then coated onto a release film. The release film is then adhered to the adhesive surface of the adhesive film. The mixture is then subjected to a reaction at 8000 mJ / cm².2 The silicone-modified acrylate pressure-sensitive adhesive was cured under ultraviolet light to obtain the adhesive.

[0032] Example 2: A method for preparing a silicone-modified acrylate pressure-sensitive adhesive, comprising the following steps: S1, silicone-modified acrylate prepolymer: 45 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methoxyethyl acrylate, 10 parts by weight of vinyltris(2-methoxyethoxy)silane, 5 parts by weight of hydroxyethyl acrylate, and 0.1 parts by weight of photoinitiator are mixed. Stirring is then started and nitrogen gas is introduced for 20 minutes. The mixture is then irradiated with a 5W LED lamp at a distance of 10 cm from the reactor until the viscosity reaches 4500 cps, thus obtaining the silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.1 parts by weight of 2,2-dimethoxy-2-phenylethyl ketone and 0.1 parts by weight of polyethylene glycol diacrylate are added to the silicone-modified acrylate prepolymer. The mixture is stirred until homogeneous, then coated onto a release film. The release film is then adhered to the adhesive surface of the adhesive film. The mixture is then subjected to a reaction at 8000 mJ / cm². 2 The silicone-modified acrylate pressure-sensitive adhesive was cured under ultraviolet light to obtain the adhesive.

[0033] Example 3: A method for preparing a silicone-modified acrylate pressure-sensitive adhesive, comprising the following steps: S1, silicone-modified acrylate prepolymer: 45 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methoxyethyl acrylate, 10 parts by weight of vinyl polydimethylsiloxane, 5 parts by weight of hydroxyethyl acrylate, and 0.1 parts by weight of photoinitiator are mixed. Stirring is then started and nitrogen gas is introduced for 20 minutes. The mixture is then irradiated with a 5W LED lamp at a distance of 10 cm from the reactor until the viscosity reaches 4500 cps, thus obtaining the silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.1 parts by weight of 2,2-dimethoxy-2-phenylethyl ketone and 0.1 parts by weight of polyethylene glycol diacrylate are added to the silicone-modified acrylate prepolymer. The mixture is stirred until homogeneous, then coated onto a release film. The release film is then adhered to the adhesive surface of the adhesive film. The mixture is then subjected to a reaction at 8000 mJ / cm². 2 The silicone-modified acrylate pressure-sensitive adhesive was cured under ultraviolet light to obtain the adhesive.

[0034] Example 4: A method for preparing a silicone-modified acrylate pressure-sensitive adhesive, comprising the following steps: S1, silicone-modified acrylate prepolymer: 45 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of ethoxyethoxyethyl acrylate, 10 parts by weight of vinyl polydimethylsiloxane, 5 parts by weight of hydroxyethyl acrylate, and 0.1 parts by weight of photoinitiator are mixed. Stirring is then started and nitrogen gas is introduced for 20 minutes. The mixture is then irradiated with a 5W LED lamp at a distance of 10 cm from the reactor until the viscosity reaches 4500 cps, thus obtaining the silicone-modified acrylate prepolymer; S2, silicone-modified acrylate pressure-sensitive adhesive: 0.1 parts by weight of 2,2-dimethoxy-2-phenylethyl ketone and 0.1 parts by weight of polyethylene glycol diacrylate are added to the silicone-modified acrylate prepolymer. The mixture is stirred until homogeneous, then coated onto a release film. The release film is then adhered to the adhesive surface of the adhesive film. The mixture is then subjected to a reaction at 8000 mJ / cm². 2 The silicone-modified acrylate pressure-sensitive adhesive was cured under ultraviolet light to obtain the adhesive.

[0035] Comparative Example 1: A method for preparing an acrylic pressure-sensitive adhesive, comprising the following steps: S1, Acrylic prepolymer: 95 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of hydroxyethyl acrylate, and 0.1 parts by weight of photoinitiator are mixed, then stirred and nitrogen is introduced for 20 minutes. The mixture is then irradiated with a 5W LED lamp at a distance of 10 cm from the reactor until the viscosity reaches 4500 cps to obtain the acrylic prepolymer; S2, Acrylic pressure-sensitive adhesive: 0.1 parts by weight of 2,2-dimethoxy-2-phenylethyl ketone and 0.1 parts by weight of polyethylene glycol diacrylate are added to the acrylic prepolymer, stirred until uniformly mixed, and then coated onto a release film. The release film is then adhered to the adhesive surface of the adhesive film and subjected to a reaction at 8000 mJ / cm². 2 The acrylic pressure-sensitive adhesive is cured under ultraviolet light to obtain the adhesive.

[0036] Comparative Example 2: A method for preparing an acrylic pressure-sensitive adhesive, comprising the following steps: S1, Acrylic prepolymer: 55 parts by weight of 2-ethylhexyl acrylate, 40 parts by weight of methoxyethyl acrylate, 5 parts by weight of hydroxyethyl acrylate, and 0.1 parts by weight of photoinitiator are mixed. Stirring is then started and nitrogen gas is introduced for 20 minutes. The mixture is then irradiated with a 5W LED lamp at a distance of 10 cm from the reactor until the viscosity reaches 4500 cps to obtain the acrylic prepolymer; S2, Acrylic pressure-sensitive adhesive: 0.1 parts by weight of 2,2-dimethoxy-2-phenylethyl ketone and 0.1 parts by weight of polyethylene glycol diacrylate are added to the acrylic prepolymer. The mixture is stirred until homogeneous, then coated onto a release film. The release film is then adhered to the adhesive surface of the adhesive film. The mixture is then subjected to a reaction at 8000 mJ / cm². 2 The acrylic pressure-sensitive adhesive is cured under ultraviolet light to obtain the adhesive.

[0037] The performance tests were performed on the acrylic pressure-sensitive adhesives prepared in the examples and comparative examples as follows: (1) 180° peel strength test: the release film of one side of the pressure-sensitive adhesive with a thickness of 100 μm in Examples 1-4 and Comparative Example 1 was peeled off and transferred to 50 μm PET. The sample was cut into a length of 30 mm and a width of 25.4 mm. Then the release film of the other side of the pressure-sensitive adhesive was peeled off. The PET film was laminated to the surface of the substrate with a 2 kg rubber roller. After standing for 20 min in an environment of 23°C and 50% RH, its peel strength was tested with a tensile testing machine.

[0038] (2) Adhesion after water absorption: The pressure-sensitive adhesives with a thickness of 100 μm of Examples 1-4 and Comparative Example 1 were placed in an environment of 37 °C and 95% RH for 24 h, and their 180° peel strength was tested after removal.

[0039] (3) Water absorption: Prepare a 30mm×30mm×1mm sample of pressure-sensitive adhesive. Peel off one side of the release film and attach it to a glass slide. Then peel off the other side of the release film of the pressure-sensitive adhesive. Weigh the total mass of the glass slide and the pressure-sensitive adhesive before water absorption as W1. Soak the glass slide with the pressure-sensitive adhesive attached in deionized water at 37 ℃ for 24 hours. Remove it, wipe off the moisture on the glass surface, and let it stand. After the surface of the pressure-sensitive adhesive is dry, weigh it again to get the total mass after water absorption as W2. Water absorption W = (W2 - W1) × 10 4 / (3×3)(4)Moisture permeability: Add a certain amount of deionized water to the container, peel off one side of the release film of the 100um thick pressure-sensitive adhesive, seal the container with the adhesive side facing the water, and then peel off the other side of the release film. The total weight is W1, and the contact area between the pressure-sensitive adhesive and the water is S. After being placed in an environment of 37℃ and <10%RH for 24 h, the total weight is W2. Moisture permeability W=(W1-W2) / S.

[0040] The test results for each embodiment and comparative example are shown in Table 1: Table 1 The performance test results of Examples 1-4 and Comparative Example 1 show that the addition of organosilicon monomers improves the adhesion of the pressure-sensitive adhesive to non-polar materials and enhances its tackiness after water absorption. This is mainly because organosilicon has good flexibility and low surface energy, which allows it to migrate to the surface of the pressure-sensitive adhesive, greatly reducing the polarity of the adhesive surface and improving its wettability to non-polar substrates, thus enhancing its adhesion to them. The presence of hydrophilic groups such as methoxy and ethoxy groups ensures the water absorption of the pressure-sensitive adhesive, while the high steric hindrance or long branches of organosilicon monomers give it a loose network structure, resulting in good moisture permeability.

[0041] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details.

Claims

1. A silicone-modified acrylate pressure-sensitive adhesive, characterized in that, It includes the following raw material components by weight: 70-90 parts of acrylate soft monomer, 5-15 parts of organosilicon monomer, 5-15 parts of functional monomer, 0.01-1 parts of curing agent and 0.01-1 parts of photoinitiator.

2. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The acrylate soft monomer is one or more of butyl acrylate, 2-ethylhexyl acrylate, methoxyethyl acrylate, heptyl acrylate, n-octyl acrylate, decyl acrylate, ethoxyethoxyethyl acrylate, lauryl acrylate, or octadecyl acrylate.

3. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The organosilicon monomer is one or more of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, 3-methacryloyloxypropyltrimethoxysilane, and vinyl polydimethylsiloxane.

4. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The functional monomer is one or more of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acrylate, acrylic acid, carboxyethyl acrylate, and glycidyl methacrylate.

5. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The curing agent is one or more of 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, and dipentaerythritol hexaacrylate.

6. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The photoinitiator is one or more of 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoyl)phosphonate, 1-hydroxy-cyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 2,2-dimethoxy-2-phenylethyl ketone.

7. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The acrylate soft monomer is a mixture of 2-ethylhexyl acrylate and methoxyethyl acrylate, the functional monomer is hydroxyethyl acrylate, and the organosilicon monomer is one or both of vinyltris(2-methoxyethoxy)silane and vinyl polydimethylsiloxane.

8. The silicone-modified acrylate pressure-sensitive adhesive according to claim 1, characterized in that, The curing agent is polyethylene glycol diacrylate, and the photoinitiator is 2,2-dimethoxy-2-phenylethyl ketone.

9. A method for preparing an organosilicon-modified acrylate pressure-sensitive adhesive as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. Silicone-modified acrylate prepolymer: Mix 70-90 parts by weight of acrylate soft monomer, 5-15 parts by weight of silicone monomer, 5-15 parts by weight of functional monomer, and 0.01-1 parts by weight of photoinitiator. Then, turn on the stirrer and introduce nitrogen gas. Use an LED lamp to irradiate the reaction to obtain the silicone-modified acrylate prepolymer. S2. Silicone-modified acrylate pressure-sensitive adhesive: Add 0.01-1 parts by weight of photoinitiator and 0.01-1 parts by weight of curing agent to the silicone-modified acrylate prepolymer. Stir to mix it evenly, then coat it on a release film. Then, attach another release film to the adhesive surface and cure it under ultraviolet light to obtain the silicone-modified acrylate pressure-sensitive adhesive.

10. The method for preparing the organosilicon-modified acrylate pressure-sensitive adhesive according to claim 9, characterized in that, Includes the following steps: S1. Silicone-modified acrylate prepolymer: Mix 70-90 parts by weight of soft acrylate monomer, 5-15 parts by weight of silicone monomer, 5-15 parts by weight of functional monomer, and 0.01-1 parts by weight of photoinitiator. Then, start stirring and purge with nitrogen for 15-30 minutes. Irradiate the mixture with an LED lamp until the viscosity reaches 3000-6000 cps to obtain the silicone-modified acrylate prepolymer. S2. Silicone-modified acrylate pressure-sensitive adhesive: Add 0.01-1 parts by weight of photoinitiator and 0.01-1 parts by weight of curing agent to the silicone-modified acrylate prepolymer. Stir until uniformly mixed, then coat it onto a release film. Attach another release film to the adhesive surface and cure under ultraviolet light, controlling the light energy to 6000-10000 mJ / cm². 2 Organosilicon-modified acrylate pressure-sensitive adhesive was obtained.

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