Interface test circuit, judgment method and test equipment

Abstract

The invention discloses an interface test circuit, a judgment method and test equipment, and relates to the field of interface test, and the interface test circuit comprises a connection module, a switch module, a test module and a control module. And the connection module is connected with a to-be-tested pin of the Type-C interface. The switch module connects or disconnects the test path of each to-be-tested pin. And the test module performs function test on each to-be-tested pin to obtain a test result. And the control module determines whether all the to-be-tested pins are successfully tested according to the test result and sends the test result to the to-be-tested equipment for display. Based on the scheme of the invention, all the pins of the Type-C interface can be tested, so that the function failure phenomenon of the untested pins is avoided. And meanwhile, whether all the to-be-tested pins are successfully tested or not is determined and sent to the to-be-tested equipment to be displayed, so that the problems of missing detection and error detection can be prevented, the test personnel can conveniently watch, and the test efficiency is relatively high.

Description

Technical Field

[0001] This application relates to the field of interface testing technology, specifically to an interface testing circuit, a judgment method, and a testing device. Background Technology

[0002] With the continuous development of society, electronic devices have become an indispensable part of people's daily lives, such as mobile phones, tablets, and computers. Currently, many electronic devices use the Universal Serial Bus (USB Type-C) interface to support various functions. These include various charging protocols, OTG (on-the-go) functionality, headphone functionality, and display port (DP) projection.

[0003] The Type-C interface is a reversible interface with identical functional structures on both sides. During the manufacturing process of electronic devices, it is often necessary to test various functions and pin configurations of the Type-C interface. However, existing interface testing equipment typically only tests one side of the Type-C interface, leading to potential functional failures on the untested side. Furthermore, existing interface testing circuits generally display test results directly on the equipment, requiring manual review, which can result in missed or incorrect tests and is inefficient.

[0004] Therefore, a new solution is urgently needed to address the aforementioned problems. Summary of the Invention

[0005] This application provides an interface testing circuit, a judgment method, and a testing device that can test all pins of a Type-C interface, thereby avoiding functional failures of untested pins. Simultaneously, it determines whether all pins under test have been successfully tested and sends the results to the device under test for display, thus preventing missed or incorrect tests and providing convenient viewing for testers, resulting in high testing efficiency.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] Firstly, an interface testing circuit is provided for performing interface testing on a device under test (DUT) with a Type-C interface. The interface testing circuit includes a connection module, a switch module, a test module, and a control module. The first end of the connection module is connected to the first end of the control module. The connection module is used to connect to the pins under test (DUT) of the Type-C interface; the DUT includes all pins of the Type-C interface. The first end of the switch module is connected to the second end of the control module, and the second end of the switch module is connected to the second end of the connection module. The switch module is used to turn the test path of each DUT pin on or off. The first end of the test module is connected to the third end of the control module, and the second end of the test module is connected to the third end of the switch module. The test module is used to perform functional testing on each DUT pin and obtain test results. The control module is used to control the connection between the connection module and the DUT pins, control the on / off state of the switch module, and determine whether all DUT pins have been successfully tested based on the test results and send the results to the DUT for display.

[0008] In this embodiment, the connection module is used to connect to the pins under test (DUT) of the Type-C interface, which include all pins of the Type-C interface. The switch module controls the on / off state of the test path for each DUT, and the test module performs functional tests on each DUT to obtain test results, thereby enabling testing of all pins of the Type-C interface and effectively preventing functional failures of untested pins. The control module determines whether all DUT pins have been successfully tested based on the test results and sends the results to the device under test for display, thus preventing missed or incorrect tests and providing convenient viewing for testers, resulting in high testing efficiency.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the test module includes an open-circuit test unit, the first end of which is connected to the third end of the control module, and the second end of which is connected to the third end of the switch module. The open-circuit test unit is used to perform open-circuit testing on the pin under test.

[0010] In this implementation, the open-circuit test unit is used to perform open-circuit tests on the pin under test, thereby preventing the pin under test from being in an open-circuit state, which would cause the corresponding function to fail.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the open circuit test includes: applying a high-level signal to the signal line of the pin under test; when the level of the pin under test is pulled high, it indicates that the pin under test is not in an open circuit state; when the level of the pin under test is not pulled high, it indicates that the pin under test is in an open circuit state.

[0012] In this implementation, the open circuit status of the pin under test is determined by whether the level of the pin under test is pulled high after a high-level signal is applied to the signal line of the pin under test.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the test module includes a short-circuit test unit, the first end of which is connected to the third end of the control module, and the second end of which is connected to the third end of the switch module. The short-circuit test unit is used to perform short-circuit testing on the pin under test.

[0014] In this implementation, the short-circuit test unit is used to perform short-circuit tests on the pin under test, thereby preventing the pin under test from being short-circuited and causing the corresponding function to fail.

[0015] In conjunction with the first aspect, the short-circuit test includes: applying a high-level signal to the signal line of the pin under test and detecting the status of other signal lines; when other signal lines are not accidentally pulled high, it indicates that the pin under test is not short-circuited; when other signal lines are accidentally pulled high, it indicates that the pin under test is short-circuited.

[0016] In this implementation, the short-circuit status of the pin under test is determined by whether other signal lines are unexpectedly pulled high after a high-level signal is applied to the signal line of the pin under test.

[0017] In conjunction with the first aspect, some implementations of the first aspect also include a protection module, wherein a first end of the protection module is connected to a second end of the connection module, and a second end of the protection module is connected to a second end of the switch module. The protection module is used to provide overcurrent protection when the current of the connection module exceeds a preset current.

[0018] In this implementation, the protection module is used to provide overcurrent protection when the current of the connected module exceeds a preset current, thereby preventing excessive current from damaging the electronic components in the interface test circuit.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the control module is also used to control the test module to continue testing the next pin under test when the test result of the pin under test is successful, until all pins under test are tested; and to output the pin under test that failed the test when the test result of the pin under test is unsuccessful.

[0020] In this implementation, the control module controls the testing process of all pins under test. When the test result of a pin is successful, the next pin under test is tested, and so on, until all pins under test are tested. When the test result of a pin under test is unsuccessful, the failed pin is output and the testing stops.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the control module is also used to control the switch module to sequentially turn on or off all specified pins corresponding to the specified function when performing a specified function test on the Type-C interface, and to control the test module to perform a function test on each specified pin.

[0022] In this implementation, the control module is also used to perform specified functional tests on the Type-C interface, thereby selectively performing functional tests on certain specified pins of the Type-C interface and improving testing efficiency.

[0023] Optionally, the specified function may include one or more of the following: fast charging function, headphone function, DP function, or OTG function.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the control module includes an interface testing mode and a storage mode, which are performed alternately; when the control module is in the interface testing mode, it performs interface testing on the Type-C interface; when the control module is in the storage mode, it stores the test results of the Type-C interface.

[0025] In this implementation, the control module can alternate between interface test mode and storage mode, thereby storing the test results of each pin under test of the Type-C interface.

[0026] Secondly, an interface testing device is provided, including an interface testing circuit and a memory chip, wherein the memory chip is used to store the test results of the interface testing circuit.

[0027] In this implementation, the test results of the interface test circuit can be stored using a memory chip.

[0028] Thirdly, a method for judging test results is provided. Based on the interface test circuit, the method includes: reading a text file of test results; parsing the text file to obtain the test results for all pins under test; displaying the failed pins when some pins fail to pass the test, and displaying a test success interface when all pins pass the test successfully.

[0029] In this implementation, the test results for all pins under test are obtained by reading and parsing a text file containing the test results. If some pins fail the test, the failed pins are displayed directly for the tester to review. If all pins pass the test, a test success screen is displayed, allowing the device under test to proceed to the next test.

[0030] In conjunction with the third aspect, some implementations of the third aspect involve reading the text format file of the test results, including: creating the filename of the text format file; creating a file input stream based on the filename and defining the encoding format of the file input stream; reading the data from the text format file of the test results according to the file input stream; appending the data from the text format file to the file input stream when a marker bit appears at the end of the file input stream; combining the data in the file input stream into a list of strings; and closing the file input stream.

[0031] In this implementation, the process of reading the text-formatted file of test results can include the following steps: First, create a filename for the text-formatted file. Then, create a file input stream based on the filename and define the encoding format of the file input stream. Next, read the data from the text-formatted file of test results using the file input stream. Determine if a marker bit appears at the end of the file input stream. If a marker bit appears, append the data from the text-formatted file to the file input stream. Otherwise, continue reading the data from the text-formatted file of test results using the file input stream. Then, combine the data in the file input stream into a list of strings. Finally, close the file input stream to release the memory resources it occupies.

[0032] In conjunction with the third aspect, in some implementations of the third aspect, parsing a text format file to obtain all test results for the pins under test includes: reading the contents of the text format file containing the test results; segmenting the contents of the text format file into multiple data segments; parsing each data segment to obtain key-value pairs; extracting key information from the key-value pairs; and obtaining the test results for all pins under test from the key information.

[0033] In this implementation, the process of parsing a text format file to obtain the test results of all pins under test can include the following steps: First, read the contents of the text format file containing the test results, and segment the contents of the text format file to obtain multiple data segments. Then, parse each data segment to obtain key-value pairs, and extract key information from the key-value pairs, such as the results section. Finally, obtain the test results of all pins under test from the key information, such as the test results of the 24 pins of the Type-C interface.

[0034] Fourthly, an electronic device is provided, comprising: one or more processors, and a memory. The memory is coupled to the one or more processors, the memory being used to store computer program code, the computer program code including computer instructions, wherein the one or more processors invoke the computer instructions to cause the electronic device to perform the method.

[0035] Fifthly, a chip system is provided, the chip system being applied to an electronic device, the chip system including one or more processors, the one or more processors being configured to invoke computer instructions to cause the electronic device to perform the method.

[0036] In a sixth aspect, a computer-readable storage medium is provided, the computer-readable storage medium including instructions that, when executed on an electronic device, cause the electronic device to perform the method. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of a scenario for a mobile communication system to which this application embodiment applies;

[0038] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0039] Figure 3 This is a schematic diagram of the structure of a software system for an electronic device provided in an embodiment of this application;

[0040] Figure 4 This is a schematic diagram of the structure of a Type-C interface provided in an embodiment of this application;

[0041] Figure 5 A schematic diagram of a cracked pin structure of a Type-C interface according to an embodiment of this application;

[0042] Figure 6 This is a schematic diagram of the structure of an interface test circuit provided in an embodiment of this application;

[0043] Figure 7 This is a schematic diagram of the structure of an interface test circuit provided in another embodiment of this application;

[0044] Figure 8 A flowchart of an open-circuit test method provided in an embodiment of this application;

[0045] Figure 9 This is a schematic diagram of the structure of an interface test circuit provided in another embodiment of this application;

[0046] Figure 10 A flowchart of a short-circuit testing method provided in an embodiment of this application;

[0047] Figure 11 This is a schematic diagram of the structure of an interface test circuit provided in another embodiment of this application;

[0048] Figure 12 This is a schematic diagram of the structure of an interface testing device provided in an embodiment of this application;

[0049] Figure 13 A flowchart illustrating a method for determining test results according to an embodiment of this application;

[0050] Figure 14 A flowchart illustrating another method for determining test results provided in this application embodiment;

[0051] Figure 15 A flowchart illustrating another method for determining test results provided in this application embodiment;

[0052] Figure 16 This is a schematic diagram of the structure of another electronic device. Detailed Implementation

[0053] The technical solutions in the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; the word "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0054] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0055] To facilitate understanding of the embodiments of this application, the relevant concepts involved in the embodiments of this application will be briefly explained first.

[0056] 1. USB Type-C interface.

[0057] In the field of electronics, the USB Type-C interface is a type of USB interface that supports reversible insertion. It also supports high-current and high-voltage charging, contributing to faster charging speeds. The USB Type-C interface supports bidirectional power supply, allowing it to charge electronic devices themselves or power external devices. Furthermore, the USB Type-C interface offers strong expandability, enabling the transmission of audio and video signals and thus allowing for various audio and video output interfaces.

[0058] 2. OTG function.

[0059] In the field of electronics, OTG functionality is primarily used for connecting and exchanging data between various electronic or mobile devices. OTG enables USB devices, such as media players or mobile phones, to transform from USB peripherals into USB hosts, allowing them to connect and communicate with other USB devices. Under normal circumstances, these OTG-enabled USB devices and USB hosts (such as desktop or laptop computers) still function as USB peripherals.

[0060] For example, devices that support OTG functionality include USB printers or tablets. USB printers can directly connect a USB flash drive to read files and print them without connecting to a computer. Tablets can directly connect USB storage drives, keyboards, or mice to expand their external hardware capabilities. OTG functionality allows users to directly connect their phones to external devices such as USB flash drives, card readers, MP3 players, keyboards, and digital cameras for data transfer, input operations, or charging without a computer as an intermediary. In addition, OTG functionality can expand the memory of phones and tablets, connect mice and keyboards, and even power another phone or tablet.

[0061] 3. Screen mirroring function.

[0062] In the field of electronics, DisplayPort (DP) is a common digital video and audio interface, primarily used for connecting video sources to devices such as displays, while also supporting audio, USB, and other data transfer methods. In other words, DP provides an efficient and convenient screen mirroring method, allowing you to project content from your mobile phone or computer onto a monitor or television. DP offers low transmission latency, high image clarity, excellent connectivity, and stability, making it widely applicable for presentations, meetings, and training sessions in corporate and educational settings.

[0063] The above is a brief introduction to the terms used in the embodiments of this application, and will not be repeated below.

[0064] With the continuous development of technology and society, electronic devices have become an indispensable part of people's daily lives, such as mobile phones, tablets, and computers. To facilitate user experience, many electronic devices now use USB Type-C interfaces to support various functions. These include multiple charging protocols, OTG functionality, headphone support, and screen mirroring. The USB Type-C interface is a reversible interface that can be plugged in either way.

[0065] Before providing a detailed explanation of the interface testing circuit provided in the embodiments of this application, the application scenarios and related technologies of the electronic device will be described first.

[0066] Figure 1This is a schematic diagram of a scenario for a mobile communication system to which an embodiment of this application applies. For example... Figure 1 As shown, users can communicate with base station 20 using electronic device 10. This application does not specifically limit the type of electronic device 10. In some embodiments, electronic device 10 can be a mobile phone, wearable device (e.g., smart bracelet, smartwatch, earphones, etc.), tablet computer, laptop computer, handheld computer, ultra-mobile personal computer (UMPC), cellular phone, personal digital assistant (PDA), augmented reality (AR) / virtual reality (VR) device, or other IoT (Internet of Things) devices. It can also be a television, large screen, printer, projector, etc. For ease of understanding, the following embodiments use a mobile phone as an example for illustrative purposes.

[0067] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0068] like Figure 2 As shown in the embodiments of this application, the electronic device 10 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, a first antenna 1, a second antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0069] It should be noted that, Figure 2 The structure shown does not constitute a specific limitation on the electronic device. In other embodiments of this application, the electronic device may include a... Figure 2 The components shown may include more or fewer components, or the electronic device may include... Figure 2 The components shown may be a combination of certain components, or the electronic device may include... Figure 2 Sub-components of some of the components shown. Figure 2 The components shown can be implemented in hardware, software, or a combination of both.

[0070] Processor 110 may include one or more processing units. For example, processor 110 may include at least one of the following processing units: application processor (AP), modem processor, graphics processing unit (GPU), image signal processor (ISP), controller, video codec, digital signal processor (DSP), baseband processor, and neural network processing unit (NPU). These different processing units may be independent devices or integrated devices. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution.

[0071] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0072] USB interface pin 130 is used to connect with other devices, thereby enabling electronic device 10 to communicate with the outside world or perform charging functions. For example, it supports various charging protocols, On-the-Go (OTG) USB functionality, analog headset functionality, digital headset functionality, and DisplayPort (DP) projection functionality, etc. For instance, USB interface pin 130 can be a Type-C interface.

[0073] Figure 2 The connection relationships between the modules shown are merely illustrative and do not constitute a limitation on the connection relationships between the modules of the electronic device. Optionally, the modules of the electronic device may also adopt a combination of various connection methods described in the above embodiments.

[0074] The charging management module 140 receives power from the charger. While charging the battery 142, the charging management module 140 can also power electronic devices via the power management module 141. The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, and powers the processor 110, internal memory 121, display screen 194, camera 193, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (e.g., leakage current, impedance). Optionally, the power management module 141 can be located within the processor 110, or the power management module 141 and the charging management module 140 can be located in the same device.

[0075] The wireless communication function of the electronic device can be implemented through devices such as a first antenna 1, a second antenna 2, a mobile communication module 150, a wireless communication module 160, a modem processor, and a baseband processor. The first antenna 1 and the second antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in the electronic device can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization.

[0076] The mobile communication module 150 can provide a wireless communication solution for use in electronic devices, such as at least one of the following: a second-generation (2G) mobile communication solution, a third-generation (3G) mobile communication solution, a fourth-generation (5G) mobile communication solution, or a fifth-generation (5G) mobile communication solution.

[0077] The modem processor may include a modulator and a demodulator. The modulator modulates a low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates a received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through audio devices (e.g., speaker 170A, receiver 170B) or displays images or videos through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0078] Similar to the mobile communication module 150, the wireless communication module 160 can also provide wireless communication solutions for use in electronic devices, such as at least one of the following: wireless local area networks (WLAN), Bluetooth (BT), Bluetooth Low Energy (BLE), ultra-wideband (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technology.

[0079] In some embodiments, the antenna 1 of the electronic device is coupled to the mobile communication module 150, and the antenna 2 of the electronic device is coupled to the wireless communication module 160, enabling the electronic device to communicate with the network and other electronic devices via wireless communication technology.

[0080] The external storage interface 120 can be used to connect an external memory card, such as a secure digital (SD) card, to expand the storage capacity of the electronic device. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, music, video, and other files can be saved on the external memory card.

[0081] Internal memory 121 can be used to store computer executable program code, which includes instructions. Internal memory 121 may include a program storage area and a data storage area.

[0082] In some embodiments, pressure sensor 180A may be disposed on display screen 194. Pressure sensor 180A can be of many types, such as resistive pressure sensor, inductive pressure sensor, or capacitive pressure sensor. A capacitive pressure sensor may include at least two parallel plates with conductive material. When force is applied to pressure sensor 180A, the capacitance between the electrodes changes, and the electronic device determines the pressure intensity based on the change in capacitance. When a touch operation is applied to display screen 194, the electronic device detects the touch operation based on pressure sensor 180A. The electronic device may also calculate the touch position based on the detection signal from pressure sensor 180A. In some embodiments, touch operations applied to the same touch position but with different touch operation intensities may correspond to different operation commands. For example, when a touch operation with an intensity less than a first pressure threshold is applied to the SMS application icon, a command to view an SMS message is executed; when a touch operation with an intensity greater than or equal to the first pressure threshold is applied to the SMS application icon, a command to create a new SMS message is executed.

[0083] The fingerprint sensor 180H is used to collect fingerprints. Electronic devices can use the collected fingerprint characteristics to unlock devices, access app locks, take photos, and answer calls.

[0084] Touch sensor 180K, also known as a touch device, can be disposed on display screen 194. The touch sensor 180K and display screen 194 together form a touchscreen, also known as a touch screen. Touch sensor 180K is used to detect touch operations applied to or near it. Touch sensor 180K can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180K may also be disposed on the surface of the electronic device and in a different location from display screen 194.

[0085] Button 190 includes a power button and volume buttons. Button 190 can be a mechanical button or a touch button. The electronic device can receive button input signals and realize functions related to the button input signals.

[0086] The following is a brief introduction to the software systems involved in electronic devices.

[0087] Figure 3 This is a schematic diagram of the structure of a software system for an electronic device provided in an embodiment of this application. For example... Figure 3 As shown, this software system may include an application layer, a system framework layer (FWK), a system runtime layer, a hardware abstraction layer (HAL), and a kernel layer. These will be described in detail below.

[0088] The application layer can include a series of application packages, such as desktop applications, contact applications, calling applications, SMS, gallery, video applications, calendar, camera, navigation applications, map applications, Bluetooth, WLAN, email clients, and other applications.

[0089] The system framework layer provides application programming interfaces (APIs) and programming frameworks for applications in the application layer. The system framework layer may include predefined functions, such as functions for receiving events sent by the system framework layer.

[0090] Specifically, the system framework layer may include Views, ContentProviders, Resource Manager, Notification Manager, Activity Manager, Windows Manager, etc.

[0091] A view system includes visual controls, such as controls for displaying text and controls for displaying images. View systems can be used to build applications. A display interface can consist of one or more views. For example, a display interface including a text notification icon could include views for displaying text and views for displaying images.

[0092] Content providers enable applications to access data from other applications (such as a contacts database) or share their own data. Content providers store and retrieve data, making that data accessible to applications. This data can include videos, images, audio, made and received phone calls, browsing history and bookmarks, phone books, etc.

[0093] The file explorer provides applications with various resources, such as localized strings, icons, images, layout files, video files, and more.

[0094] The notification manager allows applications to display notifications in the status bar. These notifications can be used to deliver informational messages and can disappear automatically after a short pause, requiring no user interaction. For example, the notification manager can be used to notify users of completed downloads or message alerts. The notification manager can also display notifications as icons or scrolling text in the top status bar, such as notifications from background applications, or as dialog boxes on the screen. Examples include displaying text messages in the status bar, emitting sounds, vibrating electronic devices, and flashing indicator lights.

[0095] The Activity Manager is used to manage the application lifecycle and provides commonly used navigation and back functions.

[0096] The window manager is used to manage windowed applications. It can retrieve screen size, determine the presence of a status bar, lock the screen, and capture screenshots, among other things.

[0097] The system runtime library layer includes program libraries and runtime libraries. For example, in the Android system, program libraries contain C / C++ libraries that can be used by different components within the Android system. They provide services to developers through the Android application framework. The runtime library includes a core library that provides most of the functionality of the Java programming language core library.

[0098] The Hardware Abstraction Layer (HAL) is the interface layer between the hardware and software layers, used to abstract the hardware. The HAL includes audio / video interfaces, voice communication interfaces, and wireless fidelity (WiFi) interfaces, among others.

[0099] The kernel layer can include display drivers, camera drivers, sensor drivers, etc., which are used to drive the relevant hardware in the hardware layer, such as displays, cameras, and sensors.

[0100] Figure 4 This is a schematic diagram of the structure of a Type-C interface provided in an embodiment of this application. Figure 4 As shown, the Type-C interface consists of two sides, with a total of 24 pins. The first side includes pins A1 to A12, and the second side includes pins B1 to B12. Specifically, the 24 pins of the Type-C interface are shown in Table 1 below:

[0101] Table 1 Type-C Interface Pinout

[0102] A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 GND TX1+ TX1- <![CDATA[V BUS ]]> CC1 D+ D- SBU1 <![CDATA[V BUS ]]> RX2- RX2+ GND GND RX1+ RX1- <![CDATA[V BUS ]]> SBU2 D- D+ CC2 <![CDATA[V BUS ]]> TX2- TX2+ GND B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1

[0103] The pin functions of the Type-C interface are shown in Table 2 below:

[0104] Table 2 USB Type-C Interface Pin Functions

[0105] pins / ports name pins / ports name GND Grounding port TX1+ First differential signal positive transmission port TX1- First differential signal negative transmission port VBUS USB power port CC1 First configured channel port D+ Positive data port D- Negative phase data port SBU1 First sideband uses port RX2- Second differential signal negative receiver port RX2+ Second differential signal positive receiver port RX1- First differential signal negative receiving port RX1+ First differential signal positive receiving port SBU2 Second sideband uses port CC2 Second configuration channel port TX2- Second differential signal negative transmission port TX2+ Second differential signal positive transmission port

[0106] The following section details common problems encountered during Type-C interface testing in the manufacturing process of electronic devices.

[0107] Figure 5 This is a schematic diagram of a cracked pin structure of a Type-C interface according to an embodiment of this application. Figure 5As shown, the electronic device 10 includes a sub-board 101 and a USB interface pin 130. The USB interface pin 130 is typically soldered to the sub-board 101 by melting soldering material (such as solder rod). For example, the USB interface can be a Type-C interface. Type-C interface pins may crack due to incomplete soldering or weak soldering, affecting the fast charging, headphone, DisplayPort, or OTG functions of the Type-C interface. For instance, cracks in the D+ and D- pins of the Type-C interface can cause an open circuit, affecting the data transmission function of the Type-C interface.

[0108] During the manufacturing process of electronic devices, the pins and functions of the Type-C interface are tested. However, existing interface testing circuits typically only test one side or a portion of the Type-C interface's functions, failing to fully cover all pins and functions. This can lead to functional failures on the untested side. Furthermore, existing interface testing circuits generally display test results directly on the testing equipment, requiring manual review, which is prone to missed or incorrect tests and results in low testing efficiency.

[0109] In view of this, embodiments of this application provide an interface testing circuit, a judgment method, and a testing device, which can test all pins of the Type-C interface, thereby avoiding functional failures of untested pins. Simultaneously, it determines whether all pins under test have been successfully tested and sends the results to the device under test for display, thus preventing missed or incorrect tests and providing convenient viewing for testers, resulting in high testing efficiency.

[0110] The following is combined Figures 6 to 11 This application further details a solution for improving the testing quality of electronic devices, reducing missed and false detections, and increasing testing efficiency through the interface testing circuit provided. In the embodiments of this application, the connection between two electrical modules / electronic devices includes communication connections and electrical connections. A communication connection here refers to a connection capable of transmitting communication signals. Communication signals can be electrical signals or optical signals, and are not limited here. An electrical connection refers to a connection capable of transmitting electrical signals. Electrical connections include direct connections and indirect connections. For example, a direct connection between device A and device B means that device A and device B are connected by a wire to transmit electrical signals. An indirect connection between device A and device B means that the first end of device A is connected to device C by a wire, and the second end of device C is connected to device B by a wire, so that device A and device B can transmit electrical signals through device C. For ease of understanding, in the following description, "electrical connection" will be simply referred to as a connection.

[0111] Figure 6This is a schematic diagram of the structure of an interface test circuit provided in an embodiment of this application. Figure 6 As shown, this application embodiment provides an interface test circuit 30, which is used to perform interface testing on a device under test (DUT) equipped with a Type-C interface. The interface test circuit 30 may include a connection module 301, a switch module 302, a test module 303, and a control module 304.

[0112] Exemplarily, the connection module 301 includes two ends. The first end of the connection module 301 is connected to the first end of the control module 304. The connection module 301 is used to connect to the pins under test of the Type-C interface. The pins under test include all pins of the Type-C interface. For example, the 24 pins of the Type-C interface, as shown in Table 1 above. This allows the connection module 301 to connect to all 24 pins of the Type-C interface of the device under test, so that all 24 pins can be subsequently tested, avoiding functional failure of untested pins. The connection module 301 can be a Type-C interface connector with model number USB_CON_24P_JAE.

[0113] For example, the switch module 302 includes three terminals. The first terminal of the switch module 302 is connected to the second terminal of the control module 304, and the second terminal of the switch module 302 is connected to the second terminal of the connection module 301. The switch module 302 is used to turn on or off the test path of each pin under test. For example, the switch module 302 can be a multiplexer / analog switch of model BL1530, TUSB564, or CH440G.

[0114] It should be understood that the switch module 302 may have multiple sub-switches, each of which can be connected to a pin under test (DUT), thereby controlling the test path of each DUT. When a sub-switch is on, the test path of the corresponding DUT is open, and the back-end test module 303 can perform functional testing on the DUT. When a sub-switch is off, the test path of the corresponding DUT is closed, and the test module 303 cannot perform functional testing on the DUT.

[0115] It should be noted that the switch module 302 can also simultaneously control the test path of all pins under test to be turned on or off, thereby controlling whether to perform functional tests on the pins of the Type-C interface.

[0116] For example, the test module 303 includes two terminals. The first terminal of the test module 303 is connected to the third terminal of the control module 304, and the second terminal of the test module 303 is connected to the third terminal of the switch module 302. The test module 303 is used to perform functional tests on each pin under test to obtain test results, thereby obtaining the test results for all pins under test.

[0117] It should be noted that functional testing can include open-circuit testing and short-circuit testing to determine whether the pin under test has cracked pins or short circuits, which would affect the function of the pin under test.

[0118] It should be understood that the test module 303 may include multiple test units for performing functional tests on each pin under test individually, or it may include a single test unit for performing functional tests on each pin under test sequentially.

[0119] For example, the control module 304 is used to control the connection between the connection module 301 and the pin under test, control the on and off states of the switch module 302, and determine whether all pins under test have been successfully tested based on the test results and send the results to the device under test for display. This allows the tester to directly obtain the test results of all pins under test on the device under test, preventing missed or incorrect tests, and providing convenient viewing for the tester, resulting in high testing efficiency.

[0120] It should be understood that, in practical applications, the function of the interface test circuit 30 can also be called the automatic in-circuit-test (ICT) function.

[0121] It should be noted that when the test module 303 successfully tests a certain pin under test, the control module 304 can control the test module 303 to continue testing the next pin under test until all pins under test have been tested. After that, a "pass" flag is sent to the device under test for display, so that the tester can check. At the same time, the device under test will automatically jump to the next test stage.

[0122] When the test result of the pin under test is a failure, the pin under test that failed the test is output to the device under test for display so that the tester can check and repair the pin that failed the test.

[0123] In another embodiment, the control module 304 is also used to perform a specified function test on the Type-C interface. For example, the specified function test could be to establish a USB 2.0 signal link or a USB 3.0 signal link on the Type-C interface. When performing a specified function test on the Type-C interface, the control module 304 controls the switch module 302 to sequentially turn on or off all specified pins corresponding to the specified function. Simultaneously, the control module 304 controls the test module 303 to perform a function test on each specified pin. The specified function may include one or more of the following: fast charging function, headphone function, DP function, or OTG function.

[0124] For example, when the control module 304 performs USB OTG 3.0 function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, TX1+ pin, TX1- pin, TX2+ pin, TX2- pin, RX1+ pin, RX1- pin, RX2+ pin, RX2- pin, GND pin, SBU1 pin, and SBU2 pin of the Type-C interface. Alternatively, when the control module 304 performs fast charging function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, VBUS pin, and GND pin of the Type-C interface.

[0125] It should be noted that the control module 304 may include an interface test mode and a storage mode. These modes generally alternate. When the control module 304 is in interface test mode, it performs interface tests on the Type-C interface. Once the interface test is complete, the control module 304 enters storage mode. In storage mode, the control module 304 stores the test results of the Type-C interface and creates a text file (TXT). This TXT file may include the test results for the 24 pins of the Type-C interface. For example, pin X: result = 0 indicates that the pin test passed, and result = 1 indicates that the pin test failed. It should be understood that the interface test mode and storage mode can be performed simultaneously under certain special circumstances. No restrictions are imposed here.

[0126] It should be noted that the control module 304 can determine whether to enter the interface test mode or the storage mode by the status of the CC1 and CC2 pins.

[0127] The test module 303 will be described in two parts below.

[0128] Part 1 introduces and explains the interface test circuit 30, including the open circuit test unit 3031.

[0129] Figure 7 This is a schematic diagram of the structure of another interface test circuit provided in this application embodiment. Figure 7 As shown, this application embodiment provides an interface test circuit 30, which is used to perform interface testing on a device under test (DUT) equipped with a Type-C interface. The interface test circuit 30 may include a connection module 301, a switch module 302, a test module 303, and a control module 304.

[0130] Exemplarily, the connection module 301 includes two ends. The first end of the connection module 301 is connected to the first end of the control module 304. The connection module 301 is used to connect to the pins under test of the Type-C interface. The pins under test include all pins of the Type-C interface. For example, the 24 pins of the Type-C interface, as shown in Table 1 above. This allows the connection module 301 to connect to all 24 pins of the Type-C interface of the device under test, so that all 24 pins can be subsequently tested, avoiding functional failure of untested pins. The connection module 301 can be a Type-C interface connector with model number USB_CON_24P_JAE.

[0131] For example, the switch module 302 includes three terminals. The first terminal of the switch module 302 is connected to the second terminal of the control module 304, and the second terminal of the switch module 302 is connected to the second terminal of the connection module 301. The switch module 302 is used to turn on or off the test path of each pin under test. For example, the switch module 302 can be a multiplexer / analog switch of model BL1530, TUSB564, or CH440G.

[0132] It should be understood that the switch module 302 may have multiple sub-switches, each of which can be connected to a pin under test (DUT), thereby controlling the test path of each DUT. When a sub-switch is on, the test path of the corresponding DUT is open, and the back-end test module 303 can perform functional testing on the DUT. When a sub-switch is off, the test path of the corresponding DUT is closed, and the test module 303 cannot perform functional testing on the DUT.

[0133] It should be noted that the switch module 302 can also simultaneously control the test path of all pins under test to be turned on or off, thereby controlling whether to perform functional tests on the pins of the Type-C interface.

[0134] For example, the test module 303 includes two terminals. The first terminal of the test module 303 is connected to the third terminal of the control module 304, and the second terminal of the test module 303 is connected to the third terminal of the switch module 302. The test module 303 is used to perform functional tests on each pin under test to obtain test results, thereby obtaining the test results for all pins under test.

[0135] It should be noted that functional testing can include open-circuit testing and short-circuit testing to determine whether the pin under test has cracked pins or short circuits, which would affect the function of the pin under test.

[0136] It should be understood that the test module 303 can include multiple test units for functional testing of each pin under test individually, but this is more expensive. Alternatively, it can include a single test unit for sequential functional testing of each pin under test, which is less expensive. Since the overall testing time is shorter, this test structure is more commonly chosen in practical applications.

[0137] In one embodiment, the test module 303 includes an open-circuit test unit 3031. The open-circuit test unit 3031 has two terminals. The first terminal of the open-circuit test unit 3031 is connected to the third terminal of the control module 304, and the second terminal of the open-circuit test unit 3031 is connected to the third terminal of the switch module 302. The open-circuit test unit 3031 is used to perform open-circuit tests on all pins under test, thereby preventing open-circuit faults in the Type-C interface pins from affecting the pin functionality.

[0138] For example, the control module 304 is used to control the connection between the connection module 301 and the pin under test, control the on and off states of the switch module 302, and determine whether all pins under test have been successfully tested based on the test results and send the results to the device under test for display. This allows the tester to directly obtain the test results of all pins under test on the device under test, preventing missed or incorrect tests, and providing convenient viewing for the tester, resulting in high testing efficiency.

[0139] It should be noted that when the test module 303 successfully tests a certain pin under test, the control module 304 can control the test module 303 to continue testing the next pin under test until all pins under test have been tested. After that, a "pass" flag is sent to the device under test for display, so that the tester can check. At the same time, the device under test will automatically jump to the next test stage.

[0140] When the test result of the pin under test is a failure, the pin under test that failed the test is output to the device under test for display so that the tester can check and repair the pin that failed the test.

[0141] In another embodiment, the control module 304 is also used to perform a specified function test on the Type-C interface. For example, the specified function test could be to establish a USB 2.0 signal link or a USB 3.0 signal link on the Type-C interface. When performing a specified function test on the Type-C interface, the control module 304 controls the switch module 302 to sequentially turn on or off all specified pins corresponding to the specified function. Simultaneously, the control module 304 controls the test module 303 to perform a function test on each specified pin. The specified function may include one or more of the following: fast charging function, headphone function, DP function, or OTG function.

[0142] For example, when the control module 304 performs USB OTG 3.0 function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, TX1+ pin, TX1- pin, TX2+ pin, TX2- pin, RX1+ pin, RX1- pin, RX2+ pin, RX2- pin, GND pin, SBU1 pin, and SBU2 pin of the Type-C interface. Alternatively, when the control module 304 performs fast charging function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, VBUS pin, and GND pin of the Type-C interface.

[0143] It should be noted that the control module 304 may include an interface test mode and a storage mode. These modes generally alternate. When the control module 304 is in interface test mode, it performs interface tests on the Type-C interface. Once the interface test is complete, the control module 304 enters storage mode. In storage mode, the control module 304 stores the test results of the Type-C interface and creates a text file (TXT). This TXT file may include the test results for the 24 pins of the Type-C interface. For example, pin X: result = 0 indicates that the pin test passed, and result = 1 indicates that the pin test failed. It should be understood that the interface test mode and storage mode can be performed simultaneously under certain special circumstances. No restrictions are imposed here.

[0144] It should be noted that the control module 304 can determine whether to enter the interface test mode or the storage mode by the status of the CC1 and CC2 pins.

[0145] Figure 8 This is a flowchart of an open-circuit test method provided in an embodiment of this application. Figure 8 As shown in the figure, this application provides an open-circuit test method, which may specifically include the following steps:

[0146] S301. The interface test equipment applies a high-level signal to the signal line of the pin under test.

[0147] It should be understood that when performing open-circuit testing on all pins of a Type-C interface, a high-level signal can be applied to the signal of each pin under test individually.

[0148] S302. The interface test equipment determines whether the signal line of the pin under test is maintained at a high level.

[0149] For example, it can be determined whether the signal line of the pin under test is maintained at a high level by detecting the signal line voltage value.

[0150] S303. When the voltage level of the pin under test is pulled high, it indicates that the pin under test is in an open-circuit state. This means that the pin under test of the Type-C interface is in a normal connection state and signal transmission can be performed through the pin under test.

[0151] S304. When the voltage level of the pin under test is not pulled high, it indicates that the pin under test is in an open circuit state. This means that the pin under test of the Type-C interface is disconnected, and the electronic device needs to be returned to the factory for repair to ensure that all pins of the Type-C interface are in a normal connection state.

[0152] Part Two introduces and explains the interface test circuit 30, including the short-circuit test unit 3032.

[0153] Figure 9 This is a schematic diagram of the structure of another interface test circuit provided in this application embodiment. Figure 9 As shown, this application embodiment provides an interface test circuit 30, which is used to perform interface testing on a device under test (DUT) equipped with a Type-C interface. The interface test circuit 30 may include a connection module 301, a switch module 302, a test module 303, and a control module 304.

[0154] Exemplarily, the connection module 301 includes two ends. The first end of the connection module 301 is connected to the first end of the control module 304. The connection module 301 is used to connect to the pins under test of the Type-C interface. The pins under test include all pins of the Type-C interface. For example, the 24 pins of the Type-C interface, as shown in Table 1 above. This allows the connection module 301 to connect to all 24 pins of the Type-C interface of the device under test, so that all 24 pins can be subsequently tested, avoiding functional failure of untested pins. The connection module 301 can be a Type-C interface connector with model number USB_CON_24P_JAE.

[0155] For example, the switch module 302 includes three terminals. The first terminal of the switch module 302 is connected to the second terminal of the control module 304, and the second terminal of the switch module 302 is connected to the second terminal of the connection module 301. The switch module 302 is used to turn on or off the test path of each pin under test. For example, the switch module 302 can be a multiplexer / analog switch of model BL1530, TUSB564, or CH440G.

[0156] It should be understood that the switch module 302 may have multiple sub-switches, each of which can be connected to a pin under test (DUT), thereby controlling the test path of each DUT. When a sub-switch is on, the test path of the corresponding DUT is open, and the back-end test module 303 can perform functional testing on the DUT. When a sub-switch is off, the test path of the corresponding DUT is closed, and the test module 303 cannot perform functional testing on the DUT.

[0157] It should be noted that the switch module 302 can also simultaneously control the test path of all pins under test to be turned on or off, thereby controlling whether to perform functional tests on the pins of the Type-C interface.

[0158] For example, the test module 303 includes two terminals. The first terminal of the test module 303 is connected to the third terminal of the control module 304, and the second terminal of the test module 303 is connected to the third terminal of the switch module 302. The test module 303 is used to perform functional tests on each pin under test to obtain test results, thereby obtaining the test results for all pins under test.

[0159] It should be noted that functional testing can include open-circuit testing and short-circuit testing to determine whether the pin under test has cracked pins or short circuits, which would affect the function of the pin under test.

[0160] It should be understood that the test module 303 can include multiple test units for functional testing of each pin under test individually, but this is more expensive. Alternatively, it can include a single test unit for sequential functional testing of each pin under test, which is less expensive. Since the overall testing time is shorter, this test structure is more commonly chosen in practical applications.

[0161] In one embodiment, the test module 303 includes a short-circuit test unit 3032. The short-circuit test unit 3032 includes another terminal. The first terminal of the short-circuit test unit 3032 is connected to the third terminal of the control module 304, and the second terminal of the short-circuit test unit 3032 is connected to the third terminal of the switch module 302. The short-circuit test unit 3032 is used to perform short-circuit tests on the pins under test, thereby preventing short-circuit faults in the Type-C interface pins from affecting the pin functionality.

[0162] For example, the control module 304 is used to control the connection between the connection module 301 and the pin under test, control the on and off states of the switch module 302, and determine whether all pins under test have been successfully tested based on the test results and send the results to the device under test for display. This allows the tester to directly obtain the test results of all pins under test on the device under test, preventing missed or incorrect tests, and providing convenient viewing for the tester, resulting in high testing efficiency.

[0163] It should be noted that when the test module 303 successfully tests a certain pin under test, the control module 304 can control the test module 303 to continue testing the next pin under test until all pins under test have been tested. After that, a "pass" flag is sent to the device under test for display, so that the tester can check. At the same time, the device under test will automatically jump to the next test stage.

[0164] When the test result of the pin under test is a failure, the pin under test that failed the test is output to the device under test for display so that the tester can check and repair the pin that failed the test.

[0165] In another embodiment, the control module 304 is also used to perform a specified function test on the Type-C interface. For example, the specified function test could be to establish a USB 2.0 signal link or a USB 3.0 signal link on the Type-C interface. When performing a specified function test on the Type-C interface, the control module 304 controls the switch module 302 to sequentially turn on or off all specified pins corresponding to the specified function. Simultaneously, the control module 304 controls the test module 303 to perform a function test on each specified pin. The specified function may include one or more of the following: fast charging function, headphone function, DP function, or OTG function.

[0166] For example, when the control module 304 performs USB OTG 3.0 function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, TX1+ pin, TX1- pin, TX2+ pin, TX2- pin, RX1+ pin, RX1- pin, RX2+ pin, RX2- pin, GND pin, SBU1 pin, and SBU2 pin of the Type-C interface. Alternatively, when the control module 304 performs fast charging function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, VBUS pin, and GND pin of the Type-C interface.

[0167] It should be noted that the control module 304 may include an interface test mode and a storage mode. These modes generally alternate. When the control module 304 is in interface test mode, it performs interface tests on the Type-C interface. Once the interface test is complete, the control module 304 enters storage mode. In storage mode, the control module 304 stores the test results of the Type-C interface and creates a text file (TXT). This TXT file may include the test results for the 24 pins of the Type-C interface. For example, pin X: result = 0 indicates that the pin test passed, and result = 1 indicates that the pin test failed. It should be understood that the interface test mode and storage mode can be performed simultaneously under certain special circumstances. No restrictions are imposed here.

[0168] It should be noted that the control module 304 can determine whether to enter the interface test mode or the storage mode by the status of the CC1 and CC2 pins.

[0169] Figure 10 This is a flowchart of a short-circuit testing method provided in an embodiment of this application. Figure 10 As shown in the figure, this application provides a method for short-circuit testing, which may specifically include the following steps:

[0170] S401. The interface test equipment applies a high-level signal to the signal line of the pin under test.

[0171] It should be understood that when performing a short-circuit test on all pins of the Type-C interface, a high-level signal can be applied to the signal of each pin under test one by one.

[0172] S402, the interface test equipment determines whether other signal lines are in a high-level state.

[0173] For example, it can be determined whether other signal lines are in a high-level state by detecting the voltage value of the signal lines.

[0174] S403. When the interface test device is not accidentally pulled high, it indicates that the pin under test is not short-circuited. This means that the pin under test of the Type-C interface is in a normal connection state and signal transmission can be performed through the pin under test.

[0175] S404. When other signal lines of the interface testing equipment are unexpectedly pulled high, it indicates that the pin under test is short-circuited. This means that the pin under test of the Type-C interface is short-circuited, and the electronic device needs to be returned to the factory for repair to ensure that all pins of the Type-C interface are in a normal connection state.

[0176] The interface test circuit 30 provided in another embodiment will be described below.

[0177] Figure 11 This is a schematic diagram of the structure of another interface test circuit provided in this application embodiment. Figure 11 As shown, this application embodiment provides an interface test circuit 30, which is used to perform interface testing on a device under test (DUT) equipped with a Type-C interface. The interface test circuit 30 may include a connection module 301, a switch module 302, a test module 303, a control module 304, and a protection module 305.

[0178] Exemplarily, the connection module 301 includes two ends. The first end of the connection module 301 is connected to the first end of the control module 304. The connection module 301 is used to connect to the pins under test of the Type-C interface. The pins under test include all pins of the Type-C interface. For example, the 24 pins of the Type-C interface, as shown in Table 1 above. This allows the connection module 301 to connect to all 24 pins of the Type-C interface of the device under test, so that all 24 pins can be subsequently tested, avoiding functional failure of untested pins. The connection module 301 can be a Type-C interface connector with model number USB_CON_24P_JAE.

[0179] For example, the protection module 305 includes three terminals. The first terminal of the protection module 305 is connected to the second terminal of the connection module 301, and the second terminal of the protection module 305 is connected to the second terminal of the switch module 302. The protection module 305 is used to provide overcurrent protection when the current in the connection module 301 exceeds a preset current, thereby preventing excessive current in the interface test circuit 30 from damaging the device under test. For example, the protection module 305 can be an ultra-low capacitance transient voltage suppressor of model RCLamp0522P. Alternatively, the protection module 305 can also be a relay of model G3VM-61G1.

[0180] It should be understood that the protection module 305 can also be used to provide overvoltage protection when the voltage of the connection module 301 exceeds the preset voltage, thereby preventing the device under test from being damaged by excessive voltage in the interface test circuit 30.

[0181] For example, the switch module 302 includes three terminals. The first terminal of the switch module 302 is connected to the second terminal of the control module 304, and the second terminal of the switch module 302 is connected to the second terminal of the connection module 301. The switch module 302 is used to turn on or off the test path of each pin under test. For example, the switch module 302 can be a multiplexer / analog switch of model BL1530, TUSB564, or CH440G.

[0182] It should be understood that the switch module 302 may have multiple sub-switches, each of which can be connected to a pin under test (DUT), thereby controlling the test path of each DUT. When a sub-switch is on, the test path of the corresponding DUT is open, and the back-end test module 303 can perform functional testing on the DUT. When a sub-switch is off, the test path of the corresponding DUT is closed, and the test module 303 cannot perform functional testing on the DUT.

[0183] It should be noted that the switch module 302 can also simultaneously control the test path of all pins under test to be turned on or off, thereby controlling whether to perform functional tests on the pins of the Type-C interface.

[0184] For example, the test module 303 includes two terminals. The first terminal of the test module 303 is connected to the third terminal of the control module 304, and the second terminal of the test module 303 is connected to the third terminal of the switch module 302. The test module 303 is used to perform functional tests on each pin under test to obtain test results, thereby obtaining the test results for all pins under test.

[0185] It should be noted that functional testing can include open-circuit testing and short-circuit testing to determine whether the pin under test has cracked pins or short circuits, which would affect the function of the pin under test.

[0186] It should be understood that the test module 303 may include multiple test units for performing functional tests on each pin under test individually, or it may include a single test unit for performing functional tests on each pin under test sequentially.

[0187] For example, the control module 304 is used to control the connection between the connection module 301 and the pin under test, control the on and off states of the switch module 302, and determine whether all pins under test have been successfully tested based on the test results and send the results to the device under test for display. This allows the tester to directly obtain the test results of all pins under test on the device under test, preventing missed or incorrect tests, and providing convenient viewing for the tester, resulting in high testing efficiency.

[0188] It should be noted that when the test module 303 successfully tests a certain pin under test, the control module 304 can control the test module 303 to continue testing the next pin under test until all pins under test have been tested. After that, a "pass" flag is sent to the device under test for display, so that the tester can check. At the same time, the device under test will automatically jump to the next test stage.

[0189] When the test result of the pin under test is a failure, the pin under test that failed the test is output to the device under test for display so that the tester can check and repair the pin that failed the test.

[0190] In another embodiment, the control module 304 is also used to perform a specified function test on the Type-C interface. For example, the specified function test could be to establish a USB 2.0 signal link or a USB 3.0 signal link on the Type-C interface. When performing a specified function test on the Type-C interface, the control module 304 controls the switch module 302 to sequentially turn on or off all specified pins corresponding to the specified function. Simultaneously, the control module 304 controls the test module 303 to perform a function test on each specified pin. The specified function may include one or more of the following: fast charging function, headphone function, DP function, or OTG function.

[0191] For example, when the control module 304 performs USB OTG 3.0 function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, TX1+ pin, TX1- pin, TX2+ pin, TX2- pin, RX1+ pin, RX1- pin, RX2+ pin, RX2- pin, GND pin, SBU1 pin, and SBU2 pin of the Type-C interface. Alternatively, when the control module 304 performs fast charging function testing on the Type-C interface, it can perform function testing on the CC1 pin, CC2 pin, D+ pin, D- pin, VBUS pin, and GND pin of the Type-C interface.

[0192] It should be noted that the control module 304 may include an interface testing mode and a storage mode. These modes generally alternate. When the control module 304 is in interface testing mode, it performs interface testing on the Type-C interface. Once the interface testing is complete, the control module 304 enters storage mode. In storage mode, the control module 304 stores the test results of the Type-C interface into a text file (TXT). It should also be understood that the control module 304 can store the test results of the Type-C interface to a USB flash drive via OTG functionality.

[0193] The TXT file can include test results for the 24 pins of the Type-C interface. For example, pin X: result = 0 indicates the pin passed the test, and result = 1 indicates the pin failed the test. It should be understood that interface test mode and storage mode can be performed simultaneously under certain special circumstances. No limitation is imposed here. For example, during the process of an electronic device reading stored content, the interface test circuit 30 can also simultaneously perform communication tests on USB 2.0 or USB 3.0 related pins.

[0194] It should be noted that the control module 304 can determine whether to enter the interface test mode or the storage mode by the status of the CC1 and CC2 pins.

[0195] Furthermore, in this embodiment, since the interface test circuit 30 directly stores the test results of the Type-C interface in storage mode, it effectively reduces the need for manual data viewing and recording, thus not only reducing the possibility of human error but also improving testing efficiency. Simultaneously, automated data transmission and parsing effectively reduce the risk of missed and false detections, improving test accuracy.

[0196] The following section introduces and explains interface testing equipment based on interface testing circuits.

[0197] Figure 12 This is a schematic diagram of the structure of an interface testing device provided in an embodiment of this application. Figure 12 As shown, this application embodiment provides an interface testing device 40. The interface testing device 40 includes an interface testing circuit 30 and a memory chip 401. The interface testing circuit 30 is connected to the memory chip 401. The interface testing circuit 30 is used to perform functional tests on multiple pins of the Type-C interface. For example, open-circuit tests or short-circuit tests. It can also be used to perform fast charging function tests, headphone function tests, DP function tests, or OTG function tests on the Type-C interface. The memory chip 401 is used to store the test results of the interface testing circuit 30. It should be understood that in practical applications, the memory chip 401 can also be directly disposed within the interface testing circuit 30.

[0198] In this embodiment, the interface testing device 40 can test all pins of the Type-C interface, thereby avoiding functional failures of untested pins. Simultaneously, it determines whether all pins under test have been successfully tested and sends the results to the device under test for display, thus preventing missed or incorrect tests and facilitating viewing for testers, resulting in high testing efficiency. When the interface testing device 40 is in storage mode, it directly stores the test results of the Type-C interface, effectively reducing manual data viewing and recording, lowering the possibility of human error and improving testing efficiency. Furthermore, automated data transmission and parsing effectively reduce the risk of missed or incorrect tests, improving test accuracy. Additionally, the test results of the Type-C interface can be directly displayed as success or failure on the electronic device testing interface. If the Type-C interface test result shows failure, the corresponding failure and the reason for the failure are directly displayed, allowing testers to promptly return the device for repair. If the Type-C interface test result shows success, the electronic device testing software can automatically jump to the next testing stage.

[0199] The following section provides a detailed explanation of the method for judging test results based on the interface test circuit.

[0200] Figure 13 This is a flowchart illustrating a method for determining test results according to an embodiment of this application. Figure 13 As shown, exemplarily, based on the interface test circuit 30, this application embodiment provides a method for judging test results, which may include the following steps:

[0201] S501. Electronic devices read text format files containing test results.

[0202] For example, after the interface testing equipment completes the testing of the pins of the Type-C interface of the electronic device, it will generate a test result file. The storage path of the test result file is generally located in the storage path when the interface testing equipment is in storage mode. Then, the human-machine interface (MMI) testing software of the electronic device will read the text format file (i.e., TXT format file) of the test result.

[0203] S502: The electronic device parses the test results into a text file to obtain the test results for all pins under test.

[0204] For example, after reading the TXT format file of the interface test results, the human-machine interface testing software of the electronic device will parse the TXT format file of the interface test results to obtain the test results of all the pins under test of the Type-C interface.

[0205] S503: The electronic device determines whether the test results of all the pins under test are successful.

[0206] For example, to reduce the chance of testers missing any pins, the test results for all pins under test on the Type-C interface can be checked one by one to ensure that all pins were successfully tested. For instance, the test results for all pins under test on the Type-C interface could be 24 pins, represented by a 24-bit numeric code. Each numeric code can represent the test result of one pin, with "0" indicating success and "1" indicating failure. The electronic device can identify the test result of the pin corresponding to each numeric code based on its status.

[0207] It should be noted that, in another embodiment, when the electronic device only performs a functional test on the Type-C interface, involving only the 9 pins under test of the Type-C interface, the test results of all the pins under test of the Type-C interface can also be the test results of the 9 pins under test, i.e., a 9-bit numeric code. Therefore, the test results of the 9 pins under test can be determined based on the "0" or "1" state of the 9-bit numeric code.

[0208] S504. When some of the pins under test fail in the test results of all the pins under test, the electronic device displays the pins under test that failed the test.

[0209] For example, if some pins under test (e.g., at least one pin under test) fail the test among all the pins under test of the Type-C interface, such as when one or more digit codes display "1", then an error report for the corresponding pin under test is generated based on these failed digit codes.

[0210] It should be noted that the error report can display specific error information. For example, it can show which pins failed the test and the corresponding reasons for the failure. For example, "D+" pin open circuit, "VBUS" pin short circuit, "TX1+" pin open circuit, etc.

[0211] S505. When all the test results of the pins under test are successful, the electronic device displays a test success interface.

[0212] For example, if all the test results for the pins under test of the Type-C interface are successful, it means that all the pins under test of the Type-C interface are in good working order and can perform the corresponding functions. A test success screen can then be displayed on the test interface. Simultaneously, the test installation package can automatically jump to the next test item.

[0213] The following section provides a detailed description of step S501 in the method for judging test results.

[0214] Figure 14 This is a flowchart illustrating another method for determining test results provided in this application. Figure 14 As shown, exemplarily, based on the interface test circuit 30, this application embodiment provides a method for judging test results. Specifically, step S501, where the electronic device reads the text format file of the test results, may include the following steps:

[0215] S5011, The filename for a text format file created by an electronic device.

[0216] For example, in the process of judging the test results of the Type-C interface, it is first necessary to create a filename for a TXT format file and define a standard filename for accessing the file.

[0217] S5012. The electronic device creates a file input stream based on the filename and defines the encoding format of the file input stream.

[0218] For example, a file stream is created based on a TXT filename to read test results data from the Type-C interface. It should be understood that an input stream refers to data that a program reads from external media or other programs from memory; it is also commonly referred to as an input source.

[0219] At the same time, define the encoding format of the input stream. For example, define the encoding format of the input stream as UTF-8 to ensure correct decoding of TXT format file content.

[0220] S5013. The electronic device reads data from a text-formatted file containing test results based on a file input stream.

[0221] For example, data stored in a TXT format file containing test results is read from a created file input stream.

[0222] S5014. The electronic device determines whether the last bit of the file input stream is a flag bit.

[0223] For example, whether to add read data to the input stream is determined by checking if the last bit of the file input stream is a flag bit.

[0224] It should be noted that if the last bit of the file input stream does not contain a marker, the system returns to S5014. This means the electronic device continues reading data from the text-formatted file containing the test results based on the file input stream.

[0225] S5015. When a marker bit appears at the end of the file input stream, the electronic device adds the data of the text format file to the file input stream.

[0226] For example, the flag bit can be "-1" or other flag bits, etc., used to distinguish the data that needs to be read.

[0227] S5016, The electronic device combines data from a file input stream into a list of strings.

[0228] For example, data from the file input stream is combined into a complete list of strings. This list of strings contains the test results for all the pins under test of the Type-C interface.

[0229] S5017. Electronic device closes file input stream.

[0230] For example, after reading the data from the TXT format file containing the test results, the file input stream can be closed. This frees up memory resources for use by other programs.

[0231] The following section provides a detailed explanation of step S502 in the method for judging test results.

[0232] Figure 15This is a flowchart illustrating another method for determining test results provided in this application. Figure 15 As shown, exemplarily, based on the interface test circuit 30, this application embodiment further provides a method for judging test results. Specifically, S502, the electronic device parses the text format file of the test results to obtain the test results of all pins under test, which may include the following steps:

[0233] S5021. Electronic devices read the contents of a text-formatted file containing test results.

[0234] For example, after reading the TXT format file of the test results, the contents of the TXT format file can be read again to prepare for parsing the TXT format file.

[0235] S5022. The electronic device splits the contents of a text format file into multiple data segments.

[0236] For example, splitting a TXT file according to a predefined symbol can yield multiple distinct data segments. It should be understood that the predefined symbol can be a comma, a period, or something similar.

[0237] S5023. The electronic device parses each data segment to obtain key-value pairs.

[0238] For example, the electronic device parses multiple different data segments separately. For instance, the electronic device can parse each data segment according to an equal sign, thereby obtaining multiple key-value pairs corresponding to the equal sign.

[0239] It should be understood that key-value pairs are a data structure widely used in computer science, especially in programming languages ​​and database design. It consists of two parts: a key and a value. The key is typically used to identify and retrieve related values, while the value stores the specific data information.

[0240] S5024. The electronic device extracts key information from key-value pairs.

[0241] For example, an electronic device provides key information about the testing process from the corresponding names and contents in key-value pairs. For instance, key-value pairs may contain information such as the test version, test duration, and test results.

[0242] S5025: Electronic devices obtain the test results of all pins under test from key information.

[0243] For example, an electronic device can obtain test results from key information. For instance, the test results for the 24 pins of a Type-C interface.

[0244] It should be understood that the test result for each pin under test (DUT) of the Type-C interface can be represented by a one-bit numeric code. Therefore, 24 DUT pins can be represented by 24-bit numeric codes.

[0245] It should be noted that the aforementioned electronic device 10 is embodied in the form of a functional module. The term "module" here can be implemented in software and / or hardware, without any specific limitation.

[0246] For example, a "module" can be a software program, a hardware circuit, or a combination of both that implements the above functions. The hardware circuit may include an application-specific integrated circuit (ASIC), electronic circuitry, a processor (e.g., a shared processor, a proprietary processor, or a group processor) and memory for executing one or more software or firmware programs, integrated logic circuitry, and / or other suitable components that support the described functions.

[0247] Therefore, the units of the various examples described in the embodiments of this application can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0248] Figure 16 This is a schematic diagram of the structure of another electronic device provided in this application. Figure 16 The dashed line indicates that the unit or module is optional; the electronic device 10 can be used to implement the control method of the interface test circuit described in the above method embodiments.

[0249] The electronic device 10 includes one or more processors 110, which can support the implementation of the control methods in the method embodiments of the electronic device 10. The processor 110 can be a general-purpose processor or a special-purpose processor. For example, the processor 110 can be a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, such as discrete gates, transistor logic devices, or discrete hardware components.

[0250] Optionally, the processor 110 can be used to control the electronic device 10, execute software programs, and process data from the software programs. The electronic device 10 may also include a communication unit 905 for inputting (receiving) and outputting (transmitting) signals.

[0251] For example, electronic device 10 may be a chip, communication unit 905 may be the input and / or output circuit of the chip, or communication unit 905 may be the communication interface of the chip, and the chip may be a component of electronic device or other electronic device.

[0252] For example, electronic device 10 can be an electronic device, and communication unit 905 can be a transceiver of electronic device 10. Alternatively, communication unit 905 can include one or more memories 902, which store program 904. Program 904 can be executed by processor 110 to generate instructions 903, causing processor 110 to execute the control method of the interface test circuit described in the above method embodiment according to instructions 903.

[0253] Optionally, the memory 902 may also store data.

[0254] Optionally, the processor 110 can also read data stored in the memory 902, which may be stored at the same memory address as the program 904, or the data may be stored at a different memory address than the program 904.

[0255] Alternatively, the processor 110 and memory 902 can be configured separately or integrated together, for example, integrated on a system-on-chip (SOC) of an electronic device.

[0256] For example, the memory 902 can be used to store the relevant program 904 of the control method of the interface test circuit provided in the embodiments of this application, and the processor 110 can be used to call the relevant program 904 of the control method of the interface test circuit stored in the memory 902 when executing the control method of the interface test circuit, and execute the control method of the interface test circuit of the embodiments of this application.

[0257] Optionally, this application also provides a computer program product that, when executed by processor 110, implements the control method of the interface test circuit in any method embodiment of this application.

[0258] For example, the computer program product can be stored in memory 902, such as program 904. Program 904 is eventually converted into an executable object file that can be executed by processor 110 after processing such as preprocessing, compilation, assembly and linking.

[0259] Optionally, this application also provides a chip system applied to an electronic device 10. The chip system includes one or more processors, which are used to invoke computer instructions to cause the electronic device 10 to execute a control method for an interface test circuit.

[0260] Optionally, this application also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a computer, implements the control method for the interface testing circuit described in any of the method embodiments of this application. The computer program may be a high-level language program or an executable object program.

[0261] For example, the computer-readable storage medium is, for instance, memory 902. Memory 902 can be volatile memory or non-volatile memory, or memory 902 can include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous linked dynamic random access memory (SLDRAM), and direct rambus RAM (DR RAM).

[0262] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0263] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0264] The beneficial effects that the electronic device provided in the above-described embodiments of this application can achieve can be referred to the beneficial effects corresponding to the modules provided above, and will not be repeated here.

[0265] It should be understood that the above description is merely to help those skilled in the art better understand the embodiments of this application, and is not intended to limit the scope of the embodiments of this application. Based on the examples given above, those skilled in the art can obviously make various equivalent modifications or changes. For example, some steps in the various embodiments of the above detection method may be unnecessary, or new steps may be added. Alternatively, any combination of two or more of the above embodiments may be used. Such modifications, changes, or combinations also fall within the scope of the embodiments of this application. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0266] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0267] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0268] It should also be understood that the above description of the embodiments of this application focuses on highlighting the differences between the various embodiments. Any similarities or differences not mentioned can be referred to each other. For the sake of brevity, they will not be repeated here.

[0269] It should also be understood that, in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0270] It should also be understood that in the embodiments of this application, "pre-setting" or "pre-defining" can be achieved by pre-saving the corresponding code, table or other means that can be used to indicate relevant information in the device (e.g., including electronic devices), and this application does not limit the specific implementation method.

[0271] It should also be understood that the methods, situations, categories, and classifications of embodiments in this application are for the convenience of description only and should not constitute a special limitation. Various methods, categories, situations, and features in embodiments can be combined without contradiction.

[0272] It should also be understood that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0273] Finally, it should be noted that the above descriptions are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above descriptions are merely preferred embodiments of the technical solutions of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An interface testing circuit, characterized in that, This circuit is used to perform interface testing on devices under test (DUTs) equipped with a Type-C interface. The interface testing circuit includes a connection module, a switch module, a testing module, and a control module. The first end of the connection module is connected to the first end of the control module, and the connection module is used to connect to the pin under test of the Type-C interface; the pin under test includes all the pins of the Type-C interface; The first end of the switch module is connected to the second end of the control module, and the second end of the switch module is connected to the second end of the connection module; the switch module is used to turn on or off the test path of each pin under test. The first end of the test module is connected to the third end of the control module, and the second end of the test module is connected to the third end of the switch module; the test module is used to perform functional tests on each of the pins under test to obtain test results; The control module is used to control the connection between the connection module and the pin under test, control the on and off of the switch module, and determine whether all the pins under test have been successfully tested based on the test results and send the results to the device under test for display.

2. The interface test circuit as described in claim 1, characterized in that, The test module includes an open-circuit test unit. The first end of the open-circuit test unit is connected to the third end of the control module, and the second end of the open-circuit test unit is connected to the third end of the switch module. The open-circuit test unit is used to perform an open-circuit test on the pin under test.

3. The interface test circuit as described in claim 2, characterized in that, The open-circuit test includes: applying a high-level signal to the signal line of the pin under test; when the level of the pin under test is pulled high, it indicates that the pin under test is not in an open-circuit state; when the level of the pin under test is not pulled high, it indicates that the pin under test is in an open-circuit state.

4. The interface test circuit as described in any one of claims 1-3, characterized in that, The test module includes a short-circuit test unit. The first end of the short-circuit test unit is connected to the third end of the control module, and the second end of the short-circuit test unit is connected to the third end of the switch module. The short-circuit test unit is used to perform a short-circuit test on the pin under test.

5. The interface test circuit as described in claim 4, characterized in that, The short-circuit test includes: applying a high-level signal to the signal line of the pin under test and detecting the status of other signal lines; when the other signal lines are not accidentally pulled high, it indicates that the pin under test is not short-circuited; when the other signal lines are accidentally pulled high, it indicates that the pin under test is short-circuited.

6. The interface test circuit as described in any one of claims 1-5, characterized in that, It also includes a protection module, the first end of which is connected to the second end of the connection module, and the second end of which is connected to the second end of the switch module; the protection module is used to provide overcurrent protection when the current of the connection module exceeds a preset current.

7. The interface test circuit as described in any one of claims 1-5, characterized in that, The control module is also used to control the test module to continue testing the next pin under test when the test result of the pin under test is successful, until all the pins under test are tested; and to output the pin under test that failed the test when the test result of the pin under test is unsuccessful.

8. The interface test circuit as described in any one of claims 1-5, characterized in that, The control module is also used to control the switch module to sequentially turn on or off all specified pins corresponding to the specified function when performing a specified function test on the Type-C interface, and to control the test module to perform a function test on each specified pin.

9. The interface test circuit as described in claim 8, characterized in that, The specified functions include one or more of the following: fast charging function, headphone function, DP function, or OTG function.

10. The interface test circuit as described in any one of claims 1-5, characterized in that, The control module includes an interface testing mode and a storage mode, which are performed alternately. When the control module is in the interface testing mode, it performs interface testing on the Type-C interface. When the control module is in the storage mode, it stores the test results of the Type-C interface.

11. An interface testing device, characterized in that, It includes the interface test circuit as described in any one of claims 1-10 and a memory chip, wherein the memory chip is used to store the test results of the interface test circuit.

12. A method for judging test results, based on the interface test circuit according to any one of claims 1-10, characterized in that, The methods for judging the test results include: Read the test results in a text file; The test results are obtained by parsing the text format file of the test results; When some of the pins under test fail in the test results, the failed pins are displayed; when all the pins under test succeed, a test success screen is displayed.

13. The determination method as described in claim 12, characterized in that, The text format file for reading test results includes: Create the filename for the text format file; A file input stream is created based on the filename, and the encoding format of the file input stream is defined; Read the data from the text format file of the test results according to the file input stream; When a marker bit appears at the end of the file input stream, the data of the text format file is appended to the file input stream; Combine the data in the file input stream into a list of strings; Close the file input stream.

14. The determination method as described in claim 12, characterized in that, The process of parsing the text format file of the test results yields all test results for the pins under test, including: Read the contents of the text file containing the test results; The content of the text format file is divided into multiple data segments; Each of the data segments is parsed to obtain key-value pairs; Extract key information from the key-value pairs; The test results of all the pins under test are obtained from the key information.

15. An electronic device, characterized in that, The electronic device includes: one or more processors, and memory; The memory is coupled to the one or more processors, the memory being used to store computer program code, the computer program code including computer instructions, the one or more processors invoking the computer instructions to cause the electronic device to perform the method as described in any one of claims 12-14.

16. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes instructions that, when executed on an electronic device, cause the electronic device to perform the method as described in any one of claims 12-14.

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