Detector module and method for producing the same, detector and medical imaging apparatus

Abstract

The invention discloses a detector module and a production method thereof, a detector and medical imaging equipment, and relates to the technical field of medical equipment, the detector module comprises a plurality of sub-modules, the sub-modules are constructed as photon counting modules, the plurality of sub-modules are arranged on a first curve along a first direction, and the top surfaces of the sub-modules are tangent to the first curve; and the conductive film is arranged on the top surfaces of the plurality of sub-modules and is arranged on a second curve, and the second curve and the first curve are configured to be an equidistant curve, so that the distances between the conductive film and the top surfaces of the sub-modules are equal. Therefore, the plurality of sub-modules can be arranged in an arc shape along the first direction, and the conductive films are parallel to the top surfaces of the sub-modules, so that the conductive films are parallel to the pixelated anodes of the sub-modules, and the distances between the conductive films and the top surfaces of the sub-modules are equal; the distance between the conductive film and the pixelated anode of each sub-module can be equal, a continuous, stable and uniform electric field can be formed, and the imaging effect is improved.

Description

Technical Field

[0001] This invention relates to the field of medical device technology, and in particular to a detector module and its manufacturing method, a detector, and a medical imaging device. Background Technology

[0002] With the continuous development of medical technology, more and more medical devices are being used to assist in medical diagnosis and treatment. For example, CT (Computed Tomography) equipment is used to detect diseases in the human body. CT equipment uses a CT detector to detect X-rays passing through the human body and converts the received light signals into electrical signals.

[0003] CT equipment includes traditional energy integrating CT and photon-counting CT (PCCT). Photon-counting CT is a revolutionary technology in the field of CT. It can record the number, energy and arrival time of X-ray photons one by one, directly generating multi-energy spectrum images, realizing a fundamental upgrade "from integration to counting" to achieve higher spatial resolution, lower radiation dose and accurate energy spectrum imaging. Among them, the multiple sub-modules installed on the photon-counting CT detector are important components for realizing photoelectric conversion. At present, in photon-counting CT, it is difficult to form a stable electric field between the high-voltage membrane and the anode of the sub-module, which affects the imaging effect and there is room for improvement. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a detector module that facilitates the formation of a continuous, stable and uniform electric field, thereby improving imaging performance.

[0005] The present invention further proposes a method for manufacturing a detector module.

[0006] The present invention further proposes a detector.

[0007] The present invention further proposes a medical imaging device.

[0008] According to the detector module of the present invention, a detector module is used to detect rays emitted from a radiation source after attenuation by a scanned object, the detector module comprising: Multiple sub-modules, each sub-module being constructed as a photon counting module, are arranged along a first direction on a first curve, and the top surface of each sub-module is tangent to the first curve. A conductive film is disposed on the top surface of the plurality of sub-modules and arranged on a second curve, wherein the second curve and the first curve are configured as equidistant curves so that the distance between the conductive film and the top surface of each sub-module is equal.

[0009] According to the detector module of the present invention, multiple sub-modules can be arranged in an arc along a first direction, and the conductive film can be parallel to the top surface of the sub-module. This allows the conductive film to be parallel to the pixelated anode of the sub-module, and the spacing between the conductive film and the top surface of each sub-module can be equal. This facilitates the formation of a continuous, stable, and uniform electric field, thereby improving the imaging effect.

[0010] In some examples of the present invention, multiple pairs of adjacent sub-modules are partially staggered along a second direction orthogonal to the first direction, and all are staggered on the same side of the sub-modules relative to the edge in the second direction.

[0011] In some examples of the present invention, the greater the misalignment distance between the sub-module closer to the center and the sub-module at the edge in the first direction.

[0012] In some examples of the present invention, in a pair of adjacent and partially misaligned sub-modules, the overlapping portion of the orthographic projection of the two sub-modules along the first direction has a width dimension A along the second direction, and the width of the conductive film is B, satisfying the relationship: B < A.

[0013] In some examples of the present invention, the conductive film includes a plurality of sub-films connected in sequence, and at least one pair of adjacent sub-films are partially staggered along a second direction orthogonal to the first direction.

[0014] In some examples of the present invention, the top surface of the submodule is tangent to the first curve at the center of the top surface.

[0015] In some examples of the present invention, the total coverage width of the detector module in the first direction is greater than or equal to 6 cm.

[0016] In some examples of the present invention, the total coverage width of the detector module in the first direction is greater than or equal to 8 cm.

[0017] According to the method for manufacturing a detector module of the present invention, wherein the detector module is the detector module described above, the manufacturing method includes: A conductive adhesive layer is formed on the top surface of the submodule; The planar conductive film is attached to the top surface of the sub-module using the pressing surface of the pressing tool to form the conductive film disposed on the top surface of the plurality of sub-modules and arranged on the second curve.

[0018] In some examples of the present invention, during the process of attaching the conductive film to the top surface of the submodule, a reverse tensile force is applied to both ends of the conductive film to keep the conductive film in a state of tension.

[0019] In some examples of the present invention, the tensile force of the reverse tension is F, which satisfies the relationship: 0.1N≤F≤2N.

[0020] The detector according to the present invention includes the detector module described above, or includes the detector module prepared according to the production method described above, wherein a plurality of the detector modules are arranged on a third curve along a second direction orthogonal to the first direction, and the first curve and the third curve are configured as curves of the same sphere.

[0021] The medical imaging device according to the present invention includes: a scanning gantry, a radiation source, and the detector described above; the radiation source and the detector are respectively disposed on the scanning gantry, the radiation source is configured to emit rays toward the scanned object, and the detector is configured to receive rays attenuated by the scanned object and convert the rays into electrical signals.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of a detector module according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a detector module according to an embodiment of the present invention (conductive film omitted). Figure 3 This is a schematic diagram of a detector module according to an embodiment of the present invention (the number of sub-modules varies). Figure 4 This is a schematic diagram of the sub-modules and conductive film of the detector module according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a sub-module of the detector module according to an embodiment of the present invention and another angle of the conductive film; Figure 6 This is a schematic diagram of the sub-modules and conductive film of the detector module according to an embodiment of the present invention (showing multiple sub-modules arranged in a staggered manner). Figure 7 This is a schematic diagram of the conductive film according to an embodiment of the present invention; Figure 8This is a schematic diagram of the detector according to an embodiment of the present invention; Figure 9 This is a flowchart of a method for producing a detector module according to an embodiment of the present invention.

[0024] Figure label: Detector module 100; sub-module 10; top surface 101; bracket 11; conductive film 20; sub-film 201; power supply terminal 202; First curve 30; Second curve 40; Detector 200; Housing 201. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0026] The following is for reference. Figures 1-9 The present invention describes a detector module 100, a method for manufacturing the same, a detector 200, and a medical imaging device according to embodiments thereof.

[0027] Detector module 100 is a component of detector 200. Detector 200 is used to detect rays emitted from a radiation source after attenuation by the scanned object. Therefore, each detector module 100 is also used to detect rays emitted from a radiation source after attenuation by the scanned object. Detector 200 can be used in various devices, including medical imaging equipment such as CT scanners, and other devices requiring scanning imaging, such as security screening machines.

[0028] In CT scanners, XYZ coordinate system is typically used, where the X direction can be the arrangement direction of multiple detector modules 100, the Y direction is the vertical direction, and the Z direction is perpendicular to the plane formed by the X and Y directions. The Z direction is usually the rotation axis of the scanner, and multiple sub-modules 10 of the detector module 100 can be arranged along the Z direction.

[0029] like Figures 1-7As shown, the detector module 100 according to an embodiment of the present invention includes: a plurality of sub-modules 10 and a conductive film 20. The sub-modules 10 are configured as photon counting modules, and the plurality of sub-modules 10 are arranged along a first direction on a first curve 30, with the top surface 101 of the sub-modules 10 tangent to the first curve 30. The first direction can be the Z-direction described above. The sub-modules 10 are used to detect rays emitted by a radiation source after attenuation by the scanned object, and convert the received rays into electrical signals. In a CT scanner, the radiation source can emit fan-shaped or cone-shaped beams of radiation, each beam comprising several rays. The radiation source projects the beams of radiation onto the scanned object from its focal point. The radiation source includes an X-ray tube (not shown) and a high-voltage generator (not shown), the high-voltage generator providing high-voltage electricity to the X-ray tube, which generates radiation. In the embodiments described in this application, the radiation is X-rays.

[0030] The internal structure and organization of the object being detected cause varying degrees of attenuation of rays passing through it, resulting in unequal intensities of these rays. The attenuated optical signals are received by submodule 10 and converted into electrical signals, representing the intensity of the rays passing through the object. The electrical signal generated by each submodule 10 is proportional to the intensity of the received attenuated optical signal.

[0031] Submodule 10 is constructed as a photon counting module. In some embodiments, submodule 10 includes a cadmium zinc telluride (CdZnTe, CZT) crystal or a cadmium telluride (CdTe) crystal, etc. The cadmium zinc telluride crystal or cadmium telluride crystal is used to receive the attenuated X-rays after they have passed through the object being detected and convert the X-rays into electrical signals. Specifically, X-rays generate electron-hole pairs in submodule 10. After applying a high voltage (e.g., 800V–1000V) to the top cathode (top surface 101) and the pixelated anode of submodule 10, electrons move towards the anode to obtain current, thereby achieving direct conversion of X-rays (X-ray → electrical signal). A conductive film 20 is provided on the top surface 101 of multiple submodules 10, through which a high voltage can be applied. This submodule 10 can distinguish X-rays of different energies (achieving "photon counting"), simultaneously acquire imaging data at multiple energy levels, support "spectral CT" (such as distinguishing different tissues and identifying contrast agents), and avoid light scattering by scintillators. It offers higher spatial resolution (up to sub-millimeter level), fewer signal conversion steps, lower noise, clearer imaging, and extremely fast response speed, adaptable to higher scanning speeds. It should be noted that the "coincidence, equality, and parallelism" described in this paper refer to industrially achievable coincidence, equality, and parallelism, not absolute coincidence, absolute equality, and absolute parallelism in a mathematical sense. Therefore, within a certain error range (e.g., but not limited to, the distance between the center of the first curve 30 and the focal point of the radiation source being 3 mm), the coincidence, equality, and parallelism proposed in this application can be considered achieved.

[0032] In this configuration, the center of the first curve 30 coincides with or is near the focal point of the radiation source, and the top surface 101 of the submodule 10 is tangent to the first curve 30. This allows the rays emitted by the radiation source to be incident perpendicularly at the point where the top surface 101 of the submodule 10 is tangent to the first curve 30, resulting in a high-quality image reconstructed by the medical imaging device based on the projection data converted from the electrical signals generated by the submodule 10.

[0033] By arranging multiple sub-modules 10 along the first direction on the first curve 30, the structure is reasonable, the installation of the conductive film 20 can be continuous and there are no obvious structural changes (discontinuity, step jumps, wrinkles, etc.), there are no excessive invalid areas, and it is easy to attach the conductive film 20. It is also conducive to the formation of a stable electric field by the conductive film 20. Moreover, the number, number of layers and coverage of the multiple sub-modules 10 along the first direction are not limited by the conductive film 20.

[0034] Conductive films 20 are disposed on the top surfaces 101 of multiple sub-modules 10. As some embodiments of this application, the conductive films 20 can be disposed on the top surfaces 101 of multiple sub-modules 10 by means of adhesion, but not limited to adhesion. The conductive films 20 are arranged on a second curve 40, which is configured to be equidistant from the first curve 30, so that the spacing between the conductive films 20 and the top surfaces 101 of each sub-module 10 is equal. Due to the influence of manufacturing errors and measurement errors, "equal" here can mean approximately equal.

[0035] The configuration of the second curve 40 and the first curve 30 as equidistant curves can be understood as the distance between any position of the second curve 40 and the first curve 30 being equal, or it can be understood as the second curve 40 and the first curve 30 being parallel. This allows the conductive film 20 to be parallel to the top surface 101 of multiple consecutive sub-modules 10, and to be parallel to the pixelated anode of multiple consecutive sub-modules 10. This ensures that the distance between the conductive film 20 and the top surface 101 of each sub-module 10 is equal, continuous, and stable, and that the distance between the conductive film 20 and the pixelated anode of each sub-module 10 is equal, continuous, and stable. This is beneficial for the conductive film 20 above each sub-module 10 to form a stable electric field with the pixelated anode of the sub-module 10, thereby improving charge collection efficiency and stability, improving energy resolution, improving spatial resolution, reducing image artifacts, and improving the performance of the detector module 100.

[0036] Therefore, multiple sub-modules 10 can be arranged in an arc along the first direction, and the conductive film 20 can be parallel to the top surface 101 of the sub-module 10. This allows the conductive film 20 to be parallel to the pixelated anode of the sub-module 10, and the spacing between the conductive film 20 and the top surface 101 of each sub-module 10 to be equal. This facilitates the formation of a continuous, stable, and uniform electric field, thereby improving the imaging effect.

[0037] As some embodiments of this application, such as Figures 1-3 As shown, the detector module 100 also includes a bracket 11, and multiple sub-modules 10 are disposed on the bracket 11.

[0038] In some embodiments of the present invention, the conductive film 20 is constructed as a rectangle in its orthographic projection along its thickness direction. The conductive film 20 can be formed by bending a rectangular conductive film 20 to create a structure arranged on the second curve 40. The rectangle is regular and can completely cover the effective area of ​​a pixel array of similar shapes, eliminating detection blind spots. When X-rays are incident, all effective pixels of the submodule 10 are in a uniform electric field, preventing artifacts or blind spots caused by edge pixels "leaking the field" due to irregular shapes of the conductive film 20 (such as circles or polygons).

[0039] Moreover, the conductive film 20 is generally a composite structure of aluminum film and insulating film, and is usually prepared by vapor deposition, sputtering or hot pressing. Commercial metal film substrates and insulating film substrates are standard rectangular rolls. There is almost no material waste in the production of rectangular conductive film 20, the cost is low, and the production process of rectangular conductive film 20 can be completed by relatively conventional automated equipment, with short processing cycle and high precision.

[0040] In some embodiments of the present invention, such as Figure 6As shown, multiple pairs of adjacent sub-modules 10 are partially staggered along a second direction orthogonal to the first direction, and each is staggered relative to the edge sub-modules 10 on the same side of the second direction. This partial staggered arrangement can be understood as the orthographic projections of two sub-modules 10 along the first direction not completely overlapping in the second direction, but having overlapping areas. In other words, the orthographic projections of two sub-modules 10 along the first direction partially overlap in the second direction, meaning the orthographic projections of two sub-modules 10 along the first direction are not completely staggered in the second direction. Furthermore, the staggered distance between the sub-module 10 closer to the center and the edge sub-modules 10 is greater in the first direction. In other words, the multiple sub-modules 10 of the detector module 100 are arranged in a stepped manner, with the middle sub-modules 10 closer to one side of the second direction and the two outer sub-modules 10 closer to the other side of the second direction. Specifically, when the number of sub-modules 10 of detector module 100 is odd, the center of detector module 100 in the first direction is the center of the middle sub-module 10. When the number of sub-modules 10 of detector module 100 is even, the center of detector module 100 in the first direction is the center of the two middle adjacent sub-modules 10.

[0041] It should be noted that the detector 200 includes multiple detector modules 100, which are arranged on a third curve along a second direction orthogonal to the first direction. The first curve 30 and the third curve are configured as curves on the same sphere, and the second direction can be the X-direction described above. This arrangement allows multiple sub-modules 10 to be arranged on the sphere, ensuring that when there are many sub-modules 10, the distances from the top surface 101 of the multiple sub-modules 10 to the focal point of the X-ray tube are similar or consistent, which is beneficial for algorithm correction and improving image quality. However, because multiple sub-modules 10 are arranged on the sphere, the X-direction gap of the middle sub-module 10 in the Z-direction is larger than the X-direction gap of the edge sub-modules 10. The more Z-direction sub-modules 10 there are, the larger the X-direction gap of the middle sub-module 10 becomes. Excessive gaps affect image reconstruction and image accuracy. By partially staggering multiple pairs of adjacent sub-modules 10 along a second direction (X-direction) orthogonal to the first direction (Z-direction), and in multiple pairs of adjacent and partially staggered sub-modules 10, the sub-module 10 closer to the edge of the detector module 100 along the first direction is staggered to the same side along the second direction compared to the other sub-module 10 in the same pair, the position of some sub-modules 10 can be adjusted according to the actual situation to reduce the X-direction gap of the middle sub-module 10, which can improve the problem of image reconstruction and image accuracy being affected by the excessive X-direction gap.

[0042] Specifically, the sub-module 10 of the detector module 100 on the right can be moved to the left by a certain distance, and the sub-module 10 of the detector module 100 on the left can be moved to the right by a certain distance, so as to form a structure in which a pair of adjacent sub-modules 10 are partially staggered along a second direction (X direction) orthogonal to the first direction (Z direction), thereby improving the problem of image reconstruction and image accuracy being affected by the excessive gap in the X direction.

[0043] In some embodiments of the present invention, such as Figure 6 As shown, in a pair of adjacent and partially misaligned sub-modules 10, the overlapping portion of the orthographic projections of the two sub-modules 10 along the first direction has a width dimension A along the second direction, and the width of the conductive film 20 is B, satisfying the relationship: B < A. Wherein, the width of the conductive film 20 refers to the width dimension of the conductive film 20 along the second direction.

[0044] It is understood that a detector module 100 includes multiple sub-modules 10, and there may be multiple pairs of adjacent and partially misaligned sub-modules 10, resulting in multiple A's. The width B of the conductive film 20 can be smaller than the smallest A among the multiple A's, that is, the width B of the conductive film 20 is smaller than the minimum overlapping width of the multiple sub-modules 10 of a detector module 100. This setting allows the conductive film 20 to adapt to the sub-modules 10 that are misaligned in the second direction (X direction). On the basis of improving the problem that the image reconstruction and image accuracy are affected by the excessive gap in the X direction, it can form a continuous, stable and uniform electric field, thereby improving the imaging effect.

[0045] In some embodiments of the present invention, such as Figure 7 As shown, the conductive film 20 includes multiple sub-films 201, which are connected sequentially. At least one pair of adjacent sub-films 201 are partially staggered along a second direction orthogonal to the first direction. This partial staggered arrangement can be understood as the orthographic projections of two sub-films 201 along the first direction not completely overlapping in the second direction, but having an overlapping region. In other words, the orthographic projections of two sub-films 201 along the first direction partially overlap in the second direction, meaning that the orthographic projections of two sub-films 201 along the first direction are not completely staggered in the second direction.

[0046] This configuration allows the conductive film 20 to be adapted to the detector module 100 with a sub-module 10 having a large misalignment size. It can form a continuous, stable and uniform electric field, thereby improving the imaging effect, while improving the problem of image reconstruction and image accuracy affected by the large X-axis gap.

[0047] In some embodiments of the present invention, the top surface 101 of the submodule 10 is tangent to the first curve 30 at the center of the top surface 101. The central axis of the submodule 10 points to the focal point of the radiation source, and the rays radiated from the focal point of the radiation source can be incident perpendicularly to the center point of the top surface 101. Thus, the image reconstructed by the medical imaging device based on the projection data converted from the electrical signals generated by the submodule 10 has a high quality.

[0048] As some embodiments of this application, the top surface 101 of the submodule 10 is tangent to the first curve 30 near the center of the top surface 101. The central axis of the submodule 10 points near the focal point of the radiation source. The rays radiated from the focal point of the radiation source can be incident perpendicularly near the center point of the top surface 101. It is understood that in the actual assembly process, it is difficult to guarantee that the top surface 101 of the submodule 10 is precisely tangent to the first curve 30 at the center of the top surface 101. Within a certain deviation range, the impact on the image quality reconstructed based on the electrical signal generated by the submodule 10 is small, and it can still meet the requirements of medical diagnosis. As described above, the "coincidence, equality, parallelism" etc. described herein refer to the coincidence, equality, and parallelism that can be achieved in industry, rather than absolute coincidence, absolute equality, and absolute parallelism in a mathematical sense. This description also applies to the fact that the top surface 101 of the submodule 10 is tangent to the first curve 30 near the center of the top surface 101.

[0049] In some embodiments of the present invention, such as Figures 1-3 As shown, the detector module 100 further includes a conductive adhesive layer (not shown in the figure), which is bonded between the conductive film 20 and the top surfaces 101 of the plurality of sub-modules 10. The conductive adhesive layer can be formed by conductive adhesive. During the assembly of the detector module 100, conductive adhesive can be applied to the top surfaces 101 of the plurality of sub-modules 10 to form the conductive adhesive layer, and then the conductive film 20 is attached to the conductive adhesive layer so that the conductive film 20 is attached to the top surfaces 101 of the plurality of sub-modules 10. Submodule 10 is relatively brittle, and the conductive film 20 is easily torn and wrinkled. However, the detector module 100 experiences temperature changes during operation. The conductive adhesive layer has a certain degree of elasticity, which can buffer the stress caused by thermal expansion and contraction, reduce the risk of cracks in submodule 10 due to tension, and reduce the risk of tearing and wrinkling of the conductive film 20. Furthermore, the thickness of the conductive adhesive layer is controllable, which helps to ensure uniform spacing. This is beneficial to ensure that the spacing between the conductive film 20 and the top surface 101 of each submodule 10 is equal, and that the spacing between the conductive film 20 and the pixelated anode of each submodule 10 is equal, so as to form a continuous, stable and uniform electric field and improve the imaging effect.

[0050] In some embodiments of the present invention, such as Figure 1 and Figure 3As shown, along the extension direction of the conductive film 20, the end of the conductive film 20 is configured as a power supply terminal 202. At the contact point between the power supply terminal 202 and the electrode, a local electric field concentration occurs due to impedance abrupt changes. If the power supply terminal 202 is placed between the two ends of the conductive film 20 (i.e., the middle part of the conductive film 20), the electric field concentration will cause abnormal field strength at the corresponding location, distorted charge drift paths, and noise or artifacts in the signal. However, by using the end of the conductive film 20 as the power supply terminal 202, charge collection and energy resolution are not affected, thus improving the imaging effect. Furthermore, after the high-voltage cable is led out from the end, it can be routed along the edge of the detector 200 without tangling or compressing the submodule 10.

[0051] In some embodiments of the present invention, the total coverage width of the detector module 100 in the first direction is greater than or equal to 6 cm. This configuration can significantly improve scanning speed, greatly shorten whole-body scanning time, suppress motion artifacts, and expand the coverage area of ​​a single scan, reducing stitching artifacts and improving detection performance. The total coverage width, also known as the equivalent width, is the width covered in the Z-direction at the scanning center position (isocenter) of the CT scanner in which the detector module 100 is located. In other words, the total coverage width is the projection width in the Z-direction of the X-ray beam that the detector module 100 can receive and that contributes to image reconstruction.

[0052] In some embodiments of the present invention, the total coverage width of the detector module 100 in the first direction is greater than or equal to 8 cm. This configuration can significantly improve the scanning speed, further compress the scanning time, effectively suppress motion artifacts, and, moreover, enable the single-pass coverage of larger anatomical units, further reducing stitching artifacts and improving detection performance.

[0053] In some embodiments of the present invention, the detector module 100 has a total coverage width of 16 cm or greater in the first direction. This Z-axis coverage configuration allows for the single-scan capture of ultra-large anatomical structures such as the entire heart and both lungs, the entire spinal segment, and the entire pelvis. Scanning the entire spine requires only 3 to 4 rotations, which improves detection efficiency. Furthermore, it allows for the direct acquisition of seamless, complete images without the need to switch between multiple images, significantly improving diagnostic efficiency. For the photon counting module, the 16 cm ultra-wide coverage enables the simultaneous acquisition of multi-energy data across the entire Z-axis range in a single scan, eliminating the need for multiple scans and avoiding registration errors in the energy spectrum data caused by patient positional changes, thus improving the accuracy of substance separation.

[0054] The following is for reference. Figure 9 This application describes a method for manufacturing the detector module 100, such as... Figure 9 As shown, the method for manufacturing the detector module 100 includes the following steps: S1, a conductive adhesive layer is formed on the top surface 101 of the sub-module 10. This can be achieved by automatically applying conductive adhesive to the top surfaces 101 of multiple sub-modules 10 using equipment such as a dispensing machine or a scraper. Alternatively, conductive double-sided tape can be applied to the top surfaces 101 of multiple sub-modules 10 to form the conductive adhesive layer. The conductive adhesive does not require high-temperature curing, thus avoiding damage to the semiconductor performance of the sub-module 10 or the insulating layer of the conductive film 20. Furthermore, its thickness is controllable, facilitating uniform spacing and ensuring equal spacing between the conductive film 20 and the top surfaces 101 of each sub-module 10, as well as between the conductive film 20 and the pixelated anodes of each sub-module 10. This results in a continuous, stable, and uniform electric field, improving imaging performance.

[0055] S2, a planar conductive film 20 is attached to the top surface 101 of the sub-module 10 using the pressing surface of the pressing fixture, thereby forming conductive films 20 disposed on the top surfaces 101 of multiple sub-modules 10 and arranged on the second curve 40. It is understood that the produced conductive film 20 is planar, but after being attached to the top surface 101 of the sub-module 10, the conductive film 20 becomes arc-shaped. During the attachment process, the planar conductive film 20 can be pressed by the pressing surface of the pressing fixture to adhere it to the conductive adhesive layer, thereby attaching the conductive film 20 to the top surface 101 of the sub-module 10, forming conductive films 20 disposed on the top surfaces 101 of multiple sub-modules 10 and arranged on the second curve 40. In some embodiments of this application, the pressing surface is a smooth curved surface, and the pressing surface can move along the extension direction of the conductive film 20 to gradually attach the conductive film 20 to the top surface 101 of the sub-module 10. As some embodiments of this application, the crimping fixture has a rotatable crimping member with an annular crimping surface. The crimping member can roll along the extension direction of the conductive film 20 so that the conductive film 20 is gradually attached to the top surface 101 of the submodule 10.

[0056] This allows the conductive film 20 to be attached to the top surface 101 of the sub-module 10, and the installation of the conductive film 20 can be continuous without significant structural changes such as jumps or wrinkles. This helps to ensure that the spacing between the conductive film 20 and the top surface 101 of each sub-module 10 is equal, and the spacing between the conductive film 20 and the pixelated anode of each sub-module 10 is equal. This helps to form a continuous, stable and uniform electric field and improve the imaging effect.

[0057] In some embodiments of the present invention, the manufacturing method of the detector module 100 further includes: during the process of attaching the conductive film 20 to the top surface 101 of the submodule 10, applying a reverse tensile force at both ends of the conductive film 20 to make the conductive film 20 be in a state of tension. Specifically, during the process of attaching the conductive film 20, a reverse tensile force can be applied to both ends of the conductive film 20 by means of a tooling or other components to make the conductive film 20 be in a state of tension, and then the planar conductive film 20 is attached to the top surface 101 of the submodule 10 by means of the pressing surface of the pressing tooling. By placing the conductive film 20 under tension, the conductive film 20 is stretched uniformly, the wrinkles of the conductive film 20 are completely flattened, and the surface of the conductive film 20 forms a flat plane. This greatly reduces obvious changes such as step jumps and wrinkles in the conductive film 20, which helps to ensure that the distance between the conductive film 20 and the top surface 101 of each sub-module 10 is equal, and the distance between the conductive film 20 and the pixelated anode of each sub-module 10 is equal. This helps to form a continuous, stable and uniform electric field and improve the imaging effect.

[0058] In some embodiments of the present invention, the tensile force F of the reverse tension satisfies the relationship: 0.1N ≤ F ≤ 2N. That is, the tensile force F of the reverse tension can be any value between 0.1N and 2N, for example, the tensile force F of the reverse tension can be 0.1N, 0.7N, 1.0N, 1.3N, 2N, etc. This makes the tensile force value of the reverse tension reasonable. By ensuring that 0.1N ≤ F, wrinkles on the film surface can be effectively eliminated, ensuring the fit with the submodule 10. By ensuring that F ≤ 2N, the risk of tensile breakage or plastic deformation of the conductive film 20 can be effectively reduced, improving the yield.

[0059] like Figure 8As shown, the detector 200 according to an embodiment of the present invention includes the detector module 100 described above, or includes a detector module 100 prepared according to the manufacturing method described above. Multiple detector modules 100 are arranged along a second direction orthogonal to the first direction on a third curve, and the first curve 30 and the third curve are configured as curves on the same spherical surface. The detector 200 further includes a housing 201, in which multiple detector modules 100 are disposed. This arrangement allows multiple sub-modules 10 to be arranged on a spherical surface, ensuring that when the number of sub-modules 10 is large, the distances from the top surface 101 of multiple sub-modules 10 to the focal point of the X-ray tube are similar or consistent, which is beneficial for algorithm correction and improving image quality. Furthermore, by setting the detector module 100 described above, multiple sub-modules 10 can be arranged in an arc along the first direction, and the conductive film 20 can be parallel to the top surface 101 of the sub-module 10. This allows the conductive film 20 to be parallel to the pixelated anode of the sub-module 10, and the spacing between the conductive film 20 and the top surface 101 of each sub-module 10 to be equal. This facilitates the formation of a continuous, stable, and uniform electric field, thereby improving the imaging effect.

[0060] A medical imaging device according to an embodiment of the present invention includes: a scanning gantry, a radiation source, and the aforementioned detector 200. The radiation source and detector 200 are respectively disposed on the scanning gantry. The radiation source is used to emit rays toward the scanned object, and the detector 200 is used to receive rays attenuated by the scanned object. When the scanning gantry rotates about the Z-axis, the radiation source and detector 200 rotate synchronously with the scanning gantry and always remain in a radially opposite position, so that the detector 200 can receive rays, such as X-rays, emitted by the radiation source and passing through the scanned object.

[0061] The structure of the scanning gantry is not limited. For example, the scanning gantry may have a scanning cavity for receiving the object being scanned, with the radiation source and detector 200 respectively disposed on both radial sides of the scanning cavity. Exemplarily, in addition to the above-described configuration, a medical imaging device may also include a scanning bed for supporting the object being scanned.

[0062] By setting the detector module 100 as described above, multiple sub-modules 10 can be arranged in an arc along the first direction, and the conductive film 20 can be parallel to the top surface 101 of the sub-module 10. This allows the conductive film 20 to be parallel to the pixelated anode of the sub-module 10, and the spacing between the conductive film 20 and the top surface 101 of each sub-module 10 to be equal. This facilitates the formation of a continuous, stable, and uniform electric field, thereby improving the imaging effect.

[0063] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0064] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0065] In the description of this invention, "a plurality of" means two or more.

[0066] In the description of this invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0067] In the description of this invention, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0069] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A detector module (100) for detecting rays emitted from a radiation source after attenuation by a scanned object, characterized in that, include: Multiple sub-modules (10) are constructed as photon counting modules. The multiple sub-modules (10) are arranged along a first direction on a first curve (30), and the top surface (101) of the sub-modules (10) is tangent to the first curve (30). A conductive film (20) is disposed on the top surface (101) of a plurality of sub-modules (10) and arranged on a second curve (40). The second curve (40) and the first curve (30) are configured as equidistant curves so that the distance between the conductive film (20) and the top surface (101) of each sub-module (10) is equal.

2. The detector module (100) according to claim 1, characterized in that, Multiple pairs of adjacent sub-modules (10) are partially staggered along a second direction orthogonal to the first direction, and are all staggered on the same side of the second direction relative to the edge of the sub-module (10).

3. The detector module (100) according to claim 2, characterized in that, The greater the misalignment distance between the sub-module (10) closer to the center and the sub-module (10) at the edge in the first direction, the greater the misalignment distance.

4. The detector module (100) according to claim 2, characterized in that, In a pair of adjacent and partially misaligned sub-modules (10), the width of the overlapping portion of the orthographic projection of the two sub-modules (10) along the first direction along the second direction is A, and the width of the conductive film (20) is B, satisfying the relationship: B < A.

5. The detector module (100) according to claim 2, characterized in that, The conductive film (20) includes a plurality of sub-films (201), which are connected in sequence, and at least one pair of adjacent sub-films (201) are partially staggered along a second direction orthogonal to the first direction.

6. The detector module (100) according to claim 1, characterized in that, The top surface (101) of the submodule (10) is tangent to the first curve (30) at the center of the top surface (101).

7. The detector module (100) according to claim 1, characterized in that, The detector module (100) has a total coverage width of 6 cm or more in the first direction.

8. The detector module (100) according to claim 7, characterized in that, The detector module (100) has a total coverage width of 8 cm or more in the first direction.

9. A method for manufacturing a detector module, characterized in that, The detector module is the detector module according to any one of claims 1-8, and the production method includes: A conductive adhesive layer is formed on the top surface of the submodule; The planar conductive film is attached to the top surface of the sub-module using the pressing surface of the pressing tool to form the conductive film disposed on the top surface of the plurality of sub-modules and arranged on the second curve.

10. The method for manufacturing the detector module according to claim 9, characterized in that, During the process of attaching the conductive film to the top surface of the submodule, a reverse tensile force is applied to both ends of the conductive film to keep the conductive film under tension.

11. The method for manufacturing the detector module according to claim 10, characterized in that, The tension value of the reverse tension is F, which satisfies the relationship: 0.1N≤F≤2N.

12. A detector (200), characterized in that, The detector module (100) comprises a plurality of detector modules (100) according to any one of claims 1-7, or comprises a plurality of detector modules (100) prepared by a production method according to any one of claims 9-11, wherein the plurality of detector modules (100) are arranged on a third curve along a second direction orthogonal to the first direction, and the first curve (30) and the third curve are configured as curves of the same sphere.

13. A medical imaging device, characterized in that, include: Scanning frame, radiation source, and detector (200) according to claim 12; The radiation source and the detector (200) are respectively disposed on the scanning frame. The radiation source is configured to emit rays toward the scanned object, and the detector (200) is configured to receive rays attenuated by the scanned object and convert the rays into electrical signals.

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