Vacuum chuck and preparation method thereof

Abstract

The invention discloses a vacuum chuck and a preparation method thereof, and belongs to the technical field of wafer processing. The vacuum chuck comprises a first body, a second body, a supporting structure and a connecting layer. The second main body and the first main body are oppositely arranged, at least one of the mutually facing side surfaces of the first main body and the second main body is provided with a flow channel formed by sinking along the first direction, and one side, back to the first main body, of the second main body is used for bearing a wafer. The supporting structure is located between the first body and the second body and supports the first body and the second body. The connecting layer is located between the first main body and the second main body, the first main body and the second main body are connected through the connecting layer, the connecting layer is located on at least one side of the supporting structure, and at least two of the projections of the connecting layer, the supporting structure and the flow channel in the same plane in the first direction are adjacently arranged. According to the supporting structure, the sealing performance of the flow channel can be improved, and the uniformity of heat exchange and the consistency of adsorption capacity are improved.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and in particular to a vacuum chuck and its preparation method. Background Technology

[0002] This section provides only background information related to the present invention and is not necessarily prior art.

[0003] Currently, in semiconductor manufacturing, semiconductor chips need to be processed. The wafers to be processed need to be fixed, supported, and moved by chucks in related processes to ensure high-precision positioning and ensure smooth processing. In order to maintain the high-precision surface shape of the wafer and improve processing quality and efficiency, the chucks need to have both adsorption and heat exchange functions: the air channels (to achieve vacuum adsorption) and water channels (i.e., heat exchange channels, collectively called flow channels) processed inside are the key to realizing the function. The processing accuracy of the flow channels directly affects the adsorption stability and heat exchange efficiency.

[0004] Currently, most suction cup internal flow channels adopt a "separate machining of upper and lower discs + precision sealing" approach: first, air channels, water channels, and sealing grooves are machined separately on the upper and lower discs using milling and other processes, and then they are welded together to form a complete flow channel. However, during welding, solder easily flows into the inner walls of the air and water channels, forming an uneven film layer. This causes irregular changes in the channel cross-section, which not only hinders uniform heat transfer, significantly reduces heat exchange efficiency, and makes precise temperature control impossible, but also disrupts the stability of the adsorption airflow, leading to a decrease in adsorption efficiency, affecting wafer positioning accuracy, and ultimately reducing processing quality. Summary of the Invention

[0005] The purpose of this application is to at least solve the problem of solder flowing into the gas channel and water channel inner wall, forming an uneven film layer. This purpose is achieved through the following methods: The first aspect of this application proposes a vacuum suction cup, comprising: First subject; The second body is disposed opposite to the first body. At least one of the sides of the first body and the second body facing each other has a flow channel formed by a recess along a first direction. The side of the second body facing away from the first body is used to carry the wafer. The first direction is the arrangement direction of the first body and the second body. A supporting structure is located between the first main body and the second main body, and the supporting structure supports the first main body and the second main body. A connecting layer is located between the first body and the second body. The first body and the second body are connected by the connecting layer. The connecting layer is located on at least one side of the support structure. At least two of the connecting layer, the support structure, and the flow channel are arranged adjacent to each other in the projection of their respective planes along the first direction.

[0006] The vacuum chuck of this application has a support structure between the first body and the second body, and the support structure, the connecting layer, and the flow channel are arranged adjacent to each other, so that the support structure and the connecting layer are both located in the connection area between the first body and the second body. The support structure can support the first body and the second body, thereby reducing the possibility that the connecting layer is squeezed by the second body during the preparation process, reducing the possibility that the connecting layer is squeezed into the flow channel during the preparation process, so that the connecting layer is retained in the connection area under the action of its own surface tension during the preparation process, improving the connection reliability of the connecting layer, while improving the sealing performance of the flow channel, improving the uniformity of heat exchange and the consistency of adsorption capacity, and improving the processing quality of the wafer.

[0007] In some embodiments, the support structure includes a plurality of support portions, which are spaced apart along a direction perpendicular to the first direction.

[0008] In some embodiments, a plurality of support portions are arranged in a ring array with vacuum suction cups along the geometric center of a plane perpendicular to the first direction.

[0009] In some embodiments, in the direction from the first body to the second body, at least some of the multiple support portions have a gradually decreasing cross-sectional area in the first plane; and / or, in the direction from the first body to the second body, at least some of the multiple support portions have the same cross-sectional area in the first plane, and the first plane is perpendicular to the first direction.

[0010] In some embodiments, the flow channel includes a first segment and a second segment, both of which are arranged around the geometric center of the vacuum suction cup along a plane perpendicular to the first direction, and the first segment and the second segment are arranged sequentially away from the geometric center. A plurality of support portions include a first support portion located between the first segment and the second segment, and along the arrangement direction of the first segment and the second segment, the distance between the first support portion and the first segment is equal to the distance between the first support portion and the second segment.

[0011] In some embodiments, the plurality of supports includes a second support, wherein the outline of the second support projected along a first direction partially coincides with the outline of the flow channel projected along the first direction.

[0012] In some embodiments, the support structure includes a first support segment and a second support segment, the first support segment being disposed on a first main body and the second support segment being disposed on a second main body, the first support segment and the second support segment being disposed opposite to each other along a first direction.

[0013] In some embodiments, the dimension of the support structure along the first direction is equal to the dimension of the connecting layer along the first direction.

[0014] A second aspect of this application provides a method for preparing a vacuum chuck, used to prepare the vacuum chuck of any of the foregoing embodiments, the method comprising: A prefabricated layer is formed by multi-layer printing on at least one side of the first body and the second body using a mask. The prefabricated layer is formed in the cutout area of ​​the mask. The support structure and the flow channel are both located in the mask area of ​​the mask. At least one of the mutually facing sides of the first body and the second body is provided with a flow channel formed by a recess along a first direction. The side of the second body facing away from the first body is used to carry the wafer. The support structure supports the first body and the second body. The surface of the precast layer undergoes a first grinding process; The preformed layer after the first grinding process is subjected to a first heating treatment, the first heating treatment including a first heating temperature, the first heating temperature being greater than the liquidus temperature of the preformed layer; The surface of the preform after the first heat treatment is subjected to a second grinding treatment; The first body and the second body are arranged opposite each other, and the prefabricated layer after the second grinding process is subjected to a second heating process to form a connecting layer. The second heating process includes a second heating temperature, which is greater than the liquidus temperature of the prefabricated layer. The connecting layer is located on at least one side of the support structure. Any two of the projections of the connecting layer, the support structure, and the flow channel in the same plane along the first direction are arranged adjacent to each other. The first direction is the arrangement direction of the first body and the second body.

[0015] In some embodiments, the step of sequentially forming a prefabricated layer using a mask plate on at least one side of the first body and the second body includes: A composite layer is printed on at least one side of the first and second bodies. The composite layer is made of a connecting material forming a prefabricated layer and a sphere forming a support structure. The melting temperature of the connecting material is lower than the melting temperature of the sphere.

[0016] In some embodiments, the connecting material includes borosilicate glass. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. Wherein: Figure 1 This is a cross-sectional view of the vacuum suction cups of some embodiments of this application; Figure 2 for Figure 1 An enlarged structural diagram of P in the middle; Figure 3 This is a top view of the first body in a vacuum suction cup according to some embodiments of this application; Figure 4 for Figure 1 Another enlarged structural diagram of P; Figure 5 for Figure 3 A cross-sectional structural diagram of AA; Figure 6 for Figure 3 Another cross-sectional structural diagram of AA; Figure 7 This is a partial exploded cross-sectional view of the vacuum suction cups of some embodiments of this application; Figure 8 This is a partial exploded cross-sectional view of the vacuum suction cups of some embodiments of this application; Figure 9 This is a flowchart illustrating a method for preparing a vacuum chuck according to some embodiments of this application.

[0018] The labels in the attached diagram are as follows: 10. The primary subject; 20. Second subject; 30. Flow channel; 31. First section; 32. Second section; 30a. Heat exchange channel; 30b. Adsorption channel; 40. Support structure; 41. Support part; 411. First support part; 412. Second support part; 42. First support section; 43. Second support section; 50. Connecting layer; X, the first direction. Detailed Implementation

[0019] Exemplary embodiments of this application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this application and to fully convey the scope of this application to those skilled in the art.

[0020] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0021] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure rotates, then an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0023] In the description of the application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", "height direction", "first direction", "second direction", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] Figure 1 This is a cross-sectional structural diagram of a vacuum suction cup according to some embodiments of this application. Figure 2 for Figure 1 An enlarged structural diagram of P. Figure 3 This is a top view of the first body in a vacuum suction cup according to some embodiments of this application.

[0026] like Figures 1 to 3 As shown, according to an embodiment of the present invention, a vacuum chuck is provided, comprising a first body 10, a second body 20, a support structure 40, and a connecting layer 50. The second body 20 is disposed opposite to the first body 10. At least one of the facing sides of the first body 10 and the second body 20 has a flow channel 30 recessed along a first direction X. The side of the second body 20 facing away from the first body 10 is used to support a wafer. The first direction X is the arrangement direction of the first body 10 and the second body 20. The support structure 40 is located between the first body 10 and the second body 20, and supports the first body 10 and the second body 20. The connecting layer 50 is located between the first body 10 and the second body 20, and the first body 10 and the second body 20 are connected by the connecting layer 50. The connecting layer 50 is located on at least one side of the support structure 40, and at least two of the projections of the connecting layer 50, the support structure 40, and the flow channel 30 onto the same plane along the first direction X are disposed adjacent to each other.

[0027] Vacuum chucks can be used to adsorb and fix wafers. Vacuum chucks can be circular or other shapes depending on factors such as the shape of the wafer. In this embodiment, the example is a circular vacuum chuck used to adsorb and fix wafers.

[0028] The first body 10 and the second body 20 are disposed opposite to each other. Both the first body 10 and the second body 20 can be circular structures. The shape and size of the first body 10 and the second body 20 can be the same or different. The first body 10 is used to support the second body 20. The thickness of the first body 10 (i.e., the dimension along the first direction X of the vacuum suction cup) can be greater than the thickness of the second body 20 so that the first body 10 can provide sufficient support force. The first direction X of the vacuum suction cup can be parallel to the stacking direction of the first body 10 and the second body 20.

[0029] The side of the second body 20 facing away from the first body 10 can be fixed with the wafer by means of vacuum adsorption or other methods.

[0030] Optionally, the flow channel 30 may include at least one of an adsorption channel 30b and a heat exchange channel 30a. It is understood that the adsorption channel 30b needs to penetrate the second body 20 to allow gas to flow from the second surface into the adsorption channel 30b to create a negative pressure, thereby adsorbing the wafer.

[0031] Optionally, the heat exchange channel 30a may include an inlet and an outlet, both of which may be located in the first body 10 and pass through the first body 10 to connect the heat exchange channel 30a with an external heat circulation device.

[0032] In some examples, the flow channel 30 can have various shapes, such as straight, spiral, labyrinthine, or other shapes. The flow channel 30 can be matched with the shape of the vacuum suction cup, for example, the flow channel 30 can be spiral in shape.

[0033] For example, the flow channel 30 can be arranged in a variety of ways. For instance, the flow channel 30 can be provided in the first body 10; or, the flow channel 30 can be provided in the second body 20; or, both the first body 10 and the second body 20 can be provided with the flow channel 30.

[0034] In some examples, the flow channel 30 includes a first flow channel located in the first body 10, which is formed by a recess in the side of the first body 10 toward the second body 20 (hereinafter referred to as the first surface for ease of description), and the area of ​​the first surface where the flow channel 30 is not recessed (i.e. the connecting area) can be used to set the support structure 40 and the connecting layer 50.

[0035] In some examples, the flow channel 30 includes a second flow channel located in the second body 20, which is formed by a recess in the side of the second body 20 toward the first body 10 (hereinafter referred to as the second surface for ease of description). The area of ​​the second surface where the flow channel 30 is not recessed (i.e. the connecting area) can be used to set the support structure 40 and the connecting layer 50.

[0036] Optionally, the first flow channel and the second flow channel can be arranged opposite to each other along the first direction X, so that the first flow channel and the second flow channel form a flow channel 30 with a larger cross-sectional area; or, the projection of the first flow channel along the first direction X and the projection of the second flow channel along the first direction X are spaced apart, so that the first flow channel and the second flow channel are two independent spaces.

[0037] Optionally, the cross-sectional areas of the first flow channel and the second flow channel can be the same or different.

[0038] The support structure 40 supports the first main body 10 and the second main body 20. One of the first main body 10 and the second main body 20 can be integrally formed with the support structure 40; alternatively, the support structure 40, the first main body 10, and the second main body 20 can be separate structures, with the support structure 40 positioned between the first main body 10 and the second main body 20. When the first main body 10 and the second main body 20 tend to move closer together under external force or their own weight, the support structure 40 can provide support. Optionally, the support structure 40 can be located on the first main body 10; or, the support structure 40 can be located on the second main body 20; or, the support structure 40 can comprise two parts, one part of which is located on the first main body 10, and the other part of which is located on the second main body 20. It is understood that the part of the support structure 40 located on the first main body 10 and the other part of the support structure 40 located on the second main body 20 are arranged opposite each other along a first direction X, so that the two parts of the support structure 40 support each other to form a complete support structure.

[0039] Optionally, one of the first body 10 and the second body 20 may be provided with a mounting groove, and a part of the support structure 40 may be embedded in the mounting groove.

[0040] In some technologies, to reduce the possibility of gaps forming at the connection between the first body 10 and the second body 20, leading to gas flowing into the gaps in the flow channel 30, it is proposed that the areas between the first body 10 and the second body 20 without the flow channel 30 be connected by a connecting layer 50. The connecting layer 50 is formed by a welding process. During the fabrication process of the connecting layer 50, the material of the connecting layer 50 becomes molten. Molten material has fluidity and is easily squeezed into the flow channel 30 under the gravity of the second body 20, forming an uneven film layer within the flow channel 30. When the fluid in the flow channel 30 passes through the uneven film layer, fluctuations occur, resulting in reduced adsorption and / or temperature control consistency. Furthermore, the lack of connecting material in the areas where the connecting layer 50 was originally provided reduces the connection reliability of the first body 10 and the second body 20.

[0041] Compared to some of the technologies mentioned above, the vacuum chuck in this embodiment provides a support structure 40 between the first body 10 and the second body 20. The support structure 40, the connecting layer 50, and the flow channel 30 are arranged adjacent to each other, so that the support structure 40 and the connecting layer 50 are both located in the connection area between the first body 10 and the second body 20. The support structure 40 can support the first body 10 and the second body 20, thereby reducing the possibility that the connecting layer 50 will be squeezed by the second body 20 during the preparation process, and reducing the possibility that the connecting layer 50 will be squeezed into the flow channel 30 during the preparation process. This allows the connecting layer 50 to remain in the connection area under the action of its own surface tension during the preparation process, improving the connection reliability of the connecting layer 50, while improving the sealing performance of the flow channel 30, improving the uniformity of heat exchange and the consistency of adsorption capacity, and improving the processing quality of the wafer.

[0042] This application embodiment does not limit the shape and size of the support structure 40. For example, the shape of the support structure 40 may include a columnar, straight, arc-shaped, mesh-like, irregular, planar, or other shapes. The dimension of the support structure 40 along the first direction X may be equal to the distance between the first surface and the second surface along the first direction X.

[0043] In some examples, the number of support structures 40 may include one or more. When there is one support structure, the support structure may extend in a direction perpendicular to the first direction. When there are multiple support structures, the multiple support structures 40 may be disposed on the periphery of the flow channel 30.

[0044] In some examples, the connecting layer 50 connects the first body 10 and the second body 20 to fix the first body 10 and the second body 20 relative to each other and seal the flow channel 30, thereby reducing the possibility of fluid overflowing from the flow channel 30 to the connecting area of ​​the first body 10 and the second body 20.

[0045] The connecting layer 50 is located on at least one side of the supporting structure 40, and at least two of the connecting layer 50, the supporting structure 40, and the flow channel 30 are arranged adjacent to each other in the projection of their respective parts onto the same plane along the first direction X. This means that both the supporting structure 40 and the connecting layer 50 are located in the connection area of ​​the first body 10 and the second body 20. During the fabrication process, the supporting structure 40 supports the first body 10 and the second body 20. After the connecting layer 50 is fabricated, it connects the first body 10 and the second body 20. Furthermore, during the fabrication process of the connecting layer 50, the adjacent arrangement of the connecting layer 50 and the flow channel 30 increases the connection area of ​​the connecting layer 50, thereby increasing the connection area between the first body 10 and the second body 20 and improving the connection strength between them.

[0046] The connecting layer 50 is located on at least one side of the supporting structure 40, for example, the connecting layer 50 is located on one or more sides of the supporting structure. At least two of the projections of the connecting layer 50, the supporting structure 40, and the flow channel 30 along the first direction X in the same plane are arranged adjacently. This can be understood as the projection of the connecting layer 50 along the first direction X of the vacuum chuck and the projection of the supporting structure 40 along the first direction X being adjacently arranged, and / or, the projection of the connecting layer 50 along the first direction X of the vacuum chuck and the projection of the flow channel 30 along the first direction X being adjacently arranged, and / or, the projection of the supporting structure 40 along the first direction X and the projection of the flow channel 30 along the first direction X being adjacently arranged. Here, "adjacent arrangement" can include the outlines of the two structural projections being spaced apart, and can also include the outlines of the two structural projections being coincident. It is understood that when the projection outline of the connecting layer 50 along the first direction X of the vacuum chuck and the projection outline of the flow channel 30 along the first direction X are coincidentally arranged, the connecting layer 50 will be subject to its own surface tension during the fabrication process, and the molten connecting material will remain in the connecting area without external force.

[0047] In some alternative embodiments, such as Figure 2 and Figure 3 As shown, the support structure 40 includes a plurality of support parts 41, which are arranged at intervals along a direction perpendicular to the first direction X.

[0048] For example, the direction perpendicular to the first direction X may include a second direction, and the plurality of support portions 41 may be arranged at intervals along the second direction. The direction perpendicular to the first direction X may also include a third direction, and the plurality of support portions 41 may be arranged at intervals along the third direction. The first direction, the second direction, and the third direction intersect each other. Optionally, the second direction and the third direction are in the same plane (such as the first plane), and the first direction is perpendicular to the first plane.

[0049] For example, multiple support portions 41 can be symmetrically distributed within the connection area to enhance the support performance of the support structure 40. Optionally, multiple support portions 41 can also be disposed around the periphery of the flow channel 30 along the extension direction of the flow channel 30 to reduce the possibility of the connection layer 50 near the flow channel 30 being subjected to external forces during the fabrication process.

[0050] Alternatively, the shapes of the multiple support portions 41 may be the same or different.

[0051] Alternatively, the support portion 41 can be protected by a mask, processed by laser or sandblasting, or processed by a high-precision machining center on the connection area.

[0052] In some examples, multiple support portions 41 may be provided on the first body 10. In other examples, multiple support portions 41 may be provided on the second body 20.

[0053] The multiple support parts 41 are spaced apart, which helps to enhance the design flexibility of the support structure 40, improve the support performance of the support structure 40 on the first main body 10 and the second main body 20, and at the same time reduce the space occupied by the support structure 40 in the connecting layer 50, and increase the connection area of ​​the first main body 10 and the second main body 20.

[0054] In some alternative embodiments, such as Figure 3 As shown, multiple support parts 41 are arranged in a ring array with vacuum suction cups along the geometric center of a plane perpendicular to the first direction X.

[0055] For example, "ring-shaped" means that the lines connecting the multiple support portions 41 can form a ring centered on the geometric center of the vacuum suction cup along a plane perpendicular to the first direction X. "Array arrangement" means that the multiple support portions 41 are evenly spaced. The plane perpendicular to the first direction of the vacuum suction cup can be a first plane. The geometric center refers to the geometric center of the pattern of the projection of the vacuum suction cup onto the first plane. Optionally, the lines connecting the multiple support portions 41 can form a single ring, or multiple concentric rings of different sizes.

[0056] In the above embodiment, the multiple support parts 41 are arranged in a ring array, which can improve the uniformity of the support force of the support structure 40, reduce the possibility of local depression of the second main body 20 due to insufficient local support force, and thus ensure the sealing of the flow channel 30.

[0057] Figure 4 for Figure 1 Another enlarged structural diagram of P.

[0058] In some alternative embodiments, such as Figure 2 and Figure 4 As shown, in the direction from the first body 10 to the second body 20, at least some of the support portions 41 have a gradually decreasing cross-sectional area in the first plane; and / or, in the direction from the first body 10 to the second body 20, at least some of the support portions 41 have the same cross-sectional area in the first plane, and the first plane is perpendicular to the first direction X.

[0059] In some examples, from the first body 10 to the second body 20, a portion of the plurality of support portions 41 have a gradually decreasing cross-sectional area in the first plane, while a portion of the plurality of support portions 41 have the same cross-sectional area in the first plane. In other examples, from the first body 10 to the second body 20, at least a portion of the plurality of support portions 41 have a gradually decreasing cross-sectional area in the first plane. In still other examples, from the first body 10 to the second body 20, at least a portion of the plurality of support portions 41 have the same cross-sectional area in the first plane.

[0060] For example, the first plane is perpendicular to the first direction X, meaning the first plane can be parallel to the first surface (and / or the second surface). The cross-sectional area of ​​the support portion 41 in the first plane refers to the area of ​​the cut surface after the support portion 41 is cut by the first plane. The gradually decreasing cross-sectional area of ​​the support portion 41 in the first plane means that the cross-sectional area of ​​the support portion 41 decreases from the end near the first body 10 (lower end) to the end near the second body 20 (upper end), resulting in a shape that is wider at the lower end and narrower at the upper end. The shape of the support portion 41 can include a frustum of a cone, a truncated pyramid, etc. The uniform cross-sectional area of ​​the support portion 41 in the first plane means that the overall shape of the support portion is cylindrical, so that the force on each part of the support portion is the same.

[0061] In the above embodiments, by making the lower end area of ​​the support portion wider, the support area between the support portion 41 and the first body 10 can be increased, thereby reducing the possibility of the support portion 41 tipping over; by making the upper end area of ​​the support portion narrower, the space occupied by the support portion 41 can be reduced, thereby increasing the connection area between the connecting layer 50 and the second body 20. Since the second body 20 needs to support the wafer, the side of the second body 20 facing away from the first body 10 needs to be flat. The contact area between the upper end of the support portion 41 and the second body 20 is small, so that the support portion 41 can both provide support to the second body 20 and reduce the local compression deformation of the second body 20 by the support portion 41 (because during the fabrication of the connecting layer 50, the support portion 41 will support the second body 20, so that the external load on the supported area and the unsupported area of ​​the second body 20 will be different), thereby improving the flatness of the surface of the second body 20 facing away from the first body 10.

[0062] Figure 5 for Figure 3 A cross-sectional structural diagram of AA.

[0063] In some alternative embodiments, such as Figure 3 and Figure 5 As shown, the flow channel 30 includes a first segment 31 and a second segment 32. The first segment 31 and the second segment 32 are arranged around the vacuum chuck along the geometric center of a plane perpendicular to the first direction X, and the first segment 31 and the second segment 32 are arranged sequentially away from the geometric center. A plurality of support portions 41 include a first support portion 411 located between the first segment 31 and the second segment 32. Along the arrangement direction of the first segment 31 and the second segment 32, the distance between the first support portion 411 and the first segment 31 is equal to the distance between the first support portion 411 and the second segment 32.

[0064] Optionally, the first segment 31 and the second segment 32 can be connected. For example, the flow channel 30 is spiral in shape, and the first segment 31 and the second segment 32 are two adjacent spiral segments of the flow channel 30. Alternatively, the first segment 31 and the second segment 32 can be independent of each other. For example, the first segment 31 is an adsorption channel 30b, and the second segment 32 is a heat exchange flow channel 30.

[0065] Optionally, the first segment 31 and the second segment 32 can have the same shape, for example, the first segment 31 and the second segment 32 can be two arcs, rings or other shapes with different radii. Furthermore, the distance between the first segment 31 and the geometric center is less than the distance between the second segment 32 and the geometric center.

[0066] Along the arrangement direction of the first segment 31 and the second segment 32, the distance between the first support portion 411 and the first segment 31 is equal to the distance between the first support portion 411 and the second segment 32. This can be understood as the first support portion 411 being located precisely in the middle of the first segment 31 and the second segment 32 along the radial direction of the vacuum chuck. This improves the uniformity of the supporting force in the area between the first segment 31 and the second segment 32 of the second body 20, further reducing the possibility of deformation of the second body 20. It is also understood that the connecting layer 50 filling the area between the first support portion 411 and the first segment 31 has the same size as the connecting layer 50 filling the area between the first support portion 411 and the second segment 32. This improves the uniformity of the connecting force exerted by the connecting layer 50 on the first body 10 and the second body 20 on both sides of the first support portion 411 during the manufacturing process, thereby improving the connection reliability.

[0067] like Figure 5 As shown, for example, the distance between the first support part 411 and the first segment 31 is d1, and the distance between the first support part 411 and the second segment 32 is d2, where d1=d2.

[0068] Figure 6 for Figure 3 Another cross-sectional structural diagram of AA.

[0069] In some alternative embodiments, such as Figure 3 and Figure 6 As shown, the plurality of support portions 41 include a second support portion 412, the outline of the projection of the second support portion 412 along the first direction X partially coincides with the outline of the projection of the flow channel 30 along the first direction X. For example, the first plane is perpendicular to the first direction X, and the projection shape of the second support 412 on the second plane has a contour (hereinafter referred to as the first contour for ease of description). The projection shape of the flow channel 30 on the second plane also has a contour (hereinafter referred to as the second contour for ease of description). The first contour and the second contour fit together and overlap, and the first projection and the second projection have no overlapping area, so that the second support 412 is disposed at the edge of the flow channel 30. The second support 412 can not only support the first body 10 and the second body 20, but also serve as a blocking structure to prevent the connection layer 50 from flowing into the flow channel 30 during the preparation process.

[0070] Optionally, the second support 412 may be provided at the bend of the flow channel 30, at the interface of the flow channel 30, or at other locations.

[0071] In some examples, the first support portion 411 and the second support portion 412 may be provided together on the first body 10 to further improve the uniformity of support for the second body 20.

[0072] Figure 7 This is a partial cross-sectional exploded view of a vacuum suction cup according to some embodiments of this application. Figure 8 This is a partial cross-sectional exploded view of a vacuum suction cup according to some embodiments of this application.

[0073] In some alternative embodiments, such as Figure 7 and Figure 8 As shown, the support structure 40 includes a first support section 42 and a second support section 43. The first support section 42 is disposed on the first main body 10, and the second support section 43 is disposed on the second main body 20. The first support section 42 and the second support section 43 are disposed opposite to each other along the first direction X.

[0074] For example, the two opposing surfaces of the first support segment 42 and the second support segment 43 along the first direction X contact each other so that the first support segment 42 and the second support segment 43 together form a support portion 41, and the first support segment 42 and the second support segment 43 jointly bear the supporting force. Optionally, the surface of the first support segment 42 facing the second support segment 43 and the surface of the second support segment 43 facing the first support segment 42 can both be planar. Optionally, the first support segment 42 and the second support segment 43 can be fitted together by a fitting structure. For example, the side of the first support segment 42 facing the second support segment 43 forms a recess, and the side of the second support segment 43 facing the first support segment 42 forms a protrusion. When the first body 10 and the second body 20 are assembled, the protrusion is inserted into the recess so that the first support segment 42 and the second support segment 43 are assembled into a support portion 41.

[0075] Optionally, the first support segment 42 and the second support segment 43 may together form the first support portion 411; and / or, the first support segment 42 and the second support segment 43 may together form the second support portion 412.

[0076] Optionally, the sum of the dimensions of the first support segment 42 along the first direction X and the dimensions of the second support segment 43 along the first direction X is equal to the dimension of the connecting portion along the first direction X.

[0077] In the above embodiment, by providing the first support section 42 and the second support section 43, connecting materials can be provided on both the first body 10 and the second body 20, thereby reducing the possibility of gaps between the connecting part and one of the first body 10 and the second body 20 due to factors such as manufacturing tolerances, and improving the reliability of the connection.

[0078] In some alternative embodiments, the dimension of the support structure 40 along the first direction X is equal to the dimension of the connecting layer 50 along the first direction X. This reduces the possibility of gaps forming between the connecting portion and either the first body 10 or the second body 20 due to manufacturing tolerances or other factors, and reduces the possibility of fluid leakage into the gap within the flow channel 30. Simultaneously, it improves the uniformity of the supporting force of the support structure 40, reduces the possibility of deformation of the second body 20, and further improves the wafer processing quality.

[0079] Figure 9 This is a flowchart illustrating a method for preparing a vacuum chuck according to some embodiments of this application.

[0080] like Figure 1 , Figure 2 as well as Figure 9 As shown, according to an embodiment of the present invention, a method for preparing a vacuum chuck is also provided for preparing the vacuum chuck in any of the above embodiments. The preparation method includes the following steps.

[0081] Step S100: Multilayer printing is performed on at least one side of the first body 10 and the second body 20 using a mask to form a prefabricated layer, wherein the prefabricated layer is formed in the cutout area of ​​the mask, the support structure 40 and the flow channel 30 are located in the mask area of ​​the mask, at least one of the mutually facing sides of the first body 10 and the second body 20 is provided with a flow channel 30 recessed along the first direction X, the side of the second body 20 facing away from the first body 10 is used to carry the wafer, and the support structure 40 supports the first body 10 and the second body 20. Step S200: Perform a first grinding treatment on the surface of the precast layer; Step S300: Perform a first heating treatment on the preform after the first grinding treatment. The first heating treatment includes a first heating temperature, which is greater than the liquidus temperature of the preform. Step S400: Perform a second grinding treatment on the surface of the preform after the first heat treatment; Step S500: The first body and the second body are positioned opposite each other, and the preformed layer after the second grinding process is subjected to a second heat treatment to form a connecting layer 50. The second heat treatment includes a second heating temperature, which is greater than the liquidus temperature of the preformed layer. The connecting layer 50 is located on at least one side of the support structure 40. Any two of the connecting layer 50, the support structure 40, and the flow channel 30 are arranged adjacent to each other in the projection of their respective parts onto the same plane along the first direction X. The first direction is the arrangement direction of the first body and the second body.

[0082] In this embodiment, the preparation method of this vacuum chuck will be described in detail below: For step S100: The cutout area of ​​the mask plate is aligned with the preset connection area. The prefabricated layer can be printed multiple times sequentially using screen printing technology to gradually approach the height of the support structure 40. The stacking of prefabricated layers can improve the uniformity and accuracy of the distribution of the connecting material. The mask area (i.e., the area covered by the mask plate) covers the support structure 40, reducing the possibility that the second main body 20 will bulge locally due to the excessive thickness of the support structure 40. The mask area also covers the flow channel 30, reducing the possibility that the connecting material will fall into the flow channel 30 during the printing process.

[0083] There are several ways to set up the prefabricated layers. For example, the support structure 40 is set on the first main body 10, and all the prefabricated layers are set on the first main body 10; or, the support structure 40 is set on the second main body 20, and all the prefabricated layers are set on the second main body 20; or, the support structure 40 includes a first support section 42 and a second support section 43, a portion of the prefabricated layers is set on the first main body 10, and another portion of the prefabricated layers is set on the second main body 20. In this embodiment, the example of the support structure 40 being set on the first main body 10 and all the prefabricated layers being set on the first main body 10 will be used for explanation.

[0084] For step S200: The surface of the prefabricated layer is subjected to a first grinding process. By controlling the grinding precision, the flatness and thickness deviation of the prefabricated layer are corrected so that the thickness of the prefabricated layer reaches the target range.

[0085] For step S300: The preformed layer and the first body 10 after the first grinding treatment are placed in a sintering furnace and placed at a preset temperature for a preset time to remove the organic binder in the preformed layer. Then, sintering is carried out at a first heating temperature so that the connecting material in the preformed layer is initially dense and solidified, while removing air bubbles in the preformed layer to reduce the possibility of sealing failure due to air bubble rupture during subsequent preparation.

[0086] Optionally, the preset temperature is lower than the first heating temperature.

[0087] The liquidus temperature is the lowest temperature at which the preform material completely transforms from a solid to a flowable molten state. When the preform is in an environment with a first heating temperature, the molten preform can undergo interfacial wetting with the first surface and / or the second surface. That is, the molten material will closely adhere to the first surface and / or the second surface, and even form a transition layer through tiny atomic diffusion. After cooling, an inseparable integral connection is formed.

[0088] For step S400: The surface of the prefabricated layer after the first heat treatment is subjected to a second grinding treatment. The grinding corrects the flatness and thickness deviation of the prefabricated layer caused by the high temperature during the first heat treatment, thereby improving the accuracy of the prefabricated layer thickness control.

[0089] Optionally, the grinding precision of the first grinding process may be lower than that of the first grinding process.

[0090] For step S500: The first body 10 and the second body 20, which have undergone the second grinding treatment and have preformed layers, are positioned opposite each other and placed in a high-temperature furnace. A uniform, slightly positive pressure is applied to ensure close contact between the first body 10, the second body 20, and the preformed layers. The furnace is then heated within a preset environment to allow the preformed layers to melt and bond at a second heating temperature, thereby connecting the first body 10 and the second body 20. Optionally, the preset environment includes an environment filled with a gas such as argon. Optionally, the high-temperature furnace includes a programmable high-temperature furnace.

[0091] The embodiments of this application, through the above-described preparation method, first improve the preparation precision of the prefabricated layer, then repeatedly correct the shape precision of the prefabricated layer, and finally transform the prefabricated layer into the connecting layer 50. This is beneficial to improving the preparation quality of the connecting layer 50, improving the temperature control and adsorption effect of the vacuum chuck, and thus improving the wafer processing effect.

[0092] In other examples, after completing step S500, the connecting layer 50 can be inspected, and the flow channel 30 can be subjected to flow resistance, pressure testing, and pressure holding tests to determine the uniformity of defects in the connecting layer 50. Optionally, the connecting layer 50 can be inspected using industrial ultrasound, industrial X-rays, or other methods.

[0093] In some alternative embodiments, the step of sequentially forming a prefabricated layer on at least one side of the first body 10 and the second body 20 using a mask includes: Step S110: Print a composite layer on at least one side of the first body 10 and the second body 20. The composite layer is made of a connecting material forming the preform and a sphere forming the support structure 40. The melting temperature of the connecting material is lower than the melting temperature of the sphere.

[0094] For step S110: A spherical structure can be added to the connecting material to form a composite layer. During the printing of the composite material onto the first body 10, the prefabricated layer and the support structure are prepared simultaneously, simplifying the vacuum suction cup preparation process and reducing preparation costs. Furthermore, during heating, the connecting material melts before the spheres, so that when the connecting material melts and seals, the spheres can still provide support.

[0095] In some alternative embodiments, the connecting material includes borosilicate glass. Borosilicate glass has characteristics such as high viscosity, low flowability, and high chemical stability, which helps to reduce the possibility of the connecting layer 50 flowing into the flow channel 30 during the preparation process, and at the same time reduces the possibility of the connecting layer 50 cracking in the vacuum chuck under the wafer processing environment, thereby improving the connection reliability.

[0096] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vacuum suction cup, characterized in that, include: First subject; The second body is disposed opposite to the first body. At least one of the sides of the first body and the second body facing each other is provided with a flow channel formed by a recess along a first direction. The side of the second body facing away from the first body is used to carry the wafer. The first direction is the arrangement direction of the first body and the second body. A support structure is located between the first main body and the second main body, and the support structure supports the first main body and the second main body; A connecting layer is located between the first body and the second body, the first body and the second body are connected by the connecting layer, the connecting layer is located on at least one side of the support structure, and at least two of the projections of the connecting layer, the support structure and the flow channel in the same plane along the first direction are arranged adjacent to each other.

2. The vacuum suction cup according to claim 1, characterized in that, The support structure includes multiple support parts, which are arranged at intervals along a direction perpendicular to the first direction.

3. The vacuum suction cup according to claim 2, characterized in that, The plurality of the support portions are arranged in a ring array around the geometric center of the vacuum suction cup along a plane perpendicular to the first direction.

4. The vacuum suction cup according to claim 2, characterized in that, In the direction from the first body to the second body, at least a portion of the plurality of support portions have a gradually decreasing cross-sectional area in the first plane; and / or, In the direction from the first body to the second body, at least some of the plurality of support portions have the same cross-sectional area in a first plane, and the first plane is perpendicular to the first direction.

5. The vacuum suction cup according to claim 2, characterized in that, The flow channel includes a first segment and a second segment. Both the first segment and the second segment are arranged around the geometric center of the vacuum suction cup along a plane perpendicular to the first direction. The first segment and the second segment are arranged sequentially away from the geometric center. The plurality of support portions include a first support portion located between the first segment and the second segment. Along the arrangement direction of the first segment and the second segment, the distance between the first support portion and the first segment is equal to the distance between the first support portion and the second segment.

6. The vacuum suction cup according to claim 2, characterized in that, The plurality of support portions include a second support portion, wherein the outline of the projection of the second support portion along the first direction partially coincides with the outline of the projection of the flow channel along the first direction.

7. The vacuum suction cup according to claim 1, characterized in that, The support structure includes a first support segment and a second support segment. The first support segment is disposed on the first main body, and the second support segment is disposed on the second main body. The first support segment and the second support segment are disposed opposite to each other along the first direction.

8. The vacuum suction cup according to claim 1, characterized in that, The dimension of the support structure along the first direction is equal to the dimension of the connecting layer along the first direction.

9. A method for preparing a vacuum chuck, used to prepare the vacuum chuck according to any one of claims 1 to 8, characterized in that, The preparation method includes: A prefabricated layer is formed by multi-layer printing on at least one side of a first body and a second body using a mask. The prefabricated layer is formed in the cutout area of ​​the mask. The support structure and the flow channel are both located in the mask area of ​​the mask. At least one of the mutually facing sides of the first body and the second body is provided with the flow channel formed by a recess along a first direction. The side of the second body facing away from the first body is used to carry the wafer. The support structure supports the first body and the second body. The surface of the preform layer is subjected to a first grinding process; The preformed layer after the first grinding process is subjected to a first heating treatment, the first heating treatment including a first heating temperature, the first heating temperature being greater than the liquidus temperature of the preformed layer; The surface of the preformed layer after the first heat treatment is subjected to a second grinding treatment; The first body and the second body are arranged opposite each other, and the preformed layer after the second grinding process is subjected to a second heating process to form a connecting layer. The second heating process includes a second heating temperature, which is greater than the liquidus temperature of the preformed layer. The connecting layer is located on at least one side of the support structure. Any two of the projections of the connecting layer, the support structure, and the flow channel in the same plane along the first direction are arranged adjacent to each other. The first direction is the arrangement direction of the first body and the second body.

10. The preparation method according to claim 9, characterized in that, include: The step of sequentially forming a prefabricated layer on at least one side of the first body and the second body using a mask includes: A composite layer is printed on at least one side of the first body and the second body, the composite layer being made of a connecting material forming the preform and a sphere forming a support structure, wherein the melting temperature of the connecting material is lower than the melting temperature of the sphere.

11. The preparation method according to claim 10, characterized in that, include: The connecting material includes borosilicate glass.

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