Grinding device for high-purity silicon powder

Abstract

The invention discloses a grinding device for high-purity silicon powder. The grinding device comprises a grinding cylinder, a grinding wheel and a driving device, the preliminary grinding mechanism and the grinding cylinder are arranged in a penetrating manner; the filtering mechanism is arranged in the grinding cylinder, the filtering mechanism is installed between the inner wall of the grinding cylinder and the preliminary grinding mechanism, the filtering mechanism comprises a filtering cover and multiple sets of adsorption cylinders, the filtering cover is longitudinally arranged in the grinding cylinder, and the outer wall of the filtering cover is fixedly sleeved with an annular ring; the annular ring is arranged in an annular groove formed in the inner wall of the grinding cylinder; a plurality of groups of filtering holes are formed in the bottom surface of the filtering cover, each group of adsorption barrels are respectively arranged in the corresponding filtering holes, surrounding coils are arranged in the adsorption barrels, and according to the dispersed silicon powder disclosed by the embodiment of the invention, each impurity has a greater chance to approach the adsorption barrels and is adsorbed, so that the impurities are completely adsorbed, and the purity of the silicon powder is improved.

Description

Technical Field

[0001] This application relates to the technical field of silicon powder grinding, and more particularly to a grinding apparatus for high-purity silicon powder. Background Technology

[0002] During the formation of silica ore, magnetic minerals such as magnetite and hematite may be present. When silica powder is produced from these types of silica ore, the magnetic minerals are processed along with the silica ore and thus become magnetic impurities in the silica powder. For example, some sedimentary silica ores are often associated with iron-bearing minerals. During mining and subsequent crushing and grinding processes, these iron-bearing magnetic minerals are broken into tiny particles and mixed into the silica powder system.

[0003] In the silicon powder processing, the metal components inside equipment such as crushers and grinders undergo wear during long-term operation. These wear-generated metal fragments often contain ferromagnetic substances; for example, iron filings from worn steel components can enter the silicon powder. The continuous friction between the grinding media and the cylinder wall causes the cylinder surface to wear away and peel off. These detached fragments mix with the silicon powder, becoming a significant source of magnetic impurities.

[0004] The presence of magnetic impurities is extremely detrimental to the quality of high-purity silicon powder. In fields such as semiconductors and photovoltaics, where the purity of silicon powder is critically high, even trace amounts of magnetic impurities can severely affect product performance. For example, in semiconductor manufacturing, magnetic impurities interfere with electron migration, leading to unstable chip performance; in the photovoltaic industry, they reduce the photoelectric conversion efficiency of silicon wafers. Summary of the Invention

[0005] This application aims to at least partially address one of the technical problems in the related art.

[0006] Therefore, one objective of this application is to provide a grinding device for high-purity silicon powder, in which the dispersed silicon powder allows each impurity to have a greater chance of approaching the adsorption cylinder and being adsorbed, thereby achieving complete adsorption of impurities and improving the purity of silicon powder.

[0007] To achieve the above objectives, a first aspect of this application provides a grinding apparatus for high-purity silicon powder, comprising: a grinding cylinder arranged longitudinally; a preliminary grinding mechanism that is through-connected to the grinding cylinder; and a filtering mechanism disposed inside the grinding cylinder, the filtering mechanism being installed between the inner wall of the grinding cylinder and the preliminary grinding mechanism. The filtering mechanism includes a filter cover and multiple sets of adsorption cylinders. The filter cover is arranged longitudinally inside the grinding cylinder, and an annular ring is fixedly fitted onto the outer wall of the filter cover. The annular ring is disposed in an annular groove opened in the inner wall of the grinding cylinder. The bottom surface of the filter cover has multiple sets of filter holes, and each set of adsorption cylinders is disposed inside a corresponding filter hole. A coil is disposed inside each adsorption cylinder.

[0008] In addition, the grinding apparatus for high-purity silicon powder proposed in this application may also have the following additional technical features: Furthermore, the preliminary grinding mechanism includes: a servo motor, positioned directly below the grinding cylinder, with a U-shaped motor base fixedly mounted on the bottom of the servo motor, and the upper end of the motor base fixedly mounted to the bottom surface of the grinding cylinder by bolts; a mounting shaft, with its bottom end fixedly mounted to the output end of the servo motor, and the end of the mounting shaft away from the servo motor movably penetrating through the bottom surface of the grinding cylinder and extending into the interior of the grinding cylinder; and a frustum grinding block, disposed inside the grinding cylinder, with its bottom surface fixedly mounted to the top end of the mounting shaft.

[0009] Furthermore, the filtration mechanism further includes: multiple sets of first springs arranged in a circular array within an annular groove, with the top end of each first spring fixedly mounted to the bottom surface of the annular ring and the bottom end of each first spring fixedly mounted to the bottom of the inner wall of the annular groove; an auxiliary cover fitted over the outside of the mounting shaft, the inner diameter of which is larger than the outer diameter of the mounting shaft, and the bottom surface of which is fixedly mounted to the bottom of the inner wall of the filter cover; wherein the top surface of the auxiliary cover has multiple circular grooves arranged in a circular array; and auxiliary rods, the number of which corresponds to the number of circular grooves, with the top end of each auxiliary rod fixedly mounted to the bottom surface of the frustum grinding block.

[0010] Furthermore, the filtration mechanism also includes a spiral blade, which is sleeved on the outer wall of the mounting shaft, with its upper diameter being larger than its lower diameter, and the positive spiral direction being the same as the rotation direction of the device.

[0011] Furthermore, it also includes a grinding reinforcement mechanism, which is connected to the preliminary grinding mechanism and located between the preliminary grinding mechanism and the filtering mechanism. The grinding reinforcement mechanism includes: a cylindrical grinding block disposed inside the filter cover; a T-shaped support column, the bottom end of which is fixedly installed to the bottom surface of the cylindrical grinding block, and the upper end of the T-shaped support column is disposed in an inner groove opened on the bottom surface of the frustum grinding block through a spherical hinge; a second spring disposed inside the inner groove, the bottom end of which is fixedly installed to the top end of the T-shaped support column, and the top end of the second spring is fixedly installed to the top of the inner wall of the inner groove; and an upper grinding disc disposed above the inner wall of the filter cover.

[0012] Furthermore, the filtration mechanism also includes a conductive disk and a conductive block. Multiple sets of the adsorption cylinders are electrically connected to the conductive disk. The conductive block is disposed on the inner wall of the grinding cylinder by multiple sets of springs. The conductive block is electrically connected to the conductive disk and is connected to an external power source.

[0013] Furthermore, the distance between the outer surface of the frustum grinding block and the inner wall of the grinding cylinder gradually decreases from top to bottom.

[0014] Furthermore, the bottom end of the auxiliary rod is spherical, and the auxiliary rod is made of rubber.

[0015] Beneficial effects: The dispersed silicon powder gives each impurity a greater chance to approach the adsorption cylinder and be adsorbed, thereby achieving complete adsorption of impurities and improving the purity of silicon powder.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic diagram of the grinding apparatus for high-purity silicon powder according to this application; Figure 2 Grinding apparatus for high-purity silicon powder according to this application Figure 1 A top-view structural diagram; Figure 3 This is a cross-sectional structural diagram of the grinding cylinder in the grinding apparatus for high-purity silicon powder according to this application; Figure 4 A cross-sectional schematic diagram of the frustum grinding body in the grinding apparatus for high-purity silicon powder according to this application; Figure 5 This is an exploded structural diagram of the auxiliary cover and auxiliary rod in the grinding apparatus for high-purity silicon powder according to this application; Figure 6 This is a schematic diagram of the filter cover and its connecting components in the grinding apparatus for high-purity silicon powder according to this application; Figure 7 This is a top view of the filter cover and its connecting components in the grinding apparatus for high-purity silicon powder according to this application.

[0018] As shown in the figure: 1. Grinding cylinder; 2. Discharge port; 3. Support leg; 4. Preliminary grinding mechanism; 41. Servo motor; 42. Motor base; 43. Mounting shaft; 44. Frustum grinding block; 5. Filtering mechanism; 51. Filter cover; 52. Annular ring; 53. Annular groove; 54. First spring; 55. Auxiliary cover; 56. Auxiliary rod; 57. Circular groove; 58. Adsorption cylinder; 59. Conductive disk; 501. Conductive block; 502. Filter hole; 503. Spiral blade; 6. Grinding reinforcement mechanism; 61. Columnar grinding block; 62. T-shaped support column; 63. Inner groove; 64. Second spring; 65. Upper grinding disc. Detailed Implementation

[0019] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0020] The following is in conjunction with the appendix Figures 1-7 The grinding apparatus for high-purity silicon powder described in this application includes: The grinding cylinder 1 is arranged longitudinally to facilitate feeding. The outer wall of the lower end of the grinding cylinder 1 has a discharge port 2, and four support legs 3 are fixedly installed on the bottom surface of the grinding cylinder 1. The four support legs 3 are arranged in a circular array on the bottom surface of the grinding cylinder 1. The discharge port 2 on the outer wall of the grinding cylinder 1 facilitates the discharge of the ground silicon powder, and the four support legs 3 installed on the bottom surface of the grinding cylinder 1 provide stable support for the entire device.

[0021] The preliminary grinding mechanism 4 is used for the preliminary grinding of high-purity silicon powder. The preliminary grinding mechanism 4 is connected to the grinding cylinder 1.

[0022] The filter mechanism 5 is located inside the grinding cylinder 1 and is installed between the inner wall of the grinding cylinder 1 and the preliminary grinding mechanism 4.

[0023] The filtration mechanism 5 includes a filter cover 51, multiple adsorption cylinders 58, a conductive disk 59, and a conductive block 501. The filter cover 51 is arranged longitudinally inside the grinding cylinder 1. An annular ring 52 is fixedly sleeved on the outer wall of the filter cover 51. The annular ring 52 is arranged in an annular groove 53 opened on the inner wall of the grinding cylinder 1.

[0024] The bottom surface of the filter cover 51 has multiple sets of filter holes 502. Each set of adsorption cylinders 58 is disposed inside the corresponding filter hole 502. A coil is installed inside the adsorption cylinder 58, and the multiple sets of adsorption cylinders 58 are electrically connected to the conductive disk 59. The conductive block 501 is disposed on the inner wall of the grinding cylinder 1 by multiple sets of springs. The conductive block 501 is electrically connected to the conductive disk 59 and connected to an external power source. When the coil is energized, the adsorption cylinder 58 will generate magnetism. The multiple sets of filter holes 502 disperse the silicon powder into different filtration positions. When the silicon powder passes through the filter holes 502, the magnetic impurities in it are adsorbed by the adsorption cylinders 58, thereby removing the magnetic impurities from the silicon powder and improving the purity of the silicon powder.

[0025] The spring arrangement in this embodiment ensures good contact between the conductive block 501 and the conductive disk 59, guaranteeing stable current transmission even under device vibration or slight displacement. The conductive block 501 introduces electrical energy from an external power source into the device, transferring it to the conductive disk 59 via contact plates, thereby powering the adsorption cylinder 58.

[0026] Specifically, the high-purity silicon powder to be ground enters the device from the top of the grinding cylinder 1. The preliminary grinding mechanism 4 performs preliminary grinding on the silicon powder, breaking larger silicon powder particles into smaller particles. The silicon powder after preliminary grinding enters the filter cover 51. The larger silicon powder particles are intercepted by the filter holes 502, while the smaller silicon powder particles pass through the filter holes. An external power supply powers the coil of the adsorption cylinder 58 through the conductive block 501 and the conductive disk 59. The adsorption cylinder 58 generates magnetism and adsorbs magnetic impurities in the silicon powder. The silicon powder after filtration and impurity removal is discharged from the device from the discharge port 2.

[0027] In one embodiment of this application, such as Figures 1-2 As shown, the preliminary grinding mechanism 4 includes: The servo motor 41 is located directly below the grinding cylinder 1. A U-shaped motor base 42 is fixedly installed on the bottom of the servo motor 41. The upper end of the motor base 42 is fixedly installed to the bottom surface of the grinding cylinder 1 by bolts.

[0028] The mounting shaft 43 is fixedly mounted at its bottom end to the output end of the servo motor 41, and the end of the mounting shaft 43 away from the servo motor 41 moves through the bottom surface of the grinding cylinder 1 and extends into the interior of the grinding cylinder 1.

[0029] A frustum grinding block 44 is disposed inside the grinding cylinder 1, and the bottom surface of the frustum grinding block 44 is fixedly installed with the top end of the mounting shaft 43.

[0030] Specifically, the servo motor 41 is turned on, and the servo motor 41 starts to rotate and output power. The mounting shaft 43 starts to rotate under the drive of the servo motor 41. The frustum grinding block 44, which is fixedly connected to the top of the mounting shaft 43, rotates together with the mounting shaft 43 inside the grinding cylinder 1. The high-purity silicon powder to be ground is added from the top of the grinding cylinder 1. The silicon powder enters the space between the frustum grinding block 44 and the inner wall of the grinding cylinder 1. The frustum grinding block 44 squeezes and rubs the silicon powder by rotating, completing the preliminary grinding. The silicon powder after preliminary grinding enters the subsequent filtration mechanism 5 for further processing.

[0031] In one embodiment of this application, such as Figures 4-7 As shown, the filter mechanism 5 also includes: Multiple sets of first springs 54 are arranged in a ring array within an annular groove 53. The top end of each first spring 54 is fixedly mounted to the bottom surface of the annular ring 52, and the bottom end of each first spring 54 is fixedly mounted to the bottom of the inner wall of the annular groove 53. The first springs 54 provide elastic support and cushioning. When the filter cover 51 is subjected to external force, the first springs 54 will compress or elongate. When the auxiliary rod 56 and the auxiliary cover 55 cooperate to make the filter cover 51 move up and down, the first springs 54 can provide elastic restoring force, causing the filter cover 51 to vibrate up and down. This vibration can prevent silicon powder from clogging the filter holes 502, helping the silicon powder to pass smoothly through the filter cover 51 and improving filtration efficiency.

[0032] An auxiliary cover 55 is fitted over the mounting shaft 43. The inner diameter of the auxiliary cover 55 is larger than the outer diameter of the mounting shaft 43. The bottom surface of the auxiliary cover 55 is fixedly installed to the bottom of the inner wall of the filter cover 51. The auxiliary cover 55's larger inner diameter ensures a certain gap between it and the mounting shaft 43, preventing interference with the shaft's rotation. The bottom surface of the auxiliary cover 55 is fixedly installed to the bottom of the inner wall of the filter cover 51, forming a relatively stable integrated structure.

[0033] The auxiliary cover 55 mainly serves as a connector and connector. It is fixedly connected to the filter cover 51 and applies the force transmitted by the auxiliary rod 56 to the filter cover 51, enabling the filter cover 51 to vibrate. At the same time, the circular groove 57 on the top surface of the auxiliary cover 55 provides the application point for the auxiliary rod 56, facilitating the implementation of the vibration function.

[0034] The top surface of the auxiliary cover 55 has multiple circular grooves 57 arranged in a ring array. The number of auxiliary rods 56 corresponds to the number of circular grooves 57, and the top of the auxiliary rods 56 is fixedly installed on the bottom surface of the frustum grinding block 44.

[0035] During the rotation of the frustum grinding block 44, the auxiliary rod 56 continuously engages with the circular groove 57 on the top surface of the auxiliary cover 55, periodically applying pressure to the auxiliary cover 55, thereby causing the filter cover 51 to vibrate up and down under the action of the first spring 54, thus enhancing the filtration effect.

[0036] Specifically, when the preliminary grinding mechanism 4 is working, the frustum grinding block 44 drives the auxiliary rod 56 to rotate.

[0037] When the auxiliary rod 56 rotates to the position corresponding to the circular groove 57 on the top surface of the auxiliary cover 55, the bottom end of the auxiliary rod 56 enters the circular groove 57, generating downward pressure on the auxiliary cover 55.

[0038] Since the auxiliary cover 55 is fixedly connected to the filter cover 51, the filter cover 51 moves downwards, compressing the first spring 54 in the annular groove 53.

[0039] As the frustum grinding block 44 continues to rotate, the auxiliary rod 56 leaves the circular groove 57, and the first spring 54 rebounds after losing pressure, causing the filter cover 51 to move upward.

[0040] The frustum grinding block 44 rotates continuously, and the auxiliary rod 56 repeats the above process, causing the filter cover 51 to vibrate up and down.

[0041] During the vibration of the filter cover 51, the pre-ground silicon powder enters the filter cover 51. The vibration helps the silicon powder pass through the filter holes 502, while preventing the silicon powder from clogging the filter holes, thus improving the filtration efficiency and effect.

[0042] In one embodiment of this application, such as Figure 6 As shown, the filter mechanism 5 also includes: The spiral vane 503, fitted onto the outer wall of the mounting shaft 43, has a larger upper diameter than its lower diameter, and its helical direction is the same as the rotation direction of the device. According to the right-hand rule, when the spiral vane rotates clockwise and viewed from above, if the helix direction is right-handed (i.e., the helix line rises to the right), an upward wind will be generated. The principle by which the spiral vane directs the wind upward is similar to that of a propeller; the rotating vane pushes the airflow. When the helical direction of the vane is the same as the rotation direction of the device, the trajectory of each point of the vane in contact with the air during rotation is consistent with the direction of the helix line, generating an upward component force on the air, thus pushing the air upward and creating an upward wind.

[0043] Specifically, when the spiral blade 503 rotates with the mounting shaft 43, its special shape and spiral direction push the surrounding air upward, forming an upward airflow. This upward airflow can affect the movement of the silicon powder, causing the silicon powder and impurities to disperse during the falling process, slowing down the falling speed of the silicon powder, and making the falling silicon powder distributed. In this way, during the silicon powder adsorption process, impurities can be completely adsorbed by the adsorption cylinder.

[0044] In this example, the spiral vane 503 is further explained. The difference in diameter between the upper and lower parts of the spiral vane 503 creates airflows of different sizes at the top and bottom. The shape of the spiral vane 503, which is larger at the top and smaller at the bottom, results in different flow spaces and paths for the air as it passes over the upper and lower parts of the spiral vane 503. The upper space is relatively larger, allowing the air to occupy a wider area during rotation, resulting in a more dispersed airflow. Conversely, the lower space is relatively smaller, causing the airflow to be more concentrated due to rotation. From a spatial perspective, the lower airflow may be relatively "stronger," preventing excessive accumulation of silicon powder at the bottom and ensuring the permeability of the filter pore 502.

[0045] In one embodiment of this application, such as Figure 4As shown, it also includes a grinding reinforcement mechanism 6, which is connected to the preliminary grinding mechanism 4. The grinding reinforcement mechanism 6 is located between the preliminary grinding mechanism 4 and the filtration mechanism 5. The grinding reinforcement mechanism 6 includes: A cylindrical grinding block 61 is disposed inside the filter cover 51, and an elastic rubber ring is disposed between the cylindrical grinding block 61 and the frustum grinding block 44.

[0046] The bottom end of the T-shaped support column 62 is fixedly installed on the bottom surface of the cylindrical grinding block 61, and the upper end of the T-shaped support column 62 is set in the inner groove 63 opened on the bottom surface of the frustum grinding block 44 through a spherical hinge seat.

[0047] The second spring 64 is disposed in the inner groove 63. The bottom end of the second spring 64 is fixedly installed with the top end of the T-shaped support column 62, and the top end of the second spring 64 is fixedly installed with the top of the inner wall of the inner groove 63.

[0048] The second spring 64 provides elastic support for the cylindrical grinding block 61. When the cylindrical grinding block 61 is subjected to the resistance of the silicon powder or other external forces while grinding silicon powder, the second spring 64 will compress or extend. This elastic deformation allows the cylindrical grinding block 61 to produce a micro-vibration effect, changing the contact pressure and relative movement between it and the silicon powder. The micro-vibration enhances the grinding force on the silicon powder, allowing it to be ground more thoroughly. It also helps prevent the cylindrical grinding block 61 from being stuck by larger silicon powder particles, ensuring a smooth grinding process.

[0049] The upper grinding disc 65 is set above the inner wall of the filter cover 51, and grinding holes are opened on the surface of the upper grinding disc 65.

[0050] The upper grinding disc 65 and the cylindrical grinding block 61 together form a grinding pair. During the grinding process of silicon powder, the silicon powder is located between the cylindrical grinding block 61 and the upper grinding disc 65. As the cylindrical grinding block 61 rotates and vibrates, the silicon powder is squeezed and rubbed by both, which enables the silicon powder to be ground more finely, thereby improving the quality of the silicon powder.

[0051] Specifically, after the preliminary grinding mechanism 4 performs preliminary grinding on the silicon powder, the pre-ground silicon powder enters the filter cover 51 and is also within the range of action of the grinding enhancement mechanism 6.

[0052] The frustum grinding block 44 begins to rotate under the drive of the servo motor 41 and the mounting shaft 43, and drives the cylindrical grinding block 61 to rotate together through the T-shaped support column 62.

[0053] During rotation, the cylindrical grinding block 61 comes into contact with and grinds the silicon powder. At the same time, due to the action of the second spring 64, the cylindrical grinding block 61 vibrates up and down slightly, which enhances the grinding effect on the silicon powder.

[0054] The silicon powder is squeezed and rubbed between the cylindrical grinding block 61 and the upper grinding disc 65, and is further crushed and refined.

[0055] The silicon powder, after being processed by the grinding and strengthening mechanism 6, then enters the subsequent filtration mechanism 5 for filtration and impurity removal.

[0056] In this embodiment, the spiral blade 503 is used to further explain that in the high-purity silicon powder grinding device described herein, the operation of the grinding enhancement mechanism 6 and the spiral blade 503 in the filtration mechanism 5 work together to improve the grinding effect.

[0057] During the enhanced grinding process, the cylindrical grinding block 61, under the elastic force of the second spring 64, will move slightly up and down. During this process, silicon powder is prone to accumulating in clumps in local areas, affecting the uniformity and thoroughness of grinding. The spiral blade 503, sleeved on the outer wall of the mounting shaft 43, can push the surrounding air to form an upward airflow when rotating with the mounting shaft 43, thanks to its unique shape that is larger at the top and smaller at the bottom and its specific spiral direction.

[0058] This upward airflow can disturb the clumps of silicon powder, breaking up the aggregated state of the silicon powder, dispersing it and changing its position. In this way, the silicon powder that was originally in a localized state of accumulation can be redistributed, allowing it to make more full contact with the cylindrical grinding block 61 and the upper grinding disc 65, thereby achieving a more comprehensive and uniform grinding process. This effectively avoids the problem of insufficient grinding caused by silicon powder clumps, and further improves the grinding quality and efficiency of silicon powder.

[0059] In one embodiment of this application, such as Figure 4 As shown, the distance between the outer surface of the frustum grinding block 44 and the inner wall of the grinding cylinder 1 gradually decreases from top to bottom.

[0060] Specifically, as the silicon powder moves downward under the influence of centrifugal force and its own gravity, the distance between the frustum grinding block 44 and the inner wall of the grinding cylinder 1 gradually decreases, and the extrusion pressure and friction force on the silicon powder gradually increase. This progressive change in grinding force allows the silicon powder to be subjected to appropriate grinding action at different stages, gradually refining it from larger particles, thus ensuring the thoroughness and efficiency of grinding.

[0061] In one embodiment of this application, such as Figure 5 As shown, the bottom end of the auxiliary rod 56 is spherical, and the auxiliary rod 56 is made of rubber.

[0062] Specifically, the spherical shape and rubber material at the bottom of the auxiliary rod 56 work in conjunction with other components in the filter mechanism 5, such as the first spring 54 and the filter cover 51, to achieve the vibration function of the filter cover 51. The first spring 54 provides elastic restoring force, the auxiliary rod 56 transmits power, and the filter cover 51 vibrates under the action of both, thereby better filtering and screening silicon powder.

[0063] Specifically, feeding: the high-purity silicon powder to be ground enters the device from the top of the vertically arranged grinding cylinder 1.

[0064] Preliminary grinding: Start the servo motor 41 located directly below the grinding cylinder 1. The servo motor 41 drives the frustum grinding block 44 to rotate inside the grinding cylinder 1 via the mounting shaft 43. The distance between the outer surface of the frustum grinding block 44 and the inner wall of the grinding cylinder 1 gradually decreases from top to bottom. As the frustum grinding block 44 rotates, the silicon powder in the space between the two is subjected to increasing compressive force, thus achieving preliminary grinding and crushing.

[0065] Grinding Enhancement: After preliminary grinding, the silicon powder enters the filter cover 51, at which point the grinding enhancement mechanism 6 begins to work. When the frustum grinding block 44 rotates, it drives the cylindrical grinding block 61 to rotate together through the T-shaped support column 62. At the same time, the second spring 64 causes the cylindrical grinding block 61 to vibrate up and down slightly, which cooperates with the upper grinding disc 65 set above the inner wall of the filter cover 51 to further grind and refine the silicon powder.

[0066] Filtration and impurity removal: The ground and reinforced silicon powder is filtered inside the filter cover 51. Larger silicon powder particles are intercepted by the filter holes 502 on the bottom surface of the filter cover 51, while smaller silicon powder particles pass through the filter holes. At the same time, the adsorption cylinder 58 inside the filter holes 502 generates magnetism after being energized, adsorbing magnetic impurities in the silicon powder, thus achieving impurity removal.

[0067] Discharge: After filtration and impurity removal, the high-purity silicon powder is discharged from the discharge port 2 on the outer wall of the lower end of the grinding cylinder 1, completing the entire grinding process.

[0068] In summary, the high-purity silicon powder grinding apparatus of this application provides an environment more conducive to magnetic adsorption, where the silicon powder is dispersed under the action of airflow. After the silicon powder and impurities are dispersed, they can enter the effective working area of ​​the adsorption cylinder more evenly. The dispersed silicon powder increases the chance for each impurity to approach the adsorption cylinder and be adsorbed, thereby achieving complete adsorption of impurities, improving the purity of the silicon powder, and meeting the stringent requirement of extremely low impurity content for high-purity silicon powder.

[0069] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0071] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A grinding device for high-purity silicon powder, characterized in that, include: Grinding cylinder (1), arranged longitudinally; A preliminary grinding mechanism (4) is provided, which is connected to the grinding cylinder (1) through the grinding cylinder. A filter mechanism (5) is disposed inside the grinding cylinder (1). The filter mechanism (5) is installed between the inner wall of the grinding cylinder (1) and the preliminary grinding mechanism (4). The filtration mechanism (5) includes a filter cover (51) and multiple adsorption cylinders (58). The filter cover (51) is arranged longitudinally inside the grinding cylinder (1). An annular ring (52) is fixedly sleeved on the outer wall of the filter cover (51). The annular ring (52) is arranged in an annular groove (53) opened on the inner wall of the grinding cylinder (1). The bottom surface of the filter cover (51) has multiple sets of filter holes (502), and each set of adsorption cylinders (58) is respectively set inside the corresponding filter hole (502). A coil is provided inside the adsorption cylinder (58).

2. The grinding apparatus for high-purity silicon powder according to claim 1, characterized in that, The preliminary grinding mechanism (4) includes: A servo motor (41) is located directly below the grinding cylinder (1). A U-shaped motor base (42) is fixedly installed at the bottom of the servo motor (41). The upper end of the motor base (42) is fixedly installed to the bottom surface of the grinding cylinder (1) by bolts. The mounting shaft (43) is fixedly mounted at its bottom end to the output end of the servo motor (41), and the end of the mounting shaft (43) away from the servo motor (41) moves through the bottom surface of the grinding cylinder (1) and extends into the interior of the grinding cylinder (1). A frustum grinding block (44) is placed inside the grinding cylinder (1), and the bottom surface of the frustum grinding block (44) is fixedly installed with the top end of the mounting shaft (43).

3. The grinding apparatus for high-purity silicon powder according to claim 2, characterized in that, The filtration mechanism (5) further includes: The first spring (54) is in multiple sets. The multiple sets of first springs (54) are arranged in a ring array in the annular groove (53). The top end of the first spring (54) is fixedly installed with the bottom surface of the ring (52), and the bottom end of the first spring (54) is fixedly installed with the bottom of the inner wall of the annular groove (53). An auxiliary cover (55) is fitted onto the outside of the mounting shaft (43). The inner diameter of the auxiliary cover (55) is larger than the outer diameter of the mounting shaft (43). The bottom surface of the auxiliary cover (55) is fixedly installed to the bottom of the inner wall of the filter cover (51). The top surface of the auxiliary cover (55) has a plurality of circular grooves (57) arranged in a ring array. The number of auxiliary rods (56) corresponds to the number of circular grooves (57), and the top of the auxiliary rods (56) is fixedly installed on the bottom surface of the frustum grinding block (44).

4. The grinding apparatus for high-purity silicon powder according to claim 1, characterized in that, The filtration mechanism (5) further includes: The spiral blade (503) is sleeved on the outer wall of the mounting shaft (43), with its upper diameter being larger than its lower diameter, and its positive spiral direction being the same as the rotation direction of the device.

5. The grinding apparatus for high-purity silicon powder according to claim 1, characterized in that, It also includes a grinding reinforcement mechanism (6), which is connected to the preliminary grinding mechanism (4). The grinding reinforcement mechanism (6) is located between the preliminary grinding mechanism (4) and the filtration mechanism (5). The grinding reinforcement mechanism (6) includes: A cylindrical grinding block (61) is disposed inside the filter cover (51); The bottom end of the T-shaped support column (62) is fixedly installed on the bottom surface of the cylindrical grinding block (61), and the upper end of the T-shaped support column (62) is set in the inner groove (63) opened on the bottom surface of the frustum grinding block (44) through a spherical hinge seat; The second spring (64) is disposed in the inner groove (63). The bottom end of the second spring (64) is fixedly installed with the top end of the T-shaped support column (62), and the top end of the second spring (64) is fixedly installed with the top of the inner wall of the inner groove (63). The upper grinding disc (65) is positioned above the inner wall of the filter cover (51).

6. The grinding apparatus for high-purity silicon powder according to claim 1, characterized in that, The filtration mechanism (5) further includes a conductive disk (59) and a conductive block (501). Multiple sets of adsorption cylinders (58) are electrically connected to the conductive disk (59). The conductive block (501) is disposed on the inner wall of the grinding cylinder (1) by multiple sets of springs. The conductive block (501) is electrically connected to the conductive disk (59) and is connected to an external power source.

7. The grinding apparatus for high-purity silicon powder according to claim 2, characterized in that, The distance between the outer surface of the frustum grinding block (44) and the inner wall of the grinding cylinder (1) gradually decreases from top to bottom.

8. The grinding apparatus for high-purity silicon powder according to claim 3, characterized in that, The bottom end of the auxiliary rod (56) is spherical, and the auxiliary rod (56) is made of rubber.

Images