Surface treatment device and process for glue injection port of routing finger surface of circuit board

Abstract

The invention discloses a circuit board routing finger surface glue injection port surface treatment device and process, and belongs to the technical field of circuit board manufacturing. According to the invention, an OSP organic solderability preservative process is adopted to replace nickel-gold plating. In order to realize automatic and efficient execution of the process, the matched device comprises an annular treatment assembly provided with a plurality of treatment grooves, a rotating assembly driven by a driving motor to rotate, a plurality of clamping assemblies distributed on the rotating assembly in an annular array, and a fixed guide assembly. During revolution, the clamping assembly is matched with a track of the guide assembly to achieve lifting, and is matched with a convex ring of the guide assembly to achieve clamping and releasing, so that continuous cycle operation of feeding, micro-etching, cleaning, OSP film forming, final cleaning and drying and discharging is automatically completed. According to the invention, the production cost is reduced by more than 75%, the wastewater is nearly zero-pollution discharged, and the high efficiency, stability and flexibility of the treatment process are ensured through pure mechanical linkage and adjustable track design.

Description

Technical Field

[0001] This invention belongs to the field of circuit board manufacturing technology, and particularly relates to a surface treatment device and process for the glue injection port of the wire bonding finger surface of a circuit board. Background Technology

[0002] In the semiconductor packaging and high-end circuit board manufacturing fields, to ensure the reliability of wire bonding, it is essential to perform anti-oxidation and solderability surface treatment on the exposed copper layer of the bonding fingers and the glue injection port. For a long time, electroless nickel immersion gold (ENIG) has been the mainstream and standard technology for this application. The specific process is as follows: after degreasing and micro-etching cleaning of the copper surface, a layer of nickel (as a diffusion barrier layer, 2-5 μm thick) and a thin layer of gold (as an anti-oxidation and soldering layer, 0.03-0.1 μm thick) are deposited sequentially through a chemical displacement reaction, followed by cleaning and drying.

[0003] However, this existing technology has significant shortcomings: 1. High cost: Gold, as a precious metal, accounts for more than 70% of the direct material cost, and the price of gold fluctuates at a high level, resulting in a high processing cost per square meter (100-150 yuan). 2. Immense environmental pressure: The process generates heavy metal wastewater containing nickel, gold, and complexing agents (such as cyanide), which is difficult and costly to treat (approximately 12 yuan / ton), and poses environmental and safety risks. 3. Complex process control: It involves multiple sensitive parameters such as nickel-phosphorus ratio, plating rate, and displacement reaction, with a narrow control window, making it prone to defects such as "black plates," and posing a significant challenge to quality stability. 4. Production efficiency bottleneck: Whether it is manual tank immersion or existing semi-automatic equipment, it is an intermittent operation, with manual or robotic handling between tanks, making cycle matching difficult and limiting the improvement of overall capacity and efficiency (20-25 m² / hour). Summary of the Invention

[0004] This invention provides a surface treatment device and process for the glue injection port on the finger surface of a circuit board, aiming to solve the key technical problems in the current field of surface treatment of glue injection ports on the finger surface of circuit boards, which are caused by excessively high overall costs, serious environmental pollution, complex process control, low production efficiency, and difficulty in achieving high-quality continuous automated production due to reliance on nickel-gold plating processes.

[0005] This invention is implemented as follows: a surface treatment device for the glue injection port of the finger surface of a circuit board bonding wire, comprising: Base; A processing component, disposed above the base, is used to install and hold the cleaning and drying components and various solvents required for the surface treatment of the circuit board to be processed; A rotating component is disposed above the processing component; Multiple clamping components are arranged in a ring array on the rotating component for clamping and releasing the circuit board to be processed; A guide component is disposed on the outside of the rotating component; A support component is disposed between the processing component, the guiding component, and the rotating component, integrating the three into one unit; A drive motor, mounted on the support assembly, is used to drive the rotating assembly to rotate, thereby causing the clamping assembly to revolve. During the revolve of the clamping assembly, in conjunction with the transmission of the guide assembly, it can clamp, release, and lift the circuit board to be processed.

[0006] Preferably, the rotating assembly includes an inner ring, a cross is fixedly attached to the inner wall of the inner ring, and a T-shaped outer ring is fixedly sleeved on the outer periphery of the inner ring.

[0007] Preferably, the guide assembly includes an upper ring and a lower ring disposed below the upper ring, with a guide track formed between the lower ring and the upper ring; The guide rail consists of a horizontally extending upper crossbar, a horizontally extending bottom crossbar, and an inclined rail connecting the two end to end; wherein, the bottom crossbar is correspondingly set above each processing tank, and the length of each bottom crossbar is set according to the processing time required by the corresponding process.

[0008] Preferably, the guide assembly further includes a convex ring fixed to the inner wall of the lower side of the lower ring. The convex ring is a non-closed ring structure, and a notch is formed between the first and last ends of the convex ring.

[0009] Preferably, the clamping assembly includes a fixing frame slidably sleeved on the outer wall of the T-shaped outer ring, the fixing frame being fixedly connected to the T-shaped outer ring by bolts, two U-shaped rods being fixedly connected to the top of the fixing frame, a lifting column being slidably sleeved on the outer walls of the two U-shaped rods, a limiting piece being fixedly connected to the outer wall of the U-shaped rod, and a connecting spring being sleeved on the outer wall of the U-shaped rod, with both ends of the connecting spring being connected to the limiting piece and the lifting column respectively; A crossbar is fixed to the outer wall of the lifting column, and the crossbar is slidably sleeved on the inner side of the guide rail.

[0010] Preferably, a second Z-shaped frame is fixedly connected to the lower side of the lifting column, and a first Z-shaped frame is slidably connected to one side of the second Z-shaped frame. A protruding post that cooperates with the protruding ring is fixedly connected to the outer wall of the first Z-shaped frame. A plurality of guide posts slide through the second Z-shaped frame. One end of the guide post is fixedly connected to the first Z-shaped frame, and a return spring is connected to the other end of the second Z-shaped frame and the guide post. The return spring is sleeved on the outside of the guide post.

[0011] Preferably, the processing component includes an annular pool, with several support plates fixedly connected between the annular pool and the base. The annular pool has a micro-etching roughening tank, an immersion cleaning tank, an OSP tank, a cleaning and drying tank, and a drain pipe fixedly connected to the bottom of each tank. A bottom cross passage is respectively provided above the micro-etching roughening tank, the immersion cleaning tank, and the OSP tank.

[0012] Preferably, the support assembly includes several first right-angle frames fixedly to the outer wall of the annular pool in a circular array. A second right-angle frame is fixedly connected to one end of each first right-angle frame. A mounting plate is fixedly connected to several second right-angle frames. The drive motor is fixedly installed on the top of the mounting plate. The shaft of the drive motor slides through the mounting plate and is fixedly connected to the top of the center of the cross. A U-shaped limiting frame is provided between the first and second right-angle frames for fixing the upper and lower rings.

[0013] Preferably, the cleaning and drying assembly includes a first pipe and a second pipe disposed inside the cleaning and drying tank. Both the first pipe and the second pipe are fixedly supported inside the cleaning and drying tank by a vertical plate. Spray holes are provided on opposite sides of the two upper arc-shaped pipes on the first pipe, and air outlet holes are provided on opposite sides of the two upper arc-shaped pipes on the second pipe. External connecting pipes are fixedly connected to the outer walls of both the first pipe and the second pipe.

[0014] A surface treatment process for the glue injection port on the finger side of a circuit board bonding wire includes the following steps: S1. Loading and clamping: The circuit board to be processed is placed into the clamping assembly that moves to the notch of the convex ring. The convex post then contacts the inner wall of the convex ring, driving the first Z-shaped frame to close to clamp the circuit board. S2, Micro-etching and roughening: The crossbar holding the component descends along the guide rail, immersing the circuit board into the micro-etching and roughening tank for processing; S3. Cleaning: After the micro-etched circuit board is lifted and transferred, it is immersed in the soaking cleaning tank for cleaning. S4, OSP film formation: The cleaned circuit board is immersed in the OSP tank to form an organic solder mask on the copper surface; S5. Final cleaning and drying: The circuit board after film formation is lifted and moved to the cleaning and drying tank area, where it is sprayed cleaned and dried with hot air in sequence. S6. Unloading: The dried circuit board is transported to the notch of the convex ring, and the clamping component automatically opens to release the circuit board.

[0015] Compared with related technologies, the surface treatment device and process for the glue injection port of the circuit board bonding finger surface provided by the present invention have the following beneficial effects: 1. By completely replacing the traditional nickel-gold plating process with OSP organic solder resist technology and supporting it with dedicated automated equipment, a revolutionary cost reduction, efficiency improvement, and environmental upgrade have been achieved. The core of this invention lies in changing the surface treatment process of the glue injection port on the wire bonding finger from "nickel-gold plating" which relies on precious metals to "OSP film formation" based on organic compounds. To achieve efficient and stable execution of this process, a dedicated processing device is provided. This device drives a rotating component to revolve via a drive motor, causing the clamping components distributed in a ring array to pass through each station sequentially. During the revolution, the clamping components cooperate with a fixed guide rail to achieve automatic lifting and lowering of the circuit board, and cooperate with a fixed convex ring to achieve automatic clamping and release, thereby automating the entire process of micro-etching, cleaning, OSP film formation, and post-processing. This brings fundamental innovation to three levels: materials, process, and production mode. In terms of materials, expensive gold and nickel are completely eliminated, reducing the processing cost per square meter by more than 75%, and the cost is not affected by fluctuations in precious metal prices. In terms of environmental protection, it has achieved zero emissions of heavy metal ions (nickel, gold), reduced wastewater treatment costs by more than 90%, and fully complies with stringent environmental standards. In terms of production mode, it has transformed from intermittent, multi-tank manual or semi-automatic operation to continuous, synchronous automated production line production, significantly improving equipment utilization and production efficiency. 2. Through the integrated design of "mechanical structure replacing complex electrical control" and "track length controlling process time," the device achieves full automation while ensuring the accuracy, stability, and flexible controllability of process parameters. This invention eliminates complex robotic arms and multi-axis motion control systems, employing a single rotary drive combined with a purely mechanical linkage mechanism of "track-controlled lifting and cam-controlled clamping," resulting in a simple and reliable structure. The length of the "bottom crossbar" in the guide rail corresponding to each processing tank can be independently designed and precisely set according to the required process time for that tank (such as micro-etching time and OSP film formation time). The purely mechanical linkage scheme boasts high reliability, simple maintenance, and low manufacturing cost, overcoming the pain points of complex and expensive electrical control systems in traditional automated equipment. Furthermore, by directly and precisely controlling the immersion time of the circuit board in each tank through the physical track length, the timing errors caused by manual operation or program control are eliminated, ensuring a high degree of consistency in the processing conditions for each product and significantly improving the stability of product quality. Finally, this design can flexibly adapt to the different requirements of different process formulations and different drug activities on the processing time. Without changing the drive speed, the process parameters can be quickly switched and optimized simply by replacing or designing guide rails of different shapes. The versatility and adaptability of the device are significantly enhanced. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural schematic diagram of a surface treatment device for the glue injection port of the circuit board bonding finger surface according to the present invention; Figure 2 This is a schematic diagram of the structural composition of the processing component of the present invention; Figure 3 This is a schematic diagram of the supporting component structure of the present invention; Figure 4 This is a schematic diagram of the structural composition of the guide component of the present invention; Figure 5 This is a schematic diagram of the clamping component structure of the present invention; Figure 6 This is a schematic diagram of the structural composition of the cleaning and drying assembly of the present invention.

[0017] In the picture: 100. Base support; 200. Processing components; 201. Circular pool; 202. Support plate; 203. Cleaning and drying tank; 204. Micro-etching and roughening tank; 205. Immersion cleaning tank; 206. OSP tank; 207. Drain pipe; 300. Cleaning and drying assembly; 301. First connecting pipe; 302. Second connecting pipe; 303. Spray nozzle; 304. Air outlet; 305. External connecting pipe; 306. Vertical plate; 400. Support assembly; 401. First right-angle bracket; 402. Second right-angle bracket; 403. Mounting plate; 404. U-shaped limit bracket; 500. Rotating assembly; 501. Cross-shaped component; 502. Inner ring; 503. T-shaped outer ring; 600. Guide assembly; 601. Upper ring; 602. Lower ring; 603. Inclined track; 604. Bottom cross track; 605. Notch; 606. Upper cross track; 607. Protruding ring; 6071. Head end; 6072. Tail end; 700. Clamping assembly; 701. Fixing frame; 702. U-shaped rod; 703. Limiting plate; 704. Connecting spring; 705. Crossbar; 706. Lifting column; 707. Protruding column; 708. First Z-shaped frame; 709. Second Z-shaped frame; 710. Return spring; 711. Guide column; 800. Drive motor; 900. Circuit board to be processed. Detailed Implementation

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments. Example

[0020] A preferred embodiment of the surface treatment device and process for the glue injection port of the wire bonding finger surface of the circuit board provided by the present invention is as follows: Figures 1 to 6 The device includes: a base 100 for surface treatment of the finger-side glue injection port of a circuit board bonding assembly; a processing component 200, disposed above the base 100, for mounting and accommodating a cleaning and drying component 300 and various solvents required for surface treatment of the circuit board 900 to be processed; a rotating component 500, disposed above the processing component 200; multiple clamping components 700, arranged in a circular array on the rotating component 500, for clamping and releasing the circuit board 900 to be processed; a guide component 600, disposed outside the rotating component 500; a support component 400, disposed between the processing component 200, the guide component 600, and the rotating component 500, integrating the three components; and a drive motor 800, disposed on the support component 400, for driving the rotating component 500 to rotate, thereby driving the clamping components 700 to revolve. During the revolve of the clamping components 700, in conjunction with the transmission of the guide component 600, the circuit board 900 to be processed can be clamped, released, and raised / lowered.

[0021] In this embodiment, the drive motor 800 starts, driving the rotating assembly 500 to rotate. The rotating assembly 500 drives multiple clamping assemblies 700 arranged in a ring above it to revolve synchronously. Supported by the processing assembly 200, the guide assembly 600 is fixedly disposed around the rotating assembly 500. When the clamping assembly 700 revolves, it engages with the fixed guide assembly 600. This engagement allows each clamping assembly 700 to perform three key actions on the circuit board 900 to be processed along its circular path: clamping and fixing it at a specific position, releasing it at another specific position, and controlling its vertical lifting and lowering during travel. Through the combination and cycle of the above movements, the clamped circuit board can sequentially pass through different workstations on the processing assembly 200. In the processing assembly 200, the circuit board can be immersed in different solvent tanks for surface treatment, and the final cleaning and drying are completed at the cleaning and drying assembly 300. The support assembly 400 provides a stable integrated structural support for the entire device, ensuring the precision of coordinated operation of each component. This enables automated and continuous surface treatment of the glue injection port on the finger surface of the circuit board bonding process.

[0022] In a further preferred embodiment of the present invention, the rotating component 500 includes an inner ring 502, a cross 501 is fixedly connected to the inner wall of the inner ring 502, and a T-shaped outer ring 503 is fixedly sleeved on the outer periphery of the inner ring 502.

[0023] In a further preferred embodiment of the present invention, the guide assembly 600 includes an upper ring 601 and a lower ring 602 disposed below the upper ring 601, forming a guide track between the lower ring 602 and the upper ring 601. The guide track is composed of a horizontally extending upper crossbeam 606, a horizontally extending bottom crossbeam 604, and an inclined track 603 connecting the two end to end. The bottom crossbeam 604 is correspondingly disposed above each processing tank, and the length of each section of the bottom crossbeam 604 is set according to the processing time required for the corresponding process. The guide assembly 600 also includes a protruding ring 607 fixed to the lower inner wall of the lower ring 602. The protruding ring 607 is a non-closed ring structure, and a notch 605 is formed between the first end 6071 and the last end 6072 of the protruding ring 607.

[0024] In a further preferred embodiment of the present invention, the clamping assembly 700 includes a fixing frame 701 slidably sleeved on the outer wall of the T-shaped outer ring 503. The fixing frame 701 and the T-shaped outer ring 503 are fixedly connected by bolts. Two U-shaped rods 702 are fixedly connected to the top of the fixing frame 701. A lifting column 706 is slidably sleeved on the outer wall of the two U-shaped rods 702. A limiting piece 703 is fixedly connected to the outer wall of the U-shaped rods 702. A connecting spring 704 is sleeved on the outer wall of the U-shaped rods 702. The two ends of the connecting spring 704 are respectively connected to the limiting piece 703 and the lifting column 706. A crossbar 705 is fixedly connected to the outer wall of the lifting column 706. The crossbar 705 is slidably sleeved on the inner side of the guide rail. A second Z-shaped frame 709 is fixedly connected to the lower side of the lifting column 706. A first Z-shaped frame 708 is slidably connected to one side of the second Z-shaped frame 709. A protruding post 707 that cooperates with the protruding ring 607 is fixedly connected to the outer wall of the first Z-shaped frame 708. Several guide posts 711 slide through the second Z-shaped frame 709. One end of the guide post 711 is fixedly connected to the first Z-shaped frame 708. A return spring 710 is connected to the other end of the second Z-shaped frame 709 and the guide post 711. The return spring 710 is sleeved on the outside of the guide post 711.

[0025] In this embodiment, the drive motor 800 is activated, driving the rotating assembly 500 and the multiple clamping assemblies 700 mounted thereon to rotate at a constant speed. When an empty clamping assembly 700 rotates to the position corresponding to the notch 605 of the convex ring 607 (i.e., the loading / unloading station), its protrusion 707 is located within the notch 605 and is not subject to radial force. Under the action of the return spring 710, the first Z-shaped frame 708 and the second Z-shaped frame 709 separate. At this time, the pre-processed circuit board 900 can be placed in.

[0026] After the circuit board is placed in, the clamping assembly 700 continues to rotate, and the protrusion 707 moves away from the notch 605 and comes into contact with the continuous inner wall of the protrusion ring 607. The radial pressing force of the inner wall of the protrusion ring 607 on the protrusion 707 pushes the first Z-shaped frame 708 to slide towards the second Z-shaped frame 709, compressing the return spring 710, thereby firmly clamping the circuit board. From this point until unloading, the protrusion 707 remains in contact with the inner wall of the protrusion ring 607, maintaining stable clamping.

[0027] In a further preferred embodiment of the present invention, the processing component 200 includes an annular pool 201, and a plurality of support plates 202 are fixedly connected between the annular pool 201 and the base 100. The annular pool 201 is provided with a micro-etching roughening tank 204, an immersion cleaning tank 205, an OSP tank 206, a cleaning and drying tank 203, and a drain pipe 207 fixedly connected to the bottom of each tank. A bottom cross passage 604 is respectively provided above the micro-etching roughening tank 204, the immersion cleaning tank 205, and the OSP tank 206.

[0028] In a further preferred embodiment of the present invention, the support component 400 includes a plurality of first right-angle frames 401 fixedly attached to the outer wall of the annular pool 201 in a ring array. A second right-angle frame 402 is fixedly attached to one end of each first right-angle frame 401. A mounting plate 403 is fixedly attached to the plurality of second right-angle frames 402. A drive motor 800 is fixedly mounted on the top of the mounting plate 403. The shaft of the drive motor 800 slides through the mounting plate 403 and is fixedly attached to the top of the center of the cross 501. A U-shaped limiting frame 404 is provided between the first right-angle frames 401 and the second right-angle frames 402 for fixing the upper ring 601 and the lower ring 602.

[0029] In a further preferred embodiment of the present invention, the cleaning and drying assembly 300 includes a first through pipe 301 and a second through pipe 302 disposed inside the cleaning and drying tank 203. Both the first through pipe 301 and the second through pipe 302 are fixedly supported inside the cleaning and drying tank 203 by a vertical plate 306. Spray holes 303 are provided on opposite sides of the two upper arc-shaped pipes on the first through pipe 301, and air outlets 304 are provided on opposite sides of the two upper arc-shaped pipes on the second through pipe 302. An outer pipe 305 is fixedly connected to the outer wall of both the first through pipe 301 and the second through pipe 302.

[0030] In this embodiment, based on a single rotary drive source, two independent yet coordinated motion control mechanisms enable fully automated and continuous processing of multiple circuit boards. Specifically, the spatial cam track (composed of the upper ring 601 and lower ring 602 of the guide assembly 600) controls the vertical lifting motion of the clamping mechanism, while the planar cam (convex ring 607) controls the opening and closing motion of the clamping mechanism. These two mechanisms precisely cooperate in the circumferential direction, guiding the clamping assembly 700 to sequentially complete all processes, including loading, clamping, impregnation, cleaning, drying, and unloading.

[0031] The specific work process is as follows: 1. Initialization and material loading: The appropriate chemical solutions and clean water are injected into the micro-etching roughening tank 204, the immersion cleaning tank 205, and the OSP tank 206, respectively. The two external pipes 305 of the cleaning and drying assembly 300 are connected to an external deionized water source and a hot air source, respectively. The drive motor 800 is started, driving the rotating assembly 500 and the multiple clamping assemblies 700 mounted on it to rotate at a uniform speed. When the empty clamping assembly 700 revolves to the position corresponding to the notch 605 of the convex ring 607 (i.e., the loading / unloading station), its protrusion 707 is located within the notch 605 and is not subject to radial force. Under the action of the return spring 710, the first Z-shaped frame 708 and the second Z-shaped frame 709 separate. At this time, the pre-processed circuit board 900 can be placed in.

[0032] 2. Automatic clamping: After the circuit board is placed in, the clamping assembly 700 continues to rotate, and the protrusion 707 moves away from the notch 605 and comes into contact with the continuous inner wall of the protrusion ring 607. The radial pressing force of the inner wall of the protrusion ring 607 on the protrusion 707 pushes the first Z-shaped frame 708 to slide towards the second Z-shaped frame 709, compressing the return spring 710, thereby firmly clamping the circuit board. From this point until unloading, the protrusion 707 remains in contact with the inner wall of the protrusion ring 607, maintaining stable clamping.

[0033] 3. Micro-etching roughening treatment: In the clamping state, the clamping assembly 700 revolves to the top of the micro-etching roughening groove 204. At this time, its crossbar 705 slides down from the upper crossbar 606 of the guide rail via the inclined rail 603 to the bottom crossbar 604 corresponding to the groove. During the descent, the crossbar 705 drives the lifting column 706 and the entire clamping mechanism to descend, immersing the bonding fingers of the circuit board into the micro-etching solution (such as a dilute sulfuric acid-hydrogen peroxide system). As it passes through the bottom crossbar 604 at a constant speed, the copper surface undergoes uniform micro-etching, forming a fresh, micro-rough active surface to enhance the adhesion of subsequent film layers.

[0034] 4. Cleaning after micro-etching: After micro-etching is completed, the crossbar 705 rises back to the upper crossbar 606 along the next inclined section 603, lifting the circuit board above the liquid surface. After horizontal movement, the crossbar 705 descends again along the inclined section 603 to the bottom crossbar 604 above the immersion cleaning tank 205, immersing the circuit board in the cleaning tank for rinsing to remove residual chemicals. As a preferred embodiment to improve the cleaning effect, an ultrasonic transducer or air agitator can be installed in the immersion cleaning tank 205 to enhance the cleaning effect through physical vibration or bubble agitation.

[0035] 5. OSP film formation treatment: After cleaning, the mechanism uses the same "rise-translation-fall" motion to transfer the circuit board and immerse it in the film-forming solution of the OSP tank 206. As the circuit board passes through the bottom crossbar 604 above the OSP tank 206 at a constant speed, the copper surface undergoes a complexation reaction with the organic compounds (such as benzotriazole derivatives) in the solution to form a dense and uniform organic solder resist film.

[0036] 6. Final spray cleaning and drying: After film formation, the crossbar 705 rises one last time to the upper crossbar 606, horizontally transferring the circuit board above the cleaning and drying tank 203. First, deionized water is sprayed onto the circuit board through the spray holes 303 of the first pipe 301 to remove residual chemicals from the surface. Then, hot air is blown out through the air outlets 304 of the second pipe 302 to quickly dry the board surface at a low temperature, ensuring a clean and dry surface.

[0037] 7. Automatic feeding: After all processing is complete, the circuit board returns to the notch 605 position of the convex ring 607 (i.e., the unloading station) as the clamping assembly 700 revolves. When the convex post 707 reaches the notch 605, the clamping force disappears. The return spring 710 rebounds, pushing the first Z-shaped frame 708 to open, and the circuit board automatically falls off under gravity, completing the unloading process. Preferably, a conveyor belt can be configured below this station to achieve automatic collection of finished products.

[0038] 8. Continuous cyclic operation: After unloading, the clamping assembly 700 returns to the open state and continues to the loading station to begin the next processing cycle. Multiple clamping assemblies 700 are arranged in a circular array, enabling loading, processing at each stage, and unloading to be performed simultaneously at multiple stations, achieving full-process automation and efficient continuous production. Regarding process time control: the processing time of the circuit board in the micro-etching, cleaning, and OSP tanks is precisely controlled by the arc length (i.e., horizontal passage time) of the corresponding bottom crossbeam 604. By changing the design length of each section of the bottom crossbeam 604, the time parameters required for different process formulations can be flexibly adjusted and matched, making the device highly adaptable.

[0039] It should be noted that this embodiment focuses on demonstrating the core process of micro-etching, cleaning, OSP film formation, and post-processing. It can be understood that the circuit board 900 entering this device has already undergone pre-treatment processes such as degreasing and rinsing on its wire bonding finger surfaces, resulting in a clean and activated copper surface. Furthermore, the annular pool 201 of this device adopts a modular design. Based on the complete process route requirements, degreasing tanks, rinsing tanks, etc., can be added upstream of the tank shown in this embodiment, and these can be coordinated with extended guide rails to achieve integrated processing from degreasing to OSP.

[0040] It is worth noting that the circuits, electronic components, and modules involved in this invention are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this invention does not involve improvements to the software and methods.

[0041] It should be understood that the disclosed apparatus can be implemented in other ways, as illustrated in the embodiments provided in this application. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or communication connections shown or discussed may be through some interfaces; the indirect coupling or communication connections between devices or units may be telecommunications or other forms.

[0042] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of the present invention according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of the present invention. These technical solutions also fall within the scope of protection of the present invention.

Claims

1. A surface treatment device for the glue injection port of the finger surface of a circuit board bonding wire, characterized in that, include: Base (100); A processing assembly (200) is disposed above the base (100) for mounting and accommodating a cleaning and drying assembly (300) and various solvents required for surface treatment of the circuit board (900) to be processed; A rotating component (500) is disposed above the processing component (200); Multiple clamping components (700) are arranged in a ring array on the rotating component (500) for clamping and releasing the circuit board (900) to be processed; A guide assembly (600) is disposed on the outside of the rotating assembly (500); A support component (400) is disposed between the processing component (200), the guide component (600), and the rotating component (500), integrating the three components into one unit; A drive motor (800) is mounted on the support assembly (400) to drive the rotating assembly (500) to rotate, thereby driving the clamping assembly (700) to revolve. During the revolve of the clamping assembly (700), in conjunction with the transmission of the guide assembly (600), it can clamp, release and lift the circuit board (900) to be processed.

2. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 1, characterized in that, The rotating assembly (500) includes an inner ring (502), a cross (501) is fixedly connected to the inner wall of the inner ring (502), and a T-shaped outer ring (503) is fixedly sleeved on the outer periphery of the inner ring (502).

3. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 2, characterized in that, The guide assembly (600) includes an upper ring (601) and a lower ring (602) disposed below the upper ring (601), and a guide track is formed between the lower ring (602) and the upper ring (601); The guide rail is composed of a horizontally extending upper crossbar (606), a horizontally extending bottom crossbar (604), and an inclined rail (603) connecting the two. The bottom crossbar (604) is correspondingly arranged above each processing tank, and the length of each section of the bottom crossbar (604) is set according to the processing time required by the corresponding process.

4. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 3, characterized in that, The guide assembly (600) further includes a protruding ring (607) fixed to the inner wall of the lower ring (602). The protruding ring (607) is a non-closed ring structure, and a notch (605) is formed between the first end (6071) and the last end (6072) of the protruding ring (607).

5. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 4, characterized in that, The clamping assembly (700) includes a fixing frame (701) slidably sleeved on the outer wall of the T-shaped outer ring (503). The fixing frame (701) and the T-shaped outer ring (503) are fixedly connected by bolts. Two U-shaped rods (702) are fixedly connected to the top of the fixing frame (701). A lifting column (706) is slidably sleeved on the outer wall of the two U-shaped rods (702). A limiting piece (703) is fixedly connected to the outer wall of the U-shaped rods (702). A connecting spring (704) is sleeved on the outer wall of the U-shaped rods (702). The two ends of the connecting spring (704) are respectively connected to the limiting piece (703) and the lifting column (706). A crossbar (705) is fixed to the outer wall of the lifting column (706), and the crossbar (705) is slidably sleeved on the inner side of the guide rail.

6. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 5, characterized in that, A second Z-shaped frame (709) is fixedly connected to the lower side of the lifting column (706). A first Z-shaped frame (708) is slidably connected to one side of the second Z-shaped frame (709). A protruding column (707) that cooperates with the protruding ring (607) is fixedly connected to the outer wall of the first Z-shaped frame (708). A plurality of guide columns (711) slide through the second Z-shaped frame (709). One end of the guide column (711) is fixedly connected to the first Z-shaped frame (708). A return spring (710) is connected to the other end of the second Z-shaped frame (709) and the guide column (711). The return spring (710) is sleeved on the outside of the guide column (711).

7. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 6, characterized in that, The processing component (200) includes an annular pool (201), and several support plates (202) are fixedly connected between the annular pool (201) and the base (100). The annular pool (201) is provided with a micro-etching roughening tank (204), an immersion cleaning tank (205), an OSP tank (206), a cleaning and drying tank (203), and a drain pipe (207) fixedly connected to the bottom of each tank. A bottom crossbar (604) is respectively provided above the micro-etching roughening tank (204), the immersion cleaning tank (205), and the OSP tank (206).

8. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 7, characterized in that, The support assembly (400) includes several first right-angle frames (401) fixedly attached to the outer wall of the annular pool (201) in a ring array. A second right-angle frame (402) is fixedly attached to one end of each first right-angle frame (401). A mounting plate (403) is fixedly attached to several second right-angle frames (402). The drive motor (800) is fixedly mounted on the top of the mounting plate (403). The shaft of the drive motor (800) slides through the mounting plate (403) and is fixedly attached to the top of the center of the cross (501). A U-shaped limiting frame (404) is provided between the first right-angle frame (401) and the second right-angle frame (402) for fixing the upper ring (601) and the lower ring (602).

9. The surface treatment device for the glue injection port of the finger surface of a circuit board as described in claim 8, characterized in that, The cleaning and drying assembly (300) includes a first pipe (301) and a second pipe (302) disposed inside the cleaning and drying tank (203). The first pipe (301) and the second pipe (302) are both fixedly supported inside the cleaning and drying tank (203) by a vertical plate (306). Spray holes (303) are provided on opposite sides of the two arc-shaped pipes at the top of the first pipe (301), and air outlets (304) are provided on opposite sides of the two arc-shaped pipes at the top of the second pipe (302). An external pipe (305) is fixedly connected to the outer wall of both the first pipe (301) and the second pipe (302).

10. A surface treatment process for the glue injection port on the finger surface of a circuit board bonding assembly, using the surface treatment device for the glue injection port on the finger surface of a circuit board bonding assembly as described in any one of claims 1-9, characterized in that... Includes the following steps: S1. Loading and clamping: The circuit board (900) to be processed is placed into the clamping assembly (700) that moves to the notch (605) of the convex ring (607). The convex post (707) then contacts the inner wall of the convex ring (607), driving the first Z-shaped frame (708) to close to clamp the circuit board. S2, Micro-etching and roughening: The crossbar (705) of the clamping assembly (700) descends along the guide rail to immerse the circuit board into the micro-etching and roughening tank (204) for processing; S3. Cleaning: After the micro-etched circuit board is lifted and transferred, it is immersed in the immersion cleaning tank (205) for cleaning. S4, OSP film formation: Immerse the cleaned circuit board in the OSP tank (206) to form an organic solder mask on the copper surface; S5. Final cleaning and drying: The circuit board after film formation is lifted and moved to the cleaning and drying tank (203) area, and spray cleaning and hot air drying are performed in sequence. S6. Unloading: The dried circuit board is transported to the notch (605) of the convex ring (607), and the clamping assembly (700) automatically opens to release the circuit board.

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