System for applying laser patterns using machine vision positioning and alignment of wafers

Abstract

A system and method for applying a laser pattern using machine vision positioning and alignment of a wafer is provided. A laser annealing machine configured to apply laser annealing to a workpiece may be configured to provide visual positioning and alignment of the workpiece for applying laser annealing. Providing visual positioning and alignment of a workpiece includes acquiring visual data representing the workpiece via at least one visual sensing device, identifying one or more features in the workpiece or identifying one or more regions in the workpiece based on the acquired visual data to ensure that the workpiece is centered and aligned when a scanning beam is applied to the workpiece. The identifying includes adjusting an operation of the at least one processing component.

Description

A system that uses machine vision to position and align chips to apply laser patterns. Technical Field

[0001] This disclosure relates to solutions related to device fabrication (e.g., semiconductor wafers). More specifically, certain implementations of this disclosure relate to methods and systems for implementing and utilizing machine vision positioning and alignment of wafers for applying laser patterns. Background Technology

[0002] The limitations and disadvantages of conventional and traditional solutions will become apparent to those skilled in the art when compared with systems having some aspects of this disclosure as set forth in the remainder of this application with reference to the accompanying drawings. Summary of the Invention

[0003] Systems and methods are provided for machine vision positioning and alignment of wafers to apply laser patterns.

[0004] A system for positioning and aligning a wafer using machine vision to apply a laser pattern includes: a laser annealing machine configured to apply laser annealing to a workpiece, wherein the laser annealing machine includes: one or more manipulation components for manipulating the workpiece; one or more processing components configured to apply laser annealing to the workpiece; an integrated vision inspection system including one or more vision sensing devices configured to acquire visual data associated with the workpiece and / or with the laser annealing applied to the workpiece; and control circuitry configured to control the function or operation of the laser annealing machine and / or one or more parts of the laser annealing machine. The function or operation of the workpiece; wherein applying laser annealing to each workpiece includes applying a scanning beam to the surface of the workpiece based on a scanning pattern; wherein the laser annealing machine is configured to provide visual positioning and alignment of the workpiece via the control circuit to apply laser annealing; and wherein providing visual positioning and alignment of the workpiece includes: acquiring visual data representing the workpiece via at least one of the visual sensing devices; and identifying one or more features or regions in the workpiece based on the acquired visual data to ensure that the workpiece is centered and aligned when the scanning beam is applied to the workpiece, wherein the identification includes the operation of adjusting at least one processing component.

[0005] One or more of the processing components include one or more scanning components configured to project the scanning beam onto the workpiece when laser annealing is applied to the workpiece.

[0006] One or more of the scanning components include a laser source configured to provide a laser beam for applying laser annealing to a workpiece.

[0007] One or more of the scanning components include a scanning head configured to project the scanning beam onto the workpiece using an input beam received from a beam source.

[0008] The scanning head includes one or more optical components configured to guide the input beam to project the scanning beam onto the workpiece.

[0009] One or more of the optical components include one or more galvanometers and reflectors.

[0010] At least one of the processing components is the scanning head, and wherein adjusting at least one of the processing components includes moving at least one galvanometer mirror.

[0011] At least one of the processing components includes a galvanometer reflector, and wherein adjusting at least one of the processing components includes moving the galvanometer reflector.

[0012] The control circuit is configured to run software for controlling the application of laser annealing, wherein the software is configured to perform visual positioning and alignment of the workpiece.

[0013] Configuring the software includes modifying the software to support a dedicated mode that allows for adjustments to the operation of at least one of the processing components.

[0014] When at least one of the processing components includes one or more galvanometer mirrors, the dedicated mode includes a galvanometer positioning mode.

[0015] Identifying one or more features or regions in a workpiece, including identifying the center of the workpiece.

[0016] Identifying the center of a workpiece involves identifying multiple circular alignment positions corresponding to different edge positions on the workpiece surface.

[0017] Identifying one or more features or regions in a workpiece includes identifying the orientation of the workpiece.

[0018] Identifying the orientation of a workpiece involves identifying multiple linear alignment positions on the surface of the workpiece.

[0019] At least one of the visual sensing devices includes a coaxial camera.

[0020] One or more of the processing components include an annealing chamber configured to accommodate a workpiece when laser annealing is applied to it.

[0021] One or more of the manipulation components include a robotic arm configured to move a workpiece to assist in the application of laser annealing.

[0022] One or more of the said manipulation components include one or more containers configured for storing workpieces.

[0023] The workpiece includes semiconductor wafers. Attached Figure Description

[0024] These and other advantages, aspects and novel features of this disclosure, as well as the details of the embodiments shown therein, will be more fully understood from the following description and accompanying drawings.

[0025] Figure 1 shows an exemplary laser annealing machine.

[0026] Figure 2 illustrates an exemplary use case when using video mode of laser control software in an exemplary laser annealing machine.

[0027] Figures 3A and 3B show exemplary images taken using an integrated vision inspection system in an exemplary laser annealing machine.

[0028] Figures 4A and 4B illustrate exemplary use cases when performing center offset and rotation alignment. Detailed Implementation

[0029] This disclosure relates to solutions related to device manufacturing (e.g., semiconductor wafers). Specifically, implementations based on this disclosure involve vision-based positioning and alignment of a workpiece (e.g., a wafer) during annealing processes (e.g., when a laser pattern is applied). In various implementations based on this disclosure, workpiece positioning and alignment can be accomplished using visual data (e.g., images) acquired via a vision sensing device (e.g., a camera) to ensure proper positioning and alignment of the workpiece during processing (e.g., annealing), wherein adjustments related to positioning and alignment are determined and performed automatically (e.g., by software within the system). In some cases, workpiece positioning and alignment can be accomplished using, for example, stage movement or galvanometer movement. This is particularly true in processing systems utilizing galvanometer scanning (e.g., laser annealing machines). In such machines, hardware and software are used for laser annealing, thus essentially forming a laser engraving system suitable for applying annealing. In machines using galvanometer scanning, one or more galvanometer mirrors (also referred to herein as “ammeter mirrors”) can be used to control the scanning beam used for laser annealing. In some cases, the galvanometer reflector can be movable, such as by using a corresponding galvanometer (ammeter) motor. For example, the collimated laser beam first passes through one or more (e.g., two) galvanometer reflectors, which redirect the beam in two dimensions. In some cases, additional optical components, such as those that focus the scanning beam onto the surface of the workpiece, can be used to provide the desired scan (annealing). For example, one or more lenses (e.g., telecentric lenses) can be used to focus the scanning beam.

[0030] In various implementations, a camera can be used to observe the workpiece surface. In some cases, the camera can collect light using the same optics used to guide and focus the laser beam. Such a camera can be used to collect images for manual positioning of the workpiece or for machine vision alignment of the workpiece. In some cases, the camera can be a coaxial camera, i.e., having the same orientation as the component used to project the scanning beam.

[0031] Among various implementations, machine vision is used to ensure workpiece positioning and alignment. In this regard, machine vision alignment requires capturing precise image data, particularly around one or more edges of the workpiece, thereby detecting the workpiece edges and aligning a scanned pattern with the detected edges. In some cases, such as due to size considerations, this can be challenging. In this case, a typical workpiece is circular, ranging in size from approximately 100 mm to 200 mm in diameter or larger, with a flat surface on one side. However, the field of view through a coaxial camera can be much smaller (e.g., only about 4 mm), and therefore it may be necessary to capture multiple images at different locations. Therefore, alignment points are specified along the circular edge and along the flat surface of the wafer. The stage is moved to each alignment point, and an image is captured at that point using a coaxial camera.

[0032] Edge detection algorithms can be used to identify edge pixels in each image. Edge pixels on the circular edge of the workpiece are used to align the scan pattern (e.g., by offsetting one or both of the x and y positions in the xy plane corresponding to the flat surface of the workpiece), and edge pixels along the flat side are used to align the scan pattern rotationally. Therefore, the alignment process can be time-consuming even for small workpieces (e.g., 100 mm in diameter or less) because the stage needs to be moved to each alignment point. In the case of laser annealing, the alignment process can be particularly slow because the workpiece may be large (e.g., 200 mm in diameter or larger). In some cases, the x-axis (or both the x and y axes) of the xy stage can be removed because the motion axis is not necessary for a single chamber and a scanning lens with a wide scanning area.

[0033] Therefore, it is desirable to reduce the complexity and time required to perform workpiece positioning and alignment, especially for laser annealing. Among various implementations based on this disclosure, workpiece positioning and alignment based on galvanometer motion can be used. In this regard, alignment using galvanometer motion is likely preferred for the reasons stated above. To accelerate the workpiece positioning and alignment process, the camera can be aimed using a galvanometer reflector instead of positioning via a stage. This can be accomplished by configuring existing software used in the machine for controlling laser-related functions. For example, such software can be configured to use a specific mode (e.g., a "galvanometer positioning mode") that is adaptively configured to achieve automatic positioning and alignment based on images captured in the machine (such as the coaxial camera described herein). Several aspects of the solution according to this disclosure and implementations based thereon are described in more detail below with reference to the accompanying drawings.

[0034] Figure 1 illustrates an exemplary laser annealing machine. Figure 1 shows a laser annealing machine (or simply "machine") 100 (or a portion thereof) implemented according to an exemplary embodiment.

[0035] Machine 100 is configured to process semiconductor wafers using laser annealing. In this respect, annealing is a heat treatment that can be used to change the physical and / or chemical properties of a material. Specifically, heat treatment performed during annealing can be used to achieve conditions where the surface layer of a heated material (typically a very thin metal layer) reacts with the underlying bulk material (semiconductor) to form ohmic contacts on the back side of the wafer without heating the front side device. In laser annealing, a laser beam is used for heat treatment. Laser annealing can be used as one of the processing steps used in the manufacture of semiconductor devices. Specifically, laser annealing can be used to process semiconductor wafers during the manufacture of semiconductor devices.

[0036] Machine 100 includes suitable hardware components and circuitry (e.g., embedded in a dedicated control unit (not shown) and / or within some hardware components of the machine) configured to assist laser annealing, particularly laser annealing of semiconductor-based wafers, etc.

[0037] As shown in Figure 1, the machine 100 includes a main structure 102, a robotic arm 104, one or more wafer cassettes (containers) 106, an annealing chamber 108, a scanning head 110, and a laser source 112.

[0038] The main structure 102 is configured to engage and / or accommodate at least some of the remaining components of the machine 100. For example, the main structure 102 may include: a base section that securely supports the remaining sections of the machine; a chamber holding section (attached to or as part of the base section) that engages the annealing chamber 108; and a frame section configured to hold or engage the scanning head 110 and the laser source 112 above the chamber holding section.

[0039] Scanning head 110 can be configured to project a laser beam emitted by laser source 112 onto wafer 122 within annealing chamber 108. In various implementations, scanning head 110 may include optical components configured to control and guide the laser beam emitted by laser source 112 such that, when the wafer is placed within annealing chamber 108, the laser beam can be projected (e.g., vertically, i.e., downward in the z-direction) onto the surface of wafer 122. For example, the optical components include one or more mirrors (e.g., galvanometer mirrors) and one or more lenses (e.g., telecentric lenses). Scanning head 110 may also include additional components that may require control of the optical components, such as galvanometer motors that can be used to move the galvanometer mirrors. These optical components can be configured to operate cooperatively to control the laser beam emitted by laser source 112 (and input into scanning head 110) to redirect the laser beam so that it can be projected (vertically) downward onto the surface of wafer 122, as shown in FIG1.

[0040] In some implementations, the frame section may be incorporated into a scanner holding section that holds or engages the scan head 110 and the laser source 112. Furthermore, in some implementations, one or both of the chamber holding section and the scanner holding section may be movable (e.g., using a track-like mechanism) to ensure alignment of the scan head 110 with the annealing chamber 108. For example, the scan head 110 may be configured to move in one direction (e.g., the x-direction), while the annealing chamber 108 may move in a different direction (e.g., the y-direction) to aid in alignment of the scan head 110 during scanning. Additionally, the scan head 110 may also be movable in the z-direction (i.e., vertically relative to the annealing chamber 108) to enable functions such as focusing. Therefore, the scan head 110 can be effectively moved in three dimensions relative to the annealing chamber 108 (e.g., by directly moving the scan head or by moving other components).

[0041] In operation, robotic arm 104 is configured to remove an (unprocessed) wafer 122 from a wafer cassette 106 and place the wafer 122 into an annealing chamber 108. The wafer 122 is processed in the annealing chamber 108, a process that includes subjecting the wafer to laser annealing. In this regard, the wafer 122 is processed by being subjected to a scanning beam projected onto the wafer from a scanning head 110, wherein a laser source 112 provides the laser used in the scanning beam. For example, the scanning head 110 may include a reflector positioned at a suitable angle (e.g., 45°) to provide a scanning beam by projecting the laser beam emitted by the laser source 112 downwards (e.g., vertically at 90° relative to the horizontal plane) onto the wafer 122 within the annealing chamber 108. After laser annealing is complete, robotic arm 104 removes the processed wafer 122 from the annealing chamber 108 and returns it (e.g., to another wafer cassette 106).

[0042] According to this disclosure, a laser annealing machine (e.g., machine 100) may incorporate an integrated vision inspection system configured to provide and / or support various vision-based functions that can be used to enhance the operation and / or performance of the laser annealing machine. In this regard, an exemplary integrated vision inspection system may include one or more vision sensing devices (e.g., cameras) that can be used to provide and / or support the execution of vision-based functions within the machine, such as vision-based control, vision-based monitoring, vision-based inspection, etc.

[0043] For example, in the embodiment shown in FIG1, machine 100 includes a plurality of cameras, including a coaxial camera 114, a top inspection camera 116, and a bottom inspection camera 118. Machine 100 may also include a main camera 120. Each of these cameras may include suitable hardware components (e.g., lenses, etc.) and circuitry configured to capture or otherwise acquire visual representations of a particular object and / or a particular region thereof (e.g., still images, videos, etc.).

[0044] Coaxial camera 114 can be configured to acquire visual data of wafer 122 when the wafer is in annealing chamber 108 and, in particular, when the wafer is scanned using scanning head 112. In this respect, coaxial camera 114 is arranged such that it has the same viewing orientation as scanning head 112, i.e., coaxial camera 114 acquires visual data (images) along an axis parallel to the scan beam projected by scanning head 112. Top inspection camera 116 and bottom inspection camera 118 can be configured to acquire visual data of the top and bottom surfaces of each wafer 122, respectively, when wafers are removed from wafer cassette 106 and / or loaded back into wafer cassette 106. Main camera 120 can be configured to acquire visual data of the wafer when wafer 122 is manipulated within machine 100 (i.e., when wafers are manipulated by robotic arm 104, when wafers are placed in annealing chamber 108, etc.). Therefore, main camera 120 can allow acquisition of visual data of wafer 122 in many aspects other than the coaxial mode provided by coaxial camera 114.

[0045] In various implementations based on this disclosure, such an integrated vision inspection system can be configured to provide and / or support vision-based positioning and alignment of the wafer, and / or facilitate the use of associated process control methods. Specifically, the integrated vision inspection system can be configured to provide and / or support the execution of vision-based positioning and alignment of the wafer during wafer processing, such as ensuring correct and optimal positioning and alignment of the wafer when a laser pattern is applied to the wafer during wafer annealing.

[0046] For example, an integrated vision inspection system can be configured to sense and identify specific features of a wafer (e.g., edges and flat surfaces). These detected features can then be used (e.g., in software) to set and / or adjust a laser pattern. In this regard, scanning can be controlled by adjusting software that drives scanning-related components (e.g., scanning lenses and / or optics, such as those within the scanning head). Using this simplified design may be superior to any existing solution because it will allow the elimination of xy stage movement (i.e., movement in the xy plane), thereby reducing cost and complexity. Furthermore, this simplified design does not require pre-orientation, thus eliminating the risks associated with wafer manipulation.

[0047] In various implementations, workpiece positioning and alignment can be performed using, for example, stage motion or galvanometer motion. In this regard, as noted in a laser annealing machine (e.g., machine 100), annealing is performed using laser engraving, where a collimated laser beam is used as a scanning beam. The laser beam can be projected via a scanning head 110. In the case of a galvanometer-based design, the laser beam passes through one or more (e.g., two) galvanometer mirrors that manipulate the beam (e.g., in two dimensions) and then (e.g., using a telecentric lens) focuses the beam onto the surface of the wafer.

[0048] According to this disclosure, a coaxial camera 114 is used to acquire images of the surface of a wafer 122, wherein these images are used to align the wafer 122. Specifically, to accelerate the process, the coaxial camera 114 can be configured to utilize a galvanometer mirror (e.g., instead of positioning via an xy-stage in a plane). This can be accomplished by configuring the machine 100 to support a dedicated mode (e.g., a "galvanometer positioning mode") for this purpose. In this regard, the machine 100 may include or otherwise use laser control software for configuring and controlling the laser marking process. The laser control software may have or use multiple motion coordinate system modes, such as to accommodate different coordinate system offsets. These modes may include, for example, a laser mode, a video mode, a contact probe mode, and a depth sensor mode.

[0049] For example, when setting up machine 100, the camera view can be manually positioned on different parts of the wafer, such as by switching a specific mode (e.g., "video" mode). Focus can then be applied to different areas within the image, such as by interacting with different areas within the interface (e.g., the "cutting path" pane) (e.g., by clicking). The xy stage can then move the workpiece so that this portion of the pattern is in the camera view. An example of this manual process is shown in Figure 2.

[0050] According to this disclosure, a galvanometer positioning mode can be added and alternatively used to manipulate alignment operations using a galvanometer reflector. In this regard, in response to switching to the galvanometer positioning mode (e.g., based on user input, etc.), and optionally based on interaction with the image (e.g., by clicking a specific area or point in the image within the "cutting path" pane), the galvanometer reflector can be used to aim the camera at a specific area of ​​the wafer without moving the xy stage. This is manipulated and accomplished by the laser control software. By performing video alignment in galvanometer positioning mode, the alignment operation can be performed using the same sequence of operations as before, except that the camera uses the galvanometer reflector for rapid aiming instead of slow positioning using xy stage movement. This is illustrated in Figures 4A and 4B. This rapid aiming of the camera results in improved performance because positioning and alignment are completed in a shorter overall time.

[0051] In some cases, additional measures can be used to address any potential limitations of using galvanometer positioning modes. For example, the range of motion in galvanometer positioning modes may be limited due to the range of galvanometer reflector angles that produce an acceptable image of the surface. Therefore, when aiming video using a galvanometer reflector, a scaling factor may need to be introduced because the center of the video field of view may not be perfectly aligned with the laser focus when the galvanometer reflector is off-center aimed. Thus, in some implementations, the laser annealing machine (e.g., machine 100) or, in particular, the laser control software used therein can be configured to determine and apply such a scaling factor.

[0052] Figure 2 illustrates an exemplary use case when utilizing video mode of laser control software in an exemplary laser annealing machine. Figure 2 shows a screenshot 200 comprising two separate image segments 210 and 220.

[0053] In this regard, screenshot 200 may correspond to or illustrate a specific mode that can be supported in or used via laser control software, which can be utilized in an exemplary laser annealing machine (such as the laser annealing machine 100 of FIG. 1). Specifically, within screenshot 200, image segment 210 illustrates an exemplary “video” mode associated with the laser control software, while image segment 220 represents an exemplary “cutting path” pane that can be used via the laser control software or otherwise made available in conjunction with the “video” mode. As described above, when setting up the laser annealing machine, the camera view can be manually positioned on different portions of the wafer by switching to “video” mode (image segment 210), and then a specific area within the view can be selected, for example, by clicking on different areas within the “cutting path” pane (image segment 220). The xy stage can then move the workpiece so that this portion of the pattern is in the camera view.

[0054] Figures 3A and 3B illustrate exemplary images taken using an integrated vision inspection system in an exemplary laser annealing machine. Figures 3A and 3B show images 300, 310, 320, and 330, which represent exemplary images taken using an integrated vision inspection system in a laser annealing machine (e.g., machine 100).

[0055] In this regard, laser annealing machines can be configured to utilize an integrated vision inspection system when managing laser annealing processes. For example, reference machine 100 can use a coaxial camera 114 to capture images 300 to 330. Specifically, images 300 to 330 represent images of a particular wafer 122 and portions thereof (e.g., the edges of the wafer, the transition region between the flat central portion of the wafer and the edge segment, etc.) when the wafer is processed within the annealing chamber 108 and, more specifically, when alignment and / or positioning-related processes are performed according to this disclosure.

[0056] In this regard, image 300 shows the left edge of the wafer. Image 310 shows a flat section of the wafer. Image 320 shows an edge section of the wafer, specifically showing a set of pixels (322) indicating the wafer edge location for detecting this edge section. Similarly, image 330 shows different edge sections of the wafer, specifically showing a set of pixels (332) indicating the wafer edge location for detecting this edge section.

[0057] Figures 4A and 4B illustrate exemplary use cases when performing center offset and rotational alignment. Figures 4A and 4B illustrate offset and alignment diagram 400, which can be used during exemplary center offset and exemplary rotational alignment in a laser annealing machine (e.g., machine 100) configured to utilize an integrated vision inspection system to manage laser annealing processes according to this disclosure.

[0058] The offset and alignment diagram 400 can be configured and / or used to position (e.g., center) and align a wafer during processing in a laser annealing machine. Specifically, the offset and alignment diagram 400 can be used in conjunction with captured images (e.g., images captured via coaxial camera 114). For example, when performing processes related to wafer positioning and wafer alignment, the offset and alignment diagram 400 can be used in conjunction with captured images via software in the system (e.g., laser control software). In this regard, the offset and alignment diagram 400 can, for example, overlay an image of the wafer (or a segment thereof) to enable wafer positioning and / or alignment.

[0059] As shown in Figure 4A, the offset and alignment diagram 400 may include a circle 402 having a center point 404. The offset and alignment diagram 400 may include a tangent 406 intersecting the circle 402 on one side (e.g., the side where the x-axis of the offset and alignment diagram 400 intersects the circle 402). To facilitate wafer positioning and / or alignment, a plurality of alignment points 408 along the circumference of the circle 402 and the tangent 406 may be used.

[0060] For example, as shown in Figure 4B, alignment point 408 can be used in conjunction with a galvanometer mirror to facilitate wafer positioning and alignment. During the exemplary use case, circular alignment can be performed on an offset wafer annealing process center position. This can be performed by moving the galvanometer mirror (e.g., within the scan head 112) (e.g., along circle 402) to be able to inspect and / or identify multiple circular alignment positions 410 (e.g., along different edge points of circle 402). Rotational alignment (e.g., for wafer annealing process orientation) can be performed. This can be achieved by moving the galvanometer mirror (e.g., along tangent 406) to be able to inspect and / or identify multiple linear alignment positions 420 (e.g., along tangent 406) on the wafer's flat surface to be able to calculate wafer orientation.

[0061] An exemplary system according to this disclosure includes: a laser annealing machine configured to apply laser annealing to a workpiece, wherein the laser annealing machine includes: one or more manipulation components for manipulating the workpiece; one or more processing components configured to apply laser annealing to the workpiece; an integrated vision inspection system including one or more vision sensing devices configured to acquire visual data associated with the workpiece and / or with applying laser annealing to the workpiece; and control circuitry configured to control the function or operation of the laser annealing machine and / or one or more components of the laser annealing machine; wherein applying laser annealing to each workpiece includes applying a scanning beam to the surface of the workpiece based on a scanning pattern; wherein the laser annealing machine is configured to provide visual positioning and alignment of the workpiece via the control circuitry to apply laser annealing; and wherein providing visual positioning and alignment of the workpiece includes: acquiring visual data representing the workpiece via at least one vision sensing device; and identifying one or more features or regions in the workpiece based on the acquired visual data to ensure that the workpiece is centered and aligned when the scanning beam is applied to the workpiece, wherein identification includes adjusting the operation of at least one processing component.

[0062] In an exemplary embodiment, one or more processing components include one or more scanning components configured to project a scanning beam onto the workpiece when laser annealing is applied to the workpiece.

[0063] In an exemplary embodiment, one or more scanning components include a laser source configured to provide a laser beam for applying laser annealing to a workpiece.

[0064] In an exemplary embodiment, one or more scanning components include a scanning head configured to project a scanning beam onto a workpiece using an input beam received from a beam source.

[0065] In an exemplary embodiment, the scanning head includes one or more optical components configured to guide an input beam to project the scanning beam onto a workpiece.

[0066] In an exemplary embodiment, one or more optical components include one or more galvanometer mirrors.

[0067] In an exemplary embodiment, at least one processing component is a scanning head, wherein adjusting at least one processing component includes moving at least one galvanometer mirror.

[0068] In an exemplary embodiment, at least one processing component includes a galvanometer reflector, wherein adjusting at least one processing component includes moving the galvanometer reflector.

[0069] In an exemplary embodiment, the control circuitry is configured to run software for controlling the application of laser annealing, wherein the software is configured to perform visual positioning and alignment of the workpiece.

[0070] In an exemplary embodiment, configuring the software includes modifying the software to support a dedicated mode that allows for adjustment of the operation of at least one processing component.

[0071] In an exemplary embodiment, when at least one processing component includes one or more galvanometer mirrors, the dedicated mode includes a galvanometer positioning mode.

[0072] In an exemplary embodiment, identifying one or more features in a workpiece or identifying one or more regions in a workpiece includes identifying the center of the workpiece.

[0073] In an exemplary embodiment, identifying the center of a workpiece includes identifying a plurality of circular alignment positions corresponding to different edge positions on the surface of the workpiece.

[0074] In an exemplary embodiment, identifying one or more features in a workpiece or identifying one or more regions in a workpiece includes identifying the orientation of the workpiece.

[0075] In an exemplary embodiment, identifying the orientation of a workpiece includes identifying multiple linear alignment positions on the surface of the workpiece.

[0076] In an exemplary embodiment, at least one visual sensing device includes a coaxial camera.

[0077] In an exemplary embodiment, one or more processing components include an annealing chamber configured to accommodate a workpiece when laser annealing is applied to it.

[0078] In an exemplary embodiment, one or more manipulation components include a robotic arm configured to move a workpiece to assist in the application of laser annealing.

[0079] In an exemplary embodiment, one or more manipulation components include one or more containers configured for storing workpieces.

[0080] In an exemplary embodiment, the workpiece includes a semiconductor wafer.

[0081] As used herein, “and / or” refers to any one or more items in a list connected by “and / or”. As an example, “x and / or y” refers to any element in the three-element set {(x), (y), (x, y)}. In other words, “x and / or y” means “one or both of x and y”. As another example, “x, y and / or z” refers to any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and / or z” means “one or more of x, y and z”. As used herein, the term “exemplary” means used as a non-limiting example, instance, or illustration. As used herein, the terms “for example” and “such as” list one or more non-limiting examples, instances, or illustrations.

[0082] As used herein, the terms “circuit system” and “circuit” refer to physical electronic components (e.g., hardware) and any software and / or firmware (“code”) that can configure, be executed by, and / or otherwise associate with the hardware. As used herein, for example, a particular processor and memory (e.g., volatile or non-volatile memory devices, general-purpose computer-readable media, etc.) may include a first “circuit” when executing one or more lines of first code, and may include a second “circuit” when executing one or more lines of second code. Additionally, a circuit may include analog and / or digital circuitry. Such circuitry may operate, for example, on analog and / or digital signals. It should be understood that a circuit may be in a single device or chip, on a single motherboard, in a single chassis, in multiple enclosures at a single geographic location, or in multiple enclosures distributed across multiple geographic locations. Similarly, the term “module” may, for example, refer to physical electronic components (e.g., hardware) and any software and / or firmware (“code”) that can configure, be executed by, and / or otherwise associate with the hardware.

[0083] As used in this article, a circuit or module is “operable” to perform a function, regardless of whether the function is disabled or not enabled (e.g., through user-configurable settings, factory adjustments, etc.), as long as the circuit or module includes the hardware and code necessary to perform the function (if necessary).

[0084] Other embodiments of the present invention may provide a non-transitory computer-readable medium and / or storage medium, and / or a non-transitory machine-readable medium and / or storage medium having stored machine code and / or a computer program having at least one code segment executable by a machine and / or a computer, thereby enabling the machine and / or the computer to perform the processes as described herein.

[0085] Therefore, various embodiments of the invention can be implemented in hardware, software, or a combination of hardware and software. The invention can be implemented in a centralized manner or in a distributed manner in at least one computing system, with different components distributed across several interconnected computing systems. Any kind of computing system or other device suitable for performing the methods described herein is appropriate. Typical implementations may include one or more application-specific integrated circuits (ASICs), one or more field-programmable gate arrays (FPGAs), and / or one or more processors (e.g., x86, x64, ARM, PIC, and / or any other suitable processor architecture) and associated supporting circuitry (e.g., memory, DRAM, flash memory, bus interface circuitry, etc.). Each discrete ASIC, FPGA, processor, or other circuit may be referred to as a "chip," and multiple such circuitry systems may be referred to as a "chipset." Another implementation may include a non-transitory machine-readable (e.g., computer-readable) medium (e.g., a flash drive, optical disk, or magnetic storage disk, etc.) storing one or more lines of code that, when executed by a machine, causes the machine to perform the processes described in this disclosure. Another implementation may include a non-transitory machine-readable (e.g., computer-readable) medium (e.g., flash drive, optical disk, magnetic storage disk, etc.) storing one or more lines of code that, when executed by the machine, configures the machine to operate as the system described in this disclosure (e.g., load software and / or firmware into its circuitry).

[0086] Various implementations of the invention can also be embedded in a computer program product that includes all the features capable of implementing the methods described herein and capable of executing those methods when the computer program product is loaded into a computer system. In this context, a computer program means any expression of a set of instructions represented in any language, code, or notation, intended to cause an information-processing system to perform a particular function directly or after any one or both of the following: a) being translated into another language, code, or notation; or b) being copied in a different material form.

[0087] While this method and / or system has been described with reference to certain implementations, those skilled in the art will understand that various changes and substitutions can be made without departing from the scope of this method and / or system. Furthermore, many modifications can be made to adapt particular situations or materials to the teachings of this disclosure without departing from the scope of this disclosure. Therefore, it is intended that this method and / or system be limited to the specific implementations disclosed, but rather that this method and / or system encompass all implementations falling within the scope of the appended claims.

Claims

1. A system for positioning and aligning a wafer using machine vision to apply a laser pattern, comprising: A laser annealing machine configured to apply laser annealing to a workpiece, wherein the laser annealing machine includes: one or more manipulation components for manipulating the workpiece; one or more processing components configured to apply laser annealing to the workpiece; an integrated vision inspection system including one or more vision sensing devices configured to acquire visual data associated with the workpiece and / or with the laser annealing applied to the workpiece; and control circuitry configured to control the function or operation of the laser annealing machine and / or the function or operation of one or more components of the laser annealing machine; wherein applying laser annealing to each workpiece includes applying a scanning beam to the surface of the workpiece based on a scanning pattern; wherein the laser annealing machine is configured to provide visual positioning and alignment of the workpiece via the control circuitry to apply laser annealing; and wherein providing visual positioning and alignment of the workpiece includes: acquiring visual data representing the workpiece via at least one of the vision sensing devices; and identifying one or more features or regions in the workpiece based on the acquired visual data to ensure that the workpiece is centered and aligned when the scanning beam is applied to the workpiece, wherein the identification includes adjusting the operation of at least one processing component.

2. The system according to claim 1, wherein, One or more of the processing components include one or more scanning components configured to project the scanning beam onto the workpiece when laser annealing is applied to the workpiece.

3. The system according to claim 2, wherein, One or more of the scanning components include a laser source configured to provide a laser beam for applying laser annealing to a workpiece.

4. The system according to claim 2, wherein, One or more of the scanning components include a scanning head configured to project the scanning beam onto the workpiece using an input beam received from a beam source.

5. The system according to claim 4, wherein, The scanning head includes one or more optical components configured to guide the input beam to project the scanning beam onto the workpiece.

6. The system according to claim 5, wherein, One or more of the optical components include one or more galvanometers and reflectors.

7. The system according to claim 6, wherein, At least one of the processing components is the scanning head, and wherein adjusting at least one of the processing components includes moving at least one galvanometer mirror.

8. The system according to claim 1, wherein, At least one of the processing components includes a galvanometer reflector, and wherein adjusting at least one of the processing components includes moving the galvanometer reflector.

9. The system according to claim 1, wherein, The control circuit is configured to run software for controlling the application of laser annealing, wherein the software is configured to perform visual positioning and alignment of the workpiece.

10. The system according to claim 9, wherein, Configuring the software includes modifying the software to support a dedicated mode that allows for adjustments to the operation of at least one of the processing components.

11. The system according to claim 10, wherein, When at least one of the processing components includes one or more galvanometer mirrors, the dedicated mode includes a galvanometer positioning mode.

12. The system according to claim 1, wherein, Identifying one or more features or regions in a workpiece, including identifying the center of the workpiece.

13. The system according to claim 12, wherein, Identifying the center of a workpiece involves identifying multiple circular alignment positions corresponding to different edge positions on the workpiece surface.

14. The system according to claim 1, wherein, Identifying one or more features or regions in a workpiece includes identifying the orientation of the workpiece.

15. The system according to claim 14, wherein, Identifying the orientation of a workpiece involves identifying multiple linear alignment positions on the surface of the workpiece.

16. The system according to claim 1, wherein, At least one of the visual sensing devices includes a coaxial camera.

17. The system according to claim 1, wherein, One or more of the processing components include an annealing chamber configured to accommodate a workpiece when laser annealing is applied to it.

18. The system according to claim 1, wherein, One or more of the manipulation components include a robotic arm configured to move a workpiece to assist in the application of laser annealing.

19. The system according to claim 1, wherein, One or more of the said manipulation components include one or more containers configured for storing workpieces.

20. The system according to claim 1, wherein, The workpiece includes semiconductor wafers.

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