Pin lifter with positioning compensation

Abstract

A pin lifting device (10) is configured for moving and positioning a substrate (1) to be processed in a processing atmosphere area (P), the pin lifting device (10) comprising a lifting unit having a mount (11) configured to hold at least one lifting pin (7a-7c) and a drive unit (14) connected to the mount (11) and interacting with the mount (11), the mounting (11) is movable along the movement axis (M) from a lowered normal position into a raised raised position and back again. The pin lifting device (10) comprises an adjustment structure (21) configured to interact with the lifting unit and an actuation unit (22) coupled to the adjustment structure (21) and to the lifting unit such that a movement of the adjustment structure (21) relative to the lifting unit according to at least one degree of freedom different from a mobility along a movement axis (M) can be provided.

Description

Pin lifter with positioning compensation

[0001] The present invention relates to a pin lift device for moving and positioning a substrate in a processing chamber.

[0002] Pin lifting devices (also known as pin lifters) are typically designed and configured to receive the substrate to be processed in a processing chamber and position it in a defined manner within the processing chamber. These devices are exemplarily used in vacuum chamber systems in the fields of IC, semiconductor, flat panel, or substrate manufacturing, which must be carried out in a protective atmosphere free of contaminating particles.

[0003] Such a vacuum chamber system specifically includes at least one evacuable vacuum chamber configured to receive semiconductor elements or substrates to be processed or produced, and has at least one vacuum chamber opening through which the semiconductor element or other substrate can be guided into and out of the vacuum chamber. For example, in a manufacturing plant for semiconductor wafers or liquid crystal substrates, highly sensitive semiconductor or liquid crystal elements sequentially pass through several processing vacuum chambers, in which components located within the processing vacuum chambers are each processed by a processing device.

[0004] The processing chamber typically has at least one transfer valve whose cross-section is adapted to the substrate and the robot, through which the substrate can be transferred into the vacuum chamber and removed, if necessary, after the intended processing. Alternatively, a second transfer valve may be provided through which the processed substrate is removed from the chamber.

[0005] A substrate (e.g., a wafer) is guided, for example, by a suitably designed and controlled handler (e.g., a robotic arm), through an opening in a processing chamber provided by a delivery valve. The processing chamber is then loaded, for example, by clamping the substrate with the handler, introducing the substrate into the processing chamber, and depositing the substrate in the chamber in a defined manner. The substrate can be removed by the same reverse process or a different process, or even through a second opening.

[0006] In order to place the substrate in the chamber, the substrate's mobility must be ensured. For this purpose, a pin lifting system is used, which can provide multiple support points for the substrate, thereby providing load distribution (due to the substrate's own weight) across the entire substrate.

[0007] The pin is preferably in a receiving position, and the robot places the substrate on the pin in that position. Alternatively, the robot can bring the substrate to a position above the support pin of the lifting device, and then lift the substrate by the pin. After the robot has moved away, the substrate is placed on a carrier (e.g., a potential plate (electrostatic chuck)) by lowering the pin, and the robotic arm that typically carries the substrate is removed from the chamber, for example, while the substrate is being placed. The pin can be further lowered after the substrate is placed and then exist separately from it, i.e., there is no contact between the pin and the substrate. After the robotic arm is removed and the chamber is closed (and optionally, process gas is introduced or evacuated), the processing steps are performed.

[0008] Applying low forces to the substrate after the processing steps have been performed in the chamber and when the substrate is subsequently lifted may be important, as the substrate may adhere to the carrier, for example. If the substrate is pushed away from the carrier too quickly, it may break because the adhesive forces cannot be overcome or eliminated, at least at some points of contact. Furthermore, even if contact is established between the support pin and the substrate, any impact to the substrate may result in undesirable stress (or breakage).

[0009] In addition to handling the substrate as gently and carefully as possible, the processing time should also be minimized. This means that the substrate can be placed into the chamber's defined conditions (loading and unloading positions and processing positions) as quickly as possible.

[0010] To avoid unwanted shocks during the handling of semiconductor wafers, for example, US 6,481,723 B1 recommends the use of special stop devices instead of hard motion stoppers in pin lifters. Any hard plastic stopper should be replaced here with a combination of a softer stop portion and a hard stopper, wherein the soft stop portion first contacts to restrict movement, and then the hard stopper contacts the soft stop portion and dampens accordingly.

[0011] US 6,646,857 B2 proposes adjusting lifting movement by recording the generated force. The lifting pin can be moved based on the received force signal, ensuring that the lifting force at the lifting pin is always applied to the wafer in a controlled and quantitative manner.

[0012] To further improve substrate processing time, more than one substrate can be brought into the processing chamber and processed simultaneously. However, processing multiple substrates simultaneously presents greater challenges. For example, if several substrates (wafers) are carried simultaneously by a wafer manipulator, it is necessary to provide a specific position and / or orientation for each substrate while carrying it and when placing it on the chuck. This allows for the reproduction of the desired processing for each wafer.

[0013] However, due to the challenging positioning of the aforementioned substrate and the need to keep processing time short, misalignment or twisting of the substrate may occur during processing. Therefore, if the substrate exhibits some offset or twisting on the chuck, the processing results may be worse compared to those based on precise positioning.

[0014] Therefore, the object of the present invention is to provide an improved pin lifting device that reduces or avoids the above-mentioned disadvantages.

[0015] In particular, the object of the present invention is to provide an improved pin lifting device that enables optimized (i.e., particularly robust and precise) processing of the substrate to be processed.

[0016] These objectives are achieved through the characteristic features of the actual independent claims. Features of the invention can be further developed from dependent patent claims in alternative or advantageous ways.

[0017] This invention relates to a pin lifting device, particularly a pin lifter, configured for moving and positioning a substrate to be processed within a processing atmosphere region. The substrate can be a wafer or any other semiconductor device. The processing atmosphere region can typically be provided by a vacuum processing chamber.

[0018] The pin lifting device includes a lifting unit with a mounting member configured to hold at least one lifting pin, wherein the at least one lifting pin is adapted to contact and support a substrate. The pin lifting unit also includes a drive unit connected to and interacting with the mounting member, such that the mounting member moves linearly along a movement axis from a lowered normal position to an elevated lifted position, and then back again.

[0019] The drive unit can be designed as an electric motor, particularly a stepper motor, which provides an electromechanical pin lifting device. Alternatively, the drive unit can be designed as a pneumatically driven cylinder.

[0020] The lowered normal position should be understood as the position of the mounting component, providing at least one lifting pin in a state where it performs essentially no action in terms of its intended function.

[0021] The intended function of a support pin is essentially to pick up, contact, move, support, and / or position a workpiece or substrate. In this context, the normal lowered position of a lifting pin should be understood as a state where the pin is not in contact with the substrate it is intended to contact (has not yet or is no longer in contact), and specifically, it does not temporarily serve its intended purpose, i.e., it is set in a lowered waiting position, for example. This is particularly true when performing machining operations on wafers.

[0022] The raised lifting position should be understood as providing the intended function of a lifter for receiving and / or setting the substrate via at least one lifting pin. The raised lifting position does not exclusively imply contact between the lifting pin and the substrate; rather, the pin may be in an extended state and remain ready to receive the wafer (the wafer is placed on the pin). Subsequent processing or movement (wafer transport) that may occur upon contact should also be understood as providing the intended function of the pin lifter.

[0023] The pin lifting device relates at least to a device in an unloaded installation state, in which the lifting pin to be installed on the mounting member is not in a holding position relative to the mounting member; in other words, the pin is absent. In the installed state, the lifting pin can be held by the mounting member in the desired receiving position. It should be understood that the present invention relates to pin lifting devices with and without installed lifting pins.

[0024] The pin lifting device includes: an adjustment structure configured to interact with the lifting unit; and an actuation unit coupled to both the adjustment structure and the lifting unit, such that the adjustment structure can be provided with movement of at least one degree of freedom relative to the lifting unit, according to a movement different from that along the movement axis.

[0025] By means of a movable adjustable structure, the pin lifting device according to the invention can provide not only movement of the substrate in one direction of movement, but also movement of the substrate in at least one additional direction (translation or rotation). Thus, the pin lifting device according to the invention can provide precise positioning of the substrate with high accuracy.

[0026] In one embodiment, the adjustment structure can be configured to interact with at least one of the at least one lifting pins, and the at least one adjusting pin can be moved by the movement of the adjustment structure according to at least one degree of freedom that is different from (e.g., linear) movement along the movement axis (M).

[0027] Therefore, for example, a pin lifter may include several lifting pins and mounting components, wherein a first part of the pin is designed to move only up and down, and a second part of the pin (adjusting pin) can move in at least one additional degree of freedom via an adjusting structure.

[0028] According to one embodiment, the movement based on at least one degree of freedom different from the movement along the axis of movement includes at least one of the following:

[0029] • Linear movement in at least one direction transverse to or orthogonal to the axis of movement (M),

[0030] • Rotational movement about the axis of motion, and

[0031] • Rotational motion about an axis orthogonal to the axis of movement.

[0032] The adjustment structure can move accordingly in a plane orthogonal to the axis of movement and / or can tilt relative to the axis of movement.

[0033] In one embodiment, the mounting element may include at least one joint, particularly a rotary joint, wherein the joint may be configured to provide tilting of the lifting pin relative to the mounting element.

[0034] With the lifting pin installed at the mounting point, the adjustment structure can further interact with the lifting pin, and the pin can be tilted by moving the adjustment structure.

[0035] In one embodiment, the adjustment mechanism may be provided by a flange or any other connecting element to mount the pin lifting device at the processing chamber. The adjustment mechanism may also be provided by the wall (e.g., the bottom wall) of the processing chamber.

[0036] In one embodiment, the adjustment structure may include a feedthrough or recess configured to provide an extension (through) of the lifting pin through the adjustment structure. The feedthrough may guide the lifting pin, thereby providing movement relative to the movement axis.

[0037] Specifically, the feedthrough may include sealing components, particularly O-rings or bellows. The sealing components provide atmospheric isolation between the processing volume and the machine portion of the lifting pin. Where the regulating structure provides part of the processing chamber, the sealing components can provide airtightness to the processing chamber while allowing movement of the lifting pin within the processing chamber.

[0038] In particular, the sealing element can be designed to also allow the pin to move orthogonally to the moving axis or to rotate relative to the moving axis.

[0039] Suitable materials for such sealing components, especially O-rings in vacuum systems, are, for example, fluororubber or fluoroelastomers, particularly perfluororubber.

[0040] According to one embodiment, the mounting element may include at least three joints to hold at least three lifting pins, and the adjusting structure may include at least three feeders to provide extensions of at least three lifting pins through the adjusting structure, wherein the mobility of the at least three lifting pins in at least one degree of freedom other than the mobility along the moving axis may be provided by relative movement between the adjusting structure and the mounting element.

[0041] In one embodiment, the adjustment structure may include a base plate having at least three feeders, wherein the feeders may be arranged in the edge region of the base plate and may be evenly distributed around the circumference of the base plate.

[0042] The present invention also relates to a pin lifting system. The pin lifting system includes the aforementioned pin lifting device and a control unit. The control unit is configured to control at least one actuating unit of the pin lifting device. In particular, control can be provided by means of a corresponding adjustment function that can be implemented on the control unit.

[0043] Control of the actuation unit is provided by receiving positioning information about the position of the substrate relative to the pin lifting device. Specifically, the positioning information can be generated by setting the substrate on the pin lifting device, i.e., by a substrate handling step, or by placing the substrate on the lifting device. Furthermore, the positioning information can be further processed by the control unit to provide specific position data.

[0044] The control signal is derived based on the positioning information and then applied to the actuation unit.

[0045] In one implementation, the location information may include at least one of the following:

[0046] • Position offset information

[0047] • Misaligned information

[0048] • The current position of the substrate, and

[0049] • The current orientation of the substrate.

[0050] The position offset information and misalignment information preferably relate to the offset or misalignment of the substrate relative to the lifting unit (especially relative to a reference point defined by the pin lifting device).

[0051] In one embodiment, deriving the control signal may include processing the positioning information by comparing defined reference positioning information with actual positioning information, which is related to the actual position and / or orientation of the substrate relative to the pin lifting device (particularly relative to the lifting unit).

[0052] According to one embodiment, the control unit can be configured to control the actuation unit by: receiving or deriving the position and / or orientation offset of the substrate relative to the pin lifting device, and providing movement of the adjustment structure via the actuation unit such that the position and / or orientation offset is compensated. Specifically, the position and / or orientation offset represents positioning information.

[0053] In one embodiment, the pin lifting system may include at least one lifting pin connected to a mounting member of the pin lifting device, and positioning information is generated by setting the substrate onto the at least one lifting pin. Alternatively or additionally, the pin lifting system may include a substrate manipulator, such as a robot, to set the substrate onto the pin lifting device, particularly onto at least one lifting pin.

[0054] The present invention also relates to a method for compensating for the position of a substrate relative to a pin lifting device (particularly relative to the drive unit or mounting component of the pin lifting device). The pin lifting device is implemented as described above.

[0055] The method includes the following steps:

[0056] • Receive positioning information regarding the position of the substrate relative to the pin lifting device, particularly positioning information generated due to the placement and / or processing of the substrate on the pin lifting device.

[0057] • Derive control signals based on the positioning information, and

[0058] • The control signal is applied to the actuation unit of the pin lifting device.

[0059] The present invention also relates to a computer program product that, when executed by a control unit (e.g., a pin lifting device), causes the steps of the above-described method to be automatically executed and controlled. The above-described method can be implemented in the computer program product.

[0060] The apparatus and method according to the invention are described or explained in more detail below by way of example only, with reference to the schematic examples of operation shown in the accompanying drawings. Specifically,

[0061] Figure 1 illustrates an embodiment of a processing setup for processing semiconductor wafers;

[0062] Figure 2 illustrates an embodiment of the pin lifting system according to the present invention, which includes a pin lifting device and a control unit; and

[0063] Figures 3a to 4b illustrate embodiments of the pin lifting device according to the present invention.

[0064] Figure 1 schematically illustrates the processing setup for processing a semiconductor wafer 1 (substrate) under vacuum conditions. The wafer 1 is introduced into the vacuum chamber 4 (processing atmosphere region P) by means of a first robotic arm or manipulator 2 via a first vacuum transfer valve 5a, and is brought into place via lifting pins 7 (here, three pins are shown) of the pin lifting device 10 according to the invention. The wafer 1 is picked up or placed on it by the movement of the pins 7, and the robotic arm 2 is removed.

[0065] The wafer 1 is typically placed on a robotic arm or a support provided by robotic arms 2 or 3, or held by a specific support device. After the wafer 1 is held by pin 7, the robotic arm is guided out of chamber 4 and the delivery valve 5a is closed.

[0066] The processing setup includes a measurement system to provide information about the current position of wafer 1 relative to robotic arm 2 and / or relative to a pin lifting device (or lifting pin). This allows for the detection of possible deviations in the substrate's position and / or orientation relative to a reference position and / or orientation. The reference position and / or orientation preferably represents, for example, the desired position and / or orientation of the substrate in the processing system when placed for processing. Accordingly, the corresponding offset or misalignment can be calculated based on this.

[0067] The pin lifting device according to the invention (in addition to a typical drive unit) includes an actuation unit implemented to provide movement of the pin in at least one direction other than a linear lifting or lowering movement of the pin (described in more detail below). The actuation unit can be controlled to provide movement of the pin along a defined direction and according to a desired amount (distance).

[0068] The system also includes a control unit 9 configured to receive and / or process positional information regarding possible deviations in the position and / or orientation of the substrate relative to a reference position and / or orientation. The control unit 9 derives control signals based on the identified deviations. The control signals are adapted to control the actuation unit. The control signals may include information about the direction and / or distance the substrate must move to approach or reach the reference state.

[0069] The control unit is further configured to apply a control signal to the actuation unit. Thus, the lifting pin can be moved by driving the actuation unit according to the control signal. Accordingly, deviations in the measured substrate state can be compensated for (i.e., at least reduced or fully compensated for).

[0070] Preferably, after this compensation, pin 7 can be lowered. This is accomplished by the (main) drive unit of the pin lifting device 10 connected to the corresponding pin 7. Thus, wafer 1 can be placed on the four support elements 8 shown. Alternatively, wafer 1 is placed on an electrostatic device (not shown) (a so-called electrostatic chuck) and held in place by applying a voltage between the chuck electrodes, and leveled if necessary by the force exerted through this action. Electrostatic chucks are commonly used to process semiconductor wafers under vacuum conditions.

[0071] In this state, the planned processing of wafer 7 (e.g., coating, etching, atomic layer deposition, etc.) takes place under defined vacuum conditions, particularly under a defined atmosphere (i.e., with a specific processing gas and at a defined pressure). For this purpose, chamber 4 is connected to a processing gas source, a vacuum pump, and a vacuum control valve (not shown), preferably for controlling the chamber pressure.

[0072] After processing, wafer 1 is raised again to the elevated removal position by pin lifting device 10. Second robotic arm 3 is then used to remove wafer 1 via second delivery valve 5b. Alternatively, the process can be designed with only one robotic arm, in which case placement and removal can be performed via a single delivery valve.

[0073] The control unit 9 can communicate with the pin lifting device via wireless means (e.g., wireless means such as radio, WiFi, Bluetooth) and / or electronic and / or electrical means. Furthermore, the control unit 9 can be integrated into the pin lifting device of the system. The control unit 9 can be designed to communicate wirelessly with several pin lifters and provide individual control and reception of corresponding information for each individual pin lifter.

[0074] The control unit may be physically separate from the pin lifting device and may include, for example, a tablet PC, a cellular phone, and / or a computer workstation.

[0075] The pin lifting system according to the invention can correct the position of the wafer even when the wafer is brought into the processing chamber with a specific offset, and even when the wafer is placed on the pin with a specific offset relative to the desired processing position. This provides higher accuracy and robustness for wafer processing.

[0076] Another advantage is that the processing system used to deliver the wafers can be built to accept larger tolerances, and thus allows for faster wafer transport and placement. This can reduce the overall processing time.

[0077] Figure 2 illustrates an embodiment of a pin lifting system according to the present invention, which includes a pin lifting device 10 and a control unit 9.

[0078] The lifting pin 7 is arranged at the mounting part 11 (e.g., the connector) of the device 10. The lifting pin 7 preferably comprises a metallic material, a polymer-based material, or a ceramic material, and in particular, the pin 7 is made entirely of such a material. The connection of the pin can be achieved, for example, magnetically or by clamping.

[0079] Mounting member 11 can be moved in the z direction along the moving axis M via sliding member 12. For this purpose, sliding member 12 is connected to threaded spindle 13, which can in turn be driven by electric motor of drive unit 14.

[0080] According to another embodiment, the drive unit 14 of the pin lifting device according to the invention can be provided by a pneumatic actuator.

[0081] In one embodiment, optional thermal and electrical insulation between the upper mounting portion and the lower drive portion is provided by a first insulating element 15, which thermally and electrically isolates the upper housing portion from the lower housing portion. Preferably, a second insulating element, which can be implemented by the slider 12, may be provided. In this embodiment of the pin lifting device 10, the threaded spindle 13 is designed and mounted in a precise and rigid manner such that no (conductive or thermal) contact occurs between the spindle 13 and the mounting portion 11, even during relative movement.

[0082] Alternatively, the spindle 13 is made of or coated with a non-conductive or thermally insulating material. Therefore, complete electrical and thermal isolation is provided between the upper and lower parts of the device 10 in any state.

[0083] In another embodiment, both the threaded spindle 13 and the slider 12 mounted on the spindle 13 can be manufactured to be conductive (e.g., metallic). Insulation can then be achieved, in particular, by means of, an intermediate sleeve between the spindle / slider and the mounting.

[0084] It should be understood that the above embodiments are purely optional, but the present invention also relates to embodiments with alternative driving and coupling methods to provide linear movement of the mounting member 11 and the lifting pin 7 in the direction according to the moving axis M.

[0085] The pin lifter 10 further includes an internal bellows 16. The bellows 16 is arranged and shaped to provide atmospheric isolation between the processing atmosphere region P and the external atmosphere region A, in which the lifting pin 7 can be present and where substrate processing typically occurs, and in which, for example, the driver 14 and other peripheral components can be present. When the pin 7 extends (moves in the upward direction), the bellows 16 is compressed while maintaining atmospheric isolation.

[0086] The pin lifting device can be connected to the housing of the vacuum processing chamber.

[0087] It should be understood that the pin lifting device according to the invention can alternatively achieve another sealing concept instead of a bellows, which also provides atmospheric isolation, for example, a radial seal in the upper outlet area of ​​the support pin 7, such as an O-ring or a diaphragm.

[0088] The pin lifting device also includes an adjusting structure 21 and an actuating unit 22. Here, the adjusting structure 21 is implemented as a bolt.

[0089] The actuation unit 22 is connected to the adjustment structure 21 and to the lifting unit, thereby providing the adjustment structure 21 with at least one degree of freedom relative to the lifting unit, based on a linear movement different from that along the movement axis M. The lifting unit may include a mounting component, a drive unit, a housing, etc.

[0090] The actuation unit 22 can be implemented as a motor or a piezoelectric actuator and provides a change in the position of the bolt in a direction orthogonal to the movement axis M (i.e., in the y direction).

[0091] Control unit 9 is configured to control actuation unit 22 (and drive unit 12). A corresponding control signal for moving actuation unit 22 can be derived based on position information regarding the position of a base plate intended to be moved by pin lifter 10 relative to pin lifter 10. Position information may include the position and / or orientation of the base plate relative to pin lifter 10 before contacting pin 7 of lifter 10. Alternatively or additionally, position information may include the position and / or orientation of the base plate relative to pin lifter 10 when supported by pin lifter 10.

[0092] Based on the position information, the offset and / or misalignment of the substrate relative to the pin lifting device 10 can be calculated. The control unit 9 can then derive a corresponding control signal to control the actuation unit 22, such that, for example, the offset is compensated. For instance, the control unit 9 provides a specific movement of the bolt 21, the distance of which causes a specific y-offset to be compensated, i.e., reduced or eliminated.

[0093] Figures 3a and 4b illustrate an embodiment of the pin lifting device 10 according to the present invention. Figures 3a and 4a are side views of the device 10, and Figures 3b and 4b show the device in a specific perspective view.

[0094] The pin lifting device 10 includes a mounting member 11 and a drive unit 14, wherein the mounting member 11 is connected to the drive unit 14 to move along the moving axis M via the drive unit 14.

[0095] Here, the drive unit 14 includes an electric motor. However, according to an alternative embodiment, the drive unit 14 may include a pneumatic actuator to provide movement of the mounting member 11.

[0096] Mounting member 11 (here: centrally located) is coupled to drive unit 14 and includes three arms 17a-17c (arms 17c are not visible in the figure due to being obscured by drive unit 14). Arms 17a-17c are evenly distributed around the circumference of drive unit 14. Each arm is connected to a lifting pin 7a-7c (lifting pins 7c are not visible in the figure due to being obscured by drive unit 14). Corresponding rotary joints 18a-18c are provided to allow rotation or tilting of pins 7a-7c relative to mounting member 11.

[0097] The pin lifting device 10 further includes an adjustment structure 21 and an actuation unit 22. The adjustment structure 21 is implemented as a base plate 21. The base plate 21 includes three feed passages (recesses), each of which is passed through one of the lifting pins 7a-7c. Each feed passage includes a sealing element to provide atmospheric isolation despite the opening provided by the feed passage.

[0098] Actuation unit 22 is disposed between drive unit 14 and base plate 21. Actuation unit 22 is configured to provide relative movement between base plate 21 and drive unit 14. Actuation unit 22 may include at least one driver and at least one guide to provide movement in one direction. In particular, actuation unit 22 may include at least two drivers and at least two guides to provide movement in two directions.

[0099] The actuation unit 22 may include a piezoelectric element as an actuator to provide relative movement.

[0100] Referring to Figures 4a and 4b, the pin lifting device 10 is shown after relative movement between the base plate 21 and the drive unit 14. It can be seen that the actuation unit 22 can provide movement of the base plate 21 relative to the drive unit 14 along the y-axis (i.e., the y-direction). Due to this movement, the three lifting pins 7a-7c move accordingly along the y-direction.

[0101] Thus, the substrate 1, placed on top of the pins 7a-7c, can also move in the y-direction. Possible positional offsets of the substrate 1 (e.g., relative to the drive unit 14) related to the y-axis can be compensated for by this reverse action. The design of the pin lifting device 10 allows for horizontal movement of the substrate 1 without tilting it.

[0102] The actuation unit 22 may be further configured to provide the base plate 21 with movement in an additional lateral direction (e.g., the x direction) and / or rotational movement about the x-axis and / or y-axis.

[0103] According to an alternative embodiment, the base plate 21 can be fixedly arranged, for example, at the processing chamber, or it can be provided by the bottom wall of the processing chamber, and the actuation unit provides movement of the drive unit 14 relative to the base plate 21. As a result, the lifting pins 7a-7c can also be moved as described above.

[0104] Although the invention has been illustrated above with reference to some specific embodiments, it must be understood that many modifications and combinations can be made to the different features of the embodiments, and that the different features can be combined with each other or with vacuum applications known in the art.

Claims

1. A pin lifting device (10) configured for moving and positioning a substrate (1) to be processed in a processing atmosphere region (P) provided by a vacuum processing chamber (4), the pin lifting device (10) comprising a lifting unit having: a mounting member (11) configured to hold at least one lifting pin (7, 7a-7c) adapted to contact and support the substrate (1); and a drive unit (14) connected to and interacting with the mounting member (11) such that the mounting member (11) can move along a movement axis (M) from Lowered normal position moved to The raised position, and then returned, is characterized by, The pin lifting device (10) includes an adjustment structure (21) configured to interact with the lifting unit, and an actuation unit (22) coupled to the adjustment structure (21) and the lifting unit, such that the adjustment structure (21) can be provided with movement of the lifting unit relative to the lifting unit according to at least one degree of freedom different from movement along the movement axis (M).

2. The pin lifting device (10) according to claim 1, wherein, The adjustment structure (21) is configured to interact with at least one of the at least one lifting pins (7, 7a-7c), and the at least one adjusting pin is movable by the movement of the adjustment structure (21) according to at least one degree of freedom different from the mobility along the movement axis (M).

3. The pin lifting device (10) according to claim 1 or 2, wherein, The movement according to at least one degree of freedom different from the movement along the axis of motion (M) includes at least one of the following: linear movement in at least one direction transverse to or orthogonal to the axis of motion (M), rotational movement about the axis of motion (M), and rotational movement about an axis orthogonal to the axis of motion (M).

4. The pin lifting device (10) according to any one of the preceding claims, wherein, The mounting component (11) includes joints (18a-18c), particularly rotary joints, wherein the joints (18a-18c) are configured to provide tilting of the lifting pins (7, 7a-7c) relative to the mounting component (11).

5. The pin lifting device (10) according to any one of the preceding claims, wherein, The adjustment structure (21) includes a feeder configured to provide an extension of the lifting pins (7, 7a-7c) through the adjustment structure (21).

6. The pin lifting device (10) according to claim 5, wherein, The feedthrough includes sealing components, particularly O-rings or bellows.

7. The pin lifting device (10) according to any one of the preceding claims, wherein, The mounting member (11) includes at least three joints (18a-18c) to hold at least three lifting pins (7a-7c), and the adjusting structure (21) includes at least three feeders to provide extensions of the at least three lifting pins (7a-7c) through the adjusting structure (21), wherein the mobility of the at least three lifting pins (7a-7c) in at least one degree of freedom different from the mobility along the moving axis (M) can be provided by the relative movement of the adjusting structure (21) and the mounting member (11).

8. The pin lifting device (10) according to any one of the preceding claims, wherein, The adjustment structure (21) includes a base plate having at least three feeders, wherein the feeders are arranged in the edge region of the base plate and are evenly distributed around the circumference of the base plate.

9. A pin lifting system, the pin lifting system comprising: • The pin lifting device (10) according to any one of the preceding claims, and • the control unit (9), the control unit (9) being configured to control at least the actuation unit (22) of the pin lifting device (10) by: Receive positioning information regarding the position of the substrate (1) relative to the pin lifting device (10). Based on the positioning information, control signals are derived, and The control signal is applied to the actuation unit.

10. The pin lifting system according to claim 9, wherein, The positioning information includes at least one of the following: position offset information, misalignment information, current position of the substrate (1), and current orientation of the substrate (1).

11. The pin lifting system according to claim 9 or 10, wherein, The output control signal includes processing the positioning information by comparing defined reference positioning information with actual positioning information, which is related to the actual position and / or orientation of the substrate (1) relative to the pin lifting device (10).

12. The pin lifting system according to any one of claims 9 to 11, wherein, The control unit (9) is configured to control the actuation unit (22) by: receiving or deriving the position and / or orientation offset of the base plate (1) relative to the pin lifting device (10), and providing movement of the adjustment structure (21) through the actuation unit (22) such that the position and / or orientation offset is compensated.

13. The pin lifting system according to any one of claims 9 to 12, wherein, • The pin lifting system includes at least one lifting pin connected to the mounting member of the pin lifting device (10), and the positioning information is generated by setting the substrate on the at least one lifting pin, and / or • The pin lifting system includes a substrate manipulator to set the substrate onto the pin lifting device (10).

14. A method for compensating the position of a substrate relative to a pin lifting device (10) according to any one of claims 1 to 8, the method comprising the steps of: • Receive positioning information about the position of the substrate relative to the pin lifting device (10), • derive a control signal based on the processing of the positioning information, and • apply the control signal to the actuation unit of the pin lifting device (10).

15. A computer program product, when executed by a control unit, causes the steps of the method according to claim 14 to be automatically executed and controlled.

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