Display panel and display device

By using conductive vias and conductive composite layers to achieve electrical coupling between the light-emitting unit and the silicon-based driving substrate in a structure combining a glass substrate and a silicon-based driving substrate, and by controlling the disconnection of the electrical connection with laser, the problem of circuit damage caused by the fabrication of the light-emitting unit on the silicon-based driving substrate is solved, the product yield is improved, and efficient spot repair is achieved.

CN121968922APending Publication Date: 2026-05-01HKC CORP LTD
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Patent Information

Application Number
CN202411548453.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Directly depositing OLED light-emitting devices onto silicon-based driving substrates can easily damage the driving circuitry and increase costs.

Method used

The light-emitting unit is electrically coupled to the silicon-based driving substrate by adopting a combined structure of glass substrate and silicon-based driving substrate. The conductive through-hole and conductive composite layer are used to disconnect the electrical connection by laser control of the conductive composite layer, thus avoiding the direct fabrication of the light-emitting unit on the silicon-based driving substrate.

Benefits of technology

This avoids damage to the driving circuit caused by the fabrication of light-emitting units on silicon-based driving substrates, improves product yield, and achieves efficient pixel repair through bright spot repair.

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Abstract

The invention provides a display panel and a display device. The display panel comprises a glass substrate, a plurality of light-emitting units, a plurality of first bonding parts, a silicon-based driving substrate and a plurality of conductive composite layers. The glass substrate has a plurality of first conductive vias extending from a first surface to a second surface. And the first bonding parts are electrically connected with the corresponding anode electrodes through the corresponding first conductive through holes. The silicon-based driving substrate comprises a plurality of first bonding electrodes which are at least partially arranged in the corresponding first conductive through holes. The conductive composite layer is arranged between the corresponding first bonding electrode and the first bonding part, and the first bonding electrode is electrically connected with the corresponding first bonding part through the conductive composite layer; and the conductive composite layer can disconnect the electric connection between the first bonding electrode and the corresponding first bonding part under the irradiation of laser with a preset wave band. According to the display panel, the pixel driving circuit can be prevented from being damaged due to the fact that the light-emitting units are directly manufactured on the silicon-based driving substrate; and bright spot repair can be realized.
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Description

Display panel and display device Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0002] Monocrystalline silicon driving backplanes are driving substrates formed using semiconductor devices fabricated using Complementary Metal Oxide Semiconductor (CMOS) technology as driving units. Compared to conventional Active-Matrix Organic Light-Emitting Diode (AMOLED) panels that use amorphous silicon, microcrystalline silicon, or low-temperature polycrystalline silicon thin-film transistors as backplanes, monocrystalline silicon driving backplanes exhibit higher carrier mobility. Therefore, silicon-based organic light-emitting diode (OLED) display panels are currently the highest-performing display panel type used in AR / VR products.

[0003] Currently, silicon-based OLED display panels integrate the traditionally externally bonded display chip into a silicon-based driving backplane. The fabrication method involves depositing OLED light-emitting devices onto a silicon-based driving substrate. Specifically, the process involves first depositing an anode, then creating a pixel definition layer, followed by the sequential deposition of an organic light-emitting layer and a cathode. This allows for the fabrication of smaller pixel units, achieving display detail exceeding retina-level precision, and offering numerous advantages such as high resolution, high integration, low power consumption, small size, and light weight.

[0004] However, directly depositing OLED light-emitting devices on silicon-based driving substrates can easily damage the silicon-based driving circuits, rendering them unusable and increasing costs. Summary of the Invention

[0005] The display panel and display device provided in this application are intended to solve the problem that the direct deposition of OLED light-emitting devices on silicon-based driving substrates in the prior art can easily lead to damage to the driving circuit.

[0006] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display panel, comprising:

[0007] A glass substrate includes opposing first and second surfaces, the glass substrate having a plurality of conductive vias extending from the first surface to the second surface; the plurality of conductive vias includes a plurality of first conductive vias;

[0008] Multiple light-emitting units are disposed on the first surface of the glass substrate; each light-emitting unit includes an anode electrode, an organic light-emitting layer, and a cathode electrode stacked sequentially in a direction away from the glass substrate;

[0009] Multiple first bonding portions are provided, each first bonding portion being disposed within a corresponding first conductive via; the first bonding portion is electrically connected to the corresponding anode electrode through the corresponding first conductive via.

[0010] A silicon-based driving substrate is disposed on one side of the second surface of the glass substrate and includes a plurality of first bonding electrodes; each of the first bonding electrodes is at least partially embedded in a corresponding first conductive via.

[0011] Multiple conductive composite layers are disposed between the corresponding first bonding electrode and the first bonding portion, and the first bonding electrode is electrically connected to the corresponding first bonding portion through the conductive composite layer; the conductive composite layer can disconnect the electrical connection between the first bonding electrode and the corresponding first bonding portion under laser irradiation of a preset wavelength band.

[0012] In one specific embodiment, the conductive composite layer includes an excitation element and a reaction element; the first bonding electrode is electrically connected to the corresponding first bonding portion at least through the reaction element;

[0013] The exciter can provide excitation under laser irradiation in the preset wavelength band; in response to the excitation provided by the exciter, the reactant can disconnect the electrical connection between the first bonding electrode and the corresponding first bonding portion.

[0014] In one specific embodiment, the excitation element includes an aerogel layer; the aerogel layer is capable of generating gas under laser irradiation of the preset wavelength band;

[0015] The reaction element includes a composite repair layer; the composite repair layer includes a plurality of uniformly dispersed conductive particles and a plurality of foamed gel particles; the first bonding electrode is electrically connected to the corresponding first bonding portion at least through the plurality of uniformly dispersed conductive particles; the plurality of foamed gel particles are capable of absorbing the gas generated by the aerogel layer.

[0016] In response to the absorption of gas generated by the aerogel layer by the multiple foamed gel particles, the foamed gel particles undergo foaming and nucleation growth to expand in volume and compress the multiple conductive particles, causing the multiple conductive particles to aggregate and disconnecting the electrical connection between the first bonding electrode and the corresponding first bonding portion.

[0017] In one specific embodiment, the aerogel layer is a conductive aerogel layer; the conductive aerogel layer and the composite repair layer are stacked along the thickness direction of the display panel; the first bonding electrode is electrically connected to the first bonding portion through the conductive aerogel layer and the composite repair layer.

[0018] In one specific embodiment, the conductive aerogel layer is disposed on the surface of the first bonding electrode facing the glass substrate; the composite repair layer is disposed on the surface of the first bonding portion facing the silicon-based driving substrate; in response to the composite repair layer absorbing the gas generated by the conductive aerogel layer, the composite repair layer can disconnect the electrical connection between the conductive aerogel layer and the first bonding portion; or

[0019] The conductive aerogel layer is disposed on the side surface of the first bonding portion facing the silicon-based driving substrate; the composite repair layer is disposed on the side surface of the first bonding electrode facing the glass substrate; in response to the composite repair layer absorbing the gas generated by the conductive aerogel layer, the composite repair layer can disconnect the electrical connection between the conductive aerogel layer and the first bonding electrode.

[0020] In one specific embodiment, the composite repair layer further includes a matrix structure; the plurality of conductive particles and the plurality of foamed gel particles are dispersed on the surface of the matrix structure.

[0021] In one specific embodiment, the matrix structure is a fiber felt; the material of the fiber felt is any one or more of polyester, polyamide, polyvinyl alcohol, polyacrylonitrile, polyurethane or poly(p-phenylene terephthalamide).

[0022] In one specific embodiment, the conductive particles include conductive graphite particles.

[0023] In one specific embodiment, the foamed gel particles include polyurethane flexible foam gel materials and catalytic phase materials.

[0024] To solve the above-mentioned technical problems, another technical solution adopted in this application is: a display device, including a display panel as described in any of the above.

[0025] The beneficial effects of this application's embodiments are as follows: Unlike existing technologies, this application provides a display panel and a display device. The display panel includes a glass substrate, a plurality of light-emitting units, a plurality of first bonding portions, a silicon-based driving substrate, and a plurality of conductive composite layers. The glass substrate includes opposing first and second surfaces, and has a plurality of conductive vias extending from the first surface to the second surface; the plurality of conductive vias includes a plurality of first conductive vias. A plurality of light-emitting units are disposed on the first surface of the glass substrate; each light-emitting unit includes an anode electrode, an organic light-emitting layer, and a cathode electrode sequentially stacked in a direction away from the glass substrate. Each first bonding portion is disposed within a corresponding first conductive via; the first bonding portion is electrically connected to the corresponding anode electrode through the corresponding first conductive via. The silicon-based driving substrate is disposed on one side of the second surface of the glass substrate and includes a plurality of first bonding electrodes; each first bonding electrode is at least partially embedded within a corresponding first conductive via. Multiple conductive composite layers are disposed between corresponding first bonding electrodes and first bonding portions. The first bonding electrodes are electrically connected to their corresponding first bonding portions through the conductive composite layers. The conductive composite layers can disconnect the electrical connection between the first bonding electrodes and their corresponding first bonding portions under laser irradiation of a preset wavelength. By respectively setting light-emitting units and first bonding portions on two opposite surfaces of the glass substrate, and making multiple first bonding portions electrically connected to the anode electrodes of the corresponding light-emitting units through first conductive vias, the light-emitting units are electrically coupled to the silicon-based driving substrate, enabling the silicon-based driving substrate to drive the light-emitting units to emit light. This eliminates the need to directly fabricate the light-emitting units on the silicon-based driving substrate, avoiding the problem of damage to the pixel driving circuit and reduced product yield caused by directly fabricating the light-emitting units on the silicon-based driving substrate. Furthermore, by providing a conductive composite layer between the corresponding first bonding electrode and the first bonding portion, the first bonding electrode and the first bonding portion are electrically connected. At the same time, the conductive composite layer can disconnect the electrical connection between the first bonding electrode and the first bonding portion under laser irradiation of a preset wavelength. When a pixel needs bright spot repair, the conductive composite layer corresponding to the pixel can be irradiated with a laser, causing the conductive composite layer to disconnect the electrical connection between the first bonding electrode and the first bonding portion. This prevents the silicon-based driving substrate from transmitting the anode driving signal to the pixel, making the pixel a normally black dark spot, thus achieving bright spot repair. Attached Figure Description

[0026] Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0027] Figure 2 is a magnified view of part A in Figure 1;

[0028] Figure 3 is a magnified view of part B in the structure shown in Figure 2;

[0029] Figure 4 is a schematic diagram of the structure of the foamed gel particles after expansion in the structure shown in Figure 3.

[0030] Figure 5 is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0031] Explanation of icon numbers:

[0032] 100-Display panel; 1-Glass substrate; 2-Light-emitting unit; 3-Pixel definition layer; 4-First bonding portion; 5-Silicon-based driving substrate; 6-Conductive composite layer; 7-Second bonding portion; 8-Encapsulation layer; 11-First surface; 12-Second surface; 13-Conductive via; 21-Anode electrode; 22-Organic light-emitting layer; 23-Cathode electrode; 51-First bonding electrode; 52-Silicon substrate; 53-Driving circuit; 54-Protective layer; 55-Second bonding electrode; 61-Excitation element; 62-Reaction element; 131-First conductive via; 132-Second conductive via; 611-Aerogel layer; 621-Composite repair layer; 6111-Conductive aerogel layer; 6211-Conductive particles; 6212-Foamed gel particles; 6213-Matrix structure. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0035] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0036] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] Referring to Figure 1, Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of this application; this application provides a display panel, which can be an OLED display panel; the display panel may include a glass substrate 1, a plurality of light-emitting units 2, a plurality of first bonding portions 4, a silicon-based driving substrate 5, and a plurality of conductive deformation layers.

[0038] The glass substrate 1 includes a first surface 11 and a second surface 12 facing each other, and has a plurality of conductive vias 13 extending from the first surface 11 to the second surface 12. The plurality of conductive vias 13 may include a plurality of first conductive vias 131.

[0039] Multiple light-emitting units 2 are disposed on the first surface 11 of the glass substrate 1. Each light-emitting unit 2 includes an anode electrode 21, an organic light-emitting layer 22, and a cathode electrode 23, which are sequentially stacked along a direction away from the glass substrate 1. Specifically, the first surface 11 of the glass substrate 1 is also provided with a pixel definition layer 3, which protrudes from the glass substrate 1 and surrounds multiple pixel receiving areas (not shown in the figure); and the multiple light-emitting units 2 are respectively disposed in the multiple pixel receiving areas. The multiple pixel receiving areas are respectively disposed in a one-to-one correspondence with multiple first conductive vias 131.

[0040] In this design, the anode electrode 21 is disposed on the surface of the glass substrate 1 exposed through the pixel accommodating area, and the pixel defining layer 3 covers the edge of the anode electrode 21 to prevent contact between the anode electrodes 21 of adjacent light-emitting units 2, thus avoiding signal crosstalk. An organic light-emitting layer 22 is disposed on the surface of the anode electrode 21 away from the glass substrate 1, and a cathode electrode 23 is disposed on the side of the organic light-emitting layer 22 away from the anode electrode 21 and covers the organic light-emitting layer 22 of multiple light-emitting units 2 to form a full-surface common cathode. The anode electrode 21 and the cathode electrode 23 transmit anode driving signals and cathode driving signals to the organic light-emitting layer 22, respectively, to drive the organic light-emitting layer 22 to emit light.

[0041] In some embodiments, the light-emitting unit 2 may include light-emitting units 2 with different emitting colors, such as red, green, and blue light-emitting units, to achieve color display; specifically, the emitting color of the light-emitting unit 2 is determined by the emitting color of the organic light-emitting layer 22. Alternatively, in other embodiments, the light-emitting unit 2 may also be a light-emitting unit 2 of the same color, such as white, red, green, blue, or other colors, which can be set according to actual needs; for example, if the light-emitting unit 2 is white, grayscale display can be achieved by controlling the brightness of the light-emitting unit 2, and a color resist layer can also be added above the light-emitting unit 2 to achieve color display. For example, if the light-emitting unit 2 is blue, a red quantum dot layer can be added above some of the light-emitting units 2, and a green quantum dot layer can be added above some of the light-emitting units 2 to achieve color display.

[0042] Multiple first bonding portions 4 are disposed on the second surface 12 of the glass substrate 1, and each first bonding portion 4 is disposed in a corresponding first conductive via 131; each first bonding portion 4 is electrically connected to the corresponding anode electrode 21 through the first conductive via 131, so as to transmit an anode driving signal to the anode electrode 21 of the corresponding light-emitting unit 2 through the first conductive via 131.

[0043] The silicon-based driving substrate 5 is disposed on one side of the second surface 12 of the glass substrate 1; the silicon-based driving substrate 5 may also include a plurality of first bonding electrodes 51, each bonding electrode being at least partially embedded in the corresponding first conductive via 131 and electrically connected to the corresponding first bonding portion 4, for controlling the light-emitting unit 2 corresponding to the first bonding portion 4 to emit light; specifically, the first bonding electrode 51 is spaced apart from the sidewall of the corresponding first conductive via 131.

[0044] Specifically, the silicon-based driving substrate 5 may further include a silicon substrate 52 and a driving circuit 53 stacked together; wherein, the silicon substrate 52 refers to a substrate based on single-crystal silicon material; the driving circuit 53 is electrically connected to a plurality of first bonding electrodes 51 for transmitting an anode driving signal to the anode electrode 21 through the first bonding portion 4. Specifically, the driving circuit 53 includes an active driving circuit 53 integrated on the single-crystal silicon substrate 52 using CMOS (Complementary Metal-Oxide-Semiconductor) technology; it may specifically include a plurality of "3T1C" structures (three thin-film transistors and one capacitor) to achieve independent control of each light-emitting unit 2 and high-definition display.

[0045] The silicon-based driving substrate 5 may also include a display control circuit (not shown) electrically connected to the driving circuit 53. The display control circuit controls the light-emitting unit 2 to display through the driving circuit 53. The display control circuit is an integrated circuit (IC) integrated on the silicon-based driving substrate 5.

[0046] By setting light-emitting units 2 and first bonding portions 4 on two opposite surfaces of the glass substrate 1, and making multiple first bonding portions 4 electrically connected to the anode electrode 21 of the corresponding light-emitting unit 2 through first conductive vias 131, the light-emitting unit 2 is electrically coupled to the silicon-based driving substrate 5, enabling the silicon-based driving substrate 5 to drive the light-emitting unit 2 to emit light. This eliminates the need to directly fabricate the light-emitting unit 2 on the silicon-based driving substrate 5, avoiding the problem of damage to the pixel driving circuit 53 and reduced product yield caused by directly fabricating the light-emitting unit 2 on the silicon-based driving substrate 5. Furthermore, compared with silicon through-hole technology, glass via technology has advantages such as superior high-frequency electrical characteristics, low cost, simple process flow, and strong mechanical stability.

[0047] As shown in Figure 1, a conductive composite layer 6 is disposed between the corresponding first bonding electrode 51 and the first bonding portion 4. The first bonding electrode 51 can be electrically connected to the corresponding first bonding portion 4 through the conductive composite layer 6 to transmit an anode driving signal to the anode of the corresponding sub-pixel. The conductive composite layer 6 can disconnect the electrical connection between the first bonding electrode 51 and the corresponding first bonding portion 4 under laser irradiation of a preset wavelength. Specifically, the conductive composite layer 6 can disconnect the electrical connection by changing its internal structure to alter its conductivity; or by deforming the conductive composite layer 6 to disengage it from the first bonding electrode 51 and / or the first bonding portion 4.

[0048] By providing a conductive composite layer 6 between the corresponding first bonding electrode 51 and the first bonding portion 4, the first bonding electrode 51 and the first bonding portion 4 are electrically connected. At the same time, the conductive composite layer 6 can disconnect the electrical connection between the first bonding electrode 51 and the first bonding portion 4 under laser irradiation of a preset wavelength. When a pixel needs bright spot repair, the conductive composite layer 6 corresponding to the pixel can be irradiated by laser, causing the conductive composite layer 6 to disconnect the electrical connection between the first bonding electrode 51 and the first bonding portion 4, thereby turning the pixel into a normally black dark spot and achieving bright spot repair.

[0049] Referring to Figure 2, which is a partial enlarged view of point A in Figure 1; in a specific embodiment, the conductive composite layer 6 may include an excitation element 61 and a reaction element 62; wherein, the excitation element 61 is used to provide excitation, and the first bonding electrode 51 is electrically connected to the first bonding portion 4 through at least the reaction element 62; wherein, the reaction element 62 is in contact with at least one of the first bonding electrode 51 and the first bonding portion 4.

[0050] Specifically, the excitation element 61 can provide excitation under laser irradiation of a preset wavelength; in response to the excitation element 61 providing excitation, the reaction element 62 can disconnect the electrical connection between the first bonding electrode 51 and the corresponding first bonding portion 4. By enabling the reaction element 62, which provides the electrical connection, to disconnect the electrical connection between the first bonding electrode 51 and the first bonding portion 4 under laser irradiation of a preset wavelength, when a pixel needs bright spot repair, the conductive composite layer 6 corresponding to the pixel can be irradiated with laser, causing the conductive composite layer 6 to disconnect the electrical connection between the first bonding electrode 51 and the first bonding portion 4. This prevents the silicon-based driving substrate 5 from transmitting the anode driving signal to the pixel, making the pixel a normally black dark spot, thus achieving bright spot repair.

[0051] Specifically, the electrical connection of the reactant 62 can be disconnected by changing its internal structure to alter its conductivity, so that the first bonding electrode 51 cannot transmit the anode drive signal to the first bonding part 4 through the reactant 62; or by deforming the reactant 62 to disengage it from the first bonding electrode 51 and / or the first bonding part 4.

[0052] The following embodiments of this application are all explained by taking the example of changing the conductivity of the reactant 62 by changing its internal structure.

[0053] Specifically, the excitation element 61 may include an aerogel layer 611; the aerogel layer 611 is capable of structural deterioration under laser irradiation in a preset wavelength band to generate gas, which is used to excite the reaction element 62. The laser may be an infrared laser with a preset wavelength band of 700nm-1mm; specifically, the preset wavelength band may be any range from 700nm-800nm, 800nm-1000nm, 1000nm-2000nm, or 2000nm-1mm. Preferably, the laser may be a far-infrared laser with a preset wavelength band of 10000nm-1mm.

[0054] Of course, in other embodiments, the laser used to irradiate the aerogel layer 611 can also be an ultraviolet laser, with a preset wavelength of 370nm-405nm.

[0055] The reaction element 62 may include a composite repair layer 621, used to provide an electrical connection between the first bonding electrode 51 and the first bonding portion 4 or to disconnect the electrical connection under gas excitation. Specifically, as shown in FIG3, FIG3 is a partial enlarged view of point B in the structure shown in FIG2; the composite repair layer 621 may include a plurality of uniformly dispersed conductive particles 6211 and a plurality of foamed gel particles 6212; wherein, the interior of the composite repair layer 621 has a multi-pore structure, and the plurality of conductive particles 6211 and the plurality of foamed gel particles 6212 are uniformly mixed in the multi-pore structure.

[0056] Specifically, the uniformly dispersed multiple conductive particles 6211 give the composite repair layer 621 conductivity, and the first bonding electrode 51 is electrically connected to the corresponding first bonding portion 4 at least through the uniformly dispersed multiple conductive particles 6211. The gas generated by the aerogel can excite the multiple foamed gel particles 6212; specifically, the multiple foamed gel particles 6212 can absorb the gas generated by the aerogel layer 611.

[0057] Referring to Figures 3 and 4, Figure 4 is a schematic diagram of the structure after the foamed gel particles in the structure shown in Figure 3 have expanded. In response to the absorption of gas generated by the aerogel layer 611 by the multiple foamed gel particles 6212, the foamed gel particles 6212 undergo foaming and nucleation growth to expand in volume and compress the multiple conductive particles 6211, causing the multiple conductive particles 6211 to agglomerate and disconnecting the electrical connection between the first bonding electrode 51 and the corresponding first bonding part 4.

[0058] Thus, when a pixel needs bright spot repair, the aerogel layer 611 can be irradiated with a laser to generate gas, which in turn excites the foamed gel particles 6212 in the composite repair layer 621. The foamed gel particles 6212 absorb the gas and undergo foaming and nucleation growth, causing their volume to expand rapidly. This compresses the internal voids of the composite repair layer 621, causing the originally uniformly dispersed conductive particles 6211 to agglomerate and lose their uniformity. When the conductive particles 6211 agglomerate to a certain extent, the composite repair layer 621 loses its conductivity, thereby breaking the electrical connection between the first bonding electrode 51 and the corresponding first bonding portion 4. This prevents the silicon-based driving substrate 5 from transmitting the anode driving signal to the pixel, causing the pixel to become a normally black dark spot, thus achieving bright spot repair.

[0059] As shown in Figure 3, in a specific embodiment, the composite repair layer 621 may further include a matrix structure 6213. The matrix structure 6213 forms a porous structure within the composite repair layer 621, allowing multiple conductive particles 6211 and multiple foamed gel particles 6212 to be uniformly distributed within the pores formed by the matrix structure 6213. Furthermore, the conductive particles 6211 can move and aggregate within the pores under the pressure of the expanding foamed gel particles 6212. Specifically, the multiple conductive particles 6211 and multiple foamed gel particles 6212 are dispersed on the surface of the matrix structure 6213.

[0060] Specifically, the matrix structure 6213 can be a fiber mat; this fiber mat can be prepared by electrospinning; specifically, a polymer solution or melt can be sprayed into fine droplets by applying a high-voltage electrostatic field, and then stretched into fibers under the action of the electric field. This method can produce continuous fibers with diameters ranging from tens to hundreds of nanometers, possessing high surface area, high porosity, and excellent mechanical properties. The highly elastic fiber mat facilitates the movement of conductive particles 6211 and foamed gel particles 6212 within the pores. The fiber mat material can be any one or more of polyester, polyamide, polyvinyl alcohol, polyacrylonitrile, polyurethane, or poly(p-phenylene terephthalamide).

[0061] Of course, in other embodiments, the substrate structure 6213 may also be a porous membrane layer, such as a polyimide porous film.

[0062] The conductive particles 6211 may include conductive graphite particles to give them good conductivity and dispersion properties. The foaming gel particles 6212 may include polyurethane flexible foam gel materials and catalytic phase materials; wherein, the polyurethane flexible foam gel materials can be foamed into polyurethane foam materials at room temperature in the presence of the catalytic phase material. Specifically, the catalytic phase material may be an amine or an oxidizing catalyst.

[0063] Referring further to Figure 3, the aerogel layer 611 can be a conductive aerogel layer 6111; the conductive aerogel layer 6111 and the composite repair layer 621 are stacked along the thickness direction Y of the display panel. The conductive aerogel layer 6111 can be prepared by doping the aerogel with conductive fillers; the conductive fillers can specifically be carbon nanotubes, graphite powder, metal nanoparticles, etc., and the aerogel can be silane aerogel or siloxane aerogel.

[0064] It is understood that by stacking the conductive aerogel layer 6111 with the composite repair layer 621, the different positions of the composite repair layer 621 can uniformly absorb the gas generated by the conductive aerogel layer 6111, so that the changes in conductivity at different positions of the composite repair layer 621 can be kept consistent. This avoids the situation where the repair failure of the conductive composite layer 6 for bright pixels is caused by the inconsistent foaming degree of the foamed gel particles 6212 at different positions in the composite repair layer 621.

[0065] Specifically, the composite repair layer 621 can be in contact with one of the first bonding electrode 51 and the first bonding portion 4, and the conductive aerogel layer 6111 can be in contact with the other of the first bonding electrode 51 and the first bonding portion 4; the conductive aerogel layer 6111 is in contact with the composite repair layer 621, and the conductive aerogel layer 6111 is conductive, and the first bonding electrode 51 is electrically connected to the first bonding portion 4 through the conductive aerogel layer 6111 and the composite repair layer 621.

[0066] Specifically, as shown in Figure 2, the conductive aerogel layer 6111 can be disposed on the surface of the first bonding electrode 51 facing the glass substrate 1; the composite repair layer 621 can be disposed on the surface of the first bonding portion 4 facing the silicon-based driving substrate 5. In response to the multiple foamed gel particles 6212 in the composite repair layer 621 absorbing gas generated by the conductive aerogel layer 6111, the multiple conductive particles 6211 in the composite repair layer 621 are compressed and aggregated by the expanded foamed gel particles 6212, causing the composite repair layer 621 to lose its conductivity. This allows the composite repair layer 621 to disconnect the electrical connection between the conductive aerogel layer 6111 and the first bonding portion 4, achieving bright spot repair.

[0067] Of course, in some embodiments, the conductive aerogel layer 6111 may also be disposed on the surface of the first bonding portion 4 facing the silicon-based driving substrate 5; the composite repair layer 621 may be disposed on the surface of the first bonding electrode 51 facing the glass substrate 1. In response to the multiple foamed gel particles 6212 in the composite repair layer 621 absorbing the gas generated by the conductive aerogel layer 6111, the multiple conductive particles 6211 in the composite repair layer 621 are squeezed and agglomerated by the expanded foamed gel particles 6212, so that the composite repair layer 621 loses its conductivity, thereby enabling the composite repair layer 621 to disconnect the electrical connection between the conductive aerogel layer 6111 and the first bonding electrode 51, and realize the repair of the bright spot.

[0068] Of course, in other embodiments, the composite repair layer 621 may also be disposed in contact with the first bonding electrode 51 and the first bonding portion 4 respectively. The first bonding electrode 51 may be directly electrically connected to the first bonding portion 4 through the conductive aerogel layer 6111. In this way, the excitation element 61 may be a non-conductive aerogel layer 611, thereby reducing manufacturing costs.

[0069] The silicon-based driving substrate 5 may also include a protective layer 54 disposed on the side close to the glass substrate 1. At least a portion of the first bonding electrode 51 is embedded in the protective layer 54. The protective layer 54 is used to protect the driving circuit 53 from external moisture corrosion. The material of the protective layer 54 may be an inorganic insulating material such as silicon dioxide, silicon nitride, or silicon oxynitride.

[0070] Referring to Figure 1, in a specific embodiment, the conductive via 13 may further include a plurality of second conductive vias 132 disposed around the periphery of the plurality of first conductive vias 131; the display panel may further include a plurality of second bonding portions 7 at least partially disposed within the second conductive vias 132, each second bonding portion 7 being electrically connected to the cathode electrode 23 through a corresponding second conductive via 132, so as to transmit a cathode driving signal to the cathode electrode 23 of the light-emitting unit 2 through the second conductive via 132. The silicon-based driving substrate 5 may further include a plurality of second bonding electrodes 55, each second bonding electrode 55 being aligned and bonded one-to-one with the plurality of second bonding portions 7, and the silicon-based driving substrate 5 being able to transmit a cathode driving signal to the cathode electrode 23 through the second bonding electrodes 55 and the second bonding portions 7, so as to control the light-emitting unit 2 to emit light.

[0071] As shown in the figure, in a specific embodiment, an encapsulation layer 8 is also provided on the glass substrate 1 to protect the light-emitting unit 2 on the glass substrate 1, isolate external water and oxygen, and prevent water and oxygen from invading and causing the light-emitting unit 2 to fail; specifically, the encapsulation layer 8 covers the side surface of the cathode electrode 23 away from the anode electrode 21 and overlaps the surface of the glass substrate 1 that is not covered by the light-emitting unit 2.

[0072] This application provides a display panel and a display device. The display panel includes a glass substrate 1, a plurality of light-emitting units 2, a plurality of first bonding portions 4, a silicon-based driving substrate 5, and a plurality of conductive composite layers 6. The glass substrate 1 includes opposing first surfaces 11 and second surfaces 12, and has a plurality of conductive vias 13 extending from the first surface 11 to the second surface 12; the plurality of conductive vias 13 include a plurality of first conductive vias 131. The plurality of light-emitting units 2 are disposed on the first surface 11 of the glass substrate 1; each light-emitting unit 2 includes an anode electrode 21, an organic light-emitting layer 22, and a cathode electrode 23 sequentially stacked in a direction away from the glass substrate 1. Each first bonding portion 4 is disposed within a corresponding first conductive via 131; the first bonding portion 4 is electrically connected to the corresponding anode electrode 21 through the corresponding first conductive via 131. The silicon-based driving substrate 5 is disposed on one side of the second surface 12 of the glass substrate 1 and includes a plurality of first bonding electrodes 51; each first bonding electrode 51 is at least partially embedded within a corresponding first conductive via 131. Multiple conductive composite layers 6 are disposed between corresponding first bonding electrodes 51 and first bonding portions 4. The first bonding electrodes 51 are electrically connected to the corresponding first bonding portions 4 through the conductive composite layers 6. The conductive composite layers 6 can disconnect the electrical connection between the first bonding electrodes 51 and the corresponding first bonding portions 4 under laser irradiation of a preset wavelength. By respectively setting light-emitting units 2 and first bonding portions 4 on two opposite surfaces of the glass substrate 1, and making multiple first bonding portions 4 electrically connected to the anode electrode 21 of the corresponding light-emitting unit 2 through first conductive vias 131, the light-emitting unit 2 is electrically coupled to the silicon-based driving substrate 5, enabling the silicon-based driving substrate 5 to drive the light-emitting unit 2 to emit light. In this way, it is not necessary to directly fabricate the light-emitting unit 2 on the silicon-based driving substrate 5, avoiding the problem of damage to the pixel driving circuit 53 and reduced product yield caused by directly fabricating the light-emitting unit 2 on the silicon-based driving substrate 5. Furthermore, by providing a conductive composite layer 6 between the corresponding first bonding electrode 51 and the first bonding portion 4, the first bonding electrode 51 and the first bonding portion 4 are electrically connected. At the same time, the conductive composite layer 6 can disconnect the electrical connection between the first bonding electrode 51 and the first bonding portion 4 under laser irradiation of a preset wavelength. When a pixel needs bright spot repair, the conductive composite layer 6 corresponding to the pixel can be irradiated by laser, causing the conductive composite layer 6 to disconnect the electrical connection between the first bonding electrode 51 and the first bonding portion 4. As a result, the silicon-based driving substrate 5 cannot transmit the anode driving signal to the pixel, making the pixel a normally black dark spot, thus achieving bright spot repair.

[0073] Referring to Figure 5, which is a schematic diagram of the structure of a display device provided in one embodiment of this application; this application also provides a display device for displaying an image. The display device includes the display panel 100 involved in any of the above embodiments. This display device can avoid damage to the pixel driving circuit caused by directly fabricating light-emitting units on a silicon-based driving substrate; it can also prevent the silicon-based driving substrate from transmitting an anode driving signal to the pixel when a pixel needs bright spot repair, causing the pixel to become a normally black dark spot, thus achieving bright spot repair.

[0074] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized in that, include: A glass substrate includes opposing first and second surfaces, the glass substrate having a plurality of conductive vias extending from the first surface to the second surface; Multiple conductive vias include multiple first conductive vias; multiple light-emitting units are disposed on the first surface of the glass substrate; each light-emitting unit includes an anode electrode, an organic light-emitting layer, and a cathode electrode sequentially stacked along a direction away from the glass substrate; A plurality of first bonding portions are provided, each first bonding portion being disposed within a corresponding first conductive via; the first bonding portion is electrically connected to the corresponding anode electrode through the corresponding first conductive via; a silicon-based driving substrate is disposed on one side of the second surface of the glass substrate, including a plurality of first bonding electrodes; each first bonding electrode is at least partially embedded within a corresponding first conductive via; a plurality of conductive composite layers are disposed between the corresponding first bonding electrodes and the first bonding portions, the first bonding electrodes being electrically connected to the corresponding first bonding portions through the conductive composite layers; the conductive composite layers are capable of disconnecting the electrical connection between the first bonding electrodes and the corresponding first bonding portions under laser irradiation of a preset wavelength band.

2. The display panel according to claim 1, characterized in that, The conductive composite layer includes an excitation element and a reaction element; the first bonding electrode is electrically connected to the corresponding first bonding portion at least through the reaction element; the excitation element can provide excitation under laser irradiation in the preset wavelength band; in response to the excitation element providing excitation, the reaction element can disconnect the electrical connection between the first bonding electrode and the corresponding first bonding portion.

3. The display panel according to claim 2, characterized in that, The excitation element includes an aerogel layer; the aerogel layer is capable of generating gas under laser irradiation in the preset wavelength band; the reaction element includes a composite repair layer; the composite repair layer includes a plurality of uniformly dispersed conductive particles and a plurality of foamed gel particles; the first bonding electrode is electrically connected to the corresponding first bonding portion at least through the uniformly dispersed plurality of conductive particles; the plurality of foamed gel particles are capable of absorbing the gas generated by the aerogel layer; wherein, in response to the plurality of foamed gel particles absorbing the gas generated by the aerogel layer, the foamed gel particles undergo foaming nucleation growth to expand in volume and compress the plurality of conductive particles, causing the plurality of conductive particles to aggregate and disconnecting the electrical connection between the first bonding electrode and the corresponding first bonding portion.

4. The display panel according to claim 3, characterized in that, The aerogel layer is a conductive aerogel layer; the conductive aerogel layer and the composite repair layer are stacked along the thickness direction of the display panel; the first bonding electrode is electrically connected to the first bonding portion through the conductive aerogel layer and the composite repair layer.

5. The display panel according to claim 4, characterized in that, The conductive aerogel layer is disposed on the surface of the first bonding electrode facing the glass substrate; the composite repair layer is disposed on the surface of the first bonding portion facing the silicon-based driving substrate; in response to the composite repair layer absorbing the gas generated by the conductive aerogel layer, the composite repair layer can disconnect the electrical connection between the conductive aerogel layer and the first bonding portion; or the conductive aerogel layer is disposed on the surface of the first bonding portion facing the silicon-based driving substrate; the composite repair layer is disposed on the surface of the first bonding electrode facing the glass substrate; in response to the composite repair layer absorbing the gas generated by the conductive aerogel layer, the composite repair layer can disconnect the electrical connection between the conductive aerogel layer and the first bonding electrode.

6. The display panel according to any one of claims 3-5, characterized in that, The composite repair layer also includes a matrix structure; the plurality of conductive particles and the plurality of foamed gel particles are dispersed on the surface of the matrix structure.

7. The display panel according to claim 6, characterized in that, The matrix structure is a fiber felt; the material of the fiber felt is any one or more of polyester, polyamide, polyvinyl alcohol, polyacrylonitrile, polyurethane or poly(p-phenylene terephthalamide).

8. The display panel according to claim 6, characterized in that, The conductive particles include conductive graphite particles.

9. The display panel according to claim 6, characterized in that, The foamed gel particles include polyurethane flexible foam gel materials and catalytic phase materials.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.