Electronic device

Abstract

An electronic device according to an embodiment of the present invention includes a display panel, a cover panel, and an electronic module. The cover panel includes a cushion layer, a magnetic layer, and a conductive layer. A first opening is defined in the cushion layer and the magnetic layer, and a second opening is defined in the conductive layer. An electronic device is disposed in the first opening and the second opening. A first region adjacent to the electronic device and having a first magnetic permeability and a second region covering the first region and having a second magnetic permeability different from the first magnetic permeability are defined in the cover panel.

Description

Technical Field

[0001] The embodiments of this disclosure described herein relate to an electronic device with improved reliability. Background Technology

[0002] Electronic devices may include electronic modules. For example, an electronic device may be a portable terminal and / or a wearable device, and an electronic module may include a fingerprint sensor, an antenna module, a camera module, and / or a battery module. As portable terminals become thinner and wearable devices become smaller, the space available for installing electronic modules is gradually decreasing. Furthermore, as electronic devices are developed to have more functions and higher specifications, the number of electronic modules included in electronic devices is increasing. Summary of the Invention

[0003] Technical issues Embodiments of this disclosure provide an electronic device with improved reliability.

[0004] Technical solution According to one or more embodiments, an electronic device includes: a display panel; a cover panel below the display panel; and an electronic module below the display panel, wherein the cover panel includes: a pad layer below the display panel; a magnetic layer below the pad layer; and a conductive layer below the magnetic layer, a first opening defined in the pad layer and the magnetic layer, a second opening defined in the conductive layer, the electronic module located in the first opening and the second opening, and a first region adjacent to the electronic module and having a first magnetic permeability and a second region surrounding the first region and having a second magnetic permeability different from the first magnetic permeability defined in the cover panel.

[0005] The first area of ​​the first opening can be smaller than the second area of ​​the second opening.

[0006] The second area can be 1.5 to 1.6 times the first area.

[0007] In a planar diagram, the magnetic layer can cover the conductive layer.

[0008] The magnetic layer may include ferrite, and the conductive layer may include copper.

[0009] The magnetic permeability of the magnetic layer can be higher than that of the conductive layer.

[0010] In the plan view, at least a portion of the second opening may overlap with the first region.

[0011] In a plan view, the electronic module may not be stacked with the magnetic and conductive layers.

[0012] The electronic module may include a fingerprint sensor.

[0013] The electronic module may include a speaker or a light sensor.

[0014] Each of the first and second openings can be circular in shape.

[0015] Each of the first and second openings can have a quadrilateral shape.

[0016] The display panel may include a display layer and a sensor layer on the display layer, wherein the sensor layer may include: a plurality of first electrodes arranged along a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged along the second direction and extending in the first direction; a plurality of first auxiliary electrodes arranged along the first direction, extending in the second direction, and superimposed on the plurality of first electrodes; and a plurality of second auxiliary electrodes arranged along the second direction, extending in the first direction, and superimposed on the plurality of second electrodes.

[0017] The magnetic layer may include a first portion in a first region and a second portion in a second region, and the permeability of the first portion may be higher than that of the second portion.

[0018] The areas of the first opening and the second opening can be the same.

[0019] The first area of ​​the first opening can be smaller than the second area of ​​the second opening.

[0020] The area of ​​the first part can be 0.2 to 0.3 times the area of ​​each of the first and second openings.

[0021] In a planar view, the conductive layer may be superimposed only on the second region, and the magnetic layer may be superimposed on the first and second regions.

[0022] The cover panel may also include an insulating layer, which is on the same layer as the conductive layer and overlaps with the first region in a plan view.

[0023] The cover panel may also include a sub-conductive layer below the conductive layer and include a third opening having an area larger than that of the second opening.

[0024] According to one or more embodiments, an electronic device includes a display panel and a cover panel below the display panel, wherein the cover panel includes: a magnetic layer below the display panel and having a first opening; and a conductive layer below the magnetic layer and having a second opening, and defines in the cover panel a first region adjacent to the first opening and the second opening and having a first magnetic permeability and a second region surrounding the first region and having a second magnetic permeability different from the first magnetic permeability.

[0025] The first area of ​​the first opening can be smaller than the second area of ​​the second opening.

[0026] In a planar diagram, the magnetic layer can cover the conductive layer.

[0027] The magnetic layer may include ferrite, and the conductive layer may include copper.

[0028] The magnetic layer may include a first portion in a first region and a second portion in a second region, and the permeability of the first portion may be higher than that of the second portion.

[0029] In a planar view, the conductive layer may be superimposed only on the second region, and the magnetic layer may be superimposed on the first and second regions.

[0030] The display panel may include a display layer and a sensor layer on the display layer, wherein the sensor layer may include: a plurality of first electrodes arranged along a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged along the second direction and extending in the first direction; a plurality of first auxiliary electrodes arranged along the first direction, extending in the second direction, and superimposed on the plurality of first electrodes; and a plurality of second auxiliary electrodes arranged along the second direction, extending in the first direction, and superimposed on the plurality of second electrodes.

[0031] In a planar view, the conductive layer may not overlap with the first region.

[0032] The cover panel may also include an insulating layer, which is on the same layer as the conductive layer and overlaps with the first region in a plan view.

[0033] The cover panel may also include a sub-conductive layer below the conductive layer and have a third opening having an area larger than that of the second opening.

[0034] Beneficial effects As described above, in the sensing region where the electronic module is located, the magnetic layer and conductive layer may not be superimposed on the electronic module. The permeability of the first region adjacent to the sensing region may be higher than that of the second region. Therefore, the change in inductance of the magnetic field in the sensing region and the region adjacent to the sensing region can be reduced. Therefore, the sensing reliability in the region of the sensor layer superimposed on the sensing region can be improved. The linearity of the pen input can be improved. Therefore, an electronic device with improved sensing reliability can be provided. Attached Figure Description

[0035] Figure 1 This is a block diagram of an electronic device according to one or more embodiments of the present disclosure.

[0036] Figure 2 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0037] Figure 3 This is a schematic cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0038] Figure 4 This is a schematic cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0039] Figure 5 This is a view illustrating the operation of an electronic device according to one or more embodiments of the present disclosure.

[0040] Figure 6 It is according to one or more embodiments of this disclosure along Figure 2 The cross-sectional view of the display panel is taken by line I-I'.

[0041] Figure 7 This is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0042] Figure 8 This is an enlarged plan view illustrating a sensing unit according to one or more embodiments of the present disclosure.

[0043] Figure 9a This is a plan view illustrating the first conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0044] Figure 9b This is a plan view illustrating the second conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0045] Figure 9c It is along Figure 9a and Figure 9b The cross-sectional view of the sensor layer shown is taken from line III-III'.

[0046] Figure 10a This is a plan view illustrating the first conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0047] Figure 10b This is a plan view illustrating the second conductive layer of a sensing unit according to one or more embodiments of the present disclosure.

[0048] Figure 10c It is according to one or more embodiments of this disclosure along Figure 10a and Figure 10b The cross-sectional view of the sensor layer shown is taken along line A-A'.

[0049] Figure 11 This is a view illustrating the operation of a sensor driving unit according to one or more embodiments of the present disclosure.

[0050] Figure 12 This is a view illustrating the operation of a sensor driving unit according to one or more embodiments of the present disclosure.

[0051] Figure 13a and Figure 13b This is a view describing a first mode according to one or more embodiments of the present disclosure.

[0052] Figure 14 This is a view describing a first mode according to one or more embodiments of the present disclosure.

[0053] Figure 15 This is a view describing a second mode according to one or more embodiments of the present disclosure.

[0054] Figure 16a This is a view describing a second mode according to one or more embodiments of the present disclosure.

[0055] Figure 16b This is a view for describing a second mode based on a sensing unit, according to one or more embodiments of the present disclosure.

[0056] Figure 17 It is according to one or more embodiments of this disclosure along Figure 2 A cross-sectional view of the electronic device taken from line II-II'.

[0057] Figure 18 This is a perspective view showing a portion of the cover panel and a pen according to one or more embodiments of the present disclosure.

[0058] Figure 19 It is a graph depicting the inductance for each location according to one or more embodiments of the present disclosure.

[0059] Figure 20a This is a plan view showing a portion of the rear surface of a cover panel according to one or more embodiments of the present disclosure.

[0060] Figure 20b This is a plan view showing a portion of the rear surface of a cover panel according to one or more embodiments of the present disclosure.

[0061] Figure 21 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'.

[0062] Figure 22 This is a perspective view showing a portion of the cover panel and a pen according to one or more embodiments of the present disclosure.

[0063] Figure 23 It is a graph depicting the inductance for each location according to one or more embodiments of the present disclosure.

[0064] Figure 24 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'.

[0065] Figure 25 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'.

[0066] Figure 26 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'.

[0067] Figure 27a This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0068] Figure 27b This is a rear perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0069] Figure 28 This is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0070] Figure 29 This is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0071] Figure 30 An input sensor according to one or more embodiments of the present disclosure is shown. Detailed Implementation

[0072] In the specification, the description that the first component (or area, layer, part, section, etc.) is "set on", "connected to", or "combined to" the second component means that the first component is directly set on / directly connected to / directly combined with the second component, or that the third component is placed between the first component and the second component.

[0073] The same reference numerals denote the same components. Furthermore, in the drawings, the thickness, scale, and / or dimensions of the components are exaggerated for the purpose of effectively describing the technical content. The expression "and / or" includes one or more combinations of the relevant components that can be defined.

[0074] Although the terms "first," "second," etc., can be used to describe various components, components should not be limited by the terms. Terms are used only to distinguish one component from another. For example, without departing from the spirit and scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless clearly indicated otherwise in the context, singular expressions include plural expressions.

[0075] Additionally, the terms "below," "under," "on," and "above" are used to describe the relationships between the components shown in the accompanying drawings. Conceptually relative terms are described based on the directions shown in the drawings.

[0076] It will be understood that the terms “comprising,” “including,” “having,” etc., indicate the presence of the features, quantities, steps, operations, elements and / or components or combinations thereof described in the specification, and do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements and / or components and / or combinations thereof.

[0077] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Furthermore, terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with the context of the relevant art, and should not be interpreted in an overly idealized or formalized sense unless explicitly defined herein.

[0078] Given the measurements discussed and the errors associated with the measurement of a particular quantity (e.g., limitations of the measurement system), the terms “about” or “approximately” as used herein include the stated value and mean within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations of the stated value, or within about ±30%, ±20%, ±10%, ±5% of the stated value.

[0079] In the description, for the purposes of its meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in a connecting or separating sense and can be understood as equivalent to "and / or". In the description, for the purposes of its meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one of..." selected from the group of... For example, "at least one of A and B" can be understood to mean "A, B, or A and B".

[0080] It will be understood by those skilled in the art that, in view of the entirety of this disclosure, each suitable feature of the various embodiments of this disclosure may be combined in part or in whole, or combined with one another, and may be technically interlocked and operated in a variety of suitable ways, and unless otherwise stated or implied, each embodiment may be implemented independently or in combination with one another in any suitable manner.

[0081] In the following description, one or more embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0082] Figure 1 This is a block diagram of an electronic device according to one or more embodiments of the present disclosure.

[0083] Reference Figure 1 The electronic device 1000 can output various types of information through the display panel DP within the operating system. When the main drive unit 1000C executes an application stored in the memory 1300, the display panel DP can provide application information to the user through the display layer 100. The main drive unit 1000C can be referred to as the main processor.

[0084] The main drive unit 1000C can acquire external input through the input module 1400 and execute the application corresponding to the external input. For example, when a user selects the camera icon displayed on the display layer 100, the main drive unit 1000C can acquire user input through the sensor layer 200 and the sensor drive unit 200C, and activate the camera module 1710. The main drive unit 1000C can transmit the image data corresponding to the captured image acquired by the camera module 1710 to the display panel DP. The display panel DP can display the image corresponding to the captured image through the display layer 100.

[0085] As another example, when performing personal information authentication on the display panel DP, the fingerprint sensor 1610 can acquire the input fingerprint information as input data. The main drive unit 1000C can compare the input data acquired by the fingerprint sensor 1610 with the authentication data stored in the memory 1300, and execute the application based on the comparison result. The display panel DP can display the information executed according to the application logic through the display layer 100.

[0086] As another example, when a music stream icon displayed on the display panel DP is selected, the main drive unit 1000C can acquire user input through the sensor layer 200 and the sensor drive unit 200C, and activate the music stream application stored in the memory 1300. When a music playback command is input from the music stream application, the main drive unit 1000C can activate the sound output module 1630 to provide the user with sound information corresponding to the music playback command.

[0087] The operation of the electronic device 1000 has been briefly described above. The construction of the electronic device 1000 will be described in detail below. Some of the components of the electronic device 1000 described below may be integrated and provided as a single component, or a single component may be provided as two or more separate components.

[0088] Electronic device 1000 can communicate with external electronic device 1001 via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to one or more embodiments, electronic device 1000 may include a main drive unit 1000C, a memory 1300, an input module 1400, a display panel DP, a power module 1500, an embedded module 1600, and an external module 1700. According to one or more embodiments, at least one of the above-mentioned components may be omitted from electronic device 1000, or one or more other components may be added. According to one or more embodiments, some of the above-mentioned components (e.g., fingerprint sensor 1610, antenna module 1620, and audio output module 1630) may be integrated into another component (e.g., display panel DP).

[0089] The main drive unit 1000C can execute software to control at least one other component (e.g., a hardware component or a software component) connected to the electronic device 1000 and process or calculate a wide variety of data. According to one or more embodiments, as at least part of the data processing or calculation, the main drive unit 1000C can store commands or data received from other components (e.g., input module 1400, fingerprint sensor 1610, or communication module 1730) in volatile memory 1310, can process the commands or data stored in volatile memory 1310, and can store the result data in non-volatile memory 1320.

[0090] The main drive unit 1000C may include a main processor 1100 and an auxiliary processor 1200. The main processor 1100 may include one or more of a central processing unit (CPU) 1110 and an application processor. The main processor 1100 may also include one or more of a graphics processing unit (GPU) 1120, a communication processor (CP), and an image signal processor (ISP). The main processor 1100 may also include a neural processing unit (NPU) 1130. The NPU 1130 may be a dedicated processor for processing artificial intelligence models and may generate artificial intelligence models through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, and combinations of two or more of these, but this disclosure is not limited to the examples described above. In addition to the hardware architecture, the artificial intelligence model may additionally or optionally include a software architecture. At least two of the aforementioned processing units and processors can be implemented as an integrated component (e.g., a single chip) or as independent components (e.g., multiple chips).

[0091] The auxiliary processor 1200 may include an image processor 1210, a data conversion circuit 1220, a gamma correction circuit 1230, and a rendering circuit 1240. The image processor 1210 can convert and output the data format of image data.

[0092] The data conversion circuit 1220 can receive image data from the drive controller driving the display layer 100 and can compensate the image data to display an image with the desired brightness according to the characteristics of the electronic device 1000 or user settings, or it can convert the image data to reduce power consumption or compensate for image retention. The gamma correction circuit 1230 can convert the image data and / or gamma reference voltage, etc., so that the image displayed on the electronic device 1000 has the desired gamma characteristics. The rendering circuit 1240 can receive image data from the drive controller and render the image data taking into account the pixel arrangement, etc., of the display layer 100 applied to the electronic device 1000. At least one of the data conversion circuit 1220, gamma correction circuit 1230, and rendering circuit 1240 can be integrated into another component (e.g., the main processor 1100 or the drive controller). At least one of the data conversion circuit 1220, gamma correction circuit 1230, and rendering circuit 1240 can be integrated into a data driver.

[0093] The memory 1300 may store a wide variety of data used by at least one component of the electronic device 1000 (e.g., the main drive unit 1000C) as well as input or output data for commands associated therewith. The memory 1300 may include at least one of volatile memory 1310 and non-volatile memory 1320.

[0094] The input module 1400 can receive commands or data from outside the electronic device 1000 (e.g., from a user or external electronic device 1001) to be used in components of the electronic device 1000 (e.g., the main drive unit 1000C, the sensor layer 200, and / or the sound output module 1630).

[0095] Input module 1400 may include a first input module 1410 and a second input module 1420. The first input module 1410 receives commands or data from the user, and the second input module 1420 receives commands or data from an external electronic device 1001. The first input module 1410 may include a microphone, mouse, keyboard (e.g., buttons), and / or pen (e.g., passive and / or active pen). The second input module 1420 may support specified protocols that allow wired and / or wireless connection to the external electronic device 1001. According to one or more embodiments, the second input module 1420 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The second input module 1420 may include connectors that can be physically connected to the external electronic device 1001, such as an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0096] Display panel DP can visually provide information to the user. Display panel DP may include display layer 100, sensor layer 200, and sensor driving unit 200C. Display panel DP may also include windows, base frames, and / or brackets for protecting display layer 100. Display panel DP may also include light-emitting driving circuitry and / or voltage generators.

[0097] The sensor layer 200 can generate data values ​​corresponding to the coordinate information of the user's body input or pen input. Changes in capacitance caused by input to the sensor layer 200 can be generated as data values. The sensor layer 200 can sense input from a passive pen, or transmit data to or receive data from an active pen.

[0098] Power module 1500 can supply power to components of electronic device 1000. Power module 1500 may include a battery charged with electrical voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell, etc. Power module 1500 may include a power management integrated circuit (PMIC). The PMIC can supply optimized power to the modules described above and below. The PMIC can provide optimized power to the components described above and below. Power module 1500 may include a wireless power transmission / reception component electrically connected to the battery. The wireless power transmission / reception component may include multiple coil-shaped antenna radiators.

[0099] The electronic device 1000 may also include an embedded module 1600 and an external module 1700. The embedded module 1600 may include a fingerprint sensor 1610, an antenna module 1620, and a voice output module 1630. The external module 1700 may include a camera module 1710, a lamp module 1720, and a communication module 1730.

[0100] The fingerprint sensor 1610 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 1610 can include any of the following: ultrasonic fingerprint sensor, optical fingerprint sensor, and capacitive fingerprint sensor.

[0101] Antenna module 1620 may include one or more antennas for transmitting or receiving signals or power to and / or from external sources. According to one or more embodiments, communication module 1730 may transmit or receive signals to or from external electronic device 1001 via antennas suitable for communication methods. The antenna pattern of antenna module 1620 may be integrated into a component of display panel DP (e.g., display layer 100 or sensor layer 200).

[0102] The sound output module 1630 is a device for outputting sound signals to the outside of the electronic device 1000, and may include, for example, a speaker for general purposes such as multimedia playback or recording playback and a receiver specifically for receiving calls. According to one or more embodiments, the receiver may be integrally formed with or separate from the speaker. The sound output mode of the sound output module 1630 may be integrated into a display panel (DP).

[0103] Camera module 1710 can capture still images and / or moving images. According to one or more embodiments, camera module 1710 may include one or more lenses, image sensors, or image signal processors. Camera module 1710 may also include an infrared camera that can measure the presence or absence of a user, the user's position, and / or the user's gaze, etc.

[0104] The lamp module 1720 can provide light. The lamp module 1720 may include a light-emitting diode and / or a xenon lamp. The lamp module 1720 can operate in conjunction with the camera module 1710 and / or independently of the camera module 1710.

[0105] Communication module 1730 can support the establishment of wired and / or wireless communication channels between electronic device 1000 and external electronic device 1001, and perform communication through the established communication channels. Communication module 1730 may include one or all of the following: wireless communication modules such as cellular communication modules, short-range wireless communication modules, or Global Navigation Satellite System (GNSS) communication modules; and wired communication modules such as local area network (LAN) and / or power line communication modules. Communication module 1730 can communicate with external electronic device 1001 via short-range communication networks such as Bluetooth, WiFi Direct, and / or Infrared Data Association (IrDA) and / or long-range communication networks such as cellular networks, the Internet, and / or computer networks (e.g., LAN or wide area network (WAN)). Various types of communication modules 1730 can be implemented as a single chip or as separate chips.

[0106] Embedded module 1600 and / or external module 1700, etc., can be used in conjunction with main drive unit 1000C to control the operation of display panel DP.

[0107] The main drive unit 1000C can output commands or data to the display layer 100, the sound output module 1630, the camera module 1710, and / or the lamp module 1720 based on input data received from the sensor layer 200. For example, the main drive unit 1000C can generate image data in response to input data applied via a mouse and / or pen, and output the generated image data to the display layer 100, and / or can generate command data in response to input data, and output the generated command data to the camera module 1710 or the lamp module 1720. When no input data is received from the input module 1400 for a certain period of time, the main drive unit 1000C can switch the operating mode of the electronic device 1000 to a low-power mode or a sleep mode to reduce the power consumed in the electronic device 1000.

[0108] Some of the components can be connected to each other via communication methods between peripheral devices (e.g., buses, general purpose input / output (GPIO), serial peripheral interfaces (SPI), mobile industrial processor interfaces (MIPI), or hyperpath interconnect (UPI) links) and can exchange signals (e.g., commands or data) between them. The main drive unit 1000C can communicate with the display panel DP via mutually matched interfaces, and for example, any of the above-described communication methods can be used, and this disclosure is not limited to the above-described communication methods.

[0109] The electronic device 1000 according to one or more embodiments disclosed in this disclosure can be of various types. The electronic device 1000 may include at least one of, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, and a home appliance. The electronic device 1000 according to one or more embodiments of this disclosure is not limited to the devices described above.

[0110] Figure 2 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0111] Reference Figure 2 The electronic device 1000 can sense the input of the input device PN. The electronic device 1000 can be a device activated by an electrical signal. For example, the electronic device 1000 can be a mobile phone, tablet computer, car navigation system, game console, and / or wearable device, but this disclosure is not limited thereto. As an example, Figure 2 The electronic device 1000 shown is a mobile phone.

[0112] The effective area DA and the peripheral area NDA can be defined in the electronic device 1000.

[0113] The effective area DA may include a plane defined by a first direction DR1 and a second direction DR2. The electronic device 1000 can display an image IM on a third direction DR3 intersecting the first and second directions DR1 and DR2 via the effective area DA. A sensing area SA may be defined within the effective area DA. The electronic device 1000 can identify a user's biometric information via the sensing area SA.

[0114] The peripheral region NDA can be located around the periphery of the effective region DA (e.g., it can surround the periphery of the effective region DA).

[0115] The electronic device 1000 can sense inputs applied from outside the electronic device 1000. Externally applied inputs can include various types of external inputs (such as a part of the user's body, light, heat, or pressure). Externally applied inputs can be referred to as secondary inputs.

[0116] Figure 2 The electronic device 1000 shown can sense input from a user's touch and input from an input device PN. The input device PN can mean a device other than the user's body. The input from the input device PN can be referred to as the first input. For example, the input device PN can be an active electrostatic (AES) pen, an electromagnetic resonant (EMR) pen, a stylus, a touch pen, or an electronic pen. In the following description, as an example, the case where the input device PN is an EMR pen will be described. The input device PN can be referred to as the pen PN.

[0117] Figure 3 This is a schematic cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0118] Reference Figure 3 The electronic device 1000 may include a window WP, multiple adhesive layers OCA1, OCA2 and OCA, an anti-reflective layer POL, a display panel DP, a protective film PF, and a cover panel CP. For ease of description, Figure 3 The adhesive layer OCA is shown to be included in the cover panel CP.

[0119] The window WP can form the exterior of the electronic device 1000. The window WP can protect the internal components of the electronic device 1000 from external impacts and can essentially provide the effective area DA of the electronic device 1000 (see...). Figure 2 For example, a window WP may include a glass substrate, a sapphire substrate, and / or a plastic film. A window WP may have a multi-layered or single-layered structure. For example, a window WP may have a laminated structure of multiple plastic films bonded together with adhesive, or a laminated structure of a glass substrate and a plastic film bonded together with adhesive.

[0120] The first adhesive layer OCA1 can be disposed below the window WP. The window WP and the anti-reflective layer POL can be bonded to each other through the first adhesive layer OCA1. The first adhesive layer OCA1 may include conventional adhesives and / or adhesives. For example, the first adhesive layer OCA1 may be an optically transparent adhesive film, an optically transparent resin, and / or a pressure-sensitive adhesive film.

[0121] An anti-reflective layer (POL) can be installed below the window WP. The POL reduces the reflectivity of natural light (or sunlight) entering from the top of the window WP.

[0122] The antireflective layer POL according to one or more embodiments of this disclosure may include a retarder and / or a polarizer. The retarder may be film-type and / or liquid crystal coated type, and may include λ / 2 retarders and / or λ / 4 retarders. The polarizer may be film-type and / or liquid crystal coated type. The film-type may include a stretchable synthetic resin film, and the liquid crystal coated type may include liquid crystals arranged in a suitable form (e.g., a predetermined form). The retarder and polarizer may also include a protective film. The retarder and polarizer themselves or the protective film may be defined as a substrate layer of the antireflective layer POL.

[0123] The second adhesive layer OCA2 can be disposed below the anti-reflective layer POL. The anti-reflective layer POL and the display panel DP can be bonded to each other through the second adhesive layer OCA2. The second adhesive layer OCA2 may contain material substantially the same as that of the first adhesive layer OCA1.

[0124] The display panel DP may include a display layer 100 and a sensor layer 200.

[0125] Sensor layer 200 can be positioned below the anti-reflective layer POL. Sensor layer 200 can acquire coordinate information from external input. Sensor layer 200 can sense the input device PN (see...). Figure 2 The sensor layer 200 according to one or more embodiments of the present disclosure can be directly disposed on a surface of the display layer 100. For example, the sensor layer 200 can be integrally formed with the display layer 100 in an on-cell manner. The sensor layer 200 can be manufactured together with the display layer 100 using a continuous process. However, the present disclosure is not limited thereto, and the sensor layer 200 can be manufactured and adhered to the display layer 100 using a separate process.

[0126] Display layer 100 can be positioned below sensor layer 200. Display layer 100 can essentially generate image IM (see...). Figure 2 Display layer 100 may be a light-emitting display layer, but this disclosure is not particularly limited thereto. For example, display layer 100 may include an organic light-emitting display layer, a quantum dot display layer, a micro light-emitting diode (LED) display layer, or a nano LED display layer. The light-emitting layer of an organic light-emitting display layer may include organic light-emitting materials. The light-emitting layer of a quantum dot display layer may include quantum dots and / or quantum rods. The light-emitting layer of a micro LED display layer may include micro LEDs. The light-emitting layer of a nano LED display layer may include nano LEDs.

[0127] The protective film PF can be disposed below the display panel DP. The protective film PF can protect the lower surface of the display layer 100. The protective film PF may include polyethylene terephthalate (PET). However, the material of the protective film PF is not particularly limited to this.

[0128] The cover panel CP can be disposed under the protective film PF. The cover panel CP may include an adhesive layer OCA, a padding layer CSH, a magnetic layer FS, and a conductive layer CU.

[0129] The adhesive layer OCA can adhere the padding layer CSH and the protective film PF. The adhesive layer OCA can include conventional adhesives and / or adhesives. For example, the adhesive layer OCA can be an optically clear adhesive film, an optically clear resin, and / or a pressure-sensitive adhesive film.

[0130] The padding layer CSH can be disposed below the adhesive layer OCA. The padding layer CSH may include embossed sheets and gaskets. The magnetic layer FS can be disposed below the padding layer CSH. The conductive layer CU can be disposed below the magnetic layer FS. The following is a description of the construction of the cover panel CP.

[0131] Figure 4 This is a schematic cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0132] Reference Figure 4 The display panel DP may include a display layer 100 and a sensor layer 200.

[0133] The display layer 100 may include a substrate layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0134] The substrate layer 110 may be a component providing a substrate surface on which the circuit layer 120 is disposed. The substrate layer 110 may have a multilayer structure or a single-layer structure. The substrate layer 110 may be a glass substrate, a metal substrate, a silicon substrate, and / or a polymer substrate, etc., but this disclosure is not limited thereto.

[0135] Circuit layer 120 may be disposed on substrate layer 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and / or signal lines, etc. Insulating layers, semiconductor layers, and conductive layers are formed on substrate layer 110 by means such as coating and / or deposition, and the insulating layers, semiconductor layers, and conductive layers can be selectively patterned by multiple photolithography processes.

[0136] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro LEDs and / or nano LEDs.

[0137] An encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from moisture, oxygen and / or foreign matter such as dust particles.

[0138] Sensor layer 200 may be disposed on display layer 100. Sensor layer 200 can sense external input applied from external units. Sensor layer 200 may be an integrated sensor formed continuously during the manufacturing process of display layer 100, or sensor layer 200 may be an external sensor attached to display layer 100. Sensor layer 200 may be referred to as a sensor, input sensing layer, input sensing panel, and / or electronic device for sensing input coordinates, etc.

[0139] According to one or more embodiments of this disclosure, sensor layer 200 can sense passive input devices (such as a user's body) and input device PN that generates a magnetic field with a suitable resonant frequency (e.g., a predetermined resonant frequency) (see [link to relevant documentation]). Figure 2 The inputs are both.

[0140] Figure 5 This is a view illustrating the operation of an electronic device according to one or more embodiments of the present disclosure.

[0141] Reference Figure 5 The electronic device 1000 may include a display layer 100, a sensor layer 200, a display driving unit 100C, a sensor driving unit 200C, a main driving unit 1000C, and a power circuit 1000P.

[0142] Sensor layer 200 can sense a first input 2000 and / or a second input 3000 applied from an external unit. The first input 2000 and the second input 3000 can be input devices that can provide changes in the capacitance of sensor layer 200 and / or input devices that can induce current in sensor layer 200. For example, the first input 2000 can be a passive input device (such as a user's body). The second input 3000 can be an input to a pen PN or an input to a radio frequency integrated circuit (RFIC) tag. For example, the pen PN can be a passive pen or an active pen.

[0143] In one or more embodiments of this disclosure, the pen PN can be a device for generating a magnetic field with a suitable resonant frequency (e.g., a predetermined resonant frequency). The pen PN can be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus, and / or an electromagnetic resonant pen.

[0144] The PN can include an RLC resonant circuit, and the RLC resonant circuit can include an inductor L and a capacitor C. In one or more embodiments of this disclosure, the RLC resonant circuit can be a variable resonant circuit with a variable resonant frequency. In this case, the inductor L can be a variable inductor and / or the capacitor C can be a variable capacitor, but this disclosure is not limited thereto.

[0145] Inductor L generates current through a magnetic field formed in sensor layer 200. However, this disclosure is not particularly limited thereto. For example, when pen PN operates in an active mode, it can generate current even when it does not receive a magnetic field from an external unit. The generated current is transferred to capacitor C. Capacitor C is charged with the current input from inductor L and releases the charged current back to inductor L. Thereafter, inductor L can emit a magnetic field with a resonant frequency. The induced current can flow in sensor layer 200 through the magnetic field emitted by pen PN, and the induced current can be transmitted to sensor drive unit 200C as a received signal (or sensing signal).

[0146] The main drive unit 1000C can control the overall operation of the electronic device 1000. For example, the main drive unit 1000C can control the operation of the display drive unit 100C and the sensor drive unit 200C. The main drive unit 1000C may include at least one microprocessor and may also include a graphics controller. The main drive unit 1000C may be referred to as an application processor, a central processing unit (CPU), or a main processor.

[0147] The display driving unit 100C can drive the display layer 100. The display driving unit 100C can receive image data and control signals from the main driving unit 1000C. The control signals can include various signals. For example, the control signals can include input vertical synchronization signals, input horizontal synchronization signals, master clock and / or data enable signals, etc.

[0148] The sensor driving unit 200C can drive the sensor layer 200. The sensor driving unit 200C can receive control signals from the main driving unit 1000C. The control signals may include a clock signal of the sensor driving unit 200C. In addition, the control signals may also include a mode determination signal that determines the driving mode of the sensor driving unit 200C and the sensor layer 200.

[0149] The sensor driving unit 200C can be implemented as an integrated circuit (IC) and electrically connected to the sensor layer 200. For example, the sensor driving unit 200C can be directly mounted on a suitable area (e.g., a predetermined area) of the display panel, or mounted on a separate printed circuit board (PCB) using a chip-on-film (COF) method and electrically connected to the sensor layer 200.

[0150] The sensor driving unit 200C and the sensor layer 200 can selectively operate in a first mode and / or a second mode. For example, the first mode may be a mode for sensing touch input (e.g., first input 2000). The second mode may be a mode for sensing input from the pen PN (e.g., second input 3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0151] Switching between the first mode and the second mode can be performed in various ways. For example, the sensor driving unit 200C and the sensor layer 200 can be driven in a time-division manner in the first mode and the second mode, and can sense the first input 2000 and the second input 3000. Optionally, the switching between the first mode and the second mode can be generated by user selection or by a specific user action. Either the first mode or the second mode can be activated or deactivated by activating or deactivating a specific application, or the current mode can be switched from one of the first mode and the second mode to the other. Optionally, when the sensor driving unit 200C and the sensor layer 200 operate alternately in the first mode and the second mode, the first mode is maintained when the first input 2000 is sensed, or the second mode is maintained when the second input 3000 is sensed.

[0152] The sensor driving unit 200C can calculate the input coordinate information based on the signal received from the sensor layer 200, and provide the coordinate signal containing the coordinate information to the main driving unit 1000C. The main driving unit 1000C performs an operation corresponding to the user's input based on the coordinate signal. For example, the main driving unit 1000C can operate the display driving unit 100C so that a new application image is displayed on the display layer 100.

[0153] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P can generate multiple driving voltages for driving the display layer 100, sensor layer 200, display driving unit 100C, and sensor driving unit 200C. For example, the multiple driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage (e.g., ELVSS voltage), a second driving voltage (e.g., ELVDD voltage), and / or an initialization voltage, etc., but this disclosure is not particularly limited to the above examples. The power circuit 1000P may be included in the power module 1500 (see...). Figure 1 )middle.

[0154] Figure 6 It is according to one or more embodiments of this disclosure along Figure 2 A cross-sectional view of the display panel taken by line I-I'. Figure 6 In the description, through Figure 4 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0155] Reference Figure 6At least one buffer layer BFL is formed on the upper surface of the substrate layer 110. The buffer layer BFL can improve the adhesion between the substrate layer 110 and the semiconductor pattern. The buffer layer BFL can be formed as multiple layers. Alternatively, the display layer 100 may also include a barrier layer. The buffer layer BFL may include silicon oxide, silicon nitride, and / or silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0156] Semiconductor patterns SC, AL, DR, and SCL can be disposed on the buffer layer BFL. The semiconductor patterns SC, AL, DR, and SCL can include polycrystalline silicon. However, this disclosure is not limited thereto, and the semiconductor patterns SC, AL, DR, and SCL can also include amorphous silicon, low-temperature polycrystalline silicon, and / or oxide semiconductors.

[0157] Figure 6 Some of the semiconductor patterns SC, AL, DR, and SCL are shown, and semiconductor patterns can also be arranged in other regions. The semiconductor patterns SC, AL, DR, and SCL can be arranged across (multiple) pixels according to a specific rule. The semiconductor patterns SC, AL, DR, and SCL can have different electrical properties depending on whether they are doped. The semiconductor patterns SC, AL, DR, and SCL can include a first region SC, DR, and SCL with high conductivity and a second region AL with low conductivity. The first region SC, DR, and SCL can be doped with N-type or P-type dopant. A P-type transistor can include a doped region doped with P-type dopant, and an N-type transistor can include a doped region doped with N-type dopant. The second region AL can be an undoped region or a region doped at a lower concentration than the first region.

[0158] The conductivity of the first regions SC, DR, and SCL can be greater than that of the second region AL, and the first regions SC, DR, and SCL can be essentially used as electrodes or signal lines. The second region AL can essentially correspond to the active region AL (or channel) of transistor 100PC. In other words, some of the ALs in the semiconductor patterns SC, AL, DR, and SCL can be the active region AL of transistor 100PC, the other semiconductor patterns SC and DR in the semiconductor patterns SC, AL, DR, and SCL can be the source region SC or drain region DR of transistor 100PC, and the other semiconductor pattern SCL in the semiconductor patterns SC, AL, DR, and SCL can be a connecting electrode or a connecting signal line SCL.

[0159] Each pixel can have an equivalent circuit comprising seven transistors, a capacitor, and a light-emitting element, and the equivalent circuit of a pixel can be modified in various forms. As an example, Figure 6The image shows a transistor 100PC and a light-emitting element 100PE included in a pixel.

[0160] The source region SC, active region AL, and drain region DR of transistor 100PC can be formed by semiconductor patterns SC, AL, DR, and SCL. The source region SC and drain region DR can extend from the active region AL in opposite directions in the cross-section. Figure 6 A portion of the connection signal line SCL, formed by semiconductor patterns SC, AL, DR, and SCL, is shown. In one or more embodiments, the connection signal line SCL may be connected in a plane to the drain region DR of transistor 100PC.

[0161] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may be commonly stacked with multiple pixels and cover semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In one or more embodiments, the first insulating layer 10 may be a single-layer silicon oxide layer. The insulating layers of the first insulating layer 10 and the circuit layer 120 described below, excluding the first insulating layer 10, may be inorganic layers and / or organic layers, and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above-described materials, but this disclosure is not limited thereto.

[0162] The gate GT of transistor 100PC is disposed on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT is stacked with the active region AL on a third-direction DR3 (e.g., the thickness direction of the substrate layer 110). In the process of doping or reducing the semiconductor patterns SC, AL, DR, and SCL, the gate GT may be used as a mask.

[0163] The second insulating layer 20 may be disposed on the first insulating layer 10 and cover the gate GT. The second insulating layer 20 may be stacked commonly with (multiple) pixels. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The second insulating layer 20 may include silicon oxide, silicon nitride, and / or silicon oxynitride. In one or more embodiments, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0164] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0165] The first connection electrode CNE1 can be disposed on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through the contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0166] The fourth insulating layer 40 may be disposed on the third insulating layer 30 and cover the first connecting electrode CNE1. The fourth insulating layer 40 may be a single layer of silicon oxide. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0167] The second connecting electrode CNE2 can be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0168] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 to cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0169] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro-LEDs and / or nano-LEDs. In the following description, it will be stated that the light-emitting element 100PE is an organic light-emitting element, but this disclosure is not particularly limited thereto.

[0170] The light-emitting element 100PE may include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0171] The first electrode AE ​​can be disposed on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 passing through the sixth insulating layer 60.

[0172] A pixel defining film 70 may be disposed on a sixth insulating layer 60 and cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.

[0173] Effective region DA (see) Figure 1 The electrode may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA (e.g., it may surround the light-emitting region PXA). In one or more embodiments, the light-emitting region PXA is defined to correspond to the portion of the first electrode AE ​​exposed by the opening 70-OP.

[0174] The light-emitting layer EL can be disposed on the first electrode AE. The light-emitting layer EL can be disposed in the region corresponding to the opening 70-OP. That is, the light-emitting layer EL can be formed separately for each pixel. When the light-emitting layer EL is formed separately for each pixel, each of the light-emitting layer EL can emit light having at least one of blue, red, and green. However, this disclosure is not limited thereto, and the light-emitting layer EL can be connected to the pixel and can be commonly included in the pixel. In this case, the light-emitting layer EL can also provide blue light or white light.

[0175] The second electrode CE can be disposed on the light-emitting layer EL. The second electrode CE can have a monolithic shape and can be commonly included in multiple pixels.

[0176] In one or more embodiments of this disclosure, a hole control layer may be disposed between the first electrode AE ​​and the light-emitting layer EL. The hole control layer may be commonly disposed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in multiple pixels using an aperture mask or an inkjet process.

[0177] An encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include sequentially stacked inorganic layers, organic layers, and inorganic layers, and the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light-emitting element layer 130 from moisture and / or oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer, etc. The organic layer may include an acrylic organic layer; however, this disclosure is not limited thereto.

[0178] The sensor layer 200 may include an insulating substrate layer 201, a first conductive layer 202, a sensing insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0179] The insulating substrate layer 201 may be an inorganic layer comprising silicon nitride, silicon oxynitride, and / or silicon oxide. Alternatively, the insulating substrate layer 201 may be an organic layer comprising epoxy resin, acrylic resin, and / or imide resin. The insulating substrate layer 201 may have a single-layer structure or a multilayer structure in which the middle layer is stacked on a third-direction DR3.

[0180] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure in which the layers are stacked on a third-direction DR3.

[0181] Each of the first conductive layer 202 and the second conductive layer 204, having a monolayer structure, may include a metal layer and / or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and / or alloys thereof. The transparent conductive layer may include a transparent conductive oxide (such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and / or indium zinc tin oxide (IZTO)). Furthermore, the transparent conductive layer may include conductive polymers such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, and / or graphene, etc.

[0182] Each of the first conductive layer 202 and the second conductive layer 204, which have a multilayer structure, may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The conductive layer with a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0183] At least one of the sensing insulating layer 203 and the cover insulating layer 205 may include an inorganic film. The inorganic film may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide and / or hafnium oxide.

[0184] At least one of the sensing insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include acrylic resins, methacrylate resins, polyisoprene resins, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and / or perylene resins.

[0185] Figure 7 This is a plan view of a sensor layer according to one or more embodiments of the present disclosure, and Figure 8 This is an enlarged plan view illustrating a sensing unit according to one or more embodiments of the present disclosure. Figure 9a This is a plan view illustrating the first conductive layer of a sensing unit according to one or more embodiments of the present disclosure. Figure 9b This is a plan view illustrating the second conductive layer of a sensing unit according to one or more embodiments of the present disclosure, and Figure 9c It is along Figure 9a and Figure 9b The image shows a cross-sectional view of the sensor layer taken by line III-III'.

[0186] Reference Figures 7 to 9c An effective region 200A and an adjacent peripheral region 200NA can be defined in the sensor layer 200.

[0187] Multiple sensing units SU arranged in the effective area 200A can be defined in the sensor layer 200. The multiple sensing units SU can be arranged along the first direction DR1 and the second direction DR2.

[0188] The sensor layer 200 may include a plurality of first electrodes 210, a plurality of second electrodes 220, a plurality of third electrodes 230 and a plurality of fourth electrodes 240.

[0189] The plurality of first electrodes 210 may intersect with the plurality of second electrodes 220. Each of the plurality of first electrodes 210 may extend in a second direction DR2. The plurality of first electrodes 210 may be spaced apart from each other in a first direction DR1 (e.g., spaced apart).

[0190] Each of the plurality of second electrodes 220 may extend in the first direction DR1. The plurality of second electrodes 220 may be arranged to be spaced apart from each other in the second direction DR2.

[0191] The sensing unit SU of the sensor layer 200 can be a region in which a first electrode 210 and a second electrode 220 intersect each other.

[0192] The sensing unit SU may include one of a plurality of first electrodes 210, one of a plurality of second electrodes 220, one of a plurality of third electrodes 230, and one of a plurality of fourth electrodes 240.

[0193] Each of the first electrodes 210 may include first segmented electrodes 210dv1 and 210dv2. The first segmented electrodes 210dv1 and 210dv2 may extend in a second direction DR2 and may be spaced apart from each other in a first direction DR1 (e.g., spaced apart). The first segmented electrodes 210dv1 and 210dv2 may have a shape that is line-symmetrical with respect to the line extending in the second direction DR2.

[0194] Each of the second electrodes 220 may include second segmented electrodes 220dv1 and 220dv2. The second electrodes 220 may extend in a first direction DR1 and may be spaced apart from each other in a second direction DR2 (e.g., spaced apart). The second segmented electrodes 220dv1 and 220dv2 may have a shape that is linearly symmetrical with respect to the line extending in the first direction DR1.

[0195] Each of the second segmented electrodes 220dv1 and 220dv2 may include a sensing pattern 221 and a bridging pattern 222. The sensing pattern 221 and the bridging pattern 222 may be disposed on different layers and may be electrically connected to each other via a first contact CNA. For example, the bridging pattern 222 may be included in a first conductive layer 202SU, and the sensing pattern 221 and the first segmented electrodes 210dv1 and 210dv2 may be included in a second conductive layer 204SU. The first conductive layer 202SU may be included in... Figure 6 The first conductive layer 202, and the second conductive layer 204SU may be included in the ... second conductive layer 204SU. Figure 6 In the second conductive layer 204.

[0196] Each of the third electrodes 230 may extend in the second direction DR2, and the third electrodes 230 may be spaced apart from each other in the first direction DR1 (e.g., spaced apart). In one or more embodiments of this disclosure, each of the third electrodes 230 may include a plurality of first auxiliary electrodes 230s connected in parallel with each other. Various modifications can be made to the number of first auxiliary electrodes 230s included in each of the third electrodes 230. For example, as the number of first auxiliary electrodes 230s included in each of the third electrodes 230 increases, the resistance of each of the third electrodes 230 decreases, thus improving power efficiency and sensing sensitivity. Conversely, as the number of first auxiliary electrodes 230s included in each of the third electrodes 230 decreases, the loop coil pattern formed using the third electrodes 230 can be implemented in more diverse forms.

[0197] As an example, Figure 7 A third electrode 230 is shown comprising two first auxiliary electrodes 230s, but this disclosure is not particularly limited thereto. The first auxiliary electrodes 230s may be arranged in a one-to-one correspondence with the first electrodes 210. Therefore, a sensing unit SU may include a portion of one of the first auxiliary electrodes 230s.

[0198] A coupling capacitor can be defined between a first electrode 210 and a first auxiliary electrode 230s. In this case, the induced current generated during pen sensing can be transmitted from the first auxiliary electrode 230s to the first electrode 210 through the coupling capacitor. That is, the first auxiliary electrode 230s can be used to supplement the signal transmitted from the first electrode 210 to the sensor driving unit 200C. Therefore, the maximum effect can be obtained when the phase of the signal induced in the first auxiliary electrode 230s and the phase of the signal induced in the first electrode 210 are in sync. Therefore, the center of each of the first electrodes 210 in the second direction DR2 and the center of each of the first auxiliary electrodes 230s in the second direction DR2 can be superimposed on each other. Furthermore, the center of each of the first electrodes 210 in the first direction DR1 and the center of each of the first auxiliary electrodes 230s in the first direction DR1 can also be superimposed on each other.

[0199] In one or more embodiments of this disclosure, because a third electrode 230 includes two first auxiliary electrodes 230s, one third electrode 230 can correspond to (or be stacked) two first electrodes 210. Therefore, the number of first electrodes 210 included in the sensor layer 200 can be greater than the number of third electrodes 230. For example, the number of first electrodes 210 can be the same as the product of the number of third electrodes 230 included in the sensor layer 200 and the number of first auxiliary electrodes 230s included in each of the third electrodes 230. For example, in Figure 7 In this configuration, the number of first electrodes 210 can be six, the number of third electrodes 230 can be three, and the number of first auxiliary electrodes 230s included in each of the third electrodes 230 can be two.

[0200] The fourth electrode 240 may be arranged along the second direction DR2, and the fourth electrode 240 may extend along the first direction DR1. In one or more embodiments of this disclosure, each of the fourth electrodes 240 may include a second auxiliary electrode 240s1 or 240s2 connected in parallel with each other. The second auxiliary electrode 240s1 or 240s2 may be referred to as the second-1 auxiliary electrode 240s1 or the second-2 auxiliary electrode 240s2.

[0201] The circuit directions of the second auxiliary electrode 240s1 and the second auxiliary electrode 240s2 can be different from each other. As an example, Figure 7 Two fourth electrodes 240 are shown, and five second auxiliary electrodes 240s1 or 240s2 are included in each of the fourth electrodes 240.

[0202] In this specification, terms indicating different line directions mean that the connection positions between the electrodes and traces are different from each other. For example, the first connection position of the fourth trace 240t-1 electrically connected to the second auxiliary electrode 240s1 and the second connection position of the fourth trace 240t-2 electrically connected to the second auxiliary electrode 240s2 can be different from each other. The first connection position can be the leftmost end relative to the second auxiliary electrode 240s1, and the second connection position can be the rightmost end of the second auxiliary electrode 240s2.

[0203] In one or more embodiments of this disclosure, the sensor layer 200 may include a fourth electrode 240. In this case, the fourth electrode may include ten second auxiliary electrodes 240s1 or 240s2 connected in parallel with each other. The number of second auxiliary electrodes 240s1 or 240s2 is only... Figure 7 As shown in the figure, the number of second auxiliary electrodes 240s1 or 240s2 included in the fourth electrode is not limited to the examples described above.

[0204] As an example, Figure 7 Five second auxiliary electrodes 240s1 are shown to be electrically connected to each other, and five second auxiliary electrodes 240s2 are shown to be electrically connected to each other. That is, the area ratio of the two fourth electrodes 240 or the ratio of the number of second auxiliary electrodes included in each of the two fourth electrodes 240 can be a 1:1 ratio. However, this disclosure is not particularly limited thereto. For example, the number of second auxiliary electrodes 240s1 and the number of second auxiliary electrodes 240s2 can be different from each other.

[0205] In one or more embodiments of this disclosure, the area of ​​a fourth electrode can be increased when each of the fourth electrodes 240 includes a second auxiliary electrode 240s1 or 240s2 connected in parallel with each other. Furthermore, the resistance of each of the fourth electrodes 240 can be reduced, thereby improving the resistance to the second input 3000 (see...). Figure 6 ) sensing sensitivity.

[0206] A coupling capacitor can be defined between a second electrode 220 and a second auxiliary electrode 240s1. In this case, the induced current generated during pen sensing can be transmitted from the second auxiliary electrode 240s1 to the second electrode 220 through the coupling capacitor. That is, the second auxiliary electrode 240s1 can be used to supplement the signal transmitted from the second electrode 220 to the sensor driving unit 200C. Therefore, the maximum effect can be obtained when the phase of the signal induced in the second auxiliary electrode 240s1 and the phase of the signal induced in the second electrode 220 are consistent with each other. Therefore, the center of each of the second electrodes 220 in the first direction DR1 and the center of each of the second auxiliary electrodes 240s1 in the first direction DR1 can be superimposed on each other. Furthermore, the center of each of the second electrodes 220 in the second direction DR2 and the center of each of the second auxiliary electrodes 240s1 in the second direction DR2 can also be superimposed on each other.

[0207] Each of the first auxiliary electrodes 230s included in the third electrode 230 may include a third-first pattern 231 and a third-second pattern 232. The third-first pattern 231 and the third-second pattern 232 may be arranged in different layers, and the third-first pattern 231 and the third-second pattern 232 may be electrically connected to each other via a second contact CNb. The third-first pattern 231 may be included in the first conductive layer 202SU, and the third-second pattern 232 may be included in the second conductive layer 204SU.

[0208] In one or more embodiments of this disclosure, a portion of the third-1 pattern 231 may be superimposed with a portion of each of the first segmented electrodes 210dv1 and 210dv2. Therefore, a coupling capacitor may be provided (or formed) between the first electrode 210 and the third electrode 230.

[0209] Each of the second auxiliary electrodes 240s1 or 240s2 included in the fourth electrode 240 may include a 4-1 pattern 241, a 4-2 pattern 242, and a 4-3 pattern 243. The 4-2 pattern 242 and the 4-3 pattern 243 may be arranged in the same layer (e.g., arranged in the same layer), and the 4-1 pattern 241 may be disposed in a different layer than the 4-2 pattern 242 and the 4-3 pattern 243. The 4-1 pattern 241 and the 4-2 pattern 242 may be electrically connected to each other via a third contact CNc, and the 4-1 pattern 241 and the 4-3 pattern 243 may be electrically connected to each other via a fourth contact CNd. The 4-2 pattern 242 and the 4-3 pattern 243 may be included in a first conductive layer 202SU, and the 4-1 pattern 241 may be included in a second conductive layer 204SU.

[0210] In one or more embodiments of this disclosure, a portion of the fourth-2 pattern 242 may be superimposed with the sensing pattern 221 of each of the second segmented electrodes 220dv1 and 220dv2. Therefore, a coupling capacitor may be provided (or formed) between the second electrode 220 and the fourth electrode 240.

[0211] In one or more embodiments of this disclosure, the first conductive layer 202SU may further include dummy patterns DMP. Each of the dummy patterns DMP may be electrically floating or electrically grounded. In one or more embodiments of this disclosure, the dummy patterns DMP may be omitted.

[0212] The sensor layer 200 may also include multiple first traces 210t arranged in the peripheral region 200NA, multiple first pads ("pads", also known as "solder pads" or "solder pads") PD1 connected to the first traces 210t in a one-to-one correspondence, multiple second traces 220t, and multiple second pads PD2 connected to the second traces 220t in a one-to-one correspondence.

[0213] The first traces 210t can be electrically connected to the first electrode 210 in a one-to-one correspondence. Two first segmented electrodes 210dv1 and 210dv2, included in one first electrode 210, can be connected to one of the first traces 210t. Each of the first traces 210t can include multiple branches for connecting to the two first segmented electrodes 210dv1 and 210dv2. In one or more embodiments of this disclosure, the two first segmented electrodes 210dv1 and 210dv2 can be connected to each other within the effective region 200A.

[0214] The second traces 220t can be electrically connected to the second electrodes 220 in a one-to-one correspondence. Two second segmented electrodes 220dv1 and 220dv2, included in one second electrode 220, can be connected to one of the second traces 220t. Each of the second traces 220t can include multiple branches for connecting to the two second segmented electrodes 220dv1 and 220dv2. In one or more embodiments of this disclosure, the two second segmented electrodes 220dv1 and 220dv2 can be connected to each other within the effective region 200A.

[0215] The sensor layer 200 may also include a third trace 230rt1 disposed in the peripheral region 200NA, a plurality of third pads PD3 connected to one end and the other end of the third trace 230rt1, fourth traces 240t-1 and 240t-2, fourth pads PD4 connected to the fourth traces 240t-1 and 240t-2 in a one-to-one correspondence, a fifth trace 230rt2, and a fifth pad PD5 connected to the fifth trace 230rt2 in a one-to-one correspondence.

[0216] The third trace 230rt1 may be electrically connected to at least one of the first auxiliary electrodes 230s. In one or more embodiments of this disclosure, the third trace 230rt1 may be electrically connected to all the first auxiliary electrodes 230s. That is, the third trace 230rt1 may be electrically connected to all the third electrodes 230s. The third trace 230rt1 may include a first line portion 231t extending in a first direction DR1 and electrically connected to the third electrode 230, a second line portion 232t extending in a second direction DR2 from a first end of the first line portion 231t, and a third line portion 233t extending in a second direction DR2 from a second end of the first line portion 231t.

[0217] In one or more embodiments of this disclosure, each of the resistances of the second wire portion 232t and the third wire portion 233t can be substantially the same as the resistance of one of the third electrodes 230. Therefore, the second wire portion 232t and the third wire portion 233t can be used as the third electrode 230, and the same effect as if the third electrode 230 were also arranged in the peripheral region 200NA can be achieved. For example, either the second wire portion 232t or the third wire portion 233t can form a coil with any of the third electrodes 230. Therefore, a pen located in a region adjacent to the peripheral region 200NA can also be fully charged through a loop including the second wire portion 232t or the third wire portion 233t.

[0218] In one or more embodiments of this disclosure, the width of each of the second line portion 232t and the third line portion 233t in the first direction DR1 can be adjusted to adjust the resistance of the second line portion 232t and the third line portion 233t. However, this is merely an example, and the first line portion 231t, the second line portion 232t, and the third line portion 233t may have substantially the same width.

[0219] The fifth trace 230rt2 can be connected one-to-one with the third electrode 230. That is, the number of fifth traces 230rt2 can correspond to the number of third electrodes 230. As an example, Figure 7 Three fifth traces 230rt2 are shown.

[0220] In one or more embodiments of this disclosure, the fifth trace 230rt2 and the fifth pad PD5 may be omitted, as may the charging drive mode for charging the pen. In this case, the sensor layer 200 can sense input from an active pen capable of emitting a magnetic field even when no magnetic field is provided from the sensor layer 200.

[0221] The fourth traces 240t-1 and 240t-2 may be spaced apart from each other (e.g., spaced apart), and the effective region 200A is located between the fourth traces 240t-1 and 240t-2. The fourth trace 240t-1 may be electrically connected to at least one of the second auxiliary electrodes 240s1. For example, one end of each of the second auxiliary electrodes 240s1 may be connected to the fourth trace 240t-1. The fourth trace 240t-2 may be electrically connected to at least one of the second auxiliary electrodes 240s2. For example, one end of each of the second auxiliary electrodes 240s2 may be connected to the fourth trace 240t-2.

[0222] Figure 10a This is a plan view illustrating the first conductive layer of a sensing unit according to one or more embodiments of the present disclosure. Figure 10b This is a plan view illustrating the second conductive layer of a sensing unit according to one or more embodiments of the present disclosure, and Figure 10c It is according to one or more embodiments of this disclosure along Figure 10a and Figure 10b The cross-sectional view of the sensor layer shown is taken along line A-A'.

[0223] Reference Figure 8 , Figure 10a , Figure 10b and Figure 10c Each of the first electrodes 210 may include a plurality of first sensing patterns 211 and a plurality of first bridging patterns 212. The first sensing patterns 211 may be spaced apart from each other in the second direction DR2 (e.g., spaced apart), and the first bridging patterns 212 may extend in the second direction DR2 and may be electrically connected to the first sensing patterns 211 via first contacts CNa1. As an example, Figure 10a and Figure 10b Two adjacent first sensing patterns 211 are shown to be electrically connected to each other via two first bridging patterns 212, but this disclosure is not particularly limited thereto. For example, two adjacent first sensing patterns 211 may be electrically connected to each other via one first bridging pattern 212, or via three or more first bridging patterns 212.

[0224] The first sensing patterns 211 adjacent to each other in the second direction DR2 may be spaced apart (e.g., spaced apart), and the first dividing electrode 220-D1 is placed between the first sensing patterns 211. In one or more embodiments of this disclosure, the first sensing patterns 211 and the first dividing electrode 220-D1 may be included in the second conductive layer 204SUa, and the first bridging pattern 212 may be included in the first conductive layer 202SUa. The first bridging pattern 212 may be insulated from and intersect with the first dividing electrode 220-D1 superimposed on the first bridging pattern 212.

[0225] Each of the first auxiliary electrodes 230s included in the plurality of third electrodes 230 can extend in the second direction DR2. The first auxiliary electrodes 230s can be included in the first conductive layer 202SUa. One or more holes can be defined in each of the first auxiliary electrodes 230s. A first bridging pattern 212 can be disposed in one of the holes. Therefore, the first bridging pattern 212 can be electrically insulated from the first auxiliary electrodes 230s.

[0226] Each of the second auxiliary electrodes 240s included in the plurality of fourth electrodes 240 may include a plurality of second sensing patterns 241a and a plurality of second bridging patterns 242a. The second sensing patterns 241a may be spaced apart from each other in the first direction DR1 (e.g., spaced apart), and the second bridging patterns 242a may extend in the first direction DR1 and may be electrically connected to the second sensing patterns 241a through the second contact CNb1.

[0227] As an example, Figure 10a and Figure 10b Two adjacent second sensing patterns 241a are shown to be electrically connected to each other via two second bridging patterns 242a, but this disclosure is not particularly limited thereto. For example, two adjacent second sensing patterns 241a may be electrically connected to each other via one second bridging pattern 242a, or via three or more second bridging patterns 242a.

[0228] In one or more embodiments of this disclosure, the second sensing pattern 241a and the first auxiliary electrode 230s may be included in the first conductive layer 202SUa, and the second bridging pattern 242a may be included in the second conductive layer 204SUa. The second bridging pattern 242a may be insulated from and intersect with the first auxiliary electrode 230s superimposed on the second bridging pattern 242a.

[0229] Reference Figure 10a and Figure 10b In the second conductive layer 204SU within a sensing unit SU, the area occupied by the components included in the plurality of first electrodes 210 and the plurality of second electrodes 220 can be larger than the area occupied by the components included in the plurality of third electrodes 230 and the plurality of fourth electrodes 240. Due to the first input 2000 (see...) Figure 5 The change in capacitance caused by this can increase as the distance from the first input 2000 decreases. Therefore, the capacitance used to sense the first input 2000 (see...) Figure 5 The components can be arranged in conjunction with the electronic device 1000 (see...). Figure 1 In relatively large areas of adjacent layers on the surface of the object, touch performance can be improved.

[0230] In one or more embodiments of this disclosure, the first conductive layer 202SUa may further include a first dummy pattern DMP1, and the second conductive layer 204SUa may further include a second dummy pattern DMP2. Each of the first dummy pattern DMP1 and the second dummy pattern DMP2 may be floated or electrically floated. Each of the first dummy pattern DMP1 and the second dummy pattern DMP2 may be divided into multiple conductive patterns. For example, a first dummy pattern DMP1 may include multiple floated dummy patterns that are separated from each other or electrically separated.

[0231] Reference Figure 10c The area of ​​the first auxiliary electrode 230s and the area of ​​the first sensing pattern 211 can be adjusted. For example, the position of the boundary between the first auxiliary electrode 230s and the first dummy pattern DMP1, and the position of the boundary between the first sensing pattern 211 and the second dummy pattern DMP2 can be adjusted. In this case, the area of ​​the overlapping region where the first auxiliary electrode 230s and the first sensing pattern 211 overlap each other can be adjusted, and therefore the capacitance of the coupling capacitor C-CP between the first auxiliary electrode 230s and the first sensing pattern 211 can be adjusted.

[0232] Figure 11 This is a view illustrating the operation of a sensor driving unit according to one or more embodiments of the present disclosure.

[0233] Reference Figure 5 and Figure 11 The sensor drive unit 200C can be configured to be selectively driven in one of the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3.

[0234] The first operation mode DMD1 can be referred to as the touch and pen wait mode, the second operation mode DMD2 can be referred to as the touch-activated and pen wait mode, and the third operation mode DMD3 can be referred to as the pen-activated mode. The first operation mode DMD1 can be a mode that waits for the first input 2000 and the second input 3000. The second operation mode DMD2 can be a mode that senses the first input 2000 and waits for the second input 3000. The third operation mode DMD3 can be a mode that senses the second input 3000.

[0235] In one or more embodiments of this disclosure, the sensor driving unit 200C can be driven initially in a first operating mode DMD1. When the first input 2000 is sensed in the first operating mode DMD1, the sensor driving unit 200C can switch (or change) to a second operating mode DMD2. Alternatively, when the second input 3000 is sensed in the first operating mode DMD1, the sensor driving unit 200C can switch (or change) to a third operating mode DMD3.

[0236] In one or more embodiments of this disclosure, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driving unit 200C can switch to the third operating mode DMD3. When the first input 2000 is released (or not sensed) in the second operating mode DMD2, the sensor driving unit 200C can switch to the first operating mode DMD1. When the second input 3000 is released (or not sensed) in the third operating mode DMD3, the sensor driving unit 200C can switch to the first operating mode DMD1.

[0237] Figure 12 This is a view illustrating the operation of a sensor driving unit according to one or more embodiments of the present disclosure.

[0238] Reference Figure 5 , Figure 7 , Figure 11 and Figure 12 As an example, the operations in each of the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3 are shown in the order of time "t".

[0239] In the first operating mode DMD1, the sensor driving unit 200C can be repeatedly driven in the order of the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned to detect the first input 2000. As an example, Figure 12 The sensor drive unit 200C is shown to operate in the first mode MD1-d after the second mode MD2-d, but the order is not limited to this.

[0240] In the second operating mode DMD2, the sensor driving unit 200C can be repeatedly driven in the order of the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1, the sensor layer 200 can be scanned to detect the coordinates of the first input 2000.

[0241] In the third operating mode DMD3, the sensor driving unit 200C can be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 can be scanned to detect the coordinates of the second input 3000. In the third operating mode DMD3, the sensor driving unit 200C may not operate in the first mode MD1-d or MD1 until the second input 3000 is released (or not sensed).

[0242] In both the first mode MD1-d and the first mode MD1, all third electrodes 230 and fourth electrodes 240 can be grounded. Therefore, touch noise can be prevented from being introduced through the third electrodes 230 and fourth electrodes 240.

[0243] In both the second mode MD2-d and the second mode MD2, one end of each of the third electrode 230 and the fourth electrode 240 can be floating. Furthermore, in both the second mode MD2-d and the second mode MD2, the other end of each of the third electrode 230 and the fourth electrode 240 can be grounded or floating. Therefore, compensation for the sensing signal can be maximized through the coupling between the first electrode 210 and the third electrode 230, and the coupling between the second electrode 220 and the fourth electrode 240.

[0244] Figure 13a and Figure 13b This is a view describing a first mode according to one or more embodiments of the present disclosure.

[0245] Reference Figure 12 , Figure 13a and Figure 13b The first mode MD1-d and the first mode MD1 may include a self-capacitance detection mode. The self-capacitance detection mode may include a first sub-part and a second sub-part. Figure 13a It is a view used to describe the operations in the first subsection, and Figure 13b This is a view used to describe the operations in the second subsection.

[0246] In self-capacitance detection mode, the sensor driving unit 200C can output driving signals Txs1 and Txs2 to the first electrode 210 and the second electrode 220 respectively, and calculate the input coordinates by sensing the change in capacitance of each of the first electrode 210 and the second electrode 220. (Refer to...) Figure 13a In the first sub-section, the sensor driving unit 200C can output the driving signal Txs1 to the first trace 210t. (Refer to...) Figure 13b In the second sub-section, the sensor driving unit 200C can output the driving signal Txs2 to the second trace 220t.

[0247] The third electrode 230 is electrically connected to the third trace 230rt1 and the fifth trace 230rt2, and the fourth electrode 240 is electrically connected to the fourth traces 240t-1 and 240t-2. In self-capacitance detection mode, all third electrodes 230 and fourth electrodes 240 can be grounded. Therefore, no noise is introduced through the third electrodes 230 and fourth electrodes 240.

[0248] Figure 14 This is a view describing a first mode according to one or more embodiments of the present disclosure.

[0249] Reference Figure 5 , Figure 12 and Figure 14 The first mode MD1-d and the first mode MD1 may also include a mutual capacitance detection mode. Figure 14 This is a view used to describe the mutual capacitance detection modes in the first mode MD1-d and the first mode MD1.

[0250] In mutual capacitance detection mode, the sensor driving unit 200C can sequentially provide a transmission signal TX to the first electrode 210 and use the received signal RX detected by the second electrode 220 to detect the coordinates of the first input 2000. For example, the sensor driving unit 200C can calculate the input coordinates by sensing the change in mutual capacitance between the first electrode 210 and the second electrode 220.

[0251] Figure 14 This illustratively indicates that a transmitted signal TX is provided to a first electrode 210 and a received signal RX is output from a second electrode 220. To clarify the signal representation, in Figure 14 In this configuration, only the first electrode 210, to which the transmitted signal TX is provided, is marked with a shaded area. The sensor driving unit 200C can detect the input coordinates of the first input 2000 by sensing the change in capacitance between the first electrode 210 and the second electrode 220.

[0252] In mutual capacitance detection mode, all third electrodes 230 and fourth electrodes 240 can be grounded. Therefore, no noise will be introduced through the third electrodes 230 and fourth electrodes 240.

[0253] In each of the first mode MD1-d and the first mode MD1, the sensor layer 200 can perform alternately and repeatedly. Figure 13a , Figure 13b and Figure 14 The operations described herein. However, this is merely an example, and this disclosure is not particularly limited thereto. For example, in each of the first mode MD1-d and the first mode MD1, the sensor layer 200 may simply repeat the operations described herein. Figure 14 The operation described herein. Alternatively, in the first mode MD1-d, sensor layer 200 may simply repeat the operation. Figure 13a , Figure 13b and Figure 14 At least one of the operations described herein, and in the first mode MD1, the sensor layer 200 can perform alternately and repeatedly. Figure 13a , Figure 13b and Figure 14 The operations described in the document.

[0254] Figure 15This is a view describing a second mode according to one or more embodiments of the present disclosure.

[0255] Reference Figure 5 , Figure 12 and Figure 15 The second mode MD2 can include a charging drive mode and a pen sensing drive mode.

[0256] In charging drive mode, the sensor drive unit 200C can apply a first charging signal SG1 to one of the third pad PD3 and the fifth pad PD5, and apply a second charging signal SG2 to the other pad. The second charging signal SG2 can be the inverted signal of the first charging signal SG1. For example, the first charging signal SG1 can be a sine wave signal or a square wave signal.

[0257] As an example, Figure 15 The illustration shows a first charging signal SG1 applied to one pad and a second charging signal SG2 applied to another pad, but the disclosure is not limited thereto. For example, the first charging signal SG1 may be applied to two or more pads, and the second charging signal SG2 may be applied to two or more other pads.

[0258] Because the first charging signal SG1 and the second charging signal SG2 are applied to at least two pads, the current RFS can have a current path flowing through at least one pad to at least another pad. Furthermore, because the first charging signal SG1 and the second charging signal SG2 are sinusoidal signals with an out-of-phase relationship, the direction of the current RFS can change periodically.

[0259] The first charging signal SG1 and the second charging signal SG2 can be out of phase. Therefore, in the display layer 100, the noise caused by the first charging signal SG1 and the noise caused by the second charging signal SG2 can cancel each other out. As a result, flickering does not occur in the display layer 100, and the display quality of the display layer 100 can be improved.

[0260] A second charging signal SG2 is shown provided to a third pad PD3a connected to a third trace 230rt1, and a first charging signal SG1 is provided to a fifth pad PD5a connected to a third electrode 230. Current RFS can flow through a current path defined by the fifth pad PD5a, the fifth trace 230rt2 connected to the fifth pad PD5a, the third electrode 230, a portion of the third trace 230rt1 connected to the third pad PD3a, and the third pad PD3a. The current path can have a coil shape. Therefore, in the charging drive mode of the second mode, the resonant circuit of the pen PN can be charged through the current path. In this case, the multiple third electrodes 230 can be referred to as multiple channels.

[0261] According to this disclosure, a current path having a loop coil pattern can be implemented using components included in the sensor layer 200. Therefore, the electronic device 1000 can use the sensor layer 200 to charge the pen PN. Thus, because no additional components for charging the pen PN are required separately, there is no increase in the thickness, weight, or reduced flexibility of the electronic device 1000.

[0262] In charging drive mode, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be grounded, electrically floated, or have a constant voltage applied to them. Specifically, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be floated. In this case, the current RFS may not flow through the first electrode 210, the second electrode 220, and the fourth electrode 240.

[0263] Charging drive modes can include search charging drive mode and track charging drive mode.

[0264] In the search-charging drive mode, since the position of the pen PN is not sensed, the first charging signal SG1 or the second charging signal SG2 can be sequentially provided to all channels included in the sensor layer 200. For example, the first charging signal SG1 and the second charging signal SG2 can be sequentially scanned in the first direction DR1. That is, in the search-charging drive mode, the entire effective area 200A of the sensor layer 200 can be scanned.

[0265] In the search-charging drive mode, when the pen PN is sensed, the sensor layer 200 can be driven to perform tracking charging. For example, in the tracking charging drive mode, the sensor driving unit 200C can sequentially output the first charging signal SG1 and the second charging signal SG2 to the area superimposed on the point where the pen PN is sensed, instead of the entire sensor layer 200.

[0266] Therefore, after sensing the position of the pen PN, the channel that is charged and driven and corresponds to the position of the pen PN in the immediately preceding frame can be restricted. Thus, since channels that overlap with areas where the pen PN is not located are not charged and driven, the efficiency of the charging drive can be improved.

[0267] Figure 16a This is a view describing a second mode according to one or more embodiments of this disclosure, and Figure 16b This is a view for describing a second mode based on a sensing unit, according to one or more embodiments of the present disclosure.

[0268] Reference Figure 5 , Figure 16a and Figure 16bIn the second mode, the charging drive mode and the pen sensing drive mode can be executed alternately and repeatedly. Figure 16b A sensing unit SU is shown through which the first induced current Ia, the second induced current Ib, the third induced current Ic, and the fourth induced current Id generated by the pen PN flow.

[0269] The RLC resonant circuit of the pen PN can emit a magnetic field with a resonant frequency while releasing the charged charge. The magnetic field provided in the pen PN generates a first induced current Ia in the first electrode 210 and a second induced current Ib in the second electrode 220. Furthermore, a third induced current Ic can be generated in the first auxiliary electrode 230s of the third electrode 230, and a fourth induced current Id can be generated in the second auxiliary electrode 240s of the fourth electrode 240.

[0270] A first coupling capacitor Ccp1 can be formed between the first auxiliary electrode 230s and the first electrode 210, and a second coupling capacitor Ccp2 can be formed between the second auxiliary electrode 240s and the second electrode 220. A third induced current Ic can be transmitted to the first electrode 210 through the first coupling capacitor Ccp1, and a fourth induced current Id can be transmitted to the second electrode 220 through the second coupling capacitor Ccp2. In this case, each of the plurality of first electrodes 210 and the plurality of second electrodes 220 can be referred to as a channel.

[0271] The sensor driving unit 200C can receive a first sensing signal PRX1a based on a first induced current Ia and a third induced current Ic from the first electrode 210, and can receive a second sensing signal PRX2a based on a second induced current Ib and a fourth induced current Id from the second electrode 220. That is, the sensor driving unit 200C can receive the first sensing signal PRX1a from multiple first electrodes 210 and the second sensing signal PRX2a from multiple second electrodes 220. The sensor driving unit 200C can detect the coordinates of the pen PN based on the first sensing signal PRX1a and / or the second sensing signal PRX2a.

[0272] The sensor driving unit 200C can receive a first sensing signal PRX1a from the first electrode 210 and a second sensing signal PRX2a from the second electrode 220. In this case, one end of the third electrode 230 and one end of the fourth electrode 240 can be floating. Therefore, the compensation of the sensing signal can be maximized through the coupling between the first electrode 210 and the third electrode 230 and the coupling between the second electrode 220 and the fourth electrode 240. Furthermore, the other ends of the third electrode 230 and the fourth electrode 240 can be grounded or floating. Therefore, the third induced current Ic can be sufficiently transmitted to the first electrode 210 through the coupling between the first electrode 210 and the third electrode 230, and the fourth induced current Id can be sufficiently transmitted to the second electrode 220 through the coupling between the second electrode 220 and the fourth electrode 240.

[0273] In one or more embodiments of this disclosure, the wiring orientations of the stacked electrodes and auxiliary electrodes of the sensor layer 200 may be different from each other. For example, the wiring orientation of the first electrode 210 and the wiring orientation of the first auxiliary electrode 230s may be different from each other. Furthermore, the wiring orientations of the second electrode 220 and the second auxiliary electrode 240s may be different from each other. For example, in... Figure 16a and Figure 16b In this sensor unit SU, the first electrode 210 and the first trace 210t can be connected to each other at the lower part of the sensor unit SU, and the first auxiliary electrode 230s and the third trace 230rt1 can be connected to each other at the upper part of the sensor unit SU. The second electrode 220 and the second trace 220t can be connected to each other at the right part of the sensor unit SU, and the second auxiliary electrode 240s and the fourth trace 240t can be connected to each other at the left part of the sensor unit SU.

[0274] Figure 17 It is according to one or more embodiments of this disclosure along Figure 2 A cross-sectional view of the electronic device taken from line II-II'.

[0275] Reference Figure 17 The electronic device 1000 may include a display panel DP, a cover panel CP, and an electronic module EM.

[0276] The electronic module (EM) and cover panel (CP) can be arranged below the display panel (DP).

[0277] The cover panel CP may include a padding layer CSH, a magnetic layer FS, and a conductive layer CU.

[0278] The CSH (Content Sheet) can be placed below the display panel (DP). The CSH can include a gasket and an embossed sheet.

[0279] Embossed sheets can be colored. For example, embossed sheets can be black. Embossed sheets can absorb light input into the CSH padding.

[0280] Gaskets can relieve pressure applied from the outside. Gaskets may include sponges, foams, and / or urethane resins, etc. The thickness of the gasket can be greater than that of the embossed sheet.

[0281] When attaching a padding layer (CSH), the embossed sheet may include an embossed pattern to prevent air bubbles from forming.

[0282] The gasket protects the display panel (DP) from impacts transmitted from below. The shock resistance of the electronic device 1000 can be improved by using a CSH (Content Shock Sheet) layer.

[0283] The magnetic layer FS can be disposed below the padding layer CSH. The magnetic layer FS can reflect the magnetic field passing through the display panel DP. Therefore, the magnetic field reaching the magnetic layer FS can be reflected upwards. For example, the magnetic layer FS can be used to guide the direction of the passing magnetic field to a different direction. Therefore, the magnetic field reaching the magnetic layer FS can be shielded from leakage to the outside (e.g., not leaking to the lower part of the magnetic layer FS). Thus, the magnetic layer FS can prevent signal interference from the outside.

[0284] The magnetic layer FS may include magnetic materials containing iron oxides (such as magnetic metal powders and ferrites). The magnetic layer FS may be referred to as a ferrite sheet, a magnetic metal powder layer, a magnetic layer, a magnetic circuit layer, and / or a magnetic path layer.

[0285] The conductive layer CU can be disposed below the magnetic layer FS. The conductive layer CU can be conductive. The conductive layer CU can shield the magnetic field passing through the magnetic layer FS to prevent the magnetic field from leaking to the outside (e.g., to prevent the magnetic field from leaking to the lower part of the conductive layer CU).

[0286] In addition, the conductive layer CU can block magnetic fields generated from components (e.g., antennas) disposed under the conductive layer CU, so as to prevent magnetic fields from reaching the display panel.

[0287] The conductive layer CU may comprise aluminum, copper, and / or copper alloys. For example, the conductive layer CU may be a copper strip. However, this disclosure is not limited thereto.

[0288] A ground voltage can be applied to the conductive layer CU. However, this is illustrative, and the conductive layer CU can be floating.

[0289] According to this disclosure, the magnetic layer FS and the conductive layer CU can be stacked such that the magnetic layer FS is closer to the display panel DP than the conductive layer CU. This can be achieved through the sensor layer 200 (see...). Figure 5 ) Sensing by pen PN (see Figure 5The magnetic field generated by the sensor layer 200 can be reflected by the magnetic layer FS in this case, thus improving the sensor layer 200 (see...). Figure 5 The sensing reliability is improved. The magnetic field passing through the magnetic layer FS can be blocked by the conductive layer CU. The conductive layer CU can improve signal reliability by blocking the magnetic fields generated above and below it. Therefore, an electronic device 1000 with improved reliability can be provided.

[0290] The first opening OP1 can be confined within the padding layer CSH and the magnetic layer FS.

[0291] The second opening OP2 can be confined within the conductive layer CU.

[0292] The first area of ​​the first opening OP1 can be smaller than the second area of ​​the second opening OP2. The first opening OP1 can be connected to the sensing area SA (see...). Figure 2 )correspond.

[0293] The electronic module EM can be disposed inside the first opening OP1 and the second opening OP2. The electronic module EM may include a fingerprint sensor 1610 (see...). Figure 1 However, this is illustrative, and the electronic module EM according to one or more embodiments of this disclosure may include a sound output module 1630 (see...). Figure 1 In this case, the sound output module 1630 (see...) Figure 1 The electronic module (EM) may include a piezoelectric loudspeaker. Alternatively, the electronic module (EM) may include a light sensor.

[0294] Unlike this disclosure, the reliability of the fingerprint sensor 1610 may decrease when it comes into contact with the magnetic layer FS. However, according to this disclosure, when viewed in a planar plane (e.g., in a plan view), the electronic module EM may not be stacked with the magnetic layer FS and the conductive layer CU. The electronic module EM may be spaced apart from the magnetic layer FS and the conductive layer CU (e.g., spaced apart). This can improve the reliability of the electronic module EM. Therefore, an electronic device 1000 with improved reliability can be provided.

[0295] The first region AR1 and the second region AR2 can be confined within the cover panel CP.

[0296] The first region AR1 can be adjacent to the electronic module EM. When viewed in a plane, the first region AR1 can surround the electronic module EM.

[0297] The second region AR2 may be adjacent to the first region AR1. When viewed in a plane, the second region AR2 may surround the first region AR1 (e.g., encircle the first region AR1). The second region AR2 may be spaced apart from the first opening OP1 (e.g., spaced apart), and the first region AR1 is positioned between the second region AR2 and the first opening OP1. When viewed in a plane, the area of ​​the second opening OP2 may be a value obtained by adding the area of ​​the first region AR1 to the area of ​​the first opening OP1.

[0298] When viewed in a plane, the first region AR1 can be defined between the second region AR2 and the first opening OP1. When viewed in a plane, at least a portion of the second opening OP2 can be superimposed on the first region AR1.

[0299] When viewed in a planar plane, the conductive layer CU can be stacked only with the second region AR2. The conductive layer CU can be without stacking with the first region AR1. The padding layer CSH and the magnetic layer FS can be stacked with the first region AR1 and the second region AR2. Therefore, the first region AR1 and the second region AR2 of the cover panel CP can have different magnetic permeabilities.

[0300] The first region AR1 of the cover plate CP may have a first permeability. The second region AR2 of the cover plate CP may have a second permeability different from the first permeability.

[0301] Figure 18 This is a perspective view showing a portion of the cover panel and a pen according to one or more embodiments of the present disclosure, and Figure 19 It is a graph depicting the inductance for each location according to one or more embodiments of the present disclosure.

[0302] Reference Figure 5 , Figure 18 and Figure 19 When viewed on a flat surface, the magnetic layer FS can cover the conductive layer CU. The magnetic permeability of the magnetic layer FS can be higher than that of the conductive layer CU.

[0303] The pen PN can be disposed on the magnetic layer FS and the conductive layer CU. As an example, Figure 18 The pen PN is shown to be positioned at point PT, which is the center of the first opening OP1.

[0304] The pen PN may include an inductor L and a capacitor C. The inductor L may emit a magnetic field MF with a resonant frequency. The induced current may flow in the sensor layer 200 through the magnetic field MF emitted by the pen PN, and the induced current may be transmitted to the sensor drive unit 200C as a received signal (or sensing signal).

[0305] Reference curve GR shows the inductance measured when the pen PN moves in the first direction DR1 in a comparative example where the first region AR1 and the second region AR2 have the same permeability. For example, in the comparative example, the first opening OP1 and the second opening OP2 may have the same area when viewed in a plane.

[0306] When viewed in a plane, a second opening OP2, having an area larger than the area of ​​the first opening OP1 of the magnetic layer FS, can be defined within the conductive layer CU. The magnetic layer FS can be superimposed on the first region AR1 and the second region AR2, and the conductive layer CU can be separated from the first region AR1 due to the second opening OP2. Therefore, the first permeability of the first region AR1 can be different from the second permeability of the second region AR2.

[0307] The first curve G1 shows the inductance measured in an embodiment of this disclosure when the pen PN moves in the first direction DR1, in which the first region AR1 and the second region AR2 have different permeabilities.

[0308] The x-axis in each of the reference curve GR and the first curve G1 can indicate the position of the pen PN. For example, the x-axis represents -35mm to 35mm in 5mm increments, and the point PT (as the center of the first opening OP1) is set to 0mm. For example, the range from -4mm to 4mm can correspond to the first opening OP1, the ranges from -6mm to -4mm and 4mm to 6mm can correspond to the first region AR1, and the ranges from -25mm to -6mm and 6mm to 25mm can correspond to the second region AR2.

[0309] The y-axis in each of the reference curve GR and the first curve G1 can refer to the inductance. For example, the y-axis represents 45.05H (Henry) to 45.5H in increments of 0.05H.

[0310] According to one or more embodiments of this disclosure, the second opening OP2 may be defined within the conductive layer CU, thus the conductive layer CU may not be superimposed on the first region AR1. Eddy currents generated by the magnetic field MF can be unblocked by the conductive layer CU within the first region AR1. The first permeability of the first region AR1 may be higher than the second permeability of the second region AR2.

[0311] Inductance can be proportional to permeability. The inductance of the portion adjacent to the first region AR1 and the portion adjacent to the first opening OP1 can be increased.

[0312] Unlike this disclosure, referring to the reference curve GR, the inductance change DT1 according to the comparative example may be relatively large in the measurement region A1 according to the comparative example. In this case, when the sensor driving unit 200C senses the coordinates of the pen PN, the sensor driving unit 200C may deviate from the possible correction range, the received signal may not be corrected, and therefore, the sensing reliability may deteriorate. However, according to this disclosure, referring to the first curve G1 measured based on the electronic device 1000, the inductance change DT2 in the measurement region A2 can be relatively small. That is, compared with the inductance change DT1 according to the comparative example, the inductance change DT2 according to one or more embodiments of this disclosure can be reduced. The received signal may have a value within the correction range of the sensor driving unit 200C. Therefore, the sensor driving unit 200C can correct the received signal, thereby improving the sensing reliability.

[0313] According to this disclosure, a sensing area SA (see) of an electronic module EM is provided therein. Figure 2 In this configuration, the magnetic layer FS and the conductive layer CU may not be superimposed on the electronic module EM. This is in contrast to the sensing area SA (see...). Figure 2 The first permeability of the adjacent first region AR1 can be higher than the second permeability of the second region AR2. Therefore, the sensing region SA can be reduced (see...). Figure 2 ) and with sensing area SA (see Figure 2 The inductance change DT2 of the magnetic field MF in the adjacent region can be calculated. Therefore, the sensing reliability of the region of the sensor layer 200 overlapping with the sensing region SA can be improved. The linearity of the input of the pen PN can be improved. Therefore, an electronic device 1000 with improved sensing reliability can be provided.

[0314] Figure 20a This is a plan view showing a portion of the rear surface of a cover panel according to one or more embodiments of the present disclosure.

[0315] Reference Figure 17 and Figure 20a Each of the first opening OP1a and the second opening OP2a can have a circular shape.

[0316] The first opening OP1a may have a first diameter D1. For example, the first diameter D1 may be 8 mm.

[0317] The difference DF between the radius of the first opening OP1a and the radius of the second opening OP2a can be 2mm.

[0318] The second opening OP2a can have a second diameter D2. For example, the second diameter D2 can be 12 mm.

[0319] The second area of ​​the second opening OP2a can be 1.5 to 1.6 times the first area of ​​the first opening OP1a. The permeability of the first region AR1 can be defined by the first area and the second area.

[0320] Unlike this disclosure, when the second area is less than 1.5 times the first area, the inductance of the portion adjacent to the first region AR1 and the portion adjacent to the first opening OP1a may increase only slightly, and when the second area is greater than 1.6 times the first area, the inductance of the portion adjacent to the first region AR1 and the portion adjacent to the first opening OP1a may increase excessively, thus the change in inductance may increase. However, according to this disclosure, the increase in inductance can be controlled by the relationship between the second area of ​​the second opening OP2a and the first area of ​​the first opening OP1a. Due to the increase in inductance in the first opening OP1a, the first region AR1, and the second region AR2, the change in inductance can be relatively small. The received signal may have a sensor driving unit 200C (see...). Figure 5 The value within the correction range of ). Therefore, the sensor drive unit 200C (see Figure 5 It can correct the received signal, thus improving sensing reliability.

[0321] Figure 20b This is a plan view showing a portion of the rear surface of a cover panel according to one or more embodiments of the present disclosure.

[0322] Reference Figure 17 and Figure 20b Each of the first opening OP1b and the second opening OP2b can be quadrilateral in shape. For example, each of the first opening OP1b and the second opening OP2b can be square in shape. However, this is illustrative, and the shape of each of the first opening OP1b and the second opening OP2b is not limited thereto. For example, the shape of each of the first opening OP1b and the second opening OP2b can be a polygonal shape such as a triangle or an octagon.

[0323] The first opening OP1b may have a first width D1-1 in the first direction DR1. For example, the first width D1-1 may be 8mm.

[0324] The width difference DF-1 between the first opening OP1b and the second opening OP2b can be 2mm.

[0325] The second opening OP2b can have a second width D2-1 in the second direction DR2. For example, the second width D2-1 can be 12mm.

[0326] The second area of ​​the second opening OP2b can be 1.5 to 1.6 times the first area of ​​the first opening OP1b. The permeability of the first region AR1 can be defined by the first area and the second area.

[0327] Unlike this disclosure, when the second area is less than 1.5 times the first area, the inductance of the portion adjacent to the first region AR1 and the portion adjacent to the first opening OP1b may increase only slightly, and when the second area is greater than 1.6 times the first area, the inductance of the portion adjacent to the first region AR1 and the portion adjacent to the first opening OP1b may increase excessively, thus increasing the amount of change in inductance. However, according to this disclosure, the amount of increase in inductance can be controlled by the relationship between the second area of ​​the second opening OP2b and the first area of ​​the first opening OP1b. Due to the increase in inductance in the first opening OP1a, the first region AR1, and the second region AR2, the amount of change in inductance can be relatively small. The received signal may have a sensor driving unit 200C (see... Figure 5 The value within the correction range of ). Therefore, the sensor drive unit 200C (see Figure 5 It can correct the received signal, thus improving sensing reliability.

[0328] Figure 21 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'. Figure 21 In the description, through Figure 17 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0329] Reference Figure 21 The electronic device 1000-1 may include a display panel DP, a cover panel CP-1, and an electronic module EM.

[0330] The electronic module EM and the cover panel CP-1 can be arranged below the display panel DP.

[0331] The cover panel CP-1 may include a pad layer CSH, a magnetic layer FS-1, and a conductive layer CU-1. A first region AR1-1 and a second region AR2-1 may be defined within the cover panel CP-1.

[0332] The first region AR1-1 may be adjacent to the electronic module EM. When viewed in a plane, the first region AR1-1 may be around the electronic module EM (e.g., surrounding the electronic module EM).

[0333] The second region AR2-1 may be adjacent to the first region AR1-1. The second region AR2-1 may surround the first region AR1-1 (e.g., may encircle the first region AR1-1). The second region AR2-1 may be separated from the first opening OP1 (e.g., spaced apart) and the first region AR1-1 is located between the second region AR2-1 and the first opening OP1.

[0334] When viewed on a plane, the first region AR1-1 can be defined between the second region AR2-1 and the first opening OP1.

[0335] The magnetic layer FS-1 may include a first portion P1 disposed in a first region AR1-1 and a second portion P2 disposed in a second region AR2-1.

[0336] The permeability of the first part P1 can be higher than that of the second part P2.

[0337] The first opening OP1 can be confined within the padding layer CSH and the magnetic layer FS-1.

[0338] The second opening OP2-1 can be confined within the conductive layer CU-1.

[0339] The first area of ​​the first opening OP1 can be the same as the second area of ​​the second opening OP2-1.

[0340] When viewed on a flat surface, the magnetic layer FS-1 and the conductive layer CU-1 can be superimposed on the first region AR1-1 and the second region AR2-1.

[0341] The first region AR1-1 of the cover panel CP-1 may have a first permeability. The second region AR2-1 of the cover panel CP-1 may have a second permeability that is less than the first permeability.

[0342] Figure 22 This is a perspective view showing a portion of the cover panel and a pen according to one or more embodiments of the present disclosure, and Figure 23 It is a graph depicting the inductance for each location according to one or more embodiments of the present disclosure. Figure 22 and Figure 23 In the description, through Figure 18 and Figure 19 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0343] Reference Figure 5 , Figure 22 and Figure 23 When viewed on a flat surface, the magnetic layer FS-1 can cover the conductive layer CU-1. The first permeability of the first region AR1-1 can be higher than the second permeability of the second region AR2-1.

[0344] The PN pen can be set on the magnetic layer FS-1 and the conductive layer CU-1. Figure 22 The pen PN is illustrated at point PT, which is the center of the first opening OP1.

[0345] The pen PN may include an inductor L and a capacitor C. The inductor L may emit a magnetic field MF with a resonant frequency. The induced current may flow in the sensor layer 200 through the magnetic field MF emitted by the pen PN, and the induced current may be transmitted to the sensor drive unit 200C as a received signal (or sensing signal).

[0346] Reference curve GR shows the inductance measured when the pen PN moves in the first direction DR1 in a comparative example where the first region AR1-1 and the second region AR2-1 have the same permeability.

[0347] The second curve G2 shows the inductance measured when the pen PN moves in the first direction DR1 in one or more embodiments of this disclosure, in which the first region AR1-1 and the second region AR2-1 have different permeabilities.

[0348] The first permeability of the first region AR1-1 can be higher than the second permeability of the second region AR2-1. The inductance can be proportional to the permeability. The inductance of the portion adjacent to the first region AR1-1 and the portion adjacent to the first opening OP1 can be increased.

[0349] Unlike this disclosure, referring to reference curve GR, the inductance change DT1 according to the comparative example may be relatively large in measurement region A1 according to the comparative example. In this case, when the sensor driving unit 200C senses the coordinates of the pen PN, the sensor driving unit 200C may deviate from the possible correction range, the received signal may not be corrected, and therefore, the sensing reliability may deteriorate. However, according to this disclosure, referring to the second curve G2 measured based on the electronic device 1000, the inductance change DT2-1 in measurement region A2-1 can be relatively small. That is, compared with the inductance change DT1 according to the comparative example, the inductance change DT2-1 according to one or more embodiments of this disclosure can be reduced. The received signal may have a value within the correction range of the sensor driving unit 200C. Therefore, the sensor driving unit 200C can correct the received signal, thereby improving the sensing reliability.

[0350] The area of ​​the first part P1 can be 0.2 to 0.3 times the area of ​​each of the first opening OP1 and the second opening OP2-1.

[0351] Unlike this disclosure, when the area of ​​the first portion P1 is less than 0.2 times the area of ​​each of the first opening OP1 and the second opening OP2-1, the inductance of the portion adjacent to the first region AR1-1 and the portion adjacent to the first opening OP1 may increase less. Conversely, when the area of ​​the first portion P1 is greater than 0.3 times the area of ​​each of the first opening OP1 and the second opening OP2-1, the inductance of the portion adjacent to the first region AR1-1 and the portion adjacent to the first opening OP1 may increase excessively, thus increasing the amount of inductance change. However, according to this disclosure, the amount of inductance increase can be controlled by the relationship between the area of ​​the first portion P1 and the area of ​​each of the first opening OP1 and the second opening OP2-1. The amount of inductance change in the first opening OP1, the first region AR1-1, and the second region AR2-1 can be relatively small. The received signal can have a value within the correction range of the sensor driving unit 200C. Therefore, the sensor driving unit 200C can correct the received signal, thereby improving sensing reliability.

[0352] Figure 24 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'. Figure 24 In the description, through Figure 21 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0353] Reference Figure 24 The electronic device 1000-2 may include a display panel DP, a cover panel CP-2, and an electronic module EM.

[0354] The cover panel CP-2 may include a pad layer CSH, a magnetic layer FS-1, and a conductive layer CU-2. A first region AR1-1 and a second region AR2-1 may be defined within the cover panel CP-2.

[0355] The second opening OP2-2 can be confined within the conductive layer CU-2.

[0356] When viewed on a plane, the first area of ​​the first opening OP1 can be smaller than the second area of ​​the second opening OP2-2.

[0357] The conductive layer CU-2 may be stacked with a portion of the first region AR1-1 and the second region AR2-1. However, this is illustrative, and the stacking relationship of the conductive layer CU-2 according to one or more embodiments of this disclosure is not limited thereto. For example, the conductive layer CU-2 may be stacked with the second region AR2-1, but may not be stacked with the first region AR1-1.

[0358] The first region AR1-1 of the cover panel CP-2 may have a first permeability. The second region AR2-1 of the cover panel CP-2 may have a second permeability that is less than the first permeability.

[0359] Figure 25 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'. Figure 25 In the description, through Figure 17 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0360] Reference Figure 25 The electronic device 1000-3 may include a display panel DP, a cover panel CP-3, and an electronic module EM.

[0361] The cover panel CP-3 may include a pad layer CSH, a magnetic layer FS, a conductive layer CU-3, and a sub-conductive layer SCU. A first region AR1-3 and a second region AR2-3 may be defined within the cover panel CP-3.

[0362] The first region AR1-3 may be adjacent to the electronic module EM. When viewed in a plane, the first region AR1-3 may be around the electronic module EM (e.g., surrounding the electronic module EM).

[0363] The second region AR2-3 may be adjacent to the first region AR1-3. The second region AR2-3 may surround the first region AR1-3 (e.g., may encircle the first region AR1-3). The second region AR2-3 may be separated from the first opening OP1 (e.g., spaced apart) and the first region AR1-3 is located between the second region AR2-3 and the first opening OP1.

[0364] When viewed on a plane, the first region AR1-3 can be defined between the second region AR2-3 and the first opening OP1.

[0365] The second opening OP2-3 can be confined within the conductive layer CU-3.

[0366] When viewed on a plane, the first area of ​​the first opening OP1 can be the same as the second area of ​​the second opening OP2-3.

[0367] A sub-conductive layer SCU can be disposed below the conductive layer CU-3. When viewed in a plane, a third opening OP3, having an area larger than that of the second opening OP2-3, can be defined within the sub-conductive layer SCU.

[0368] The first region AR1-3 of the cover panel CP-3 may have a first permeability. The second region AR2-3 of the cover panel CP-3 may have a second permeability that is less than the first permeability.

[0369] Figure 26 It is along with one or more embodiments of this disclosure. Figure 2 The cross-sectional view of the electronic device is taken from the line corresponding to line II-II'. Figure 26 In the description, through Figure 17 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0370] Reference Figure 26 The electronic device 1000-4 may include a display panel DP, a cover panel CP-4, and an electronic module EM.

[0371] The cover panel CP-4 may include a padding layer CSH, a magnetic layer FS, a conductive layer CU, and an insulating layer IN. A first region AR1 and a second region AR2 may be defined within the cover panel CP-4.

[0372] The insulating layer IN can be disposed on the same layer as the conductive layer CU (or on the same layer as the conductive layer CU). When viewed in a plane, the insulating layer IN can be superimposed on the first region AR1. The second opening OP2-4 can be defined by the insulating layer IN.

[0373] The first region AR1 of the cover panel CP-4 may have a first permeability. The second region AR2 of the cover panel CP-4 may have a second permeability that is less than the first permeability.

[0374] Figure 27a This is a perspective view of an electronic device according to one or more embodiments of the present disclosure, and Figure 27b This is a rear perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0375] Reference Figure 27a and Figure 27b The electronic device 1000a can be a device activated by an electrical signal. For example, the electronic device 1000a can display an image and sense input applied from an external source. The external input can be user input. User input can include various types of external input (such as a part of the user's body, a pen PN, light, heat, or pressure). The pen PN can be referred to as the input device PN.

[0376] Electronic device 1000a may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate panels. The first display panel DP1 may be referred to as the main display panel, and the second display panel DP2 may be referred to as the auxiliary display panel or the external display panel.

[0377] The first display panel DP1 may include a first display unit DA1-F, and the second display panel DP2 may include a second display unit DA2-F. The area of ​​the second display panel DP2 may be smaller than the area of ​​the first display panel DP1. In order to correspond with the size of the first display panel DP1 and the second display panel DP2, the area of ​​the first display unit DA1-F may be larger than the area of ​​the second display unit DA2-F.

[0378] In the unfolded state of the electronic device 1000a, the first display unit DA1-F may have a plane substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000a may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and rear surface (or lower surface) of the components constituting the electronic device 1000a may be defined based on the third direction DR3.

[0379] The first display panel DP1 or the first display unit DA1-F may include a folded or unfolded folded area FA and a plurality of non-folded areas NFA1 and NFA2 spaced apart from each other (e.g., spaced apart) with the folded area FA located therebetween. The second display panel DP2 may be stacked with one of the plurality of non-folded areas NFA1 and NFA2. For example, the second display panel DP2 may be stacked with the first non-folded area NFA1.

[0380] The display orientation of the first image IM1a displayed on a portion of the first display panel DP1 (e.g., the first non-folding region NFA1) may be opposite to the display orientation of the second image IM2a displayed on the second display panel DP2. For example, the first image IM1a may be displayed on a third direction DR3, and the second image IM2a may be displayed on a fourth direction DR4, which is opposite to the third direction DR3.

[0381] In one or more embodiments of this disclosure, the folding region FA can be bent relative to a folding axis extending in a direction parallel to the long side of the electronic device 1000a (e.g., a direction parallel to the second direction DR2). In the folded state of the electronic device 1000a, the folding region FA has a suitable curvature (e.g., a predetermined curvature) and a suitable radius of curvature (e.g., a predetermined radius of curvature). The first non-folding region NFA1 and the second non-folding region NFA2 can face each other, and the electronic device 1000a can be folded inwards to prevent the first display unit DA1-F from being exposed to the outside.

[0382] In one or more embodiments of this disclosure, the electronic device 1000a can be folded outwards, exposing the first display unit DA1-F to the outside. In one or more embodiments of this disclosure, the electronic device 1000a can be folded both inwards and outwards in an unfolded state, but this disclosure is not limited thereto.

[0383] As an example, Figure 27a The present disclosure shows a folding region FA defined in the electronic device 1000a, but is not limited thereto. For example, multiple folding axes and corresponding multiple folding regions may be defined in the electronic device 1000a, and the electronic device 1000a may be folded inward or outward in each of the multiple folding regions in an unfolded state.

[0384] According to one or more embodiments of this disclosure, even when at least one of the first display panel DP1 and the second display panel DP2 does not include a digital converter, at least one of the first display panel DP1 and the second display panel DP2 can still sense the input of the pen PN. Therefore, because the digital converter for sensing the pen PN is omitted, the increase in thickness, weight, and reduced flexibility of the electronic device 1000a due to the addition of a digital converter is avoided. Therefore, the second display panel DP2 and the first display panel DP1 can be designed to sense the pen PN.

[0385] Figure 28 This is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure.

[0386] Reference Figure 28 The electronic device 1000a may include a first display panel DP1, an upper functional layer, and a lower functional layer. The upper functional layer may include components disposed on the first display panel DP1, and the lower functional layer may include components disposed below the first display panel DP1.

[0387] The first display panel DP1 can be configured to generate images and sense external input. For example, the first display panel DP1 may include a display layer 100 (see...). Figure 5 ) and sensor layer 200 (see Figure 5 ).

[0388] The upper functional layer may include a protective layer PL, a window WD, an impact-absorbing layer DL, and a first adhesive layer PSA1, a second adhesive layer PSA2, and a third adhesive layer PSA3. The components included in the upper functional layer are not limited to those described above. At least some of the above components may be omitted, and other components may be added.

[0389] The protective layer PL can protect the components disposed beneath it. The thickness of the protective layer PL can be 60 micrometers to 70 micrometers (e.g., 65 micrometers), but is not limited to this.

[0390] The protective layer PL may additionally include a hard coating and / or an anti-fingerprint layer to improve properties such as chemical resistance and abrasion resistance. For example, the hard coating may be a functional layer for improving the usability of the electronic device 1000a, and may be provided by coating it onto the protective layer PL. For example, the hard coating may improve anti-fingerprint properties, anti-fouling properties, and / or scratch resistance. For example, the thickness of the hard coating may be 5 micrometers, but this disclosure is not particularly limited thereto.

[0391] The window WD can be disposed below the protective layer PL. The first adhesive layer PSA1 can be disposed between the window WD and the protective layer PL. The thickness of the first adhesive layer PSA1 can be 30 micrometers to 40 micrometers (e.g., 35 micrometers), but is not limited to this. In one or more embodiments of this disclosure, a border pattern can be disposed between the first adhesive layer PSA1 and the protective layer PL.

[0392] Window insulating materials (WDs) can include optically transparent insulating materials. For example, a window WD can include a glass substrate and / or a synthetic resin film. A window WD can have a multilayer or single-layer structure. For example, a window WD can include multiple synthetic resin films bonded together with an adhesive, or it can include a glass substrate and a synthetic resin film bonded together with an adhesive. When the window WD is a glass substrate, the thickness of the window WD can be 80 micrometers or less (e.g., 30 micrometers), but the thickness of the window WD is not limited to this.

[0393] The impact-absorbing layer DL can be disposed below the window WD. The second adhesive layer PSA2 can be disposed between the window WD and the impact-absorbing layer DL. The thickness of the second adhesive layer PSA2 can be 70 micrometers to 80 micrometers (e.g., 75 micrometers), but the thickness of the second adhesive layer PSA2 is not limited to this.

[0394] The shock-absorbing layer DL can absorb impacts applied to the first display panel DP1 to protect it. The shock-absorbing layer DL can be manufactured in the form of a stretched film. For example, the shock-absorbing layer DL can comprise a flexible plastic material. A flexible plastic material can be defined as a synthetic resin film. For example, the shock-absorbing layer DL can comprise flexible plastic materials such as polyimide and / or polyethylene terephthalate. The thickness of the shock-absorbing layer DL can be from 18 micrometers to 28 micrometers (e.g., 23 micrometers), but the thickness of the shock-absorbing layer DL is not limited to this. In one or more embodiments of this disclosure, the shock-absorbing layer DL may be omitted.

[0395] The third adhesive layer PSA3 can be disposed between the shock-absorbing layer DL and the first display panel DP1. The thickness of the third adhesive layer PSA3 can be from 45 micrometers to 55 micrometers (e.g., 50 micrometers), but the thickness of the third adhesive layer PSA3 is not limited to this.

[0396] The lower functional layer may include a protective film PF, a plate PLT, a cover layer CVL, a cover panel CPa, an insulating film PET, step compensation components ARS1, ARS2, and ARS3, and a fourth adhesive layer PSA4, a fifth adhesive layer PSA5, and a sixth adhesive layer PSA6. The components included in the lower functional layer are not limited to those described above. At least some of the above components may be omitted, and other components may be added.

[0397] The protective film PF can be bonded to the rear surface of the first display panel DP1 via the fourth adhesive layer PSA4. The thickness of the fourth adhesive layer PSA4 can be from 20 micrometers to 30 micrometers (e.g., 25 micrometers), but the thickness of the fourth adhesive layer PSA4 is not limited to this.

[0398] The protective film PF prevents scratches on the rear surface of the first display panel DP1 during the manufacturing process. The protective film PF may be a colored polyimide film. For example, the protective film PF may be an opaque yellow film, but this disclosure is not limited thereto. The thickness of the protective film PF may be from 45 micrometers to 55 micrometers (e.g., 50 micrometers), but the thickness of the protective film PF is not limited thereto.

[0399] The plate PLT can be disposed under the protective film PF. The fifth adhesive layer PSA5 can be disposed between the plate PLT and the protective film PF. The thickness of the fifth adhesive layer PSA5 can be from 11 micrometers to 21 micrometers (e.g., 16 micrometers), but the thickness of the fifth adhesive layer PSA5 is not limited to this.

[0400] The plate PLT can comprise carbon fiber reinforced plastic (CFRP), metal, and / or metal alloy. The plate PLT can support components disposed on its upper side. An opening PH can be defined (formed or disposed) within a portion of the plate PLT. For example, the plate PLT can include an opening PH having a shape extending from the upper surface to the lower surface of the plate PLT. The opening PH can be defined in a region overlapping with a folded region FA. When viewed in a plane (e.g., on a third-direction DR3 or in the thickness direction of the plate PLT), the opening PH can overlap with the folded region FA. The shape of a portion of the plate PLT can be more easily deformed due to the opening PH. The thickness of the plate PLT can be from 160 micrometers to 180 micrometers (e.g., 170 micrometers), but the thickness of the plate PLT is not limited to this.

[0401] A capping layer CVL can be attached to a plate PLT. The capping layer CVL can cover the opening PH of the plate PLT. Therefore, the capping layer CVL can prevent foreign matter from being introduced into the opening PH. The capping layer CVL can include thermoplastic polyurethane, but this disclosure is not particularly limited thereto. The thickness of the capping layer CVL can be from 11 micrometers to 21 micrometers (e.g., 16 micrometers), but the thickness of the capping layer CVL is not limited thereto.

[0402] The cover panel CPa may include a magnetic layer FSa and a conductive layer CUa.

[0403] The magnetic layer FSa can be disposed below the plate PLT and the capping layer CVL. The sixth adhesive layer PSA6 can be disposed between the magnetic layer FSa and the plate PLT. The thickness of the sixth adhesive layer PSA6 can be from 15 micrometers to 25 micrometers (e.g., 20 micrometers), but the thickness of the sixth adhesive layer PSA6 is not limited to this.

[0404] The magnetic layer FSa can shield magnetic fields passing through the first display panel DP1. The thickness of the magnetic layer FSa can be from 53 micrometers to 63 micrometers (e.g., 58 micrometers), but the thickness of the magnetic layer FSa is not limited to this.

[0405] The first opening OP1' can be confined within the magnetic layer FSa.

[0406] The conductive layer CUa can be disposed below the magnetic layer FSa. The thickness of the conductive layer CUa can be from 15 micrometers to 25 micrometers (e.g., 20 micrometers), but the thickness of the conductive layer CUa is not limited to this.

[0407] The second opening OP2' can be confined within the conductive layer CUa.

[0408] When viewed in a flat surface, the first area of ​​the first opening OP1' can be smaller than the second area of ​​the second opening OP2'. When viewed in a flat surface, the first opening OP1' and the second opening OP2' can be superimposed on the folded area FA.

[0409] The first permeability of the first region superimposed with the second opening OP2' of the cover plate CPa can be higher than the second permeability of the second region superimposed with the magnetic layer FSa and the conductive layer CUa of the cover plate CPa.

[0410] According to this disclosure, the first permeability of the first region adjacent to the folded region FA can be higher than the second permeability of the second region. Therefore, the magnetic permeability of the pen PN in the folded region FA and the region adjacent to the folded region FA can be reduced (see...). Figure 27a The change in inductance of the emitted magnetic field. Therefore, the sensor layer 200 (see...) can be improved. Figure 5 The sensing reliability of the PN can be improved in a region where it overlaps with the folded area FA. Figure 27a The linearity of the input is improved. Therefore, an electronic device 1000a with improved sensing reliability can be provided.

[0411] The insulating film PET can be disposed below the conductive layer CUa. The insulating film PET may include polyethylene terephthalate, but this disclosure is not particularly limited thereto. The insulating film PET can prevent the inflow of static electricity. For example, the insulating film PET can prevent electrical interference between components disposed on the insulating film PET and components disposed below the insulating film PET. The thickness of the insulating film PET can be from 3 micrometers to 9 micrometers (e.g., 6 micrometers), but the thickness of the insulating film PET is not limited thereto.

[0412] The step compensation components ARS1, ARS2, and ARS3 may include a first step compensation component ARS1 attached to the insulating film PET, a second step compensation component ARS2 attached to the magnetic layer FSa, and a third step compensation component ARS3 attached to the magnetic layer FSa. The thickness of each of the first step compensation component ARS1, the second step compensation component ARS2, and the third step compensation component ARS3 may be set in various ways depending on the product structure and / or component arrangement. For example, the thickness of the first step compensation component ARS1 may be 90 micrometers, the thickness of the second step compensation component ARS2 may be 87 micrometers, and the thickness of the third step compensation component ARS3 may be 87 micrometers, but this disclosure is not limited thereto.

[0413] Furthermore, in one or more embodiments of this disclosure, each of the sixth adhesive layer PSA6, the magnetic layer FSa, the conductive layer CUa, and the insulating film PET can have a separate structure in the portion overlapping with the folded region FA. For example, the sixth adhesive layer PSA6, the magnetic layer FSa, the conductive layer CUa, and the insulating film PET can each be divided into two structures that are spaced apart from each other by a suitable gap (e.g., a predetermined gap) in the portion overlapping with the folded region FA.

[0414] Figure 29 This is a cross-sectional view of an electronic device according to one or more embodiments of the present disclosure, and Figure 30 An input sensor according to one or more embodiments of the present disclosure is shown. Figure 29 In the description, through Figure 17 The components described are indicated by the same reference numerals, and their descriptions will be omitted.

[0415] Reference Figure 29 and Figure 30 The electronic device 1000b may include a display panel DPb, an input sensor DGT, a cover panel CP, and an electronic module EM.

[0416] The sensor layer of the display panel DPb can be omitted. Figure 7 The sensor layer 200 shown (see Figure 7 Multiple third electrodes 230 in ) (see Figure 7 ) and multiple fourth electrodes 240 (see Figure 7 ) components.

[0417] The input sensor DGT can be located below the display panel DPb. Pen PN (see...) Figure 5 The second input 3000 (see) Figure 5 The second input 3000 can be sensed via the input sensor DGT. That is, the display panel DPb can sense the second input 3000 via a separate input sensor DGT (see...). Figure 5 ).

[0418] The input sensor DGT can sense external inputs through electromagnetic resonance (EMR).

[0419] In EMR mode, it can be configured in the input device PN (see Figure 5 A magnetic field is generated in the internal resonant circuit. This oscillating magnetic field can induce signals in multiple coils included in the input sensor DGT, and the input device PN can be sensed by the signals induced in the coils (see...). Figure 5 The position of ).

[0420] The input sensor DGT may include multiple first coils DL1 and multiple second coils DL2. The multiple first coils DL1 may be referred to as drive coils, and the multiple second coils DL2 may be referred to as sensing coils.

[0421] Multiple first coils DL1 can be arranged to be insulated from and interleaved with multiple second coils DL2. This is for sensing the input device PN (see...). Figure 5An alternating current (AC) signal can be sequentially supplied to the first terminal DL1t of each of a plurality of first coils DL1. Each of the plurality of first coils DL1 can be formed as a closed curve shape, and magnetic lines of force can be induced between the plurality of first coils DL1 and the plurality of second coils DL2 when current flows through each of the plurality of first coils DL1. The plurality of second coils DL2 can transmit magnetic field lines through sensing from the input device PN (see...). Figure 5 The signal obtained by induced electromagnetic force emitted is output to the second terminal DL2t of each of the plurality of second coils DL2.

[0422] As an example, Figure 30 The construction of the digital converter is shown, but this disclosure is not limited thereto. Furthermore, the arrangement relationship between the plurality of first coils DL1 and the plurality of second coils DL2 is not limited to... Figure 30 The arrangement shown is a logical relationship that can be modified in various ways.

[0423] The first region AR1 of the cover plate CP may have a first permeability. The second region AR2 of the cover plate CP may have a second permeability that is less than the first permeability.

[0424] Although one or more embodiments of this disclosure have been described above, it is to be understood that various modifications and changes can be made to this disclosure by those skilled in the art or those with ordinary knowledge in the art without departing from the spirit and scope of this disclosure as described in the appended claims and their equivalents. Therefore, the scope of this disclosure is not limited to the detailed description in the specification, but should be defined by the appended claims.

[0425] Industrial applicability According to one embodiment of the invention, the inductance change in response to a magnetic field in the sensing region and the region adjacent to the sensing region can be reduced. This can improve the detection reliability in the region of the sensor layer overlapping the sensing region. It can also improve the linearity of input using a pen. Therefore, the present invention relating to an electronic device has high industrial applicability.

Claims

1. An electronic device, the electronic device comprising: Display panel; Cover panel, located below the display panel; as well as The electronic module is located below the display panel. The cover panel includes: a pad layer beneath the display panel; a magnetic layer beneath the pad layer; and a conductive layer beneath the magnetic layer. The first opening is defined within the pad layer and the magnetic layer. The second opening is defined within the conductive layer. The electronic module is located in the first opening and the second opening, and The cover panel defines a first region adjacent to the electronic module and having a first magnetic permeability, and a second region surrounding the first region and having a second magnetic permeability different from the first magnetic permeability.

2. The electronic device according to claim 1, wherein, The first area of ​​the first opening is smaller than the second area of ​​the second opening.

3. The electronic device according to claim 2, wherein, The second area is 1.5 to 1.6 times the first area.

4. The electronic device according to claim 1, wherein, In the plan view, the magnetic layer covers the conductive layer.

5. The electronic device according to claim 1, wherein, The magnetic layer comprises ferrite, and the conductive layer comprises copper.

6. The electronic device according to claim 1, wherein, The magnetic permeability of the magnetic layer is higher than that of the conductive layer.

7. The electronic device according to claim 1, wherein, In the plan view, at least a portion of the second opening overlaps with the first region.

8. The electronic device according to claim 1, wherein, In the plan view, the electronic module is not stacked with the magnetic layer and the conductive layer.

9. The electronic device according to claim 1, wherein, The electronic module includes a fingerprint sensor.

10. The electronic device according to claim 1, wherein, The electronic module includes a speaker or a light sensor.

11. The electronic device according to claim 1, wherein, Each of the first opening and the second opening has a circular shape.

12. The electronic device according to claim 1, wherein, Each of the first opening and the second opening has a quadrilateral shape.

13. The electronic device according to claim 1, wherein, The display panel includes a display layer and a sensor layer on the display layer, and The sensor layer includes: A plurality of first electrodes are arranged along a first direction and extend in a second direction intersecting the first direction; A plurality of second electrodes are arranged along the second direction and extend in the first direction; A plurality of first auxiliary electrodes are arranged along the first direction, extend in the second direction, and overlap with the plurality of first electrodes; and A plurality of second auxiliary electrodes are arranged along the second direction, extend in the first direction, and overlap with the plurality of second electrodes.

14. The electronic device according to claim 1, wherein, The magnetic layer comprises a first portion in the first region and a second portion in the second region, and The permeability of the first part is higher than that of the second part.

15. The electronic device according to claim 14, wherein, The area of ​​the first opening is the same as the area of ​​the second opening.

16. The electronic device according to claim 14, wherein, The first area of ​​the first opening is smaller than the second area of ​​the second opening.

17. The electronic device according to claim 14, wherein, The area of ​​the first portion is 0.2 to 0.3 times the area of ​​each of the first opening and the second opening.

18. The electronic device according to claim 1, wherein, In the plan view, the conductive layer overlaps only with the second region, and the magnetic layer overlaps with both the first and second regions.

19. The electronic device according to claim 18, wherein, The cover panel also includes an insulating layer, which is located on the same layer as the conductive layer and overlaps with the first region in a plan view.

20. The electronic device according to claim 1, wherein, The cover panel further includes a sub-conductive layer beneath the conductive layer and includes a third opening having an area larger than that of the second opening.

21. An electronic device, the electronic device comprising: Display panel and cover panel below the display panel, The cover panel includes: a magnetic layer below the display panel and having a first opening; and a conductive layer below the magnetic layer and having a second opening. The cover panel defines a first region adjacent to the first opening and the second opening and having a first magnetic permeability, and a second region surrounding the first region and having a second magnetic permeability different from the first magnetic permeability.

22. The electronic device according to claim 21, wherein, The first area of ​​the first opening is smaller than the second area of ​​the second opening.

23. The electronic device according to claim 21, wherein, In the plan view, the magnetic layer covers the conductive layer.

24. The electronic device according to claim 21, wherein, The magnetic layer comprises ferrite, and the conductive layer comprises copper.

25. The electronic device according to claim 21, wherein, The magnetic layer comprises a first portion in the first region and a second portion in the second region, and The permeability of the first part is higher than that of the second part.

26. The electronic device according to claim 21, wherein, In the plan view, the conductive layer overlaps only with the second region, and the magnetic layer overlaps with both the first and second regions.

27. The electronic device according to claim 21, wherein, The display panel includes a display layer and a sensor layer on the display layer, and The sensor layer includes: A plurality of first electrodes are arranged along a first direction and extend in a second direction intersecting the first direction; A plurality of second electrodes are arranged along the second direction and extend in the first direction; A plurality of first auxiliary electrodes are arranged along the first direction, extend in the second direction, and overlap with the plurality of first electrodes; and A plurality of second auxiliary electrodes are arranged along the second direction, extend in the first direction, and overlap with the plurality of second electrodes.

28. The electronic device according to claim 21, wherein, In the plan view, the conductive layer does not overlap with the first region.

29. The electronic device according to claim 21, wherein, The cover panel also includes an insulating layer, which is on the same layer as the conductive layer and overlaps with the first region in a plan view.

30. The electronic device according to claim 21, wherein, The cover panel further includes a sub-conductive layer below the conductive layer and having a third opening having an area larger than that of the second opening.

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