Marking device, marking method, semiconductor wafer, and semiconductor chip

Abstract

In order to prevent a predetermined mark applied to a semiconductor wafer or a semiconductor chip from being unable to be read later, a marking device (EA) for applying a predetermined mark (MK) to a semiconductor wafer (WF) or a semiconductor chip (CP) is provided with: a marking means (10) for applying the predetermined mark (MK) to the semiconductor wafer (WF) or the semiconductor chip (CP); and a coating unit (20) that provides a coating material (AS) so as to cover a predetermined mark (MK) applied to the semiconductor wafer (WF) or the semiconductor chip (CP).

Description

Marking apparatus, marking method, semiconductor wafer, and semiconductor chip Technical Field

[0001] This invention relates to a marking device, a marking method, a semiconductor wafer, and a semiconductor chip. Background Technology

[0002] A marking device for applying a predetermined mark to a semiconductor wafer is known (see, for example, Patent Document 1).

[0003] Prior art literature, patent literature, patent literature 1: Japanese Patent Application Publication No. 2016-112579 Summary of the Invention

[0004] (a) Technical problem to be solved: In the laser processing apparatus (marking device) described in Patent Document 1, the ID mark 110, anti-counterfeiting mark 110 and other marks (predetermined marks) assigned to the semiconductor wafer 10 (semiconductor wafer) are kept exposed, which causes the following inconvenience: the predetermined mark is deformed or disappears due to contact with other objects or the presence of liquid, and thus cannot be read in the future.

[0005] The purpose of this invention is to provide a marking device, marking method, semiconductor wafer, and semiconductor chip that can prevent the inability to read predetermined marks assigned to a semiconductor wafer or semiconductor chip later.

[0006] (II) Technical Solution The present invention adopts the structure described in the claims.

[0007] (iii) Beneficial effects According to the present invention, since the coating material is provided in such a way as to cover the predetermined mark given to the semiconductor wafer or semiconductor chip, the predetermined mark will not be exposed, thereby preventing the predetermined mark given to the semiconductor wafer or semiconductor chip from being unreadable later. Attached Figure Description

[0008] Figures 1(A) to (D) are explanatory diagrams of a marking device, a semiconductor wafer, and a semiconductor chip according to one embodiment of the present invention. Figures 1(E) to (H) are explanatory diagrams of a modified example. Detailed Implementation

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0010] Furthermore, in this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other. The X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Moreover, in this embodiment, based on the view from the near-forward direction in Figure 1 (A), when the direction is displayed without specifying a figure, "up" is the arrow direction of the Z-axis, and "down" is the opposite direction of "up"; "left" is the arrow direction of the X-axis, and "right" is the opposite direction of "left"; "forward" is the arrow direction of the Y-axis, and "backward" is the opposite direction of "forward".

[0011] The marking apparatus EA for implementing the marking method of the present invention is an apparatus for applying a predetermined mark MK (see Figure 1(B)) to a semiconductor wafer (hereinafter also simply referred to as "wafer") WF. The marking apparatus EA includes: a marking unit 10 that performs a marking step in which the marking step applies the predetermined mark MK to the wafer WF; a coating unit 20 that performs a coating step in which an adhesive sheet AS, which is a coating material, is disposed to cover the predetermined mark MK applied to the wafer WF; an energy imparting unit 30 that performs an energy imparting step in which ultraviolet light UV, which is an energy of predetermined energy, is imparted to the adhesive sheet AS; and an imaging unit 40 that performs an imaging step in which the imaging step captures the predetermined mark MK to form a marking image and outputs the marking image to another device. The marking apparatus EA is disposed above a moving unit 50, which transports the wafer WF.

[0012] Furthermore, in this embodiment, a preliminary wafer AS1 is stacked on one side of the wafer WF as a laminate, and the marking unit 10 assigns a predetermined mark MK to the preliminary wafer AS1, thereby assigning the predetermined mark MK to the wafer WF via the preliminary wafer AS1.

[0013] Furthermore, the adhesive sheet AS undergoes a hardening process due to the application of ultraviolet (UV) light, resulting in a change characteristic of that UV light.

[0014] The marking unit 10 includes: an XY stage 11 as a drive device, which enables the slider 11A to move in the front-back direction and the left-right direction; and an inkjet printer 12 as a marking device, which is supported by the slider 11A. The marking unit 10 prints a predetermined mark MK on the adhesive sheet AS.

[0015] As shown in Figures (C) of Figure 1, the predetermined mark MK printed by the inkjet printer 12 becomes an irregular outer edge shape when viewed under magnification, and there are multiple unspecified scattered marks SM around it. Due to the irregular outer edge shape and the scattered marks SM, each has its own different characteristics.

[0016] The coating unit 20 includes: a base plate 21 that directly or indirectly supports the structures constituting the coating unit 20; a support roller 22 that supports the raw material sheet RS, which is obtained by temporarily attaching an adhesive sheet AS to a strip-shaped release sheet RL; a guide roller 23 that guides the raw material sheet RS; a release plate 24 as a release unit that folds back the release sheet RL through a release edge 24A and peels the adhesive sheet AS from the release sheet RL; a pressing roller 25 as a pressing unit that presses and attaches the adhesive sheet AS to the wafer WF; a drive roller 26 that is supported on an output shaft (not shown) of a rotary motor 26A as a drive device, and clamps the release sheet RL by the drive roller 26 and a pinch roller 26B; and a recovery roller 27 as a recovery unit that is supported on the output shaft of a drive device (not shown), and during the automatic operation of the marking device EA, always applies a predetermined tension to the release sheet RL present between the recovery roller 27 and the pinch roller 26B, and recovers the release sheet RL.

[0017] The energy-generating unit 30 includes an ultraviolet emitter 31 that emits ultraviolet (UV) light.

[0018] The shooting unit 40 is equipped with a camera 41 and shoots a predetermined mark MK, thereby also shooting the irregular outer edge shape of the predetermined mark MK and even shooting scattered marks SM, and capturing the different features of each predetermined mark MK to form a mark image.

[0019] The imaging unit 40 of this embodiment outputs the marked image to other devices, thereby enabling the other devices to perform specific processing on the wafer WF.

[0020] The moving unit 50 includes: a linear motor 51 as a drive device; and a support platform 52, which is supported by the slider 51A of the linear motor 51 and has a support surface 52A, which can be held by adsorption by a pressure reducing unit (holding unit) not shown, such as a pressure reducing pump or a vacuum ejector.

[0021] Explain the operation of the marking device EA described above.

[0022] First, regarding the marking device EA, which positions each component in the initial position shown by the solid line in Figure 1(A), the user of the marking device EA (hereinafter referred to as "the user") places the raw material wafer RS ​​as shown in Figure 1(A) and inputs a signal to start automatic operation via an operation unit (not shown) such as an operation panel or personal computer. Then, the coating unit 20 drives the rotary motor 26A to pull out the raw material wafer RS. If the front end of the adhesive sheet AS at the front end, as shown in Figure 1(A), is peeled off from the peeling sheet RL at the fold-back portion of the peeling sheet RL folded back by the peeling edge 24A of the peeling plate 24 by a predetermined length, the drive of the rotary motor 26A is stopped. Next, if the user, a multi-joint robot, or a conveyor unit (not shown) places the wafer WF on the support stage 52 with the lead wafer AS1 facing upwards as shown in Figure 1(A), the moving unit 50 drives the decompression unit (not shown) to start the adsorption holding on the support surface 52A.

[0023] Subsequently, the moving unit 50 drives the linear motor 51 to move the wafer WF supported by the support stage 52 to the right. If the wafer WF reaches the predetermined mark assignment position MP, the driving of the linear motor 51 is stopped. The predetermined mark assignment position MP is the position where a predetermined mark MK can be assigned by the marking unit 10. Next, the marking unit 10 drives the XY stage 11 and the inkjet printer 12 to print the predetermined mark MK on the pre-drilled wafer AS1. Furthermore, in this embodiment, the predetermined mark MK is a predetermined symbol composed of arbitrary numbers and characters. When the wafer WF is subsequently monolithized along the cutting line CL shown in FIG1 (B) to become multiple semiconductor chips (hereinafter also referred to as "chips") CP as shown in FIG1 (D), the marking unit 10 prints the predetermined mark MK in such a way that the predetermined mark MK is assigned to the predetermined position of each chip CP.

[0024] Then, if the predetermined mark MK is applied by the marking unit 10, the moving unit 50 drives the linear motor 51 to move the wafer WF to the right. If the wafer WF reaches a predetermined position relative to the coating unit 20, the coating unit 20 drives the rotary motor 26A to pull out the raw material wafer RS ​​in accordance with the moving speed of the wafer WF. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the fold-back portion (as shown by the double-dotted line in Figure 1(A)) and pressed and attached to the wafer WF by the pressing roller 25. Next, the entire front adhesive sheet AS is attached to the wafer WF. If the front end of the next adhesive sheet AS following the front adhesive sheet AS is peeled off from the release sheet RL at the fold-back portion of the release sheet RL by a predetermined length in the pulling direction, the coating unit 20 stops driving the rotary motor 26A.

[0025] Subsequently, if the wafer WF conveyed by the moving unit 50 reaches a predetermined position relative to the energy imparting unit 30, the energy imparting unit 30 drives the ultraviolet emitter 31 to emit ultraviolet (UV) light and impart UV light to the adhesive sheet AS. As a result, the adhesive sheet AS hardens. Once the entire adhesive sheet AS has been imparted with UV light, the energy imparting unit 30 stops driving the ultraviolet emitter 31. Next, if the wafer WF conveyed by the moving unit 50 reaches the imaging position RP, the imaging unit 40 drives the camera 41 to capture a predetermined mark MK to form a mark image. The imaging position RP is the location where the imaging unit 40 can capture the predetermined mark MK.

[0026] Then, as shown by the double-dotted line in Figure 1(A), if the support stage 52 reaches the predetermined position at the right end of the linear motor 51, the moving unit 50 stops driving the linear motor 51 and then stops driving the decompression unit (not shown), releasing the adsorption holding on the support surface 52A. Next, if the user or the transport unit (not shown) holds the wafer WF and transports the wafer WF to the next step, the moving unit 50 drives the linear motor 51 to return the support stage 52 to its initial position, and then repeats the same operation as described above.

[0027] Furthermore, in this embodiment, after the wafer WF is transported to the next step, the marking image output by the imaging unit 40 is used in a manner shared with other devices after the next step. That is, after the wafer WF is transported to the next step, other devices processing the wafer WF capture predetermined marks MK to form other marking images, and compare the marking images with other marking images through these other devices, thereby enabling specific processing of the wafer WF, such as counterfeit detection of the wafer WF and selection of the wafer WF processing method.

[0028] According to the embodiment described above, since the adhesive sheet AS is set in such a way as to cover the predetermined mark MK applied to the wafer WF, the predetermined mark MK will not be exposed, thereby preventing the predetermined mark MK applied to the wafer WF from being unreadable later.

[0029] The units and steps in this invention are not limited in any way as long as they can realize the actions, functions, or steps described therein, and are not limited to the constructions or steps of a single embodiment shown in the described embodiments. For example, a marking unit can be any component as long as it can assign a predetermined mark to a semiconductor wafer or semiconductor chip; there are no limitations as long as it is within the technical scope of this invention with reference to the common knowledge of the art at the time of application (the same applies to other units and steps).

[0030] Alternatively, the marking device EA of the present invention can be used to apply a predetermined mark MK to a semiconductor chip CP. The marking device EA includes: a marking unit 10 that performs a marking step, which applies the predetermined mark MK to the semiconductor chip CP; and a coating unit 20 that performs a coating step, which sets an adhesive sheet AS as a coating material to cover the predetermined mark MK applied to the semiconductor chip CP.

[0031] According to this marking device EA, the same effect as the above-described embodiment can be produced. In this case, a preliminary wafer AS1 may be stacked on the semiconductor chip CP as a laminate, and the marking unit 10 may assign a predetermined mark MK to the preliminary wafer AS1, thereby enabling the semiconductor chip CP to be assigned the predetermined mark MK via the preliminary wafer AS1.

[0032] Furthermore, as shown in FIG1(B), the semiconductor wafer WF of the present invention can exemplify a semiconductor wafer with a predetermined mark MK, the predetermined mark MK being covered by an adhesive sheet AS as a coating material. By manufacturing such a semiconductor wafer WF, the same effects as in the embodiments described above can also be achieved.

[0033] Furthermore, as shown in FIG1(D), the semiconductor chip CP of the present invention can exemplify a semiconductor chip having a predetermined mark MK, the predetermined mark MK being covered by an adhesive sheet AS as a coating material. By providing such a semiconductor chip CP, the same effects as in the embodiments described above can also be achieved.

[0034] The marking unit 10 can use, for example, a laser printer, letterpress printing machine, gravure printing machine, offset printing machine, screen printing, stencil printing, thermal printer, thermal transfer printer, dot matrix printing, etc., as marking equipment. As long as a predetermined mark MK can be assigned, any component can be used. As shown in Figure 1 (E), the predetermined mark MK can be assigned directly to the wafer WF, or only to the wafer WF or the chip CP, or only to the lead wafer AS1, or to both the wafer WF and the lead wafer AS1, or to both the chip CP and the lead wafer AS1. The predetermined mark MK can also be assigned to the wafer WF or the chip CP as a symbol, number, text, graphic, pattern, mark, etc., such as a logo, number, text, graphic, pattern, mark, etc. The predetermined mark MK can also be assigned to the wafer WF or the chip CP for anti-counterfeiting purposes. The predetermined mark can also be assigned without stopping the movement of the support stage 52 by the moving unit 50. The MK can be a single marking device, multiple marking devices of the same type, or multiple marking devices of different types. It may not have a drive device to move the components used as marking devices. The predetermined mark MK can be given in a way that the scattered mark SM appears, or the predetermined mark MK can be given in a way that the scattered mark SM does not appear. For example, as shown in the upper part of (E) and the upper part of (F) in FIG1, the predetermined mark MK can be given across each cut line CL. As shown in the lower part of (E) in FIG1, the predetermined mark MK can be given outside the cut line CL. As shown in the lower part of (F) in FIG1, one or more predetermined marks MK can be given inside the cut line CL. Or, when the wafer is monolithized along the cut line CL to become multiple chips CP, the predetermined mark MK can be given without giving each chip CP a predetermined mark MK. When a laser printer is used as the marking device, the predetermined mark MK can also be given by changing or developing the color of the laminate, wafer WF, or chip CP.

[0035] The coating unit 20 can be attached by forming a closed-loop or integral cut in the short-width direction on the strip-shaped adhesive sheet substrate temporarily bonded to the strip-shaped release tab RL, thereby peeling the adhesive sheet AS from the raw material sheet RS, which serves as the adhesive sheet AS in a predetermined area divided by the cut; alternatively, a strip-shaped adhesive sheet raw material sheet on which the strip-shaped adhesive sheet substrate is temporarily bonded to the strip-shaped release tab RL can be used, and a cutting blade, which serves as a cutting unit, can be used to form a cut on the adhesive sheet substrate during the pulling out of the strip-shaped adhesive sheet raw material sheet. A closed-loop or short-width integral cut is made, and the adhesive sheet AS is peeled off from the raw material sheet RS, which serves as the adhesive sheet AS in the predetermined area divided by the cut, and then attached. Alternatively, the strip adhesive sheet AS can be peeled off from the raw material sheet RS, to which the strip adhesive sheet AS is temporarily bonded on a strip release sheet RL, and then attached. Alternatively, when attaching the adhesive sheet AS to the wafer WF or chip CP, the attachment tension can be controlled, which controls the speed and tension of the pulled-out raw material sheet RS to apply the adhesive sheet AS. The adhesive sheet AS can be attached by applying a predetermined tension or no tension; it can also be attached by peeling it off from a fan-shaped folded raw material sheet RS without winding; a pressing unit with the following structure can be used, which is supported on the output shaft of a linear motor that serves as a drive device, and uses a holding member that can be held by adsorption by a pressure reducing unit (not shown) such as a pressure reducing pump or a vacuum ejector to hold the adhesive sheet AS, and presses and attaches the adhesive sheet AS held by the holding member to the wafer WF or chip CP; a recycling unit can also be used, which does not wind, but rather recycles the stripping sheet RL by fan-shaped folding, crushing by a shredder, or random stacking; a recycling unit can also be omitted; the adhesive sheet AS can be attached to the wafer WF or chip CP by moving the stripping plate 24, pressing roller 25, drive roller 26, etc. without moving the wafer WF or chip CP or by moving the wafer WF or chip CP; the adhesive sheet AS that is not temporarily attached to the stripping sheet RL can also be used.

[0036] The coating unit 20 may use materials such as adhesive sheets, adhesive pads, resin materials, coatings, varnishes, rubber, adhesives, resin boards, or metal plates as coating materials; the coating unit 20 may also use sheet attaching devices or sheet stacking devices that provide adhesive sheets or adhesive pads, sprayers or transfer rollers that provide resin materials, coatings, varnishes, rubber, adhesives, or adhesives, or stacking machines or loading devices that provide resin boards or metal plates; the coating unit 20 may also provide coating materials in a manner that covers the entire predetermined mark MK, or in a manner that covers a portion of the predetermined mark MK.

[0037] The energy imparting unit 30 can also be located at a location other than that shown in the embodiment. As long as it is a location that can impart predetermined energy to the adhesive sheet AS, it can be located anywhere. The predetermined energy can be imparted without stopping the movement of the support table 52 by the moving unit 50, or it can be imparted when the moving unit 50 stops moving the support table 52. The energy imparting unit 30 can also be a component that imparts electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, a component that imparts heat media such as hot water or hot air, a component that imparts cold media such as cold water or cold air, or any other component that imparts energy as the predetermined energy. The energy imparting unit 30 can be any component as long as it can cause the coated material to produce a change unique to the energy, taking into account the characteristics, properties, properties, materials, composition and structure of the coated material. The energy imparting unit 30 can be included in the marking device EA of the present invention, or it can be not included in the marking device EA of the present invention.

[0038] The imaging unit 40 can capture the entire predetermined mark MK to form a mark image, or capture a portion of the predetermined mark MK to form a mark image. It can also capture the predetermined mark MK using an optical sensor to form a mark image. Alternatively, the moving unit 50 can stop the movement of the support platform 52 and capture the predetermined mark MK to form a mark image. It can also capture the dispersed marks SM to form a mark image, or it can form a mark image without capturing the dispersed marks SM. It can also capture the predetermined mark MK to form a mark image before the covering unit 20 covers the predetermined mark MK with the adhesive sheet AS. The imaging unit 40 can be included in the marking device EA of the present invention, or it can be not included in the marking device EA of the present invention.

[0039] The moving unit 50 may also be a support platform 52 that cannot be held by the support surface 52A; the moving unit 50 may or may not be included in the marking device EA of the present invention.

[0040] The marking device EA may also include a stacking unit that performs a stacking step to stack a material onto a semiconductor wafer WF or a semiconductor chip CP. In this case, for example, in the marking device EA described above, the material can be stacked onto the semiconductor wafer WF by the stacking unit after the semiconductor wafer WF without a material is placed on the support surface 52A and before the wafer WF reaches the predetermined marking position MP.

[0041] The covering material can be transparent, semi-transparent, or opaque. If the covering material is opaque, the shooting unit 40 can simply use a camera 41 that can see through the covering material to shoot the predetermined mark MK.

[0042] Furthermore, when using a predetermined mark MK for anti-counterfeiting, as long as a transparent or semi-transparent coating material is provided to cover part or all of the predetermined mark MK, even if one wants to read and copy the predetermined mark MK, it is difficult to copy the predetermined mark MK because the coating material is read depending on the reading device that reads the predetermined mark MK. Alternatively, the image of the predetermined mark MK read becomes complex due to light reflection and refraction based on the coating material, making optical recognition-based copying difficult, thus improving the anti-counterfeiting effect. Moreover, when the coating material is provided to cover only a portion of the predetermined mark MK, even if the coating material needs to be read to reproduce light reflection and refraction, it is difficult to identify the boundary between the coating material and the predetermined mark MK, thereby improving the anti-counterfeiting effect.

[0043] The changes characteristic of the predetermined energy produced by the coating material, as well as changes characteristic of other energies, can be any changes such as hardening, softening, shrinking, expanding, vaporizing, liquefying, curing, discoloration, oxidation, penetration, fixing, decrease in adhesion or increase in adhesion, etc.

[0044] The laminate can be any component such as an adhesive sheet, adhesive pad, resin material, coating, varnish, rubber, adhesive, resin board, metal plate, etc. It can be laminated only on one side of the wafer WF or chip CP, only on the other side of the wafer WF or chip CP, or on both sides of the wafer WF or chip CP. It can also be not laminated on the wafer WF or chip CP. It can also be laminated on the wafer WF or chip CP after a predetermined mark MK is applied to the wafer WF or chip CP. It can also be a structure that produces a change specific to the predetermined energy by the predetermined energy applied by the energy application unit 30. It can also be a structure that produces a change specific to the other energy by other energy applied by other energy application units. In this case, the marking device EA can also have other energy application units.

[0045] The changes in a laminate produced by a predetermined energy or other energy, which are specific to that predetermined energy, can be any changes such as hardening, softening, shrinking, expanding, vaporizing, liquefying, solidifying, discoloration, oxidation, penetration, fixing, reduction or increase of adhesive strength.

[0046] The predetermined mark MK can be a structure that produces a change specific to the predetermined energy by the predetermined energy supplied by the energy supply unit 30, or it can be a structure that produces a change specific to the other energy supplied by other energy supply units. In this case, the marking device EA can also have other energy supply units.

[0047] Furthermore, the changes specific to the predetermined energy generated by the predetermined mark MK, as well as changes specific to other energies, can be any changes such as hardening, softening, shrinking, expanding, vaporizing, liquefying, curing, discoloration, oxidation, penetration, fixing, reduction of adhesion or increase of adhesion.

[0048] The predefined mark MK can be used for random anti-counterfeiting based on optical identification using detection devices such as cameras and sensors.

[0049] When comparing a predetermined marker MK, one can compare a part or all of the marker image itself, or compare features extracted from a part or all of the marker image such as shape, size, position, quantity, configuration, spacing, color, brightness, contrast, etc., or compare feature quantities obtained by quantifying such features.

[0050] Dispersed markers (SM) can contain both markers that can be identified by the naked eye and markers that cannot be identified by the naked eye, or they can contain only markers that can be identified by the naked eye, or only markers that cannot be identified by the naked eye.

[0051] The wafer WF can be cut along the cut line CL from the state shown in the upper part of Figure 1 (E) to form the chip CP shown in Figure 1 (G), or it can be cut along the cut line CL from the state shown in the upper part of Figure 1 (F) to form the chip CP shown in Figure 1 (H). An orientation plane and V-notch indicating the orientation can be formed on the outer edge, or no orientation plane and V-notch can be formed on the outer edge. A circuit can be formed, or no circuit can be formed.

[0052] The chip CP can be given predetermined markings MK as shown in (G) and (H) of Figure 1, for example, without cutting the wafer WF along the cut line CL, and can be formed into a circuit or not.

[0053] The next step can be any step, such as plating, cleaning, etching, immersion, cutting, oxide film formation, nitriding, grinding, sandblasting, polishing, coating, lamination, sheet bonding, surface treatment, perforation, bending, inspection, verification, irradiation, etc.

[0054] Other devices can be any device as long as the next step is implemented. They can be directly or indirectly connected to the marking device EA, or they can be not directly or indirectly connected to the marking device EA. For example, they can be located in the same building, the same site, or other buildings where the marking device EA exists, or in the building or site at the shipping destination of the shipped wafer WF or chip CP, even if they are not directly or indirectly connected to the marking device EA.

[0055] In the next step, another device that processes the chip CP may capture a predetermined mark MK assigned to the chip CP and form other mark images. The other device may then compare the mark images or features or feature quantities extracted from the mark images with other mark images or features or feature quantities extracted from other mark images, and determine specific processing for the chip CP. Such specific processing may include counterfeit detection of the chip CP or selection of the processing method of the chip CP.

[0056] The materials, types, and shapes of the coating materials, laminates, wafers (WF), and chips (CP) in this invention are not particularly limited. For example, the coating materials, laminates, wafers (WF), and chips (CP) can be circular, elliptical, polygonal (such as triangular or quadrilateral), or other shapes; at least one of the coating materials and laminates can also be components with pressure-sensitive adhesive, heat-sensitive adhesive, or other adhesive forms; when using components with heat-sensitive adhesive forms, coating or lamination can be performed by appropriate methods such as providing a heating unit with a suitable coil heater, a heating side of a heat pipe, etc., and the heating unit heats the component with the heat-sensitive adhesive form. Furthermore, when adhesive sheets or adhesive pads are used as such coating materials or laminates, these adhesive sheets or adhesive pads can have any structure, such as a single-layer structure consisting only of an adhesive layer or adhesive layer, a two-layer structure consisting of a substrate and an adhesive layer or a substrate and an adhesive layer, a three-layer or more structure consisting of one or more intermediate layers stacked between the substrate and the adhesive layer or between the substrate and the adhesive layer, a three-layer or more structure consisting of one or more cover layers stacked on the upper surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer are peelably provided, a single-layer double-sided adhesive sheet or double-sided adhesive pad consisting only of an adhesive layer or adhesive layer, or a double-sided adhesive sheet or double-sided adhesive pad consisting of an adhesive layer or adhesive layer stacked on the two outermost surfaces of one or more intermediate layers, etc. Moreover, as a wafer (WF), examples include silicon semiconductor wafers, compound semiconductor wafers, etc.; as a semiconductor chip (CP), examples include silicon semiconductor chips, compound semiconductor chips, etc.

[0057] The coating material or laminate can be any sheet, film, or tape, such as information recording labels, decorative labels, protective sheets, cutting tapes, chip bonding films, chip bonding tapes, or recording layer forming resin sheets.

[0058] The size relationships in the coating material, stack, and wafer (WF) and the chip (CP) can be any size relationship, such as one of them being the largest, all being the same size, any two of them being the same size, or all being different sizes.

[0059] The drive device in the described embodiment may be an electric device such as a rotary motor, linear motor, linear motor, single-axis robot, so-called multi-joint robot with two or more axes, cylinder, hydraulic cylinder, rodless cylinder and rotary cylinder actuator, or a component that directly or indirectly combines these electric devices and actuators. It may also be a component that can perform torque control, speed control, etc. on the output of these electric devices and actuators, or a component that cannot perform torque control, speed control, etc. on the output of these electric devices and actuators.

[0060] In the described embodiment, the relative movement of an object (hereinafter referred to as "object A") and an object moving relative to object A (hereinafter referred to as "object B") can be either object B moving relative to object A (which is not moving), object A moving relative to object B (which is not moving), or both object A and object B moving. As long as the result of the movement is the same, either object A or object B can move. When a rotating component such as a roller is used, a drive device for rotating the rotating component can also be provided, and the rotating component can be constructed from deformable components such as rubber or resin. The surface and rotating parts themselves can be made of non-deformable parts, or other parts such as rotating or non-rotating shafts or blades can be used to replace the rollers. When pressing units or pressing parts such as pressing rollers or pressing heads are used to press the object being pressed, in addition to rollers, round rods, blades, or brush-like parts, parts that spray air or other gases can be used to replace the parts illustrated above or used together with the parts illustrated above. The pressing parts can also be made of deformable parts such as rubber, resin, or sponge, or non-deformable parts such as metal or glass. The pressing component; when using a peeling unit or peeling component such as a peeling plate or peeling roller for peeling off the object to be peeled, a plate-shaped component, a round rod, a roller, or other component may be used to replace or be used in conjunction with the components illustrated above. The peeling component may be made of a deformable component such as rubber or resin, or it may be made of a non-deformable component. When using a support (holding) unit or support (holding) component for supporting (holding) the supported component (held component), a holding unit such as a chuck motor or chuck cylinder, coulomb force, or adhesive may be used. Structures that support (hold) supported components, such as adhesive sheets, adhesive tapes, adhesives (adhesive sheets, adhesive tapes), magnetism, Bernoulli adsorption, suction adsorption, and drive devices; when using components for cutting off components such as cutting units or cutting parts, or when forming cuts or cutting lines on components, components that cut by means of blades, laser cutting, ion beams, fire, heat, water pressure, electric heating wires, gas, liquid, etc., can be used to replace or in conjunction with the components illustrated above, or components that move the cutting part by incorporating appropriate drive devices can be used for cutting.

[0061] Explanation of reference numerals: EA: Marking device; 10: Marking unit; 20: Coating unit; 30: Energy imparting unit; 40: Imaging unit; AS: Adhesive sheet (coating material); AS1: Pre-formed sheet (laminated material); CP: Semiconductor chip; MK: Pre-marked; UV: Ultraviolet light (pre-defined energy); WF: Semiconductor wafer.

Claims

1. A marking device for applying a predetermined mark to a semiconductor wafer or semiconductor chip, characterized in that, The marking device includes: a marking unit that applies the predetermined mark to the semiconductor wafer or the semiconductor chip; and a coating unit that applies a coating material to cover the predetermined mark applied to the semiconductor wafer or the semiconductor chip.

2. The marking device according to claim 1, characterized in that, A stacked material is stacked on the semiconductor wafer or the semiconductor chip; the marking unit assigns the predetermined mark to the stacked material, thereby assigning the predetermined mark to the semiconductor wafer or the semiconductor chip via the stacked material.

3. The marking device according to claim 1 or 2, characterized in that, The coating material produces a change characteristic of the predetermined energy by being given a predetermined energy; the marking device includes an energy-giving unit that applies the predetermined energy to the coating material.

4. The marking device according to claim 1 or 2, characterized in that, The device includes a camera unit that captures images of the predetermined markers to form marker images and outputs the marker images to other devices.

5. A marking method for assigning a predetermined mark to a semiconductor wafer or semiconductor chip, characterized in that, The marking method includes a marking step, which assigns the predetermined mark to the semiconductor wafer or the semiconductor chip. And a coating step, which applies a coating material in a manner that covers the predetermined markings assigned to the semiconductor wafer or the semiconductor chip.

6. A semiconductor wafer, which is marked with a predetermined mark, characterized in that, The predetermined mark is covered by a coating material.

7. A semiconductor chip, which is marked with a predetermined mark, characterized in that, The predetermined mark is covered by a coating material.

Images