Dispersion equipment and sheet cutting system and method

Abstract

The invention discloses peptizing equipment and a sheet cutting system and method.The peptizing equipment comprises an irradiation device and a sheet cutting device, the irradiation device comprises a box body and a light source arranged in the box body, an opening is formed in the top of the box body, and the light source faces the opening; the carrying device comprises a first module and a first end effector in transmission connection with the first module; by means of the first module, the first end effector is suitable for grasping a wafer or a wafer assembly, so that the wafer or the wafer assembly enters the box body from the opening and rotates to seal the opening. According to the invention, the wafer or the wafer assembly intervenes into the box body from the opening, and compared with a conventional dispergator that a pull-out carrier is moved out and put in step by step, the process is simple and efficient; the first end executor is suitable for grabbing the wafer or the wafer assembly intervening in the box body, the situation that the wafer or the wafer assembly is grabbed again after being placed is avoided, the action is concise, and circulation is continuous; the first end effector is suitable for closing the opening to prevent the light projected by the light source from overflowing to the outside from the opening, so that the viscous carrier can absorb the light to reduce viscosity, and the safety is good.

Description

Technical Field

[0001] This invention relates to the field of Taiko process technology, and in particular to a degumming device and a cutting system and method. Background Technology

[0002] In the Taiko process, adhesive carriers such as grinding tape (BG tape) and cutting tape (Dicing tape) are attached to wafers or wafer assemblies. Therefore, a debonding machine is needed to reduce the adhesiveness and facilitate peeling.

[0003] Conventional degumming machines often use pull-out carriers. For example, Chinese utility model patent CN201720410761.3 discloses a UV degumming machine, which includes a housing and a discharge drawer. Specifically, the discharge drawer is moved out of the housing to receive wafers or wafer assemblies, and then the discharge drawer is returned to the housing. Therefore, the removal and return of the discharge drawer are carried out in separate steps, reducing the capacity of the degumming equipment.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0005] The purpose of this invention is to provide a degumming device and a cutting system and method to improve production capacity.

[0006] The objective of this invention is achieved through the following technical solution: A degumming device, comprising: An illumination device includes a housing and a light source built into the housing, the top of the housing having an opening, and the light source facing the opening; A conveying device, comprising a first module and a first end effector drivenly connected thereto; In this embodiment, the first end effector is adapted to grasp a wafer or wafer assembly so that it enters the housing through the opening and then closes the opening.

[0007] Further, the first end effector includes: The first base has a circular outer contour and a diameter not less than the inner contour diameter of the opening; Several suction nozzles are disposed on the first base; In this process, the wafer or wafer assembly is attached to the bottom end face of the first base via the suction nozzle.

[0008] Furthermore, the irradiation device includes: The housing is movably connected to the box body; The first driving component is connected to the housing in a transmission manner; Wherein, by means of the first drive member, the housing is adapted to seal or expose the opening.

[0009] Furthermore, the wafer assembly includes a wafer, a tooling, and an adhesive carrier attached to both; The degumming device includes: Separation device suitable for circumferential cutting of adhesive carriers, thus freeing wafers from tooling; The wafer is then placed into the housing via the aforementioned transport device.

[0010] Furthermore, the wafer assembly includes a wafer, a tooling, and an adhesive carrier attached to both, wherein the back side of the wafer is thinned in the middle and a raised ring is formed at the edge; The degumming device includes: The separation device is suitable for circumferentially cutting wafer rings and adhesive carriers, so that the tooling detaches from the wafer along with the rings; The wafer is then placed into the housing via the aforementioned transport device.

[0011] Furthermore, the separation device includes: The operating table includes a second base and a first table surface and a second table surface detachably connected thereto. The second table surface has an opening in the middle, and the first table surface is disposed therein, with its outer edge and inner edge being flush to form a gap. A ring cutter is located above the operating table; The second driving component is connected to the ring cutter in a driving connection. The wafer and the tooling are respectively fixed on the first platform and the second platform; the circumciser is then adapted to insert into the gap by means of the second driving member to circumcise the adhesive carrier.

[0012] Furthermore, the separation device includes: The operating table includes a second base and a first table surface and a second table surface detachably connected thereto. The second table surface has an opening in the middle, and the first table surface is disposed therein, with its outer edge and inner edge being flush to form a gap. A ring cutter is located above the operating table; The second driving component is connected to the ring cutter in a driving connection. The wafer center, wafer protrusion, and tooling are respectively fixed on the first platform and the second platform; the circumciser is then adapted to insert into the gap via the second driving member to circumcise the protrusion and the adhesive carrier.

[0013] Furthermore, the degumming equipment includes a feeding device, which includes a platform, a buffer mechanism, and a conveying mechanism; The material box is detachably mounted on the stage, where wafers or wafer assemblies are stacked and stored; the conveying mechanism is located above the buffer mechanism and is used to deliver the wafers or wafer assemblies in the material box to the buffer mechanism.

[0014] In addition, the present invention provides a dicing system for dividing wafers into individual dies for packaging into chips, including dicing equipment, grinding equipment, attaching equipment, removal equipment, die bonding equipment, and the aforementioned descaling equipment.

[0015] Furthermore, the present invention provides a method for cutting orders using the aforementioned order cutting system, comprising the following steps: S01, using an attachment device, attach the cutting tape to the back of the wafer and the tooling; S02, using a cutting device, a groove is formed from the front side of the wafer along a predetermined line, with the back side of the wafer as the bottom; S03, using an attachment device, apply the grinding tape to the front side of the wafer and the tooling; S04, Use a removal device to peel off the cutting tape; S05, using grinding equipment, the middle part of the back side of the wafer is thinned to eliminate the bottom of the groove and form a raised ring; S06, using the aforementioned de-adhesive equipment, the wafer convex ring is circumferentially cut and the adhesive tape is ground, so that the tooling is detached from the wafer along with the convex ring; S07, using the aforementioned de-adhesion equipment, reduce the stickiness of the grinding tape; S08, using a die bonding device, obtains a single grain from a grinding tape.

[0016] Compared with the prior art, the present invention has the following advantages: the wafer or wafer assembly is inserted into the box from the open, which is simpler and more efficient than the step-by-step removal and placement of the conventional desizing machine pull-out carrier; in addition, the first end effector is suitable for grasping the wafer or wafer assembly inserted into the box, eliminating the need to put it aside and then grab it again, making the action simple and the flow continuous; furthermore, the first end effector is suitable for closing the open, preventing the light source from spilling out of the open to the outside, so that the adhesive carrier can absorb it and reduce the stickiness, thus ensuring good safety. Attached Figure Description

[0017] Figure 1 This is a top view of the degumming device of the present invention.

[0018] Figure 2 This is a schematic diagram of the installation of the irradiation device, operating table, and feeding device in this invention.

[0019] Figure 3 This is a schematic diagram of the structure of the first end effector in this invention.

[0020] Figure 4 This is a schematic diagram of the wafer assembly structure in this invention.

[0021] Figure 5 This is a schematic diagram of the separation device in this invention.

[0022] Figure 6 This is an exploded view of the operating console in this invention.

[0023] Figure 7 This is a schematic diagram of the ring cutter in this invention.

[0024] Figure 8 This is a schematic diagram of the structure of the ring cutter after removing the base frame in this invention.

[0025] Figure 9 yes Figure 8 A structural diagram in the main view direction.

[0026] Figure 10 yes Figure 8 A schematic diagram of the structure in a side view.

[0027] Explanation of reference numerals in the attached figures: 100. Irradiation device; 110. Housing; 111. Opening; 112. Body; 113. Cover plate; 120. Light source; 130. Housing; 140. First driving component; 200. Handling device; 210. First module; 220. First end effector; 221. First base; 222. Nozzle; 300. Separation device; 310. Operating table; 311. Second base; 312. First tabletop; 313. Second tabletop; 314. Gap; 320. Ring cutter; 321. Base frame; 3211. Third base; 3212. Guide rod; 322. Pressure application assembly; 323. Cutting assembly; 324. Fourth base; 325. First attitude adjustment structure; 3251. Third driving component; 3252. First plate; 3253. First elastic component; 3254. Second plate; 3255. First arc-shaped hole; 3256. Second mounting hole; 326. Second attitude adjustment structure; 3261. Frustum; 3262. Third plate; 3263. Fourth driving component 3264, Fourth plate; 3265, Second elastic element; 3266, Second arc-shaped hole; 3267, Transmission element; 330, Second driving element; 331, Second module; 332, Third module; 400, Feeding device; 410, Platform; 420, Buffer mechanism; 421, Guide rail; 430, Handling mechanism; 431, Fourth module; 432, Second end effector; 440, Material box; 500, Wafer assembly; 510, Wafer wafer; 511, Chamfered edge; 520, Tooling; 530, Adhesive carrier. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0029] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] Please see Figures 1 to 2 As shown, a debonding device corresponding to a preferred embodiment of the present invention includes: an irradiation device 100, including a housing 110 and a light source 120 built into the housing 110, the top of the housing 110 having an opening 111, the light source 120 facing the opening 111, and the effective area of ​​the light source 120 at least covering the opening 111; and a conveying device 200, including a first module 210 and a first end effector 220 connected thereto; the first module 210 and the first end effector 220 are adapted to grasp a wafer or wafer assembly 500 so that it enters the housing 110 through the opening 111 and then closes the opening 111.

[0032] In this invention, the wafer 510 or wafer assembly 500 enters the housing 110 from the opening 111. Compared with the conventional peeling machine's pull-out carrier, which involves separate steps of removal and placement, the process is simpler and more efficient. Furthermore, the first end effector 220 is adapted to grasp the wafer 510 or wafer assembly 500 entering the housing 110, eliminating the need to place it and then pick it up again, resulting in concise and continuous operation. In addition, the first end effector 220 is adapted to close the opening 111, preventing the light projected by the light source 120 from leaking out of the opening 111 to the outside, so that the adhesive carrier 530 can absorb it and reduce its stickiness, thus ensuring good safety.

[0033] Furthermore, the inner contour of the opening 111 is circular to avoid interference with the wafer 510 or wafer assembly 500 entering the housing 110. The housing 110 includes a body 112 and a cover 113 detachably connected to it. Specifically, the body 112 is a square body with an open top, and the cover 113 is sealed to the top of the body 112 and has an opening 111 formed therein. The body 112 and the cover 113 can be fastened together by bolts, screws, or other threaded components. With the aforementioned structure, it is convenient to install the light source 120 and other components inside the housing 110, and to replace the cover 113 with one that matches the inner contour of the opening 111 based on the actual size of the wafer 510 or wafer assembly 500.

[0034] Preferably, the irradiation device 100 includes a housing 130 movably connected to the enclosure 110 and a first driving member 140 driven thereto; the housing 130 is adapted to seal or expose the opening 111 via the first driving member 140. Specifically, when the irradiation device 100 is idle, the housing 130 seals the opening 111 via the first driving member 140 to prevent unwanted substances from seeping into the enclosure 110, thereby maintaining the cleanliness of the interior of the enclosure 110; when the irradiation device 100 is in operation, the housing 130 exposes the opening 111 via the first driving member 140 to prevent interference with the wafer 510 or wafer assembly 500 entering the enclosure 110.

[0035] In one embodiment, the housing 130 is movably connected to the box 110 via a pivot; thus, the housing 130 is adapted to turn or tilt away from the box 110 via the first drive member 140. In other embodiments, the housing 130 is slidably connected to the box 110 via a slide rail; thus, the housing 130 is adapted to slide toward or move away from the box 110 via the first drive member 140. Admittedly, the first drive member 140 may specifically be a motor or a cylinder.

[0036] Further, please refer to Figure 1 and Figure 3 As shown, the first module 210 includes at least two linear slides to drive the first end effector 220 to move at least in a vertical direction and a horizontal direction.

[0037] In one embodiment, the first end effector 220 is specifically a Bernoulli suction cup. In this embodiment, the first end effector 220 includes a first base 221 and a plurality of suction nozzles 222 disposed on the first base 221. The outer contour of the first base 221 is circular, and its diameter is not less than the inner contour diameter of the opening 111. The plurality of suction nozzles 222 are preferably evenly spaced along the circumference of the first base 221. At least the outer edge of the bottom end face of the first base 221 can fit against the top of the housing 110, so that the first end effector 220 is suitable for closing the opening 111. Through the suction nozzles 222, the wafer 510 or wafer assembly 500 is attached to the bottom end face of the first base 221, so that the first end effector 220 is suitable for gripping it.

[0038] In one embodiment, at least one first mounting hole (not shown) is formed by recessing inward from the bottom end face of the first base 221. The first mounting hole is adapted to receive a suction nozzle 222 to generate an attractive force, thereby attaching the wafer 510 or wafer assembly 500 to the bottom end face of the first base 221. In other embodiments, a negative pressure channel (not shown) is formed inside the first base 221, and a plurality of first mounting holes (not shown) are formed in communication with it on the bottom end face of the first base 221. The suction nozzle 222 is received in the first mounting hole to communicate with the negative pressure channel, thereby generating an attractive force through the first mounting hole.

[0039] Further, please refer to Figure 4 As shown, the wafer assembly 500 includes a wafer 510, a tooling 520, and an adhesive carrier 530 attached to both. Indeed, separating the wafer assembly 500 and then inserting the wafer 510 into the housing 110 to reduce the adhesion of the adhesive carrier 530 is beneficial to the de-adhesive equipment's capacity compared to processing the entire adhesive carrier 530. Furthermore, in the conventional Taiko process, the center of the back side of the wafer 510 is thinned to form an edge protrusion ring to maintain the rigidity of the wafer 510 and prevent warping. To avoid interference during subsequent packaging, the protrusion ring needs to be circumferentially cut.

[0040] Therefore, please refer to Figures 1 to 2 As shown, a debonding device corresponding to a preferred embodiment of the present invention includes: a separation device 300, adapted to circumferentially cut the adhesive carrier 530 or the wafer 510 protrusion and the adhesive carrier 530, so that the wafer 510 is freed from the tooling 520. The wafer 510 is then placed into the housing 110 by a conveying device 200 to reduce the adhesion of the adhesive carrier 530 on it. Further details can be found in the following description. Figures 5 to 6 As shown, the separation device 300 includes an operating table 310, a ring cutter 320, and a second drive unit 330. The operating table 310 is located below the ring cutter 320, and the ring cutter 320 is connected to the second drive unit 330. Specifically, the wafer assembly 500 is fixed on the operating table 310. The second drive unit 330 is used to ring cut the adhesive carrier 530 to free the wafer 510 from the fixture 520, or to ring cut the protrusion of the wafer 510 and the adhesive carrier 530 to free the fixture 520 from the wafer 510 along with the protrusion.

[0041] Furthermore, the operating table 310 includes a second base 311 and a first table surface 312 and a second table surface 313 detachably connected thereto. The second table surface 313 has an opening in the middle, and the first table surface 312 is disposed therein, with its outer edge and inner edge clamped together to form a gap 314. Specifically, the wafer 510 and the tooling 520 are respectively fixed on the first table surface 312 and the second table surface 313, or the middle part of the wafer 510, the wafer 510 protrusion, and the tooling 520 are respectively fixed on the first table surface 312 and the second table surface 313. By means of the second driving member 330, the circumciser 320 is then adapted to insert into the gap 314 to circumcise the adhesive carrier 530, or to circumcise the wafer 510 protrusion and the adhesive carrier 530.

[0042] Specifically, the outer contour of the first mesa 312 and the inner contour of the central opening of the second mesa 313 are both circular, and the second mesa 313 is approximately flush with the first mesa 312. Admittedly, the diameter of the outer contour of the first mesa 312 is smaller than the diameter of the inner contour of the central opening of the second mesa 313, and the diameter of the inner contour of the tooling 520 or the inner contour of the convex ring of the wafer 510 is not smaller than the diameter of the outer contour of the first mesa 312.

[0043] In one embodiment, the first mezzanine 312 and / or the second mezzanine 313 are movably disposed on the second base 311 and are adapted by a drive member (not shown) to move relative to each other to allow the wafer 510 to be removed from the fixture 520 or the convex ring to be removed from the wafer 510.

[0044] Furthermore, the second drive unit 330 includes a second module 331 and a third module 332 connected thereto. The circumferential cutter 320 is connected to the third module 332 and is correspondingly arranged above the gap 314. Through the second module 331, the circumferential cutter 320 is adapted to penetrate downward to pierce the gap 314; through the third module 332, the circumferential cutter 320 is adapted to circumferentially cut the adhesive carrier 530 along the wafer 510, or circumferentially cut the wafer 510 protrusion and the adhesive carrier 530.

[0045] Further, please refer to Figures 7 to 10 As shown, the circumferential cutter 320 includes a base frame 321, a pressure application component 322, a cutting component 323, and an orientation adjustment component. Specifically, the base frame 321 is connected to the third module 332; the cutting component 323 is used for circular cutting of the adhesive carrier 530; the orientation adjustment component is connected to the base frame 321 and the cutting component 323, and is adapted to adjust the orientation of the cutting component 323 in multiple dimensions so that it fits and contacts the outer edge of the wafer 510 or the inner edge of the wafer 510's convex ring, so that the cutting component 323 is suitable for cleanly cutting the adhesive carrier 530 on the outer edge of the wafer 510 or cleanly cutting the wafer 510's convex ring without damaging its middle part; the pressure application component 322 is provided on the base frame 321 and is adapted to abut against the wafer 510 to prevent warping during circumferential cutting, which is beneficial to the operation of the cutting component 323.

[0046] Furthermore, the base frame 321 includes a third base 3211 and a guide rod 3212 disposed on the third base 3211. The third base 3211 is connected to the third module 332. The axis of the guide rod 3212 is parallel to the radial direction of the wafer 510. The attitude adjustment component is movably disposed on the guide rod 3212. With the aforementioned structure, based on the actual size of the wafer 510 or the wafer 510 convex ring, the position of the attitude adjustment component is changed along the axial direction of the guide rod 3212 to adjust the rotation radius of the cutting component 323, so that its circumferential cutting trajectory matches the outer edge of the wafer 510 or the inner edge of the wafer 510 convex ring.

[0047] Furthermore, both the pressure application component 322 and the cutting component 323 are conventional structures. The pressure application component 322 is specifically a roller, suitable for elastically contacting the wafer 510 to prevent warping without damage. Admittedly, the cutting component 323 is preferably suitable for heating to prevent the viscous carrier 530 from wrinkling during circumferential cutting; this will not be elaborated further here.

[0048] Furthermore, the attitude adjustment assembly includes a fourth base 324, a first attitude adjustment structure 325, and a second attitude adjustment structure 326. Specifically, the fourth base 324 is movably disposed on the guide rod 3212, the cutting assembly 323 is disposed on the first attitude adjustment structure 325, and the second attitude adjustment structure 326 is connected to the fourth base 324 and the first attitude adjustment structure 325. Through the first attitude adjustment structure 325, the cutting assembly 323 is adapted to be displaced radially along the wafer 510. Through the second attitude adjustment structure 326, the cutting assembly 323 is adapted to be displaced around the axis of the wafer 510.

[0049] Specifically, please refer to Figure 4 As shown, the outer contour of the conventional wafer 510 is not a standard circle, but often has a chamfered edge 511. By means of the second orientation adjustment structure 326, the cutting component 323 is adapted to be displaced to circumferentially cut the adhesive carrier 530 along the chamfered edge 511.

[0050] Further, the first attitude adjustment structure 325 includes a third driving member 3251, a first plate 3252, and a first elastic member 3253. Specifically, the first plate 3252 is disposed on the second attitude adjustment structure 326, the third driving member 3251 is disposed on the first plate 3252, the cutting assembly 323 is connected to the third driving member 3251, and the first elastic member 3253 is connected to the first plate 3252 and the cutting assembly 323. Through the third driving member 3251, the cutting assembly 323 is adapted to slightly shift along the radial direction of the wafer 510; through the first elastic member 3253, the cutting assembly 323 is then adapted to return to its original position. More specifically, the third driving member 3251 is a cylinder arranged radially along the wafer 510, and the first elastic member 3253 is a spring or a tension spring.

[0051] Preferably, the first attitude adjustment structure 325 includes a second plate 3254. Specifically, the second plate 3254 is connected to the first plate 3252 and the second attitude adjustment structure 326, and its end face is parallel to the axis of the wafer 510 and has at least one first arc-shaped hole 3255. More specifically, the axis of the first arc-shaped hole 3255 is perpendicular to the axis of the wafer 510, and the end face of the first plate 3252 has a corresponding second mounting hole 3256, through which a threaded component (not shown) passes, and the second plate 3254 is connected to the first plate 3252. Through the second plate 3254, the first plate 3252 is adapted to tilt around the axis of the first arc-shaped hole 3255 to adjust the attitude of the cutting component 323 when it inserts into the gap 314.

[0052] Furthermore, the second attitude adjustment structure 326 includes a frustum 3261, a third plate 3262, and a fourth drive member 3263. Specifically, the frustum 3261 is disposed on the fourth base 324, and the third plate 3262 is movably disposed on the frustum 3261 and connected to the second plate 3254. In one embodiment, the third plate 3262 is drive-connected to the fourth drive member 3263. By means of the fourth drive member 3263, the third plate 3262 is adapted to rotate about the axis of the wafer 510, thereby displacing the cutting assembly 323 to perform circumferential cutting along the chamfered edge 511. Indeed, the fourth drive member 3263 is specifically a cylinder, with its output end hinged to the third plate 3262 and its other end hinged to the fourth base 324.

[0053] Preferably, the second attitude adjustment structure 326 includes a fourth plate 3264 and a second elastic member 3265. Specifically, the fourth plate 3264 is located above the third plate 3262 and is movably connected to the frustum 3261, and the second elastic member 3265 is connected to the third plate 3262 and the fourth plate 3264. In this embodiment, the fourth plate 3264 is drively connected to the fourth driving member 3263. More specifically, the fourth plate 3264 has at least one second arc-shaped hole 3266, and the third plate 3262 is provided with a corresponding transmission member 3267. The axis of the second arc-shaped hole 3266 is parallel to the axis of the wafer 510, and the transmission member 3267 is disposed therein and adapted to guide the fourth plate 3264 to move along its arc. Specifically, via the fourth driving member 3263, the fourth plate 3264 shifts along the arc of the second arc-shaped hole 3266, causing the second elastic member 3265 to deform. When the transmission member 3267 abuts against the inner edge of one end of the second arc-shaped hole 3266, the second arc-shaped hole 3266 is adapted to apply pressure to the transmission member 3267, thereby actuating the third plate 3262, causing it to rotate around the axis of the wafer 510. In this way, the cutting assembly 323 is displaced to make a circular cut along the chamfered edge 511. Then, via the second elastic member 3265, the cutting assembly 323 is adapted to return to its original position. Indeed, the second elastic member 3265 has a similar structure to the first elastic member 3253; the fourth driving member 3263 is specifically a cylinder, with its output end hinged to the fourth plate 3264 and its other end hinged to the fourth base 324.

[0054] In this invention, the first elastic element 3253 or the second elastic element 3265 deforms and then returns to its original state to pull the cutting assembly 323 to reset. Compared with the third driving element 3251 or the fourth driving element 3263 doing work again, the process is simple and energy-saving.

[0055] Further, please refer to Figures 1 to 2As shown, the debonding equipment includes a loading device 400, which is used to transport wafers 510 or wafer assemblies 500 into the debonding equipment. Specifically, the loading device 400 includes a stage 410, a buffer mechanism 420, and a transport mechanism 430. A cassette 440 is detachably mounted on the stage 410, where wafers 510 or wafer assemblies 500 are stacked. The transport mechanism 430 is located above the buffer mechanism 420 and is used to transport the wafers 510 or wafer assemblies 500 from the cassette 440 to the buffer mechanism 420. More specifically, the cassette 440 has an opening on one side, and the transport mechanism 430 includes a fourth module 431 and a second end effector 432 drivenly connected thereto. Specifically, through the fourth module 431, the second end effector 432 is adapted to extend into the opening of the cassette 440 to grasp the wafers 510 or wafer assemblies 500 and then transport them to the buffer mechanism 420. Admittedly, the first end effector 220 is adapted to grip the wafer 510 or wafer assembly 500 from the buffer mechanism 420 for insertion into the housing 110; or the buffer mechanism 420 grips the wafer assembly 500 for placement on the worktable 310, and then grips the wafer 510 from the worktable 310 for insertion into the housing 110. It is understood that the wafer 510 gripped by the first end effector 220 from the worktable 310 has been separated from the tooling 520 or the cam and tooling 520.

[0056] Preferably, via the buffer mechanism 420, the wafer assembly 500 is adapted to be centered and aligned with the first mesa 312, such that the circumferential cutting trajectory of the cutting assembly 323 matches the outer edge of the wafer 510 or the inner edge of the wafer 510's convex ring. Specifically, the buffer mechanism 420 includes a fifth module (not shown) and guide rails 421 drivenly connected thereto. More specifically, there are two guide rails 421, arranged opposite each other in the horizontal direction. Indeed, the second end effector 432 is adapted to pick up the wafer 510 or wafer assembly 500 from the cassette 440 and place it on the guide rails 421; via the fifth module, the two guide rails 421 are then adapted to move relative to each other until the wafer assembly 500 is centered and aligned with the first mesa 312.

[0057] Preferably, the loading device 400 includes a fifth drive member (not shown), such that the second end effector 432 is adapted to grasp any level of wafer 510 or wafer assembly 500 in the vertical direction within the cassette 440. In one embodiment, the stage 410 is drive-connected to the fifth drive member; by means of the fifth drive member, the stage 410 is adapted to actuate the cassette 440 in the vertical direction, causing it to rise and fall. In other embodiments, the fifth drive member is connected to the fourth module 431 and the second end effector 432; by means of the fifth drive member, the second end effector 432 is adapted to move vertically.

[0058] The degumming device according to a preferred embodiment of the present invention operates as follows: First, the second end effector 432 picks up the wafer assembly 500 from the hopper 440 and places it on the guide rail 421; Secondly, the first end effector 220 picks up the wafer assembly 500 from the guide rail 421 and places it on the operating table 310. Next, the circumferential cutter 320 extends downward to penetrate the gap 314, and then circumferentially cuts the adhesive carrier 530 along the wafer 510 so that the wafer 510 can be freed from the tooling 520, or circumferentially cuts the wafer 510 protrusion and the adhesive carrier 530 so that the tooling 520 can be freed from the wafer 510 along with the protrusion. Then, the first end effector 220 picks up the wafer 510 from the operating table 310 so that it is inserted into the housing 110, so that the adhesive carrier 530 on its upper part absorbs the light projected by the light source 120 and becomes less sticky.

[0059] In addition, the present invention provides a single-die dicing system for dividing wafer 510 into single dies for packaging into chips, including a cutting device (not shown), a grinding device (not shown), an attachment device (not shown), a removal device (not shown), a die bonding device (not shown), and the aforementioned de-adhesive device.

[0060] Furthermore, the present invention provides a method for cutting orders using the aforementioned order cutting system, comprising the following steps: S01, using an attachment device, attach the cutting tape to the back of the wafer 510 and the tooling 520; S02, using a cutting device, a groove is formed from the front side of the wafer 510 along a predetermined line, with the back side of the wafer 510 as the bottom. S03, using an attachment device, attach the grinding tape to the front side of the wafer 510 and the tooling 520; S04, Use a removal device to peel off the cutting tape; S05, using grinding equipment, the middle part of the back side of wafer 510 is thinned to remove the bottom of the groove and form a raised ring; S06, using the aforementioned de-adhesive equipment, the convex ring of the wafer 510 is circumferentially cut and the adhesive tape is ground, so that the tooling 520 is detached from the wafer 510 along with the convex ring; S07, using the aforementioned de-adhesion equipment, reduce the stickiness of the grinding tape; S08, using a die bonding device, obtains a single grain from a grinding tape.

[0061] Preferably, the step between steps S03 and S04 includes: Step S09: Using the aforementioned adhesive removal equipment, reduce the adhesion of the cutting tape to facilitate its peeling.

[0062] Preferably, step S06, which is an interference-free step, is located between steps S05 and S06 and includes: Step S10: Heat and grind the tape.

[0063] Step S10 can shrink the grinding tape to maintain the tension required in step S06.

[0064] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A degumming device, characterized in that, include: An illumination device (100) includes a housing (110) and a light source (120) built into the housing (110). The top of the housing (110) is provided with an opening (111), and the light source (120) faces the opening (111). The conveying device (200) includes a first module (210) and a first end effector (220) drivenly connected thereto. In this embodiment, the first end effector (220) is adapted to grasp a wafer (510) or wafer assembly (500) through the first module (210) so that it enters the housing (110) through the opening (111) and then closes the opening (111).

2. The degumming device as described in claim 1, characterized in that, The first end effector (220) includes: The first base (221) has a circular outer contour and a diameter not less than the inner contour diameter of the opening (111); Several suction nozzles (222) are disposed on the first base (221); In this process, a wafer (510) or a wafer assembly (500) is attached to the bottom end face of the first base (221) via the nozzle (222).

3. The degumming device as described in claim 1, characterized in that, The irradiation device (100) includes: The housing (130) is movably connected to the box (110); The first driving component (140) is connected to the housing (130) in a transmission manner; Wherein, by means of the first drive member (140), the housing (130) is adapted to cover or expose the opening (111).

4. The degumming apparatus according to any one of claims 1 to 3, characterized in that, The wafer assembly (500) includes a wafer (510), a tooling (520), and an adhesive carrier (530) attached to both. The degumming device includes: Separation device (300) is suitable for circumferentially cutting the adhesive carrier (530), so that the wafer (510) is freed from the tooling (520); The wafer (510) is then placed into the housing (110) by means of the transport device (200).

5. The degumming apparatus according to any one of claims 1 to 3, characterized in that, The wafer assembly (500) includes a wafer (510), a tooling (520), and an adhesive carrier (530) attached to the two, wherein the back side of the wafer (510) is thinned in the middle and a raised ring is formed at the edge; The degumming device includes: Separation device (300) is suitable for ring cutting of wafer (510) ring and adhesive carrier (530), such that tooling (520) is separated from wafer (510) along with the ring; The wafer (510) is then placed into the housing (110) by means of the transport device (200).

6. The degumming device as described in claim 4, characterized in that, The separation device (300) includes: The operating table (310) includes a second base (311) and a first table surface (312) and a second table surface (313) detachably connected thereto. The second table surface (313) has an opening in the middle, and the first table surface (312) is disposed therein, with its outer edge and inner edge being flush to form a gap (314). A ring cutter (320) is located above the operating table (310); The second driving component (330) is connected to the ring cutter (320) in a transmission manner; The wafer (510) and the tooling (520) are respectively fixed on the first mesa (312) and the second mesa (313); by means of the second drive member (330), the circumciser (320) is then adapted to insert into the gap (314) to circumcise the adhesive carrier (530).

7. The degumming device as described in claim 5, characterized in that, The separation device (300) includes: The operating table (310) includes a second base (311) and a first table surface (312) and a second table surface (313) detachably connected thereto. The second table surface (313) has an opening in the middle, and the first table surface (312) is disposed therein, with its outer edge and inner edge being flush to form a gap (314). A ring cutter (320) is located above the operating table (310); The second driving component (330) is connected to the ring cutter (320) in a transmission manner; The wafer (510) center, the wafer (510) protrusion ring and the tooling (520) are respectively fixed on the first mesa (312) and the second mesa (313); by means of the second driving member (330), the ring cutter (320) is then adapted to insert into the gap (314) to ring cut the protrusion ring and the adhesive carrier (530).

8. The degumming device as described in claim 1, characterized in that, The degumming device includes a feeding device (400), which includes a platform (410), a buffer mechanism (420), and a conveying mechanism (430). The material box (440) is detachably disposed on the stage (410), and wafers (510) or wafer assemblies (500) are stacked therein; the conveying mechanism (430) is located above the buffer mechanism (420) and is used to deliver the wafers (510) or wafer assemblies (500) in the material box (440) to the buffer mechanism (420).

9. A dicing system for dicing wafers (510) into individual dies for packaging into chips, characterized in that, It includes cutting equipment, grinding equipment, adsorption equipment, removal equipment, die bonding equipment, and debinding equipment as described in any one of claims 5 or 7.

10. A method for cutting orders using the order cutting system as described in claim 9, characterized in that, Includes the following steps: S01, using an attachment device, attach the cutting tape to the back of the wafer 510 and the tooling (520). S02, using a cutting device, a groove is formed from the front side of the wafer (510) along a predetermined line, with the back side of the wafer (510) as the bottom of the groove; S03, using an attachment device, attach the grinding tape to the front side of the wafer (510) and the tooling (520). S04, Use a removal device to peel off the cutting tape; S05, using grinding equipment, the middle part of the back side of the wafer (510) is thinned to remove the bottom of the groove and form a raised ring; S06, using the aforementioned de-adhesive equipment, the convex ring of the wafer (510) and the grinding tape are circumferentially cut, so that the tooling (520) is detached from the wafer (510) along with the convex ring. S07, using the aforementioned de-adhesion equipment, reduce the stickiness of the grinding tape; S08, using a die bonding device, obtains a single grain from a grinding tape.

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