Assembling jig for silica gel key conductive particles

Abstract

The embodiment of the invention discloses an assembly jig for silica gel key conductive particles. According to one specific implementation mode, the device comprises an upper movable pressing plate and a material bearing bottom plate which are oppositely arranged in parallel; the upper movable pressing plate is of a closed interlayer structure defined by double layers of plate bodies, and a hollow needle tube array is installed on the lower end face of the upper movable pressing plate and can move along with the upper movable pressing plate. The upper end face of the upper movable pressing plate is provided with a negative pressure connector, and the hollow needle tube array is communicated with the negative pressure connector. The material bearing bottom plate is provided with a positioning hole array corresponding to the hollow needle tube array, conductive particles can be embedded into positioning holes in the positioning hole array, and the hollow needle tube array can penetrate through the positioning hole array; the upper movable pressing plate and the material bearing bottom plate are separated through a guide supporting column embedded with an elastic assembly, and the upper movable pressing plate and the material bearing bottom plate can be extruded by external force to be attached to each other along the guide supporting column. According to the embodiment, the filling efficiency of the conductive particles can be improved.

Description

Technical Field

[0001] The embodiments disclosed herein relate to the field of silicone keypad manufacturing equipment technology, and more specifically to assembly fixtures for conductive particles in silicone keypads. Background Technology

[0002] In the silicone keypad manufacturing industry, the extraction and filling of conductive particles is a crucial step in the assembly process, directly affecting the conductivity and reliability of the silicone keypad. Traditional assembly processes often involve manually using a negative pressure suction pen to extract conductive particles and individually fill them into the designated positions on the silicone keypad.

[0003] However, in practice, it has been found that when the above-mentioned method is used to fill conductive particles, the operators fill the conductive particles one by one, resulting in low production efficiency, which is difficult to meet the needs of modern large-scale production. At the same time, it is also easily affected by the operator's experience and condition. The operator's visual fatigue can easily lead to positioning deviation, causing the conductive particles to be offset or tilted, resulting in an increase in product defect rate and a technical problem of low stability of the conductivity of silicone buttons.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background of the inventive concept, and therefore may contain information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The summary portion of this disclosure is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description portion. This summary portion is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0006] Some embodiments of this disclosure provide assembly fixtures for conductive particles in silicone keypads to address one or more of the technical problems mentioned in the background section above.

[0007] Some embodiments of this disclosure provide an assembly fixture for conductive particles for silicone keypads. The device includes: an upper moving pressure plate and a base plate arranged relatively parallel to each other; the upper moving pressure plate is a closed sandwich structure formed by two layers of plates, and a hollow needle array is installed on the lower end face of the upper moving pressure plate, which can move with the upper moving pressure plate; a negative pressure interface is installed on the upper end face of the upper moving pressure plate, and the hollow needle array communicates with the negative pressure interface; the base plate is provided with a positioning hole array corresponding to the hollow needle array, each positioning hole in the positioning hole array can be embedded with conductive particles, and the hollow needle array can penetrate the positioning hole array; the upper moving pressure plate and the base plate are separated by a guide support column with an embedded elastic component, and the upper moving pressure plate and the base plate can be pressed together along the guide support column by external force; the two ends of the elastic component abut against the lower end face of the upper moving pressure plate and the upper end face of the base plate, respectively.

[0008] Optionally, the upper end face of the aforementioned upper dynamic pressure body is also provided with a hand-held component.

[0009] Optionally, a sealing groove is provided on the outer periphery of the aforementioned negative pressure interface, and an elastic sealing gasket is embedded in the sealing groove.

[0010] Optionally, the number of the above-mentioned guide support columns is four, and each of the above-mentioned guide support columns is located at the four corners of the above-mentioned upper moving pressure plate and the above-mentioned material bearing bottom plate.

[0011] Optionally, the inner walls of the aforementioned positioning hole array are all provided with a wear-resistant coating.

[0012] Optionally, the aforementioned handheld component is fitted with a non-slip rubber sleeve.

[0013] Optionally, one end of the guide support column is fixed to the material-bearing base plate, and the other end is threaded; the other end of the guide support column is detachably connected to the upper moving pressure plate via threads.

[0014] The above-described embodiments of this disclosure have the following beneficial effects: The assembly fixtures for conductive particles in silicone keypads according to some embodiments of this disclosure can improve the filling efficiency and accuracy of the conductive particles, thereby improving the production efficiency and the stability of the conductivity of silicone keypads. Specifically, the reasons for the low production efficiency and low conductivity stability of silicone keypads are: operators fill the conductive particles one by one, resulting in low production efficiency, which is difficult to meet the needs of modern large-scale production. Furthermore, it is easily affected by the operator's experience and condition; operator visual fatigue can lead to positioning deviations, causing the conductive particles to shift or tilt, resulting in an increased product defect rate and thus lower conductivity stability of the silicone keypads. Based on this, some embodiments of this disclosure provide an assembly fixture for conductive particles of silicone keypads. The device includes: an upper moving pressure plate and a base plate arranged relatively parallel to each other; the upper moving pressure plate is a closed sandwich structure formed by two layers of plates, and a hollow needle array is installed on the lower end face of the upper moving pressure plate, which can move with the upper moving pressure plate; a negative pressure interface is installed on the upper end face of the upper moving pressure plate, and the hollow needle array is connected to the negative pressure interface; the base plate is provided with a positioning hole array corresponding to the hollow needle array, each positioning hole in the positioning hole array can be embedded with conductive particles, and the hollow needle array can penetrate the positioning hole array; the upper moving pressure plate and the base plate are separated by a guide support column with an embedded elastic component, and the upper moving pressure plate and the base plate can be pressed together along the guide support column by external force; the two ends of the elastic component abut against the lower end face of the upper moving pressure plate and the upper end face of the base plate, respectively. By setting a positioning hole array that matches the size of the conductive particles, conductive particles can be loaded in batches, improving the loading efficiency. Through the coordinated operation of the hollow needle array and the negative pressure interface, the conductive particles can be absorbed in batches, further improving the production efficiency of silicone buttons. With the upper moving pressure plate and the material receiving base plate that can fit together, when the two are pressed together, the hollow needle array can push each conductive particle adsorbed in the positioning hole array into the corresponding mold, which can improve the loading accuracy of conductive particles, reduce the product defect rate, and thus improve the stability of the conductivity of silicone buttons. Attached Figure Description

[0015] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and elements are not necessarily drawn to scale.

[0016] Figure 1 This is a schematic diagram of the structure of an assembly fixture for conductive particles of silicone keypads according to some embodiments of this disclosure; Figure 2 This is a schematic diagram of the material-bearing base plate of an assembly fixture for conductive particles of silicone key buttons according to some embodiments of this disclosure. Figure 3 This is an internal test diagram of an assembly fixture for conductive particles for silicone key buttons, according to some embodiments of this disclosure. Detailed Implementation

[0017] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0018] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0019] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0020] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0021] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.

[0022] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Figure 1 This is a schematic diagram of the structure of an assembly fixture for conductive particles of silicone keypads according to some embodiments of this disclosure. Figure 1 It includes an upper moving pressure plate 1, a material supporting base plate 2, a hollow needle tube array 3, a positioning hole array 4, a negative pressure interface 5, and a handheld component 6.

[0024] In some embodiments, the assembly fixture for conductive particles in silicone buttons may include: an upper moving pressure plate 1 and a base plate 2 arranged relatively parallel to each other. The upper moving pressure plate 1 is a closed sandwich structure formed by two layers of square plates, with a hollow cavity between the two layers. The base plate 2 may be a plate-shaped structure with the same dimensions as the upper moving pressure plate 1. The upper moving pressure plate 1 may be located above the base plate 2. A hollow needle array 3 may be installed on the lower end face of the upper moving pressure plate 1. Each hollow needle in the hollow needle array 3 may be a cylindrical needle embedded in the lower end face of the upper moving pressure plate 1 and communicating with the hollow cavity, capable of moving with the upper moving pressure plate 1. The lower end face of the upper moving pressure plate 1 may be the side facing the base plate 2. A negative pressure port 5 is installed on the upper end face of the aforementioned upper moving pressure plate 1. The negative pressure port 5 can be connected to the hollow needle array 3 and a negative pressure source. The negative pressure source can be a vacuum pump or a negative pressure generator, which can provide stable negative pressure to the hollow needle array 3 through the negative pressure port 5. A valve can be installed between the negative pressure port 5 and the negative pressure source to control the on / off state of the negative pressure.

[0025] In some embodiments, the aforementioned base plate 2 may be provided with a positioning hole array 4 corresponding to the aforementioned hollow needle tube array 3. Specifically, refer to... Figure 3 , Figure 3 This is an internal test diagram of an assembly fixture for conductive particles for silicone key buttons, according to some embodiments of this disclosure. The aforementioned positioning hole array 4 can be a hole structure penetrating the aforementioned material-bearing base plate 2. The size of each positioning hole in the aforementioned positioning hole array 4 can be matched with the size of the conductive particle, enabling one of the aforementioned conductive particles to be embedded therein, realizing the rapid batch pickup of conductive particles and improving the pickup efficiency of conductive particles.

[0026] In some embodiments, the upper movable pressure plate 1 and the material-bearing base plate 2 can be separated by a guide support column embedded with an elastic component. The elastic component can be a compression spring, and its two ends can respectively abut against the lower end face of the upper movable pressure plate 1 and the upper end face of the material-bearing base plate 2, providing continuous elastic support for the upper movable pressure plate 1 and the material-bearing base plate 2. The upper movable pressure plate 1 and the material-bearing base plate 2 can be pressed together along the guide support column by external force. The guide support column can be a cylindrical metal component, providing guidance for the relative movement of the upper movable pressure plate 1 and the material-bearing base plate 2, preventing the upper movable pressure plate 1 from shifting during movement. When the upper moving pressure plate 1 is in contact with the material support base plate 2, the hollow needle array 3 can penetrate the positioning hole array 4. By closing the negative pressure through the valve, the conductive particles absorbed by the positioning hole array 4 can be pushed out by the hollow needle array 3 into the mold for making silicone buttons, thereby realizing the batch filling and filling accuracy of conductive particles, improving the production efficiency of silicone buttons, and improving the stability of the conductivity of silicone buttons.

[0027] Optionally, the upper end face of the above-mentioned upper dynamic pressure body may also be provided with a hand-held component 6. The hand-held component 6 may be two arc-shaped handles symmetrically distributed on the upper end face of the upper dynamic pressure plate 1, which can facilitate the operator to move the assembly fixture for the conductive particles of silicone buttons.

[0028] Optionally, a sealing groove may be provided on the outer periphery of the aforementioned negative pressure interface 5, and an elastic sealing gasket may be embedded in the sealing groove to achieve a sealed connection between the valve and the negative pressure interface 5, ensuring an effective seal when connected to the negative pressure pipeline and preventing negative pressure leakage from affecting the adsorption effect. The aforementioned elastic sealing gasket may be made of fluororubber, which has aging resistance and negative pressure resistance properties.

[0029] Optionally, the number of the above-mentioned guide support columns can be four. Each of the above-mentioned guide support columns can be located at the four corners of the above-mentioned upper moving pressure plate 1 and the above-mentioned material bearing base plate 2, forming a rectangular distribution to maintain the parallelism of the above-mentioned upper moving pressure plate 1 and the above-mentioned material bearing base plate 2 during relative movement. This can reduce the risk of misalignment between the above-mentioned hollow needle array 3 and the above-mentioned positioning hole array 4 due to uneven force, and can ensure the coaxiality of the above-mentioned hollow needle array 3 and the above-mentioned positioning hole array 4, thereby improving the filling accuracy of conductive particles.

[0030] Optionally, the inner wall of the aforementioned positioning hole array 4 may be provided with a wear-resistant coating, which can reduce frictional wear between the hollow needle array 3 and the inner wall of the positioning hole array 4, extend the service life of the equipment, and ensure the guiding accuracy of the hollow needle array 3 during repeated penetration of the positioning hole array 4, reducing positioning deviations caused by inner wall wear, thereby further improving the filling accuracy of conductive particles. For example, the wear-resistant coating can be a titanium nitride coating, which has excellent wear resistance and chemical stability, and can effectively reduce frictional loss between the hollow needle and the inner wall of the positioning hole during frequent relative movement.

[0031] Optionally, the aforementioned handheld component 6 may be fitted with an anti-slip rubber sleeve, which can effectively increase the friction between the hand and the handheld component 6, preventing slippage caused by hand sweat or oil during operation and improving the grip stability during jig handling. At the same time, the elastic properties of the rubber material can cushion the grip pressure, reduce hand fatigue caused by prolonged operation, and improve the operator's comfort.

[0032] Optionally, one end of the guide support column can be fixed to the pre-set mounting hole in the material-bearing base plate 2 via an interference fit, and the other end can be threaded. The other end of the guide support column can be detachably connected to the upper moving pressure plate 1 via the thread. Specifically, the other end of the guide support column can pass through the mounting hole of the upper moving pressure plate 1 and achieve a detachable connection between the guide support column and the upper moving pressure plate 1 through a limiting structure. At the same time, the limiting structure can also prevent the upper moving pressure plate 1 and the material-bearing base plate 2 from being bounced apart by the elastic component. The limiting structure can be a nut that matches the thread, and the axial limiting of the upper moving pressure plate 1 can be achieved by tightening the nut. By adjusting the tightening degree of the nut, the initial compression amount of the elastic component can be controlled, thereby setting the initial distance between the upper moving pressure plate 1 and the material-bearing base plate 2, so that the hollow needle array 3 can be embedded in the positioning hole array 4 in the non-working state but will not exceed the depth of the positioning hole array 4.

[0033] In addressing the aforementioned technical problems through the adoption of technical solutions, the application scenario of this technical solution—multi-specification conductive particle loading—often presents the following technical challenges: the positioning holes of existing assembly fixtures are of fixed size, making it difficult to flexibly adapt to conductive particles of different specifications and diameters, resulting in the need for multiple assembly fixtures and higher production costs. To address the following requirements for this application scenario: flexible switching to accommodate conductive particles of different diameters and reduced production costs, we have decided to adopt the following solution: Figure 2 This is a schematic diagram of the base plate of an assembly fixture for conductive particles of silicone key buttons according to some embodiments of this disclosure. Figure 2 Includes replaceable bushing 7.

[0034] Optionally, the aforementioned base plate 2 may have multiple bushing mounting holes, which may be through-hole structures. The number of bushing mounting holes may be the same as the number of mounting hole arrays. A limiting pin is provided within each bushing mounting hole, and the limiting pin may be a protrusion arranged axially along the bushing mounting hole. A replaceable bushing 7 may be embedded within the bushing mounting hole. The replaceable bushing 7 may be a tubular structure adapted to the bushing mounting hole. The outer circumferential surface of the replaceable bushing 7 is provided with a limiting groove adapted to the limiting pin, allowing the limiting pin to be embedded in the limiting groove for rapid positioning of the replaceable bushing 7. Each positioning hole in the positioning hole array 4 may be respectively located within the corresponding replaceable bushing 7, and the positioning hole and the replaceable bushing 7 may be coaxially arranged. After being embedded in the bushing mounting hole, the replaceable bushing 7 may be flush with the lower end face of the base plate 2, facilitating the embedding of conductive particles into the positioning hole. The aforementioned positioning hole may include a guide section adapted to the outer diameter of the hollow needle tube and a receiving section adapted to the size of the conductive particles. The depth of the receiving section may be adapted to the thickness of the conductive particles, allowing only one conductive particle to be embedded in the receiving section, thus improving the filling accuracy of the conductive particles. The replaceable bushing 7 has a radially outwardly extending annular positioning flange at one end corresponding to the receiving section. The end of the bushing mounting hole may have a groove for embedding the annular positioning flange, so that the replaceable bushing 7 is flush with the end face of the material-bearing base plate 2 after being embedded in the bushing mounting hole, which is beneficial for the conductive particles to be embedded in the positioning hole. The annular positioning flange may be embedded with a first magnetic attractor, which may be a magnetically conductive material, for example, an iron sheet. The material-bearing base plate 2 may have a second magnetic attractor at a position corresponding to the annular positioning flange, which may be a permanent magnet, for example, with attractive force, to achieve rapid fixation of the annular positioning flange and the material-bearing base plate 2. The aforementioned annular positioning flange can be magnetically connected and fixed in the bushing mounting hole by the first magnetic suction component and the second magnetic suction component. When it is necessary to replace conductive particles of different specifications, the operator only needs to apply an external force to overcome the magnetic attraction to remove the replaceable bushing 7 from the bushing mounting hole. After replacing it with a new bushing of the corresponding positioning hole size, it can be quickly reset and fixed by means of magnetic attraction.

[0035] The above-described technical solution, as an inventive point of this disclosure, solves the technical problem that "the positioning holes of the original assembly fixtures are of fixed size, making it difficult to flexibly adapt to conductive particles of different specifications and diameters, resulting in the need to prepare multiple assembly fixtures and thus higher production costs." The factors leading to higher production costs are often as follows: the positioning holes of the original assembly fixtures are of fixed size, making it difficult to flexibly adapt to conductive particles of different specifications and diameters, resulting in the need to prepare multiple assembly fixtures and thus higher production costs. Solving these factors can reduce production costs. To achieve this effect, the assembly fixture for conductive particles for silicone buttons disclosed herein uses bushing mounting holes with limiting pins on the base plate of the material receiving plate, and the limiting groove of the replaceable bushing achieves precise positioning. Then, the first magnetic suction element on the annular positioning flange is magnetically attracted and fixed to the second magnetic suction element on the base plate of the material receiving plate, thereby improving the installation stability of the bushing. The positioning hole is set as a guide section and a receiving section, which can be adapted to hollow needle tubes and conductive particles. At the same time, the replaceable bushing can be adapted to conductive particles of different specifications without modifying the main structure of the device, which can achieve convenient and efficient replacement and reduce the increase in production costs caused by using multiple assembly fixtures.

[0036] In addressing the aforementioned technical problems using technical solutions, the application scenario of this solution—a high-frequency, multi-variety production line with small batches and frequent model changes—often presents the following challenges: the production line needs to switch between various specifications of conductive particles daily, requiring operators to frequently replace the corresponding replaceable bushings. However, the rigid fit between mechanical limit pins and limit grooves causes the limit pins to scrape against the edge of the limit groove during replacement, leading to wear over time and making the replaceable bushings prone to falling off. Furthermore, the lack of a force-applying structure after the replaceable bushing is embedded in the bushing mounting hole results in low disassembly and assembly efficiency. Considering the following requirements for this application scenario—reduced wear, improved connection stability, and increased disassembly and assembly efficiency—we have decided to adopt the following solution: Optionally, the aforementioned limiting pin may include a pin body and a compression spring. The pin body may have a cylindrical structure with one end being hollow, and a portion of the compression spring can be embedded in the hollow structure of the pin body. The hollow end of the pin body can be embedded in the wall of the bushing mounting hole and connected to the wall of the bushing mounting hole via the compression spring. The compression spring allows the pin body to maintain a pop-out tendency within the wall of the bushing mounting hole and partially protrude from the inner wall of the bushing mounting hole. The other end of the pin body may be a ball head structure, which may be polished to reduce wear between the pin body and the limiting groove. The limiting groove may include a guide groove and a fixing groove. The guide groove may be a groove arranged axially along the replaceable bushing 7, and the fixing groove may be a groove adapted to the ball head structure of the pin body. The guide groove and the fixing groove may be smoothly connected to reduce wear between the pin body and the guide groove and the fixing groove. The depth of the aforementioned fixing groove can be greater than the depth of the aforementioned guide groove, and the position of the aforementioned fixing groove can correspond to the position of the aforementioned pin. When the replaceable bushing 7 is axially inserted into the bushing mounting hole, the ball head structure of the pin first contacts the guide groove. Under the action of axial thrust, the guide groove compresses the pin through the compression spring, causing the pin to retract and slide along the inner wall of the guide groove. When the replaceable bushing 7 is fully inserted into the bushing mounting hole, the ball head structure of the pin can be inserted into the fixing groove. The replaceable bushing 7 can be stably fixed through the dual action of magnetic attraction and mechanical limiting. The end of the aforementioned bushing mounting hole can be provided with a limiting baffle. The limiting baffle can be a baffle structure adapted to the shape of the aforementioned limiting groove, which can limit the replacement bushing 7 when it is inserted into the aforementioned bushing mounting hole. The limiting baffle can be located on the same straight line as the aforementioned pin, which facilitates the operator to quickly replace the replaceable bushing 7. The aforementioned annular positioning flange may be provided with disassembly and assembly holes. The disassembly and assembly holes may be through-hole structures that are evenly distributed along the circumference of the aforementioned annular positioning flange. The number of the disassembly and assembly holes may be two and they may be centrally symmetrically distributed. The replaceable bushing 7 can be quickly disassembled and assembled by inserting a special tool into the disassembly and assembly holes, which can improve the replacement efficiency of the replaceable bushing 7.

[0037] The above-described technical solution, as an inventive point of this disclosure, solves the technical problem of: "The production line needs to switch between multiple specifications of conductive particles daily, and operators need to frequently replace the corresponding replaceable bushings. However, due to the rigid fit between the mechanical limit pin and the limit groove, the limit pin will scrape against the edge of the limit groove during replacement, causing wear after long-term use, resulting in the replaceable bushing easily falling off. Simultaneously, the lack of a force-applying structure after the replaceable bushing is embedded in the bushing mounting hole leads to low disassembly and assembly efficiency." The factors leading to the replaceable bushing easily falling off and low disassembly and assembly efficiency are often as follows: The production line needs to switch between multiple specifications of conductive particles daily, and operators need to frequently replace the corresponding replaceable bushings. However, due to the rigid fit between the mechanical limit pin and the limit groove, the limit pin will scrape against the edge of the limit groove during replacement, causing wear after long-term use, resulting in the replaceable bushing easily falling off. Simultaneously, the lack of a force-applying structure after the replaceable bushing is embedded in the bushing mounting hole leads to low disassembly and assembly efficiency. Solving these factors can improve the stability of the replaceable bushing connection and the efficiency of disassembly and assembly. To achieve this effect, the assembly fixture for conductive particles in silicone keypads disclosed herein designs the limiting pin as a ball-head structure with a compression spring. Combined with a polished contact surface, the pin can elastically retract via the compression spring during the insertion of the replaceable bushing, reducing wear between the limiting pin and the limiting groove. The limiting groove features a smooth transition between the guide groove and the fixing groove, allowing the pin to slide along the guide groove in a progressively limiting manner. The deepened structure of the fixing groove, combined with the ball-head structure, creates a mechanical self-locking effect. Combined with the magnetic connection between the annular positioning flange and the base plate, this effectively prevents the bushing from loosening and falling off due to wear after long-term use. Simultaneously, the symmetrical disassembly holes on the annular positioning flange can accommodate the application points of specialized extraction tools. Operators can apply axial force by inserting the tool into the holes, overcoming the combined force of the magnetic attraction and mechanical limiting to achieve rapid disassembly, thus improving the replacement efficiency of the replaceable bushing.

[0038] In addressing the aforementioned technical problems through the adoption of technical solutions, the intended application scenario of this technical solution—batch filling of easily adhering conductive particles (such as carbon particles with static electricity or particles with adhesive coatings)—often presents the following technical issues: Due to surface static electricity or adhesive coatings, conductive particles easily adhere to each other or are adsorbed onto the inner wall of the hollow syringe, resulting in multiple conductive particles overlapping during a single adsorption process. This necessitates manual separation of the conductive particles, leading to low filling efficiency. Furthermore, the adhered conductive particles attach to the inner wall of the positioning holes, requiring operators to repeatedly press or tap the upper pressure plate to allow the conductive particles to enter the corresponding mold, causing hand fatigue and further reducing filling efficiency. To address the following requirements for this application scenario: reducing conductive particle adhesion, improving filling efficiency, and reducing operator fatigue, we have decided to adopt the following solution: Optionally, the aforementioned handheld component 6 may include a handle and a connecting part. The handle may be a ring-shaped structure for easy gripping by the operator, and the connecting part may be a vertical connecting rod. The handle and the connecting part may be integrally formed, which can increase the structural strength of the handheld component 6. The handle may be fixedly connected to the upper end face of the upper moving pressure plate 1 through the connecting part. The inner ring wall of the ring structure may be provided with a wavy curved surface. The crests and troughs of the wavy curved surface may be arranged alternately along the circumference of the ring structure. When the operator grips the handheld component 6, the fingers naturally embed into the trough positions, significantly reducing the local pressure on the fingers and effectively relieving finger pain and fatigue caused by prolonged work. At the same time, the concave and convex structure formed by the crests and troughs of the wavy curved surface can form a mechanical interlock between the fingers and the handheld component 6, reducing the possibility of axial sliding or circumferential rotation during gripping even when the hands are sweaty or oily, thus improving operational safety. The aforementioned handle may also feature fingertip recesses, which can be arc-shaped grooves adapted to the contours of the fingertips. These recesses allow the operator to accurately perceive the center of force, improving filling efficiency. When the operator grips the handle, the fingertips naturally embed into the corresponding recesses, forming a multi-point support structure that further distributes hand pressure and reduces hand fatigue. A vibration motor, which can be an eccentric block type, can be embedded inside the upper moving pressure plate 1. This motor can be installed near the hollow needle array 3, transmitting vibration energy to each hollow needle and then to the positioning holes. High-frequency vibration can separate adhered particles, causing conductive particles to detach from the positioning holes. This eliminates the need for repeated pressing or tapping of the upper moving pressure plate 1, reducing operator hand fatigue and improving filling efficiency. A motor switch can be located on the side of the handle, communicating with the vibration motor and controlling its start and stop. To prevent excessive vibration energy from being transmitted to the gripping part and causing discomfort during operation, an elastic buffer pad can be provided between the connecting part and the upper moving pressure plate 1. This elastic buffer pad can be a flexible pad made of silicone material. The upper end face of the elastic buffer pad can abut against the lower end face of the connecting part, and the lower end face of the elastic buffer pad can abut against the upper end face of the upper moving pressure plate 1, thereby reducing the efficiency of vibration energy transmission to the gripping part. Both the hollow needle array 3 and the material-bearing base plate 2 can be coated with an antistatic coating. This antistatic coating can be a graphene composite coating, which has excellent antistatic properties and can reduce the electrostatic adsorption force between conductive particles and the contact surface, reducing the risk of conductive particles sticking together or adhering to the inner wall of the positioning hole due to static electricity.

[0039] The above-described technical solution, as an inventive point of this disclosure, solves the technical problem of "conductive particles easily adhering to each other or adsorbing onto the inner wall of the hollow needle tube due to surface electrostatics or adhesive coatings, resulting in multiple conductive particles overlapping during a single adsorption process. This necessitates manual separation of the conductive particles, leading to low filling efficiency. Furthermore, the adhered conductive particles attach to the inner wall of the positioning hole, requiring repeated pressing or tapping of the upper pressure plate by the operator to allow the conductive particles to enter the corresponding mold, causing operator fatigue and further reducing filling efficiency." The factors leading to low filling efficiency are often as follows: conductive particles easily adhering to each other or adsorbing onto the inner wall of the hollow needle tube due to surface electrostatics or adhesive coatings, resulting in multiple conductive particles overlapping during a single adsorption process. This requires manual separation of the conductive particles, leading to low filling efficiency. Additionally, the adhered conductive particles attach to the inner wall of the positioning hole, requiring repeated pressing or tapping of the upper pressure plate by the operator to allow the conductive particles to enter the corresponding mold, causing operator fatigue and further reducing filling efficiency. Solving the above-mentioned factors can improve the filling efficiency. To achieve this, the assembly fixture for conductive particles for silicone buttons disclosed herein uses a graphene composite antistatic coating on the surface of the hollow needle array and the base plate to reduce the adhesion of conductive particles caused by static electricity and the adsorption force on the contact surface. A vibration motor causes the particles attached to the inner wall of the positioning hole to fall off. The wavy curved surface of the handle and the concave design of the fingertips form an ergonomic multi-point support structure, which disperses hand pressure and improves grip stability, reducing fatigue during long-term operation. The elastic buffer pad between the connecting part and the upper moving pressure plate effectively blocks the transmission of vibration energy to the grip, reducing the discomfort of operation. This reduces the need for manual intervention to separate the adhered particles and eliminates the need to repeatedly press and tap the upper moving pressure plate, significantly improving the filling efficiency of conductive particles and reducing the labor intensity of the operator.

[0040] The above-described embodiments of this disclosure have the following beneficial effects: The assembly fixtures for conductive particles in silicone keypads according to some embodiments of this disclosure can improve the filling efficiency and accuracy of the conductive particles, thereby improving the production efficiency and the stability of the conductivity of silicone keypads. Specifically, the reasons for the low production efficiency and low conductivity stability of silicone keypads are: operators fill the conductive particles one by one, resulting in low production efficiency, which is difficult to meet the needs of modern large-scale production. Furthermore, it is easily affected by the operator's experience and condition; operator visual fatigue can lead to positioning deviations, causing the conductive particles to shift or tilt, resulting in an increased product defect rate and thus lower conductivity stability of the silicone keypads. Based on this, some embodiments of this disclosure provide an assembly fixture for conductive particles of silicone keypads. The device includes: an upper moving pressure plate and a base plate arranged relatively parallel to each other; the upper moving pressure plate is a closed sandwich structure formed by two layers of plates, and a hollow needle array is installed on the lower end face of the upper moving pressure plate, which can move with the upper moving pressure plate; a negative pressure interface is installed on the upper end face of the upper moving pressure plate, and the hollow needle array is connected to the negative pressure interface; the base plate is provided with a positioning hole array corresponding to the hollow needle array, each positioning hole in the positioning hole array can be embedded with conductive particles, and the hollow needle array can penetrate the positioning hole array; the upper moving pressure plate and the base plate are separated by a guide support column with an embedded elastic component, and the upper moving pressure plate and the base plate can be pressed together along the guide support column by external force; the two ends of the elastic component abut against the lower end face of the upper moving pressure plate and the upper end face of the base plate, respectively. By setting a positioning hole array that matches the size of the conductive particles, conductive particles can be loaded in batches, improving the loading efficiency. Through the coordinated operation of the hollow needle array and the negative pressure interface, the conductive particles can be absorbed in batches, further improving the production efficiency of silicone buttons. With the upper moving pressure plate and the material receiving base plate that can fit together, when the two are pressed together, the hollow needle array can push each conductive particle adsorbed in the positioning hole array into the corresponding mold, which can improve the loading accuracy of conductive particles, reduce the product defect rate, and thus improve the stability of the conductivity of silicone buttons.

[0041] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. An assembly fixture for conductive particles in silicone keypads, characterized in that, include: The upper dynamic pressure plate and the material-bearing base plate are arranged relatively parallel to each other; The upper moving pressure plate is a closed sandwich structure formed by two layers of plates. A hollow needle array is installed on the lower end face of the upper moving pressure plate. The hollow needle array can move with the upper moving pressure plate. The upper end face of the upper dynamic pressure plate is equipped with a negative pressure interface, and the hollow needle array is connected to the negative pressure interface; The material-bearing base plate is provided with a positioning hole array corresponding to the hollow needle tube array. Each positioning hole in the positioning hole array can embed conductive particles, and the hollow needle tube array can penetrate the positioning hole array. The upper moving pressure plate and the material-bearing base plate are separated by a guide support column with an embedded elastic component. The upper moving pressure plate and the material-bearing base plate can be pressed together along the guide support column by external force. The two ends of the elastic component abut against the lower end face of the upper moving pressure plate and the upper end face of the material bearing base plate, respectively.

2. The assembly fixture for conductive particles in silicone keypads according to claim 1, characterized in that, The upper end face of the upper dynamic pressure body is also provided with a hand-held component.

3. The assembly fixture for conductive particles of silicone buttons according to claim 1, characterized in that, The outer periphery of the negative pressure interface is provided with a sealing groove, and an elastic sealing gasket is embedded in the sealing groove.

4. The assembly fixture for conductive particles in silicone keypads according to claim 1, characterized in that, The number of guide support columns is four, and each guide support column is located at one of the four corners of the upper moving pressure plate and the material bearing base plate.

5. The assembly fixture for conductive particles in silicone buttons according to claim 1, characterized in that, The inner walls of the positioning hole array are all coated with a wear-resistant coating.

6. The assembly fixture for conductive particles of silicone buttons according to claim 2, characterized in that, The handheld component is covered with a non-slip rubber sleeve.

7. The assembly fixture for conductive particles of silicone keypads according to claim 4, characterized in that, One end of the guide support column is fixed to the material-bearing base plate, and the other end is threaded; The other end of the guide support column is detachably connected to the upper moving pressure plate via a thread.

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