Dental auxiliary illuminating lamp and production, assembly and processing technology thereof

Abstract

The invention discloses a dental auxiliary illuminating lamp and a production, assembly and processing technology thereof. The production, assembly and processing technology comprises the following preparation steps of S1, PCB pretreatment, S2, solder paste screen printing, S3, chip mounting, S4, reflow soldering curing, S5, chip packaging and S6, adhesive layer curing. Wherein in the step S6, in the glue layer curing step, the PCB is fed into a curing oven in an inverted mode, and curing work is completed in the inverted mode. An inverted baking mode is adopted for glue layer curing, glue can be effectively prevented from overflowing to other chip positions in the baking process, the independence of chip packaging is guaranteed, clear isolation between chips is guaranteed, and the regularity of a packaged finished product is remarkably improved; and in cooperation with precise fixing of a special drying jig, the stability of the inversion posture of the PCB can be further guaranteed, the overflow-free effect is enhanced, and the PCB inversion device is suitable for batch and large-scale production.

Description

Technical Field

[0001] This invention belongs to the field of packaging and processing technology, and relates to a dental auxiliary lighting lamp and its manufacturing and assembly process. Background Technology

[0002] Dental auxiliary lighting is a crucial piece of equipment in clinical oral diagnosis and treatment and dental restoration. Its core function is to provide highly uniform, shadow-free, and color-temperature-appropriate illumination to the surgical area, ensuring accurate judgment by dentists during delicate procedures such as caries detection, root canal preparation, and aesthetic restorations, while also considering patient eye comfort and the clarity of the treatment area. The quality of the lighting directly determines the accuracy of the treatment procedure, the aesthetics of the restoration, and the experience for both doctor and patient, thus having a decisive impact on the overall quality of dental treatment. As oral medical technology develops towards minimally invasive, digital, and refined approaches, the market demands higher standards for the stability of the light spot, adjustable illuminance, anti-fog and anti-stain capabilities, and compatibility with various treatment scenarios in dental auxiliary lighting.

[0003] However, in the current mass production and assembly process of dental auxiliary lighting lamps, during the bonding and curing stage of the optical lens and lamp body bracket, the glue that has not been fully cured is prone to overflow and spread to the optical surface of the lens or the internal circuit interface of the lamp body, resulting in serious defects such as decreased lens transmittance, light spot distortion, and short circuit, which significantly reduces the product qualification rate and increases production costs. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A dental auxiliary lighting lamp, characterized in that it comprises: a lighting lamp housing and an LED chip packaging unit disposed within the lighting lamp housing;

[0006] The LED chip packaging unit includes: a PCB substrate, LED chips soldered on the PCB substrate, and wires for connecting the LED chips to power are also soldered to the lower end of the PCB substrate.

[0007] The PCB substrate is also provided with an encapsulating adhesive layer covering the LED chip.

[0008] The lighting fixture housing has a through-type housing structure. The bottom of the housing has an installation port for inserting LED chips, and the top has a light-transmitting hole for the light source to shine out.

[0009] During assembly, the LED chip packaging unit is inserted into the lighting housing with the LED chip facing upwards through the mounting port, and the PCB substrate is attached to the inner wall of the lighting housing to form a positioning.

[0010] A manufacturing and assembly process for a dental auxiliary lighting lamp, used in the production of the aforementioned dental auxiliary lighting lamp, includes the following preparation steps:

[0011] S1. PCB pretreatment: After cleaning the PCB board, the positioning groove is formed on the PCB board using laser cutting equipment;

[0012] S2, Screen Printing Solder Paste: Solder paste is evenly printed onto the PCB board using a stencil screen printing machine;

[0013] S3, Chip mounting: LED chip beads are mounted in positioning slots using a chip mounting device;

[0014] S4. Reflow Soldering and Curing: The PCB board after chip mounting is sent into the reflow soldering equipment to cure the solder paste in the positioning groove, thus establishing the electrical and mechanical connection between the chip and the PCB board.

[0015] S5. Chip Packaging: Precise dispensing of adhesive into each positioning slot on the PCB board is achieved by using dispensing equipment to package the chip in the positioning slot on the PCB board.

[0016] S6. Adhesive layer curing: The encapsulated PCB board is sent into the curing oven for adhesive layer curing. The PCB board is sent into the curing oven in an upside-down manner to complete the curing process.

[0017] S7. Chip wire bonding: Using the bottom pad of the positioning slot in the PCB board as the positioning reference, the wire bonding of LED lamp chip is realized.

[0018] S8. Chip Cutting: Precisely cut the chip using the pre-set positioning slots on the PCB board as a reference, dividing the entire PCB board into individual independent LED chip packaging units.

[0019] S9, LED chip packaging: The LED chip packaging unit is assembled into the lighting lamp housing, and the LED chip wires pass through the lighting lamp housing for wire bonding processing; and the bottom of the LED chip packaging unit is sealed with glue to fix the LED chip packaging unit in the lighting lamp housing.

[0020] As a further aspect of the present invention: in step S6, during adhesive layer curing, the PCB board is fed into the curing oven in an inverted manner using a specific drying fixture.

[0021] As a further aspect of the present invention: in step S6, the adhesive layer curing process, a stepped heating curing method is adopted, including: baking at 80°C for 1 hour, baking at 100°C for 1 hour, and baking at 150°C for 3 hours.

[0022] As a further aspect of the present invention: In S5, chip packaging, the encapsulating adhesive uses a two-component phenylsiloxane encapsulating adhesive as the base adhesive, and the components are mixed in the following proportions: A adhesive: B adhesive: phosphor: diffusion powder: anti-precipitation powder = 1:10:0.8:0.1:0.18.

[0023] As a further aspect of the present invention: in the encapsulating adhesive, the viscosity of component A is 6500 cP (6.5 Pa·sec) at 25°C, the viscosity of component B is 2450 cP (2.45 Pa·sec) at 25°C, and the viscosity after mixing is 2830 cP (2.83 Pa·sec) at 25°C.

[0024] As a further aspect of the present invention: In S5, chip packaging, the dispensing equipment is equipped with a heating platform for heating the PCB board.

[0025] As a further aspect of the present invention: In step S9, the lighting housing is a through-type sleeve-shaped housing structure, with an installation port at one end and a potting port at the other end; during assembly, the LED chip packaging unit is assembled into the lighting housing with the bottom facing down, and the wires of the LED chip packaging unit pass through the potting port; then, sealant is poured into the potting port of the lighting housing to seal the bottom of the LED chip packaging unit.

[0026] The beneficial effects of this invention are:

[0027] In the dispensing process, the inverted baking method is used to cure the adhesive layer, which can effectively prevent the adhesive from overflowing to other chip positions during the baking process, ensuring the independence of each chip package, ensuring clear isolation between chips, and significantly improving the neatness of the packaged product. With the precise fixation of the special drying fixture, the stability of the PCB board in the inverted position can be further guaranteed, the overflow-free effect can be enhanced, and it is suitable for mass production.

[0028] In the assembly process, compared with the traditional process of installing first and then applying adhesive, the present invention significantly improves production efficiency and product quality by adjusting the processing technology of applying adhesive first and then installing. On the one hand, by applying adhesive first to encapsulate and protect the LED chip in advance, and then carrying out subsequent assembly, the problem of operating the narrow space of the soldering wire inside the shell in the traditional mode of installing first and then applying adhesive is completely avoided. At the same time, it realizes the standardized batch production and simple assembly of small PCB units, saving more than 50% of the assembly time per product, and significantly reducing labor costs and production threshold.

[0029] On the other hand, the standardized solder lines in the whole board state ensure consistent solder line quality, and together with the bottom glue can form a double seal protection, which not only effectively improves the consistency of core parameters such as light efficacy and color temperature, but also better isolates corrosive media in the dental treatment environment, extends product life, and the simplified assembly process adapts to the lightweight design requirements of dental auxiliary lighting lamps, taking into account both production efficiency and reliability. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the present invention.

[0031] Figure 2 This is a schematic diagram of the drying fixture in this invention.

[0032] Figure 3 This is a schematic diagram of the LED assembly structure in this invention. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. It should be understood that this application is not limited to the exemplary embodiments disclosed herein. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] Please see Figure 3 A dental auxiliary lighting lamp includes: a lighting lamp housing 6 and an LED chip packaging unit disposed within the lighting lamp housing 6;

[0036] The LED chip packaging unit includes: a PCB substrate 5, an LED chip 3 soldered on the PCB substrate 5, and a wire 7 for connecting the LED chip 3 to power is also soldered to the lower end of the PCB substrate 5.

[0037] The PCB substrate 5 is also provided with an encapsulating adhesive layer 2 covering the LED lamp bead chip 3;

[0038] The lighting housing 6 has a through-type housing structure. The bottom of the lighting housing 6 is provided with an installation port 62 for inserting LED lamp chip 3; the top is provided with a light-transmitting hole 61 for the light source to shine out.

[0039] During assembly, the LED chip packaging unit is inserted into the lighting housing 6 through the mounting port 62 with the LED chip 3 facing upwards. The PCB substrate 5 is attached to the inner wall of the lighting housing 6 to form a positioning, and the diameter of the light-transmitting hole 61 of the lighting housing 6 is smaller than that of the encapsulating adhesive layer 2, so that the LED chip 3 is positioned below the light-transmitting hole 61. After the LED chip packaging unit is installed in place, it forms a structural assembly with the lighting housing 6. The lower end of the LED chip packaging unit is also filled with sealant to form a sealing layer 4 for fixing the LED chip packaging unit, thus fixing the LED chip packaging unit in the lighting housing 6.

[0040] Compared to traditional post-application processes, this significantly improves production efficiency and product reliability. On the one hand, standardized processes for coating and curing fluorescent adhesive before shipment allow for precise control of adhesive layer thickness, phosphor mixing ratio, and coverage, avoiding defects such as uneven adhesive layers and phosphor agglomeration, and ensuring consistency in luminous color temperature and color rendering index. On the other hand, modular LED chip packaging units eliminate the need for additional dispensing and curing processes, simplifying the assembly process, shortening the production cycle, and preventing adhesive overflow from contaminating the housing or light-transmitting holes 61, thus reducing the defect rate. Simultaneously, the pre-encapsulated adhesive layer 2 provides complete protection for the LED chip 3 in advance, avoiding damage caused by dust and external forces during assembly, effectively improving product reliability and lifespan.

[0041] Please see Figures 1-2 In this embodiment of the invention, a manufacturing and assembly process for a dental auxiliary lighting lamp, used in the preparation of the aforementioned dental auxiliary lighting lamp, includes the following preparation steps:

[0042] S1. PCB pretreatment: After cleaning the PCB board, positioning grooves are formed on the PCB board using laser cutting equipment; the positioning grooves provide a precise reference for the mounting of LED lamp chip, and at the same time play a role in accommodating and limiting the subsequent solder paste and encapsulation glue, thus initially reducing the risk of material spillage.

[0043] S2, Solder paste printing: Solder paste is evenly printed onto the PCB board using a stencil screen printing machine; the solder paste printing area is precisely aligned with the positioning groove, providing a structural basis for the electrical connection and mechanical fixation of the chip and the PCB board;

[0044] S3, Chip Placement: LED chips are placed in positioning slots using a chip placement device; the positioning slots ensure precise chip placement without offset, allowing the bottom of the chip to make full contact with the solder paste.

[0045] S4. Reflow Soldering and Curing: The PCB board after chip mounting is sent into the reflow soldering equipment to cure the solder paste in the positioning tank, realizing the electrical and mechanical connection between the chip and the PCB board; by controlling the reflow soldering temperature, the solder paste is fully melted and wetted to the pads and chip leads, and a stable connection structure is formed after curing.

[0046] S5. Chip Packaging: Precise dispensing of adhesive into each positioning slot on the PCB board is performed using dispensing equipment to encapsulate the chip in the positioning slot on the PCB board, forming an encapsulating adhesive layer. The dispensing equipment is equipped with a heating platform for heating the PCB board. This heating platform increases the temperature of the PCB board during processing, thereby improving the fluidity of the encapsulating adhesive inside the board. This allows the adhesive to spread quickly and evenly in the positioning slot after dispensing, more fully filling the tiny gaps between the chip and the positioning slot wall, and avoiding uneven phenomena such as localized adhesive accumulation or gaps.

[0047] S6. Adhesive Layer Curing: The packaged PCB board is sent into a curing oven for adhesive layer curing. During curing, the PCB board is placed inverted into the curing oven to complete the curing process (using the adhesive's adhesion to fix the dispensing position). This inverted position can effectively prevent adhesive from overflowing to other chip locations during baking, ensuring the independence of each chip package, ensuring clear isolation between chips, and improving the neatness of the packaged product.

[0048] S7. Chip Wire Bonding: Using the bottom pad of the positioning slot in the PCB board as the positioning reference, the LED chip wire bonding process is realized; after wire bonding, the visual inspection system checks each point to remove defective products with poor soldering, desoldering, or metal wire misalignment.

[0049] S8. Chip Cutting: A board splitter is used to precisely cut the PCB into individual LED chip packaging units based on the pre-set positioning slots on the PCB. The cutting depth and speed are controlled during the cutting process to avoid damaging the chip packaging adhesive layer and internal electrical connection structure. After cutting, the edges of the units are chamfered to reduce the risk of edge breakage during subsequent assembly.

[0050] S9, LED chip packaging: The LED chip packaging unit is assembled into the lighting lamp housing, and the LED chip wires pass through the lighting lamp housing for wire bonding processing; and the bottom of the LED chip packaging unit is sealed with glue to fix the LED chip packaging unit in the lighting lamp housing.

[0051] Furthermore, in step S9, during assembly, the LED chip packaging unit is inserted into the lighting housing through the mounting port with the LED chip facing upwards, and the wires of the LED chip packaging unit pass out through the mounting port for subsequent power connection.

[0052] Then, sealant is poured into the lighting fixture housing through the mounting port to seal the bottom of the LED chip packaging unit, thus fixing the LED chip packaging unit in the lighting fixture housing.

[0053] Furthermore, in step S6, during adhesive layer curing, the PCB board is fed into the curing oven in an inverted manner through a specific drying fixture. The drying fixture has a frame structure and a hollow structure that runs through the front and back. The inner end face of the drying fixture has multiple sets of mounting slots arranged along its height on both sides. The two sides of the PCB board are respectively inserted into the mounting slots of the corresponding height to achieve a firm fixation.

[0054] The hollow structure ensures smooth airflow within the curing oven, guaranteeing uniform temperature across all areas of the PCB board and preventing localized curing defects. Multiple mounting slots accommodate PCBs of different sizes, while precise positioning ensures stability of the PCB board when inverted, preventing PCB board misalignment during curing and thus avoiding abnormal glue flow, further guaranteeing a no-overflow effect.

[0055] Furthermore, in step S6, the adhesive layer curing, a stepped heating curing method is adopted, specifically including: baking at 80℃ for 1 hour, baking at 100℃ for 1 hour, and baking at 150℃ for 3 hours. Stepped heating allows the encapsulating adhesive to cure gradually. The first stage at low temperature removes volatile components from the adhesive, avoiding the formation of bubbles due to rapid curing at high temperature; the intermediate temperature stage allows the adhesive to initially gel and set, further reducing the risk of flow and overflow; and the final high temperature stage ensures complete curing of the adhesive layer, improving the structural stability and bonding strength of the adhesive layer.

[0056] Furthermore, in the S5 chip packaging, the encapsulating adhesive uses a two-component phenylsiloxane encapsulating adhesive as the base adhesive, with each component mixed in the following ratio: A adhesive : B adhesive : phosphor : diffusing powder : anti-settling powder = 1 : 10 : 0.8 : 0.1 : 0.18. The two-component phenylsiloxane encapsulating adhesive possesses excellent high-temperature resistance, light transmittance, and adhesion properties, meeting the long-term operating requirements of LED chip beads; the phosphor can adjust the emission color, the diffusing powder ensures uniform light dispersion, and the anti-settling powder prevents functional powders from settling in the adhesive, ensuring uniform and stable adhesive performance.

[0057] Furthermore, in the encapsulating adhesive, component A has a viscosity of 6500 cP (6.5 Pa·sec) at 25°C, and component B has a viscosity of 2450 cP (2.45 Pa·sec) at 25°C. After mixing, the viscosity at 25°C is 2830 cP (2.83 Pa·sec). The adhesive is liquid during dispensing and is colorless to pale yellow and transparent. These viscosity parameters are suitable for the positioning groove encapsulation requirements, ensuring that the adhesive can smoothly fill the gaps while avoiding excessive flow that could increase the risk of overflow. The transparency ensures the light transmittance of the LED and does not affect the luminous effect.

[0058] Furthermore, in step S5, the heating table of the dispensing equipment can precisely control the temperature of the PCB board within a suitable range. By increasing the temperature, the viscosity of the adhesive is reduced and its fluidity is enhanced, allowing the adhesive to spread quickly and evenly in the positioning groove, filling tiny gaps and reducing the risk of uneven stress or overflow after curing caused by localized adhesive accumulation.

[0059] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0060] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A dental auxiliary lighting lamp, characterized in that, include: Lighting lamp housing and LED chip packaging unit disposed inside the lighting lamp housing; The LED chip packaging unit includes: a PCB substrate, LED chips soldered on the PCB substrate, and wires for connecting the LED chips to power are also soldered to the lower end of the PCB substrate. The PCB substrate is also provided with an encapsulating adhesive layer covering the LED chip. The lighting fixture housing has a through-type housing structure. The bottom of the housing has an installation port for inserting LED chips, and the top has a light-transmitting hole for the light source to shine out. The LED chip packaging unit is inserted into the lighting housing with the LED chip facing upwards through the mounting port, and the PCB substrate is attached to the inner wall of the lighting housing to form a positioning.

2. A manufacturing and assembly process for a dental auxiliary lighting lamp, used in the manufacturing of the dental auxiliary lighting lamp as described in claim 1, characterized in that, The preparation steps include the following: S1. PCB pretreatment: After cleaning the PCB board, the positioning groove is formed on the PCB board by laser cutting equipment; S2, Screen Printing Solder Paste: Solder paste is evenly printed onto the PCB board using a stencil screen printing machine; S3, Chip mounting: LED chip beads are mounted in positioning slots using a chip mounting device; S4. Reflow Soldering and Curing: The PCB board after chip mounting is sent into the reflow soldering equipment to cure the solder paste in the positioning groove, thus establishing the electrical and mechanical connection between the chip and the PCB board. S5. Chip Packaging: Precise dispensing of adhesive into each positioning slot on the PCB board is achieved by using dispensing equipment to package the chip in the positioning slot on the PCB board. S6. Adhesive layer curing: The encapsulated PCB board is sent into the curing oven for adhesive layer curing. The PCB board is sent into the curing oven in an upside-down manner to complete the curing process. S7. Chip wire bonding: Using the bottom pad of the positioning slot in the PCB board as the positioning reference, the wire bonding of LED lamp chip is realized. S8. Chip Cutting: Precisely cut the chip using the pre-set positioning slots on the PCB board as a reference, dividing the entire PCB board into individual independent LED chip packaging units. S9, LED chip packaging: The LED chip packaging unit is assembled into the lighting lamp housing, and the LED chip wires pass through the lighting lamp housing for wire bonding processing; and the bottom of the LED chip packaging unit is sealed with glue to fix the LED chip packaging unit in the lighting lamp housing.

3. The manufacturing and assembly process of a dental auxiliary lighting lamp according to claim 1, characterized in that, In step S6, during adhesive layer curing, the PCB board is fed into the curing oven in an inverted manner using a specific drying fixture.

4. The manufacturing and assembly process of a dental auxiliary lighting lamp according to claim 1, characterized in that, In step S6, the adhesive layer is cured by a stepped heating method, including baking at 80°C for 1 hour, baking at 100°C for 1 hour, and baking at 150°C for 3 hours.

5. The manufacturing and assembly process of a dental auxiliary lighting lamp according to claim 1, characterized in that, In S5 chip packaging, the encapsulating adhesive uses a two-component phenylsiloxane encapsulating adhesive as the base adhesive. The components are mixed in the following proportions: A adhesive : B adhesive : phosphor : diffusing powder : anti-precipitation powder = 1: 10：0.8：0.1：0.18。 6. The manufacturing and assembly process of a dental auxiliary lighting lamp according to claim 5, characterized in that, In the encapsulating adhesive, component A has a viscosity of 6500 cP (6.5 Pa·sec) at 25°C, component B has a viscosity of 2450 cP (2.45 Pa·sec) at 25°C, and the viscosity of the mixture at 25°C is 2830 cP (2.83 Pa·sec).

7. The manufacturing and assembly process of a dental auxiliary lighting lamp according to claim 5, characterized in that, In S5 chip packaging, the dispensing equipment is equipped with a heating platform for heating the PCB board.

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