Test system and temperature control method and control device thereof

Abstract

The invention relates to a test system, a temperature control method thereof and a control device. The temperature control method comprises the steps of obtaining a test set temperature and a preset temperature threshold value of a test station, and determining whether a control valve is in an open state or a cut-off state based on the test set temperature and the preset temperature threshold value of the test station; when the control valve is in the open state, the actual test temperature of the test station and the first set temperature and the first actual temperature of the first station are obtained; if the actual test temperature reaches the set test temperature and the first actual temperature reaches the first set temperature, acquiring a test heating duty ratio and a test duty ratio threshold value of the test heating module; if the test heating duty ratio is smaller than the test duty ratio threshold value, the control valve is adjusted to enable the test heating duty ratio to be larger than or equal to the test duty ratio threshold value; and if the test heating duty ratio is greater than or equal to the test duty ratio threshold value, the test station and the first station enter a working state.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, specifically to a testing system and its temperature control method and control device. Background Technology

[0002] With the continuous development of integrated circuits, their application areas are also constantly expanding. Chips in some specialized fields, such as automotive electronics, aerospace electronics, and military electronics, have higher requirements for reliability and stability under harsh environments such as high or low temperatures. Customers are increasingly demanding higher and higher capabilities from testing equipment to create suitable high and low temperature testing environments when conducting high and low temperature testing during the FT (Final Test) stage.

[0003] In current technology, testing equipment for precision components (such as chips), such as sorting machines, requires a temperature control system to strictly control the temperature of the components under test during the testing process to meet testing requirements. The testing equipment may have multiple stations requiring temperature management; in the case of a sorting machine, this includes the testing station, as well as other secondary temperature control stations such as pre-temperature and reheat stations. Each station has a similar cooling unit that continuously delivers low-temperature refrigerant to the components under test to cool them down.

[0004] To prevent excessively high refrigerant temperatures in the compressor's return gas line from affecting its normal operation, an internal refrigerant return gas cooling function is typically employed. This involves adding a thermostatic valve bypass branch between the condenser outlet pipe and the evaporator return gas end to cool the refrigerant return gas line and prevent problems such as compressor suction overheating. However, activating this internal refrigerant return gas cooling function weakens the refrigerant's cooling effect to some extent, failing to meet the cooling requirements of components and hindering temperature control at various workstations within the testing system. Summary of the Invention

[0005] Therefore, it is necessary to provide a testing system and its temperature control method and control device to address the above problems.

[0006] On one hand, this application provides a temperature control method for a testing system. The testing system includes a testing station, a first station, a testing temperature control unit for controlling the temperature of the testing station and the first station respectively, and a first temperature control unit. The testing temperature control unit includes a testing refrigeration module and a testing heating module. The first temperature control unit includes a first refrigeration module. A return gas cooling module is provided between the testing refrigeration module and the first refrigeration module. The return gas cooling module includes a first cooling flow path, a control valve and a heat exchanger disposed on the first cooling flow path. The input end and output end of the first cooling flow path are respectively connected to the refrigerant output end and refrigerant input end of the first refrigeration module. The first cooling flow path exchanges heat with the compressor return gas pipeline of the testing refrigeration module through the heat exchanger. The temperature control method includes the following steps:

[0007] The test setting temperature and preset temperature threshold of the test station are obtained, and the control valve is determined to be in the open or closed state based on the test setting temperature and preset temperature threshold of the test station.

[0008] With the control valve in the open state, the actual test temperature of the test station, the first set temperature of the first station, and the first actual temperature are obtained.

[0009] If the actual test temperature reaches the set test temperature, and the first actual temperature reaches the first set temperature, the test heating duty cycle and the test duty cycle threshold of the test heating module are obtained.

[0010] If the test heating duty cycle is less than the test duty cycle threshold, adjust the control valve to make the test heating duty cycle greater than or equal to the test duty cycle threshold;

[0011] If the test heating duty cycle is greater than or equal to the test duty cycle threshold, the test station and the first station enter the working state;

[0012] In the operating state, the test station tests the component under test, and the first station preheats or reheats the component under test.

[0013] In some embodiments, the step of adjusting the control valve to make the test heating duty cycle greater than or equal to the test duty cycle threshold if the test heating duty cycle is less than the test duty cycle threshold includes:

[0014] Obtain the actual return gas temperature of the test cooling module, and the preset return gas temperature corresponding to the test duty cycle threshold;

[0015] If the actual return gas temperature is greater than the preset return gas temperature, the opening of the control valve is gradually increased by a first set step size until the actual return gas temperature is less than the preset return gas temperature.

[0016] In some embodiments, the return gas superheat and superheat threshold of the first refrigeration module are obtained. When the return gas superheat of the first refrigeration module is less than the superheat threshold, the opening of the control valve is gradually reduced by a second set step size until the return gas superheat of the first refrigeration module is greater than or equal to the superheat threshold.

[0017] Alternatively, the return gas temperature and return gas temperature threshold of the first refrigeration module can be obtained. When the return gas temperature of the first refrigeration module is less than the return gas temperature threshold, the opening of the control valve is gradually reduced by a second set step size until the return gas temperature of the first refrigeration module is greater than or equal to the return gas temperature threshold.

[0018] In some embodiments, after the step of determining whether the control valve is in an open or closed state based on the test set temperature of the test station and the preset temperature threshold, the method further includes:

[0019] Obtain the test heating duty cycle and test duty cycle threshold of the test heating module. If the test heating duty cycle is less than the test duty cycle threshold, adjust the return gas superheat of the test cooling module and the first cooling module in a preset manner to meet their respective preset superheat ranges.

[0020] The preset adjustment method includes: adjusting the set temperature of the test refrigeration module and the first refrigeration module step by step within the preset temperature range with a third preset step; or increasing the opening of the first return gas cooling valve of the first refrigeration module step by step with a fourth preset step.

[0021] In some embodiments, when the control valve is in the open state, the step of adjusting the return gas superheat of the test refrigeration module and the first refrigeration module to meet their respective preset superheat ranges using a preset adjustment method further includes:

[0022] Obtain the actual return gas temperature of the test cooling module, and the preset return gas temperature corresponding to the test duty cycle threshold;

[0023] If the actual return gas temperature is greater than the preset return gas temperature, the opening of the control valve is gradually increased by a first set step size until the actual return gas temperature is less than the preset return gas temperature.

[0024] In some embodiments, after the step of gradually increasing the opening degree of the control valve in a first preset step until the actual return gas temperature is less than the preset return gas temperature, the method further includes:

[0025] Obtain the actual temperature, set temperature, and preset temperature fluctuation range of the test cooling module and the first cooling module respectively;

[0026] If the difference between the actual temperature and the set temperature of the test refrigeration module and the difference between the actual temperature and the set temperature of the first refrigeration module are both within the preset temperature fluctuation range, the preset adjustment method is used to make the return gas superheat of the test refrigeration module and the first refrigeration module meet their respective preset superheat ranges.

[0027] In some embodiments, the first temperature control unit further includes a first heating module. Before the step of adjusting the return gas superheat of the test refrigeration module (21) and the first refrigeration module to meet their respective preset superheat ranges by means of a preset adjustment method when the control valve is in a cut-off state, the following steps are included:

[0028] Obtain the first heating duty cycle and the first duty cycle threshold of the first heating module;

[0029] If the first heating duty cycle is less than the first duty cycle threshold, or the test heating duty cycle is less than the test duty cycle threshold, the return gas superheat of the test refrigeration module and the first refrigeration module are adjusted in the preset mode to meet their respective preset superheat ranges.

[0030] In some embodiments, the specific steps of adjusting the return gas superheat of the test refrigeration module and the first refrigeration module to meet their respective preset superheat ranges using a preset adjustment method include:

[0031] Obtain the return gas superheat and preset superheat range corresponding to the test refrigeration module and the first refrigeration module;

[0032] This step ends when the return gas superheat of the test refrigeration module and the first refrigeration module are respectively within the corresponding preset superheat range;

[0033] Otherwise, within the preset temperature range, the set temperature of the test refrigeration module and the first refrigeration module are adjusted step by step with the third set step; or the opening of the first return gas cooling valve of the first refrigeration module is increased step by step with the fourth set step.

[0034] In some embodiments, the preset superheat range includes a lower limit value for superheat. If the return gas superheat of the first refrigeration module is less than or equal to the lower limit value for superheat, the set temperature of the test refrigeration module remains unchanged, and the set temperature of the first refrigeration module is gradually reduced by the third set step size until the return gas superheat of the first refrigeration module is greater than the lower limit value for superheat.

[0035] If the return gas superheat of the test refrigeration module is less than or equal to the lower limit of superheat, the set temperature of the first refrigeration module remains unchanged, and the set temperature of the test refrigeration module is gradually reduced by the third set step size until the return gas superheat of the test refrigeration module is greater than the lower limit of superheat.

[0036] In some embodiments, the preset superheat range includes an upper limit value for superheat. If the return gas superheat of the test refrigeration module is greater than or equal to the upper limit value for superheat, the set temperature of the first refrigeration module remains unchanged, and the set temperature of the test refrigeration module is gradually increased with the third set step size until the return gas superheat of the test refrigeration module is less than the upper limit value for superheat.

[0037] If the return gas superheat of the first refrigeration module is greater than or equal to the upper limit of superheat, the set temperature of the test refrigeration module remains unchanged, and the set temperature of the first refrigeration module is gradually increased in steps by the third set step size until the return gas superheat of the first refrigeration module is less than the upper limit of superheat.

[0038] In some embodiments, the step of gradually increasing the set temperature of the first cooling module in the third set step size further includes:

[0039] If the return gas superheat of the first refrigeration module is greater than or equal to the upper limit of superheat, the set temperature of the test refrigeration module remains unchanged, and the opening of the first return gas cooling valve is increased step by step with a fifth set step size until the return gas superheat of the first refrigeration module is less than the upper limit of superheat.

[0040] On the other hand, this application also provides a control device, including:

[0041] The data acquisition module is used to acquire the test setting temperature and preset temperature threshold of the test station; it is also used to acquire the actual test temperature of the test station, the first setting temperature and the first actual temperature of the first station; and it is also used to acquire the test heating duty cycle and test duty cycle threshold of the test heating module.

[0042] The judgment module is used to compare the acquired test set temperature and preset temperature threshold of the test station, and determine the state of the control valve based on the comparison result; it is also used to compare the acquired test actual temperature of the test station and the first actual temperature of the first station with the test set temperature and the first set temperature, respectively, and determine whether it is necessary to acquire the test heating duty cycle and test duty cycle threshold of the test heating module based on the comparison result; it is also used to compare the acquired test heating duty cycle and test duty cycle threshold of the test heating module, and determine whether the test station and the first station have entered the working state based on the comparison result; and

[0043] The control module is used to control the opening degree of the control valve.

[0044] On the other hand, this application also provides a testing system, including a test temperature control unit, a first temperature control unit, and a testing unit. The test temperature control unit and the first temperature control unit are used to control the temperature of the test station and the first station respectively using the temperature control method described in any of the above embodiments. The testing unit is used to test the component under test located at the test station.

[0045] Compared with the prior art, this application has the following beneficial effects:

[0046] The aforementioned testing system and its temperature control method and control device determine the open or closed state of the control valve based on the test set temperature and preset temperature threshold of the test station. When the control valve is open, the refrigerant output from the first refrigeration module passes through the heat exchanger via the first cooling flow path, thereby cooling the refrigerant in the compressor return gas pipeline of the test refrigeration module. This prevents alarms caused by overheating of the return gas from the test refrigeration module and avoids weakening the cooling effect of the test refrigeration module, better meeting the cooling requirements of the components at the test station. Furthermore, the aforementioned temperature control method also considers that the first actual temperature of the first station must meet the first set temperature condition. After the test heating duty cycle reaches the standard, both the test station and the first station can enter the working state, meaning that all parts of the testing system can operate normally to complete the corresponding testing of the components under test. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the test system in one embodiment of this application;

[0048] Figure 2 This is a schematic diagram of the test system in another embodiment of this application;

[0049] Figure 3 for Figure 1 The diagram shows the structure of the first temperature control unit of the test system.

[0050] Figure 4 for Figure 1 The diagram shows the structural schematic of the test temperature control unit of the test system.

[0051] Figure 5 This is a flowchart illustrating a temperature control method for a test system in conventional cooling mode, as shown in one embodiment of this application.

[0052] Figure 6 This is a flowchart illustrating a temperature control method for a test system in high-efficiency cooling mode, as shown in one embodiment of this application.

[0053] Figure 7 for Figure 6 A flowchart illustrating the preset adjustment method in the temperature control method shown.

[0054] Figure 8 for Figure 5 The flowchart shown is a step diagram of the temperature control method in the normal cooling mode;

[0055] Figure 9 for Figure 8 The flowchart shown illustrates the steps in the temperature control method where the first return gas cooling valve and the test return gas cooling valve are in the cut-off state.

[0056] Figure 10 for Figure 6 The flowchart shown is a step diagram of the temperature control method in the high-efficiency cooling mode;

[0057] Figure 11 for Figure 10 The flowchart shows step S50 and the steps after step S50 in the temperature control method shown.

[0058] Figure 12 This is a flowchart of the return gas superheat control step S100 in a temperature control method according to an embodiment of this application;

[0059] Figure 13 This is a flowchart of step S100' of the return gas superheat control method in another embodiment of this application;

[0060] Figure 14 for Figure 11 The flowchart of step S54 shown below;

[0061] Figure 15 for Figure 14 The diagram below illustrates step S542.

[0062] Figure 16 for Figure 10 The flowchart shows the steps in the temperature control method when the control valve is in the off state. Detailed Implementation

[0063] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0064] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0067] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0068] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0069] Please see Figure 1 This application provides a testing system, including a testing station a2, a testing temperature control unit 20, a first station a1, a first temperature control unit 10, and a testing unit (not shown).

[0070] Test station a2 is used to load the component under test (DUT). The test temperature control unit 20 includes a test cooling module 21 and a test heating module 400. The test cooling module 21 provides a cold source to test station a2. The test heating module 400 is located at test station a2 and provides a heat source to test station a2. The cold and heat sources provided by the test cooling module 21 and the test heating module 400 are balanced at test station a2, thereby ensuring that the DUT located at test station a2 is maintained at the target temperature or within the target temperature range. The test unit is used to test the DUT located at test station a2.

[0071] The first station a1 is used for loading components. The first temperature control unit 10 includes a first cooling module 11 and a first heating module 100. The first cooling module 11 is used to provide a cold source to the first station a1. The first heating module 100 is arranged at the first station a1 and is used to provide a heat source to the first station a1. The cold source and the heat source provided by the first cooling module 11 and the first heating module 100 are balanced at the first station a1, thereby maintaining the temperature of the components located at the first station a1 at the target temperature or within the target temperature range. It should be noted that the first station a1 can be a preheating station (e.g., a preheating plate station, a feed shuttle station, etc.), a reheating station (e.g., a feed shuttle station, etc.), or other stations that require temperature control of components, which are not limited here.

[0072] A return gas cooling module 30 is provided between the test refrigeration module 21 and the first refrigeration module 11. This return gas cooling module 30 includes a first cooling flow path 31, a control valve A3 disposed on the first cooling flow path 31, and a heat exchanger 33. The input and output ends of the first cooling flow path 31 are respectively connected to the refrigerant output and refrigerant input ends of the first refrigeration module 11. The first cooling flow path 31 exchanges heat with the compressor return gas pipeline 23 of the test refrigeration module 21 through the heat exchanger 33, thereby cooling the refrigerant in the compressor return gas pipeline 23 of the test refrigeration module 21. In this embodiment, referring to... Figure 1 The first cooling flow path 31 is branched from the refrigerant output pipe 12 of the first refrigeration module 11 and connected to the refrigerant input pipe 13 of the first refrigeration module 11. That is, the first cooling flow path 31 is a branch connected to the refrigerant circuit of the first refrigeration module 11.

[0073] Thus, a portion of the low-temperature, low-pressure refrigerant liquid in the refrigerant output pipe 12 of the first refrigeration module 11 enters the first cooling flow path 31 and then enters the heat exchanger 33 along the first cooling flow path 31. The high-temperature, high-pressure refrigerant gas in the compressor return pipe 23 of the test refrigeration module 21 flows through the heat exchanger 33, where the low-temperature, low-pressure refrigerant liquid provided by the first refrigeration module 11 exchanges heat with the high-temperature, high-pressure refrigerant gas provided by the test refrigeration module 21. This achieves cooling of the high-temperature, high-pressure refrigerant gas in the compressor return pipe 23 of the test refrigeration module 21, thereby avoiding the problem of excessively high return temperature of the test refrigeration module 21 and preventing a weakening of the cooling effect of the test refrigeration module 21, thus better meeting the cooling requirements of the components at test station a2.

[0074] Specifically, in the embodiments, the first heating module 100 includes a first electric heating element, which is used to electrically heat the component located at the first station a1. The test heating module 400 includes a test electric heating element, which is used to electrically heat the component under test located at the test station a2.

[0075] Please see Figure 3In some embodiments, the first refrigeration module 11 includes a first high-temperature stage refrigeration module B1 and a first low-temperature stage refrigeration module B2. The first high-temperature stage refrigeration module B1 includes a first high-temperature stage compressor 115, a first high-temperature stage condenser 116, a first high-temperature stage throttling device 117, and a first condenser-evaporator 112, which are sequentially connected and form a first high-temperature stage refrigeration circuit. The first low-temperature stage refrigeration module B2 includes a first low-temperature stage compressor 111, the aforementioned first condenser-evaporator 112, a first low-temperature stage throttling device 113, and a first low-temperature stage evaporator 100, which are sequentially connected and form a first low-temperature stage refrigeration circuit. The first low-temperature stage evaporator 100 is arranged at a first station a1. The first high-temperature stage refrigeration circuit and the first low-temperature stage refrigeration circuit are thermally coupled through the first condenser-evaporator 112, meaning that the refrigerant in the first high-temperature stage refrigeration circuit exchanges heat with the refrigerant in the first low-temperature stage refrigeration circuit in the first condenser-evaporator 112, thereby achieving cooling of the refrigerant in the first low-temperature stage refrigeration circuit by the refrigerant in the first high-temperature stage refrigeration circuit. In the first low-temperature stage refrigeration circuit, the refrigerant exchanges heat with the components located at the first station a1 in the first low-temperature stage evaporator 100, thereby cooling the components and keeping them at the target temperature or within the target temperature range.

[0076] In actual use, in the first high-temperature stage refrigeration circuit, the first condenser-evaporator 112 discharges high-temperature low-pressure refrigerant gas; the first high-temperature stage compressor 115 draws in the high-temperature low-pressure refrigerant gas and compresses it into high-temperature high-pressure refrigerant gas; the high-temperature high-pressure refrigerant gas is condensed into medium-temperature high-pressure refrigerant liquid by the first high-temperature stage condenser 116; the medium-temperature high-pressure refrigerant liquid expands and depressurizes by the first high-temperature stage throttling device 117 into low-temperature low-pressure refrigerant liquid; the low-temperature low-pressure refrigerant liquid enters the first condenser-evaporator 112 and exchanges heat with the refrigerant in the first low-temperature stage refrigeration circuit, thereby evaporating again into high-temperature low-pressure refrigerant gas.

[0077] In the first low-temperature stage refrigeration circuit, the first low-temperature stage evaporator 100 discharges high-temperature, low-pressure refrigerant gas; the first low-temperature stage compressor 111 draws in the high-temperature, low-pressure refrigerant gas and compresses it into high-temperature, high-pressure refrigerant gas; the high-temperature, high-pressure refrigerant gas enters the first condenser-evaporator 112 to exchange heat with the refrigerant in the first high-temperature stage refrigeration circuit and is condensed into medium-temperature, high-pressure refrigerant liquid; the medium-temperature, high-pressure refrigerant liquid expands and depressurizes through the first low-temperature stage throttling device 113 to become low-temperature, low-pressure refrigerant liquid; the low-temperature, low-pressure refrigerant liquid enters the first low-temperature stage evaporator 100 and exchanges heat with the components located at the first station a1, thereby evaporating again into high-temperature, low-pressure refrigerant gas.

[0078] It is understood that the refrigerant output pipe 12 of the first refrigeration module 11 refers to the pipe between the first low-temperature stage throttling device 113 and the first low-temperature stage evaporator 100, and the refrigerant input pipe 13 of the first refrigeration module 11 refers to the pipe between the first low-temperature stage evaporator 100 and the first low-temperature stage compressor 111. The refrigerant output end of the first refrigeration module 11 is the outlet of the first low-temperature stage throttling device 113, and the refrigerant input end of the first refrigeration module 11 is the inlet of the first low-temperature stage compressor 111.

[0079] Specifically, in this embodiment, the first low-temperature stage refrigeration module B2 of the first refrigeration module 11 further includes a first return gas cooling pipeline 114 and a first return gas cooling valve A1. The inlet end of the first return gas cooling pipeline 114 is connected to the pipeline between the outlet of the first condenser-evaporator 112 and the inlet of the first low-temperature stage throttling device 113; or, the inlet end of the first return gas cooling pipeline 114 is connected to the pipeline between the outlet of the first low-temperature stage throttling device 113 and the inlet of the first low-temperature stage evaporator 100. The outlet end of the first return gas cooling pipeline 114 is connected to the pipeline between the outlet of the first low-temperature stage evaporator 100 and the inlet of the first low-temperature stage compressor 111. The first return gas cooling valve A1 is installed on the first return gas cooling pipeline 114, thereby allowing control of the flow rate of the first return gas cooling pipeline 114 by adjusting the opening degree of the first return gas cooling valve A1. In this way, the flow rate of refrigerant in the first return gas cooling pipe 114 can be controlled by the first return gas cooling valve A1, and the high-temperature, low-pressure refrigerant gas in the refrigerant input pipe 13 of the first refrigeration module 11 can be cooled by the medium-temperature, high-pressure refrigerant liquid or low-temperature, low-pressure refrigerant liquid in the first return gas cooling pipe 114, thus avoiding the problem of excessively high return gas temperature of the first refrigeration module 11. Optionally, the first return gas cooling valve A1 can be a thermostatic valve.

[0080] Furthermore, the first cryogenic stage refrigeration module B2 of the first refrigeration module 11 also includes a hot gas bypass pipe 118 and a hot gas bypass valve 119. The inlet end of the hot gas bypass pipe 118 is connected to the pipe between the outlet of the first cryogenic stage compressor 111 and the inlet of the first condenser-evaporator 112. The outlet end of the hot gas bypass pipe 118 is connected to the pipe between the outlet of the first cryogenic stage throttling element 113 and the inlet of the first cryogenic stage evaporator 100. The hot gas bypass valve 119 is installed on the hot gas bypass pipe 118, so that the flow rate of the hot gas bypass pipe 118 can be controlled by adjusting the opening degree of the hot gas bypass valve 119. Thus, when the return gas superheat of the first refrigeration module 11 is too low, the hot gas bypass valve 119 can be opened, allowing a portion of the high-temperature and high-pressure refrigerant gas discharged from the first low-temperature stage compressor 111 to enter the hot gas bypass pipe 118 and then enter the first low-temperature stage evaporator 100 along the hot gas bypass pipe 118, thereby increasing the return gas temperature of the first low-temperature stage compressor 111 and thus improving the return gas superheat of the first refrigeration module 11.

[0081] It is understood that the first refrigeration module 11 may be a cascade refrigeration system including a first high-temperature stage refrigeration module B1 and a first low-temperature stage refrigeration module B2. Of course, in other embodiments, the first refrigeration module 11 may also be a single-stage refrigeration module including only one stage refrigeration module, which is not limited here.

[0082] It should be noted that the return gas cooling module 30 is not limited to connecting the inlet and outlet ends of the first cooling flow path 31 to the refrigerant output pipe 12 and refrigerant input pipe 13 of the first refrigeration module 11, respectively. For other embodiments, please refer to... Figure 2 As shown, the refrigerant output pipe 12 of the first refrigeration module 11 can also be directly used as the first cooling flow path 31. That is, the refrigerant output terminal d1 of the first refrigeration module 11 is connected to the inlet of the first low-temperature stage evaporator 100 located at the first station a1 through the first cooling flow path 31, and the first cooling flow path 31 serves as part of the refrigerant circuit of the first refrigeration module 11. In this way, all the refrigerant output from the refrigerant output terminal d1 of the first refrigeration module 11 enters the heat exchanger 33 for heat exchange along the first cooling flow path 31, and then enters the first low-temperature stage evaporator 100 located at the first station a1 for heat exchange. Finally, it flows back to the first low-temperature stage compressor 111 along the refrigerant input terminal d2 of the first refrigeration module 11.

[0083] Please see Figure 4 In some embodiments, the test refrigeration module 21 includes a high-temperature test refrigeration module F1 and a low-temperature test refrigeration module F2. The high-temperature test refrigeration module F1 includes a high-temperature test compressor 215, a high-temperature test condenser 216, a high-temperature test throttling device 217, and a test condenser-evaporator 212, which are sequentially connected and form a high-temperature test refrigeration circuit. The low-temperature test refrigeration module F2 includes a low-temperature test compressor 211, the aforementioned test condenser-evaporator 212, a low-temperature test throttling device 213, and a test low-temperature test evaporator 200, which are sequentially connected and form a low-temperature test refrigeration circuit. The low-temperature test evaporator 200 is arranged at test station a2. The high-temperature test refrigeration circuit and the low-temperature test refrigeration circuit are thermally coupled through the test condenser-evaporator 212, meaning that the refrigerant in the high-temperature test refrigeration circuit exchanges heat with the refrigerant in the low-temperature test refrigeration circuit in the test condenser-evaporator 212, thereby achieving cooling of the refrigerant in the low-temperature test refrigeration circuit by the refrigerant in the high-temperature test refrigeration circuit. In the test low-temperature stage refrigeration circuit, the refrigerant exchanges heat with the component under test in the test low-temperature stage evaporator 200, thereby cooling the component under test and keeping it at the target temperature or within the target temperature range.

[0084] In actual use, in the high-temperature stage refrigeration circuit, the test condenser-evaporator 212 discharges high-temperature, low-pressure refrigerant gas; the test high-temperature stage compressor 215 draws in the high-temperature, low-pressure refrigerant gas and compresses it into high-temperature, high-pressure refrigerant gas; the high-temperature, high-pressure refrigerant gas is condensed into medium-temperature, high-pressure refrigerant liquid by the test high-temperature stage condenser 216; the medium-temperature, high-pressure refrigerant liquid expands and depressurizes by the test high-temperature stage throttling device 217 into low-temperature, low-pressure refrigerant liquid; the low-temperature, low-pressure refrigerant liquid enters the test condenser-evaporator 212 and exchanges heat with the refrigerant in the test low-temperature stage refrigeration circuit, thereby evaporating again into high-temperature, low-pressure refrigerant gas.

[0085] In the test low-temperature stage refrigeration circuit, the test low-temperature stage evaporator 200 discharges high-temperature, low-pressure refrigerant gas; the test low-temperature stage compressor 211 draws in the high-temperature, low-pressure refrigerant gas and compresses it into high-temperature, high-pressure refrigerant gas; the high-temperature, high-pressure refrigerant gas enters the test condenser-evaporator 212 and exchanges heat with the refrigerant in the test high-temperature stage refrigeration circuit, thereby being condensed into medium-temperature, high-pressure refrigerant liquid; the medium-temperature, high-pressure refrigerant liquid expands and depressurizes through the test low-temperature stage throttling device 213 to become low-temperature, low-pressure refrigerant liquid; the low-temperature, low-pressure refrigerant liquid enters the test low-temperature stage evaporator 200 and exchanges heat with the component under test, thereby evaporating again into high-temperature, low-pressure refrigerant gas.

[0086] It is understandable that the refrigerant output line 22 of the test refrigeration module 21 refers to the line between the test low-temperature stage throttling device 213 and the test low-temperature stage evaporator 200, and the compressor return line 23 of the test refrigeration module 21 refers to the line between the test low-temperature stage evaporator 200 and the test low-temperature stage compressor 211.

[0087] Furthermore, the test low-temperature stage refrigeration module F2 of the test refrigeration module 21 also includes a test return gas cooling line 214 and a test return gas cooling valve A2. The inlet end of the test return gas cooling line 214 is connected to the pipeline between the outlet of the test condenser evaporator 212 and the inlet of the test low-temperature stage throttling device 213; or, the inlet end of the test return gas cooling line 214 is connected to the pipeline between the outlet of the test low-temperature stage throttling device 213 and the inlet of the test low-temperature stage evaporator 200. The outlet end of the test return gas cooling line 214 is connected to the pipeline between the outlet of the test low-temperature stage evaporator 200 and the inlet of the test low-temperature stage compressor 211. In this way, the flow rate of refrigerant in the test return gas cooling pipeline 214 can be controlled by the test return gas cooling valve A2, and the high-temperature, low-pressure refrigerant gas in the compressor return gas pipeline 23 of the test refrigeration module 21 can be cooled by the medium-temperature, high-pressure refrigerant liquid or low-temperature, low-pressure refrigerant liquid in the test return gas cooling pipeline 214, thus avoiding the problem of excessively high return gas temperature of the test refrigeration module 21. Optionally, the test return gas cooling valve A2 can be a thermostatic valve.

[0088] It is understood that the test refrigeration module 21 can be a cascade refrigeration system including a high-temperature test refrigeration module F1 and a low-temperature test refrigeration module F2. Of course, in other embodiments, the test refrigeration module 21 can also be a single-stage refrigeration module including only one stage refrigeration module, which is not limited here.

[0089] Based on the aforementioned testing system, this application also provides a temperature control method for the testing system. The temperature control method includes a conventional cooling mode and a high-efficiency cooling mode, and by default, in the conventional cooling mode, control valve A3 is in the cut-off state.

[0090] Specifically, when the test system is running in the normal cooling mode, the return gas temperature of the first cooling module 11 and the test cooling module 21 can be controlled by adjusting the opening of the first return gas cooling valve A1 and the test return gas cooling valve A2, respectively. That is, the first return gas cooling valve A1 and the test return gas cooling valve A2 can be in the open state.

[0091] When the test system is running in high-efficiency cooling mode, the return gas temperature of the test cooling module 21 can be controlled by adjusting the opening of control valve A3. That is, the opening of control valve A3 can be adjusted as needed, and it can be in an open or closed state. Of course, in high-efficiency cooling mode, the first return gas cooling valve A1 and the second return gas cooling valve A2 can also be adjusted as needed, and they can be in an open or closed state.

[0092] Please see also Figure 5 and Figure 8 In the embodiments of this application, the temperature control method includes the following steps:

[0093] S10b: Start the test system and set the test system to enter normal cooling mode.

[0094] S20b. In normal cooling mode, the test set temperature SV and preset temperature threshold T3 of test station a2 are obtained, and the first return gas cooling valve A1 and the test return gas cooling valve A2 are determined to be in the open or closed state based on the test set temperature SV and preset temperature threshold T3 of test station a2. Specifically, when the test set temperature SV of test station a2 is greater than or equal to the preset temperature threshold T3, that is, the temperature of test station a2 is high, it is necessary to use the first return gas cooling pipeline 114 and the test return gas cooling pipeline 214 to cool the refrigerant in the compressor return gas pipeline 23 of the first refrigeration module 11 and the test refrigeration module 21 respectively (that is, the first return gas cooling valve A1 and the test return gas cooling valve A2 are in the open state) to avoid the return gas overheating alarm of the first refrigeration module 11 and the test refrigeration module 21. When the test set temperature SV in test station a2 is less than the preset temperature threshold T3, that is, the temperature of test station a2 is low, it is not necessary to use the first return gas cooling pipeline 114 and the test return gas cooling pipeline 214 to cool the refrigerant in the compressor return gas pipeline 23 of the first refrigeration module 11 and the test refrigeration module 21 respectively (i.e., the first return gas cooling valve A1, the test return gas cooling valve A2 and the control valve).

[0095] S30b, with the first return gas cooling valve A1 and the test return gas cooling valve A2 in the open state, acquire the actual test temperature T2 of the test station a2, the first set temperature SV1 of the first station a1 and the first actual temperature T1.

[0096] S40b If the actual test temperature T2 does not reach the test set temperature SV, or the first actual temperature T1 does not reach the first set temperature SV1, then continue to obtain the actual test temperature T2 of test station a2 and the first actual temperature T1 of first station a1.

[0097] If the actual test temperature T2 reaches the test set temperature SV, and the first actual temperature T1 reaches the first set temperature SV1, then the test heating duty cycle c2 and test duty cycle threshold c3 of the test heating module 400, and the first heating duty cycle c1 and first duty cycle threshold c4 of the first heating module 100 are obtained.

[0098] S50b: If the test heating duty cycle c2 of the test heating module 400 is less than the test duty cycle threshold c3, or the first heating duty cycle c1 of the first heating module 100 is less than the first duty cycle threshold c4, then step S50b1 is executed.

[0099] If the test heating duty cycle c2 of the test heating module 400 is greater than or equal to the test duty cycle threshold c3, and the first heating duty cycle c1 of the first heating module 100 is greater than or equal to the first duty cycle threshold c4, then the test station a2 and the first station a1 enter the working state.

[0100] S60b: When test station a2 is in operation and its temperature reaches the set test temperature SV, the test unit is used to test the component under test located at test station a2. When first station a1 is in operation and its temperature reaches the first set temperature SV1, the temperature of the component located at first station a1 reaches the first set temperature SV1, thereby achieving pre-warming or rewarming of the component.

[0101] Specifically, step S50b1 includes adjusting the first return gas cooling valve A1 and the test return gas cooling valve A2 so that the heating duty cycle of the first heating module 100 and the test heating module 400 are both greater than or equal to their respective duty cycle thresholds, and then returning to execute S30b. Specifically, when the opening of the first return gas cooling valve A1 decreases, the flow rate of the first return gas cooling pipeline 114 decreases, and the main cooling flow rate increases, thereby enhancing the cooling effect of the first cooling module 11 on the first station a1, and thus increasing the first heating duty cycle c1 of the first heating module 100; conversely, when the opening of the first return gas cooling valve A1 increases, the flow rate of the first return gas cooling pipeline 114 increases, and the main cooling flow rate decreases, thereby weakening the cooling effect of the first cooling module 11 on the first station a1, and thus decreasing the first heating duty cycle c1 of the first heating module 100.

[0102] When the opening degree of the test return gas cooling valve A2 decreases, the flow rate of the test return gas cooling pipeline 214 decreases, thereby enhancing the cooling effect of the test refrigeration module 21 on the test station a2, which in turn increases the test heating duty cycle c2 of the test heating module 400. Conversely, when the opening degree of the test return gas cooling valve A2 increases, the flow rate of the test return gas cooling pipeline 214 increases, thereby weakening the cooling effect of the test refrigeration module 21 on the test station a2, which in turn decreases the test heating duty cycle c2 of the test heating module 400.

[0103] Please see Figure 5 and Figure 9 In some embodiments, the following step is included after step S20b:

[0104] S30c, with the first return gas cooling valve A1 and the test return gas cooling valve A2 in the cut-off state, acquire the actual test temperature T2 of the test station a2, the first set temperature SV1 of the first station a1 and the first actual temperature T1.

[0105] S40c. If the actual test temperature T2 does not reach the test set temperature SV, or the first actual temperature T1 does not reach the first set temperature SV1, then continue to obtain the actual test temperature T2 of test station a2 and the first actual temperature T1 of first station a1.

[0106] If the actual test temperature T2 reaches the test set temperature SV, and the first actual temperature T1 reaches the first set temperature SV1, then the test heating duty cycle c2 and test duty cycle threshold c3 of the test heating module 400, and the first heating duty cycle c1 and first duty cycle threshold c4 of the first heating module 100 are obtained.

[0107] S50c: If the test heating duty cycle c2 of the test heating module 400 is less than the test duty cycle threshold c3, then the cooling capacity of the test refrigeration module is increased by adjusting the test low temperature stage throttling device 213 until the test heating duty cycle c2 of the test heating module 400 is greater than or equal to the test duty cycle threshold c3; if the first heating duty cycle c1 of the first heating module 100 is less than the first duty cycle threshold c4, then the cooling capacity of the first refrigeration module is increased by adjusting the first low temperature stage throttling device 113 until the first heating duty cycle c1 of the first heating module 100 is greater than or equal to the first duty cycle threshold c4; and then return to step S30c.

[0108] If the test heating duty cycle c2 of the test heating module 400 is greater than or equal to the test duty cycle threshold c3, and the first heating duty cycle c1 of the first heating module 100 is greater than or equal to the first duty cycle threshold c4, then the test station a2 and the first station a1 enter the working state.

[0109] Please see Figure 6 and Figure 10 In embodiments of this application, the temperature control method further includes the following steps:

[0110] S10. Start the test system and set the test system to enter the high-efficiency cooling mode.

[0111] S20. In high-efficiency cooling mode, the test set temperature SV and preset temperature threshold T3 of test station a2 are obtained, and the control valve A3 is determined to be in the open or closed state based on the test set temperature SV and preset temperature threshold T3 of test station a2. Specifically, the test set temperature SV of test station a2 refers to the target temperature or target temperature range that the component under test needs to reach when testing the component under test located at test station a2. When the test set temperature SV of test station a2 is greater than or equal to the preset temperature threshold T3, that is, the temperature of test station a2 is high, so at this time, the refrigerant in the first cooling flow path 31 needs to be used to cool the refrigerant in the compressor return gas pipeline 23 of test cooling module 21 (that is, control valve A3 is in the open state) to avoid alarm due to overheating of the return gas of test cooling module 21. When the test set temperature SV in test station a2 is less than the preset temperature threshold T3, that is, the temperature of test station a2 is low, it is not necessary to use the refrigerant in the first cooling flow path 31 to cool the refrigerant in the compressor return gas pipeline 23 of the test refrigeration module 21 (that is, the control valve A3 is in the cut-off state).

[0112] It should be noted that when control valve A3 is in the shut-off state, its opening is zero, meaning that the refrigerant does not flow in the first cooling flow path 31. When control valve A3 is in the open state, its opening is not zero; it can be 30%, 50%, 70%, or 100%, meaning that the refrigerant can flow in the first cooling flow path 31. It can be understood that the larger the opening of control valve A3, the greater the refrigerant flow rate in the first cooling flow path 31; conversely, the smaller the opening of control valve A3, the smaller the refrigerant flow rate in the first cooling flow path 31.

[0113] S30. With control valve A3 in the open state, acquire the actual test temperature T2 of test station a2, the first set temperature SV1 of the first station a1, and the first actual temperature T1. It should be noted that the actual test temperature T2 of test station a2 refers to the actual temperature of the current test station a2. The first set temperature SV1 of the first station a1 refers to the target temperature or target temperature range that the component located at the first station a1 needs to achieve. The first actual temperature T1 of the first station a1 refers to the actual temperature of the current first station a1.

[0114] S40. If the actual test temperature T2 of test station a2 is less than the test set temperature SV, or the first actual temperature T1 of the first station a1 is less than the first set temperature SV1, then continue to obtain the actual test temperature T2 of test station a2 and the first actual temperature T1 of the first station a1.

[0115] If the actual test temperature T2 reaches the test set temperature SV, and the first actual temperature T1 reaches the first set temperature SV1, then the test heating duty cycle c2 and the test duty cycle threshold c3 of the test heating module 400 are obtained.

[0116] S50. If the test heating duty cycle c2 of the test heating module 400 is less than the test duty cycle threshold c3, then adjust the control valve A3 so that the test heating duty cycle c2 of the test heating module 400 is greater than or equal to the test duty cycle threshold c3.

[0117] If the test heating duty cycle c2 of test station a2 is greater than or equal to the test duty cycle threshold c3, then test station a2 and first station a1 enter the working state.

[0118] S60. When test station a2 is in operation and its temperature reaches the set test temperature SV, the test unit is used to test the component under test located at test station a2. When first station a1 is in operation and its temperature reaches the first set temperature SV1, the temperature of the component located at first station a1 reaches the first set temperature SV1, thereby achieving preheating or reheating of the component. If first station a1 is a preheating station, the component needs to be preheated at first station a1 before being transferred to test station a2 for testing; if first station a1 is a reheating station, the component needs to be tested at test station a2 before being transferred to first station a1 for reheating.

[0119] The aforementioned temperature control method determines the open or closed state of control valve A3 by comparing the test set temperature SV of test station a2 with the preset temperature threshold T3. When control valve A3 is open, the refrigerant output from the first refrigeration module 11 passes through the heat exchanger 33 via the first cooling flow path 31, thereby cooling the input refrigerant of the test refrigeration module 21. This prevents alarms caused by overheating of the return gas from the test refrigeration module 21 and avoids weakening the cooling effect of the test refrigeration module 21, thus better meeting the cooling requirements of the components at test station a2. Furthermore, the aforementioned temperature control method also considers that the first actual temperature of the first station must meet the first set temperature condition. After the test heating duty cycle reaches the standard, both the test station and the first station can enter the working state, meaning that all parts of the test system can operate normally to complete the corresponding tests on the components under test.

[0120] Please see Figure 6 and Figure 11 In some embodiments, step S50 specifically includes the following steps:

[0121] S51. Obtain the actual return gas temperature of the test cooling module 21 and the preset return gas temperature corresponding to the test duty cycle threshold c3 of the test heating module 400.

[0122] S52. If the actual return gas temperature of the test cooling module 21 is greater than the preset return gas temperature, the opening of the control valve A3 is gradually increased by a first preset step size until the actual return gas temperature of the test cooling module 21 is less than the preset return gas temperature. In this way, by gradually increasing the opening of the control valve A3, the actual return gas temperature of the test cooling module 21 is gradually reduced, thereby improving the cooling effect of the test cooling module 21 on the test station a2, and thus improving the test heating duty cycle c2 of the test heating module 400.

[0123] The problem might be due to insufficient heat exchange in the low-temperature evaporator 200 at test station a2, such as frosting or high thermal resistance, or insufficient refrigerant circulation in the low-temperature refrigeration circuit. This could cause the refrigerant to absorb only a small amount of heat before evaporating into a gaseous state in the evaporator 200. This gaseous refrigerant then continues to absorb heat from the outside, resulting in an excessively high return temperature for the low-temperature compressor 211. In this case, it means the cooling capacity of the refrigeration module 21 is insufficient. To ensure precise temperature control and prevent excessively low temperatures, the heating duty cycle c2 of the heating module 400 is matched to the cooling capacity of the refrigeration module 21. By adjusting control valve A3, the actual return gas temperature of the refrigeration module 21 is reduced to a reasonable range, improving its cooling effect, and consequently increasing the heating duty cycle c2 of the heating module 400.

[0124] It should be noted that return gas superheat refers to the difference between the temperature of the refrigerant gas at the inlet of the cryogenic compressor and the saturation temperature of the refrigerant gas at the current pressure. It is a core monitoring parameter for ensuring the safe and efficient operation of the refrigeration module. A positive return gas superheat indicates that the refrigerant at the inlet of the cryogenic compressor is entirely gaseous; a zero or negative return gas superheat indicates that the refrigerant at the inlet of the cryogenic compressor contains incompletely evaporated liquid components, posing a greater risk of liquid slugging. Therefore, to ensure the safe and efficient operation of the refrigeration module, it is necessary to monitor the return gas superheat in real time and control it to a state greater than or equal to the superheat threshold. This superheat threshold can be set according to specific operating conditions and is not limited here.

[0125] Please see Figure 12 Specifically, in this embodiment, the temperature control method further includes a return gas superheat regulation step S100 for the first refrigeration module 11. This return gas superheat regulation step S100 of the first refrigeration module 11 specifically includes:

[0126] S101. When the control valve A3 is in the open state, obtain the return gas superheat and superheat threshold of the first refrigeration module 11.

[0127] S102. If the return gas superheat of the first refrigeration module 11 is less than the superheat threshold, the opening of the control valve A3 is gradually reduced by the second set step size until the return gas superheat of the first refrigeration module 11 is greater than or equal to the superheat threshold.

[0128] If the return gas superheat of the first refrigeration module 11 is greater than or equal to the superheat threshold, then the control valve A3 will remain at its current opening.

[0129] Please see Figure 13 Specifically, in this embodiment, the temperature control method further includes a return gas superheat regulation step S100' of the first refrigeration module 11. The return gas superheat regulation step S100' of the first refrigeration module 11 is as follows:

[0130] S101' When the control valve A3 is in the open state, obtain the return gas temperature and return gas temperature threshold of the first refrigeration module 11;

[0131] S102' If the return gas temperature of the first refrigeration module 11 is less than the return gas temperature threshold, the opening of the control valve A3 is gradually reduced by the second set step size until the return gas temperature of the first refrigeration module 11 is greater than or equal to the return gas temperature threshold.

[0132] If the return gas temperature of the first refrigeration module 11 is greater than or equal to the return gas temperature threshold, the control valve A3 will remain at its current opening.

[0133] Thus, as the opening of control valve A3 gradually decreases in the second set step size, the amount of refrigerant entering the first cooling flow path 31 in the first refrigeration circuit decreases, allowing the refrigerant entering the heat exchanger 33 from the first cooling flow path 31 to absorb heat more fully and evaporate into a gaseous state, thereby increasing the return gas superheat and return gas temperature of the first refrigeration module 11, so that the return gas superheat and return gas temperature of the first refrigeration module 11 are greater than or equal to the superheat threshold and return gas temperature threshold, respectively.

[0134] It should be noted that in the actual production process, when the control valve A3 is in the open state, step S100 or S100' is used to regulate the return gas superheat of the first refrigeration module 11, so that the return gas temperature of the first refrigeration module 11 is always kept at a state greater than or equal to the return gas temperature threshold, so as to avoid the abnormal alarm caused by the return gas temperature of the first refrigeration module 11 being too low.

[0135] It should also be noted that, as mentioned above, on the one hand, increasing the opening of control valve A3 can reduce the return gas temperature of the test refrigeration module 21, making the return gas temperature of the test refrigeration module 21 lower than the preset return gas temperature; on the other hand, decreasing the opening of control valve A3 can increase the return gas superheat and return gas temperature of the first refrigeration module 11, making the return gas superheat and return gas temperature of the first refrigeration module 11 greater than or equal to the superheat threshold and return gas temperature threshold, respectively.

[0136] When a conflict arises in the adjustment of control valve A3, for example, if the return gas temperature of the test refrigeration module 21 is higher than the preset return gas temperature, and the return gas superheat of the first refrigeration module 11 is lower than the superheat threshold, then the opening of control valve A3 is gradually increased, and the opening of hot gas bypass valve 119 is also gradually increased. In this way, increasing the opening of control valve A3 can lower the return gas temperature of the test refrigeration module 21, making it lower than the preset return gas temperature, but it will further reduce the return gas superheat of the first refrigeration module 11; simultaneously, increasing the opening of hot gas bypass valve 119 can increase the return gas superheat of the first refrigeration module 11, making its return gas superheat greater than or equal to the superheat threshold.

[0137] Please see again Figure 6 and Figure 11 In the embodiments of this application, the following steps are included after step S50:

[0138] S53. Obtain the actual temperatures PV and PV1 of the test cooling module 21 and the first cooling module 11, the set temperatures SV2 and SV3, and the preset temperature fluctuation range ±P.

[0139] S54. If the difference between the actual temperature PV of the test cooling module 21 and the set temperature SV2, or the difference between the actual temperature PV1 of the first cooling module 11 and the set temperature SV3, is outside the preset temperature fluctuation range ±P, then continue to obtain the actual temperatures PV and PV1 of the test cooling module 21 and the first cooling module 11, until the difference between the actual temperature PV of the test cooling module 21 and the set temperature SV2, and the difference between the actual temperature PV1 of the first cooling module 11 and the set temperature PV3, are both within the preset temperature fluctuation range ±P.

[0140] If the difference between the actual temperature PV of the test refrigeration module 21 and the set temperature SV2, and the difference between the actual temperature PV1 of the first refrigeration module 11 and the set temperature SV3, are both within the preset temperature fluctuation range ±P, then the return gas superheat of the test refrigeration module 21 and the first refrigeration module 11 is adjusted in a preset manner to meet their respective preset superheat ranges, and the process returns to step S30.

[0141] Since the temperature of the refrigeration system is calculated based on pressure, adjusting the opening of control valve A3 can reduce the return gas temperature. However, adjusting the opening of control valve A3 will inevitably cause pressure fluctuations in the refrigeration system. Therefore, it is necessary to wait for the pressure to stabilize, that is, for the actual temperature to remain stable within the preset temperature range, before the refrigeration system is in a stable state. Only then can subsequent temperature judgments be more accurate.

[0142] Specifically, the preset adjustment method includes: adjusting the set temperatures SV2 and SV3 corresponding to the test refrigeration module 21 and the first refrigeration module 11 step by step within the preset temperature range with a third set step; or, increasing the opening of the first return gas cooling valve A1 of the first refrigeration module 11 step by step with a fourth set step.

[0143] It should be noted that the preset temperature range, third setting step size, and preset superheat range of the test refrigeration module 21 may be the same as or different from the preset temperature range, third setting step size, and preset superheat range of the first refrigeration module 11. The temperature control requirements of the test system shall prevail, and no special limitation shall be made here.

[0144] Please see Figure 6 and Figure 14 Specifically, in this embodiment, the preset adjustment method includes the following steps:

[0145] S541. Obtain the return gas superheat and preset superheat range corresponding to the test refrigeration module 21 and the first refrigeration module 11 respectively.

[0146] S542. If the return gas superheat of the test refrigeration module 21 is outside the corresponding preset superheat range, or the return gas superheat of the first refrigeration module 11 is outside the corresponding preset superheat range, then the set temperatures SV2 and SV3 of the test refrigeration module 21 or the first refrigeration module 11 are adjusted step by step within the preset temperature range by a third set step; or the opening of the first return gas cooling valve A1 of the first refrigeration module 11 is increased step by step by a fourth set step until the return gas superheat of the test refrigeration module 21 and the first refrigeration module 11 are respectively within the corresponding preset superheat range.

[0147] S543. If the return gas superheat of the test refrigeration module 21 and the first refrigeration module 11 are respectively within the corresponding preset superheat range, this step ends and returns to the execution step S30.

[0148] Because the adjustment of relevant valves in the system changes the refrigerant flow, the refrigeration system is in a temporary unbalanced state. The test refrigeration module 21 and the first refrigeration module 11 adjust the set temperature step-by-step within the preset temperature range using a third set step size. This allows buffer time for each component in the system (compressor, evaporator, condenser, etc.), enabling them to adapt synchronously and smoothly approach the target superheat. It can be understood that the test refrigeration module 21 adjusts the set temperature step-by-step by gradually increasing or decreasing the opening of the test low-temperature stage throttling device 213 by a fixed step size. Similarly, the first refrigeration module 11 adjusts the set temperature step-by-step by gradually increasing or decreasing the opening of the first low-temperature stage throttling device 113 by a fixed step size.

[0149] Please see Figure 6 and Figure 15 Furthermore, the aforementioned preset superheat range includes a lower superheat limit h1 and an upper superheat limit h2. Step S542 specifically includes:

[0150] Sa, if the return gas superheat of the first refrigeration module 11 is less than or equal to the lower limit of superheat h1, then the set temperature VS2 of the test refrigeration module 21 remains unchanged, and the set temperature SV3 of the first refrigeration module 11 is gradually reduced by the third set step size until the return gas superheat of the first refrigeration module 11 is greater than the lower limit of superheat h1.

[0151] Sb. If the return gas superheat of the test refrigeration module 21 is less than or equal to the lower limit of superheat h1, the set temperature SV3 of the first refrigeration module 11 remains unchanged, and the set temperature SV2 of the test refrigeration module 21 is gradually reduced by the third set step size until the return gas superheat of the test refrigeration module 21 is greater than the lower limit of superheat h1.

[0152] Sc. If the return gas superheat of the test refrigeration module 21 is greater than or equal to the upper limit of superheat h2, the set temperature VS3 of the first refrigeration module 11 remains unchanged, and the set temperature SV2 of the test refrigeration module 21 is gradually increased by the third set step until the return gas superheat of the test refrigeration module 21 is less than the upper limit of superheat h2.

[0153] Sd. If the return gas superheat of the first refrigeration module 11 is greater than or equal to the upper limit of superheat h2, the set temperature SV2 of the test refrigeration module 21 remains unchanged, and the set temperature SV3 of the first refrigeration module 11 is gradually increased by the third set step size until the return gas superheat of the first refrigeration module 11 is less than the upper limit of superheat h2.

[0154] Furthermore, step Sd specifically includes:

[0155] If the return gas superheat of the first refrigeration module 11 is greater than or equal to the upper limit of superheat h2, the opening of the first return gas cooling valve A1 is increased step by step with the fifth set step until the return gas superheat of the first refrigeration module 11 is less than the upper limit of superheat h2.

[0156] The set temperature SV2 of the test refrigeration module 21 remains unchanged, while the set temperature SV3 of the first refrigeration module 11 is gradually increased in the third set step size until the return gas superheat of the first refrigeration module 11 is less than the upper limit value of superheat h2.

[0157] It should be noted that increasing the opening degree of the first return gas cooling valve A1 increases the flow rate of the first return gas cooling pipeline 114, thereby cooling the high-temperature refrigerant gas in the refrigerant input pipeline 13 of the first refrigeration module 11 and preventing the return gas temperature of the first refrigeration module 11 from becoming too high. Because the opening degree of the first return gas cooling valve A1 changes, the system is in an unbalanced state. Therefore, it is necessary to further adjust the set temperature SV3 of the first refrigeration module 11 step by step with a third set step size to ensure that the return gas superheat meets the standard.

[0158] Please see Figure 6 and Figure 16 In the embodiments of this application, in step S20, if the test set temperature SV of test station a2 is less than the preset temperature threshold T3, then control valve A3 is in a cut-off state. The following steps are also included after step S20:

[0159] S30a. When the control valve A3 is in the cut-off state, the first return gas cooling valve A1 and the test return gas cooling valve A2 are switched to the cut-off state, and the actual test temperature T2 of the test station a2, the first set temperature SV1 and the first actual temperature T1 of the first station a1 are obtained.

[0160] S40a. If the actual test temperature T2 of test station a2 is less than the test set temperature SV, or the first actual temperature T1 of the first station a1 is less than the first set temperature SV1, then continue to obtain the actual test temperature T2 of test station a2 and the first actual temperature T1 of the first station a1.

[0161] If the actual test temperature T2 of test station a2 reaches the test set temperature SV, and the first actual temperature T1 of the first station a1 reaches the first set temperature SV1, then the test heating duty cycle c2 and test duty cycle threshold c3 of the test heating module 400, and the first heating duty cycle c1 and first duty cycle threshold c4 of the first heating module 100 are obtained.

[0162] S50a. If the test heating duty cycle c2 of the test heating module 400 is less than the test duty cycle threshold c3, or the first heating duty cycle c1 of the first heating module 100 is less than the first duty cycle threshold c4, then the return gas superheat of the test cooling module 21 and the first cooling module 11 is made to meet their respective preset superheat ranges by the above-mentioned preset adjustment method, and then the process returns to step S30a.

[0163] If the test heating duty cycle c2 of the test heating module 400 is greater than or equal to the test duty cycle threshold c3, and the first heating duty cycle c1 of the first heating module 100 is greater than or equal to the first duty cycle threshold c4, then the test station a2 and the first station a1 enter the working state.

[0164] S60a. In the working state, test station a2 tests the component under test, and the first station a1 preheats or reheats the component under test.

[0165] Based on the same inventive concept, this application also provides a control device for implementing the temperature control method of the test system described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more control device embodiments provided below can be found in the limitations of the temperature control method for the test system described above, and will not be repeated here.

[0166] In one embodiment, the control device includes a data acquisition module, a judgment module, and a control module.

[0167] The acquisition module is used to acquire the test set temperature SV and preset temperature threshold T3 of test station a2; it is also used to acquire the test actual temperature T2 of test station a2, the first set temperature SV1 and the first actual temperature T1 of the first station a1; and it is also used to acquire the test heating duty cycle c2 and the test duty cycle threshold c3 of test heating module 400.

[0168] The judgment module is used to compare the acquired test set temperature SV of test station a2 with the preset temperature threshold T3, and determine the state of control valve A3 based on the comparison result; it is also used to compare the acquired test actual temperature T2 of test station a2 and the first actual temperature T1 of first station a1 with the test set temperature SV and the first set temperature SV1 respectively, and determine whether it is necessary to acquire the test heating duty cycle c2 and the test duty cycle threshold c3 of test heating module 400 based on the comparison result; it is also used to compare the acquired test heating duty cycle c2 and the test duty cycle threshold c3 of test heating module 400, and determine whether test station a2 and first station a1 have entered the working state based on the comparison result.

[0169] The control module is used to control the opening degree of the control valve A3.

[0170] Each module in the aforementioned refrigeration system control device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0171] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0172] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A temperature control method for a testing system, the testing system comprising a testing station (a2), a first station (a1), a testing temperature control unit (20) for respectively controlling the temperature of the testing station (a2) and the first station (a1), a first temperature control unit (10), the testing temperature control unit (20) comprising a testing cooling module (21) and a testing heating module (400), the first temperature control unit (10) comprising a first cooling module (11), the testing cooling module (21) and the first cooling module (11) A return gas cooling module (30) is provided between the two, the return gas cooling module (30) includes a first cooling flow path (31), a control valve (A3) disposed on the first cooling flow path (31) and a heat exchanger (33), the input end and the output end of the first cooling flow path (31) are respectively connected to the refrigerant output end and the refrigerant input end of the first refrigeration module (11), and the first cooling flow path (31) exchanges heat with the compressor return gas pipeline (23) of the test refrigeration module (21) through the heat exchanger (33); characterized in that, The temperature control method includes the following steps: Obtain the test set temperature (SV) and preset temperature threshold (T3) of the test station (a2), and determine whether the control valve (A3) is in the open state or the shut-off state based on the test set temperature (SV) and preset temperature threshold (T3) of the test station (a2). With the control valve (A3) in the open state, the actual test temperature (T2) of the test station (a2), the first set temperature (SV1) and the first actual temperature (T1) of the first station (a1) are obtained. If the actual test temperature (T2) reaches the set test temperature (SV), and the first actual temperature (T1) reaches the first set temperature (SV1), the test heating duty cycle (c2) and the test duty cycle threshold (c3) of the test heating module (400) are obtained. If the test heating duty cycle (c2) is less than the test duty cycle threshold (c3), adjust the control valve (A3) so that the test heating duty cycle (c2) is greater than or equal to the test duty cycle threshold (c3). If the test heating duty cycle (c2) is greater than or equal to the test duty cycle threshold (c3), the test station (a2) and the first station (a1) enter the working state; In the operating state, the test station (a2) tests the component under test, and the first station (a1) preheats or reheats the component under test.

2. The temperature control method for the testing system according to claim 1, characterized in that, The step of adjusting the control valve (A3) to make the test heating duty cycle (c2) greater than or equal to the test duty cycle threshold (c3) if the test heating duty cycle (c2) is less than the test duty cycle threshold (c3) includes: Obtain the actual return gas temperature of the test cooling module (21) and the preset return gas temperature corresponding to the test duty cycle threshold (c3); If the actual return gas temperature is greater than the preset return gas temperature, the opening of the control valve (A3) is gradually increased by a first set step size until the actual return gas temperature is less than the preset return gas temperature.

3. The temperature control method for the testing system according to claim 2, characterized in that, Obtain the return gas superheat and superheat threshold of the first refrigeration module (11). When the return gas superheat of the first refrigeration module (11) is less than the superheat threshold, the opening of the control valve (A3) is gradually reduced by a second set step size until the return gas superheat of the first refrigeration module (11) is greater than or equal to the superheat threshold. Alternatively, the return gas temperature and return gas temperature threshold of the first refrigeration module (11) can be obtained. When the return gas temperature of the first refrigeration module (11) is less than the return gas temperature threshold, the opening of the control valve (A3) is gradually reduced by a second set step size until the return gas temperature of the first refrigeration module (11) is greater than or equal to the return gas temperature threshold.

4. The temperature control method for the testing system according to claim 1, characterized in that, After the step of determining whether the control valve (A3) is in the open or closed state based on the test setting temperature of the test station (a2) and the preset temperature threshold (T3), the method further includes: Obtain the test heating duty cycle (c2) and test duty cycle threshold (c3) of the test heating module (400). If the test heating duty cycle (c2) is less than the test duty cycle threshold (c3), adjust the return gas superheat of the test cooling module (21) and the first cooling module (11) in a preset adjustment mode to meet their respective preset superheat ranges. The preset adjustment method includes: adjusting the set temperature of the test refrigeration module (21) and the first refrigeration module (11) step by step within the preset temperature range with a third set step; or increasing the opening of the first return gas cooling valve (A1) of the first refrigeration module (11) step by step with a fourth set step.

5. The temperature control method for the testing system according to claim 4, characterized in that, When the control valve (A3) is in the open state, before the step of adjusting the return gas superheat of the test refrigeration module (21) and the first refrigeration module (11) to meet their respective preset superheat ranges using a preset adjustment method, the method further includes: Obtain the actual return gas temperature of the test cooling module (21) and the preset return gas temperature corresponding to the test duty cycle threshold (c3); If the actual return gas temperature is greater than the preset return gas temperature, the opening of the control valve (A3) is gradually increased by a first set step size until the actual return gas temperature is less than the preset return gas temperature.

6. The temperature control method for the testing system according to claim 5, characterized in that, The step of gradually increasing the opening of the control valve (A3) in a first set step until the actual return gas temperature is less than the preset return gas temperature, further includes: Obtain the actual temperature, set temperature, and preset temperature fluctuation range of the test refrigeration module (21) and the first refrigeration module (11); If the difference between the actual temperature and the set temperature of the test refrigeration module (21) and the difference between the actual temperature and the set temperature of the first refrigeration module (11) are both within the preset temperature fluctuation range, the return gas superheat of the test refrigeration module (21) and the first refrigeration module (11) shall be adjusted in the preset manner to meet their respective preset superheat ranges.

7. The temperature control method for the testing system according to claim 4, characterized in that, The first temperature control unit (10) further includes a first heating module (100). When the control valve (A3) is in the cut-off state, before the step of adjusting the return gas superheat of the test refrigeration module (21) and the first refrigeration module (11) to meet their respective preset superheat ranges by a preset adjustment method, the following steps are also included: Obtain the first heating duty cycle (c1) and the first duty cycle threshold (c4) of the first heating module (100). If the first heating duty cycle (c1) is less than the first duty cycle threshold (c4), or the test heating duty cycle (c2) is less than the test duty cycle threshold (c3), the return gas superheat of the test refrigeration module (21) and the first refrigeration module (11) are adjusted in the preset manner to meet their respective preset superheat ranges.

8. The temperature control method for the testing system according to claim 4, characterized in that, The specific steps for adjusting the return gas superheat of the test refrigeration module (21) and the first refrigeration module (11) to meet their respective preset superheat ranges using a preset adjustment method include: Obtain the return gas superheat and preset superheat range corresponding to the test refrigeration module (21) and the first refrigeration module (11); If the return gas superheat of the test refrigeration module (21) and the first refrigeration module (11) are respectively within the corresponding preset superheat range, this step ends; Otherwise, within the preset temperature range, the set temperature corresponding to the test refrigeration module (21) and the first refrigeration module (11) is adjusted step by step with the third set step; or the opening of the first return gas cooling valve (A1) of the first refrigeration module (11) is increased step by step with the fourth set step.

9. The temperature control method for the testing system according to claim 8, characterized in that, The preset superheat range includes a lower limit value (h1) of superheat. If the return gas superheat of the first refrigeration module (11) is less than or equal to the lower limit value (h1), the set temperature of the test refrigeration module (21) remains unchanged, and the set temperature of the first refrigeration module (11) is gradually reduced by the third set step size until the return gas superheat of the first refrigeration module (11) is greater than the lower limit value (h1). If the return gas superheat of the test refrigeration module (21) is less than or equal to the lower limit of superheat (h1), the set temperature of the first refrigeration module (11) remains unchanged, and the set temperature of the test refrigeration module (21) is gradually reduced by the third set step size until the return gas superheat of the test refrigeration module (21) is greater than the lower limit of superheat (h1).

10. The temperature control method for the testing system according to claim 8, characterized in that, The preset superheat range includes an upper limit value (h2) of superheat. If the return gas superheat of the test refrigeration module (21) is greater than or equal to the upper limit value (h2), the set temperature of the first refrigeration module (11) remains unchanged, and the set temperature of the test refrigeration module (21) is gradually increased by the third set step size until the return gas superheat of the test refrigeration module (21) is less than the upper limit value (h2). If the return gas superheat of the first refrigeration module (11) is greater than or equal to the superheat upper limit value (h2), the set temperature of the test refrigeration module (21) remains unchanged, and the set temperature of the first refrigeration module (11) is gradually increased by the third set step size until the return gas superheat of the first refrigeration module (11) is less than the superheat upper limit value (h2).

11. The temperature control method for the testing system according to claim 10, characterized in that, Before the step of gradually increasing the set temperature of the first cooling module (11) with the third set step size, the following steps are also included: If the return gas superheat of the first refrigeration module (11) is greater than or equal to the superheat upper limit value (h2), the set temperature of the test refrigeration module (21) remains unchanged, and the opening of the first return gas cooling valve (A1) is increased step by step with the fifth set step until the return gas superheat of the first refrigeration module (11) is less than the superheat upper limit value (h2).

12. A control device, characterized in that, include: The data acquisition module is used to acquire the test set temperature (SV) and preset temperature threshold (T3) of the test station (a2); it is also used to acquire the test actual temperature (T2) of the test station (a2), the first set temperature (SV1) and the first actual temperature (T1) of the first station (a1); it is also used to acquire the test heating duty cycle (c2) and the test duty cycle threshold (c3) of the test heating module (400). The judgment module is used to compare the acquired test set temperature (SV) and preset temperature threshold (T3) of the test station (a2) and determine the state of the control valve (A3) based on the comparison result; it is also used to compare the acquired test actual temperature (T2) of the test station (a2) and the first actual temperature (T1) of the first station (a1) with the test set temperature (SV) and the first set temperature (SV1) respectively, and determine whether it is necessary to acquire the test heating duty cycle (c2) and test duty cycle threshold (c3) of the test heating module (400) based on the comparison result; it is also used to compare the acquired test heating duty cycle (c2) and test duty cycle threshold (c3) of the test heating module (400) and determine whether the test station (a2) and the first station (a1) have entered the working state based on the comparison result; and The control module is used to control the opening degree of the control valve (A3).

13. A testing system, characterized in that, The device includes a test temperature control unit (20), a first temperature control unit (10), and a test unit. The test temperature control unit (20) and the first temperature control unit (10) are used to apply the temperature control method as described in any one of claims 1 to 11 to control the temperature of the test station (a2) and the first station (a1), respectively. The test unit is used to test the component under test located at the test station (a2).

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