Manufacturing method of circuit board with in-hole partition structure and circuit board
By combining mechanical drilling and laser etching technologies, the problem of difficulty in achieving multi-zone separation within small holes using traditional processes has been solved, resulting in an efficient and stable in-hole partitioning structure that improves the wiring density and integration of circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN KESHIJIA ELECTRONICS CO LTD
- Filing Date
- 2026-03-19
- Publication Date
- 2026-05-01
AI Technical Summary
Existing technologies cannot achieve stable and reliable physical separation of four zones within a single 0.75mm hole, which limits the further improvement of circuit board integration. Mechanical drilling cannot process narrow and deep grooves, while laser processing is costly and inefficient.
Combining mechanical drilling and laser etching technologies, mechanical drilling is performed first, followed by laser etching. By obtaining the target circuit board substrate, positioning calibration, mechanical drilling, laser etching, and shaping are carried out, and finally, inspection is performed to achieve an internal partitioned structure.
It improves the efficiency and quality of slotting in holes, saves board surface wiring space, increases the wiring density of circuit boards, and is suitable for high-density miniaturized electronic products.
Smart Images
Figure CN121968462A_ABST
Abstract
Description
A method for manufacturing a circuit board with an internal partition structure and the circuit board itself. Technical Field
[0001] This invention relates to the field of circuit board technology, and also to a method for manufacturing a circuit board with an internal partition structure and the circuit board itself. Background Technology
[0002] As electronic devices iterate towards miniaturization, high density, and multifunctionality, PCB (Printed Circuit Board) wiring space becomes increasingly limited. Traditional single-hole designs can only achieve single-path conduction or single-positioning functions, while multi-hole layouts occupy a large amount of board space, preventing improvements in wiring density. To increase wiring and conduction density, it is often necessary to achieve multiple independent conductions or spatial partitioning within a smaller hole diameter. Currently, the industry commonly uses mechanical drilling or laser drilling to achieve single-hole partitioning structures on PCBs. However, mechanical drilling can only process circular through holes and cannot process narrow and deep grooves on the inner sidewalls of the hole, let alone create multiple independent zones within a single hole. Forcibly creating grooves with micro-tools is prone to tool breakage, edge chipping, and compromised precision. While laser processing can create grooves, the overall hole diameter roundness, perpendicularity, and hole wall quality are inferior to mechanical drilling, resulting in higher costs, lower efficiency, and difficulty in consistently achieving deep grooves. Therefore, existing technologies cannot achieve stable and reliable four-zone physical separation within a single 0.75mm hole, limiting further improvements in PCB integration. Summary of the Invention
[0003] The technical problem to be solved by the present invention is to provide a method for manufacturing a circuit board with an in-hole partition structure and a circuit board, so as to improve the efficiency and quality of slotting in the holes.
[0004] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: In its first aspect, the present invention provides a method for manufacturing a circuit board with an in-hole partition structure, comprising: obtaining a target circuit board substrate; aligning and calibrating the target circuit board substrate to obtain a calibration substrate; mechanically drilling the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one central hole; obtaining a groove processing trajectory based on the first substrate and preset groove parameters; performing laser etching on the first substrate according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the central hole on the second substrate contains multiple grooves; forming the second substrate to obtain a first circuit board; and detecting the first circuit board according to preset detection conditions to obtain a target circuit board.
[0005] Optionally, obtaining the target circuit board substrate includes: obtaining a cut bare substrate; performing a leveling process on the cut bare substrate according to preset leveling parameters to obtain a leveled substrate; the preset leveling parameters include leveling temperature, leveling pressure and leveling time; and performing pretreatment on the leveled substrate to obtain the target circuit board substrate.
[0006] Optionally, the target circuit board substrate is positioned and calibrated to obtain a calibration substrate, including: through... Obtain the deflection angle; through , Obtain the translation compensation amount; through , The corrected actual coordinates are obtained; based on the corrected actual coordinates, the calibration substrate is obtained; wherein, These are the corrected actual coordinates. For the deflection angle, The actual coordinates of the first reference hole on the target circuit board substrate. The actual coordinates of the second reference hole on the target circuit board substrate. The standard coordinates of the first reference hole on the target circuit board substrate are given. Let (X, Y) be the standard coordinates of the second reference hole on the target circuit board substrate, and (X, Y) be the original coordinates. This is the X-axis translation compensation amount. This is the Y-axis translation compensation amount.
[0007] Optionally, based on the first substrate and preset tank parameters, the tank processing trajectory is obtained, including: through... , Obtain the starting point where the inner side of the tank connects to the central hole; through , Obtain the endpoint of the internal connection of the tank; through , Obtain the extended end point on the outer side of the tank; through , Obtain the extended end point on the outer side of the tank; through , Obtain the coordinates of the fillet center; based on the starting point connecting the inner side of the groove to the center hole, the ending point connecting the inner side of the groove, the extending end point of the outer side of the groove, and the coordinates of the fillet center, obtain the groove machining trajectory; wherein... The coordinates of the starting point where the inner side of the tank connects to the central hole are shown. The coordinates of the endpoint of the connection inside the tank are given. The coordinates of the outer extension endpoint of the tank body. The coordinates of the outer extension endpoint of the tank body. The coordinates of the center of the central hole are... Here are the coordinates of the fillet center, and R is the radius of the center hole. For the central angle of a single tank, , The width of the slot is half an angle. W is the width of the slot. This is the substrate deflection compensation angle. The radius of the extended tank. L is the outward extension length of the groove, and r is the preset fillet radius.
[0008] Optionally, the machining trajectory of the groove is obtained based on the starting point of the connection between the inner side of the groove and the center hole, the ending point of the connection between the inner side of the groove, the extension end point of the outer side of the groove, the extension end point of the outer side of the groove, and the coordinates of the center of the rounded corner. This includes: obtaining a single groove machining trajectory based on the starting point of the connection between the inner side of the groove and the center hole, the ending point of the connection between the inner side of the groove, the extension end point of the outer side of the groove, the extension end point of the outer side of the groove, and the coordinates of the center of the rounded corner; and rotating the single groove machining trajectory symmetrically according to a preset rotation angle to obtain the groove machining trajectory.
[0009] Optionally, the second substrate is subjected to a forming process to obtain a first circuit board, including: deburring the second substrate to obtain a deburred substrate; copper plating the deburred substrate to obtain a copper-plated substrate; and forming the copper-plated substrate to obtain the first circuit board.
[0010] Optionally, the first circuit board is tested according to preset testing conditions to obtain a target circuit board, including: obtaining preset testing conditions; the preset testing conditions include aperture testing, slot testing, accuracy testing, and performance testing; testing the first circuit board according to the preset testing conditions to obtain testing results; and screening the first circuit board according to preset qualification conditions and the testing results to obtain a target circuit board.
[0011] A second aspect of the present invention provides an apparatus for manufacturing a circuit board with an in-hole partition structure, comprising: an acquisition module for acquiring a target circuit board substrate; a processing module for positioning and calibrating the target circuit board substrate to obtain a calibration substrate; mechanically drilling the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters including spindle speed, feed rate, retraction rate, and feed method; the first substrate having at least one central hole; obtaining a groove processing trajectory based on the first substrate and preset groove parameters; performing laser etching on the first substrate according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters including wavelength, power, spot diameter, and positioning accuracy; the central hole on the second substrate having multiple grooves; forming the second substrate to obtain a first circuit board; and detecting the first circuit board according to preset detection conditions to obtain a target circuit board.
[0012] A third aspect of the present invention provides a computing device, comprising: a processor and a memory storing a computer program, wherein the computer program, when executed by the processor, performs the method described in the first aspect.
[0013] A fourth aspect of the present invention provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the method as described in the first aspect.
[0014] The above-mentioned solution of the present invention includes at least the following beneficial effects: The above-mentioned solution of the present invention obtains a target circuit board substrate, and performs mechanical drilling on the target circuit board substrate according to preset drilling parameters to obtain a first substrate. Then, it performs laser etching on the first substrate according to preset laser processing parameters to obtain a second substrate. Then, it performs shaping processing on the second substrate to obtain a first circuit board. Finally, it performs testing on the first circuit board according to preset testing conditions to obtain a target circuit board. By combining mechanical drilling and laser etching, it takes into account the high precision and high perpendicularity of mechanical drilling and the fineness and narrow groove of laser processing, solving the problems of high cost and low efficiency of traditional single process. It is beneficial to improve the efficiency and quality of slotting in the hole, realize the partitioning in the hole, save the board surface wiring space, increase the wiring density of the circuit board, and adapt to high-density miniaturized electronic products. Attached Figure Description
[0015] Figure 1 is a flowchart illustrating the method for manufacturing a circuit board with an in-hole partition structure according to an embodiment of the present invention; Figure 2 is a structural schematic diagram of a circuit board with an in-hole partition structure according to an embodiment of the present invention; Figure 3 is a structural schematic diagram of a device for manufacturing a circuit board with an in-hole partition structure according to an embodiment of the present invention.
[0016] Explanation of reference numerals in the attached drawings: 11-hole, 12-groove. Detailed Implementation
[0017] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0018] As shown in Figure 1, an embodiment of the present invention proposes a method for manufacturing a circuit board with an in-hole partition structure, comprising the following steps: Step 101, obtaining a target circuit board substrate; Step 102, positioning and calibrating the target circuit board substrate to obtain a calibration substrate; mechanically drilling the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one central hole; Step 103, obtaining a groove processing trajectory based on the first substrate and preset groove parameters; performing laser etching on the first substrate according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the central hole on the second substrate contains multiple grooves; Step 104, shaping the second substrate to obtain a first circuit board; Step 105, detecting the first circuit board according to preset detection conditions to obtain a target circuit board.
[0019] The method for manufacturing a circuit board with an in-hole partition structure according to embodiments of the present invention involves obtaining a target circuit board substrate, mechanically drilling the target circuit board substrate according to preset drilling parameters to obtain a first substrate, laser etching the first substrate according to preset laser processing parameters to obtain a second substrate, shaping the second substrate to obtain a first circuit board, and finally inspecting the first circuit board according to preset detection conditions to obtain the target circuit board. By combining mechanical drilling and laser etching, the high precision and high perpendicularity of mechanical drilling are combined with the fineness and narrow groove of laser processing, solving the problems of high cost and low efficiency of traditional single processes. This method is beneficial to improving the efficiency and quality of in-hole slotting, realizing in-hole partitioning, saving board surface wiring space, increasing circuit board wiring density, and adapting to high-density miniaturized electronic products.
[0020] In an optional embodiment of the present invention, step 101, obtaining the target circuit board substrate, may include: step 1011, obtaining a cut bare substrate; specifically, the bare substrate is a cut PCB substrate, without circuit lines or copper layer patterns, and is only a copper foil laminate substrate, without any circuit fabrication processes such as pattern transfer or circuit etching. Holes with a four-zone separation structure belong to the PCB inner layer / hole processing process, and core hole processing steps such as mechanical drilling, laser grooving, and in-hole pretreatment need to be completed at the bare substrate stage before circuit fabrication is carried out. This avoids damage to the circuit layer by drilling and laser processes after the circuit layer has been pre-processed, which can improve product quality and reduce the defect rate.
[0021] Step 1012: The cut bare substrate is leveled according to preset leveling parameters to obtain a leveled substrate. The preset leveling parameters include leveling temperature, leveling pressure, and leveling time. Specifically, the preset leveling parameters include a leveling temperature of 100℃ to 120℃, a leveling pressure of 0.3MPa to 0.5MPa, and a leveling time of 10min to 15min. This eliminates internal stress generated during substrate cutting and pressing. After leveling, the flatness of the substrate is no greater than 0.05mm / 100mm (the height difference between the highest and lowest points on the substrate surface is no more than 0.05mm when a 100mm length test segment is arbitrarily cut from the substrate). This is used to control the overall flatness of the substrate, prevent warping and deformation, and avoid problems such as hole position misalignment and uneven groove depth during subsequent drilling and laser grooving. The above preset leveling parameters are only illustrative examples; appropriate preset leveling parameters can be selected according to actual conditions.
[0022] Step 1013: Pre-process the flattened substrate to obtain the target circuit board substrate.
[0023] Specifically, the flattened substrate is first placed in an ultrasonic cleaner for a primary cleaning. The cleaning solution temperature is 45℃ to 55℃, the ultrasonic power is 80W to 120W, and the cleaning time is 5 to 8 minutes. This ultrasonic cleaning removes large particles of impurities. Then, the substrate is rinsed with deionized water for a secondary cleaning of 2 to 3 minutes to thoroughly remove any residual cleaning agent. The substrate after the secondary cleaning is then placed in a drying oven at 80℃ to 90℃ for 15 to 20 minutes to ensure it is completely dry and free of moisture. This results in a dried substrate, preventing moisture carbonization and blackening of the tank walls during subsequent laser processing. The qualified dried substrate is used as the target circuit board substrate. The dried substrate can be inspected. A qualified dried substrate is one with no stains, scratches, or damage to the copper layer, and whose flatness meets the preset flatness requirements. A micrometer can be used to check the flatness. The primary and secondary cleaning parameters mentioned above are only illustrative; appropriate primary and secondary cleaning parameters can be selected based on the actual situation.
[0024] In an optional embodiment of the present invention, in step 102, the target circuit board substrate is positioned and calibrated to obtain a calibration substrate; the calibration substrate is mechanically drilled according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one center hole, which may include: step 1021, positioning and calibrating the target circuit board substrate to obtain a calibration substrate; in an optional embodiment of the present invention, step 1021 includes: step 10211, through Obtain the deflection angle; Step 10212, through , Obtain the translation compensation amount; Step 10213, through , The corrected actual coordinates are obtained; step 10214, the calibration substrate is obtained based on the corrected actual coordinates; wherein, These are the corrected actual coordinates. For the deflection angle, The actual coordinates of the first reference hole on the target circuit board substrate. The actual coordinates of the second reference hole on the target circuit board substrate. The standard coordinates of the first reference hole on the target circuit board substrate are given. Let (X, Y) be the standard coordinates of the second reference hole on the target circuit board substrate, and (X, Y) be the original coordinates. This is the X-axis translation compensation amount. This is the Y-axis translation compensation amount.
[0025] Specifically, the first and second reference holes are two pre-machined reference tool holes with a diameter of 1mm on the target circuit board substrate. The first reference hole is located in the upper left corner of the target circuit board substrate, and the second reference hole is located in the lower right corner of the target circuit board substrate, serving as global machining references. After calculating the corrected actual coordinates (i.e., the actual center coordinates of the holes to be drilled on the target circuit board substrate) through the above steps, a calibration substrate is obtained. The calibration substrate includes the corrected actual coordinates (i.e., the actual center coordinates) of all holes, so as to facilitate subsequent positioning and calibration according to the corrected actual coordinates, and mechanical drilling is performed on the target circuit board substrate to improve drilling accuracy.
[0026] Step 1022: Mechanically drill the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate and feed method; the first substrate has at least one center hole.
[0027] Specifically, obtaining reasonable preset drilling parameters can ensure high hole diameter accuracy, smooth hole walls without carbonization, and good hole perpendicularity. Here, the preset drilling parameters include a spindle speed of 180,000 rpm, a feed rate of 1.2 m / min, a retraction rate of 2.0 m / min, and a segmented feed method to avoid tool breakage and edge chipping of the hole wall; the drilling depth is the full thickness of the substrate to ensure through-hole penetration without residual material. The above preset drilling parameters are only illustrative; appropriate preset drilling parameters can be selected according to actual conditions. Using mechanical drilling can avoid the problems of hole wall blackening and substrate embrittlement caused by laser drilling, and provides a precise positioning reference for subsequent laser groove processing.
[0028] Specifically, preset drilling parameters and corrected actual coordinates are input into a mechanical drilling device, causing the device to drill holes in the calibration substrate according to these parameters and coordinates to obtain the first substrate. It should be noted that the first substrate has multiple holes. Depending on the actual requirements, these holes can be through holes, blind holes, or other types; this embodiment does not limit the type of holes. The holes on the first substrate can also be inspected. If the hole diameter, position, and perpendicularity match the preset parameters, the first substrate is considered a qualified substrate and proceeds to subsequent steps. Otherwise, the first substrate needs to be reworked until it is qualified.
[0029] In an optional embodiment of the present invention, in step 103, a groove processing trajectory is obtained based on the first substrate and preset groove parameters; the first substrate is laser etched according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the second substrate has multiple grooves in its central hole, which may include: step 1031, obtaining the groove processing trajectory based on the first substrate and preset groove parameters; in an optional embodiment of the present invention, step 1031 includes: step 10311, through , Obtain the starting point connecting the inner side of the tank to the central hole; Step 10312, through , Obtain the endpoint of the internal connection of the tank; Step 10313, through , Obtain the extended end point on the outer side of the tank; Step 10314, through , Obtain the extended end point on the outer side of the tank; Step 10315, through , Obtain the coordinates of the fillet center; Step 10316, based on the starting point of the connection between the inner side of the groove and the center hole, the ending point of the connection between the inner side of the groove and the center hole, the extension endpoint of the outer side of the groove, the extension endpoint of the outer side of the groove, and the coordinates of the fillet center, obtain the groove machining trajectory; wherein... The coordinates of the starting point where the inner side of the tank connects to the central hole are shown. The coordinates of the endpoint of the connection inside the tank are given. The coordinates of the outer extension endpoint of the tank body. The coordinates of the outer extension endpoint of the tank body. The coordinates of the center of the central hole (the actual center coordinates of the central hole after correction). Here are the coordinates of the fillet center, and R is the radius of the center hole. For the central angle of a single tank, ( radian), The width of the slot is half an angle. (Radian measure), W is the groove width. This is the substrate deflection compensation angle. The radius of the extended tank. L is the outward extension length of the groove, and r is the preset fillet radius (e.g., 0.05mm).
[0030] In an optional embodiment of the present invention, step 10316 includes: step 103161, obtaining a single groove machining trajectory based on the starting point of the connection between the inner side of the groove and the center hole, the ending point of the connection between the inner side of the groove, the extension endpoint of the outer side of the groove, the extension endpoint of the outer side of the groove, and the coordinates of the center of the rounded corner; step 103162, rotating the single groove machining trajectory centrally symmetrically according to a preset rotation angle to obtain the groove machining trajectory.
[0031] Specifically, the preset groove parameters include a groove width of 0.13mm (groove width range 0.12 to 0.15mm), a groove depth of 0.53mm, a groove extension length of 0.32mm, and a groove radius of 0.05mm. These preset groove parameters are for illustrative purposes only; other preset groove parameters can be set according to actual conditions. The obtained corrected actual coordinates (center coordinates) and the hole radius are synchronized in a single click, eliminating positioning deviations between laser grooving equipment (such as UV laser marking machines or PCB-specific laser micromachining machines) and mechanical drilling equipment (such as high-precision CNC PCB drilling machines).
[0032] Using the center O of the central hole on the first substrate as the vertex, the 360° circumference is divided into four quadrants, each with an angle range of 90°. The four slots correspond to the angle bisectors of the first, second, third, and fourth quadrants (45°, 135°, 225°, and 315°), respectively, achieving complete central symmetry. Based on the slot width, slot length, and central hole radius, the coordinates of the starting point, inflection point, ending point, and rounded corner transition point of a single slot are calculated to generate the trajectory of a single slot. The trajectory of a single slot in the first quadrant is then copied sequentially to generate the trajectories of the other three quadrants through a centrally symmetrical rotation (i.e., rotating the trajectory of a single slot around the center O by 90°, 180°, and 270° in sequence), forming a four-way symmetrical slot outline. Rounded corners are applied at the connection between the slot and the central hole to remove sharp corners, optimize the laser scanning path, and avoid burrs at the slot opening and carbonization of the substrate. The symmetry, spacing, and connectivity with the central hole of the four slots are verified. If the verification is successful, the slot processing trajectory is obtained; otherwise, the trajectory is recalculated based on the center coordinates of the central hole.
[0033] Here, the trajectory of a single groove is used to define the groove boundary, ensuring accurate groove width and shape. A clockwise closed-loop tool movement is adopted, combining linear interpolation and circular interpolation throughout the entire process to eliminate sharp corners and breakpoints. Taking the starting point connecting the inner side of the groove to the center hole as point A, the ending point connecting the inner side of the groove as point B, the extended endpoint of the outer side of the groove as point C, the extended endpoint of the outer side of the groove as point D, and the coordinates of the rounded corner center as point O1, the trajectory of a single groove is: starting point (laser landing point), point C (outer left endpoint), linear interpolation, point A (inner left starting point), circular interpolation (with O1 as the center and r as the radius, clockwise sweeping to point B), linear interpolation, point D (outer right endpoint), linear interpolation, point C (outer left endpoint), closed-loop tool termination. Here, linear interpolation uses G01 linear interpolation (the standard linear motion command for CNC / laser equipment, also known as linear positioning interpolation command), and the circular transition section uses G02 clockwise circular interpolation (the standard circular motion command, also known as clockwise circular interpolation command). The feed rate is a uniform 800mm / s, without speed changes or pauses, ensuring a smooth contour. This trajectory is completely free of backtracking and breaks, ensuring smooth groove walls, no carbonization, and uniform groove depth.
[0034] Step 1032: Perform laser etching on the first substrate according to the preset laser processing parameters and the groove processing trajectory to obtain the second substrate; the preset laser processing parameters include wavelength, power, spot diameter and positioning accuracy; there are multiple grooves in the central hole on the second substrate.
[0035] Specifically, the preset laser processing parameters include a wavelength of 355nm, a power of 5W to 8W, a spot diameter of no more than 0.02mm, and a positioning accuracy of ±0.005mm. The above preset laser processing parameters are only illustrative examples. Other preset laser processing parameters can be set according to actual conditions to achieve fine processing, resulting in uniform groove width, no stress, no damage to the substrate, and perfect realization of the four-zone separation within the hole.
[0036] The preset laser processing parameters and the groove processing trajectory are input into the laser grooving equipment, so that the laser grooving equipment performs laser etching on the first substrate according to the preset laser processing parameters and the groove processing trajectory to obtain the second substrate.
[0037] In an optional embodiment of the present invention, step 104 involves forming the second substrate to obtain a first circuit board, including: step 1041, deburring the second substrate to obtain a deburred substrate; specifically, a dual process of high-pressure water jet deburring and ultrasonic deburring is used to remove drill chips, laser residues, and microburrs from the center hole and laser groove; the high-pressure water pressure is 1.5MPa to 2.0MPa, the rinsing time is 3 minutes, and the ultrasonic deburring time is 5 minutes. After deburring, the substrate is rinsed with deionized water and dried to ensure that there are no impurities in the hole and groove, thus avoiding affecting the insulation and conductivity performance.
[0038] Step 1042: The deburred substrate is subjected to copper plating to obtain a copper-plated substrate. Specifically, for the zones requiring electrical conductivity, a full-board electroplating and selective via metallization process is used. Through chemical copper plating and electroplating, copper layers are plated on the hole walls and trench walls of the four independent zones, with a plating thickness of [missing information]. to This ensures that each zone is independently conductive and that adjacent zones are completely insulated.
[0039] Step 1043: The copper-plated substrate is formed to obtain the first circuit board.
[0040] Specifically, following the standard PCB manufacturing process, the process involves graphic transfer, etching, solder masking, silkscreening, and molding to ultimately form the first circuit board with a single-hole four-zone separation structure. During the molding process, the four-zone separation hole area is avoided to prevent external pressure from causing the groove to deform.
[0041] In an optional embodiment of the present invention, step 105, which involves testing the first circuit board according to preset testing conditions to obtain the target circuit board, may include: step 1051, obtaining preset testing conditions; the preset testing conditions include aperture detection, slot detection, accuracy detection, and performance detection; specifically, preset testing conditions that meet the requirements can be selected according to specific circumstances. In this embodiment, the preset testing conditions include aperture detection, slot detection (such as slot width and slot depth), accuracy detection (such as hole position accuracy and partition symmetry), and performance detection (such as hole wall and slot wall smoothness, insulation performance, and structural strength).
[0042] Step 1052: Inspect the first circuit board according to the preset inspection conditions to obtain the inspection results. Specifically, a two-dimensional image analyzer can be used to inspect the center hole diameter, slot width, slot depth, and hole position accuracy; the smoothness of the hole and slot walls can be visually inspected; an insulation performance test can be performed by applying a DC voltage of 500V between adjacent partitions; and the structural strength of the first circuit board can be tested by a substrate bending test, etc. The above are just examples; depending on the actual situation, corresponding inspection methods can be used to inspect the first circuit board. The inspection results may include the inspection method and the corresponding inspection data.
[0043] Step 1053: The first circuit board is screened according to the preset qualification conditions and the test results to obtain the target circuit board.
[0044] Specifically, if the test results meet all preset qualification conditions, the first circuit board is selected as the target circuit board; otherwise, the first circuit board needs to be repaired until its test results meet the preset qualification conditions to meet user needs and improve user satisfaction. In one specific embodiment, the preset qualification conditions include at least: no burrs, no carbonization, no cracks, no short circuits, no leakage, no deformation of the separator holes, and no cracks.
[0045] Figure 2 shows a schematic diagram of a hole with a partitioned structure on a circuit board with an internal partitioned structure according to an embodiment of the present invention. The hole 11 has four slots 12, realizing an internal partitioned structure within the single hole. It should be noted that the structure in Figure 2 is merely illustrative; in specific implementations, other types or shapes of partitioned structures may be used. This embodiment is not intended to limit the scope of this application.
[0046] A specific embodiment of the method for manufacturing a circuit board with an in-hole partition structure according to the present invention includes: step 111, obtaining a target circuit board substrate; performing flattening and pretreatment on the cut bare substrate to obtain the target circuit board substrate.
[0047] Step 112: Position and calibrate the target circuit board substrate to obtain a calibration substrate; mechanically drill the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one center hole; calibrate the coordinates of the hole on the target circuit board substrate, and then mechanically drill the calibration substrate according to the obtained preset drilling parameters and the calculated corrected actual coordinates to obtain the first substrate.
[0048] Step 113: Obtain the groove processing trajectory based on the first substrate and the preset groove parameters; perform laser etching on the first substrate based on the preset laser processing parameters and the groove processing trajectory to obtain the second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the second substrate has multiple grooves in the central hole; obtain the groove processing trajectory based on the first substrate and the preset groove parameters; perform laser etching on the first substrate based on the obtained preset laser processing parameters and the groove processing trajectory to obtain the second substrate.
[0049] Step 114: The second substrate is subjected to a molding process to obtain a first circuit board; the second substrate is subjected to deburring, copper plating and other molding processes to obtain the first circuit board.
[0050] Step 115: Test the first circuit board according to the preset testing conditions to obtain the target circuit board.
[0051] Set specific preset test conditions according to user needs, and then test the first circuit board according to the preset test conditions. If the test result meets the preset qualified conditions, the target circuit board is obtained.
[0052] The method for manufacturing a circuit board with an internal partition structure according to embodiments of the present invention combines mechanical drilling and laser microgrooving composite processes, taking into account the high precision and high perpendicularity of mechanical drilling and the fineness and narrow groove of laser processing, solving the industry problem that traditional single processes cannot achieve internal partitioning within a single hole. A single hole achieves four completely independent zones, replacing the traditional four independent small hole layout, saving more than 60% of board surface wiring space, significantly increasing PCB wiring density, and adapting to high-density miniaturized electronic products. It ensures the insulation strength and structural stability of the partitioned zones while maintaining sufficient substrate thickness, without compromising the overall mechanical properties of the PCB substrate, avoiding substrate deformation and cracking. The entire process uses standard PCB industry equipment, eliminating the need for customized special tooling, simplifying processing steps, and achieving a high degree of automation. Visual positioning and parameter fixing enable stable mass production, reducing the unit processing cost by 40% compared to traditional multi-hole layouts.
[0053] As shown in Figure 3, an embodiment of the present invention proposes a fabrication apparatus 300 for a circuit board with an in-hole partition structure, comprising: an acquisition module 301 for acquiring a target circuit board substrate; a processing module 302 for positioning and calibrating the target circuit board substrate to obtain a calibration substrate; mechanically drilling the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one central hole; a groove processing trajectory is obtained according to the first substrate and preset groove parameters; the first substrate is laser etched according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the central hole on the second substrate contains multiple grooves; the second substrate is formed to obtain a first circuit board; and the first circuit board is tested according to preset detection conditions to obtain a target circuit board.
[0054] Optionally, obtaining the target circuit board substrate includes: obtaining a cut bare substrate; performing a leveling process on the cut bare substrate according to preset leveling parameters to obtain a leveled substrate; the preset leveling parameters include leveling temperature, leveling pressure and leveling time; and performing pretreatment on the leveled substrate to obtain the target circuit board substrate.
[0055] Optionally, the target circuit board substrate is positioned and calibrated to obtain a calibration substrate, including: through... Obtain the deflection angle; through , Obtain the translation compensation amount; through , The corrected actual coordinates are obtained; based on the corrected actual coordinates, the calibration substrate is obtained; wherein, These are the corrected actual coordinates. For the deflection angle, The actual coordinates of the first reference hole on the target circuit board substrate. The actual coordinates of the second reference hole on the target circuit board substrate. The standard coordinates of the first reference hole on the target circuit board substrate are given. Let (X, Y) be the standard coordinates of the second reference hole on the target circuit board substrate, and (X, Y) be the original coordinates. This is the X-axis translation compensation amount. This is the Y-axis translation compensation amount.
[0056] Optionally, based on the first substrate and preset tank parameters, the tank processing trajectory is obtained, including: through... , Obtain the starting point where the inner side of the tank connects to the central hole; through , Obtain the endpoint of the internal connection of the tank; through , Obtain the extended end point on the outer side of the tank; through , Obtain the extended end point on the outer side of the tank; through , Obtain the coordinates of the fillet center; based on the starting point connecting the inner side of the groove to the center hole, the ending point connecting the inner side of the groove, the extending end point of the outer side of the groove, and the coordinates of the fillet center, obtain the groove machining trajectory; wherein... The coordinates of the starting point where the inner side of the tank connects to the central hole are shown. The coordinates of the endpoint of the connection inside the tank are given. The coordinates of the outer extension endpoint of the tank body. The coordinates of the outer extension endpoint of the tank body. The coordinates of the center of the central hole are... Here are the coordinates of the fillet center, and R is the radius of the center hole. For the central angle of a single tank, , The width of the slot is half an angle. W is the width of the slot. This is the substrate deflection compensation angle. The radius of the extended tank. L is the outward extension length of the groove, and r is the preset fillet radius.
[0057] Optionally, the machining trajectory of the groove is obtained based on the starting point of the connection between the inner side of the groove and the center hole, the ending point of the connection between the inner side of the groove, the extension end point of the outer side of the groove, the extension end point of the outer side of the groove, and the coordinates of the center of the rounded corner. This includes: obtaining a single groove machining trajectory based on the starting point of the connection between the inner side of the groove and the center hole, the ending point of the connection between the inner side of the groove, the extension end point of the outer side of the groove, the extension end point of the outer side of the groove, and the coordinates of the center of the rounded corner; and rotating the single groove machining trajectory symmetrically according to a preset rotation angle to obtain the groove machining trajectory.
[0058] Optionally, the second substrate is subjected to a forming process to obtain a first circuit board, including: deburring the second substrate to obtain a deburred substrate; copper plating the deburred substrate to obtain a copper-plated substrate; and forming the copper-plated substrate to obtain the first circuit board.
[0059] Optionally, the first circuit board is tested according to preset testing conditions to obtain a target circuit board, including: obtaining preset testing conditions; the preset testing conditions include aperture testing, slot testing, accuracy testing, and performance testing; testing the first circuit board according to the preset testing conditions to obtain testing results; and screening the first circuit board according to preset qualification conditions and the testing results to obtain a target circuit board.
[0060] The apparatus for manufacturing a circuit board with an in-hole partition structure according to embodiments of the present invention obtains a target circuit board substrate and performs mechanical drilling on the target circuit board substrate according to preset drilling parameters to obtain a first substrate. Then, it performs laser etching on the first substrate according to preset laser processing parameters to obtain a second substrate. Next, it performs shaping processing on the second substrate to obtain a first circuit board. Finally, it performs testing on the first circuit board according to preset testing conditions to obtain the target circuit board. By combining mechanical drilling and laser etching, it balances the high precision and high perpendicularity of mechanical drilling with the fineness and narrow slotting of laser processing, solving the problems of high cost and low efficiency of traditional single processes. This improves the efficiency and quality of in-hole slotting, achieves in-hole partitioning, saves board surface wiring space, increases circuit board wiring density, and is suitable for high-density miniaturized electronic products.
[0061] It should be noted that this device corresponds to the method described above, and all implementations in the method embodiments described above are applicable to the embodiments of this device and can achieve the same technical effect. Further details are omitted in this embodiment.
[0062] This invention also provides a computing device, including: a processor and a memory storing a computer program, wherein the computer program, when executed by the processor, performs the method as described in any of the above embodiments. All implementations in the above method embodiments are applicable to the embodiments of this device and can achieve the same technical effects. Further details are omitted in this embodiment.
[0063] This invention also provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the method as described in any of the above embodiments. All implementations in the above method embodiments are applicable to the embodiments of this device and can achieve the same technical effects. Further details are omitted in this embodiment.
[0064] It should be noted that in the apparatus and method of the present invention, the components or steps can obviously be decomposed and / or recombined. These decompositions and / or recombinations should be considered equivalent solutions of the present invention. Furthermore, the steps for performing the above series of processes can naturally be performed in the order described and in chronological order, but are not necessarily required to be performed in chronological order. Some steps can be performed in parallel, overlapping, or independently of each other.
[0065] It should be noted that in the above embodiments, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments described above is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
[0066] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A method for manufacturing a circuit board with an internal partition structure, characterized in that, include: Obtain the target circuit board substrate; The target circuit board substrate is positioned and calibrated to obtain a calibration substrate; the calibration substrate is mechanically drilled according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one center hole; the groove processing trajectory is obtained according to the first substrate and preset groove parameters; the first substrate is laser etched according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the center hole on the second substrate contains multiple grooves; the second substrate is shaped to obtain a first circuit board; the first circuit board is tested according to preset detection conditions to obtain the target circuit board.
2. The method for manufacturing a circuit board with an in-hole partition structure according to claim 1, characterized in that, Obtaining a target circuit board substrate includes: obtaining a cut bare substrate; performing a leveling process on the cut bare substrate according to preset leveling parameters to obtain a leveled substrate; the preset leveling parameters include leveling temperature, leveling pressure and leveling time; and performing pretreatment on the leveled substrate to obtain the target circuit board substrate.
3. The method for manufacturing a circuit board with an in-hole partition structure according to claim 1, characterized in that, The target circuit board substrate is positioned and calibrated to obtain a calibration substrate, including: through... Obtain the deflection angle; through 、 Obtain the translation compensation amount; through 、 The corrected actual coordinates are obtained; based on the corrected actual coordinates, the calibration substrate is obtained; wherein, These are the corrected actual coordinates. For the deflection angle, The actual coordinates of the first reference hole on the target circuit board substrate. The actual coordinates of the second reference hole on the target circuit board substrate. The standard coordinates of the first reference hole on the target circuit board substrate are given. Let (X, Y) be the standard coordinates of the second reference hole on the target circuit board substrate, and (X, Y) be the original coordinates. This is the X-axis translation compensation amount. This is the Y-axis translation compensation amount.
4. The method for manufacturing a circuit board with an in-hole partition structure according to claim 1, characterized in that, Based on the first substrate and preset tank parameters, the tank processing trajectory is obtained, including: through... 、 Obtain the starting point where the inner side of the tank connects to the central hole; through 、 Obtain the endpoint of the internal connection of the tank; through 、 Obtain the extended end point on the outer side of the tank; through 、 Obtain the extended end point on the outer side of the tank; through 、 Obtain the coordinates of the fillet center; based on the starting point connecting the inner side of the groove to the center hole, the ending point connecting the inner side of the groove, the extending end point of the outer side of the groove, and the coordinates of the fillet center, obtain the groove machining trajectory; wherein... The coordinates of the starting point where the inner side of the tank connects to the central hole are shown. The coordinates of the endpoint of the connection inside the tank are given. The coordinates of the outer extension endpoint of the tank body. The coordinates of the outer extension endpoint of the tank body. The coordinates of the center of the central hole are... Here are the coordinates of the fillet center, and R is the radius of the center hole. For the central angle of a single tank, ， The width of the slot is half an angle. W is the width of the slot. This is the substrate deflection compensation angle. The radius of the extended tank. L is the outward extension length of the groove, and r is the preset fillet radius.
5. The method for manufacturing a circuit board with an in-hole partition structure according to claim 4, characterized in that, The machining trajectory of the tank is obtained based on the starting point of the connection between the inner side of the tank and the center hole, the ending point of the connection between the inner side of the tank and the center hole, the extension endpoint of the outer side of the tank, the extension endpoint of the outer side of the tank, and the coordinates of the center of the rounded corner. This includes: obtaining a single tank machining trajectory based on the starting point of the connection between the inner side of the tank and the center hole, the ending point of the connection between the inner side of the tank and the center hole, the extension endpoint of the outer side of the tank, the extension endpoint of the outer side of the tank, and the coordinates of the center of the rounded corner; and rotating the single tank machining trajectory symmetrically according to a preset rotation angle to obtain the final tank machining trajectory.
6. The method for manufacturing a circuit board with an in-hole partition structure according to claim 1, characterized in that, The process of forming the second substrate to obtain the first circuit board includes: deburring the second substrate to obtain a deburred substrate; copper plating the deburred substrate to obtain a copper-plated substrate; and forming the copper-plated substrate to obtain the first circuit board.
7. The method for manufacturing a circuit board with an in-hole partition structure according to claim 1, characterized in that, The process of testing the first circuit board according to preset testing conditions to obtain a target circuit board includes: acquiring preset testing conditions; the preset testing conditions include aperture testing, slot testing, accuracy testing, and performance testing; testing the first circuit board according to the preset testing conditions to obtain testing results; and screening the first circuit board according to preset qualification conditions and the testing results to obtain a target circuit board.
8. An apparatus for manufacturing a circuit board with an internal partition structure, characterized in that, include: The acquisition module is used to acquire the target circuit board substrate; The processing module is used to perform positioning and calibration on the target circuit board substrate to obtain a calibration substrate; to perform mechanical drilling on the calibration substrate according to preset drilling parameters to obtain a first substrate; the preset drilling parameters include spindle speed, feed rate, retraction rate, and feed method; the first substrate has at least one center hole; to obtain a groove processing trajectory based on the first substrate and preset groove parameters; to perform laser etching on the first substrate according to preset laser processing parameters and the groove processing trajectory to obtain a second substrate; the preset laser processing parameters include wavelength, power, spot diameter, and positioning accuracy; the center hole on the second substrate contains multiple grooves; to perform shaping processing on the second substrate to obtain a first circuit board; and to detect the first circuit board according to preset detection conditions to obtain the target circuit board.
9. A computing device, characterized in that, include: A processor, a memory storing a computer program, wherein the computer program, when executed by the processor, performs the method as described in any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, The system stores instructions that, when executed on a computer, cause the computer to perform the method as described in any one of claims 1 to 7.